JP6278101B2 - Light emitting device - Google Patents

Description

  The present disclosure relates to a light emitting device.

  Instead of providing a housing that houses a light emitting element, a light emitting device in which a side surface of the light emitting element is covered with a reflective member is known (for example, Patent Documents 1 to 4). In these light emitting devices, a light transmissive member is disposed between the light emitting element and the reflective member, and light emitted from the side surface of the light emitting element is extracted to the light emitting surface side of the light emitting device through the light transmissive member. Thus, the light extraction efficiency of the light emitting device is improved.

JP 2012-227470 A JP2013-012545A International Publication No. 2013/005646 JP 2010-219324 A

  When a light-transmitting member is provided between the light-emitting element and the reflective member, the light-transmitting member may be separated from the light-emitting element. This peeling changes the optical characteristics of the interface between the light emitting element and the translucent member, so that the amount of light extracted through the translucent member and the light distribution can be changed. That is, since the light extraction efficiency and light distribution characteristics of the light emitting device can be changed by peeling off the translucent member, the quality of the light emitting device is not constant, and there is a possibility that sufficient reliability cannot be guaranteed. In view of the above, an object of the present invention is to provide a highly reliable light-emitting device by suppressing peeling between the light-transmitting member and the light-emitting element.

Therefore, a light emitting device according to an embodiment of the present invention is
A first surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface, wherein the second surface and the second surface A light-emitting element having a plurality of corner portions in contact with two of the plurality of side surfaces, and having a pair of electrodes on the second surface side;
A translucent member covering at least one of the side surfaces and a part of the side where the at least one side surface and the second surface are in contact with each other so as to expose one or more of the plurality of corner portions; ,
A cover member that covers the exposed corners of the light emitting element and an outer surface of the translucent member so as to expose the pair of electrodes;
A difference in thermal expansion coefficient between the covering member and the light emitting element is smaller than a difference in thermal expansion coefficient between the light transmissive member and the light emitting element.

  According to one embodiment of the present invention, the light transmissive member can be prevented from peeling from the light emitting element, and the reliability of the light emitting device can be improved.

1 is a schematic plan view of the light emitting device according to Embodiment 1. FIG. 2A is a schematic cross-sectional view taken along the line AA in FIG. 1, and FIG. 2B is a schematic cross-sectional view taken along the line BB in FIG. FIG. 3 is a schematic perspective view showing the light emitting device according to Embodiment 1 with a covering member omitted and a translucent member exposed. 4 is a schematic bottom view of the light emitting device according to Embodiment 1. FIG. FIG. 5A to FIG. 5C are schematic cross-sectional views for explaining the first manufacturing method of the light emitting device according to the first embodiment. FIG. 6A and FIG. 6B are schematic plan views for explaining a second manufacturing method of the light emitting device according to the first embodiment. FIG. 7A and FIG. 7B are schematic plan views for explaining a second manufacturing method of the light emitting device according to the first embodiment. FIG. 8 is a schematic plan view for explaining a second manufacturing method of the light emitting device according to the first embodiment. 9A is a schematic cross-sectional view taken along line CC in FIG. 6A, FIG. 9B is a schematic cross-sectional view taken along line DD in FIG. 6B, and FIG. (C) is a schematic sectional drawing in alignment with the EE line of Fig.7 (a). FIG. 10A is a schematic cross-sectional view taken along line FF in FIG. 7B, and FIG. 10B is a schematic cross-sectional view taken along line GG in FIG. FIG. 11A and FIG. 11B are schematic plan views for explaining the third manufacturing method of the light emitting device according to the first embodiment. 12A is a schematic cross-sectional view taken along line HH in FIG. 11A, and FIG. 12B is a schematic cross-sectional view taken along line II in FIG. 11B. FIG. 13A to FIG. 13C are schematic cross-sectional views for explaining a third manufacturing method of the light emitting device according to the first embodiment. FIG. 14A to FIG. 14C are schematic cross-sectional views for explaining a third alternative method for manufacturing the light emitting device according to the first embodiment. FIG. 15A is a schematic plan view of the light-emitting device according to Embodiment 2, and FIG. 15B is a schematic cross-sectional view taken along the line JJ of FIG. ) Is a schematic cross-sectional view along the line KK in FIG. FIG. 16A to FIG. 16E are schematic cross-sectional views for explaining the method for manufacturing the light emitting device according to the second embodiment. FIG. 17A to FIG. 17D are schematic cross-sectional views for explaining the method for manufacturing the light emitting device according to the second embodiment. FIG. 18 is a schematic perspective view of the light-emitting device according to Embodiment 3. FIG. 19 is a schematic plan view showing the light emitting device according to Embodiment 3 with the covering member omitted and the translucent member exposed. FIG. 20 is a schematic perspective view showing the light emitting device according to Embodiment 3 with the covering member omitted and the translucent member exposed. 21A and 21B are diagrams for explaining dimensions and shapes suitable for a light-transmitting member of a light-emitting device. FIG. 21A is a schematic plan view of the light-emitting device, and FIG. 21B is a diagram of FIG. It is a schematic sectional drawing in alignment with the LL line.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. . The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

<Embodiment 1>
A light-emitting device 10 according to the present embodiment shown in FIGS. 1, 2A, and 2B includes a light-emitting element 20, a translucent member 30 provided on the side surface 23 of the light-emitting element 20, and a translucent light Covering member 40 covering outer surface 33 of adhesive member 30. The light emitting device 10 can include a wavelength conversion member 50 on the first surface (upper surface) 11 side that functions as a light emitting surface.

  FIG. 2A is a schematic cross-sectional view along the line AA in FIG. 1 (a line orthogonal to the pair of side surfaces 23 facing the light emitting element 20). FIG. 2B is a schematic cross-sectional view taken along the line BB in FIG. 1 (a line that coincides with a diagonal line in the rectangular light emitting element 20 in a top view). As shown in FIGS. 2A and 2B, the light emitting element 20 can include a translucent substrate 27 and a semiconductor stacked body 28 formed on the lower surface side of the translucent substrate 27. The light emitting element 20 includes a first surface (upper surface) 21 on the translucent substrate 27 side, a second surface (lower surface) 22 on the semiconductor stacked body 28 side facing the first surface 21, and a first surface. A plurality of side surfaces 23 are provided between the first surface 21 and the second surface 22. The light emitted from the light emitting element 20 passes through the translucent substrate 27 from the semiconductor stacked body 28, or passes through the side surface 23 of the light emitting element 20 and the translucent member 30 from the semiconductor stacked body 28. 1 is taken out to the surface 11 side.

  A pair of electrodes 251 and 252 for energizing the light emitting element 20 are provided on the second surface 22 of the light emitting element 20 (on the semiconductor stacked body 28 side in FIGS. 2A and 2B). Note that in this specification, the “second surface 22” of the light emitting element 20 refers to the surface of the light emitting element 20 in a state where the electrodes 251 and 252 are not included. In the present embodiment, the second surface 22 coincides with the lower surface of the semiconductor stacked body 28.

  Each of the two electrodes 251 and 252 constituting the pair of electrodes can have an arbitrary shape. For example, in the light emitting device 10 illustrated in FIG. 4, the electrodes 251 and 252 are in one direction (y direction) when viewed from the second surface 12 side of the light emitting device 10 (that is, when viewed along the z direction). ). Note that the electrodes 251 and 252 do not have to have the same shape. The two electrodes 251 and 252 can be arbitrarily arranged as long as they are separated from each other. In FIG. 4, the two electrodes 251 and 252 are arranged in parallel along the y direction.

  Referring to FIG. 2A again, the translucent member 30 covers the side surface 23 of the light emitting element 20 and guides light emitted from the side surface 23 toward the first surface 11 of the light emitting device 10. To do. That is, before the light reaching the side surface 23 of the light emitting element 20 is reflected by the side surface 23 and attenuates in the light emitting element 20, the light can be extracted to the outside of the light emitting element 20 through the translucent member 30. By providing the translucent member 30, light loss can be suppressed and the light extraction efficiency of the light emitting device 10 can be improved.

In particular, when the side surface 23 of the light emitting element 20 is inclined with respect to the second surface 22, the effect of the translucent member 30 becomes significant. For example, in the manufacturing process of the light emitting element 20, when the light emitting element 20 is separated into pieces by cleavage, the side surface 23 of the light emitting element 20 may not be perpendicular to the second surface 22. In general, the light-emitting element 20 has a parallelogram shape in a cross section along line AA in FIG. 1 (FIG. 2A). That is, the first surface 21 and the second surface 22 are parallel, the two opposing side surfaces 23 are parallel, and each side surface 23 is inclined with respect to the first surface 21 and the second surface 22. Element 20 is formed. Since the angle formed between the one side surface 23 and the second surface 22 is an obtuse angle, the light reflected by the one side surface 23 is directed toward the first surface 21 of the light emitting element 20 as it is. It can be taken out to the outside. However, the angle formed between the other side surface 23 and the second surface 22 is an acute angle, so that the light reflected by the other side surface 23 is directed toward the second surface 22 in the light emitting element 20. Can decay.
By covering the other side surface 23 with the translucent member 30, the light reaching the other side surface 23 can be taken out to the outside of the light emitting device 10 through the translucent member 30.

FIG. 3 shows the light emitting device 10 in a state in which the covering member 40 is omitted in order to make it easy to grasp the covering state of the light emitting element 20 by the translucent member 30. Further, in order to make it easy to visually recognize a corner portion where the second surface 22 and the two side surfaces 23 of the light emitting device 20 are in contact (referred to as “corner portion on the second surface 22 side”), the light emitting device 20 The second surface 22 is shown facing up.
The translucent member 30 does not cover the entire side surface 23 of the light emitting element 20 but partially covers the side surface 23. Therefore, specifically, the side surface 23 of the light emitting element 20 is exposed from the translucent member 30 in the vicinity of the corners 241, 242, 243, and 244 on the second surface 22 side of the light emitting element 20. . Further, the sides of the light emitting element 20 that extend in the z direction through the corners 241, 242, 243, and 244 (referred to as “third sides 231, 232, 233, and 234”) are also in the vicinity of the corners. It is exposed from the translucent member 30. (Refer FIG. 3, FIG.2 (b)). Note that the portion of the side surface 23 exposed from the translucent member 30 (the exposed portion of the side surface 23) is covered with the covering member 40 described later, and thus is not exposed to the outer surface of the light emitting device 10.

Referring to FIGS. 2A and 2B again, the covering member 40 covers the outer surface 33 of the translucent member 30 and the exposed portion (FIG. 3) of the side surface 23 of the light emitting element 20. The covering member 40 is formed of a material that satisfies a predetermined relationship with the translucent member 30 and the light emitting element 20 in the magnitude relationship of the thermal expansion coefficient. Specifically, the thermal expansion coefficient difference between the translucent member 30 and the light emitting element 20 (referred to as “first thermal expansion coefficient difference ΔT ₃₀ ”), and the thermal expansion between the covering member 40 and the light emitting element 20. The material of the covering member 40 is selected so that ΔT ₄₀ <ΔT ₃₀ when comparing the rate difference (referred to as “second thermal expansion coefficient difference ΔT ₄₀ ”). In other words, the material of the covering member 40 is selected so that the thermal expansion coefficient of the covering member is lower than the thermal expansion coefficient of the translucent member. Thereby, it can suppress that the translucent member 30 peels from the light emitting element 20. FIG. The mechanism that can suppress the peeling of the translucent member 30 is considered as follows.

  The reason why the translucent member 30 peels from the light emitting element 20 is mainly due to heat generated when the light emitting element 20 is turned on. When the light emitting element 20 is a semiconductor light emitting element and the translucent member 30 is a resin material, the thermal expansion coefficient (for example, linear expansion coefficient, Young's modulus, etc.) of the translucent member 30 is the thermal expansion of the light emitting element 20. More than 10 times the rate. Therefore, when the light emitting element 20 is turned on, tensile stress is applied to the interface between the light emitting element 20 and the translucent member 30 due to the difference between the thermal expansion amount of the light emitting element 20 and the thermal expansion amount of the translucent member 30. Occur. This stress is eliminated when the light emitting element 20 is turned off. That is, when the light emitting element 20 is repeatedly turned on and off, a tensile stress is generated at the interface every time the light emitting element 20 is turned on, so that the adhesive force at the interface between the light emitting element 20 and the translucent member 30 is weakened. The translucent member 30 peels from the light emitting element 20.

  As described above, the light transmissive member 30 has the light transmitted through the light transmissive member 30 before the light reaching the side surface 23 of the light emitting element 20 is reflected by the side surface 23 and attenuated in the light emitting element 20. It is a member for taking out outside. Therefore, when the translucent member 30 is peeled from the light emitting element 20, the optical characteristics at the interface between the light emitting element 20 and the translucent member 30 change. That is, part of the light reaching the side surface 23 of the light emitting element 20 can be reflected by the side surface 23 without being emitted to the translucent member 30. As a result, the amount of light extracted through the translucent member 30 after the translucent member 30 is peeled may be reduced as compared with that before the translucent member 30 is peeled off. Thereby, the light extraction efficiency of the light emitting device 10 decreases, and the light distribution characteristics of the light emitting device 10 may change. Therefore, in the light emitting device according to the embodiment of the present invention, by using the light transmissive member 30 and suppressing the light transmissive member 30 from being peeled from the light emitting element 20, the light emission efficiency can be improved even after long-term use. An object of the present invention is to provide a highly reliable light-emitting device 10 having a light distribution characteristic that hardly changes, a constant quality, and the like.

  When the peeled state of the translucent member 30 is observed, it is likely to occur starting from the corners 241, 242, 243, 244 (see FIG. 2B and FIG. 3) on the second surface 22 side of the light emitting element 20. I understood it. This is considered to be because the tensile stress generated at the interface between the light emitting element 20 and the translucent member 30 concentrates on the corners. In particular, the second surface 22 side of the light emitting element 20 is likely to generate heat because the semiconductor stacked body 28 is formed, and among the corner portions of the light emitting element 20, the corner portion on the second surface 22 side. It is considered that peeling occurs easily at 241, 242, 243, and 244. When the light-transmissive member 30 is not peeled off at the corners 241, 242, 243, 244 on the second surface 22 side of the light-emitting element 20, the light-transmissive member 30 is also formed on the side surface 23 of the light-emitting element 20. It did not peel. That is, if peeling of the translucent member 30 at the corners 241, 242, 243, 244 on the second surface 22 side of the light emitting element 20 can be suppressed, peeling of the translucent member 30 can be effectively suppressed.

Therefore, in the embodiment of the present invention, as shown in FIGS. 1A, 1B, and 3, the light extraction efficiency is improved by covering most of the side surface 23 of the light emitting element 20 with a translucent member 30. A member (covering member 40) that improves and is difficult to peel off the corners 241, 242, 243, 244 on the second surface 22 side of the light emitting element 20 (instead of covering with the light transmissive member 30). By covering, peeling of the translucent member 30 covering the side surface 23 is suppressed. As described above, the cause of peeling is that the difference in thermal expansion coefficient between the light emitting element 20 and the member covering it is large. Therefore, the “first thermal expansion coefficient difference ΔT ₃₀ ”, which is the difference between the thermal expansion coefficient of the light emitting element 20 and the thermal expansion coefficient of the translucent member 30, the thermal expansion coefficient of the light emitting element 20, and the first of the light emitting element 20. 2 is compared with the “second thermal expansion coefficient difference ΔT ₄₀ ”, which is the difference from the thermal expansion coefficient of the covering member 40 that covers the corners on the surface 22 side of the second surface 22, the second thermal expansion coefficient difference ΔT ₄₀ < The first thermal expansion coefficient difference ΔT _{30 is} assumed. That is, when the thermal expansion coefficient of the translucent member 30 and the thermal expansion coefficient of the covering member 40 are high, the thermal expansion coefficient of the covering member 40 is equal to the thermal expansion coefficient of the translucent member 30. Make it lower. Accordingly, the corner portion 241 is more likely than the probability that the translucent member 30 peels off when the corner portions 241, 242, 243, 244 on the second surface 22 side of the light emitting element 20 are covered with the translucent member 30. The probability that the covering member 40 peels when the covering members 242, 243, and 244 are covered with the covering member 40 becomes low. Therefore, the probability that the translucent member 30 covering the side surface 23 of the light emitting element 20 is peeled can be reduced.

About the thermal expansion coefficient of each member, the thermal expansion coefficient of the light emitting element 20 is 7-10 ppm / degrees C, for example. The thermal expansion coefficient of the translucent member 30 is, for example, 200 to 300 ppm / ° C. under a temperature condition equal to or higher than the glass transition point (Tg) when a resin material is used as the base material. The thermal expansion coefficient of the covering member 40 is, for example, 45 to 100 ppm / ° C. under a temperature condition equal to or higher than the glass transition point (Tg) when a resin material is used as the base material.
As a specific example, assuming that the thermal expansion coefficient of each member is 7 ppm / ° C. for the light emitting element 20, 200 ppm / ° C. for the translucent member 30, and 45 ppm / ° C. for the covering member 40, the first thermal expansion coefficient difference ΔT ₃₀ = (200−7) = 193 ppm / ° C., “second thermal expansion coefficient difference ΔT ₄₀ = (45−7) = 38 ppm / ° C. Therefore, the second thermal expansion coefficient difference ΔT ₄₀ <first The relationship of the thermal expansion coefficient difference ΔT ₃₀ is satisfied.

  In the present specification, the “thermal expansion coefficient of the light emitting element 20” means the thermal expansion coefficient of the entire light emitting element 20. For example, as shown in FIGS. 2A and 2B, when the light-emitting element 20 includes a plurality of materials such as a light-transmitting substrate 27 and a semiconductor laminate 28, the coefficient of thermal expansion as a whole is set. means.

  As shown in FIG. 3, when the corners 241, 242, 243, 244 on the second surface 22 side of the light emitting element 20 are exposed from the translucent member 30, light emission in the vicinity of the corners 241, 242, 243, 244 is obtained. The side surface 23 of the element 20 is also exposed from the translucent member 30. Light that reaches the exposed portion of the side surface 23 that is not in contact with the light transmissive member 30 cannot be extracted from the light emitting device 10 through the light transmissive member 30. Therefore, from the viewpoint of the light extraction efficiency of the light emitting device 10, it is preferable that the area of the exposed portion of the side surface 23 is small. On the other hand, since the exposed part of the side surface 23 is covered with the covering member 40, it is preferable that the area of the exposed part is large from the viewpoint of preventing the translucent member 30 from peeling. Therefore, various variations can be considered for the arrangement and form of the exposed portions depending on the purpose.

  As shown in FIG. 3, variations will be described by taking as an example a case where the light emitting element 20 has a substantially rectangular parallelepiped shape having four corners 241, 242, 243, 244 on the second surface 22 side. In the example of FIG. 3, the semiconductor stacked body 28 of the light emitting element 20 includes three semiconductor layers, a first conductive type semiconductor layer 281, a light emitting layer 282, and a second conductive type semiconductor layer 283. Of the three semiconductor layers 281, 282, and 283 exposed on the side surface of the semiconductor stacked body 28, the first conductive type semiconductor layer 281 and the light emitting layer 282 are all covered with the translucent member 30, and the second semiconductor layer 283 Only a part is exposed from the translucent member 30.

  In the first example of the variation, only one corner (for example, the corner 244 in FIG. 3) is exposed from the translucent member 30, and the remaining three corners 241, 242, and 243 are translucent. 30. Thereby, since the side surface 23 of the light emitting element 20 can be widely covered with the translucent member 30 to the corner portions 241, 242, and 243, the light extraction efficiency is high. As shown in FIG. 2B, the corner portion 244 exposed from the translucent member 30 is covered with the covering member 40, so that the translucent member 30 peels from the light emitting element 20 in the vicinity of the corner portion 244. Can be suppressed.

  In the second example of the variation, the two corners located diagonally (for example, the corners 241 and 243 in FIG. 3) are exposed from the translucent member 30, and the remaining two corners 242 and 244 are moved. It can be covered with the translucent member 30. As a result, the side surface 23 of the light emitting element 20 can be covered with the translucent member 30 up to the corners 242, 244, so that the light extraction efficiency is good. The corners 241 and 243 exposed from the light transmissive member 30 are covered with the covering member 40 as shown in FIG. It can control that member 30 exfoliates. In addition, since stress generated at the interface between the light emitting element 20 and the covering member 40 is relieved in the two corner portions 241 and 243 arranged diagonally, the corner portions 242 and 244 arranged between the corner portions. However, a relaxation effect of stress generated at the interface between the light emitting element 20 and the translucent member 30 can be expected.

  In the third example of the variation, two adjacent corner portions (for example, the corner portions 243 and 244 in FIG. 3) are exposed from the translucent member 30, and the remaining two corner portions 241 and 242 are translucent. It can be covered with the member 30. Thereby, since the side surface 23 of the light emitting element 20 can be covered with the translucent member 30 to the corner | angular parts 241,242, light extraction efficiency is good. The corners 243 and 244 exposed from the translucent member 30 are covered with the covering member 40 as shown in FIG. 2B, so that the light transmitting element 20 transmits light in the vicinity of the two corners 243 and 244. It can control that member 30 exfoliates. At this time, the side 223 sandwiched between the two corners 243 and 244 may also be exposed from the translucent member 30 and covered with the covering member 40, which further enhances the peeling suppression effect. it can.

  In the fourth example of the variation, three corner portions (for example, the corner portions 241, 242, and 243 in FIG. 3) are exposed from the translucent member 30, and the remaining one corner portion 244 is exposed to the translucent member 30. Can be covered. Thereby, since the side surface 23 of the light emitting element 20 can be widely covered with the translucent member 30 to the corner | angular part 244, light extraction efficiency is good. The corners 241, 242, and 243 exposed from the translucent member 30 are covered with the covering member 40 as shown in FIG. 2B, so that the light-emitting element 20 transmits light near the corners 241, 242, and 243. The effect which can suppress that the photosensitive member 30 peels is high.

  In the fifth example of the variation, all four corner portions (corner portions 241, 242, 243, and 244 in FIG. 3) can be exposed from the translucent member 30. Since the corners 241, 242, 243, 244 exposed from the translucent member 30 are covered with the covering member 40 as shown in FIG. 2B, light is emitted in the vicinity of the corners 241, 242, 243, 244. The effect which can suppress that the translucent member 30 peels from the element 20 is especially high.

  With reference to FIG. 3, the light-transmitting member 20, in which all of the four corner portions 241, 242, 243, 244 are exposed from the light-transmitting member 30, is taken as an example. The form of the light emitting element 20 covered with 30 will be described in detail. In FIG. 3, four sides where the first surface 21 and the side surface 23 of the light emitting element 20 are in contact with each other are referred to as “first sides 211, 212, 213, and 214”. Are called “second sides 221, 222, 223, 224”, and four sides touched by two adjacent side surfaces 23 are called “third sides 231, 232, 233, 234”.

  The first sides 211, 212, 213, and 214 surrounding the first surface 21 of the light emitting element 20 are covered with the translucent member 30 over their entire length. The third sides 231, 232, 233, 234 extending from the first surface 21 to the second surface 22 are in the vicinity of the second surface 22 (that is, the corners 241, 242, 243 on the second surface 22 side). Most of the light is covered with the translucent member 30 except for the vicinity of H.244. The second sides 221, 222, 223, and 224 surrounding the second surface 22 of the light emitting element 20 are portions excluding the corners 241, 242, 243, and 244 on the second surface 22 side (in FIG. The middle part of the side) is covered with the translucent member 30, and other portions are exposed from the translucent member 30. By covering the light emitting element 20 with the light transmissive member 30 in this way, the light emitting element 20 is covered with the light transmissive member 30 in the most part of the side surface 23 and the corner of the light emitting element 20 on the second surface 22 side. The parts 241 242 243 244 are exposed.

  In addition, as above-mentioned, FIG. 3 shows the case where the corner | angular parts 241, 242, 243, 244 by the side of the 2nd surface 22 of the light emitting element 20 are all exposed from the translucent member 30 (5th example of a variation). It is shown. Therefore, when a part of the corner is covered with the translucent member 30 (first example to fourth example of the variation), the second side 221, 222, 223, 224, the third side 231 are used. As for 232, 233, 234, more parts are covered with the translucent member 30. For example, when the corner 244 is covered with the translucent member 30, the second sides 223 and 224 extending from the corner 244 are covered with the translucent member 30 at the end on the corner 244 side. Further, the third side 234 extending from the corner portion 244 is covered with the translucent member 30 over its entire length.

  Referring to FIG. 2A again, the translucent member 30 covering the side surface 23 of the light emitting element 20 extends beyond the first side of the light emitting element 20 (reference numerals 222 and 224 in FIG. 2A). The first surface 21 may be partially covered or the entire first surface 21 may be covered. The first surface 21 of the light emitting element 20 can be protected by the translucent member 30. Further, when the wavelength conversion member 50 is provided on the first surface 21 side of the light emitting element 20, the light transmissive member 30 is provided between the first surface 21 of the light emitting element 20 and the wavelength conversion member 50. The first surface 21 and the wavelength conversion member 50 can function as an adhesive member.

In FIG. 3, the translucent member 30 covering the side surface 23 of the light emitting element 20 partially reaches the second sides 221, 222, 223, and 224, but is formed so as not to exceed the second side. Is preferred. That is, as shown in FIG. 3, the upper edge portion of the translucent member 30 is positioned below the second sides 221, 222, 223, 224 in the vicinity of the corner portions 241, 242, 243, 244, Otherwise, it coincides with the second side. The translucent member 30 having such a shape uses a liquid resin material as a raw material of the translucent member 30, and utilizes the fact that the liquid resin material wets and spreads on the side surface 23 of the light emitting element 20 due to surface tension. Thus, it can be easily formed. Further, by providing a step at a portion where the second surface 22 and the side surface 23 of the light emitting element 20 intersect, it is possible to suppress the liquid resin material from spreading over the second surface 22 beyond the step. it can. Such a step is formed by removing, for example, only a part of the semiconductor stacked body 28 of the light emitting element 20, more preferably a part of the second semiconductor layer 283 close to the second surface 22 of the light emitting element 20. Can be provided.
It is preferable that the translucent member 30 covers the light emitting layer 282 exposed on the side surface 23 of the light emitting element 20 as widely as possible, and in particular, covers all. Accordingly, light emitted from the light emitting layer 282 can be efficiently extracted outside the light emitting element 20 through the translucent member 30.

  Note that the upper edge portion of the translucent member 30 does not completely exclude exceeding the second sides 221, 222, 223, and 224 of the light emitting element 20. That is, the upper edge portion of the translucent member 30 may exceed the second sides 221, 222, 223, and 224 of the light emitting element 20, and the translucent member 30 may partially cover the second surface 22. . However, if the second surface 22 is widely covered with the translucent member 30, the problem of peeling at the interface between the second surface 22 and the translucent member 30 may become prominent.

  As shown in FIGS. 2A, 2 </ b> B, and 3, the outer surface 33 of the translucent member 30 faces outward from the second surface 22 side of the light emitting element 20 toward the first surface 21 side. It is preferable to incline. That is, in the cross-sectional views as shown in FIGS. 2A and 2B, the left and right outer surfaces 33 of the translucent member 30 spread toward the first surface (light emitting surface) 11 of the light emitting device 10. Is preferred. The light emitted from the side surface 23 of the light emitting element 20 and propagating through the translucent member 30 reaches the inclined outer surface 33. Here, when the light is reflected by the outer surface 33, the light can be directed toward the first surface 11 of the light emitting device 10. Thereby, the light extraction efficiency of the light emitting device 10 can be improved.

In the cross section parallel to one side surface 23 of the light emitting element 20 (the cross section along the line AA in FIG. 1, that is, FIG. 2A), another side surface 23 orthogonal to the one side surface 23, The angle formed by the outer surface 33 of the translucent member 30 that covers the side surface 23 (referred to as “inclination angle θ ₁ ”) is preferably in an appropriate range. Specifically, the inclination angle theta ₁ can be made is preferably from 40 ° to 60 °, for example 45 °. If the inclination angle theta ₁ is large, (in FIG. 1, a substantially depicted in circular) contour of the first surface 31 of the translucent member 30 is increased, light extraction efficiency is improved. On the other hand, when the inclination angle theta ₁ is small, the external shape of the first surface 31 is reduced, it is possible to reduce the dimensions of one side of the light emitting device 10 in the top view (i.e., the light emitting device 10 can be miniaturized). Considering both the light extraction efficiency and the miniaturization of the light emitting device 10, it is optimal that the inclination angle θ ₁ = 45 °.

In a cross-section along the diagonal line of the light-emitting element 20 in plan view (cross-section along the line BB in FIG. 1, that is, FIG. 2B), the third side of the light-emitting element 20 (reference numeral in FIG. 2B) 231 and 233) and the outer surface 33 of the translucent member 30 covering the third side (this is referred to as “inclination angle θ ₂ ”) is smaller than the inclination angle θ ₁ . That is, as shown in FIGS. 2A and 2B, the inclination angle θ ₂ <the inclination angle θ ₁ is satisfied.

  The outer surface 33 of the translucent member 30 is provided with a ridge line starting from a point where the outer surface 33 and the third sides 231, 232, 233, and 234 (see FIG. 3) of the light emitting element 20 come into contact. May be. However, if there is a ridge line on the outer surface 33, the light incident on the translucent member 30 from the side surface 23 of the light emitting element 20 is transmitted to the interface between the outer surface 33 of the translucent member 30 and the covering member 40 (FIG. 2A). When being reflected in (b)), light may be repeatedly reflected between the surfaces located on both sides of the ridge line (that is, two surfaces constituting the ridge line) in the vicinity of the ridge line. . Since light can be gradually absorbed while the reflection is repeated and the intensity can be weakened, the light extraction efficiency of the light emitting device 10 can be reduced. In order to improve the light extraction efficiency, it is preferable that there is no ridge line on the outer surface of the translucent member 30, that is, the outer surface 33 of the translucent member 30 is formed from a smoothly continuous curved surface. Thereby, the multiple reflection in the translucent member 30 can be reduced, and the light extraction efficiency of the light emitting device 10 can be increased.

The outer surface 33 of the translucent member 30 may be linear in the cross-sectional views shown in FIGS. 2A and 2B, or may be curved. Here, the “curve shape” may be a curve that is convex outward (covering member 40 side) and a curve that is convex inward (light emitting element 20 side). From the viewpoint of light extraction efficiency, the outer surface 33 is preferably an outwardly convex curve.
In addition, the curved outer surface 33 that protrudes outward in the sectional view has a dome shape as shown in FIG. 3 in the perspective view. In addition, the curved outer surface 33 that protrudes inward in the cross-sectional view has a trumpet shape (flared type) as shown in FIG.

  When the light emitting element 20 includes the translucent substrate 27 and the semiconductor stacked body 28, the translucent substrate 27 is disposed on the first surface 21 side of the light emitting element 20 as shown in FIG. 28 can be disposed on the second surface 22 side. When the light emitting element 20 is turned on, heat is generated in the light emitting layer (reference numeral 282 in FIG. 3) included in the semiconductor stacked body 28. Therefore, the translucent member 30 is peeled from the light emitting element 20 in the vicinity of the semiconductor stacked body 28 side. It's easy to do. As shown in FIG. 2B, on the second surface 22 side of the light emitting element 20, the corners of the light emitting element 20 (reference numerals 241 and 243 in FIG. 2B) are exposed from the translucent member 30. And covered with the covering member 40. Thereby, peeling of the translucent member 30 from the light emitting element 20 is suppressed on the second surface 22 side of the light emitting element 20. Therefore, by disposing the semiconductor stacked body 28 that is a generation source of heat that causes peeling on the second surface 22 side of the light emitting element 20, it is possible to effectively suppress peeling of the translucent member 30. it can.

  FIG. 4 shows the light emitting device 10 as viewed from the second surface 12 side. The pair of electrodes 251 and 252 of the light emitting element 20 are exposed from the covering member 40 and exposed on the second surface (lower surface) 12 of the light emitting device 10. Thereby, the external electrode provided in the board | substrate etc. in which the light emitting element 20 is mounted, and the electrodes 251 and 252 of the light emitting element 20 can be connected. In addition, it is preferable that the light emitting element 20 is covered with the covering member 40 in order to protect the light emitting element 20 from the external environment other than the portions where the electrodes 251 and 252 of the second surface 22 are provided.

  When covering the second surface 22 of the light emitting element 20 with the covering member 40, the electrodes 251 and 252 formed on the second surface 22 of the light emitting element 20 are exposed on the surface (second surface 12) of the light emitting device 10. Like that. For example, the side surfaces (reference numerals 251c and 252c in FIG. 3) of the electrodes 251 and 252 may be covered with the covering member 40, but the surfaces 251s and 252s of the electrodes 251 and 252 are covered so as not to be covered with the covering member 40. The thickness of the member 40 is adjusted. The electrode surfaces 251s and 252s may protrude from the covering member 40 or may be substantially flush (see FIG. 2A).

  Referring to FIGS. 2A and 2B again, as described above, the light emitting device 10 can include the wavelength conversion member 50 on the first surface 11 side. The wavelength conversion member 50 is a member for converting a part of transmitted light to another wavelength. The wavelength conversion member 50 contains a phosphor that is excited by transmitted light. When the light emitting device 10 includes the wavelength conversion member 50, the light emitting device 10 having an emission color different from the emission color of the light emitting element 20 can be obtained. For example, the light emitting device 10 that emits white light can be obtained by combining the light emitting element 20 that emits blue light and the wavelength conversion member 50 that absorbs blue light and emits yellow fluorescence.

  The wavelength conversion member 50 is preferably provided so as to cover the first surface 21 of the light emitting element 20 and the first surface 31 of the translucent member 30. The light generated in the light emitting element 20 is directly taken out from the first surface 21 of the light emitting element 20, or is emitted from the side surface 23 of the light emitting element 20 and passes through the light transmitting member 30 and the light transmitting member 30. 1 is indirectly extracted from one surface 31. Therefore, by disposing the wavelength conversion member 50 so as to cover the first surface 21 of the light emitting element 20 and the first surface 31 of the translucent member 30, substantially all of the light generated in the light emitting element 20 can be obtained. Can be passed through the wavelength conversion member 50. In other words, since there is substantially no light that does not pass through the wavelength conversion member 50, uneven color emission of the light emitting device 10 can be suppressed.

<First manufacturing method>
Next, a first manufacturing method of the light emitting device 10 according to the present embodiment will be described with reference to FIG.

Step 1-1. Fixing the light emitting element 20 The light emitting element 20 is disposed on the wavelength conversion member 50 (FIG. 5A). At this time, the first surface 21 of the light emitting element 20 is disposed to face the second surface 52 of the wavelength conversion member 50. The light emitting element 20 can be fixed to the wavelength conversion member 50 with a translucent adhesive or the like. Instead of using an adhesive, the light emitting element 20 may be fixed to the wavelength conversion member 50 by a translucent member 30 to be formed later. Further, when the wavelength conversion member 50 itself has adhesiveness (in a semi-cured state or the like), the wavelength conversion member 50 may be fixed without using an adhesive.

Step 1-2. Formation of Translucent Member 30 The translucent member 30 is formed so as to cover a part of the side surface 23 of the light emitting element 20 and a region near the light emitting element 20 in the second surface 52 of the wavelength conversion member 50. (FIG. 5B). When the translucent member 30 is formed from a translucent resin material, the liquid resin material 30L, which is a raw material of the translucent member 30, is replaced with a first side (see FIG. 5 (b), and is applied along the boundary between the wavelength conversion member 50. The liquid resin material 30L spreads over the wavelength conversion member 50 and scoops the side surface 23 of the light emitting element 20 by surface tension. Thereafter, the liquid resin material 30L is cured by heating or the like to obtain the translucent member 30.

  The distance by which the liquid resin material 30L climbs up the light emitting element 20 can be controlled by adjusting the viscosity and the coating amount of the liquid resin material 30L. For example, in the translucent member 30 shown in FIG. 3, the liquid resin material 30 </ b> L scoops up the side surface 23 of the light emitting element 20 and contacts a part of the second sides 221, 222, 223, and 224. However, the liquid resin material crawls up partway on the third sides 231, 232, 233 and 234, but does not reach the corners 241, 242, 243 and 244 of the light emitting element 20. The corners 241, 242, 243, and 244 of the light emitting element 20 are exposed from the translucent member 30 by adjusting the viscosity and the coating amount of the liquid resin material 30 </ b> L so that the form as illustrated in FIG. 3 is obtained. Can do. The viscosity of the liquid resin material 30L can be adjusted by adding a filler or the like.

  When the translucent member 30 is formed from the liquid resin material 30L, the outer surface 33 of the translucent member 30 faces outward in the Z direction (ie, away from the side surface 23 of the light emitting element 20) due to surface tension. It can be inclined (FIG. 5B).

Step 1-3. Formation of the covering member 40 Of the outer surface 33 of the translucent member 30 and the portion of the second surface 52 of the wavelength conversion member 50 that is not covered with the translucent member 30 (that is, the second surface 52 is exposed). The covering portion 40 is covered with the covering member 40. Further, a portion of the second surface 22 of the light emitting element 20 that is not covered with the electrodes 251 and 252 (that is, a portion where the second surface 22 is exposed) may be covered with the covering member 40. At this time, the thickness (dimension in the −Z direction) of the covering member 40 is adjusted so that parts of the electrodes 251 and 252 (for example, the surfaces 251 s and 252 s of the electrodes 251 and 252) are exposed from the covering member 40. Is preferred. That is, when the second surface 52 of the wavelength conversion member 50 is used as a reference, the height of the second surface 42 of the covering member 40 may be equal to or less than the height of the surfaces 251 s and 252 s of the electrodes 251 and 252.

  In the case where the covering member 40 is formed of a resin material, for example, a mold that surrounds the light emitting element 20 and the translucent member 30 is provided, and the liquid resin material 40L that is a raw material of the covering member 40 is placed in the mold. Pour. At this time, the wavelength conversion member 50 can be used as the bottom of the mold by fitting the mold on the outer periphery of the wavelength conversion member 50 (see FIG. 5C). Thereafter, the liquid resin material 40L is cured by heating or the like to obtain the covering member 40. By removing the mold, a light emitting device 10 as shown in FIGS. 1, 2 and 4 can be obtained. The covering member 40 may be formed by spray coating, compression molding, or various methods. Further, after forming the covering member so as to fill the electrodes 251 and 252, only the covering member 40 or the covering member 40 and a part of the electrodes 251 and 252 may be removed to expose the electrodes 251 and 252.

<Second production method>
A second manufacturing method of the light emitting device 10 according to the present embodiment will be described with reference to FIGS. In the second manufacturing method, a plurality of light emitting devices 10 can be manufactured simultaneously.

Step 2-1. Fixing the light emitting element 20 The light emitting element 20 is disposed on the second surface 520 of the wavelength conversion sheet 500 (FIGS. 6A and 9A). The wavelength conversion sheet 500 becomes the wavelength conversion member 50 after being separated into individual light emitting devices 10. At this time, a plurality of light emitting elements 20 are arranged on one wavelength conversion sheet 500 using a relatively large wavelength conversion sheet 500. Adjacent light emitting elements 20 are arranged at a predetermined interval. If the interval between adjacent light emitting elements 20 is too wide, the number of light emitting devices 10 that can be formed at the same time decreases, and the efficiency of mass production of the light emitting devices 10 deteriorates. Therefore, the light emitting elements 20 are arranged at appropriate intervals. Is desirable. The light emitting element 20 is manufactured by the steps 1-1. The wavelength conversion sheet 500 is fixed at a predetermined position by a fixing method similar to the fixing method described above.

Step 2-2. Formation of translucent member 30 Step 1-2 of the first manufacturing method. Similarly, the translucent member 30 is formed around each light emitting element 20 (FIGS. 6B and 9B). The translucent member 30 formed around a light emitting element 20 and the translucent member 30 formed around the light emitting element 20 disposed adjacent to the light emitting element 20 do not contact each other. The optical member 30 is formed.

Step 2-3. Formation of covering member 400 Step 1-3 of the first manufacturing method. Similarly, the outer surface 33 of the translucent member 30 and the second surface 520 of the wavelength conversion sheet 500 are covered with the covering member 400 (FIGS. 7A and 9C). The covering member 400 becomes the covering member 40 after being separated into individual light emitting devices 10. Step 2-3. Are steps 1-3. Unlike the above, the thickness (dimension in the −z direction) of the covering member 400 is adjusted so as to cover the surfaces 251 s and 252 s of the electrodes 251 and 252 of the light emitting element 20. At this time, the plurality of translucent members 30 provided around the plurality of light emitting elements 20 arranged on the wavelength conversion sheet 500 are covered with one continuous covering member 400.
Thereafter, the thickness of the covering member 400 is reduced by a known processing method so that the electrodes 251 and 252 of the light emitting element 20 are exposed (FIGS. 7B and 10A).

Step 2-4. Separation of Light-Emitting Device 10 A covering member along broken lines X ₁ , broken lines X ₂ , broken lines X ₃ and broken lines X ₄ (FIGS. 7B and 10A) passing through the middle of adjacent light-emitting elements 20 400 and the wavelength conversion sheet 500 are cut with a dicer or the like. As a result, the individual light emitting devices 10 are separated into individual pieces (FIGS. 8 and 10B). In this manner, a plurality of light emitting devices 10 including one light emitting element 20 can be manufactured at the same time.

  In the light emitting device 10 that has been singulated, when the translucent member 30 is exposed on the side surface 13 of the light emitting device 10 (the side surface 40 c of the covering member 40), the light emitted from the light emitting element 20 passes through the translucent member 30. Thus, the light leaks from the side surface 13 of the light emitting device 10 in the lateral direction. Therefore, it is preferable to adjust the interval between adjacent light emitting elements 20, the viscosity of the translucent member 30, and the like so that the translucent member 30 is not exposed from the side surface 13 of the light emitting device 10.

<Third production method>
A third manufacturing method of the light-emitting device 10 according to the present embodiment will be described with reference to FIGS. In the third manufacturing method, a plurality of light emitting devices 10 can be manufactured simultaneously. Note that description of steps similar to those of the second manufacturing method is omitted.

Step 3-1. Arrangement of Translucent Member 30 On the second surface 520 of the wavelength conversion sheet 500, the liquid resin material 300 for forming the translucent member 30 is applied in a plurality of separated island shapes (FIG. 11 (a). ), 12 (a)). At this time, a plurality of island-shaped liquid resin materials 300 are arranged on one wavelength conversion sheet 500 using a relatively large wavelength conversion sheet 500. Each liquid resin material 300 provided in an island shape can have any shape in plan view, and examples thereof include a circle, an ellipse, a square, and a rectangle. Note that if the interval between the adjacent island-shaped liquid resin materials 300 is too wide, the number of light emitting devices 10 that can be formed at the same time decreases, and the mass production efficiency of the light emitting devices 10 deteriorates. It is desirable to arrange them at intervals.

Step 3-2. Fixing of Light-Emitting Element 20 and Curing of Liquid Resin Material 300 As shown in FIGS. 11 (b) and 12 (b), the light-emitting element 20 is disposed on each island-shaped liquid resin material 300. By simply placing the light emitting element 20 on the island-shaped liquid resin material 300 or pressing the light emitting element 20 after placing the light emitting element 20, the liquid resin material 300 crawls up to the side surface 23 of the light emitting element 20 due to surface tension. The outer surface 303 of the liquid resin material 300 (the outer surface 33 of the subsequent translucent member 30) has a shape that expands downward. Thereafter, the liquid resin material 300 is cured to form the translucent member 30.
The shape of the liquid resin material 300 in a plan view is deformed by the arrangement or pressing of the light emitting element 20, and the first surface 31 of the translucent member 30 included in the light emitting device 10 which is the final product (see FIGS. 1 and 2). The shape almost coincides with the outer shape.

  In this manufacturing method, the liquid resin material 300 exists in the form of a film between the wavelength conversion sheet 500 and the light emitting element 20. The film-shaped translucent member 30 t formed by curing the film-shaped liquid resin material 300 can also function as an adhesive between the wavelength conversion sheet 500 and the light emitting element 20. The thickness of the film-like light transmissive member 30 t is preferably determined in consideration of adhesiveness and heat dissipation of the light emitting device 10. Specifically, the thickness of the film-shaped translucent member 30t is such that when the light emitting device 10 emits light, heat generated from the wavelength conversion member 500 can be efficiently conducted to the light emitting element 20 side. Can be, for example, 2 to 30 μm, preferably 4 to 20 μm, and most preferably about 5 to 10 μm.

  Thereafter, step 2-3 of the second manufacturing method. The covering member 400 is formed in the same manner as in Step 2-4. In the same manner as described above, the light emitting device 10 is separated into pieces. Thereby, a plurality of light emitting devices 10 including one light emitting element 20 can be manufactured simultaneously.

  As described above, according to this manufacturing method, the liquid resin material 300 is coated on the wavelength conversion sheet 500 in an island shape, and the light emitting element 20 is disposed, whereby the adhesion of the light emitting element 20 and the translucent member 30 are arranged. Formation can occur simultaneously. Thereby, mass productivity can be improved. .

<Fourth manufacturing method>
A fourth manufacturing method of the light emitting device 10 according to the present embodiment will be described with reference to FIGS. In the fourth manufacturing method, a plurality of light emitting devices 10 can be manufactured simultaneously.

Step 4-1. Fixing the light emitting element 20 The light emitting element 20 is disposed on the upper surface 60a of the support member 60 made of a heat resistant sheet or the like (FIG. 13A). At this time, the plurality of light emitting elements 20 are arranged on one support member 60 using a relatively large support member 60. Similar to the step 2-1 of the second manufacturing method, the adjacent light emitting elements 20 are arranged at a predetermined interval. The light emitting element 20 is manufactured by the steps 1-1. The support member 60 is fixed at a predetermined position by the same fixing method as described in the above.

Step 4-2. Formation of translucent member 30 Step 1-2 of the first manufacturing method. Similarly to the above, a translucent member 30 is formed around each light emitting element 20 (FIG. 13B). The translucent member 30 formed around a light emitting element 20 and the translucent member 30 formed around the light emitting element 20 disposed adjacent to the light emitting element 20 do not contact each other. The optical member 30 is formed.

Step 4-3. Formation of covering member 400 Step 1-3 of the first manufacturing method. In the same manner, the outer surface 33 of the translucent member 30 and the upper surface 60a of the support member 60 are covered with the covering member 400 (FIG. 13C). The covering member 400 becomes the covering member 40 after being separated into individual light emitting devices 10. The plurality of translucent members 30 provided around the plurality of light emitting elements 20 arranged on the support member 60 are covered with one continuous covering member 400.

Step 4-4. Formation of Wavelength Conversion Layer 510 The support member 60 is removed (peeled) to expose the first surface 21 of the light emitting element 20 and the first surface 400a of the covering member 400 (FIG. 14A). Thereafter, a wavelength conversion layer 510 that covers the first surface 21 of the light emitting element 20 and the first surface 400a of the covering member 400 (hereinafter referred to as “first surface 21, 400a”) is formed. The wavelength conversion layer 510 becomes the wavelength conversion member 50 after being separated into individual light emitting devices 10. As a method for forming the wavelength conversion layer 510, a sheet made of a translucent resin containing a phosphor is bonded to the first surface 21, 400a by hot melt or an adhesive, and the first surface is formed by electrophoretic deposition. 21, a method of impregnating a phosphor with a translucent resin after adhering the phosphor to 400a, a translucent resin containing a phosphor, potting, transfer molding, compression molding, molding with a casting case, The method of apply | coating to the 1st surface 21 and 400a by known techniques, such as a spray method, an electrostatic coating method, and a printing method, is mentioned. Among these methods, the spray method is preferable, and the pulse spray method in which spray is intermittently ejected is particularly preferable.

Step 4-5. In the same manner as in Step 2-4 of the second manufacturing method singulation of the light emitting device 10, along the broken line X ₁ and the broken line X ₂ through the middle of the adjacent light-emitting element 20, the covering member 400 and the wavelength conversion layer 510 Is cut with a dicer or the like (FIG. 14B). As a result, the individual light emitting devices 10 are separated into individual pieces (FIG. 14C). In this manner, a plurality of light emitting devices 10 including one light emitting element 20 can be manufactured at the same time.

<Embodiment 2>
As shown in FIG. 15, the light emitting device 15 according to the present embodiment is different from the light emitting device 10 according to Embodiment 1 in that the side surface 501 b of the wavelength conversion member 501 is covered with a covering member 403. The difference is that the covering member 403 has a two-layer structure. The other points are the same as in the first embodiment.

  The light emitting device 15 according to the present embodiment includes a light emitting element 20, a wavelength conversion member 501 that covers the first surface 21 of the light emitting element 20, and a translucent member 30 provided on the side surface 23 side of the light emitting element 20. And a covering member 403 that covers the outer surface 33 of the translucent member 30. In the present embodiment, the covering member 403 includes a first covering member 401 that covers the side surface 501 b of the wavelength conversion member 501 and a second covering member 402 that covers the outer surface 33 of the translucent member 30.

  By covering the side surface 501b of the wavelength converting member 501 with the covering member 403 (first covering member 401), light emitted from the light emitting element 20 propagates through the inside of the wavelength converting member 501 and leaks laterally from the side surface 501b. Can be suppressed. Most of the light emitted from the light emitting device 15 is extracted from the first surface (upper surface) 16 that functions as the light emitting surface of the light emitting device 15. That is, since the light from the light emitting device 15 is emitted substantially in the z direction, the directivity of the light of the light emitting device 15 can be improved.

Next, a method for manufacturing the light emitting device 15 will be described with reference to FIGS.
Step A. Formation of Wavelength Conversion Member 501 A coating material layer 404 for forming the first coating layer 401 is formed on the first support member 61 made of a heat-resistant sheet or the like (FIG. 16A). Then, the frame member 405 is obtained by providing a plurality of through holes 409 in the coating material layer 404 (FIG. 16B). The dimension and shape of the inner surface of the through hole 409 of the frame member 405 when viewed from the z direction are the same as the dimension and shape of the outer shape of the wavelength conversion member 501 in the plan view of the light emitting device 15 shown in FIG. is there. Note that when the through hole 409 is formed, the covering material layer 404 is formed so as not to penetrate the first support member 61.

  In each through-hole 409, a translucent resin (liquid resin material before curing) 502L containing a phosphor is potted (FIG. 16B). Thereafter, the translucent resin 502L is cured by heating to form the phosphor-containing member 502 (FIG. 16C). The “upper portion of the phosphor-containing member 502” and the “upper portion of the frame member 405” above the Ct-Ct line (broken line) in FIG. 16C are removed by cutting or the like. As a result, a sheet-like member including a lower part (wavelength conversion member 501) of the phosphor-containing member 502 and a lower part of the frame member 405 (hereinafter referred to as “thin frame member 406”) is formed ( FIG. 16 (d)). The thin frame member 406 becomes a first coating layer 401 shown in FIG. Next, the sheet-like member (the wavelength conversion member 501 and the thin frame member 406) is transferred to the second support member 62 made of a heat-resistant sheet or the like (FIG. 16E). The transfer of the sheet-like member may be omitted.

Step B. Fixing of the light emitting element 20 The light emitting element 20 is fixed on the exposed surface 501x of each wavelength conversion member 501 (FIG. 17A). The fixing method of the light emitting element 20 is the same as the process 1-1. This is the same as the fixing method described in.

Step C. Formation of translucent member 30 Step 1-2 of Embodiment 1 Similarly to the above, a liquid resin material 30L as a raw material of the translucent member 30 is applied around the light emitting element 20 (FIG. 17B). The translucent member 30 is obtained by curing the liquid resin material 30L by heating or the like. The applied liquid resin material 30L spreads along the exposed surface 501x of the wavelength conversion member 501, but when the boundary line between the wavelength conversion member 501 and the thin frame member 406 is reached, it is further increased by the pinning effect. Difficult to spread. Therefore, in the light emitting device 15 according to the present embodiment, the form of the translucent member 30 can be easily controlled. As shown in FIG. 15A, the translucent member 30 does not reach the four corner portions 501e (hatched portions) of the wavelength conversion member 501. Therefore, the four corner portions 501 e are exposed from the translucent member 30.

Step D. Formation of covering member 407 Step 1-3 of Embodiment 1. In the same manner, the outer surface 33 of the translucent member 30, the four corners of the wavelength conversion member 501 (reference numeral 501e in FIG. 15A), and the thin frame member 406 surrounding the wavelength conversion member 501 The second surface 406b is covered with a covering member 407 (FIG. 17C). The covering member 407 becomes the covering member 402 after being separated into individual light emitting devices 15. The plurality of translucent members 30 provided around the plurality of light emitting elements 20 are covered with one continuous covering member 407. In addition, as shown to Fig.15 (a), the wavelength conversion member 501 is covered with the translucent member 30 except for the four corner parts 501e. Therefore, only the four corner portions 501e of the wavelength conversion member 501 that are not covered with the translucent member 30 are covered with the covering member 407 (FIG. 15C).

Step E. Along the dashed line X ₅ and dashed X ₆ through the intermediate light-emitting elements 20 adjacent singulation of the light emitting device 15, and the covering member 407, and Usukatachiwaku member 406, and a second support member 62 by a dicer or the like Disconnect. Finally, the light emitting device 15 is obtained by removing (peeling) the second support member 62. The second support member 62 may be removed before cutting, and then the covering member 407 and the thin frame member 406 may be cut.

<Embodiment 3>
In this embodiment, the shape of the electrode of the light emitting element included in the light emitting device is different from the shape of the electrodes 251 and 252 of the light emitting element 20 of the first embodiment. Other configurations of the light emitting device are the same as those in the first embodiment.

  FIG. 18 is a perspective view of the light emitting device 17 according to the present embodiment. The light emitting element 207 included in the light emitting device 17 includes the semiconductor stacked body 28 and a pair of electrodes 257 and 258. On the second surface (lower surface) 172 of the light emitting device 17, the surfaces 257 s and 258 s of the pair of electrodes 257 and 258 are exposed from the covering member 40.

  In the present embodiment, the surface 257s of the first electrode 257 and the surface 258s of the second electrode 258 are formed in different shapes. The surface 257s of the first electrode 257 is a rectangle extending in one direction (y direction). The surface 258s of the second electrode 258 has a comb shape in which a plurality of convex portions 258a and a plurality of concave portions 258b are alternately arranged on a side 258L facing the first electrode 257. The recess 258 b is filled with the covering member 40. Thereby, the adhesiveness of the light emitting element 20 and the coating | coated member 40 can be improved.

  The shape of the convex portion 258a and the concave portion 258b can be any shape. For example, in FIG. 18, the shape of the concave portion 258 b is configured by a belt-like portion extending in the x direction from the side 258 </ b> L and a circular portion provided at the end of the belt-like portion. When two or more recesses 258b are formed, the shape of the recesses 258b may be all the same as shown in FIG. 18, or some or all may be different. When three or more recesses 258b are formed, the intervals between the adjacent recesses 258b may all be equal as shown in FIG. 18, or may be different.

FIG. 19 is a plan view of the light emitting device 17 with the covering member 40 illustrated in FIG. 18 omitted, and FIG. 20 is a perspective view of the light emitting device 17 with the covering member 40 omitted. As shown in FIGS. 19 and 20, the light-emitting element 207 is on the second surface 207b side, more specifically, on the second semiconductor layer 283 side of the semiconductor stack 28 of the light-emitting element 207 (see FIGS. 20 and 3). ) Can be provided with a reflective film 29. The reflective film 29 can be formed of a material such as a metal having a high light reflectance such as Ag or Al, or a dielectric multilayer film. By providing the reflective film 29, light directed toward the second surface 207b can be reflected toward the first surface 207a.
As shown in FIG. 19, in the light emitting element 207, the semiconductor laminate 28 and the reflective film 29 may not be formed at the corners of the translucent substrate 27 for reasons of the manufacturing process. The corners of the translucent substrate 27 on which the reflective film 29 is not formed are preferably covered with the covering member 40, and light directed toward the corners of the translucent substrate 27 is transmitted to the translucent substrate 27 and the covering member 40. By reflecting at the interface, the light extraction efficiency of the light emitting device 10 can be improved.

Below, the material etc. which are suitable for each structural member of the light-emitting device 10 of Embodiment 1-3 are demonstrated.
(Light emitting element 20, 207)
As the light emitting elements 20 and 207, for example, a semiconductor light emitting element such as a light emitting diode can be used. The semiconductor light emitting element can include a translucent substrate 27 and a semiconductor stacked body 28 formed thereon.

(Translucent substrate 27)
For the light-transmitting substrate 27 of the light-emitting elements 20 and 207, for example, a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or spinel (MgA 1 ₂ O ₄ ), or light emission from the semiconductor laminate 28. Can be used. For example, a nitride-based semiconductor material can be used.

(Semiconductor laminate 28)
The semiconductor stacked body 28 includes a plurality of semiconductor layers. As an example of the semiconductor stacked body 28, three semiconductors including a first conductive type semiconductor layer (for example, an n-type semiconductor layer) 281, a light emitting layer (active layer) 282, and a second conductive type semiconductor layer (for example, a p-type semiconductor layer) 283. Layers can be included (see FIG. 3). The semiconductor layer can be formed from a semiconductor material such as a III-V group compound semiconductor or a II-VI group compound semiconductor, for example. _{Specifically, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride semiconductor material (e.g., InN such, AlN, GaN, InGaN, AlGaN , InGaAlN Etc.) can be used.

(Electrodes 251, 252, 257, 258)
As the electrodes 251, 252, 257, 258 of the light emitting elements 20, 207, a good electrical conductor can be used, and for example, a metal such as Cu is preferable.

(Translucent member 30)
The translucent member 30 can be formed from a translucent material such as a translucent resin or glass. The translucent resin is particularly preferably a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, and a phenol resin. Since the translucent member 30 is in contact with the side surface 23 of the light emitting element 20, it is easily affected by heat generated in the light emitting element 20 during lighting. Since the thermosetting resin is excellent in heat resistance, it is suitable for the translucent member 30. The translucent member 30 preferably has a high light transmittance. Therefore, it is usually preferable that no additive that reflects, absorbs, or scatters light be added to the translucent member 30. However, it may be preferable to add an additive to the translucent member 30 in order to impart desirable characteristics. For example, various fillers may be added to adjust the refractive index of the translucent member 30 or to adjust the viscosity of the translucent member (liquid resin material 300) before curing.

In plan view of the light emitting device 10, the outer shape of the first surface 31 of the translucent member 30 is at least larger than the outer shape of the second surface 22 of the light emitting element 20. The outer shape of the first surface 31 of the translucent member 30 can be various shapes, for example, a round shape as shown in FIG. 21A or a rounded square shape as shown in FIG. , And oval, square, rectangular, etc.
In particular, as shown in FIG. 21A, the dimension of the first surface 31 of the translucent member 30 in a plan view (from the outer shape of the first surface 21 of the light emitting element 20, the first of the translucent member 30. As for the distance to the outer shape of the surface 31 of the light-emitting element 20, the dimension 30D on the diagonal line of the light-emitting element 20 is compared with the dimension 30W on the line perpendicular to the side surface 23 from the center of the side surface 23 of the light-emitting element 20. <Dimension 30W is preferred. In order to satisfy the dimensional conditions, the shape of the first surface 31 of the translucent member 30 is preferably a circle, an ellipse, or a rounded square.

Moreover, you may determine the external shape of the 1st surface 31 of the translucent member 30 based on other conditions. For example, when the light emitting device 10 is used in combination with an optical lens (secondary lens), the outer shape of the first surface 31 is preferably circular, and the light emitted from the light emitting device 10 is also nearly circular. The light is easily collected by the optical lens. On the other hand, when downsizing of the light emitting device 10 is desired, the outer shape of the first surface 31 is preferably a rounded square, and the size 30W can be reduced, so that the size of the upper surface 11 of the light emitting device 10 is reduced. can do.
In general, the ratio of the dimension 30D to the dimension 30W is 30D / 30W = 2/3 to 1/2 in consideration of easy focusing by the optical lens and the miniaturization of the light emitting device 10. Is preferred.

Further, as shown in FIG. 21 (a) and FIG. 21 (b), when the dimension from the first surface 21 to the second surface 22 of the light emitting element 20 is “thickness 20T of the light emitting element 20”, the dimension is 30W. And the thickness 20T can be approximated by a relationship of tan θ ₁ = 30 W / 20T. Here, for example, in the case of 30 W = 250 μm and 20T = 150 μm, the inclination angle θ ₁ = 59 °, and the light extraction efficiency can be increased.
As described above, since the inclination angle θ ₁ is preferably 40 ° to 60 °, if the thickness 20T of the light emitting element 20 to be used is determined, a preferable range of 30 W can also be determined.

(Coating members 40, 403)
The covering members 40 and 403 are made of a material that has a predetermined relationship in thermal expansion coefficient with respect to the translucent member 30 and the light emitting element 20. That is, the covering members 40 and 403 are configured such that the difference in thermal expansion ΔT ₄₀ between the covering members 40 and 403 and the light emitting element 20 is smaller than the difference in thermal expansion ΔT ₃₀ between the translucent member 30 and the light emitting element 20. The material is selected. For example, when the light-emitting element 20 includes a sapphire translucent substrate 27 and a semiconductor laminate 28 made of a GaN-based semiconductor, the coefficient of thermal expansion of the light-emitting element 20 is approximately 5 to 9 × 10 ⁻⁶ / K. . On the other hand, when the translucent member 30 is formed from a silicone resin, the thermal expansion coefficient of the translucent member 30 is 2 to 3 × 10 ⁻⁵ / K. Therefore, the covering members 40 and 403 can be made to satisfy ΔT ₄₀ <ΔT ₃₀ by being formed of a material having a smaller thermal expansion coefficient than that of the silicone resin.

When a resin material is used for the covering members 40 and 403, the thermal expansion coefficient is generally on the order of 10 ⁻⁵ / K, which is an order of magnitude larger than that of the general light emitting element 20. However, the thermal expansion coefficient of the resin material can be reduced by adding a filler or the like to the resin material. For example, by adding a filler such as silica to the silicone resin, the coefficient of thermal expansion can be lowered as compared with the silicone resin before the filler is added.

  The resin material that can be used for the covering members 40 and 403 is particularly preferably a thermosetting translucent resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin.

  The covering members 40 and 403 can be formed of a light reflecting resin. The light reflecting resin means a resin material having a reflectance of 70% or more with respect to light from the light emitting element 20. The light reaching the covering members 40 and 403 is reflected and travels toward the first surface 11 (light emitting surface) of the light emitting device 10, whereby the light extraction efficiency of the light emitting device 10 can be increased.

  As the light-reflective resin, for example, a resin obtained by dispersing a light-reflective substance in a light-transmitting resin can be used. As the light reflective material, for example, titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite and the like are suitable. The light-reflective substance may be in the form of particles, fibers, thin plate pieces, etc., but the fiber-like substance is particularly preferable because it can be expected to reduce the thermal expansion coefficient of the covering members 40 and 403.

(Wavelength conversion member 50)
The wavelength conversion member 50 includes a phosphor and a light transmissive material. As the translucent material, translucent resin, glass, or the like can be used. In particular, a translucent resin is preferable, and a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin is used. it can. In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

A phosphor that can be excited by light emission from the light emitting element 20 is used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet phosphors activated with cerium (Ce: YAG); lutetium-aluminum-garnet phosphors activated with cerium (Ce: LAG); nitrogen-containing calcium aluminosilicate phosphor activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ); silicate phosphor activated with europium ((Sr, Ba) ₂ SiO ₄ ); nitride phosphor such as β sialon phosphor, CASN phosphor, SCASN phosphor; KSF phosphor (K ₂ SiF ₆ : Mn); sulfide phosphor, quantum dot phosphor Etc. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.
The wavelength conversion member 50 may contain various fillers for the purpose of adjusting the viscosity.

  Note that the surface of the light emitting element may be coated with a translucent material that does not include a phosphor instead of the wavelength conversion member 50. Further, this light-transmitting material may contain various fillers for the purpose of adjusting the viscosity.

As mentioned above, although some embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .
Note that the disclosure content of the present specification may include the following aspects.
(Aspect 1)
A first surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface, wherein the second surface and the second surface A light-emitting element having a plurality of corner portions in contact with two of the plurality of side surfaces, and having a pair of electrodes on the second surface side;
A translucent member covering at least one of the side surfaces and a part of the side where the at least one side surface and the second surface are in contact with each other so as to expose one or more of the plurality of corner portions; ,
A cover member that covers the exposed corners of the light emitting element and an outer surface of the translucent member so as to expose the pair of electrodes;
A light emitting device, wherein a difference in thermal expansion coefficient between the covering member and the light emitting element is smaller than a difference in thermal expansion coefficient between the translucent member and the light emitting element.
(Aspect 2)
A first surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface, wherein the second surface and the second surface A light-emitting element having a plurality of corner portions in contact with two of the plurality of side surfaces, and having a pair of electrodes on the second surface side;
A translucent member covering at least one of the side surfaces and a part of the side where the at least one side surface and the second surface are in contact with each other so as to expose one or more of the plurality of corner portions; ,
A cover member that covers the exposed corners of the light emitting element and an outer surface of the translucent member so as to expose the pair of electrodes;
The light-emitting device whose thermal expansion coefficient of the said covering member is lower than the thermal expansion coefficient of the said translucent member.
(Aspect 3)
The light emitting device according to aspect 1 or 2, wherein the outer surface of the translucent member is inclined outward from the second surface side of the light emitting element toward the first surface side.
(Aspect 4)
The light emitting element has a substantially rectangular parallelepiped shape having four corners,
The light-emitting device according to any one of aspects 1 to 3, wherein two of the four corners positioned diagonally are covered with the covering member.
(Aspect 5)
The light emitting element has a substantially rectangular parallelepiped shape having four corners,
The two adjacent corners of the four corners and a part of the side between the two adjacent corners are covered with the covering member according to any one of aspects 1 to 3. Light emitting device.
(Aspect 6)
The light emitting device according to aspect 4 or 5, wherein all of the four corners are covered with the covering member.
(Aspect 7)
The light emitting element includes a translucent substrate and a semiconductor laminate,
The light emitting device according to any one of aspects 1 to 6, wherein the translucent substrate is disposed on the first surface side of the light emitting element, and the semiconductor stacked body is disposed on the second surface side. .
(Aspect 8)
The light-emitting device according to any one of aspects 1 to 7, wherein the translucent member is made of a translucent resin, and the covering member is made of a light-reflective resin.
(Aspect 9)
The translucent member has a first surface flush with the first surface of the light emitting element,
The light emitting device according to any one of aspects 1 to 8, wherein the first surface of the light emitting element and the first surface of the translucent member are covered with a wavelength conversion member.
(Aspect 10)
The light emitting device according to any one of aspects 1 to 9, wherein the first surface of the light emitting element is covered with the light transmissive member.
(Aspect 11)
Preparing a wavelength converting member;
Disposing the light emitting element on the wavelength conversion member such that the first surface of the light emitting element faces the second surface of the wavelength conversion member;
Forming a translucent member so as to cover a part of the side surface of the light emitting element and to expose at least one corner of the light emitting element;
Forming a covering member so as to cover an outer surface of the light transmissive member and the at least one corner of the light emitting element exposed from the light transmissive member.
(Aspect 12)
The step of forming the translucent member includes:
Disposing a liquid resin material on the wavelength conversion member;
The manufacturing method according to aspect 11, including disposing the light emitting element on the liquid resin material, and curing the liquid resin material to form the translucent member.
(Aspect 13)
The step of preparing the wavelength conversion member includes:
The manufacturing method of the aspect 11 or 12 including providing a through-hole in a coating material layer, and forming a fluorescent substance containing member in the said through-hole.
(Aspect 14)
The manufacturing method according to any one of aspects 11 to 13, wherein a difference in thermal expansion coefficient between the covering member and the light emitting element is smaller than a difference in thermal expansion coefficient between the translucent member and the light emitting element.

10, 15, 17 Light emitting device 11 First surface (upper surface) of light emitting device
12 Second surface (lower surface) of light-emitting device
20, 207 Light emitting element 21 First surface (upper surface) of light emitting element
22 Second surface (lower surface) of light-emitting element
23 Light Emitting Element Sides 241, 242, 243, 244 Light Emitting Element Corners 251, 252 Electrode 30 Translucent Member 33 Translucent Member Outer Surface 40 Covering Member 50 Wavelength Conversion Member 500 Wavelength Conversion Sheet 502 Phosphor-Containing Member 510 Wavelength conversion layer

Claims (11)

A first surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface, wherein the second surface and the second surface A light-emitting element having a plurality of corner portions in contact with two of the plurality of side surfaces, and having a pair of electrodes on the second surface side;
A part of at least one of the side surfaces, a part of a side where the at least one side surface and the second surface are in contact with each other, and the at least one side surface so as to expose one or more of the plurality of corners. And a translucent member that covers a part of the side that is in contact with the side surface adjacent thereto,
A cover member that covers the exposed corners of the light emitting element and an outer surface of the translucent member;
A light emitting device, wherein a difference in thermal expansion coefficient between the covering member and the light emitting element is smaller than a difference in thermal expansion coefficient between the translucent member and the light emitting element. A first surface, a second surface opposite to the first surface, and a plurality of side surfaces between the first surface and the second surface, wherein the second surface and the second surface A light-emitting element having a plurality of corner portions in contact with two of the plurality of side surfaces, and having a pair of electrodes on the second surface side;
A part of at least one of the side surfaces, a part of a side where the at least one side surface and the second surface are in contact with each other, and the at least one side surface so as to expose one or more of the plurality of corners. And a translucent member that covers a part of the side that is in contact with the side surface adjacent thereto,
A cover member that covers the exposed corners of the light emitting element and an outer surface of the translucent member;
The light-emitting device whose thermal expansion coefficient of the said covering member is lower than the thermal expansion coefficient of the said translucent member.   3. The light emitting device according to claim 1, wherein the outer surface of the translucent member is inclined outwardly from the second surface side of the light emitting element toward the first surface side. The light emitting element has a substantially rectangular parallelepiped shape having four corners,
The light-emitting device according to any one of claims 1 to 3, wherein two of the four corners positioned diagonally are covered with the covering member. The light emitting element has a substantially rectangular parallelepiped shape having four corners,
The adjacent two of the four corners and a part of the side between the two adjacent corners are covered with the covering member. The light emitting device according to 1.   The light emitting device according to claim 4 or 5, wherein all of the four corners are covered with the covering member. The light emitting element includes a translucent substrate and a semiconductor laminate,
The said translucent board | substrate is arrange | positioned at the said 1st surface side of the said light emitting element, and the said semiconductor laminated body is arrange | positioned at the said 2nd surface side. Light-emitting device.   The light-emitting device according to claim 1, wherein the translucent member is made of a translucent resin, and the covering member is made of a light-reflective resin. The translucent member has a first surface flush with the first surface of the light emitting element,
The light emitting device according to any one of claims 1 to 8, wherein the first surface of the light emitting element and the first surface of the translucent member are covered with a wavelength conversion member. Wherein the first surface of the light emitting element, the light emitting device according to any one of claims 1 to 8 is covered on the translucent member.   The light emitting device according to claim 1, wherein side surfaces of the pair of electrodes are covered with the covering member.

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