TW202005112A - Method of manufacturing light emitting module, and light emitting module - Google Patents

Abstract

The method of manufacturing a light emitting module (100) includes: providing a light guiding plate (1) having a first main surface (1c) serving as a light emitting surface; and a second main surface (1d) positioned on a side opposite to the first main surface (1c) and provided with a recess (1b); providing a light adjustment portion (10) containing a fluorescent material; providing a light emitting element unit (3) in which a light emitting element (11) is integrally bonded to the light adjustment portion (10); bonding the light adjustment portion (10) of the light emitting element unit (3) to the recess (1b); and forming wiring on an electrode (11b) of the light emitting element (11).

Description

Light emitting module manufacturing method and light emitting module

The invention relates to a method for manufacturing a light-emitting module and a light-emitting module.

Light-emitting devices using light-emitting elements such as light-emitting diodes are widely used in various light sources such as backlights of liquid crystal displays and displays. For example, the light source device disclosed in Patent Document 1 includes: a plurality of light-emitting elements mounted on a mounting substrate; a hemispherical lens member that seals each of the plurality of light-emitting elements; and a diffusion member disposed in a hemispherical shape Above the lens member and for the light from the light emitting element to enter. Furthermore, regarding the light-emitting device disclosed in Patent Document 2, a two-layer sheet obtained by integrating a sealing resin layer and a phosphor layer is fixed on the upper surface of the light-emitting element, and the side surface is covered with a reflective resin. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-32373 [Patent Document 2] Japanese Patent Laid-Open No. 2016-115703

[Problems to be solved by the invention]

However, in the light source device such as Patent Document 1, it is necessary to make the distance between the mounting substrate and the diffusion plate larger than the thickness of the lens member, and it may not be possible to achieve sufficient thinning. In addition, in the light-emitting device of Patent Document 2, the light from the plurality of light-emitting elements cannot be uniformly dispersed and irradiated, and cannot be used for applications requiring light-emitting characteristics with less uneven brightness.

Therefore, an object of the present invention is to provide a method for manufacturing a light-emitting module and a light-emitting module that can be made thin and capable of achieving uniform and light emission characteristics with less uneven brightness. [Technical means to solve the problem]

The method for manufacturing a light-emitting module of the present invention is a method for manufacturing a light-emitting module provided with a light guide plate having a first main surface that becomes a light-emitting surface and a side opposite to the first main surface and provided The second main surface formed by the concave part; the light adjustment part including the phosphor; and the light-emitting element formed by bonding to the light adjustment part; the manufacturing method of the light-emitting module is to prepare the light guide plate and the light adjustment part The light-emitting element unit is bonded to the light-emitting element to form an integrated structure, and the light adjustment part of the light-emitting element unit is fixed to the recess, and wiring is formed on the electrode of the light-emitting element to manufacture a light-emitting module.

In addition, the light emitting module of the present invention includes: a translucent light guide plate formed by providing a recessed portion on the second main surface opposite to the first main surface of the light emitting surface that emits light to the outside; and a light emitting element unit, It is fixed to the concave portion of the light guide plate; the light-emitting element unit is joined to the light-adjusting portion of the light-emitting element including the phosphor, and further, the light-emitting element unit is arranged outside the insertion portion of the concave portion is smaller than the inner shape of the concave portion And, a light-transmitting bonding agent having an annular gap filled between the insertion portion and the concave portion serves as a bonding wall. [Effect of invention]

The method for manufacturing a light-emitting module of the present invention can provide a light-emitting module that is thinner overall, reduces uneven brightness and achieves uniform light-emitting characteristics, and is provided with a light guide plate and a light-emitting element. The reason is that the light adjustment part is fixed to the concave portion of the light guide plate, and the light emitting element unit to which the light emitting element is joined to the light adjustment part is arranged at a predetermined position of the light guide plate. Furthermore, the above manufacturing method has the following features: a light-emitting element unit in which the light adjustment portion including the phosphor and the light-emitting element are integrated, and the light adjustment portion of the light-emitting element unit is fixed to the light guide plate The concave part, and the light emitting element unit is arranged at a predetermined position of the light guide plate, so the relative positional deviation of the light adjustment part, the light emitting element and the concave part of the light guide plate is eliminated, and the high precision is fixed to the accurate position, so It can make the whole thinner and mass-produce with high efficiency, and can reduce the uneven brightness of the surface of the light guide plate.

In addition, the light-emitting module of the present invention has the following features: the light-emitting element unit including the light adjustment portion of the phosphor is bonded to the concave portion of the light guide plate on the light-emitting surface of the light-emitting element, and the light-emitting element unit is arranged on the light-emitting element unit The outer shape of the insertion portion of the concave portion is smaller than the inner shape of the concave portion of the light guide plate, and the light-transmitting bonding agent filling the annular gap between the insertion portion and the concave portion is used as the bonding wall, so that the overall thickness can be thinned and realized Uniform light emission characteristics with less uneven brightness. The reason is that the insertion portion of the light-emitting element unit can be arranged in the concave portion of the light guide plate, and a light-transmitting junction wall can be provided between the insertion portion and the concave portion of the light-emitting element unit, and the light-emitting element unit can be arranged at the precise position of the concave portion of the light guide plate In this way, the light emitted by the light-emitting element enters the light guide plate through the light adjustment section, is diffused by the light guide plate, and then is emitted to the outside.

Hereinafter, the present invention will be described in detail based on the drawings. In addition, in the following description, terms indicating specific directions or positions (such as "upper", "lower", and other terms including these terms) are used as necessary, but the use of these terms is for ease of reference The invention is understood by the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. In addition, parts with the same symbol formed in a plurality of drawings represent the same or equivalent parts or components. Furthermore, the embodiments shown below exemplify a light-emitting module for embodying the technical idea of the present invention and a method of manufacturing the same, and do not limit the present invention to the following. In addition, the dimensions, materials, shapes, and relative arrangements of the constituent members described below are intended to be exemplified as long as there is no specific description, and are not intended to limit the scope of the present invention to this. In addition, the contents described in one embodiment or embodiment can also be applied to other embodiments or embodiments. In addition, the size or positional relationship of the members shown in the drawings may be exaggerated for clarity.

(Liquid crystal display device 1000) FIG. 1 is a configuration diagram showing each configuration of a liquid crystal display device 1000 provided with the light emitting module of this embodiment. The liquid crystal display device 1000 shown in FIG. 1 includes a liquid crystal panel 120, two lens sheets 110a, 110b, a diffusion sheet 110c, and a light emitting module 100 in this order from the upper side. The liquid crystal display device 1000 shown in FIG. 1 is a so-called direct type liquid crystal display device in which the light emitting module 100 is stacked under the liquid crystal panel 120. The liquid crystal display device 1000 irradiates the liquid crystal panel 120 with light irradiated from the light emitting module 100. In addition to the above-mentioned constituent members, members such as a polarizing film or a color filter may be further provided.

(Light emitting module 100) The structure of the light emitting module of this embodiment is shown in FIGS. 2 and 3. 2 is a schematic plan view of the light emitting module of this embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view of the light emitting module of this embodiment, and is a view obtained by arranging the light guide plate below and turning it upside down. The light-emitting module 100 shown in these figures includes a light guide plate 1 and a plurality of light-emitting element units 3 disposed in a recess 1b of the light guide plate 1. The light-emitting module 100 shown in these figures is provided with a plurality of recesses 1b in one light guide plate 1, and the light-emitting element unit 3 is fixed to each recess 1b. However, as shown in the bottom view of the model of FIG. 4, the light-emitting module may be provided with a concave portion 1b in the light guide plate 1', and the light-emitting element unit 3 is fixed to the concave portion 1b to form a light-emitting bit 5, and a plurality of light-emitting bits After the elements 5 are arranged, a light emitting module 100' is formed. Furthermore, the light-emitting module 100 shown in FIG. 3 is provided with a first sealing resin portion 15A on the light-emitting element unit 3 and a second main surface 1d of the light guide plate 1 on which the light-emitting element unit 3 is fixed, and is provided with a surface for embedding In the second sealing resin portion 15B of the light-emitting element unit 3, the first sealing resin portion 15A has the outer peripheral surface on the same plane as the outer peripheral surface of the light adjustment portion 10, and the light-emitting element 11 is embedded.

In the light-emitting element unit 3, the light-emitting element 11 is fixed on the surface of the light adjustment section 10 having the wavelength conversion section 12. The light-emitting element 11 has an upper surface as an electrode forming surface 11d and a lower surface as a light emitting surface 11c. The light emitting element 11 mainly emits light from the light emitting surface 11c, and irradiates the light to the light adjusting section 10. The light-emitting module 100 of FIGS. 2 and 3 arranges a plurality of light-emitting element units 3 in recesses 1b provided on the light guide plate 1 in a matrix to fix the light guide plate 1 and the like. The light guide plate 1 sets the first main surface 1c as a light-emitting surface that emits light toward the outside, and a plurality of concave portions 1b are provided on the second main surface 1d. In this concave portion 1b, a part of the light-emitting element unit 3 is arranged, and in the figure, a light adjustment portion 10 is arranged. The light adjustment unit 10 includes a wavelength conversion unit 12. The light adjustment part 10 of FIG. 2 has a light diffusion part 13 laminated on the wavelength conversion part 12. The light adjustment portion 10 has a wavelength conversion portion 12 laminated on the light-emitting element 11 side, and a light diffusion portion 13 laminated on the light guide plate 1 side. The light adjustment unit 10 can diffuse the light transmitted through the wavelength conversion unit 12 to the light guide plate 1 by the light diffusion unit 13 to make the light emitted from the light guide plate 1 more uniform.

In the light emitting module 100 of the present invention, the light guide plate 1 is provided with the concave portion 1b, and the light emitting element unit 3 is disposed in the concave portion 1b, so that the overall thickness can be reduced. The light adjusting element unit 3 is fixed with the light adjustment portion including the wavelength conversion portion 12 10. In addition, since the light guide plate 1 is provided with a concave portion 1b, and the light emitting element unit 3 is disposed and fixed in the concave portion 1b, compared with a light emitting module in which a light emitting element is mounted on a substrate and a light guide plate is combined, the light emitting element unit 3 and the light guide can be prevented The position of the light board 1 is shifted. In particular, since the light-emitting module 100 is bonded to the light-emitting element 11 by the wavelength conversion unit 12, and the light-emitting element unit 3 in which the light-emitting element 11 and the light adjustment unit 10 are integrated is disposed in the concave portion 1b of the light guide plate 1, it is possible Both the wavelength conversion section 12 and the light-emitting element 11 are arranged at accurate positions of the light guide plate 1 to achieve good optical characteristics. In particular, in the light-emitting module 100 that allows the light of the light-emitting element 11 to pass through the wavelength conversion section 12 and guide it to the light guide plate 1 and emits to the outside, the light-emitting element 11 and the wavelength conversion section 12 can be arranged without positional deviation And the light guide plate 1, the light emission characteristics of the light emitted from the light guide plate 1 to the outside, such as color unevenness or uneven brightness, will be improved to achieve particularly excellent light emission characteristics.

In the direct type liquid crystal display device, since the distance between the liquid crystal panel and the light emitting module is relatively short, uneven color or brightness of the light emitting module may affect the uneven color or brightness of the liquid crystal display device. Therefore, as a light-emitting module of a direct type liquid crystal display device, a light-emitting module with less color unevenness or brightness unevenness is desired.

According to the configuration of the light emitting module 100 of this embodiment, the thickness of the light emitting module 100 can be reduced to 5 mm or less, 3 mm or less, 1 mm or less, and uneven brightness or color unevenness can be reduced.

Hereinafter, each member and manufacturing method of the light-emitting module 100 of this embodiment will be described in detail.

(Light guide plate 1) The light guide plate 1 is a translucent member that emits light incident from the light source to the outside in a planar manner. As shown in FIG. 2, the light guide plate 1 of this embodiment includes a first main surface 1c that becomes a light-emitting surface, and a second main surface 1d opposite to the first main surface 1c. The light guide plate 1 is provided with a plurality of recesses 1b on the second main surface 1d, and a V-shaped groove 1e is provided between adjacent recesses 1b. A part of the light-emitting element unit 3 is arranged in the recess 1b. By inserting a part of the light emitting element 11 into the concave portion 1b of the light guide plate 1, the entire light emitting module can be thinned. Regarding the light guide plate 1, as shown in FIGS. 2 and 3, a plurality of concave portions 1b may be provided and the light emitting element unit 3 may be disposed in each concave portion 1b to make the light emitting module 100, or as shown in FIG. The light guide plate 1'of the concave portion 1b is configured with one light emitting element unit 3 to form a light emitting bit 5, and a plurality of light emitting bits 5 are arranged in a plane to form a light emitting module 100'. As shown in FIG. 3, the light guide plate 1 provided with a plurality of recesses 1b is provided with a lattice-shaped V-shaped groove 1e between the recesses 1b. As shown in FIG. 4, the light guide plate 1 provided with one concave portion 1 b is provided with an inclined surface 1 f which slopes downward toward the outer peripheral edge on the outer peripheral portion of the second main surface 1 d.

The V-shaped groove 1e or the inclined surface 1f is provided with the following sealing resin portion 15 that reflects light. The sealing resin portion 15 filled in the V-shaped groove 1e is preferably a white resin that reflects light, and the white resin sealing resin portion 15 prevents the light emitted by the light-emitting element 11 from entering the adjacent light guide plate divided by the V-shaped groove 1e 2, and prevent the light of each light-emitting element 11 from leaking to the adjacent side. The sealing resin portion 15 joined to the inclined surface 1f of the outer peripheral portion of the second main surface 1d of the one light guide plate 1 will prevent light from leaking around the light guide plate 1 and from the first main surface 11c of the light guide plate 1 Luminous intensity decreases.

The size of the light guide plate 1 is set to an optimal size according to the number of recesses 1b, for example, in the light guide plate 1 having a plurality of recesses 1b, one side may be set to about 1 cm to 200 cm, preferably 3 cm ~30 cm. The thickness can be set to about 0.1 mm to 5 mm, preferably 0.5 mm to 3 mm. The planar shape of the light guide plate 1 can be, for example, substantially rectangular or substantially circular.

As the material of the light guide plate 1, resin materials such as acrylic resin, polycarbonate, cyclic polyolefin, polyethylene terephthalate, polyester and other thermoplastic resins, epoxy resin, silicone resin and other thermosetting resins can be used Or optically transparent materials such as glass. In particular, a thermoplastic resin material is preferable because it can be efficiently produced by injection molding. Among them, polycarbonate with high transparency and low price is preferred. In the manufacturing process, the light-emitting module manufactured without being exposed to a high-temperature environment such as reflow soldering may also use a thermoplastic material such as polycarbonate with a lower heat resistance.

The light guide plate 1 can be formed by injection molding or injection molding, for example. The light guide plate 1 can be formed into a shape having a concave portion 1b using a mold, thereby reducing the positional deviation of the concave portion 1b, and mass-produced at a low price. However, after forming the light guide plate into a plate shape, an NC (Numerical Control, numerical control) processing machine or the like may be used for cutting to provide a concave portion.

The light guide plate 1 of this embodiment may be formed as a single layer, or may be formed by laminating a plurality of translucent layers. When there are a plurality of light-transmitting layers in the laminate, it is preferable to provide layers with different refractive indexes, such as an air layer, among any layers. In this way, light can be diffused more easily, and a light-emitting module with reduced uneven brightness can be made. Such a configuration can be realized, for example, by providing spacers between any plural light-transmitting layers, separating them, and providing an air layer. Furthermore, a light-transmitting layer may be provided on the first main surface 1c of the light guide plate 1, and a layer with a different refractive index, such as an air layer, may be provided between the first main surface 1c of the light guide plate 1 and the light-transmitting layer Wait. In this way, light can be diffused more easily, and a liquid crystal display device with reduced brightness unevenness can be made. Such a configuration can be realized, for example, by providing a spacer between any light guide plate 1 and the light-transmitting layer to separate it, and providing an air layer.

(Optical function section 1a) The light guide plate 1 may include an optical function portion 1a on the first main surface 1c side. The optical function section 1a may have a function of diffusing light in the plane of the light guide plate 1, for example. For example, a material having a refractive index different from that of the light guide plate 1 is provided. Specifically, the following materials can be used: from concaves such as inverted cones, inverted quadrangular cones, inverted hexagonal cones, and the like provided on the first principal surface 1c side, inverted cones, inverted polygonal cones, etc. The interface between the material of the concave and the refractive index different from the light guide plate 1 (for example, air) and the inclined surface of the concave reflects the irradiated light toward the side of the light emitting element unit 3. In addition, for example, a material having light reflectivity (for example, a reflective film such as metal or white resin) or the like may be provided in the concave portion 1b having an inclined surface. The inclined surface of the optical function portion 1a may be a straight line or a curved line in a cross-sectional view. As described below, the optical function portion 1a preferably corresponds to each light-emitting element unit 3, that is, is provided at a position opposite to the light-emitting element unit 3 disposed on the second main surface 1d side. Particularly preferably, the optical axis of the light-emitting element unit 3 is substantially the same as the optical axis of the optical function section 1a. The size of the optical function section 1a can be set appropriately.

(Recess 1b) The light guide plate 1 is provided with a concave portion 1b on the second main surface 1d side. The concave portion 1b is used to arrange a part of the light-emitting element unit 3 inside and at a predetermined position. The recess 1b shown in FIG. 3 is provided with a recess 1b in a shape in which a part of the second main surface 1d is cut away. However, although not shown, the concave portion may be provided inside the convex strip after the convex strip is provided on the second main surface in a ring shape. The inner shape of the concave portion 1b is larger than the outer shape of the insertion portion 17 for arranging the light emitting element unit 3 in the concave portion 1b. In the state where the insertion portion 17 of the light emitting element unit 3 is arranged, the inner circumference of the concave portion 1b and the light emitting element unit 3 An annular gap 18 is provided between the outer periphery of the insertion portion 17. The annular gap 18 is filled with the bonding agent 14 and becomes the bonding wall 19. The inner shape of the concave portion 1b is set to have a shape in which the volume of the annular gap 18 is larger than the volume of the insertion portion 17 of the light emitting element unit 3. In the light-emitting module of this embodiment, since the light adjustment portion 10 is disposed in the concave portion 1 b of the light guide plate 1, the light adjustment portion 10 is used as the insertion portion 17 of the light-emitting element unit 3. However, the insertion portion 17 of the light-emitting element unit 3 is not specifically defined as the light adjustment portion 10. For example, a part of the light adjustment portion 10 and the light-emitting element 11 may be used as the insertion portion 17 disposed in the concave portion 1 b.

The inner shape of the concave portion 1b is set to a size where the capacity of the annular gap 18 is set to, for example, 1.2 times or more, preferably 1.5 times or more, and more preferably 2 times the volume of the insertion portion 17 of the light-emitting element unit 3 More than times. The annular gap 18 is filled with the light-transmitting bonding agent 14 and becomes the bonding wall 19. In the light guide plate 1 of FIG. 4, the inner shape of the concave portion 1 b is set to a quadrangle, and the outer shape of the insertion portion 17 of the light emitting element unit 3 arranged here is also set to a quadrangle. The quadrangular insertion portion 17 is disposed in the recess 1b in such a posture that each side intersects the quadrilateral recess 1b, in other words, is rotated relative to the quadrilateral recess 1b, and an annular gap 18 is provided between the recess 1b and the insertion portion 17. The insertion portion 17 in this figure is disposed in the concave portion 1b in such a manner that each side is inclined at 45 degrees. Regarding the concave portion 1b in which the insertion portion 17 is arranged in this posture, the inner shape thereof is set to be twice or more the outer shape of the insertion portion 17.

The light guide plate 1 in which the insertion portion 17 is arranged in the concave portion 1b in the posture of FIG. 4 has a feature that it can reduce the unevenness in brightness of the first main surface 1c. The reason for this is that the light emitted from each side of the insertion portion 17 to the surroundings is strongly emitted in the direction of the arrow A shown by the chain line in FIG. 5 to brightly illuminate the area C in the figure. Regarding the insertion portion 17 of the quadrangle, the intensity of light in the direction indicated by the arrow A orthogonal to each side is stronger than the light emitted from the corner in the direction indicated by the arrow B. In FIG. 5, the area C is located further away from the insertion portion 17 than the area D, so there is a tendency to become darker, but since the light in the direction indicated by arrow A is stronger than the light in the direction indicated by arrow B, it can be prevented As the brightness decreases, the uneven brightness decreases. As shown in FIG. 6, when the insertion portion 17 of the quadrangle is arranged in the concave portion 1b of the quadrangle in such a manner that the sides are parallel, the area C is located farther from the insertion portion 17 than the area D, and the light emitted from the insertion portion 17 The intensity is also reduced, so the brightness of area C is lower than that of area D.

The concave portion 1b formed by making the inner shape larger than the outer shape of the insertion portion 17 also realizes the following features: in addition to increasing the degree of freedom of the posture of the insertion portion 17 and preventing uneven brightness, it is also possible to eliminate the The deviation of the surface height due to the error in the filling amount of the bonding agent 14 makes the light distribution of the outer periphery of the recess 1b ideal. The annular gap 18 is filled with the bonding agent 14 to become the light-transmissive bonding wall 19, but the difference in the filling amount of the bonding agent 14 will cause the surface height to fluctuate and cause abnormal light emission. 7 and 8 show a state where the liquid level height of the bonding wall 19 is abnormal due to an error in the filling amount of the bonding agent 14. FIG. 7 shows a state where the filling amount of the bonding agent 14 is too small. The surface height of the joint wall 19 is lower than the second main surface 1d of the light guide plate 1 and lowered to the inside of the annular gap 18, and a gap is generated between the light guide plate 1 and the insertion portion 17. FIG. 8 shows a state where the filling amount of the bonding agent 14 is excessive, and the bonding wall 19 in this state is a state where the bonding agent 14 leaks out from the annular gap 18 and swells on the second main surface 1d. The gap between the light guide plate 1 and the insertion portion 17 or the adhesive 14 swelled on the second main surface 1d may cause the path of light incident from the insertion portion 17 to the light guide plate 1 to change, resulting in abnormal light emission.

The configuration of making the inner shape of the concave portion 1b larger than the insertion portion 17 and making the volume of the annular gap 18 larger than the volume of the insertion portion 17 will reduce the liquid caused by the uneven filling amount of the cement 14 filled in the annular gap 18 The change in the surface height makes the light emission in the area of the light guide plate 1 and the insertion portion 17 ideal.

Considering the outer shape of the insertion portion 17 and the above characteristics, regarding the size of the recessed portion 1b in plan view, the diameter in the case of a circle, the long axis in the case of an ellipse, and the length of the diagonal in the case of a quadrangle can be exemplified It is set to 0.05 mm to 10 mm, preferably 0.1 mm to 2 mm. The depth can be set to 0.05 mm to 4 mm, preferably 0.1 mm to 1 mm. The distance between the optical functional portion 1a and the concave portion 1b can be appropriately set within a range where the optical functional portion 1a and the concave portion 1b are separated. The shape of the recess 1b in plan view can be, for example, substantially rectangular and substantially circular, and can be selected according to the arrangement pitch of the recess 1b. When the arrangement pitch of the concave portions 1b (the distance between the centers of the two closest concave portions 1b) is approximately equal, it is preferably approximately circular or approximately square. Among them, the substantially circular shape is effective to diffuse light from the light-emitting element unit 3 well.

(Light-emitting element unit 3) The light-emitting element unit 3 is a light source of the light-emitting module 100. As for the light-emitting element unit 3, as shown in FIG. 3, the light-adjusting portion 10 having the wavelength conversion portion 12 is joined to the light-emitting element 11. Furthermore, the light-emitting element unit 3 of the present embodiment is provided with a first sealing resin portion 15A having an outer peripheral surface on the same plane as the outer peripheral surface of the light adjustment portion 10 and embedding the light-emitting element 11. The light emitting element unit 3 is disposed in the concave portion 1b of the light guide plate 1, and emits the emitted light to the outside through the light guide plate 1. In the light-emitting element unit 3 in the figure, the light adjustment portion 10 is arranged inside the concave portion 1 b as an insertion portion 17 arranged in the concave portion 1 b of the light guide plate 1. The light-emitting element unit 3 joins the light adjustment portion 10 to the bottom surface of the concave portion 1b so as to be fixed to the concave portion 1b provided on the light guide plate 1.

The light-emitting element unit 3 of FIG. 3 connects the light adjustment portion 10 to the light-emitting surface 11c of the light-emitting element 11. In the light-emitting element 11, the side opposite to the electrode formation surface 11 d is a light-emitting surface 11 c, and the light adjustment portion 10 is joined to this surface. The light-emitting module of this embodiment uses a face-down type in which the opposite side of the electrode forming surface 11d is the light-emitting surface 11c and the light-emitting surface 11c is the main light-emitting surface, but a face-up type may also be used Light emitting element. In the light-emitting element 11 of FIG. 3, the opposite side of the light emitting surface 11c is an electrode forming surface 11d, and a pair of electrodes 11b are provided on the electrode forming surface 11d. The pair of electrodes 11b are wired and electrically connected in the following structure. The light-emitting element unit 3 and the light guide plate 1 are joined via a light-transmitting bonding material 14 such as a light-transmitting resin.

The light-emitting element 11 has, for example, a translucent substrate such as sapphire, and a semiconductor laminated structure laminated on the translucent substrate. The semiconductor build-up structure includes a light-emitting layer, an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light-emitting layer, and an n-side electrode and a p-side electrode 11b are electrically connected to the n-type semiconductor layer and the p-type semiconductor layer, respectively. The light-emitting element 11 has, for example, a light-emitting surface 11c provided with a translucent substrate facing the light guide plate 1, and has a pair of electrodes 11b on an electrode forming surface 11d on the opposite side of the light-emitting surface 11c.

As the light-emitting element 11, the vertical, horizontal, and height dimensions are not particularly limited, but it is preferably used in a semiconductor light-emitting element 11 with a vertical and horizontal dimension of 1000 μm or less in a plan view, and more preferably a vertical and horizontal dimension of 500 In the case of μm or less, it is more preferable to use the light-emitting element 11 having a vertical and horizontal dimension of 200 μm or less. If such a light-emitting element 11 is used, high-definition images can be realized when performing area dimming of the liquid crystal display device 1000. In addition, if the light-emitting element 11 having a vertical and horizontal size of 500 μm or less is used, the light-emitting element 11 can be purchased at a low price, so that the light-emitting module 100 can be inexpensive. Furthermore, regarding the light-emitting element 11 in which both the vertical and horizontal dimensions are 250 μm or less, since the area of the upper surface of the light-emitting element 11 is reduced, the amount of light emitted from the side surface of the light-emitting element 11 relatively increases. That is, the light-emitting element 11 is easy to form a bat-wing shape because of its light emission, so it is preferably used for the light-emitting module of this embodiment in which the light-emitting element 11 is bonded to the light guide plate 1 and the distance between the light-emitting element 11 and the light guide plate 1 is extremely short 100.

Furthermore, the light guide plate 1 may be provided with an optical function part 1a having a reflection or diffusion function such as a lens. The light guide plate 1 can diffuse the light from the light emitting element 11 to the side and average the luminous intensity in the plane of the light guide plate 1. However, it is difficult for the light guide plate 1 in which a plurality of optical functional sections 1a are formed at the corresponding positions of the plurality of light emitting elements 11 to accurately maintain the relative positions of all the light emitting elements 11 and the optical functional section 1a. In particular, in a structure in which a plurality of smaller light-emitting elements 11 are provided, it is difficult to accurately maintain the relative positions of all the light-emitting elements 11 and the optical function portion 1a. The displacement of the relative position of the light-emitting element 11 and the optical functional section 1a has the following problem: the optical functional section 1a cannot be used to diffuse light sufficiently, so that the brightness locally decreases in-plane, etc., resulting in uneven brightness. In particular, in the method of assembling the light guide plate 1 after mounting the light emitting element 11 on the wiring board, it is necessary to consider the positional deviation of the wiring board and the light emitting element 11 in the plane direction and the stacking direction, and the optical function with the light guide plate 1 Since the position of the portion 1a is shifted, it is more difficult to optically couple the light-emitting element 11 and the optical function portion 1a well.

Regarding the light-emitting module 100 of the present embodiment, the light guide plate 1 is provided with a plurality of concave portions 1b and optical function portions 1a, and the light-emitting element unit 3 is disposed in the concave portion 1b, so that the light-emitting element 11 can be arranged with high position accuracy Both with the optical function section 1a. This makes it possible to use the optical function unit 1a to homogenize the light from the light-emitting element 11 with high accuracy, thereby producing a high-quality backlight light source with less uneven brightness or less uneven color.

The light guide plate 1 provided with the optical functional part 1a on the surface opposite to the concave part 1b where the light emitting element 11 is arranged, and the optical functional part 1a is provided at the position where the concave part 1b of the light emitting element 11 is arranged in a plan view, thereby enabling the light emitting element 11 It is easier to position with the optical function section 1a, and the two are arranged without relative positional deviation with high position accuracy.

As the light emitting element 11, a light emitting element 11 having a square shape or a rectangular shape in plan view is used. The light-emitting element 11 used in the high-definition liquid crystal display device is preferably a rectangular light-emitting element, and the shape of its upper surface preferably has a long side and a short side. In the case of a high-definition liquid crystal display device, the number of light-emitting elements used reaches more than thousands, and the installation step of the light-emitting elements becomes an important step. That is, in the installation step of the light-emitting element, a part of the light-emitting elements of the plurality of light-emitting elements has a rotational offset (for example, an offset in the direction of ±90 degrees). Since a rectangular light-emitting element is used in plan view, visual confirmation is also easier. In addition, since the p-type electrode and the n-type electrode can be formed at a distance, the following wiring 21 can be easily formed. On the other hand, when a square light-emitting element 11 is used in plan view, a smaller light-emitting element 11 can be manufactured with good mass productivity. The density (arrangement pitch) of the light-emitting elements 11, that is, the distance between the light-emitting elements 11 can be set to, for example, about 0.05 mm to 20 mm, preferably about 1 mm to 10 mm.

Regarding the light-emitting module 100 in which a plurality of light-emitting element units 3 are arranged on the light guide plate 1 having a plurality of recesses 1b, the light-emitting element units 3 are two-dimensionally arranged in a plan view of the light guide plate 1. Preferably, as shown in FIG. 2, the plurality of light-emitting element units 3 are arranged in the concave portions 1 b that are two-dimensionally arranged along two directions that are orthogonal, that is, the x direction and the y direction. About configuration for a plurality of light emitting element units arranged in the recess 3 of the arrangement direction x. IB of the _x and y-direction, the pitch P of the pitch P _y, of the embodiment shown in FIG 2, between the x and y directions may be the same pitch, also It can be different. Also, the two directions of arrangement may not necessarily be orthogonal. In addition, the arrangement pitch in the x direction or the y direction is not limited to equal intervals, and may be not equal intervals. For example, the recesses 1b for arranging the light-emitting element units 3 may be arranged so that the interval from the center of the light guide plate 1 toward the periphery becomes wider. In addition, the distance between the light-emitting element units 3 disposed in the concave portion 1b refers to the distance between the optical axes of the light-emitting element units 3, that is, the distance between the centers.

The light-emitting element 11 can use a well-known semiconductor light-emitting element. In this embodiment, a face-down type light-emitting diode is exemplified as the light-emitting element 11. The light-emitting element 11 emits blue light, for example. As the light-emitting element 11, an element that emits light other than blue may be used, or a face-up type light-emitting element may be used. Furthermore, a plurality of light-emitting elements 11 may be used as light-emitting elements that emit light of different colors. The light emitted from the light emitting element 11 is adjusted by the wavelength conversion section 12 to the luminous color emitted to the outside.

As the light-emitting element 11, an element that emits light of any wavelength can be selected. For example, emit blue, green component of light may be utilized using a nitride semiconductor _{(In x Al y Ga1 -xy N} , 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) or GaP light emitting element of . As an element that emits red light, a light-emitting element including semiconductors such as GaAlAs and AlInGaP can be used. Furthermore, semiconductor light-emitting elements containing materials other than these can also be used. Various light emission wavelengths can be selected according to the material of the semiconductor layer and its mixed crystallinity. The composition, light-emitting color, size, number, etc. of the light-emitting elements used may be appropriately selected according to the purpose.

(Light adjustment section 10) In the present embodiment, the light-emitting element unit 3 is provided with a light adjustment unit 10 that adjusts the emission color from the light-emitting element 11 to make the light enter the light guide plate 1. The light adjustment unit 10 includes a wavelength conversion unit 12 that adjusts the emission color of the light-emitting element 11. The light adjusting portion 10 is joined to the light emitting surface 11c of the light emitting element 11 to adjust the light emission color of the light emitting element 11. The light adjustment unit 10 preferably includes a wavelength conversion unit 12 and a light diffusion unit 13. The light adjustment unit 10 joins the wavelength conversion unit 12 and the light diffusion unit 13 and arranges the wavelength conversion unit 12 on the light-emitting element 11 side. The light adjustment unit 10 may also laminate a plurality of wavelength conversion units 12 or light diffusion units 13. In the light-emitting module 100 of the present embodiment, the light adjustment portion 10 is arranged in the concave portion 1b of the light guide plate 1 and serves as the insertion portion 17 of the light-emitting element unit 3. The light adjustment unit 10 transmits light incident from the light-emitting element 11 and enters the light guide plate 1. For the purpose of thinning the light emitting module 100 and the like, the light adjustment portion 10 is preferably located inside the concave portion 1b of the light guide plate 1 as shown in FIG. 3 and is not protruded from the second main surface 1d to the surface side Within the recess 1b. The light adjustment portion 10 of FIG. 3 is set to have a thickness equal to the depth of the concave portion 1b, and its surface is arranged on the same plane as the second principal surface 1d. However, although not shown, the light adjustment portion may be located inside the concave portion, and may have a thickness slightly exposed from the second main surface of the light guide plate to the surface side.

In the light-emitting element unit 3 of FIG. 3, the light adjustment portion 10 has a larger outer shape than the light-emitting element 11. The light-emitting element unit 3 allows all light emitted from the light-emitting surface 11c of the light-emitting element 11 to pass through the light adjustment portion 10 and enter the light guide plate 1, thereby reducing color unevenness.

The wavelength conversion unit 12 adds a wavelength conversion material to the base material, and the light diffusion unit 13 adds a diffusion material to the base material. For the material of the base material, for example, epoxy resin, silicone resin, resin obtained by mixing these, or light-transmitting materials such as glass can be used. From the viewpoint of the light resistance and formability of the light adjustment section 10, it is advantageous to select a silicone resin as the base material. As the base material of the light adjustment section 10, a material having a higher refractive index than that of the light guide plate 1 is preferable.

Examples of the wavelength conversion material included in the wavelength conversion section 12 include YAG (Yttrium Aluminum Garnet, Yttrium Aluminum Garnet) phosphors, fluoride-based phosphors such as β-sialon phosphors, and KSF-based phosphors. In particular, since a plurality of wavelength conversion members are used in one wavelength conversion section 12, it is more preferable that the wavelength conversion section 12 includes a β-sialon phosphor emitting green light and a KSF fluorescent light emitting red light Fluoride, such as phosphor, can expand the color reproduction range of the light emitting module. In this case, the light-emitting element 11 is preferably a nitride semiconductor (In _x Al _y Ga _1-xy N, 0≦X, 0≦Y, X, which can emit short-wavelength light that can efficiently excite the wavelength conversion member +Y≦1). In addition, for example, when using the light-emitting element 11 that emits blue-based light, in order to obtain red-based light, the wavelength conversion section 12 may also contain 60% by weight or more of KSF-based phosphor (red phosphor), Preferably, it contains 90% by weight or more. That is, it is also possible to emit light of a specific color by including a wavelength conversion member that emits light of a specific color. In addition, the wavelength conversion material may also be quantum dots. Within the wavelength conversion section 12, the wavelength conversion material may be arranged in any manner. For example, it may be distributed substantially uniformly, or it may exist in a partial bias. In addition, a plurality of layers each including a wavelength conversion member may be provided in layers.

For the light diffusing portion 13, for example, the above resin material can be used as a base material, and white inorganic fine particles such as SiO ₂ or TiO _{2 are} contained therein.

(Sealing resin part 15) The light emitting module 100 of FIG. 3 is bonded to the second main surface 1d of the light guide plate 1 and provided with a sealing resin portion 15. The sealing resin portion 15 is preferably a white resin such as white powder as an additive for reflecting light added to the transparent resin. The sealing resin portion 15 of white resin emits light emitted from the outer peripheral portion or electrode surface of the light emitting element 11, light emitted from the back surface of the light adjustment portion 10, light emitted from the back surface of the bonding wall 19, and the first light guide plate 1 2 The light emitted from the main surface 1d is reflected, so that the light emitted from the light emitting element 11 is effectively emitted from the first main surface 1c of the light guide plate 1 to the outside. The light emitting module 100 of FIG. 3 divides the sealing resin portion 15 into a first sealing resin portion 15A and a second sealing resin portion 15B. The light-emitting module 100 in this figure divides the sealing resin portion 15 into a first sealing resin portion 15A having an integral structure with the light-emitting element unit 3 and a second seal formed by bonding to the second main surface 1d of the light guide plate 1 The resin portion 15B, but the sealing resin portion may be an integrated structure without dividing the first sealing resin portion and the second sealing resin portion. The light-emitting module is manufactured by fixing a light-emitting element unit without a first sealing resin portion to a light guide plate, and bonding the sealing resin portion to the second main surface of the light guide plate.

The light-emitting module 100 divided into the first sealing resin portion 15A and the second sealing resin portion 15B is manufactured in the following steps in the manufacturing step of the light-emitting module 100: the first sealing resin portion 15A is joined to the light-emitting element 11 and the light adjustment In the portion 10, the first sealing resin portion 15A is a block having an integral structure with the light-emitting element 11 and the light adjustment portion 10. The second sealing resin portion 15B is bonded to the second principal surface 1d of the light guide plate 1 in a state where the light emitting element unit 3 provided with the first sealing resin portion 15A is bonded to the light guide plate 1 and filled in the first seal The gap of the resin portion 15A.

The first sealing resin portion 15A and the second sealing resin portion 15B are in close contact with each other. Furthermore, the first sealing resin portion 15A is also in close contact with the light-emitting element 11. The first sealing resin portion 15A is located around the light-emitting element 11, the light-emitting element 11 is buried, and the electrode 11 b of the light-emitting element 11 is exposed to the surface. The first sealing resin portion 15A has its outer peripheral surface being the same plane as the outer peripheral surface of the light adjusting portion 10 and is also in close contact with the light adjusting portion 10. The first sealing resin portion 15A is fabricated as a light-emitting element unit 3 integrated with the light-emitting element 11 and the light adjustment portion 10 and fixed to the light guide plate 1. In addition, the first sealing resin portion 15A is preferably white resin. The first sealing resin portion 15A can reflect light emitted toward the outer peripheral surface of the light emitting element 11, thereby improving the light emitting efficiency of the light emitting module 100. The second sealing resin portion 15B is in close contact with the boundary between the second main surface 1d of the light guide plate 1 and the back surface of the bonding wall 19. The second sealing resin portion 15B is provided on the same plane as the surface of the first sealing resin portion 15A where the electrode 11b is exposed. The second sealing resin portion 15B is joined to the second main surface 1d of the light guide plate 1 to which the light emitting element unit 3 having the first sealing resin portion 15A as an integral structure is fixed, and is provided between the first sealing resin portions 15A.

The second sealing resin portion 15B is laminated on the light guide plate 1 to reinforce the light guide plate 1. Furthermore, the second sealing resin portion 15B is preferably a white resin. The sealing resin portion 15 can efficiently capture the light emitted by the light emitting element 11 to the light guide plate 1 to increase the light output of the first main surface 1c of the light guide plate 1 Big. Furthermore, the second sealing resin portion 15B of the white resin also serves as a member that protects the light-emitting element 11 and a layer that reflects the surface of the second main surface 1d of the light guide plate 1, whereby the light-emitting module 100 can be thinned.

The sealing resin portion 15 is preferably a white resin having a reflectance of 60% or more for light emitted from the light-emitting element 11, and preferably a reflectance of 90% or more. The sealing resin portion 15 is preferably a resin containing white pigments such as white powder. In particular, a silicone resin containing inorganic white powder such as titanium oxide is preferred. As a result, as a material used to cover a relatively large amount of one surface of the light guide plate 1, low-cost raw materials such as titanium oxide are mostly used, so that the light-emitting module 100 can be made inexpensive.

(Translucent joining member) The light emitting module 100 of FIG. 3 uses a light-transmitting bonding member to bond the wavelength conversion portion 12 and the light diffusion portion 13, the light adjustment portion 10 and the light emitting element 11, and the light emitting element unit 3 and the light guide plate 1. The translucent joining member joins the wavelength conversion portion 12 and the light diffusion portion 13 to form the light adjustment portion 10, and joins the light adjustment portion 10 to the light emitting element 11 to form the light emitting element unit 3. A light-transmitting bonding member 16A as an adhesive 14 that bonds the light-emitting element unit 3 to the bottom surface of the concave portion 1b of the light guide plate 1 fixes the light-emitting element unit 3 to the light guide plate 1 and fills the insertion of the concave portion 1b and the light-emitting element unit 3 The light-transmissive bonding member 16A which is the bonding agent 14 formed by the annular gap 18 between the portions 17 constitutes the bonding wall 19, and bonds the light adjustment portion 10 to the inner surface of the recess 1b.

The light-transmitting bonding member has a light transmittance of 60% or more, preferably 90% or more. The translucent bonding member 16A transmits light emitted from the light-emitting element 11 to the light guide plate 1. The translucent bonding member 16A may include a diffusion member or the like, or may include white powder or the like as an additive that reflects light, but may also be composed only of a translucent resin material that does not include a diffusion member or white powder.

As the material of the light-transmitting joining member, a light-transmitting thermosetting resin material such as epoxy resin or silicone resin can be used.

(Manufacturing steps of light emitting module 100) 9A to 9D and 10A to 10D show the manufacturing steps of the light-emitting element unit 3 of this embodiment. In the steps shown in FIGS. 9A and 9B, the wavelength conversion unit 12 and the light diffusion unit 13 are stacked to become the light adjustment unit 10. In the step shown in FIG. 9A, in a state where the wavelength conversion portion 12 and the light diffusion portion 13 are joined, the first sheet 31 and the second sheet 32 are stacked, and the first sheet 31 is attached to the base sheet 30 The wavelength conversion portion 12 is attached to the surface with a uniform thickness, and the second sheet 32 is attached with the light diffusion portion 13 to the surface of the base sheet 30 with a uniform thickness. The wavelength conversion portion 12 and the light diffusion portion 13 are joined by a light-transmitting joining member. On the base sheet 30, for example, the long conversion portion 12 and the light diffusion portion 13 are attached in a peelable manner via an adhesive layer. Furthermore, in the step shown in FIG. 9B, the base sheet 30 of the second sheet 32 is attached to the bottom plate 33 in a peelable manner, and the base sheet bonded to the wavelength conversion portion 12 of the first sheet 31 is peeled off 30.

In the step shown in FIG. 9C, the light-emitting element 11 is bonded to the light adjustment part 10. The light-emitting element 11 has the light-emitting surface 11c side bonded to the light adjustment portion 10. The light-emitting element 11 is bonded to the wavelength conversion portion 12 of the light adjustment portion 10 at specific intervals. The light-emitting element 11 is joined to the light adjustment part 10 via a light-transmitting joining member. The translucent bonding member is applied to the surface of the light adjustment unit 10 or the light-emitting element 11, and joins the light-emitting element 11 and the light adjustment unit 10. 9C shows a state where the applied light-transmitting bonding member 16B overflows around the light-emitting element 11 and the light-emitting element 11 is bonded to the light adjustment portion 10. As shown in FIG. 10D, the interval between the light-emitting elements 11 is set to the following size: the light-emitting elements 11 are cut out to form a specific size outside the light adjustment portion 10. The reason for this is that the interval between the light-emitting elements 11 specifies the shape of the light emission adjusting portion 10.

In the step shown in FIG. 9D, the first sealing resin portion 15A is formed so as to embed the light-emitting element 11. The first sealing resin portion 15A is preferably white resin. The first sealing resin portion 15A containing white resin is applied to the surface of the light adjustment portion 10, and is cured in a state where the light emitting element 11 is embedded. The first sealing resin portion 15A is applied to a thickness for completely embedding the light-emitting element 11, and in the figure is applied to a thickness for embedding the electrode 11b of the light-emitting element 11.

In the step shown in FIG. 10A, the hardened white resin is ground to expose the electrode 11b of the light-emitting element 11.

The electrode terminal 23 may be formed by using a metal film on the electrode 11b of the light-emitting element 11. In this case, for example, in the step shown in FIG. 10B, the metal film 22 is provided on the surface of the first sealing resin portion 15A. Regarding the metal film 22, for example, metal films such as copper, nickel, and gold are provided on the surface of the first sealing resin portion 15A by sputtering or the like, and are connected to the electrode 11b.

In the step shown in FIG. 10C, a part of the metal film 22 is removed, and the metal film 22 is deposited on the electrode 11 b to form the electrode terminal 23 of the light-emitting element unit 3. The metal film 22 can be removed by dry etching, wet etching, laser ablation, and the like.

In the step shown in FIG. 10D, the first sealing resin portion 15A containing white resin and the layer that becomes the light adjustment portion 10 are cut and separated into the light-emitting element units 3. In the separated light-emitting element unit 3, the light-emitting element 11 is joined to the light adjustment part 10, the first sealing resin part 15A is provided around the light-emitting element 11, and the electrode terminal 23 is exposed to the surface of the first sealing resin part 15A.

The light-emitting element unit 3 manufactured by the above steps is bonded to the concave portion 1b of the light guide plate 1 through the steps shown in FIGS. 11A to 11C and 12A to 12C. The light guide plate 1 is made of polycarbonate. Regarding the light guide plate 1, as shown in FIGS. 11A and 11B, after molding a thermoplastic resin such as polycarbonate, a concave portion 1b is formed on the second main surface 1d, and an inverted conical optical function portion 1a is provided on the first main surface 1c . The light emitting element unit 3 is joined to the concave portion 1b of the light guide plate 1. Regarding the light-emitting element unit 3, the light adjustment portion 10 is inserted into the concave portion 1b coated with the liquid-state light-transmitting bonding member 16A in an uncured state, and the light-transmitting bonding member 16A is hardened and fixed to the light guide plate 1 . Regarding the light-emitting element unit 3, the light adjustment portion 10 is accurately inserted into the center of the recess 1b, and the light-transmitting bonding member 16A is hardened to be bonded to the light guide plate 1. The translucent bonding member 16A applied to the concave portion 1b in an uncured state is extruded into the annular gap 18 and adjusted to the surface of the bonding wall 19 in a state where the light emitting element unit 3 is bonded to the light guide plate 1 The height is the same as the filling amount of the second main surface 1d of the light guide plate 1. However, the light-transmitting bonding member in the uncured state may be filled into the annular gap 18 after bonding the light-emitting element unit 3 to the light guide plate 1, and the surface height of the bonding wall 19 may be the second main surface of the light guide plate 1 1d is the same plane. Therefore, regarding the filling amount of the uncured translucent bonding member 16A initially filled in the concave portion 1b, in a state where the light emitting element unit 3 is bonded to the concave portion 1b, it is assumed that the surface height of the bonding wall 19 is located higher than the light guide plate 1 The second main surface 1d has a low height, that is, a small amount inside the annular gap 18, and after the light-emitting element unit 3 is joined to the light guide plate 1, the light-transmitting joining member starts to fill the annular gap 18, The surface height of the bonding wall 19 is set to the same plane as the second main surface 1d of the light guide plate 1.

The light-transmitting bonding member 16A that joins the light adjustment portion 10 to the bottom surface of the recess 1b is in an uncured state and is in close contact with the surfaces of both, and after hardening, the surface of the light adjustment portion 10 is joined to the bottom surface of the recess 1b. Furthermore, the translucent bonding member 16A extruded from between the light adjustment portion 10 and the bottom surface of the concave portion 1b becomes the bonding wall 19, and the outer periphery of the light adjustment portion 10 is bonded to the inner circumferential surface of the concave portion 1b. In this manufacturing method, the uncured liquid-like light-transmitting bonding member 16A filled in the concave portion 1 b is extruded into the annular gap 18 to form the bonding wall 19. In this method, the translucent bonding member 16A filled in the concave portion 1b is set as the bonding agent 14. Therefore, it is necessary to adjust the filling amount of the translucent bonding member 16A so that the bonding wall 19 and the second main surface 1d of the light guide plate 1 become the same The amount of plane. If the filling amount of the translucent bonding member 16A is small, as shown in FIG. 7, the surface of the bonding wall 19 is lower than the second main surface 1d of the light guide plate 1. Conversely, if the filling amount of the translucent bonding member 16A is large, as shown in FIG. 8, the bonding wall 19 overflows from the annular gap 18, and the surface of the bonding wall 19 protrudes from the second main surface 1 d of the light guide plate 1. If the surface of the bonding wall 19 is not the same plane as the second main surface 1d of the light guide plate 1, the light distribution around the light-emitting portion cannot be brought into an ideal state. The reason is that the light-transmitting bonding member overflowing from the concave portion 1b or the gap not filled with the light-transmitting bonding member may cause abnormal light distribution. The filling amount of the translucent bonding member 16A is adjusted in such a manner that the bonding wall 19 and the second main surface 1d of the light guide plate 1 become the same plane, but a slight difference in the filling amount will cause the bonding wall 19 and the light guide plate 1 The relative position of the second main surface 1d is abnormal.

Regarding the light-emitting module 100 of the present embodiment, in order to prevent the deviation of the relative position of the height of the surface of the bonding wall 19 and the second main surface 1d of the light guide plate 1 due to the uneven filling amount of the translucent bonding member 16A, The volume of the entire joint wall 19 is greater than the volume of the light-emitting element unit 3 disposed in the recess 1b, that is, the volume in the recess. In the present embodiment, the light-emitting element unit 3 arranges the light adjustment portion 10 in the concave portion 1b, so the volume in the concave portion becomes the volume of the light adjustment portion 10. Therefore, in the present embodiment, the volume of the entire junction wall 19 is made larger than the volume of the light adjustment portion 10. Regarding the concave portion 1b in which the entire volume of the bonding wall 19 is larger than the volume in the concave portion of the light-emitting element unit 3, the positional deviation of the bonding wall surface can be reduced for the difference in the filling amount of the filled translucent bonding member 16A.

For example, as a specific example, the inner shape of the concave portion is set to a quadrilateral with 0.6 mm on one side, and the depth is set to 0.2 mm, the outer shape of the light adjustment portion is set to a quadrilateral with a side of 0.5 mm, and the thickness is set to 0.2 mm, if the light adjustment part is arranged in the concave part, the volume of the concave part of the light-emitting element unit becomes 0.05 mm ³ , the volume of the entire bonding wall 19 becomes 0.022 mm ³ , and the volume of the whole bonding wall 19 becomes approximately 1/2 of the volume of the concave part . In this structure, in order to set the height difference of the surface of the bonding wall 19 to within ±0.01 mm, the filling amount of the light-transmitting bonding member must be extremely accurately controlled to within ±0.0036 mm ³ .

On the other hand, if the inner shape of the concave portion 1b is a quadrilateral with one side 1.0 mm and the same depth, the internal volume of the concave portion is also 0.05 mm ^3. Therefore, if the entire volume of the joint wall 19 is large, it is 0.15 mm ³ , and set to about 3 times the volume in the concave portion, in order to adjust the height difference of the surface of the bonding wall 19 to within ±0.01 mm, the error of the filling amount of the translucent bonding member can be changed to about 2.8 times to ±0.01 Within ³ mm.

Therefore, the light emitting module 100 formed by expanding the volume of the annular gap 18 and the total volume of the bonding wall 19 can absorb the error of the filling amount of the translucent bonding member 16A filled in the recess 1b, and The surface height of 19 is accurately arranged to be the same plane as the second main surface 1d of the light guide plate 1. Furthermore, the thicker junction wall 19 transmits the light emitted from the light adjustment section 10 and guides it to the light guide plate 1. Therefore, the difference between the light guide plate 1 and the light adjustment section 10 is different from that of the light guide plate 1. With the structure of the thick joint wall 19, the light is more evenly dispersed and emitted from the light guide plate 1 to the outside. After joining the light-emitting element unit 3 to the recess 1b, the surface height of the joining wall 19 is lower than the second main surface 1d of the light guide plate 1, and then the recess 1b is supplemented with a translucent joining member 16A to join the joining wall 19 The surface height is set to the same plane as the second main surface 1d of the light guide plate 1, the large-capacity annular gap 18 can absorb the error of the filling amount of the translucent bonding member 16A supplementing the recess 1b, On the other hand, the height of the surface of the bonding wall 19 becomes the same plane as the second principal surface 1d.

After fixing the light emitting element unit 3 to the light guide plate 1, in the step shown in FIG. 11C, the second sealing resin portion 15B is formed on the second main surface 1 d of the light guide plate 1. The second sealing resin portion 15B uses white resin and is formed to have a thickness in which the light-emitting element unit 3 is buried inside.

In the step shown in FIG. 12A, the surface of the cured second sealing resin portion 15B is polished to expose the electrode terminal 23 to the surface. In addition, in the step shown in FIG. 11C, the second sealing resin portion 15B is formed to a thickness where the light emitting element unit 3 is buried inside, but it may be formed so as to reach the same plane as the surface of the electrode terminal 23 or The thickness of the surface of the electrode terminal 23 is low, and the above-mentioned polishing step is omitted.

In the step shown in FIG. 12B, the conductive film 24 is layered on the surface area of the sealing resin portion 15. In this step, a metal film 24 of Cu/Ni/Au is formed on the substantially entire surface of the electrode terminal 23 of the light-emitting element 11 and the sealing resin portion 15 by sputtering or the like.

In the step shown in FIG. 12C, a part of the conductive film 24 is removed, and each light-emitting element 11 is electrically connected via the conductive film 24.

In the above steps, a light-emitting module 100 with a plurality of light-emitting element units 3 fixed to one light guide plate 1 is manufactured. Regarding the method of manufacturing a light-emitting bit 5 by fixing one light-emitting element unit 3 to one light guide plate 1', after the light-emitting element unit 3 is manufactured in FIGS. 9A to 9D and FIGS. 10A to 10D, by FIG. 11A 11B, the light-emitting element unit 3 is fixed to the concave portion 1b of the light guide plate 1 provided with a concave portion 1b, and thereafter, the second seal is bonded to the light guide plate 1 in the same manner as the step shown in FIG. 11C The resin portion 15B, further, the surface of the second sealing resin portion 15B is polished to expose the electrode terminal 23 in the same manner as the step shown in FIG. 12A, and then the conductive film 24 is deposited by the step shown in FIG. 12B, and A part of the conductive film 24 is removed by the steps shown in FIG. 12C, separated into a pair of power terminals 23, and the conductive film 24 is electrically connected.

The plurality of light-emitting element units 3 can also be wired separately and independently. Alternatively, the light guide plate 1 may be divided into a plurality of ranges, and the plurality of light-emitting element units 3 mounted in one range may be set as a group, and the plurality of light-emitting element units 3 in the group may be separated from each other. It is electrically connected in series or parallel, so that it is connected to the same circuit, etc., so as to have a plurality of such light-emitting element unit groups. By performing such grouping, a light-emitting module capable of area dimming can be made.

Regarding the light-emitting module 100 of this embodiment, one module may be used as a backlight of one liquid crystal display device. Alternatively, a plurality of light emitting modules 100 may be arranged and used as a backlight of one liquid crystal display device 1000. By fabricating a plurality of smaller light-emitting modules 100 and inspecting them separately, the yield can be improved as compared with the case where the light-emitting modules 100 are larger and the number of light-emitting elements 11 is larger.

As shown in FIG. 13, the light emitting module 100 may have a wiring board 25. The wiring board 25 is formed with, for example, a conductive member 26 filled in a plurality of via holes provided in an insulating base material constituting the wiring board 25; and a wiring layer 27 on both sides of the base material and the conductive member 26 Electrical connection. Furthermore, the electrode 11 b is electrically connected to the wiring layer 27 via the conductive member 26. In addition, one light emitting module 100 may be bonded to one wiring board. In addition, a plurality of light emitting modules 100 may be bonded to one wiring board. As a result, electrical connection terminals (such as connectors) to the outside can be collected (that is, there is no need to prepare for each light-emitting module 1), so the structure of the liquid crystal display device 1000 can be simplified.

In addition, the one wiring board to which the plurality of light-emitting modules 100 are bonded may be arranged in a plurality to form a backlight of one liquid crystal display device 1000. At this time, for example, a plurality of wiring boards may be placed on a frame, etc., and each may be connected to an external power source using a connector or the like.

Furthermore, a light-transmitting member having functions such as diffusion may be further laminated on the light guide plate 1. In this case, when the optical function portion 1a is a recess, it is preferable to cover the opening of the recess (ie, the portion close to the first main surface 1c of the light guide plate 1) but not fill the recess The translucent member is provided in a manner. Thereby, an air layer can be provided in the concave portion of the optical function portion 1a, and the light from the light emitting element 11 can be diffused well. [Industry availability]

The light emitting module of the present invention can be used, for example, as a backlight of a liquid crystal display device, a lighting fixture, or the like.

1‧‧‧Light guide plate 1'‧‧‧Light guide plate 1a‧‧‧Optical function section 1b‧‧‧Concave section 1c‧‧‧First main surface 1d‧‧‧Second main surface 1e‧‧‧V-shaped groove 1f‧ ‧‧Slanted surface 3‧‧‧Lighting element unit 5‧‧‧Lighting position 10‧‧‧Light adjustment section 11‧‧‧Lighting element 11b‧‧‧Electrode 11c‧‧‧Light emitting surface 11d‧‧‧Electrode formation surface 12‧‧‧wavelength conversion unit 13‧‧‧ light diffusion unit 14‧‧‧ adhesive 15‧‧‧sealing resin unit 15A‧‧‧first sealing resin unit 15B‧‧‧second sealing resin unit 16A‧‧‧ Optical bonding member 16B ‧‧‧Translucent bonding member 17 ‧‧‧ Insert 18 ‧‧‧Annular gap 19 ‧‧‧Joint wall 22 ‧‧‧Metal film 23 Electrode terminal 24 ‧‧‧ Conductive film 25‧‧‧ Wiring board 26‧‧‧ Conductive member 27‧‧‧ Wiring layer 30‧‧‧Base sheet 31‧‧‧ First sheet 32‧‧‧Second sheet 33‧‧‧‧Bottom plate 100‧‧ ‧Light emitting module 100'‧‧‧Light emitting module 110a‧‧‧Lens sheet 110b‧‧‧Lens sheet 110c‧‧‧Diffusion sheet 120‧‧‧LCD panel 1000‧‧‧LCD display device p _x ‧‧‧x direction Arrangement pitch p _y ‧‧‧Arrangement pitch in _y direction

FIG. 1 is a configuration diagram showing each configuration of the liquid crystal display device of the embodiment. 2 is a schematic plan view of a light emitting module according to an embodiment. 3 is a partially enlarged cross-sectional view of a light-emitting module according to an embodiment, and is a view obtained by placing the light guide plate downward and turning it upside down. 4 is a schematic bottom view of another embodiment of a light emitting module. FIG. 5 is a schematic bottom view showing a state where the insertion portion of the quadrangle is disposed in the concave portion of the quadrangle in an inclined posture. Fig. 6 is a schematic bottom view showing a state where the insertion portion of the quadrangle is arranged in the concave portion of the quadrangle in a parallel posture. 7 is a cross-sectional view showing a state where the surface height of the bonding wall becomes low due to the error in the filling amount of the bonding agent. 8 is a cross-sectional view showing a state where the surface height of the bonding wall becomes high due to the error in the filling amount of the bonding agent. 9A to 9D are enlarged schematic cross-sectional views showing an example of manufacturing steps of the light-emitting unit of the embodiment. 10A to 10D are enlarged schematic cross-sectional views showing an example of manufacturing steps of the light-emitting unit of the embodiment. 11A to 11C are enlarged schematic cross-sectional views showing an example of manufacturing steps of the light-emitting module of the embodiment. 12A to 12C are enlarged schematic cross-sectional views showing an example of manufacturing steps of the light-emitting module of the embodiment. 13 is an enlarged schematic cross-sectional view showing an example of connecting the circuit board to the light-emitting module shown in FIG. 3.

1‧‧‧Light guide plate

1a‧‧‧Optics Department

1b‧‧‧recess

1c‧‧‧ 1st main face

1d‧‧‧ 2nd main face

1e‧‧‧V slot

3‧‧‧Lighting unit

10‧‧‧Light adjustment department

11‧‧‧Lighting element

11b‧‧‧electrode

11c‧‧‧Light emitting surface

11d‧‧‧electrode forming surface

12‧‧‧Wavelength Conversion Department

13‧‧‧Diffusion Department

14‧‧‧Cement

15‧‧‧Sealing Resin Department

15A‧‧‧The first sealing resin department

15B‧‧‧Second Sealing Resin Department

16B‧‧‧Translucent joining member

17‧‧‧Insert Department

18‧‧‧Annular gap

19‧‧‧Joint wall

24‧‧‧ conductive film

100‧‧‧Lighting module

Claims (15)

A method for manufacturing a light-emitting module, the light-emitting module has: A light guide plate having a first main surface that becomes a light-emitting surface, and a second main surface that is located on the opposite side of the first main surface and provided with a recess; A light adjustment section, which includes a phosphor; and A light-emitting element, which is joined to the light adjustment part; The manufacturing method of the light emitting module is to prepare the above light guide plate, and The light adjustment unit and the light-emitting element are joined to form a light-emitting element unit of an integrated structure, and Fixing the light adjustment part of the light emitting element unit to the concave part, Wiring is formed on the electrode of the light-emitting element. A method of manufacturing a light emitting module according to claim 1, wherein the light guide plate is formed by providing a plurality of recesses on the second main surface, The light-emitting element unit is fixed to each of the concave portions of the light guide plate, and the plurality of light-emitting element units are fixed to a predetermined position of the light guide plate. The method for manufacturing a light emitting module according to claim 1 or 2, wherein the light emitting surface of the light emitting element is arranged on the same plane as the second main surface of the light guide plate, and the light emitting element unit is fixed to the light guide Light board. The method for manufacturing a light emitting module according to claim 3, wherein the outer shape of the insertion portion of the light emitting element unit disposed in the recess of the light guide plate is smaller than the inner shape of the recess, An annular gap formed between the inner periphery of the recess and the outer periphery of the insertion portion is formed by arranging the insertion portion in the recess and filled with a bonding agent to form a bonding wall. The method for manufacturing a light emitting module according to claim 4, wherein the volume of the annular gap is made larger than the volume of the insertion portion of the light emitting element unit. The method for manufacturing a light emitting module according to claim 4 or 5, wherein the surface height of the bonding wall is set to be the same plane as the second main surface of the light guide plate. The method for manufacturing a light-emitting module according to any one of claims 4 to 6, wherein a light-transmitting resin is used for the bonding wall. The method for manufacturing a light-emitting module according to any one of claims 1 to 7, wherein a first sealing resin portion is provided on the light-emitting element unit, and the first sealing resin portion has an outer peripheral surface which is the outer periphery of the light adjusting portion The surface is the same plane, and the above light-emitting elements are buried, The light-emitting element unit provided with the first sealing resin portion is fixed to the light guide plate. The method for manufacturing a light emitting module according to claim 8, wherein the first sealing resin portion is made of white resin. The method for manufacturing a light emitting module according to any one of claims 1 to 9, wherein a second sealing resin for embedding the light emitting element unit is provided on the second main surface of the light guide plate formed by fixing the light emitting element unit unit. A light-emitting module with: A translucent light guide plate formed by providing a concave portion on the second main surface opposite to the first main surface of the light-emitting surface that emits light to the outside; and A light emitting element unit, which is fixed to the concave portion of the light guide plate; The light-emitting element unit is connected to the light-adjusting portion including the phosphor in the light-emitting element, The light-emitting element unit is arranged in the recessed portion and the outer shape of the insertion portion is smaller than the inner shape of the recessed portion, and A light-transmitting adhesive filled in an annular gap formed between the insertion portion and the recessed portion serves as a bonding wall. The light emitting module according to claim 11, wherein the volume of the annular gap is larger than the volume of the insertion portion of the light emitting element unit. The light emitting module according to claim 11 or 12, which has a second sealing resin portion formed by embedding the light emitting element unit in the second main area layer of the light guide plate. The light-emitting module according to claim 13, wherein the light-emitting element unit has a first sealing resin portion, the first sealing resin portion having an outer peripheral surface on the same plane as the outer peripheral surface of the light adjustment portion, and for embedding the Light emitting element, The light-emitting element unit formed by providing the first sealing resin portion is embedded in the second sealing resin portion. The light emitting module according to claim 13 or 14, wherein the second sealing resin portion and the first sealing resin portion are white resin.

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