JP6627316B2 - Light emitting device manufacturing method - Google Patents

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  2. Description of the Related Art In recent years, light emitting diodes have been used in various forms in the general lighting field, the on-board lighting field, and the like with an increase in output. For example, as a high-output light-emitting device, there is known a light-emitting device in which a plate-shaped transparent member surrounded by a white ceramic outer frame and a light-emitting element (light-emitting diode) are joined via a phosphor-containing resin layer. (Patent Document 1).

JP-A-2012-134355

  In a conventional light emitting device, a joining member (phosphor-containing resin layer) is used when joining a light emitting element and a translucent member (plate-shaped transparent member). There is a possibility that it spreads in a plan view. If the joining member is wider than the intended range, the position of the light emitting element may shift when joining the light emitting element and the translucent member. Generally, when the joining member is hardened, it shrinks toward the center of the joining member. If the joining member is wider than the target range, the center of the joining member may be shifted from the target position. When the center of the joining member is displaced from the target position, when the joining member contracts due to curing, the light emitting element may be pulled by the joining member and the mounting position of the light emitting element may shift. Therefore, there is a need for a light emitting device in which the spread of the joining member is suppressed. In addition, if the spread of the joining member is suppressed, the center position of the joining member can be easily placed in a targeted range, so that the displacement of the light emitting element can be reduced. Therefore, an embodiment according to the present invention aims to provide a method for manufacturing a light emitting device in which the spread of a joining member is suppressed.

(1) In the method for manufacturing a light emitting device according to the embodiment of the present invention, the first surface, the second surface that is the back surface of the first surface, the first surface, and the second surface A translucent member having a side surface between the first side surface, a first light reflecting member disposed on a part of the side surface, and another part of the side surface located around the first surface. Preparing a covering member disposed on the upper surface of the first light reflecting member; and emitting light using a bonding member having a wettability with respect to the covering member that is lower than the wettability with respect to the first light reflecting member. Bonding an element to the first surface.
(2) In the method for manufacturing a light emitting device according to the embodiment of the present invention, the first surface, the second surface that is the back surface of the first surface, the first surface, and the second surface A translucent member having a side surface between the first side surface, a first light reflecting member disposed on a part of the side surface, and another part of the side surface located around the first surface. A step of preparing a coating member that is disposed on the upper surface of the first light reflection member and is formed by at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane; Bonding the light emitting element to the first surface using a bonding member formed of a silicone resin.
(3) The method for manufacturing a light emitting device according to the embodiment of the present invention includes: a light transmitting member having a first surface; a second surface that is a back surface of the first surface; Providing a covering member that covers the first surface so that at least a part of the surface is exposed; and a joining member having a wettability with respect to the covering member that is worse than the wettability with respect to the light-transmitting member. Using, the step of joining the light emitting element and the exposed first surface, the step of removing the covering member, the side face of the light emitting element, the translucent member, and the joining member, Forming a covering second light reflecting material.
(4) The method for manufacturing a light emitting device according to an embodiment of the present invention includes: a light transmitting member having a first surface; a second surface that is a back surface of the first surface; A coating member formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, covering the first surface so that at least a part of the surface is exposed; Preparing a light-emitting element, bonding the light-emitting element to the first surface using a bonding member made of a silicone resin, removing the covering member, a side surface of the light-emitting element, Forming a second light reflecting material covering the member and the joining member.

  According to one embodiment of the present invention, it is possible to provide a method for manufacturing a light emitting device in which the spread of a joining member is suppressed.

FIG. 1A is a plan view showing a process 1-1, and FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A. FIG. 2A and FIG. 2B are cross-sectional views illustrating Step 1-1-1. FIG. 3A to FIG. 3D are cross-sectional views illustrating Step 1-1-2. FIGS. 4A and 4B are cross-sectional views illustrating a modification of the step 1-1. 5A to 5C are cross-sectional views illustrating Step 1-2. FIGS. 6A and 6B are cross-sectional views showing the steps 1-3. FIG. 7A and FIG. 7B are cross-sectional views showing steps 1-4. FIG. 8A is a plan view showing Step 1-5, and FIG. 8B is a cross-sectional view taken along line BB of FIG. 8A. FIG. 9A is a plan view showing a step 1-5, FIG. 9B is a cross-sectional view taken along line CC of FIG. 9A, and FIG. It is sectional drawing shown about process 1-5. FIG. 10A is a plan view illustrating Step 2-1. FIG. 10B is a cross-sectional view taken along line DD of FIG. 10A. FIG. 11A and FIG. 11B are cross-sectional views illustrating Step 2-1. FIGS. 12A and 12B are cross-sectional views illustrating a modification of the process 2-1. FIGS. 13A to 13C are cross-sectional views illustrating Step 2-2. FIGS. 14A and 14B are cross-sectional views illustrating Step 2-3. FIGS. 15A and 15B are cross-sectional views illustrating Step 2-4. FIG. 16A is a plan view illustrating Step 2-5, and FIG. 16B is a cross-sectional view taken along line EE of FIG. 16A. FIG. 17A is a plan view illustrating the step 2-5, FIG. 17B is a cross-sectional view taken along line FF of FIG. 17A, and FIG. It is sectional drawing shown about process 2-5.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction or position (for example, “above”, “below”, and other terms including those terms) are used as necessary. The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of the terms. The same reference numerals in a plurality of drawings denote the same parts or members.

<Method 1 for manufacturing light emitting device>
The manufacturing method of the light emitting device 1000 according to the present embodiment will be described with reference to FIGS. The first light reflecting member 10 and the covering member 20 are placed on a supporting member 30 made of a heat-resistant sheet or the like.

Step 1-1. 1. Preparing a Translucent Member, a First Light Reflecting Member, and a Covering Member As shown in FIG. 1B, a first surface 401 and a second surface that is a back surface of the first surface 401 402, a light transmitting member 40 having a side surface 403 between the first surface 401 and the second surface 402, and a first light disposed on a part of the side surface 403 of the light transmitting member 40. Prepare the reflecting member 10 and the covering member 20 which is located around the first surface 401 and is disposed on another part of the side surface 403 of the light transmitting member 40 and the upper surface of the first light reflecting member 10. I do.

  In other words, as shown in FIG. 1A, the first light reflecting member 10 has a through hole, and the light transmitting member 40 is disposed in the through hole of the first light reflecting member 10. The first light reflecting member 10 is not disposed on at least a part of the side surface of the light transmitting member 40 on the first surface 401 side. Then, the covering member 20 is disposed on the side surface 403 of the light transmitting member on which the first light reflecting member 10 is not disposed. The light transmitting member 40, the first light reflecting member 10, and the covering member 20 are prepared.

  In other words, one surface of the covering member 20 and one surface of the first light reflecting member 10 are disposed in contact with each other. Further, there is a through-hole penetrating the first light reflecting member 10 and the covering member 20, and the translucent member 40 is disposed in the through-hole. That is, the first light reflecting member 10 and the covering member 20 are arranged on the side surface 403 of the light transmitting member 40. The covering member 20 is disposed on the side surface 403 of the light transmitting member 40 on the first surface 401 side, and the first light reflecting member 10 is disposed on the side surface 403 of the light transmitting member 40 on the second surface 402 side. Be placed. The light transmitting member 40, the first light reflecting member 10, and the covering member 20 are prepared.

Step 1-1-1. Disposing the translucent member in the through holes of the first light reflecting member and the covering member. The translucent member 40, the first light reflecting member 10, and the covering member 20 shown in FIG. 1B are prepared. An example of the process will be described. The translucent member 40 is a member that is joined to a light extraction surface of a light emitting element described below via a joining member, and is formed of a material that transmits light emitted from the light emitting element. As a material of the translucent member 40, a resin material that is liquid before curing is particularly preferable. When the light-transmitting member 40 is in a liquid state before being cured, first, as shown in FIG. 2A, the first light reflecting member 10 and the covering member 20 having the through holes 105 formed on the supporting member 30 are removed. prepare.

  When preparing the first light reflecting member 10 having the through hole 105 and the covering member 20, first, the first light reflecting member 10 having no through hole 105 and the covering member 20 not having the through hole 105 are separated. It is preferable to stick them together. Note that the shape of the first light reflecting member 10 is preferably a plate or a sheet. In the case of a plate or a sheet, the first light reflecting member 10 and the covering member 20 are easily bonded to each other because there are almost no irregularities. Further, the shape of the light-emitting device singulated by the singulation step described later can be made substantially the same. Further, the shape of the covering member 20 is also preferably a plate shape or a sheet shape. This makes it easier to bond the first light reflecting member 10 and the covering member 20 together.

  Next, a through-hole 105 that penetrates the bonded first light reflecting member 10 and the covering member 20 is formed. For example, when the through-hole 105 is formed by punching, it is preferable to form the through-hole 105 that penetrates the first light reflecting member 10 and the covering member 20 at one time by punching. Note that, even when the through-hole 105 is formed by laser light irradiation or the like other than punching, it is preferable to form the through-hole 105 that passes through the first light reflecting member 10 and the covering member 20 at one time. By doing so, the positional deviation of the through hole of the first light reflecting member 10 and the through hole of the covering member 20 in plan view can be reduced. In addition, since the through-hole of the first light reflecting member 10 and the through-hole of the covering member 20 are formed in the same step, the number of steps can be reduced.

  The first light reflecting member 10 having the through hole and the covering member 20 having the through hole may be separately prepared. Then, by bonding the first light reflecting member and the covering member 20 so that the through hole of the first light reflecting member 10 and the through hole of the covering member 20 are connected, the through hole 105 shown in FIG. You may prepare the 1st light reflection member 10 and the covering member 20 which have.

  When forming the through-hole of the first light reflecting member 10 and the through-hole of the covering member, any of the methods known in the art may be used. For example, punching, etching, blasting, laser light irradiation, and the like can be given.

  Further, the first light reflecting member 10 having the through hole 105 may be formed by compression molding, transfer molding, or injection molding using a mold. By forming in this manner, it is possible to prevent variations in the shape of the through hole of the first light reflecting member 10.

  Next, as shown in FIG. 2B, it is preferable that the liquid-state light-transmitting member 40 be disposed in the through-hole 105 and the light-transmitting member 40 be cured. By doing so, the shape of the translucent member 40 can be made substantially the same as the shape of the through-hole 105, so that variation in shape can be suppressed. In particular, when the material of the translucent member 40 is a thermosetting resin, a plurality of translucent members 40 can be simultaneously cured and formed by applying heat to the uncured translucent members 40 arranged in the through holes. .

  As a method of arranging the translucent member 40 in each through hole 105, any of the methods known in the art may be used. For example, printing, potting and the like can be mentioned.

Step 1-1-2. A covering member having a through hole is disposed on the upper surface of the first light reflecting member and / or the light transmitting member. Next, the light transmitting member 40, the first light reflecting member 10, and the covering member shown in FIG. 20 is shown. As shown in FIG. 3A, a first light reflecting member 10 having a through hole formed on the support member 30, and a light transmitting member 40 disposed in the through hole of the first light reflecting member 10. Prepare As described above, the light transmitting member 40 is formed by injecting the liquid light transmitting member 40 into the through hole of the first light reflecting member 10 and curing the light transmitting member 40 as described above. May be.

  Then, as shown in FIG. 3B, the covering member 20 is disposed on the upper surface of the first light reflecting member 10. As a method of arranging the covering member 20, when the covering member 20 has an adhesive property, the covering member 20 may be arranged by being attached to the upper surface of the first light reflecting member 10. Further, the covering member 20 may be disposed by forming the covering member 20 on the upper surface of the first light reflecting member 10 by printing, spraying, or the like. By doing so, a step is generated between the first surface 401 of the translucent member 40 and the upper surface of the covering member 20, so that when a joining member described later spreads, the spread can be further suppressed by the step. Further, as shown in FIG. 3B, the shape of the covering member 20 in plan view may be the same as the first light reflecting member 10. Since a joining member described later is formed to extend on the light transmitting member 40, the size of the light transmitting member 40 and the joining member in a plan view can be made substantially the same. Thereby, the light extraction efficiency can be increased as compared with the case where the joining member is formed up to the upper surface of the first light reflecting member.

  Further, as shown in FIG. 3C, the covering member 20 may cover the upper surface of the first light reflecting member 10 and a part of the first surface 401 of the light transmitting member 40. By doing so, even if the translucent member 40 is enlarged to further increase the light extraction efficiency, the covering member 20 can suppress the bonding member from spreading in the x and y directions.

  As shown in FIG. 3D, the covering member 20 may cover only a part of the upper surface of the first light reflecting member 10. By doing so, even if the area of the light transmitting member 40 in plan view is smaller than the outer edge of the light emitting element, the joining member is formed by the first surface 401 and the first light reflecting member 10 of the light transmitting member 40. , It is possible to provide a light-emitting device with high parting performance while increasing the bonding strength. The presence of the covering member 20 can suppress the area of the joining member spreading on the upper surface of the first light reflecting member 10.

Modification 1 Modification of Translucent Member Prepared in Step 1-1, First Light Reflecting Member, and Covering Member Next, the translucent member 40 and the first light reflecting member 10 shown in FIG. , The coating member 20 and a modified example thereof. First, when reducing the thickness of the light emitting device, the portion above the line Ct1-Ct1 (broken line) in FIG. 2B may be removed to reduce the thickness as shown in FIG. That is, the first light reflecting member 10 and a part of the light transmitting member 40 may be removed to reduce the thickness in the z direction.

  Further, as shown in FIG. 4B, the translucent member 40 may include a wavelength conversion member 41 that absorbs light from the light emitting element and emits light having a wavelength different from the output light from the light emitting element. Good. With the wavelength conversion member 41, the wavelength of light emitted from the light emitting element can be converted. Thereby, light of various chromaticities can be obtained. For example, a yellow phosphor may be used as the wavelength conversion member 41 for a light emitting element that emits blue light. In this manner, white light can be obtained by mixing the blue light emitted from the light emitting element and the yellow light emitted from the wavelength conversion member 41 excited by the blue light emitted from the light emitting element.

  As shown in FIG. 4B, the light transmitting member 40 may contain a light diffusing material 42 for diffusing light from the light emitting element. Light emitted from the light emitting element is diffused into the light transmitting member 40 by the light diffusing material 42, so that luminance unevenness can be suppressed.

  In addition, both the wavelength conversion member 41 and the light diffusing material 42 may be contained in the translucent member 40, or may be contained alone. The translucent member 40 may contain two or more wavelength conversion members and / or two or more light diffusing materials.

  The shape of the translucent member 40 in a plan view includes a shape including a curve such as a circle, an ellipse, a semicircle, a semiellipse, and the like, a polygon such as a triangle and a quadrangle, and an irregular shape such as T and L. Any shape may be used.

Step 1-2. Step of Joining Light-Emitting Element and Translucent Member As shown in FIG. 5A, the joining member 60 before curing is arranged on the first surface 401 of the translucent member 40. When arranging the joining member 60, any of the methods known in the art may be used. For example, potting, printing, transfer, spraying and the like can be mentioned. Next, as shown in FIG. 5B, the light emitting element 50 is disposed on the bonding member 60 before curing, or the light emitting element 50 is pressed after being disposed, and then the bonding member 60 is cured. Form. That is, the light emitting element 50 and the first surface 401 of the translucent member 40 are joined via the joining member 60.

  In the step of preparing the translucent member 40, the first light reflecting member 10, and the covering member 20, as shown in FIG. 2B, the supporting member 30 and the covering member 20 are arranged so as to face each other. 5A, the vertical direction of the light transmitting member 40, the first light reflecting member 10, and the covering member 20 is changed as shown in FIG. 5A. That is, the covering member 20 is arranged on the upper surface. At this time, the support member 30 may be changed to another support member before and after changing the vertical direction of the translucent member 40, the first light reflection member 10, and the covering member 20.

  Further, it is preferable to use a bonding member 60 that has a lower wettability to the covering member 20 than a wettability to the first light reflecting member 10. In this specification, poor wettability means that the contact angle is large. That is, the bonding member 60 having a wettability to the covering member 20 lower than the wettability to the first light reflecting member 10 means that the contact angle between the bonding member 60 before the curing and the covering member 20 is smaller than the bonding member 60 before the curing. Is larger than the contact angle between the first light reflection member 10 and the first light reflection member 10. The contact angle between the joining member 60 before curing and the covering member 20 is obtained by drawing a tangent to a curved surface of the joining member 60 before curing from a portion where the joining member 60 before curing and the covering member 20 come into contact with air. At this time, it is the angle between the tangent and the surface of the covering member 20. Further, the contact angle between the joining member 60 before curing and the first light reflecting member 10 is determined from the part where the joining member 60 before curing and the first light reflecting member 10 come into contact with air. When a tangent is drawn on the curved surface, the angle is formed between the tangent and the surface of the covering member 20. In addition, the contact angle in this specification refers to a value measured by a static drop method at 20 ° C. to 35 ° C., which is a temperature at which the light emitting element 50 and the light transmitting member 40 are joined.

  The difference between the contact angle between the joining member 60 before curing and the covering member 20 and the contact angle between the joining member 60 before curing and the first light reflecting member 10 is not particularly limited, but the joining before curing. The contact angle between the member 60 and the covering member 20 is preferably 10 ° or more, more preferably 20 ° or more, more preferably 30 ° or more than the contact angle between the bonding member 60 and the first light reflecting member 10 before curing. Larger is more preferable.

  By doing so, the area where the joining member 60 spreads over the covering member 20 can be made smaller than the area where the joining member 60 spreads over the first light reflecting member 10 without the covering member 20. That is, the presence of the covering member 20 can suppress the spread of the joining member 60. Since the spread of the joining member 60 is suppressed, it is possible to prevent the mounting position of the light emitting element from being shifted.

  When the joining member 60 is made of a silicone resin, the covering member 20 is at least selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, which are materials having poor wettability with respect to the silicone resin. It is preferable to be formed by one kind. Selecting the material of the covering member 20 can also prevent the joining member 60 from spreading on the covering member 20. Since the spread of the joining member 60 is suppressed, it is possible to suppress the mounting position of the light emitting element 50 from being shifted.

  When the joining member 60 and the first light reflecting member 10 include a silicone resin, it is preferable that the covering member 20 is formed of a material having low wettability with respect to the silicone resin. Since the joining member 60 and the first light reflecting member 10 include a silicone resin, the joining member 60 moves over the first light reflecting member 10 when the covering member 20 is not provided, compared with the area where the joining member 60 spreads over the covering member 20. The spreading area increases. That is, the presence of the covering member 20 having poor wettability with respect to the silicone resin can further suppress the spread of the joining member 60. In this specification, poor wettability means that the contact angle is 90 ° or more.

  Alternatively, the amount of the joining member 60 may be adjusted so that the joining member 60 is not formed on the upper surface of the covering member 20 as shown in FIG. In addition, since the covering member 20 has worse wettability of the joining member 60 than the first light reflecting member 10, it is difficult for the joining member 60 to be formed on the upper surface of the covering member 20. Further, as shown in FIG. 5C, the joining member 60 may be formed on the upper surface of the covering member 20. As shown in FIG. 5C, even if the joining member 60 is formed on the upper surface of the covering member 20, the spread of the joining member 60 is suppressed, so that the area of the joining member in a plan view can be reduced.

  Further, after the light emitting element 50 is disposed on the bonding member 60, the viscosity and the amount of the bonding member 60 are adjusted so that the bonding member 60 crawls on the side surface of the light emitting element 50 when pressing the light emitting element 50. Is preferred. By doing so, the joining member 60 covers the side surface 503 of the light emitting element 50 and spreads downward as shown in FIGS. 5B and 5C. In other words, the cross-sectional area of the bonding member 60 increases from the electrode forming surface 502 (upper surface) of the light emitting element 50 to be described later toward the light extraction surface 501 (lower surface). The joining member 60 not only joins the light emitting element 50 and the translucent member 40 but also allows the light emitted from the light emitting element 50 to pass through the joining member 60, so that the joining member 60 covers the side surface 503 of the light emitting element 50 to cover the light emitting element 50. By extracting the light from the electrode forming surface 502 (upper surface) to the light extracting surface 501 (lower surface), the light emitted from the light emitting element can be more efficiently extracted.

  The light emitting element 50 includes a light transmitting substrate 51 and a semiconductor laminate 52 formed on the upper surface side of the light transmitting substrate 51. The light-emitting element 50 includes a light extraction surface 501 (lower surface) on the light-transmitting substrate 51 side, an electrode formation surface 502 (upper surface) which is a back surface of the light extraction surface, and a pair of electrodes 53 on the electrode formation surface 502 (upper surface). 54. Each of the two electrodes 53 and 54 forming a pair of electrodes can be formed in an arbitrary shape. The light extraction surface 501 of the light emitting element 50 and the first surface 401 of the translucent member 40 are joined via the joining member 60.

  Note that the light extraction surface 501 of the light emitting element 50 indicates a surface of the light emitting element 50 opposite to the surface facing the base when the light emitting element 50 is mounted on the base. In other words, when the light-emitting element 50 is mounted face-down, the surface opposite to the surface of the light-emitting element 50 having the electrode is shown. In the case where the light-emitting element 50 is mounted face-up, the surface of the light-emitting element 50 having electrodes is shown. The surface having the electrodes is referred to as an electrode formation surface. Further, in this specification, the “electrode formation surface” of the light emitting element 50 refers to the surface of the light emitting element 50 in a state where the electrodes 53 and 54 are not included. In the present embodiment, the electrode forming surface 502 coincides with the lower surface of the semiconductor stacked body 52.

  Further, it is preferable that the area of the light transmitting member 40 be larger than the area of the light emitting element 50 in a plan view. With this configuration, when the light emitted from the light emitting element 50 passes through the light transmitting member 40, the first light reflecting member is smaller than when the area of the light transmitting member 40 is smaller than the area of the light emitting element 50. It is possible to reduce the amount of light that falls on 10. Thus, light loss can be reduced.

Step 1-3. Step of Removing Covering Member Next, the covering member 20 is removed as shown in FIG. Since the covering member 20 is a material having poor wettability, a second light reflecting member that covers the side surface of the light emitting element 50, which will be described later, the first light reflecting member 10, and the joining member 60 is formed. The interface of the reflection member is easily peeled off. Therefore, it is preferable to remove the covering member 20. Note that it is preferable that the size of the through hole of the covering member 20 be larger than the outer edge of the light emitting element 50 because the covering member 20 is easily removed.

  When the joining member 60 is also formed on the covering member 20 as shown in FIG. 5C, the joining member 60 is formed on the covering member 20 as shown in FIG. A part of the joined member 60 can also be removed. That is, even if the joining member 60 is formed so as to expand in plan view, the area of the joining member 60 in plan view can be reduced by removing a part of the joining member 60. By doing so, the thickness of the second light reflecting member in the lateral direction can be increased by the amount corresponding to the removal of the bonding member 60 without changing the size of the light emitting device. It is possible to prevent light from passing through a thin portion of the second light reflection member described later through the member 60. Further, the portion where the joining member 60 is disposed on the upper surface of the first light reflecting member 10 can be reduced. By doing so, the light emitted from the light emitting element 50 is suppressed from hitting the upper surface of the first light reflecting member 10 through the bonding member 60, so that the light extraction efficiency can be improved.

  The thickness of the covering member 20 is not particularly limited, but is preferably 10 to 150 μm. If the thickness of the covering member 20 is too thin, the covering member 20 may be broken at the time of removing the covering member 20, and if the thickness of the covering member 20 is too large, the cost of the covering member 20 increases or the covering member 20 is peeled off. This is because it may be difficult to remove them.

Step 1-4. Step of Forming Second Light Reflecting Material As shown in FIG. 7A, the second light reflecting member 70 that covers the side surface 503 of the light emitting element 50, the first light reflecting member 10, and the joining member 60 is formed. . When forming the second light reflecting member 70, any of the methods known in the art may be used. For example, compression molding, transfer molding, injection molding and the like can be mentioned. Note that the side surface 503 of the light emitting element 50 may be covered by the second light reflecting member 70 via the joining member 60. Further, a portion of the electrode forming surface 502 of the light emitting element 50 that is not covered by the electrodes 53 and 54 may be covered by the second light reflecting member 70. At this time, the thickness (dimension in the z direction) of the second light reflecting member 70 may be adjusted so that a part of the electrodes 53 and 54 is exposed from the second light reflecting member 70.

  Further, as shown in FIG. 7B, a second light reflecting member 70 having a thickness to bury the electrodes 53 and 54 may be formed. Thereafter, the portion above the line Ct2-Ct2 (broken line) in FIG. 7B is removed. That is, a part of the second light reflecting member 70 is removed to expose the electrodes 53 and 54 of the light emitting element. When removing the second light reflecting member 70, any of the methods known in the art may be used. For example, etching, cutting, grinding, polishing, blasting and the like can be mentioned.

Step 1-5. Separation of Light Emitting Device There are a plurality of light emitting elements 50, and the first light reflecting member 10 and the second light reflecting member 70 between the light emitting element 50 and the adjacent light emitting element 50 are cut. In other words, along the broken line X1, broken line X2, broken line X3 and broken line X4 passing through the middle of the adjacent light emitting element 50 shown in FIG. 8A, the first light reflecting member 10 as shown in FIG. The second light reflecting member 70 and the supporting member 30 are cut by a dicer or the like. Thereby, as shown in FIG. 9A, the light emitting device can be divided into individual pieces. Finally, the light emitting device 1000 is obtained by removing (peeling) the support member 30 as shown in FIG. 9B.

  Further, when cutting the first light reflecting member 10, the second light reflecting member 70, and the supporting member 30, it is preferable that the supporting member 30 is not completely cut. That is, as shown in FIG. 9C, the first light reflecting member 10 and the second light reflecting member 70 are separated into individual pieces by the cutting portion 101, and the support member 30 is not separated into individual pieces. preferable. By doing so, since the support member 30 is not divided into a plurality, the support member 30 can be removed (peeled) at a time. Note that the support member 30 may be removed before cutting, and then the first light reflecting member 10 and the second light reflecting member 70 may be cut. Thus, a plurality of light emitting devices 1000 each including one light emitting element 50 can be manufactured. Further, the cutting may be performed at a position including the plurality of light emitting elements 50.

<Light-emitting device manufacturing method 2>
A method of manufacturing the light emitting device 2000 will be described with reference to FIGS. The difference from the light emitting device 1000 is that the first light reflecting member 10 is not disposed on the side surface of the light transmitting member 40. The other points are the same as those of the light emitting device 1000. The translucent member 40 is placed on a support member 30 made of a heat-resistant sheet or the like.

Step 2-1. Preparing a Light-Transmissive Member and a Covering Member As shown in FIG. 10B, a light-transmitting member having a first surface 401 and a second surface 402 which is a back surface of the first surface 401. The sex member 40 and the covering member 20 that covers the first surface so that at least a part of the first surface is exposed are prepared.

  In other words, the covering member 20 having the through-hole is arranged on the first surface 401 of the translucent member 40. In addition, as shown in FIG. 10A, the first surface of the light transmitting member 40 located in the through hole of the covering member 20 is exposed from the covering member 20. Such a translucent member 40 and the covering member 20 are prepared.

Step 2-1-1. Placing the covering member on the first surface of the translucent member An example of the process of preparing the translucent member 40 and the covering member 20 shown in FIG. First, as shown in FIG. 11A, the light transmitting member 40 is formed on the support member 30. Thereafter, as shown in FIG. 11B, the covering member 20 is disposed on the first surface 401 of the light transmitting member 40. Regarding the arrangement method of the covering member 20, when the covering member 20 has an adhesive property, the covering member 20 may be arranged by bonding to the first surface 401 of the translucent member 40. Alternatively, the cover member 20 may be disposed by forming the cover member 20 on the first surface 401 of the translucent member 40 by printing, spraying, or the like. The covering member 20 covers the first surface of the light transmitting member 40 so that at least a part of the first surface 401 is exposed.

  Note that the shape of the translucent member 40 is preferably a plate or a sheet. When the translucent member 40 and the covering member 20 are attached to each other, if the translucent member 40 has a plate shape or a sheet shape, there is almost no unevenness, so that the translucent member 40 can be easily attached to the covering member 20. Further, the shape of the light-emitting device singulated by the singulation step described later can be made substantially the same. Further, the shape of the covering member 20 is also preferably a plate shape or a sheet shape. Since the covering member 20 has a through-hole, the shape of the covering member 20 may be a plate or a sheet, assuming that the inside of the through-hole is filled with the covering member 20. This makes it easier to bond the first light reflecting member 10 and the covering member 20 together.

Modification 2 Modification of Translucent Member and Covering Member Prepared in Step 2-1 Next, an example of a modification of the translucent member 40 and the covering member 20 shown in FIG. 10B will be described. First, in the case where the light emitting device is made thinner, the portion above the line Ct3-Ct3 (broken line) in FIG. 11B may be removed. In other words, after removing the translucent member 40 and reducing the thickness in the z direction, the covering member 20 may be disposed on the first surface 401 of the translucent member 40 as shown in FIG. Good. In addition, as shown in FIG. 12B, the light transmitting member 40 may include a wavelength conversion member 41 and / or a light diffusing material 42.

Step 2-2. Step of Joining Light-Emitting Element and Translucent Member As shown in FIG. 13A, the joining member 60 before curing is arranged on the first surface 401. When arranging the joining member 60, any of the methods known in the art may be used. For example, potting, printing, transfer, spraying and the like can be mentioned. Next, as illustrated in FIG. 13B, the light emitting element 50 is disposed on the bonding member 60 before curing, or the light emitting element 50 is pressed after being disposed, and then the bonding member 60 is cured. Form. That is, the light emitting element 50 and the first surface 401 of the translucent member 40 are joined via the joining member 60.

  Further, it is preferable to use a bonding member 60 that has a lower wettability to the covering member 20 than a wettability to the translucent member 40. The bonding member 60 whose wettability to the covering member 20 is lower than the wettability to the translucent member 40 means that the contact angle between the bonding member 60 before curing and the covering member 20 is different from that of the bonding member 60 before curing. Means larger than the contact angle with the conductive member 40. The contact angle between the joining member 60 before curing and the translucent member 40 is defined as the angle between the contact between the joining member 60 before curing and the translucent member 40 and air from the curved surface of the joining member 60 before curing. When a tangent is drawn, it is the angle between the tangent and the surface of the covering member 20.

  The difference between the contact angle between the joining member 60 before curing and the covering member 20 and the contact angle between the joining member 60 before curing and the translucent member 40 is not particularly limited, but the joining member before curing. The contact angle between 60 and the covering member 20 is preferably 10 ° or more, more preferably 20 ° or more, more preferably 30 ° or more than the contact angle between the bonding member 60 and the translucent member 40 before curing. Is more preferred.

  By doing so, the area where the joining member 60 spreads over the covering member 20 can be made smaller than the area where the joining member 60 spreads over the translucent member 40 when there is no covering member in plan view. . That is, the presence of the covering member 20 can suppress the spread of the joining member 60. Since the spread of the joining member 60 is suppressed, the displacement of the mounting position of the light emitting element 50 can be suppressed.

  When the joining member 60 is made of a silicone resin, it is preferable that the covering member is formed of the same material having poor wettability with respect to the silicone resin described above. Selecting the material of the covering member 20 can also prevent the joining member 60 from spreading on the covering member 20. Since the spread of the joining member 60 is suppressed, it is possible to suppress the mounting position of the light emitting element from being shifted.

  When the joining member 60 and the translucent member 40 include a silicone resin, it is preferable that the covering member 20 is further formed of the same material having poor wettability with respect to the silicone resin described above. Since the joining member 60 and the translucent member 40 include a silicone resin, the joining member 60 moves over the first light reflecting member when the covering member 20 is not provided, compared with the area where the joining member 60 spreads over the covering member 20. The spreading area increases. That is, the presence of the covering member 20 having poor wettability with respect to the silicone resin can further suppress the spread of the joining member 60.

  Further, as shown in FIG. 13B, a step is generated between the first surface 401 of the light transmitting member 40 and the upper surface of the covering member 20, so that when the joining member 60 spreads, the spread is further suppressed by the step. it can.

  Further, the amount of the joining member 60 may be adjusted so that the joining member 60 is not formed on the upper surface of the covering member 20 as shown in FIG. Since the covering member 20 has poorer wettability than the translucent member 40, the joining member 60 is less likely to be formed on the upper surface of the covering member 20. As shown in FIG. 13C, the joining member 60 may be formed on the upper surface of the covering member 20. As shown in FIG. 13C, even if the joining member 60 is formed on the upper surface of the covering member 20, the spread of the joining member 60 is suppressed, so that the area of the joining member 60 in a plan view can be reduced.

  Further, after the light emitting element 50 is disposed on the bonding member 60, the viscosity and the amount of the bonding member 60 are adjusted so that the bonding member 60 crawls on the side surface of the light emitting element 50 when pressing the light emitting element 50. Is preferred. By doing so, as shown in FIG. 13B, the bonding member 60 has a shape that covers the side surface of the light emitting element 50 and spreads downward. In other words, the cross-sectional area of the bonding member 60 increases from the electrode forming surface 502 (upper surface) of the light emitting element 50 to the light extraction surface 501 (lower surface). The joining member 60 not only joins the light emitting element 50 and the translucent member 40 but also allows light emitted from the light emitting element to pass through the joining member 60, so that the joining member 60 covers the side surface of the light emitting element 50 and the electrode of the light emitting element 50. By forming the shape expanding from the formation surface 502 (upper surface) to the light extraction surface 501 (lower surface), extraction of light emitted from the light emitting element 50 can be improved.

Step 2-3. Step of Removing Covering Member Next, the covering member 20 is removed as shown in FIG. Since the covering member 20 has poor wettability, a second light reflecting member that covers the side surface of the light emitting element 50, which will be described later, the first light reflecting member 10, and the bonding member 60 is formed. It is preferable to remove the covering member 20 because the interface between the members is easily separated.

  When the joining member 60 is also formed on the covering member 20 as illustrated in FIG. 13C, the joining member 60 is formed on the covering member 20 as illustrated in FIG. 14B by removing the covering member. A part of the joined member 60 can also be removed. That is, even if the joining member 60 is formed so as to expand in plan view, the area of the joining member 60 in plan view can be reduced by removing a part of the joining member 60. By doing so, the thickness of the second light reflecting member in the lateral direction can be increased by the amount corresponding to the removal of the bonding member 60 without changing the size of the light emitting device. Light can be prevented from passing through the thin portion of the second light reflection member 70 through the member 60.

Step 2-4. Step of Forming Second Light Reflecting Material As shown in FIG. 15A, a second light reflecting member 70 that covers the side surface 503 of the light emitting element 50, the translucent member 40, and the bonding member 60 is formed. When forming the second light reflecting member 70, any of the methods known in the art may be used. For example, compression molding, transfer molding, injection molding and the like can be mentioned. Note that the side surface 503 of the light emitting element 50 may be covered by the second light reflecting member 70 via the joining member 60. Further, a portion of the electrode forming surface 502 of the light emitting element 50 that is not covered by the electrodes 53 and 54 may be covered by the second light reflecting member 70. At this time, the thickness (dimension in the z direction) of the second light reflecting member 70 may be adjusted so that a part of the electrodes 53 and 54 is exposed from the second light reflecting member 70.

  Further, as shown in FIG. 15B, a second light reflecting member 70 having a thickness to bury the electrodes 53 and 54 may be formed. After that, the portion above the line Ct4-Ct4 (broken line) in FIG. 15B is removed. That is, the second light reflecting member 70 is removed, and the electrodes 53 and 54 of the light emitting element 50 are exposed. When removing the second light reflecting member 70, any of the methods known in the art may be used. For example, etching, cutting, grinding, polishing, blasting and the like can be mentioned.

Step 2-5. Separation of Light Emitting Device There are a plurality of light emitting elements 50, and the light transmitting member 40 and the second light reflecting member 70 between the light emitting element 50 and the adjacent light emitting element 50 are cut. That is, along the broken lines X5, X6, X7, and X8 passing through the middle of the adjacent light emitting elements 50 shown in FIG. 16A, the translucent member 40 as shown in FIG. The two-light reflecting member 70 and the supporting member 30 are cut by a dicer or the like. As a result, the light emitting device can be divided into individual pieces as shown in FIG. Finally, the light-emitting device 2000 is obtained by removing (peeling) the support member 30 as shown in FIG.

  Further, it is preferable that the support member 30 is not completely cut when the light transmitting member 40, the second light reflection member 70, and the support member 30 are cut. That is, as shown in FIG. 17C, the first light reflecting member 10 and the second light reflecting member 70 are separated into individual pieces by the cutting portion 101, and the support member 30 is not separated into individual pieces. preferable. By doing so, the support member 30 is not divided into a plurality of parts, so that the support member 30 can be removed (peeled) at a time. Note that the support member 30 may be removed before cutting, and then the light transmitting member 40 and the second light reflecting member 70 may be cut. Thereby, a plurality of light emitting devices each including one light emitting element 50 can be manufactured at the same time. Further, the cutting may be performed at a position including the plurality of light emitting elements 50.

Hereinafter, materials and the like suitable for the components of the manufacturing methods 1 and 2 will be described.
(Light emitting element 50)
As the light emitting element 50, for example, a semiconductor light emitting element such as a light emitting diode can be used. The semiconductor light emitting device can include a light transmitting substrate 51 and a semiconductor laminate 52 formed on one surface thereof.

(Translucent substrate 51)
The light-transmitting substrate 51 of the light-emitting element 50 transmits a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or spinel (MgA1 ₂ O ₄ ), or light emitted from the semiconductor laminate 52. Semiconductor material (for example, a nitride-based semiconductor material) can be used.

(Semiconductor laminate 52)
The semiconductor laminate 52 includes a plurality of semiconductor layers. An example of the semiconductor laminate 52 includes three semiconductor layers of a first conductivity type semiconductor layer (eg, an n-type semiconductor layer), a light emitting layer (active layer), and a second conductivity type semiconductor layer (eg, a p-type semiconductor layer). be able to. The semiconductor layer can be formed from a semiconductor material such as a III-V compound semiconductor and a II-VI compound semiconductor, for example. _{Specifically, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride semiconductor material (e.g., InN such, AlN, GaN, InGaN, AlGaN , InGaAlN Etc.) can be used.

(Electrodes 53, 54)
As the electrodes 53 and 54 of the light emitting element 50, a good electric conductor can be used, and for example, a metal such as Cu is preferable.

(First light reflection member 10)
The first light reflecting member may be a member having a reflectance of 60% or more, preferably 70% or more with respect to light from the light emitting element. By doing so, the light that reaches the first light reflecting member is reflected, and the light goes to the outside of the translucent resin, so that the light extraction efficiency of the light emitting device can be increased.

  Examples of the material of the first light reflection member include ceramic, resin, dielectric, pulp, glass, metal, and a composite material thereof. Among them, resins are preferred from the viewpoint that they can be easily formed into an arbitrary shape. Examples of the resin include a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, and a phenol resin, and a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, and a polynorbornene resin. In particular, a silicone resin excellent in light resistance and heat resistance is preferable.

  Further, in order to increase the reflectance of the first light reflecting member, it is preferable that the resin contains a light reflecting substance. The amount of the light-reflective substance to be contained is not particularly limited, but the light-reflective substance is 10 to 95% by weight, preferably 30 to 80% by weight, more preferably 30 to 80% by weight based on the weight of the first light-reflective member. Is preferably contained in an amount of about 40 to 70% by weight. In addition, it is preferable to form a first light reflecting member by dispersing a light reflecting substance in a resin, because processing such as etching, cutting, grinding, polishing, and blasting becomes easy.

  Light-reflective materials include titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, niobium oxide, barium sulfate, various rare earth oxides (eg, yttrium oxide, gadolinium oxide), and the like. Is mentioned.

(Second light reflection member 70)
The material of the second light reflecting member can be formed using the same material as the first light reflecting member. The material of the second light reflecting member may be the same as the material of the first light reflecting member, but may be changed according to required characteristics. For example, the content of the light reflective substance contained in the first light reflecting member and the second light reflecting member may be changed. Since the second light reflecting member covers the side surface of the light emitting element, the strength may be required more than the first light reflecting member. For this reason, when forming the first light reflecting member and the second light reflecting member from the resin containing the light reflecting material, the amount of the light reflecting material contained in the second light reflecting member is reduced to the second light reflecting member. The strength may be increased by reducing the amount of the light reflecting substance contained in one light reflecting member. By doing so, it is possible to increase the reflectance of the first light reflecting member which is required to have higher reflectivity. Further, since the first light reflecting member has a step of partially removing the first light reflecting member, strength may be required. In this case, the amount of the light reflecting substance contained in the first light reflecting member may be smaller than the amount of the light reflecting substance contained in the second light reflecting member. By doing so, the strength of the first light reflecting member can be made higher than the strength of the second light reflecting member. The first light reflecting member may be formed of a metal or a light reflecting material, and the second light reflecting member may be formed of a different material such as a resin containing the light reflecting material.

(Translucent member 40)
The translucent resin is a member disposed on the light extraction surface side of the light emitting element to protect the light emitting element from an external environment and to optically control light output from the light emitting element. The translucent member can be formed from a translucent material such as a translucent resin or glass. As the translucent resin, it is particularly possible to use a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, and a phenol resin, and a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, and a polynorbornene resin. it can. In particular, a silicone resin excellent in light resistance and heat resistance is preferable. Furthermore, a dimethyl-based silicone resin is excellent in reliability such as high-temperature resistance, and a phenyl-based silicone resin can increase the refractive index to increase the light extraction efficiency from the light emitting element. Further, it is preferable that the bonding member has a high light transmittance. In addition, a wavelength conversion member or a light diffusing material may be added to the translucent resin in order to impart desirable properties, or various fillers may be added to adjust the viscosity of the translucent member before curing. May be.

(Joining member 60)
The joining member is preferably formed from a light-transmitting material. As a material for the joining member, it can be formed using the same material as the above-described light-transmitting resin. Since the joining member is in contact with the side surface of the light emitting element, it is easily affected by heat generated in the light emitting element during lighting. Therefore, a thermosetting resin having excellent heat resistance is suitable for the joining member. Further, an additive may be added to the joining member in order to impart desirable characteristics. For example, various fillers may be added to adjust the refractive index of the bonding member or to adjust the viscosity of the bonding member before curing. Further, a wavelength conversion member, a light diffusing material, or the like may be added to the joining member.

(Coating member 20)
The covering member is formed of a material in which the wettability of the joining member before curing is lower than that of the first light reflecting member or the light transmitting member. That is, the first light reflecting member or the light transmitting member is formed of a material having a larger contact angle of the bonding member 60 before curing. In particular, it is preferably formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane having poor wettability. When the joining member is made of a silicone resin, the joining member is less likely to spread on the covering member by selecting polyimide, polyester, fluorine resin, polyolefin, polyphenylene sulfide, or polyurethane as the material of the covering member.

  Further, it is possible to suppress the formation of the bonding member on the first light reflecting member as in the light emitting device 1000, and particularly, when the first light reflecting member contains a silicone resin, polyimide, polyester, fluorine resin, It is preferably formed of at least one selected from the group consisting of polyolefin, polyphenylene sulfide, and polyurethane. Since the bonding member and the first light reflection member include the silicone resin, the bonding member is easily spread. Therefore, by selecting the above-described material, the spread of the bonding member can be suppressed.

  Even when the light-transmitting member contains a silicone resin, it is possible to suppress the formation of a bonding member on the light-transmitting member as in the light-emitting device 2000, and particularly to use a polyimide, polyester, fluororesin, polyolefin, or polyphenylene. It is preferably formed of at least one selected from the group consisting of sulfide and polyurethane. Since the joining member and the translucent member include the silicone resin, the joining member is easily spread. Therefore, by selecting the above-described material, the spread of the joining member can be suppressed.

(Wavelength conversion member 41)
As the wavelength conversion member, a phosphor that can be excited by light emission from the light emitting element is used. For example, as a phosphor that can be excited by a blue light emitting element or an ultraviolet light emitting element, a yttrium aluminum garnet phosphor (Ce: YAG) activated by cerium, a lutetium aluminum garnet phosphor activated by cerium (Ce: LAG), europium and / or activated nitrogen containing calcium aluminosilicate phosphor chromium _{(CaO-Al 2 O 3 -SiO} 2), silicate activated with europium phosphor ((Sr, Ba) ₂ SiO ₄ ), nitride-based phosphor such as β-sialon phosphor, CASN-based phosphor, SCASN-based phosphor; fluoride-based phosphor such as KSF-based phosphor, sulfide-based phosphor, chloride-based phosphor , Silicate-based phosphors, phosphate-based phosphors, quantum dot phosphors, and the like. In general formula KSF based phosphor can be represented by ^{_{A 2 [M 1-a Mn}} 4+ a F 6] ... (I). (Wherein, A represents at least one cation selected from the group consisting of K ⁺ , Li ⁺ , Na ⁺ , Rb ⁺ , Cs ⁺ and NH ₄ ⁺ ; and M represents a Group 4 element and A represents at least one element selected from the group consisting of Group 14 elements, a satisfies 0.01 <a <0.20.) Further, A in the general formula (I) includes K ⁺ , and M is A fluoride-based phosphor containing Si may be used. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.

(Light diffusing material 42)
As a material of the light diffusing material 42, specifically, SiO ₂ , Al ₂ O ₃ , Al (OH) ₃ , MgCO ₃ , TiO ₂ , ZrO ₂ , ZnO, Nb ₂ O ₅ , MgO, Mg (OH) _{2, SrO, in 2 O 3} , TaO 2, HfO, SeO, Y 2 O 3, CaO, Na 2 O, B 2 O 3, SnO, oxides such as ZrSiO _4, SiN, AlN, nitride such as AlON , MgF ₂ , CaF ₂ , NaF, LiF, fluorides such as Na ₃ AlF _{6 and} the like. These may be used alone or various types may be melted and mixed and used as glass or the like. Alternatively, they may be divided into a plurality of layers and stacked.

  In particular, by using glass, the refractive index can be arbitrarily controlled. The particle size of the light diffusing material can be arbitrarily selected from 0.01 to 100 μm. Further, the content of the light diffusing material needs to be adjusted, and cannot be univocally determined by the volume of the coating resin or the particle size of the light diffusing material.

  As described above, several embodiments according to the present invention have been exemplified. However, it is needless to say that the present invention is not limited to the above-described embodiments, and may be arbitrary without departing from the gist of the present invention. .

1000, 2000 Light emitting device 10 First light reflecting member 20 Covering member 30 Supporting member 40 Translucent member 41 Wavelength conversion member 42 Light diffusing material 50 Light emitting element 51 Translucent substrate 52 Semiconductor laminate 53, 54 Electrode 60 Joint member 70 Second light reflecting member 101 Cutting section 401 First surface 402 Second surface 501 Light extraction surface 502 Electrode formation surface

Claims (15)

A light-transmitting member having a first surface, a second surface that is a back surface of the first surface, and a side surface between the first surface and the second surface; A first light reflecting member disposed on a part of the first member, and a covering member located around the first surface and disposed on another part of the side surface and on the upper surface of the first light reflecting member; The step of preparing
A step of joining the light emitting element to the first surface using a joining member having a wettability to the covering member that is lower than the wettability to the first light reflecting member;
A method for manufacturing a light emitting device comprising:   The light emitting device according to claim 1, wherein the covering member is formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, and the bonding member is formed of a silicone resin. Production method. A light-transmitting member having a first surface, a second surface that is a back surface of the first surface, and a side surface between the first surface and the second surface; A first light reflecting member disposed on a part of the first surface, and a first light reflecting member disposed around the first surface, and disposed on another part of the side surface and the upper surface of the first light reflecting member, polyimide, polyester, A step of preparing a covering member formed of at least one selected from the group consisting of a fluororesin, polyolefin, polyphenylene sulfide, and polyurethane;
Joining a light emitting element to the first surface using a joining member formed of silicone resin;
A method for manufacturing a light emitting device comprising: The step of preparing includes a step of forming a through-hole penetrating the covering member and the first light reflecting member, and a step of arranging the translucent member in the through-hole. A method for manufacturing the light-emitting device according to claim 1. Forming a second light-reflecting member that covers the side surface of the light-emitting element, the first light-reflecting member, and the joining member, after the step of joining the light-emitting element and the first surface ; The method for manufacturing a light emitting device according to any one of claims 1 to 4, further comprising a step of removing the covering member before the step of forming the second light reflecting member . There is a plurality of the light emitting elements, and after the step of forming the second light reflecting member, a step of cutting the first light reflecting member and the second light reflecting member between the light emitting element and the adjacent light emitting element The method for manufacturing a light emitting device according to claim 5, wherein A light-transmitting member having a first surface and a second surface that is a back surface of the first surface, and the first surface so that at least a part of the first surface is exposed. Providing a covering member; and
A step of joining the light emitting element and the exposed first surface using a joining member having a wettability to the covering member that is worse than the wettability to the translucent member;
Removing the covering member;
Forming a second light reflecting member that covers the side surface of the light emitting element, the translucent member, and the joining member;
A method for manufacturing a light emitting device comprising: The light emitting device according to claim 7, wherein the covering member is formed of at least one selected from the group consisting of polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane, and the joining member is formed of a silicone resin. Production method. A light-transmitting member having a first surface and a second surface that is a back surface of the first surface, and the first surface so that at least a part of the first surface is exposed. Covering, formed by at least one member selected from the group consisting of a cover, polyimide, polyester, fluororesin, polyolefin, polyphenylene sulfide, and polyurethane; and
Bonding a light emitting element to the first surface using a bonding member made of silicone resin;
Removing the covering member;
Forming a second light reflecting member that covers the side surface of the light emitting element, the translucent member, and the joining member;
A method for manufacturing a light emitting device comprising: There is a plurality of the light emitting elements, and after the step of forming the second light reflecting member, a step of cutting the light transmitting member and the second light reflecting member between the light emitting element and the adjacent light emitting element is included. A method for manufacturing the light emitting device according to claim 7 . The method for manufacturing a light emitting device according to claim 5 , wherein in the step of removing the covering member, a part of the joining member is also removed. The method according to any one of claims 5 to 11 , further comprising, after the step of forming the second light reflecting member, removing a part of the second light reflecting member to expose an electrode of the light emitting element. A method for manufacturing a light emitting device. The method for manufacturing a light emitting device according to claim 1, wherein the translucent member is made of a resin material. The method for manufacturing a light emitting device according to any one of claims 1 to 13, wherein the translucent member includes a wavelength conversion member. The method of manufacturing a light emitting device according to claim 1 , wherein the thickness of the covering member is 10 to 150 μm.

Images