JP2007059930A - Led lighting fixture and card type led lighting light source - Google Patents

Led lighting fixture and card type led lighting light source Download PDF

Info

Publication number
JP2007059930A
JP2007059930A JP2006274596A JP2006274596A JP2007059930A JP 2007059930 A JP2007059930 A JP 2007059930A JP 2006274596 A JP2006274596 A JP 2006274596A JP 2006274596 A JP2006274596 A JP 2006274596A JP 2007059930 A JP2007059930 A JP 2007059930A
Authority
JP
Japan
Prior art keywords
light source
led
illumination light
led illumination
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006274596A
Other languages
Japanese (ja)
Inventor
Nobuyuki Matsui
Tatsumi Setomoto
Masanori Shimizu
Tetsushi Tamura
Tadashi Yano
伸幸 松井
正則 清水
龍海 瀬戸本
哲志 田村
正 矢野
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2001242857 priority Critical
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2006274596A priority patent/JP2007059930A/en
Publication of JP2007059930A publication Critical patent/JP2007059930A/en
Application status is Pending legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00Lighting devices intended to be free-standing
    • F21S6/002Table lamps, e.g. for ambient lighting
    • F21S6/003Table lamps, e.g. for ambient lighting for task lighting, e.g. for reading or desk work, e.g. angle poise lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21LLIGHTING DEVICES OR SYSTEMS THEREOF, BEING PORTABLE OR SPECIALLY ADAPTED FOR TRANSPORTATION
    • F21L4/00Electric lighting devices with self-contained electric batteries or cells
    • F21L4/02Electric lighting devices with self-contained electric batteries or cells characterised by the provision of two or more light sources
    • F21L4/022Pocket lamps
    • F21L4/027Pocket lamps the light sources being a LED
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00Lighting devices intended to be free-standing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787Ceramics, e.g. crystalline carbides, nitrides or oxides
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED lighting light source which improves heat radiation and light utilization efficiency and in which LEDs are integrated with high density, and to provide an LED lighting fixture thereof. <P>SOLUTION: The LED lighting fixture includes at least one connector to be connected to the detachable card type LED lighting light source 10 with the LEDs mounted on one face of a board, and a lighting circuit which is electrically connected to the card type LED lighting light source 10 through the connector. The card type LED lighting light source 10 includes preferably a metal base board, and a plurality of the LEDs mounted on one face of the metal base board, and a back face of the metal base board on which the LEDs are not mounted is thermally brought into contact with a portion of the lighting fixture. A feeding terminal to be electrically connected by the connector is provided on one face of the metal base board on which the LEDs are mounted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an LED illumination device and a card-type LED illumination light source. More specifically, the present invention relates to an LED illumination device that uses a card-type LED illumination light source on which a plurality of LEDs are mounted, and a card-type LED illumination light source that is suitably used for this LED illumination device.

  Conventionally, incandescent bulbs, fluorescent lamps, high-pressure discharge lamps and the like have been used as light sources for lighting fixtures and signboards. As a new illumination light source that replaces these light sources, research on LED illumination light sources is underway. This LED illumination light source has an excellent advantage that it has a long life compared to the above light source, and is highly expected as a next-generation illumination light source. However, since one LED element has a small luminous flux, it is necessary to arrange an LED illumination light source by arranging a plurality of LED elements in order to obtain a luminous flux equivalent to that of an incandescent bulb or a fluorescent lamp.

  Hereinafter, a conventional LED illumination light source will be described with reference to the drawings.

  1A and 1B show the configuration of a conventional LED illumination light source, and FIGS. 2A and 2B show the cross-sectional configuration of the LED in the LED illumination light source.

  As shown in FIGS. 1A and 1B, the LED illumination light source includes a substrate 21, and a plurality of LED bare chips 22 are mounted on the substrate 21. In this specification, the “LED bare chip” means that the LED is not molded with a resin or the like before being mounted on the substrate 21. Further, an LED in which the LED is molded in a stage before mounting and the light emitting portion or the like is not exposed is referred to as an “LED element” to be distinguished. On the substrate 21 shown in FIG. 1A, a plate 23 is provided by opening a hole 23 a that transmits light emitted from the LED bare chip 22. On the other hand, a layered resin 24 that transmits light emitted from the LED bare chip 22 is formed on the substrate 21 shown in FIG. 1B, and the LED bare chip 22 is covered with the resin 24.

  In these LED illumination light sources, the bare LED chip 22 is mounted on the substrate 21 as shown in FIGS. The LED bare chip 22 includes an element substrate 31 such as sapphire, SiC, GaAs, or GaP, and a light emitting portion formed on the element substrate 31. The light emitting portion includes an n-type semiconductor layer 32 such as a GaN-based layer, The active layer 33 and the p-type semiconductor layer 34 are stacked. The electrode 32a of the n-type semiconductor layer 32 and the electrode 34a of the p-type semiconductor layer 34 are electrically connected to the wiring pattern 21a on the substrate 21 by gold wires 41 and 42, respectively. In addition, the structure of the said light emission part is only an example, and LED may be provided with a quantum well, a plug reflective layer, a resonator structure, etc.

  In the configuration shown in FIGS. 1A and 2A, the light generated by the LED bare chip 22 is reflected by the reflecting surface 23a corresponding to the inner peripheral surface of the hole (opening) 23b provided in the plate 23. Then, the light is emitted out of the element. The hole 23b of the plate 23 is filled with a resin 24 so that the LED bare chip 22 and the wires 41 and 42 are molded. Further, in the configuration shown in FIGS. 1B and 2B, the light generated by the LED bare chip 22 is emitted outside the element through the mold resin 24.

  When a forward bias voltage is applied between the electrode 32a of the n-type semiconductor layer 32 and the electrode 34a of the p-type semiconductor layer 34 in the LED bare chip 22, electrons and holes are injected into the semiconductor layer and recombined. By this recombination, light is generated in the active layer 33 and light is emitted from the active layer 33. In the LED illumination light source, light emitted from a plurality of LED bare chips 22 mounted on a substrate is used as illumination light.

  However, in the LED illumination light source having the above configuration, the LED bare chip 22 generates a large amount of heat as it emits light. The generated heat is intended to be dissipated from the substrate 21 through the element substrate 31. However, the following problems to be solved remain in practical use of such an LED lighting device.

  As described above, since the light flux from each LED bare chip 22 is small, it is necessary to arrange a considerable number of LED bare chips 22 on the substrate 21 in order to obtain a desired brightness. For this reason, it is necessary to increase the density of the LED bare chips 22 to be mounted so that the size of the substrate does not increase even if a large number of LED bare chips 22 are provided.

Further, in order to increase the luminous flux of each LED bare chip 22 as much as possible, the current density in a normal use other than lighting (for example, about 20 mA; assuming a 0.3 mm square LED bare chip, the current density per unit area is about 222.2 [ mA / mm 2 ]) (overcurrent: about 40 mA; for example, the current density per unit area is about 444.4 [mA / mm 2 ]) needs to flow through each LED bare chip 22. When a large current is passed through each LED bare chip 22, the amount of heat generated from the LED bare chip 22 increases, so that the temperature of the LED bare chip 22 (bare chip temperature) rises to a high temperature. The bare chip temperature has a great influence on the lifetime of the LED bare chip. Specifically, when the bare chip temperature rises by 10 ° C., it is said that the lifetime of the LED device incorporating the LED bare chip 22 is halved.

  For this reason, although it is generally considered that the lifetime of the LED is long, when the LED is used for illumination, the common sense is not valid. Further, when the bare chip temperature increases with an increase in the amount of heat generation, there is a problem that the light emission efficiency of the LED bare chip 22 also decreases.

  For the above reasons, in order to put into practical use an LED lighting device in which a large number of LED bare chips 22 are mounted at a high density, it is necessary to realize higher heat dissipation than before and to keep the bare chip temperature low. In addition, it is necessary to increase the light use efficiency so that the light emitted from the LED bare chip 22 can be used as illumination light as much as possible.

  In order to solve such a problem, proposals of LED illumination light sources in which various LED bare chips are integrated have been made, but no LED illumination light source that can sufficiently cope with all these problems has been seen. .

  Hereinafter, the problem of the conventional LED illumination light source will be described with reference to FIGS. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b). First, there is a problem that due to continuous lighting of LEDs, the central part of many integrated LED substrates becomes hot, and the temperature difference from the peripheral part of the LED substrate becomes large. For example, the configuration shown in FIGS. 1A and 2A is employed in an LED dot matrix display. In the LED display, the plate 23 functions to increase the contrast between the light emission and non-light emission portions of each LED. In the case of a display, all LEDs do not always turn on at a high output, and heat generation is not a major problem. However, when used as a lighting device, all LEDs remain on for a long time. The problem becomes obvious.

  In the conventional configuration example, resin is used for the material of the substrate 21 and the plate 23, and they are integrated. For this reason, although the thermal expansion coefficient of the board | substrate 21 and the board 23 is substantially equal, since the heat conductivity of a normal resin material is low and heat | fever becomes easy to accumulate, it is not suitable for the illuminating device always lighted with a high output. .

  Further, since there is a temperature difference between the substrate 21 and the central portion of the substrate 21 and the peripheral portion of the plate 23, a large stress is generated in the peripheral portion of the substrate due to the difference in thermal expansion coefficient of the material. When an LED is applied to an illumination device, stress due to heating is generated each time the LED is repeatedly turned on / off, which eventually leads to disconnection of the electrode 32a and the electrode 34a of the LED.

  Furthermore, the plate 23 is not individually configured, and a portion having a thickness corresponding to the plate 23 is formed on the substrate itself using a material having the same thermal conductivity as the substrate material having a high thermal conductivity. Even when the recess for mounting the LED bare chip is provided on the board, the ability of heat dissipation and soaking is regulated by the thermal conductivity of the substrate material.

  In addition, when the above configuration is adopted, it is necessary to increase the thickness of the substrate itself, and the substrate on which the LED bare chip 22 is mounted cannot be reduced. Is done. For this reason, when the energized lighting state continues for a long time with a large current as in a lighting device, the temperature of the LED bare chip mounted in the center of the substrate particularly rises, and a large temperature difference occurs between the center of the substrate and the surroundings. . Therefore, the characteristics of the substrate material having high thermal conductivity cannot be utilized, and the problem of heat dissipation cannot be solved. Furthermore, unless the concave portion formed on the substrate surface is made large, there is a problem that the space for mounting the LED bare chip 22 and wiring the LED bare chip 22 by wire bonding cannot be secured, and the optical system becomes large. Furthermore, it is difficult to mount the LED bare chip 22 in the recess from the viewpoint of the sizes of capillaries and collets of various bonders. In order to be able to insert a capillary or a collet into the recess, it is necessary to increase the size of the recess and the optical system (light emission region).

  On the other hand, according to the configuration shown in FIG. 1B and FIG. 2B, since the mold resin 24 covers one surface of the substrate 21, a time difference in the curing reaction occurs between the center and the periphery when the mold resin 24 is cured. Large residual stress is generated inside. Furthermore, since the light emitted from the LED bare chip 22 is absorbed by another LED bare chip 22 (self-absorption by the LED), the light extraction efficiency from the entire LED is lowered. Further, since the mold resin 24 functions as a heat retaining material, a temperature difference is generated between the central portion and the peripheral portion of the substrate, and the stress of the mold resin 24 propagates to the peripheral portion of the substrate due to the difference in thermal expansion coefficient of the material.

  This invention is made | formed in view of such a situation, and it aims at providing the LED illumination light source which can solve the subject regarding densification.

  The LED illumination light source of the present invention is mounted on a metal base substrate on which an insulating layer formed of a composite material including at least a wiring pattern, an inorganic filler, and a resin composition is formed, and one side of the metal base substrate. An LED illumination light source comprising a plurality of LED bare chips and two or more wiring layers stacked via the insulating layer, wherein the two or more wiring layers are interconnected. .

  In a preferred embodiment, the thermal resistance between the back surface of the metal base substrate on which the LED bare chip is not mounted and the LED bare chip is 10 ° C./W or less.

  In a preferred embodiment, the thermal resistance is 5 ° C./W or less.

  In a preferred embodiment, the thermal resistance is 2 ° C./W or less.

In a preferred embodiment, the inorganic filler is formed of at least one material selected from Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 and AlN.

  In a preferred embodiment, the LED bare chip is directly mounted on the wiring pattern of the metal base substrate by flip chip bonding.

  In a preferred embodiment, the LED bare chip is incorporated as a surface mount device (SMD: surface mount device) or a chip type device.

  In a preferred embodiment, an optical reflector having a hole surrounding each LED bare chip is provided on a surface of the metal base substrate on which the LED bare chip is mounted, and each LED bare chip is molded.

  In a preferred embodiment, an optical lens is disposed in the hole of the optical reflector.

  According to the LED illumination light source of the present invention, it is possible to achieve a high heat dissipation effect due to its thermal conductivity and mechanical strength, and to smoothly dissipate heat generated in each LED element. In addition, since two or more wiring layers are provided, it is possible to achieve high density, and it is also possible to drive electrically independent multipaths.

  The LED illumination device of the present invention includes a connector that is electrically connected to a detachable card type LED illumination light source, and a lighting circuit that is electrically connected to the card type LED illumination light source via this connector. By installing a card type LED illumination light source, illumination light can be emitted. As will be described in detail later, the card-type LED illumination light source has a configuration in which a plurality of LEDs are mounted on one surface of a substrate excellent in heat dissipation.

  As described for the conventional LED illumination light source, when a large number of LED elements are mounted on the substrate at a high density and a large current is passed through each LED element, the amount of heat generated by the LED reaches an excessive level, and the LED There is a problem that the lifetime of the LED lighting device is shortened, which hinders practical application of the LED lighting device.

  In the present invention, the light source portion of the lighting device is constituted by a removable card-like structure, and the effect of smoothly dissipating the heat generated by each LED is enhanced, and only the light source that has reached the end of its life can be replaced with a new light source. By doing so, a structure other than the light source of the LED lighting device can be used for a long period of time.

  From the viewpoint of improving heat dissipation, the LED is preferably mounted as a bare chip on one side of the substrate. This is because the heat generated in the LED is directly transmitted to the substrate, and higher heat dissipation is exhibited.

  By concentrating the LED and the power supply electrode on one surface which is one main surface of the substrate, the other surface (back surface) which forms a pair with the main surface can be widely used as a heat conducting surface for heat dissipation. For this reason, it becomes possible to make the area which contacts the heat-conducting member in LED lighting apparatus equal to or more than the area of the light emission area | region in which LED is mounted. In order to promote heat conduction, it is preferable to form the back surface of the substrate on which the LEDs are not mounted from metal.

  By standardizing the size of the card-type LED illumination light source and the position of the feeding electrode, the card-type LED illumination light source can be used in various illumination devices, and the cost can be reduced by mass production of the card-type LED illumination light source. .

  From the viewpoint of the insulation between the electrodes and the alignment of the electrodes of other devices, the pitch of the feeding electrodes is, for example, 0.3, 0.5, 0.8, 1.25, 1.27, 1.5, Set to 2.54 mm. When mass-producing a card-type LED illumination light source substrate, it is preferable to divide a large substrate substrate to produce a large number of card-type LED illumination light source substrates, but there are processing errors in cutting. Mechanical manufacturing errors also occur with respect to the dimensions of the connector of the LED illumination device to which the card-type LED illumination light source is attached and detached. For this reason, if the inter-electrode pitch is too small, the feeding electrodes may be short-circuited at the connector portion of the LED lighting device. From the above, it is preferable that the pitch between the electrodes is set to a size of 0.8 mm or more.

  Further, since the forward voltage of the LED decreases at a high temperature, it is preferable to adopt constant current driving rather than constant voltage driving from the viewpoint of operational stability. When performing constant current driving, the card type LED light source requires as many ground lines as the number of driving paths for constant current driving. Preferably, a plurality of electrically independent ground feeding electrodes are formed on the substrate. Therefore, it is preferable to provide a plurality of ground electrode connectors also in the LED illumination device corresponding to such a card-type LED illumination light source. When a large number of feeding electrodes are arranged in the card-type LED light source, the pitch between the electrodes is preferably set to 2 mm or less, and more preferably set to 1.25 mm or less.

  As will be described later, when the card-type LED light source and the LED illumination device of the present invention are used to perform illumination by individually driving blue, green (blue-green), yellow (orange), red, and white LEDs, It is preferable to provide two electrodes (total 10 electrodes) for each color LED.

  The card-type LED light source of the present invention may be designed to support not only constant voltage driving but also constant current driving, or may perform multi-path driving that is electrically independent. In these cases, it is desirable that the card-type LED light source has a structure in which two or more wiring layers are stacked via an insulating layer and the two or more wiring layers are interconnected.

  When a via structure is employed as a structure for interconnecting two or more wiring layers, the via diameter can be arbitrarily set, for example, between 100 μm and 350 μm. Considering the via drilling error, the width of the power supply electrode of the card-type LED light source is preferably 2 to 3 times the diameter of the via, for example, 200 μm to 1050 μm.

  The length of the power supply electrode is preferably set so that the connector of the LED lighting device does not directly contact the via. Therefore, the length of the power supply electrode is preferably set to 1 mm or more, for example. However, in order to reduce the size of the card-type LED light source, it is preferable to suppress the length of the power supply electrode to 5 mm or less.

  Hereinafter, an embodiment of an LED lighting device according to the present invention will be described first with reference to the drawings.

(Embodiment 1)
Fig.3 (a) is a perspective view which shows a part of LED lighting apparatus by this invention, and has shown the heat sink 19 by which the several card | curd type LED illumination light source 10 which can be attached or detached is fitted.

  The card type LED illumination light source 10 is inserted to a predetermined position through a slot provided on the side surface of the heat sink 19. The heat sink 19 is in thermal contact with the back surface of the mounted card-type LED illumination light source 10 and dissipates heat from the back surface of the card-type LED illumination light source 10 to the outside.

  The card type LED illumination light source 10 inserted in the heat sink 19 is electrically connected to a connector (not shown) provided in the heat sink 19. The card type LED illumination light source 10 is electrically connected to a lighting circuit (not shown) through this connector. In the present specification, the term “connector” covers a wide range of members and parts that are electrically connected to the card-type LED illumination light source by a detachable mechanism. There are connectors having various configurations to which various memory cards and the like can be attached and detached. However, in the present invention, a connector having substantially the same configuration as those existing connectors can be employed.

  Since the LED lighting device including such a heat sink 19 and a lighting circuit can be easily reduced in thickness, it is preferably used as a surface light source. Further, when any of the plurality of card type LED illumination light sources 10 fails, the failed card type LED illumination light source 10 is removed from the heat sink 19 and a new (no failure or deteriorated) card type LED illumination light source 10 is mounted. Then, the use as a lighting device can be continued.

  In a preferred embodiment of the present invention, a power supply electrode is provided on the surface of the card-type LED illumination light source 10 so that the card-type LED illumination light source 10 can be easily attached and detached without using a special tool or instrument. By simply connecting the LED illumination light source 10 to the connector, electrical contact and connection between the power supply electrode and the connector can be realized. A specific example preferable as the structure of the card-type LED illumination light source 10 will be described in detail later.

  As described above, in the example of FIG. 3A, the heat sink 19 is in thermal contact with the back surface of the card-type LED illumination light source 10 (the side on which the LEDs are not mounted). Therefore, the heat sink 19 functions as a heat conducting member that receives heat from the back side of the substrate of the card type LED illumination light source. As the heat conducting member, a heat radiating sheet formed from silicon grease or gel may be used. A combination of these heat radiation sheet and heat sink, or a combination of a heat pipe or a fan may be used. Moreover, you may use the housing | casing itself of a LED lighting apparatus as a heat conductive member.

  Next, refer to FIG.

  The LED illumination device shown in FIG. 3B is an illumination device that can be replaced with a known incandescent bulb, and includes an adapter 20 that detachably supports a card-type LED illumination light source, and a card-type LED illumination light source that is mounted. A light-transmitting cover 20a is provided. A lighting circuit (not shown) is provided inside the adapter 20. A power supply socket (screw socket) for supplying electric energy from the outside to the internal lighting circuit is provided at the lower part of the adapter 20. The shape and size of the power supply socket are equal to the shape and size of the power supply socket provided in a normal incandescent bulb. For this reason, the LED lighting apparatus of FIG.3 (b) can be mounted | worn and used as it is to the existing electric appliance in which an incandescent lamp is inserted. Note that a pin-type socket may be adopted instead of the screw-type socket.

  The adapter 20 of the LED illumination device shown in FIG. 3B is provided with a slot for inserting the card type LED illumination light source 10. A connector (not shown) is disposed in the back of the slot, and the card-type LED illumination light source 10 and the lighting circuit are electrically connected via this connector. In the illustrated example, the adapter 20 is provided with a slot, and the card-type LED illumination light source 10 is attached / detached through the slot, but the attachment / detachment type is not limited to this. An embodiment in which no slot is provided will be described later. As described above, the card-type LED illumination light source 10 of FIG. 3B has a mechanism that can be easily inserted into and removed from the connector, so that it can be easily removed and replaced with a lighting fixture. . As described above, since the card-type LED illumination light source 10 can be easily removed, there is an advantage described below.

  First, by replacing the card-type LED illumination light source 10 having different LED mounting densities, it is possible to easily provide lighting fixtures having different light emission amounts. Second, even if the card-type LED illumination light source 10 deteriorates in a short period of time and the lifetime as a light source is shortened, it is only necessary to replace the card-type LED illumination light source 10 as in the case of replacement of a normal light bulb or fluorescent lamp. Only the light source unit can be replaced.

  Third, the LED mounted on the card-type LED illumination light source 10 is for a light color having a low correlated color temperature or a light color having a high correlated color temperature, or having an individual light color such as blue, red, green, or yellow. It can be. If an appropriate one is selected from the card-type LED illumination light sources 10 as described above, the emitted light color of the LED illumination device can be switched or controlled if it is attached to the corresponding LED illumination device.

  Furthermore, by mounting LEDs of multiple emission colors (two or more light colors) on the card-type LED illumination light source 10, one card type from a light color having a low correlated color temperature to a light color having a high correlated color temperature. The emitted light color can be controlled by the card type LED illumination light source 10. In this case, when the two-wavelength type using two kinds of light colors is used, a highly efficient light source can be realized although the color rendering property is low. When the correlated color temperature is low, a combination of red and blue-green (green) emission, correlated color It is desirable to employ a combination of blue and yellow (orange) emission when the temperature is high. When a phosphor that emits blue light and has an emission peak at an intermediate wavelength (for example, YAG phosphor) is added to a combination of blue and red light emitting LEDs, the average color rendering index is high. More than 80 light sources can be realized. Furthermore, in the case of the three-wavelength type using three kinds of light colors, a combination of blue, blue-green (green) and red emission, and in the case of the four-wavelength type using four kinds of light colors, blue and blue-green (green). A combination of yellow, orange, and red light emission is desirable, and a high color rendering light source having an average color rendering index exceeding 90 can be realized particularly in the case of a four-wavelength type. The present invention can also be applied to a case where the mounted LED bare chip emits a single color or ultraviolet light, or a case where white light is emitted by exciting a phosphor or phosphor with the LED bare chip. Further, the substrate may contain a phosphor or a phosphorescent material. Furthermore, it is possible to satisfy both high efficiency and high color rendering at the same time by combining a blue light emitting LED with a phosphor or phosphor that is excited by blue light and a red light emitting LED.

  Although the above-mentioned card type LED illumination light source 10 has a square card type shape, the present invention is not limited to this. The power supply electrode (power supply electrode) is preferably formed on the periphery of the area where the LEDs are arranged on the substrate of the card-type LED illumination light source 10. In a more desirable mode, a plurality of power supply electrodes are arranged in the vicinity of one end (one side) around the substrate. When the number of power supply electrodes is large, a rectangular shape in which one side of the substrate is elongated may be employed. In this case, the center of the LED cluster (the center of the light emitting area where the LEDs are arranged) and the center of the substrate are shifted, so that bending stress is not applied to the center of the light emitting area having the optical system, so that it is strong against bending stress. . Further, by rounding the corners of the rectangular shape, it is possible to reduce the possibility of scratching the LED lighting apparatus at the corners of the board when taking out the card-type LED with a human finger.

  In addition, you may clarify the direction of the card-type LED illumination light source 10 by providing a notch, a mark, or an unevenness | corrugation in a part of board | substrate. If it carries out like this, when mounting | wearing with a card type LED illumination light source 10 in an illuminating device, positioning of the card type LED illumination light source 10 with respect to an illuminating device can be performed correctly and easily.

  In the above example, the power supply electrode is provided on the card-type LED illumination light source and connected to the connector electrode. However, the following configuration can also be used.

  Configuration Example 1 A surface mount type cable connector component is mounted on the electrode of the card type LED illumination light source so that the power supply cable can be removed from the card type LED illumination light source itself.

  Configuration Example 2 The power supply cable is directly joined to the card-type LED light source, and the cable can be inserted and removed at one end not joined to the card-type LED light source.

  When the above configuration is adopted, the power supply cable is preferably a flat cable having flexibility.

(Embodiment 2)
Next, an embodiment of a card type LED illumination light source according to the present invention will be described.

  4A and 4B show the configuration of the card-type LED illumination light source in this embodiment. The card type LED illumination light source of this embodiment is suitably used for the illumination device of FIG.

  In the card-type LED illumination light source of the present embodiment, a plurality of LED bare chips 2 are mounted on one side of the heat dissipation substrate 1 as shown in FIG. In the example shown in the figure, the LED bare chips 2 are arranged in a matrix composed of rows and columns, but the present invention is not limited to this, and the arrangement pattern of the LED bare chips 2 is arbitrary.

  4 (a) is further combined with the heat radiating substrate 1 on which the LED bare chip 2 is mounted, and the card type LED illumination light source shown in FIG. 4 (b) is configured. The optical reflector 3 is formed with openings (holes) 3 b corresponding to the LED bare chips 2 arranged on the heat dissipation substrate 1. For this reason, the light from the LED bare chip 2 is extracted to the outside through the opening 3 b of the optical reflecting plate 3. In addition, in order to improve light extraction efficiency, it is preferable that the opening (hole) of the optical reflecting plate has a larger diameter at the light emitting portion on the side opposite to the heat dissipation substrate than on the heat dissipation substrate side.

  In this embodiment, an alumina composite substrate having high thermal conductivity (about 3.2 W / (m · K)) is used as the heat dissipation substrate 1 of the card-type LED illumination light source. The heat dissipation substrate 1 made of an alumina composite is a metal base substrate including a metal plate (thickness: for example, 0.5 to 3.0 μm) serving as a base and an insulating layer provided on the metal plate. The substrate thickness is preferably 0.7 mm or more from the viewpoint of warpage due to heat and bending strength, and is preferably 2.0 mm or less from the viewpoint of cutting out the substrate. From the viewpoint of improving heat dissipation, it is preferable that the thermal resistance between the back surface of the substrate on which the LED bare chip of the card-type LED illumination light source is not mounted and the LED bare chip is set to 10 ° C./W or less.

  Next, a cross-sectional configuration of the card type LED illumination light source will be described in detail with reference to FIGS. FIG. 5A shows a partial cross section of an example in which the insulating layer has a single-layer structure (insulating layer 1c), and FIG. 5B shows a multilayered insulating layer 1c (two layers of insulating layers 1c and 1e). The partial cross section of the other example made into the structure is shown.

  As can be seen from FIGS. 5A and 5B, the heat dissipation substrate 1 of this embodiment includes a metal plate 1b and an insulating layer 1c (and an insulating layer 1e) attached on the metal plate 1b. Yes. The insulating layers 1c and 1e are preferably formed from a composite material containing an inorganic filler and a resin composition, and the total thickness of the insulating layers 1c and 1e is set to, for example, 100 to 400 μm. FIG. 5B shows an example of the two-layered insulating layer, but further multilayering is possible.

As the inorganic filler, it is preferable to use at least one filler selected from Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 and AlN. From the viewpoint of increasing the filling rate and thermal conductivity, the particle shape of the inorganic filler is preferably spherical. The resin composition in which the inorganic filler is dispersed includes at least one selected from an epoxy resin, a phenol resin, and a cyanate resin. Furthermore, the inorganic filler is 70 to 95% by weight and the resin composition is 5 to 30% by weight. Is preferably formed from a mixture of

  The metal plate 1b maintains the mechanical strength of the heat dissipation board 1 and contributes to the heat equalization of the heat dissipation board 1. Moreover, since the metal plate 1b has a flat back surface, a high heat dissipation effect can be realized by making thermal contact with a member having excellent thermal conductivity such as a heat sink member (not shown).

  As another embodiment, instead of the insulating layer 1e directly above the metal plate 1b which is the base metal of the heat dissipation substrate 1, a low-temperature fired glass / ceramic substrate having a lower thermal conductivity than the composite material is used. It may be used. Further, a ceramic substrate, enamel substrate, aluminum nitride substrate, beryllium oxide substrate, or the like, which is more expensive but has high thermal conductivity, may be used as equipment. However, in consideration of heat dissipation and mechanical strength, it is most preferable to use a metal plate as the base metal of the heat dissipation substrate 1. A substrate such as the above-described ceramic substrate may be selected as the insulating layer and attached to a metal plate. In this case, the thickness of the insulating substrate to be attached to the metal plate is preferably thin and strong enough to be attached, and is set in the range of, for example, 80 μm to 1000 μm. In this manner, insulating layers having different materials and compositions can be stacked on the base metal.

  A wiring pattern 1a (and 1d) is formed on the heat dissipation substrate 1, and the wiring pattern 1a (and 1d) is electrically connected from the metal plate 1b by an insulating layer 1c (and 1e) formed of a composite material. Is electrically insulated.

  In the example of FIG. 5B, via the via 1f formed in the first insulating layer 1c, the wiring pattern 1a formed on the second insulating layer 1c and on the second insulating layer 1e. The formed wiring pattern 1d is electrically connected.

  In the heat radiating substrate 1 shown in FIG. 5A, when a plurality of LEDs are arranged on the same substrate for multicolor (for example, 2 to 4 colors) light emission, FIG. 6A and FIG. ) A simple series-parallel connection or ladder connection as shown in Fig. 2) will be adopted. By adopting such a ladder-type connection, the LED can be lit while suppressing variations in the current-voltage characteristics of the LED. Further, when one LED is disconnected, in the circuit of FIG. 6A, all LEDs connected in series with the disconnected LED are not lit, but in the circuit of FIG. 6B, the disconnected LED Only the light is off. On the other hand, according to the heat dissipation substrate 1 having the multilayer structure as shown in FIG. 5B, it is possible to arrange the LEDs of different electrical systems adjacent to each other as shown in FIG. And brightness variations can be further reduced. Further, it is advantageous for mixing light of multicolored LEDs. Ladder type connection is possible.

  In the present embodiment, a bare chip-state LED (“LED bare chip”) 2 is directly mounted on the heat dissipation substrate 1. As shown in FIGS. 5A and 5B, the LED bare chip 2 includes a light emitting unit 15 on an element substrate 11 made of sapphire. The light emitting unit 15 includes a GaN-based n-type semiconductor layer 12, The active layer 13 and the p-type semiconductor layer 14 are stacked.

  In the present embodiment, unlike the conventional example shown in FIG. 1, the LED bare chip 2 is mounted with the light emitting portion 15 facing the side closer to the heat dissipation substrate 1 than the element substrate 11. That is, the electrode 14a of the p-type semiconductor layer 14 is directly connected to the wiring pattern 1a of the heat dissipation substrate 1 by flip chip bonding. The electrode 12a of the n-type semiconductor layer 12 is also connected by a bump 16 to the wiring pattern 1a of the heat dissipation board 1 without a wire. Note that both the electrode 12a and the electrode 14a can be variously bump-bonded, and the larger the area of the electrodes 12a and 14a of the LED bare chip 2 that is metal-bonded to the wiring pattern 1a, the more heat is dissipated. Is advantageous. Also from this point, the configuration of the present embodiment that can extract light from the element substrate 11 side and have a large metal contact area on the light emitting unit 15 side is advantageous.

  The size of each LED bare chip 2 is practically about 250 to 350 μm in length and width and about 90 to 350 μm in thickness when considering the current state of the LED bare chip, but the present invention is limited to this. It is not something.

  When the LED bare chip 2 is connected to the wiring pattern by flip chip connection as in this embodiment, the LED bare chip 2 is enlarged to about 1 mm in length and width, or more, and the amount of light extracted from one LED bare chip 2 is increased. There are several advantages.

  When the LED bare chip is enlarged to 500 μm or more, it emits intensely in the vicinity of the electrode but far from the electrode due to the resistance and current density distribution of the p-type semiconductor and n-type semiconductor that are joined and fed to the electrode. Has the problem of weakening the light emission. This problem can be solved by using a large LED bare chip as a flip chip configuration as in the present invention and increasing the electrode of the LED bare chip to 50% or more of the element area. This solution arises from the unique configuration of the present invention in which the light extraction surface and the power supply surface of the LED bare chip are opposite. In addition, it is also possible to suppress current density unevenness in the LED bare chip by using a large number of electrodes of the LED bare chip instead of a pair of p-type and n-type. When this many-pair configuration is performed by conventional wire bonding, there are problems such as a long wire handling and an increased number of wire bondings.

  In the present embodiment, the surface of the element substrate 11, that is, the LED bare chip substrate (light emission side surface) is not a perfect plane, but has a shape in which the central portion is high and decreases toward the peripheral edge (for example, a dome shape). There is no.

  A metal (aluminum) optical having a reflective surface 3a for controlling the traveling direction of light generated in the LED bare chip 2 at a position surrounding each LED bare chip 2, and a hole 3b is opened at each LED bare chip 2 installation position. A reflection plate 3 is provided on the heat dissipation substrate 1. The hole 3b is filled with a resin 4 (epoxy, resin, silicone, or a combination thereof) so that the LED bare chip 2 is molded. This filled resin 4 functions as a lens.

  With such a configuration, when a forward bias voltage is applied between the electrode 12a and the electrode 14a, recombination of electrons injected into the n-type semiconductor layer 12 and holes injected into the p-type semiconductor layer 14 is achieved. Thus, light is emitted from the active layer 13, and this emitted light is used as illumination. Further, light emitted in the lateral direction of FIGS. 5A and 5B is reflected upward by the reflecting surface 3a of the optical reflecting plate 3 to improve the light utilization efficiency.

  Even in the case of this embodiment, a large amount of heat is generated along with the light emitting operation of the LED bare chip 2, and this generated heat is directly dissipated from the light emitting unit 15 to the heat dissipation substrate 1. At the same time, the metallic optical reflector 3 contributes to the soaking of the heat radiating board 1 and also has the effect of suppressing the heat concentration at the center of the heat radiating board 1.

  The LED bare chip 2 of this embodiment is produced by the following processes, for example.

  First, on a sapphire substrate having a diameter of about 2 inches, a GaN-based n-type semiconductor layer, an active layer, and a p-type semiconductor layer are sequentially stacked by, for example, a CVD method, and electrodes 12a and 14a are further formed to manufacture a semiconductor wafer. To do. And each LED bare chip 2 is produced combining the sandblasting process and the dicing process to the manufactured semiconductor wafer.

  Fine ceramic grains or metal grains are sprayed on a semiconductor wafer with the sapphire substrate side up, and after forming isolation grooves for each element from the sapphire substrate side, the isolation grooves are further diced to be cut into a plurality of LED bare chips 2. By doing in this way, the some LED bare chip 2 in which the light emission side surface of the element substrate 11 made the dome shape is produced. Here, the surface shape of the element substrate 11 can be controlled by controlling the flow rate and flow velocity of the ceramic particles or metal particles to be sprayed. In addition to this, it is also possible to combine dicing blades having different blade shapes, first cut and form the inclined portion, and then completely and individually cut with a dicing blade having another blade shape.

  In this embodiment, unlike the case where electrodes are formed above and below a conventional LED bare chip, a flip chip configuration is adopted, and the upper surface of the LED bare chip is smaller than the lower surface. For this reason, when performing the above-described processing, there is no need to worry about the size and damage of the upper surface electrode. In addition, since there is no wire on the upper surface of the LED bare chip, it is possible to eliminate radiation disturbance (interference) due to the wire, and to avoid disturbance of light distribution and a decrease in light output due to the wire.

  In this embodiment, a sapphire substrate is taken as an example, but a SiC substrate, a GaN substrate, or the like may be used. The important point is not limited to visible light, but a substrate that transmits light emitted from the LED may be used. Further, the LED bare chip may be used by being incorporated in an element such as a conventional through-hole element (such as a bullet-shaped element) or a surface mount element (such as SMD (surface mount device) or a chip-type element).

  The plurality of LED bare chips 2 produced in this way are arranged on the heat dissipation substrate 1 in a matrix by connecting the electrodes 12a, 14a to the wiring patterns 1a, 1a of the heat dissipation substrate 1. Then, after covering the optical reflecting plate 3, each LED bare chip 2 is molded with the resin 4. In addition, when encapsulating the resin 4 in the hole 3b of the optical reflecting plate 3, when resin sealing is performed by a printing method, a large amount of resin lenses can be formed at one time. The effect can be increased.

  In the card-type LED illumination light source of the present invention, each LED bare chip 2 is provided with the light emitting portion 15 facing the heat radiating substrate 1 side, so there is no need to provide a power supply wire as seen in the conventional example shown in FIG. Since the area required for wire bonding is not required, the distance between the LED bare chips 2 and 2 installed adjacent to each other can be narrowed, and the LED bare chip 2 can be highly integrated. This point is also advantageous for light mixing using a large number of LED bare chips 2 (or bare chips) having different emission colors.

  Moreover, the heat generated in the light emitting unit 15 is efficiently dissipated to the outside through the heat dissipation substrate 1 having high thermal conductivity. At this time, in each LED bare chip 2, the light emitting portion 15 that generates heat is directly connected to the heat dissipation substrate 1, so that heat is not dissipated through the element substrate as in the conventional example shown in FIG. 1. The heat generated in the light emitting part 15 is directly dissipated to the outside through the heat dissipation substrate 1, and the heat dissipation is excellent. Therefore, since it is excellent in heat dissipation, even if a large amount of heat is generated, the generated heat can be easily dissipated and the temperature rise of the LED bare chip 2 can be suppressed, so that a strong current flows through each LED bare chip 2. And a large luminous flux can be obtained.

  Since the refractive index of the element substrate 11 (sapphire) of the LED bare chip 2 and the refractive index of the resin 4 (epoxy resin or silicone resin) are different, the light emitted from the light emitting portion 15 is emitted from the light emitting side surface of the element substrate 11. A part of the reflected light is totally reflected by the difference in refractive index. Since the totally reflected light travels to the LED bare chip 2 side, it does not contribute for illumination. Therefore, in order to effectively use the generated light, it is necessary to suppress this total reflection as much as possible.

  In the present embodiment, the shape of the light emitting side surface of the element substrate 11 of each LED bare chip 2 is processed and formed into a dome shape rather than horizontal with respect to the light emitting surface. By doing so, the ratio of total reflection of the light emitted from the light emitting unit 15 is lowered. FIG. 7A is a diagram showing a light path in the present invention in which the light emission side surface forms a dome shape, and FIG. 7B shows a light path in a comparative example in which the light emission side surface forms a horizontal plane. FIG.

  When the light emitting side surface forms a horizontal plane, the incidence angle increases at the peripheral edge, and the ratio of light reaching the critical angle (B in FIG. 7B) increases, and total reflection tends to occur. . On the other hand, in the case where the light emission side surface has a dome shape, the rate at which the incident angle of light reaches the critical angle decreases even at the peripheral portion, and most of the light emitted from the light emitting unit 15 ( In FIG. 7A, A) is emitted to the outside without being totally reflected.

  Light in the LED bare chip 2 (example of the present invention) obtained by processing and shaping the light emitting side surface of the element substrate 11 into a dome shape, and the LED bare chip 2 (comparative example) in which the light emitting side surface of the element substrate 11 has a horizontal shape. 8A and 8B show the simulation results of the emitted light beam. Comparing FIGS. 8A and 8B, it can be seen that the upward luminous flux that can contribute to the illumination light is increased in the example of the present invention as compared with the comparative example, and the external extraction of the light can be effectively performed. . According to the measurement of the present inventor, the light extraction efficiency can be improved 1.6 times in the example of the present invention compared to the comparative example.

  As described above, in the card-type LED illumination light source of the present invention, since the light emission side surface of the element substrate 11 is formed in a dome shape, the generated light can be taken out without waste, and the generated light can be used for illumination light. The efficiency can be made very high.

  In the above-described example, the shape of the light emitting side surface of the element substrate 11 is a dome shape, but the shape is such that total reflection hardly occurs (an inclined surface shape in which the central portion is high and the peripheral portion is low). If there is, it can be set to an arbitrary shape. For example, as shown in FIG. 9 (a), the shape is reverse to the above example, and the inclined surface is convexly formed on the light emitting portion 15 side, and the inclination with a constant inclination angle as shown in FIG. 9 (b). You may make it use the shape in which the surface (taper surface) was formed.

  However, this effect is reduced when the inclined surface is not a curved surface but a flat surface or a polyhedron. The inclined surface is preferably dome-shaped, and in this case, an effect is obtained in which a lens is formed on the LED bare chip 2 itself. Since the LED bare chip 2 itself has a lens effect, the light distribution of the LED bare chip 2 itself is concentrated on the front surface of the lens, and the amount of light emitted to the side of the LED bare chip 2 is reduced. Thereby, the stray light component of the optical system in which the LED bare chip 2 is incorporated is reduced, and as a result, the light utilization efficiency of the entire card type LED illumination light source is improved.

  In the example described above, the blue light card-type LED illumination light source using the LED bare chip 2 that emits blue light in the GaN-based semiconductor layer / sapphire element substrate configuration has been described, but another LED bare chip that emits red light, green light Of course, the present invention can be similarly applied to a card-type LED illumination light source using an LED bare chip that emits light or an LED bare chip that emits yellow light. Of course, the present invention can also be applied to a white card type LED illumination light source in which these four types of LED elements are mixedly arranged to control white light distribution and provide white light and variable color light. It is.

  As other embodiments, there are GaN-based LEDs configured on different element substrates such as an SiC substrate and a GaN substrate that emit blue light emission and green (blue-green) light emission. In this case, the element substrate itself is present. Since the electrode has conductivity, in addition to forming electrodes on the n-type and p-type semiconductor layers 12 and 14 sandwiching the active layer 13 in FIGS. 5A and 5B, one electrode is used as the element substrate itself. Configuration is also possible.

  In addition, in the case of an AlInGaP-based LED bare chip (element) that emits yellow (orange) and red light, a GaP substrate having a high transmittance with respect to these emission colors is used as the element substrate. Can be taken.

  A similar configuration can be obtained by wafer bonding the light emitting portion of the AlInGaP-based LED bare chip to a transparent substrate such as a sapphire substrate or a glass substrate on which a transparent electrode is formed.

  Furthermore, as shown in FIG. 10, a metal electrode having an optical opening is formed on a transparent element substrate 11 such as a sapphire substrate or a glass substrate on which a metal electrode 18 having an optical opening is formed. A similar configuration can be obtained by metal bonding (for example, metal bonding using ultrasonic bonding or the like) of the light emitting portion 15 of the formed AlInGaP-based LED bare chip (element). In this case, the bonding portion of the wafer bond can take various shapes, and an example thereof is shown in FIGS.

  In the case of an AlInGaP-based LED bare chip, without removing the growth substrate, first, a metal electrode having an opening of the bare chip and a metal electrode having an opening on the transparent element substrate 11 to be wafer bonded are metal-bonded. Also good. In this case, after the metal bonding, a process of removing the growth substrate of the LED bare chip is performed. The shape processing of the element substrate 11 may be performed at any time before and after the wafer bonding process, and may be performed at any time before and after the process of removing the growth substrate of the LED bare chip.

  Even when an optically transparent bonding means is used, wafer bonding between the transparent substrate and the light emitting portion of the LED bare chip is possible.

  In the above-described example, the surface shape of the element substrate 11 is formed by sandblasting, but the surface shape is formed by processing by water jet or selective chemical etching, and has a refractive index equivalent to that of the LED element substrate 11. An optical lens may be attached. Further, as described for the processing of the GaN-based LED bear chip, the surface shape of the element substrate 11 can be obtained by cutting using a cutting edge of a dicing blade. In addition, you may use even if the bare chip | tip for flip chips to which these processes were given is integrated in elements, such as the conventional bullet shape and SMD.

  The above configuration eliminates the need for wire bonding, and thus contributes to the miniaturization and high efficiency of the optical system.

  Even when using an AlInGaP-based LED, by increasing the area of the LED electrode located on the side closer to the substrate (heat dissipation substrate) on which the LED bare chip is mounted, the light directed toward the mounting substrate is reflected and the light extraction efficiency is improved. To do.

  The heat dissipation substrate 1 can be made of a metal core substrate or the like other than the metal plate base substrate as shown in FIGS. However, in the case of a metal base substrate, the lower surface of the substrate is metal, and a metal optical reflector can be arranged on the substrate, so that heat can be radiated from the upper and lower surfaces of the substrate. , The heat dissipation effect becomes larger.

(Embodiment 3)
Next, another embodiment of the card type LED illumination light source according to the present invention will be described.

  First, the card type LED illumination light source of this embodiment will be described with reference to FIG.

  As shown in FIG. 12, the card-type LED illumination light source of the present embodiment includes a metal plate 50, a multilayer wiring board 51, and a metal optical reflection plate 52. The metal plate 50 and the multilayer wiring board 51 constitute one “card type LED illumination light source” as a whole.

  The metal plate 50 is a base metal of the heat dissipation board. The metal plate 50 and the optical reflection plate 52 can be made of aluminum, copper, stainless steel, iron, or an alloy thereof. The materials of the metal plate 50 and the optical reflecting plate 52 may be different. Arrangement of preferable materials from the viewpoint of thermal conductivity is in the order of copper, aluminum, iron, and stainless steel. On the other hand, when preferable materials are arranged from the viewpoint of the coefficient of thermal expansion, the order is stainless steel, iron, copper, and aluminum. Aluminum-based materials are preferred from the viewpoint of ease of use such as rust prevention treatment, and stainless steel-based materials are preferred from the viewpoint of avoiding reliability deterioration due to thermal expansion.

  The back surface of the metal plate 50 is flat and can come into contact with a flat surface of a member (not shown) having excellent thermal conductivity.

  If the metal plate 50 is insulated by electrolytic polishing, alumite treatment, electroless plating, electrodeposition, or the like, an electrical short circuit does not occur even when the metal plate 50 directly contacts the wiring pattern.

  In addition, it is preferable to perform the process for improving a reflectance with respect to the part which reflects the light radiated | emitted from the LED bare chip in the surface of the metal plate 50 at least. The treatment for improving the reflectivity includes an increase reflection treatment in which a large number of material layers having different refractive indexes are stacked, and a treatment for improving the specularity on the surface of the metal plate 50.

  Similar to the second embodiment, the multilayer wiring board 51 has a two-layer structure of a first insulating layer and a second insulating layer made of a mixture of an inorganic filler and a resin composition. A lower layer wiring is formed between the first insulating layer and the second insulating layer, and an upper layer wiring is formed on the second insulating layer. The upper layer wiring and the lower layer wiring are electrically connected via vias provided in the second insulating layer.

  It is possible to fill the hole of the optical reflecting plate 52 with LED sealing resin to form a concave lens or convex lens made of resin, and it is also possible to flatten the hole portion by filling the hole portion with resin. However, since the area of the optical reflecting plate 52 is smaller than the area of the multilayer wiring substrate 51, the entire optical reflecting plate 52 can be molded with resin. If the optical reflecting plate 52 is completely covered with resin, the sealing performance is improved.

  For example, as shown in FIG. 13, the connector provided on the lighting device side includes a main body 55 having a guide portion that guides the card type LED illumination light source while sliding, and a plurality of connectors electrically connected to the card type LED illumination light source. Connector electrode 56, a metal plate (bottom plate) 57 excellent in thermal conductivity, and a wiring cord 58 for connecting the connector electrode to a circuit (such as a lighting circuit).

  The power supply electrode 54 of the card-type LED illumination light source inserted into the connector comes into contact with the corresponding connector electrode 56 and becomes conductive. From the viewpoint of heat dissipation, it is preferable that all or part of the back surface of the metal plate 50 is in thermal contact with the metal plate 57 of the connector when the card-type LED illumination light source is inserted into the connector.

  In the present embodiment, as shown in FIG. 12, the power supply electrode 54 is intensively arranged on one side of the four sides on the upper surface of the multilayer wiring board 51, so that the card-type LED illumination light source is Then, it is pushed in the direction of arrow A in the figure and inserted into the connector.

  As can be seen from FIG. 12, the size of the multilayer wiring board 51 is larger than the size of the optical reflector 52 by the size of the region where the power supply electrode 54 is provided. For this reason, in this embodiment, the center position (optical center) of the area (light emission area or LED cluster area) where the LED bare chips 53 are mounted in a matrix does not coincide with the center position of the substrate, and the card type LED The center of bending stress of the illumination light source does not coincide with the center of the fragile optical system, and the strength is improved. Further, by concentrating the feeding electrode 54 at one end of the substrate, the end portions corresponding to the other three sides on the upper surface of the multilayer wiring substrate 51 do not necessarily need to be completely fitted into the connector, and the shape, etc. Design freedom is improved.

  The position of the optical center can be arbitrarily adjusted by appropriately setting the size of the multilayer wiring board 51 (and the metal plate 50) in the long side direction (size of the side parallel to the arrow A).

  The optical reflection plate 52 basically has the same configuration as the optical reflection plate 3 shown in FIG. 4A and has a plurality of openings corresponding to the arrangement of the LED bare chips 53. A resin lens is preferably formed in the opening of the optical reflecting plate 52, and the LED bare chip 53 is sealed by the resin lens, so that the connection between the LED bare chip 53 and the multilayer wiring board 51 is stronger. It becomes. Thus, when the connection between the LED bare chip 53 and the multilayer wiring board 51 is strengthened, a screw hole is provided in the card of the card type LED illumination light source for the purpose of screwing the card type LED illumination light source to the heat radiating member. Or an arc for screwing can be provided on a part of the edge side of the card substrate.

  With reference to Fig.14 (a) and FIG.14 (b), the structure of the card type LED illumination light source of this embodiment is demonstrated still in detail. FIG. 14A shows an LED bare chip 53 that is flip-chip mounted with the active layer face-down. As will be described later, in the present embodiment, different mounting methods are adopted depending on the type of the LED bare chip 53.

  The LED bare chip 53 is mounted so as to be connected to the wiring pattern 59 of the multilayer wiring board 51 and to be fixed on the multilayer wiring board 51. The metal optical reflector 52 is attached to the multilayer wiring board 51 after the LED bare chip 53 is mounted on the multilayer wiring board 51.

  Two layers of wiring patterns 59 are formed on the multilayer wiring board 51, and wiring patterns 59 in different layers are connected by vias 63. The wiring pattern 59 in the uppermost layer is connected to the electrode of the LED bare chip 53 via the Au bump 61. The wiring pattern 59 is configured by, for example, a wiring pattern formed from copper, nickel, aluminum, or an alloy containing these metals as main components.

  As described above, the multilayer wiring board 51 includes an insulating layer made of a mixture of an insulating resin composition and an inorganic filler, and the mixture preferably includes a thermosetting resin. . By appropriately selecting the type and amount of the resin composition and the inorganic filler constituting the insulating layer, the thermal conductivity, linear expansion coefficient, dielectric constant, etc. of the insulating layer can be adjusted. A preferable thermal conductivity of the insulating layer is 1 to 10 (W / m · K). The insulating layer is preferably white. By adopting the white insulating layer, the visible light reflectance by the exposed portion of the insulating layer is increased, and the light utilization efficiency is further improved.

As the inorganic filler, it is preferable to use at least one filler selected from the group consisting of Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 , and AlN, which are excellent in thermal conductivity. The average particle size of the inorganic filler is preferably set from a range of 0.1 to 100 μm. This is because if the average particle size is out of this range, the filler filling property and the heat dissipation property of the substrate are lowered.

  As the thermosetting resin, it is preferable to use at least one kind of resin selected from the group consisting of an epoxy resin, a phenol resin, and a cyanate resin. This is because these resins have better electrical insulation, mechanical strength, and heat resistance after curing than other cured resins. If necessary, additives such as a coupling agent, a dispersant, a colorant, and a release agent may be added to the resin composition.

  Using a 160 μm thick sheet made of alumina filler composite material, prepare a multilayer wiring board with two layers of wiring with a total insulation layer of 320 μm, and paste the card type LED illumination light source on the aluminum metal base. Produced. When an LED bare chip was directly mounted on the aluminum metal-based alumina composite bilayer substrate and the thermal resistance between the LED bare chip and the base metal was measured, a thermal resistance of about 1 [° C./W] was obtained.

When natural heat dissipation by a heat sink is performed on the prototype in a windless state, an LED bare chip (64 pieces) of about 0.3 mm square is 40 mA (current twice the rating, current density is about 444 [mA / mm 2 ]. In order to keep the LED bare chip temperature at about 80 ° C., a heat sink surface area of about 300 [cm 2 ] is required. Further, in the case of performing natural air cooling, when operating with such a large current, the thermal resistance between the LED bare chip and the base metal needs to be set to about 10 [° C./W] or less.

  In the case of performing natural air cooling, it is not preferable that the temperature of the LED bare chip exceeds 80 to 120 ° C. because the thermal degradation and light degradation of the sealing resin (resin such as epoxy and silicone) of the LED bare chip become severe.

  If the thermal resistance is about 5 [° C./W] or less, sufficient heat dissipation by natural air cooling is possible even when a heat sink having a realistic finite area is used instead of a heat sink having an ideal large area. Is possible. Furthermore, if the thermal resistance is about 2 to 1 [° C./W] or less, a small heat sink can sufficiently radiate heat.

  In addition, the insulating layer thickness is reduced, and the thermal conductivity of about 3 to 5 [W / mK] is used instead of the insulating layer of the alumina composite material having the thermal conductivity of about 2 to 4 [W / mK]. A system having a thermal resistance of 1 [° C./W] or less, such as using an insulating layer of a boron-based composite material, can be realized. In this case, the same effect can be obtained even if the heat sink area is further reduced.

  In addition, when an insulating layer made of a silica composite material having a thermal conductivity of 1 to 2.5 [W · mk] is used, the insulating layer is made thinner than when an insulating layer having a higher thermal conductivity is used. By doing so, the thermal resistance in the above range can be realized.

  The wiring pattern 59 of the multilayer wiring board 51 can be formed, for example, by forming a wiring pattern on a release carrier such as an organic film and then transferring the wiring pattern from the release carrier onto the insulating layer. it can. For the wiring pattern of the release carrier, a metal foil such as copper foil is adhered to the release carrier via an adhesive, and a metal layer is deposited on the metal foil in a film shape by electrolytic plating or electroless plating. Thereafter, the metal can be patterned by chemical etching or the like. However, when the wiring pattern is formed from the metal foil, the surface of the insulating layer is preferably roughened in order to increase the adhesive strength of the metal foil.

  The wiring pattern 59 may be produced by other methods. Further, the wiring pattern 59 may be buried in the insulating layer or may be attached to the flat insulating layer surface. The via 63 connecting the wiring patterns 59 in different layers is produced by providing plating or a conductive resin composition part inside a hole (via hole or through hole) formed in the insulating layer.

  Most of the upper surface of the multilayer wiring board 51 having such a configuration is covered with the optical reflecting plate 52, but a part thereof is exposed. A plurality of power supply electrodes 54 are formed in the exposed region on the multilayer wiring board 51. The power supply electrode 54 is electrically connected to a lighting circuit of the lighting device via a connector into which a card type LED illumination light source is inserted.

  An underfill (stress relaxation layer) 60 is provided between the optical reflector 52 and the multilayer wiring board 51. The underfill 60 relieves stress caused by a difference in thermal expansion between the metallic optical reflection plate 52 and the multilayer wiring substrate 51, and the upper layer wiring on the optical reflection plate 52 and the multilayer wiring substrate 51. Electrical insulation between the two is also ensured.

  The entire optical reflector 3 is preferably made of metal. By sandwiching the insulating layer (substrate insulating layer) between the substrate base metal and the metal reflector, heat can be radiated from both sides of the substrate, and the heat at the center of the LED mounting side, which is a heating element, is transmitted to the periphery. On the other hand, it is possible to obtain effects such as equalization of temperature. Moreover, the effect of pressing down the warpage of each metal plate from both sides of the substrate insulating layer can be expected as a secondary effect.

  Furthermore, if the substrate insulating layer is formed from a composite material composed of a resin composition and an inorganic filler, the stress of both metals can be relaxed by the elasticity of the composite material. As a result, it is possible to improve the reliability as a lighting device that is turned on at high temperature and high output.

  In order to further relax the stress and further improve the reliability, it is preferable to provide a stress relaxation layer made of a material different from these materials between the optical reflector and the substrate insulating layer. A bump is formed on the wiring on the insulating layer, or a bump land is provided in addition to the wiring, thereby providing a gap between the insulating layer and the optical reflector. Even if a resin (epoxy or silicone) used for the LED mold is filled, the stress can be relieved. By providing such stress relaxation means, it is possible to suppress non-lighting and a decrease in reliability even under severe conditions where stress due to a thermal shock in a blinking test is applied.

  A lens is formed by a molded resin 62 at the opening of the optical reflection plate 52. From the viewpoint of improving heat dissipation, the optical reflecting plate 52 is preferably formed from a metal plate such as aluminum, but a plate formed from another insulating material may be used. In that case, at least a part (preferably all) of the inner peripheral wall surface of the opening is made of a material having a higher reflectance than the insulating plate, for example, a metal such as Ni, Al, Pt, Ag, Al, or these It is desirable to provide a reflective film formed from an alloy containing metal as a main component. By doing so, the light emitted from the LED to the side is appropriately reflected by the reflective film, and the light utilization efficiency can be improved.

  The material of the metal plate 50 attached to the back surface is not limited to aluminum, and may be copper. The back surface of the metal plate 50 is preferably flat so as to improve heat dissipation by contacting a member having good thermal conductivity provided in a connector or the like, but fins or linear irregularities for heat dissipation are partly on the back surface. May be provided. In that case, it is preferable that the surface of the member in contact with the back surface of the metal plate 50 is provided with an uneven shape corresponding to fins or linear unevenness. When adopting a configuration in which the card-type LED illumination light source is slid and connected to the connector, the fins and linear irregularities provided on the back surface of the metal plate preferably extend along the sliding direction so as not to inhibit the sliding. . When doing in this way, while the fin and the linear unevenness | corrugation itself function as a guide, the effect that a contact area increases is acquired.

  In order to enhance the thermal contact between the heat conductive material member and the card type LED illumination light source, it is preferable to employ a mechanism for pressing the heat conductive material member against the card type LED illumination light source. Such pressing can be performed by a power supply terminal having a spring property. However, in order to obtain a sufficient pressing force only with this, it is necessary to sufficiently increase the spring property of the power supply terminal. When the mechanical pressing force required for electrical contact with the power supply terminal is about 50 to 100 g per terminal, it is preferable to additionally provide pressing means for applying a pressing force stronger than this. As such a pressing means, a spring member that pressurizes 200 g or more against a portion other than the power supply terminal in the card-type LED illumination light source can be disposed. A plurality of such pressing means may be provided.

  If the pressing means is provided, it is not necessary to increase the mechanical pressure on the power supply terminal so much that the card-type LED illumination light source can be easily attached and detached with a human finger. After the card-type LED illumination light source is mounted on the connector of the LED illumination device, the user can firmly press the back surface of the card-type LED illumination light source against the heat conducting member by the pressing means. By such pressing, the card-type LED illumination light source is in a kind of locked state with the LED illumination device, and the card-type LED illumination light source is prevented from being accidentally dropped from the device.

  FIG.14 (b) has shown the edge part cross section of the card-type LED illumination light source in the state connected with the connector. In the drawing, the connectors are indicated by broken lines. For convenience, the card-type LED illumination light source of FIG. 14B is shown thinner than the card-type LED illumination light source shown in FIG.

  As can be seen from FIG. 14B, a feeding electrode 54 is formed on the connector side end of the multilayer wiring board 51, and the feeding electrode 54 is electrically connected to the wiring pattern 59 directly or via a via. It is connected. Since the region where the feeding electrode 54 is formed in the multilayer wiring board 51 is not covered with the optical reflecting plate 52, the connector electrode 56 can easily come into contact with the feeding electrode 54.

  Electrical connection / disconnection between the connector electrode 56 and the power feeding electrode 54 can be easily performed by inserting and removing the card-type LED illumination light source with respect to the connector. Safety is improved if a switch for detecting insertion / removal of the card-type LED illumination light source is installed on the connector side where the card-type LED illumination light source is inserted to prevent energization when the card-type LED illumination light source is not inserted. . In this case, the switch may be provided at any position on the lower surface, side surface, and upper surface of the card.

  In FIG. 13, the connector electrode 56 is shown so that it can be seen from the outside. However, as shown in FIG. 14B, the actual connector electrode 56 is designed not to be touched by human fingers. Is preferred.

  In this embodiment, four types of LED bare chips that emit red (R), green (G), blue (B), and yellow (Y) light are arranged on a single substrate, 16 pieces each. Yes. The substrate size is, for example, long side 28.5 mm × short side 23.5 mm × thickness 1.3 mm, and the size of the rectangular region in which 64 LEDs are arranged is, for example, 20 mm × 20 mm × thickness 1 mm. is there. In this example, the reason why the area where the LEDs are arranged (the area where the reflector is present) has a size of about 2 cm square is that the bulb size of a small round bulb or a mini-krypton bulb that is common among small wattage bulbs. This is because it is possible to replace these existing low-wattage bulbs by providing an equivalent light emitting area. According to the Komaru bulb, a total luminous flux of about 20 to 50 lm can be obtained with a power of about 5 to 10 W, and with a mini-krypton bulb, a total luminous flux of about 250 to 500 lm can be obtained with a power of about 22 to 38 W. It is done.

  According to an experiment by the present inventor, in an embodiment using a white LED, when natural air cooling is performed and the room temperature is 25 ° C., a light flux of about 100 to 300 lm is obtained, and an equivalent light amount is obtained with a light emitting unit size equivalent to a small light bulb. was gotten. In addition, when a card-type LED illumination light source is assembled in a housing equivalent to a beam bulb and placed in a diameter equivalent to a beam-type dichroic halogen bulb, the center of the light emission area (light emission area) provided with the reflector is The distance from the light emitting unit center to the long side end face (feeding electrode side) of the substantially rectangular card is as follows.

  When the diameter is 35 mm: About 13 mm.

  When the diameter is 40 mm: About 15 mm.

  For a diameter of 50 mm: about 23 mm.

  Further, it is preferable to secure a flat portion that can come into contact with the guide portion in the peripheral portion of the substrate. Moreover, in order to resin seal the whole reflecting plate, it is preferable to arrange | position the area | region which does not provide LED in the board | substrate periphery part. Such regions are provided on both sides of a light emission region of about 2 cm square size, and the width of each region is set to 1 to 3 mm, for example. When this region (margin portion) is set larger, the distance from the light emitting portion center to the end face needs to be reduced.

  When using the card insertion type or the type of usage in which the card is installed and pressed, and corresponding to the use of both lighting equipment and lamps, the feeding electrodes must be concentrated on one side of the card-type LED illumination light source. It is also desirable from the viewpoint of dealing with various types of insertion / removal, and it is further desirable that the reflecting mirror plate (light emission region) be arranged so as to deviate from the geometric center of the substrate.

  In order to effectively dissipate heat from the back side of the substrate of the card type LED illumination light source, it is preferable that the power feeding electrode is concentrated on the light emitting side surface of the substrate. In order to ensure thermal contact with the conductive member (heat dissipating means), it is preferable to perform not only pressing by the power supply terminal but also pressing by another pressing means. It is desirable to provide a space for performing such pressing as a blank portion on the substrate main surface.

  The distance from the light emitting portion center to the substrate end surface where the feeding electrode is not present can be set shorter than the distance on the side where the feeding electrode is present. If this distance is made to coincide with the width of the margin part on both sides of the light emitting area, for example, when four card-type LED illumination light sources are closely arranged so that two sides are in contact with each other, the interval between the reflector plates (light emitting areas) Can be set at equal distances and as short as possible.

  From the viewpoint described above, the distance from the center of the light emission region (light emitting part center) to the substrate end face (end face on the power feeding electrode side) in the card type LED illumination light source is about 16.5 mm, and the substrate end face (power feeding) from the light emitting part center. A prototype having a distance to the end surface opposite to the electrode side of about 12 mm was produced. By setting the space (width) on the side opposite to the power supply electrode to a sufficient size, via connection with the lower wiring layer is possible outside the reflector (light emission region) (the blank portion of the substrate). In this case, by making this part a partial single layer, it is also possible to conduct electricity by wiring the upper and lower layers without using vias. Conversely, the feeding electrode side can be a partial single layer. Furthermore, it is possible to increase the degree of freedom of wiring jumpers by further increasing the number of layers on only a part of the substrate. In this case, the margin part becomes an effective space.

  In the present embodiment, the feeding electrode is designed to have a substantially rectangular shape in consideration of mechanical errors in contact with the connector electrodes and via manufacturing errors, and has a width of 0.8 mm and a length of 2.5 mm. The center-to-center distance between the feeding electrodes is set to 1.25 mm. In order to form as many independent circuits as possible on the substrate of the card type LED illumination light source, it is preferable that the number of power supply electrodes is large. In the configuration example of this embodiment, 16 power supply electrodes can be provided.

  When the same number of anode-side electrodes and cathode-side electrodes are provided for constant current driving, 6 (on each power supply electrode are assigned to blue, green (blue-green), yellow (orange), red, and white). (3 paths) spare terminals can be provided.

  In this embodiment, in order to ensure the minimum insulation distance between the power supply electrode and the metal base substrate, the distance between the edge of the power supply electrode and the substrate end surface is set to 2 mm at the minimum. In order to further improve this insulation, it is also possible to make the space between the feeding electrodes three-dimensional instead of flat and form ribs with an insulating layer.

  FIG. 15 shows an equivalent circuit representing an interconnection state of 64 LED bare chips provided in one card type LED illumination light source. In FIG. 15, R (+) means the anode side of the LED bare chip that emits red light, and R (−) means the cathode side of the LED bare chip that emits red light. The same applies to the other colors (Y, G, B).

  FIG. 16 is a block diagram illustrating a configuration example of the LED lighting circuit. In the illustrated configuration example, the lighting circuit 70 of the card type LED illumination light source includes a rectification / smoothing circuit 71, a voltage drop circuit 72, and a constant current circuit 73. The rectifying / smoothing circuit 71 is a known circuit that is connected to an AC 100V power source and has a function of converting alternating current into direct current. The power source is not limited to AC 100 V, and a DC power source may be used. When a DC power source is used, a voltage conversion circuit (step-down / step-up circuit) may be used instead of using the rectification / smoothing circuit 71 that combines a smoothing circuit and a step-down circuit.

  The voltage drop circuit 72 reduces the DC voltage to a voltage suitable for LED emission (for example, 18V). The constant current circuit 73 is composed of LED control constant current circuits for blue, green, yellow, and red. The LED control constant current circuit has a function of adjusting the current supplied to each color LED group 76 in the card-type LED illumination light source 75 to a constant value. Electrical connection between the constant current circuit 73 and each LED group 76 is achieved by fitting the card type LED illumination light source 75 into the connector of the illumination device. Specifically, the power supply electrode formed on the substrate of the card-type LED illumination light source 75 is electrically connected to the corresponding power supply electrode in the connector.

  Such a lighting circuit 70 includes an electrolytic capacitor as a part of circuit elements. Since the life of the electrolytic capacitor is remarkably shortened at about 100 ° C., the temperature in the vicinity of the electrolytic capacitor needs to be well below 100 ° C. According to the present embodiment, the heat generated in the card type LED illumination light source 75 is radiated from the heat radiation means through the heat radiation member in the illumination device via the metal plate of the card type LED illumination light source 75, so that the electrolytic capacitor of the lighting circuit Is maintained at about 80 ° C. or lower, and the life of the lighting circuit is extended.

  In the present embodiment, the ground potential is separately applied to the blue, green (blue green), yellow (orange), and red LED groups 76 in order to perform constant current driving. For this reason, the number of power supply electrodes of the card-type LED illumination light source 75 in this embodiment is eight. Half of the eight feeding electrodes function as an anode electrode, and the other half functions as a cathode electrode.

  Hereinafter, the multilayer wiring pattern of the card-type LED illumination light source in the present embodiment will be described with reference to FIGS. 17 and 18. FIG. 17 shows the layout of the upper wiring pattern in the multilayer wiring board, and FIG. 18 shows the layout of the lower wiring pattern.

  17 and 18, a small circular region 79 shown on the wiring pattern 78 indicates the position of the via connecting the upper and lower wiring patterns. In FIGS. 17 and 18, for simplification, reference numerals “78” and “79” are shown only in one place in each figure, but in reality, a large number of wiring patterns and vias are formed. Needless to say.

  In FIG. 17, LED bare chips are mounted in regions 85a and 85b surrounded by broken lines as representatively shown. FIGS. 19A and 19B show the regions 85a and 85b in an enlarged manner. In the portion shown in FIG. 19A, an LED bare chip is mounted in a flip chip (FC) mounting format. On the other hand, an LED bare chip is mounted on the portion shown in FIG. 19B in a wire bond (WB) mounting format. FIG. 19 (c) shows a cross section of the LED bare chip mounted with FC, and FIG. 19 (d) shows a cross section of the LED bare chip mounted with WB.

  In the present embodiment, FC mounting is performed for LED bare chips that emit blue or green (blue-green) light, and WB mounting is performed for LED bare chips that emit yellow (orange) or red light.

  In an LED bare chip (element) that emits red or yellow (orange) light (light having a relatively long wavelength), a laminated structure including a light emitting layer is usually formed on a GaAs substrate. Since the GaAs substrate hardly transmits red or yellow light, it is mounted so as to be positioned below the light emitting layer. For this reason, such an LED bare chip cannot be mounted face-down.

  In the case of the FC mounting shown in FIG. 19 (c), the n-electrode and the p-electrode are formed on the side where the light emitting layer of the LED bare chip is present, and the connection between these electrodes and the wiring on the multilayer wiring board (upper-layer wiring) It is done through gold bumps.

  In the present embodiment, the wiring pattern on the substrate is produced by performing nickel plating on a copper foil and performing gold plating thereon. By setting the thickness of the copper foil to 35 μm or less, a partial fine pattern having a lateral size required for flip chip mounting of 50 μm or less is formed. By forming the partial fine pattern, it is possible to shorten the electrode interval at the place where the flip chip mounting is performed while maintaining the line and space in the pattern design rule on the entire surface of the substrate at a large value. For this reason, a wiring pattern can be produced efficiently and the manufacturing yield of a board | substrate improves.

  Moreover, since the wiring pattern exists discretely on the substrate, it was formed by electroless plating under certain conditions. In the prototype, the thickness of the nickel plating was set to about 6 μm, and the thickness of the gold plating formed thereon was set to 0.6 μm. Thus, by setting the thickness of the gold plating to be sufficiently large, it becomes possible to compensate for a lack of bonding strength due to gold cracking that occurs when metal bonding is performed with the LED bare chip.

  In order to increase the reflectance in the region where the LED bare chip is not mounted, a layer or member made of a material having a high reflectance may be disposed on the wiring pattern or the substrate surface.

  On the other hand, in an LED bare chip (element) that emits blue or green (blue-green) light (light having a relatively short wavelength), a laminated structure including a light emitting layer is usually formed on a sapphire substrate. Since the sapphire substrate transmits blue or green light, the sapphire substrate can be mounted in any arrangement below or above the light emitting layer. Since FC mounting is more suitable for higher density, in this embodiment, the blue LED bare chip and the green LED bare chip are mounted on the substrate by FC mounting. In the case of the WB mounting shown in FIG. 19D, an n electrode and a p electrode are formed on the back surface of the substrate and the side where the light emitting layer of the LED bare chip exists, respectively, and the p electrode is a wiring (upper layer wiring) on the multilayer wiring board. ) And a bonding wire. The n-electrode is connected to the wiring (upper layer wiring) on the multilayer wiring board through conductive paste, solder, metal bonding, anisotropic conductive adhesive, and the like. Moreover, in order to connect these more firmly, you may use an underfill material.

  Note that the structure and mounting format of each color LED are not limited to those in the present embodiment. All the LEDs on one substrate may be mounted in one type of mounting format, or may be mounted in three or more types of mounting formats. It is desirable to mount each LED in an optimal mounting format according to the structure of the LED employed. Further, from the viewpoint of improving the bonding reliability with the element, it is desirable that at least the surface of the wiring pattern of the substrate is formed from a gold layer. In order to ensure metal bonding to gold, the thickness of the gold layer is preferably set to 0.5 μm or more, and more preferably set to 1 μm or more.

  When different types of LEDs are arranged on the same substrate, or when LEDs are arranged on the same substrate by a plurality of types of mounting methods, the position of the light emitting layer is changed by the LEDs. For this reason, it is preferable to optimize the geometric shape (focus position and aperture ratio) of the lens provided for each LED in accordance with the chromatic aberration caused by the light emission position and the light emission color of the LED.

  The wiring layout will be described with reference to FIGS. 17 and 18.

  Electrodes 80a, 80b, 80c, and 80d shown in FIG. 17 are power supply electrodes that apply an anode potential to, for example, red, blue, green, and yellow LED groups, respectively. On the other hand, the electrodes 90a, 90b, 90c, and 90d are power supply electrodes that apply a cathode potential (ground potential) to, for example, each of red, blue, green, and yellow LED groups.

  The electrodes 80a, 80b, 80c, and 80d are connected to wirings 81a, 81b, 81c, and 81d shown in FIG. 18 through vias, respectively. On the other hand, the electrodes 90a, 90b, 90c, and 90d shown in FIG. 17 are connected to the wirings 92a, 92b, 92c, and 92d shown in FIG. 18 through vias, respectively.

  The multilayer wiring configuration shown in FIGS. 17 and 18 forms a circuit substantially equivalent to the circuit of FIG. 15, but the layout of the wiring pattern is arbitrary and is not limited to the configuration shown in FIGS. Needless to say.

  In the present embodiment, all the feeding electrodes (anode electrodes and cathode electrodes) 80a to 80d and 90a to 90d are arranged in a straight line in the region shown in the lower part of FIG. 17, and the feeding electrodes are concentrated near one side of the substrate. Therefore, the connection between the card-type LED illumination light source and the connector becomes easy. As described above, the reason why the power supply electrode can be concentrated on one side of the substrate while separating the ground line for each LED group emitting different colors is because the multilayer wiring structure as described above is employed. .

  As described above, in the present embodiment, no power supply electrode exists on the back surface of the metal plate of the card-type LED illumination light source, and the back surface of the metal plate is flat. For this reason, it is possible to secure a wide contact area between the metal plate and a member having excellent thermal conductivity (provided in the lighting device), and to promote heat dissipation from the card-type LED illumination light source to the outside. This contact area is preferably larger than the area of the region where the LEDs are arranged (light emitting region or LED cluster region).

  In this embodiment, four types of LED bare chips that emit light of different wavelengths are arranged on one substrate, but the present invention is not limited to this. The color (wavelength band) of the emitted light may be 1 to 3 or 5 or more. Moreover, you may use the LED bare chip which each emits a some light, and the LED bare chip which emits white light by adding fluorescent substance. Unless an LED bare chip that emits white light is used, it is generally necessary to cover the periphery of the LED bare chip with a phosphor for white light emission. In this case, if the phosphor is enclosed in a space formed by the substrate and the reflector, phosphor excitation by the LED can be realized. Instead of doing this, a sheet in which the phosphor is dispersed may be attached to the upper surface of the reflector. Further, the sheet itself in which the phosphor is dispersed may be formed integrally with a card type LED light source with a transparent resin material.

(Embodiment 4)
Hereinafter, various embodiments of the LED lighting device according to the present invention will be described with reference to FIGS. 20 to 31.

  First, refer to FIG. FIG. 20 shows a light bulb type LED lighting device. This LED illumination device basically has the same configuration as that of the LED illumination device shown in FIG. 3, but the system for incorporating the card-type LED illumination light source into the illumination device is different. The LED lighting device of FIG. 20 is used in combination with a light transmitting cover 97 in combination with the lighting device main body 96. However, the removal of the card-type LED lighting light source 95 is temporarily removed from the main body 96. Perform in the state. A receiving portion 98 into which the card type LED illumination light source 96 is fitted is provided on the upper surface of the main body 96, and the main body 96 has a fixed lid 99 that holds the card type LED illumination light source 96 fitted into the receiving portion 98 from the upper surface. I have. The fixed lid 99 is supported so as to open and close with the vicinity of one end thereof as a rotation axis, and has a connector electrode 99a that contacts the power supply electrode 95a on the card-type LED illumination light source 95. The connector electrode 99a is connected to a lighting circuit (not shown) in the main body 96. The fixed lid 99a and the receiving portion 98 function as one “connector” by a combination thereof.

  The fixed lid 99 has a structure that presses the power supply electrode 95a and other portions while opening the light emitting area of the card-type LED illumination light source 95 housed in the receiving portion 98. In a state in which the fixed lid 99 is closed, the back surface of the card-type LED illumination light source 95 is in thermal contact with the bottom surface of the receiving portion 98. The bottom surface of the receiving portion 98 is preferably formed from a material having excellent thermal conductivity (for example, a metal material such as aluminum). This material with excellent thermal conductivity functions as a heat sink, dissipates heat generated by the card-type LED illumination light source 95, and can suppress excessive temperature rise.

  In a preferred embodiment, the light transmissive cover 97 can be removed and the fixed lid 99 can be easily opened and closed by a human hand or finger without using a special tool. For this reason, the card-type LED illumination light source 95 can be easily replaced (detached). The light transmissive cover 97 may have light diffusibility. Instead of the light transmissive cover 97, another cover 97a made of a coloring material, a fluorescent material, or a phosphorescent material may be used. Further, a lenticular lens 97b or a light diffusion cover 97c may be employed. Or you may employ | adopt the cover which has the function which compounded multiple lenses, a reflecting material, or the above-mentioned various optical members.

  In the illuminating device of FIG. 20, one card-type LED illumination light source 95 is attached / detached, but a plurality of card-type LED illumination light sources may be attached / detached to / from one illumination device. FIG. 21 shows a light bulb-type LED illumination device to which a plurality of card-type LED illumination light sources are attached. The card-type LED illumination light source is held down and fixed by a pair of fixed lids that can be opened and closed.

  20 and 21 show an LED illuminating device that can be replaced with a bulb-type lamp. However, an LED illuminating light source that can be replaced with a straight tube fluorescent lamp or a round tube fluorescent lamp is used as the card-type LED illuminating light source of the present invention. It is also possible to implement it. If an LED illumination light source having the same form as a straight tube fluorescent lamp or a round tube fluorescent lamp is produced, the LED illumination light source according to the present invention is used in place of a straight tube or a round tube fluorescent lamp in an existing apparatus. can do.

  FIG. 22 shows a stand-type LED lighting device. The illumination device main body 96 shown in FIG. 22 is provided with a receiving portion 98 for accommodating the card type LED illumination light source 95. The receiving portion 98 has a guide for guiding the card type LED illumination light source 95 to slide. If the card-type LED illumination light source 95 is inserted into the receiving portion 98 of the illumination device with the portion where the power-feed electrode 95a is provided as the tip, the card-type LED illumination light source 95 is attached to the connector electrode with the card-type LED illumination light source 95 attached. Connection is complete. The mounted card-type LED illumination light source 95 is fixed by frictional force and cannot be removed carelessly. Further, since the back surface of the card-type LED illumination light source 95 is in thermal contact with the receiving portion 98, it is preferable that the contact portion is formed from a material having excellent thermal conductivity.

  In the stand type illumination device of FIG. 22, one card type LED illumination light source 95 is attached / detached, but a plurality of card type LED illumination light sources may be attached / detached to / from one illumination device. FIG. 23 shows a stand-type LED illumination device in which two card-type LED illumination light sources are attached and detached.

  FIG. 24 shows another embodiment of a stand-type LED lighting device. In this LED illumination device, a connector of the type shown in FIG. 21 is employed. The card-type LED illumination light source is fixed to the illumination device by a fixed lid. The opening and closing of the fixed lid can be easily performed with a human finger.

  FIG. 25 shows an LED lighting device that can be carried as a flashlight or a penlight. The illumination device is provided with a slot 100 for attaching / detaching the card type LED illumination light source 95. However, the card-type LED illumination light source 95 may be attached / detached without providing a slot. The LED illumination device of FIG. 25 can operate a card-type LED illumination light source with a dry battery or a rechargeable battery, and has a portable configuration.

  FIG. 26 shows an LED illuminating device that replaces an illuminating device using a conventional straight tube fluorescent lamp. The main body 101 of this LED illumination device is provided with a connector that can attach and detach a plurality of card type LED illumination light sources 95, and the card type LED illumination light sources 95 are attached and detached via the slots 100 of the main body 101. .

  The illumination light source of FIG. 26 is not an LED illumination light source that can be replaced with a straight tube fluorescent lamp itself, but an LED illumination light source that can be replaced with a stand-type illumination device using a straight tube fluorescent lamp.

  FIG. 27 shows an LED illumination device that replaces an illumination device using a conventional round tube fluorescent lamp. The main body 102 of the LED lighting device is provided with a connector that can attach and detach a plurality of card type LED illumination light sources 95, and the card type LED illumination light sources 95 are attached and detached through the slot 100 of the main body 102.

  FIG. 28 shows a downlight type LED illumination light source. Since the LED lighting device of the present invention is easily reduced in thickness, it can be easily disposed as a downlight on the ceiling of a room or car.

  FIG. 29 shows an optical illumination variable type LED lighting device. The light emission direction is set to a desired direction by rotating the portion where the card-type LED illumination light source is mounted about a specific axis (not limited to one axis, including multiple axes) by an arbitrary angle. Is easy.

  FIG. 30 shows a card-type LED lighting device. A thin battery such as a button battery is adopted as a power source, and the lighting device itself is made thin. Such an LED lighting device is easy to carry by being thin and light.

  FIG. 31 shows a key holder type LED lighting device. This LED lighting device is also convenient to carry because it operates with a thin battery such as a button battery and is reduced in size and weight.

  As described above, various embodiments of the LED lighting device according to the present invention have been described with reference to FIGS. 20 to 31. However, the embodiments of the present invention are not limited to these and can take various forms.

  As is clear from the description of the above embodiment, when each lighting device is designed to use one or a plurality of card-type LED illumination light sources for one lighting device, a standardized predetermined card type is used. LED illumination light sources are easy to spread. For example, in the case of the illuminating device of FIG. 21, the configuration is such that a plurality of card-type LED illuminating light sources that can be attached to and detached from the illuminating device of FIG. Is preferred. If it does so, the important effect that it is easy to reduce the price of a single unit by the mass production effect of the card type LED illumination light source is obtained. Also, if the card-type LED illumination light source that can be used differs depending on the type of lighting device and the manufacturer, compatibility is poor and user dissatisfaction increases, so the main part of the card-type LED illumination light source is standardized. It is preferable to have different functions and dimensions.

  In addition, although the card type LED illumination light source in the said embodiment uses what mounted | worn the LED bare chip, you may employ | adopt the card type LED illumination light source in which the organic EL film | membrane was formed. The “detachable card-type LED illumination light source in which LEDs are mounted on one side of the substrate” in this specification includes a wide range of card-type LED illumination light sources in which an organic EL is provided on a heat dissipation substrate.

  As described above, the LED illumination device according to the present invention uses the card-type LED illumination light source as a member that can be easily attached and detached, thereby extending the life of the illumination device and being able to replace the existing illumination device. . A card-type LED illumination light source having the configuration shown in FIG. 12 is preferably used for such an LED illumination device, but the card-type LED illumination light source used for the LED illumination device of the present invention is limited to the above-described embodiment. I don't mean.

  Thus, what has various structures can be adopted as a card type LED illumination light source attached to and detached from the LED illumination device of the present invention, and the implementation of the card type LED illumination light source described with reference to the drawings. The form is not limited.

  Moreover, the card-type LED illumination light source of the present invention can also be employed in devices other than the illumination device. For example, the detachable card-type LED illumination light source according to the present invention may be used for a device that needs to emit light with high luminance as in the case of the illumination device, and a light source portion of other devices.

  Instead of directly mounting the LED bare chip on the substrate, an LED element (preferably a surface mount type) in which the LED bare chip is molded may be bonded to the substrate. In this case, since the LED is separately manufactured in a molded state, the thermal resistance between the substrate and the LED bare chip is higher than when the LED bare chip is directly mounted. However, if the above-described substrate configuration is adopted, even when the LED element is installed on the substrate, it is possible to achieve better heat dissipation than before, and it is possible to improve the heat dissipation when LED elements are integrated. It is.

  According to the LED lighting device of the present invention, the light source portion is constituted by a detachable card-like structure, thereby enhancing the effect of smoothly dissipating the heat generated in each LED element in the light source, and the light source that has reached the end of its lifetime. It becomes possible to use a structure other than the light source of the lighting device for a long period of time by making it possible to replace only the light source with a new light source.

(A) is a perspective view of the conventional LED illumination light source, (b) is a perspective view of the other conventional LED illumination light source. (A) is the fragmentary sectional view of LED in the LED illumination light source of Drawing 1 (a), (b) is the fragmentary sectional view of LED in the LED illumination light source of Drawing 1 (b). (A) is a perspective view which shows a part of flat type LED lighting apparatus by this invention, (b) is a perspective view which shows the light bulb type LED lighting apparatus by this invention. (A) is a disassembled perspective view in one Embodiment of the card-type LED illumination light source of this invention, (b) is a perspective view of the LED illumination light source. (A) And (b) is sectional drawing of LED in embodiment of the card-type LED illumination light source of this invention, respectively. (A) And (b) is an equivalent circuit diagram which shows the example of a connection of several LED in a card type LED illumination light source. (A) And (b) is a figure which shows the course of the light emitted from LED. (A) And (b) is a figure which shows the simulation result about the emitted light beam of the light which came out of LED. (A) And (b) is sectional drawing which shows the other example of a shape of the light emission side surface of the element substrate in LED. It is sectional drawing which shows the other structural example of LED. (A)-(d) is a plane layout figure which shows the structural example of the junction part of the wafer bond in LED shown in FIG. It is a disassembled perspective view which shows other embodiment of the card type LED illumination light source of this invention. It is a figure which shows the connector which can be used for the LED illumination light source of this invention. (A) is sectional drawing of the area | region in which LED is provided in the card-type LED illumination light source of FIG. 12, (b) is sectional drawing of the area | region in which the feeding electrode is provided. It is an equivalent circuit diagram which shows the connection structure of LED in the card-type LED illumination light source of FIG. It is a block diagram which shows the structure of the lighting circuit of the LED lighting apparatus with which the card-type LED illumination light source of FIG. 12 is mounted | worn. It is a plane layout figure which shows the upper layer wiring pattern in the card type LED illumination light source of FIG. It is a plane layout figure which shows the lower layer wiring pattern in the card type LED illumination light source of FIG. The top view which shows the wiring pattern of the part mounted by flip chip (FC), (b) is the top view which shows the wiring pattern of the part mounted by wire bond (WB), (c) is the LED bare chip mounted by FC (D) is sectional drawing of the LED bare chip mounted in WB. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the bulb-type LED illumination apparatus. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the bulb-type LED illumination apparatus with which several card | curd type LED illumination light sources are mounted | worn. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the stand-type LED illumination apparatus. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the stand type LED illuminating device of the structure by which two cards type LED illumination light sources are attached or detached. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown other embodiment of the stand type LED illumination apparatus. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the LED illumination apparatus of the flashlight or the penlight. The LED illuminating device replaced with the illuminating device using the conventional straight tube | pipe fluorescent lamp is shown. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the LED illuminating device replaced with the illuminating device using the conventional round tube fluorescent lamp. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the downlight type LED illumination apparatus. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the LED illuminating device of a variable optical axis type. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the card-type LED illumination apparatus. It is a figure which shows other embodiment of the LED illumination light source of this invention, and has shown the key ring type LED illumination apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat radiation board 1a Wiring pattern 1b Metal plate 1c Insulating layer 1d Wiring pattern 1e Insulating layer 2 LED bare chip 3 Optical reflecting plate 3a Reflecting surface 3b Hole (opening part) of optical reflecting plate
4 Resin 10 Card-type LED illumination light source 11 LED element substrate 12 GaN-based n-type semiconductor layer 13 Active layer 14 p-type semiconductor layer 15 Light emitting portion 16 Bump 19 Heat sink 20 Adapter 21 Substrate 21a Wiring pattern 22 LED bare chip 23 Plate 23a Plate Reflective surface 23b of 23 Hole (opening) of plate 23
24 resin (mold resin)
31 element substrate 32 n-type semiconductor layer 33 active layer 34 p-type semiconductor layer 34a electrode 41 gold wire 42 gold wire 50 metal plate 51 multilayer wiring board 52 metal optical reflector 53 LED
54 Feeding electrode 55 Connector body 56 Connector electrode 57 Metal plate (bottom plate)
58 wiring cord 59 wiring pattern 60 underfill 61 Au bump 62 resin 63 via

Claims (9)

  1. At least with the wiring pattern,
    A metal base substrate on which an insulating layer formed of a composite material containing an inorganic filler and a resin composition is formed;
    A plurality of LED bare chips mounted on one side of the metal base substrate;
    Two or more wiring layers laminated via the insulating layer;
    An LED illumination light source comprising:
    An LED illumination light source having a structure for interconnecting the two or more wiring layers.
  2.   2. The LED illumination light source according to claim 1, wherein a thermal resistance between a rear surface of the metal base substrate on which the LED bare chip is not mounted and the LED bare chip is 10 ° C./W or less.
  3.   The LED illumination light source according to claim 2, wherein the thermal resistance is 5 ° C./W or less.
  4.   The LED illumination light source according to claim 2, wherein the thermal resistance is 2 ° C./W or less.
  5. 3. The LED illumination light source according to claim 1, wherein the inorganic filler is formed of at least one material selected from Al 2 O 3 , MgO, BN, SiO 2 , SiC, Si 3 N 4 and AlN. .
  6.   3. The LED illumination light source according to claim 1, wherein the LED bare chip is directly mounted on a wiring pattern of the metal base substrate by flip chip bonding.
  7. The LED illumination light source according to claim 1, wherein the LED bare chip is incorporated as a surface-mount element or a chip-type element.
  8. 8. The optical base plate with a hole surrounding each LED bare chip is provided on a surface of the metal base substrate on which the LED bare chip is mounted, and each LED bare chip is molded. The LED illumination light source according to any one of the above.
  9. The LED illumination light source according to claim 8, wherein an optical lens is disposed in the hole of the optical reflector.
JP2006274596A 2001-08-09 2006-10-06 Led lighting fixture and card type led lighting light source Pending JP2007059930A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001242857 2001-08-09
JP2006274596A JP2007059930A (en) 2001-08-09 2006-10-06 Led lighting fixture and card type led lighting light source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006274596A JP2007059930A (en) 2001-08-09 2006-10-06 Led lighting fixture and card type led lighting light source

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005088767 Division

Publications (1)

Publication Number Publication Date
JP2007059930A true JP2007059930A (en) 2007-03-08

Family

ID=37923073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006274596A Pending JP2007059930A (en) 2001-08-09 2006-10-06 Led lighting fixture and card type led lighting light source

Country Status (1)

Country Link
JP (1) JP2007059930A (en)

Cited By (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009038125A (en) * 2007-07-31 2009-02-19 Sanyo Electric Co Ltd Light emitting module and manufacturing method thereof
JP2009283933A (en) * 2008-05-21 2009-12-03 Intematix Technology Center Corp Ac light-emitting diode module, light source apparatus adapting it, and its production process
EP2141407A1 (en) * 2007-03-28 2010-01-06 Kyocera Corporation Lighting apparatus and lighting unit
JP2010192762A (en) * 2009-02-19 2010-09-02 Stanley Electric Co Ltd Semiconductor light emitting device
JP2011003341A (en) * 2009-06-17 2011-01-06 Wun Song Hu Structure capable of cancelling halation of led, smd led bulb and lamp, and capable of adjustment of uniform light, intensified light, and quadrant elevation
WO2011007621A1 (en) * 2009-07-14 2011-01-20 日亜化学工業株式会社 Light emitting device
JP2011060718A (en) * 2009-09-14 2011-03-24 Panasonic Electric Works Co Ltd Lighting fixture
WO2011042999A1 (en) * 2009-10-07 2011-04-14 シャープ株式会社 Light source module and electronic apparatus provided with same
WO2011055519A1 (en) * 2009-11-06 2011-05-12 パナソニック株式会社 Spot light source and bulb-type light source
JP2011103435A (en) * 2009-10-15 2011-05-26 Sharp Corp Light-emitting device and method of manufacturing the same
JP2011124182A (en) * 2009-12-14 2011-06-23 Sharp Corp Illuminating device
JP2011124577A (en) * 2009-12-14 2011-06-23 Tyco Electronics Corp Led lighting assembly
JP2011134485A (en) * 2009-12-22 2011-07-07 Sumita Optical Glass Inc Light-emitting device
JP2011228425A (en) * 2010-04-19 2011-11-10 Mitsubishi Electric Corp Light-emitting device and wavelength conversion member
JP2011253636A (en) * 2010-05-31 2011-12-15 Sharp Corp Illumination apparatus
JP2012069834A (en) * 2010-09-27 2012-04-05 Toshiba Lighting & Technology Corp Light-emitting device and lighting unit
JP2012527088A (en) * 2009-05-15 2012-11-01 ブリッジラックス インコーポレイテッド Modular LED light bulb
JP2013516728A (en) * 2010-01-05 2013-05-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Circuit board support structure having fixed circuit board connection device
JP2013521614A (en) * 2010-03-03 2013-06-10 クリー インコーポレイテッドCree Inc. LED lamp or bulb using a remote phosphor and diffuser configuration with enhanced scattering properties
JP2013524415A (en) * 2010-03-29 2013-06-17 ヘレーウス ノーブルライト ゲゼルシャフト ミット ベシュレンクテル ハフツングHeraeus Noblelight GmbH LED lamp for uniformly illuminating the hollow body
US8545083B2 (en) 2009-12-22 2013-10-01 Sumita Optical Glass, Inc. Light-emitting device, light source and method of manufacturing the same
JP2014143148A (en) * 2013-01-25 2014-08-07 Yamagata Univ Organic el light-emitting device
JP2014160756A (en) * 2013-02-20 2014-09-04 Stanley Electric Co Ltd Light emitting element module
US8858029B2 (en) 2010-06-08 2014-10-14 Cree, Inc. LED light bulbs
US8872214B2 (en) 2009-10-19 2014-10-28 Sharp Kabushiki Kaisha Rod-like light-emitting device, method of manufacturing rod-like light-emitting device, backlight, illuminating device, and display device
US8882284B2 (en) 2010-03-03 2014-11-11 Cree, Inc. LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties
US8931933B2 (en) 2010-03-03 2015-01-13 Cree, Inc. LED lamp with active cooling element
JP2015018640A (en) * 2013-07-09 2015-01-29 オリンパス株式会社 Heat processing device for light source and light source device
JP2015032491A (en) * 2013-08-04 2015-02-16 交和電気産業株式会社 Illuminator
US9024517B2 (en) 2010-03-03 2015-05-05 Cree, Inc. LED lamp with remote phosphor and diffuser configuration utilizing red emitters
US9057511B2 (en) 2010-03-03 2015-06-16 Cree, Inc. High efficiency solid state lamp and bulb
US9062830B2 (en) 2010-03-03 2015-06-23 Cree, Inc. High efficiency solid state lamp and bulb
US9068701B2 (en) 2012-01-26 2015-06-30 Cree, Inc. Lamp structure with remote LED light source
JP2015158995A (en) * 2014-02-21 2015-09-03 スタンレー電気株式会社 Filament, light source, and heater
US9169977B2 (en) 2013-06-28 2015-10-27 Cree, Inc. LED lamp
US9217544B2 (en) 2010-03-03 2015-12-22 Cree, Inc. LED based pedestal-type lighting structure
US9222659B2 (en) 2013-06-28 2015-12-29 Cree, Inc. LED lamp
US9234638B2 (en) 2012-04-13 2016-01-12 Cree, Inc. LED lamp with thermally conductive enclosure
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US9273835B2 (en) 2010-12-08 2016-03-01 Cree, Inc. Linear LED lamp
US9285082B2 (en) 2013-03-28 2016-03-15 Cree, Inc. LED lamp with LED board heat sink
US9310030B2 (en) 2010-03-03 2016-04-12 Cree, Inc. Non-uniform diffuser to scatter light into uniform emission pattern
US9310065B2 (en) 2012-04-13 2016-04-12 Cree, Inc. Gas cooled LED lamp
US9316361B2 (en) 2010-03-03 2016-04-19 Cree, Inc. LED lamp with remote phosphor and diffuser configuration
US9322543B2 (en) 2012-04-13 2016-04-26 Cree, Inc. Gas cooled LED lamp with heat conductive submount
US9328876B2 (en) 2014-03-19 2016-05-03 Cree, Inc. High efficiency LED lamp
US9328874B2 (en) 2014-03-25 2016-05-03 Cree, Inc. LED lamp
US9353937B2 (en) 2012-04-13 2016-05-31 Cree, Inc. Gas cooled LED lamp
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
US9388948B2 (en) 2014-03-25 2016-07-12 Cree, Inc. LED lamp
US9395051B2 (en) 2012-04-13 2016-07-19 Cree, Inc. Gas cooled LED lamp
US9395074B2 (en) 2012-04-13 2016-07-19 Cree, Inc. LED lamp with LED assembly on a heat sink tower
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US9410687B2 (en) 2012-04-13 2016-08-09 Cree, Inc. LED lamp with filament style LED assembly
US9435528B2 (en) 2014-04-16 2016-09-06 Cree, Inc. LED lamp with LED assembly retention member
US9482421B2 (en) 2011-12-30 2016-11-01 Cree, Inc. Lamp with LED array and thermal coupling medium
US9488322B2 (en) 2014-04-23 2016-11-08 Cree, Inc. LED lamp with LED board heat sink
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
US9500325B2 (en) 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
US9518704B2 (en) 2014-02-25 2016-12-13 Cree, Inc. LED lamp with an interior electrical connection
US9562677B2 (en) 2014-04-09 2017-02-07 Cree, Inc. LED lamp having at least two sectors
US9618162B2 (en) 2014-04-25 2017-04-11 Cree, Inc. LED lamp
US9618163B2 (en) 2014-06-17 2017-04-11 Cree, Inc. LED lamp with electronics board to submount connection
US9625105B2 (en) 2010-03-03 2017-04-18 Cree, Inc. LED lamp with active cooling element
US9651240B2 (en) 2013-11-14 2017-05-16 Cree, Inc. LED lamp
US9664369B2 (en) 2013-03-13 2017-05-30 Cree, Inc. LED lamp
US9726330B2 (en) 2013-12-20 2017-08-08 Cree, Inc. LED lamp
US9759387B2 (en) 2014-03-04 2017-09-12 Cree, Inc. Dual optical interface LED lamp
US9765935B2 (en) 2014-03-25 2017-09-19 Cree, Inc. LED lamp with LED board brace
US9927100B2 (en) 2014-03-25 2018-03-27 Cree, Inc. LED lamp with LED board brace
US9951910B2 (en) 2014-05-19 2018-04-24 Cree, Inc. LED lamp with base having a biased electrical interconnect
US9951909B2 (en) 2012-04-13 2018-04-24 Cree, Inc. LED lamp
US10030819B2 (en) 2014-01-30 2018-07-24 Cree, Inc. LED lamp and heat sink
US10260683B2 (en) 2017-05-10 2019-04-16 Cree, Inc. Solid-state lamp with LED filaments having different CCT's
US10359151B2 (en) 2010-03-03 2019-07-23 Ideal Industries Lighting Llc Solid state lamp with thermal spreading elements and light directing optics
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290780A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Photoelectric conversion device
JPH05299700A (en) * 1992-04-22 1993-11-12 Mitsubishi Cable Ind Ltd Light emitting substrate
JPH1146049A (en) * 1997-07-25 1999-02-16 Matsushita Electric Ind Co Ltd Radiative resin substrate and its manufacturing method
JPH11149262A (en) * 1997-11-17 1999-06-02 Copal Co Ltd White light emitting element, and lighting display unit
JP2001057446A (en) * 1999-06-09 2001-02-27 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2001148509A (en) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd Illuminating light source
JP2001196643A (en) * 2000-01-11 2001-07-19 Toppan Printing Co Ltd Chip carrier for mounting light/electric element and mounting method thereof, light/electric wiring board and manufacturing method thereof, and mounting board
JP2001230450A (en) * 2000-02-21 2001-08-24 Buruukyatto Kk Manufacturing method for surface emitting body

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61290780A (en) * 1985-06-19 1986-12-20 Hitachi Ltd Photoelectric conversion device
JPH05299700A (en) * 1992-04-22 1993-11-12 Mitsubishi Cable Ind Ltd Light emitting substrate
JPH1146049A (en) * 1997-07-25 1999-02-16 Matsushita Electric Ind Co Ltd Radiative resin substrate and its manufacturing method
JPH11149262A (en) * 1997-11-17 1999-06-02 Copal Co Ltd White light emitting element, and lighting display unit
JP2001057446A (en) * 1999-06-09 2001-02-27 Sanyo Electric Co Ltd Hybrid integrated circuit device
JP2001148509A (en) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd Illuminating light source
JP2001196643A (en) * 2000-01-11 2001-07-19 Toppan Printing Co Ltd Chip carrier for mounting light/electric element and mounting method thereof, light/electric wiring board and manufacturing method thereof, and mounting board
JP2001230450A (en) * 2000-02-21 2001-08-24 Buruukyatto Kk Manufacturing method for surface emitting body

Cited By (91)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9412926B2 (en) 2005-06-10 2016-08-09 Cree, Inc. High power solid-state lamp
US8870411B2 (en) 2007-03-28 2014-10-28 Kyocera Corporation Lighting apparatus and lighting unit
EP2141407A1 (en) * 2007-03-28 2010-01-06 Kyocera Corporation Lighting apparatus and lighting unit
EP2141407A4 (en) * 2007-03-28 2012-05-30 Kyocera Corp Lighting apparatus and lighting unit
JP2009038125A (en) * 2007-07-31 2009-02-19 Sanyo Electric Co Ltd Light emitting module and manufacturing method thereof
JP2009283933A (en) * 2008-05-21 2009-12-03 Intematix Technology Center Corp Ac light-emitting diode module, light source apparatus adapting it, and its production process
JP2010192762A (en) * 2009-02-19 2010-09-02 Stanley Electric Co Ltd Semiconductor light emitting device
JP2012527088A (en) * 2009-05-15 2012-11-01 ブリッジラックス インコーポレイテッド Modular LED light bulb
KR101754585B1 (en) * 2009-05-15 2017-07-06 제니오 코포레이션 Modular LED Light Bulb
JP2011003341A (en) * 2009-06-17 2011-01-06 Wun Song Hu Structure capable of cancelling halation of led, smd led bulb and lamp, and capable of adjustment of uniform light, intensified light, and quadrant elevation
WO2011007621A1 (en) * 2009-07-14 2011-01-20 日亜化学工業株式会社 Light emitting device
US8614544B2 (en) 2009-07-14 2013-12-24 Nichia Corporation Light emitting device with electrode having recessed concave portion
JP2011060718A (en) * 2009-09-14 2011-03-24 Panasonic Electric Works Co Ltd Lighting fixture
WO2011042999A1 (en) * 2009-10-07 2011-04-14 シャープ株式会社 Light source module and electronic apparatus provided with same
JP2012089885A (en) * 2009-10-15 2012-05-10 Sharp Corp Light-emitting device
JP2011103435A (en) * 2009-10-15 2011-05-26 Sharp Corp Light-emitting device and method of manufacturing the same
US8872214B2 (en) 2009-10-19 2014-10-28 Sharp Kabushiki Kaisha Rod-like light-emitting device, method of manufacturing rod-like light-emitting device, backlight, illuminating device, and display device
JP2011175978A (en) * 2009-11-06 2011-09-08 Panasonic Corp Spot light source and bulb-type light source
JP4745467B2 (en) * 2009-11-06 2011-08-10 パナソニック株式会社 Spot light source and bulb-type light source
WO2011055519A1 (en) * 2009-11-06 2011-05-12 パナソニック株式会社 Spot light source and bulb-type light source
JP2011124182A (en) * 2009-12-14 2011-06-23 Sharp Corp Illuminating device
JP2011124577A (en) * 2009-12-14 2011-06-23 Tyco Electronics Corp Led lighting assembly
JP2011134485A (en) * 2009-12-22 2011-07-07 Sumita Optical Glass Inc Light-emitting device
US8545083B2 (en) 2009-12-22 2013-10-01 Sumita Optical Glass, Inc. Light-emitting device, light source and method of manufacturing the same
JP2013516728A (en) * 2010-01-05 2013-05-13 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Circuit board support structure having fixed circuit board connection device
US9062830B2 (en) 2010-03-03 2015-06-23 Cree, Inc. High efficiency solid state lamp and bulb
US9310030B2 (en) 2010-03-03 2016-04-12 Cree, Inc. Non-uniform diffuser to scatter light into uniform emission pattern
US10359151B2 (en) 2010-03-03 2019-07-23 Ideal Industries Lighting Llc Solid state lamp with thermal spreading elements and light directing optics
JP2013521614A (en) * 2010-03-03 2013-06-10 クリー インコーポレイテッドCree Inc. LED lamp or bulb using a remote phosphor and diffuser configuration with enhanced scattering properties
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
US9316361B2 (en) 2010-03-03 2016-04-19 Cree, Inc. LED lamp with remote phosphor and diffuser configuration
US9625105B2 (en) 2010-03-03 2017-04-18 Cree, Inc. LED lamp with active cooling element
US8882284B2 (en) 2010-03-03 2014-11-11 Cree, Inc. LED lamp or bulb with remote phosphor and diffuser configuration with enhanced scattering properties
US8931933B2 (en) 2010-03-03 2015-01-13 Cree, Inc. LED lamp with active cooling element
US9500325B2 (en) 2010-03-03 2016-11-22 Cree, Inc. LED lamp incorporating remote phosphor with heat dissipation features
US9217544B2 (en) 2010-03-03 2015-12-22 Cree, Inc. LED based pedestal-type lighting structure
US9024517B2 (en) 2010-03-03 2015-05-05 Cree, Inc. LED lamp with remote phosphor and diffuser configuration utilizing red emitters
US9057511B2 (en) 2010-03-03 2015-06-16 Cree, Inc. High efficiency solid state lamp and bulb
US9188289B2 (en) 2010-03-29 2015-11-17 Heraeus Noblelight Gmbh LED lamp for homogeneously illuminating hollow bodies
JP2013524415A (en) * 2010-03-29 2013-06-17 ヘレーウス ノーブルライト ゲゼルシャフト ミット ベシュレンクテル ハフツングHeraeus Noblelight GmbH LED lamp for uniformly illuminating the hollow body
JP2011228425A (en) * 2010-04-19 2011-11-10 Mitsubishi Electric Corp Light-emitting device and wavelength conversion member
JP2011253636A (en) * 2010-05-31 2011-12-15 Sharp Corp Illumination apparatus
US8858029B2 (en) 2010-06-08 2014-10-14 Cree, Inc. LED light bulbs
US9933148B2 (en) 2010-06-08 2018-04-03 Cree, Inc. LED light bulbs
US10107487B2 (en) 2010-06-08 2018-10-23 Cree, Inc. LED light bulbs
US10451251B2 (en) 2010-08-02 2019-10-22 Ideal Industries Lighting, LLC Solid state lamp with light directing optics and diffuser
JP2012069834A (en) * 2010-09-27 2012-04-05 Toshiba Lighting & Technology Corp Light-emitting device and lighting unit
US8770795B2 (en) 2010-09-27 2014-07-08 Toshiba Lighting & Technology Corporation Light-emitting device and lighting apparatus
US9273835B2 (en) 2010-12-08 2016-03-01 Cree, Inc. Linear LED lamp
US9234655B2 (en) 2011-02-07 2016-01-12 Cree, Inc. Lamp with remote LED light source and heat dissipating elements
US9482421B2 (en) 2011-12-30 2016-11-01 Cree, Inc. Lamp with LED array and thermal coupling medium
US9068701B2 (en) 2012-01-26 2015-06-30 Cree, Inc. Lamp structure with remote LED light source
US9488359B2 (en) 2012-03-26 2016-11-08 Cree, Inc. Passive phase change radiators for LED lamps and fixtures
US9234638B2 (en) 2012-04-13 2016-01-12 Cree, Inc. LED lamp with thermally conductive enclosure
US9810379B2 (en) 2012-04-13 2017-11-07 Cree, Inc. LED lamp
US9310065B2 (en) 2012-04-13 2016-04-12 Cree, Inc. Gas cooled LED lamp
US9951909B2 (en) 2012-04-13 2018-04-24 Cree, Inc. LED lamp
US9395074B2 (en) 2012-04-13 2016-07-19 Cree, Inc. LED lamp with LED assembly on a heat sink tower
US9410687B2 (en) 2012-04-13 2016-08-09 Cree, Inc. LED lamp with filament style LED assembly
US9395051B2 (en) 2012-04-13 2016-07-19 Cree, Inc. Gas cooled LED lamp
US9322543B2 (en) 2012-04-13 2016-04-26 Cree, Inc. Gas cooled LED lamp with heat conductive submount
US9353937B2 (en) 2012-04-13 2016-05-31 Cree, Inc. Gas cooled LED lamp
JP2014143148A (en) * 2013-01-25 2014-08-07 Yamagata Univ Organic el light-emitting device
JP2014160756A (en) * 2013-02-20 2014-09-04 Stanley Electric Co Ltd Light emitting element module
US9664369B2 (en) 2013-03-13 2017-05-30 Cree, Inc. LED lamp
US9285082B2 (en) 2013-03-28 2016-03-15 Cree, Inc. LED lamp with LED board heat sink
US9169977B2 (en) 2013-06-28 2015-10-27 Cree, Inc. LED lamp
US9222659B2 (en) 2013-06-28 2015-12-29 Cree, Inc. LED lamp
JP2015018640A (en) * 2013-07-09 2015-01-29 オリンパス株式会社 Heat processing device for light source and light source device
US10038299B2 (en) 2013-07-09 2018-07-31 Olympus Corporation Light source device and heat processing device for light source
JP2015032491A (en) * 2013-08-04 2015-02-16 交和電気産業株式会社 Illuminator
US9651240B2 (en) 2013-11-14 2017-05-16 Cree, Inc. LED lamp
US9726330B2 (en) 2013-12-20 2017-08-08 Cree, Inc. LED lamp
US10030819B2 (en) 2014-01-30 2018-07-24 Cree, Inc. LED lamp and heat sink
US9360188B2 (en) 2014-02-20 2016-06-07 Cree, Inc. Remote phosphor element filled with transparent material and method for forming multisection optical elements
JP2015158995A (en) * 2014-02-21 2015-09-03 スタンレー電気株式会社 Filament, light source, and heater
US9518704B2 (en) 2014-02-25 2016-12-13 Cree, Inc. LED lamp with an interior electrical connection
US9759387B2 (en) 2014-03-04 2017-09-12 Cree, Inc. Dual optical interface LED lamp
US9328876B2 (en) 2014-03-19 2016-05-03 Cree, Inc. High efficiency LED lamp
US9765935B2 (en) 2014-03-25 2017-09-19 Cree, Inc. LED lamp with LED board brace
US9328874B2 (en) 2014-03-25 2016-05-03 Cree, Inc. LED lamp
US9927100B2 (en) 2014-03-25 2018-03-27 Cree, Inc. LED lamp with LED board brace
US9388948B2 (en) 2014-03-25 2016-07-12 Cree, Inc. LED lamp
US9562677B2 (en) 2014-04-09 2017-02-07 Cree, Inc. LED lamp having at least two sectors
US9435528B2 (en) 2014-04-16 2016-09-06 Cree, Inc. LED lamp with LED assembly retention member
US9488322B2 (en) 2014-04-23 2016-11-08 Cree, Inc. LED lamp with LED board heat sink
US9791110B2 (en) 2014-04-25 2017-10-17 Cree, Inc. High efficiency driver circuit with fast response
US9618162B2 (en) 2014-04-25 2017-04-11 Cree, Inc. LED lamp
US9951910B2 (en) 2014-05-19 2018-04-24 Cree, Inc. LED lamp with base having a biased electrical interconnect
US9618163B2 (en) 2014-06-17 2017-04-11 Cree, Inc. LED lamp with electronics board to submount connection
US10260683B2 (en) 2017-05-10 2019-04-16 Cree, Inc. Solid-state lamp with LED filaments having different CCT's

Similar Documents

Publication Publication Date Title
US7812360B2 (en) Light emitting device, lighting equipment or liquid crystal display device using such light emitting device
US8752983B2 (en) Gas cooled LED lamp
JP6025787B2 (en) Light emitting diode package
US8217412B2 (en) Solid state lighting component
EP1398839B1 (en) Light emitting device comprising light emitting diode chip
EP2056014B1 (en) LED array and method for fabricating same
JP4995722B2 (en) Semiconductor light emitting device, lighting module, and lighting device
JP5015180B2 (en) Module
US7880185B2 (en) Semiconductor light emitting device with a substrate having a cross sectional trapezoidal shape and an oblique surface
US7622743B2 (en) Semiconductor light emitting device, lighting module, lighting apparatus, and manufacturing method of semiconductor light emitting device
JP4236544B2 (en) Lighting device
US8384121B2 (en) Electronic devices with yielding substrates
CN102893418B (en) Light emitting unit and illuminating apparatus
US8390021B2 (en) Semiconductor light-emitting device, light-emitting module, and illumination device
TWI373855B (en) Led package with structure and materials for high heat dissipation
US7479660B2 (en) Multichip on-board LED illumination device
US8317358B2 (en) Method and apparatus for providing an omni-directional lamp having a light emitting diode light engine
US20190113182A1 (en) Light emitting device
US20170074468A1 (en) Integrated led based illumination device
KR20120030432A (en) Light emitting device
KR101266226B1 (en) Light emitting device and method for manufacturing the same
CN1605790B (en) LED light apparatus and method therefor
EP1769541B1 (en) Semiconductor light-emitting device, lighting module, lighting device and method for manufacturing semiconductor light-emitting device
KR20110017405A (en) Light emitting device
CN102667318B (en) Lamp assemblies and methods of making the same

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100427

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100622

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100914

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101213

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20101220

A912 Removal of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20110121