JP2005247160A - Led signal bulb and color lamp sinal - Google Patents

Led signal bulb and color lamp sinal Download PDF

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JP2005247160A
JP2005247160A JP2004061403A JP2004061403A JP2005247160A JP 2005247160 A JP2005247160 A JP 2005247160A JP 2004061403 A JP2004061403 A JP 2004061403A JP 2004061403 A JP2004061403 A JP 2004061403A JP 2005247160 A JP2005247160 A JP 2005247160A
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lamp
emitting diode
light
led signal
bulb
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JP4471683B2 (en
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Isamu Suzuki
勇 鈴木
Tsutomu Hiromitsu
勉 弘光
Yoshihiko Yamazaki
悦彦 山崎
Takeshi Mizuno
健 水野
Kunihiro Hattori
邦裕 服部
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Daido Signal Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/008—Combination of two or more successive refractors along an optical axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
    • B61L5/00—Local operating mechanisms for points or track-mounted scotch-blocks; Visible or audible signals; Local operating mechanisms for visible or audible signals
    • B61L5/12—Visible signals
    • B61L5/18—Light signals; Mechanisms associated therewith, e.g. blinders
    • B61L5/1809—Daylight signals
    • B61L5/1818—Daylight signals using mobile coloured screen
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/10—Refractors for light sources comprising photoluminescent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61L—GUIDING RAILWAY TRAFFIC; ENSURING THE SAFETY OF RAILWAY TRAFFIC
    • B61L2207/00—Features of light signals
    • B61L2207/02—Features of light signals using light-emitting diodes (LEDs)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To change a bulb from a filament bulb to an LED signal bulb while a lamp and a color lens are provided to a color lamp signal. <P>SOLUTION: A bump 12b is formed on a heat-conductive supporting member 12 insulated from lead members 13, 14, and a blue light emitting diode chip 11 is accommodated in the bump, and covered by a first resin part 17 and a second resin part 15. At that time, a yellow wavelength converting material and a red wavelength converting material are mixed in the resin part 17, and an exposed end 12a is exposed. A supporting member is released from electric supply, and plays only a supporting function and a heat-conducting function, so as to loosen restraints of a heat-dissipation means. Therefore, problems of compatibility in addition to small size, multi-color, and raise in luminous intensity can be solved. Also, a bonding wire 16 is protected by a third flexible resin part 18, and mixed with a wavelength converting material. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、発光ダイオードを光源とするＬＥＤ信号電球および色灯信号機に関し、詳しくは、赤・黄・青の三色を含む多灯の色灯信号機についてフィラメント電球を置き換えるのに好適なＬＥＤ信号電球と、一部の又は総てのフィラメント電球をＬＥＤ信号電球で置き換えた色灯信号機に関する。
本発明では、熱による発光効率の変動および発光波長の変動を抑える等のことにより、互換性を高めて、交換を容易にしている。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED signal light bulb and a color light signal device using a light emitting diode as a light source, and more particularly, an LED signal light bulb suitable for replacing a filament light bulb for a multi-color light signal device including three colors of red, yellow and blue And a color lamp signal device in which some or all filament bulbs are replaced with LED signal bulbs.
In the present invention, compatibility is improved and exchange is facilitated by suppressing fluctuations in luminous efficiency and emission wavelength due to heat.

ＬＥＤ信号電球をフィラメント電球に代えて信号機の光源とする事例が増えており、発光原理の異なる電球について代替を可能とするために種々の工夫がなされている。具体例を挙げると、回路基板上に多数の発光ダイオードを並べるとともに、その駆動回路を改良して発光特性を改善したものがある(例えば、特許文献１参照)。また、基板上に多数の黄色発光ダイオードを密集して配設するとともに、少数の青緑色発光ダイオードを混在させることで発光色を白色にしたものも知られている（例えば特許文献２参照）。これは、放熱も考慮して、基板の表面や発光ダイオード間を合成樹脂で埋めている。   There are an increasing number of cases in which LED light bulbs are replaced with filament light bulbs and used as light sources for traffic lights, and various ideas have been made to enable replacement of light bulbs having different light emission principles. As a specific example, there is one in which a large number of light emitting diodes are arranged on a circuit board, and the driving circuit is improved to improve the light emission characteristics (see, for example, Patent Document 1). In addition, there are also known ones in which a large number of yellow light emitting diodes are arranged densely on a substrate and the emission color is made white by mixing a small number of blue-green light emitting diodes (see, for example, Patent Document 2). In consideration of heat dissipation, the surface of the substrate and the space between the light emitting diodes are filled with synthetic resin.

これらは鉄道用信号機を対象にしたものであるが、道路交通用信号機を対象にしたもので放熱まで考慮したものが知られている(例えば特許文献３参照)。これは、アルミニウムプレートやアルミニウム支柱を介してケーシング等の外部へ熱を逃がすようになっている。もっとも、アルミニウムプレートが熱を奪うのは、絶縁ラバーを介して重ね合わされた基板からであり、基板上に発光ダイオードが配設されている点は同じである。
すなわち、何れの場合も、発光ダイオードは、ディスクリートタイプのものであり、具体的には発光ダイオードチップが樹脂封止されていてそこから二本の給電用リードフレームが突き出している構造のものであるため、リードフレームを支えにして回路基板に植設されている。 These are intended for railway traffic signals, but those intended for road traffic traffic signals and considering heat dissipation are known (see, for example, Patent Document 3). This allows heat to escape to the outside of the casing or the like via an aluminum plate or an aluminum column. However, the aluminum plate deprives of heat from the substrates that are overlapped via the insulating rubber, and the same point is that the light emitting diodes are arranged on the substrate.
That is, in any case, the light-emitting diode is of a discrete type, and specifically, has a structure in which the light-emitting diode chip is sealed with resin and two lead frames for power feeding protrude therefrom. Therefore, the lead frame is supported on the circuit board.

発光ダイオードは、フィラメント電球に比べて、発光効率が良いので、発熱量は少ないが、半導体なので、耐熱性に劣ることから、さほど高温に至らなくても、温度が上昇すると、発光効率の低下、信頼性の低下を招くおそれがある。
そのため、ＬＥＤ信号電球では、上述したような放熱のための配慮もなされており、発光ダイオードの発した熱を合成樹脂やアルミニウム支柱等にてベースやケースへ伝導するようになっている。 Light emitting diodes have better luminous efficiency than filament bulbs, so they generate less heat, but they are semiconductors, so they have poor heat resistance, so even if they do not reach a very high temperature, if the temperature rises, the luminous efficiency decreases. There is a risk of lowering reliability.
For this reason, in the LED signal bulb, consideration is given to the heat dissipation as described above, and the heat generated by the light emitting diode is conducted to the base and the case by a synthetic resin, an aluminum support or the like.

特開２００２−１７３０２８号公報JP 2002-173028 A 特開平０９−２０４５９５号公報Japanese Patent Laid-Open No. 09-204595 特開２０００−２９４００２号公報JP 2000-294002 A

［未公開特許出願１］特願２００３−１３６９２６号     [Unpublished Patent Application 1] Japanese Patent Application No. 2003-136926

しかし、何れの場合であっても、熱の発生源であるＬＥＤチップ搭載部はレンズ兼保護用の樹脂にて封止されていることから、そのＬＥＤチップ搭載部と放熱用の合成樹脂やアルミニウムプレート上の回路基板とが大抵は断面０．２５ｍｍ２のリードフレームで繋がっているだけなので、放熱効果は極めて悪い。それゆえ、一個当たりのＬＥＤ素子に注入できる電流値は２０ｍＡ程度までであり、発光ダイオードの密度が大になれば、より低電流でしか使用できなくなる。そのため、発光効率が思うようには向上しないという不都合がある。 However, in any case, since the LED chip mounting portion, which is a heat generation source, is sealed with a lens and protective resin, the LED chip mounting portion and a synthetic resin or aluminum for heat dissipation are used. Since the circuit board on the plate is usually connected by a lead frame having a cross-section of 0.25 mm 2 , the heat dissipation effect is extremely poor. Therefore, the current value that can be injected into each LED element is up to about 20 mA, and if the density of the light emitting diodes is increased, it can be used only at a lower current. Therefore, there is an inconvenience that the luminous efficiency is not improved as expected.

また、ディスクリートの発光ダイオードは、回路基板に二本のリードフレームで固定されるときに、前後または左右のどちらかに傾く可能性があり、傾きがばらつくと、集合体として使用する場合には点灯状態で個々の光軸を調整しなければならなくなる。そのため、製造に際してコストアップを招来するという不都合がある。
そして、それらの点を考慮して、熱による特性変動を非常に低く抑えたＬＥＤランプ及びＬＥＤ照明器具が、開発されている（未公開特許出願１参照）。
このＬＥＤランプは、発光特性が安定しているのに加え、小形化にも高輝度化にも向いている。 Discrete light emitting diodes can tilt either forward or backward or left and right when fixed to a circuit board with two lead frames. If the inclination varies, the LED will light up when used as an assembly. In this state, the individual optical axes must be adjusted. For this reason, there is an inconvenience of incurring a cost increase in manufacturing.
In consideration of these points, LED lamps and LED lighting fixtures have been developed (see unpublished patent application 1) in which characteristic fluctuation due to heat is suppressed to a very low level.
In addition to stable light emission characteristics, this LED lamp is suitable for downsizing and high brightness.

ところで、信号機には三個以上の灯器を装備していて赤・黄・青の三色を使うものが多いが、フィラメント電球が白く発光するため、フィラメント電球の装着を前提とした既設の信号機は、赤く点灯させたい灯器には赤色の色レンズが装着され、黄色く点灯させたい灯器には黄色の色レンズが装着され、青く点灯させたい灯器には青色の色レンズが装着されている。これに対し、発光ダイオードを光源とするＬＥＤ信号電球では、単色の発光ダイオードが普通であることから、色灯信号機のためには、赤・黄・青の各色に対応した三種のＬＥＤ信号電球が開発され(例えば特許文献３参照)、白色の信号機のためには適宜な二色の発光ダイオードを混在させた更に別のＬＥＤ信号電球が開発されている(例えば特許文献２参照)。   By the way, many of the traffic lights are equipped with three or more lamps and use three colors of red, yellow, and blue, but since the filament light bulb emits white light, the existing traffic light that presupposes the installation of the filament light bulb. The lamp that you want to light red is equipped with a red color lens, the lamp that you want to light yellow is equipped with a yellow color lens, and the lamp that you want to light blue is equipped with a blue color lens. Yes. On the other hand, in LED signal light bulbs using light emitting diodes as light sources, single color light emitting diodes are common, so for color light traffic lights, there are three types of LED signal light bulbs corresponding to each color of red, yellow, and blue. Another LED signal light bulb has been developed (see, for example, Patent Document 2) in which appropriate two-color light emitting diodes are mixed for a white traffic light.

このように、色灯信号機では、赤色用と黄色用と青色用の３種類のＬＥＤ信号電球を使い分けることで、色レンズが灯器の必需品でなくなるとともに、ＬＥＤ信号電球の光度がフィラメント電球のそれより小さくて済むようになっている。
もっとも、従来のＬＥＤ信号電球は外形がフィラメント電球より大きいため、既設の信号機を電球式からＬＥＤ式へ変更する場合、従来のＬＥＤ信号電球を採用したのでは、電球部分の交換に伴って色レンズを外したりそれを透明レンズに取り替えたりするだけでは足りず、それらを格納・装備する灯器まで取り替える必要がある。このため、工事費の増大を招来するという不都合がある。 In this way, in the color lamp traffic light, by using three types of LED signal bulbs for red, yellow and blue, the color lens is no longer an essential item of the lamp, and the luminous intensity of the LED signal bulb is that of the filament bulb. It can be smaller.
However, since the conventional LED signal light bulb is larger than the filament light bulb in the case of changing the existing traffic light from the light bulb type to the LED type, if the conventional LED signal light bulb is adopted, the color lens is replaced with the replacement of the light bulb part. It is not enough to remove the lens or replace it with a transparent lens. It is also necessary to replace the lamp that houses and equips them. For this reason, there is an inconvenience that the construction cost is increased.

また、電球は球切れ等に備えて交換用のものを用意しておく必要があるが、多種類のＬＥＤ信号電球を用意しておくのは、保守用品の増加や管理の煩雑化を招くという不都合がある。
そこで、既設の色灯信号機のフィラメント電球をＬＥＤ信号電球で代替するに際して取り替え部品が少なくなるよう、具体的には灯器や色レンズを色灯信号機に装備したまま電球をフィラメント電球からＬＥＤ信号電球に交換できるよう、ＬＥＤ信号電球をフィラメント電球ほどに小さくするとともに、ＬＥＤ信号電球にフィラメント電球と同様の発光を行わせることが要請される。 In addition, it is necessary to prepare replacement bulbs in preparation for running out of bulbs, etc., but preparing various types of LED signal bulbs increases the number of maintenance items and complicates management. There is an inconvenience.
Therefore, in order to replace the filament light bulb of the existing color light signal device with the LED signal light bulb, specifically, the light bulb and the color lens are mounted on the color light signal device while the light device and the color lens are mounted on the LED light bulb. The LED signal bulb is required to be as small as a filament bulb so that the LED signal bulb can emit light similar to a filament bulb.

しかしながら、フィラメント電球同様に発光するには、三色総てを含んだ光を出さなければならないうえ、各色成分ごとに従来のＬＥＤ信号電球と同等光度で発光しなければならない。言い換えれば従来のＬＥＤ信号電球の約三倍の光量が必要とされる。このため、上記要請に応えるには、小形化と多色化と高光度化という三つの技術課題を同時にクリアしなければならない。そして、そのためには、熱による特性変動を非常に低く抑えた上記ＬＥＤランプの長所を取り込むとともに、更なる改良を施すことが、有効となる。   However, in order to emit light in the same way as a filament light bulb, light including all three colors must be emitted, and each color component must emit light with the same luminous intensity as a conventional LED signal light bulb. In other words, about three times as much light as the conventional LED signal bulb is required. For this reason, in order to meet the above requirements, the three technical issues of miniaturization, multiple colors, and high luminous intensity must be cleared simultaneously. For this purpose, it is effective to take in the advantages of the LED lamp with extremely low fluctuation in characteristics due to heat and to make further improvements.

本発明のＬＥＤ信号電球および色灯信号機は（解決手段１）、このような課題を解決するために創案されたものであり、当初請求項１，９に記載の如く、赤・黄・青の色レンズを装備した灯器を取り替えなくてもフィラメント電球をＬＥＤ信号電球で置き換えられるようにしたものである。
具体的には、本発明の解決手段１の色灯信号機は、赤色の色レンズを装着した第１灯器と黄色の色レンズを装着した第２灯器と青色の色レンズを装着した第３灯器とを備えた色灯信号機において、前記灯器のうち何れか一つ又は複数のものに次のＬＥＤ信号電球を装着したものである。 The LED signal light bulb and the color light signal device of the present invention (Solution 1) were created to solve such a problem. As described in Claims 1 and 9, the red, yellow, and blue light The filament light bulb can be replaced with an LED signal light bulb without replacing the lamp equipped with the color lens.
Specifically, the color lamp traffic light of Solution 1 of the present invention includes a first lamp mounted with a red color lens, a second lamp mounted with a yellow color lens, and a third lamp mounted with a blue color lens. In a color lamp signal device provided with a lamp, any one or a plurality of the lamps are mounted with the following LED signal bulbs.

そして、本発明の解決手段１のＬＥＤ信号電球は、何れの色も信号機の色レンズで選択して透過させるのに適した赤色と黄色と青色の三種類の波長成分を含む光を点灯時に発するＬＥＤ信号電球であって、熱伝導性材料からなり一端面に窪みが形成された棒状の支持部材と、前記窪みに納めて前記支持部材に搭載され前記窪みの底面に対し電気絶縁状態で片面が接合された一個または複数個の青色発光ダイオードチップと、前記支持部材から電気的に絶縁された状態で前記支持部材に固定され前記青色発光ダイオードチップへの給電を担うリード部材と、中心発光波長が黄色の波長変換材料と中心発光波長が赤色の波長変換材料とが混入されており前記窪みにおいて前記青色発光ダイオードチップを覆う第１樹脂部と、この第１樹脂部を含めて前記支持部材の前記一端部は覆い他端部は露出させる光透過性の第２樹脂部とを備えている、というものである。   The LED signal light bulb of Solution 1 of the present invention emits light including three types of wavelength components of red, yellow, and blue suitable for selecting and transmitting any color with the color lens of the traffic light. An LED signal light bulb, which is made of a heat conductive material and has a rod-shaped support member formed with a depression on one end surface, and is mounted on the support member in the depression and is electrically insulated from the bottom surface of the depression. One or a plurality of blue light emitting diode chips joined, a lead member fixed to the support member in a state of being electrically insulated from the support member, and supplying power to the blue light emitting diode chip, and a central light emission wavelength A first resin portion in which a yellow wavelength conversion material and a wavelength conversion material having a central emission wavelength of red are mixed, and covers the blue light-emitting diode chip in the depression, and includes the first resin portion Wherein one end portion covers the other end portion of the support member and a second resin portion of the light transmissive of exposing, is that.

また、本発明のＬＥＤ信号電球および色灯信号機は（解決手段２）、上記解決手段１のＬＥＤ信号電球および色灯信号機であって、前記ＬＥＤ信号電球が、当初請求項２，３，４，９記載の如く更に、前記青色発光ダイオードチップと前記リード部材とを接続するボンディングワイヤーと、前記第１樹脂部と前記第２樹脂部とに介在して前記ボンディングワイヤーを囲む柔軟な第３樹脂部とを備えている、というものである。なお、この第３樹脂部は波長変換材料が混入されていても良く、その波長変換材料は、中心発光波長が黄色の波長変換材料と中心発光波長が赤色の波長変換材料とが含まれていれば、第１樹脂部に混入されたものと同じでも良く或いは成分や濃度の異なるものでも良い。また、波長変換材料が第３樹脂部に混入されていれば第１樹脂部には混入されていなくても良い（出願当初請求項４）。   The LED signal light bulb and the color light signal device of the present invention are (Solution means 2), the LED signal light bulb and the color light signal device of the above solution means 1, wherein the LED signal light bulb is originally claimed in claims 2, 3, 4, and 4. And a flexible third resin portion surrounding the bonding wire by interposing the bonding wire connecting the blue light emitting diode chip and the lead member, and the first resin portion and the second resin portion. It is said that it is equipped with. The third resin portion may be mixed with a wavelength conversion material, and the wavelength conversion material includes a wavelength conversion material having a central emission wavelength of yellow and a wavelength conversion material having a central emission wavelength of red. For example, it may be the same as that mixed in the first resin part, or may have different components and concentrations. Moreover, if the wavelength conversion material is mixed in the 3rd resin part, it does not need to be mixed in the 1st resin part (application initial claim 4).

さらに、本発明のＬＥＤ信号電球および色灯信号機は（解決手段３）、上記解決手段１，２のＬＥＤ信号電球および色灯信号機であって、前記ＬＥＤ信号電球が、当初請求項５，９記載の如く更に、放熱フィン付きの放熱部材を備え、この放熱部材と前記支持部材の前記他端部とが伝熱可能に連結されている、というものである。   Furthermore, the LED signal light bulb and the color light signal device of the present invention are (Solution means 3), the LED signal light bulb and the color light signal device of the above solution means 1 and 2, wherein the LED signal light bulb is originally claimed in claims 5 and 9. Further, a heat dissipating member with heat dissipating fins is provided, and the heat dissipating member and the other end portion of the support member are connected so as to be able to transfer heat.

また、本発明のＬＥＤ信号電球および色灯信号機は（解決手段４）、上記解決手段３のＬＥＤ信号電球および色灯信号機であって、前記ＬＥＤ信号電球が、当初請求項６，９記載の如く更に、フィラメント電球に適合した駆動電力を前記青色発光ダイオードチップの駆動電力に変換する電力変換回路を備えており、前記放熱部材には貫通穴等の空洞が形成されており、この空洞に前記電力変換回路が納められている、というものである。   The LED signal light bulb and the color light signal device of the present invention are (Solution means 4), the LED signal light bulb and the color light signal device of the solution means 3, wherein the LED signal light bulb is originally as claimed in claims 6 and 9. Furthermore, a power conversion circuit for converting driving power suitable for the filament light bulb into driving power for the blue light emitting diode chip is provided, and a cavity such as a through hole is formed in the heat radiating member. The conversion circuit is housed.

また、本発明の色灯信号機は（解決手段５）、上記解決手段３，４の色灯信号機であって、当初請求項１０記載の如く更に、それぞれ赤・黄・青の色レンズを装着している前記第１，第２，第３灯器が何れもフィラメント電球保持用のソケットを内装可能なものであり、それらの灯器のうち何れか一つ又は複数のものにおける前記ソケットの装着部位に、前記放熱部材が装着されている、というものである。   The color lamp traffic light of the present invention is (Solution 5), which is the color lamp traffic light of the above solutions 3 and 4, and is further equipped with red, yellow and blue color lenses, respectively, as described in Claim 10. Each of the first, second, and third lamps can be equipped with a socket for holding a filament bulb, and the socket mounting portion in any one or more of these lamps In addition, the heat radiating member is mounted.

また、本発明のＬＥＤ信号電球および色灯信号機は（解決手段６）、上記解決手段１〜５のＬＥＤ信号電球および色灯信号機であって、前記ＬＥＤ信号電球が、当初請求項７，８，９記載の如く更に、前記青色発光ダイオードチップを複数個具備しており、しかも、それらの青色発光ダイオードチップが二列に並んだ状態で配設されている、というものである。あるいは、そのようなＬＥＤ信号電球において更に、前記リード部材が第１，第２，第３リード部材の三個に分かれており、前記第１リード部材と前記第２リード部材とが前記青色発光ダイオードチップのうち前記二列の一方に配されたものと給電可能に接続され、前記第２リード部材と前記第３リード部材とが前記青色発光ダイオードチップのうち前記二列の他方に配されたものと給電可能に接続されている、というものである。   The LED signal light bulb and the color light signal device of the present invention are (Solution means 6), the LED signal light bulb and the color light signal device of the above solution means 1 to 5, wherein the LED signal light bulb is originally claimed in claims 7, 8, In addition, as described in item 9, a plurality of blue light emitting diode chips are provided, and the blue light emitting diode chips are arranged in two rows. Alternatively, in such an LED signal bulb, the lead member is further divided into three parts, a first lead member and a third lead member, and the first lead member and the second lead member are the blue light emitting diodes. One of the chips arranged in one of the two rows is connected to be able to supply power, and the second lead member and the third lead member are arranged in the other of the two rows of the blue light emitting diode chips It is said that it is connected so that power can be supplied.

このような本発明のＬＥＤ信号電球および色灯信号機にあっては（解決手段１）、ＬＥＤ信号電球について、発光ダイオードチップを窪みに納めて集光効率を上げるとともに、点灯時に発熱するＬＥＤ素子をベアチップ状態で支持したことにより、すなわち発光ダイオードチップを熱伝導度の大きい支持部材の一端面に搭載したことにより、発光ダイオードチップ内の発光部・接合部で発生する熱がチップ裏面から支持部材を介してその他端部へ最短距離で伝導されるため、発光ダイオードチップの温度上昇が十分に小さく抑えられるので、温度変化に起因しての電流値変化による特性の変動を最小限にすることができる。特に大電流での発光効率の低下および寿命の短縮を防止することができるので、発光ダイオードチップを小領域に集約したりチップ数を減らしたりしてＬＥＤ信号電球をフィラメント電球と同程度に小さくしても、ＬＥＤ信号電球にフィラメント電球と同等光度で発光させることが無理なくできることとなる。   In such an LED signal light bulb and color lamp signal device of the present invention (Solution 1), the LED signal light bulb is provided with a light emitting diode chip in a recess to increase the light collection efficiency, and an LED element that generates heat during lighting is provided. By supporting in a bare chip state, that is, by mounting a light emitting diode chip on one end surface of a support member having a high thermal conductivity, heat generated at the light emitting part / joint part in the light emitting diode chip is transferred from the chip back surface to the support member. The temperature rise of the light-emitting diode chip can be suppressed to a sufficiently small value because it is conducted to the other end through the shortest distance, so that fluctuations in characteristics due to changes in the current value due to temperature changes can be minimized. . In particular, it is possible to prevent a decrease in luminous efficiency and a shortening of the lifetime at a large current, so that LED signal bulbs can be made as small as filament bulbs by concentrating light-emitting diode chips in a small area or reducing the number of chips. However, the LED signal bulb can be made to emit light with the same luminous intensity as the filament bulb.

また、ＬＥＤ信号電球のＬＥＤ素子として青色発光ダイオードチップを搭載するとともに、波長変換材料を混入した第１樹脂で青色発光ダイオードチップを覆ってから、更に第２樹脂でも覆うことにより、放熱も送光も妨げることなく絶縁や保護がなされるが、その際、波長変換材料には青色発光ダイオードチップの光により励起され中心波長が黄色を発する波長変換材料ばかりか中心波長が赤色を発する波長変換材料も混入しておくことにより、このＬＥＤ信号電球はフィラメント電球同様に三色成分を含んだ発光を行うものとなる。そして、そのようなＬＥＤ信号電球は、フィラメント電球を装着している色灯信号機の灯器に対して、灯器や色レンズを取り替えることなくフィラメント電球と交換され、点灯時には色レンズを介して以前と同等の光を外部へ放つ。   In addition, a blue light emitting diode chip is mounted as an LED element of the LED signal bulb, and the blue light emitting diode chip is covered with the first resin mixed with the wavelength conversion material, and further covered with the second resin, so that heat radiation is also transmitted. In this case, the wavelength conversion material is not only a wavelength conversion material that is excited by the light of the blue light-emitting diode chip but also emits yellow at the center wavelength, and a wavelength conversion material that emits red at the center wavelength. By mixing, this LED signal light bulb emits light containing three color components like a filament light bulb. And such an LED signal light bulb is replaced with a filament light bulb without replacing the light device or the color lens with respect to the light device of the color light signal device equipped with the filament light bulb. The same amount of light is emitted to the outside.

さらに、ＬＥＤ信号電球について、支持部材を発光ダイオードチップ及びリード部材から電気的に絶縁して、支持部材を給電から解放し、支持部材の役目を支持機能と伝熱機能に絞ったことにより、支持部材の他端部に繋がる放熱手段に係る制約が緩和されることから、例えば特定構造の放熱部材を特定箇所に装着するのも容易になるので、ＬＥＤ信号電球およびその装着先の色灯信号機について、灯器や色レンズを色灯信号機に装備したままフィラメント電球をＬＥＤ信号電球で置き換えるための互換性を無理なく高めることができる。
したがって、この発明によれば、小形化と多色化と高光度化に加えて互換性の課題までもクリアしたＬＥＤ信号電球および色灯信号機を実現することができる。 Furthermore, the LED signal bulb is supported by electrically insulating the support member from the light-emitting diode chip and the lead member, releasing the support member from the power supply, and reducing the role of the support member to the support function and the heat transfer function. Since restrictions on the heat dissipation means connected to the other end of the member are relaxed, for example, it becomes easy to mount a heat dissipation member with a specific structure at a specific location. The interchangeability for replacing the filament light bulb with the LED signal light bulb can be increased without difficulty while the lamp and the color lens are mounted on the color light signal device.
Therefore, according to the present invention, it is possible to realize an LED signal light bulb and a color light signal that have cleared compatibility problems in addition to downsizing, multicoloring, and high luminous intensity.

また、本発明のＬＥＤ信号電球および色灯信号機にあっては（解決手段２）、ＬＥＤ信号電球について、第１樹脂部と第２樹脂部との間に柔軟な第３樹脂部を介在させ、この第３樹脂部で給電用のボンディングワイヤーを囲むようにもしたことにより、第２樹脂部の形成時にボンディングワイヤーが保護されるので第２樹脂部の成型等が容易になる。   Further, in the LED signal bulb and the color lamp signal device of the present invention (Solution means 2), for the LED signal bulb, a flexible third resin portion is interposed between the first resin portion and the second resin portion, Since the power supply bonding wire is surrounded by the third resin portion, the bonding wire is protected during the formation of the second resin portion, so that the second resin portion can be easily molded.

さらに、本発明のＬＥＤ信号電球および色灯信号機にあっては（解決手段３）、青色発光ダイオードチップで発生した熱を放熱部材の放熱フィンへ導くようにもしたことにより、空気・大気への放熱が効率良く行われる。特に鉄道用信号機では灯器のプラスチック化が進んでおり、その場合、灯器に伝達しても十分な放熱は期待できないところ、本発明にあっては、灯器に伝達するまでもなく十分な放熱が行われるので、適切な発光が行えるうえ、灯器を過剰に熱することもない。   Furthermore, in the LED signal bulb and the color lamp signal device of the present invention (Solution means 3), the heat generated in the blue light emitting diode chip is guided to the heat radiating fins of the heat radiating member, so that Heat dissipation is performed efficiently. Especially in railway traffic lights, the use of plastic lamps is progressing. In that case, sufficient heat dissipation cannot be expected even if the lamps are transmitted to the lamps. Since heat is dissipated, appropriate light emission can be performed and the lamp is not excessively heated.

また、本発明のＬＥＤ信号電球および色灯信号機にあっては（解決手段４）、ＬＥＤ信号電球について、電気的な互換性をとるための電力変換回路を導入するとともに、その回路を放熱部材に格納したことにより、取り扱い易く纏まるうえ、不都合なサイズアップを招くことなく互換性を高めることができ、さらには電力変換回路の空冷まで随伴して行なわれることとなる。   Further, in the LED signal bulb and the color lamp signal device of the present invention (Solution means 4), a power conversion circuit for electrical compatibility is introduced for the LED signal bulb, and the circuit is used as a heat dissipation member. By storing it, it is easy to handle, and it is possible to improve compatibility without causing an inconvenient increase in size. Further, it is accompanied by air cooling of the power conversion circuit.

また、本発明の色灯信号機にあっては（解決手段５）、フィラメント電球に代えてＬＥＤ信号電球を灯器に装着するときに灯器内のフィラメント電球保持用ソケット装着部位にＬＥＤ信号電球の放熱部材が装着されるようにもしたことにより、フィラメント電球とそのソケットとを外せば、ＬＥＤ信号電球を灯器に装着するのが可能となる。そのため、取り替え部品が僅かで済むうえ、交換作業も容易になる。   Further, in the color lamp signal device of the present invention (solution 5), when the LED signal bulb is installed in the lamp instead of the filament bulb, the LED signal bulb is attached to the socket for holding the filament bulb in the lamp. Since the heat dissipating member is attached, the LED signal light bulb can be attached to the lamp device by removing the filament light bulb and its socket. Therefore, only a few replacement parts are required, and replacement work is facilitated.

また、本発明のＬＥＤ信号電球および色灯信号機にあっては（解決手段６）、ＬＥＤ信号電球について、発光素子である青色発光ダイオードチップを二列に並べたことにより、鉄道信号で多用されているＧ形電球等とＦＲＰ（遠視野パターン）が同じに又は似たものになる。さらに、それらを直列接続して、その両端と中間の接続点との三箇所から即ち第１〜第３リード部材から給電できるようにもしたことにより、給電態様・駆動態様もＧ形電球等と同様になる。これにより、鉄道信号用Ｇ形電球等との互換性がより高まる。   Moreover, in the LED signal bulb and the color lamp signal device of the present invention (Solution means 6), the LED signal bulb is frequently used in railway signals by arranging blue light emitting diode chips as light emitting elements in two rows. The G-shaped light bulb and the like and the FRP (far field pattern) are the same or similar. Furthermore, by connecting them in series, power can be supplied from three places, that is, both ends and intermediate connection points, that is, from the first to third lead members. It will be the same. Thereby, compatibility with a G-shaped light bulb for railway signals and the like is further increased.

このような本発明のＬＥＤ信号電球および色灯信号機について、これを実施するための具体的な形態を、以下の実施形態１，２及び実施例１により説明する。
図１〜６に示した実施形態１は、上述した解決手段１〜５（出願当初の請求項１〜６，９，１０）を具現化したものであり、図７〜９に示した実施形態２は、上述した解決手段６（出願当初の請求項７，８）をも具現化したものであり、図１０〜１１に示した実施例１は、試作した具体例である。 With regard to the LED signal bulb and the color lamp signal device of the present invention, specific modes for carrying out this will be described with reference to Embodiments 1 and 2 and Example 1 below.
The first embodiment shown in FIGS. 1 to 6 embodies the above-described solving means 1 to 5 (claims 1 to 6, 9, and 10 at the beginning of the application), and the embodiments shown in FIGS. 2 also embodies the above-described solution 6 (claims 7 and 8 at the beginning of the application), and Example 1 shown in FIGS.

［実施形態１］
本発明のＬＥＤ信号電球および色灯信号機の実施形態１について、ＬＥＤ信号電球のＬＥＤランプ部の具体的な構成を、図面を引用して説明する。図１は、（ａ）がその斜視図、（ｂ）が縦断面図、（ｃ）が発光波長特性図である。 [Embodiment 1]
With reference to the drawings, a specific configuration of the LED lamp portion of the LED signal bulb will be described with respect to Embodiment 1 of the LED signal bulb and the color lamp signal device of the present invention. 1A is a perspective view, FIG. 1B is a longitudinal sectional view, and FIG. 1C is an emission wavelength characteristic diagram.

このＬＥＤランプ部１０は、青色発光ダイオードチップ１１を樹脂モールドしたものであり（図１（ａ），（ｂ）参照）、点灯時に赤色と黄色と青色の三種類の波長成分を含む光を出させるため（図１（ｃ）参照）、波長変換材料を樹脂に混入するとともに、放熱の効率向上のため、熱伝導性材料からなる支持部材１２に青色発光ダイオードチップ１１を搭載し（図１（ｂ）参照）更に支持部材１２を給電用リード部材１３，１４から電気的に絶縁している。モールド用樹脂は、第１樹脂部１７と第３樹脂部１８と第２樹脂部１５の三層からなる。青色発光ダイオードチップ１１は電気絶縁体のサファイアを基板に採用しているので、青色発光ダイオードチップ１１の片面の接合には、例えば銀ろう等の熱伝導性接着剤１９ａが用いられている。絶縁性接着材１９ｂによるリード部材１３，１４の固定には、電気絶縁が必要なので、非導電性接着剤が用いられている。リード部材１３，１４は何れもボンディングワイヤー１６で青色発光ダイオードチップ１１と給電可能に接続されている。   This LED lamp unit 10 is a resin molded mold of a blue light emitting diode chip 11 (see FIGS. 1A and 1B), and emits light containing three types of wavelength components of red, yellow and blue when lit. (See FIG. 1C), the wavelength conversion material is mixed into the resin, and the blue light emitting diode chip 11 is mounted on the support member 12 made of a heat conductive material in order to improve the heat dissipation efficiency (FIG. 1 ( See b)) Further, the support member 12 is electrically insulated from the lead members 13 and 14 for power feeding. The molding resin includes three layers of the first resin portion 17, the third resin portion 18, and the second resin portion 15. Since the blue light emitting diode chip 11 employs sapphire, which is an electrical insulator, as a substrate, a heat conductive adhesive 19a such as silver solder is used for joining one side of the blue light emitting diode chip 11. Fixing the lead members 13 and 14 with the insulating adhesive 19b requires electrical insulation, so a non-conductive adhesive is used. Each of the lead members 13 and 14 is connected to the blue light emitting diode chip 11 by a bonding wire 16 so as to be able to supply power.

青色発光ダイオードチップ１１は、市販の青色発光ダイオードに搭載されている公知のベアチップと同じものか或いは可能範囲でサイズアップしたものである。
支持部材１２は、熱伝導性に優れた例えばアルミニウム等の短い丸棒を切削加工して作られ、その一端面の中央には表面を彫り込んで窪み１２ｂが形成されている。支持部材１２の他端部には、露出端１２ａになる凸部が形成されており、その形成は本体より少し小さい。 The blue light-emitting diode chip 11 is the same as a known bare chip mounted on a commercially available blue light-emitting diode, or an increased size within a possible range.
The support member 12 is made by cutting a short round bar such as aluminum having excellent thermal conductivity, and a recess 12b is formed by carving the surface at the center of one end face thereof. The other end portion of the support member 12 is formed with a convex portion that becomes the exposed end 12a, and its formation is slightly smaller than the main body.

窪み１２ｂについて詳述すると、その底辺はフラットで、それを一周する段差部は、反射面として機能するよう、円滑に仕上げられ、傾斜している。そこに納める青色発光ダイオードチップ１１の幅をＷ１とすると、窪み１２ｂ底辺の直径Ｗは、Ｗ１×１．４１＋０．０２ｍｍ≦Ｗ≦Ｗ１×１．４１＋１．０ｍｍが望ましく、さらに望ましくは、Ｗ１×１．４１＋０．１ｍｍ≦Ｗ≦Ｗ１×１．４１＋０．５ｍｍである。なお、数個の青色発光ダイオードチップ１１を搭載する場合、配列の最長辺をＷ１とすれば、やはり上式で窪み１２ｂ底辺の直径Ｗを計算することができる。   The recess 12b will be described in detail. The bottom of the recess 12b is flat, and the stepped portion that goes around the recess 12b is smoothly finished and inclined so as to function as a reflecting surface. When the width of the blue light emitting diode chip 11 accommodated therein is W1, the diameter W of the bottom of the recess 12b is preferably W1 × 1.41 + 0.02 mm ≦ W ≦ W1 × 1.41 + 1.0 mm, and more preferably W1 × 1. 41 + 0.1 mm ≦ W ≦ W1 × 1.41 + 0.5 mm. When several blue light emitting diode chips 11 are mounted, if the longest side of the array is W1, the diameter W of the bottom of the recess 12b can be calculated by the above formula.

窪み１２ｂの深さについては、搭載する青色発光ダイオードチップ１１チップの高さをＴ、波長変換材料を混入した樹脂厚みをｔとすると、深さＨは（Ｔ＋ｔ）≦Ｈ＜（Ｔ＋ｔ）×５が望ましく、さらに望ましくは、（Ｔ＋ｔ）×３≦Ｈ≦（Ｔ＋ｔ）×４である。
また、窪み１２ｂにおける反射面の広がり角度θは、底面に対し３０°以上が望ましく、さらに望ましくは４５°≦θ≦７５°であり、この範囲外ではレンズ面への取り出し効率が低下する。 Regarding the depth of the recess 12b, if the height of the blue light emitting diode chip 11 to be mounted is T and the thickness of the resin mixed with the wavelength conversion material is t, the depth H is (T + t) ≦ H <(T + t) × 5. More preferably, (T + t) × 3 ≦ H ≦ (T + t) × 4.
The spread angle θ of the reflecting surface in the recess 12b is desirably 30 ° or more with respect to the bottom surface, and more desirably 45 ° ≦ θ ≦ 75 °. Outside this range, the extraction efficiency to the lens surface decreases.

このような窪み１２ｂに納めることで青色発光ダイオードチップ１１を支持部材１２に搭載するが、その際、青色発光ダイオードチップ１１と支持部材１２との電気的絶縁を損なわないよう留意して伝熱性能を高めるために、窪み１２ｂの底面に対し薄い熱伝導性接着剤１９ａを介在させて青色発光ダイオードチップ１１の片面を接合させる。例えば、銀ろう等で、窪み１２ｂ底辺中央のフラット部に、青色発光ダイオードチップ１１を搭載固定する。   The blue light-emitting diode chip 11 is mounted on the support member 12 by being housed in such a recess 12b. At this time, attention is paid so as not to impair electrical insulation between the blue light-emitting diode chip 11 and the support member 12. In order to increase the thickness, one surface of the blue light emitting diode chip 11 is bonded to the bottom surface of the recess 12b with a thin heat conductive adhesive 19a interposed therebetween. For example, the blue light emitting diode chip 11 is mounted and fixed on a flat portion at the center of the bottom of the recess 12b with silver solder or the like.

次に、窪み１２ｂの外縁部すなわち支持部材１２の一端面にリード部材１３，１４を絶縁性接着材１９ｂで固定し、窪み１２ｂ内の青色発光ダイオードチップ１１の電極パターンとリード部材１３，１４とをボンディングワイヤー１６で接続する。その際、リード部材１３，１４は、給電のため、アノード電極（正極）とカソード電極（陰極）とに分けて接続する。
それから、青色発光ダイオードチップ１１保護のため窪み１２ｂ内に青色発光ダイオードチップ１１を覆う程度の樹脂を入れて第１樹脂部１７を形成し、その上に柔軟な樹脂を盛り上げて第３樹脂部１８を形成し、これでボンディングワイヤー１６を覆って保護する。なお、これらの第１樹脂部１７及び第３樹脂部１８には、予め、発光中心が黄色の波長変換材料と発光中心が赤色の波長変換材料とを混和させておく。 Next, the lead members 13 and 14 are fixed to the outer edge of the recess 12b, that is, one end surface of the support member 12 with an insulating adhesive 19b, and the electrode pattern of the blue light emitting diode chip 11 and the lead members 13 and 14 in the recess 12b Are connected by a bonding wire 16. At that time, the lead members 13 and 14 are connected separately to the anode electrode (positive electrode) and the cathode electrode (cathode) for power feeding.
Then, in order to protect the blue light emitting diode chip 11, a resin that covers the blue light emitting diode chip 11 is put in the recess 12 b to form the first resin portion 17, and a flexible resin is raised thereon to form the third resin portion 18. , Which covers and protects the bonding wire 16. The first resin portion 17 and the third resin portion 18 are previously mixed with a wavelength conversion material whose emission center is yellow and a wavelength conversion material whose emission center is red.

これらの樹脂の硬化後、青色発光ダイオードチップ１１搭載側である支持部材１２の一端面がレンズ側になるよう、支持部材１２等をモールド用型にセットする。続いて、モールド用型に透明樹脂を充填して第２樹脂部１５を形成するが、その際、支持部材１２の凸部すなわち露出端１２ａは露出するようにしておく。これにより、青色発光ダイオードチップ１１の前方（図では上方）に集光レンズ部１５ａが形成されるとともに、露出端１２ａとリード部材１３，１４の端部を除いて樹脂モールドされたＬＥＤランプ部１０が出来上がる。   After these resins are cured, the support member 12 and the like are set on the mold so that one end surface of the support member 12 on the blue light emitting diode chip 11 mounting side is on the lens side. Subsequently, the mold resin is filled with a transparent resin to form the second resin portion 15. At this time, the convex portion of the support member 12, that is, the exposed end 12 a is exposed. As a result, the condensing lens portion 15a is formed in front of the blue light emitting diode chip 11 (upward in the drawing), and the LED lamp portion 10 is resin-molded except for the exposed end 12a and the end portions of the lead members 13 and 14. Is completed.

なお、充填する樹脂は熱硬化、熱可塑のどちらの樹脂を使ってもよい。また、樹脂と凸部段差は、支持部材１２と透明樹脂の熱膨張係数を考慮し、ＬＥＤランプ部１０の点灯時に支持部材１２の凸部すなわち露出端１２ａが常に水平になるよう又は突出するよう、樹脂充填量を調節しておく。
また、波長変換材料は、第１樹脂部１７と第３樹脂部１８に同じものを同じ濃度で混入しても良く、第１樹脂部１７と第３樹脂部１８とで材質や濃度を異ならせても良く、要するに、ＬＥＤランプ部１０点灯時に出力される光に赤色と黄色と青色の三種類の波長成分が含まれ何れの色も信号機の色レンズで選択して透過させるのに適したものになるのであれば良い（図１（ｃ）参照）。 Note that the resin to be filled may be either a thermosetting resin or a thermoplastic resin. In addition, the resin and the convex step, the thermal expansion coefficients of the support member 12 and the transparent resin are taken into consideration, so that the convex part of the support member 12, that is, the exposed end 12a, is always horizontal or protrudes when the LED lamp unit 10 is turned on. The resin filling amount is adjusted.
Further, the wavelength conversion material may be the same in the first resin portion 17 and the third resin portion 18 at the same concentration, and the first resin portion 17 and the third resin portion 18 are made of different materials and concentrations. In short, the light output when the LED lamp unit 10 is lit contains three types of wavelength components of red, yellow and blue, and any color is suitable for being selected and transmitted by the color lens of the traffic light. (See FIG. 1C).

このようなＬＥＤランプ部１０を組み込んだ本発明のＬＥＤ信号電球について、その具体的な構成を、図面を引用して説明する。図２は、（ａ）がその側面図、（ｂ）がその展開図である。また、図３は、（ａ），（ｂ）何れも電力変換回路の回路図である。   A specific configuration of the LED signal light bulb of the present invention in which the LED lamp unit 10 is incorporated will be described with reference to the drawings. 2A is a side view thereof, and FIG. 2B is a development view thereof. FIG. 3 is a circuit diagram of the power conversion circuit in both (a) and (b).

ＬＥＤ信号電球２０は、上述したＬＥＤランプ部１０に加えて、それを押さえるカバー２１と、伝熱部材と装着部材とを兼ねる連結部材２２と、放熱フィン２３ａの付いた放熱部材２３と、電力変換回路３０を搭載した回路基板２４と、電力変換回路３０の一次側へ給電可能に接続された給電端子３１付きの給電線２５と、リード部材１３，１４と電力変換回路３０の二次側とを給電可能に接続する中継線２６とを具えている。   In addition to the LED lamp section 10 described above, the LED signal light bulb 20 includes a cover 21 that holds the LED lamp section 10, a connecting member 22 that serves as both a heat transfer member and a mounting member, a heat dissipation member 23 with a heat dissipation fin 23a, and power conversion. The circuit board 24 on which the circuit 30 is mounted, the power supply line 25 with the power supply terminal 31 connected to the primary side of the power conversion circuit 30, the lead members 13 and 14, and the secondary side of the power conversion circuit 30. The relay line 26 is connected so as to be able to supply power.

カバー２１は、絶縁性部材から作られ、これには、ＬＥＤランプ部１０を納めるための凹部２１ａが彫り込み形成されるとともに、ＬＥＤランプ部１０の発した光を前方へ送るための透光穴２１ｂが形成される。
連結部材２２は、伝熱のため例えばアルミニウム等の熱伝導性部材を加工して作られ、これには、後述する灯器４０に小ボルトで装着するための装着部２２ａが突出形成されるとともに、中継線２６を挿通させるための穴２２ｂが貫通形成される。 The cover 21 is made of an insulating member. A concave portion 21a for enclosing the LED lamp portion 10 is formed in the cover 21 and a light transmitting hole 21b for sending light emitted from the LED lamp portion 10 forward. Is formed.
The connection member 22 is made by processing a heat conductive member such as aluminum for heat transfer, and is provided with a mounting portion 22a for mounting on the lamp 40 to be described later with a small bolt. The hole 22b for inserting the relay line 26 is formed through.

放熱部材２３は、伝熱・放熱のため例えばアルミニウム等の熱伝導性部材を加工して作られ、その外周面には、多数の放熱フィン２３ａが形成される。また、放熱部材２３の軸線部は、中空２３ｂが貫通形成されて、電力変換回路３０を収納可能な空洞になっている。
カバー２１と連結部材２２、連結部材２２と放熱部材２３、放熱部材２３と回路基板２４は、適宜なネジ又はリベット等で連結固定されるようになっている。 The heat dissipating member 23 is made by processing a heat conductive member such as aluminum for heat transfer and heat dissipation, and a large number of heat dissipating fins 23a are formed on the outer peripheral surface thereof. Further, the axial portion of the heat radiating member 23 has a hollow 23b formed therethrough so as to be a cavity in which the power conversion circuit 30 can be accommodated.
The cover 21 and the connecting member 22, the connecting member 22 and the heat radiating member 23, and the heat radiating member 23 and the circuit board 24 are connected and fixed with appropriate screws or rivets.

ＬＥＤ信号電球２０を組み立てるときは、先ずＬＥＤランプ部１０のリード部材１３，１４に中継線２６を接続し、支持部材１２の露出端１２ａに熱伝導性樹脂を塗布する。次に、その露出端１２ａを連結部材２２の一端面に当接させ、その上からカバー２１を被せて凹部２１ａにＬＥＤランプ部１０を納め、その状態でカバー２１を連結部材２２に固定する。これにより、熱伝導性樹脂の厚みが薄くなって、支持部材１２の露出端１２ａと連結部材２２の一端面とが密着し、両部材間の伝熱性が高まる。   When assembling the LED signal light bulb 20, first, the relay wire 26 is connected to the lead members 13 and 14 of the LED lamp unit 10, and a heat conductive resin is applied to the exposed end 12 a of the support member 12. Next, the exposed end 12 a is brought into contact with one end surface of the connecting member 22, the cover 21 is placed on the exposed end 12 a, the LED lamp unit 10 is placed in the recess 21 a, and the cover 21 is fixed to the connecting member 22 in this state. Thereby, the thickness of the heat conductive resin is reduced, the exposed end 12a of the support member 12 and the one end surface of the connecting member 22 are in close contact with each other, and the heat conductivity between the two members is increased.

それから、連結部材２２の他端面と放熱部材２３の一端面とを適宜なネジ又はリベット等で連結固定する。その際、両部材の当接端面に熱伝導性樹脂を塗布しておくと、両部材間の伝熱性も高まる。また、これらの連結により、連結部材２２を介して放熱部材２３の一端面と支持部材１２の露出端１２ａとが伝熱良好に連結され、ひいては青色発光ダイオードチップ１１と放熱フィン２３ａとに良好な伝熱状態が確立される。
さらに、中継線２６を連結部材２２の穴２２ｂ及び放熱部材２３の中空２３ｂ経由で電力変換回路３０の二次側・出力側に接続してから、電力変換回路３０を搭載した回路基板２４を放熱部材２３の他端面に適宜なネジ又はリベット等で取り付けて、電力変換回路３０を放熱部材２３の中空２３ｂの中に納める。 Then, the other end face of the connecting member 22 and the one end face of the heat radiating member 23 are connected and fixed with appropriate screws or rivets. At that time, if a heat conductive resin is applied to the contact end surfaces of both members, the heat transfer between the two members is also increased. In addition, due to these connections, the one end surface of the heat radiating member 23 and the exposed end 12a of the support member 12 are connected to each other through the connecting member 22 with good heat transfer, and thus the blue light emitting diode chip 11 and the heat radiating fins 23a are good. A heat transfer state is established.
Further, after connecting the relay line 26 to the secondary side / output side of the power conversion circuit 30 via the hole 22b of the connecting member 22 and the hollow 23b of the heat dissipation member 23, the circuit board 24 on which the power conversion circuit 30 is mounted is radiated. The power conversion circuit 30 is accommodated in the hollow 23 b of the heat dissipation member 23 by being attached to the other end surface of the member 23 with an appropriate screw or rivet.

これでＬＥＤ信号電球２０が組み上がり、給電端子３１及び給電線２５を介して電力変換回路３０に外部仕様に基づく所定の電力を供給すると、電力変換回路３０から青色発光ダイオードチップ１１へ内部仕様に基づく所定の電力が供給されて、青色発光ダイオードチップ１１が発光し、さらに、それを受光した波長変換材料によって波長の異なる光が発せられて、何れの色も信号機の色レンズで選択して透過させるのに適した赤色と黄色と青色の三種類の波長成分を含む光が生成され、これがカバー２１の透光穴２１ｂから外部へ出射されることとなる。   As a result, the LED signal bulb 20 is assembled, and when predetermined power based on the external specification is supplied to the power conversion circuit 30 via the power supply terminal 31 and the power supply line 25, the internal specification is supplied from the power conversion circuit 30 to the blue light emitting diode chip 11. The blue light emitting diode chip 11 emits light when a predetermined power is supplied, and light having a different wavelength is emitted by the wavelength conversion material that receives the blue light emitting diode chip 11, and any color is selected and transmitted by the color lens of the traffic light. Light including three types of wavelength components, red, yellow, and blue, suitable for the generation, is generated and emitted to the outside from the light transmitting hole 21 b of the cover 21.

また、青色発光ダイオードチップ１１で発生した熱は、熱伝導性接着剤１９ａと支持部材１２と連結部材２２と放熱部材２３を介して放熱フィン２３ａに伝達され、さらに放熱フィン２３ａから空気・大気に放出される。しかも、その放熱効率が良いので、青色発光ダイオードチップ１１と放熱フィン２３ａ周囲の空気との温度差が、大きく開かず、小さくとどまることとなる。さらに、電力変換回路３０で発生した熱も、放熱部材２３において中空２３ｂから放熱フィン２３ａへ伝達され、速やかに空気・大気へ放出される。   The heat generated in the blue light emitting diode chip 11 is transmitted to the heat radiating fins 23a through the heat conductive adhesive 19a, the support member 12, the connecting member 22, and the heat radiating member 23, and further from the heat radiating fins 23a to the air / atmosphere. Released. In addition, since the heat dissipation efficiency is good, the temperature difference between the blue light emitting diode chip 11 and the air around the heat dissipation fins 23a does not open greatly but remains small. Further, the heat generated in the power conversion circuit 30 is also transmitted from the hollow 23b to the heat radiating fins 23a in the heat radiating member 23 and quickly released to the air / atmosphere.

その電力変換回路３０の具体例を二つ挙げると、先ず基本的なものは（図３（ａ）参照、特許文献１の図７等も参照）、給電端子３１から青色発光ダイオードチップ１１への給電路に介挿されたトランス３２と整流器３３（整流回路）と定電流用素子３４（ダイオードや抵抗）とを具えている。そして、一対の給電端子３１に駆動用の交流電圧が印加されると、その電圧はトランス３２で適宜なレベルに変換され、整流器３３で交流が脈流に変換され、そうして生成された電流が青色発光ダイオードチップ１１に供給されて、交流電圧が印加されれば点灯し、印加が停止されれば滅灯するようになっている。   Two specific examples of the power conversion circuit 30 are as follows. First, the basic one (see FIG. 3A, see FIG. 7 of Patent Document 1) is connected from the power supply terminal 31 to the blue light emitting diode chip 11. A transformer 32, a rectifier 33 (rectifier circuit), and a constant current element 34 (diode or resistor) inserted in the power supply path are provided. When a driving AC voltage is applied to the pair of power supply terminals 31, the voltage is converted to an appropriate level by the transformer 32, and the AC is converted to a pulsating current by the rectifier 33. Is supplied to the blue light emitting diode chip 11 and is turned on when an AC voltage is applied, and turned off when the application is stopped.

また、入力電源電圧が変動しても光度が一定に保たれるよう改良したものは（図３（ｂ）参照、特許文献１の図１，図２等も参照）、整流回路３３と青色発光ダイオードチップ１１との間に平滑回路３６および定電流制御回路３７を設け、これで青色発光ダイオードチップ１１への供給電流を検出するとともに一定に制御するようになっている。さらには、平滑回路３６から青色発光ダイオードチップ１１への供給電流についてその有無を検知する検知手段３８と、その検知結果に基づき給電端子３１の通電量についてその大小を切り替える通電量切替手段３５も具えている。なお、これらは例示であり、電力変換回路３０はこれらに限られる訳ではない。   Further, an improvement in which the luminous intensity is kept constant even when the input power supply voltage fluctuates (see FIG. 3B, see also FIG. 1, FIG. 2, etc. of Patent Document 1), the rectifier circuit 33 and the blue light emission. A smoothing circuit 36 and a constant current control circuit 37 are provided between the diode chip 11 and the supply current to the blue light emitting diode chip 11 is detected and controlled to be constant. Furthermore, a detecting means 38 for detecting the supply current from the smoothing circuit 36 to the blue light-emitting diode chip 11 and an energization amount switching means 35 for switching the energization amount of the power supply terminal 31 based on the detection result are provided. It is. These are examples, and the power conversion circuit 30 is not limited to these.

このようなＬＥＤ信号電球２０を装着する色灯信号機の灯器について、その具体的な構成を、図面を引用して説明する。図４は、（ａ），（ｂ）何れも灯器の要部の縦断面図であり、（ａ）がフィラメント電球の装着状態、（ｂ）がＬＥＤ信号電球の装着状態を示している。   A specific configuration of the lamp of the color lamp signal device to which the LED signal bulb 20 is mounted will be described with reference to the drawings. FIGS. 4A and 4B are longitudinal sectional views of the main part of the lamp. FIG. 4A shows a state in which a filament bulb is attached, and FIG. 4B shows a state in which an LED signal bulb is attached.

この灯器４０は、ＪＲＳ２２３１２−１Ｈ−１４ＡＲ５Ｃで規定する多灯形色灯信号機に装備されるものであり、ＪＲＳ３３１０４−１で規定するＧ形の信号電球を装着しうるようになっている。信号レンズには、レンズフレーム４１にて内外に保持された組合わせレンズが採用され、外側のレンズ４２は無色であるが、内側のレンズ４３は有色で色レンズとなっている。レンズ４３の更に内側にフィラメント電球４６を保持するため（図４（ａ）参照）、そこには、レンズフレーム４１に固定された電球取付部４４が設けられている。また、給電線２５の付いたソケット４５をフィラメント電球４６と共に電球取付部４４に着脱することで、フィラメント電球４６への給電可能状態が確立されるようにもなっている。   The lamp 40 is mounted on a multi-lamp color lamp traffic light specified by JRS2232-12-1H-14AR5C, and can be equipped with a G-shaped signal light bulb specified by JRS33104-1. The signal lens employs a combination lens held inside and outside by a lens frame 41, and the outer lens 42 is colorless, while the inner lens 43 is colored and is a color lens. In order to hold the filament light bulb 46 further inside the lens 43 (see FIG. 4A), a light bulb mounting portion 44 fixed to the lens frame 41 is provided therein. In addition, by attaching / detaching the socket 45 with the power supply line 25 to / from the light bulb mounting portion 44 together with the filament light bulb 46, a state where power can be supplied to the filament light bulb 46 is established.

これに対し、灯器４０にＬＥＤ信号電球２０を装着する場合（図４（ｂ）参照）、フィラメント電球４６だけを置き換えるという訳にはいかないが、上述したようにＬＥＤ信号電球２０は、連結部材２２の装着部２２ａがソケット４５における電球取付部４４への装着部との互換性を具えているので、フィラメント電球４６と共にソケット４５を灯器４０から取り外せば、フィラメント電球４６のときと概ね同様にして、ＬＥＤ信号電球２０を電球取付部４４に取り付けることができる。もともとソケット４５はフィラメント電球４６と共に着脱されており、これらを一緒に取り外す作業に違和感や負担増は生じないので、フィラメント電球４６をＬＥＤ信号電球２０で交換する作業や、ＬＥＤ信号電球２０同士を付け替える作業は、フィラメント電球４６同士を付け替える従前の作業と同じく容易に行える。   On the other hand, when the LED signal light bulb 20 is attached to the lamp 40 (see FIG. 4B), it is not possible to replace only the filament light bulb 46. However, as described above, the LED signal light bulb 20 includes the connecting member. 22 is compatible with the mounting portion of the socket 45 attached to the light bulb mounting portion 44. Therefore, if the socket 45 is removed from the lamp 40 together with the filament light bulb 46, it is almost the same as that of the filament light bulb 46. Thus, the LED signal light bulb 20 can be attached to the light bulb attachment portion 44. Originally, the socket 45 is attached and detached together with the filament light bulb 46, and there is no sense of incongruity or burden on the work of removing them together. Therefore, the operation of exchanging the filament light bulb 46 with the LED signal light bulb 20 or the replacement of the LED signal light bulbs 20 is performed. The work can be easily performed in the same manner as the previous work of replacing the filament light bulbs 46.

この実施形態１のＬＥＤ信号電球および色灯信号機について、その使用態様及び動作を、図面を引用して説明する。図５は、（ａ），（ｂ）何れも灯箱の要部の縦断面図であり、（ａ）がフィラメント電球の装着状態、（ｂ）がＬＥＤ信号電球の装着状態を示している。また、図６は、（ａ），（ｂ）何れも灯箱の縦断面図および信号機柱への装着状態を示し、（ａ）がフィラメント電球だけの装着状態、（ｂ）が三箇所のうち一箇所だけＬＥＤ信号電球を装着した状態を示している。   The use mode and operation of the LED signal light bulb and the color light signal of Embodiment 1 will be described with reference to the drawings. FIGS. 5A and 5B are longitudinal sectional views of the main part of the lamp box, where FIG. 5A shows a state in which a filament bulb is attached, and FIG. 5B shows a state in which an LED signal bulb is attached. 6 (a) and 6 (b) both show a longitudinal sectional view of the lamp box and a state where it is mounted on a traffic light pole, where (a) is a state where only a filament bulb is mounted, and (b) is one of three locations. The state where the LED signal light bulb is attached to only the part is shown.

灯器４０は、フィラメント電球４６を装着するか（図５（ａ）参照）、ＬＥＤ信号電球２０を装着するか（図５（ｂ）参照）に拘わらず、何れの場合も、灯箱５０の中に納めた状態で、庇５２の下の開口部に取着される。そして、フィラメント電球４６やＬＥＤ信号電球２０を着脱するときには、灯箱５０の後背側の灯箱蓋５１を開けて作業するようになっている。   Regardless of whether the light bulb 40 is equipped with a filament light bulb 46 (see FIG. 5A) or an LED signal light bulb 20 (see FIG. 5B), And is attached to the opening below the flange 52. When the filament light bulb 46 or the LED signal light bulb 20 is attached or detached, the work is performed with the light box lid 51 on the rear side of the light box 50 opened.

そのような灯器４０を複数装備した多灯形色灯信号機の場合、例えば三個の灯器４０がそれぞれ青・黄・赤の三色に分かれて点灯する鉄道信号機の場合（図６参照、ＪＲＳ２２３１２−１Ｈ−１４ＡＲ５Ｃの規定も参照）、三個の灯器４０が縦一列に並んだ状態で縦長の灯箱５０に装備され、その灯箱５０が信号機柱６０にて適宜高さに支持され適宜方向に向けられる。そのうち下側の赤色灯Ｒ（第１灯器４０）のレンズ４３には赤色の色レンズが装着され、中間の黄色灯Ｙ（第２灯器４０）のレンズ４３には黄色の色レンズが装着され、上側の青色灯Ｇ（第３灯器４０）のレンズ４３には青色の色レンズが装着されている。   In the case of a multi-lamp type color light signal equipped with a plurality of such lamps 40, for example, in the case of a railway signal light in which three lamps 40 are lit in three colors of blue, yellow and red, respectively (see FIG. 6, JRS2232-1H-14AR5C), and three lamps 40 are mounted in a vertically long lamp box 50 in a state of being aligned in a vertical row, and the lamp box 50 is supported at an appropriate height by a traffic light pole 60 and has an appropriate direction. Directed to. Among them, a red color lens is mounted on the lens 43 of the lower red light R (first lamp 40), and a yellow color lens is mounted on the lens 43 of the middle yellow lamp Y (second lamp 40). A blue color lens is attached to the lens 43 of the upper blue lamp G (third lamp 40).

上述したように、これらの灯器４０は、何れも（Ｒ，Ｙ，Ｇ）、電球取付部４４を内蔵していて、フィラメント電球４６保持用のソケット４５を内装可能なものであり、このような灯器４０を装備したままの色灯信号機の場合、従来ではフィラメント電球４６だけが取り付けられていた（図６（ａ）参照）。しかし、本発明のＬＥＤ信号電球２０が開発されたことにより、上述したように、フィラメント電球４６をソケット４５と共に電球取付部４４から外して、その代わりにＬＥＤ信号電球２０を電球取付部４４に取り付けるということが可能なので、例えば上側の青色灯Ｇが球切れしたときや定期交換のときなどを利用して手軽にＬＥＤ信号電球２０に交換することができる（図６（ｂ）参照）。ＬＥＤ信号電球２０とフィラメント電球４６とを一台の色灯信号機に混在させて使用することも、ＬＥＤ信号電球２０で揃えることも、無理なくできる。   As described above, each of these lamps 40 (R, Y, G) has a built-in light bulb mounting portion 44 and can be equipped with a socket 45 for holding a filament light bulb 46. In the case of a color lamp signal device that is still equipped with a simple lamp device 40, only the filament light bulb 46 is conventionally attached (see FIG. 6A). However, as a result of the development of the LED signal light bulb 20 of the present invention, as described above, the filament light bulb 46 is removed together with the socket 45 from the light bulb attachment portion 44, and instead the LED signal light bulb 20 is attached to the light bulb attachment portion 44. Therefore, it is possible to easily replace the LED signal light bulb 20 by using, for example, when the upper blue light G is out of a bulb or when it is regularly replaced (see FIG. 6B). The LED signal light bulb 20 and the filament light bulb 46 can be mixed and used in a single color light signal device, or can be aligned with the LED signal light bulb 20 without difficulty.

［実施形態２］
本発明のＬＥＤ信号電球および色灯信号機の実施形態２について、その具体的な構成を、図面を引用して説明する。図７は、Ｇ形のＬＥＤ信号電球および色灯信号機の構造を示し、（ａ）が対比用フィラメント電球の横断面図、（ｂ）が本発明のＬＥＤ信号電球におけるＬＥＤ搭載部の平面図、（ｃ）が色灯信号機の目視状態を示す模式図である。また、図８は、（ａ）が電力変換回路の回路図、（ｂ）がＬＥＤ信号電球の等価回路の回路図である。 [Embodiment 2]
A specific configuration of Embodiment 2 of the LED signal light bulb and the color light signal device of the present invention will be described with reference to the drawings. FIG. 7 shows the structure of a G-shaped LED signal light bulb and a color light signal device, (a) is a cross-sectional view of a comparison filament light bulb, (b) is a plan view of an LED mounting portion in the LED signal light bulb of the present invention, (C) is a schematic diagram which shows the visual condition of a color lamp signal apparatus. 8A is a circuit diagram of a power conversion circuit, and FIG. 8B is a circuit diagram of an equivalent circuit of an LED signal bulb.

鉄道信号機に従来より使用されているＧ形フィラメント電球４６では（図７（ａ）参照）、二本のフィラメント４６ａが並列に配設されており、その幅Ｈは約３ｍｍで長さＷ１は約６ｍｍである。
本発明のＬＥＤ信号電球７０は（図７（ｂ）参照）、そのようなフィラメントの配置に対応させて多数個の青色発光ダイオードチップ１１を配置したものである。具体的には、複数の青色発光ダイオードチップ１１（図では四個ずつ）が二列に並んで支持部材１２の窪み１２ｂの底面に配設されている。その二列分の幅Ｈも約３ｍｍで長さＷ１も約６ｍｍである。 In the G-type filament bulb 46 conventionally used for railway traffic lights (see FIG. 7A), two filaments 46a are arranged in parallel, the width H is about 3 mm, and the length W1 is about 6 mm.
The LED signal light bulb 70 of the present invention (see FIG. 7B) has a large number of blue light-emitting diode chips 11 arranged in correspondence with the arrangement of such filaments. Specifically, a plurality of blue light emitting diode chips 11 (four in the figure) are arranged in two rows on the bottom surface of the recess 12b of the support member 12. The two rows have a width H of about 3 mm and a length W1 of about 6 mm.

このように発光素子である青色発光ダイオードチップ１１をフィラメント４６ａ対応で二列に並べたことにより、灯箱５０の灯器４０にＬＥＤ信号電球７０を装着し（図７（ｃ）参照）それを点灯させて送光範囲７１内から見ると、そのときのＦＲＰ（遠視野パターン）がフィラメント電球４６点灯時とほとんど同じになる。
また、このようなＬＥＤ信号電球７０には、Ｇ形への適格性を更に高めるために、給電端子が二端子から三端子になっている。 Thus, by arranging the blue light emitting diode chips 11 as the light emitting elements in two rows corresponding to the filament 46a, the LED signal bulb 70 is mounted on the lamp 40 of the lamp box 50 (see FIG. 7C), and it is turned on. When viewed from within the light transmission range 71, the FRP (far field pattern) at that time is almost the same as when the filament bulb 46 is lit.
Moreover, in order to further improve the eligibility for the G-shaped LED signal bulb 70, the power supply terminals are changed from two terminals to three terminals.

すなわち、詳細な機械図面は割愛して電気回路図の中で示したが（図８参照）、ＬＥＤ信号電球２０においては二個であったリード部材１３，１４が第１リード部材８１，第２リード部材８２，第３リード部材８３の三個に増えている。また、これに対応して、第１リード部材８１と第２リード部材８２とが、二列の青色発光ダイオードチップ１１のうち一方の列に配されたものと給電可能に接続され、第２リード部材８２と第３リード部材８３とが、二列の青色発光ダイオードチップ１１のうち他方の列に配されたものと給電可能に接続されている。その際、各列における複数の青色発光ダイオードチップ１１は、直並列に接続しても（図８（ａ）参照）、直列接続しても（図８（ｂ）参照）、並列接続しても（不図示）良い。   That is, although detailed mechanical drawings are omitted and shown in the electric circuit diagram (see FIG. 8), the two lead members 13 and 14 in the LED signal light bulb 20 are the first lead member 81 and the second lead member 81, respectively. The number of lead members 82 and third lead members 83 is increased to three. Correspondingly, the first lead member 81 and the second lead member 82 are connected to one of the two rows of blue light emitting diode chips 11 so as to be able to supply power, and the second lead The member 82 and the third lead member 83 are connected to the two rows of blue light emitting diode chips 11 arranged in the other row so as to be able to supply power. At that time, the plurality of blue light emitting diode chips 11 in each row may be connected in series (see FIG. 8A), connected in series (see FIG. 8B), or connected in parallel. (Not shown) Good.

給電端子３１も三個になっており、それらの給電端子３１とリード部材８１〜８３とに介挿接続される電力変換回路８０は上述の電力変換回路３０を二重化したものとなっている。具体的には（図８（ａ）参照）、一番目の給電端子３１は一組目のトランス３２及び整流器３３等の一次側に接続され、その二次側に第１リード部材８１が接続される。二番目の給電端子３１は第２リード部材８２に接続され、三番目の給電端子３１は二組目のトランス３２及び整流器３３等の一次側に接続され、その二次側に第３リード部材８３が接続される。これにより、電力変換回路８０は、ＬＥＤ信号電球７０において、二列分の青色発光ダイオードチップ１１を纏めて点灯させることも、各列ごとに点灯させることもできるものとなる。   There are also three power supply terminals 31, and a power conversion circuit 80 that is inserted and connected to the power supply terminals 31 and the lead members 81 to 83 is a doubled power conversion circuit 30 described above. Specifically (see FIG. 8A), the first power supply terminal 31 is connected to the primary side of the first set of transformer 32 and rectifier 33, and the first lead member 81 is connected to the secondary side thereof. The The second power supply terminal 31 is connected to the second lead member 82, the third power supply terminal 31 is connected to the primary side of the second set of transformer 32 and rectifier 33, and the third lead member 83 is connected to the secondary side thereof. Is connected. As a result, the power conversion circuit 80 can turn on the blue light emitting diode chips 11 for two rows in the LED signal light bulb 70 as well as turn on each row.

この実施形態２のＬＥＤ信号電球および色灯信号機について、その使用態様及び動作を、図面を引用して説明する。図９は、（ａ）がＧ形ＬＥＤ信号電球の記号の説明図、（ｂ）が三灯の色灯信号機の内部配線例、（ｃ）が四灯の色灯信号機の内部配線例である。
図９（ｂ），（ｃ）における内部配線例の図示に際しては（図９（ａ）参照）、第１リード部材８１に電力変換回路８０を介して給電する給電端子３１には符号「Ｓ」を付し、第２リード部材８２に接続された給電端子３１には符号「Ｃ」を付し、第３リード部材８３に電力変換回路８０を介して給電する給電端子３１には符号「Ｍ」を付している。 The use mode and operation of the LED signal light bulb and the color light signal of Embodiment 2 will be described with reference to the drawings. 9A is an explanatory diagram of symbols of a G-shaped LED signal bulb, FIG. 9B is an example of internal wiring of a three-color signal light signal, and FIG. 9C is an example of internal wiring of a four-color signal light signal. .
When the internal wiring examples in FIGS. 9B and 9C are illustrated (see FIG. 9A), the power supply terminal 31 that supplies power to the first lead member 81 via the power conversion circuit 80 is denoted by “S”. The power supply terminal 31 connected to the second lead member 82 is denoted by “C”, and the power supply terminal 31 that supplies power to the third lead member 83 via the power conversion circuit 80 is denoted by “M”. Is attached.

これらの内部配線例は（図９（ｂ），（ｃ）参照）、鉄道規格ＪＲＳ２２３１２−１Ｈ−１４ＡＲ５Ｃに記載されており、公知のものなので、その詳細な説明は割愛するが、赤色灯Ｒと黄色灯Ｙと青色灯Ｇとの三灯を装備してＬＥＤ信号電球７０における二列分の青色発光ダイオードチップ１１を纏めて点灯させる色灯信号機にあっても（図９（ｂ）参照）、黄色灯Ｙ１と青色灯Ｇと赤色灯Ｒと黄色灯Ｙ２との四灯に加えて電圧平衡器９１も装備してＬＥＤ信号電球７０における青色発光ダイオードチップ１１を各列ごとに点灯させる色灯信号機にあっても（図９（ｃ）参照）、本発明のＬＥＤ信号電球７０はＧ形フィラメント電球４６と同様に使用することができる。 Examples of these internal wirings (see FIGS. 9B and 9C) are described in the railway standard JRS2232-1H-14AR5C, and are publicly known, so detailed description thereof is omitted, but the red light R and Even in a color lamp signal device that is equipped with three lamps of a yellow lamp Y and a blue lamp G and lights together the blue light emitting diode chips 11 of two rows in the LED signal bulb 70 (see FIG. 9B), color lighting the blue light emitting diode chip 11 in the yellow light Y 1 and LED signal bulb 70 also equipped with a voltage balancer 91 in addition to the four lights of blue light G and red light R and the yellow light Y 2 for each column Even if it exists in a light signal machine (refer FIG.9 (c)), the LED signal light bulb 70 of this invention can be used similarly to the G-type filament light bulb 46. FIG.

本発明のＬＥＤ信号電球の実施例１について、その具体的な構成を、図面を引用して説明する。図１０は発光波長変動特性図、図１１は発光強度特性図である。   About the Example 1 of the LED signal bulb of this invention, the specific structure is demonstrated referring drawings. FIG. 10 is an emission wavelength variation characteristic diagram, and FIG. 11 is an emission intensity characteristic diagram.

ＬＥＤ信号電球を試作するため、厚さ５ｍｍ、直径１５ｍｍのアルミニウム円板を、表面側に底面の直径が１０ｍｍ，反射面の角度が６０°，２ｍｍの窪み，裏面側に直径１２．５ｍｍ、段差２ｍｍの凸部になるようプレス加工した放熱プレート（支持部材１２）の表面ドーナツ状フラット面（一端面）に非導電性接着材ムロマックボンドＨ−３３３Ｃを薄く塗布し、プレスで打ち抜き下地に１μｍのニッケルめっき、表面に３μｍの銀メッキした給電フレーム（リード部材１３，１４）を９８０６６Ｐａ（１．０ｋｇ／ｃｍ２）の加重を掛けた状態で１５０℃の雰囲気で３０分間硬化した。 To make a prototype LED signal bulb, an aluminum disk with a thickness of 5 mm and a diameter of 15 mm, a bottom diameter of 10 mm on the front side, a reflection surface angle of 60 °, a recess of 2 mm, a diameter of 12.5 mm on the back side, a step A non-conductive adhesive Muromac Bond H-333C is thinly applied to the surface donut-shaped flat surface (one end surface) of the heat radiating plate (support member 12) that has been press-processed so as to have a 2 mm convex portion, and punched with a press to have a thickness of 1 μm. The power supply frame (lead members 13 and 14) having a nickel plating and a silver plating of 3 μm on the surface was cured in an atmosphere of 150 ° C. for 30 minutes under a load of 98066 Pa (1.0 kg / cm 2 ).

なお、本実施例では接着強度２３５３５９６０Ｐａ（２４０ｋｇ／ｃｍ２）を使用したが、硬化後の接着強度が１４７０９９７５Ｐａ（１５０ｋｇ／ｃｍ２）以上が望ましい。また、非導電性接着剤の塗布はスタンピング方式で行ったが、スクリーン印刷、ディスペンス方式でもよい。硬化時の加重は１９６１３３Ｐａ〜４９０３３Ｐａ（２．０〜０．５ｋｇ／ｃｍ２）が望ましく、加重を大きくすると電気絶縁されない場合が生じやすくなる。また、加重をかけない場合には接着材の厚みが不均一となり硬化後の接着強度にバラツキが生じ信頼性が落ちる原因となる。また、事前に給電フレーム（リード部材１３，１４）または放熱プレート（支持部材１２）に数μｍの厚みに非導電性接着剤を塗布し硬化しておくことにより、より絶縁性は確保される。 In this example, an adhesive strength of 2535960 Pa (240 kg / cm 2 ) was used, but the adhesive strength after curing is preferably 147099975 Pa (150 kg / cm 2 ) or more. The non-conductive adhesive is applied by a stamping method, but may be a screen printing or a dispensing method. The weight at the time of curing is preferably 196133 Pa to 49033 Pa (2.0 to 0.5 kg / cm 2 ). When the weight is increased, the case where electrical insulation is not likely to occur. In addition, when no weight is applied, the thickness of the adhesive becomes non-uniform, resulting in variations in the adhesive strength after curing, leading to reduced reliability. Insulating properties are further ensured by applying a non-conductive adhesive to the power supply frame (lead members 13 and 14) or the heat radiating plate (support member 12) in advance to a thickness of several μm and curing.

上記の放熱プレート（支持部材１２）の窪み１２ｂの底面に青色発光ダイオードチップ１１（チップサイズ１．０ｍｍ角、チップ高さ０．０７５ｍｍ、材質ＧａＮ/サファイヤ）６個を非導電性接着剤ムロマックボンドＨ−３３３Ｃで配置固定し、青色発光ダイオードチップ１１表面の電極および給電フレーム（リード部材１３，１４）をφ２５μｍの金線（ボンディングワイヤー１６）で接続した。青色発光ダイオードチップ１１の固定に使用する非導電性樹脂は、透明または白色樹脂がより望ましく、着色樹脂は光の吸収によりレンズ面への光の取り出し効率が低下する。また、樹脂の色によっては本来の青色発光ダイオードチップ１１の発光色と異なる色度となる不具合が生じる。   Six blue light emitting diode chips 11 (chip size: 1.0 mm square, chip height: 0.075 mm, material GaN / sapphire) are placed on the bottom surface of the recess 12b of the heat dissipation plate (support member 12). The electrodes were placed and fixed with a bond H-333C, and the electrodes on the surface of the blue light-emitting diode chip 11 and the power supply frame (lead members 13 and 14) were connected with a gold wire (bonding wire 16) of φ25 μm. The non-conductive resin used for fixing the blue light-emitting diode chip 11 is more preferably a transparent or white resin, and the colored resin reduces light extraction efficiency to the lens surface due to light absorption. Further, depending on the color of the resin, there is a problem that the chromaticity is different from the emission color of the original blue light emitting diode chip 11.

続いて、青色発光ダイオードチップ１１チップ搭載の窪み１２ｂに透明シリコン樹脂１００部に対し発光中心波長が５３０ｎｍの波長変換材料Ｐ７−Ｙ１（化成オプトニクス製）４０部と発光中心波長が６２６ｎｍの波長変換材料Ｐ２２−ＲＥ３（同上）２５部を混合した樹脂（第１樹脂部１７）を青色発光ダイオードチップ１１表面が１ｍｍの厚みで覆われるように充填した。次にその樹脂（第１樹脂部１７）の表面に、ボンディングワイヤー１６を覆う形状で、同波長変換材料を含むＴＳＪ３１５０透明シリコン樹脂（第３樹脂部１８）を塗布し、硬化後チップ搭載面側が下側になるよう金型に装着した。その際、金型についてもレンズ面（レンズ部１５ａ）が下になるようにした。それから、透明エポキシ樹脂（第２樹脂部１５）を金型と放熱プレート隙間から放熱プレートの凸部（露出端１２ａ）とフラットになるよう注入し、１２０℃で硬化後、金型から取り外しＬＥＤ信号電球７０のＬＥＤランプ部を作成した。   Subsequently, 40 parts of wavelength conversion material P7-Y1 (manufactured by Kasei Optonics) having a light emission center wavelength of 530 nm and wavelength conversion of light emission center wavelength of 626 nm with respect to 100 parts of transparent silicon resin in the depression 12b mounted with the blue light emitting diode chip 11 chip. A resin (first resin portion 17) obtained by mixing 25 parts of the material P22-RE3 (same as above) was filled so that the surface of the blue light emitting diode chip 11 was covered with a thickness of 1 mm. Next, on the surface of the resin (first resin portion 17), TSJ3150 transparent silicon resin (third resin portion 18) containing the same wavelength conversion material is applied so as to cover the bonding wire 16, and the chip mounting surface side after curing is applied to the surface of the resin (first resin portion 17). The mold was mounted on the bottom side. At that time, the lens surface (lens portion 15a) was also turned down on the mold. Then, a transparent epoxy resin (second resin portion 15) is injected from the gap between the mold and the heat radiating plate so as to be flat with the convex portion (exposed end 12a) of the heat radiating plate. The LED lamp part of the light bulb 70 was created.

なお、本実施例では黄色発光成分として（Ｚｎ，Ｃｄ）Ｓ：Ｃｕを使用したが、発光中心が５００ｎｍから５６０ｎｍの範囲のものであればよい。また、赤色発光成分としてＰＲ−ＲＥ３（ＹＯＳ：Ｅｕ）を使用したが、発光中心が５１５ｎｍから６６０ｎｍの範囲の波長変換材料であれば特に問題はない。本実施例ではレンズおよびケース用（第２樹脂部１５）として透明エポキシ樹脂を使用したが、インサート成形等、他の成形方法を用いれば透明ポリカーボネート樹脂、アクリル樹脂等も使用できる。   In this embodiment, (Zn, Cd) S: Cu is used as the yellow light-emitting component, but the light emission center may be in the range of 500 nm to 560 nm. Moreover, although PR-RE3 (YOS: Eu) was used as a red light emitting component, there is no particular problem as long as the wavelength conversion material has a light emission center in the range of 515 nm to 660 nm. In this embodiment, a transparent epoxy resin is used for the lens and case (second resin portion 15). However, a transparent polycarbonate resin, an acrylic resin, or the like can be used if other molding methods such as insert molding are used.

次に、上記ＬＥＤランプ部の放熱プレート（支持部材１２）の凸部（露出端１２ａ）に熱伝導性コンパウンドＧ７５１（信越シリコン製）を塗布し、内部が空洞の放熱器（放熱部材２３）のフラット面にＬＥＤランプ部のレンズ面側からランプのレンズ部１５ａが露出する形状のカバー２１で固定する。一方、電子制御部品（電力変換回路３０）を搭載したエポキシ回路基板２４とＬＥＤランプ部の給電フレーム（リード部材１３，１４）とはケーブル（中継線２６）で接続し、電子制御部品（電力変換回路３０）を放熱器（放熱部材２３）内部の空洞部（中空２３ｂ）に収納する形でエポキシ回路基板２４を固定し、鉄道信号機用ＬＥＤ光源（ＬＥＤ信号電球２０）を作製した。それを点灯させて発光波長特性を測定したところ赤・黄・青の三色成分が適度に含まれていた（図１（ｃ）参照）。   Next, heat conductive compound G751 (made by Shin-Etsu silicon) is applied to the convex part (exposed end 12a) of the heat dissipation plate (support member 12) of the LED lamp part, and the inside of the radiator (heat dissipation member 23) having a hollow interior is applied. A flat surface is fixed with a cover 21 having a shape in which the lens portion 15a of the lamp is exposed from the lens surface side of the LED lamp portion. On the other hand, the epoxy circuit board 24 on which the electronic control component (power conversion circuit 30) is mounted and the power supply frame (lead members 13 and 14) of the LED lamp part are connected by a cable (relay line 26), and the electronic control component (power conversion) The epoxy circuit board 24 was fixed in such a manner that the circuit 30) was housed in a hollow portion (hollow 23b) inside the heat radiator (heat radiating member 23), and an LED light source (LED signal light bulb 20) for a railway traffic signal was produced. When it was turned on and the emission wavelength characteristics were measured, three color components of red, yellow, and blue were appropriately contained (see FIG. 1C).

［その他］
比較のため、上記実施例１の方法で、本発明のＬＥＤランプ部を２２４個作成し、それらを従来品と同じ同心円状に配置したＬＥＤ照明具を作成した（比較例）。そして、それを７個直列３２並列の電気回路で点灯させ、ＬＥＤランプ一個に流れる電流値を基準に、本発明のＬＥＤランプを、ディスクリートランプを搭載した従来品Ｂｂ、金属積層基板を用いた従来品Ｂａと比較した。図１０の発光波長変動特性図，図１１の発光強度特性図に示すように、従来品Ｂｂ（波線グラフ参照）は３０ｍＡ付近まで比例的に出力は増加するものの、５０ｍＡを超えると出力は低下した。また、従来品Ｂａ（波線グラフ参照）についても９０ｍＡを超えると出力低下がみられた。発光波長についても、ほぼＬＥＤチップの温度に対応していると推測される波長変動をした。一方、本比較例（実線グラフＡ参照）で作成したＬＥＤ照明具は１６０ｍＡまで略比例的に光度が得られ、発光波長変動についても従来品の１／３〜１／２の変動であった。 [Others]
For comparison, 224 LED lamp parts of the present invention were created by the method of Example 1 described above, and an LED illuminator in which they were arranged concentrically as in the conventional product was created (Comparative Example). Then, seven of them are turned on by an electric circuit of 32 in series, and based on the current value flowing through one LED lamp, the LED lamp of the present invention is a conventional product Bb on which a discrete lamp is mounted, and a conventional product using a metal laminated substrate. Comparison with product Ba. As shown in the emission wavelength variation characteristic diagram of FIG. 10 and the emission intensity characteristic diagram of FIG. 11, the output of the conventional product Bb (see the wavy line graph) increases proportionally to around 30 mA, but the output decreases when it exceeds 50 mA. . Also, the output of the conventional product Ba (see the wavy line graph) was reduced when it exceeded 90 mA. As for the emission wavelength, the wavelength was estimated to correspond to the temperature of the LED chip. On the other hand, the LED illuminator created in this comparative example (see the solid line graph A) has a luminous intensity approximately proportionally up to 160 mA, and the emission wavelength variation was also 1/3 to 1/2 of the conventional product.

本発明の実施形態１について、ＬＥＤランプ部の構造を示し、（ａ）が斜視図、（ｂ）が縦断面図、（ｃ）が発光波長特性図である。The structure of an LED lamp part is shown about Embodiment 1 of this invention, (a) is a perspective view, (b) is a longitudinal cross-sectional view, (c) is a light emission wavelength characteristic view. ＬＥＤ信号電球の構造を示し、（ａ）が側面図、（ｂ）が展開図である。The structure of an LED signal bulb is shown, (a) is a side view, and (b) is a development view. （ａ），（ｂ）何れも電力変換回路の回路図である。Both (a) and (b) are circuit diagrams of the power conversion circuit. （ａ），（ｂ）何れも灯器の要部の縦断面図であり、（ａ）がフィラメント電球の装着状態、（ｂ）がＬＥＤ信号電球の装着状態を示している。(A), (b) are the longitudinal cross-sectional views of the principal part of a lamp, (a) has shown the mounting state of the filament bulb, (b) has shown the mounting state of the LED signal bulb. （ａ），（ｂ）何れも灯箱の要部の縦断面図であり、（ａ）がフィラメント電球の装着状態、（ｂ）がＬＥＤ信号電球の装着状態を示している。(A), (b) are the longitudinal cross-sectional views of the principal part of a lamp box, (a) has shown the mounting state of the filament bulb, (b) has shown the mounting state of the LED signal bulb. （ａ），（ｂ）何れも灯箱の縦断面図および信号機柱への装着状態を示し、（ａ）がフィラメント電球だけの装着状態、（ｂ）がＬＥＤ信号電球を一つだけ装着した状態を示している。Both (a) and (b) show the vertical cross-sectional view of the lamp box and the mounting state on the signal pole, (a) shows the mounting state with only the filament light bulb, and (b) shows the state with only one LED signal light bulb mounted. Show. 本発明の実施形態２について、Ｇ形のＬＥＤ信号電球および色灯信号機の構造を示し、（ａ）が対比用フィラメント電球の横断面図、（ｂ）がＬＥＤ搭載部の平面図、（ｃ）が色灯信号機の目視状態を示す模式図である。About Embodiment 2 of this invention, the structure of a G-shaped LED signal light bulb and a color light signal is shown, (a) is a cross-sectional view of a filament light bulb for comparison, (b) is a plan view of an LED mounting portion, (c) FIG. 3 is a schematic diagram showing a visual state of a color lamp traffic light. （ａ）が電力変換回路の回路図、（ｂ）がＬＥＤ信号電球の等価回路の回路図である。(A) is a circuit diagram of a power conversion circuit, (b) is a circuit diagram of an equivalent circuit of an LED signal bulb. （ａ）がＧ形ＬＥＤ信号電球の記号の説明図、（ｂ）が三灯の色灯信号機の内部配線例、（ｃ）が四灯の色灯信号機の内部配線例である。(A) is explanatory drawing of the symbol of a G type LED signal bulb, (b) is an example of internal wiring of a three-lamp color lamp signal device, (c) is an example of internal wiring of a four-lamp color lamp signal device. 本発明の実施例１について、発光波長変動特性図である。It is a light emission wavelength variation characteristic view about Example 1 of the present invention. 発光強度特性図である。FIG.

符号の説明Explanation of symbols

１０…ＬＥＤランプ部、
１１…青色発光ダイオードチップ、
１２…支持部材（伝熱部材）、１２ａ…露出端（他端部）、１２ｂ…窪み、
１３，１４…リード部材、
１５…第２樹脂部（波長変換材料非混入）、１５ａ…レンズ部、
１６…ボンディングワイヤー、１７…第１樹脂部（波長変換材料混入）、
１８…第３樹脂部（保護用、波長変換材料混入）、
１９ａ…熱伝導性接着剤（接合部材）、１９ｂ…絶縁性接着材、
２０…ＬＥＤ信号電球、
２１…カバー、２２…連結部材（伝熱部材）、２２ａ…装着部、２２ｂ…穴、
２３…放熱部材、２３ａ…放熱フィン、２３ｂ…中空（貫通穴，空洞）、
２４…回路基板、２５…給電線、２６…中継線、
３０…電力変換回路、３１…給電端子、
４０…灯器、
４１…レンズフレーム、４２，４３…レンズ（色レンズ）、
４４…電球取付部、４５…ソケット、
４６…フィラメント電球、４６ａ…フィラメント、
５０…灯箱、５１…灯箱蓋、５２…庇、
６０…信号機柱、Ｒ…赤色灯（第１灯器）、
Ｙ…黄色灯（第２灯器）、Ｇ…青色灯（第３灯器）、
７０…ＬＥＤ信号電球、７１…送光範囲、
８０…電力変換回路、
８１…第１リード部材、８２…第２リード部材、８３…第３リード部材 10 ... LED lamp part,
11 ... Blue light emitting diode chip,
12 ... support member (heat transfer member), 12a ... exposed end (other end), 12b ... depression,
13, 14 ... lead member,
15 ... 2nd resin part (wavelength conversion material non-mixing), 15a ... Lens part,
16 ... Bonding wire, 17 ... 1st resin part (wavelength conversion material mixing),
18 ... 3rd resin part (for protection and wavelength conversion material mixing),
19a ... Thermally conductive adhesive (joining member), 19b ... Insulating adhesive,
20 ... LED signal bulb,
21 ... Cover, 22 ... Connecting member (heat transfer member), 22a ... Mounting part, 22b ... Hole,
23 ... Heat dissipation member, 23a ... Heat dissipation fin, 23b ... Hollow (through hole, cavity),
24 ... circuit board, 25 ... feed line, 26 ... relay line,
30 ... Power conversion circuit, 31 ... Feeding terminal,
40 ... Lamp,
41 ... lens frame, 42, 43 ... lens (color lens),
44 ... light bulb mounting part, 45 ... socket,
46 ... Filament bulb, 46a ... Filament,
50 ... light box, 51 ... light box cover, 52 ... 庇,
60 ... Traffic light pole, R ... Red light (first lamp),
Y ... yellow light (second lamp), G ... blue light (third lamp),
70 ... LED signal bulb, 71 ... light transmission range,
80 ... power conversion circuit,
81: first lead member, 82: second lead member, 83: third lead member

Claims (10)

何れの色も信号機の色レンズで選択して透過させるのに適した赤色と黄色と青色の三種類の波長成分を含む光を点灯時に発するＬＥＤ信号電球であって、熱伝導性材料からなり一端面に窪みが形成された棒状の支持部材と、前記窪みに納めて前記支持部材に搭載され前記窪みの底面に対し絶縁状態で片面が接合された一個または複数個の青色発光ダイオードチップと、前記支持部材から絶縁された状態で前記支持部材に固定され前記青色発光ダイオードチップへの給電を担うリード部材と、中心発光波長が黄色の波長変換材料と中心発光波長が赤色の波長変換材料とが混入されており前記窪みにおいて前記青色発光ダイオードチップを覆う第１樹脂部と、この第１樹脂部を含めて前記支持部材の前記一端部は覆い他端部は露出させる光透過性の第２樹脂部とを備えたことを特徴とするＬＥＤ信号電球。   Each color is an LED signal light bulb that emits light including three types of wavelength components of red, yellow, and blue, which is suitable for being selected and transmitted by a color lens of a traffic light, and is made of a thermally conductive material. A rod-like support member having a depression formed on an end surface thereof, one or a plurality of blue light emitting diode chips that are placed in the depression and mounted on the support member, and one surface of which is joined in an insulated state to the bottom surface of the depression; A lead member that is fixed to the support member and insulated from the support member and that supplies power to the blue light emitting diode chip, and a wavelength conversion material having a central emission wavelength of yellow and a wavelength conversion material having a central emission wavelength of red are mixed. A first resin portion that covers the blue light emitting diode chip in the recess, and a light transmitting property that covers the one end portion of the support member including the first resin portion and exposes the other end portion. LED signal light bulb, characterized in that a second resin portion. 前記青色発光ダイオードチップと前記リード部材とを接続するボンディングワイヤーと、前記第１樹脂部と前記第２樹脂部とに介在して前記ボンディングワイヤーを囲む柔軟な第３樹脂部とを備えたことを特徴とする請求項１記載のＬＥＤ信号電球。   A bonding wire connecting the blue light emitting diode chip and the lead member; and a flexible third resin portion surrounding the bonding wire interposed between the first resin portion and the second resin portion. The LED signal light bulb according to claim 1. 中心発光波長が黄色の波長変換材料と中心発光波長が赤色の波長変換材料とが前記第３樹脂部にも混入されていることを特徴とする請求項２記載のＬＥＤ信号電球。   The LED signal light bulb according to claim 2, wherein a wavelength conversion material having a center emission wavelength of yellow and a wavelength conversion material having a center emission wavelength of red are also mixed in the third resin portion. 何れの色も信号機の色レンズで選択して透過させるのに適した赤色と黄色と青色の三種類の波長成分を含む光を点灯時に発するＬＥＤ信号電球であって、熱伝導性材料からなり一端面に窪みが形成された棒状の支持部材と、前記窪みに納めて前記支持部材に搭載され前記窪みの底面に対し絶縁状態で片面が接合された一個または複数個の青色発光ダイオードチップと、前記支持部材から絶縁された状態で前記支持部材に固定され前記青色発光ダイオードチップへの給電を担うリード部材と、波長変換材料が混入されておらず前記窪みにおいて前記青色発光ダイオードチップを覆う第１樹脂部と、この第１樹脂部を含めて前記支持部材の前記一端部は覆い他端部は露出させる光透過性の第２樹脂部と、前記青色発光ダイオードチップと前記リード部材とを接続するボンディングワイヤーと、前記第１樹脂部と前記第２樹脂部とに介在して前記ボンディングワイヤーを囲む柔軟な樹脂からなり中心発光波長が黄色の波長変換材料と中心発光波長が赤色の波長変換材料とが混入されている第３樹脂部とを備えたことを特徴とするＬＥＤ信号電球。   Each color is an LED signal light bulb that emits light including three types of wavelength components of red, yellow, and blue, which is suitable for being selected and transmitted by a color lens of a traffic light, and is made of a thermally conductive material. A rod-like support member having a depression formed on an end surface thereof, one or a plurality of blue light emitting diode chips that are placed in the depression and mounted on the support member, and one surface of which is joined in an insulated state to the bottom surface of the depression; A lead member that is fixed to the support member in a state of being insulated from the support member and that supplies power to the blue light-emitting diode chip; and a first resin that is not mixed with a wavelength conversion material and covers the blue light-emitting diode chip in the recess A light-transmissive second resin portion that covers the one end portion of the support member including the first resin portion and exposes the other end portion, the blue light emitting diode chip, and the lead. A wavelength conversion material having a center emission wavelength of yellow and a center emission wavelength of red, which is composed of a bonding wire for connecting members, a flexible resin that is interposed between the first resin portion and the second resin portion and surrounds the bonding wire An LED signal light bulb comprising a third resin portion mixed with the wavelength conversion material. 放熱フィン付きの放熱部材を備え、この放熱部材と前記支持部材の前記他端部とが伝熱可能に連結されていることを特徴とする請求項１乃至請求項４の何れかに記載されたＬＥＤ信号電球。   The heat dissipation member with a heat dissipation fin is provided, and the heat dissipation member and the other end portion of the support member are connected to be able to transfer heat. LED signal bulb. フィラメント電球に適合した駆動電力を前記青色発光ダイオードチップの駆動電力に変換する電力変換回路が設けられ、前記放熱部材に貫通穴等の空洞が形成され、この空洞に前記電力変換回路が納められていることを特徴とする請求項５記載のＬＥＤ信号電球。   A power conversion circuit that converts driving power suitable for a filament light bulb into driving power for the blue light-emitting diode chip is provided, and a cavity such as a through hole is formed in the heat dissipation member, and the power conversion circuit is placed in the cavity. The LED signal light bulb according to claim 5, wherein 前記青色発光ダイオードチップが複数個設けられ、それらが二列に並んでいることを特徴とする請求項１乃至請求項６の何れかに記載されたＬＥＤ信号電球。   The LED signal light bulb according to any one of claims 1 to 6, wherein a plurality of the blue light emitting diode chips are provided and are arranged in two rows. 前記リード部材が第１，第２，第３リード部材の三個に分かれており、前記第１リード部材と前記第２リード部材とが前記青色発光ダイオードチップのうち前記二列の一方に配されたものと給電可能に接続され、前記第２リード部材と前記第３リード部材とが前記青色発光ダイオードチップのうち前記二列の他方に配されたものと給電可能に接続されていることを特徴とする請求項７記載のＬＥＤ信号電球。   The lead member is divided into three parts, a first lead member, a second lead member, and a third lead member, and the first lead member and the second lead member are arranged in one of the two rows of the blue light emitting diode chips. The second lead member and the third lead member are connected so as to be able to supply power to the blue light emitting diode chip arranged in the other of the two rows. The LED signal light bulb according to claim 7. 赤色の色レンズを装着した第１灯器と黄色の色レンズを装着した第２灯器と青色の色レンズを装着した第３灯器とを備えた色灯信号機において、前記灯器のうち何れか一つ又は複数のものに、請求項１乃至請求項８の何れか一項に記載されたＬＥＤ信号電球を装着したことを特徴とする色灯信号機。   In a color lamp traffic light comprising a first lamp mounted with a red color lens, a second lamp mounted with a yellow color lens, and a third lamp mounted with a blue color lens, any one of the lamps A color lamp traffic light comprising the LED signal light bulb according to any one of claims 1 to 8 attached to one or a plurality of the ones. 何れもフィラメント電球保持用のソケットを内装可能な第１灯器と第２灯器と第３灯器とを備え、前記第１灯器には赤色の色レンズが装着され、前記第２灯器には黄色の色レンズが装着され、前記第３灯器には青色の色レンズが装着されている色灯信号機において、前記灯器のうち何れか一つ又は複数のものにおける前記ソケットの装着部位に、請求項５又は請求項６に記載されたＬＥＤ信号電球の前記放熱部材を装着したことを特徴とする色灯信号機。   Each includes a first lamp, a second lamp, and a third lamp that can house a socket for holding a filament bulb, and the first lamp is equipped with a red color lens, and the second lamp In the color lamp traffic light in which a yellow color lens is mounted on the third lamp and a blue color lens is mounted on the third lamp, the socket mounting site in any one or more of the lamps A color lamp signal device comprising the heat radiation member of the LED signal light bulb according to claim 5 or 6 attached thereto.
JP2004061403A 2004-03-04 2004-03-04 LED signal bulb and color light signal Expired - Lifetime JP4471683B2 (en)

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JP2007311482A (en) * 2006-05-17 2007-11-29 Ichikoh Ind Ltd Fixing structure for light-emitting diode
JP2010520598A (en) * 2007-03-06 2010-06-10 クァンサン ライティング インダストリー カンパニー リミテッド LED lamp for AC power supply
WO2010083665A1 (en) * 2009-01-20 2010-07-29 Liu Xuefeng Led radiating and luminescent integrated tube
JP2011076905A (en) * 2009-09-30 2011-04-14 Kondo Kogei:Kk Led lamp
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JP2011146709A (en) * 2010-01-15 2011-07-28 Lg Innotek Co Ltd Light-emitting device and illumination system
JP2011195121A (en) * 2010-03-23 2011-10-06 Daido Signal Co Ltd G-form led signal bulb
JP2011527082A (en) * 2008-06-30 2011-10-20 ブリッジラックス インコーポレイテッド Heat sink device for semiconductor lamp
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007311482A (en) * 2006-05-17 2007-11-29 Ichikoh Ind Ltd Fixing structure for light-emitting diode
JP4710713B2 (en) * 2006-05-17 2011-06-29 市光工業株式会社 Light emitting diode fixing structure
JP2010520598A (en) * 2007-03-06 2010-06-10 クァンサン ライティング インダストリー カンパニー リミテッド LED lamp for AC power supply
JP2011527082A (en) * 2008-06-30 2011-10-20 ブリッジラックス インコーポレイテッド Heat sink device for semiconductor lamp
WO2010083665A1 (en) * 2009-01-20 2010-07-29 Liu Xuefeng Led radiating and luminescent integrated tube
JP2011076905A (en) * 2009-09-30 2011-04-14 Kondo Kogei:Kk Led lamp
JP2011146709A (en) * 2010-01-15 2011-07-28 Lg Innotek Co Ltd Light-emitting device and illumination system
KR101142015B1 (en) * 2010-03-18 2012-05-17 한국광기술원 Light Emitting Diode package with dehumidity and heat-resisting structure and Method thereof
JP2011195121A (en) * 2010-03-23 2011-10-06 Daido Signal Co Ltd G-form led signal bulb
JP2011249771A (en) * 2010-05-24 2011-12-08 Taida Electronic Ind Co Ltd Light source module
KR101032885B1 (en) * 2010-07-19 2011-05-06 주식회사 엔엘텍 A bicycle's lighting apparatus
EP2942258A1 (en) * 2014-05-05 2015-11-11 Lite-On Technology Corporation Led traffic signal light module
US9709243B2 (en) 2014-05-05 2017-07-18 Lite-On Technology Corporation LED traffic signal light module
JP2016147603A (en) * 2015-02-13 2016-08-18 公益財団法人鉄道総合技術研究所 Light emitting machine control system for railways and light emitting machine for railways

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