JP2006186197A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which is superior in heat dissipation. <P>SOLUTION: A plurality of semiconductor light emitting elements arranged in a row-form comprise a light emitting device. A heat sink 14 is placed adjacent to the rear side of a lead frame 12 wherein the semiconductor light emitting elements are mounted. A thermal conductive insulating sheet 90 is pinched with the heat sink 14 and the lead frame 12. By the above structure, regardless of the light emitting device wherein the semiconductor light emitting elements are arranged in a row-form and the quantity of light is large, an installation space for the heat sink can be ensured. As a result, a heat generating from the light emitting elements can be efficiently received by the lead frame 12 and the thermal conductive insulating sheet 90, and the heat can be radiated from the heat sink. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light emitting device using a light emitting element such as an LED, and more particularly to a light emitting device suitable for an application in which a plurality of devices are arranged adjacent to each other.

Conventionally, in order to further reduce the size of a small illuminating device constituted by a combination of a light source such as a lamp and a reflecting member, an illuminating device in which light emitting elements such as LEDs are arranged in a line or a plane as a light source has been proposed. ing. For example, in Patent Document 1, a plurality of light-emitting elements are arranged in a line, and are linearly moved or rotated at high speed by a drive mechanism unit, whereby a light beam that has a large amount of light and can be collected efficiently is efficiently Disclosed is a small lighting device that is well produced. It is also possible to obtain an illumination device having a desired emission color by arranging a plurality of light emitting elements arranged in a row in combination with elements having a desired wavelength. By using such a small illumination device, the strobe of the imaging device and the illumination unit of the image projection display device can be realized using a light emitting element such as an LED.
JP 2003-346503 A

  In a light-emitting device using light-emitting elements, a plurality of light-emitting elements are arranged as close as possible to obtain a bright light flux, and a large driving current within an allowable range is allowed to flow through each light-emitting element, whereby light emission of each light-emitting element is achieved. It is desirable to increase the amount of light. On the other hand, since the luminous efficiency of the light emitting element is inversely proportional to the temperature of the junction inside the element, it is necessary to efficiently release the heat generated by the light emitting element to the outside. However, when a plurality of light emitting elements are arranged close to each other, it is not easy to secure a place for installing a heat dissipating means such as a heat sink. In addition, the heat sink installation location must be a location where heat from the light emitting element can be received, heat can be effectively radiated to the outside, and electrical insulation between the light emitting element and the heat sink can be secured.

  An object of this invention is to provide the light-emitting device excellent in the thermal radiation characteristic.

  In order to achieve the above object, a light emitting device of the present invention includes a light emitting device, a lead frame on which a plurality of light emitting devices are mounted on one surface side and supplying power to the light emitting device, and the other surface side of the lead frame. And a resin part having an opening for integrating the lead frame and the heat sink and exposing the light emitting element. The lead frame includes a plurality of light emitting element mounting portions each mounting a light emitting element, a pair of terminal portions functioning as electrical terminals, and a wiring portion. The plurality of light emitting elements are arranged in a row and are electrically connected in series via the light emitting element mounting portion. The first terminal of the pair of terminal portions is formed integrally with one of the plurality of light emitting element mounting portions through the resin portion, and the second terminal is connected to the other of the plurality of light emitting element mounting portions via the wiring portion. The first electrode terminal and the second electrode terminal are both pulled out in the same direction from the resin portion. The wiring part is exposed to the outside of the resin part. The heat sink is a block that is longer than the length of both ends in the longitudinal direction of the light emitting elements arranged in a row and protrudes from the resin portion. A heat conductive insulating sheet is sandwiched between the heat sink and the lead frame. By adopting such a structure, it is possible to secure an installation place of the heat sink while being a light emitting device having a large light quantity in which the light emitting elements are arranged in a row, and the heat generation of the light emitting elements can be ensured by the lead frame and the heat conductive insulating sheet It is possible to efficiently receive and dissipate heat.

  In the light emitting device according to another aspect of the present invention, a structure in which almost the entire surface of the heat sink itself is covered with an insulating material, instead of the heat conductive insulating sheet. The same effect can be obtained by this structure.

  The first and second electrode terminals can be drawn out in the longitudinal direction of the resin portion. The exposed wiring is routed from one end to the other end in the longitudinal direction of the resin portion, and can be integrated with the second electrode terminal.

  It is possible to make the surface of the heat sink and the lead frame in contact with the heat conductive insulating sheet flat, thereby making it possible to bring both surfaces into close contact with each other through the sheet, thereby improving the efficiency of heat transfer. Can be made.

  The resin portion may be configured to include an opening for mounting an electric component that is exposed in a state where the first and second terminals are arranged in parallel on an end portion side in the longitudinal direction. Thereby, the surface mount-type electrical component can be connected so as to straddle the exposed first and second terminals.

  A configuration in which three or more lead frames for mounting the light emitting elements are provided can be employed. In this case, the resin portion may have two or more light emitting element openings for exposing the light emitting elements, and two or more light emitting elements may be arranged in the same opening.

  The heat sink has, for example, a height of 3 to 10 times the depth of the light emitting element opening in the resin portion, and emits light with a width 0.4 to 0.6 times the length in the short direction of the resin portion. The shape can be larger than the width of the element. At this time, it is desirable that the light emitting element is located at the center of the heat sink in the short direction.

  Wiring is routed around one side surface in the short direction of the resin portion, and the end surface portion of the lead frame is exposed on the other side surface side.

The light emitting device of the present invention can be manufactured by the following manufacturing method. That is, a step of forming a metal frame in which the plurality of lead frames are mechanically connected by pressing a plate-shaped metal plate; and
Preparing a plurality of heat sinks with an insulating film coated on a metal block surface;
A step of forming a resin portion where a wiring portion is exposed by supplying and integrating a resin material on one surface side of the lead frame in a state where a heat sink with an insulating film coating is pressed and adhered; and
Bending the wiring part along the side of the resin part;
A step of connecting a plurality of light emitting elements in series by fixing the light emitting elements to the light emitting element mounting portions and wire-connecting the electrodes of the light emitting elements to the light emitting element mounting portions;
And a step of cutting a predetermined portion of the metal frame and separating it into a plurality of light emitting elements.

An embodiment of the present invention will be described with reference to the drawings.
First, FIG. 1 is a side view, FIG. 2 is a top view, FIG. 3 is an AA sectional view, and FIG. 4 is a BB sectional view for the structure of the semiconductor light emitting device of the first embodiment. It explains using. The semiconductor light emitting device includes an LED (light emitting diode) chip 11, a metal lead frame 17 that fixes the LED chip to the upper surface and supplies power to the LED chip 11, and a heat sink disposed adjacent to the lower surface of the lead frame 17. 14, a resin portion 13 that integrally holds the lead frame 17, the electrode terminal 16, and the heat sink 14, and a light guide portion 15 that guides the light emitted from the LED chip 11 to form a light beam having a desired diffusion angle. I have.

  As shown in FIGS. 5 (a) and 5 (b), the shape of the resin portion 13 is as shown in FIGS. 5 (a) and 5 (b). LED openings 51a and 51b for exposing the LED chip 11 are formed on the upper surface side. And an electric circuit component opening 54 for mounting an electric circuit component 53 such as a rectifying element or a resistor on the base portion of the pair of electrode terminals 16. As shown in FIG. 4, an opening 41 having the same shape as the outer periphery of the heat sink 13 is provided on the lower surface side of the resin portion 13, and the heat sink 13 protrudes outward from the opening 41. Further, the resin part 13 is provided with two through holes 52. The base of the light guide 15 is inserted and fixed in the through hole 52.

  The structure of the lead frame 17 will be described with reference to FIG. FIG. 6 shows a part of a metal frame in which a plurality of lead frames 17 are mechanically connected by an outer frame 67 during the manufacturing process. The lead frame 17 is separated from the outer frame 67 at the final stage of the manufacturing process.

  The lead frame 17 includes a pair of electrode terminals 16 functioning as electrical terminals, an LED mounting area 12 on which the LED chip 11 is mounted, and a wiring portion 65 for guiding power from the electrode terminal 16 to the LED mounting area 12. I have. The shape of the LED mounting area 12 is such that a plurality of (four in this case) LED chips 11 are mounted in series in a row as shown in FIG. 6, and a plurality of LED mounting portions 61, 62, 63, 64. The LED mounting portions 61 and 62 are exposed from the opening 51a of the resin portion 13, and the LED mounting portions 63 and 64 are exposed from the opening 51b. As shown in FIG. 5B, the LED chip 11 is fixed to the LED mounting portions 61, 62, 63, and 64, and the lower surface electrodes are electrically connected. The upper surface electrode of the LED chip 11 is electrically connected to the adjacent mounting portions 62 to 64 or the terminal portion 68 in the LED mounting region 12 by a bonding wire 69. Accordingly, the LED chips 11 are connected in series as shown in FIG. 7 (a) or (b). By connecting in series, power consumption can be reduced. Further, depending on the characteristics of the LED chip 11, surface mount type resistors such as resistors and rectifier elements may be provided on the bases of the first and second electrode terminals 16 as shown in FIGS. 5 (a) and 5 (b). The electric circuit element 53 is mounted so as to straddle the first and second electrode terminals 16a and 16b, and the electrodes of the electric circuit element 53 are electrically connected to the first and second electrode terminals 16a and 16b. . As a result, an electric circuit configuration as shown in FIG. In addition, when using the LED chip 11 having a shape in which two electrodes are provided on the upper surface, the two electrodes on the upper surface are both connected to the mounting portions 61 to 64 and the terminal portion 68 by bonding wires. To achieve serial connection.

  The pair of electrode terminals 16 includes two electrode terminals 16 a and 16 b arranged in parallel, and both are led out in the same direction from one end of the resin portion 13. The first electrode terminal 16 a is configured integrally with the mounting portion 61. The second electrode terminal 16b is connected by an exposed wiring portion 65 to a terminal portion 68 located at the end opposite to the end from which the second electrode terminal 16b is drawn. In the present embodiment, in order to reduce the size of the resin part 13, the wiring part 65 is exposed to the outside of the resin part 13 as shown in FIG. As shown in FIG. 5, the exposed wiring portion 65 is bent substantially perpendicularly to the LED mounting region 12 so as to be along the side surface of the resin portion 13, and in the notch 31 provided in the lower portion of the side surface of the resin portion 13, the exposed wiring portion. 65 is accommodated. Thereby, as shown in FIG. 3, when the resin part 13 and the exposed wiring part 65 are projected on the main plane of the LED mounting area 12, the inside of the projected outer position 36 of the resin part 13 (on the LED chip 11 side). ) Is a positional relationship in which the projection of the exposed wiring portion 65 enters. For this reason, the exposed wiring portion 65 does not protrude outward from the outer shape of the resin portion 13, although the exposed wiring portion 65 is routed around one side surface in the short direction of the resin portion 13. The cut end surface of the lead frame 17 is exposed on the other side surface side.

  As described above, the exposed wiring portion 65 is routed around one side surface of the resin portion 13 but is folded and accommodated inside the outer shape of the resin portion, so that the exposed wiring portion 65 is not bent. Thus, the size of the resin portion 13 can be reduced by the area of the exposed wiring portion 65. As a result, a device having a line shape with a narrow outer shape can be realized as a semiconductor light emitting device, and therefore, a plurality of semiconductor light emitting devices can be arranged adjacent to each other at a high density. Further, since the exposed wiring portion 65 is accommodated inside the outer shape of the resin portion, electrical insulation between the cut end surface of the lead frame 17 exposed on the side surface of the adjacent semiconductor light emitting device can be ensured.

  The heat sink 14 is a block-like member made of a metal material (for example, copper) having good thermal conductivity, and is disposed adjacent to the lower surface of the LED mounting region 12 of the lead frame 17 as shown in FIGS. ing. The upper surface of the heat sink 14 and the lower surface of the lead frame 17 are formed as flat surfaces, and the heat of the LED chip 11 is efficiently conducted to the heat sink 14 via the lead frame 17 by improving the adhesion between them. However, since the heat sink 13 is made of a metal material having good thermal conductivity, there arises a problem that the heat sink 13 is electrically connected to the lead frame 17. Therefore, in the present embodiment, an insulating film 90 that is electrically insulative and has good thermal conductivity is sandwiched between the upper surface of the heat sink 17 and the lower surface of the lead frame 17 as shown in FIG. Thereby, insulation is ensured while improving the adhesion between the heat sink 14 and the lead frame 17. As the insulating film 90, for example, a resin film such as polyimide, a silicone film in which a ceramic filler is dispersed, or the like can be used. Thereby, high thermal conductivity can be realized while maintaining electrical insulation.

  The length in the longitudinal direction of the upper surface of the heat sink 14 is longer than the length from the end in the same direction of the LED chips 11 arranged in a row, and the length (width) in the short direction is the resin portion. It is 0.4 to 0.6 times the width of 13 (short direction) and larger than the width of the LED chip 11. In addition, the heat sink 13 is disposed so that the LED chip 11 is positioned at approximately the center of the upper surface of the heat sink 14 in the width direction. The height of the heat sink 14 is 3 to 10 times the depth of the LED openings 51 a and 51 b of the resin portion 13, and protrudes greatly from the resin portion 13. Thereby, it is comprised so that the heat | fever of the LED chip 11 may be thermally radiated efficiently. Further, as shown in FIG. 4, a groove 42 is formed on the side surface of the heat sink 14 in a portion located inside the opening 41 of the resin portion 13 in parallel with the upper surface. Filling the groove 42 with the resin that forms the resin portion 13 prevents the heat sink 13 from coming off from the opening 41.

  Next, a method for manufacturing the semiconductor light emitting device of this embodiment will be described. First, a metal frame shown in FIG. 6 is formed by pressing a plate-like metal plate. In this metal frame, a plurality of lead frames 17 are mechanically connected by an outer frame 67. On the other hand, a metal heat sink 13 having the shape described above and an insulating film 90 having a shape that matches the shape of the upper surface thereof are prepared. An insulating film 90 is mounted on the upper surface of the heat sink 13, and the lead frame 17 and the heat sink 13 are integrated by supplying and molding a resin material in the peripheral space in a state where the insulating film 90 is pressed and adhered to the lower surface of the lead frame 17. To form the resin portion 13. Thus, the two LED chip openings 51a and 51b are provided on the upper surface, the opening 41 is provided with the heat sink 13 integrated and protruded on the lower surface, and the resin portion 13 having the through hole 52 and the notch 31 is molded. . The resin material may be supplied to the peripheral space of the lead frame 17 in a state where the resin constituting the resin portion 13 is dissolved or softened, or the precursor of the resin constituting the resin portion 13 or unreacted It is also possible to form the resin part 13 by supplying it to the peripheral space in the state of a mixture of two or more resin materials and then reacting it by heating or irradiation with radiation such as light or electromagnetic waves.

  Next, the exposed wiring portion 65 protruding from the side surface of the resin portion 13 is bent at a right angle to the side opposite to the opening 51 of the resin portion 13, that is, the lower surface side so as to be along the side surface of the resin portion 13. The exposed wiring portion 65 is accommodated in the notch 31.

  When the LED chip 11 is mounted on the LED mounting portions 61 to 64 exposed in the openings 51a and 51b of the resin portion 13, and one of the LED chips 11 has an electrode on the lower surface, it is electrically connected to the mounting portions 61 and 64. Connect to. The upper surface electrode of the LED chip 11 is wire-connected to the opposing LED mounting portions 61 to 64 by bonding or the like. Thereby, the electric circuit of FIG.7 (b) by which the four LED chips 11 were connected in series is comprised. Further, if necessary, a surface-mount type electric circuit element 53 such as a resistor or a rectifying element is mounted on the bases of the first and second electrode terminals 16 so as to straddle the electrode terminals 16, and FIG. The electrical circuit is realized.

  Furthermore, the portion of the broken line area 66 of the metal frame in FIG. 6 is cut and separated into individual semiconductor light emitting devices. After the silicone resin 32 having a predetermined refractive index is filled in the opening 41, the light guide portion 15 is mounted, and the end portion is inserted into the through hole 52 of the resin portion 13 and fixed. Thereby, the semiconductor light emitting device of the present embodiment is completed.

  In the semiconductor light emitting device of the present embodiment, by supplying current between the electrode terminals 16, the four LED chips 11 connected in series emit light, and the emitted light is guided through the silicone resin 32. The light enters the portion 15, is formed into a predetermined diffused light beam by the light guide portion 15, and is emitted.

  Since this semiconductor light emitting device is equipped with four LED chips 11, the amount of emitted light is large, and the power consumption is small because of the series connection. In addition, since the LED chips 11 are arranged in a row on the narrow resin portion 13, a plurality of semiconductor light emitting devices can be arranged adjacent to each other in the width direction, and the surface light source can be easily configured. Can do.

  Although this semiconductor light emitting device is a device having a narrow line-shaped outer shape, in the present embodiment, the heat sink 14 is disposed immediately below the LED mounting region 12 of the lead frame 17, thereby providing sufficient heat dissipation characteristics. Can be secured. Thereby, since it can prevent that the junction part of LED chip 11 becomes high temperature, the fall of the emitted light amount by a temperature rise can be prevented, and the stable light emission characteristic can be maintained.

  Further, since the exposed wiring portion 65 is bent along the side surface of the resin portion 13 and stored in the notch 31, the width of the semiconductor light emitting device can be reduced by the width of the exposed wiring portion 65. Since the exposed wiring portion 65 does not protrude to the outside, there is no possibility that adjacent semiconductor light emitting devices are electrically connected to each other.

Next, a second embodiment of the present invention will be described with reference to FIG.
The semiconductor light emitting device according to the second embodiment is different from the semiconductor light emitting device according to the first embodiment in that the entire surface of the heat sink 14 is coated with an electrical insulating film 101 having good thermal conductivity. Yes. As the electrical insulating film 101, a resin film, a silicone film, or the like can be used in the same manner as the insulating film 90 of the first embodiment. Note that the insulating film 90 used in the first embodiment is not disposed. Other configurations are the same as those in the first embodiment, and thus the description thereof is omitted.

  In the manufacturing process of the semiconductor light emitting device of the second embodiment, the metal heat sink 14 is previously covered with the insulating film 101 with the insulating film 90 and the resin portion 13 is formed in close contact with the lower surface of the lead frame 17. To do. The insulating film 90 is not disposed. Other steps are the same as those in the first embodiment.

  In the second embodiment, since the heat sink 14 is covered with the insulating film 101 having good thermal conductivity, the lead frame 17 and the heat sink 14 can be electrically insulated, and the lead frame 17 can be electrically insulated. Heat can be conducted well to the heat sink 14. Therefore, an effect equivalent to that of the first embodiment can be obtained.

  In the first and second embodiments described above, the description has been given of the case where the four LED chips 11 are used. However, the number of the LED chips 11 is not limited to four, preferably two or more, preferably The desired number can be 3 or more. Further, the arrangement of the LED chips 11 is not limited to one row, but may be two or more rows. Furthermore, it is also possible to use light emitting elements other than the LED chip 11.

The side view of the semiconductor light-emitting device of 1st Embodiment. FIG. 2 is a top view of the semiconductor light emitting device of FIG. 1. FIG. 2 is a cross-sectional view of the semiconductor light emitting device of FIG. 1 taken along line AA. BB sectional drawing of the semiconductor light-emitting device of FIG. (A) The perspective view of the state which removed the light guide part 15 from the light emitting element of FIG. 1, (b) The top view of the state which removed the light guide part 15 from the light emitting element of FIG. FIG. 3 is a top view of a metal frame used in the manufacturing process of the semiconductor light emitting device of FIG. 1. (A) And (b) The electric circuit diagram which shows the connection of the LED chip 11 of the semiconductor light-emitting device of 1st Embodiment. (A) The perspective view and side view which show the state which cut | disconnected the lead frame 12, the exposed electrode part 65, and the electrode terminal 16 from the metal frame in the manufacturing process of the semiconductor light-emitting device of FIG. 1, (b) Resin the exposed electrode part 65 is resin. The perspective view and side view which show the state bent about 90 degree | times along the side surface of the part 13, and accommodated in the notch. FIG. 2 is a cutaway perspective view showing an insulating film 90 of the semiconductor light emitting device of FIG. 1. FIG. 6 is a cutaway perspective view showing an insulating film 101 that covers a heat sink of the semiconductor light emitting device of the second embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... LED chip, 12 ... Lead frame, 13 ... Resin part, 14 ... Heat sink, 15 ... Light guide part, 16 ... Terminal part, 16a ... 1st terminal Part, 16b ... second terminal part, 31 ... notch, 32 ... silicone resin, 35 ... main plane of lead frame 12, 36 ... external position of projection of resin part 13, 41 ... Heat sink opening, 42 ... Groove, 51a, 51b ... LED chip opening, 52 ... Through hole, 53 ... Electric circuit element, 54 ... Electric circuit element opening, 61, 62, 63, 64 ... mounting portion, 65 ... exposed electrode portion, 67 ... outer frame portion, 68 ... terminal portion, 69 ... wire, 90 ... insulating film, 101 ... Insulating film.

Claims (8)

A light-emitting element, a lead frame on which a plurality of light-emitting elements are mounted on one surface side and supplying power to the light-emitting element, a heat sink adjacent to the other surface side of the lead frame, the lead frame and the heat sink In a light emitting device having a resin portion with an opening that is integrated and exposes the light emitting element,
The lead frame includes a plurality of light emitting element mounting portions each mounting the light emitting elements, a pair of terminal portions functioning as electrical terminals, and a wiring portion,
The plurality of light emitting elements are arranged in a row, and are electrically connected in series via the light emitting element mounting portion,
A first terminal of the pair of terminal portions passes through the resin portion and is integrally formed with one of the plurality of light emitting element mounting portions, and a second terminal is connected to the plurality of light emitting elements via the wiring portion. Connected with the other one of the mounting portion, both the first and second electrode terminals are drawn out from the resin portion in the same direction, and the wiring portion is exposed to the outside of the resin portion,
The heat sink is longer than the length of both ends in the longitudinal direction of the plurality of light emitting elements arranged in the row, and is a block protruding from the resin portion,
A light emitting device, wherein a heat conductive insulating sheet is sandwiched between the heat sink and the lead frame. A light emitting element; a lead frame on which a plurality of light emitting elements are mounted on one surface side and supplying power to the light emitting element; a heat sink adjacent to the other surface side of the lead frame; the lead frame and the heat sink; In a light emitting device having a resin portion with an opening that is integrated and exposes the light emitting element,
The lead frame includes a plurality of light emitting element mounting portions each mounting the light emitting elements, a pair of terminal portions functioning as electrical terminals, and a wiring portion,
The plurality of light emitting elements are arranged in a row, and are electrically connected in series via the light emitting element mounting portion,
A first terminal of the pair of terminal portions passes through the resin portion and is integrally formed with one of the plurality of light emitting element mounting portions, and a second terminal is connected to the plurality of light emitting elements via the wiring portion. The first and second electrode terminals are both pulled out in the same direction from the end of the resin part, and the wiring part is connected to the outside of the resin part. Exposed,
The heat sink is a metal block that is longer than the lengths of both ends in the longitudinal direction of the plurality of light emitting elements arranged in a row and protrudes from the resin portion, and is almost entirely covered with an insulating material. A light emitting device characterized by that.   The direction in which the first and second terminals are drawn out is the longitudinal direction of the resin portion, and the exposed wiring is routed from one end to the other end in the longitudinal direction of the resin portion, The light emitting device according to claim 1, wherein the light emitting device is integrated with the second terminal.   The light emitting device according to claim 1, wherein surfaces of the heat sink and the lead frame in contact with the thermally conductive insulating sheet are flat surfaces.   The resin part includes an opening for mounting an electrical component that is exposed in a state where the first and second terminals are arranged in parallel on an end side in the longitudinal direction, and straddles the exposed first and second electrode terminals. The light emitting device according to claim 2, wherein surface mount type electrical components are connected as described above. Three or more light emitting element mounting portions are provided, the resin portion has two or more openings exposing the light emitting elements, and two or more light emitting elements are disposed in the same opening,
The heat sink has a height that is 3 to 10 times the depth of the opening for the light emitting element of the resin portion, and a width that is 0.4 to 0.6 times the length in the short direction of the resin portion. 3. The light emitting device according to claim 1, wherein the light emitting element is larger than a width of the light emitting element, and the light emitting element is positioned at a center in a short direction of the heat sink.   3. The light emitting device according to claim 1, wherein the wiring is exposed on one side surface in a short direction of the resin portion, and an end surface portion of the lead frame is exposed on the other side surface. 4. apparatus. A light emitting element; a lead frame on which a plurality of light emitting elements are mounted on one surface side and supplying power to the light emitting element; a heat sink adjacent to the other surface side of the lead frame; the lead frame and the heat sink; And a resin part having an opening that exposes the light emitting element, and the lead frame includes a plurality of light emitting element mounting parts each mounting the light emitting element, and a pair of electrical terminals functioning as electrical terminals A method of manufacturing a light emitting device including a terminal portion and a wiring portion,
Forming a metal frame in which a plurality of the lead frames are mechanically connected by pressing a plate-shaped metal plate; and
Preparing a plurality of heat sinks with an insulating film coated on a metal block surface;
A step of supplying and molding a resin material on one surface side of the lead frame in a state in which the heat sink coated with the insulating film is pressed and adhered, and forming the resin portion in which the wiring portion is exposed; ,
A step of bending the wiring portion and extending along the side surface of the resin portion;
Fixing the light emitting element to the light emitting element mounting portion, and connecting the plurality of light emitting elements in series by wire-connecting the electrode of the light emitting element to the light emitting element mounting portion;
And a step of cutting a predetermined portion of the metal frame and separating it into a plurality of light emitting elements.

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