JP2017034160A - Method for manufacturing light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light-emitting device capable of suppressing spreading of a joining member.SOLUTION: A method for manufacturing a light-emitting device includes the steps of: preparing a translucent member including a first surface, a second surface which is a rear surface of the first surface, and a side surface located between the first surface and the second surface, a first light reflection member arranged in a part of the side surface, and a coating member located around the first surface and arranged in the other part of the side surface and on an upper surface of the first light reflection member; and joining a light-emitting element to the first surface using a joining member having worse wettability to the coating member than wettability to the first light reflection member.SELECTED DRAWING: Figure 4

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  In recent years, light-emitting diodes have been used in various forms in the general lighting field, the on-vehicle lighting field, and the like as output is improved. For example, as a high-output light-emitting device, a light-emitting device in which a plate-like transparent member surrounded by a white ceramic outer frame and a light-emitting element (light-emitting diode) are joined via a phosphor-containing resin layer is known. (Patent Document 1).

JP2012-134355

  In a conventional light emitting device, a joining member (phosphor-containing resin layer) is used when joining a light emitting element and a translucent member (plate-like transparent member). There is a risk of spreading in a plan view. If the joining member is wider than the target range, the position of the light emitting element may be shifted when the light emitting element and the translucent member are joined. Generally, when the joining member is cured, the joining member contracts in the central direction of the joining member. If the joint member is wider than the target range, the center of the joint member may be displaced from the target position. If the center of the joining member deviates from the target position, when the joining member contracts due to curing, the light emitting element may be pulled by the joining member and the mounting position of the light emitting element may be shifted. For this reason, the light-emitting device which suppressed the breadth of the joining member is calculated | required. Further, if the spread of the joining member is suppressed, it is easy to fit the center position of the joining member in a target range, so that the position of the light emitting element can be reduced from shifting. Then, embodiment concerning this invention aims at providing the manufacturing method of the light-emitting device which suppressed the breadth of the joining member.

(1) A method of manufacturing a light emitting device according to an embodiment of the present invention includes a first surface, a second surface that is a back surface of the first surface, the first surface, and the second surface. A translucent member having a side surface therebetween, a first light reflecting member disposed on a part of the side surface, and another part of the side surface located around the first surface; A step of preparing a covering member disposed on an upper surface of the first light reflecting member, and light emission using a bonding member whose wettability with respect to the covering member is worse than the wettability with respect to the first light reflecting member. Bonding an element to the first surface.
(2) A method for manufacturing a light emitting device according to an embodiment of the present invention includes a first surface, a second surface that is a back surface of the first surface, the first surface, and the second surface. A translucent member having a side surface therebetween, a first light reflecting member disposed on a part of the side surface, and another part of the side surface located around the first surface; A step of preparing a covering member disposed on the upper surface of the first light reflecting member and formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane; Bonding a light emitting element to the first surface using a bonding member formed of a silicone resin.
(3) The manufacturing method of the light-emitting device which concerns on embodiment of this invention has a 1st surface and the 2nd surface which is a back surface of the said 1st surface, The said 1st surface, The said 1st surface A covering member that covers the first surface so that at least a part of the surface is exposed; and a bonding member having wettability with respect to the covering member that is worse than wettability with respect to the translucent member. A step of bonding the light emitting element to the exposed first surface, a step of removing the covering member, a side surface of the light emitting element, the translucent member, and the bonding member. Forming a second light reflecting material to be covered.
(4) A method for manufacturing a light emitting device according to an embodiment of the present invention includes a translucent member having a first surface and a second surface that is a back surface of the first surface, and the first surface. Covering the first surface such that at least a part of the surface is exposed; and a covering member formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane; A step of bonding the light emitting element to the first surface using a bonding member made of silicone resin, a step of removing the covering member, a side surface of the light emitting element, and the translucency Forming a second light reflecting material covering the member and the joining member.

  According to one embodiment of the present invention, it is possible to provide a method for manufacturing a light emitting device in which the spread of the joining member is suppressed.

Fig.1 (a) is a top view shown about the process 1-1, FIG.1 (b) is sectional drawing along the AA line of Fig.1 (a). FIG. 2A and FIG. 2B are cross-sectional views illustrating step 1-1-1. FIG. 3A to FIG. 3D are cross-sectional views illustrating step 1-1-2. FIG. 4A and FIG. 4B are cross-sectional views showing a modification of step 1-1. Fig.5 (a)-FIG.5 (c) are sectional drawings shown about the process 1-2. FIG. 6A and FIG. 6B are cross-sectional views illustrating step 1-3. FIG. 7A and FIG. 7B are cross-sectional views showing process 1-4. Fig.8 (a) is a top view shown about the process 1-5, FIG.8 (b) is sectional drawing along the BB line of Fig.8 (a). FIG. 9A is a plan view showing Step 1-5, FIG. 9B is a cross-sectional view taken along the line CC in FIG. 9A, and FIG. It is sectional drawing shown about process 1-5. Fig.10 (a) is a top view shown about the process 2-1, and FIG.10 (b) is sectional drawing along the DD line | wire of Fig.10 (a). FIG. 11A and FIG. 11B are cross-sectional views illustrating the step 2-1. FIG. 12A and FIG. 12B are cross-sectional views showing a modification of step 2-1. FIG. 13A to FIG. 13C are cross-sectional views illustrating step 2-2. FIG. 14A and FIG. 14B are cross-sectional views illustrating step 2-3. FIG. 15A and FIG. 15B are cross-sectional views illustrating step 2-4. FIG. 16A is a plan view showing the step 2-5, and FIG. 16B is a cross-sectional view taken along the line EE of FIG. FIG. 17A is a plan view showing the step 2-5, FIG. 17B is a cross-sectional view taken along the line FF in FIG. 17A, and FIG. It is sectional drawing shown about process 2-5.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “upper”, “lower”, and other terms including those terms) are used as necessary. The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

<Light-emitting device manufacturing method 1>
A method for manufacturing the light-emitting device 1000 according to the present embodiment will be described with reference to FIGS. The first light reflecting member 10 and the covering member 20 are placed on a support member 30 made of a heat resistant sheet or the like.

Step 1-1. A translucent member, a first light reflecting member, and a covering member are prepared. As shown in FIG. 1B, a first surface 401 and a second surface that is the back surface of the first surface 401. 402, a translucent member 40 having a side surface 403 between the first surface 401 and the second surface 402, and a first light disposed on a part of the side surface 403 of the translucent member 40 Preparing the reflecting member 10 and the covering member 20 that is positioned around the first surface 401 and disposed on the other part of the side surface 403 of the translucent member 40 and the upper surface of the first light reflecting member 10 To do.

  In other words, as shown in FIG. 1A, the first light reflecting member 10 has a through hole, and the translucent member 40 is disposed in the through hole of the first light reflecting member 10. In addition, the 1st light reflection member 10 is not arrange | positioned in at least one part of the side surface of the translucent member 40 which is the 1st surface 401 side. And the covering member 20 is arrange | positioned at the side surface 403 of the translucent member in which the 1st light reflection member 10 is not arrange | positioned. Such a translucent member 40, the 1st light reflection member 10, and the coating | coated member 20 are prepared.

  In other words, one surface of the covering member 20 and one surface of the first light reflecting member 10 are arranged in contact with each other. And it has a through-hole which penetrates the 1st light reflection member 10 and the coating | coated member 20, and the translucent member 40 is arrange | positioned in a through-hole. That is, the first light reflecting member 10 and the covering member 20 are disposed on the side surface 403 of the translucent member 40. The covering member 20 is disposed on the side surface 403 of the translucent member 40 on the first surface 401 side, and the first light reflecting member 10 is disposed on the side surface 403 of the translucent member 40 on the second surface 402 side. Be placed. Such a translucent member 40, the 1st light reflection member 10, and the coating | coated member 20 are prepared.

Step 1-1-1. A translucent member is disposed in the through hole of the first light reflecting member and the covering member. The translucent member 40, the first light reflecting member 10, and the covering member 20 shown in FIG. An example of the process will be described. The translucent member 40 is a member that is bonded to a light extraction surface of a light emitting element to be described later via a bonding member, and is formed of a material that transmits light emitted from the light emitting element. As a material of the translucent member 40, a resin material that is liquid before curing is particularly preferable. When the translucent member 40 is in a liquid state before being cured, as shown in FIG. 2A, first, the first light reflecting member 10 and the covering member 20 in which the through holes 105 are formed on the support member 30 are provided. prepare.

  When preparing the first light reflecting member 10 and the covering member 20 having the through hole 105, first, the first light reflecting member 10 not having the through hole 105 and the covering member 20 not having the through hole 105 are prepared. It is preferable to bond them together. In addition, it is preferable that the shape of the 1st light reflection member 10 is plate shape or a sheet form. If it is a plate shape or a sheet shape, since there is almost no unevenness | corrugation, it will become easy to bond the 1st light reflection member 10 and the coating | coated member 20 together. Moreover, the shape of the light-emitting device separated by the individualization process mentioned later can also be made substantially the same. The shape of the covering member 20 is also preferably a plate shape or a sheet shape. In this way, the first light reflecting member 10 and the covering member 20 can be more easily bonded together.

  Next, a through hole 105 that penetrates the bonded first light reflecting member 10 and the covering member 20 is formed. For example, when the through hole 105 is formed by punching, it is preferable to form the through hole 105 penetrating the first light reflecting member 10 and the covering member 20 at a time by punching. Even when the through hole 105 is formed by laser light irradiation other than punching, it is preferable to form the through hole 105 penetrating the first light reflecting member 10 and the covering member 20 at a time. By doing in this way, the position shift in planar view with the through-hole of the 1st light reflection member 10 and the through-hole of the coating | coated member 20 can be made small. Moreover, since the through-hole of the 1st light reflection member 10 and the through-hole of the coating | coated member 20 are formed in the same process, the number of processes can also be reduced.

  In addition, you may prepare the 1st light reflection member 10 which has a through-hole, and the coating | coated member 20 which has a through-hole separately. Then, by bonding the first light reflecting member and the covering member 20 so that the through hole of the first light reflecting member 10 and the through hole of the covering member 20 are connected, the through hole 105 shown in FIG. You may prepare the 1st light reflection member 10 and the coating | coated member 20 which have.

  When forming the through hole of the first light reflecting member 10 and the through hole of the covering member, any method known in the art may be used. For example, punching, etching, blasting, laser light irradiation, and the like can be given.

  Moreover, you may form the 1st light reflection member 10 which has the through-hole 105 by the compression molding using a metal mold | die, transfer molding, or injection molding. By forming in this way, variation in the shape of the through hole of the first light reflecting member 10 can be prevented.

  Next, as shown in FIG. 2B, it is preferable to form the liquid translucent member 40 in the through hole 105 by curing the translucent member 40. By doing in this way, since the shape of the translucent member 40 can be made into the substantially same shape as the shape of the through-hole 105, the variation in shape can be suppressed. In particular, when the material of the translucent member 40 is a thermosetting resin, it is possible to simultaneously cure and form a plurality by applying heat to the translucent member 40 before curing disposed in the through hole. .

  As a method of disposing the translucent member 40 in each through-hole 105, any method known in the art may be used. Examples include printing and potting.

Step 1-1-2. A covering member having a through hole is disposed on the upper surface of the first light reflecting member and / or the light transmitting member. Next, the light transmitting member 40, the first light reflecting member 10, and the covering member shown in FIG. 20, another example of the process of preparing is shown. As shown in FIG. 3A, the first light reflecting member 10 having a through hole formed on the support member 30, and the translucent member 40 disposed in the through hole of the first light reflecting member 10, Prepare. As for the method of forming the translucent member 40, as described above, the liquid translucent member 40 is injected into the through hole of the first light reflecting member 10, and the translucent member 40 is cured. May be.

  Then, as shown in FIG. 3B, the covering member 20 is disposed on the upper surface of the first light reflecting member 10. As a method for arranging the covering member 20, when the covering member 20 has adhesiveness, the covering member 20 may be arranged by being bonded to the upper surface of the first light reflecting member 10. Moreover, you may arrange | position by forming the coating | coated member 20 in the upper surface of the 1st light reflection member 10 by printing, spraying, etc. FIG. By doing in this way, since a level | step difference arises in the 1st surface 401 of the translucent member 40, and the upper surface of the coating | coated member 20, when a junction member mentioned later spreads, a spreading | diffusion can further be suppressed by a level | step difference. As shown in FIG. 3B, the shape of the covering member 20 in plan view may be the same as that of the first light reflecting member 10. Since the joining member described later is formed so as to spread on the translucent member 40, the size of the translucent member 40 and the joining member in plan view can be made substantially the same. Thereby, the light extraction efficiency can be increased as compared with the case where the joining member is formed up to the upper surface of the first light reflecting member.

  Further, as shown in FIG. 3C, the covering member 20 may cover a part of the upper surface of the first light reflecting member 10 and the first surface 401 of the translucent member 40. By doing in this way, even if the translucent member 40 is enlarged in order to further increase the light extraction efficiency, the covering member 20 can suppress the bonding member from spreading in the x and y directions.

  As shown in FIG. 3D, the covering member 20 may cover only a part of the upper surface of the first light reflecting member 10. By doing in this way, even if the area of the translucent member 40 in plan view is smaller than the outer edge of the light emitting element, the bonding member is the first surface 401 of the translucent member 40 and the first light reflecting member 10. Therefore, it is possible to provide a light-emitting device with high parting ability while increasing the bonding strength. And the area of the joining member spreading on the upper surface of the first light reflecting member 10 can be suppressed by the presence of the covering member 20.

Modification 1 Modification Example of Translucent Member Prepared in Step 1-1, First Light Reflecting Member, and Covering Member Next, translucent member 40 shown in FIG. 1 (b), first light reflecting member 10, and A modification of the covering member 20 will be described. First, in the case of thinning the light emitting device, the upper side from the Ct1-Ct1 line (broken line) in FIG. 2B may be removed and the light emitting device may be thinned as shown in FIG. That is, a part of the first light reflecting member 10 and the translucent member 40 may be removed to reduce the thickness in the z direction.

  Moreover, as shown in FIG.4 (b), even if the translucent member 40 is made to contain the wavelength conversion member 41 which absorbs the light from a light emitting element and emits the light of the wavelength different from the output light from a light emitting element. Good. By having the wavelength conversion member 41, the wavelength of light emitted from the light emitting element can be converted. Thereby, light of various chromaticities can be obtained. For example, a yellow phosphor may be used as the wavelength conversion member 41 in a light emitting element that emits blue light. Thus, white light can be obtained by mixing the blue light emitted from the light emitting element and the yellow light emitted from the wavelength conversion member 41 excited by the blue light emitted from the light emitting element.

  As shown in FIG. 4B, the light transmissive member 40 may contain a light diffusing material 42 that diffuses light from the light emitting element. The light emitted from the light emitting element is diffused into the translucent member 40 by the light diffusing material 42, so that uneven brightness can be suppressed.

  In addition, you may make the translucent member 40 contain both the wavelength conversion member 41 and the light-diffusion material 42, and may make it contain independently. The translucent member 40 may contain two or more types of wavelength conversion members and / or light diffusing materials.

  The shape of the translucent member 40 in plan view includes a shape including a curve such as a circle, an ellipse, a semicircle, a semi-ellipse, a polygon such as a triangle and a quadrangle, an irregular shape such as T and L, and the like. Any shape can be used.

Step 1-2. Step of Bonding Light-Emitting Element and Translucent Member As illustrated in FIG. 5A, the uncured bonding member 60 is disposed on the first surface 401 of the translucent member 40. When the joining member 60 is disposed, any method known in the art may be used. For example, potting, printing, transfer, spraying and the like can be mentioned. Next, as shown in FIG.5 (b), the light emitting element 50 is arrange | positioned on the bonding member 60 before hardening, or after arrange | positioning, the light emitting element 50 is pressed, and it hardens | cures after that, and the bonding member 60 is set. Form. That is, the light emitting element 50 and the first surface 401 of the translucent member 40 are bonded via the bonding member 60.

  In the step of preparing the translucent member 40, the first light reflecting member 10, and the covering member 20, as shown in FIG. 2B, the support member 30 and the covering member 20 are arranged to face each other. 5A, the up and down directions of the translucent member 40, the first light reflecting member 10 and the covering member 20 are changed as shown in FIG. That is, the covering member 20 is arranged on the upper surface. At this time, the support member 30 may be changed to another support member before and after changing the vertical direction of the translucent member 40, the first light reflecting member 10, and the covering member 20.

  Moreover, it is preferable to use the joining member 60 whose wettability with respect to the covering member 20 is worse than the wettability with respect to the first light reflecting member 10. In this specification, poor wettability means a large contact angle. That is, the bonding member 60 whose wettability with respect to the covering member 20 is worse than the wettability with respect to the first light reflecting member 10 is that the contact angle between the bonding member 60 before curing and the covering member 20 is the bonding member 60 before curing. It means that it is larger than the contact angle between the first light reflecting member 10 and the first light reflecting member 10. The contact angle between the bonding member 60 before curing and the covering member 20 is obtained by drawing a tangent to the curved surface of the bonding member 60 before curing from the portion where the bonding member 60, the covering member 20 and air before curing are in contact with each other. Sometimes, this is the angle formed by the tangent and the surface of the covering member 20. Further, the contact angle between the bonding member 60 before curing and the first light reflecting member 10 is determined from the portion where the bonding member 60 before curing, the first light reflecting member 10 and the air are in contact with each other, of the bonding member 60 before curing. When a tangent is drawn on the curved surface, this is an angle formed by the tangent and the surface of the covering member 20. In addition, the contact angle of this specification refers to the value measured by the sessile drop method in 20 to 35 degreeC which is the temperature when joining the light emitting element 50 and the translucent member 40. FIG.

  The difference between the contact angle between the bonding member 60 before curing and the covering member 20 and the contact angle between the bonding member 60 before curing and the first light reflecting member 10 is not particularly limited. The contact angle between the member 60 and the covering member 20 is preferably 10 ° or more larger than the contact angle between the bonding member 60 and the first light reflecting member 10 before curing, more preferably 20 ° or more, and more preferably 30 ° or more. The larger one is more preferable.

  By doing in this way, the area where the joining member 60 spreads on the covering member 20 can be made smaller than the area where the joining member 60 spreads on the first light reflecting member 10 when there is no covering member 20. That is, the presence of the covering member 20 can suppress the spread of the joining member 60. Since the spread of the bonding member 60 is suppressed, it is possible to suppress the mounting position of the light emitting element from being shifted.

  When the joining member 60 is made of a silicone resin, the covering member 20 is at least selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, which are materials having poor wettability with respect to the silicone resin. It is preferably formed of one kind. By selecting the material of the covering member 20, the bonding member 60 can be prevented from spreading on the covering member 20. Since the spread of the bonding member 60 is suppressed, it is possible to suppress the mounting position of the light emitting element 50 from being shifted.

  When the joining member 60 and the first light reflecting member 10 include a silicone resin, the covering member 20 is preferably formed of a material having poor wettability with respect to the above-described silicone resin. Since the joining member 60 and the first light reflecting member 10 contain a silicone resin, the joining member 60 moves on the first light reflecting member 10 when the covering member 20 is not present, rather than the area where the joining member 60 spreads on the covering member 20. The spreading area increases. That is, the spread of the joining member 60 can be further suppressed by the presence of the covering member 20 having poor wettability with respect to the silicone resin. In this specification, poor wettability means that the contact angle is 90 ° or more.

  Further, the amount of the joining member 60 may be adjusted so that the joining member 60 is not formed on the upper surface of the covering member 20 as shown in FIG. In addition, since the covering member 20 is worse in wettability of the joining member 60 than the first light reflecting member 10, the joining member 60 is hardly formed on the upper surface of the covering member 20. Further, as shown in FIG. 5C, the joining member 60 may be formed on the upper surface of the covering member 20. Even if the joining member 60 is formed on the upper surface of the covering member 20 as shown in FIG. 5C, since the spreading of the joining member 60 is suppressed, the area of the joining member in a plan view can be reduced.

  In addition, after the light emitting element 50 is disposed on the bonding member 60, the viscosity and amount of the bonding member 60 are adjusted so that the bonding member 60 climbs up the side surface of the light emitting element 50 when pressing the light emitting element 50. Is preferred. By doing in this way, as shown in FIG.5 (b) and FIG.5 (c), it becomes the shape which the joining member 60 covered the side surface 503 of the light emitting element 50, and was extended downward. In other words, the cross-sectional area of the bonding member 60 increases from an electrode formation surface 502 (upper surface) of the light emitting element 50 described later toward the light extraction surface 501 (lower surface). The bonding member 60 not only bonds the light emitting element 50 and the translucent member 40, but also the light emitted from the light emitting element 50 passes through the bonding member 60, so that the bonding member 60 covers the side surface 503 of the light emitting element 50 and the light emitting element 50. Extraction of light emitted from the light-emitting element can be improved by forming a shape expanding from the electrode formation surface 502 (upper surface) toward the light extraction surface 501 (lower surface).

  The light emitting element 50 includes a translucent substrate 51 and a semiconductor stacked body 52 formed on the upper surface side of the translucent substrate 51. The light emitting element 50 includes a light extraction surface 501 (lower surface) on the translucent substrate 51 side, an electrode formation surface 502 (upper surface) which is the back surface of the light extraction surface, and a pair of electrodes 53 on the electrode formation surface 502 (upper surface). 54. Each of the two electrodes 53 and 54 constituting the pair of electrodes can have an arbitrary shape. The light extraction surface 501 of the light emitting element 50 and the first surface 401 of the translucent member 40 are bonded via the bonding member 60.

  The light extraction surface 501 of the light emitting element 50 indicates a surface opposite to the surface facing the base in the light emitting element 50 when the light emitting element 50 is mounted on the base. In other words, when the light emitting element 50 is mounted face-down, a surface opposite to the surface having the electrodes of the light emitting element 50 is shown. In addition, when the light emitting element 50 is mounted face-up, the surface of the light emitting element 50 having an electrode is shown. Further, the surface having the electrodes is defined as an electrode formation surface. Further, in this specification, the “electrode formation surface” of the light emitting element 50 refers to the surface of the light emitting element 50 in a state where the electrodes 53 and 54 are not included. In the present embodiment, the electrode formation surface 502 coincides with the lower surface of the semiconductor stacked body 52.

  Moreover, it is preferable that the area of the translucent member 40 is larger than the area of the light emitting element 50 in plan view. By doing in this way, when the light radiate | emitted from the light emitting element 50 passes the translucent member 40, a 1st light reflection member is compared with the case where the area of the translucent member 40 is smaller than the area of the light emitting element 50. The light hitting 10 can be reduced. Thereby, the loss of light can be reduced.

Step 1-3. Step of Removing Covering Member Next, the covering member 20 is removed as shown in FIG. Since the covering member 20 is a material having poor wettability, when a second light reflecting member is formed to cover a side surface of the light emitting element 50 described later, the first light reflecting member 10, and the bonding member 60, the covering member 20 and the second light are formed. The interface of the reflecting member is easily peeled off. For this reason, it is preferable to remove the covering member 20. Note that it is preferable that the size of the through hole of the covering member 20 is larger than the outer edge of the light emitting element 50 because the covering member 20 can be easily removed.

  Further, when the joining member 60 is also formed on the covering member 20 as shown in FIG. 5C, the covering member 20 is removed to form on the covering member 20 as shown in FIG. A part of the joined member 60 can also be removed. That is, even if the joining member 60 is formed so as to expand in plan view, the area of the joining member 60 in plan view can be reduced by removing a part of the joining member 60. By doing so, the lateral thickness of the second light reflecting member can be increased by the amount by which the joining member 60 is removed without changing the size of the light emitting device, so that the light emitted from the light emitting element 50 is joined. Light can be prevented from passing through the thin portion of the second light reflecting member, which will be described later, through the member 60. Further, the portion where the joining member 60 is disposed on the upper surface of the first light reflecting member 10 can be reduced. By doing in this way, it is suppressed that the light emitted from the light emitting element 50 hits the upper surface of the 1st light reflection member 10 through the joining member 60, Therefore Light extraction efficiency can be improved.

  The thickness of the covering member 20 is not particularly limited, but is preferably 10 to 150 μm. If the thickness of the covering member 20 is too thin, the covering member 20 may be broken when the covering member 20 is removed. If the covering member 20 is too thick, the cost of the covering member 20 increases or the covering member 20 is peeled off. This is because it becomes difficult to remove.

Step 1-4. Step of Forming Second Light Reflecting Material As shown in FIG. 7A, the second light reflecting member 70 that covers the side surface 503 of the light emitting element 50, the first light reflecting member 10, and the bonding member 60 is formed. . When forming the 2nd light reflection member 70, you may utilize any of a well-known method in the said field | area. Examples thereof include compression molding, transfer molding, and injection molding. Note that the side surface 503 of the light emitting element 50 may be covered with the second light reflecting member 70 via the bonding member 60. Further, a portion of the electrode forming surface 502 of the light emitting element 50 that is not covered with the electrodes 53 and 54 may be covered with the second light reflecting member 70. At this time, the thickness (dimension in the z direction) of the second light reflecting member 70 may be adjusted so that parts of the electrodes 53 and 54 are exposed from the second light reflecting member 70.

  Further, as shown in FIG. 7B, a second light reflecting member 70 having a thickness for embedding the electrodes 53 and 54 may be formed. Thereafter, the upper side from the Ct2-Ct2 line (broken line) in FIG. That is, a part of the second light reflecting member 70 is removed, and the electrodes 53 and 54 of the light emitting element are exposed. When removing the 2nd light reflection member 70, you may utilize any of a well-known method in the said field | area. Examples include etching, cutting, grinding, polishing, blasting and the like.

Step 1-5. Separation of Light Emitting Device There are a plurality of light emitting elements 50, and the first light reflecting member 10 and the second light reflecting member 70 between the light emitting elements 50 adjacent to the light emitting element 50 are cut. That is, along the broken line X1, the broken line X2, the broken line X3, and the broken line X4 passing through the middle of the adjacent light emitting elements 50 shown in FIG. 8A, the first light reflecting member 10 as shown in FIG. The second light reflecting member 70 and the support member 30 are cut with a dicer or the like. As a result, the light emitting device can be singulated as shown in FIG. Finally, as shown in FIG. 9B, the support member 30 is removed (peeled) to obtain the light emitting device 1000.

  In addition, it is preferable that the support member 30 is not completely cut when the first light reflection member 10, the second light reflection member 70, and the support member 30 are cut. That is, as shown in FIG. 9C, the first light reflecting member 10 and the second light reflecting member 70 are separated into pieces by the cutting portion 101, and the support member 30 is not separated into pieces. preferable. By doing in this way, since the support member 30 is not divided | segmented into plurality, the support member 30 can be removed (peeled) at once. The support member 30 may be removed before cutting, and then the first light reflecting member 10 and the second light reflecting member 70 may be cut. Accordingly, a plurality of light emitting devices 1000 including one light emitting element 50 can be manufactured. Moreover, you may cut | disconnect in the position containing the several light emitting element 50. FIG.

<Method 2 for manufacturing light-emitting device>
A method of manufacturing the light emitting device 2000 will be described with reference to FIGS. Compared to the light emitting device 1000, the first light reflecting member 10 is not disposed on the side surface of the translucent member 40. The other points are the same as those of the light emitting device 1000. The translucent member 40 is placed on a support member 30 made of a heat resistant sheet or the like.

Step 2-1. A translucent member and a covering member are prepared. As shown in FIG. 10B, a translucent light having a first surface 401 and a second surface 402 that is the back surface of the first surface 401. And the covering member 20 covering the first surface so that at least a part of the first surface is exposed.

  In other words, the covering member 20 having a through hole is disposed on the first surface 401 of the translucent member 40. As shown in FIG. 10A, the first surface of the translucent member 40 located in the through hole of the covering member 20 is exposed from the covering member 20. Such a translucent member 40 and the covering member 20 are prepared.

Step 2-1-1. An example of a process of preparing the covering member 20 and the covering member 20 shown in FIG. 10B will be described, in which the covering member is disposed on the first surface of the light transmitting member. First, as shown in FIG. 11A, the translucent member 40 is formed on the support member 30. Thereafter, as shown in FIG. 11B, the covering member 20 is disposed on the first surface 401 of the translucent member 40. Regarding the arrangement method of the covering member 20, when the covering member 20 has adhesiveness, the covering member 20 may be arranged by being bonded to the first surface 401 of the translucent member 40. Moreover, you may arrange | position by forming the coating | coated member 20 in the 1st surface 401 of the translucent member 40 by printing, spraying, etc. FIG. The covering member 20 covers the first surface so that at least a part of the first surface 401 of the translucent member 40 is exposed.

  In addition, it is preferable that the shape of the translucent member 40 is plate shape or sheet shape. When the translucent member 40 and the covering member 20 are bonded together, if the translucent member 40 has a plate shape or a sheet shape, there is almost no unevenness, so that the covering member 20 is easily bonded. Moreover, the shape of the light-emitting device separated by the individualization process mentioned later can also be made substantially the same. The shape of the covering member 20 is also preferably a plate shape or a sheet shape. In addition, since the covering member 20 has a through hole, when it is assumed that the inside of the through hole is filled with the covering member 20, the shape of the covering member 20 may be a plate shape or a sheet shape. In this way, the first light reflecting member 10 and the covering member 20 can be more easily bonded together.

Modification 2 Modified Example of Translucent Member Prepared in Step 2-1 and Covering Member Next, an example of a modified example of the translucent member 40 and the covering member 20 shown in FIG. First, when the light emitting device is thinned, the upper side from the Ct3-Ct3 line (broken line) in FIG. 11B may be removed. That is, after the translucent member 40 is removed and the thickness in the z direction is reduced, the covering member 20 is disposed on the first surface 401 of the translucent member 40 as shown in FIG. Good. Moreover, as shown in FIG.12 (b), you may make the translucent member 40 contain the wavelength conversion member 41 and / or the light-diffusion material 42. FIG.

Step 2-2. Step of Bonding Light-Emitting Element and Translucent Member As shown in FIG. 13A, the bonding member 60 before curing is disposed on the first surface 401. When the joining member 60 is disposed, any method known in the art may be used. For example, potting, printing, transfer, spraying and the like can be mentioned. Next, as shown in FIG.13 (b), the light emitting element 50 is arrange | positioned on the joining member 60 before hardening, or after arrange | positioning, the light emitting element 50 is pressed, and the joining member 60 is hardened after that. Form. That is, the light emitting element 50 and the first surface 401 of the translucent member 40 are bonded via the bonding member 60.

  Moreover, it is preferable to use the joining member 60 whose wettability with respect to the covering member 20 is worse than wettability with respect to the translucent member 40. The joining member 60 whose wettability with respect to the covering member 20 is worse than the wettability with respect to the translucent member 40 is that the contact angle between the joining member 60 before curing and the covering member 20 is light-transmitting with the joining member 60 before curing. It means that it is larger than the contact angle with the sex member 40. Note that the contact angle between the bonding member 60 before curing and the translucent member 40 refers to the curved surface of the bonding member 60 before curing from the portion where the bonding member 60 before curing and the translucent member 40 are in contact with air. When a tangent is drawn, this is the angle formed by the tangent and the surface of the covering member 20.

  The difference between the contact angle between the bonding member 60 before curing and the covering member 20 and the contact angle between the bonding member 60 before curing and the translucent member 40 is not particularly limited, but the bonding member before curing. The contact angle between 60 and the covering member 20 is preferably 10 ° or more larger than the contact angle between the joining member 60 and the translucent member 40 before curing, more preferably 20 ° or more, more preferably 30 ° or more. Is more preferable.

  By doing in this way, the area where the joining member 60 spreads on the covering member 20 can be made smaller than the area where the joining member 60 spreads on the translucent member 40 when there is no covering member in plan view. . That is, the presence of the covering member 20 can suppress the spread of the joining member 60. Since the spread of the bonding member 60 is suppressed, the mounting position shift of the light emitting element 50 can be suppressed.

  When the joining member 60 is made of a silicone resin, the covering member is preferably formed of a material having poor wettability with respect to the same silicone resin as described above. By selecting the material of the covering member 20, the bonding member 60 can be prevented from spreading on the covering member 20. Since the spread of the bonding member 60 is suppressed, it is possible to suppress the mounting position of the light emitting element from being shifted.

  When the joining member 60 and the translucent member 40 include a silicone resin, it is preferable that the covering member 20 is further formed of a material having poor wettability with respect to the same silicone resin as described above. Since the joining member 60 and the translucent member 40 contain a silicone resin, the joining member 60 moves on the first light reflecting member when there is no covering member 20 than the area where the joining member 60 spreads on the covering member 20. The spreading area increases. That is, the spread of the joining member 60 can be further suppressed by the presence of the covering member 20 having poor wettability with respect to the silicone resin.

  Further, as shown in FIG. 13B, a step is generated between the first surface 401 of the translucent member 40 and the upper surface of the covering member 20, so that the step is further suppressed by the step when the bonding member 60 is expanded. it can.

  Further, the amount of the joining member 60 may be adjusted so that the joining member 60 is not formed on the upper surface of the covering member 20 as shown in FIG. Since the covering member 20 is worse in wettability of the joining member 60 than the translucent member 40, the joining member 60 is less likely to be formed on the upper surface of the covering member 20. The joining member 60 may be formed on the upper surface of the covering member 20 as shown in FIG. Even if the joining member 60 is formed on the upper surface of the covering member 20 as shown in FIG. 13C, since the spreading of the joining member 60 is suppressed, the area of the joining member 60 in plan view can be reduced.

  In addition, after the light emitting element 50 is disposed on the bonding member 60, the viscosity and amount of the bonding member 60 are adjusted so that the bonding member 60 climbs up the side surface of the light emitting element 50 when pressing the light emitting element 50. Is preferred. By doing in this way, as shown in FIG.13 (b), the joining member 60 becomes the shape which covered the side surface of the light emitting element 50, and was extended downward. In other words, the cross-sectional area of the bonding member 60 increases from the electrode formation surface 502 (upper surface) of the light emitting element 50 toward the light extraction surface 501 (lower surface). The bonding member 60 not only bonds the light emitting element 50 and the translucent member 40, but also light emitted from the light emitting element passes through the bonding member 60, so that the bonding member 60 covers the side surface of the light emitting element 50 and the electrode of the light emitting element 50. Extraction of light emitted from the light-emitting element 50 can be improved by forming a shape expanding from the formation surface 502 (upper surface) toward the light extraction surface 501 (lower surface).

Step 2-3. Step of Removing Covering Member Next, the covering member 20 is removed as shown in FIG. Since the covering member 20 has poor wettability, forming a second light reflecting member that covers the side surface of the light emitting element 50, the first light reflecting member 10, and the joining member 60, which will be described later, forms the covering member 20 and the second light reflecting member. It is preferable to remove the covering member 20 because the interface of the member is easy to peel off.

  Further, in the case where the joining member 60 is also formed on the covering member 20 as shown in FIG. 13C, it is formed on the covering member 20 as shown in FIG. 14B by removing the covering member. A part of the joining member 60 can also be removed. That is, even if the joining member 60 is formed so as to expand in plan view, the area of the joining member 60 in plan view can be reduced by removing a part of the joining member 60. By doing so, the lateral thickness of the second light reflecting member can be increased by the amount by which the joining member 60 is removed without changing the size of the light emitting device, so that the light emitted from the light emitting element 50 is joined. Light can be prevented from passing through the thin portion of the second light reflecting member 70 through the member 60.

Step 2-4. Step of Forming Second Light Reflecting Material As shown in FIG. 15A, the second light reflecting member 70 that covers the side surface 503 of the light emitting element 50, the translucent member 40, and the bonding member 60 is formed. When forming the 2nd light reflection member 70, you may utilize any of a well-known method in the said field | area. Examples thereof include compression molding, transfer molding, and injection molding. Note that the side surface 503 of the light emitting element 50 may be covered with the second light reflecting member 70 via the bonding member 60. Further, a portion of the electrode forming surface 502 of the light emitting element 50 that is not covered with the electrodes 53 and 54 may be covered with the second light reflecting member 70. At this time, the thickness (dimension in the z direction) of the second light reflecting member 70 may be adjusted so that parts of the electrodes 53 and 54 are exposed from the second light reflecting member 70.

  Further, as shown in FIG. 15B, a second light reflecting member 70 having a thickness for embedding the electrodes 53 and 54 may be formed. Thereafter, the upper side from the Ct4-Ct4 line (broken line) in FIG. That is, the second light reflecting member 70 is removed and the electrodes 53 and 54 of the light emitting element 50 are exposed. When removing the 2nd light reflection member 70, you may utilize any of a well-known method in the said field | area. Examples include etching, cutting, grinding, polishing, blasting and the like.

Step 2-5. Separation of Light-Emitting Device There are a plurality of light-emitting elements 50, and the translucent member 40 and the second light reflecting member 70 between the light-emitting elements 50 and the adjacent light-emitting elements 50 are cut. That is, along the broken line X5, the broken line X6, the broken line X7, and the broken line X8 passing through the middle of the adjacent light emitting elements 50 shown in FIG. The two-light reflecting member 70 and the support member 30 are cut with a dicer or the like. As a result, the light emitting device can be singulated as shown in FIG. Finally, the light emitting device 2000 is obtained by removing (peeling) the support member 30 as shown in FIG.

  In addition, it is preferable that the support member 30 is not completely cut when the translucent member 40, the second light reflecting member 70, and the support member 30 are cut. That is, as illustrated in FIG. 17C, the first light reflecting member 10 and the second light reflecting member 70 are separated into pieces by the cutting portion 101, and the support member 30 is not separated into pieces. preferable. By doing in this way, since the support member 30 is not divided | segmented into plurality, the support member 30 can be removed (peeled) at once. Note that the support member 30 may be removed before cutting, and then the translucent member 40 and the second light reflecting member 70 may be cut. Thereby, a plurality of light emitting devices including one light emitting element 50 can be manufactured simultaneously. Moreover, you may cut | disconnect in the position containing the several light emitting element 50. FIG.

Below, the material etc. which are suitable for each structural member of the manufacturing methods 1 and 2 are demonstrated.
(Light emitting element 50)
As the light emitting element 50, for example, a semiconductor light emitting element such as a light emitting diode can be used. The semiconductor light emitting device can include a translucent substrate 51 and a semiconductor stacked body 52 formed on one surface thereof.

(Translucent substrate 51)
The light-transmitting substrate 51 of the light-emitting element 50 transmits light emitted from a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or spinel (MgA 1 ₂ O ₄ ) or the semiconductor stacked body 52. A semiconductor material to be used (eg, a nitride-based semiconductor material) can be used.

(Semiconductor laminate 52)
The semiconductor stacked body 52 includes a plurality of semiconductor layers. An example of the semiconductor stacked body 52 includes three semiconductor layers, a first conductive semiconductor layer (for example, an n-type semiconductor layer), a light emitting layer (active layer), and a second conductive semiconductor layer (for example, a p-type semiconductor layer). be able to. The semiconductor layer can be formed from a semiconductor material such as a III-V group compound semiconductor or a II-VI group compound semiconductor, for example. _{Specifically, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride semiconductor material (e.g., InN such, AlN, GaN, InGaN, AlGaN , InGaAlN Etc.) can be used.

(Electrodes 53, 54)
As the electrodes 53 and 54 of the light emitting element 50, a good electric conductor can be used, and for example, a metal such as Cu is preferable.

(First light reflecting member 10)
The first light reflecting member may be a member having a reflectance with respect to light from the light emitting element of 60% or more, preferably 70% or more. By doing so, the light reaching the first light reflecting member is reflected, and the light is directed to the outside of the translucent resin, whereby the light extraction efficiency of the light emitting device can be increased.

  Examples of the material for the first light reflecting member include ceramic, resin, dielectric, pulp, glass, metal, and composite materials thereof. Among these, a resin is preferable from the viewpoint that it can be easily formed into an arbitrary shape. Examples of the resin include thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenol resins, and thermoplastic resins such as polycarbonate resins, acrylic resins, methylpentene resins, and polynorbornene resins. In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

  Moreover, in order to raise the reflectance of a 1st light reflection member, it is preferable to make a resin contain a light reflective substance. The amount of the light-reflecting substance to be contained is not particularly limited, but the light-reflecting substance is 10 to 95% by weight, preferably 30 to 80% by weight, more preferably based on the weight of the first light reflecting member. Is preferably contained in an amount of about 40 to 70% by weight. In addition, it is preferable to form a first light reflecting member by dispersing a light reflecting material in the resin, since processing such as etching, cutting, grinding, polishing, and blasting is facilitated.

  Examples of the light reflecting material include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, various rare earth oxides (eg, yttrium oxide, gadolinium oxide), etc. Is mentioned.

(Second light reflecting member 70)
The material of the second light reflecting member can be formed using the same material as the first light reflecting member. The material of the second light reflecting member may be the same as the material of the first light reflecting member, but may be changed according to the required characteristics. For example, the content of the light reflective material contained in the first light reflecting member and the second light reflecting member may be changed. Since the second light reflecting member covers the side surface of the light emitting element, strength may be required from the first light reflecting member. Therefore, when the first light reflecting member and the second light reflecting member are formed from the resin containing the light reflecting material, the amount of the light reflecting material contained in the second light reflecting member is set to the first light reflecting member. The strength may be increased by reducing the amount of the light reflecting material contained in the one light reflecting member. By carrying out like this, the reflectance of the 1st light reflection member for which reflectivity is calculated | required more can be made high. Moreover, since the first light reflecting member has a step of removing a part thereof, strength may be required. In this case, the amount of the light reflecting material contained in the first light reflecting member may be less than the amount of the light reflecting material contained in the second light reflecting member. By doing in this way, the intensity | strength of a 1st light reflection member can be made higher than the intensity | strength of a 2nd light reflection member. The first light reflecting member may be formed of a metal or a light reflecting material, and the second light reflecting member may be formed of a different material such as a resin containing a light reflecting material.

(Translucent member 40)
The translucent resin is a member disposed on the light extraction surface side of the light emitting element in order to protect the light emitting element from the external environment and optically control the light output from the light emitting element. The translucent member can be formed from a translucent material such as a translucent resin or glass. As the translucent resin, in particular, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin is used. it can. In particular, a silicone resin excellent in light resistance and heat resistance is suitable. Furthermore, if it is a dimethyl-type silicone resin, it is excellent in reliability, such as high temperature tolerance, and if it is a phenyl-type silicone resin, a refractive index can be made high and the extraction efficiency of the light from a light emitting element can be improved. Further, the bonding member preferably has a high light transmittance. In addition, in order to impart desirable characteristics, a wavelength conversion member, a light diffusing material, or the like may be added to the translucent resin, or various fillers may be added to adjust the viscosity of the translucent member before curing. May be.

(Jointing member 60)
The joining member is preferably formed from a light-transmitting material. As a material of the bonding member, it can be formed using the same material as the above-described translucent resin. Since the joining member is in contact with the side surface of the light emitting element, it is easily affected by the heat generated in the light emitting element during lighting. For this reason, the thermosetting resin excellent in heat resistance is suitable for a joining member. Further, an additive may be added to the joining member in order to impart desirable characteristics. For example, various fillers may be added to adjust the refractive index of the bonding member or to adjust the viscosity of the bonding member before curing. Moreover, you may add a wavelength conversion member, a light-diffusion material, etc. to a joining member.

(Coating member 20)
The covering member is formed of a material in which the wettability of the bonding member before curing is worse than that of the first light reflecting member or the light transmitting member. That is, the first light reflecting member or the translucent member has a larger contact angle of the bonding member 60 before curing. In particular, it is preferably formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane having poor wettability. In addition, when the joining member is made of a silicone resin, it is difficult for the joining member to spread on the covering member by selecting polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, or polyurethane as the material of the covering member.

  In addition, in the case where the bonding member is suppressed from being formed on the first light reflecting member as in the light emitting device 1000 and the first light reflecting member contains a silicone resin, polyimide, polyester, fluororesin, It is preferably formed of at least one selected from the group consisting of polyolefin, polyphenylene sulfide, and polyurethane. Since the joining member and the first light reflecting member include the silicone resin, the joining member is easily spread. Therefore, the spread of the joining member can be suppressed by selecting the above-described materials.

  Even when the bonding member is prevented from being formed on the translucent member as in the light emitting device 2000, and the translucent member contains a silicone resin, polyimide, polyester, fluororesin, polyolefin, polyphenylene, etc. It is preferably formed of at least one selected from the group consisting of sulfide and polyurethane. Since the joining member and the translucent member contain the silicone resin, the joining member is likely to spread. Therefore, the spread of the joining member can be suppressed by selecting the above-described materials.

(Wavelength conversion member 41)
As the wavelength conversion member, a phosphor that can be excited by light emission from the light emitting element is used. For example, phosphors that can be excited by blue light emitting elements or ultraviolet light emitting elements include yttrium-aluminum-garnet phosphors activated with cerium (Ce: YAG), and lutetium-aluminum-garnet phosphors activated with cerium. (Ce: LAG), nitrogen-containing calcium aluminosilicate phosphors activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ), silicate phosphors activated with europium ((Sr, Ba) ₂ SiO ₄ ), β-sialon phosphors, CASN phosphors, SCASN phosphors and other nitride phosphors; KSF phosphors and other fluoride phosphors, sulfide phosphors and chloride phosphors Silicate phosphors, phosphate phosphors, quantum dot phosphors, and the like. In general formula KSF based phosphor can be represented by ^{_{A 2 [M 1-a Mn}} 4+ a F 6] ... (I). (In the formula, A represents at least one cation selected from the group consisting of K ⁺ , Li ⁺ , Na ⁺ , Rb ⁺ , Cs ⁺ and NH ₄ ⁺ , and M represents a Group 4 element and a Group 4 element. Represents at least one element selected from the group consisting of Group 14 elements, and a satisfies 0.01 <a <0.20.) Also, A in the general formula (I) includes K ⁺ , and M is A fluoride-based phosphor containing Si may be used. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.

(Light diffusion material 42)
As the material of the light diffusing member 42, _{specifically, SiO 2, Al 2 O 3} , Al (OH) 3, MgCO 3, TiO 2, ZrO 2, ZnO, Nb 2 O 5, MgO, Mg (OH) ₂ , oxides such as SrO, In ₂ O ₃ , TaO ₂ , HfO, SeO, Y ₂ O ₃ , CaO, Na ₂ O, B ₂ O ₃ , SnO, ZrSiO ₄ , nitrides such as SiN, AlN, and AlON , Fluorides such as MgF ₂ , CaF ₂ , NaF, LiF, and Na ₃ AlF ₆ . These may be used alone or may be used as glass by melting and mixing various kinds. Alternatively, these may be laminated in a plurality of layers.

  In particular, the refractive index can be arbitrarily controlled by using glass. The particle size of the light diffusing material can be arbitrarily selected from 0.01 to 100 μm. Further, the content of the light diffusing material needs to be adjusted, and cannot be uniquely determined depending on the volume of the coating resin and the particle size of the light diffusing material.

  As mentioned above, although some embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .

1000, 2000 Light emitting device 10 First light reflecting member 20 Cover member 30 Support member 40 Translucent member 41 Wavelength converting member 42 Light diffusing material 50 Light emitting element 51 Translucent substrate 52 Semiconductor laminate 53, 54 Electrode 60 Joining member 70 Second light reflecting member 101 Cutting portion 401 First surface 402 Second surface 501 Light extraction surface 502 Electrode forming surface

Claims (16)

A translucent member having a first surface, a second surface that is the back surface of the first surface, and a side surface between the first surface and the second surface; A first light reflecting member disposed on a part of the first surface, a covering member disposed around the first surface and disposed on another part of the side surface and the upper surface of the first light reflecting member; The process of preparing
Using a bonding member whose wettability with respect to the covering member is worse than wettability with respect to the first light reflecting member, and bonding the light emitting element to the first surface;
A method for manufacturing a light-emitting device including:   2. The light emitting device according to claim 1, wherein the covering member is formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, and the bonding member is formed of a silicone resin. Production method. A translucent member having a first surface, a second surface that is the back surface of the first surface, and a side surface between the first surface and the second surface; A first light reflecting member disposed on a part of the first light reflecting member, and located on the periphery of the first surface, disposed on another part of the side surface and the upper surface of the first light reflecting member, polyimide, polyester, A step of preparing a covering member formed of at least one selected from the group consisting of fluororesin, polyolefin, polyphenylene sulfide, and polyurethane;
Bonding the light emitting element to the first surface using a bonding member formed of a silicone resin;
A method for manufacturing a light-emitting device including:   The manufacturing method of the light-emitting device of any one of Claims 1-3 including the process of forming the through-hole which penetrates the said coating | coated member and a said 1st light reflection member before the said process to prepare.   And a step of forming a second light reflecting material covering the side surface of the light emitting element, the first light reflecting member, and the bonding member after the step of bonding the light emitting element and the first surface. Item 5. A method for manufacturing a light-emitting device according to any one of Items 1 to 4.   The method for manufacturing a light emitting device according to claim 1, further comprising a step of removing the covering member before the step of forming the second light reflecting material.   There are a plurality of the light emitting elements, and after the step of forming the second light reflecting member, a step of cutting the first light reflecting member and the second light reflecting member between the light emitting elements adjacent to the light emitting element. The manufacturing method of the light-emitting device of any one of Claims 1-6 containing. A translucent member having a first surface and a second surface that is the back surface of the first surface; and the first surface so that at least a portion of the first surface is exposed. A step of preparing a covering member for covering;
Using a bonding member whose wettability with respect to the covering member is worse than wettability with respect to the translucent member, and bonding the light emitting element and the exposed first surface;
Removing the covering member;
Forming a second light reflecting material that covers a side surface of the light emitting element, the translucent member, and the bonding member;
A method for manufacturing a light-emitting device including:   The light emitting device according to claim 8, wherein the covering member is formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, and the joining member is formed of a silicone resin. Production method. A translucent member having a first surface and a second surface that is the back surface of the first surface; and the first surface so that at least a portion of the first surface is exposed. A step of preparing a covering member formed of at least one selected from the group consisting of a cover, polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane;
A step of bonding the light emitting element to the first surface using a bonding member made of silicone resin;
Removing the covering member;
Forming a second light reflecting material that covers a side surface of the light emitting element, the translucent member, and the bonding member;
A method for manufacturing a light-emitting device including:   There are a plurality of the light emitting elements, and after the step of forming the second light reflecting member, the step of cutting the translucent member and the second light reflecting member between the light emitting elements adjacent to the light emitting element is included. The manufacturing method of the light-emitting device of any one of Claims 8-10.   The method for manufacturing a light-emitting device according to claim 1, wherein a part of the joining member is also removed in the step of removing the covering member.   The light emission of any one of Claims 1-12 including the process of removing a part of said 2nd light reflection member and exposing the electrode of the said light emitting element after the process of forming a said 2nd light reflection member. Device manufacturing method.   The method for manufacturing a light emitting device according to claim 1, wherein the translucent member is made of a resin material.   The manufacturing method of the light-emitting device of any one of Claims 1-14 in which the wavelength conversion member contains in the said translucent member.   The method for manufacturing a light emitting device according to claim 1, wherein the covering member has a thickness of 10 to 150 μm.

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