KR20180074968A - Led lighting not having fluorescence molding layer - Google Patents

Abstract

The present invention provides LED lighting that is easy to manufacture, has thermal durability and excellent color reproducibility.
LED lighting without a fluorescent molding layer according to an aspect of the present invention includes the steps of: soldering a plurality of LED bear chips on a substrate; forming an underfilling layer filling a space between the LED bear chips on the substrate And attaching at least one color conversion sheet including a phosphor on the substrate so as to cover the plurality of LED bear chips, wherein the upper surface of the underfilling layer, in the step of forming the underfilling layer, Wherein the color conversion sheet is attached to the upper surface of the underfilling layer or the upper surface of the LED bare chip in a step of attaching the color conversion sheet, The one color conversion sheet is formed so as to cover at least one LED bare chip.

Description

{LED LIGHTING NOT HAVING FLUORESCENCE MOLDING LAYER}

The present invention relates to LED lighting, and more particularly to LED lighting without a package structure comprising a fluorescent molding layer.

A light emitting diode (LED) refers to a device that emits a predetermined light by making a small number of injected carriers (electrons or holes) using a pn junction structure of a semiconductor and recombining them. A green light emitting diode using GaP or the like, and a blue light emitting diode using an InGaN / AlGaN double hetero structure.

In particular, recent light emitting devices for illumination realize white light by combining a light emitting diode chip and a phosphor mold. For example, a phosphor is disposed on a light emitting diode chip that emits blue light to obtain white light by blue light emission of a light emitting diode chip and yellow-green or yellow light emission of a phosphor. That is, a blue light emitting diode chip composed of a semiconductor component emitting a wavelength of 430 nm to 480 nm and a phosphor emitting blue-green light and yellow-green and yellow light are excited to realize white light.

That is, up to now, a white light emitting device for illumination has been used in a method in which light having a sufficiently high energy emitted from a blue LED bare chip of a high luminance is molded on the LED bare chip and excited by a phosphor mold disposed thereon to induce white color.

In order to form a phosphor mold, a reflector is provided and a phosphor resin is injected into a reflector to constitute a so-called LED package. Such an LED package has not only an increase in cost due to the complexity of the manufacturing process, It is pointed out that the problem of irregularity of light emission due to irregular deposition of the phosphor upon curing, a high defect rate of the element, and poor color reproducibility is continuously pointed out, due to the mixing ratio of the epoxy resin or silicone resin used for coating, thermal instability of such resin, It is true.

[Prior Art Literature]

An encapsulant having a different sphere and an LED package using the encapsulant and an LED package using the encapsulant.

It is an object of the present invention to provide an LED illumination which is easy to manufacture, has thermal durability and excellent color reproducibility.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

LED lighting without a fluorescent molding layer according to an aspect of the present invention includes the steps of: soldering a plurality of LED bear chips onto a substrate; forming an underfilling layer filling a space between the LED bear chips on the substrate And attaching at least one color conversion sheet including a phosphor on the substrate so as to cover the plurality of LED bear chips, wherein the upper surface of the underfilling layer, in the step of forming the underfilling layer, Wherein the color conversion sheet is attached to the upper surface of the underfilling layer or the upper surface of the LED bare chip in a step of attaching the color conversion sheet, The one color conversion sheet is formed so as to cover at least one LED bare chip.

At this time, the underfilling layer may be made of a light transmitting material.

In addition, the underfilling layer may include a white or silver color material reflecting light.

Further, in the step of forming the underfilling layer, the underfilling layer may be formed so as to surround the side surface and the bottom surface of the LED bare chip.

In addition, in the step of attaching the color conversion sheet, the one color conversion sheet may be formed so as to cover at least two LED bear chips.

The LED illumination of the present invention includes a color conversion sheet and does not have an LED package manufacturing process, so that it is possible to manufacture the LED illumination more easily.

Further, since the color conversion sheet is provided instead of the phosphor mold, the phosphor mold is prevented from being deteriorated by heat, and white color can be reproduced with excellent performance.

In addition, since the color conversion sheet includes the first sheet and the second sheet, the color conversion sheet having adhesiveness and the phosphor layer can be manufactured more easily, and the color conversion sheet can be more easily installed.

In addition, since the underfilling layer abutting the side surface of the LED bare chip is formed, the heat generated from the LED bear chip can be efficiently emitted to prevent the color conversion sheet from being deteriorated.

1 is a perspective view showing an LED lighting according to a first embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing an LED illumination according to a first embodiment of the present invention.
3A is a diagram for explaining a process for producing a color conversion sheet.
3B is a view showing a state in which an LED bear chip is mounted on a substrate.
3C is a view showing a state in which an underfilling layer is formed on a substrate.
Fig. 3D is a view showing a state in which a color conversion sheet is attached to an underfilling layer and an LED bare chip.

The present invention can be variously modified and may have various embodiments, and specific embodiments will be described in detail with reference to the drawings. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Terms including ordinals, such as first, second, etc., may be used to describe various elements, but the elements are not limited to these terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Hereinafter, the present invention and its preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing an LED lighting according to a first embodiment of the present invention.

1, the LED lighting 101 according to the first embodiment includes a substrate 21, an LED bare chip 25, and a color conversion sheet 10. The LED illumination 101 according to the first embodiment does not have a package. In the present description, the package is defined as including a LED bearing chip, a reflective barrier, and a fluorescent molding layer covering the LED bear chip inside the reflective barrier. do.

FIG. 3 is a view for explaining a process of manufacturing a color conversion sheet according to a first embodiment of the present invention. FIG. 3B is a cross- FIG. 3C is a view showing a state in which an underfilling layer is formed on a substrate, and FIG. 3D is a view showing a state in which a color conversion sheet is attached to an underfilling layer and an LED bare chip.

2, a manufacturing method of the LED lighting 101 according to the first embodiment includes a step of manufacturing a color conversion sheet 10 (S101), a step of forming an LED bear chip 25 on the substrate 21 A step of soldering (S102), a step of forming an underfilling layer (S103), and a step of attaching the color conversion sheet 10 (S104).

As shown in Fig. 3A, the step S101 of producing the color conversion sheet 10 produces the first sheet 11 having the phosphor. At this time, the color conversion sheet 10 can be manufactured by further bonding the second sheet 12 having adhesiveness. In this case, the step S101 of manufacturing the color conversion sheet 10 includes a step of coating the phosphor layer 11b on the first base material 11a to produce the first sheet 11, And then bonding the first sheet 11 and the second sheet 12 in a roll-to-roll process. The first sheet 11 and the second sheet 12 are bonded together by a roll-to-roll process.

The first base material 11a may be made of a resin, and the resin may be, for example, a silicone resin, an epoxy resin, a glass, a glass ceramic, a polyester resin, an acrylic resin, a urethane resin , Thermosetting resins having transparency such as nylon resin, polyamide resin, polyimide resin, vinyl chloride resin, polycarbonate resin, polyethylene resin, Teflon resin, polystyrene resin, polypropylene resin and polyolefin resin.

The phosphor layer 11b is manufactured by using as a main component a phosphor whose yellow wavelength is excited by the blue light emitted from the LED bear chip 25. Here, the present embodiment corresponds to the case where the LED bear chip 25 outputs the blue light and constitutes the color conversion sheet 10 for producing the white light, but the LED bear chip 25 outputs the green light or the red light In the case of a phosphor, other phosphors may be used to produce white light.

In the step of manufacturing the first sheet 11, the phosphor layer 11b may be applied on the first base material 11a in a printing manner using a slot die or a doctor blade. At this time, the first sheet 11 is formed in the shape of a ribbon wound on a roller and can be conveyed at a speed of 1 m / min to 15 m / min, and the first sheet 11 is cured through a thermosetting section of 10 m or more .

The second sheet 12 includes a second base material 12a and an adhesive layer 12b formed on the second base material 12a. The second base material 12a may be made of a resin having an adhesive force, and may be made of heat-resistant transparent silicone. The adhesive layer 12b may include a transparent adhesive such as a UV curable resin, a thermosetting resin, and a sealant.

In the step of manufacturing the second sheet 12, the adhesive layer 12b may be applied on the second substrate 12a in a printing manner using a slot die or a doctor blade. The hardness of the second sheet 12 in the step of producing the second sheet 12 is formed to be smaller than the thickness of the first sheet 11 and the hardness of the second sheet 12 is set to the Shore A hardness 5 or more and 20 or less. Further, the thickness of the second sheet 12 may be larger than 15 mu m and smaller than the thickness of the LED bear chip 25. However, the present invention is not limited thereto, and the second sheet 12 may have various structures. On the other hand, the second sheet 12 is formed to have a higher thermal conductivity than the first sheet 11. The second sheet 12 may be made of a polyimide resin, and the second sheet 12 may be made of a thermally conductive And may include a metal oxide such as ITO (indium tin oxide) so as to be improved.

The step of joining the first sheet 11 and the second sheet 12 by a roll to roll process is performed by simultaneously pressing the first sheet 11 and the second sheet 12 using a roller And the first sheet 11 and the second sheet 12 are joined together by heating.

As shown in FIG. 3B, the step of soldering the LED bear chip 25 to the substrate 21 (S102) is to solder the LED bear chip 25 on a substrate by surface mount technology (SMT). Accordingly, a soldering portion 27 is formed between the LED bare chip 25 and the substrate 21. The soldering portion 27 electrically connects the LED bear chip 25 and the substrate 21 and electrically connects the terminal 26 formed on the LED bear chip 25 to the substrate 21.

The substrate 21 can be any substrate that can mount the LED bare chip 25 at a high density. Such as, but not limited to, alumina, quartz, calcium zirconate, forsterite, SiC, graphite, fused silica, Mullite, cordierite, zirconia, beryllia, and aluminum nitride, low temperature co-fired ceramic (LTCC), and the like.

1, the substrate 21 is provided with a first wire 23 and a second wire 23 for supplying power to the LED bear chip 25, 24 may be installed. The LED lighting 101 according to the first embodiment is electrically connected to the LED bear chip 25 and the substrate 21 through the soldering portion 27 and does not have a separate bonding wire.

The LED bear chip 25 is a blue light emitting LED chip, and may be made of a semiconductor component emitting a wavelength of 430 nm to 480 nm. However, the LED bare chip 25 may be an LED bare chip that emits different color light, and the scope of the present invention is not limited to a specific LED bare chip.

3C, in the step of forming the underfilling layer 22 (S103), an underfilling layer 22 filling a space between the LED bearings 25 is formed. Chips 25 to form an underfilling layer 22. The under-

The under filling layer 22 may be made of an epoxy resin or a polyimide resin. In addition, the underfilling layer 22 may be made of a light-transmitting material that transmits light, and may be made of a white or silver material that reflects light. One underfilling layer 22 is in contact with the side surfaces of the plurality of LED bear chips 25 and may be made of a unibody.

The underfilling layer 22 may be formed to surround the side surfaces and bottom surfaces of the LED bear chips 25 and the upper surface of the underfilling layer 22 may be formed higher than the upper surface of the LED bear chip 25. The distance between the upper surface of the underfilling layer 22 and the substrate 21 becomes larger than the distance between the upper surface of the LED bear chip 25 and the substrate 21. [ This reflects the fact that the height of the upper surface of the underfilling layer 22 becomes lower as the color conversion sheet is squeezed. In addition, the underfilling layer 22 may be formed to expose only the upper surfaces of the LED bear chips 25 and to cover the side surfaces and the bottom surface.

The underfilling layer 22 is formed by flattening the surface to which the color conversion sheet 10 is attached so that the color conversion sheet 10 can be stably installed on the substrate 21, And quickly discharges the heat generated in the heat exchanger 21.

In step S103 of attaching the color conversion sheet 10, the color conversion sheet 10 is attached so as to abut the LED bear chip 25, the underfilling layer 22, and the substrate 21. In step S103 of attaching the color conversion sheet 10, the color conversion sheet 10 is provided to cover the plurality of LED bear chips 25 and includes an LED bear chip 25, an underfilling layer 22, (21).

A color conversion sheet 10 may be provided on the substrate 21 so as to cover all the LED bear chips 25 provided on the substrate 21 in the step S103 of attaching the color conversion sheet 10. [ At this time, the color conversion sheet 10 may be made of a unibody. However, the present invention is not limited thereto, and a plurality of color conversion sheets 10 may be provided on one substrate 21. In this case, the color conversion sheet 10 may be provided so as to cover the plurality of LED bear chips 25. However, it is preferable that one color conversion sheet 10 is installed to cover at least two LED bear chips 25.

The LED lighting 101 according to the first embodiment does not have a fluorescent molding layer and is not packaged. Since the LED bear chip 25 is directly mounted on the substrate 21, the LED lighting can significantly reduce the volume And the manufacturing process can be remarkably simplified.

Further, since the color conversion sheet 10 is provided so as to cover the plurality of LED bear chips 25 instead of the fluorescent molding layer, it is possible to prevent the fluorescent molding layer from being deteriorated due to the thermal effect, thereby reducing the color reproducibility.

When the underfilling layer 22 is formed as in the first embodiment, the heat generated from the LED bear chip 25 can be discharged more easily and the color conversion sheet 10 can be stably attached .

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

101: LED lighting
10: Color conversion sheet
11: first sheet
11a: first substrate
11b: phosphor layer
12: second sheet
12a: second substrate
12b:
15: Phosphor
22: Underfilling layer
23: first wire
24: second wire
25: LED bear chip
26: Terminal
27: soldering portion
28: buffer space

Claims (5)

A method of manufacturing a light emitting device, comprising the steps of: soldering a plurality of LED bear chips on a substrate; forming an underfilling layer filling a space between the LED bear chips on the substrate; And attaching at least one color conversion sheet,
In the step of forming the underfilling layer, the upper surface of the underfilling layer is formed higher than the upper surface of the LED bear chip,
In the step of attaching the color conversion sheet, the color conversion sheet is attached so as to abut the upper surface of the underfilling layer or the upper surface of the LED bear chip,
Wherein the one color conversion sheet is formed so as to cover at least one LED bare chip in the step of attaching the color conversion sheet.
The method according to claim 1,
Wherein the underfilling layer is made of a light-transmitting material, and the LED lighting does not have a fluorescent molding layer produced by the method.
The method according to claim 1,
Wherein the underfilling layer comprises a white or silver material that reflects light. ≪ RTI ID = 0.0 > 11. < / RTI >
The method according to claim 1,
Wherein the underfilling layer is formed to surround the side surface and the lower surface of the LED bare chip in the step of forming the underfilling layer.
The method according to claim 1,
Wherein the one color conversion sheet is formed to cover at least two LED bear chips in the step of attaching the color conversion sheet.

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