CN110364515A - The manufacturing method and light emitting module of light emitting module - Google Patents
The manufacturing method and light emitting module of light emitting module Download PDFInfo
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- CN110364515A CN110364515A CN201910232439.XA CN201910232439A CN110364515A CN 110364515 A CN110364515 A CN 110364515A CN 201910232439 A CN201910232439 A CN 201910232439A CN 110364515 A CN110364515 A CN 110364515A
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- light
- guide plate
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- emitting
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2933/0008—Processes
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Abstract
The present invention provides a kind of slimming, the less light emitting module for having light guide plate and light-emitting component of brightness disproportionation.The light emitting module is fixed with dimming section on the bottom surface of the recess portion of the second interarea of the opposite side for being set to the first interarea as light-emitting surface, light-emitting component is bonded on the surface of dimming section, make the luminous transmission dimming section for carrying out self-emission device and injects in light guide plate, light guide plate is shone from the first main facing external radiation, in the manufacturing method of the light emitting module, as the light-emitting device unit for dimming section being engaged with light-emitting component and can be integrated dimming section and light-emitting component construction, the dimming section of light-emitting device unit is fixed on to the constant position that light-emitting component and dimming section both sides are fixed in recess portion and all to light guide plate.
Description
Technical field
The present invention relates to the manufacturing method of light emitting module and light emitting modules.
Background technique
Backlight, the display etc. of liquid crystal display are widely used as using the light emitting device of the light-emitting components such as light emitting diode
Various light sources.
For example, light supply apparatus disclosed in patent document 1, which has, is installed on a plurality of light-emitting elements of installation base plate, by multiple hairs
The hemispherical lenticular unit of each sealing of optical element, be configured thereon that be launched into the diffusion part for carrying out the light of self-emission device
Part.
In addition, light emitting device disclosed in patent document 2 will the bilayer as made of sealing resin layer and luminescent coating integration
Piece is fixed on the upper surface of light-emitting component, and covers its side using reflection resin.
Patent document 1:(Japan) special open 2015-32373 bulletin
Patent document 2:(Japan) special open 2016-115703 bulletin
But in the light supply apparatus as patent document 1, need to make the distance between installation base plate and diffuser plate than saturating
The thickness of mirror element is big, it is possible to can not achieve sufficient slimming.In addition, cannot make in the light emitting device of patent document 2
Light from a plurality of light-emitting elements is uniformly dispersed irradiation, it is impossible to be used in requests the use for the characteristics of luminescence for having brightness disproportionation less
On the way.
Summary of the invention
Therefore, the purpose of the present invention is to provide one kind can be thinned, can equably realize brightness disproportionation it is few shine
The manufacturing method and light emitting module of characteristic radiation pattern module.
In the manufacturing method of light emitting module of the invention, the light emitting module has: light guide plate has as light-emitting surface
The first interarea, positioned at the first interarea opposite side and be equipped with recess portion the second interarea；Dimming section, it includes fluorophor；Hair
Optical element is engaged with dimming section and is constituted, and the manufacturing method of the light emitting module manufactures light emitting module by following process:
Prepare light guide plate and dimming section and light-emitting component are engaged and can be integrated construction by light-emitting device unit, the light-emitting device unit
It forms；The dimming section of light-emitting device unit is fixed in recess portion；Wiring is formed on the electrode of light-emitting component.
In addition, light emitting module of the invention has: translucency light guide plate is becoming light-emitting surface to external radiant light
Second interarea of the opposite side of the first interarea is equipped with recess portion；Light-emitting device unit is fixed on the recess portion of light guide plate, light-emitting component
Unit is bonded to the dimming section comprising fluorophor on light emitting elements, and light-emitting device unit makes the outer of the insertion section for being configured at recess portion
Shape is smaller than the interior shape of recess portion, and there is the translucency cement being filled in the annular gap being formed between insertion section and recess portion to make
For joined wall.
The manufacturing method of light emitting module of the invention, which is capable of providing, can either make whole slimming, and can reduce brightness not
Realize the light emitting module with light guide plate and light-emitting component of uniformly light-emitting characteristic.This is because in the recess portion of light guide plate
It is fixed with dimming section, the constant position that the light-emitting device unit that light-emitting component is bonded in the dimming section configured in light guide plate
Reason.In turn, above manufacturing method has following feature, that is, sets as by the dimming section for including fluorophor and light-emitting component
It is integrated the light-emitting device unit of construction, since the dimming section of the light-emitting device unit to be fixed on to the recess portion of light guide plate, thus
By light-emitting device unit configuration light guide plate constant position, therefore can eliminate dimming section, light-emitting component, light guide plate recess portion it
Between relative offset, correct position is fixed on high precision, therefore whole slimming can either be made, and can be efficient
Ground mass production, but also the brightness disproportionation of light guide plate surface can be reduced.
In addition, light emitting module of the invention has following feature, that is, shining due to being fixed in the recess portion of light guide plate
It is bonded to the light-emitting device unit of the dimming section comprising fluorophor in the light radiating surface of element, and makes to be configured at light-emitting component list
The shape of insertion section in the recess portion of member is smaller than the interior shape of the recess portion of light guide plate, and will be filled in the ring between insertion section and recess portion
Translucency cement in shape gap is set as joined wall, therefore can either make whole slimming, and can equably realize brightness
The uneven less characteristics of luminescence.That is because the insertion section of light-emitting device unit is configured the recess portion in light guide plate, and sending out
It is equipped with translucency joined wall between the insertion section and recess portion of photo-element unit cell, shines in the correct position configuration of the recess portion of light guide plate
Cell can make shining for light-emitting component inject light guide plate via dimming section, from light guide plate spread and to external radiation.
Detailed description of the invention
Fig. 1 is the composition figure respectively constituted for indicating the liquid crystal display device of embodiment；
Fig. 2 is the diagrammatic top view of the light emitting module of an embodiment；
Fig. 3 is the partial enlargement constructed profile of the light emitting module of an embodiment, and be make light guide plate downwards and
Figure after spinning upside down；
Fig. 4 is the diagrammatic bottom view of the light emitting module of other embodiments；
Fig. 5 is indicated relative to quadrangle recess portion with the schematic bottom of the state of inclination attitude configuration quadrangle insertion section
Figure；
Fig. 6 is indicated relative to quadrangle recess portion with the schematic bottom of the state of parallel position configuration quadrangle insertion section
Figure；
Fig. 7 is the sectional view for the state for indicating that the surface level of joined wall is reduced by the error of the loading of cement；
Fig. 8 is the sectional view for indicating surface level raised state because of the error of the loading of cement of joined wall；
Fig. 9 A~Fig. 9 D is the amplification constructed profile for indicating an example of the manufacturing process of luminescence unit of embodiment；
Figure 10 A~Figure 10 D is the amplification constructed profile for indicating an example of the manufacturing process of luminescence unit of embodiment；
Figure 11 A~Figure 11 C is the amplification constructed profile for indicating an example of the manufacturing process of light emitting module of embodiment；
Figure 12 A~Figure 12 C is the amplification constructed profile for indicating an example of the manufacturing process of light emitting module of embodiment；
Figure 13 is the amplification constructed profile of an example that indication circuit substrate is connect with light emitting module shown in Fig. 3.
Description of symbols
1000: liquid crystal display device
100,100 ': light emitting module
110a: lens
110b: lens
110c: diffusion sheet
120: liquid crystal display panel
1,1 ': light guide plate
1a: optical function unit
1b: recess portion
1c: the first interarea
1d: the second interarea
1e:V shape slot
1f: inclined surface
3: light-emitting device unit
5: light tiles
10: dimming section
11: light-emitting component
11b: electrode
11c: light radiating surface
11d: electrode forming surface
12: wavelength conversion section
13: light diffusing unit
14: cement
15: sealing resin section
15A: the first sealing resin section
15B: the second sealing resin section
16A, 16B: translucency joint element
17: insertion section
18: annular gap
19: joined wall
22: metal film
23: electrode terminal
24: conductive film
30: substrate
31: the first
32: the second
33: plate
Specific embodiment
Hereinafter, based on attached drawing, the present invention is described in detail.In addition, in the following description, as needed, using table
Show the term (for example, "upper", "lower" and other terms comprising these terms) of specific direction, position, but these terms are all
It is to be used convenient for understanding invention referring to attached drawing, technical scope of the invention is not limited by the meaning of these terms.Separately
Outside, what the part of the same label indicated in multiple attached drawings indicated is same or same part or component.
In addition, it is for by the light emitting module of technical idea materialization of the invention that embodiment as shown below is exemplary
And its manufacturing method, not limit the invention to the following contents.In addition, the size for the constituent part recorded below, material, shape
Shape, its relative configuration etc. are recorded as long as no specific, are not the meanings that the scope of the present invention is only defined in this, and only one
Kind example.In addition, the content illustrated in an embodiment, embodiment can also be applied to other embodiments, implement
Example.In addition, the size of component shown in the drawings, positional relationship etc., which will do it exaggeration in order to clearly state, to be indicated.
(liquid crystal display device 1000)
Fig. 1 is the composition respectively constituted for indicating to have the liquid crystal display device 1000 of the light emitting module of present embodiment
Figure.Liquid crystal display device 1000 shown in FIG. 1 successively have from upside 120, two pieces of lens 110a, 110b of liquid crystal display panel,
Diffusion sheet 110c, light emitting module 100.Liquid crystal display device 1000 shown in FIG. 1 is that stacking shines in the lower section of liquid crystal display panel 120
The so-called direct type liquid crystal display device of module 100.Liquid crystal display device 1000 makes the light irradiated from light emitting module 100 to liquid crystal
Panel 120 irradiates.In addition, the portions such as light polarizing film, colored filter can also be also equipped with other than having above-mentioned component parts
Part.
(light emitting module 100)
What Fig. 2 and Fig. 3 was indicated is the composition of the light emitting module of present embodiment.Fig. 2 is the light emitting module of present embodiment
Diagrammatic top view.Fig. 3 is the partial enlargement constructed profile for indicating the light emitting module of present embodiment, and is to match light guide plate
Set the figure in lower section and after spinning upside down.
Light emitting module 100 shown in these figures has multiple luminous members of light guide plate 1, the recess portion 1b for being disposed in light guide plate 1
Part unit 3.Light emitting module 100 shown in these figures is equipped with multiple recess portion 1b on one piece of light guide plate 1, all solid in each recess portion 1b
Surely there is light-emitting device unit 3.Wherein, as shown in the diagrammatic bottom view of Fig. 4, light emitting module can also be arranged one on light guide plate 1 '
A recess portion 1b in the fixed light-emitting device unit 3 of recess portion 1b and is set as light tiles (development light ビ ッ ト) 5, arrange multiple light tiles 5 and shape
As light emitting module 100 '.In turn, light emitting module 100 shown in Fig. 3 is equipped in light-emitting device unit 3 by outer peripheral surface and dimming section
10 outer peripheral surface is set as same plane, and the first sealing resin section 15A of embedded light-emitting component 11, is being fixed with light-emitting component list
Second interarea 1d of the light guide plate 1 of member 3 is equipped with the second sealing resin section 15B of embedded light-emitting device unit 3.
Light-emitting device unit 3 is fixed with light-emitting component 11 on the surface of the dimming section 10 with wavelength conversion section 12.It shines
For element 11 using upper surface as electrode forming surface 11d, following surface is light radiating surface 11c.Light-emitting component 11 is mainly from light radiating surface
11c radiant light and to 10 irradiation light of dimming section.The light emitting module 100 of Fig. 2 and Fig. 3 configures a plurality of light-emitting elements unit 3 in square
In the recess portion 1b being set on light guide plate 1 to battle array shape and it is fixed on light guide plate 1.Light guide plate 1 is to external spoke with the first interarea 1c
The light-emitting surface for penetrating light is equipped with multiple recess portion 1b in the second interarea 1d.One of light-emitting device unit 3 is configured in recess portion 1b
Point, dimming section 10 is configured in figure.Dimming section 10 has wavelength conversion section 12.The dimming section 10 of Fig. 2 is in wavelength conversion section 12
It is laminated with light diffusing unit 13.Wavelength conversion section 12 is laminated in 11 side of light-emitting component by dimming section 10, and light diffusing unit 13 is laminated
In 1 side of light guide plate.The dimming section 10 spreads the light through wavelength conversion section 12 and is irradiated to light guide plate 1 by light diffusing unit 13
On, the light radiated from light guide plate 1 can be made more uniform.
Light emitting module 100 of the invention is fixed in recess portion 1b configuration due to being equipped with recess portion 1b in light guide plate 1 and has wave
The light-emitting device unit 3 of the dimming section 10 of long transformation component 12, so whole slimming can be made.In addition, due to being set in light guide plate 1
Have recess portion 1b, be fixed with light-emitting device unit 3 in recess portion 1b configuration, thus with light-emitting component is installed on substrate and has been combined
The light emitting module of light guide plate is compared, and the positional shift of light-emitting device unit 3 and light guide plate 1 can be prevented.The especially mould that shines
Block 100 makes light-emitting component 11 and dimming section 10 be integrally formed structure due to that will be bonded to wavelength conversion section 12 on light-emitting component 11
The light-emitting device unit 3 made configures in the recess portion 1b of light guide plate 1, therefore can be by wavelength conversion section 12 and light-emitting component 11 pairs
Side's all configurations can be realized good optical characteristics in the correct position of light guide plate 1.Especially keep the light of light-emitting component 11 saturating
It crosses wavelength conversion section 12 and imports in light guide plate 1 and into the light emitting module of external radiation 100, due to can without positional shift
Light-emitting component 11, wavelength conversion section 12, light guide plate 1 are configured, so the color of the light from light guide plate 1 to external radiation can be improved
The characteristics of luminescences such as unevenness, brightness disproportionation realize the especially excellent characteristics of luminescence.
In direct type liquid crystal display device, since the distance between liquid crystal display panel and light emitting module are relatively close, so shine
Irregular colour, the brightness disproportionation of module potentially affect the irregular colour of liquid crystal display device, brightness disproportionation.Therefore, as
The light emitting module of direct type liquid crystal display device, the light emitting module that desired color is uneven, brightness disproportionation is less.
If the composition of the light emitting module 100 using present embodiment, the thickness of light emitting module 100 can either be reduced
It is such as the following to 5mm or less, 3mm or less, 1mm, and brightness disproportionation, irregular colour can be reduced.
Hereinafter, each component and manufacturing method to the light emitting module 100 for constituting present embodiment are described in detail.
(light guide plate 1)
Light guide plate 1 is the light injected from light source to be made to planar and to the transparent member of external radiation.As shown in Fig. 2,
The light guide plate 1 of present embodiment has the second interarea 1d of the first interarea 1c as light-emitting surface, the first interarea 1c opposite side.It should
Light guide plate 1 is equipped with multiple recess portion 1b on the second interarea 1d, and V-shaped groove 1e is equipped between adjacent recess portion 1b.In recess portion 1b
A part configured with light-emitting device unit 3.By shining the recess portion 1b of a part insertion light guide plate 1 of light-emitting component 11
Module can be integrally thinned.As shown in Figures 2 and 3, light guide plate 1 can be by being arranged multiple recess portion 1b, and in each recess portion 1b
It configures light-emitting device unit 3 and is set as light emitting module 100, alternatively, as shown in figure 4, can be by having leading for a recess portion 1b
A light-emitting device unit 3 is configured on tabula rasa 1 ' and is set as light tiles 5, then forms the planar configuration of multiple light tiles 5
For light emitting module 100 '.As shown in figure 3, the light guide plate 1 equipped with multiple recess portion 1b is equipped with the V-shaped groove of clathrate between recess portion 1b
1e.As shown in figure 4, the light guide plate 1 equipped with a recess portion 1b is equipped with to outer peripheral edge and dips down in the peripheral part of the second interarea 1d
Oblique inclined surface 1f.
Sealing resin section 15 that reflect light, aftermentioned is equipped in V-shaped groove 1e, inclined surface 1f.It is filled in V-shaped groove 1e's
Sealing resin section 15 is preferably the white resin for reflecting light, and the sealing resin section 15 of white resin can prevent light-emitting component 11
It shines and is injected to the adjacent light guide plate 2 by V-shaped groove 1e zoning, and can prevent the light of each light-emitting component 11 from leaking into next door.With
Sealing resin section 15 set on the inclined surface 1f engagement of the peripheral part of the second interarea 1d of a light guide plate 1 can prevent light from leaking into
Around light guide plate 1, it can prevent from declining from the luminous intensity of the first interarea 11c of light guide plate 1.
The size of light guide plate 1 is set as optimal size according to the number of recess portion 1b, but for example with multiple recess portion 1b
Light guide plate 1 in, 1cm~200cm or so, preferably 3cm~30cm or so can be set as on one side.Thickness can be set as 0.1mm~5mm
Left and right, preferably 0.5mm~3mm.The flat shape of light guide plate 1 can for example be set as substantially quadrangle, roughly circular etc..
As the material of light guide plate 1, acrylate, polycarbonate, cyclic polyolefin, poly terephthalic acid second two can be used
The resin materials such as the thermosetting resins such as the thermoplastic resins such as alcohol ester, polyester, epoxy resin, silicone resin, glass etc. are optically transparent
Material.Especially thermoplastic resin material because can and being injection moulded efficiently to manufacture it is preferred.Wherein, preferably clear
High and cheap polycarbonate.In manufacturing process, it is not exposed to the luminous mould manufactured in hot environment as Reflow Soldering
The thermoplasticity as polycarbonate and the low material of heat resistance can also be used in block.
Light guide plate 1 can for example be formed by injection moulding, transfer modling.Light guide plate 1 can have by mold to be formed
The shape of recess portion 1b, can either reduce the positional shift of recess portion 1b, and being capable of inexpensively mass production.Wherein, light guide plate can also
By carrying out machining using NC processing machine etc. recess portion is arranged after being shaped to plate.
The light guide plate 1 of present embodiment can with single layer be formed, and can also be formed by the way that the layer of multiple translucency is laminated.
In the case where being laminated with the layer of multiple translucency, layers preferably different in any interlayer setting refractive index, such as air layer etc..
It is easy to spread light further as a result, can be set as reducing the light emitting module of brightness disproportionation.It is this composition for example can by
Partition is set between the layer of any number of translucency and is separated, and air layer is set to realize.Alternatively, it is also possible in light guide plate 1
The first interarea 1c setting translucency layer, and between the first interarea 1c and the layer of the translucency of light guide plate 1 be arranged refraction
The different layer of rate, for example, air layer etc..It is easy to spread light further as a result, be capable of forming to reduce the liquid of brightness disproportionation
Crystal device.This composition can for example be separated and partition is arranged between any light guide plate 1 and the layer of translucency, and be set
Gas-bearing formation is emptied to realize.
(optical function unit 1a)
Light guide plate 1 can also have optical function unit 1a in the first side interarea 1c.Optical function unit 1a can for example have and make
The function that light extends in the face of light guide plate 1.For example, being equipped with the refractive index material different from the material of light guide plate 1.Specifically,
The inverted cone set on the first side interarea 1c, rectangular pyramid, recess portions or the inverted cone such as shape of falling polygonal pyramid such as hexagonal pyramid can be used
The recess portions such as platform, the platform of falling polygonal pyramid, that is, use the inclination by the refractive index material different from light guide plate 1 (for example, air) and recess portion
The recess portion that the light that the interface in face carrys out irradiation is reflected to the side direction of light-emitting device unit 3.In addition, for example, it is also possible to having
There is the recess portion 1b of inclined surface to be equipped with reflective material (for example, the reflectance coatings such as metal, white resin) etc..In section view, optics function
The inclined surface of energy portion 1a can be straight line, be also possible to curve.As described later, optical function unit 1a be preferably provided at it is respective
The corresponding position of light-emitting device unit 3, that is, the position with 3 opposite side of light-emitting device unit for being configured at the second side interarea 1d.It is special
The optical axis of not preferred light-emitting device unit 3 and the optical axis of optical function unit 1a are substantially uniform.The size of optical function unit 1a can fit
Work as setting.
(recess portion 1b)
Light guide plate 1 is equipped with recess portion 1b in the second side interarea 1d.Recess portion 1b will be including a part configuration of light-emitting device unit 3
Side, and configure in constant position.Recess portion 1b shown in Fig. 3 is the recess portion of shape made of having cut off a part of the second interarea 1d
1b.Although not shown, but recess portion can also be arranged raised line in the second interarea upper annular and be set to the inside of raised line.Recess portion 1b's
The shape of insertion section 17 of the interior shape than being configured at light-emitting device unit 3 in recess portion 1b is big, is being configured with light-emitting device unit 3
In the state of insertion section 17, it is equipped between annular between the periphery of the insertion section 17 of the inner circumferential and light-emitting device unit 3 of recess portion 1b
Gap 18.Annular gap 18 becomes joined wall 19 by filling cement 14.The interior shape of recess portion 1b uses the appearance of annular gap 18
The product shape also bigger than the volume of the insertion section 17 of light-emitting device unit 3.The light emitting module of present embodiment is due in light guide plate 1
Recess portion 1b be configured with dimming section 10, therefore dimming section 10 is set as to the insertion section 17 of light-emitting device unit 3.But shine member
The insertion section 17 of part unit 3 is not specifically for dimming section 10, such as can also be set as a part of dimming section 10 and light-emitting component 11
It is configured at the insertion section 17 in recess portion 1b.
The interior shape of recess portion 1b be set as annular gap 18 capacity be light-emitting device unit 3 insertion section 17 volume example
Such as 1.2 times or more, preferably 1.5 times or more, the size of further preferred 2 times or more.Annular gap 18 is connect by filling translucency
Mixture 14 and become joined wall 19.The interior shape of recess portion 1b is set as quadrangle by the light guide plate 1 of Fig. 4, is configured at this light-emitting component
The shape of the insertion section 17 of unit 3 is also set as quadrangle.The appearance that quadrangle insertion section 17 is intersected with each side with quadrangle recess portion 1b
Gesture, in other words, with the posture configuration that is rotated relative to quadrangle recess portion 1b in recess portion 1b, between recess portion 1b and insertion section 17
Equipped with annular gap 18.The insertion section 17 of the figure tilts 45 degree of posture configuration in recess portion 1b with each side.With the posture configuration
Shape in it is set as the 2 times or more of the shape of insertion section 17 by the recess portion 1b of insertion section 17.
Insertion section 17, which is had with the posture configuration of Fig. 4 in the light guide plate 1 in recess portion 1b, can reduce the first interarea 1c's
The feature of brightness disproportionation.This is because the light from each side of insertion section 17 to ambient radiation is consumingly to shown in the dotted line of Fig. 5
The direction of arrow mark A radiates, to illuminate the region C in figure.For quadrangle insertion section 17, the arrow orthogonal with each side
The intensity of the light in direction shown in label A is than light intensity from corner to direction shown in arrow mark B that radiate from.In Fig. 5, due to
The region C is located at than the region D further from the position of insertion section 17, therefore has the tendency that dimmed but square as shown in arrow mark A
To light it is stronger than direction shown in arrow mark B, so can prevent brightness from declining, reduce brightness disproportionation.As shown in fig. 6, working as
When quadrangle recess portion 1b is with the parallel posture configuration quadrangle insertion section 17 in each side, due to the region C be located at than the region D further from insert
Enter the position in portion 17, and the intensity of the light radiated from insertion section 17 also reduces, so the region brightness ratio D in the region C is low.
The interior shape recess portion 1b also bigger than the shape of insertion section 17 also realizes following feature, that is, inserts in addition to that can increase configuration
Enter the freedom degree of the posture in portion 17 and prevent other than brightness disproportionation, additionally it is possible to eliminate the cement 14 by being filled in annular gap 18
Loading error caused by surface level deviation, the light distribution of the peripheral part of recess portion 1b is formed as into perfect condition.Annular
Gap 18 becomes translucency joined wall 19 by filling cement 14, but the error of the loading of cement 14 can make surface water
It is flat to change, become and upsets luminous reason.Fig. 7 and Fig. 8 shows the liquid levels of joined wall 19 because of the loading of cement 14
Error and the state upset.What Fig. 7 was indicated is the very few state of loading of cement 14.The horizontal ratio in the surface of the joined wall 19
Second interarea 1d of light guide plate 1 is low, and down to the inside of annular gap 18, to be formed between light guide plate 1 and insertion section 17
Gap.Fig. 8 shows be cement 14 the excessive state of loading, the cement 14 of the joined wall 19 of the state is between annular
Gap 18 leaks out, and becomes the state swelled on the second interarea 1d.Gap between light guide plate 1 and insertion section 17, in the second interarea
The cement 14 swelled on 1d can make the path for the light injected from insertion section 17 to light guide plate 1 change and become upset and shine
The reason of.
Keep the interior shape of recess portion 1b also bigger than the volume for the volumetric ratio insertion section 17 that insertion section 17 makes annular gap 18 greatly
The variation for constructing liquid level caused by the deviation for the loading that can reduce the cement 14 as being filled in annular gap 18, will lead
The luminous of the region of tabula rasa 1 and insertion section 17 is set as perfect condition.
It is diameter when can be by circle of size when recess portion 1b is overlooked, ellipse in view of the shape and the above characteristic of insertion section 17
Cornerwise length when major diameter when round, quadrangle is set as such as 0.05mm~10mm, preferably 0.1mm~2mm.Depth
It can be set as 0.05mm~4mm, preferably 0.1mm~1mm.The distance between optical function unit 1a and recess portion 1b can be in optical functions
Portion 1a and recess portion 1b is suitably set in the range of leaving each other.The plan view shape of recess portion 1b can for example be set as substantially quadrangle, big
Circle is caused, can be selected according to arrangement spacing of recess portion 1b etc..Recess portion 1b arrangement spacing (immediate two recess portion 1b's
Distance between center) it is substantially uniform in the case where, it is preferably substantially round or generally square.Wherein, be set as it is roughly circular
It is effective for extending the light from light-emitting device unit 3 well.
(light-emitting device unit 3)
Light-emitting device unit 3 is the light source of light emitting module 100.As shown in figure 3, light-emitting device unit 3 is in light-emitting component 11
On be bonded to the dimming section 10 with wavelength conversion section 12.In turn, the light-emitting device unit 3 of present embodiment is equipped with outer peripheral surface
Same plane, and the first sealing resin section 15A of embedded light-emitting component 11 are set as with the outer peripheral surface of dimming section 10.Light-emitting component list
Member 3 is configured at the recess portion 1b of light guide plate 1, makes to shine to external radiation via light guide plate 1.The light-emitting device unit 3 of Fig. 3 is to dim
Portion 10 is the insertion section 17 being configured in the recess portion 1b of light guide plate 1, is configured in the inside of recess portion 1b.Light-emitting device unit 3 passes through
Dimming section 10 and the bottom surface of recess portion 1b are engaged, is fixed in the recess portion 1b of light guide plate 1.
The light-emitting device unit 3 of Fig. 3 engages dimming section 10 with the light radiating surface 11c of light-emitting component 11.Light-emitting component 11
Using the opposite side of electrode forming surface 11d as light radiating surface 11c, dimming section 10 is bonded on the surface.Present embodiment shines
It is light radiating surface 11c, using light radiating surface 11c as the face of main light-emitting surface that module, which is used using the opposite side of electrode forming surface 11d,
Down type, but the light-emitting component of face up type can also be used.The light-emitting component 11 of Fig. 3 is using light radiating surface 11c opposite side as electrode
Forming face 11d is equipped with a pair of electrodes 11b on electrode forming surface 11d.A pair of electrodes 11b with aftermentioned construction by being matched
Line is simultaneously electrically connected.Light-emitting device unit 3 and light guide plate 1 have the grafting material 14 of translucency via translucent resin etc. and connect
It closes.
Light-emitting component 11 is such as with light-transmitting substrate sapphire, the semiconductor multilayer structure being laminated on light-transmitting substrate
It makes.Semiconductor laminate structure includes luminescent layer, the n-type semiconductor layer and p-type semiconductor layer for clipping luminescent layer, in n-type semiconductor
N-side electrode and p-side electrode 11b are electrically connected in layer and p-type semiconductor layer.Light-emitting component 11 is for example to have light-transmitting substrate
Light radiating surface 11c and the opposite mode of light guide plate 1 configure, have on the electrode forming surface 11d of light radiating surface 11c opposite side
A pair of electrodes 11b.
As light-emitting component 11, the size of length and width and height is not particularly limited, but when looking down, it is preferable to use it is long and
Wide size is 1000 μm of semiconductor light-emitting elements 11 below, the use of long and wide size is more preferably 500 μm of hairs below
Optical element 11 is further preferably 200 μm of light-emitting components 11 below using long and wide size.When this light-emitting component of use
When 11, the image of fine can be realized in the local dimming control for having carried out liquid crystal display device 1000.In addition, when making
When with long and wide size being 500 μm of light-emitting components 11 below, due to can inexpensively purchase light-emitting component 11, so energy
Enough make light emitting module 100 cheap.In addition, long and wide size both sides are 250 μm of light-emitting components 11 below due to the member that shines
The area of the upper surface of part 11 becomes smaller, and increases so the exit dose for the light for coming the side of self-emission device 11 is opposite.That is, this hair
Optical element 11 easily becomes batswing tab shape due to shining, and engages so being preferred for light-emitting component 11 with light guide plate 1, and shines
The light emitting module 100 of the present embodiment extremely short at a distance from light guide plate 1 of element 11.
In turn, settable lens of light guide plate 1 etc. have the optical function unit 1a of reflection, diffusion function.The light guide plate 1 can
It extends the light for carrying out self-emission device 11 to side, and the luminous intensity in the face of light guide plate 1 can be made to equalize.But
The light guide plate 1 that the corresponding position of a plurality of light-emitting elements 11 is formed with multiple optical function unit 1a is difficult to correctly remain all sometimes
The relative position of light-emitting component 11 and optical function unit 1a.Especially in the construction for being equipped with multiple small light-emitting components 11, it is difficult to
Correctly maintain the relative position of all light-emitting components 11 and optical function unit 1a.The phase of light-emitting component 11 and optical function unit 1a
The offset of position is had the following problems, that is, light cannot be made fully to extend by optical function unit 1a, brightness can be in face
Part decline etc., causes brightness disproportionation.The side of recombinant light guide plate 1 after light-emitting component 11 is especially mounted on wiring substrate
In method, due to needing the positional shift on in-plane and stacking direction to wiring substrate and light-emitting component 11, leaded light respectively
The positional shift of the optical function unit 1a of plate 1 takes in, so be more difficult sometimes so that light-emitting component 11 and optical function unit 1a
Carry out optical bond well.
The light emitting module 100 of present embodiment by light guide plate 1 be equipped with multiple recess portion 1b and optical function unit 1a, and
It is configured with the construction of light-emitting device unit 3 in recess portion 1b, light-emitting component 11 and optics can be configured with higher position precision
Function part 1a both sides.Thereby, it is possible to homogenize the light come self-emission device 11 precisely by optical function unit 1a,
It is capable of forming the high-quality backlight light source all few for brightness disproportionation, irregular colour.
In top perspective, equipped with optical function unit 1a on the face of the opposite side of the recess portion 1b of configuration light-emitting component 11
Optical function unit 1a is arranged by the position of the recess portion 1b in configuration light-emitting component 11 in light guide plate 1, can more easily be sent out
Both the positioning of optical element 11 and optical function unit 1a, can be configured with higher position precision and without relative offset.
As light-emitting component 11, it can be used and be square when overlooking or light-emitting component 11 that rectangle is i.e. rectangular.Fine
Liquid crystal display device used in light-emitting component 11 it is preferable to use rectangular light-emitting component, surface shape preferably has thereon
Length and width.In the case where the liquid crystal display device of fine, more than the quantity of the light-emitting component used becomes thousands of,
The installation procedure of light-emitting component becomes important process.In the installation procedure of light-emitting component, even if in a plurality of light-emitting elements
A part of light-emitting component on rotation offset (for example, the offset in ± 90 degree of directions) has occurred, also by use overlook Shi Weichang
Rectangular light-emitting component is easy with the naked eye to be confirmed.In addition, since p-type electrode and N-shaped electricity can be formed separated by a distance
Pole, so can be easy to carry out the formation of aftermentioned wiring 21.On the other hand, the light-emitting component being square when using overlooking
In the case where 11, the being able to produce property small light-emitting component 11 of batch micro operations well.The density (arrangement spacing) of light-emitting component 11,
That is, the distance between light-emitting component 11 can for example be set as 0.05mm~20mm degree, preferably 1mm~10mm degree.
Light emitting module 100 on the light guide plate 1 with multiple recess portion 1b configured with a plurality of light-emitting elements unit 3 is overlooked
When light guide plate 1, it is two-dimensionally arranged with light-emitting device unit 3.As shown in Fig. 2, a plurality of light-emitting elements unit 3 is preferably disposed in along just
In the recess portion 1b of the both direction of friendship, that is, direction x and the direction y two-dimensional arrangements.As shown in the example in Figure 2, a plurality of light-emitting elements unit is configured
The arrangement spacing p in the direction x of 3 recess portion 1bx, the direction y arrangement spacing pyBetween being identical between the direction x and the direction y
Away from can also be different.In addition, the both direction of arrangement can also be non-orthogonal.In addition, the arrangement spacing in the direction x or the direction y is unlimited
In at equal intervals, or unequal interval.For example, the recess portion 1b of configuration light-emitting device unit 3 can also be according to from light guide plate 1
Center is spaced increasing mode and arranges to periphery.In addition, the spacing being configured between the light-emitting device unit 3 of recess portion 1b is
Distance between the optical axis of light-emitting device unit 3, that is, the distance between center.
As light-emitting component 11, using well known semiconductor light-emitting elements.In the present embodiment, as light-emitting component
11, illustrate the light emitting diode of face down type.Light-emitting component 11 for example projects blue light.As light-emitting component 11, can also make
With the element for projecting the light other than blue, the light-emitting component of face up type also can be used.In addition, as a plurality of light-emitting elements 11,
Also the light-emitting component for issuing the light of different colours can be used.The light projected from light-emitting component 11 is adjusted by wavelength conversion section 12
Save the luminescent color to external radiation.
As light-emitting component 11, the element using the light for projecting any wavelength may be selected.For example, blue, green as projecting
The element of coloured light can be used by nitride-based semiconductor (InxAlyGa1-xyN, 0≤X, 0≤Y, X+Y≤1) or GaP constitute hair
Optical element.In addition, the light-emitting component containing semiconductors such as GaAlAs, AlInGaP can be used as the element for projecting red light.
In turn, it is possible to use the semiconductor light-emitting elements being made of the material other than them.It can be according to the material of semiconductor layer and its mixed
Brilliant degree selects various emission wavelengths.As long as the composition of used light-emitting component, luminescent color, size, number etc. are according to mesh
And suitably select.
(dimming section 10)
In the present embodiment, light-emitting device unit 3, which is equipped with, adjusts the luminescent color for carrying out self-emission device 11 and penetrates it
Enter the dimming section 10 of light guide plate 1.Dimming section 10 has the wavelength conversion section 12 for the luminescent color for adjusting light-emitting component 11.By making
Dimming section 10 is engaged with the light radiating surface 11c of light-emitting component 11, to adjust the luminescent color of light-emitting component 11.Dimming section 10 is preferred
Have wavelength conversion section 12 and light diffusing unit 13.Dimming section 10 engages wavelength conversion section 12 and light diffusing unit 13, and by wavelength
Transformation component 12 is configured at 11 side of light-emitting component.Multiple wavelength conversion sections 12, light diffusing unit 13 can also be laminated for dimming section 10.This reality
The light emitting module 100 for applying mode configures dimming section 10 in the recess portion 1b of light guide plate 1, is formed as inserting for light-emitting device unit 3
Enter portion 17.Dimming section 10 penetrates the light injected from light-emitting component 11 and injects light guide plate 1.From the slimming of light emitting module 100
The purpose of set out, as shown in figure 3, dimming section 10 is preferably configured in the inside of the recess portion 1b of light guide plate 1, and not from the second interarea
1d is configured in recess portion 1b to the mode that surface side is stretched out.The dimming section 10 of Fig. 3 is set as the thickness with the deep equality of recess portion 1b,
Same plane is configured by its surface and the second interarea 1d.Although not shown, but dimming section can also be set as on the inside of recess portion
The thickness slightly stretched out from the second interarea of light guide plate to surface side.
The light-emitting device unit 3 of Fig. 3 keeps the shape of dimming section 10 bigger than the shape of light-emitting component 11.The light-emitting device unit
3 can make all light projected from the light radiating surface 11c of light-emitting component 11 inject light guide plate 1 through dimming section 10, reduce face
Color is uneven.
Wavelength conversion section 12 is added with wavelength shifter in base material, and light diffusing unit 13 is added with diffusion materials in base material
Material.The translucency such as epoxy resin, silicone resin, the resin that the two is mixed or glass for example can be used in the material of base material
Material.It is beneficial when selecting silicone resin as base material from the viewpoint of the light resistance of dimming section 10 and molding easiness.
Base material as dimming section 10 is, it is preferable to use the refractive index material higher than the material of light guide plate 1.
As wavelength shifter contained by wavelength conversion section 12, YAG fluorophor, β Sialon phosphor or KSF class can be enumerated
The fluorides such as fluorophor system fluorophor etc..Especially by a wavelength conversion section 12 use multi-wavelength's transform component,
KSF system fluorescence more preferably by making β Sialon phosphor of the wavelength conversion section 12 containing greening colour system light and rubescent colour system shine
The fluorides such as body system fluorophor, can expand the color reproduction range of light emitting module.In this case, light-emitting component 11 is preferred
Nitride-based semiconductor (the In for capableing of the efficiently light of the short wavelength of excitation wavelength transform component can be projected by havingxAlyGa1-x-yN, 0
≤ X, 0≤Y, X+Y≤1).In addition, for example, using project blue series light light-emitting component 11 when, can also be in wavelength conversion
In portion 12 containing 60 weight % or more, preferably comprise the KSF system fluorophor (red-emitting phosphors) of 90 weight % or more, with can
Access the light of red colour system.That is, can also be by containing the wavelength conversion section for projecting light of particular color in wavelength conversion section 12
Part projects the light of particular color.In addition, wavelength shifter may be quantum dot.In wavelength conversion section 12, wavelength conversion
How material, which configures, is ok.For example, can substantially evenly be distributed, it can also lay particular stress on and be present in part.Alternatively, it is also possible to be laminated
Equipped with multiple layers respectively containing wavelength conversion member.
Light diffusing unit 13 for example can be used using above-mentioned resin material as base material, contain SiO wherein2、TiO2Deng white nothing
The material of machine particle.
(sealing resin section 15)
The light emitting module 100 of Fig. 3 engages on the second interarea 1d of light guide plate 1 is equipped with sealing resin section 15.Sealing resin
Portion 15 is preferably that additive i.e. white powder that light will be made to reflect etc. adds white resin made of in transparent resin.White tree
The sealing resin section 15 of rouge makes from the light of the peripheral part of light-emitting component 11 or electrode surface radiation, from the back side radiant of dimming section 10
Light, from the light of the back side radiant of joined wall 19, the light reflection radiated from the second interarea 1d of light guide plate 1, to make light-emitting component
11 it is luminous effectively from the first interarea 1c of light guide plate 1 to external radiation.The light emitting module 100 of Fig. 3 is by sealing resin section 15
Zoning is the first sealing resin section 15A and the second sealing resin section 15B.The light emitting module 100 of the figure is by 15th area of sealing resin section
It divides into and is integrally formed the first sealing resin section 15A of construction with light-emitting device unit 3, engaged with the second interarea 1d of light guide plate 1
The second sealing resin section 15B, but sealing resin section can not also zoning be the first sealing resin section and the second sealing resin section and
It is integrated construction.The light emitting module is by being fixed on light guide plate for the light-emitting device unit for being not provided with the first sealing resin section
Afterwards, sealing resin section is bonded on the second interarea of light guide plate and is made.
The light emitting module 100 of zoning the first sealing resin section 15A and the second sealing resin section 15B are in light emitting module 100
In manufacturing process, by engaging the first sealing resin section 15A with light-emitting component 11 and dimming section 10, then sealed by first
Resin portion 15A can be integrated in the state of the block of construction with light-emitting component 11 and dimming section 10 and make.Second sealing resin section
In the state that 15B in the light-emitting device unit 3 that will be equipped with the first sealing resin section 15A with light guide plate 1 by engaging, with light guide plate
1 the second interarea 1d engagement, is filled in the gap of the first sealing resin section 15A.
First sealing resin section 15A and the second sealing resin section 15B are mutually fitted closely.In turn, the first sealing resin section
15A is also fitted closely with light-emitting component 11.First sealing resin section 15A is located at around light-emitting component 11, buries light-emitting component
11, expose the electrode 11b of light-emitting component 11 on surface.First sealing resin section 15A is by by outer peripheral surface and dimming section 10
Outer peripheral surface is set as same plane, also fits closely with dimming section 10.First sealing resin section 15A is made into and light-emitting component 11
The light-emitting device unit 3 of construction is combined into one with dimming section 10 and is fixed on light guide plate 1.In addition, the first sealing resin section 15A
Preferably white resin, first sealing resin section 15A make the light projected to the outer peripheral surface direction of light-emitting component 11 reflection, can
Improve the luminous efficiency of light emitting module 100.Second interarea 1d and joined wall 19 of the second sealing resin section 15B in light guide plate 1
The boundary at the back side fits closely.The face for exposing electrode 11b of second sealing resin section 15B and the first sealing resin section 15A is set
For same plane.Second sealing resin section 15B and it is fixed with the light-emitting component that the first sealing resin section 15A can be integrated to construction
Second interarea 1d of the light guide plate 1 of unit 3 is engaged, and is arranged between the first sealing resin section 15A.
Second sealing resin section 15B is layered on light guide plate 1, for reinforcing light guide plate 1.In addition, the second sealing resin section
15B is preferably white resin, the sealing resin section 15 can future self-emission device 11 luminous efficiently import light guide plate 1
It is interior, increase the luminous output of the first interarea 1c of light guide plate 1.In addition, white resin i.e. the second sealing resin section 15B is by doubling as
The layer for protecting the surface reflection of the component of light-emitting component 11, the second interarea 1d for making light guide plate 1, can be realized light emitting module 100
Slimming.
Sealing resin section 15 be suitble to using have to light be emitted from light-emitting component 11 60% or more reflectivity, preferably have
There is the white resin of 90% or more reflectivity.The sealing resin section 15 is preferably the tree containing white pigments such as white powders
Rouge.Silicone resin particularly preferably containing the Inorganic whites powder such as titanium oxide.As a result, by more using as titanium oxide
Material of the cheap raw material as the one side for being heavily used for cladding light guide plate 1, can make light emitting module 100 cheap.
(translucency joint element)
The light emitting module 100 of Fig. 3 utilizes translucency joint element by wavelength conversion section 12 and light diffusing unit 13, dimming section 10
It is bonded together with light-emitting component 11, light-emitting device unit 3 and light guide plate 1.Translucency joint element is by 12 He of wavelength conversion section
Light diffusing unit 13 engages and is set as dimming section 10, and dimming section 10 and light-emitting component 11 are engaged and are set as light-emitting device unit 3.
Cement 14 by the engagement of the bottom surface of light-emitting device unit 3 and the recess portion 1b of light guide plate 1 is that translucency joint element 16A will shine
Cell 3 is fixed on light guide plate 1, is filled in the annular gap between recess portion 1b and the insertion section 17 of light-emitting device unit 3
Cement 14 in 18 is that translucency joint element 16A constitutes joined wall 19, and dimming section 10 is bonded on to the inner surface of recess portion 1b.
The transmitance of light is set as 60% or more by translucency joint element, is preferably set to 90% or more.Translucency joint portion
Part 16A makes from the light propagation that light-emitting component 11 projects to light guide plate 1.Translucency joint element 16A may include proliferation part etc.,
It or may include the additive i.e. white powder etc. for reflecting light, but can also be only by without proliferation part, white powder etc.
Translucent resin material is constituted.
As the material of translucency joint element, the thermosetting resin material of the translucency such as epoxy resin, silicone resin can be used
Material etc..
(manufacturing process of light emitting module 100)
Fig. 9 A~Fig. 9 D and Figure 10 A~Figure 10 D indicates the manufacturing process of the light-emitting device unit 3 of present embodiment.
In the process shown in Fig. 9 A and Fig. 9 B, wavelength conversion section 12 and light diffusing unit 13 is laminated and is formed as dimming section
10。
It, will be in substrate in the state of by wavelength conversion section 12 and the engagement of light diffusing unit 13 in the process shown in Fig. 9 A
30 surface is attached with that first 31 of wavelength conversion section 12, thickness equably adheres on the surface of substrate 30 with uniform thickness
There is second 32 stacking of light diffusing unit 13.Wavelength conversion section 12 and light diffusing unit 13 are engaged by translucency joint element.
On the substrate 30, such as via adhesive layer and in a manner of it can remove wavelength conversion section 12 and light diffusing unit 13 are attached with.
In turn, in the process shown in Fig. 9 B, second 32 substrate 30 is attached to plate 33 in a manner of it can remove
On, then first 31 substrate 30 engaged with wavelength conversion section 12 is removed.
In the process shown in Fig. 9 C, light-emitting component 11 is engaged in dimming section 10.Light-emitting component 11 is by light radiating surface 11c
Side is engaged with dimming section 10.Light-emitting component 11 is engaged with the wavelength conversion section 12 of dimming section 10 at a prescribed interval.Light-emitting component
11 engage via translucency joint element with dimming section 10.Translucency joint element is applied to dimming section 10, light-emitting component 11
Surface, light-emitting component 11 and dimming section 10 are engaged.Fig. 9 C indicate be coating after translucency joint element 16B shine
The state stretched out around element 11 and engage light-emitting component 11 with dimming section 10.As shown in Figure 10 D, between light-emitting component 11
Every being set as making the outer size for being formed as prescribed level of dimming section 10 and by severing between light-emitting component 11.This is because
Light-emitting component 11 interval can specific dimming section 10 shape.
In the process shown in Fig. 9 D, the first sealing resin section 15A is formed in a manner of embedded light-emitting component 11.First is close
Sealing resin portion 15A is preferably white resin.The first sealing resin section 15A being made of white resin is applied to dimming section 10
Surface, and solidified in the state of embedded light-emitting component 11.First sealing resin section 15A is with completely embedded light-emitting component 11
Thickness, be coated in the figure with the thickness of electrode 11b for burying light-emitting component 11.
In the process shown in Figure 10 A, the white resin after solidification is ground, the electrode 11b of light-emitting component 11 is exposed.
Also metal film can be used and form electrode terminal 23 on the electrode 11b of light-emitting component 11.In this case,
For example, metal film 22 is arranged on the surface of the first sealing resin section 15A in the process shown in Figure 10 B.Metal film 22 is for example logical
The surface that the metal films such as copper, nickel, gold are set to the first sealing resin section 15A by sputtering etc. is crossed, is connect with electrode 11b.
In the process shown in Figure 10 C, a part of metal film 22 is removed, is layered in metal film 22 on electrode 11b
And as the electrode terminal of light-emitting device unit 3 23.The removal of metal film 22 can be disappeared using dry-etching, wet etching, laser
Melt.
In the process shown in Figure 10 D, by the first sealing resin section 15A being made of white resin and become dimming section 10
Layer severing, be separated into light-emitting device unit 3.Light-emitting device unit 3 after separation engages light-emitting component 11 in dimming section 10,
And the first sealing resin section 15A is equipped with around light-emitting component 11, and make electrode terminal 23 the first sealing resin section 15A's
Expose on surface.
The process shown in Figure 11 A~Figure 11 C and Figure 12 A~Figure 12 C of light-emitting device unit 3 manufactured as the above process
In, it is engaged with the recess portion 1b of light guide plate 1.
Light guide plate 1 is made using polycarbonate.As shown in FIG. Figure 11 A and 11 B, light guide plate 1 is by by polycarbonate etc.
It is thermoplastic resin molded, the formed recess 1b on the second interarea 1d, and equipped with the optics function of inverted cone-shaped on the first interarea 1c
Energy portion 1a.Light-emitting device unit 3 is engaged in the recess portion 1b of the light guide plate 1.Light-emitting device unit 3 by by dimming section 10 be inserted into
Uncured state is coated in the recess portion 1b of liquid translucency joint element 16A, and solidifies translucency joint element 16A
And it is fixed on light guide plate 1.Light-emitting device unit 3 makes translucency by the way that dimming section 10 to be correctly inserted into the center of recess portion 1b
Joint element 16A solidifies and engages with light guide plate 1.It is coated on the translucency joint element in uncured state of recess portion 1b
16A is extruded in annular gap 18 in the state of engaging light-emitting device unit 3 with light guide plate 1, and is adjusted and arrived joined wall
The loading of 19 surface level and the second interarea 1d same level of light guide plate 1.But the translucency joint portion of uncured state
Part can also be filled in annular gap 18 after light-emitting device unit 3 is engaged in light guide plate 1, and by the table of joined wall 19
Second interarea 1d of face level and light guide plate 1 is set as same plane.Therefore, initially it is filled in the saturating of the uncured state of recess portion 1b
The loading of photosensitiveness joint element 16A is set as, and in the state of engaging light-emitting device unit 3 with recess portion 1b, makes joined wall 19
The surface level level lower than the second interarea 1d of light guide plate 1, that is, the small amount positioned at the inside of annular gap 18, will
After light-emitting device unit 3 is engaged in light guide plate 1, then translucency joint element is filled in annular gap 18, and by joined wall
19 surface level and the second interarea 1d of light guide plate 1 are set as same plane.
Make dimming section 10 be engaged in the translucency joint element 16A of the bottom surface of recess portion 1b in the uncured state with the two
Surface fits closely and is solidified, and the surface of dimming section 10 is engaged with the bottom surface of recess portion 1b.In turn, from dimming section 10 with it is recessed
The translucency joint element 16A squeezed out between the bottom surface of portion 1b becomes joined wall 19, and by the periphery of dimming section 10 and recess portion 1b
Inner circumferential face bonding.The manufacturing method squeezes out the uncured and liquid translucency joint element 16A for being filled in recess portion 1b
Be formed as joined wall 19 in annular gap 18.This method due to being with the translucency joint element 16A for being filled in recess portion 1b
Cement 14, it is therefore desirable to which the loading of translucency joint element 16A is adjusted into the second interarea to joined wall 19 and light guide plate 1
1d becomes conplane amount.When the loading of translucency joint element 16A is few, as shown in fig. 7, the surface of joined wall 19 is just
It can be lower than the second interarea 1d of light guide plate 1.On the contrary, when the loading of translucency joint element 16A is more, as shown in figure 8, engagement
Wall 19 will be stretched out from annular gap 18, so that the surface of joined wall 19 is prominent from the second interarea 1d of light guide plate 1.Work as joined wall
When 19 surface and the second interarea 1d of light guide plate 1 are not same planes, ideal cannot be made in the light distribution on illumination region periphery
State.This is because the gap of the translucency joint element stretched out from recess portion 1b, translucency joint element not being filled can disturb
The light distribution of random light.Although the loading of translucency joint element 16A becomes same with the second interarea 1d of joined wall 19 and light guide plate 1
The mode of one plane is conditioned, but the slight deviations of loading can become the second interarea 1d of upset joined wall 19 and light guide plate 1
Relative position the reason of.
The light emitting module 100 of present embodiment is drawn by the imbalance of the loading of translucency joint element 16A in order to prevent
The offset of the relative position of second interarea 1d of the level and light guide plate 1 on 19 surface of joined wall risen, makes the entirety of joined wall 19
The i.e. recess portion inner volume of volume that volume ratio is configured at the light-emitting device unit 3 of recess portion 1b is big.In the present embodiment, due to shining
Cell 3 configures dimming section 10 in recess portion 1b, therefore recess portion inner volume becomes the volume of dimming section 10.Therefore, at this
In embodiment, the volume of the whole volume ratio dimming section 10 of joined wall 19 is big.The whole volume ratio light-emitting component of joined wall 19
The also big recess portion 1b of the recess portion inner volume of unit 3 can be relative to the inclined of the loading for the translucency joint element 16A to be filled
The positional shift of difference and reduction engagement wall surface.
For example, the interior shape of recess portion is set as the quadrangle for 0.6mm on one side, and depth is set as concrete example
0.2mm；The shape of dimming section is set as the quadrangle for 0.5mm on one side, and thickness is set as 0.2mm, if in this recess
Dimming section is configured, then the recess portion inner volume of light-emitting device unit becomes 0.05mm3, the whole volume of joined wall 19 becomes
0.022mm3, the whole volume of joined wall 19 becomes about the 1/2 of recess portion inner volume.In this configuration, in order to by 19 table of joined wall
The level error in face is set as within ± 0.01mm, need extremely accurately to control the loading of translucency joint element ±
0.0036mm3Within.
In contrast, if by the interior shape of recess portion 1b be set as on one side for 1.0mm quadrangle and be set as same depth, by
0.05mm is similarly in recess portion inner volume3, therefore the volume of 19 entirety of joined wall is greatly to 0.15mm3, become the pact of recess portion inner volume
3 times, in this case, in order to adjust the level error on 19 surface of joined wall within ± 0.01mm, when by translucency joint element
The error of loading be set as ± 0.01mm3Within when, be also capable of increasing about 2.8 times.
The volume of annular gap 18 is increased as a result, and increases light emitting module 100 made of the total volume of joined wall 19
The error that the loading to the recess portion 1b translucency joint element 16A filled can be absorbed, can be by the surface water of joined wall 19
Flat the second interarea 1d with light guide plate 1 properly configures as same plane.In turn, since thicker joined wall 19 will make from light modulation
The light that portion 10 radiates is guided through and to light guide plate 1, therefore is different from leading by being laminated between light guide plate 1 and dimming section 10
The construction of the thicker joined wall 19 of tabula rasa 1, light are spread more evenly across, and from light guide plate 1 to external radiation.In addition, even if
Light-emitting device unit 3 is being engaged with recess portion 1b, and make the surface level of joined wall 19 it is lower than the second interarea 1d of light guide plate 1 it
Afterwards, translucency joint element 16A added in recess portion 1b and by the second interarea of the surface level of joined wall 19 and light guide plate 1
1d is set as in conplane manufacturing method, and the translucency supplemented to recess portion 1b can be also absorbed from the annular gap of large capacity 18
Same plane is made in the surface level of joined wall 19 and the second interarea 1d by the error of the loading of joint element 16A.
After light-emitting device unit 3 is fixed on light guide plate 1, in the process shown in Figure 11 C, by the second sealing resin
Portion 15B is formed on the second interarea 1d of light guide plate 1.Second sealing resin section 15B uses white resin, is formed as luminous member
Part unit 3 is embedded in internal thickness.
In the process shown in Figure 12 A, by the surface grinding of the second sealing resin section 15B after solidification, make electrode terminal
23 expose on surface.
In addition, the second sealing resin section 15B is formed as burying light-emitting device unit 3 in the process shown in Figure 11 C
Set on internal thickness, but it can also be formed as becoming same plane with the surface of electrode terminal 23 or become than electrode terminal
The thickness of the also low position in 23 surface, to omit above-mentioned grinding process.
In the process shown in Figure 12 B, conductive film 24 is laminated on the surface of sealing resin section 15.In this process, pass through
Sputtering etc. forms the gold of Cu/Ni/Au in the substantially entire surface on the electrode terminal 23 and sealing resin section 15 of light-emitting component 11
Belong to film 24.
In the process shown in Figure 12 C, a part of conductive film 24 is removed, via conductive film 24 by each light-emitting component 11
Electrical connection.
In the above process, manufacture is fixed with the light emitting module 100 of a plurality of light-emitting elements unit 3 on one piece of light guide plate 1.
The method fixed a light-emitting device unit 3 on one piece of light guide plate 1 ' and manufacture light tiles 5 is as described below, using Fig. 9 A~
After Fig. 9 D and Figure 10 A~Figure 10 D has produced light-emitting device unit 3, in the process shown in Figure 11 A and Figure 11 B, it is being equipped with
The fixed light-emitting device unit 3 of the recess portion 1b of the light guide plate 1 of one recess portion 1b, it is thereafter, same as process shown in Figure 11 C, by the
Two sealing resin section 15B are bonded on light guide plate 1, in turn, same as process shown in Figure 12 A, grind the second sealing resin section
The surface of 15B exposes electrode terminal 23, in turn, in the process shown in Figure 12 B, laminated conductive film 24, shown in Figure 12 C
Process in, remove conductive film 24 a part, be separated into a pair of power source terminals 23, conductive film 24 be electrically connected.
A plurality of light-emitting elements unit 3 can also in the way of separately being driven wiring.Alternatively, it is also possible to have
Standby multiple following this light-emitting device unit groups, this light-emitting device unit group is that light guide plate 1 is divided into multiple ranges,
Then a plurality of light-emitting elements unit 3 being installed within the scope of one is set as a group, by by multiple hairs in a group
Made of photo-element unit cell 3 is one another in series or is electrically connected and is connected in same circuit in parallel.By carrying out such grouping,
Can be set as can local dimming control light emitting module.
A backlight as a liquid crystal display device also can be used in the light emitting module 100 of present embodiment.Separately
Outside, it can also arrange multiple light emitting modules 100 and be used as the backlight of a liquid crystal display device 1000.It makes multiple small luminous
Module 100, a fairly large number of light emitting module by checking etc. respectively, with the light-emitting component 11 of production large area installation
100 the case where, is compared, and can be improved yield rate.
Light emitting module 100 can also be equipped with wiring substrate 25 as illustrated in fig. 13.Wiring substrate 25 is for example formed with conduction
Property component 26 and wiring layer 27, electroconductive component 26 is filled in multiple in the insulating properties base material for being set to and constituting wiring substrate 25
In through-hole, wiring layer 27 is electrically connected in two surface sides of substrate with electroconductive component 26.Moreover, electrode 11b is via electroconductive component
26 are electrically connected with wiring layer 27.
In addition, a light emitting module 100 can also be engaged with a wiring substrate.In addition, multiple light emitting modules 100 can also
To be engaged with a wiring substrate.Thereby, it is possible to will be integrated (that is, not with the connection terminal of external electrical connections (for example, connector)
Each light emitting module is needed to be ready for one), so the construction of liquid crystal display device 1000 can be simplified.
Alternatively, it is also possible to arrange multiple wiring substrates for being bonded to multiple light emitting module 100 and as a liquid
The backlight of crystal device 1000.At this point, being utilized respectively connector on such as multiple wiring substrates can be positioned in frame
It is attached Deng with external power supply.
In addition it is also possible to which further stacking has the transparent member of the functions such as diffusion on light guide plate 1.In such case
Under, when optical function unit 1a is recess portion, preferably to block the opening of recess portion (that is, the portion of the first interarea 1c close to light guide plate 1
Point), but transparent member is arranged in the mode for not filling recess portion.Thereby, it is possible to air is arranged in the recess portion of optical function unit 1a
Layer, can be such that the light for carrying out self-emission device 11 extends well.
Industrial utilizability
Light emitting module of the invention for example can be used as the backlight of liquid crystal display device, luminaire etc..
Claims (15)
1. a kind of manufacturing method of light emitting module, the light emitting module have:
Light guide plate has the first interarea as light-emitting surface, second positioned at the first interarea opposite side and equipped with recess portion
Interarea；
Dimming section, it includes fluorophor；
Light-emitting component is engaged with the dimming section,
The manufacturing method of the light emitting module includes following process:
Prepare the light guide plate and light-emitting device unit, the light-emitting device unit connects the dimming section and the light-emitting component
Merging, which can be integrated, to be constructed；
The dimming section of the light-emitting device unit is fixed within the recess；
Wiring is formed on the electrode of the light-emitting component.
2. the manufacturing method of light emitting module as described in claim 1, wherein
Multiple recess portions are equipped with and the light guide plate that constitutes using in second interarea,
In the fixed light-emitting device unit of each recess portion of the light guide plate, multiple light-emitting device units are fixed
In the constant position of the light guide plate.
3. the manufacturing method of light emitting module as claimed in claim 1 or 2, wherein
In the same plane by the configuration of the second interarea of the light radiating surface of the light-emitting component and the light guide plate, it shines described
Cell is fixed on the light guide plate.
4. the manufacturing method of light emitting module as claimed in claim 3, wherein
Make the shape of the insertion section of the light-emitting device unit for the recess portion for being configured at the light guide plate than the recess portion
Interior shape is small,
To can configure within the recess the insertion section, be formed in the periphery of the inner circumferential of the recess portion Yu the insertion section
Between annular gap in fill cement, formed joined wall.
5. the manufacturing method of light emitting module as claimed in claim 4, wherein
Keep the volume of the insertion section of light-emitting device unit described in the volumetric ratio of the annular gap big.
6. the manufacturing method of light emitting module as described in claim 4 or 5, wherein
Second interarea of the surface level of the joined wall and the light guide plate is set as same plane.
7. the manufacturing method of the light emitting module as described in any one of claim 4~6, wherein
The joined wall uses translucent resin.
8. such as the manufacturing method of light emitting module according to any one of claims 1 to 7, wherein
The first sealing resin section is set in the light-emitting device unit, first sealing resin section is by outer peripheral surface and the light modulation
The outer peripheral surface in portion is set as same plane, and buries the light-emitting component,
The light-emitting device unit for being equipped with first sealing resin section and constituting is fixed on the light guide plate.
9. the manufacturing method of light emitting module as claimed in claim 8, wherein
First sealing resin section is set as white resin.
10. such as the manufacturing method of light emitting module according to any one of claims 1 to 9, wherein
It is arranged for burying the hair on the second interarea of the light guide plate for constituting being fixed with the light-emitting device unit
Second sealing resin section of photo-element unit cell.
11. a kind of light emitting module, has:
Translucency light guide plate is equipped in the second interarea of the opposite side of the first interarea as light-emitting surface to external radiant light
Recess portion；
Light-emitting device unit is fixed on the recess portion of the light guide plate,
The light-emitting device unit is bonded to the dimming section comprising fluorophor on light emitting elements,
The light-emitting device unit keeps the shape for being configured at the insertion section of the recess portion smaller than the interior shape of the recess portion,
It is used as and connects with the translucency cement being filled in the annular gap being formed between the insertion section and the recess portion
It combines harmoniously.
12. light emitting module as claimed in claim 11, wherein
The volume of the insertion section of light-emitting device unit described in the volumetric ratio of the annular gap is big.
13. the light emitting module as described in claim 11 or 12, wherein
The second sealing resin burying the light-emitting device unit and constituting is laminated in second interarea of the light guide plate
Portion.
14. light emitting module as claimed in claim 13, wherein
The light-emitting device unit has the first sealing resin section, and first sealing resin section is by outer peripheral surface and the dimming section
Outer peripheral surface be set as same plane, and bury the light-emitting component,
The light-emitting device unit constituted equipped with first sealing resin section is embedded in second sealing resin section.
15. light emitting module according to claim 13 or 14, wherein
Second sealing resin section and first sealing resin section are white resin.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018059064 | 2018-03-26 | ||
| JP2018-059064 | 2018-03-26 | ||
| JP2019-056065 | 2019-03-25 | ||
| JP2019056065A JP6879325B2 (en) | 2018-03-26 | 2019-03-25 | Light emitting module manufacturing method and light emitting module |
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| Publication Number | Publication Date |
|---|---|
| CN110364515A true CN110364515A (en) | 2019-10-22 |
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| CN201910232439.XA Pending CN110364515A (en) | 2018-03-26 | 2019-03-26 | The manufacturing method and light emitting module of light emitting module |
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| Country | Link |
|---|---|
| JP (1) | JP6879325B2 (en) |
| KR (1) | KR102512369B1 (en) |
| CN (1) | CN110364515A (en) |
| TW (1) | TWI750466B (en) |
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| JP6828794B1 (en) | 2019-11-29 | 2021-02-10 | 日亜化学工業株式会社 | Surface emitting light source |
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| US11581460B2 (en) | 2019-12-25 | 2023-02-14 | Nichia Corporation | Light emitting module and method for manufacturing light emitting module |
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| JP2011204566A (en) * | 2010-03-26 | 2011-10-13 | Sumita Optical Glass Inc | Light-emitting device |
| CN105580144A (en) * | 2013-07-24 | 2016-05-11 | 柯立芝照明有限公司 | Method for producing glass substrate for magnetic disc, method for producing magnetic disc, and grinding tool |
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| JP2021100090A (en) * | 2019-12-20 | 2021-07-01 | 日亜化学工業株式会社 | Method for manufacturing light-emitting module |
| JP7111993B2 (en) | 2019-12-20 | 2022-08-03 | 日亜化学工業株式会社 | Method for manufacturing light-emitting module |
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| CN114114749B (en) * | 2020-08-31 | 2024-04-09 | 日亚化学工业株式会社 | Method for manufacturing light-emitting module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019175846A (en) | 2019-10-10 |
| JP6879325B2 (en) | 2021-06-02 |
| KR20190112675A (en) | 2019-10-07 |
| KR102512369B1 (en) | 2023-03-20 |
| TWI750466B (en) | 2021-12-21 |
| TW202005112A (en) | 2020-01-16 |
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