JP7037052B2 - Light emitting device and manufacturing method of light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device. The present disclosure also relates to a method for manufacturing a light emitting device.

It has a light emitting element such as an LED (Light Emitting Diode), and blue light emitted from the LED is incident on a phosphor to form blue light as excitation light and, for example, yellow secondary light whose wavelength is converted by the phosphor. There is known a light emitting device configured to generate white light by mixing colors of. For example, Patent Document 1 below discloses a light emitting device in which a phosphor plate is arranged above an LED chip by a transparent thermosetting adhesive.

There is a demand for reducing color unevenness in a light emitting device that produces white light by mixing the excitation light and the secondary light obtained by wavelength conversion. In the light emitting device described in Patent Document 1, by providing a vertical portion and an inclined portion on the outer peripheral end surface of the phosphor plate, the area of the phosphor plate is made smaller than the area of the upper surface of the LED chip, and the outer periphery of the phosphor plate is made smaller. The portion of the end face near the upper surface of the phosphor plate is covered with the adhesive member to prevent leakage of the excitation light through the adhesive member to the outside of the light emitting device.

JP-A-2015-079805A

However, there was room for further improvement in suppressing color unevenness.

A light emitting device according to an embodiment of the present disclosure covers at least a part of a light emitting element having an upper surface and a side surface, a wavelength conversion layer having a lower surface located above the upper surface of the light emitting element, and a side surface of the light emitting element. A light guide member including the first portion, a part of the lower surface of the wavelength conversion layer, and a reflection member covering the light guide member are provided, and the lower surface of the wavelength conversion layer has a groove portion surrounding the upper surface of the light emitting element. However, the light guide member further includes a second portion located inside the groove portion.

A method of manufacturing a light emitting device according to another embodiment of the present disclosure prepares a wavelength conversion layer including at least one element mounting region and having a main surface provided with a groove surrounding the element mounting region. A step (a), a step (b) of preparing a light emitting element having an upper surface and a side surface, and a step (c) of arranging the light emitting element in the element mounting region with the upper surface facing the main surface. The step (d) of forming a light guide member having an outer surface, which is a light guide member that covers at least a part of the side surface and includes a portion located in the groove portion, and the light guide member among the side surfaces. The step (e) of forming a reflective member covering the portion not covered with the light guide member and the outer surface of the light guide member is included.

According to the embodiment of the present disclosure, color unevenness can be suppressed more effectively.

It is a perspective view which shows an example of the appearance of the light emitting device by embodiment of this disclosure. 6 is a schematic cross-sectional view showing a cross section when the light emitting device 100A shown in FIG. 1 is cut in parallel with the ZX plane in FIG. 1 at a position near the center of the light emitting device 100A. It is a schematic cross-sectional view which shows an example of the shape of the groove part 120g which the lower surface 120b of a wavelength conversion layer 120 has. It is a schematic cross-sectional view which shows another example of the shape of the groove part 120g which the lower surface 120b of a wavelength conversion layer 120 has. It is a schematic cross-sectional view which shows still another example of the shape of the groove part 120g which the lower surface 120b of a wavelength conversion layer 120 has. It is a schematic plan view for demonstrating the relationship between a light emitting element 110, and the groove part 120g of a wavelength conversion layer 120. It is a schematic plan view for demonstrating the relationship between a light emitting element 110, and the groove part 120g of a wavelength conversion layer 120. It is a schematic plan view which shows the other example of the groove part 120g. It is a schematic plan view which shows still another example of a groove part 120g. It is a schematic perspective view which shows an example of the relationship between the shape of the groove portion 120g of a wavelength conversion layer 120 in a plan view, and the shape of the first portion 131 of a light guide member 130. FIG. 3 is a schematic perspective view showing another example of the relationship between the shape of the groove portion 120g of the wavelength conversion layer 120 in a plan view and the shape of the first portion 131 of the light guide member 130. Of the schematic cross sections shown in FIG. 2, it is an enlarged view showing the groove portion 120 g and its surroundings taken out. FIG. 3 is a schematic enlarged cross-sectional view for explaining the relationship between the position of the outer edge of the light guide member 130 and the position of the second edge 122 of the groove portion 120 g. It is a perspective view which shows an example of the appearance of the light emitting device by embodiment of this disclosure seen from the lower surface side. It is a perspective view which shows the modification of the light emitting device by embodiment of this disclosure. FIG. 5 is a schematic cross-sectional view showing a cross section when the light emitting device 100B shown in FIG. 15 is cut in parallel with the ZX plane in FIG. 15 at a position near the center of the light emitting device 100B. It is a flowchart which shows an example of the manufacturing method of the light emitting device by embodiment of this disclosure. It is a perspective view which shows an example of the laminated sheet including a fluorescent material sheet and a translucent sheet. It is a schematic sectional drawing for demonstrating the exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating the exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating the exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic cross-sectional view which shows the modification which filled the resin composition 130r in the groove part 120g in advance. It is a schematic sectional drawing for demonstrating the exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating the exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating another exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating another exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating another exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic sectional drawing for demonstrating another exemplary manufacturing method of the light emitting device by embodiment of this disclosure. It is a schematic cross-sectional view for demonstrating the modification of the manufacturing method of a light emitting device. It is a schematic cross-sectional view for demonstrating the modification of the manufacturing method of a light emitting device. It is a schematic cross-sectional view for demonstrating the modification of the manufacturing method of a light emitting device. It is a schematic cross-sectional view for demonstrating the modification of the manufacturing method of a light emitting device.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The following embodiments are examples, and the light emitting device according to the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, steps, the order of the steps, and the like shown in the following embodiments are merely examples, and various modifications can be made as long as there is no technical contradiction.

The dimensions, shapes, etc. of the components shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the dimensions, shapes, and magnitude relationships between the components in an actual light emitting device. In addition, some elements may be omitted in order to prevent the drawings from becoming excessively complicated.

In the following description, components having substantially the same function are indicated by common reference numerals, and the description may be omitted. In the following description, terms indicating a specific direction or position (eg, "top", "bottom", "right", "left" and other terms including those terms) may be used. However, those terms use relative orientation or position in the referenced drawings for clarity only. If the relative directions or positional relationships in terms such as "upper" and "lower" in the referenced drawings are the same, the drawings other than the present disclosure, actual products, manufacturing equipment, etc. are the same as the referenced drawings. It does not have to be an arrangement. In the present disclosure, "parallel" includes the case where two straight lines, sides, surfaces, etc. are in the range of about 0 ° to ± 5 ° unless otherwise specified. Further, in the present disclosure, "vertical" or "orthogonal" includes the case where two straight lines, sides, surfaces, etc. are in the range of about 90 ° to ± 5 ° unless otherwise specified.

(Embodiment of light emitting device)
FIG. 1 shows an example of the appearance of the light emitting device according to the embodiment of the present disclosure. For reference, FIGS. 1 also show arrows indicating the X, Y, and Z directions that are orthogonal to each other. Other drawings of the present disclosure may also illustrate arrows pointing in these directions.

The light emitting device 100A shown in FIG. 1 has a substantially rectangular parallelepiped appearance, and includes a light emitting element 110, a wavelength conversion layer 120, a translucent protective member 140, and a reflective member 150A. FIG. 2 schematically shows a cross section when the light emitting device 100A is cut in parallel with the ZX plane in FIG. 1 at a position near the center of the light emitting device 100A. Hereinafter, each component will be described in detail.

[Light emitting element 110]
The light emitting device 110 is a known semiconductor light emitting device such as an LED. In the illustrated example, the light emitting element 110 has an element main body 113, a first electrode 111, and a second electrode 112. In this example, the upper surface of the element main body 113 constitutes the upper surface 110a of the light emitting element 110, and the first electrode 111 and the second electrode 112 are located on the surface opposite to the upper surface 110a. The shape of the light emitting element 110 in top view is typically rectangular. Here, the shape of the upper surface 110a of the light emitting element 110 is rectangular, and therefore the light emitting element 110 has four side surfaces 110c.

The element main body 113 includes, for example, a support substrate such as a sapphire substrate or a gallium nitride substrate, and a semiconductor laminated structure on the support substrate. The semiconductor laminated structure includes an active layer, an n-type semiconductor layer sandwiching the active layer, and a p-type semiconductor layer. The semiconductor laminated structure may include a nitride semiconductor (In _x Aly Ga _{1-x-y N} , 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of emitting light in the ultraviolet to visible region. The first electrode 111 and the second electrode 112 are formed of a metal such as Cu, and are electrically connected to the n-type semiconductor layer and the p-type semiconductor layer on the opposite side of the element main body 113 from the support substrate, respectively. In the following, as the light emitting element 110, an LED that emits blue light will be exemplified.

[Wavelength conversion layer 120]
The wavelength conversion layer 120 is a substantially plate-shaped member located above the upper surface 110a of the light emitting element 110, and has a lower surface 120b located on the light emitting element 110 side and an upper surface 120a located on the side opposite to the lower surface 120b. .. The thickness of the wavelength conversion layer 120, that is, the distance between the lower surface 120b and the upper surface 120a is, for example, in the range of 30 μm or more and 300 μm or less. Here, the shape of the wavelength conversion layer 120 in the top view is similar to the shape of the top surface 110a of the light emitting element 110. That is, here, the upper surface 120a of the wavelength conversion layer 120 has a rectangular shape. One rectangular side of the upper surface 120a has a length in the range of, for example, 100 μm or more and 2700 μm or less.

The wavelength conversion layer 120 absorbs at least a part of the light emitted from the light emitting element 110 and emits light having a wavelength different from the wavelength of the light emitted from the light emitting element 110. For example, the wavelength conversion layer 120 wavelength-converts a part of the blue light from the light emitting element 110 to emit yellow light. According to such a configuration, white light is obtained by mixing the blue light that has passed through the wavelength conversion layer 120 and the yellow light emitted from the wavelength conversion layer 120.

The wavelength conversion layer 120 can be formed by using a resin composition in which particles such as a fluorescent substance, which is a wavelength conversion substance, are dispersed. Resins that disperse particles such as phosphors include silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, phenol resin, acrylic resin, urethane resin or fluororesin, or two or more of these resins. A resin containing the above can be used. Known materials can be applied to the phosphor. Examples of phosphors include fluoride-based phosphors such as YAG-based phosphors and KSF-based phosphors, nitride-based phosphors such as CASN, and β-sialon phosphors. The YAG-based phosphor is an example of a wavelength-converting substance that converts blue light into yellow light, and the KSF-based phosphor and CASN are examples of wavelength-converting substances that convert blue light into red light. Is an example of a wavelength converting substance that converts blue light into green light. The phosphor may be a quantum dot phosphor.

As schematically shown in FIG. 2, a groove portion 120g is provided on the lower surface 120b of the wavelength conversion layer 120. As will be described later, the groove portion 120g is provided so as to surround the upper surface 110a of the light emitting element 110. The groove portion 120g typically has a depth in the range of about 30% or more and 60% or less of the thickness of the wavelength conversion layer 120. In other words, the distance from the lower surface 120b of the wavelength conversion layer 120 to the deepest portion of the groove 120g, which is indicated by the double-headed arrow d in FIG. 2, is typically 30% or more of the thickness of the wavelength conversion layer 120. It is in the range of 60% or less. The depth of the groove portion 120g does not have to be constant over the entire circumference of the groove portion 120g, and the groove portion 120g may have a different depth depending on the position on the lower surface 120b.

In the example shown in FIG. 2, the groove portion 120g has a rectangular shape including two wall surface Gw and a bottom surface Gb located between the two wall surface Gw in a cross-sectional view. However, it goes without saying that the shape of the groove portion 120 g in a cross-sectional view is not limited to this example. The shape of the groove portion 120g in a cross-sectional view may be, for example, an arch shape as shown in FIG. 3 or a shape defined by a combination of a curved line and a straight line as shown in FIG. Alternatively, as shown in FIG. 5, it may be V-shaped as defined by the two wall surfaces Gw. As described above, the shape of the groove portion 120 g in the cross-sectional view can be any shape.

The groove portion 120g includes a first edge 121 and a second edge 122. The first edge 121 and the second edge 122 are portions formed at positions where the above-mentioned wall surface Gw is connected to the lower surface 120b. Here, of the two edges located on the lower surface 120b of the wavelength conversion layer 120, the edge located on the outer side is referred to as a second edge 122. As shown in the figure, the second edge 122 of the groove portion 120g is located inside the end portion (outer edge) of the lower surface 120b of the wavelength conversion layer 120.

The width of the groove portion 120g, that is, the distance between the first edge 121 and the second edge 122 may be in the range of about 1% or more and 70% or less with respect to one side of the upper surface 120a of the wavelength conversion layer 120. The groove portion 120 g has a width in the range of, for example, 20 μm or more and 500 μm or less.

FIG. 6 shows an example of the relationship between the light emitting element 110 and the groove portion 120 g of the wavelength conversion layer 120. FIG. 6 corresponds to a plan view of the structure of the light emitting device 100A excluding the reflecting member 150A when viewed from the lower surface 120b side of the wavelength conversion layer 120.

The lower surface 120b of the wavelength conversion layer 120A exemplified in FIG. 6 has a groove portion 120Ag having a rectangular shape in a plan view. That is, in this example, the shape of the first edge 121 in a plan view is a rectangular shape similar to the outer shape of the light emitting element 110. As shown in the figure, the light emitting element 110 is located inside the first edge 121 of the groove portion 120Ag. In other words, the first edge 121 of the groove portion 120Ag is located outside the side surface 110c of the light emitting element 110, and the groove portion 120Ag surrounds the light emitting element 110. In this example, a quadrangular pyramid-shaped light guide member 130A is formed on the lower surface 120b. Here, the "square pyramid-shaped" in the present specification is interpreted to include a shape in which a curved surface is included in the outer shape of the quadrangular frustum. In FIG. 6, each surface constituting the outer shape of the quadrangular pyramid of the light guide member 130A is shown as a flat surface, but the surface constituting the outer shape of the light guide member 130A is not limited to a flat surface but is a curved surface. May be good.

FIG. 7 shows another example of the relationship between the light emitting element 110 and the groove portion 120 g of the wavelength conversion layer 120. A groove portion 120Bg having an annular shape in a plan view is formed on the lower surface 120b of the wavelength conversion layer 120B illustrated in FIG. 7. In this example, the light guide member 130B having a circular outer edge is formed on the lower surface 120b of the wavelength conversion layer 120B corresponding to the circular shape of the groove portion 120Bg in a plan view. As described above, the shape of the groove portion 120 g in a plan view is not limited to a rectangular shape, and may be an annular shape or the like.

For example, in a configuration in which white light is generated by mixing blue excitation light and, for example, yellow light obtained by wavelength conversion, the outer side surrounding the center of the light emitting surface is compared with the vicinity of the center of the light emitting surface in the light emitting device. The light emitted from the area may be yellowish. Such a phenomenon is called a yellow ring. The yellow ring is generated by a combination of factors such as the shape of a wavelength conversion member such as a phosphor plate, the uneven distribution of phosphor particles in the wavelength conversion member, and the difference in the optical path length between the light rays traveling in the wavelength conversion member. In particular, when a large current exceeding the rating is applied to the light emitting element, it becomes easy to observe. By arranging the groove portion 120g at a position corresponding to the region where the yellow ring is likely to occur, the generation of the yellow ring can be suppressed.

The shape of the groove portion 120g in a plan view may be appropriately determined according to the shape of the region where the color of the emitted light is likely to shift, and is limited to a rectangular shape or an annular shape as shown in FIGS. 6 and 7. However, it may have any shape. By changing the shape of the groove portion 120g in a plan view, it is possible to obtain the effect of controlling the shape of the portion of the light guide member 130 that covers the side surface 110c of the light emitting element 110, as will be described later.

In the configurations exemplified in FIGS. 6 and 7, the groove portions 120Ag and 120Bg are formed on the lower surfaces 120b of the wavelength conversion layers 120A and 120B in the form of continuous grooves having a closed curve in a plan view. However, the groove portion 120g of the lower surface 120b is not limited to the shape of a continuous groove having a closed curve in a plan view.

8 and 9 show another example of the groove 120 g. In the configuration exemplified in FIG. 8, the lower surface 120b of the wavelength conversion layer 120C has a groove portion 120Cg. The groove portion 120Cg includes a plurality of grooves 126 separated from each other, and surrounds the upper surface 110a of the light emitting element 110 as in the example described with reference to FIG. 6 and the example described with reference to FIG. 7. .. The wavelength conversion layer 120D shown in FIG. 9 has a groove portion 120Dg on the lower surface 120b. Similar to the groove portion 120Cg shown in FIG. 8, the groove portion 120Dg includes a plurality of grooves 128. Each of the plurality of grooves 128 has an arcuate shape, and the plurality of grooves 128 are arranged in a circular shape.

As described above, the groove portion 120g of the wavelength conversion layer 120 may be formed on the lower surface 120b of the wavelength conversion layer 120 in the form of a group of a plurality of grooves or recesses arranged so as to surround the upper surface 110a of the light emitting element 110. L-shaped grooves or holes are selectively formed at four positions corresponding to the corners 110V in which two of the side surfaces 110c of the light emitting element 110 are connected to each other in the lower surface 120b of the wavelength conversion layer 120. You may. By providing grooves or holes at four positions corresponding to the corners 110V, these grooves or holes can also be used as alignment marks when arranging the light emitting element 110 on the lower surface 120b of the wavelength conversion layer 120. obtain.

The term "groove" as used herein refers to a structure having a shape such that the length (that is, the width) in the direction orthogonal to the direction is larger than the length in the direction in which the plurality of grooves are arranged, and the structure. Widely interpreted to include structures with hole-like shapes. As illustrated in FIGS. 8 and 9, the effect of suppressing the yellow ring can also be expected by providing the arrangement of a plurality of grooves on the lower surface 120b of the wavelength conversion layer 120. However, as shown in FIGS. 6 and 7, by providing the groove portion 120 g in the wavelength conversion layer 120 in a continuous shape having a closed curve in a plan view, the yellow ring can be suppressed more effectively.

[Light guide member 130]
See FIG. The light guide member 130 has a translucent structure and has an outer surface 130c which is an interface with the reflective member 150A. It should be noted that the terms "translucent" and "translucent" in the present specification are construed to include and include the fact that they exhibit diffusivity with respect to incident light, and are not limited to "transparent".

As schematically shown in FIG. 2, the light guide member 130 includes a first portion 131 that covers at least a part of the side surface 110c of the light emitting element 110, and a second portion 132 that is located inside the groove portion 120g of the wavelength conversion layer 120. And include. In the example shown in FIG. 2, the light guide member 130 further has a portion located between the upper surface 110a of the light emitting element 110 and the lower surface 120b of the wavelength conversion layer 120.

As the material of the light guide member 130, a resin composition containing a transparent resin material as a base material can be used. The light guide member 130 has a transmittance of, for example, 60% or more with respect to the light having the emission peak wavelength of the light emitting element 110. From the viewpoint of effective use of light, it is beneficial that the transmittance of the light guide member 130 at the emission peak wavelength of the light emitting element 110 is 70% or more, and it is more useful if the transmittance is 80% or more. The light guide member 130 may have a light diffusing function, for example, by dispersing a material having a refractive index different from that of the base material.

The material for forming the first portion 131 and the material for forming the second portion 132 are typically common. However, the material for forming the first portion 131 and the material for forming the second portion 132 may be different from each other. For example, when the material constituting the light guide member 130 contains a filler formed of a material having a refractive index different from that of the base material, the content of the filler differs between the first portion 131 and the second portion 132. May be.

The first portion 131 of the light guide member 130 covers a part or all of the side surface 110c of the light emitting element 110. By providing the light guide member 130 having the first portion 131, a part of the light emitted from the side surface 110c of the light emitting element 110 among the light emitted by the light emitting element 110 is incident on the first portion 131 of the light emitting element 130. Can be done. The light incident on the first portion 131 is reflected toward the upper side of the light emitting element 110 at the position of the outer surface 130c, and is emitted toward the outside of the light emitting device 100A via the wavelength conversion layer 120. Therefore, by providing the light guide member 130, it is possible to improve the light extraction efficiency. The first portion 131 of the light guide member 130 may cover the entire element body 113 from the lower end to the upper end. It is beneficial if the first portion 131 covers more region of the side surface 110c of the light emitting element 110, as more light can be directed above the light emitting element 110.

The shape of the outer surface 130c of the light guide member 130 in a cross-sectional view is not limited to the linear shape as shown in FIG. The shape of the outer surface 130c in the cross-sectional view may be a polygonal line, a curved line that is convex in the direction approaching the light emitting element 110, a curved shape that is convex in the direction away from the light emitting element 110, and the like. When the shape of the outer surface 130c in the cross-sectional view is a curved shape that is convex in the direction away from the light emitting element 110, more of the light emitted from the side surface 110c of the light emitting element 110 and passing through the light guide member 130 is more efficiently. It can be guided to the upper surface 100a side of the light emitting device 100A. Therefore, the light extraction efficiency can be improved more advantageously.

Here, the influence of the shape of the groove portion 120g of the wavelength conversion layer 120 in a plan view on the shape of the outer surface of the first portion 131 of the light guide member 130 will be described. FIG. 10 shows an example of the relationship between the shape of the groove portion 120g of the wavelength conversion layer 120 in a plan view and the shape of the first portion 131 of the light guide member 130, and FIG. 11 shows the plane of the groove portion 120g of the wavelength conversion layer 120. Another example of the relationship between the shape in view and the shape of the first portion 131 of the light guide member 130 is shown. 10 and 11 correspond to a perspective view of the structure of the light emitting device 100A excluding the reflective member 150A when viewed from the lower surface 120b side of the wavelength conversion layer 120.

As will be described later with reference to the drawings, for example, in the light guide member 130, after the material of the light guide member 130 is applied on the lower surface 120b of the wavelength conversion layer 120, the light emitting element 110 is arranged on the material, and the light emitting element 110 is arranged. It can be formed by curing the material. At this time, the groove portion 120g of the wavelength conversion layer 120 may play a role of suppressing the spread of the material of the light guide member 130. Here, when the rectangular groove portion 120Ag is formed as in the example shown in FIG. 10, the distance from the corner portion 110V to the groove portion 120Ag becomes larger than the distance from the side surface 110c of the light emitting element 110 to the groove portion 120Ag. .. According to such a groove portion 120Ag, it is easy to arrange the material of the light guide member 130 up to a higher position of the corner portion 110V, and therefore, as shown in FIG. 10, a first portion covering up to a higher position of the corner portion 110V. 131A can be formed. That is, the light guide member 130A can cover more parts of the side surface 110c of the light emitting element 110. Therefore, it is easy to improve the brightness above the corner portion 110V of the light emitting surface.

On the other hand, when the annular groove portion 120Bg is formed as in the example shown in FIG. 11, the distance from the side surface 110c to the groove portion 120Bg is larger than the distance from the corner portion 110V of the light emitting element 110 to the groove portion 120Bg. In this case, as shown in FIG. 11, a larger portion of the corner portion 110V can be exposed from the first portion 131B of the light guide member 130B formed on the lower surface 120b. In this way, the shape of the light guide member 130 can be controlled by changing the shape of the groove portion 120g of the wavelength conversion layer 120 in a plan view.

Next, the relationship between the position of the outer edge of the light guide member and the position of the second edge 122 of the groove portion will be described. FIG. 12 shows the groove portion 120 g and its surroundings taken out from the schematic cross section shown in FIG. As described above, the groove portion 120g of the wavelength conversion layer 120 can exert a function of defining the spread of the material of the light guide member 130. Therefore, the position of the outer edge of the light guide member 130 ideally matches the position of the second edge 122 of the groove portion 120g, as schematically shown in FIG.

However, for example, when the first portion 131 and the second portion 132 are collectively formed from the same material, the outer edge of the light guide member 130 is schematically shown in FIG. 13 due to shrinkage due to the curing of the resin. It may be located within the groove 120g. However, even if the outer edge of the light guide member 130 is located in the groove portion 120 g, the outer edge of the light guide member 130 is located inside the end portion of the lower surface 120b of the wavelength conversion layer 120, and as a result, the light guide member 130 is incident on the light guide member 130. It is avoided that the light is emitted to the outside of the light emitting device as it is without being incident on the wavelength conversion layer 120. Therefore, it is not essential that the position of the outer edge of the light guide member 130 coincides with the position of the second edge 122 of the groove portion 120g as schematically shown in FIG.

As can be seen from FIGS. 12 and 13, the position of the groove portion 120g of the wavelength conversion layer 120 substantially coincides with the position of the outer edge of the light guide member 130 in a plan view. The yellow ring tends to appear in the region of the light emitting surface directly above the outer edge of the light guide member and its vicinity. As described above, in the embodiments of the present disclosure, the position of the outer edge of the light guide member 130 may be defined by the groove portion 120g. Therefore, according to the embodiment of the present disclosure, the groove portion 120g is located on or near the outer edge of the light guide member 130, and the yellow ring can be effectively suppressed.

The shape and arrangement of the groove portion 120g may be appropriately determined according to the region on the light emitting surface where the yellow ring is desired to be suppressed. The depth and width of the groove 120 g are also arbitrary. It is also not necessary that the depth and / or width of the groove 120g be constant over the entire groove 120g. A plurality of groove portions 120g may be provided so that the light emitting element 110 is surrounded by two or more.

[Protective member 140]
See FIG. 2 again. The protective member 140 is located on the upper surface 120a of the wavelength conversion layer 120, and functions as a protective layer for the wavelength conversion layer 120 and the light emitting element 110. The protective member 140 is formed of, for example, a resin composition using a silicone resin or the like as a base material. Typically, the protective member 140 has a transmittance of 60% or more with respect to the light having the emission peak wavelength of the light emitting element 110. From the viewpoint of effective use of light, it is beneficial that the transmittance of the protective member 140 at the emission peak wavelength of the light emitting element 110 is 70% or more, and it is more beneficial if the transmittance is 80% or more.

The base material of the protective member 140 includes, for example, a silicone modified resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a polymethylpentene resin or a polynorbornene resin, or two or more of these, in addition to the silicone resin. The material can be applied. The protective member 140 may be provided with a light diffusing function by dispersing a material having a refractive index different from that of the base material in the base material.

[Reflective member 150A]
The reflective member 150A is formed of a light-reflecting material and is located on the lower surface 120b side of the wavelength conversion layer 120. As used herein, the term "light reflectivity" means that the reflectance of the light emitting element 110 at the emission peak wavelength is 60% or more. It is more beneficial when the reflectance of the reflective member 150A at the emission peak wavelength of the light emitting element 110 is 70% or more, and it is even more beneficial when the reflectance is 80% or more. It is beneficial for the reflective member 150A to have a white color.

In the configuration exemplified in FIG. 2, the reflective member 150A covers the portion of the side surface 110c of the light emitting element 110 that is not covered by the light guide member 130 and the outer surface 130c of the light guide member 130. In this example, the side surface 120c located between the upper surface 120a and the lower surface 120b of the wavelength conversion layer 120 and the side surface 140c of the protective member 140 are exposed from the reflective member 150A.

A part of the reflective member 150A is located on the side opposite to the upper surface 110a of the light emitting element 110, and covers a region of the lower surface of the element main body 113 excluding the region where the first electrode 111 and the second electrode 112 are arranged. FIG. 14 shows an exemplary appearance of the light emitting device 100A as viewed from the lower surface 100b side. As shown in FIG. 14, the lower surface 111b of the first electrode 111 and the lower surface 112b of the second electrode 112 are exposed from the lower surface 100b of the light emitting device 100A, and therefore the light emitting device 100A is configured to be suitable for mounting by flip chip connection. It can be said that it has.

(Modification example)
FIG. 15 shows a modified example of the light emitting device according to the embodiment of the present disclosure. Compared with the above-mentioned light emitting device 100A, the light emitting device 100B shown in FIG. 15 has a reflecting member 150B instead of the reflecting member 150A. The reflective member 150B has a shape that surrounds the light emitting element 110, the wavelength conversion layer 120, and the protective member 140.

FIG. 16 schematically shows a cross section when the light emitting device 100B is cut in parallel with the ZX plane in FIG. 15 at a position near the center of the light emitting device 100B. As shown in the figure, in this example, the upper surface 140a of the protective member 140 and the upper surface 150a of the reflective member 150B form the upper surface 100a of the light emitting device 100B. Further, in this example, the side surface 120c of the wavelength conversion layer 120 and the side surface 140c of the protective member 140 are covered with the reflection member 150B. By covering the side surface 120c of the wavelength conversion layer 120 with the reflecting member 150B, the light traveling from the side surface 120c toward the reflecting member 150B can be reflected by the reflecting member 150B, and the light distribution with improved directivity can be obtained. It can be realized.

In the embodiment of the present disclosure, a relatively thin portion is provided in the wavelength conversion layer 120 in the form of a groove portion 120 g, and a part of the light guide member 130 is arranged in the groove portion 120 g. Therefore, the light from the light emitting element 110 can be guided into the groove portion 120g via the light guide member 130, and the ratio of the light incident on the relatively thin portion of the wavelength conversion layer 120 can be increased. This makes it possible to adjust the balance between the light emitted from the light emitting element 110 that undergoes wavelength conversion and the light that passes through the wavelength conversion layer 120 without undergoing wavelength conversion. In particular, by arranging the groove portion 120g in the region where the yellow ring is likely to occur, the yellow ring can be suppressed and the occurrence of color unevenness on the upper surface of the light emitting device can be suppressed. Therefore, the uniformity of light can be improved.

For example, the shape of the first edge 121 formed by the groove portion 120g on the lower surface 120b may be similar to the outer shape of the upper surface 110a. By making the shape of the first edge 121 of the groove portion 120g similar to the outer shape of the upper surface 110a of the light emitting element 110, the groove portion 120g can be arranged in a region where a yellow ring is likely to occur. Therefore, the yellow ring can be suppressed more advantageously. The shape of the outer edge of the light guide member 130 may be defined by the shape of the groove portion 120g in a plan view. By forming the groove portion 120g in the form of a continuous single groove having a closed curve shape in a plan view, the second portion 132 of the light guide member 130 can be formed into, for example, a ring shape.

(Exemplary manufacturing method of light emitting device)
Next, a method of manufacturing a light emitting device according to the embodiment of the present disclosure will be described. FIG. 17 is a flowchart showing an example of a method for manufacturing a light emitting device according to the embodiment of the present disclosure. The method for manufacturing the light emitting device exemplified in FIG. 17 is roughly a step of preparing a wavelength conversion layer having a main surface provided with a groove portion surrounding an element mounting region (step S1) and preparing a light emitting element. (Step S2), a step of arranging the light emitting element in the element mounting region (step S3), and a light guide member including a portion that covers at least a part of the side surface of the light emitting element and is located in the groove portion. The step of forming (step S4) includes a step of forming a portion of the side surface of the light emitting element that is not covered by the light guide member and a reflection member that covers the outer surface of the light guide member (step S5). Hereinafter, the details of the manufacturing method will be described by taking the light emitting device 100A shown in FIG. 1 and the like as an example.

First, a wavelength conversion layer having a main surface provided with at least one element mounting region and a groove portion surrounding the element mounting region is prepared (step S1 in FIG. 17). Here, as shown in FIG. 18, the wavelength conversion layer is prepared in the form of a laminated sheet LS including a translucent sheet 140S and a phosphor sheet 120S containing a phosphor.

For the laminated sheet LS, for example, a fluorescent material sheet in which the resin in the resin composition in which the fluorescent material particles are dispersed is in a B stage state and a translucent resin sheet are prepared and bonded by heat. It can be prepared by obtaining a cut piece having a predetermined size by using an ultrasonic cutter or the like. The fluorescent material sheet can be formed from a resin composition containing a resin as a base material, a fluorescent material, filler particles, and a solvent. As the base material, in addition to the silicone resin exemplified as the material of the wavelength conversion layer 120, various resins such as acrylic resin, polymethylpentene resin, and polynorbornene resin can also be used. As the phosphor, various phosphors exemplified as the material of the wavelength conversion layer 120 can be used. The translucent sheet 140S can be obtained, for example, by curing a translucent resin composition. The material of the translucent sheet 140S contains, for example, a silicone resin as a base material, and additionally contains a light-reflecting filler and the like. A laminated sheet LS can also be obtained by applying a resin composition containing a phosphor to the translucent sheet 140S by a coating method such as a spray method, a casting method, or a potting method, and curing the applied resin composition. Can be done. As the translucent sheet 140S, plate-shaped polycarbonate or glass may be used. Alternatively, the laminated sheet LS may be prepared by purchase. Fluorescent sheet 120S and / or translucent sheet 140S may be prepared by purchase.

As shown in FIG. 18, the laminated sheet LS has one or more groove portions surrounding the element mounting region DR on the main surface 120Sb located on the opposite side of the main surface of the phosphor sheet 120S from the translucent sheet 140S. It has 120 g. In this example, the main surface 120Sb is provided with a plurality of rectangular groove portions 120g in a plan view, and each groove portion 120g includes a first edge 121 and a second edge 122 located on the main surface 120Sb. The second edge 122 is located outside the first edge 121, and therefore the element mounting region DR can be said to be a region defined by the first edge 121 of the groove portion 120 g. Here, the nine element mounting regions DR are two-dimensionally arranged on the main surface 120Sb at intervals from each other. Of course, the shape, number, and arrangement of the element mounting region DR can be arbitrarily determined.

The method for forming the groove portion 120 g is also not limited to the specific method. For example, the groove portion 120g can be formed by partially pressing the mold having the rectangular convex portion against one main surface of the phosphor sheet in the state of the B stage. The resin in the phosphor sheet may be cured while pressing the mold or after separating from the mold. Alternatively, a phosphor sheet having a groove portion of 120 g may be obtained by transfer molding or the like using a mold having a convex portion inside the cavity. In addition, a groove portion 120g may be formed on one main surface of the cured phosphor sheet 120S by etching, machining, or the like.

Next, as shown in FIG. 19, the laminated sheet LS is arranged on a support 300 such as a heat-resistant adhesive tape. At this time, of the main surfaces of the laminated sheet LS, the main surface 140Sa opposite to the main surface 120Sb is opposed to the support 300.

Next, a light emitting element is prepared (step S2 in FIG. 17). Here, the above-mentioned light emitting element 110 is used. The light emitting element 110 may be prepared by purchase.

Next, the light emitting element 110 is arranged in the element mounting area DR (step S3 in FIG. 17). Here, one light emitting element 110 is arranged in each element mounting area DR corresponding to a plurality of element mounting area DRs. At this time, as shown in FIG. 20, first, the translucent resin composition 130r is applied to each element mounting region DR by a dispenser or the like. As the resin composition 130r, a silicone resin, a silicone-modified resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a polymethylpentene resin or a polynorbornene resin, or a material containing two or more of these can be used. In the resin composition 130r, a material having a refractive index different from that of the base material may be dispersed.

After that, as shown in FIG. 21, the light emitting element 110 is arranged on the resin composition 130r with the upper surface 110a of the light emitting element 110 facing the main surface 120Sb of the laminated sheet LS. Instead of applying the resin composition 130r to the element mounting region DR, the resin composition 130r may be applied to the upper surface 110a of the light emitting element 110 and the light emitting element 110 may be arranged in the element mounting region DR. In either case, the groove portion 120 g can be used as an alignment mark. If the distance w between the first edge 121 of the groove portion 120g and the side surface 110c of the light emitting element 110 is large, a large alignment margin can be obtained, which is advantageous. Further, it becomes easy to form a larger light guide member 130, and there is an advantage that the light utilization efficiency can be further improved.

In the process of arranging the light emitting element 110 on the element mounting region DR, the light emitting element 110 is typically pressed against the laminated sheet LS, so that the upper surface 110a of the light emitting element 110 is embedded in the resin composition 130r. Is done. The uncured resin composition 130r applied to the element mounting region DR spreads on the main surface 120Sb by its own weight and pressing of the light emitting element 110. A part of the resin composition 130r spread on the main surface 120Sb enters the groove portion 120g. In the present embodiment, since the groove portion 120g is provided on the main surface 120Sb, it is possible to prevent the resin composition 130r from spreading beyond the second edge 122 of the groove portion 120g.

At this time, the other part of the resin composition 130r crawls up the side surface 110c of the light emitting element 110 and covers at least a part of the side surface 110c. Then, by curing the resin composition 130r, a guide having a first portion 131 covering at least a part of the side surface 110c of the light emitting element 110 and a second portion 132 located in the groove portion 120g is provided from the resin composition 130r. The optical member 130 can be formed (step S4 in FIG. 17).

As described above, in the present embodiment, by providing the groove portion 120g on the main surface 120Sb, the spread of the resin composition 130r beyond the second edge 122 of the groove portion 120g is suppressed. Therefore, it is possible to define the outer edge of the light guide member 130 by the groove portion 120 g. Further, as a result of the spread of the resin composition 130r being restricted by the groove portion 120g, the light guide member 130 is controlled by controlling the shape of the groove portion 120g in a plan view and the amount and viscosity of the resin composition 130r applied to the main surface 120Sb. The shape of the outer surface 130c of the can be controlled. For example, the outer surface 130c having a curved cross-sectional shape convex in the direction away from the light emitting element 110 can be more easily formed. By controlling the shape of the outer surface 130c of the light guide member 130, a more uniform luminance distribution can be realized. The viscosity of the resin composition 130r can be adjusted by adding a filler or the like to the base material.

When arranging the light emitting element 110 in the element mounting region DR, as shown in FIG. 22, the resin composition 130r may be first filled in the groove portion 120g so that the surface rises from the main surface 120Sb. For example, after curing the resin composition 130r arranged in a ring shape along the groove portion 120g, the resin composition 130r may be further applied to the region surrounded by the cured resin composition 130r. By applying the resin composition 130r to the main surface 120Sb in two steps in this way, the dam is arranged along the groove 120g and the cured resin composition 130r is suppressed from flowing out of the uncured resin composition 130r. Can function as. Different materials may be used between the resin composition filled in the groove portion 120 g and the resin composition applied to the inside of the dam.

Here, the light emitting element 110 is arranged on the laminated sheet LS in which the groove portion 120g is formed in advance on the main surface 120Sb, but the groove portion 120g is formed on the main surface 120Sb at the stage of arranging the light emitting element 110 on the main surface 120Sb. You may. That is, it is not essential to form the groove portion 120g that defines the element mounting region DR before the preparation of the laminated sheet LS. For example, the groove portion 120g is formed at the timing of arranging the light emitting element 110 on the main surface 120Sb. You may. For example, a frame-shaped convex portion is provided at the tip of the collet for picking up the light emitting element 110, and when the light emitting element 110 is arranged on the main surface 120Sb, the tip of the collet is placed on the phosphor sheet in the state of the B stage. The groove portion 120g may be formed by pressing the convex portion of the above. The method of forming the groove portion 120 g is not limited to a specific method.

Next, a reflective member is formed that covers the portion of the side surface 110c of the light emitting element 110 that is not covered by the light guide member 130 and the outer surface 130c of the light guide member 130 (step S5 in FIG. 17). Here, first, as shown in FIG. 23, the light-reflecting resin layer 150T covering the structure on the laminated sheet LS is formed. As shown in the figure, the light reflecting resin layer 150T covers the portion of the side surface 110c of the light emitting element 110 that is not covered by the light guide member 130 and the outer surface 130c of the light guide member 130.

The light-reflecting resin layer 150T can be formed, for example, by applying a resin material in which a light-reflecting filler is dispersed to the main surface 120Sb of the laminated sheet LS, and then curing the applied resin material. Various methods such as transfer molding, spray coating, and compression molding can be applied to the formation of the light-reflecting resin layer 150T.

As the base material of the resin material for forming the light-reflecting resin layer 150T, a silicone resin, a phenol resin, an epoxy resin, a BT resin, a polyphthalamide (PPA) or the like can be used. As the light-reflecting filler, metal particles or particles of an inorganic material or an organic material having a higher refractive index than the resin material in which the light-reflecting filler is dispersed can be used. Examples of light-reflecting fillers include titanium dioxide, silicon oxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, murite, niobium oxide, barium sulfate particles, or yttrium oxide and gadolinium oxide. Particles of various rare earth oxides and the like.

Next, by applying grinding or the like to remove a part of the light reflecting resin layer 150T from the upper surface side of the light reflecting resin layer 150T, the lower surface 111b of the first electrode 111 of the light emitting element 110 and the second electrode 112 The lower surface 112b of the above surface is exposed from the grinding surface. Further, the structure on the support 300 is cut out into a desired shape by a dicing device or the like. Here, for example, the light-reflecting resin layer 150T and the laminated sheet LS after grinding are cut at a position between two element mounting regions DR adjacent to each other. As shown in FIG. 24, the reflective member 150A can be formed from the light reflective resin layer 150T by grinding and cutting the light reflecting resin layer 150T. Further, by cutting the laminated sheet LS, the wavelength conversion layer 120 and the protective member 140 can be formed from the phosphor sheet 120S and the translucent sheet 140S, respectively. By separating the structure on the support 300 from the support 300, the above-mentioned light emitting device 100A can be obtained.

The light emitting device 100B described with reference to FIGS. 15 and 16 can be obtained, for example, as follows. First, as shown in FIG. 25, a laminated sheet piece LT having an element mounting region DR and a groove portion 120 g surrounding the element mounting region DR, respectively, is prepared on the main surface 120Sb. The laminated sheet piece LT includes a translucent sheet piece 140T and a phosphor sheet piece 120T. The laminated sheet piece LT may be a member obtained by cutting out the above-mentioned laminated sheet LS into a rectangular shape. In the example of FIG. 25, a plurality of laminated sheet pieces LT are arranged on the support 300 at intervals from each other.

Next, as shown in FIG. 26, the resin composition 130r is applied to each element mounting region DR in the same manner as in the above-mentioned example described with reference to FIGS. 20 and 21, and the resin composition 130r is applied onto the resin composition 130r. The light emitting element 110 is arranged. At this time, since the groove portion 120g is provided on the main surface 120Sb, it is possible to suppress the spread of the resin composition 130r to the outside of the groove portion 120g. In particular, the outflow of the resin composition 130r from the main surface 120Sb to the outside of the laminated sheet piece LT can be avoided.

After the resin composition 130r is cured to form the light guide member 130, the light reflecting resin layer 150T covering the light emitting element 110 and the light guide member 130 is formed in the same manner as in the example shown in FIG. However, here, as shown in FIG. 27, the light-reflecting resin layer 150T is formed on the support 300 so as to cover the laminated sheet piece LT as well.

Before arranging the light emitting element 110 in each element mounting region DR, a resin material in which a light-reflecting filler is dispersed is applied to a region between a plurality of laminated sheet pieces LT at intervals from each other. A light-reflecting resin layer having the same thickness as that of the laminated sheet pieces LT may be formed in advance between the plurality of laminated sheet pieces LT. After that, the light emitting element 110 is arranged in each element mounting region DR, and a resin material in which a light-reflecting filler is dispersed is applied so as to cover the light emitting element 110 and the light guide member 130 and cured. A structure similar to the structure shown in 27 can be obtained. A grid-shaped light-reflecting resin layer having the same thickness as the laminated sheet piece LT may be prepared, a structure similar to that of the laminated sheet piece LT may be formed in the grid-shaped opening, and the light emitting element 110 may be arranged.

Next, in the same manner as in the example shown in FIG. 24, a part of the light reflecting resin layer 150T is removed from the upper surface side of the light reflecting resin layer 150T to form the lower surface 111b of the first electrode 111 and the lower surface 112b of the second electrode 112. Is exposed from the ground surface, and then the structure on the support 300 is cut out into a desired shape. For example, as shown in FIG. 28, the light-reflecting resin layer 150T after grinding is cut at a position between two element mounting regions DR adjacent to each other. As a result, the reflective member 150B is formed from the light reflecting resin layer 150T, and a plurality of light emitting devices 100B are obtained on the support 300. The groove portion 120g may be formed at the same time as the arrangement of the light emitting element 110 in each element mounting region DR, or after the arrangement of the light emitting element 110 in each element mounting region DR.

In the example described with reference to FIGS. 25 to 28, the light emitting element 110 is arranged on the laminated sheet piece LT on the support 300. On the contrary, it is also possible to obtain a light emitting device by joining the laminated sheet piece LT to the light emitting element 110 arranged on the support 300.

For example, as shown in FIG. 29, the light emitting element 110 is arranged on the support 300 with the upper surface 110a facing away from the support 300. Then, the resin composition 130r is applied onto the upper surface 110a.

Next, the laminated sheet piece LT is arranged above the upper surface 110a with the main surface 120Sb provided with the groove portion 120g facing the upper surface 110a of the light emitting element 110. Also in this case, by pressing the laminated sheet piece LT toward the support 300, a part of the resin composition 130r can enter the inside of the groove portion 120g, and the inside of the groove portion 120g can be filled with the resin composition 130r.

By curing the resin composition 130r, the light guide member 130 can be formed from the resin composition 130r. Then, as shown in FIG. 31, the light reflecting resin layer 150T is formed so as to cover the structure on the support 300.

After the light-reflecting resin layer 150T is formed, a part of the light-reflecting resin layer 150T is removed from the upper surface side of the light-reflecting resin layer 150T by grinding or the like to expose the light-transmitting sheet piece 140T from the light-reflecting resin layer 150T. Further, for example, by cutting the light reflecting resin layer 150T at a position between the laminated sheet pieces LT adjacent to each other, the reflecting member 150B can be formed from the light reflecting resin layer 150T, and a plurality of light emitting devices 100B can be obtained. .. If cutting is performed so as to remove the light-reflecting resin layer 150T between the laminated sheet pieces LT adjacent to each other, a structure similar to that of the light emitting device 100A shown in FIG. 1 can be obtained.

Instead of arranging the light emitting element 110 on the support 300 in the step before joining the laminated sheet piece LT, the light emitting element 110 may be joined to a substrate or the like having wiring. For example, by reflow or the like, the first electrode 111 and the second electrode 112 of the light emitting element 110 are bonded to the first wiring and the second wiring of the substrate having the first wiring and the second wiring, respectively, and the substrate is used as a support. May be good. After joining the laminated sheet piece LT to the light emitting element 110, the light-reflecting resin layer 150T is formed on the substrate in the same manner as in the example shown in FIG. 31, and the light-transmitting sheet piece 140T is exposed from the light-reflecting resin layer 150T. By cutting the light-reflecting resin layer 150T and the substrate together, a light emitting device including the substrate can be obtained.

According to the embodiment of the manufacturing method described above, before the formation of the light guide member 130, the groove portion 120 g surrounding the element mounting region DR is provided in the wavelength conversion layer, so that the material of the light guide member 130 is the element mounting region. It is possible to avoid spreading beyond the DR. Therefore, it is possible to prevent light leakage due to the light guide member being exposed on the outer surface of the light emitting device.

Further, since the groove portion 120g suppresses the material of the light guide member 130 from spreading beyond the element mounting region DR, the resin composition 130r, which is the material of the light guide member 130, is used on the side surface 110c of the light emitting element 110. Can be more reliably placed on at least part of. Therefore, by curing the resin composition 130r, it becomes easier to form the light guide member 130 that covers a part or all of the side surface 110c of the light emitting element 110. In the step of applying the material of the light guide member 130, a part of the resin composition 130r is arranged in the groove 120g to cure the resin composition 130r, so that the light guide including the second portion 132 located in the groove 120g is included. The member 130 can be formed.

As in the above example, a plurality of element mounting region DRs are arranged at intervals from each other, and a light emitting element 110 is arranged for each element mounting region DR to form a light reflecting resin layer 150T, and then a light reflecting resin layer 150T. By cutting the light emitting device, it is possible to efficiently manufacture a plurality of light emitting devices at once. Two or more light emitting elements 110 may be arranged in each element mounting area DR. By arranging two or more light emitting elements 110 in each element mounting region DR, higher brightness can be realized while suppressing color unevenness.

The embodiments of the present disclosure are useful for providing various lighting light sources, vehicle-mounted light sources, backlight light sources, display light sources, and the like.

100A, 100B Light emitting device 110 Light emitting element 111 First electrode of light emitting element 112 Second electrode of light emitting element 113 Element body of light emitting element 120, 120A to 120D Wavelength conversion layer 120g, 120Ag to 120Dg Groove part 120S Fluorescent material sheet 121 Groove part No. 1 edge 122 2nd edge of groove 126, 128 groove 130, 130A, 130B Light guide member 130r Resin composition 131, 131A, 131B 1st part of light guide member 132 2nd part of light guide member 140 Protective member 140S Translucency Sheet 150A, 150B Reflective member DR element mounting area

Claims (11)

A light emitting element having an upper surface and a side surface, and
A wavelength conversion layer located above the upper surface of the light emitting element and having a lower surface,
A light guide member including a first portion that covers at least a part of the side surface of the light emitting element, and
A part of the lower surface of the wavelength conversion layer and a reflective member covering the light guide member are provided.
The lower surface of the wavelength conversion layer has a groove portion surrounding the upper surface of the light emitting element.
The light guide member is a light emitting device further including a second portion located inside the groove portion. The upper surface of the light emitting element has a rectangular shape in a plan view and has a rectangular shape.
The groove portion has a first edge located on the lower surface of the wavelength conversion layer and a second edge outside the first edge.
The light emitting device according to claim 1, wherein the shape of the first edge is similar to the outer shape of the upper surface of the light emitting element in a plan view. The light emitting device according to claim 2, wherein the second edge of the groove portion is located inside the lower end portion of the lower surface of the wavelength conversion layer in a plan view. The light emitting device according to claim 2 or 3, wherein the first edge of the groove portion is located outside the side surface of the light emitting element in a plan view. The light emitting device according to any one of claims 1 to 4, wherein the first portion and the second portion of the light guide member are formed of a common material. The light emitting device according to any one of claims 1 to 5, wherein the groove portion is a continuous single groove having a closed curve shape in a plan view. The light emitting device according to any one of claims 1 to 6, wherein the depth of the groove portion is in the range of 30% or more and 60% or less of the thickness of the wavelength conversion layer. A step (a) of preparing a wavelength conversion layer including at least one element mounting region and having a main surface provided with a groove portion surrounding the element mounting region.
Step (b) of preparing a light emitting element having an upper surface and a side surface, and
The step (c) of arranging the light emitting element in the element mounting region with the upper surface facing the main surface.
A step (d) of forming a light guide member having an outer surface, which is a light guide member that covers at least a part of the side surface and includes a portion located in the groove portion.
A method for manufacturing a light emitting device, comprising a step (e) of forming a portion of the side surface that is not covered by the light guide member and a reflective member that covers the outer surface of the light guide member. The step (d) is
The step (d1) of applying the translucent resin composition to at least a part of the side surface and the groove portion,
The method for manufacturing a light emitting device according to claim 8, further comprising a step (d2) of curing the resin composition. The method for manufacturing a light emitting device according to claim 8 or 9, wherein in the step (a), the groove is formed by partial pressing. The at least one element mounting area includes a plurality of element mounting areas arranged at intervals from each other.
The step (c) includes a step (c1) of arranging one or more of the light emitting elements in each element mounting region.
The step (e) is
A step (e1) of forming a light-reflecting resin layer that covers the portion of the side surface of each light emitting element that is not covered by the light guide member and the outer surface of each light guide member.
The method for manufacturing a light emitting device according to any one of claims 8 to 10, further comprising a step (e2) of cutting the wavelength conversion layer and the light reflecting resin layer at a position between the plurality of element mounting regions.

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