JP6552190B2 - Light emitting device and method of manufacturing light emitting device - Google Patents

Description

The present invention relates to a light-emitting device and a method for manufacturing the light- emitting device with improved light focusing and accuracy.

  Conventionally, in a light-emitting device using a light-emitting element such as a light-emitting diode, a phosphor plate containing a phosphor is arranged above the light-emitting element, and the side surfaces of the light-emitting element and the phosphor plate are covered with a reflective resin, thereby To prevent the leakage of light, and was configured to obtain a light emission color by bright and appropriate color mixing. However, since the processing of the light passing obliquely through the phosphor plate is insufficient, for example, when white light is obtained by transmitting light from a light emitting element that emits blue light through the phosphor plate, the phosphor plate is used. A ring of light with a slightly yellowish color above the light emitting element where white light is emitted right above the light emitting element where the light transmitted almost upward gathers, and only light transmitted obliquely through the phosphor plate spreads (yellow ring) It was the For this reason, the loss of brightness and the deterioration of light emitting color were caused.

  Therefore, a phosphor plate and a diffusion plate of the same size are sequentially bonded onto the light emitting surface of the light emitting element, and the side surface of the light emitting element and the side surfaces of the phosphor plate and the diffusion plate are sealed with a reflective white member, thereby obtaining a bright In order to eliminate the yellow ring, it has been proposed (for example, see Patent Document 1).

  In addition, in the process of attaching the phosphor sheet to each light emitting element, the upper part of the light emitting element is embedded in the phosphor sheet to prevent the positional deviation, and it has been possible to manufacture in a collective state (for example, , Patent Document 2).

JP, 2013-16588, A JP, 2014-90157, A

  In the light emitting device of the above-mentioned Patent Document 1, since the phosphor plate and the diffusion plate are attached on the light emitting surface of the light emitting element by sequentially bonding them, the phosphor plate is used in the bonding step or the subsequent sealing step with a white member. There was a case where a gap occurred between the diffusion plate and the diffusion plate. Thus, when the displacement occurs between the phosphor plate and the diffusion plate, the light emission color is not uniform, and a gap is generated between the phosphor plate or the diffusion plate and the white member to cause light leakage. there were. In addition, since it is necessary to bond the phosphor plate and the diffusion plate individually to the light emitting element, there is also a problem that it takes time to mass-produce it.

  Further, as in the light emitting device of Patent Document 2, if the top of the light emitting element is attached to the phosphor sheet so that the top of the light emitting element is embedded, at least the displacement between the light emitting element and the phosphor sheet can be prevented. Since the phosphor sheet wraps around, there is a problem that yellow ring occurs. Furthermore, in the assembled state in which the light emitting element and the phosphor sheet are adjacent to each other, there is a problem that light from adjacent phosphor sheets and the like interfere with each other.

  The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art, to improve the light condensing property and the accuracy thereof, and to provide a light emitting device which does not interfere with each other even when the light emitting elements are in close arrangement or aggregation. It is to do.

The light emitting device of the present invention has a substrate, a plurality of light emitting elements flip-chip mounted on the substrate, and a sealing resin layer for diffusing light on the upper side, and a phosphor layer containing a fluorescent substance on the lower side. A two-layer sheet fixed to the upper surface of the light emitting device such that the sealing resin layer connects a plurality of light emitting devices, a surface of the substrate, a side surface of the light emitting device, and a side surface of the two-layer sheet And a reflective resin for covering. Further, the sealing resin layer in the light-emitting device having a recess in a lower surface, a shielding recesses between the light emitting element where the phosphor layer is adjacent Rutotomoni formed in a recess of the sealing resin layer There is.

In particular, in the light emitting device of the present invention, a part of the entire surface or the lower side of the side surface of the sealing resin layer forms a slope in which the side space narrows downward.

On the other hand, the method for manufacturing a light emitting device of the present invention has a sealing resin layer on the upper side, which diffuses light and has a plurality of recesses on the lower surface, contains a phosphor and is in the plurality of recesses of the sealing resin layer. The upper surfaces of the plurality of light emitting elements are fixed to the plurality of phosphor layers of the two-layer sheet having the plurality of phosphor layers formed on the lower side, and the plurality of light emitting elements connected by the two-layer sheet The surface of the substrate, the side surfaces of the plurality of light emitting elements, and the side surfaces of the two-layer sheet are covered with a reflective resin.

In the method of manufacturing a light emitting device according to the present invention, a sealing resin layer which diffuses light and has a plurality of concave portions on the lower surface is provided on the upper side, and a fluorescent substance is contained therein. The upper surfaces of the plurality of light emitting elements are fixed to the plurality of phosphor layers of the two-layer sheet having the plurality of phosphor layers formed on the lower side, and the plurality of light emitting elements connected by the two-layer sheet And the sealing resin layer of the two-layer sheet is cut between the recesses, and the surface of the substrate, the side surfaces of the plurality of light emitting elements, and the sealing resin of the two-layer sheet cut The side surface of the layer is covered with a reflective resin.

  In the light emitting device of the present invention, the two-layer sheet in which the sealing resin layer for diffusing light and the phosphor layer containing the phosphor are integrated is fixed to the upper surface of the light emitting element, and the side surface is covered with the reflecting resin. In the fixing process of the two-layer sheet and the process of covering with the reflective resin, no misalignment occurs between the sealing resin layer and the phosphor layer. In particular, in the two-layer sheet in which the concave portion is provided on the lower surface of the sealing resin layer and the phosphor layer is provided in the concave portion, the sealing resin layer and the phosphor layer are more strongly integrated. In addition to the above-described steps, no displacement occurs between the sealing resin layer and the phosphor layer even in the step where a strong external force acts or the like. As described above, since the displacement between the sealing resin layer and the phosphor layer can be prevented, the color unevenness of the luminescent color can be improved and made uniform, and the light between the two-layer sheet and the reflecting resin, etc. The light distribution characteristic can be narrowed with high accuracy by preventing leakage of light and improving the light collecting property.

  In addition, since the side surface of the two-layer sheet can be accurately covered with the reflective resin, light from adjacent light emitting elements does not interfere even when a plurality of light emitting elements are mounted on a substrate without light interference. The elements can be arranged closely in high density.

  In addition, since it is only necessary to fix the two-layer sheet to the light emitting element, the light emitting device can be manufactured in fewer steps than in the prior art. In particular, a plurality of light emitting devices can be manufactured in a small number of steps by fixing one two-layer sheet to a plurality of light emitting elements.

It is sectional drawing which shows the light-emitting device which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the light-emitting device which concerns on the 2nd Embodiment of this invention. It is a principal part expanded sectional view which shows the irradiation state of the light in the light-emitting device shown in FIG. It is a principal part expanded sectional view which shows the irradiation state of the light in the light-emitting device shown in FIG. It is a principal part expanded sectional view which shows the irradiation state of the light in the partial modification of the light-emitting device shown in FIG. It is sectional drawing which shows the example of a change which mounted two or more light emitting elements in the aggregate state in the light-emitting device shown in FIG. It is sectional drawing which shows the example of a change which mounted multiple light emitting elements in the light emission device shown in FIG. It is sectional drawing which shows the example of a change which made the 2 layer sheet | seat in the light-emitting device shown in FIG. 7 a series. It is sectional drawing which shows the sealing resin layer which can form multiple sealing resin layers in the two-layer sheet | seat shown in FIG. It is sectional drawing which shows the 2 layer sheet | seat which laminated | stacked the fluorescent substance layer on the sealing resin layer shown in FIG. It is sectional drawing which shows the state which divided | segmented the two-layer sheet | seat shown in FIG. 10 into the magnitude | size compatible with a light emitting element. FIG. 12 is a cross-sectional view showing a state in which the divided two-layer sheet shown in FIG. 11 is fixed to the upper surface of the light emitting element and the light emitting element is mounted on a substrate. It is sectional drawing which shows the state which covered the side surface of the light emitting element in the state shown in FIG. 12, and a two-layer sheet by reflection resin. It is sectional drawing which shows the sealing resin layer which can form multiple sealing resin layers in the 2 layer sheet | seat shown in FIG. It is sectional drawing which shows the 2 layer sheet | seat which laminated | stacked the fluorescent substance layer on the sealing resin layer shown in FIG. It is sectional drawing which shows the state which divided | segmented the two-layer sheet | seat shown in FIG. 15 into the magnitude | size compatible with a light emitting element. FIG. 17 is a cross-sectional view showing a state in which the divided two-layer sheet shown in FIG. 16 is fixed to the upper surface of the light emitting element and the light emitting element is mounted on a substrate. FIG. 18 is a cross-sectional view showing the side surface of the light emitting element and the two-layer sheet in the state shown in FIG. 17 covered with a reflecting resin. FIG. 16 is a cross-sectional view illustrating a state where a plurality of light emitting elements are fixed to the two-layer sheet illustrated in FIG. 15. It is sectional drawing which shows the state which mounted the several light emitting element in the state shown in FIG. 19 on the board | substrate. It is sectional drawing which shows the state which parted the two-layer sheet in the state shown in FIG. It is sectional drawing which shows the state which covered the side surface of the light emitting element in the state shown in FIG. 21, and a two-layer sheet by reflection resin. It is sectional drawing which shows the state which covered the side surface of the light emitting element in the state shown in FIG. 20, and a two-layer sheet by reflection resin.

  The light emitting device 1 according to the first embodiment of the present invention shown in FIG. 1 includes a substrate 4 having wiring patterns 2 and 3 formed on the surface thereof, and flips on the wiring patterns 2 and 3 of the substrate 4 by bumps 5 and 6. And a light emitting element 7 mounted on a chip.

  A two-layer sheet 8 is fixed by an adhesive on the upper surface which is the light emitting surface of the light emitting element 7. The two-layer sheet 8 has a sealing resin layer 8a for diffusing light on the upper side, and a phosphor layer 8b containing a fluorescent substance on the lower side. The sealing resin layer 8a is made of light transmitting epoxy resin, silicon resin or the like, and in order to diffuse light transmitted from the lower side to the upper side, fine irregularities are provided on the upper surface. The phosphor layer 8b is integrally formed by printing, coating, or the like on the lower surface of the sealing resin layer 8a by mixing the phosphor into a translucent epoxy resin, silicon resin, or the like.

  The reflective resin 9 is made of an epoxy resin colored with a white pigment or the like, a silicone resin or the like, and is formed to cover the upper surface of the substrate 4, the side surface of the light emitting element 7 and the side surface of the two-layer sheet 8.

  In the light emitting device 1 configured as described above, since the two-layer sheet 8 in which the sealing resin layer 8a and the phosphor layer 8b are integrated is fixed to the upper surface of the light emitting element 7, the sealing resin layer 8a and the phosphor layer There is no deviation from 8b. In particular, since the sealing resin layer 8a and the phosphor layer 8b can be attached to the light emitting element 7 at one time and the workability is good, positioning of the sealing resin layer 8a and the phosphor layer 8b relative to the light emitting element 7 is easy It becomes.

  Further, in order to more firmly integrate the sealing resin layer 8a and the phosphor layer 8b, the light emitting device 11 according to the second embodiment of the present invention shown in FIG. 2 can be configured. In the light emitting device 11, a recess 18c is provided on the lower surface of the sealing resin layer 18a of the two-layer sheet 18, and the phosphor layer 18b is integrally formed in the recess 18c by printing, coating, or the like. When the two-layer sheet 18 is formed in this manner, lateral displacement of the sealing resin layer 18 a and the phosphor layer 18 b can be reliably prevented. The other components are the same as those of the light emitting device 1 in the first embodiment, and the same reference numerals are given.

  The light R transmitted through the two-layer sheets 8 and 18 in the light emitting devices 1 and 11 is emitted right above the light emitting element 7 as shown in FIG. 3 and FIG. , 18 is reflected by the side surface 8d of the phosphor layer 8b and the side surfaces 8e, 18e of the sealing resin layers 8a, 18a and is irradiated upward without spreading outward. Thereby, the light which spreads around can be collected in the center, and light condensing property improves.

  In addition, as shown in FIG. 5, the entire surface or the lower portion of the side surface 18e of the sealing resin layer 18a shown in FIG. Can be emitted in a direction closer to the upper right.

  Further, in the light emitting devices 1 and 11, since the side surfaces of the light emitting element 7 and the side surfaces of the two-layer sheet 8 and 18 are accurately covered with the reflecting resin 9, light does not leak to the side. Therefore, as shown in FIG. 6 and FIG. 7, even if the plurality of light emitting elements 7 are mounted on the substrate 4, the lights irradiated do not interfere with each other. Therefore, a plurality of light emitting elements 7 can be mounted on the same substrate and unitized. In addition, if it is the same luminescent color, as shown in FIG. 8, it can also be comprised so that the some light emitting element 7 may continue in a line by the two-layer sheet 18 of 1 sheet. In the case of the light emitting device shown in FIG. 8, when the shielding recess 18f is provided between the plurality of recesses 18c of the sealing resin layer 18a, the reflecting resin 9 is filled in the shielding recess 18f, and the adjacent light emitting element 7 is covered. The interference of light from the phosphor layer 18b of the above can be more reliably prevented. It is preferable that the shielding recess 18 f be formed smaller and deeper than the recess 18 b.

  Next, a method of manufacturing the light emitting device 1 will be described based on FIG. 9 to FIG. The sealing resin layer 8a shown in FIG. 9 has a size capable of forming a plurality of sealing resin layers 8a, and the phosphor layer 8b is formed on the lower surface of the sealing resin layer 8a by printing, coating or the like. Are uniformly formed integrally to form a two-layer sheet 8 shown in FIG. Thereafter, as shown in FIG. 11, the two-layer sheet 8 shown in FIG.

  Thereafter, the two-layer sheet 8 divided as described above is fixed to the upper surface of the light emitting element 7 as shown in FIG. 12, and the plurality of light emitting elements 7 are mounted on the substrate 4 of a size corresponding to a plurality of light emitting devices. Flip chip mounting. Then, as shown in FIG. 13, the surface of the substrate 4, the side surfaces of the light emitting element 7, and the side surfaces of the two-layer sheet 8 are covered with the reflective resin 9.

  Thereafter, the reflection resin 9 and the substrate 4 are divided between the light emitting elements 7 to form individual light emitting devices 1. Further, if the light emitting device 7 is divided into the state shown in FIG. 13 or the necessary number of light emitting devices 7 connected, a light emitting device in which a plurality of light emitting devices 7 as shown in FIG. It can be formed.

  Next, a method of manufacturing the light emitting device 11 will be described based on FIG. 14 to FIG. The sealing resin layer 18a shown in FIG. 14 is also of a size capable of forming a plurality of sealing resin layers 18a, and a plurality of concave portions 18c are formed on the lower surface (the upper surface in FIG. 14). It has become. The recess 18 c is set to a size that fits the light emitting element 7. Next, the phosphor layers 18b are integrally formed in the plurality of concave portions 18c of the sealing resin layer 18a by printing, coating, etc., to form the two-layer sheet 18 shown in FIG. Thereafter, as shown in FIG. 16, the two-layer sheet 18 shown in FIG. 15 is cut in a portion between the phosphor layers 18 b in the sealing resin layer 18 a to be divided into a size suitable for the light emitting element 7.

  Thereafter, the two-layer sheet 18 divided as described above is fixed to the upper surface of the light emitting element 7 as shown in FIG. 17, and the plurality of light emitting elements 7 are attached to the substrate 4 having a size corresponding to the plurality of light emitting devices. Flip chip mounting. Then, as shown in FIG. 18, the surface of the substrate 4, the side surfaces of the light emitting element 7, and the side surfaces of the two-layer sheet 18 (side surfaces of the sealing resin layer 18 a) are covered with the reflective resin 9. In addition, as shown in FIG. 8, when the recessed part 18f for shielding is provided in the sealing resin layer 18a, the reflective resin 9 is filled also in the recessed part 18f for shielding.

  Thereafter, the reflection resin 9 and the substrate 4 are divided between the two-layer sheet 18 fixed to the light emitting element 7 to form individual light emitting devices 11. Further, if division is performed in the state shown in FIG. 18 or in a state where light emitting elements 7 are connected in a required number, a plurality of light emitting elements 7 as shown in FIG. 7 or FIG. A light emitting device can be formed.

  On the other hand, as shown in FIG. 19, a plurality of light emitting elements 7 are attached to the phosphor layer 18b so that the upper surface is fixed without dividing the two-layer sheet 18, and then, as shown in FIG. The plurality of light emitting elements 7 connected by the sheet 18 can be flip chip mounted on the substrate 4 at one time. In this case, after the plurality of light emitting elements 7 are mounted on the substrate 4, as shown in FIG. 21, the sealing resin layer 18 a of the two-layer sheet 18 is divided between the phosphor layers 18 b, and then the reflecting resin 9 is used. By covering, as shown in FIG. 22, the surface of the substrate 4 and the side surfaces of the two-layer sheet 18 can be covered.

  Further, when the surface of the substrate 4 and the side surface of the two-layer sheet 18 are covered with the reflective resin 9 without dividing the two-layer sheet 18, a plurality of light emitting elements 7 as shown in FIG. 23 or FIG. The light emitting device can be formed.

  As described above, by using the two-layer sheets 8 and 18, the sealing resin layers 8a and 18a and the phosphor layers 8b and 18b do not need to be fixed to the light emitting element 7 individually, thereby reducing the number of steps and their positions. Deviation can be prevented. Further, since the sealing resin layers 8a and 18a and the phosphor layers 8b and 18b are firmly integrated, after the two-layer sheets 8 and 18 are fixed to the plurality of light emitting elements 7, the two-layer sheets 8 and 18 are Even if it divides | segments, sealing resin layer 8a, 18a and fluorescent substance layer 8b, 18b do not shift | deviate. For this reason, the two-layer sheets 8 and 18 can be fixed to the plurality of light-emitting elements 7 at one time, or the plurality of light-emitting elements 7 connected by the two-layer sheet 18 can be mounted at one time. In this case, man-hours can be significantly reduced.

DESCRIPTION OF SYMBOLS 1, 11 light-emitting device 2, 3 wiring pattern 4 board | substrate 5, 6 bump 7 light-emitting element 8, 18 2 layer sheet 8a, 18a sealing resin layer 8b, 18b fluorescent substance layer 8d, 8e side 9 reflective resin 18c recessed part 18e side 18f Shielding recess R light

Claims (3)

A substrate,
A plurality of light emitting elements flip-chip mounted on the substrate;
A sealing resin layer for diffusing light is on the upper side, and a phosphor layer containing phosphors is on the lower side, and the sealing resin layer is formed on the upper surface of the light emitting element so as to connect a plurality of light emitting elements. Fixed two-layer sheet,
A reflective resin that covers a surface of the substrate, a side surface of the light emitting element, and a side surface of the two-layer sheet;
The sealing resin layer has a recess on the lower surface, the phosphor layer has a shielding recesses between the light emitting elements adjacent Rutotomoni formed in a recess of the sealing resin layer,
A light emitting device characterized in that the entire or lower part of the side surface of the sealing resin layer has a slope in which the distance between the side surfaces is narrowed toward the lower side. It has a sealing resin layer on the upper side which diffuses light and has a plurality of recesses on the lower surface, and contains a phosphor and a plurality of phosphor layers formed in the plurality of recesses of the sealing resin layer. The upper surfaces of the plurality of light emitting elements are respectively fixed to the plurality of phosphor layers of the two-layer sheet having
Flip chip mounting the plurality of light emitting elements connected by the two-layer sheet on a substrate
A method of manufacturing a light emitting device, comprising: covering the surface of the substrate, the side surfaces of the plurality of light emitting elements, and the side surfaces of the two-layer sheet with a reflection resin. It has a sealing resin layer on the upper side which diffuses light and has a plurality of recesses on the lower surface, and contains a phosphor and a plurality of phosphor layers formed in the plurality of recesses of the sealing resin layer. The upper surfaces of the plurality of light emitting elements are respectively fixed to the plurality of phosphor layers of the two-layer sheet having
Flip chip mounting the plurality of light emitting elements connected by the two-layer sheet on a substrate
Cutting the sealing resin layer of the two-layer sheet between the recesses,
A method of manufacturing a light emitting device, comprising: covering the surface of the substrate, the side surfaces of the plurality of light emitting elements, and the side surfaces of the cut sealing resin layer of the two-layer sheet with a reflective resin.

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