JP6541963B2 - Light emitting device and method of manufacturing the same - Google Patents

Description

  The present invention relates to a light emitting device with improved light extraction efficiency, and more particularly to a light emitting device for illumination and a method of manufacturing the same.

  Conventionally, in a light emitting device for illumination using a light emitting element such as a light emitting diode, the light emitting element mounted on a substrate is surrounded by a frame-like resin, and a sealing resin for sealing the light emitting element is contained in the frame-like resin. It was filling. In such a light emitting device, the light emitted from the light emitting element may be absorbed by the wiring pattern, the frame-like resin, the sealing resin or the like provided on the substrate, which may lower the light extraction efficiency.

  Therefore, a lighting device has been proposed in which a reflector formed by stacking one or more steps of resin is provided to surround the light emitting element, and light from the light emitting element is guided to the upper side of the substrate (for example, Patent Document 1).

  In addition, a light emitting device has also been proposed in which a conductor wiring and a part of a wire on a substrate are embedded in a light reflecting resin (see, for example, Patent Document 2).

  Furthermore, a light source device has also been proposed in which a frame portion surrounding a light emitting element is formed of a resin in which a light diffusing material is mixed in a transparent resin (see, for example, Patent Document 3).

JP, 2008-41290, A JP, 2009-164157, A JP, 2013-197369, A

  In the lighting device of Patent Document 1, since the electrode on the substrate is not completely covered by the reflector, the light absorption of the electrode portion can not be prevented. Further, in the light emitting device of Patent Document 2, the conductor wiring is covered with the light reflecting resin, but since the light emitting element is surrounded by the light frame-like light reflecting resin, the spread of light is eliminated and the light emitting device for illumination is used. Needed improvement. Furthermore, in the light source device of Patent Document 3, although the frame portion transmits the light to obtain the spread of the light, the light absorption by the wiring pattern or the like can not be prevented.

  The problem to be solved by the present invention is to solve the problems of the above-mentioned prior art and to obtain light spreading while preventing absorption of light such as a wiring pattern, thereby enhancing light extraction efficiency and manufacturing thereof To provide a way.

A light emitting device according to one embodiment of the present invention includes a substrate, a light emitting element mounted on the substrate, and a wiring pattern provided around a light emitting area on the substrate on which the light emitting element is mounted. A pattern sealing resin for reflecting the light and covering the wiring pattern, a transparent frame resin provided on the pattern sealing resin and surrounding the light emitting area, and provided inside the frame resin And a sealing resin for sealing the light emitting element, wherein the pattern sealing resin and the frame-like resin are integrally formed of a transparent resin mixed with scattering agent particles that scatter and scatter light, and the scattering is performed under the same. The pattern sealing resin is formed by the precipitation of the agent particles to a high concentration, and the frame-shaped resin is formed by the low concentration of the scattering agent particles in the upper portion .

A light emitting device according to another embodiment of the present invention comprises a substrate comprising a metal substrate and a resin substrate fixed on the metal substrate and provided with a hole in a portion corresponding to a light emitting area, and a hole of the resin substrate A light emitting element mounted on the metal substrate, a wiring pattern provided around the hole of the resin substrate, and a peripheral surface sealing which reflects light and covers the edge and the inner circumferential surface of the hole of the resin substrate A resin sealing resin, a pattern sealing resin for reflecting the light and covering the wiring pattern, a transparent frame resin provided on the pattern sealing resin to surround the light emitting area, and provided inside the frame resin A sealing resin for sealing the light emitting element, and the pattern sealing resin and the frame-like resin are integrally formed of a transparent resin mixed with scattering agent particles for reflecting and scattering light , and the lower part thereof The scatterer particles are precipitated on the Turn the sealing resin is formed, the scattering agent particles in the upper is the frame-like resin is formed by a low concentration.

  In addition, the peripheral surface sealing resin in the light emitting device is provided to be inclined so as to rise from the upper surface of the metal substrate to the upper surface of the resin substrate. Further, the pattern sealing resin in the light emitting device is provided to be inclined such that the upper surface thereof is lifted from the inside to the outside.

Also, it puts that before Symbol periphery sealing resin to the light-emitting device is formed by a plurality of resin layers

Further, a transparent resin scattering agent particles are mixed to reflect scatter before Symbol light in this light emitting device, the pattern the sealing resin is formed by the scattering agent particles thereunder a high concentration to precipitate The frame-like resin is formed by the low concentration of the scattering agent particles in the upper part.

On the other hand, the method of manufacturing a light emitting device according to the present invention comprises the steps of mounting the light emitting element on a substrate provided with a wiring pattern around the light emitting area where the light emitting element is mounted, and a mask member surrounding the outer periphery of the wiring pattern. The step of mounting on the substrate, and covering the wiring pattern with a transparent resin mixed with scattering agent particles that scatter and scatter light, to surround the periphery of the light emitting area, and center axis perpendicular to the center of the light emitting area A process of applying spin coating to rotate the substrate as a center, and a pattern sealing resin for sealing the wiring pattern by separating and curing the scatterer particles in the transparent resin downward and separating it into upper and lower two layers And forming a frame-shaped resin surrounding the light-emitting area provided thereon, removing the mask member, and filling the sealing resin inside the frame-shaped resin to form the light-emitting element A step of sealing, is made of.

Further, the pattern sealing resin in the method of manufacturing a light emitting device is formed to be inclined such that the upper surface thereof is lifted from the inside to the outside at the time of spin coating .

  In the light emitting device of the present invention, since the wiring pattern is covered with the pattern sealing resin that reflects light, and the transparent frame resin is provided on the pattern sealing resin, the wiring pattern is reliably covered to reflect the light. Furthermore, light can be transmitted to the surroundings by transmitting through the frame-like resin. Thereby, the light extraction efficiency can be improved.

  In addition, even in the case of a substrate in which a resin substrate and a metal substrate in consideration of heat dissipation are overlapped, not only the wiring pattern surrounding the light emitting area provided with the light emitting element but also the edge of the hole of the resin substrate surrounding the light emitting area And by covering the inner peripheral surface with a peripheral surface sealing resin from which light is reflected, light from the light emitting element is prevented from transmitting through the resin substrate. Thereby, the light extraction efficiency in the upper irradiation direction can be improved.

  In addition, the peripheral surface sealing resin is provided so as to rise from the upper surface of the metal substrate toward the upper surface of the resin substrate, and the pattern sealing resin is such that the upper surface thereof is raised from the inside to the outside. Since it is provided in an inclined manner, light from the light emitting element can be reflected toward the upper irradiation direction.

  In addition, one or both of the pattern sealing resin and the frame-like resin are formed of a plurality of resin layers, and the peripheral surface sealing resin is formed of a plurality of resin layers. The length can be set finely and can be formed precisely. Furthermore, the upper surfaces of the pattern sealing resin and the peripheral surface sealing resin can be easily inclined.

  In addition, by covering the wiring pattern with a transparent resin mixed with scattering agent particles that scatter and scatter light, the scattering agent particles are precipitated at the lower portion thereof to have a high concentration, and the scattering agent particles at the upper portion have a low concentration. As a result, the pattern sealing resin and the frame-like resin can be collectively formed on the lower and upper portions of the integrally formed resin.

  Further, in the method of manufacturing a light emitting device according to the present invention, after the light emitting element is die-bonded to the substrate, an inner wall portion to be a part of peripheral surface sealing resin is formed around the light emitting area. The pattern sealing resin and the peripheral surface sealing resin are formed to cover the edge and the inner peripheral surface of the Accordingly, when forming the peripheral surface sealing resin, positioning is facilitated, and the resin can be prevented from entering the light emitting area.

  Further, in the method of manufacturing a light emitting device according to the present invention, spin coating is applied to cover the wiring pattern with a transparent resin mixed with scattering agent particles that scatter and scatter light and to rotate the substrate. Accordingly, the upper surface of the pattern sealing resin is formed to be inclined so as to rise from the inner side to the outer side, and light can be set to be reflected in the upper irradiation direction.

FIG. 1 is a perspective view showing a light emitting device according to a first embodiment of the present invention. It is sectional drawing of the light-emitting device shown in FIG. It is a principal part enlarged view of the light-emitting device shown in FIG. It is a perspective view which shows the light-emitting device which concerns on the 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device shown in FIG. It is a principal part enlarged view of the light-emitting device shown in FIG. It is a perspective view which shows only the board | substrate of the light-emitting device shown in FIG. It is sectional drawing of the board | substrate shown in FIG. It is a perspective view which shows the state which die-bonded the light emitting element to the board | substrate shown in FIG. It is sectional drawing of the board | substrate shown in FIG. It is a perspective view which shows the state which formed the inner wall part which becomes a part of surrounding surface sealing resin around the light emission area of the board | substrate shown in FIG. It is sectional drawing of the board | substrate shown in FIG. It is a perspective view which shows the state which wire-bonded the light emitting element in the state shown in FIG. 12, and a wiring pattern. It is sectional drawing of the board | substrate shown in FIG. It is a perspective view which shows the state which formed pattern sealing resin and peripheral surface sealing resin in the edge and inner surface of the wiring pattern in the state shown in FIG. 13, and a hole of a board | substrate. It is sectional drawing of the board | substrate shown in FIG. It is a perspective view which shows the state which formed frame-shaped resin on pattern sealing resin shown in FIG. FIG. 18 is a cross-sectional view of the substrate shown in FIG. It is sectional drawing which shows the board | substrate of the state which mounted the light emitting element in 1st Embodiment. FIG. 20 is a cross-sectional view showing a state where a mask member is attached around the light emitting area of the substrate in the state shown in FIG. 19; It is sectional drawing which shows the state which mounted the transparent resin in which the scattering particle was mixed on the wiring pattern in the state shown in FIG. FIG. 22 is a cross-sectional view showing a state where the substrate in the state shown in FIG. 21 is rotated. FIG. 23 is a cross-sectional view showing a state after the substrate in the state shown in FIG. 22 is rotated. FIG. 23 is a cross-sectional view showing a state in which the mask member shown in FIG. 22 is removed. It is sectional drawing which shows the state which provided the 1st resin layer on the wiring pattern of the board | substrate of the state which mounted the light emitting element in 1st Embodiment. It is sectional drawing which shows the state which provided the 2nd resin layer on the 1st resin layer shown in FIG. It is sectional drawing which shows the state which provided the 3rd resin layer on the 2nd resin layer shown in FIG. FIG. 28 is a cross-sectional view showing a state in which a fourth resin layer is provided on the third resin layer shown in FIG. 27.

  In the light emitting device 1 according to the first embodiment of the present invention shown in FIGS. 1 to 3, the plurality of light emitting elements 3 are mounted at the center of the substrate 2 made of ceramic or the like. A wiring pattern 4 formed by gold plating or the like is provided on the substrate 2 so as to surround the light emitting area 3A on which the light emitting element 3 is mounted (similar to the semicircular patterns shown in FIG. 7). The light emitting elements 3 are divided into several groups and connected in series between the wiring patterns 4 and 5 by the wires 6.

  On the wiring patterns 4 and 5, a pattern sealing resin 7 in which a pigment of a color that reflects white light or the like, a scattering agent particle that reflects and diffuses light, etc. is mixed in an epoxy resin, silicon resin, etc. Is provided. The pattern sealing resin 7 is provided along the wiring patterns 4 and 5, respectively, or in a series of rings.

  A frame-shaped resin 8 made of a transparent resin such as an epoxy resin or a silicon resin is provided on the pattern sealing resin 7. The frame-shaped resin 8 is formed in a ring shape surrounding the light emitting area 3A together with the pattern sealing resin 7.

  Inside the frame-shaped resin 8 is provided a sealing resin 9 made of a resin such as an epoxy resin containing a phosphor and a silicone resin. The light emitting element 3 and the wire 6 are sealed by the sealing resin 9.

  In the light emitting device 1 configured as described above, since the wiring patterns 4 and 5 are covered with the pattern sealing resin 7, the wiring patterns 4 and 5 do not absorb light. In addition, since the pattern sealing resin 7 reflects light, the light traveling toward the upper irradiation direction is increased, and the light extraction efficiency is improved by 1% as compared with the case where the pattern sealing resin 7 is not provided. It could be confirmed that Furthermore, by providing the transparent frame-shaped resin 8, the light also spreads in the outer peripheral direction, which is a preferable state for illumination requiring the spread of the light. And when transparent frame-like resin 8 was provided, compared with the case where a white frame was provided, it has confirmed that the extraction efficiency of light improved 0.4%. This is because in the case of a white frame, the light is reflected while being partially absorbed instead of being totally reflected, so the use of a transparent frame reduces the light absorption and improves the light extraction efficiency. doing.

  A light emitting device 11 according to a second embodiment of the present invention is shown in FIGS. 4 to 6. The substrate 12 in the light emitting device 11 is composed of a metal substrate 12A made of metal or alloy having high thermal conductivity and excellent heat dissipation, and a resin substrate 12B made of resin such as glass epoxy fixed on top of the metal substrate 12A. . The metal substrate 12A is formed of a rectangular plate, and a plurality of light emitting elements 13 are mounted at the center. Further, the resin substrate 12B has holes 12a in a portion corresponding to the light emitting area 13A on the metal substrate 12A in which the light emitting element 13 is mounted. Wiring patterns 14 and 15 are provided in the resin substrate 12A around the holes 12a.

  Like the light emitting element 3 of the light emitting device 1, the light emitting elements 13 are divided into several groups and connected in series between the wiring patterns 14 and 15 by wires 16. Similarly to the wiring patterns 4 and 5 of the light emitting device 1, the wiring patterns 14 and 15 are also formed in a semicircular shape or the like by gold plating or the like so as to surround the light emitting area 13A.

  Also on the wiring patterns 14 and 15 in the light emitting device 11, a pattern sealing resin 17 for reflecting light similar to the pattern sealing resin 7 of the light emitting device 1 is provided. The pattern sealing resin 17 is also provided along the wiring patterns 14 and 15, respectively, or in a series of rings. In addition, on the pattern sealing resin 17, a transparent frame-shaped resin 18 similar to the frame-shaped resin 8 of the light emitting device 1 is provided. The frame-shaped resin 18 is also formed annularly so as to surround the light emitting area 13A.

  Further, on the substrate 12 in the light emitting device 11, a peripheral surface sealing resin 20 and an inner wall portion 21 to be a part of the peripheral surface sealing resin 20 are provided. The peripheral surface sealing resin 20 covers the inner peripheral surface 12b of the hole 12a of the resin substrate 12B facing or adjacent to the light emitting area 13A and the edge 12c of the hole 12a. And the resin which reflects light. Further, the inner wall portion 21 is annularly provided along the inner peripheral surface 12b of the hole 12a so as to surround the light emitting area 13A on the metal substrate 12A. The inner wall portion 21 is provided inside the circumferential surface sealing resin 20, and the circumferential surface sealing resin 20 is provided between the inner wall portion 21 and the inner circumferential surface 12b and the edge 12c of the hole 12a. .

  The peripheral surface sealing resin 20 in the present embodiment includes an inner peripheral surface sealing portion 20a provided between the inner wall portion 21 and the inner peripheral surface 12b of the hole 12a, and the inner peripheral surface sealing portion 20a and the hole 12a. And an edge sealing portion 20b provided between the edge 12c and the edge 12c. The inner wall portion 21 is formed at a height of about the thickness of the resin substrate 12B, the inner peripheral surface sealing portion 20a is formed slightly higher than the inner wall portion 21, and the edge sealing portion 20b is an inner peripheral surface sealing portion 20a. It is formed slightly higher. Thus, the peripheral surface sealing resin 20 is formed to be inclined so as to rise from the upper surface of the metal substrate 12A to the upper surface of the resin substrate 12B. The inner wall portion 21 in the present embodiment is integrated with the circumferential surface sealing resin 20 to form a part thereof, and is formed of a resin that reflects the same light as the circumferential surface sealing resin 20.

  A transparent frame-shaped resin 18 similar to the frame-shaped resin 8 of the light emitting device 1 is provided on the pattern sealing resin 17 in the light emitting device 11 so as to surround the light emitting area 13A. In addition, a sealing resin 19 similar to the sealing resin 9 of the light emitting device 1 is provided also inside the framed resin 18 to seal the light emitting element 13 and the wire 16.

  In the light emitting device 11 having the above configuration, as in the light emitting device 1 described above, by providing the pattern sealing resin 17, the wiring patterns 14 and 15 no longer absorb light, and the pattern sealing resin 17 Can reflect the light and increase the light directed to the illumination direction. Furthermore, by providing the transparent frame-shaped resin 18, the light also spreads in the outer peripheral direction.

  Further, since the inner peripheral surface 12b and the edge 12c of the hole 12a of the resin substrate 12A facing or adjacent to the light emitting area 13A are covered with the peripheral surface sealing resin 20, the light from the light emitting element 13 is absorbed by the resin substrate 12A. Can be prevented. Furthermore, since the peripheral surface sealing resin 20 and the inner wall portion 21 reflect light, and the upper surfaces thereof are inclined so as to rise from the inner side to the outer side, the light from the light emitting element 13 is directed in the upper irradiation direction. reflect. Thus, as in the light emitting device 1 described above, the light extraction efficiency can be improved by the effect of providing the pattern sealing resin 17 and the frame-like resin 18.

  Next, a method of manufacturing the light emitting device 11 will be described based on FIGS. 7 to 18. As shown in FIGS. 7 and 8, the substrate 12 of the light emitting device 11 has a hole 12a that fits the light emitting area 13A in the metal substrate 12A provided with the light emitting area 13A in which the light emitting element is mounted at the center, and its edge The resin substrates 12B each having the wiring patterns 14 and 15 formed in a semicircular shape on top of each other are stacked and fixed.

  First, as shown in FIGS. 9 and 10, a plurality of light emitting elements 13 are mounted on a metal substrate 12A by die bonding.

  Thereafter, as shown in FIGS. 11 and 12, the inner wall 21 is formed on the metal substrate 12A along the inner peripheral surface 12b of the hole 12a of the resin substrate 12B so as to surround the light emitting element 13 by potting or the like.

  Here, as shown in FIG. 13 and FIG. 14, the light emitting element 13 is connected to the wiring patterns 14 and 15 by the wire 16 and the adjacent light emitting element 13 is connected. At this time, since the inner wall portion 21 is formed to have substantially the same height as the thickness of the resin substrate 12A, even if the wire 16 is stretched so as to jump over the inner wall portion 21, it is necessary to curve the wire 16 specially high. Absent. Accordingly, it is not necessary to form the frame-shaped resin 18 or the like to be formed particularly high thereafter, and the thickness of the light emitting device 11 does not increase.

  Thereafter, as shown in FIGS. 15 and 16, the pattern sealing resin 17 and the peripheral surface sealing resin 20 are formed in a ring shape by potting or the like. The pattern sealing resin 17 is provided in a series of rings on the wiring patterns 14 and 15 to cover the wiring patterns 14 and 15. In addition, the peripheral surface sealing resin 20 is provided with an inner peripheral surface sealing portion 20a between the inner wall portion 21 and the inner peripheral surface 12b of the hole 12a, and the inner peripheral surface sealing portion 20a and the edge 12c of the hole 12a And the edge sealing portion 20b. Thus, by sequentially stacking the inner wall portion 21, the inner peripheral surface sealing portion 20a, and the edge sealing portion 20b, the upper surface of the peripheral surface sealing resin 20 is directed from the upper surface of the metal substrate 12A toward the upper surface of the resin substrate 12B. It is inclined and formed to rise. When the peripheral surface sealing resin 20 is formed, the resin is dropped from above the wires 16 connecting the light emitting elements 13 to the wiring patterns 14 and 15 so as to be formed at predetermined positions.

  Thereafter, as shown in FIG. 17 and FIG. 18, the frame-shaped resin 18 is annularly formed on the pattern sealing resin 17. Then, the inside of the frame-shaped resin 18 is filled with the sealing resin 19 in which a fluorescent material or the like is mixed, whereby the light emitting device 11 shown in FIGS. 4 to 6 is completed.

  According to the above manufacturing method, by forming the peripheral surface sealing resin 20 after forming the inner wall portion 21, the peripheral surface sealing resin 20 can be accurately positioned with reference to the inner wall portion 21. In addition, when the peripheral surface sealing resin 20 is sequentially stacked and formed, the inner wall portion 21 can prevent the resin from flowing into the light emitting area 13A, and the yield of the product can be improved.

  Next, using the light emitting device 1 according to the first embodiment as an example, the pattern sealing resin 7 and the frame resin 8 are simultaneously formed, and the upper surface of the pattern sealing resin 7 is formed in an inclined state. This will be described based on FIG. 19 to FIG. After the light emitting element 3 is mounted on the substrate 2 as shown in FIG. 19, the mask member 22 is attached to the outer periphery of the wiring patterns 4 and 5 on the substrate 2 as shown in FIG.

  Here, as shown in FIG. 21, the wiring patterns 4 and 5 are covered with a resin 24 in which scatterer particles that reflect and diffuse light are mixed in an epoxy resin, a silicone resin or the like. As the scattering agent particles mixed at this time, those having a particle size in the order of μm are used. Then, as shown in FIG. 22, before the resin 24 is cured, the substrate 2 is rotated with an axis perpendicular to the center of the substrate 2 as the rotation axis 23.

  When the spin coating is applied, as shown in FIG. 23, the resin 24 is formed so that its upper surface is lifted from the inside to the outside by the centrifugal force. Further, at this time, the scattering agent particles are precipitated in the lower part of the resin 24 to become high concentration, thereby forming the pattern sealing resin 7 which reflects light, and the scattering agent particles in the upper part of the resin 24 become low concentration. Thus, a transparent frame-shaped resin 8 is formed. As a result, the upper surface of the pattern sealing resin 7 separated in the resin 24 is also formed to rise from the inside to the outside.

  Thereafter, as shown in FIG. 24, the mask member 22 is removed, and the inside of the frame-like resin 8 is filled with the sealing resin 9.

  As in the above manufacturing method, by mixing relatively large scattering agent particles, the particles are precipitated in the lower part of the resin 24 and separated vertically, and the pattern sealing resin 7 and the frame-like resin 8 are collectively formed. can do. Moreover, the top surface of the pattern sealing resin 7 can be easily inclined by spin coating.

  The step of collectively forming the pattern sealing resin and the frame-like resin is applicable to the light emitting device 11 in the second embodiment, and the pattern sealing resin 17 is formed together with the peripheral surface sealing resin 20. Instead, the pattern sealing resin 17 may be formed together with the frame-shaped resin 18.

  Next, with the light emitting device 1 according to the first embodiment as an example, a manufacturing method for forming the pattern sealing resin 7 and the frame-shaped resin 8 with a plurality of resin layers will be described based on FIGS. As shown in FIG. 25, after the light emitting element 3 is mounted on the substrate 2, the first resin layer 25 is annularly formed on the wiring patterns 4 and 5 to cover the wiring patterns 4 and 5. Thereafter, as shown in FIG. 26, the second resin layer 26 is annularly formed on the first resin layer 25 so that the diameter is slightly larger than that of the first resin layer 25. Then, as shown in FIG. 27, the third resin layer 27 is annularly formed on the second resin layer 26 so that the diameter is larger than that of the second resin layer 26, as shown in FIG. Then, the fourth resin layer 28 is annularly formed on the third resin layer 27 so that the diameter is larger than that of the third resin layer 27.

  As described above, when the first resin layer 25 to the fourth resin layer 28 are formed one on top of the other, by forming the resin layer little by little, the position and the shape can be formed with high accuracy, and furthermore, the stacked resin The upper surface of the layer can be formed to be inclined so as to rise from the inside to the outside. Therefore, for example, when the first resin layer 25 and the second resin layer 26 are formed of a resin that reflects light, the pattern sealing resin 7 that reflects the light from the light emitting element 3 upward can be formed. it can. At this time, if the third resin layer 27 and the fourth resin layer 28 are formed of a transparent resin, it is possible to form the frame-shaped resin 8 which transmits light outward.

  Note that the number of resin layers can be set appropriately, and as shown in FIG. 28, if the width of the resin layer to be overlaid is reduced, the resin layer can be easily overlapped without spreading outside. .

  Moreover, in the light emitting device 11 according to the second embodiment, the peripheral surface sealing resin 20 is already formed of a plurality of resin layers, but further, a plurality of the pattern sealing resin 17 and the frame resin 18 are provided as described above. It is also possible to form with a resin layer of

DESCRIPTION OF SYMBOLS 1, 11 light-emitting device 2, 12 board | substrate 3, 13 light-emitting element 3A, 13A light-emitting area 4, 5, 14, 15 wiring pattern 6, 16 wire 7, 17 pattern sealing resin 8, 18 frame-like resin 9, 19 sealing Resin 12A metal substrate 12B resin substrate 12a hole 12b inner circumferential surface 12c edge 20 circumferential surface sealing resin 20a inner circumferential surface sealing portion 20b edge sealing portion 21 inner wall portion 22 mask member 23 rotation shaft 24 resin 25 first resin layer 26 second resin layer 27 third resin layer 28 fourth resin layer

Claims (7)

A substrate,
A light emitting element mounted on the substrate;
A wiring pattern provided on the periphery of a light emitting area on which the light emitting element is mounted;
A pattern sealing resin that reflects light and covers the wiring pattern;
A transparent frame resin provided on the pattern sealing resin and surrounding the light emitting area;
And a sealing resin that is provided inside the frame-like resin to seal the light emitting element.
The pattern sealing resin and the frame-like resin are integrally formed of a transparent resin mixed with scattering agent particles for reflecting and scattering light, and the scattering agent particles are precipitated in the lower portion thereof to become a high concentration, thereby the pattern sealing resin is formed, the light-emitting device comprising that you the scattering agent particles in the upper is the frame-like resin is formed by a low concentration. A substrate comprising a metal substrate and a resin substrate fixed on the metal substrate and provided with a hole in a portion corresponding to the light emitting area;
A light emitting element mounted on the metal substrate in the hole of the resin substrate;
A wiring pattern provided around the hole of the resin substrate;
A peripheral surface sealing resin that reflects light and covers the edge and the inner peripheral surface of the hole of the resin substrate;
A pattern sealing resin that reflects light and covers the wiring pattern;
A transparent frame resin provided on the pattern sealing resin and surrounding the light emitting area;
And a sealing resin that is provided inside the frame-like resin to seal the light emitting element.
The pattern sealing resin and the frame-like resin are integrally formed of a transparent resin mixed with scattering agent particles for reflecting and scattering light, and the scattering agent particles are precipitated in the lower portion thereof to become a high concentration, thereby the pattern A light emitting device , wherein a sealing resin is formed, and the frame-like resin is formed by the concentration of the scattering agent particles in the upper portion being low .   The light emitting device according to claim 1 or 2, wherein the pattern sealing resin is provided to be inclined such that the upper surface thereof is lifted from the inner side to the outer side.   The light emitting device according to claim 2, wherein the peripheral surface sealing resin is provided so as to incline from the upper surface of the metal substrate to the upper surface of the resin substrate.   The light emitting device according to claim 2, wherein the peripheral surface sealing resin is formed of a plurality of resin layers. Mounting the light emitting element on a substrate provided with a wiring pattern around the light emitting area where the light emitting element is mounted;
Attaching a mask member surrounding the outer periphery of the wiring pattern on the substrate;
The light emitting area is surrounded by covering the wiring pattern with a transparent resin mixed with scattering agent particles that scatter and scatter light, and the substrate is rotated around a central axis perpendicular to the center of the light emitting area. A process of applying a coat,
A scattering resin particle in the transparent resin precipitates downward, separates into upper and lower layers, and hardens to seal the wiring pattern by sealing the wiring pattern and a frame-shaped resin surrounding the light emitting area provided thereon And forming the
Removing the mask member;
Filling the sealing resin inside the frame-shaped resin to seal the light emitting element;
A method of manufacturing a light emitting device, comprising: The method for manufacturing a light emitting device according to claim 6 , wherein the pattern sealing resin is formed to be inclined such that the upper surface thereof is lifted from the inner side at the time of spin coating.

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