CN212433547U - LED light source and backlight module - Google Patents
LED light source and backlight module Download PDFInfo
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- CN212433547U CN212433547U CN202020869119.3U CN202020869119U CN212433547U CN 212433547 U CN212433547 U CN 212433547U CN 202020869119 U CN202020869119 U CN 202020869119U CN 212433547 U CN212433547 U CN 212433547U
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Abstract
The utility model relates to the technical field of light emitting diodes, and provides a LED light source and a backlight module, wherein the LED light source comprises an LED chip and a packaging unit; the packaging unit comprises a first packaging layer and a second packaging layer with preset light transmittance; the first packaging layer coats the light emitting surface of the LED chip and the side surface of the LED chip; the second packaging layer is arranged on the surface of the first packaging layer; the cross section of the side surface of the first packaging layer is trapezoidal; an included angle formed by the side surface and the bottom surface of the first packaging layer meets the preset requirement. By controlling the light transmittance of the second packaging layer, partial light beams of the LED light source are emitted to a target plane through the second packaging layer, so that the light intensity of the front surface is reduced, the light intensity of the light beams passing through the side surface of the first packaging layer is enhanced, and the intensity distribution of the emitted light beams is more uniform; the cross section shape of the first packaging layer is set, so that the light beams emitted from the side surface are distributed more uniformly according to the angle of the light beams emitted from the side surface, and the uniformity of the intensity distribution of the emitted light beams is further improved.
Description
Technical Field
The utility model relates to a light emitting diode technical field especially relates to a LED light source and backlight unit.
Background
The backlight module is one of the key components of the lcd panel, and is used to provide sufficient light sources with uniform brightness and distribution, so that the lcd panel can normally display images. The backlight module can be roughly divided into a side-type backlight module and a direct-type backlight module according to the placement position of the light source of the backlight. The development trend of the current backlight products is towards the direct type backlight, which is beneficial to the control of Local Dimming (Local Dimming) and realizes dynamic Dimming.
However, the current backlight module cannot better solve the problem that the dynamic dimming is compatible with the ultra-thin design of the display product, and the problem of poor light-emitting uniformity often occurs.
Disclosure of Invention
An object of the utility model is to provide a LED light source and backlight unit to solve the not good technical problem of backlight unit light-emitting homogeneity among the prior art.
In order to achieve the above object, the utility model adopts the following technical scheme: an LED light source is provided, which comprises an LED chip and a packaging unit;
the packaging unit comprises a first packaging layer and a second packaging layer with preset light transmittance;
the first packaging layer covers the light emitting surface of the LED chip and the side surface of the LED chip;
the second packaging layer is arranged on the surface of the first packaging layer;
the cross section of the side surface of the first packaging layer is trapezoidal;
an included angle formed by the side surface of the first packaging layer and the bottom surface of the first packaging layer satisfies the following relational expression:
α＜β
wherein α represents an included angle formed by the side surface of the first encapsulation layer and the bottom surface of the first encapsulation layer, and β represents a half of a beam angle of the LED chip.
In one embodiment, the first encapsulation layer is a transparent adhesive layer or a phosphor adhesive layer or a quantum dot adhesive layer.
In one embodiment, the second encapsulation layer has a light transmittance of 5% to 95%.
In one embodiment, the projection size of the second packaging layer on the plane of the LED chip is greater than or equal to the size of the LED chip 1.
In one embodiment, the side of the encapsulation unit is a frosted surface.
In one embodiment, the LED light source further comprises a substrate;
the LED chip is fixedly connected to the surface of the substrate;
the surface of the first packaging layer, which is back to the second packaging layer, is formed on the surface of the substrate.
In one embodiment, the LED chip is a face-up LED chip or a flip LED chip.
In one embodiment, the LED chip is a red LED chip or a green LED chip or a blue LED chip.
The utility model provides a beneficial effect of LED light source lies in at least: on the one hand, this embodiment sets up the second encapsulation layer through the surface at first encapsulation layer, the luminousness of control second encapsulation layer simultaneously for the light beam to the second encapsulation layer that shines of the positive outgoing of LED light source only part can pass through the second encapsulation layer and is exited to the target plane, positive luminous intensity has been reduced, the light beam that reflects through the second encapsulation layer can pass through the side outgoing of first encapsulation layer to the target plane, can strengthen the light beam intensity through the outgoing of first encapsulation layer side, thereby reached and carried out the effect of adjusting to the intensity distribution of the outgoing beam of LED light source, make outgoing beam intensity distribution more even.
On the other hand, by setting the cross-sectional shape of the packaging unit, the outgoing angle of the light beam outgoing from the side surface of the first packaging layer can be adjusted, so that the light beam outgoing through the side surface of the first packaging layer is more uniform in distribution, and the uniformity of the intensity distribution of the outgoing light beam is further improved.
The present invention also provides a backlight module, which includes a back plate, a reflective sheet, a light-emitting unit and a diffusion plate;
the back plate comprises a flat plate surface and inclined surfaces connected to the periphery of the flat plate surface, and the flat plate surface and the inclined surfaces form a cavity;
the reflector plate is arranged in the cavity and is attached to the surfaces of the flat plate surface and the inclined surface;
the light-emitting unit comprises a plurality of LED light sources, and the LED light sources are arranged in the cavity and fixed on the surface of the flat plate surface;
the diffusion plate is arranged on the light emitting path of the light emitting unit.
In one embodiment, the backlight module further comprises a brightness enhancement film;
the brightness enhancement film is arranged on the light emitting path of the diffusion plate.
The utility model provides a backlight module's beneficial effect lies in at least: the light-emitting unit in the backlight module provided by the embodiment adopts a plurality of LED light sources and is provided with the brightness enhancement film, so that the brightness is enhanced on the basis of effectively improving the distribution uniformity of the backlight intensity, and the energy is saved. Meanwhile, the light beam intensity distribution generated by the LED light source is more uniform, so that the light mixing distance can be effectively shortened, the overall thickness of the backlight module can be reduced, and the backlight module can be designed to be thinner and thinner.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of a light emitting diode according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a light emitting diode according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a light emitting diode according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a light emitting diode according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a light emitting diode according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram six of a light emitting diode according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram seven of a light emitting diode according to an embodiment of the present invention;
fig. 8 is an eighth schematic structural diagram of a light emitting diode according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a backlight module according to an embodiment of the present invention.
The following are reference numbers:
| 1 | LED chip |
| 2 | A |
| 3 | |
| 4 | |
| 5 | Conducting |
| 6 | |
| 7 | |
| 8 | Reflector plate |
| 9 | |
| 10 | |
| 11 | Brightness enhancement film |
| Y | Horizontal line |
| Z | Perpendicular to the horizon |
| α | An included angle formed between the side surface of the first packaging layer and the bottom surface of the first packaging layer |
| β | Half of the first package layer beam angle |
| θ | The side surface of the first packaging layer forms an included angle with the vertical line |
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1, the present embodiment provides an LED light source, which includes an LED chip 1 and a package unit; the packaging unit comprises a first packaging layer 2 and a second packaging layer 3 with preset light transmittance; the first packaging layer 2 coats the light emitting surface of the LED chip 1 and the side surface of the LED chip 1; the second packaging layer 3 is arranged on the surface of the first packaging layer 2; the cross section of the side surface of the first packaging layer 2 is trapezoidal; an included angle formed by the side surface of the first packaging layer 2 and the bottom surface of the first packaging layer 2 satisfies the following relational expression:
α＜β
where α represents an angle formed by the side surface of the first package layer 2 and the bottom surface of the first package layer 2, and β represents a half of the beam angle of the LED chip 1.
In an embodiment, the manufacturing process of the packaging unit may include die bonding the LED chip 1 on the substrate 4 or the adhesive film 6, sequentially packaging the LED chip 1 with the first packaging layer 2 and the second packaging layer 3 by using a two-shot molding (molding) manner, forming the packaging unit with the first packaging layer 2 and the second packaging layer 3, cutting the first packaging layer 2 or the packaging unit according to a preset angle (please refer to an angle θ in fig. 2) after curing, wherein the cut first packaging layer 2 has a trapezoidal cross section; the cross section of the cut packaging unit may or may not be a trapezoidal cross section, but at least the first packaging layer 2 is a trapezoidal cross section, and the area of the bottom surface of the first packaging layer 2 is larger than the area of the top surface (the surface in contact with the second packaging layer 3) of the first packaging layer 2.
Referring to fig. 1, the working principle of the LED light source provided in this embodiment is as follows:
after light beams generated by the LED light source pass through the first package layer 2, the light beams emitted from the front surface of the first package layer 2 irradiate the second package layer 3, and the light beams emitted from the side surface of the first package layer 2 directly emit to the target plane. Because the second package layer 3 has a certain light transmittance, part of the light beam is transmitted by the second package layer 3 and then emitted to the target plane, and part of the light beam is reflected back to the first package layer 2 by the second package layer 3 and finally emitted from the side surface of the first package layer 2 to the target plane. Because the light intensity of the light beam emitted to the second packaging layer 3 in the light beam generated by the LED light source is large, and the light beam directly emitted from the side surface of the first packaging layer 2 has small intensity, the light beam emitted through the second packaging layer 3 can be reduced after being reflected by the second packaging layer 3, and meanwhile, the light beam intensity emitted through the first packaging layer 2 is enhanced, so that the light beam intensity distribution irradiated to a target plane is more uniform.
The LED light source provided by the embodiment has the beneficial effects that: on the one hand, this embodiment is through setting up second encapsulating layer 3 on the surface of first encapsulating layer 2, the luminousness of second encapsulating layer 3 is controlled simultaneously, make the positive outgoing light beam of shining to second encapsulating layer 3 of LED light source only partly can pass through second encapsulating layer 3 and exit to the target plane, front luminous intensity has been reduced, the light beam that reflects through second encapsulating layer 3 can pass through the side outgoing of first encapsulating layer 2 to the target plane, can strengthen the light beam intensity through the outgoing of first encapsulating layer 2 side, thereby reached and carried out the effect of adjusting to the intensity distribution of the outgoing light beam of LED light source, make outgoing light beam intensity distribution more even.
On the other hand, by setting the cross-sectional shape of the first encapsulating layer 2, the exit angle of the light beam exiting from the side surface of the first encapsulating layer 2 can be adjusted, so that the light beam exiting through the side surface of the first encapsulating layer 2 is more uniformly distributed, and the uniformity of the intensity distribution of the exiting light beam is further improved.
In one embodiment, as for the definition of the included angle formed by the side surface of the first packaging layer 2 and the bottom surface of the first packaging layer 2, it can be another way, as shown in fig. 2, that the positive direction of the Z axis is set to be 0 degree, the positive direction of the Y axis is set to be 90 degrees, the included angle θ between the side surface of the first packaging layer 2 and the positive direction of the Z axis is greater than (90 ° - β), and the degree of the beam angle of the LED light source is 2 β degrees. Where α and θ have a relationship α + θ of 90 °.
When a part of light beams generated by the LED light source is in a range from 0 degree to beta degree, the light beams can be emitted to the second packaging layer 3, one part of the light beams are reflected, one part of the light beams are transmitted, and the transmitted light beams are emitted to a target plane; when part of the light beams are in the range of beta degrees to 85 degrees, the light beams can be emitted to a target plane through the side face of the first packaging layer 2 and mixed with the light beams emitted from the second packaging layer 3; when the light beam is in the range of 85 degrees to 90 degrees, the light beam is deflected downwards by the side surface of the first packaging layer 2, and the light beam reflected by the Printed Circuit Board (PCB) is reflected to the first packaging layer 2 and finally emitted to a target plane from the side surface, so that the light beam distribution uniformity is improved, and the overall light emitting efficiency is high.
In an embodiment, the first encapsulation layer 2 is a transparent adhesive layer or a phosphor adhesive layer or a quantum dot adhesive layer, and it should be understood that the first encapsulation layer 2 may also be any other adhesive type with the same or similar function and effect as the transparent adhesive layer or the phosphor adhesive layer or the quantum dot adhesive layer, and is not limited herein.
In one embodiment, the light transmittance of the second encapsulation layer 3 is 5% to 95%, and it should be understood that the light transmittance range is adjusted according to the specific use case, and may be, for example, 6%, 94%, or 50%, and is not limited herein.
In one embodiment, the second encapsulation layer 3 may be white glue or opaque glue, which has the function of reflecting and diffusing the projection, and the part of the light beam passing through the second encapsulation layer 3 is distributed more uniformly. It should be understood that the second encapsulating layer 3 may also be other encapsulating materials having the same or similar function and effect as the white glue or the opaque glue, and is not limited herein.
In one embodiment, the projection size of the second encapsulation layer 3 on the plane where the LED chip 1 is located is greater than or equal to the size of the LED chip 1, so as to ensure that the light generated by the LED chip 1 can be reflected by the second encapsulation layer 3 after reaching the second encapsulation layer 3, and avoid uneven light distribution caused by direct emergence of part of the light after passing through the first encapsulation layer 2.
In one embodiment, the side surface of the packaging unit is a frosted surface, so that the scattering effect of the light beam can be enhanced, and the uniform distribution of the light beam is facilitated. Of course, the side of the first encapsulation layer 2 or the encapsulation unit may also be a smooth plane or other planes, which is not limited herein.
In one embodiment, the LED light source described above may further include a substrate 4; the LED chip 1 is fixedly connected to the surface of the substrate 4; the surface of the first packaging layer 2, which faces away from the second packaging layer 3, is molded on the surface of the substrate 4. The method comprises the following specific steps:
(1) die bonding and wire bonding: fixing the LED chip 1 on the substrate 4 in a die bonding manner, and conducting the LED chip 1 with the substrate 4 through a lead 5;
(2) first molding: and coating transparent glue or fluorescent powder glue or quantum dot glue (a first packaging layer 2) on the substrate 4 with the LED chip 1 in a molding mode on the substrate 4 with the LED chip 1.
(3) Second molding: and coating the white glue or the opaque glue (the second packaging layer 3) on the transparent glue or the fluorescent powder glue or the quantum dot glue (the first packaging layer 2) which is formed by the first molding in a molding mode.
(4) Baking and cutting: baking and curing the product coated with the first packaging layer 2 and the second packaging layer 3, and cutting the cured product, wherein the cut first packaging layer 2 is of a trapezoidal section; the section of the cut package unit may or may not be a trapezoidal section, but at least the first package layer 2 is a trapezoidal section.
In the case of not using the substrate 4, the reusable glue film 6 may be used, and the packaging process may be:
(1) and (3) crystal solidification: the LED chip 1 is fixed on the reusable adhesive film 6 in a die bonding manner.
(2) First molding: transparent glue or fluorescent powder glue or quantum dots (first packaging layer 2) are coated on the LED chip 1 in a molding mode.
(3) Second molding: and coating the white glue or the opaque glue (the second packaging layer 3) on the transparent glue or the fluorescent powder glue or the quantum dot glue (the first packaging layer 2) in a molding mode.
(4) Baking and cutting: baking and curing the product subjected to the two-time molding, and cutting the cured product, wherein the cut first packaging layer 2 is of a trapezoidal section; the section of the cut package unit may or may not be a trapezoidal section, but at least the first package layer 2 is a trapezoidal section.
In one embodiment, the LED chip 1 may be in a face-up configuration or a flip-chip configuration, which is not limited herein.
In an embodiment, the LED chip 1 may be a red LED chip, a green LED chip, or a blue LED chip, or may be an LED chip capable of generating light of other colors, which is not limited herein. Electromagnetic waves with different wavelengths cause different color perception of human eyes: 770-622 nm, and is red; 622-597 nm, and is orange; 597-577 nm, and is yellow; 577-492 nm, and is perceived as green; 492-455 nm, and is felt as indigo; 455-390 nm, and is perceived as purple.
Several specific embodiments of LED light sources are provided below, and it should be understood that LED light sources can be in other forms and are not limited to the embodiments described below. The following embodiments each include an LED chip 1 and a package unit including a first package layer 2 and a second package layer 3 having a predetermined light transmittance; the first packaging layer 2 coats the light emitting surface of the LED chip 1 and the side surface of the LED chip 1; the second packaging layer 3 is arranged on the surface of the first packaging layer 2; the cross section of the side surface of the first packaging layer 2 is trapezoidal; an included angle formed by the side surface of the first packaging layer 2 and the bottom surface of the first packaging layer 2 satisfies the following relational expression:
α＜β
where α represents an angle formed by the side surface of the first package layer 2 and the bottom surface of the first package layer 2, and β represents a half of the beam angle of the LED chip 1. The projection size of the second packaging layer 3 on the plane of the LED chip 1 is larger than or equal to the size of the LED chip 1.
Referring to fig. 3, in the first embodiment:
the packaging unit is of a trapezoidal section; the first packaging layer 2 is a transparent adhesive layer; the second packaging layer 3 is white glue and has light transmittance of 5%; the LED light source also comprises a substrate 4, and the LED chip 1 is fixedly connected to the surface of the substrate 4; the surface of the first packaging layer 2, which is back to the second packaging layer 3, is formed on the surface of the substrate 4; the LED chip 1 is in a face-up configuration.
Referring to fig. 4, the second embodiment:
the first packaging layer 2 is a trapezoidal section and is a fluorescent powder glue layer; the second packaging layer 3 is an opaque glue layer and has the light transmittance of 95 percent; the LED light source also comprises a substrate 4, and the LED chip 1 is fixedly connected to the surface of the substrate 4; the surface of the first packaging layer 2, which is back to the second packaging layer 3, is formed on the surface of the substrate 4; the LED chip 1 is in a face-up configuration.
Please refer to fig. 5, embodiment three:
the packaging unit is of a trapezoidal section; the first packaging layer 2 is a quantum dot glue layer; the second packaging layer 3 is white glue and has light transmittance of 15%; the LED light source also comprises a substrate 4, and the LED chip 1 is fixedly connected to the surface of the substrate 4; the surface of the first packaging layer 2, which is back to the second packaging layer 3, is formed on the surface of the substrate 4; the LED chip 1 is flip-chip mounted.
Please refer to fig. 6, which illustrates a fourth embodiment:
the packaging unit is of a trapezoidal section; the first packaging layer 2 is a transparent adhesive layer; the second packaging layer 3 is a white glue layer and has a light transmittance of 45%; the LED chip 1 is fixedly connected to the surface of the reusable adhesive film 6; the surface of the first packaging layer 2, which is back to the second packaging layer 3, is formed on the surface of the adhesive film 6; the LED chip 1 is in a face-up configuration.
Please refer to fig. 7, example five:
the packaging unit is of a trapezoidal section; the first packaging layer 2 is a fluorescent powder glue layer; the second packaging layer 3 is an opaque glue layer and has light transmittance of 59%; the LED chip 1 is fixedly connected to the surface of the reusable adhesive film 6; the surface of the first packaging layer 2, which is back to the second packaging layer 3, is formed on the surface of the adhesive film 6; the LED chip 1 is flip-chip mounted.
Please refer to fig. 8, example six:
the first packaging layer 2 is a trapezoidal section and is a quantum dot glue layer; the second packaging layer 3 is a white glue layer and has the light transmittance of 73 percent; the LED chip 1 is fixedly connected to the surface of the reusable adhesive film 6; the surface of the first packaging layer 2, which is back to the second packaging layer 3, is formed on the surface of the adhesive film 6; the LED chip 1 is in a face-up configuration.
Referring to fig. 9, another objective of the present invention is to provide a backlight module, which includes a back plate 7, a reflective sheet 8, a light emitting unit 9 and a diffusion plate 10; the back plate 7 comprises a flat plate surface and inclined surfaces connected to the periphery of the flat plate surface, and the flat plate surface and the inclined surfaces form a cavity; the reflector plate 8 is arranged in the cavity and attached to the surfaces of the flat plate surface and the inclined surface; the light emitting unit 9 comprises a plurality of the above LED light sources, which are disposed in the cavity and fixed on the surface of the flat surface; the diffusion plate 10 is disposed on the light emitting path of the light emitting unit 9.
The backlight module further comprises a brightness enhancement film 11, and the brightness enhancement film 11 is arranged on the light emitting path of the diffusion plate 10.
The embodiment of the utility model provides a backlight module's beneficial effect lies in at least: in the backlight module provided by this embodiment, the light-emitting unit 9 employs a plurality of the above-mentioned LED light sources and is provided with the brightness enhancement film 11, so that the brightness is enhanced on the basis of effectively improving the uniformity of the backlight intensity distribution, and the energy is saved. Meanwhile, the light beam intensity distribution generated by the LED light source is more uniform, so that the light mixing distance can be effectively shortened, the overall thickness of the backlight module can be reduced, and the backlight module can be designed to be thinner and thinner.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An LED light source, characterized by: the LED packaging structure comprises an LED chip and a packaging unit;
the packaging unit comprises a first packaging layer and a second packaging layer with preset light transmittance;
the first packaging layer covers the light emitting surface of the LED chip and the side surface of the LED chip;
the second packaging layer is arranged on the surface of the first packaging layer;
the cross section of the side surface of the first packaging layer is trapezoidal;
an included angle formed by the side surface of the first packaging layer and the bottom surface of the first packaging layer satisfies the following relational expression:
α＜β
wherein α represents an included angle formed by the side surface of the first encapsulation layer and the bottom surface of the first encapsulation layer, and β represents a half of a beam angle of the LED chip.
2. The LED light source of claim 1 wherein: the first packaging layer is a transparent adhesive layer or a fluorescent powder adhesive layer or a quantum dot adhesive layer.
3. The LED light source of claim 1 wherein: the light transmittance of the second packaging layer is 5% -95%.
4. The LED light source of claim 1 wherein: the projection size of the second packaging layer on the plane where the LED chip is located is larger than or equal to the size of the LED chip.
5. The LED light source of claim 1 wherein: the side surface of the packaging unit is a frosted surface.
6. The LED light source as claimed in any one of claims 1 to 5, wherein: the LED light source further comprises a substrate;
the LED chip is fixedly connected to the surface of the substrate;
the surface of the first packaging layer, which is back to the second packaging layer, is formed on the surface of the substrate.
7. The LED light source of claim 6 wherein: the LED chip is a normally-installed LED chip or a flip LED chip.
8. The LED light source of claim 6 wherein: the LED chip is a red LED chip or a green LED chip or a blue LED chip.
9. A backlight module is characterized in that: comprises a back plate, a reflecting sheet, a light emitting unit and a diffusion plate;
the back plate comprises a flat plate surface and inclined surfaces connected to the periphery of the flat plate surface, and the flat plate surface and the inclined surfaces form a cavity;
the reflector plate is arranged in the cavity and is attached to the surfaces of the flat plate surface and the inclined surface;
the light-emitting unit comprises a plurality of LED light sources according to any one of claims 1 to 8, the LED light sources are arranged in the cavity and fixed on the surface of the flat plate surface;
the diffusion plate is arranged on the light emitting path of the light emitting unit.
10. The backlight module of claim 9, wherein: the backlight module also comprises a brightness enhancement film;
the brightness enhancement film is arranged on the light emitting path of the diffusion plate.
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| CN202020869119.3U CN212433547U (en) | 2020-05-21 | 2020-05-21 | LED light source and backlight module |
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| CN202020869119.3U CN212433547U (en) | 2020-05-21 | 2020-05-21 | LED light source and backlight module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
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