TW202025508A - Light emitting device and method for manufacturing the same - Google Patents

Abstract

A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending between the first face and the second face, a plurality of comers where the second face meets two of the plurality of side faces, and a pair of electrodes on a second face side of the light emitting element; a light transmissive member covering a portion of at least one of the side faces and a portion of an edge where said at least one side face meets the second face such that at least one of the plurality of corners is exposed from the light transmissive member; and a covering member covering the at least one exposed corner of the light emitting element and the exterior of the light transmissive member such that the pair of electrodes are exposed from the covering member.

Description

Light emitting device and manufacturing method thereof

The invention relates to a light emitting device and a manufacturing method thereof.

There is known a light-emitting device in which the side surface of the light-emitting element is covered with a reflective member instead of a housing that houses the light-emitting element (for example, Patent Documents 1 to 4). In these light-emitting devices, a translucent member is arranged between the light-emitting element and the reflective member, and light emitted from the side of the light-emitting element is extracted to the light-emitting surface side of the light-emitting device through the translucent member, thereby achieving light emission The light extraction efficiency of the device is improved. [Prior Technical Literature] [Patent Literature] [Patent Document 1] Japanese Patent Laid-Open No. 2012-227470 [Patent Document 2] Japanese Patent Laid-Open No. 2013-012545 [Patent Document 3] International Publication No. 2013/005646 [Patent Document 4] Japanese Patent Laid-Open No. 2010-219324

[The problem to be solved by the invention] If a translucent member is provided between the light-emitting element and the reflective member, the translucent member may peel off from the light-emitting element. Due to the peeling, the optical characteristics of the interface between the light-emitting element and the light-transmitting member are changed, and therefore, the light quantity and light distribution of the light extracted through the light-transmitting member may change. That is, the light extraction efficiency and light distribution characteristics of the light-emitting device may change due to the peeling of the light-transmitting member. Therefore, the quality of the light-emitting device is not fixed, and there is a risk that sufficient reliability cannot be guaranteed. Therefore, in the present invention, an object is to provide a light-emitting device which suppresses the separation of the light-transmitting member and the light-emitting element and has high reliability. [Technical means to solve the problem] Therefore, the light-emitting device of one embodiment of the present invention includes: A light emitting element having a first surface, a second surface facing the first surface, and a plurality of side surfaces between the first surface and the second surface, and a plurality of the second surface and the plurality of surfaces Two of the two connecting corners of the two side surfaces have a pair of electrodes on the second surface side; A light-transmitting member covering at least one part of the side surface and a part of the side where the at least one side surface is in contact with the second surface, so that more than one of the plurality of corners is exposed; and A covering member which covers the exposed corners of the light-emitting element and the outer surface of the light-transmitting member so as to expose the pair of electrodes; and The difference in thermal expansion coefficient between the covering member and the light emitting element is smaller than the difference in thermal expansion coefficient between the translucent member and the light emitting element. [Effects of Invention] According to one embodiment of the present invention, it is possible to suppress the peeling of the light-transmitting member from the light-emitting element, so that the reliability of the light-emitting device can be improved.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings. Furthermore, in the following description, terms that indicate specific directions or positions (for example, "up", "down", "right", "left" and other terms containing these terms are used as necessary. The use of these terms is to make the invention with reference to the drawings easy to understand, and is not intended to limit the technical scope of the present invention by using these terms. In addition, the parts with the same symbols in the plural drawings represent the same parts or components. <Embodiment 1> The light-emitting device 10 of this embodiment shown in FIGS. 1, 2(a), (b) includes a light-emitting element 20, a light-transmitting member 30 provided on the side surface 23 of the light-emitting element 20, and a cover The covering member 40 of the outer surface 33 of the translucent member 30. The light-emitting device 10 can include a wavelength conversion member 50 on the side of the first surface (upper surface) 11 that functions as a light-emitting surface. FIG. 2(a) is a schematic cross-sectional view taken along the line AA of FIG. 1 (a line orthogonal to a pair of side surfaces 23 opposite to the light-emitting element 20). FIG. 2(b) is a schematic cross-sectional view taken along line BB of FIG. 1 (a line that coincides with the diagonal line of the rectangular light-emitting element 20 when viewed from above). As shown in FIGS. 2(a) and (b), the light-emitting element 20 may include a translucent substrate 27 and a semiconductor laminate 28 formed on the lower surface side of the translucent substrate 27. The light-emitting element 20 has a first surface (upper surface) 21 on the side of the translucent substrate 27, a second surface (lower surface) 22 on the side of the semiconductor laminate 28 facing the first surface 21, and the first surface 21 and A plurality of side surfaces 23 between the second surface 22. The light emitted by the light emitting element 20 is extracted from the semiconductor laminate 28 through the translucent substrate 27, or from the semiconductor laminate 28 through the side surface 23 of the light emitting element 20 and the translucent member 30, and is extracted to the first surface of the light emitting device 10 11 sides. A pair of electrodes 251 and 252 for energizing the light-emitting element 20 are provided on the second surface 22 of the light-emitting element 20 (the semiconductor laminate 28 side in FIGS. 2(a) and (b)). Furthermore, in this specification, the "second surface 22" of the light-emitting element 20 refers to the surface of the light-emitting element 20 in a state where the electrodes 251 and 252 are not included. In this embodiment, the second surface 22 coincides with the lower surface of the semiconductor laminate 28. Each of the two electrodes 251 and 252 constituting a pair of electrodes can be in any shape. For example, in the light-emitting device 10 shown in FIG. 4, the electrodes 251, 252 can be arranged along a direction (y when viewed from the second surface 12 side of the light-emitting device 10) (that is, when viewed along the z direction). Direction) extending rectangle. Furthermore, the electrodes 251 and 252 may not have the same shape. In addition, the two electrodes 251 and 252 can be arranged arbitrarily as long as they are separated from each other. In FIG. 4, two electrodes 251 and 252 are arranged in parallel along the y direction. 2(a) again, the light-transmitting member 30 covers the side surface 23 of the light emitting element 20 and guides the light emitted from the side surface 23 toward the first surface 11 of the light emitting device 10. That is, before the light reaching the side surface 23 of the light emitting element 20 is reflected by the side surface 23 and attenuated in the light emitting element 20, the light can be extracted to the outside of the light emitting element 20 through the translucent member 30. By providing the light-transmitting member 30, the loss of light can be suppressed, and the light extraction efficiency of the light-emitting device 10 can be improved. In particular, when the side surface 23 of the light-emitting element 20 is inclined with respect to the second surface 22, the effect of the translucent member 30 is remarkable. For example, in the manufacturing step of the light-emitting element 20, when the light-emitting element 20 is singulated by cleaving, the side surface 23 of the light-emitting element 20 may not be perpendicular to the second surface 22. Generally speaking, in the cross-section along the line AA of FIG. 1 (FIG. 2(a)), the light-emitting element 20 has a parallelogram shape. That is, the first surface 21 and the second surface 22 are parallel, the two opposite side surfaces 23 are parallel, and each side surface 23 is inclined with respect to the first surface 21 and the second surface 22 as the light emitting element 20. Regarding the one side surface 23, the angle formed with the second surface 22 becomes an obtuse angle, so the light reflected from the one side surface 23 can be directly extracted to the outside of the light emitting device 10 toward the first surface 21 of the light emitting element 20. However, regarding the other side surface 23, the angle formed with the second surface 22 becomes an acute angle, so the light reflected by the other side surface 23 can be attenuated in the light emitting element 20 toward the second surface 22. By covering the other side surface 23 with the translucent member 30, the light reaching the other side surface 23 can be extracted to the outside of the light emitting device 10 through the translucent member 30. 3 shows the light-emitting device 10 in which the covering member 40 is omitted in order to easily grasp the covering state of the light-emitting element 20 by the light-transmitting member 30. Also, in order to make it easier to see the corner where the second surface 22 of the light-emitting element 20 and the two side surfaces 23 meet (referred to as the "corner on the second surface 22 side"), the light-emitting element 20 faces the second surface 22 The above method icon. The translucent member 30 does not cover the entire side surface 23 of the light emitting element 20 but partially covers the side surface 23. Therefore, specifically, in the vicinity of the corners 241, 242, 243, and 244 on the second surface 22 side of the light emitting element 20, the side surface 23 of the light emitting element 20 is exposed from the translucent member 30. In addition, the sides of the light-emitting element 20 extending in the z direction through the corners 241, 242, 243, 244 (referred to as "third sides 231, 232, 233, 234") are also transparent near the corners The sexual member 30 is exposed (refer to FIGS. 3 and 2(b)). Furthermore, the part of the side surface 23 exposed from the light-transmitting member 30 (the exposed part of the side surface 23) is covered by the covering member 40 described below, and therefore is not exposed to the outer surface of the light emitting device 10. 2 (a) and (b) again, the covering member 40 covers the exposed portion of the outer surface 33 of the light-transmitting member 30 and the side surface 23 of the light-emitting element 20 (FIG. 3). The covering member 40 is formed of a material that satisfies a specific relationship with the translucent member 30 and the light-emitting element 20 in terms of the magnitude of the thermal expansion coefficient. Specifically, the difference in thermal expansion coefficient between the translucent member 30 and the light emitting element 20 (referred to as the "first thermal expansion coefficient difference ΔT ₃₀ ") and the difference in thermal expansion coefficient between the covering member 40 and the light emitting element 20 (referred to as When it is called "the second coefficient of thermal expansion difference ΔT ₄₀ "), the material of the covering member 40 is selected so that ΔT ₄₀ &lt; ΔT ₃₀ . In other words, the material of the covering member 40 is selected in such a way that the coefficient of thermal expansion of the covering member is lower than that of the translucent member. This can prevent the translucent member 30 from peeling off from the light-emitting element 20. It is considered that the mechanism by which the peeling of the translucent member 30 can be suppressed is as follows. The peeling of the light-transmitting member 30 from the light-emitting element 20 is mainly due to heat generated when the light-emitting element 20 is lit. When the light-emitting element 20 is a semiconductor light-emitting element and the light-transmitting member 30 is a resin material, the thermal expansion coefficient (eg, linear expansion coefficient, Young's modulus, etc.) of the light-transmitting member 30 is the thermal expansion coefficient of the light-emitting element 20 More than 10 times. Therefore, when the light-emitting element 20 is turned on, the difference between the thermal expansion of the light-emitting element 20 and the thermal expansion of the light-transmitting member 30 causes tensile stress at the interface between the light-emitting element 20 and the light-transmitting member 30. This stress is released when the light-emitting element 20 is extinguished. That is, if the light-emitting element 20 is repeatedly turned on and off, tensile stress is generated at the interface each time it is turned on. Therefore, the adhesive force at the interface between the light-emitting element 20 and the light-transmitting member 30 becomes weak, and finally the light-emitting element 20 is turned on and off. The optical member 30 is peeled from the light-emitting element 20. As described above, the translucent member 30 is used to extract the light reaching the side surface 23 of the light-emitting element 20 to the light-emitting element 20 through the translucent member 30 before the light reaching the side surface 23 is reflected by the side surface 23 and attenuated in the light-emitting element The outer member. Therefore, if the light-transmitting member 30 peels off from the light-emitting element 20, the optical characteristics at the interface between the light-emitting element 20 and the light-transmitting member 30 will change. That is, a part of the light reaching the side surface 23 of the light emitting element 20 is not emitted to the translucent member 30 but may be reflected by the side surface 23. As a result, the amount of light extracted by the light-transmitting member 30 after the light-transmitting member 30 is peeled may decrease compared to before the light-transmitting member 30 is peeled. As a result, the light extraction efficiency of the light emitting device 10 may decrease, and the light distribution characteristics of the light emitting device 10 may change. Therefore, in the light-emitting device of the embodiment of the present invention, by using the light-transmitting member 30 and suppressing the peeling of the light-transmitting member 30 from the light-emitting element 20, the luminous efficiency and light distribution characteristics are not easily changed after long-term use. , Light-emitting device 10 with fixed quality and high reliability. When the peeling state of the light-transmitting member 30 is observed, it can be seen that the corners 241, 242, 243, and 244 (see FIGS. 2(b) and 3) on the second surface 22 side of the light-emitting element 20 are easily generated as a starting point. It is considered that this is because the tensile stress generated at the interface between the light-emitting element 20 and the light-transmitting member 30 is concentrated at the corners. In particular, it is considered that the semiconductor laminate 28 is formed on the second surface 22 side of the light-emitting element 20, so that heat is likely to be generated. In the corners of the light-emitting element 20, the corners 241, 242, and 243 on the second surface 22 side are also likely to be generated. , 244 peeled off. Furthermore, when the light-transmitting member 30 is not peeled off at the corners 241, 242, 243, 244 on the second surface 22 side of the light-emitting element 20, the light-transmitting member 30 is also not peeled off on the side surface 23 of the light-emitting element 20. . That is, if peeling of the light-transmitting member 30 at the corners 241, 242, 243, 244 on the second surface 22 side of the light-emitting element 20 can be suppressed, peeling of the light-transmitting member 30 can be effectively suppressed. Therefore, in the embodiment of the present invention, as shown in FIG. 1(a), (b) and FIG. 3, the light extraction efficiency is improved by covering most of the side surface 23 of the light emitting element 20 with the light-transmitting member 30 And by (instead of covering with the light-transmitting member 30), the corners 241, 242, 243, 244 of the second surface 22 side of the light-emitting element 20 are covered with a member (covering member 40) that is not easily peeled from the light-emitting element 20, The peeling of the translucent member 30 covering the side surface 23 is suppressed. As described above, the cause of peeling is due to the large difference in thermal expansion coefficient between the light-emitting element 20 and the member covering it. Thus, the difference between the thermal expansion coefficient of the light-emitting element 20 and the thermal expansion coefficient of the light-transmitting member 30, that is, the "first thermal expansion coefficient difference ΔT ₃₀ ", and the thermal expansion coefficient of the light-emitting element 20 and the second surface 22 covering the light-emitting element 20 When comparing the difference in the thermal expansion coefficients of the covering member 40 at the side corners, that is, the "second thermal expansion coefficient difference ΔT ₄₀ ", it is assumed that the second thermal expansion coefficient difference ΔT ₄₀ <the first thermal expansion coefficient difference ΔT ₃₀ . That is, the thermal expansion rate of the translucent member 30 and the thermal expansion rate of the covering member 40 are when the thermal expansion rate of the light-emitting element 20 is higher, so that the thermal expansion rate of the covering member 40 is lower than the thermal expansion rate of the translucent member 30. Thereby, compared with the probability that the light-transmitting member 30 is peeled off when the light-transmitting member 30 covers the corners 241, 242, 243, and 244 on the second surface 22 side of the light-emitting element 20, the corners 241, 242, 243, and 244 are covered by the covering member 40. When the portions 241, 242, 243, and 244 are peeled off, the covering member 40 has a low probability. Thereby, it is possible to reduce the probability that the light-transmitting member 30 covering the side surface 23 of the light-emitting element 20 will peel off. Regarding the thermal expansion coefficient of each member, the thermal expansion coefficient of the light-emitting element 20 is, for example, 7-10 ppm/°C. The thermal expansion coefficient of the light-transmitting member 30 is 200-300 ppm/°C under the temperature condition above the glass transition point (Tg) when a resin material is used as the base material. The coefficient of thermal expansion of the covering member 40 is 45-100 ppm/°C under the temperature condition above the glass transition point (Tg) when a resin material is used as the base material. As a specific example, regarding the thermal expansion coefficient of each member, assuming that the light-emitting element 20 is 7 ppm/°C, the translucent member 30 is 200 ppm/°C, and the covering member 40 is 45 ppm/°C, it becomes the first thermal expansion coefficient The difference ΔT ₃₀ =(200-7)=193 ppm/°C, and the second thermal expansion coefficient difference ΔT ₄₀ =(45-7)=38 ppm/°C. Thus, the relationship of the second thermal expansion coefficient difference ΔT ₄₀ <the first thermal expansion coefficient difference ΔT ₃₀ is satisfied. Furthermore, in this specification, "the thermal expansion rate of the light-emitting element 20" refers to the thermal expansion rate of the entire light-emitting element 20. For example, as shown in FIGS. 2(a) and (b), when the light-emitting element 20 includes a plurality of materials such as a translucent substrate 27 and a semiconductor laminate 28, it refers to the overall thermal expansion rate. 3, if the corners 241, 242, 243, and 244 on the second surface 22 side of the light-emitting element 20 are exposed from the translucent member 30, the light-emitting element 20 near the corners 241, 242, 243, and 244 The side surface 23 is also exposed from the translucent member 30. The light reaching the exposed part of the side surface 23 not in contact with the translucent member 30 cannot be extracted from the light emitting device 10 through the translucent member 30. Therefore, from the viewpoint of the light extraction efficiency of the light emitting device 10, the smaller the area of the exposed portion of the side surface 23, the better. On the other hand, since the exposed portion of the side surface 23 is covered by the covering member 40, from the viewpoint of preventing peeling of the light-transmitting member 30, the larger the area of the exposed portion, the better. Therefore, various changes can be considered in the arrangement and form of the exposed part according to the purpose. As shown in FIG. 3, the light-emitting element 20 has a substantially rectangular parallelepiped shape having four corners 241, 242, 243, and 244 on the second surface 22 side as an example, and the description will be changed. In the example of FIG. 3, the semiconductor laminate 28 of the light emitting element 20 includes three semiconductor layers of a first conductivity type semiconductor layer 281, a light emitting layer 282 and a second conductivity type semiconductor layer 283. The first conductivity type semiconductor layer 281 and the light emitting layer 282 among the three semiconductor layers 281, 282, 283 exposed on the side surface of the semiconductor laminate 28 are all covered by the light-transmitting member 30, and only a part of the second conductivity type semiconductor layer 283 It is exposed from the translucent member 30. In the first example of the change, only one corner (for example, the corner 244 in FIG. 3) can be exposed from the light-transmitting member 30, and the remaining three corners 241, 242, and 243 can be made of the light-transmitting member. 30 covered. Thereby, the side surface 23 of the light emitting element 20 can be widely covered to the corners 241, 242, and 243 by the light-transmitting member 30, so the light extraction efficiency is high. The corner portion 244 exposed from the light-transmitting member 30 is covered by the covering member 40 as shown in FIG. 2( b ), so the light-transmitting member 30 can be prevented from peeling off the light-emitting element 20 in the vicinity of the corner portion 244. In the second example of the change, two corners located at opposite corners (for example, corners 241, 243 in FIG. 3) can be exposed from the translucent member 30, and the remaining two corners 242, 244 can be exposed from the transparent member 30. The optical member 30 covers. Thereby, the side surface 23 of the light-emitting element 20 can be covered to the corners 242 and 244 by the light-transmitting member 30, so the light extraction efficiency is good. The corners 241, 243 exposed from the light-transmitting member 30 are covered by the covering member 40 as shown in FIG. 2(b), so the light-transmitting member 30 can be suppressed from being light-emitting elements near the two corners 241, 243 20 peeled off. Furthermore, in the two corners 241, 243 arranged diagonally, the stress generated at the interface between the light-emitting element 20 and the covering member 40 is relieved, so the corners 242, 244 arranged between the corners , It can also be expected to alleviate the stress generated at the interface between the light-emitting element 20 and the translucent member 30. In the third example of the change, two adjacent corners (for example, the corners 243 and 244 in FIG. 3) can be exposed from the light-transmitting member 30, and the remaining two corners 241, 242 can be made transparent The member 30 covers. Thereby, the side surface 23 of the light-emitting element 20 can be covered to the corners 241 and 242 with the light-transmitting member 30, so the light extraction efficiency is good. The corners 243, 244 exposed from the light-transmitting member 30 are covered by the covering member 40 as shown in FIG. 2(b), so the light-transmitting member 30 can be restrained from being light-emitting elements near the two corners 243, 244 20 peeled off. In addition, at this time, the side 223 sandwiched between the two corners 243 and 244 may be exposed from the light-transmitting member 30 and covered by the covering member 40, which can further enhance the peeling suppression effect. In the fourth example of the change, three corners (for example, the corners 241, 242, 243 in FIG. 3) can be exposed from the light-transmitting member 30, and the remaining one corner 244 can be made of the light-transmitting member 30 cover. Thereby, the side surface 23 of the light-emitting element 20 can be widely covered to the corner portion 244 by the light-transmitting member 30, so the light extraction efficiency is good. The corners 241, 242, and 243 exposed from the light-transmitting member 30 are covered by the covering member 40 as shown in FIG. 2(b). Therefore, the light-transmitting member 30 can be restrained from being exposed in the vicinity of the corners 241, 242, and 243. The effect of peeling off the light-emitting element 20 is high. In the fifth example of the change, all four corners (corners 241, 242, 243, 244 in FIG. 3) can be exposed from the light-transmitting member 30. The corners 241, 242, 243, and 244 exposed from the light-transmitting member 30 are covered by the covering member 40 as shown in FIG. 2(b). Therefore, it is possible to suppress the penetration near the corners 241, 242, 243, and 244. The effect of peeling the optical member 30 from the light-emitting element 20 is particularly high. Take the light-emitting element 20 in which the four corners 241, 242, 243, and 244 are all exposed from the light-transmitting member 30 (that is, the fifth example of the change) as an example, referring to FIG. 3 while describing in detail that it is covered by the light-transmitting member 30 The form of the light-emitting element 20. Furthermore, in FIG. 3, the four sides where the first surface 21 and the side surface 23 of the light-emitting element 20 meet are referred to as "first sides 211, 212, 213, and 214", and the second surface 22 and the side surface 23 are connected to each other. The four adjacent sides are called "second sides 221, 222, 223, 224", and the four sides where two adjacent sides 23 meet are called "third sides 231, 232, 233, 234". The first sides 211, 212, 213, and 214 surrounding the first surface 21 of the light-emitting element 20 are covered by the light-transmitting member 30 over the entire length thereof. The third sides 231, 232, 233, and 234 extending from the first surface 21 to the second surface 22 except for the vicinity of the second surface 22 (that is, the corners 241, 242, 243, 244 on the side of the second surface 22) Except the vicinity), most of them are covered by the light-transmitting member 30. The second sides 221, 222, 223, and 224 surrounding the second surface 22 of the light-emitting element 20 are portions other than the corners 241, 242, 243, and 244 on the second surface 22 side (in FIG. The vicinity of the dot) is covered by the light-transmitting member 30, and other parts are exposed from the light-transmitting member 30. By covering the light-emitting element 20 with the light-transmitting member 30 in this way, most of the side surface 23 of the light-emitting element 20 is covered by the light-transmitting member 30, and the corners 241, 242 on the second surface 22 side of the light-emitting element 20 , 243, 244 are exposed. Furthermore, as described above, FIG. 3 is a diagram showing a state where all corners 241, 242, 243, 244 on the second surface 22 side of the light-emitting element 20 are exposed from the light-transmitting member 30 (the fifth example of the change). . Thus, in the case where a part of the corner is covered by the light-transmitting member 30 (the first to fourth examples of changes), the second sides 221, 222, 223, 224, and the third sides 231, 232, 233, In 234, more parts are covered by the light-transmitting member 30. For example, when the corner portion 244 is covered by the light-transmitting member 30, the second sides 223 and 224 extending from the corner portion 244 are the ends of the corner portion 244 side and are covered by the light-transmitting member 30. In addition, the third side 234 extending from the corner portion 244 is covered by the light-transmitting member 30 over its entire length. 2(a) again, the light-transmitting member 30 covering the side surface 23 of the light-emitting element 20 may also exceed the first side of the light-emitting element 20 (symbols 212 and 214 in FIG. 2(a)) and partially cover the first side The surface 21 or covers the entire surface of the first surface 21. The first surface 21 of the light-emitting element 20 can be protected by the light-transmitting member 30. Furthermore, when the wavelength conversion member 50 is provided on the first surface 21 side of the light-emitting element 20, by providing the light-transmitting member 30 between the first surface 21 of the light-emitting element 20 and the wavelength conversion member 50, it can be used as a The bonding member to which the first surface 21 and the wavelength conversion member 50 are connected functions. In FIG. 3, the translucent member 30 covering the side surface 23 of the light emitting element 20 partially reaches the second sides 221, 222, 223, and 224, but it is preferably formed so as not to exceed the second side. That is, as shown in FIG. 3, the upper edge of the light-transmitting member 30 is located below the second sides 221, 222, 223, and 224 near the corners 241, 242, 243, and 244. In addition, Consistent with the second side. The light-transmitting member 30 of this shape uses a liquid resin material as the raw material of the light-transmitting member 30, and uses the liquid resin material to wet and expand the side surface 23 of the light-emitting element 20 by surface tension, thereby, Can be easily formed. Furthermore, by providing a step at the intersection of the second surface 22 and the side surface 23 of the light emitting element 20, it is possible to prevent the liquid resin material from spreading to the second surface 22 by wetting beyond the step. Such a level difference can be provided by removing only a part of the semiconductor laminated body 28 of the light emitting element 20, and more preferably a part of the second conductivity type semiconductor layer 283 near the second surface 22 of the light emitting element 20, for example. The light-transmitting member 30 is preferably as wide as possible, especially the light-emitting layer 282 that completely covers the side surface 23 of the light-emitting element 20 and is exposed. Thereby, the light emitted from the light emitting layer 282 can be efficiently extracted to the outside of the light emitting element 20 through the translucent member 30. Furthermore, it is not completely excluded that the upper edge of the light-transmitting member 30 exceeds the second sides 221, 222, 223, and 224 of the light-emitting element 20. That is, the upper edge of the light-transmitting member 30 may exceed the second sides 221, 222, 223, and 224 of the light-emitting element 20 so that the light-transmitting member 30 partially covers the second surface 22. However, if the second surface 22 is widely covered with the light-transmitting member 30, the problem of peeling at the interface between the second surface 22 and the light-transmitting member 30 may become significant. 2 (a), (b) and FIG. 3, the outer surface 33 of the light-transmitting member 30 is preferably inclined outward from the second surface 22 side of the light emitting element 20 toward the first surface 21 side. That is, in the cross-sectional views shown in FIGS. 2(a) and (b), it is preferable that the left and right outer surfaces 33 of the light-transmitting member 30 extend toward the first surface (light-emitting surface) 11 of the light-emitting device 10. The light emitted from the side surface 23 of the light emitting element 20 and propagated in the translucent member 30 reaches the inclined outer surface 33. Here, when light is reflected by the outer surface 33, the light can be directed toward the direction of the first surface 11 of the light emitting device 10. Thereby, the light extraction efficiency of the light emitting device 10 can be improved. In a cross-section parallel to one side surface 23 of the light-emitting element 20 (a cross-section along the line AA in FIG. 1, that is, FIG. 2(a)), the other side surface 23 orthogonal to the one side surface 23 covers the other side surface 23 The angle formed by the outer surface 33 of the light-transmitting member 30 of one side surface 23 (set as the "inclination angle θ ₁ ") is preferably in an appropriate range. Specifically, the inclination angle θ _{1 is} preferably 40° to 60°, and can be set to 45°, for example. When the inclination angle [theta] ₁ is large, the shape of the translucent member 30 of the first surface 31 (in FIG. 1, is depicted as a substantially circular shape) is increased, light extraction efficiency. On the other hand, if the inclination angle θ ₁ is small, the outside surface 31 of the first small deformation, and therefore can be downsized while the plan view of the light emitting device 10 of the time (i.e., the light emitting device 10 can be downsized). Considering both the light extraction efficiency and the miniaturization of the light emitting device 10, the tilt angle θ ₁ =45° is the best. In the cross-section along the diagonal of the light-emitting element 20 in plan view (the cross-section along the line BB in FIG. 1, that is, in FIG. 2(b)), the third side of the light-emitting element 20 (symbol 231 in FIG. 2(b)) , 233) The angle formed with the outer surface 33 of the translucent member 30 covering the third side (let it be the "inclination angle θ ₂ ") is smaller than the inclination angle θ ₁ . That is, as shown in FIGS. 2(a) and (b), the tilt angle θ ₂ <the tilt angle θ ₁ . Furthermore, on the outer surface 33 of the light-transmitting member 30, the point where the outer surface 33 contacts the third sides 231, 232, 233, and 234 (refer to FIG. 3) of the light emitting element 20 may be provided as a starting point. However, if there is a ridge line on the outer surface 33, there is a concern that the light incident from the side surface 23 of the light-emitting element 20 to the translucent member 30 is at the interface between the outer surface 33 of the translucent member 30 and the covering member 40 (see FIG. 2(a) and (b)) When being reflected, light is repeatedly reflected near the ridgeline and between the surfaces located on both sides of the ridgeline (that is, the two surfaces constituting the ridgeline). The light is gradually absorbed during the repeated reflection period and the intensity may become weaker. Therefore, the light extraction efficiency of the light emitting device 10 may decrease. In order to improve the light extraction efficiency, it is preferable that there is no ridge line on the outer surface of the translucent member 30, that is, the outer surface 33 of the translucent member 30 is formed of a smoothly continuous curved surface. Thereby, multiple reflections inside the translucent member 30 can be reduced, and the light extraction efficiency of the light emitting device 10 can be improved. The outer surface 33 of the translucent member 30 may be linear in the cross-sectional view shown in FIGS. 2(a) and (b), but may also be curved. Here, the "curved shape" may be any one of a curve that is convex outward (on the side of the covering member 40) and a curve that is convex inward (on the side of the light-emitting element 20). From the viewpoint of light extraction efficiency, the outer surface 33 is preferably a convex curve outward. Furthermore, the curved outer surface 33 that protrudes outward in the cross-sectional view becomes a dome-like shape as shown in FIG. 3 in the perspective view. In addition, the curved outer surface 33 protruding inward in the cross-sectional view becomes a flared (flare type) as shown in FIG. 20. When the light-emitting element 20 includes the light-transmitting substrate 27 and the semiconductor laminate 28, as shown in FIG. 2, the light-transmitting substrate 27 can be arranged on the first surface 21 side of the light-emitting element 20, and the semiconductor laminate 28 can be arranged On the second surface 22 side. When the light-emitting element 20 is turned on, heat is generated in the light-emitting layer (reference number 282 in FIG. 3) included in the semiconductor laminate 28, so the light-transmitting member 30 is likely to peel off from the light-emitting element 20 near the semiconductor laminate 28 side . As shown in FIG. 2(b), on the second surface 22 side of the light-emitting element 20, the corners of the light-emitting element 20 (in FIG. 2(b), symbols 241 and 243) are exposed from the light-transmitting member 30, and are The covering member 40 covers. Thereby, on the second surface 22 side of the light-emitting element 20, the light-transmitting member 30 is prevented from being peeled from the light-emitting element 20. Thus, by arranging the semiconductor laminate 28 which is a source of heat generation that causes peeling on the second surface 22 side of the light emitting element 20, peeling of the light-transmitting member 30 can be effectively suppressed. FIG. 4 shows the light emitting device 10 viewed from the second surface 12 side. One of the pair of electrodes 251 and 252 of the light emitting element 20 is exposed from the covering member 40 and is exposed on the second surface (lower surface) 12 of the light emitting device 10. Thereby, external electrodes provided on a substrate or the like on which the light-emitting element 20 is mounted can be connected to the electrodes 251 and 252 of the light-emitting element 20. Furthermore, in the light-emitting element 20, in order to protect the light-emitting element 20 from the external environment, the portion of the second surface 22 other than the portion where the electrodes 251 and 252 are provided is preferably covered by the covering member 40. When covering the second surface 22 of the light-emitting element 20 with the covering member 40, the electrodes 251 and 252 formed on the second surface 22 of the light-emitting element 20 are exposed on the surface (second surface 12) of the light-emitting device 10. For example, the side surfaces of the electrodes 251 and 252 (symbols 251c and 252c in FIG. 3) may also be covered by the covering member 40, but the surfaces 251s and 252s of the electrodes 251 and 252 are not covered by the covering member 40 to adjust the thickness of the covering member 40. Furthermore, the surfaces 251s and 252s of the electrodes may protrude from the covering member 40 or may be substantially the same plane (refer to FIG. 2(a)). 2 (a) and (b) again, as described above, the light-emitting device 10 may include the wavelength conversion member 50 on the first surface 11 side. The wavelength conversion member 50 is a member for converting a part of the transmitted light into another wavelength. The wavelength conversion member 50 includes a phosphor excited by the transmitted light. The light-emitting device 10 is provided with the wavelength conversion member 50, whereby a light-emitting device 10 having a light-emitting color different from that of the light-emitting element 20 can be obtained. For example, by combining the light emitting element 20 that emits blue light and the wavelength conversion member 50 that absorbs blue light and emits yellow fluorescent light, the light emitting device 10 that emits white light can be obtained. The wavelength conversion member 50 is preferably provided so as to cover the first surface 21 of the light emitting element 20 and the first surface 31 of the translucent member 30. The light generated by the light-emitting element 20 is directly extracted from the first surface 21 of the light-emitting element 20, or emitted from the side surface 23 of the light-emitting element 20 and passed through the light-transmitting member 30 and indirectly from the first surface 31 of the light-transmitting member 30 The ground is extracted. Thus, by disposing the wavelength conversion member 50 so as to cover the first surface 21 of the light-emitting element 20 and the first surface 31 of the light-transmitting member 30, substantially all the light generated by the light-emitting element 20 can pass through the wavelength conversion member. 50. That is, there is substantially no light that does not pass through the wavelength conversion member 50, and therefore, the color unevenness of the light emitted by the light emitting device 10 can be suppressed. <First Manufacturing Method> Next, referring to FIG. 5, the first manufacturing method of the light-emitting device 10 of this embodiment will be described. Step 1-1. Fixing of the light-emitting element 20 The light-emitting element 20 is arranged on the wavelength conversion member 50 (FIG. 5(a)). At this time, the first surface 21 of the light emitting element 20 and the second surface 52 of the wavelength conversion member 50 are arranged to face each other. The light-emitting element 20 can be fixed to the wavelength conversion member 50 by a translucent adhesive or the like. Instead of using an adhesive, the light-emitting element 20 is fixed to the wavelength conversion member 50 by the translucent member 30 formed later. Moreover, when the wavelength conversion member 50 itself has adhesiveness (in the case of a semi-cured state, etc.), it may be fixed without using an adhesive. Step 1-2. Formation of the light-transmitting member 30 to cover a part of the side surface 23 of the light-emitting element 20 and the vicinity of the light-emitting element 20 in the second surface 52 of the wavelength conversion member 50 to form the light-transmitting member 30 ( Figure 5(b)). When the light-transmitting member 30 is formed of a light-transmitting resin material, a liquid resin material 30L, which will become the raw material of the light-transmitting member 30, is used along the first side of the light-emitting element 20 using a dispenser or the like (Figure 5(b) ) Symbols 212, 214) and the boundary of the wavelength conversion member 50 are coated. The liquid resin material 30L spreads on the wavelength conversion member 50 and spreads upward on the side surface 23 of the light emitting element 20 by the surface tension. Thereafter, the liquid resin material 30L is hardened by heating or the like to obtain the translucent member 30. The distance that the liquid resin material 30L spreads upward on the light emitting element 20 can be controlled by adjusting the viscosity and coating amount of the liquid resin material 30L. For example, in the light-transmitting member 30 shown in FIG. 3, the liquid resin material 30L spreads upward on the side surface 23 of the light-emitting element 20 and contacts a part of the second sides 221, 222, 223, and 224. However, the liquid resin material spreads upward on the third sides 231, 232, 233, and 234 to the middle, but does not reach the corners 241, 242, 243, and 244 of the light-emitting element 20. By adjusting the viscosity and coating amount of the liquid resin material 30L in a form as shown in FIG. 3, the corners 241, 242, 243, and 244 of the light-emitting element 20 can be exposed from the light-transmitting member 30. The viscosity of the liquid resin material 30L can be adjusted by adding fillers or the like. When the light-transmitting member 30 is formed of the liquid resin material 30L, the outer surface 33 of the light-transmitting member 30 can be made outward in the Z direction (that is, away from the side surface 23 of the light-emitting element 20) by surface tension Tilt (Figure 5(b)). Step 1-3. Formation of the covering member 40 The part of the outer surface 33 of the translucent member 30 and the second surface 52 of the wavelength conversion member 50 that is not covered by the translucent member 30 (ie, the second surface 52 The exposed part) is covered with a covering member 40. Furthermore, the portion of the second surface 22 of the light emitting element 20 that is not covered by the electrodes 251 and 252 (that is, the portion where the second surface 22 is exposed) may also be covered by the covering member 40. At this time, it is preferable to adjust the thickness (dimension in the -Z direction) of the covering member 40 such that a part of the electrodes 251 and 252 (for example, the surfaces 251s and 252s of the electrodes 251 and 252) is exposed from the covering member 40. That is, when the second surface 52 of the wavelength conversion member 50 is used as a reference, the height of the second surface 42 of the covering member 40 may be set to be less than the height of the surfaces 251s and 252s of the electrodes 251 and 252. When the covering member 40 is formed of a resin material, for example, a mold frame surrounding the light emitting element 20 and the light-transmitting member 30 is provided, and the liquid resin material 40L used as the raw material of the covering member 40 flows into the mold frame. At this time, by inserting a mold frame on the outer periphery of the wavelength conversion member 50, the wavelength conversion member 50 can be used as the bottom of the mold frame (see FIG. 5(c)). After that, the liquid resin material 40L is hardened by heating or the like to obtain the covering member 40. By removing the mold frame, the light-emitting device 10 shown in FIGS. 1, 2 and 4 can be obtained. Furthermore, the covering member 40 may be formed by various methods such as spray coating and compression molding. In addition, after the covering member is formed by embedding the electrodes 251 and 252, only the covering member 40 or a part of the covering member 40 and the electrodes 251 and 252 may be removed to expose the electrodes 251 and 252. <Second Manufacturing Method> With reference to FIGS. 6 to 10, the second manufacturing method of the light-emitting device 10 of this embodiment will be described. In the second manufacturing method, a plurality of light-emitting devices 10 can be manufactured at the same time. Step 2-1. Fixing of the light-emitting element 20 The light-emitting element 20 is arranged on the second surface 520 of the wavelength conversion sheet 500 (FIG. 6(a), FIG. 9(a)). The wavelength conversion sheet 500 becomes the wavelength conversion member 50 after being singulated into each light emitting device 10. At this time, a relatively large wavelength conversion sheet 500 is used, and a plurality of light-emitting elements 20 are arranged on one wavelength conversion sheet 500. Adjacent light-emitting elements 20 are arranged at specific intervals. Furthermore, if the interval between adjacent light-emitting elements 20 is too wide, the number of light-emitting devices 10 that can be formed at the same time is reduced, and the mass production efficiency of the light-emitting devices 10 deteriorates. Therefore, the light-emitting elements 20 are preferably arranged at appropriate intervals . The light-emitting element 20 is fixed to the specific position of the wavelength conversion sheet 500 by the same fixing method as the fixing method described in step 1-1. of the first manufacturing method. Step 2-2. Formation of the light-transmitting member 30 In the same manner as step 1-2 of the first manufacturing method, the light-transmitting member 30 is formed around each light-emitting element 20 (FIG. 6(b), FIG. 9(b) )). The light-transmitting member 30 is formed so that the light-transmitting member 30 formed around a certain light-emitting element 20 and the light-transmitting member 30 formed around the light-emitting element 20 adjacent to the light-emitting element 20 are not in contact with each other. Step 2-3. Formation of the covering member 400 As in Step 1-3 of the first manufacturing method, the outer surface 33 of the translucent member 30 and the second surface 520 of the wavelength conversion sheet 500 are covered by the covering member 400 (Figure 7(a), Figure 9(c)). The covering member 400 becomes the covering member 40 after being singulated into each light-emitting device 10. Step 2-3. Different from step 1-3., the thickness of the covering member 400 (dimension in the -z direction) is adjusted in such a way that the surfaces 251s, 252s of the electrodes 251, 252 of the light emitting element 20 are also covered. At this time, the plurality of light-transmitting members 30 provided around the plurality of light-emitting elements 20 arranged on the wavelength conversion sheet 500 are covered by one continuous covering member 400. Thereafter, the thickness of the covering member 400 is reduced by a known processing method so that the electrodes 251 and 252 of the light-emitting element 20 are exposed (FIG. 7(b), FIG. 10(a)). Step 2-4. The singulation of the light-emitting device 10 is along the dashed line X ₁ , the dashed line X ₂ , the dashed line X ₃ and the dashed line X ₄ passing through the middle of the adjacent light-emitting element 20 (Figure 7(b), Figure 10(a)) ), the coating member 400 and the wavelength conversion sheet 500 are cut by a cutter or the like. Thereby, the light-emitting devices 10 are singulated into individual pieces (FIG. 8, FIG. 10(b)). In this way, a plurality of light-emitting devices 10 including one light-emitting element 20 can be manufactured at the same time. Furthermore, in the light-emitting device 10 after singulation, if the light-transmitting member 30 is exposed on the side surface 13 of the light-emitting device 10 (the side surface 40c of the covering member 40), the light emitted from the light-emitting element 20 passes through the light-transmitting member 30 The side surface 13 of the light emitting device 10 leaks in the lateral direction. Therefore, it is preferable to adjust the interval between adjacent light-emitting elements 20 or the viscosity of the light-transmitting member 30 so that the light-transmitting member 30 is not exposed from the side surface 13 of the light-emitting device 10. <Third Manufacturing Method> Referring to FIGS. 11 to 12, the third manufacturing method of the light-emitting device 10 of this embodiment will be described. In the third manufacturing method, a plurality of light-emitting devices 10 can be manufactured at the same time. In addition, description of the same steps as in the second manufacturing method will be omitted. Step 3-1. The translucent member 30 is arranged on the second surface 520 of the wavelength conversion sheet 500, and the liquid resin material 300 used to form the translucent member 30 is coated into a plurality of separate islands ( Figure 11 (a), 12 (a)). At this time, a relatively large wavelength conversion sheet 500 is used, and a plurality of island-shaped liquid resin materials 300 are arranged on one wavelength conversion sheet 500. Each liquid resin material 300 arranged in an island shape can be formed in any shape when viewed from above, and examples thereof include a circle, an ellipse, a square, and a rectangle. Furthermore, if the distance between adjacent island-shaped liquid resin materials 300 is too wide, the number of light-emitting devices 10 that can be formed at the same time decreases, and the efficiency of mass production of light-emitting devices 10 deteriorates. Therefore, the liquid resin material 300 Preferably, they are arranged at appropriate intervals. Step 3-2. Fixing of the light-emitting element 20 and curing of the liquid resin material 300 As shown in Fig. 11(b) and Fig. 12(b), the light-emitting element 20 is arranged on each liquid resin material 300 in the shape of an island. Only by arranging the light-emitting element 20 on the island-shaped liquid resin material 300, or by pressing the light-emitting element 20 after arrangement, the liquid resin material 300 climbs up to the side surface 23 of the light-emitting element 20 by surface tension. The outer surface 303 of the liquid resin material 300 (the outer surface 33 of the light-transmitting member 30 described below) has a downwardly expanding shape. After that, the liquid resin material 300 is cured to form the translucent member 30. The top-view shape of the liquid resin material 300 is deformed by the arrangement or pressing of the light-emitting element 20, and becomes the same as the first surface 31 (see FIGS. 1 and 2) of the translucent member 30 of the light-emitting device 10 as the final product. The shape is roughly the same. Furthermore, in this manufacturing method, the liquid resin material 300 exists as a film between the wavelength conversion sheet 500 and the light emitting element 20. The film-shaped translucent member 30t formed by curing the film-shaped liquid resin material 300 can also function as an adhesive between the wavelength conversion sheet 500 and the light-emitting element 20. The thickness of the film-like light-transmitting member 30t is preferably determined in consideration of adhesiveness and heat dissipation of the light-emitting device 10. Specifically, the thickness of the film-like light-transmitting member 30t can be set to, for example, 2-30 μm, preferably 4-20 μm, and most preferably about 5-10 μm, so that the light-emitting device 10 can emit light. The heat generated from the wavelength conversion member 500 is efficiently conducted to the light emitting element 20 side. Thereafter, the covering member 400 is formed in the same manner as in step 2-3. of the second manufacturing method, and the light-emitting device 10 is singulated in the same manner as in step 2-4. Thereby, a plurality of light-emitting devices 10 including one light-emitting element 20 can be manufactured at the same time. As described above, according to this manufacturing method, the liquid resin material 300 is coated in an island shape on the wavelength conversion sheet 500 and the light-emitting element 20 is arranged, whereby the bonding of the light-emitting element 20 and the light-transmitting member 30 can be performed simultaneously. The formation. This can improve mass productivity. <Fourth Manufacturing Method> With reference to FIGS. 13 to 14, the fourth method of manufacturing the light-emitting device 10 of this embodiment will be described. In the fourth manufacturing method, a plurality of light-emitting devices 10 can be manufactured at the same time. Step 4-1. Fixing of the light-emitting element 20 The light-emitting element 20 is arranged on the upper surface 60a of the supporting member 60 including a heat-resistant sheet and the like (FIG. 13(a)). At this time, a relatively large supporting member 60 is used, and a plurality of light-emitting elements 20 are arranged on one supporting member 60. As in step 2-1 of the second manufacturing method, adjacent light-emitting elements 20 are arranged at a specific interval. The light-emitting element 20 is fixed to the specific position of the support member 60 by the same fixing method as the fixing method described in step 1-1. of the first manufacturing method. Step 4-2. Formation of light-transmitting member 30 In the same manner as step 1-2. of the first manufacturing method, light-transmitting member 30 is formed around each light-emitting element 20 (FIG. 13(b)). The light-transmitting member 30 is formed so that the light-transmitting member 30 formed around a certain light-emitting element 20 and the light-transmitting member 30 formed around the light-emitting element 20 adjacent to the light-emitting element 20 are not in contact with each other. Step 4-3. Formation of the covering member 400 The outer surface 33 of the translucent member 30 and the upper surface 60a of the support member 60 are covered by the covering member 400 by the same method as the step 1-3. of the first manufacturing method ( Figure 13(c)). The covering member 400 becomes the covering member 40 after being singulated into each light-emitting device 10. The plurality of light-transmitting members 30 arranged around the plurality of light-emitting elements 20 arranged on the supporting member 60 are covered by one continuous covering member 400. Step 4-4. Formation of the wavelength conversion layer 510 The supporting member 60 is removed (peeled off), and the first surface 21 of the light emitting element 20 and the first surface 400a of the covering member 400 are exposed (FIG. 14(a)). Thereafter, a wavelength conversion layer 510 covering the first surface 21 of the light-emitting element 20 and the first surface 400a of the covering member 400 (hereinafter referred to as "first surface 21, 400a") is formed. The wavelength conversion layer 510 becomes the wavelength conversion member 50 after being singulated into each light-emitting device 10. As a method of forming the wavelength conversion layer 510, a method of bonding a sheet containing a phosphor-containing light-transmitting resin to the first surface 21, 400a by heat fusion or an adhesive; After the light body is attached to the first surface 21, 400a, the light-transmitting resin is impregnated into the attached phosphor; using infusion, transfer molding, compression molding, molding by casting the shell, spray method, electrostatic coating A method in which a transparent resin containing a phosphor is applied to the first surface 21, 400a by known techniques such as a printing method. Among these methods, the spray method is preferred, and the pulse spray method of spraying spray intermittently is particularly preferred. Step 4-5. The singulation of the light-emitting device 10 is the same as the step 2-4 of the second manufacturing method, along the dashed line X ₁ and the dashed line X ₂ passing through the middle of the adjacent light-emitting element 20, and cover it with a cutter or the like The member 400 is cut off from the wavelength conversion layer 510 (FIG. 14(b)). Thereby, the light-emitting devices 10 are singulated into individual pieces (FIG. 14( c )). In this way, a plurality of light-emitting devices 10 including one light-emitting element 20 can be manufactured at the same time. <Embodiment 2> As shown in FIG. 15, compared with the light-emitting device 10 of Embodiment 1, the light-emitting device 15 of this embodiment has a double-layer structure in which the side surface 501b of the wavelength conversion member 501 is covered by the covering member 403. The layer structure is different. The other points are the same as in Embodiment 1. The light-emitting device 15 of this embodiment includes a light-emitting element 20, a wavelength conversion member 501 covering the first surface 21 of the light-emitting element 20, a translucent member 30 provided on the side surface 23 of the light-emitting element 20, and a translucent member 30 covering the light-emitting element 20 The covering member 403 of the outer surface 33. In the present embodiment, the covering member 403 includes a first covering member 401 covering the side surface 501 b of the wavelength conversion member 501 and a second covering member 402 covering the outer surface 33 of the translucent member 30. By covering the side surface 501b of the wavelength conversion member 501 with the coating member 403 (first coating member 401), it is possible to prevent the light emitted from the light emitting element 20 from propagating inside the wavelength conversion member 501 and leaking from the side surface 501b in the lateral direction. Most of the light emitted from the light emitting device 15 is extracted from the first surface (upper surface) 16 which functions as the light emitting surface of the light emitting device 15. That is, the light from the light emitting device 15 is emitted substantially in the z direction, so the directivity of the light of the light emitting device 15 can be improved. Next, referring to FIGS. 16-17, the method of manufacturing the light-emitting device 15 will be described. Step A. Formation of the wavelength conversion member 501 The coating material layer 404 for forming the first coating member 401 is formed on the first support member 61 including a heat-resistant sheet or the like (FIG. 16(a)). Thereafter, by providing a plurality of through holes 409 in the covering material layer 404, a frame member 405 is obtained (FIG. 16(b)). The size and shape of the inner surface of the through hole 409 of the frame member 405 when viewed from the z direction are the same as those of the outer shape of the wavelength conversion member 501 in the plan view of the light emitting device 15 shown in FIG. 15(a). In addition, when the through hole 409 is formed, it is formed so as to penetrate the coating material layer 404 and not penetrate the first support member 61. 502L of translucent resin (liquid resin material before curing) containing phosphor is poured into each through hole 409 (FIG. 16(b)). Thereafter, the light-transmitting resin 502L is cured by heating to form a phosphor-containing member 502 (FIG. 16(c)). The "upper portion of the phosphor-containing member 502" and the "upper portion of the frame member 405" located above the Ct-Ct line (dotted line) in FIG. 16(c) are removed by cutting or the like. As a result, a sheet-like member (FIG. 16()) including a lower portion of the phosphor-containing member 502 (wavelength conversion member 501) and a lower portion of the frame member 405 (hereinafter referred to as "thin frame member 406") is formed (Figure 16 ( d)). The thin frame member 406 becomes the first covering member 401 shown in FIG. 15(b) below. Then, the sheet-like members (the wavelength conversion member 501 and the thin frame member 406) are transferred to the second support member 62 including a heat-resistant sheet and the like (FIG. 16(e)). Furthermore, the transfer of the sheet-like member can also be omitted. Step B. Fixing of the light-emitting element 20 on the exposed surface 501x of each wavelength conversion member 501 and fix the light-emitting element 20 (FIG. 17(a)). The fixing method of the light-emitting element 20 is the same as the fixing method explained in step 1-1. of the first embodiment. Step C. Formation of the light-transmitting member 30 In the same way as the steps 1-2. of the first embodiment, the liquid resin material 30L, which becomes the raw material of the light-transmitting member 30, is coated around the light-emitting element 20 (FIG. 17( b)). The liquid resin material 30L is cured by heating or the like to obtain the translucent member 30. Furthermore, the applied liquid resin material 30L spreads along the exposed surface 501x of the wavelength conversion member 501, but when it reaches the boundary line between the wavelength conversion member 501 and the thin frame member 406, it is difficult due to the pinning effect. Further expansion. Therefore, in the light-emitting device 15 of this embodiment, it is easy to control the form of the light-transmitting member 30. As shown in FIG. 15(a), the light-transmitting member 30 does not reach the four-corner portion 501e (the portion marked with hatching) of the wavelength conversion member 501. Thus, the four-corner portion 501e is exposed from the light-transmitting member 30. Step D. Formation of the covering member 407 Using the same method as the steps 1-3. of the first embodiment, the outer surface 33 of the translucent member 30 and the four corners of the wavelength conversion member 501 are covered with the covering member 407 (Figure 15(a) ) Symbol 501e), and the second surface 406b of the thin frame member 406 surrounding the wavelength conversion member 501 (FIG. 17(c)). The covering member 407 becomes the second covering member 402 after being singulated into each light-emitting device 15. The plurality of light-transmitting members 30 arranged around the plurality of light-emitting elements 20 are covered by a continuous covering member 407. Furthermore, as shown in FIG. 15(a), the wavelength conversion member 501 is covered by the light-transmitting member 30 except for the four corner portions 501e. Thereby, only the four corner portions 501e of the wavelength conversion member 501 not covered by the light-transmitting member 30 are covered by the covering member 407 (FIG. 15(c)). Step E. The singulation of the light-emitting device 15 is to cut the covering member 407, the thin frame member 406, and the second support member 62 along the dashed line X ₅ and the dashed line X ₆ passing through the middle of the adjacent light-emitting element 20. Off. Finally, the light-emitting device 15 is obtained by removing (peeling off) the second supporting member 62. Furthermore, the second support member 62 may be removed before cutting, and the covering member 407 and the thin frame member 406 may be cut afterwards. <Embodiment 3> In this embodiment, the shape of the electrode of the light-emitting element included in the light-emitting device is different from the shape of the electrodes 251 and 252 of the light-emitting element 20 of Embodiment 1. The structure of the light-emitting device other than this is the same as that of the first embodiment. Fig. 18 is a perspective view of the light emitting device 17 of this embodiment. The light-emitting element 207 included in the light-emitting device 17 includes a semiconductor laminate 28 and a pair of electrodes 257 and 258. On the second surface (lower surface) 172 of the light-emitting device 17, the surfaces 257 s and 258 s of the pair of electrodes 257 and 258 are exposed from the covering member 40. In this embodiment, the surface 257s of the first electrode 257 and the surface 258s of the second electrode 258 have different shapes. The surface 257s of the first electrode 257 is a rectangle extending in one direction (y direction). The surface 258s of the second electrode 258 has a comb-like shape in which a plurality of convex portions 258a and a plurality of concave portions 258b are alternately arranged on the side 258L facing the first electrode 257. The recess 258b is buried by the covering member 40. Thereby, the adhesion between the light-emitting element 207 and the covering member 40 can be improved. The shape of the convex portion 258a and the concave portion 258b can be any shape. For example, in FIG. 18, the shape of the recess 258b is set to include a band-shaped portion extending from the side 258L in the x direction and a circular portion provided at the end of the band-shaped portion. When two or more recesses 258b are formed, the shapes of the recesses 258b may all be the same shape as shown in FIG. 18, or part or all may be different shapes. When three or more concave portions 258b are formed, the intervals between adjacent concave portions 258b may be all equal as shown in FIG. 18, but may be different. FIG. 19 is a plan view of the light emitting device 17 in the state of the covering member 40 shown in FIG. 18 and FIG. 20 is a perspective view of the light emitting device 17 in the state of the covering member 40 omitted. As shown in FIGS. 19 and 20, the light-emitting element 207 may be provided with reflection on the second surface 207b side, more specifically, on the second semiconductor layer 283 side of the semiconductor laminate 28 of the light-emitting element 207 (see FIGS. 20 and 3).膜29. The reflective film 29 may be formed of materials such as a metal with high light reflectivity such as Ag or Al, or a dielectric multilayer film. By providing the reflective film 29, the light directed in the direction of the second surface 207b can be reflected in the direction of the first surface 207a. As shown in FIG. 19, the light-emitting element 207 may not form the semiconductor laminate 28 and the reflective film 29 at the corner of the light-transmitting substrate 27 due to the manufacturing process. The corners of the translucent substrate 27 on which the reflective film 29 is not formed are preferably covered by the covering member 40, by reflecting light toward the corners of the translucent substrate 27 at the interface between the translucent substrate 27 and the covering member 40 , Can help improve the light extraction efficiency of the light emitting device 17. Hereinafter, materials suitable for the constituent members of the light-emitting device 10 of Embodiments 1 to 3 will be described. (Light-emitting elements 20, 207) As the light-emitting elements 20, 207, semiconductor light-emitting elements such as light-emitting diodes can be used, for example. The semiconductor light emitting element may include a translucent substrate 27 and a semiconductor laminate 28 formed thereon. (Translucent substrate 27) The translucent substrate 27 of the light-emitting elements 20, 207 can be made of translucent insulating materials such as sapphire (Al ₂ O ₃ ), spinel (MgAl ₂ O ₄ ), or A semiconductor material (for example, a nitride-based semiconductor material) through which light is transmitted from the semiconductor laminate 28. (Semiconductor laminated body 28) The semiconductor laminated body 28 includes a plurality of semiconductor layers. As an example of the semiconductor laminate 28, it may include three of a first conductivity type semiconductor layer (for example, n-type semiconductor layer) 281, a light emitting layer (activation layer) 282, and a second conductivity type semiconductor layer (for example, p-type semiconductor layer) 283 Semiconductor layer (refer to Figure 3). The semiconductor layer may be formed of semiconductor materials such as group III-V compound semiconductors, group II-VI compound semiconductors, and the like. Specifically, nitride-based semiconductor materials such as In _X Al _Y Ga _{1 - X - Y} N (0≤X, 0≤Y, X+Y≤1) (such as InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc.) can be used ). (Electrode 251, 252, 257, 258) As the electrode 251, 252, 257, 258 of the light-emitting element 20, 207, a good electrical conductor can be used, for example, a metal such as Cu is preferable. (Translucent member 30) The translucent member 30 may be formed of a translucent material such as translucent resin or glass. As the translucent resin, particularly preferred are thermosetting translucent resins such as silicone resin, silicone modified resin, epoxy resin, and phenol resin. The light-transmitting member 30 is in contact with the side surface 23 of the light-emitting element 20, so it is easily affected by the heat generated in the light-emitting element 20 during lighting. The thermosetting resin is excellent in heat resistance, so it is suitable for the translucent member 30. Furthermore, the translucent member 30 preferably has a high light transmittance. Therefore, it is generally preferable not to add an additive that reflects, absorbs, or scatters light to the translucent member 30. However, in order to impart more desirable characteristics, it is also preferable to add additives to the translucent member 30. For example, in order to adjust the refractive index of the translucent member 30, or to adjust the viscosity of the translucent member (liquid resin material 300) before curing, various fillers may be added. In a plan view of the light-emitting device 10, the outer shape of the first surface 31 of the translucent member 30 is at least larger than the outer shape of the second surface 22 of the light-emitting element 20. The outer shape of the first surface 31 of the light-transmitting member 30 can be set to various shapes, for example, it can be set to a circle as shown in FIG. 21(a), a rounded quadrilateral as shown in FIG. 15(a), and Oval, square, rectangular and other shapes. Particularly, as shown in FIG. 21(a), regarding the size of the first surface 31 of the light-transmitting member 30 when viewed from above (the shape from the first surface 21 of the light-emitting element 20 to the first surface 31 of the light-transmitting member 30) When comparing the dimension 30D on the diagonal line of the light-emitting element 20 with the dimension 30W on the line perpendicular to the side 23 from the center of the side surface 23 of the light-emitting element 20, it is preferable that the dimension 30D<the dimension 30W. In order to satisfy this size condition, the shape of the first surface 31 of the translucent member 30 is preferably a circle, an ellipse, or a quadrilateral with rounded corners. In addition, the outer shape of the first surface 31 of the translucent member 30 may be determined based on other conditions. For example, when the light-emitting device 10 is used in combination with an optical lens (secondary lens), if the outer shape of the first surface 31 is preferably circular, the light emitted from the light-emitting device 10 is also close to a circular shape. , So it is easy to condense light with an optical lens. On the other hand, when miniaturization of the light-emitting device 10 is desired, it is preferable to set the outer shape of the first surface 31 as a quadrilateral with rounded corners, and the size can be reduced by 30W. Therefore, the upper surface 11 of the light-emitting device 10 can be reduced. size. Generally speaking, considering the ease of condensing light using an optical lens and the miniaturization of the light emitting device 10, the ratio of the size 30D to the size 30W is preferably 30D/30W=2/3~1/2. Also, as shown in 21(a) and 21(b), if the size of the first surface 21 to the second surface 22 of the light-emitting element 20 is set to "the thickness of the light-emitting element 20", the size is 30W and the thickness 20T can be approximated by the relationship of tanθ ₁ =30W/20T. Here, in the case of, for example, 30W=250 μm and 20T=150 μm, the inclination angle θ ₁ =59° can improve the light extraction efficiency. As described above, the inclination angle θ _{1 is} preferably 40°-60°. Therefore, if the thickness 20T of the light-emitting element 20 to be used is determined, the preferred range of 30W can also be determined. (Coating members 40, 403) The coating members 40, 403 are formed of materials that have a specific relationship with respect to the thermal expansion coefficient of the light-transmitting member 30 and the light-emitting element 20. That is, the coating members 40 and 403 are selected such that the thermal expansion coefficient difference ΔT ₄₀ between the coating members 40 and 403 and the light emitting element 20 is smaller than the thermal expansion coefficient difference ΔT ₃₀ between the translucent member 30 and the light emitting element 20. For example, when the light-emitting element 20 includes a translucent substrate 27 of sapphire and a semiconductor laminate 28 including a GaN-based semiconductor, the thermal expansion coefficient of the light-emitting element 20 is approximately 5-9×10 ^-6 /K. On the other hand, when the translucent member 30 is formed of silicone resin, the coefficient of thermal expansion of the translucent member 30 is 2 to 3×10 ^-5 /K. As a result, the covering members 40 and 403 are formed of a material having a lower thermal expansion coefficient than silicone resin, so that ΔT ₄₀ <ΔT ₃₀ can be set. When a resin material is used for the covering members 40 and 403, in general, the thermal expansion coefficient becomes 10 ^-5 /K level, which is one order of magnitude larger than that of the general light emitting element 20. However, by adding fillers or the like to the resin material, the thermal expansion rate of the resin material can be reduced. For example, by adding fillers such as silica to the silicone resin, the thermal expansion rate can be reduced compared to the silicone resin before the filler is added. As the resin material that can be used for the coating members 40 and 403, thermosetting and translucent resins such as silicone resin, silicone modified resin, epoxy resin, and phenol resin are particularly preferred. The covering members 40 and 403 may be formed of light reflective resin. The light-reflective resin refers to a resin material having a reflectance of 70% or more with respect to the light from the light-emitting element 20. The light reaching the covering members 40 and 403 is reflected toward the first surface 11 (light emitting surface) of the light emitting device 10, whereby the light extraction efficiency of the light emitting device 10 can be improved. As the light-reflective resin, for example, a light-reflective substance dispersed in a translucent resin can be used. As the light reflective material, for example, titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite, and the like are preferable. The light-reflective substance can be used in the form of granules, fibers, sheet-like sheets, etc., but especially in the form of fibers, the effect of reducing the coefficient of thermal expansion of the covering members 40 and 403 can be expected, which is preferable. (Wavelength conversion member 50) The wavelength conversion member 50 includes a phosphor and a translucent material. As a translucent material, translucent resin, glass, etc. can be used. It is particularly preferably a light-transmitting resin. Thermosetting resins such as silicone resins, silicone modified resins, epoxy resins, phenolic resins, polycarbonate resins, acrylic resins, methylpentene resins, and polysiloxane resins can be used. Thermoplastic resins such as bornene resin. Especially preferred is silicone resin with excellent light resistance and heat resistance. The fluorescent system can be excited by the luminescence from the light-emitting element 20. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include: yttrium-aluminum-garnet-based phosphors activated by cerium (Ce: YAG); lute-aluminum-garnet activated by cerium Stone-based phosphors (Ce: LAG); nitrogen-containing calcium aluminosilicate phosphors activated by europium and/or chromium (CaO-Al ₂ O ₃ -SiO ₂ ); silicate-based phosphors activated by europium Phosphors ((Sr,Ba) ₂ SiO ₄ ); Nitride-based phosphors such as β-Sialon phosphors, CASN-based phosphors, and SCASN-based phosphors; KSF-based phosphors (K ₂ SiF ₆ : Mn); sulfide-based phosphors, quantum dot phosphors, etc. By combining these phosphors with blue light-emitting elements or ultraviolet light-emitting elements, light-emitting devices of various colors (such as white light-emitting devices) can be manufactured. In order to adjust the viscosity and the like, various fillers and the like may be contained in the wavelength conversion member 50. Furthermore, instead of the wavelength conversion member 50, the surface of the light-emitting element may be covered with a translucent material that does not contain a phosphor. In addition, in order to adjust the viscosity, etc., various fillers and the like may be contained in the translucent material. As mentioned above, some embodiments of the present invention have been exemplified, but the present invention is not limited to the above-mentioned embodiments. Of course, it can be any one without departing from the gist of the present invention.

10: Light-emitting device 11: The first surface (upper surface) of the light-emitting device 12: The second surface (lower surface) of the light-emitting device 13: Side surface of the light-emitting device 15: Light-emitting device 16: The first surface (upper surface) of the light-emitting device 15 17: Light-emitting device 20: Light-emitting element 20T: Thickness of light-emitting element 20 21: First surface (upper surface) of light-emitting element 22: Second surface (lower surface) of light-emitting element 23: Side surface of light-emitting element 27: Light transmission Flexible substrate 28: Semiconductor laminate 29: Reflective film 30: Translucent member 30D: Size 30L: Liquid resin material 30t: Film-like translucent member 30W: Size 31: First surface of the translucent member 33: Translucent member outer surface 40: coating member 40c: side surface of the coating member 40L: liquid resin material 42: second surface of the coating member 50: wavelength conversion member 52: second surface of the wavelength conversion member 50 60: support member 60a: upper surface of support member 60 61: first support member 62: second support member 172: second surface (lower surface) of light-emitting device 17 207: light-emitting element 207a: first surface of light-emitting element 207 207b: light-emitting element The second side of 207 211, 212, 213, 214: the first side 221, 222, 223, 224 of the light-emitting element: the second side 231, 232, 233, 234 of the light-emitting element: the third side 241, 242 of the light-emitting element , 243, 244: the corners 251, 252 of the light-emitting element: the electrodes 251c, 252c: the sides 251s, 252s of the electrodes 251, 252: the surface of the electrodes 251, 252: the first electrode 257s: the surface 258 of the first electrode 257: Second electrode 258s: surface 258a of second electrode 258: convex portion 258b: concave portion 258L: side 281: first conductivity type semiconductor layer 282: light-emitting layer 283: second conductivity type semiconductor layer 300: liquid resin material 303: liquid Outer surface 400 of the shaped resin material 300: covering member 400a: the first surface of the covering member 400 401: the first covering member 402: the second covering member 403: the covering member 404: the covering material layer 405: the frame member 406: the thin frame Member 406b: second surface 407 of thin frame member 406: covering member 409: through hole 500: wavelength conversion sheet 501: wavelength conversion member 501b: side surface 501e of wavelength conversion member 501: four corners 501x of wavelength conversion member 501: The exposed surface 502 of the wavelength conversion member 501: the phosphor-containing member 502L: the translucent resin 510: the wavelength conversion layer 520: the second surface of the wavelength conversion sheet 500 X ₁ : dotted line X ₂ : dotted line X ₃ : dotted line X ₄ : Broken line X ₅ : Broken line X ₆ : Broken line x: Direction y: Direction z: Direction θ ₁ : Inclination angle θ ₂ : Inclination angle

Fig. 1 is a schematic plan view of the light-emitting device of the first embodiment. Fig. 2(a) is a schematic cross-sectional view taken along line A-A of Fig. 1, and Fig. 2(b) is a schematic cross-sectional view taken along line B-B of Fig. 1. Fig. 3 is a schematic perspective view showing a state where the covering member is omitted from the light-emitting device of the first embodiment and the light-transmitting member is exposed. Fig. 4 is a schematic bottom view of the light-emitting device of the first embodiment. 5(a) to 5(c) are schematic cross-sectional views for explaining the first manufacturing method of the light-emitting device of the first embodiment. 6(a) and 6(b) are schematic plan views for explaining the second manufacturing method of the light-emitting device of the first embodiment. 7(a) and 7(b) are schematic plan views for explaining the second manufacturing method of the light-emitting device of the first embodiment. FIG. 8 is a schematic plan view for explaining the second manufacturing method of the light-emitting device of Embodiment 1. FIG. Figure 9(a) is a schematic cross-sectional view taken along line CC of Figure 6(a), Figure 9(b) is a schematic cross-sectional view taken along line DD of Figure 6(b), and Figure 9(c) is taken along line 7 (a) A schematic cross-sectional view of the EE line. Fig. 10(a) is a schematic cross-sectional view taken along the line F-F of Fig. 7(b), and Fig. 10(b) is a schematic cross-sectional view taken along the line G-G of Fig. 8. 11(a) and 11(b) are schematic plan views for explaining the third manufacturing method of the light-emitting device of the first embodiment. Fig. 12(a) is a schematic cross-sectional view taken along the line H-H of Fig. 11(a), and Fig. 12(b) is a schematic cross-sectional view taken along the line I-I of Fig. 11(b). 13(a) to 13(c) are schematic cross-sectional views for explaining the third manufacturing method of the light-emitting device of the first embodiment. 14(a) to 14(c) are schematic cross-sectional views for explaining another example of the third manufacturing method of the light-emitting device of the first embodiment. Fig. 15(a) is a schematic plan view of the light-emitting device of Embodiment 2, Fig. 15(b) is a schematic cross-sectional view taken along the line JJ of Fig. 15(a), and Fig. 15(c) is taken along the line of Fig. 15(a) A schematic cross-sectional view of the KK line. 16(a) to 16(e) are schematic cross-sectional views for explaining the manufacturing method of the light-emitting device of the second embodiment. 17(a) to 17(d) are schematic cross-sectional views for explaining the manufacturing method of the light-emitting device of the second embodiment. Fig. 18 is a schematic perspective view of the light-emitting device of the third embodiment. Fig. 19 is a schematic plan view showing a state in which the covering member is omitted for the light-emitting device of the third embodiment and the light-transmitting member is exposed. Fig. 20 is a schematic perspective view showing a state where the covering member is omitted from the light-emitting device of the third embodiment and the light-transmitting member is exposed. Fig. 21 is a diagram for explaining the size and shape of the translucent member suitable for the light-emitting device, Fig. 21(a) is a schematic plan view of the light-emitting device, and Fig. 21(b) is along the line LL of Fig. 21(a) The schematic cross-sectional view.

10: Light-emitting device

11: The first side of the light-emitting device (upper surface)

12: The second surface of the light-emitting device (lower surface)

20: Light-emitting element

21: The first surface of the light-emitting element (upper surface)

22: The second surface of the light-emitting element (lower surface)

23: Side of the light-emitting element

27: Translucent substrate

28: Semiconductor laminated body

30: Translucent member

31: The first side of the translucent member

33: Outer surface of translucent member

40: Coated component

50: Wavelength conversion component

212, 214: the first side of the light-emitting element

222, 224: the second side of the light-emitting element

231, 233: the third side of the light-emitting element

241, 243: the corner of the light-emitting element

251, 252: Electrode

251s, 252s: the surface of the electrode

x: direction

y: direction

z: direction

θ ₁ : Tilt angle

θ ₂ : Tilt angle

Claims (15)

A light emitting device, which comprises: A light emitting element having a first surface, a second surface facing the first surface, and a plurality of side surfaces between the first surface and the second surface, and a plurality of the second surface and the plurality of surfaces Two of the two connecting corners of the two side surfaces have a pair of electrodes on the second surface side; A light-transmitting member covering at least one part of the side surface and a part of the side where the at least one side surface is in contact with the second surface, so that more than one of the plurality of corners is exposed; and A covering member which covers the exposed corners of the light-emitting element and the outer surface of the light-transmitting member so as to expose the pair of electrodes; and The difference in thermal expansion coefficient between the covering member and the light emitting element is smaller than the difference in thermal expansion coefficient between the translucent member and the light emitting element. A light emitting device, which comprises: A light emitting element having a first surface, a second surface facing the first surface, and a plurality of side surfaces between the first surface and the second surface, and a plurality of the second surface and the plurality of surfaces Two of the two connecting corners of the two side surfaces have a pair of electrodes on the second surface side; A light-transmitting member covering at least one part of the side surface and a part of the side where the at least one side surface is in contact with the second surface, so that more than one of the plurality of corners is exposed; and A covering member which covers the exposed corners of the light-emitting element and the outer surface of the light-transmitting member so as to expose the pair of electrodes; and The coefficient of thermal expansion of the covering member is lower than that of the translucent member. The light-emitting device according to claim 1 or 2, wherein the outer surface of the light-transmitting member is inclined outward from the second surface side of the light-emitting element toward the first surface side. The light-emitting device of claim 1 or 2, wherein the light-emitting element has a substantially rectangular parallelepiped shape having 4 corners, Two of the four corners located opposite to each other are covered by the covering member. The light-emitting device of claim 1 or 2, wherein the light-emitting element has a substantially rectangular parallelepiped shape having 4 corners, A part of the side between two adjacent corners among the four corners and the two adjacent corners is covered by the covering member. The light-emitting device of claim 4, wherein all the four corners are covered by the covering member. The light-emitting device of claim 5, wherein all the four corners are covered by the covering member. The light-emitting device of claim 1 or 2, wherein the light-emitting element includes a translucent substrate and a semiconductor laminate, The translucent substrate is arranged on the first surface side of the light emitting element, and the semiconductor laminated system is arranged on the second surface side. The light-emitting device according to claim 1 or 2, wherein the light-transmitting member includes a light-transmitting resin, and the covering member includes a light-reflective resin. The light-emitting device of claim 1 or 2, wherein the light-transmitting member has a first surface that is the same plane as the first surface of the light-emitting element, and The first surface of the light-emitting element and the first surface of the translucent member are covered by a wavelength conversion member. The light-emitting device of claim 1 or 2, wherein the first surface of the light-emitting element is covered by the light-transmitting member. A method for manufacturing a light emitting device, which includes the following steps: Prepare wavelength conversion components; Disposing the light emitting element on the wavelength conversion member in such a way that the first surface of the light emitting element is opposite to the second surface of the wavelength conversion member; Forming a light-transmitting member so as to cover a part of the side surface of the light-emitting element and a part of the side where the side surface is in contact with the second surface and expose at least one corner of the light-emitting element; and The covering member is formed so as to cover the outer surface of the light-transmitting member and the at least one corner of the light-emitting element exposed from the light-transmitting member. The method of manufacturing a light-emitting device of claim 12, wherein the step of forming the light-transmitting member includes: Disposing a liquid resin material on the wavelength conversion member; Disposing the light-emitting element on the liquid resin material; and The liquid resin material is cured to form the translucent member. The method for manufacturing a light emitting device of claim 12 or 13, wherein the step of preparing the wavelength conversion member includes: Providing through holes in the covering material layer; and A phosphor-containing member is formed in the through hole. The method of manufacturing a light-emitting device according to claim 12 or 13, wherein the difference in thermal expansion coefficient between the covering member and the light-emitting element is smaller than the difference in thermal expansion coefficient between the translucent member and the light-emitting element.

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