KR101142015B1 - Light Emitting Diode package with dehumidity and heat-resisting structure and Method thereof - Google Patents
Light Emitting Diode package with dehumidity and heat-resisting structure and Method thereof Download PDFInfo
- Publication number
- KR101142015B1 KR101142015B1 KR1020100024184A KR20100024184A KR101142015B1 KR 101142015 B1 KR101142015 B1 KR 101142015B1 KR 1020100024184 A KR1020100024184 A KR 1020100024184A KR 20100024184 A KR20100024184 A KR 20100024184A KR 101142015 B1 KR101142015 B1 KR 101142015B1
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- KR
- South Korea
- Prior art keywords
- light emitting
- emitting diode
- diode package
- resin layer
- diode chip
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The present invention relates to a light emitting diode package and a method of manufacturing the same, which includes a plurality of protective resin layers protecting the light emitting diode chip, thereby protecting the light emitting diode chip from an external heat source, moisture, impact, or pollutant source to improve reliability. This guarantee relates to a light emitting diode package.
More specifically, the present invention provides a light emitting diode package in which at least one light emitting diode chip is mounted on a light emitting diode package substrate, wherein the predetermined region and the light emitting diode chip are formed on the light emitting diode package substrate. A first protective resin layer formed on an upper surface and a side surface of the light emitting diode chip to protect the light emitting diode chip from an external heat source, moisture, impact or pollutant, and including phosphors therein; It provides a light emitting diode package formed on the resin lens and the resin lens, and a second protective resin layer to protect the light emitting diode chip from an external heat source, moisture, impact or pollutant source and a method of manufacturing the same.
Description
The present invention relates to a light emitting diode package and a method for manufacturing the same, and in filling a resin in which a molding silicone resin for mitigating thermal shock and a phosphor that enables white expression is improved, external impact, heat resistance, and moisture resistance are improved. The present invention relates to a long-life LED package and a method of manufacturing the same, having a plurality of protective resin layers for protecting the LED chip from an external heat source, moisture, impact or contamination source, thereby improving reliability.
Recently, luminaires constructed using Light Emitting Diodes (LEDs) have explosive demand due to their long lifespan, relatively low power consumption, and no emission of contaminants in the manufacturing process, compared to conventional incandescent or fluorescent lamps. Increasingly, the LED is applied to a display device using light emission, as well as to a backlight device of an illumination device or an LCD display device. In particular, LED has the advantage of low heat generation and long life due to high energy efficiency while being able to drive at a relatively low voltage, and most of the currently used technologies have been developed to provide high brightness of white light, which was difficult to implement in the past. It is expected to replace the light source device.
LEDs are a type of solid state device that converts electrical energy into light and generally include an active layer of semiconductor material sandwiched between two opposing doped layers. When bias is applied across the two doped layers, holes and electrons are injected into the active layer and then recombined there to generate light, which is emitted in all directions and out of the semiconductor chip through all exposed surfaces. Will be.
In general, a light emitting diode device is bonded to a submount substrate made of silicon or ceramic and used in a package form or mounted in another package. At this time, the die bonding for mounting the light emitting diode device to such a different package material and externally Through a bonding process such as wire bonding for injecting electrons and electrons, a phosphor coating process for producing white light and a molding process for encapsulating a light emitting diode are performed.
The method of mounting the light emitting lens and the humidity in the LED package of the light emitting diode packaging process protects the LED chip mounted inside the package and simultaneously emits high heat generated from the package cup and the light emitting lens. In the inner space of the silicon is filled with low thermal conductivity and hardness. As a method for implementing this, the most widely used method is to dispense a quantitative phosphor around the LED chip using a dispenser, which is a kind of syringe.
In addition, LED packages generally have a structure in which a separate optical system is required to form a light distribution of a product. The separate optical system is usually composed of a silicone resin or an epoxy resin, but due to the properties of the resin itself, due to properties such as water penetration and a decrease in the bonding strength of the resin itself, deformation of the lens shape, separation of the bonding site, and water penetration It has a structure that is not suitable for high temperature / high humidity environments such as internal shape deformation and separation of the lens by high temperature. In order to improve the reliability of the LED package vulnerable to such an environment, a separate protective resin should be applied.
Thus, i) protects the light emitting diode elements from external impacts, heat sources, moisture and other contaminants, and ii) can be applied regardless of flip chip bonding or die bonding methods, and iii) adhesion of the package substrate to the light emitting diode elements and the lens. There is a need for a packaging technology that enhances this performance.
The present invention has been made to solve the above-mentioned problems of the prior art, to provide a light emitting diode package and a method of manufacturing the same to protect the light emitting diode chip from external impact, heat source, moisture and pollutant to ensure long life. have.
Another object of the present invention is to provide a light emitting diode package and a method for manufacturing the same, which improve the stability of the device by improving the adhesion of the package substrate, the light emitting diode chip and the light emitting lens.
Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description of the present invention. .
In order to solve the above-mentioned problems of the prior art, the present invention provides a light emitting diode package in which at least one light emitting diode chip is mounted on a light emitting diode package substrate. A first protective resin layer formed on a region and an upper surface and a side surface of the light emitting diode chip to protect the light emitting diode chip from an external heat source, moisture, impact or pollutant source, and including phosphors therein; Provided is a light emitting diode package formed on a resin lens formed on the resin layer and the resin lens, and a second protective resin layer to protect the light emitting diode chip from an external heat source, moisture, impact or pollutant source. do.
In the present invention, the phosphor is a light emitting diode package, characterized in that any one material selected from YAG-based, TAG-based, silicate (Silicate), sulfide-based or nitride-based phosphor inorganic compounds It includes.
In the present invention, the first protective resin layer and the second protective resin layer includes a light emitting diode package, characterized in that formed using a thermoplastic fluorine resin.
In the present invention, the thermoplastic fluorine-based resin is formed using any one or more materials selected from tetrafluoroethylene-based resin, hexafluoropropylene-based resin, and vinylidene fluoride-based resin. A light emitting diode package is featured.
In the present invention, the resin lens includes a light emitting diode package, characterized in that formed using any one or more materials selected from silicone resin or epoxy resin.
In the present invention, when the light emitting diode chip is mounted on the light emitting diode package substrate by die bonding and wire bonding, the first protective resin layer is a predetermined region on the light emitting diode package substrate, and the top and side surfaces of the light emitting diode chip. And a light emitting diode package which is formed on the surface of the wire.
In the present invention, the resin lens or the second protective resin layer includes a light emitting diode package, the upper portion of which is formed to have a dome shape.
The present invention provides a light emitting diode package in which at least one light emitting diode chip is mounted on a light emitting diode package substrate, the method comprising: (a) a predetermined region on the light emitting diode package substrate and a phosphor on top and side surfaces of the light emitting diode chip; Forming a first protective resin layer, (b) forming a resinous lens on the first protective resin layer, and (c) forming a second protective resin layer on the resinous lens. A method of manufacturing a light emitting diode package is provided.
In the step (a), the fluorescent material is mixed with a thermoplastic fluorine-based resin solvent and sprayed through a spray gun (spray-gun) to form a light emitting diode package, characterized in that for forming a first protective resin layer Include.
The present invention includes the method of manufacturing a light emitting diode package in the step (c), by spraying a thermoplastic fluorine resin solvent through a spray gun to form a second protective resin layer.
In the present invention, step (a) may include: (a1) forming a marking structure on the light emitting diode package substrate in the side region of the light emitting diode chip; (a2) a masking tape on the marking structure; Or (a)) applying a mask, (a3) applying a thermoplastic fluorine-based resin mixed with phosphors on the light emitting diode chip and the masking tape or mask, and (a4) removing the masking tape or mask. It includes a method of manufacturing a light emitting diode package, characterized in that.
According to the present invention, there is an effect of providing a light emitting diode package and a method of manufacturing the same, which protects the light emitting diode chip from an impact, heat source, moisture, and pollutant outside the package, thereby ensuring a long life. More specifically, the deformation of the filler inside the package due to external moisture is prevented, the package is protected from contaminants such as dust, and the deterioration of the light output is prevented by preventing deterioration of the package, thereby ensuring high performance of the light emitting diode package. There is.
In addition, according to the present invention, by forming a protective resin layer by spraying a protective resin solvent with a spray-gun, the thickness of the protective resin layer and the resin lens, etc. are uniformly formed to improve the light extraction efficiency. It is excellent in, and by strengthening the adhesion between the light emitting diode chip and the package substrate has the effect of ensuring the stability and long life of the package.
As described above, the factor of reducing the lifespan of the light emitting diode package is eliminated, so that it is possible to reduce the energy loss of the light emitting diode package, to implement a high efficiency light emitting diode package, and to improve the reliability of the package. can do.
1A to 1C are exemplary views illustrating a state in which a first protective resin layer is formed on a light emitting diode package according to an embodiment of the present invention.
2a to 2c is a step-by-step manufacturing configuration of a light emitting diode package according to an embodiment of the present invention.
3 is a flow chart of a method of manufacturing a light emitting diode package according to an embodiment of the present invention.
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention. Therefore, the embodiments described in this specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical ideas of the present invention. Therefore, It is to be understood that equivalents and modifications are possible.
The present invention is a combination of the light emitting lens and the package of the light emitting diode package (LED Package), the die-bonding / wire bonding or flip chip bonding of the light-emitting diode package element is a mixture of fluorine-based resin or silicon-based resin and phosphor, After spraying and applying a thin film so as to cover only the protruding portion on the substrate, the first protective resin layer is formed, and the resin layer serving as the lens is formed. By spray-spraying and coating the protruding portion to form the second protective resin layer, the adhesion between the LED chip and the package substrate is improved while securing the heat, dust, moisture and shock protection effects of the LED package and the LED product using the same. A light emitting diode package having a structure and a method of manufacturing the same are provided.
The present invention has an advantage that can be applied to a high output light emitting diode package having a high luminous intensity and illuminance, which is particularly applied for reliable operation under high pressure and high humidity conditions such as sterilization treatment of medical light irradiation apparatus.
1A to 1C are exemplary views illustrating a state in which a first protective resin layer is formed on a light emitting diode package according to an embodiment of the present invention.
The present invention provides a light emitting diode package in which at least one light emitting diode chip (120) is mounted on a light emitting diode package substrate (110), the protective resin layer protecting the light emitting diode chip, and suitable for light emitted from the light emitting diode chip. It includes a resin lens for inducing a reflection angle and a travel path.
The light emitting
Referring to FIG. 1A, a first
The present invention does not employ a method of doping a quantitative phosphor around a light emitting diode chip using a conventional dispenser, and mixes a phosphor and a thermoplastic fluorinated resin solvent and sprays a spray gun (130). Using the method was sprayed around the light emitting
When dotting the phosphor or silicone resin using the dispenser, there is a disadvantage that the light extraction efficiency is not good as the upper surface of the phosphor layer is concave or convex due to the amount of phosphor and liquid tension, etc., By applying a method using the
Referring to FIG. 1B, after the marking
The marking
Referring to FIG. 1C, after spraying and applying a phosphor and a thermoplastic fluorine-based resin solvent, the
As such, the first
2a to 2c is a step-by-step manufacturing configuration of the light emitting diode package according to an embodiment of the present invention.
The light emitting diode package according to the present invention is a light emitting diode package in which at least one light emitting
FIG. 2A illustrates a case in which a first protective resin layer is formed on the top and side surfaces of a light emitting diode chip when the light emitting diode chip is mounted on a package substrate by die bonding and wire bonding.
In this case, the difference from the case where the LED chip is mounted by the above-described flip chip bonding method is different from that of the
Of course, in the present invention, since the spray method using the
In addition, the spray method using the
The first
The thermoplastic fluorine-based resin has low gas permeability, high optical transparency, excellent bonding force with a metal frame, and excellent weather resistance, and thus has no resistance to humidity penetration of light emitting lenses and other parts of the light emitting diode package. It can be said that it is a material suitable for forming a bonding method and a bonding structure to remove the condensation by.
The first
The phosphor may be composed of any one material selected from YAG-based, TAG-based, silicate-based, sulfide-based, or nitride-based phosphor inorganic compounds.
FIG. 2B shows a state in which a resin lens is formed on the first protective resin layer.
Light generated from the light emitting
That is, the inner surface of the
However, in the present invention, the contour of the inner surface of the
The
The epoxy resin compound may include components such as cyanate ester resin, epoxy resin, epoxy, urethane, and acrylate. The epoxy resin has a property of having a small viscosity, the viscosity has the advantage of preventing the spread of the pollutant by making a physical interface between the first
FIG. 2C shows the second protective resin layer formed on the resin lens.
In the present invention, by providing the second
The second
That is, the second
In addition, in consideration of light extraction efficiency, it is preferable to form an upper surface in proportion to the shape of the
3 is a flow chart of a method of manufacturing a light emitting diode package according to an embodiment of the present invention.
First, a first protective resin layer is formed on a light emitting diode substrate on which a light emitting diode chip is mounted. That is, the first protective resin layer including the phosphor is formed on a predetermined region of the light emitting diode package substrate and on an upper surface and a side surface of the light emitting diode chip.
A marking structure is formed on the light emitting diode package substrate in the side region of the light emitting diode chip. (S301) This marking structure is to enable selective formation of the first protective resin layer. This is to form the first protective resin layer selectively only on the bonding region of.
The marking structure is formed to be spaced apart from the light emitting diode chip by a predetermined distance. When the light emitting diode chip is mounted by a die bonding / wire bonding method and a flip chip bonding method, the marking structure may be formed by different distances. will be.
Thereafter, a masking tape or a mask is combined with the masking tape on the marking structure. (S302) The masking tape or mask may be formed using a material known in the manufacture of a light emitting diode package.
Thereafter, a step of applying a thermoplastic fluorine-based resin in which phosphors are mixed on the light emitting diode chip and the masking tape or mask is performed (s303).
As described above, the phosphor for white light emission is mixed with a thermoplastic fluorine-based resin solvent and sprayed through a spray gun to form a first protective resin layer. By the spray method using the spray gun, it is possible to form the first protective resin layer more easily than in the prior art.
Subsequently, when the masking tape or mask is removed (S304), the first protective resin layer is selectively formed on the bonding region of the light emitting diode chip.
After the formation of the first protective resin layer, the step of forming a resin lens on the first protective resin layer (s305).
The resin lens may be formed by spraying a silicone resin or an epoxy resin with a spray gun. However, it may be formed by a general molding process.
In addition, the resin lens may be implemented in various forms such as a dome shape, a concave shape, or an uneven shape in consideration of light extraction efficiency.
After the resin lens forming step, the step of forming a second protective resin layer on the resin lens (s306) is completed the method of manufacturing a light emitting diode package of the present invention.
Similarly to forming the first protective resin layer, the second protective resin layer may be formed by spraying and applying a thermoplastic fluorine-based resin solvent through a spray gun.
However, the present invention is not limited to two protective resin layers, and may further include a plurality of protective resin layers.
Overall, the light emitting diode package proposed by the present invention includes a first protective resin layer covering the mounted light emitting diode chip, and together with the first protective resin layer, a double protective layer of the second protective resin layer provides an external environment. The light emitting diode chip is protected from.
That is, the first and second protective resin layers protect the light emitting diode chip and the bonding wire from externally applied forces, and block moisture in the air to prevent damage to the light emitting diode chip. In addition, the first protective resin layer may contain a phosphor for converting the wavelength of the light emitted from the light emitting diode chip. As a result, white light may be implemented using a light emitting diode chip that emits ultraviolet light or blue light.
In this case, the first protective resin layer and the first protective resin layer made of a resin-type lens and a thermoplastic fluorine-based resin comprising a silicone resin or an epoxy resin and the like having optical characteristics such as refractive index as seen from the path of light emitted from the light emitting diode chip. Since the protective resin layer maintains optical continuity, the light emitting diode chip is protected from external pollutants as well as moisture, seismic and heat resistance effects without significantly reducing light emission efficiency, thereby improving reliability and ensuring long life. It is possible to provide a light emitting diode package.
Although the present invention has been described in connection with the specific embodiments of the present invention, it is to be understood that the present invention is not limited thereto. Those skilled in the art can change or modify the described embodiments without departing from the scope of the present invention, and within the equivalent scope of the technical spirit of the present invention and the claims to be described below. Various modifications and variations are possible.
110: light emitting diode package substrate
120: light emitting diode chip
121: wire
130: spray gun
131: sprayed resin solvent
140: first protective resin layer
150: mask
151: marking structure
160: resin lens
170: second protective resin layer
Claims (11)
A first protection formed on a predetermined region on the light emitting diode package substrate and on an upper surface and a side surface of the light emitting diode chip to protect the light emitting diode chip from an external heat source, moisture, impact or pollutant, and to include a phosphor therein; Resin layer;
A resin lens formed on the first protective resin layer; And
And a second protective resin layer formed on the resin lens and protecting the light emitting diode chip from an external heat source, moisture, impact or pollutant source.
The first protective resin layer and the second protective resin layer,
A light emitting diode package formed using a thermoplastic fluorine resin.
(a) forming a first protective resin layer including phosphors on a predetermined region on the light emitting diode package substrate and on an upper surface and a side surface of the light emitting diode chip;
(b) forming a resin lens on the first protective resin layer; And
(c) forming a second protective resin layer on the resin lens;
Method of manufacturing a light emitting diode package comprising a.
The phosphor is mixed with a thermoplastic fluorine resin solvent and sprayed through a spray gun (spray-gun) to form a light emitting diode package, characterized in that to form a first protective resin layer.
A method of manufacturing a light emitting diode package comprising spraying a thermoplastic fluorine resin solvent through a spray gun to form a second protective resin layer.
(a1) forming a marking structure on a light emitting diode package substrate in a side region of the light emitting diode chip;
(a2) coupling a masking tape or mask on the marking structure;
(a3) applying a thermoplastic fluorine-based resin mixed with phosphors on the light emitting diode chip and the masking tape or mask; And
(a4) removing the masking tape or mask;
Method of manufacturing a light emitting diode package, characterized in that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100024184A KR101142015B1 (en) | 2010-03-18 | 2010-03-18 | Light Emitting Diode package with dehumidity and heat-resisting structure and Method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100024184A KR101142015B1 (en) | 2010-03-18 | 2010-03-18 | Light Emitting Diode package with dehumidity and heat-resisting structure and Method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110105113A KR20110105113A (en) | 2011-09-26 |
| KR101142015B1 true KR101142015B1 (en) | 2012-05-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100024184A KR101142015B1 (en) | 2010-03-18 | 2010-03-18 | Light Emitting Diode package with dehumidity and heat-resisting structure and Method thereof |
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| Country | Link |
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| KR (1) | KR101142015B1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002208739A (en) * | 2001-01-12 | 2002-07-26 | Rohm Co Ltd | Semiconductor device and manufacturing method thereof |
| JP2002208740A (en) | 2001-12-14 | 2002-07-26 | Nichia Chem Ind Ltd | Light emitting diode and forming method thereof |
| JP2005247160A (en) * | 2004-03-04 | 2005-09-15 | Daido Signal Co Ltd | Led signal bulb and color lamp sinal |
| KR20070084959A (en) * | 2006-02-22 | 2007-08-27 | 삼성전기주식회사 | Light emitting diode package |
-
2010
- 2010-03-18 KR KR1020100024184A patent/KR101142015B1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002208739A (en) * | 2001-01-12 | 2002-07-26 | Rohm Co Ltd | Semiconductor device and manufacturing method thereof |
| JP2002208740A (en) | 2001-12-14 | 2002-07-26 | Nichia Chem Ind Ltd | Light emitting diode and forming method thereof |
| JP2005247160A (en) * | 2004-03-04 | 2005-09-15 | Daido Signal Co Ltd | Led signal bulb and color lamp sinal |
| KR20070084959A (en) * | 2006-02-22 | 2007-08-27 | 삼성전기주식회사 | Light emitting diode package |
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| Publication number | Publication date |
|---|---|
| KR20110105113A (en) | 2011-09-26 |
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