TW201709551A - Light emitting device and method for manufacturing the same - Google Patents

Abstract

A light emitting device includes a light emitting element having a first face, a second face opposing the first face, a plurality of side faces extending between the first face and the second face, a plurality of comers where the second face meets two of the plurality of side faces, and a pair of electrodes on a second face side of the light emitting element; a light transmissive member covering a portion of at least one of the side faces and a portion of an edge where said at least one side face meets the second face such that at least one of the plurality of corners is exposed from the light transmissive member; and a covering member covering the at least one exposed corner of the light emitting element and the exterior of the light transmissive member such that the pair of electrodes are exposed from the covering member.

Description

Light emitting device and method of manufacturing same

The present invention relates to a light emitting device and a method of fabricating the same.

A light-emitting device in which a side surface of a light-emitting element is covered with a reflective member instead of a case in which a light-emitting element is housed is known (for example, Patent Documents 1 to 4). In the light-emitting device, a light-transmitting member is disposed between the light-emitting element and the reflective member, and light emitted from the side surface of the light-emitting element is extracted by the light-transmitting member to the light-emitting surface side of the light-emitting device, thereby illuminating The light extraction efficiency of the device is improved.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2012-227470

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-012545

[Patent Document 3] International Publication No. 2013/005646

[Patent Document 4] Japanese Patent Laid-Open Publication No. 2010-219324

When a light transmissive member is provided between the light emitting element and the reflective member, the light transmissive member is peeled off from the light emitting element. The optical characteristics of the interface between the light-emitting element and the light-transmitting member are changed by the peeling, and therefore the amount of light extracted by the light-transmitting member And the light distribution may change. That is, since the light extraction efficiency and the light distribution characteristics of the light-emitting device may vary due to the peeling of the light-transmitting member, the quality of the light-emitting device is not fixed, and there is a fear that sufficient reliability cannot be ensured. Therefore, in the present invention, an object of the invention is to provide a light-emitting device which suppresses peeling of a light-transmitting member from a light-emitting element and has high reliability.

Therefore, a light-emitting device according to an embodiment of the present invention includes: a light-emitting element having a first surface, a second surface facing the first facing surface, and a plurality of the first surface and the second surface a side surface having a plurality of corner portions in contact with two of the plurality of side faces, wherein the second surface has a pair of electrodes, and the light transmissive member covers at least one of the side faces And one of the sides of the at least one side surface contacting the second surface to expose one or more of the plurality of corner portions; and the covering member covering the exposed corner portion of the light emitting element and the transparent portion The outer surface of the optical member exposes the pair of electrodes; and the difference in thermal expansion coefficient between the covering member and the light-emitting element is smaller than a difference in thermal expansion coefficient between the light-transmitting member and the light-emitting element.

According to an embodiment of the present invention, it is possible to suppress peeling of the light transmissive member from the light emitting element, and it is possible to improve the reliability of the light emitting device.

10‧‧‧Lighting device

11‧‧‧The first side (upper surface) of the illuminating device

12‧‧‧The second side (lower surface) of the illuminating device

13‧‧‧Side of the illuminating device

15‧‧‧Lighting device

16‧‧‧The first side (upper surface) of the light-emitting device 15

17‧‧‧Lighting device

20‧‧‧Lighting elements

20T‧‧‧ thickness of light-emitting element 20

21‧‧‧The first side (upper surface) of the light-emitting element

22‧‧‧The second side (lower surface) of the light-emitting element

23‧‧‧ Side of the light-emitting element

27‧‧‧Transmissive substrate

28‧‧‧Semiconductor laminate

29‧‧‧Reflective film

30‧‧‧Transparent components

30D‧‧‧ size

30L‧‧‧Liquid resin material

30t‧‧‧film-like translucent member

30W‧‧‧ size

31‧‧‧The first side of the translucent member

33‧‧‧ Exterior surface of translucent member

40‧‧‧covered components

40c‧‧‧Side of the covered member

40L‧‧‧Liquid resin material

42‧‧‧The second side of the covered member

50‧‧‧wavelength conversion member

52‧‧‧The second side of the wavelength conversion member 50

60‧‧‧Support components

60a‧‧‧Support member 60 upper surface

61‧‧‧1st support member

62‧‧‧2nd support member

172‧‧‧The second side (lower surface) of the light-emitting device 17

207‧‧‧Lighting elements

207a‧‧‧ the first side of the light-emitting element 207

207b‧‧‧ the second side of the light-emitting element 207

211, 212, 213, 214‧‧ ‧ the first side of the illuminating element

221, 222, 223, 224‧ ‧ the second side of the illuminating element

231, 232, 233, 234‧ ‧ the third side of the illuminating element

2411, 242, 243, 244‧‧ ‧ corners of light-emitting elements

251, 252‧‧‧ electrodes

251c, 252c‧‧ ‧ side of electrodes 251, 252

251s, 252s‧‧‧ Surfaces of electrodes 251, 252

257‧‧‧1st electrode

257s‧‧‧ Surface of the first electrode 257

258‧‧‧2nd electrode

258s‧‧‧ Surface of the second electrode 258

258a‧‧‧ convex

258b‧‧‧ recess

258L‧‧‧ side

281‧‧‧1st conductive semiconductor layer

282‧‧‧Lighting layer

283‧‧‧2nd conductive semiconductor layer

300‧‧‧Liquid resin material

303‧‧‧ Exterior surface of liquid resin material 300

400‧‧‧covered components

400a‧‧‧The first side of the covering member 400

401‧‧‧1st covering member

402‧‧‧2nd covering member

403‧‧‧covered components

404‧‧‧ Covered material layer

405‧‧‧Box components

406‧‧‧ Thin frame members

406b‧‧‧ the second side of the thin frame member 406

407‧‧‧covered components

409‧‧‧through hole

500‧‧‧wavelength conversion sheet

501‧‧‧wavelength conversion member

501b‧‧‧ side of wavelength conversion member 501

501e‧‧‧ four corners of the wavelength conversion member 501

501x‧‧‧ exposed surface of wavelength conversion member 501

502‧‧‧ Components containing phosphors

502L‧‧‧Transparent resin

510‧‧‧wavelength conversion layer

520‧‧‧The second side of the wavelength conversion sheet 500

X ₁ ‧‧‧ dotted line

X ₂ ‧‧‧ dotted line

X ₃ ‧‧‧dotted line

X ₄ ‧‧‧dotted line

X ₅ ‧‧‧ dotted line

X ₆ ‧‧‧ dotted line

X‧‧‧ directions

Y‧‧‧ direction

Z‧‧‧direction

θ ₁ ‧‧‧ tilt angle

θ ₂ ‧‧‧ tilt angle

Fig. 1 is a schematic plan view showing a light-emitting device of a first embodiment.

2(a) is a schematic cross-sectional view taken along line A-A of Fig. 1, and Fig. 2(b) is a schematic cross-sectional view taken along line B-B of Fig. 1.

3 is a schematic perspective view showing a state in which the covering member is omitted and the light transmitting member is exposed in the light-emitting device of the first embodiment.

Fig. 4 is a schematic bottom view of a light-emitting device of the first embodiment.

5(a) to 5(c) are schematic cross-sectional views for explaining a first manufacturing method of the light-emitting device of the first embodiment.

6(a) and 6(b) are schematic plan views for explaining a second manufacturing method of the light-emitting device of the first embodiment.

7(a) and 7(b) are schematic plan views for explaining a second manufacturing method of the light-emitting device of the first embodiment.

Fig. 8 is a schematic plan view for explaining a second manufacturing method of the light-emitting device of the first embodiment.

Figure 9(a) is a schematic cross-sectional view taken along line CC of Figure 6(a), Figure 9(b) is a schematic cross-sectional view taken along line DD of Figure 6(b), and Figure 9(c) is taken along Figure 7 (a) A schematic cross-sectional view of the EE line.

Fig. 10 (a) is a schematic cross-sectional view taken along line F-F of Fig. 7 (b), and Fig. 10 (b) is a schematic cross-sectional view taken along line G-G of Fig. 8.

11(a) and 11(b) are schematic plan views for explaining a third manufacturing method of the light-emitting device of the first embodiment.

Fig. 12 (a) is a schematic cross-sectional view taken along line H-H of Fig. 11 (a), and Fig. 12 (b) is a schematic cross-sectional view taken along line I-I of Fig. 11 (b).

13(a) to 13(c) are schematic cross-sectional views for explaining a third manufacturing method of the light-emitting device of the first embodiment.

14(a) to 14(c) are schematic cross-sectional views for explaining another example of the third manufacturing method of the light-emitting device of the first embodiment.

Fig. 15 (a) is a schematic plan view of a light-emitting device of a second embodiment, Fig. 15 (b) is a schematic cross-sectional view taken along line JJ of Fig. 15 (a), and Fig. 15 (c) is taken along line 15 (a) A schematic cross-sectional view of the KK line.

16(a) to 16(e) are schematic cross-sectional views for explaining a method of manufacturing the light-emitting device of the second embodiment.

17(a) to 17(d) are schematic cross-sectional views for explaining a method of manufacturing the light-emitting device of the second embodiment.

Fig. 18 is a schematic perspective view of a light-emitting device of a third embodiment.

FIG. 19 is a schematic plan view showing a state in which the covering member is omitted and the light transmitting member is exposed in the light-emitting device of the third embodiment.

FIG. 20 is a schematic perspective view showing a state in which the covering member is omitted and the light transmitting member is exposed in the light-emitting device of the third embodiment.

Figure 21 is a view for explaining the size and shape of a light-transmitting member suitable for a light-emitting device, Figure 21 (a) is a schematic plan view of the light-emitting device, and Figure 21 (b) is taken along line LL of Figure 21 (a) A schematic cross-sectional view.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings. Furthermore, in the following description, terms indicating a particular direction or position (eg, "upper", "lower", "right", "left", and other terms including such terms) are used as needed. The use of the terms is to make the invention of the present invention easy to understand, and the technical scope of the present invention is not limited by the meaning of the terms. In addition, the parts of the same symbols denoted in the plural figures represent the same parts or components.

<Embodiment 1>

The light-emitting device 10 of the present embodiment shown in FIGS. 1 and 2 (a) and (b) includes a light-emitting element 20, a light-transmitting member 30 provided on the side surface 23 side of the light-emitting element 20, and a light-transmitting member 30. The covering member 40 of the outer surface 33. The light-emitting device 10 can include the wavelength conversion member 50 on the first surface (upper surface) 11 side that functions as a light-emitting surface.

Fig. 2(a) is a schematic cross-sectional view taken along line A-A of Fig. 1 (a line orthogonal to one side of the opposite side of the light-emitting element 20). Fig. 2(b) is a schematic cross-sectional view taken along line B-B of Fig. 1 (a line that coincides with the diagonal line of the rectangular light-emitting element 20 in plan view). As shown in FIGS. 2(a) and 2(b), the light-emitting element 20 may include a light-transmitting substrate 27 and a half formed on the lower surface side of the light-transmitting substrate 27. The volume layer body 28 is guided. The light-emitting element 20 has a first surface (upper surface) 21 on the side of the light-transmissive substrate 27, a second surface (lower surface) 22 on the semiconductor laminate 28 side facing the first surface 21, and the first surface 21 and A plurality of side faces 23 between the second faces 22 . The light emitted from the light-emitting element 20 is extracted from the semiconductor laminate 28 through the light-transmitting substrate 27, or from the semiconductor laminate 28 through the side surface 23 of the light-emitting element 20 and the light-transmitting member 30, and is extracted to the first surface of the light-emitting device 10. 11 sides.

The pair of electrodes 251 and 252 for energizing the light-emitting element 20 are provided on the second surface 22 of the light-emitting element 20 (on the side of the semiconductor laminate 28 in FIGS. 2(a) and 2(b)). In the present specification, the "second surface 22" of the light-emitting element 20 refers to the surface of the light-emitting element 20 in a state where the electrodes 251 and 252 are not included. In the present embodiment, the second surface 22 coincides with the lower surface of the semiconductor laminate 28.

Each of the two electrodes 251 and 252 constituting the pair of electrodes may have any shape. For example, in the light-emitting device 10 shown in FIG. 4, the electrodes 251 and 252 can be arranged in one direction when viewed from the second surface 12 side of the light-emitting device 10 (that is, when viewed in the z direction). Direction) The rectangle that extends. Furthermore, the electrodes 251, 252 may not be the same shape. Further, the two electrodes 251 and 252 can be arbitrarily arranged as long as they are spaced apart from each other. In FIG. 4, the two electrodes 251 and 252 are arranged in parallel in the y direction.

Referring again to FIG. 2( a ), the light transmissive member 30 covers the side surface 23 of the light emitting element 20 , and guides light emitted from the side surface 23 to the first surface 11 of the light emitting device 10 . That is, the light reaching the side surface 23 of the light-emitting element 20 can be extracted by the side surface 23 and attenuated in the light-emitting element 20, and the light can be extracted to the outside of the light-emitting element 20 through the light-transmitting member 30. By providing the light transmissive member 30, it is possible to suppress the loss of light, thereby improving the light extraction efficiency of the light-emitting device 10.

In particular, when the side surface 23 of the light-emitting element 20 is inclined with respect to the second surface 22, the effect of the light-transmitting member 30 is remarkable. For example, in the manufacturing step of the light-emitting element 20, when the light-emitting element 20 is singulated, the side surface 23 of the light-emitting element 20 may not be perpendicular to the second surface 22. In general, the section along the A-A line of Figure 1 (Figure 2(a)) Among them, the light-emitting element 20 has a parallelogram shape. In other words, the light-emitting element 20 is formed such that the first surface 21 is parallel to the second surface 22, and the two side surfaces 23 are parallel, and the side surfaces 23 are inclined with respect to the first surface 21 and the second surface 22. Since the angle formed by the one side surface 23 and the second surface 22 becomes an obtuse angle, the light reflected by the one side surface 23 can be directly extracted to the outside of the light-emitting device 10 toward the first surface 21 of the light-emitting element 20. However, since the angle formed by the other side surface 23 and the second surface 22 is an acute angle, the light reflected by the other side surface 23 can be attenuated toward the second surface 22 in the light-emitting element 20.

By covering the other side surface 23 with the light transmissive member 30, light reaching the other side surface 23 can be extracted to the outside of the light-emitting device 10 through the light transmissive member 30.

FIG. 3 shows a light-emitting device 10 in which the covering member 40 is omitted in order to easily grasp the state in which the light-transmitting member 30 is covered with the light-emitting element 20. Further, in order to easily recognize the corner portion of the second surface 22 of the light-emitting element 20 that is in contact with the two side faces 23 (referred to as "the corner portion on the second surface 22 side"), the light-emitting element 20 is oriented toward the second surface 22 The way is shown.

The light transmissive member 30 does not cover the entire side surface 23 of the light emitting element 20 but partially covers the side surface 23. Therefore, specifically, in the vicinity of the corner portions 241, 242, 243, and 244 located on the second surface 22 side of the light-emitting element 20, the side surface 23 of the light-emitting element 20 is exposed from the light-transmitting member 30. Further, the side of the light-emitting element 20 extending in the z direction by the corner portions 241, 242, 243, and 244 (referred to as "the third side 231, 232, 233, 234") is also self-transparent near the corner portion. The member 30 is exposed (see FIGS. 3 and 2(b)). Further, the portion of the side surface 23 from which the light-transmitting member 30 is exposed (the exposed portion of the side surface 23) is covered by the covering member 40 described below, and thus is not exposed to the outer surface of the light-emitting device 10.

Referring again to FIGS. 2(a) and 2(b), the covering member 40 covers the exposed portion of the outer surface 33 of the light transmissive member 30 and the side surface 23 of the light emitting element 20 (FIG. 3). The covering member 40 is formed of a material having a specific relationship with the translucent member 30 and the light-emitting element 20 in relation to the thermal expansion coefficient. Specifically, the difference in thermal expansion coefficient between the light transmissive member 30 and the light emitting element 20 is referred to as "the first thermal expansion coefficient difference ΔT ₃₀ "), and the thermal expansion coefficient of the covering member 40 and the light emitting element 20 is poor (will When it is called "the second thermal expansion rate difference ΔT ₄₀ "), the material of the covering member 40 is selected so that ΔT ₄₀ < ΔT ₃₀ . In other words, the material of the covering member 40 is selected such that the thermal expansion coefficient of the covering member is lower than the thermal expansion coefficient of the light transmitting member. Thereby, peeling of the translucent member 30 from the light emitting element 20 can be suppressed. The mechanism by which the peeling of the light transmissive member 30 can be suppressed is considered as follows.

The peeling of the light transmissive member 30 from the light emitting element 20 is mainly due to heat generation when the light emitting element 20 is turned on. When the light-emitting element 20 is a semiconductor light-emitting element and the light-transmitting member 30 is a resin material, the thermal expansion coefficient (for example, linear expansion coefficient, Young's modulus, etc.) of the light-transmitting member 30 is the thermal expansion coefficient of the light-emitting element 20. 10 times or more. Therefore, when the light-emitting element 20 is turned on, tensile stress is generated at the interface between the light-emitting element 20 and the light-transmitting member 30 due to the difference between the amount of thermal expansion of the light-emitting element 20 and the amount of thermal expansion of the light-transmitting member 30. This stress is released when the light-emitting element 20 is extinguished. In other words, when the light-emitting element 20 is turned on and off repeatedly, tensile stress is generated at the interface every time the light is turned on. Therefore, the adhesion at the interface between the light-emitting element 20 and the light-transmitting member 30 is weakened, and finally, The optical member 30 is peeled off from the light emitting element 20.

As described above, the light transmissive member 30 is configured to extract the light to the light emitting element 20 through the light transmissive member 30 before the light reaching the side surface 23 of the light emitting element 20 is reflected by the side surface 23 and attenuated in the light emitting element. The outer member. Therefore, when the light transmissive member 30 is peeled off from the light emitting element 20, the optical characteristics at the interface between the light emitting element 20 and the light transmissive member 30 change. That is, a portion of the light reaching the side surface 23 of the light-emitting element 20 is not emitted to the light transmissive member 30, but may be reflected by the side surface 23. As a result, the amount of light extracted by the translucent member 30 after the translucent member 30 is peeled off is smaller than that before the translucent member 30 is peeled off. As a result, the light extraction efficiency of the light-emitting device 10 is lowered, and the light distribution characteristics of the light-emitting device 10 are changed. Therefore, in the light-emitting device according to the embodiment of the present invention, by using the light-transmitting member 30 and suppressing the peeling of the light-transmitting member 30 from the light-emitting element 20, it is difficult to change the luminous efficiency and the light distribution characteristics after long-term use. , fixed quality, high reliability Light emitting device 10.

When the peeling state of the light-transmitting member 30 is observed, it is understood that the corner portions 241, 242, 243, and 244 (see FIGS. 2(b) and 3) on the second surface 22 side of the light-emitting element 20 are likely to occur as a starting point. The reason for this is considered to be that the tensile stress generated at the interface between the light-emitting element 20 and the light-transmitting member 30 is concentrated on the corner portion. In particular, since the semiconductor laminate 28 is formed on the second surface 22 side of the light-emitting element 20, heat is likely to occur, and the corner portions 241, 242, and 243 on the second surface 22 side are also easily formed in the corner portions of the light-emitting element 20. 244 produces peeling. Further, when the corner portions 241, 242, 243, and 244 of the light-transmitting member 30 on the second surface 22 side of the light-emitting element 20 are not peeled off, the light-transmitting member 30 is not peeled off on the side surface 23 of the light-emitting element 20. . In other words, when the peeling of the light-transmitting member 30 at the corner portions 241, 242, 243, and 244 on the second surface 22 side of the light-emitting element 20 can be suppressed, peeling of the light-transmitting member 30 can be effectively suppressed.

Therefore, in the embodiment of the present invention, as shown in FIGS. 1(a), (b) and 3, the light extraction efficiency is improved by covering most of the side surface 23 of the light-emitting element 20 with the light-transmitting member 30. And the member (cover member 40) which is not easily peeled off from the light-emitting element 20 covers the corner portions 241, 242, 243, and 244 on the second surface 22 side of the light-emitting element 20 by (instead of being covered by the light-transmitting member 30), The peeling of the light transmissive member 30 covering the side surface 23 is suppressed. As described above, the reason for the peeling is because the difference in thermal expansion rate between the light-emitting element 20 and the member covering it is large. Thus, the difference between the thermal expansion coefficient of the light-emitting element 20 and the thermal expansion coefficient of the light-transmitting member 30, that is, the "first thermal expansion coefficient difference ΔT ₃₀ ", and the thermal expansion coefficient of the light-emitting element 20 and the second surface of the light-emitting element 20 are covered. When the difference in thermal expansion coefficient of the covering member 40 at the corner portion of the 22nd side is the "second thermal expansion coefficient difference ΔT ₄₀ ", the second thermal expansion coefficient difference ΔT ₄₀ <the first thermal expansion coefficient difference ΔT _{30 is obtained} . That is, when the thermal expansion coefficient of the light transmitting member 30 and the thermal expansion coefficient of the covering member 40 are higher when the thermal expansion coefficient of the light emitting element 20 is higher, the thermal expansion coefficient of the covering member 40 is lower than the thermal expansion coefficient of the light transmitting member 30. Thereby, the probability that the light transmissive member 30 is peeled off when the corner portions 241, 242, 243, and 244 on the second surface 22 side of the light emitting element 20 are covered by the light transmissive member 30 is covered by the covering member 40. When the portions 241, 242, 243, and 244 are separated, the probability of the covering member 40 being peeled off is low. Thereby, the probability of peeling of the light transmissive member 30 covering the side surface 23 of the light emitting element 20 can be reduced.

Regarding the thermal expansion coefficient of each member, the thermal expansion coefficient of the light-emitting element 20 is, for example, 7 to 10 ppm/°C. The thermal expansion coefficient of the light transmissive member 30 is, for example, 200 to 300 ppm/° C. at a temperature higher than the glass transition point (Tg) when a resin material is used as the base material. The thermal expansion coefficient of the covering member 40 is, for example, 45 to 100 ppm/° C. at a temperature higher than the glass transition point (Tg) when the resin material is used as the base material.

As a specific example, when the thermal expansion coefficient of each member is assumed to be 7 ppm/° C., the translucent member 30 is 200 ppm/° C., and the covering member 40 is 45 ppm/° C., the first thermal expansion coefficient difference ΔT is obtained. ₃₀ = (200-7) = 193 ppm / ° C, the second coefficient of thermal expansion difference ΔT ₄₀ = (45-7) = 38 ppm / °C. Thereby, the relationship of the second coefficient of thermal expansion difference ΔT ₄₀ <the first coefficient of thermal expansion difference ΔT ₃₀ is satisfied.

In the present specification, the "thermal expansion coefficient of the light-emitting element 20" means the thermal expansion coefficient of the entire light-emitting element 20. For example, as shown in FIGS. 2(a) and 2(b), when the light-emitting element 20 includes a plurality of materials such as the light-transmitting substrate 27 and the semiconductor laminate 28, it means the thermal expansion coefficient of the whole.

As shown in FIG. 3, when the corner portions 241, 242, 243, and 244 on the second surface 22 side of the light-emitting element 20 are exposed from the light-transmitting member 30, the light-emitting elements 20 in the vicinity of the corner portions 241, 242, 243, and 244 are formed. The side surface 23 is also exposed from the light transmissive member 30. The light reaching the exposed portion of the side surface 23 not in contact with the light transmissive member 30 cannot be extracted from the light emitting device 10 by the light transmissive member 30. Thus, from the viewpoint of the light extraction efficiency of the light-emitting device 10, the smaller the area of the exposed portion of the side surface 23, the better. On the other hand, since the exposed portion of the side surface 23 is covered by the covering member 40, the larger the area of the exposed portion is, the better the viewpoint of preventing the peeling of the light transmitting member 30 is. Thereby, various changes can be considered for the arrangement and form of the exposed portion depending on the purpose.

As shown in FIG. 3, the light-emitting element 20 has four corner portions 241 on the second surface 22 side. The case of the substantially rectangular parallelepiped shape of 242, 243, and 244 is described as an example. In the example of FIG. 3, the semiconductor laminate 28 of the light-emitting element 20 includes three semiconductor layers of the first conductive semiconductor layer 281, the light-emitting layer 282, and the second conductive semiconductor layer 283. The first conductive semiconductor layer 281 and the light-emitting layer 282 of the three semiconductor layers 281, 282, and 283 exposed on the side surface of the semiconductor multilayer body 28 are all covered with the light-transmitting member 30, and only a part of the second conductive-type semiconductor layer 283 is provided. The light transmissive member 30 is exposed.

In the first example of the change, only one corner portion (for example, the corner portion 244 of FIG. 3) may be exposed from the light transmissive member 30, and the remaining three corner portions 241, 242, and 243 may be made of a light transmissive member. 30 coverage. Thereby, the side surface 23 of the light-emitting element 20 can be widely covered to the corner portions 241, 242, and 243 by the light-transmitting member 30, so that the light extraction efficiency is high. Since the corner portion 244 from which the light-transmitting member 30 is exposed is covered by the covering member 40 as shown in FIG. 2( b ), it is possible to suppress peeling of the light-transmitting member 30 from the light-emitting element 20 in the vicinity of the corner portion 244 .

In the second example of the change, the two corners located at the diagonal (for example, the corner portions 241 and 243 of FIG. 3) may be exposed from the light transmissive member 30, and the remaining two corner portions 242 and 244 may be transparent. The optical member 30 is covered. Thereby, the side surface 23 of the light-emitting element 20 can be covered by the light-transmitting member 30 to the corner portions 242 and 244, so that the light extraction efficiency is good. Since the corner portions 241 and 243 from which the light-transmitting member 30 is exposed are covered by the covering member 40 as shown in FIG. 2( b ), it is possible to suppress the light-transmitting member 30 from being in the vicinity of the two corner portions 241 and 243 from the light-emitting element. 20 peeling. Further, in the two corner portions 241 and 243 disposed diagonally, the stress generated at the interface between the light-emitting element 20 and the covering member 40 is alleviated, so that it is disposed in the corner portions 242 and 244 between the corner portions. It is also possible to expect a relaxation effect of stress generated at the interface between the light-emitting element 20 and the light-transmitting member 30.

In the third example of the change, the two adjacent corner portions (for example, the corner portions 243 and 244 of FIG. 3) may be exposed from the light transmissive member 30, and the remaining two corner portions 241 and 242 may be made translucent. The member 30 is covered. Thereby, the side surface 23 of the light-emitting element 20 can be covered by the light-transmitting member 30 to the corner portions 241 and 242, so that the light extraction efficiency is good. The corner from which the light transmissive member 30 is exposed Since the 243 and 244 are covered by the covering member 40 as shown in FIG. 2(b), it is possible to prevent the light-transmitting member 30 from being peeled off from the light-emitting element 20 in the vicinity of the two corner portions 243 and 244. In this case, the side 223 sandwiched between the two corner portions 243 and 244 may be exposed from the light transmissive member 30 and covered by the covering member 40, whereby the peeling suppressing effect can be further enhanced.

In the fourth example of the change, three corner portions (for example, the corner portions 241, 242, and 243 of FIG. 3) may be exposed from the light transmissive member 30, and the remaining one corner portion 244 may be made of the light transmissive member 30. cover. Thereby, the side surface 23 of the light-emitting element 20 can be widely covered to the corner portion 244 by the light-transmitting member 30, so that the light extraction efficiency is good. Since the corner portions 241, 242, and 243 from which the light-transmitting member 30 is exposed are covered by the covering member 40 as shown in FIG. 2(b), it is possible to suppress the light-transmitting member 30 from being in the vicinity of the corner portions 241, 242, and 243. The effect of the light-emitting element 20 peeling off is high.

In the fifth example of the change, all of the four corner portions (corner portions 241, 242, 243, and 244 of FIG. 3) can be exposed from the light-transmitting member 30. Since the corner portions 241, 242, 243, and 244 from which the light-transmitting member 30 is exposed are covered by the covering member 40 as shown in Fig. 2(b), it is possible to suppress penetration in the vicinity of the corner portions 241, 242, 243, and 244. The effect of peeling off the light-emitting member 30 from the light-emitting element 20 is particularly high.

The light-emitting element 20 (that is, the fifth example of change) in which all of the four corner portions 241, 242, 243, and 244 are exposed from the light-transmitting member 30 is exemplified, and the light-transmitting member 30 is covered in detail with reference to FIG. The form of the light-emitting element 20. Further, in FIG. 3, the four sides where the first surface 21 of the light-emitting element 20 and the side surface 23 are in contact are referred to as "first side 211, 212, 213, 214", and the second surface 22 and the side surface 23 are The four sides are referred to as "second sides 221, 222, 223, 224", and the four sides that are adjacent to the two side faces 23 are referred to as "third sides 231, 232, 233, 234".

The first sides 211, 212, 213, and 214 surrounding the first surface 21 of the light-emitting element 20 are covered by the light-transmitting member 30 over the entire length of the first sides 211, 212, 213, and 214. The third sides 231, 232, 233, and 234 extending from the first surface 21 to the second surface 22 are in the vicinity of the second surface 22 (that is, the corner portions 241, 242, 243, and 244 on the second surface 22 side). Most of the light-emitting members 30 are covered except for the vicinity. package The second sides 221, 222, 223, and 224 of the second surface 22 surrounding the light-emitting element 20 are other than the corner portions 241, 242, 243, and 244 on the second surface 22 side (in the respective sides in FIG. 3). The vicinity of the point is covered by the light transmissive member 30, and the other portion is exposed from the light transmissive member 30. By covering the light-emitting element 20 with the light-transmitting member 30 in this manner, most of the side surface 23 of the light-emitting element 20 is covered by the light-transmitting member 30, and the corner portions 241, 242 of the second surface 22 side of the light-emitting element 20 are provided. 243, 244 exposed.

In addition, as described above, FIG. 3 shows a case where the corner portions 241, 242, 243, and 244 on the second surface 22 side of the light-emitting element 20 are all exposed from the light-transmitting member 30 (the fifth example of the change). . Therefore, when one of the corner portions is covered by the light transmissive member 30 (the first to fourth examples are changed), the second sides 221, 222, 223, and 224 and the third sides 231, 232, and 233 are In 234, more portions are covered by the light transmissive member 30. For example, when the corner portion 244 is covered by the light transmissive member 30, the end portions of the second sides 223 and 224 extending from the corner portion 244 on the corner portion 244 side are covered by the light transmissive member 30. Further, the third side 234 extending from the corner portion 244 is covered by the light transmissive member 30 over the entire length thereof.

Referring again to FIG. 2(a), the light transmissive member 30 covering the side surface 23 of the light emitting element 20 may partially overlap the first side of the light emitting element 20 (symbols 212 and 214 of FIG. 2(a)). The face 21 or the entire face of the first face 21 is covered. The first surface 21 of the light-emitting element 20 can be protected by the light-transmitting member 30. Further, when the wavelength conversion member 50 is provided on the first surface 21 side of the light-emitting element 20, the light-transmitting member 30 is provided between the first surface 21 of the light-emitting element 20 and the wavelength conversion member 50. The first surface 21 and the subsequent components of the wavelength conversion member 50 function.

In Fig. 3, the light transmissive member 30 covering the side surface 23 of the light-emitting element 20 partially reaches the second sides 221, 222, 223, and 224, but is preferably formed so as not to exceed the second side. That is, as shown in FIG. 3, the upper edge portion of the light transmissive member 30 is located lower than the second sides 221, 222, 223, and 224 in the vicinity of the corner portions 241, 242, 243, and 244, and Consistent with the second side. The light transmissive member 30 of such a shape uses a liquid resin material as a light transmissive property. The material of the member 30 can be easily formed by the surface tension of the liquid resin material being wetted and spread on the side surface 23 of the light-emitting element 20 by the surface tension. Further, by providing a step at a portion where the second surface 22 of the light-emitting element 20 intersects the side surface 23, it is possible to prevent the liquid resin material from spreading to the second surface 22 beyond the step. Such a step can be provided by removing only a portion of the semiconductor laminate 28 such as the light-emitting element 20, and more preferably one of the second conductive semiconductor layers 283 close to the second surface 22 of the light-emitting element 20.

The light transmissive member 30 is preferably a light-emitting layer 282 which is exposed to the side surface 23 of the light-emitting element 20 as widely as possible, in particular. Thereby, the light emission from the light-emitting layer 282 can be efficiently extracted to the outside of the light-emitting element 20 by the light-transmitting member 30.

Further, the case where the upper edge portion of the light transmissive member 30 exceeds the second sides 221, 222, 223, and 224 of the light emitting element 20 is not completely excluded. In other words, the upper edge portion of the light transmissive member 30 may exceed the second sides 221, 222, 223, and 224 of the light emitting element 20, and the light transmissive member 30 partially covers the second surface 22. However, when the second surface 22 is widely covered by the light transmissive member 30, the problem of peeling off the interface between the second surface 22 and the light transmissive member 30 is remarkable.

As shown in FIGS. 2(a), 2(b) and 3, the outer surface 33 of the light-transmitting member 30 is preferably inclined outward from the second surface 22 side of the light-emitting element 20 toward the first surface 21 side. That is, in the cross-sectional views shown in FIGS. 2(a) and 2(b), it is preferable that the left and right outer surfaces 33 of the light transmissive member 30 are expanded toward the first surface (light emitting surface) 11 of the light-emitting device 10. Light that is emitted from the side surface 23 of the light-emitting element 20 and propagates in the light-transmitting member 30 reaches the inclined outer surface 33. Here, when light is reflected by the outer surface 33, the light can be directed in the direction of the first surface 11 of the light-emitting device 10. Thereby, the light extraction efficiency of the light-emitting device 10 can be improved.

In a cross section parallel to one side surface 23 of the light-emitting element 20 (a section along the line AA of FIG. 1 , that is, FIG. 2( a )), the other side surface 23 orthogonal to the one side surface 23 and covering the other side The angle formed by the outer surface 33 of the light transmissive member 30 of one side surface 23 (this is referred to as "inclination angle θ ₁ ") is preferably in an appropriate range. Specifically, the inclination angle θ _{1 is} preferably 40° to 60°, and may be, for example, 45°. When the inclination angle θ _{1 is} large, the first surface 31 of the light transmissive member 30 has a larger outer shape (depicted in a substantially circular shape in FIG. 1 ), and the light extraction efficiency is improved. On the other hand, when the inclination angle θ _{1 is} small, the shape of the first surface 31 is small, so that the size of one side of the light-emitting device 10 in plan view can be reduced (that is, the light-emitting device 10 can be downsized). Considering both the light extraction efficiency and the miniaturization of the light-emitting device 10, the tilt angle θ ₁ =45° is optimal.

The third side of the light-emitting element 20 (the symbol 231 of FIG. 2(b)) along the diagonal line of the light-emitting element 20 (the section along the line BB of FIG. 1, ie, FIG. 2(b)) in plan view 233) The angle formed by the outer surface 33 of the light transmissive member 30 covering the third side (this is referred to as "inclination angle θ ₂ ") is smaller than the inclination angle θ ₁ . That is, as shown in FIGS. 2(a) and 2(b), the inclination angle θ ₂ <the inclination angle θ _{1 is obtained} .

Further, on the outer surface 33 of the light transmissive member 30, a ridge line may be provided as a starting point from a point at which the outer surface 33 is in contact with the third sides 231, 232, 233, and 234 (see FIG. 3) of the light emitting element 20. However, if there is a ridge line on the outer surface 33, there is a concern that the light incident on the light-transmitting member 30 from the side surface 23 of the light-emitting element 20 is at the interface between the outer surface 33 of the light-transmitting member 30 and the covering member 40 (refer to the figure). When 2(a) and (b)) are reflected, light is repeatedly reflected between the ridge lines and the surfaces located on both sides of the ridge line (that is, the two faces constituting the ridge line). The light is gradually absorbed during the reflex reflection and the intensity may be weakened, and thus, the light extraction efficiency of the light-emitting device 10 may be lowered. In order to improve the light extraction efficiency, it is preferable that the ridge line is not present on the outer surface of the light transmissive member 30, that is, the outer surface 33 of the light transmissive member 30 is formed by a smoothly continuous curved surface. Thereby, multiple reflection inside the light transmissive member 30 can be reduced, and the light extraction efficiency of the light-emitting device 10 can be improved.

The outer surface 33 of the light transmissive member 30 may have a linear shape in the cross-sectional views shown in FIGS. 2(a) and 2(b), but may have a curved shape. Here, the "curved shape" may be any one of a curve which is convex outward (on the side of the covering member 40) and a curve which is convex inward (on the side of the light-emitting element 20). From the viewpoint of light extraction efficiency, the outer surface 33 preferably has a convex outward curve.

Furthermore, the curved outer surface 33 which protrudes outward in the cross-sectional view is formed in a perspective view. It is like a dome in Figure 3. Moreover, the curved outer surface 33 which protrudes inward in the cross-sectional view has a flared shape (Flare type) as shown in FIG.

When the light-emitting element 20 includes the light-transmitting substrate 27 and the semiconductor laminated body 28, as shown in FIG. 2, the light-transmitting substrate 27 can be disposed on the first surface 21 side of the light-emitting element 20, and the semiconductor laminated body 28 can be disposed. On the second side 22 side. When the light-emitting element 20 is turned on, heat is generated in the light-emitting layer (symbol 282 of FIG. 3) included in the semiconductor laminate 28, and the light-transmitting member 30 is easily peeled off from the light-emitting element 20 in the vicinity of the semiconductor laminate 28 side. . As shown in FIG. 2(b), on the second surface 22 side of the light-emitting element 20, the corner portions (symbols 241 and 243 in FIG. 2(b)) of the light-emitting element 20 are exposed from the light-transmitting member 30, and The covering member 40 is covered. Thereby, the light-transmitting member 30 is prevented from being peeled off from the light-emitting element 20 on the second surface 22 side of the light-emitting element 20. By disposing the semiconductor laminate 28, which is a source of heat generation due to peeling, on the second surface 22 side of the light-emitting element 20, peeling of the light-transmitting member 30 can be effectively suppressed.

4 is a view of the light-emitting device 10 viewed from the second surface 12 side. The pair of electrodes 251 and 252 of the light-emitting element 20 are exposed from the covering member 40, and are exposed on the second surface (lower surface) 12 of the light-emitting device 10. Thereby, the external electrodes provided on the substrate or the like on which the light-emitting element 20 is mounted can be connected to the electrodes 251 and 252 of the light-emitting element 20. Further, in the light-emitting element 20, in order to protect the light-emitting element 20 from the external environment, the portion of the second surface 22 on which the electrodes 251 and 252 are provided is preferably covered by the covering member 40.

When the second surface 22 of the light-emitting element 20 is covered by the covering member 40, the electrodes 251 and 252 formed on the second surface 22 of the light-emitting element 20 are exposed on the surface (second surface 12) of the light-emitting device 10. For example, the side faces of the electrodes 251 and 252 (symbols 251c and 252c of FIG. 3) may be covered by the covering member 40, but the surfaces 251s and 252s of the electrodes 251 and 252 are adjusted so as not to be covered by the covering member 40. Further, the surfaces 251s and 252s of the electrodes may protrude from the covering member 40 or may be substantially the same plane (see FIG. 2(a)).

Referring again to FIGS. 2(a) and 2(b), as described above, the light-emitting device 10 can include the wavelength conversion member 50 on the first surface 11 side. The wavelength converting member 50 is used to transmit a portion of the transmitted light A component that is converted to another wavelength. The wavelength conversion member 50 contains a phosphor that is excited by the transmitted light. The light-emitting device 10 includes the wavelength conversion member 50, whereby the light-emitting device 10 having the luminescent color different from the luminescent color of the light-emitting element 20 can be obtained. For example, by combining the light-emitting element 20 that emits blue light with the wavelength conversion member 50 that absorbs blue light and emits yellow fluorescent light, the light-emitting device 10 that emits white light can be obtained.

The wavelength conversion member 50 is preferably provided to cover the first surface 21 of the light-emitting element 20 and the first surface 31 of the light-transmitting member 30. The light generated by the light-emitting element 20 is directly extracted from the first surface 21 of the light-emitting element 20, or is emitted from the side surface 23 of the light-emitting element 20, and is indirectly transmitted from the first surface 31 of the light-transmitting member 30 through the light-transmitting member 30. The ground is extracted. Thus, by arranging the wavelength conversion member 50 so as to cover the first surface 21 of the light-emitting element 20 and the first surface 31 of the light-transmitting member 30, substantially all of the light generated by the light-emitting element 20 can pass through the wavelength conversion member. 50. That is, since light that does not pass through the wavelength conversion member 50 does not substantially exist, color unevenness of light emission of the light-emitting device 10 can be suppressed.

<First Manufacturing Method>

Next, a first manufacturing method of the light-emitting device 10 of the present embodiment will be described with reference to Fig. 5 .

Step 1-1. Fixing the light-emitting element 20

The light-emitting element 20 is disposed on the wavelength conversion member 50 (Fig. 5(a)). At this time, the first surface 21 of the light-emitting element 20 and the second surface 52 of the wavelength conversion member 50 are disposed to face each other. The light-emitting element 20 can be fixed to the wavelength conversion member 50 by a light-transmitting adhesive or the like. Instead of using an adhesive, the light-emitting element 20 is fixed to the wavelength conversion member 50 by the light-transmitting member 30 formed later. Moreover, when the wavelength conversion member 50 itself has an adhesive property (in the case of a semi-hardened state or the like), it may be fixed without using an adhesive.

Step 1-2. Formation of Transmissive Member 30

The light transmissive member 30 is formed so as to cover a portion of the side surface 23 of the light emitting element 20 and the vicinity of the light emitting element 20 in the second surface 52 of the wavelength conversion member 50 (Fig. 5(b)). When the light transmissive member 30 is formed of a light transmissive resin material, the liquid resin material 30L which is a material of the light transmissive member 30 is placed along the first side of the light emitting element 20 using a dispenser or the like (FIG. 5(b) The symbols 212, 214) are coated with the interface of the wavelength converting member 50. The liquid resin material 30L spreads over the wavelength conversion member 50 and spreads upward by the surface tension on the side surface 23 of the light emitting element 20. Thereafter, the liquid resin material 30L is cured by heating or the like to obtain the light transmissive member 30.

The distance over which the liquid resin material 30L spreads upward in the light-emitting element 20 can be controlled by adjusting the viscosity and the coating amount of the liquid resin material 30L. For example, in the light transmissive member 30 shown in FIG. 3, the liquid resin material 30L spreads upward on the side surface 23 of the light emitting element 20, and is in contact with one of the second sides 221, 222, 223, and 224. However, the liquid resin material spreads upward on the third sides 231, 232, 233, and 234, but does not reach the corner portions 241, 242, 243, and 244 of the light-emitting element 20. By adjusting the viscosity and the coating amount of the liquid resin material 30L so as to have the form shown in FIG. 3, the corner portions 241, 242, 243, and 244 of the light-emitting element 20 can be exposed from the light-transmitting member 30. The viscosity of the liquid resin material 30L can be adjusted by adding a filler or the like.

When the light transmissive member 30 is formed of the liquid resin material 30L, the outer surface 33 of the light transmissive member 30 can be outwardly directed toward the Z direction by the surface tension (that is, away from the side surface 23 of the light emitting element 20). Tilt (Fig. 5(b)).

Step 1-3. Formation of the covering member 40

The portion of the outer surface 33 of the light transmissive member 30 and the second surface 52 of the wavelength conversion member 50 that is not covered by the light transmissive member 30 (that is, the portion where the second surface 52 is exposed) is covered with the covering member 40. Further, a portion of the second surface 22 of the light-emitting element 20 that is not covered by the electrodes 251 and 252 (that is, a portion where the second surface 22 is exposed) may be covered by the covering member 40. At this time, it is preferable to adjust the thickness (the dimension in the -Z direction) of the covering member 40 so that one of the electrodes 251 and 252 (for example, the surfaces 251s and 252s of the electrodes 251 and 252) is exposed from the covering member 40. That is, when the second surface 52 of the wavelength conversion member 50 is used as a reference, the covering member 40 The height of the second surface 42 may be equal to or less than the height of the surfaces 251s and 252s of the electrodes 251 and 252.

When the covering member 40 is formed of a resin material, for example, a mold frame surrounding the light-emitting element 20 and the light-transmitting member 30 is provided, and the liquid resin material 40L which is a material of the covering member 40 flows into the mold frame. At this time, the wavelength conversion member 50 can be used as the bottom of the mold frame by inserting the mold frame on the outer circumference of the wavelength conversion member 50 (see FIG. 5(c)). Thereafter, the liquid resin material 40L is cured by heating or the like to obtain the covering member 40. By removing the mold frame, the light-emitting device 10 shown in Figs. 1, 2, and 4 can be obtained. Further, the covering member 40 can be formed by various methods such as spray coating and compression molding. Further, after the covering members are formed so as to embed the electrodes 251 and 252, only the covering member 40 or the covering member 40 and one of the electrodes 251 and 252 may be partially removed, and the electrodes 251 and 252 may be exposed.

<Second Manufacturing Method>

A second manufacturing method of the light-emitting device 10 of the present embodiment will be described with reference to Figs. 6 to 10 . In the second manufacturing method, a plurality of light-emitting devices 10 can be simultaneously manufactured.

Step 2-1. Fixing the light-emitting element 20

The light-emitting element 20 is disposed on the second surface 520 of the wavelength conversion sheet 500 (Fig. 6 (a), Fig. 9 (a)). The wavelength conversion sheet 500 is a wavelength conversion member 50 after being singulated into the respective light-emitting devices 10 . At this time, a plurality of light-emitting elements 20 are disposed on one wavelength conversion sheet 500 using a relatively large wavelength conversion sheet 500. Adjacent light-emitting elements 20 are arranged at specific intervals. Further, when the interval between the adjacent light-emitting elements 20 is too wide, the number of light-emitting devices 10 that can be simultaneously formed is reduced, and the mass production efficiency of the light-emitting device 10 is deteriorated. Therefore, the light-emitting elements 20 are preferably arranged at appropriate intervals. . The light-emitting element 20 is fixed to a specific position of the wavelength conversion sheet 500 by the same fixing method as the fixing method described in the step 1-1. of the first manufacturing method.

Step 2-2. Formation of Transmissive Member 30

Similarly to the step 1-2 of the first manufacturing method, the light transmissive member 30 is formed around each of the light-emitting elements 20 (FIG. 6(b) and FIG. 9(b)). The translucent member 30 is formed such that the translucent member 30 formed around the light-emitting element 20 does not contact the translucent member 30 formed around the light-emitting element 20 disposed adjacent to the light-emitting element 20.

Step 2-3. Formation of the covering member 400

Similarly to the steps 1-3 of the first manufacturing method, the outer surface 33 of the light transmissive member 30 and the second surface 520 of the wavelength conversion sheet 500 are covered by the covering member 400 (Fig. 7(a), Fig. 9 (Fig. 7(a), Fig. 9( c)). After the covering member 400 is singulated into the respective light-emitting devices 10, the covering member 400 becomes the covering member 40. Step 2-3. Unlike the step 1-3., the thickness (the dimension in the -z direction) of the covering member 400 is adjusted so as to cover the surfaces 251s and 252s of the electrodes 251 and 252 of the light-emitting element 20. At this time, the plurality of light transmissive members 30 provided around the plurality of light emitting elements 20 disposed on the wavelength conversion sheet 500 are covered by one continuous covering member 400.

Thereafter, the thickness of the covering member 400 is reduced by a known processing method so that the electrodes 251 and 252 of the light-emitting element 20 are exposed (FIG. 7(b) and FIG. 10(a)).

Step 2-4. Singulation of the illuminating device 10

The covering member 400 and the wavelength are cut by a cutter or the like along a broken line X ₁ , a broken line X ₂ , a broken line X _{3 ,} and a broken line X ₄ ( FIGS. 7( b ), 10 ( a )) passing through the middle of the adjacent light emitting elements 20 . The conversion sheet 500 is cut. Thereby, each of the light-emitting devices 10 is singulated (FIG. 8, FIG. 10(b)). In this manner, a plurality of light-emitting devices 10 including one light-emitting element 20 can be simultaneously manufactured.

Further, in the light-emitting device 10 after the singulation, when the light-transmitting member 30 is exposed on the side surface 13 of the light-emitting device 10 (the side surface 40c of the covering member 40), the light emitted from the light-emitting element 20 passes through the light-transmitting member 30. The side 13 of the self-illuminating device 10 leaks in the lateral direction. Therefore, it is preferable to adjust the interval between the adjacent light-emitting elements 20 or the viscosity of the light-transmitting member 30, etc., so that the light-transmitting member 30 is not exposed from the side surface 13 of the light-emitting device 10.

<Third Manufacturing Method>

Referring to FIG. 11 to FIG. 12, the third system of the light-emitting device 10 of the present embodiment is faced. The method of making is explained. In the third manufacturing method, a plurality of light-emitting devices 10 can be simultaneously manufactured. In addition, about the same procedure as the second manufacturing method, description is abbreviate|omitted.

Step 3-1. Configuration of Transmissive Member 30

The liquid resin material 300 for forming the light transmissive member 30 is applied to a plurality of isolated island shapes on the second surface 520 of the wavelength conversion sheet 500 (FIGS. 11(a) and 12(a)). At this time, a plurality of island-shaped liquid resin materials 300 are placed on one wavelength conversion sheet 500 by using a relatively large wavelength conversion sheet 500. Each of the liquid resin materials 300 provided in an island shape can be formed into any shape in plan view, and examples thereof include a circular shape, an elliptical shape, a square shape, and a rectangular shape. In addition, when the interval between the adjacent island-shaped liquid resin materials 300 is too wide, the number of light-emitting devices 10 that can be simultaneously formed is reduced, and the mass production efficiency of the light-emitting device 10 is deteriorated. Therefore, the liquid resin material 300 is 300. It is preferably arranged at appropriate intervals.

Step 3-2. Fixation of Light Emitting Element 20 and Hardening of Liquid Resin Material 300

As shown in FIGS. 11(b) and 12(b), the light-emitting element 20 is placed on each of the island-shaped liquid resin materials 300. The liquid resin material 300 is climbed up to the side surface 23 of the light-emitting element 20 by the surface tension only by disposing the light-emitting element 20 on the island-shaped liquid resin material 300 or by pressing the light-emitting element 20 after the arrangement. The outer surface 303 of the liquid resin material 300 (the outer surface 33 of the light transmissive member 30 described later) has a shape that expands downward. Thereafter, the light transmissive member 30 is formed by curing the liquid resin material 300.

The planar shape of the liquid resin material 300 is deformed by the arrangement or pressing of the light-emitting element 20, and becomes the first surface 31 (see FIGS. 1 and 2) of the light-transmitting member 30 included in the light-emitting device 10 as the final product. The shape is roughly the same.

Further, in this manufacturing method, the liquid resin material 300 exists in a film form between the wavelength conversion sheet 500 and the light emitting element 20. The film-shaped light transmissive member 30t formed by curing the film-like liquid resin material 300 can also function as an adhesive between the wavelength conversion sheet 500 and the light-emitting element 20. The thickness of the film-shaped light-transmitting member 30t is preferably determined in consideration of the adhesion and the heat dissipation property of the light-emitting device 10. Specifically, the film-like light transmissive member 30t The thickness can be, for example, 2 to 30 μm, preferably 4 to 20 μm, and most preferably about 5 to 10 μm, so that when the light-emitting device 10 emits light, heat generated from the wavelength conversion member 500 can be efficiently conducted to the side of the light-emitting element 20. .

Thereafter, the covering member 400 is formed in the same manner as in the step 2-3 of the second manufacturing method, and the light-emitting device 10 is singulated in the same manner as in the step 2-4. Thereby, a plurality of light-emitting devices 10 including one light-emitting element 20 can be simultaneously manufactured.

As described above, according to the manufacturing method, the liquid resin element 300 is applied to the wavelength conversion sheet 500 in an island shape, and the light emitting element 20 is disposed, whereby the light emitting element 20 and the light transmissive member 30 can be simultaneously performed. Formation. Thereby, mass productivity can be improved.

<Fourth manufacturing method>

A fourth manufacturing method of the light-emitting device 10 of the present embodiment will be described with reference to Figs. 13 to 14 . In the fourth manufacturing method, a plurality of light-emitting devices 10 can be simultaneously manufactured.

Step 4-1. Fixing the light-emitting element 20

The light-emitting element 20 is disposed on the upper surface 60a of the support member 60 including the heat-resistant sheet or the like (Fig. 13(a)). At this time, a plurality of light-emitting elements 20 are disposed on one support member 60 using a relatively large support member 60. Similarly to step 2-1 of the second manufacturing method, the adjacent light-emitting elements 20 are arranged at a predetermined interval. The light-emitting element 20 is fixed to a specific position of the support member 60 by the same fixing method as the fixing method described in the step 1-1. of the first manufacturing method.

Step 4-2. Formation of Transmissive Member 30

Similarly to the step 1-2 of the first manufacturing method, the light transmissive member 30 is formed around each of the light-emitting elements 20 (FIG. 13(b)). The translucent member 30 is formed such that the translucent member 30 formed around the light-emitting element 20 does not contact the translucent member 30 formed around the light-emitting element 20 disposed adjacent to the light-emitting element 20.

Step 4-3. Formation of the covering member 400

The outer surface 33 of the light transmissive member 30 and the upper surface 60a of the support member 60 are covered by the covering member 400 by the same method as step 1-3 of the first manufacturing method (Fig. 13 (c)). The covering member 400 is a covering member 40 after being singulated into each of the light-emitting devices 10 . The plurality of light transmissive members 30 provided around the plurality of light emitting elements 20 disposed on the support member 60 are covered by one continuous covering member 400.

Step 4-4. Formation of the wavelength conversion layer 510

The support member 60 is removed (peeled), and the first surface 21 of the light-emitting element 20 and the first surface 400a of the covering member 400 are exposed (FIG. 14(a)). Thereafter, a wavelength conversion layer 510 covering the first surface 21 of the light-emitting element 20 and the first surface 400a of the covering member 400 (hereinafter referred to as "first surface 21, 400a") is formed. The wavelength conversion layer 510 becomes the wavelength conversion member 50 after being singulated into the respective light-emitting devices 10. The method of forming the wavelength conversion layer 510 includes a method of adhering a sheet containing a light-transmitting resin containing a phosphor to a first surface 21, 400a by heat fusion or an adhesive; A method in which a light-transmitting resin is adhered to the first surface 21, 400a and then the light-transmitting resin is impregnated into the adhered phosphor; by pouring, transfer molding, compression molding, molding by casting, spraying, or electrostatic coating A known technique such as a method or a printing method is a method in which a light-transmitting resin containing a phosphor is applied to the first faces 21 and 400a. Among these methods, a spray method is preferred, and a pulse spray method in which a spray is intermittently sprayed is particularly preferred.

Step 4-5. Singulation of the illuminating device 10

Similarly to step 2-4 of the second manufacturing method, the covering member 400 and the wavelength conversion layer 510 are cut by a cutter or the like along a broken line X ₁ and a broken line X _{2 in} the middle of the adjacent light-emitting elements 20 (FIG. 14). (b)). Thereby, each of the light-emitting devices 10 is singulated (FIG. 14(c)). In this manner, a plurality of light-emitting devices 10 including one light-emitting element 20 can be simultaneously manufactured.

<Embodiment 2>

As shown in FIG. 15, the light-emitting device 15 of the present embodiment differs from the light-emitting device 10 of the first embodiment in that the side surface 501b of the wavelength conversion member 501 is covered by the covering member 403 and the covering member 403 has a two-layer structure. . Regarding other aspects and embodiment 1 with.

The light-emitting device 15 of the present embodiment includes the light-emitting element 20, the wavelength conversion member 501 that covers the first surface 21 of the light-emitting element 20, the light-transmitting member 30 that is provided on the side surface 23 side of the light-emitting element 20, and the light-transmitting member 30. The covering member 403 of the outer surface 33. In the present embodiment, the covering member 403 includes the first covering member 401 that covers the side surface 501b of the wavelength conversion member 501, and the second covering member 402 that covers the outer surface 33 of the light transmitting member 30.

By covering the side surface 501b of the wavelength conversion member 501 by the covering member 403 (first covering member 401), it is possible to suppress the internal light from the light-emitting element 20 from propagating inside the wavelength conversion member 501 and leaking laterally from the side surface 501b. Most of the light emission from the light-emitting device 15 is extracted from the first surface (upper surface) 16 functioning as the light-emitting surface of the light-emitting device 15. That is, since the light from the light-emitting device 15 is emitted substantially in the z direction, the directivity of the light of the light-emitting device 15 can be improved.

Next, a method of manufacturing the light-emitting device 15 will be described with reference to Figs. 16 to 17 .

Step A. Formation of Wavelength Conversion Member 501

A coating material layer 404 for forming the first covering member 401 is formed on the first supporting member 61 including the heat-resistant sheet or the like (FIG. 16(a)). Thereafter, the frame member 405 is obtained by providing a plurality of through holes 409 in the covering material layer 404 (FIG. 16(b)). The size and shape of the inner surface of the through hole 409 of the frame member 405 when viewed from the z direction are the same as those of the wavelength conversion member 501 in the plan view of the light-emitting device 15 shown in Fig. 15(a). In addition, when the through hole 409 is formed, it is formed so as to penetrate the covering material layer 404 and not penetrate the first supporting member 61.

Each of the through holes 409 is filled with a light-transmitting resin (liquid resin material before curing) 502L containing a phosphor (FIG. 16(b)). Thereafter, the light-transmitting resin 502L is cured by heating to form a member 502 containing a phosphor (FIG. 16(c)). The upper side portion of the phosphor-containing member 502 and the upper side of the frame member 405 on the upper side of the Ct-Ct line (dashed line) of FIG. 16(c). The minute is removed by cutting or the like. Thereby, a sheet-like member including the lower side portion (wavelength converting member 501) of the member 502 including the phosphor and the lower portion of the frame member 405 (hereinafter referred to as "thin frame member 406") is formed (FIG. 16 (FIG. 16) d)). The thin frame member 406 becomes the first covering member 401 shown in Fig. 15 (b) below. Then, the sheet member (the wavelength converting member 501 and the thin frame member 406) is transferred to the second supporting member 62 including the heat resistant sheet or the like (FIG. 16(e)). Further, the transfer of the sheet member may be omitted.

Step B. Fixing the light-emitting element 20

The light-emitting element 20 is fixed to the exposed surface 501x of each wavelength conversion member 501 (Fig. 17 (a)). The fixing method of the light-emitting element 20 is the same as the fixing method described in the step 1-1 of the first embodiment.

Step C. Formation of the light transmissive member 30

In the same manner as in the step 1-2 of the first embodiment, a liquid resin material 30L which is a material of the light transmissive member 30 is applied around the light-emitting element 20 (FIG. 17(b)). The liquid resin material 30L is cured by heating or the like to obtain the light transmissive member 30. Further, the applied liquid resin material 30L spreads along the exposed surface 501x of the wavelength conversion member 501, but when reaching the boundary line between the wavelength conversion member 501 and the thin frame member 406, it is difficult due to the pinning effect. Further expansion. Therefore, in the light-emitting device 15 of the present embodiment, it is easy to control the form of the light-transmitting member 30. As shown in Fig. 15 (a), the light transmissive member 30 does not reach the four corner portion 501e (the portion marked with hatching) of the wavelength conversion member 501. Thereby, the four-corner portion 501e is exposed from the light-transmitting member 30.

Step D. Formation of the covering member 407

The outer surface 33 of the light transmissive member 30, the four corner portions of the wavelength conversion member 501 (symbol 501e of Fig. 15(a)), and the surrounding are covered by the covering member 407 in the same manner as the steps 1-3 of the first embodiment. The second surface 406b of the thin frame member 406 of the wavelength conversion member 501 (Fig. 17(c)). After the covering member 407 is singulated into the respective light-emitting devices 15 , the covering member 407 becomes the second covering member 402 . A plurality of light transmissive members 30 disposed around the plurality of light emitting elements 20 are One continuous covering member 407 is covered. Further, as shown in FIG. 15(a), the wavelength conversion member 501 is covered by the light transmissive member 30 except for the square portion 501e. Thereby, the wavelength conversion member 501 is covered by the covering member 407 only by the corner portion 501e which is not covered by the light transmissive member 30 (FIG. 15(c)).

Step E. Singulation of the illuminating device 15

The covering member 407, the thin frame member 406, and the second supporting member 62 are cut by a cutter or the like along a broken line X ₅ and a broken line X ₆ passing through the middle of the adjacent light emitting elements 20. Finally, the light-emitting device 15 is obtained by removing (peeling) the second support member 62. Further, the second supporting member 62 may be removed before the cutting, and then the covering member 407 and the thin frame member 406 may be cut.

<Embodiment 3>

In the present embodiment, the shape of the electrode of the light-emitting element included in the light-emitting device is different from the shape of the electrodes 251 and 252 of the light-emitting element 20 of the first embodiment. The configuration of the light-emitting device other than this is the same as that of the first embodiment.

Fig. 18 is a perspective view of the light-emitting device 17 of the embodiment. The light-emitting element 207 included in the light-emitting device 17 includes a semiconductor laminate 28 and a pair of electrodes 257 and 258. On the second surface (lower surface) 172 of the light-emitting device 17, the surfaces 257s and 258s of the pair of electrodes 257 and 258 are exposed from the covering member 40.

In the present embodiment, the surface 257s of the first electrode 257 and the surface 258s of the second electrode 258 are different in shape. The surface 257s of the first electrode 257 is a rectangle extending in one direction (y direction). The surface 258s of the second electrode 258 has a comb shape in which a plurality of convex portions 258a and a plurality of concave portions 258b are alternately arranged on the side 258L facing the first electrode 257. The recess 258b is buried by the covering member 40. Thereby, the adhesion between the light-emitting element 207 and the covering member 40 can be improved.

The shape of the convex portion 258a and the concave portion 258b can be any shape. For example, in FIG. 18, the shape of the concave portion 258b is set to include a strip portion and a setting extending from the side 258L in the x direction. The shape of the circular portion at the end of the strip portion. When two or more recessed portions 258b are formed, the shape of the recessed portions 258b may be all the same shape as shown in FIG. 18, and some or all of them may have different shapes. In the case where three or more recessed portions 258b are formed, the interval between the adjacent recessed portions 258b may be all equal as shown in Fig. 18, but may be different.

19 is a plan view of the light-emitting device 17 in a state in which the covering member 40 shown in FIG. 18 is omitted, and FIG. 20 is a perspective view of the light-emitting device 17 in a state in which the covering member 40 is omitted. As shown in FIG. 19 and FIG. 20, the light-emitting element 207 can be reflected on the second surface 207b side, more specifically on the second semiconductor layer 283 side (see FIGS. 20 and 3) of the semiconductor laminate 28 of the light-emitting element 207. Membrane 29. The reflective film 29 can be formed of a material such as a metal having a high light reflectance such as Ag or Al or a dielectric multilayer film. By providing the reflection film 29, the light in the direction toward the second surface 207b can be reflected in the direction of the first surface 207a.

As shown in FIG. 19, in the light-emitting element 207, the semiconductor laminate 28 and the reflection film 29 are not formed at the corners of the light-transmitting substrate 27 due to the manufacturing steps. The corner portion of the light-transmitting substrate 27 on which the reflection film 29 is not formed is preferably covered by the covering member 40, and the light directed to the corner portion of the light-transmitting substrate 27 is reflected at the interface between the light-transmitting substrate 27 and the covering member 40. It can contribute to improving the light extraction efficiency of the light-emitting device 17.

Hereinafter, materials and the like of the respective constituent members of the light-emitting device 10 according to the first to third embodiments will be described.

(light-emitting elements 20, 207)

As the light-emitting elements 20 and 207, for example, a semiconductor light-emitting element such as a light-emitting diode can be used. The semiconductor light emitting element may include a light transmissive substrate 27 and a semiconductor laminate 28 formed thereon.

(translucent substrate 27)

The light-transmitting substrate 27 of the light-emitting elements 20 and 207 can be made of an insulating material such as sapphire (Al ₂ O ₃ ) or spinel (MgAl ₂ O ₄ ), or light-emitting from the semiconductor laminated body 28. A semiconductor material that is transmitted (for example, a nitride-based semiconductor material).

(semiconductor laminate 28)

The semiconductor laminate 28 includes a plurality of semiconductor layers. An example of the semiconductor laminate 28 may include three of a first conductive semiconductor layer (for example, an n-type semiconductor layer) 281, a light-emitting layer (activation layer) 282, and a second conductive semiconductor layer (for example, a p-type semiconductor layer) 283. Semiconductor layer (see Fig. 3). The semiconductor layer may be formed of a semiconductor material such as a III-V compound semiconductor or a II-VI compound semiconductor. Specifically, In _X Al _Y Ga _1-XY N (0) can be used. X,0 Y, X+Y 1) A nitride-based semiconductor material (for example, InN, AlN, GaN, InGaN, AlGaN, InGaAlN, etc.).

(electrodes 251, 252, 257, 258)

As the electrodes 251, 252, 257, and 258 of the light-emitting elements 20 and 207, an electrically conductive conductor can be used, and for example, a metal such as Cu is preferable.

(translucent member 30)

The light transmissive member 30 can be formed of a light transmissive material such as a translucent resin or glass. The translucent resin is preferably a thermosetting translucent resin such as a polyoxyxylene resin, a polyoxymethylene modified resin, an epoxy resin, or a phenol resin. Since the light transmissive member 30 is in contact with the side surface 23 of the light emitting element 20, it is easily affected by the heat generated in the light emitting element 20 at the time of lighting. Since the thermosetting resin is excellent in heat resistance, it is suitable for the light transmissive member 30. Further, the light transmissive member 30 preferably has a high light transmittance. Therefore, it is preferable that an additive that reflects, absorbs, or scatters light is not normally added to the light transmissive member 30. However, in order to impart preferable characteristics, it is preferable to add an additive to the light transmissive member 30. For example, in order to adjust the refractive index of the light transmissive member 30 or to adjust the viscosity of the light transmissive member (liquid resin material 300) before curing, various fillers may be added.

In the plan view of the light-emitting device 10, the outer surface of the first surface 31 of the light-transmitting member 30 is at least larger than the outer surface of the second surface 22 of the light-emitting element 20. The shape of the first surface 31 of the light transmissive member 30 can be various shapes, and for example, it can be a circular shape as shown in Fig. 21 (a), as shown in Fig. 15 (a). Rounded quadrilateral, and elliptical, square, rectangular and other shapes.

In particular, as shown in FIG. 21( a ), the size of the first surface 31 of the light transmissive member 30 in plan view (the shape from the first surface 21 of the light-emitting element 20 to the first surface 31 of the light-transmitting member 30 is formed. The outer shape distance is preferably 30D < size 30W when comparing the dimension 30D on the diagonal of the light-emitting element 20 with the dimension 30W from the center of the side surface 23 of the self-luminous element 20 to the line perpendicular to the side surface 23. In order to satisfy the dimensional condition, the shape of the first surface 31 of the light transmissive member 30 is preferably a circular shape, an elliptical shape, or a rounded quadrangular shape.

Further, the outer shape of the first surface 31 of the light transmissive member 30 may be determined based on other conditions. For example, when the light-emitting device 10 is used in combination with an optical lens (secondary lens), if the shape of the first surface 31 is preferably circular, the light emitted from the light-emitting device 10 is also close to a circular shape. Therefore, it is easy to collect light by using an optical lens. On the other hand, when it is desired to reduce the size of the light-emitting device 10, it is preferable to form the outer surface of the first surface 31 into a quadrangular shape having a rounded shape, and to reduce the size by 30 W. Therefore, the upper surface 11 of the light-emitting device 10 can be reduced. size.

In general, in consideration of the ease of collecting light by the optical lens and the miniaturization of the light-emitting device 10, it is preferable that the ratio of the size 30D to the size 30W is 30D/30W=2/3~1/2.

Further, as shown in FIG. 21(a) and FIG. 21(b), when the size of the first surface 21 to the second surface 22 of the self-luminous element 20 is "the thickness 20T of the light-emitting element 20", the size 30W and the thickness are obtained. 20T can be approximated by the relationship of tan θ ₁ = 30W/20T. Here, in the case of, for example, 30 W=250 μm and 20T=150 μm, the inclination angle θ ₁ =59° can improve the light extraction efficiency.

As described above, the inclination angle θ _{1 is} preferably 40° to 60°. Therefore, if the thickness 20T of the light-emitting element 20 to be used is determined, a range of preferably 30 W can be determined.

(covered member 40, 403)

The covering members 40 and 403 are formed of a material having a specific relationship with respect to the relationship between the thermal expansion coefficients of the light transmitting member 30 and the light emitting element 20. That is, the covering member covering member 40,403 to 40,403 lines with the light emitting element 20 of the thermal expansion coefficient difference △ T ₄₀ is less than the translucent member 30 and the light emitting element 20 of the coefficient of thermal expansion difference △ T manner of selection of the material _30. For example, when the light-emitting element 20 includes the sapphire translucent substrate 27 and the semiconductor laminate 28 including the GaN-based semiconductor, the thermal expansion coefficient of the light-emitting element 20 is approximately 5 to 9 × 10 ^-6 /K. On the other hand, in the case where the light transmissive member 30 is formed of a polyoxyxylene resin, the thermal expansion coefficient of the light transmissive member 30 is 2 to 3 × 10 ^-5 /K. Thereby, the covering members 40 and 403 are formed of a material having a thermal expansion coefficient smaller than that of the polyoxynoxy resin, whereby ΔT ₄₀ <ΔT _{30 can be obtained} .

When a resin material is used for the covering members 40 and 403, in general, the coefficient of thermal expansion is 10 ^-5 /K, which is an order of magnitude higher than that of the general light-emitting element 20. However, by adding a filler or the like to the resin material, the thermal expansion coefficient of the resin material can be lowered. For example, by adding a filler such as cerium oxide to the polyoxyxene resin, the coefficient of thermal expansion can be lowered as compared with the polyoxynoxy resin before the filler is added.

As the resin material which can be used for the covering members 40 and 403, a thermosetting translucent resin such as a polyfluorene oxide resin, a polyfluorene-modified resin, an epoxy resin or a phenol resin is particularly preferable.

The covering members 40 and 403 may be formed of a light reflective resin. The light reflective resin refers to a resin material having a reflectance of 70% or more with respect to light from the light emitting element 20. The light reaching the covering members 40 and 403 is reflected toward the first surface 11 (light emitting surface) of the light-emitting device 10, whereby the light extraction efficiency of the light-emitting device 10 can be improved.

As the light-reflective resin, for example, a light-reflective material can be used as a dispersion of a light-transmitting resin. As the light-reflecting substance, for example, titanium oxide, cerium oxide, titanium oxide, zirconium dioxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite or the like is preferable. Although the light-reflective substance can be used in the form of a pellet, a fiber, or a thin plate, it is preferable that the fiber-like shape can also be expected to lower the coefficient of thermal expansion of the covering members 40 and 403.

(wavelength conversion member 50)

The wavelength conversion member 50 includes a phosphor and a light transmissive material. As a light transmissive material, A translucent resin, glass, or the like can be used. Particularly preferred is a translucent resin, and a thermosetting resin such as polyfluorene oxide resin, polyfluorene modified resin, epoxy resin, or phenol resin, polycarbonate resin, acrylic resin, methylpentene resin, or polycondensate can be used. A thermoplastic resin such as bornene resin. Particularly preferred is a polyoxyl resin excellent in light resistance and heat resistance.

The fluorescent system uses an illuminator that can be excited by the illuminating element 20. For example, as a phosphor that can be excited by a blue light-emitting element or an ultraviolet light-emitting element, a ruthenium-aluminum-garnet-based phosphor (Ce:YAG) activated by ruthenium; a ruthenium-aluminum-pomegranate activated by ruthenium Stone-based phosphor (Ce: LAG); nitrogen-containing aluminum citrate-based phosphor (CaO-Al ₂ O ₃ -SiO ₂ ) activated by cerium and/or chromium; cerium-activated citrate Phosphor ((Sr,Ba) ₂ SiO ₄ ); nitride-based phosphor such as β-Sialon phosphor, CASN-based phosphor, SCASN-based phosphor; KSF-based phosphor (K ₂ SiF ₆₎ : Mn); sulfide-based phosphor, quantum dot phosphor, and the like. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, it is possible to manufacture light-emitting devices of various colors (for example, white-based light-emitting devices).

In order to adjust the viscosity or the like, the wavelength conversion member 50 may contain various fillers or the like.

Further, instead of the wavelength conversion member 50, the surface of the light-emitting element may be coated with a material that does not contain the light-transmitting property of the phosphor. Further, in order to adjust the viscosity and the like, various materials such as fillers may be contained in the light transmissive material.

The embodiments of the present invention have been exemplified above, but the present invention is not limited to the above-described embodiments, and any of them may be used as long as they do not deviate from the gist of the present invention.

10‧‧‧Lighting device

11‧‧‧The first side (upper surface) of the illuminating device

12‧‧‧The second side (lower surface) of the illuminating device

20‧‧‧Lighting elements

21‧‧‧The first side (upper surface) of the light-emitting element

22‧‧‧The second side (lower surface) of the light-emitting element

23‧‧‧ Side of the light-emitting element

27‧‧‧Transmissive substrate

28‧‧‧Semiconductor laminate

30‧‧‧Transparent components

31‧‧‧The first side of the translucent member

33‧‧‧ Exterior surface of translucent member

40‧‧‧covered components

50‧‧‧wavelength conversion member

212, 214‧‧‧ the first side of the light-emitting element

222, 224‧‧ ‧ the second side of the illuminating element

231, 233‧‧ ‧ the third side of the illuminating element

241, 243‧‧‧ corners of light-emitting elements

251, 252‧‧‧ electrodes

251s, 252s‧‧‧ surface of the electrode

X‧‧‧ directions

Y‧‧‧ direction

Z‧‧‧direction

θ ₁ ‧‧‧ tilt angle

θ ₂ ‧‧‧ tilt angle

Claims (15)

A light-emitting device comprising: a light-emitting element having a first surface, a second surface facing the first facing surface, and a plurality of side surfaces between the first surface and the second surface, and having a plurality of a corner portion of the second surface that is in contact with two of the plurality of side surfaces, a pair of electrodes on the second surface side, and a light transmissive member covering at least one of the side surfaces and the at least one One side of the side where the side surface is in contact with the second surface is exposed to expose one or more of the plurality of corner portions, and the covering member covers the exposed corner portion of the light-emitting element and the outer surface of the light-transmitting member The pair of electrodes are exposed; and a difference in thermal expansion coefficient between the covering member and the light-emitting element is smaller than a thermal expansion coefficient of the light-transmitting member and the light-emitting element. A light-emitting device comprising: a light-emitting element having a first surface, a second surface facing the first facing surface, and a plurality of side surfaces between the first surface and the second surface, and having a plurality of a corner portion of the second surface that is in contact with two of the plurality of side surfaces, a pair of electrodes on the second surface side, and a light transmissive member covering at least one of the side surfaces and the at least one One side of the side where the side surface is in contact with the second surface is exposed to expose one or more of the plurality of corner portions, and the covering member covers the exposed corner portion of the light-emitting element and the outer surface of the light-transmitting member The pair of electrodes are exposed; and the thermal expansion coefficient of the covering member is lower than the thermal expansion coefficient of the light transmissive member. The illuminating device of claim 1 or 2, wherein said outer surface of said light transmissive member The second surface side of the light-emitting element is inclined outward toward the first surface side. The light-emitting device according to claim 1 or 2, wherein the light-emitting element has a substantially rectangular parallelepiped shape having four corner portions, and two of the four corner portions are diagonally covered by the covering member. The light-emitting device of claim 1 or 2, wherein the light-emitting element has a substantially rectangular parallelepiped shape having four corner portions, and two adjacent ones of the four corner portions are adjacent to the adjacent two corner portions One of the sides is covered by the above-mentioned covering member. The light-emitting device of claim 4, wherein the four corner portions are all covered by the covering member. The illuminating device of claim 5, wherein the four corner portions are all covered by the covering member. The light-emitting device according to claim 1 or 2, wherein the light-emitting element includes a light-transmitting substrate and a semiconductor laminate, wherein the light-transmissive substrate is disposed on the first surface side of the light-emitting device, and the semiconductor laminate system is disposed in the first 2 sides. The light-emitting device of claim 1 or 2, wherein the light transmissive member comprises a light transmissive resin, and the cover member comprises a light reflective resin. The light-emitting device according to claim 1 or 2, wherein the light-transmitting member has a first surface that is flush with the first surface of the light-emitting element, and the first surface of the light-emitting element and the light-transmitting member are The first surface is covered by the wavelength conversion member. The light-emitting device according to claim 1 or 2, wherein the first surface of the light-emitting element is covered by the light-transmitting member. A method of manufacturing a light-emitting device, comprising the steps of: preparing a wavelength conversion member; Disposing the light-emitting element on the wavelength conversion member such that a first surface of the light-emitting element faces the second surface of the wavelength conversion member; covering at least one side of the light-emitting element and at least one of the light-emitting elements The light transmissive member is formed to expose the corner portions, and the covering member is formed to cover the outer surface of the light transmissive member and the at least one corner portion of the light emitting element exposed from the light transmissive member. The method of manufacturing a light-emitting device according to claim 12, wherein the step of forming the light-transmitting member comprises: disposing a liquid resin material on the wavelength conversion member; and disposing the light-emitting element on the liquid resin material; The liquid resin material is cured to form the light transmissive member. The method of manufacturing a light-emitting device according to claim 12 or 13, wherein the step of preparing the wavelength conversion member comprises: providing a through hole in the covering material layer; and forming a member containing the phosphor in the through hole. The method of manufacturing a light-emitting device according to claim 12, wherein the difference in thermal expansion coefficient between the covering member and the light-emitting element is smaller than a difference in thermal expansion coefficient between the light-transmitting member and the light-emitting element.