TWI829827B - Light-emitting device, light-emitting module, and method of manufacturing light-emitting device - Google Patents

Abstract

A light-emitting device includes a light-emitting element including first and second main surface, and a first lateral surface; a wavelength conversion member including a third main surface, a fourth main surface, and second lateral surfaces; a light-transmissive adhesive member; and a first light-reflective member containing a light-reflective first filler, covering the first lateral surface provided with the light-transmissive adhesive member, and including third lateral surfaces being peripheral surfaces of the first light-reflective member. In a cross-section in a direction perpendicular to the second main surface, a distance between the third lateral surfaces is smaller than a distance between the second lateral surfaces at the fourth main surface side. Each of the second lateral surfaces of the wavelength conversion member includes a first inclined surface in a region adjacent to the third main surface. The wavelength conversion member includes light-reflective particles located on the first inclined surface.

Description

Light-emitting device, light-emitting module and manufacturing method of light-emitting device

The present invention relates to a light-emitting device using a light-emitting element, a light-emitting module and a manufacturing method of the light-emitting device.

Light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) are widely used as backlights for liquid crystal displays or as light sources for displays, etc.

For example, the light source device disclosed in Patent Document 1 includes a plurality of light-emitting elements mounted on a mounting substrate, a phosphor layer on each of the plurality of light-emitting elements, and a reflective layer disposed on the surface of the phosphor layer.

Due to the trend of miniaturization and lightweighting in recent years, such light-emitting devices are required to be smaller and thinner on the one hand, and higher brightness on the other hand. In particular, they seek to improve the extraction efficiency of the light emitted by the light-emitting element. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2012-204614

[Problem to be solved by the invention]

One object of the present invention is to provide a light-emitting device, a light-emitting module and a manufacturing method of the light-emitting device and the light-emitting module that further improve light extraction efficiency. [Technical means to solve problems]

According to a light-emitting device according to one aspect of the present invention, a light-emitting device can be provided, which includes: a light-emitting element having: a first main surface on which an electrode is provided; a second main surface on the opposite side of the first main surface; and a first side surface that is continuous with the above-mentioned first main surface and the above-mentioned second main surface; a wavelength conversion member having: a third main surface, which is a rectangular shape with a larger area than the above-mentioned second main surface, and is connected to the above-mentioned second main surface; The second main surface is joined; the fourth main surface opposite to the above-mentioned third main surface; and the second side surface continuous with the above-mentioned third main surface and the fourth main surface; and converts the wavelength of the light emitted by the above-mentioned light-emitting element to emit different wavelength of light; a translucent adhesive member that continuously covers a portion of the second main surface side and the third main surface of the first side surface; and a first light reflective member that is covered with the translucent adhesive member The above-mentioned first side of the member has a third side around it; and the above-mentioned first light reflective member contains a first filler with light reflectivity; the above-mentioned third side in a cross section perpendicular to the direction of the second main surface The distance between each other is smaller than the distance between the second side surfaces on the fourth main surface side of the second side surfaces; the wavelength conversion member has a first inclination that is inclined in a region of the second side surface that is close to the third main surface. surface; the wavelength conversion member has light-reflective particles on the surface of the first inclined surface.

Furthermore, according to another aspect of the present invention, a method for manufacturing a light-emitting device including a light-emitting element, a wavelength conversion member, a translucent adhesive member, and a first light-reflective member may include: preparing: as the wavelength conversion member, A first resin layer in which phosphor is mixed into the first resin; a plurality of the above-mentioned light-emitting elements spaced apart from each other on the upper surface of the above-mentioned first resin layer; and a plurality of the above-mentioned light-emitting elements arranged between the adjacent above-mentioned light-emitting elements as the above-mentioned first resin layer. The step of forming a second resin layer containing a first filler having light reflective properties in a light reflective member; the step of cutting the second resin layer with a first blade having a first thickness at specific intervals to form a first cutting area; and inserting a second blade having a second thickness thinner than the first thickness into the first cutting area, and cutting the first resin layer directly below the first cutting area to form a second cutting area, divided into Each light-emitting device, and on the side of each light-emitting device, near the area of the side of the wavelength conversion member, that is, the second side, that is joined to the first light reflective member, a first inclination is formed from the plane inclination of the second side. surface, and attaching the light reflective particles to the first inclined surface.

Furthermore, a method for manufacturing a light-emitting device including a light-emitting element, a wavelength conversion member, a translucent adhesive member, and a first light-reflective member according to another aspect of the present invention may include: preparing: as the wavelength conversion member, A first resin layer in which phosphor is mixed into the first resin; a plurality of the above-mentioned light-emitting elements spaced apart from each other on the upper surface of the above-mentioned first resin layer; and a plurality of the above-mentioned light-emitting elements arranged between the adjacent above-mentioned light-emitting elements as the above-mentioned first resin layer. The step of forming a second resin layer containing a first filler having light reflective properties in a light reflective member; the step of cutting the second resin layer with a first blade having a first thickness at specific intervals to form a first cutting area; and inserting a second blade having a second thickness thinner than the first thickness into the first cutting area, cutting the first resin layer directly below the first cutting area to form a second cutting area, and dividing it into individual A light-emitting device, and on the side of each light-emitting device, a second inclined surface inclined from the plane of the third side is formed near the area of the third side of the first light-reflective member that is joined to the wavelength conversion member. steps. [Effects of the invention]

According to the light-emitting device according to one aspect of the present invention, when the light-emitting element of the light-emitting device emits light, the light passing through the wavelength conversion member is reflected in a direction to be extracted to the outside according to the inclination direction of the first inclined surface, and is further configured to The light-reflective particles on the first inclined surface scatter the light from the light-emitting element, thereby increasing the components extracted to the outside and improving the overall light extraction efficiency of the light-emitting device.

Hereinafter, the present invention will be described in detail based on the drawings. In addition, in the following description, terms indicating specific directions or positions (for example, "up", "down", and other terms including these terms) are used as necessary. These terms are used for easy understanding with reference to the drawings. The technical scope of the present invention is not limited by the meaning of these terms. In addition, parts with the same symbols shown in plural figures represent the same or equivalent parts or components.

In addition, the embodiments shown below are illustrative of a light-emitting device, a light-emitting module, and a manufacturing method of a light-emitting device for embodying the technical idea of the present invention, and do not limit the present invention to the following. In addition, the dimensions, materials, shapes, and relative arrangements of the constituent parts described below are intended to be illustrative unless otherwise specified, and are not intended to limit the scope of the present invention. In addition, the content described in one embodiment and Example can also be applied to other embodiments and Examples. In addition, the size or positional relationship of components shown in the drawings may be exaggerated for the purpose of clear explanation. [Embodiment 1] (Liquid crystal display device 1000)

FIG. 1 is a block diagram showing each structure of a liquid crystal display device 1000 equipped with a light-emitting module according to Embodiment 1. This liquid crystal display device 1000 includes a liquid crystal panel 120, two lens sheets 110a and 110b, a diffusion sheet 110c, and a light emitting module 100 in order from the upper side. The liquid crystal display device 1000 shown in FIG. 1 is a so-called direct type liquid crystal display device in which a light emitting module 100 is stacked below a liquid crystal panel 120 . The liquid crystal display device 1000 irradiates the liquid crystal panel 120 with the light emitted by the self-luminous module 100 . In addition to the above-described components, members such as polarizing films and color filters may be further provided. (Light-emitting module 100)

The structure of the light emitting module 100 of Embodiment 1 is shown in FIGS. 2 and 3 . The light-emitting module 100 of Embodiment 1 emits white light. FIG. 2 is a schematic top view of the light emitting module of this embodiment. 3 is a partially enlarged schematic cross-sectional view showing the light-emitting module according to Embodiment 1. The light-emitting module 100 shown in the figures includes a light-emitting device 3 that is a light source, and a light guide plate 1 on which the light-emitting device 3 is arranged. (Light guide plate 1)

The light guide plate 1 has a light guide plate first main surface 1c (lower surface in FIG. 3) as a light-emitting surface that radiates light to the outside, and a light guide plate second main surface 1d (FIG. 3) on the opposite side of the light guide plate first main surface 1c. middle and upper surfaces). A plurality of recessed portions 1b for arranging the light-emitting devices 3 are formed on the second main surface 1d of the light guide plate 1 at intervals. Furthermore, a groove 1e is formed between the recessed portions 1b. On the other hand, an optical function portion 1 a having a function of reflecting or diffusing light from the light-emitting device 3 may be provided on the light guide plate first main surface 1 c side of the light guide plate 1 .

Furthermore, the light-emitting module 100 includes a second light reflective member 16 covering the second main surface 1d side of the light guide plate 1 . Furthermore, the light-emitting module 100 is provided with a translucent joining member 14 that is in contact with the inner surface of the recess 1 b and the outer surface of the light-emitting device 3 .

The light-emitting module 100 shown in FIG. 2 and FIG. 3 is provided with a plurality of recessed portions 1b on a light guide plate 1, and a light-emitting device 3 is arranged in each recessed portion 1b. However, the light-emitting module can also be arranged as a plurality of light-emitting modules 100' as shown in the schematic bottom view of FIG. 4. A recess 1b is provided on the light guide plate 1' and the light-emitting devices 3 are arranged in the recess 1b. (Lighting device 3)

FIG. 5 shows a schematic cross-sectional view of the light emitting device 3 . The light-emitting device 3 shown in this figure includes a light-emitting element 11, a wavelength conversion member 12 covering the second main surface 11c of the light-emitting element 11, a translucent adhesive member 19, and a first light covering the first side surface 11e of the light-emitting element 11. Reflective member 15.

In addition, the light-emitting device 3 of FIG. 5 covers the second main surface 11c of the light-emitting element 11 with the wavelength conversion member 12. Furthermore, the wavelength conversion member 12 has a third main surface 12c and a fourth main surface 12d joined to the second main surface 11c of the light emitting element 11, and a second main surface connecting the third main surface 12c and the fourth main surface 12d. Side 12e. The third main surface 12c has a rectangular shape with a larger area than the second main surface 11c, and is joined to the second main surface 11c. The wavelength converting member 12 converts the wavelength of the light emitted by the light-emitting element 11 to emit light of different wavelengths.

On the other hand, a part of the second main surface 11c side and the third main surface 12c of the first side surface 11e of the light-emitting element 11 is continuously covered with the translucent adhesive member 19. Furthermore, the first side surface 11e of the light-emitting element 11 provided with the translucent adhesive member 19 is covered with the first light reflective member 15 . Furthermore, the first light reflective member 15 has a third side surface 15e around it. (Light-emitting element 11)

The light-emitting element 11 has a second main surface 11c, a first main surface 11d on the opposite side of the second main surface 11c, and a first side surface 11e between the second main surface 11c and the first main surface 11d. The first main surface 11d is provided with a pair of positive and negative electrodes 11b. The light-emitting element 11 mainly emits light from the second main surface 11c and irradiates the wavelength conversion member 12 covering the second main surface 11c with light.

The light-emitting element 11 has, for example, a translucent substrate such as sapphire, and a semiconductor multilayer structure laminated on the translucent substrate. The semiconductor multilayer structure includes a light-emitting layer, and an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light-emitting layer. The n-type semiconductor layer and the p-type semiconductor layer are electrically connected to the electrode 11b, that is, the n-side electrode and the p-side electrode, respectively. The second main surface 11c of the light-emitting element 11, for example, having a translucent substrate, is arranged to face the light guide plate 1, and the first main surface 11d on the opposite side of the second main surface 11c has a pair of electrodes 11b.

As the light-emitting element 11, the vertical, horizontal and height dimensions are not particularly limited, but it is preferable to use a semiconductor light-emitting element whose vertical and horizontal dimensions are 1 mm or less when viewed from above, and more preferably, the vertical and horizontal dimensions are 0.5 mm or less, and further more preferably. It is best to use light-emitting components with vertical and horizontal dimensions of less than 0.25 mm. If such a light-emitting element is used, high-definition images can be achieved when performing regional dimming of a liquid crystal display device. In addition, if light-emitting elements with vertical and horizontal dimensions of 0.5 mm or less are used, the cost efficiency of the light-emitting elements becomes better, and the cost of the light-emitting module 100 can be reduced. In addition, for light-emitting elements with both vertical and horizontal dimensions of 0.25 mm or less, since the area of the upper surface of the light-emitting element becomes smaller, the amount of light emitted from the first side surface 11e becomes relatively larger. That is, this kind of light-emitting element can be easily formed into a bat-wing shape, so it is preferably used in the light-emitting module of this embodiment in which the light-emitting element and the light guide plate are bonded and the distance between the light-emitting element and the light guide plate is extremely short.

In addition, the height of the light-emitting element 11 is preferably 0.10 mm to 0.25 mm. The height of the light-emitting element 11 is preferably such that the first main surface 11d of the light-emitting element 11 protrudes from the recess 1b when the light-emitting device 3 is installed in the recess 1b of the light guide plate 1.

The light-emitting element 11 may have any shape when viewed from above, such as a square or a rectangle. If the light-emitting elements used in high-definition liquid crystal display devices are rectangular, even if some of the light-emitting elements are rotated and offset during the installation step of the light-emitting elements, by using the light-emitting elements that are rectangular when viewed from above, , easy to confirm visually. In addition, since the distance between the p-type electrode and the n-type electrode can be separated, the wiring described later can be easily formed. On the other hand, if a light-emitting element that is square in plan view is used, smaller light-emitting elements can be manufactured with good mass productivity. The density (arrangement pitch) of the light-emitting elements 11, that is, the distance between the light-emitting elements 11, is determined by the distance between the recesses 1b provided on the light guide plate 1. For example, it can be about 0.06 mm to 20 mm, preferably 1 mm to 10 mm. about. In addition, the arrangement pitch of the light-emitting elements 11 is the distance between the centers of two adjacent light-emitting elements 11 . The light-emitting element 11 is designed to be arranged approximately at the center of the light-emitting device 3. Therefore, the arrangement pitch of the light-emitting device 3 is also about 0.06 mm to 20 mm, preferably about 1 mm to 10 mm.

In addition, in the example of FIG. 4 , the outer surfaces of the light-emitting device 3 are arranged substantially parallel to the inner surfaces of the recessed portion 1 b. However, the present invention is not limited to this arrangement. For example, the center of the light-emitting device may be used as an axis, and the relative positions may be arranged relative to each other. Arrangement rotated 45° on the quadrilateral concave portion 1b.

As the light-emitting element 11, a well-known semiconductor light-emitting element can be used. In this embodiment, a light-emitting diode is exemplified as the light-emitting element 11 .

As the light-emitting element 11, an element that emits light of any wavelength can be selected. For example, as an element that emits blue or green light, a nitride-based semiconductor (In _{x Aly} Ga _1-xy N, 0≦X, 0≦Y, X+Y≦1) or GaP can be used. components to use. In addition, as an element that emits red light, a light-emitting element containing a semiconductor such as GaAlAs, AlInGaP, or the like can be used. Furthermore, semiconductor light-emitting elements containing materials other than these may also be used. By changing the material of the semiconductor layer and its mixed crystallinity, the emission wavelength can be changed. The composition, luminous color, size, number, etc. of the light-emitting elements used can be appropriately selected according to the purpose. (Wavelength conversion member 12)

The wavelength conversion member 12 is arranged to cover the second main surface 11 c of the light emitting element 11 . The wavelength conversion member 12 uses the third main surface 12c to receive the light emitted from the second main surface 11c, converts the wavelength of the light, and emits the light from the fourth main surface 12d. For example, the wavelength converting member 12 includes phosphors that are excited by the light from the light-emitting element 11 and emit light of different wavelengths. In this way, the component of the light emitted by the light-emitting element 11 that has passed through the wavelength conversion member 12 is mixed with the component whose wavelength has been converted by the wavelength conversion member 12, and mixed color light is emitted.

The wavelength conversion member 12 may be one in which a wavelength conversion substance is dispersed in the first resin as a base material. Furthermore, the wavelength conversion member 12 may be composed of a plurality of layers. For example, the wavelength conversion member may be composed of a plurality of wavelength conversion portion layers. Alternatively, the wavelength converting member may have a two-layer structure in which a wavelength converting substance is added to a base material as a first layer, and a light diffusion part in which a diffusing material is added to the base material is used as a second layer.

As the material of the first resin of the base material, for example, epoxy resin, polysilicone resin, resins mixed with these, or light-transmitting materials such as glass can be used. From the viewpoint of light resistance and easy formability of the wavelength conversion member 12, it is advantageous to select polysilicone resin as the first resin. In addition, as the base material of the wavelength conversion member 12, it is preferable to use a material with a higher refractive index than the material of the light guide plate 1.

As the wavelength converting material contained in the wavelength converting member 12, a phosphor can be appropriately used. Examples include fluoride-based phosphors such as YAG phosphors, β-sialon phosphors, KSF-based phosphors, and MGF-based phosphors, and nitride phosphors. Specific examples of the composition formula include the following general formulas (I), (II), and (III).

(Wherein, in the above general formula (I), A is at least one element selected from the group consisting of K ⁺ , Li ⁺ , Na ⁺ , Rb ⁺ , Cs ⁺ and NH ⁴⁺ , and M is an element selected from the group 4 and at least one element in the group consisting of Group 14 elements, a satisfies 0＜a＜0.2.)

(Wherein, in the above general formula (II), Ma is at least one selected from the group consisting of Ca, Sr, Ba, and Zn, Mb is at least one selected from the group consisting of Sc, La, and Lu, and Mc is selected from the group consisting of Ca, Sr, and Ba , at least one type of Zn, X is at least one type selected from F and Cl, Md is at least one type selected from Ti, Sn, and Zr, and Me is at least one type selected from B, Al, Ga, and In. In addition , regarding x, y, a, b, c, d, e, 2≦x≦4, 0<y≦2, 0≦a≦1.5, 0≦b<1, 0≦c≦2, 0≦d ≦0.5, 0≦e＜1)

(Wherein, in the above general formula (III), Ma is at least one element selected from the group consisting of Ca, Sr and Ba, Mb is at least one element selected from the group consisting of Li, Na and K, x , y and z satisfy 0.5≦x≦1.5, 0.5≦y≦1.2, and 3.5≦z≦4.5 respectively.

The half-value width of the KSF phosphor represented by the general formula (I) can be 10 nm or less. In addition, the half-value width of the MGF phosphor represented by the general formula (II) may be 15 nm or more and 35 nm or less. As shown in the above general formula (I), part of the Si that constitutes the composition K ₂ SiF ₆ :Mn ⁴⁺ of the KSF phosphor can be replaced with other tetravalent elements, that is, Ti or Ge (expressed as K in the composition formula ₂ (Si, Ti, Ge)F ₆ : Mn), or replace part of the K of K ₂ SiF ₆ : Mn ⁴⁺ that constitutes the KSF phosphor with other alkali metals, or replace it with Al, a trivalent element, etc. A part of Si, or a substitution that can combine multiple elements.

The wavelength converting member 12 may contain one type of wavelength converting material, or may contain multiple types of wavelength converting materials. If it contains a plurality of wavelength conversion substances, for example, the wavelength conversion member may include fluoride-based phosphors such as β-sialon phosphors that emit green light and KSF phosphors that emit red light. Thereby, the color reproduction range of the light emitting module 100 can be expanded. At this time, the light-emitting element 11 preferably includes a nitride-based semiconductor (In _{x Aly} Ga _1-xy N, 0≦X, 0≦Y, +Y≦1). Furthermore, for example, when using the light-emitting element 11 that emits blue light, if it is desired to obtain red light as a light-emitting module, the wavelength conversion member 12 can also contain more than 60% by weight of KSF phosphor ( red phosphor), preferably containing more than 90% by weight. That is, the wavelength converting member 12 may contain a wavelength converting substance that emits light of a specific color, thereby emitting light of a specific color. In addition, the wavelength converting material may also be quantum dots. In the wavelength converting member 12, the wavelength converting substances may be arranged in any manner. For example, they may be distributed substantially uniformly or may be partially unevenly distributed. Alternatively, a plurality of layers each including a wavelength conversion member may be stacked.

In addition, the wavelength conversion member 12 may be additionally provided with a member that diffuses or reflects light. For example, the light diffusion member may be mixed into the interior of the wavelength conversion member 12 , or the light diffusion plate may be attached to the surface of the wavelength conversion member 12 , or the light diffusion member may be separated from the wavelength conversion member 12 and placed on the surface or inside of the light guide plate. The light diffusion layer of the light diffusion member. By providing such a light diffusion part such as a light diffusion layer or a light diffusion region, the light emitted from the light guide plate 1 can be made more uniform. Furthermore, a plurality of light diffusion parts may be provided. For example, a plurality of light diffusion layers are stacked to form a light diffusion region.

The light diffusion part can be formed by adding a diffusion material to the base material. For example, a resin material may be used as a base material and white inorganic fine particles such as SiO ₂ or TiO ₂ may be contained therein to form the light diffusion part. In addition, a light-reflective member, which is a white-based resin or metal, may be used as the diffusion material in the form of fine particles. The interior of the base material contains these diffusion materials irregularly, thereby causing the light passing through the interior of the light diffusion part to be irregularly and repeatedly reflected, so that the transmitted light is diffused in multiple directions, thereby suppressing the local concentration of the irradiation light and preventing the generation of brightness. Uneven.

The thickness of the wavelength conversion member 12 is preferably 0.02 mm to 0.30 mm. In order to achieve thinning of the light-emitting module and various wavelength conversion effects, it is preferably set within the above range.

In the light-emitting device 3 of FIG. 5 , when viewed from above, the outer shape of the wavelength conversion member 12 is larger than the outer shape of the light-emitting element 11 . The light-emitting device 3 can allow more light emitted from the second main surface 11c of the light-emitting element 11 to pass through the wavelength conversion member 12 and be incident on the light guide plate 1, thereby reducing color unevenness or brightness unevenness. (Light-transmitting adhesive member 19)

As shown in FIG. 5 , the translucent adhesive member 19 continuously covers a portion of the first side surface 11 e of the light-emitting element 11 , that is, the second main surface side of the first side surface 11 e , and a portion of the third main surface of the wavelength conversion member 12 . In addition, the outer side surface of the translucent adhesive member 19 is preferably an inclined surface extending from the first side surface 11 e toward the wavelength conversion member 12 . Furthermore, it is more preferable that the side of the light-emitting element 11 has a convex curved surface. Thereby, the light emitted from the first side surface 11e can be further guided to the wavelength conversion member 12 side, thereby improving the light extraction efficiency.

Furthermore, a translucent adhesive member 19 may be provided between the second main surface 11c of the light-emitting element 11 and the wavelength conversion member 12. Therefore, for example, since the translucent adhesive member 19 contains a diffusing agent or the like, the light emitted from the second main surface 11 c of the light-emitting element 11 is diffused in the translucent adhesive member 19 and enters the wavelength converting member 12 , thereby making it possible to Reduce brightness unevenness. The same member as the joint member 14 described later can be used as the translucent adhesive member 19 . (First light reflective member 15)

Furthermore, in the light-emitting device 3, in a state where the wavelength conversion member 12 is provided on the light-emitting element 11, the first side surface 11e is covered with the first light reflective member 15. Specifically, the first side surface 11e and the outer side surface of the translucent adhesive member 19 that are not covered by the translucent adhesive member 19 are covered with the first light reflective member 15 . (first filler 41)

The first light reflective member 15 is made of a material with excellent light reflectivity. As shown in the partial enlarged view of FIG. 5 , the first light-reflective member 15 contains a first filler 41 with light-reflective properties. The first filler 41 may be composed of inorganic substances derived from metal. Preferably, the first filler 41 is white inorganic particles, such as TiO ₂ . This first filler 41 is added to the second resin 42 as a base material, for example, a transparent resin as a white resin, to obtain the first light reflective member 15 .

The light-emitting device 3 covers the other surfaces of the light-emitting element 11 except the second main surface 11c with the first light reflective member 15, thereby suppressing light leakage in directions other than the second main surface 11c. That is, the first light reflective member 15 reflects the light emitted from the first side surface 11e or the first main surface 11d, so that the light emitted by the light-emitting element 11 is effectively radiated from the first main surface 1c of the light guide plate 1 to the outside, and The light extraction efficiency of the light emitting module 100 can be improved.

The first light reflective member 15 is made of a white resin having a reflectivity of 60% or more, preferably 90% or more, with respect to the light emitted from the light-emitting element 11 . The first light reflective member 15 is preferably resin containing white pigment such as white powder. Particularly preferred is polysiloxane resin containing inorganic white powder such as _TiO2 .

The first light reflective member 15 is in contact with at least a part of the first side surface 11e, buries the light-emitting element 11 around the light-emitting element 11, and exposes the electrode 11b of the light-emitting element 11 on the surface. In the example of FIG. 5 , the first light reflective member 15 is in contact with the wavelength converting member 12 . However, the above-mentioned light-transmitting adhesive member can also be interposed between the first light-reflective member 15 and the wavelength converting member 12 . (First inclined surface 12f)

As shown in FIG. 5 , the distance between the third side surfaces 15e in the cross section perpendicular to the second main surface 11c is smaller than that of the second side surface when the translucent adhesive member 19 is disposed on the upper end of the first side surface 11e. 12e distance from each other. In other words, the width of the first light reflective member 15 is configured to be narrower than the width of the wavelength conversion member 12 on the fourth main surface side. Specifically, the wavelength conversion member 12 having a wider width than the first light reflective member 15 forms a first inclined surface 12f in a region of the second side surface close to the third main surface 12c. The first inclined surface 12f is inclined from the third main surface 12c which is the upper end of the second side surface 12e. In other words, the wavelength conversion member 12 has a shape such that the corners of the third main surface 12c are chamfered. Thereby, the light incident from the light-emitting element 11 to the wavelength conversion member 12 can be reflected in the direction of extraction to the outside through the inclination of the first inclined surface 12f, thereby increasing the components extracted to the outside, thereby improving the overall light of the light-emitting device. Extraction efficiency.

The first inclined surface 12f is continuously inclined from the third side surface 15e toward the second side surface 12e. The first inclined surface 12f is preferably at least partially formed into a curved surface. By forming the first inclined surface 12f into a curved shape relative to the flat shape, the area of the first inclined surface 12f can be increased, thereby increasing the amount of components extracted to the outside, thereby improving the light extraction efficiency of the entire light-emitting device. . (Light reflective particles 44)

Furthermore, the wavelength converting member 12 has light reflective particles 44 that reflect the light emitted by the reflective light emitting element 11 attached to the first inclined surface 12f. Thereby, in addition to the above-mentioned inclination of the first inclined surface 12f, the light from the light emitting element 11 is scattered by the light reflective particles 44 arranged on the first inclined surface 12f, thereby increasing the components extracted to the outside. In addition, since FIG. 5 is a cross-sectional view of the light-emitting device, a part of the first inclined surface 12f can be seen. If it is a light-emitting device that is rectangular in plan view, there are first inclined surfaces 12f on each of the four surfaces corresponding to the four sides of the rectangle in plan view.

The light reflective particles 44 preferably include the same material as the first filler 41 . In this example, white inorganic fine particles such as TiO ₂ are contained as the first filler 41 in a base material such as polysiloxane resin. More preferably, the first filler 41 is mixed with the same base material as the second resin 42 constituting the first light reflective member 15 . Thereby, the first light reflective member 15 and the light reflective particles 44 can be made common and can be easily manufactured.

Moreover, it is preferable that the wavelength conversion member 12 does not allow the light reflective particles 44 to adhere to the second side surface 12e. However, the light reflective particles 44 may be adhered to a certain extent on the second side surface 12e. In this case, for example, as shown in FIG. 6, it is better to reduce the amount of adhesion on the second side surface 12e compared to the first inclined surface 12f. FIG. 6 is a side view of the light-emitting device. The first inclined surface 12f is an area surrounded by a dotted line in the figure, and light-reflective particles 44 are attached to the area enclosed by the dotted line. (Manufacturing method of light-emitting device)

Next, a method of manufacturing the light-emitting device according to Embodiment 1 will be described based on the schematic cross-sectional views of FIGS. 7 to 12 . First, as shown in FIG. 7 , the first resin layer 50 , the light emitting element 11 , and the second resin layer 40 are prepared. Here, the first resin layer 50 is coated on the substrate 30 . The substrate 30 may be, for example, an adhesive tape material with an adhesive layer. Thereby, the wavelength conversion member 12 attached to the substrate 30 can be easily peeled off. The first resin layer 50 is made by mixing a phosphor into the first resin as a base material, and becomes the wavelength converting member 12 after curing. The first resin can use the above-mentioned polysiloxane resin, etc. In addition, YAG-based phosphors, etc. can be used as the phosphor.

In the hardened state of the first resin layer 50, a plurality of light-emitting elements 11 are arranged spaced apart from each other on its upper surface. The light-emitting element 11 has the first main surface 11d as the upper surface, and the second main surface 11c side is connected and fixed to the first resin layer 50. Furthermore, the second resin 42 is applied between the adjacent light-emitting elements 11 . The second resin 42 is mixed with the first light-reflective filler 41 in the second resin 42 as the base material, and becomes the first light-reflective member 15 after hardening. In addition, on the first main surface 11d, in order to expose the electrode 11b from the second resin layer 40, if necessary, the second resin 42 is applied in a state where a mask is arranged to cover the electrode 11b. Alternatively, the second resin layer may be formed to cover the electrode 11b, and then may be formed by polishing or the like to expose the electrode 11b. In this way, after the second resin 42 is cured, an intermediate body with the light-emitting element 11 and the second resin layer 40 disposed on the first resin layer 50 is obtained as shown in FIG. 7 .

Then, as shown in FIGS. 8 and 9 , a first cutting area 46 is formed on the intermediate body. Here, the first blade 61 having the first thickness (first blade thickness) cuts between the adjacent light-emitting elements 11 of the second resin layer 40 at a specific interval. Then, cutting is stopped with the first resin layer 50 exposed on the bottom surface of the first cutting area 46 . At this time, not only the second resin layer 40 but also a part of the first resin layer 50 is preferably cut. Thereby, the second resin layer 40 can be reliably penetrated and the first resin layer 50 can be exposed. The first blade 61 is made of materials such as superhard metal saws, electroforming blades, and metal bonded blades. Here, dry cutting is performed by the first edge 61 . Therefore, cutting chips 45 of the first resin layer 50 will be generated during the cutting process. The cutting chips 45 are removed by suction or the like, and a specific amount is intentionally left in the first cutting area 46 . This chip 45 is the light reflective particle 44 mentioned later.

Furthermore, as shown in FIGS. 10 and 11 , it is divided into individual light-emitting devices 3 . Here, as shown in FIG. 10 , the first cutting area 46 is further cut to form the second cutting area 48 . Specifically, by inserting the second edge 62 having a second thickness (second edge thickness) thinner than the first thickness (first edge thickness) into the first cutting area 46, cutting is performed in the first cutting area 46. The second cutting area 48 is formed directly below the first resin layer 50 . At this time, as shown in FIG. 11 , the cutting chips 55 of the first resin layer 50 are sucked by the suction device 60 . As a result, as shown in FIG. 11 , the light-emitting devices 3 are divided into individual units. At the same time, a first inclined surface 12f is formed on the side surface of each light-emitting device 3. The first inclined surface 12f is formed in the vicinity of the area joined to the first light reflective member 15 in the second side surface 12e. The first inclined surface 12f is inclined from the main plane of the second side surface 12e. This first inclined surface 12f is formed on the end edge of the first cutting area 46 during the cutting process by the first blade 61 or the second blade 62 . The processing of the first inclined surface 12f can be performed using other tools that are different from the first blade 61 or the second blade 62, or can be performed when the second cutting area 48 of the second blade is used. Thereby, when the light-emitting element of the light-emitting device emits light, it is possible to obtain an inclined surface that reflects the light incident on the wavelength conversion member in a direction to be extracted to the outside according to the inclination direction of the first inclined surface.

Furthermore, the light reflective particles 44 are attached to the first inclined surface 12f. After the light reflective particles 44 are formed on the first inclined surface 12f, the separately prepared light reflective particles are fixed to the surface using an adhesive material or the like. Alternatively, while forming the first inclined surface 12f, cutting chips generated by cutting the first cutting area 46 are allowed to adhere to the first inclined surface 12f. The cutting chips generated by cutting the first cutting area 46 are light-reflective particles, and therefore can be attached to the first inclined surface 12f as the light-reflective particles 44. Furthermore, when the second blade 62 is inserted to cut the first resin layer 50 directly below the first cutting area 46, since the second thickness (second blade thickness) is thinner than the first thickness (first blade thickness), Therefore, the second blade 62 will not touch the second resin layer 40, and thus no cutting chips of light-reflective particles will be generated. That is, when the first resin layer 50 is cut with the second blade 62 , cutting chips of light reflective particles can be prevented or suppressed from adhering to the side surfaces of the first resin layer 50 . The amount of adhesion to the first inclined surface 12f can be appropriately adjusted by adjusting the rotation speed of the blade and the suction.

The light reflective particles 44 are fixed to the first inclined surface 12f in a required amount. For example, the adhesive material is coated with spray to fix the light reflective particles 44 on the first inclined surface 12f.

In this way, the light-emitting device 3 arranged on the substrate 30 is produced as shown in FIG. 12 . In addition, FIGS. 7 to 12 are diagrams showing the steps of cutting in the direction perpendicular to the paper surface. However, similar to this step, there are also steps of cutting in the direction parallel to the paper surface. Thereafter, each light-emitting device 3 is peeled off from the substrate 30 to obtain a single-chip light-emitting device 3 .

In this way, the light passing through the wavelength conversion member 12 is reflected in the direction of extraction to the outside according to the inclination direction of the first inclined surface 12f, and further the light is scattered by the light reflective particles 44 arranged on the first inclined surface 12f, which can increase the The components extracted to the outside can improve the overall light extraction efficiency of the light-emitting device. [Embodiment 2]

In the above example, the example in which the inclined surface is provided on the wavelength conversion member 12 side has been described, but the present invention is not limited to this configuration. For example, the inclined surface may be provided on the first light reflective member 15 side instead of the wavelength converting member side. FIG. 13 is a schematic cross-sectional view showing a light-emitting device 3B of this example as Embodiment 2. The light-emitting device 3B shown in this figure includes a light-emitting element 11, a wavelength conversion member 12, a translucent adhesive member 19, a first light-reflective member 15, and light-reflective particles 44. In addition, components having the same functions as the above-mentioned components are denoted by the same reference numerals and detailed descriptions are omitted.

The light emitting device 3B shown in FIG. 13 is provided with a second inclined surface 15f as an inclined surface on the first light reflective member 15. The second inclined surface 15f is provided in a region of the third side surface 15e close to the third main surface 12c. The second inclined surface 15f is inclined in a direction gradually widening downward from the third side surface 15e. Therefore, according to this structure, since the area where the first light reflective member 15 and the third main surface 12 c are joined can be increased, the effect of improving the adhesion between the first light reflective member 15 and the wavelength converting member 12 can be obtained. Furthermore, the effect of reflecting light incident on the wavelength conversion member in the direction of extraction to the outside is improved. In addition, by arranging the light reflective particles 44 on the third main surface 12c side (near 15f) of the wavelength conversion member 12, the range of the light distribution can be adjusted.

The manufacturing method of the light-emitting device 3B of the second embodiment is substantially the same as the manufacturing method of the light-emitting device 3 of the first embodiment. The main difference is that when the first cutting area 46B is formed in the second resin layer 40, the first blade 61 is in the middle of cutting the second resin layer 40, so that the cutting reaches the first resin layer at the front end of the first blade 61. Stop before 50. Thereby, as shown in FIG. 14 , only the first cutting area 46B is formed on the second resin layer 40 , and the first resin layer 50 is not exposed on the bottom surface of the first cutting area 46B. Furthermore, as shown in FIG. 15 , the second blade 62 is inserted into the first cutting area 46B, and the second cutting area 48B is formed as shown in FIG. 16 , and is then singulated into the light emitting device 3B. In this way, the light-emitting device 3B of Embodiment 2 is obtained. [Embodiment 3]

In the structure described above, the example in which the inclined surface is provided in either the wavelength converting member 12 or the first light reflective member 15 has been described. However, the present invention is not limited to this structure. Inclined surfaces may also be provided on the wavelength conversion member and the first light reflective member. FIG. 17 is a schematic cross-sectional view showing a light-emitting device 3C according to the third embodiment. The light emitting device 3C shown in this figure has an inclined surface 49 that is continuous from the first light reflective member 15 across the wavelength conversion member 12 . The inclined surface 49 is formed by the second inclined surface 15f of the first light reflective member 15 and the first inclined surface 12f of the wavelength conversion member 12. With this configuration, the same effects as those of the above-described Embodiments 1 and 2 can be obtained. That is, by using the first inclined surface 12f, it is possible to obtain an embodiment in which the light introduced from the light-emitting element 11 is reflected on the inner side of the wavelength conversion member 12 to increase the component of the wavelength-converted light, thereby improving the utilization efficiency of the light as a whole. The effect of Embodiment 1 and the effect of Embodiment 2 of increasing the joint area between the first light reflective member 15 and the third main surface 12c to improve the adhesion. In this embodiment, the components extracted to the outside can also be increased by attaching the light reflective particles 44 to the first inclined surface 12f of the inclined surface 49 as in other embodiments.

A light-emitting module can be constructed using the light-emitting devices exemplified in Embodiments 1 to 3. Hereinafter, the description of the light-emitting module shown in FIG. 3 and other structures using the light-emitting device 3 of Embodiment 1 will be continued. (Light guide plate 1)

The light guide plate 1 is a translucent member that forms a planar shape and radiates light incident from a light source to the outside. As shown in FIG. 3 , the light guide plate 1 has a first main surface 1 c of the light guide plate as a light-emitting surface, and a second main surface 1 d of the light guide plate opposite to the first main surface 1 c of the light guide plate. The light guide plate 1 is provided with a plurality of recessed portions 1b on the second main surface 1d of the light guide plate. Moreover, in this embodiment, the groove 1e is provided between the adjacent recessed parts 1b.

In addition, a part of the light emitting device 3 is arranged in the recessed portion 1b. Specifically, the wavelength conversion member 12 disposes a part of the light emitting device 3 in the recess 1 b of the light guide plate 1 so as to face the bottom surface of the recess 1 b. In this way, the entire light-emitting module can be made thinner. As shown in FIGS. 2 and 3 , the light guide plate 1 is provided with a plurality of recessed portions 1 b , and a part of the light-emitting device 3 is disposed in each recessed portion 1 b , thereby serving as a light-emitting module 100 .

Alternatively, as shown in FIG. 4 , a part of a light-emitting device 3 can be disposed on a certain light guide plate 1' of a recess 1b, and a plurality of light guide plates 1' can be disposed in a planar shape to form a light-emitting module 100'. As shown in FIG. 3 , the light guide plate 1 provided with a plurality of recessed portions 1 b has dot-shaped grooves 1 e between the recessed portions 1 b. As shown in Figure 4, the light guide plate 1' provided with a recessed portion 1b has an inclined surface 1f on the outer peripheral portion of the second main surface 1d of the light guide plate toward the outer peripheral edge.

The second light reflective member 16 is provided on the surface of the inclined surface 1f provided on the outer peripheral portion of the groove 1e or the second main surface 1d of the light guide plate. The details of the second light reflective member 16 arranged in the groove 1e will be described later, but it is preferably made of white resin that reflects the light from the light-emitting device 3 to prevent the light emitted from the light-emitting element 11 from being incident on the adjacent light guide plate 1 defined by the groove 1e. , to prevent the light of each light-emitting element 11 from leaking to the vicinity. The second light reflective member 16 joined to the inclined surface 1f provided at the outer peripheral portion of the second main surface 1d of the light guide plate 1' prevents light from leaking to the periphery of the light guide plate 1 and prevents light from the light guide plate 1. The luminous intensity of the first main surface 1c of the light guide plate decreases.

The size of the light guide plate 1 is appropriately set according to the size of the liquid crystal display device 1000. However, for example, in the light guide plate 1 having a plurality of recessed portions 1b, it can be set to about 1 cm to 200 cm on one side, preferably 3 cm to 30 cm. The thickness can be set to about 0.1 mm to 5 mm, preferably 0.1 mm to 3 mm. The planar shape of the light guide plate 1 may be, for example, substantially rectangular or substantially circular.

As the material of the light guide plate 1, resin materials such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, polyester and other thermoplastic resins, epoxy resin, polysilicone and other thermosetting resins can be used. Or optically transparent materials such as glass. In particular, thermoplastic resin materials are preferable because they can be efficiently produced by injection molding. Among them, polycarbonate is preferred because of its high transparency and low price. In the manufacturing step, the light-emitting module does not need to be exposed to a high-temperature environment like solder reflow, and materials with thermoplasticity and low heat resistance such as polycarbonate can also be used.

In addition, the light guide plate 1 may be formed of a single layer, or may be formed by laminating a plurality of light-transmitting layers. When a plurality of light-transmitting layers are laminated, it is preferable to provide a layer with a different refractive index between any layers, such as an air layer. In this way, a light-emitting module can be made that can diffuse light more easily and reduce brightness unevenness. This structure can be realized, for example, by providing spacers between any plurality of light-transmitting layers to separate them and provide an air layer. In addition, a light-transmissive layer may also be provided on the first main surface 1 c of the light guide plate 1 , and a layer with different refractive indexes may be provided between the first main surface 1 c of the light guide plate 1 and the light-transmissive layer. Such as air layer, etc. This makes it possible to produce a liquid crystal display device in which light can be diffused more easily and brightness unevenness can be reduced. This structure can be realized, for example, by providing a spacer between any light guide plate 1 and the light-transmitting layer to separate them and provide an air layer. (recessed portion 1b)

The light guide plate 1 is provided with a recess 1b on the second main surface 1d side of the light guide plate. A part of the light-emitting device 3 is arranged in the recessed portion 1b so that the wavelength converting member 12 faces the bottom surface of the recessed portion 1b. The inner surface of the recess 1b is larger than the outer surface of the light emitting device 3 in plan view. Specifically, as shown in FIG. 3 , the inner surface of the recess 1 b is located further outside than the outer surface of the light emitting device 3 .

In the light guide plates 1 and 1' shown in Figures 2 to 4, when viewed from above, the inner shape of the recessed portion 1b is set to a quadrilateral, and the outer shape of the light-emitting device 3 arranged there is also set to a square shape. The quadrangular light-emitting device 3 arranged in the quadrilateral recessed portion 1b may also be arranged such that each outer surface of the light-emitting device 3 is parallel to the inner surface of the opposite recessed portion 1b. Furthermore, the arrangement may be such that each outer surface of the light-emitting device 3 is rotated 45° with respect to each inner surface of the recessed portion 1b. Moreover, it is preferable to arrange|position so that the center of the bottom surface of the recessed part 1b and the center of the light-emitting device 3 may be substantially coincident when viewed from above. Thereby, the distance from the side surface of the light-emitting device 3 to the inner surface of the recess 1 b can be set to a specific value, thereby improving the color unevenness of the light-emitting module. However, a light-emitting device having a quadrilateral shape can also be arranged in such a position that each side intersects with respect to the concave portion of the quadrilateral, in other words, is rotated relative to the concave portion of the quadrilateral.

Here, although the size of the recessed portion 1b in plan view changes depending on the outer shape of the light-emitting device 3, the diameter when it is circular, the major diameter when it is elliptical, and the diagonal length when it is quadrilateral can be, for example, 0.05 mm to 10 mm. , preferably 0.1 mm ~ 2 mm. The depth can be set from 0.05 mm to 4 mm, preferably from 0.1 mm to 1 mm. The shape of the recessed portion 1b in plan view may be, for example, substantially rectangular or substantially circular, and may be selected based on the arrangement pitch of the recessed portions 1b and the like. When the arrangement pitch of the recessed portions 1b (the distance between the centers of the two closest recessed portions 1b) is substantially equal, a substantially circular or substantially square shape is preferred. Among them, the substantially circular shape has the effect of favorably diffusing the light from the light-emitting device 3 .

The height from the bottom surface of the recessed portion 1b to the second main surface 1d of the light guide plate, when viewed in cross-section, is preferably the second main surface 11c of the light-emitting element 11 and the second main surface 1d of the light guide plate, as shown in Figure 3 is the height of the recessed portion 1b which is approximately flush with the plane. In addition, the height of the recessed portion 1b may also be set such that when the light-emitting device 3 is installed in the recessed portion 1b, the position of the third main surface 12c is higher than the second main surface 1d of the light guide plate. Thereby, the light-emitting device 3 protrudes from the recessed part 1b, and wiring work etc. to the counter electrode 11b can be easily performed. In this way, it is preferable to adjust the height of the recessed portion 1b according to the height of the light-emitting device 3 . (joint member 14)

The translucent joining member 14 is in contact with the inner side of the recess 1 b and the outer side of the light-emitting device 3 . That is, the translucent joining member 14 extends from the inner side of the recess 1 b to the third side of the light emitting device 3 located outside the recess 1 b. In addition, the joint member 14 may be in contact with a part of the first light reflective member 15 located outside the recessed portion 1b. In other words, it may be configured to continuously cover the fourth main surface 12d, the second side surface 12e, and the third side surface 15e. Furthermore, the joint member 14 has an outer side surface inclined with respect to the third side surface 15e and an inclined surface 14a. This inclined surface 14a is provided such that the inclination angle α formed with the third side surface 15e is an acute angle. Moreover, the joining member 14 may be arrange|positioned between the wavelength conversion member 12 and the bottom surface of the recessed part 1b.

As shown in FIG. 3 , when the light-emitting device 3 of Embodiment 1 is fixed in the recessed portion 1 b with the joint member 14 , an inclined surface is formed near the third main surface 12 c of the light-emitting device 3 , thereby exerting an anchoring effect and improving the performance of the light-emitting device 3 . Close contact.

Furthermore, as shown in FIG. 3 , the joining member 14 is in contact with the second main surface 1d of the light guide plate 1 . Thereby, the area where the inclined surface 14a is formed is enlarged, more light can be reflected, and brightness unevenness can be reduced. Here, the inclination angle α formed by the inclined surface 14a of the joint member 14 and the third side surface 15e may be 5° to 85°, preferably 5° to 50°, and more preferably 10° to 45°. The width d1 between the outer surface of the light-emitting device 3 and the inner surface of the recessed portion 1b may vary depending on the inner diameter of the recessed portion 1b, the outer diameter of the light-emitting device 3, or the shape thereof, or the posture of the light-emitting device 3 when it is installed in the recessed portion 1b. The tolerance of the installation position of device 3 may change. In addition, the inclination angle α also changes depending on the height of the joint member 14, that is, the height of the light-emitting device 3 (the height of the light-emitting element 11 or the thickness of the wavelength conversion member 12), and the depth (height) of the recessed portion 1b. Thereby, the inclination angle α between the inclined surface 14a of the joint member 14 and the outer side surface of the first light reflective member 15 is set toward the second main surface 1d and widens downward.

Furthermore, as shown in FIG. 3 , the joint member 14 has an inclined surface 14a in cross-section. This shape can reflect the light incident on the inclined surface 14a through the joint member 14 to the light-emitting surface side in the same state.

As the joining member 14, a translucent thermosetting resin material such as epoxy resin or polysilicone resin can be used. Moreover, the light transmittance of the joining member is 60% or more, preferably 90% or more. Furthermore, the bonding member 14 may contain a diffusion material or the like, or may contain a light-reflecting additive such as white powder, or may be made of only a light-transmitting resin material that does not contain a diffusion material or white powder.

Furthermore, the translucent joint member 14 can have the inclined surface 14a as a curved surface in cross-section. For example, the inclined surface 14a may be a convex curved surface toward the concave portion 1b side. The inclined surface 14a can set the traveling direction of the reflected light in the inclined surface 14a to a wider range, thereby reducing brightness unevenness.

In addition, the inclined surface 14a may cover the entire surface of the third side surface 15e. In the example of FIG. 3 and other examples, the upper part of the third side surface 15e is retained and partially covered by the inclined surface 14a. However, the upper end of the inclined surface 14a may be extended to the upper end of the first light reflective member 15. (Optical function part 1a)

The light guide plate 1 may be provided with an optical function portion 1 a having a function of reflecting or diffusing light from the light-emitting device 3 on the side of the first main surface 1 c of the light guide plate. The light guide plate 1 can diffuse the light from the light-emitting device 3 sideways and average the luminous intensity within the surface of the light guide plate 1 . For example, the optical function portion 1 a may have a function of diffusing light within the surface of the light guide plate 1 . The optical function portion 1a is, for example, a recess such as a cone, a quadrangular pyramid, a hexagonal pyramid, or other polygonal cone, or a recess such as a truncated cone or a polygonal truncated cone provided on the side of the first main surface 1c of the light guide plate. Thereby, the light irradiated on the interface between the light guide plate 1 , the material with different refractive index (for example, air) located in the optical function portion 1 a (such as air), and the concave inclined surface can be used to reflect toward the side direction of the light emitting device 3 . Furthermore, for example, a light reflective material (for example, a reflective film such as metal or a white resin) may be provided in a recess having an inclined surface. The inclined surface of the optical function part 1a may be a flat surface or a curved surface when viewed in cross section. (Second light reflective member 16)

As shown in FIG. 3 , the second light reflective member 16 covers the second main surface 1d side of the light guide plate 1 . Specifically, the second light reflective member 16 covers the area not covered by the joint member 14 with the second main surface 1d of the light guide plate 1, the inclined surface 14a and the third side surface 15e of the light-transmissive joint member 14. .

The second light reflective member 16 reflects the light emitted from the light-emitting element 11 and enters the light guide plate 1, and guides the light to the first main surface 1c side of the light guide plate serving as the light-emitting surface that radiates external light. This can improve light extraction efficiency. Furthermore, by being laminated on the light guide plate 1, the light guide plate 1 is reinforced.

The second light reflective member 16 may preferably be made of the same material as the above-mentioned first light reflective member 15 , that is, a white resin in which a light-reflecting additive, such as white powder, is added to a transparent resin. The second light reflective member 16 allows the light emitted by the light emitting element 11 to be efficiently radiated from the first main surface 1 c of the light guide plate 1 to the outside.

In addition, as the second light reflective member 16 , similarly to the first light reflective member 15 , a white resin having a reflectivity of 60% or more, preferably 90% or more, with respect to the light emitted from the light-emitting element 11 is used. . The white resin is preferably a resin containing white pigments such as white powder. In particular, polysiloxane resin containing inorganic white powder such as TiO ₂ is preferred. Thereby, by using a large amount of low-cost raw materials such as TiO ₂ as a material for covering one side of the light guide plate 1 , the light-emitting module 100 can be reduced in price.

The above light-emitting module 100 is provided with a recessed portion 1b in the light guide plate 1, and the light-emitting device 3 is arranged in the recessed portion 1b, so the overall thickness can be reduced. In addition, since the light guide plate 1 is provided with the recess 1 b and the light emitting device 3 is arranged in the recess 1 b, the mounting accuracy of the light emitting device 3 and the light guide plate 1 is improved. In particular, since the light-emitting device 3 with the light-emitting element 11 joined to the wavelength conversion member 12 and the light-emitting element 11 and the wavelength conversion member 12 being integrated is arranged in the recess 1 b of the light guide plate 1 , the wavelength conversion member 12 and the wavelength conversion member 12 can be improved. The installation accuracy of the light-emitting element 11 on the light guide plate 1 achieves excellent light-emitting characteristics. Furthermore, in the light-emitting module 100 that causes the light from the light-emitting element 11 to pass through the wavelength conversion member 12, guide the light to the light guide plate 1, and radiate it to the outside, the light-emitting element 11, the wavelength conversion member 12, and the light guide plate 1 can be arranged with high precision. Therefore, the light-emitting characteristics such as uneven color or uneven brightness of the light emitted from the light guide plate 1 to the outside are improved, and particularly excellent light-emitting characteristics are achieved.

The joint member 14 is connected to the second side 12e and the inner side of the light guide plate 1, and further connected to the first light reflective member 15 located outside the recess 1b, whereby the emitted light from the wavelength converting member 12 can be converted into The light emitted toward the second light reflective member 16 side is further guided toward the side of the light emitting device 3 to improve brightness unevenness. In addition, the emitted light can be incident on the light guide plate 1 from the wavelength conversion member 12, thereby improving the light extraction efficiency.

In a direct-type LCD device, because the distance between the LCD panel and the light-emitting module is relatively close, uneven color or uneven brightness of the light-emitting module may affect the uneven color or uneven brightness of the LCD device. sex. Therefore, as a light-emitting module for a direct-type liquid crystal display device, it is desirable to have a light-emitting module with less color unevenness or brightness unevenness. If the structure of the light-emitting module 100 of this embodiment is adopted, not only can the thickness of the light-emitting module 100 be reduced to less than 5 mm, less than 3 mm, less than 1 mm, etc., but also uneven brightness or color can be reduced.

In addition, a light-transmitting member having functions such as diffusion may be laminated on the light guide plate 1 . In this case, if the optical function portion 1a is recessed, the opening of the recess (that is, the portion close to the first main surface 1c of the light guide plate 1) will be closed. However, it is preferable to provide a transparent opening so as not to be embedded in the recess. Components of light. Thereby, an air layer can be provided in the recess of the optical function portion 1a, and the light from the light-emitting element 11 can be well diffused. [Industrial availability]

The light-emitting device, light-emitting module and manufacturing method of the light-emitting device disclosed in the present disclosure can be used as backlights for televisions, flat panels, and liquid crystal display devices and are preferably used in televisions, flat panels, smart phones, smart watches, head-up displays, Digital signage, notice boards, etc. In addition, it can also be used as a light source for lighting, and can be used for emergency lighting, line lighting, various lighting, vehicle instrument panels, etc.

1:Light guide plate 1':Light guide plate 1a: Optical Function Department 1b: concave part 1c: First main surface of light guide plate 1d: The second main surface of the light guide plate 1e: slot 1f: Inclined surface 3:Lighting device 3B:Lighting device 3C:Light-emitting device 11:Light-emitting components 11b:Electrode 11c: Second main surface 11d: First main surface 11e: First side 12:Wavelength conversion component 12c: Third main surface 12d: Fourth main surface 12e: Second side 12f: First inclined surface 14:joint components 14a: Inclined surface 15: First light reflective member 15e:Third side 15f: Second inclined plane 16: Second light reflective member 19: Translucent adhesive member 24:Conductive film 30:Substrate 40: Second resin layer 41:First filler 42:Second resin 44:Light reflective particles 45: cutting chips 46: First cutting area 46B: First cutting area 48: Second cutting area 48B: Second cutting area 49: Inclined surface 50: First resin layer 55: cutting chips 60:Attractor 61:First Blade 62:Second Blade 100:Light-emitting module 100':Light-emitting module 110a: Lens sheet 110b: lens sheet 110c: Diffuser 120:LCD panel 1000:Liquid crystal display device d1:width α: tilt angle

FIG. 1 is a block diagram showing each structure of the liquid crystal display device according to Embodiment 1. FIG. 2 is a schematic top view of the light emitting module according to the first embodiment. 3 is a partially enlarged schematic cross-sectional view of the light-emitting module according to Embodiment 1, in which the light guide plate is placed downward and flipped up and down. Figure 4 is a schematic bottom view of a light emitting module according to a modified example. Fig. 5 is a schematic cross-sectional view showing the light-emitting device according to Embodiment 1. FIG. 6 is a photograph showing a modified example of the light-emitting device. 7 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 1. 8 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 1. 9 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 1. 10 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 1. 11 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 1. 12 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 1. Fig. 13 is a schematic cross-sectional view showing a light-emitting device according to Embodiment 2. 14 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 2. 15 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 2. 16 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device according to Embodiment 2. Fig. 17 is a schematic cross-sectional view showing a light-emitting device according to Embodiment 3.

3:Lighting device

11:Light-emitting components

11b:Electrode

11c: Second main surface

11d: First main surface

11e: First side

12:Wavelength conversion component

12c: Third main surface

12d: Fourth main surface

12e: Second side

12f: First inclined surface

15: First light reflective member

15e:Third side

19: Translucent adhesive member

41:First filler

42:Second resin

44:Light reflective particles

Claims (15)

A light-emitting device provided with: a light-emitting element having: a first main surface on which an electrode is provided; a second main surface on the opposite side of the first main surface; and a first main surface and a second main surface. A continuous first side; a wavelength conversion member having: a third main surface, which is a rectangular shape with a larger area than the above-mentioned second main surface, and is joined to the above-mentioned second main surface; the above-mentioned third main surface a fourth main surface on the opposite side; and a second side surface continuous with the third main surface and the fourth main surface; and converting the wavelength of the light emitted by the above-mentioned light-emitting element to emit light of different wavelengths; a translucent adhesive member, which A portion of the second main surface side and the third main surface that continuously covers the first side surface; and a first light reflective member covering the first side surface provided with the translucent adhesive member and having a a third side; and the first light reflective member contains a first filler with light reflectivity; the distance between the third side surfaces in a cross section perpendicular to the direction of the second main surface is smaller than the distance between the above-mentioned second side surfaces. The distance between the second side surfaces on the fourth main surface side; the wavelength conversion member has a first inclined surface that is inclined in a region of the second side surface that is close to the third main surface; the wavelength conversion member is at the first inclination The surface of the face has light reflective particles. The light-emitting device of claim 1, wherein the first light reflective member has a surface in contact with the third main surface in the third side surface. The second inclined surface is inclined in the nearest area, and the second inclined surface is continuous with the first inclined surface. The light-emitting device of claim 2, wherein the first inclined surface is at least partially formed into a curved surface. The light-emitting device of claim 1, wherein the light-reflective particles are made of the same material as the first filler. The light-emitting device of claim 2, wherein the light-reflective particles are made of the same material as the first filler. The light-emitting device of claim 3, wherein the light-reflective particles are made of the same material as the first filler. The light-emitting device of claim 4, wherein the first filler includes TiO ₂ . The light-emitting device of claim 5, wherein the first filler includes TiO ₂ . The light-emitting device of claim 6, wherein the first filler includes TiO ₂ . A light-emitting module, which is provided with: the light-emitting device according to any one of claims 1 to 9; a translucent light guide plate, which has: a first main surface of the light guide plate, which is a light-emitting surface that radiates light to the outside; and The second main surface of the light guide plate is the surface opposite to the first main surface of the light guide plate and has a recessed portion for disposing the light emitting device; and a second light reflective member covering the second main surface of the light guide plate and the above Luminous device. The light-emitting module of claim 10, wherein when viewed in cross-section, at least a part of the first light-reflective member has a transparent surface located outside the recess and connected to the inner side of the recess and the outer side of the light-emitting device. Optical joining member; the joining member extends along the third side surface located outside the recess. A method of manufacturing a light-emitting device, which is a method of manufacturing a light-emitting device. The light-emitting device is provided with: a light-emitting element; a wavelength conversion member; a translucent adhesive member; and a first light-reflective member; and the manufacturing method includes the following steps: Preparation : As the above-mentioned wavelength conversion member, a first resin layer in which a phosphor is mixed into the first resin; a plurality of the above-mentioned light-emitting elements spaced apart from each other and arranged on the upper surface of the first resin layer components; and a second resin layer containing a first filler with light reflectivity as the first light reflective member, which is arranged between the adjacent light-emitting elements; The first edge of the thickness is cut to form a first cutting area; and a second edge with a second thickness that is thinner than the first thickness is inserted into the first cutting area to cut the above-mentioned second edge directly below the first cutting area. A resin layer forms a second cutting area, is divided into each light-emitting device, and is formed on the side of each light-emitting device, near the area bonded to the first light reflective member on the side of the wavelength conversion member, that is, the second side. The first inclined surface is inclined from the plane of the second side surface, and the light reflective particles are attached to the first inclined surface. The method of manufacturing a light-emitting device according to claim 12, wherein in the step of forming the first cutting area in the second resin layer, a part of the first resin layer is cut with the front end of the first blade. A method of manufacturing a light-emitting device, which is a method of manufacturing a light-emitting device. The light-emitting device is provided with: a light-emitting element; a wavelength conversion member; a translucent adhesive member; and a first light-reflective member; and the manufacturing method includes the following steps: Preparation : As the above-mentioned wavelength conversion member, a first resin layer in which a phosphor is mixed into the first resin; a plurality of the above-mentioned light-emitting elements spaced apart from each other and arranged on the upper surface of the first resin layer components; and a second resin layer containing a first filler with light reflectivity as the first light reflective member, which is arranged between the adjacent light-emitting elements; The first edge of the thickness is cut to form a first cutting area; and a second edge with a second thickness that is thinner than the first thickness is inserted into the first cutting area to cut the above-mentioned second edge directly below the first cutting area. A resin layer forms a second cutting area, which is divided into each light-emitting device, and is formed on the side of each light-emitting device, near the area bonded to the wavelength conversion member on the side of the first light-reflective member, that is, the third side. A second inclined surface inclined from the plane of the third side. The method of manufacturing a light-emitting device according to claim 14, wherein in the step of forming the first cutting area in the second resin layer, the cutting is stopped before the front end of the first blade reaches the first resin layer.