WO2023282357A1

WO2023282357A1 - Light emission device

Info

Publication number: WO2023282357A1
Application number: PCT/JP2022/027159
Authority: WO
Inventors: 清一渡辺; 芳仁橘田; 雄一郎安藤; 克弥青嶋; 稜松浦; 洸己上野
Original assignee: シチズン電子株式会社; シチズン時計株式会社
Priority date: 2021-07-08
Filing date: 2022-07-08
Publication date: 2023-01-12
Also published as: JP7351041B2; JPWO2023282357A1; JP2023169275A

Abstract

This light emission device has: a substrate; a light emission element disposed on the upper surface of the substrate; a frame body, disposed on the upper surface of the substrate so as to surround the light emission element, for reflecting light from the light emission element; and, a sealing material that is disposed inside the frame body, includes a phosphor for emitting light obtained by converting the wavelength of light emitted from the light emission element, and seals the light emission element. The frame body has: a first frame section having a first inner peripheral curved surface that protrudes toward the light emission element; and, a second frame section having a second inner peripheral curved surface. The connecting section between the first frame section and the second frame section is disposed so as to be at the same height as the upper surface of the light emission element.

Description

light emitting device

The present disclosure relates to a light emitting device.

A light-emitting device is known in which a light-emitting element such as an LED (Light Emitting Diode) and electrodes and wiring for supplying power to the light-emitting element are mounted on a substrate and packaged. In such a light-emitting device, it is required to improve the light extraction efficiency from the light-emitting element.

Japanese Patent Application Laid-Open No. 2008-41290 discloses a light-emitting device in which a plurality of frames that reflect light from a light-emitting element are stacked on a substrate so as to surround the light-emitting element. It is described that the emitted light is reflected by the frame and extracted to the outside of the light emitting device.

It is desirable that as much light as possible be emitted from the light emitting surface of the light emitting device as uniformly as possible. Therefore, when the light emitting device is provided with a frame, part of the light emitted from the light emitting element is reflected by the frame. Light extraction efficiency may decrease.

Therefore, as described in Japanese Patent Application Laid-Open No. 2008-41290, it is conceivable to configure the frame with a plurality of curved surfaces. However, most of the light emitted from light emitting elements such as LEDs is emitted from the vicinity of the upper surface thereof. Therefore, if the reflective surface of the frame at approximately the same height as the top surface of the light emitting element is composed only of a uniform surface, even if the reflective surface of the frame is composed of a plurality of curved surfaces, light extraction is difficult. No significant improvement in efficiency was achieved.

The present disclosure has been made to solve the above-described problems, and the frame body is configured with a plurality of curved surfaces, and the connecting portion between the curved surfaces is substantially the same height as the upper surface of the light emitting element. An object of the present invention is to provide a light-emitting device capable of improving light extraction efficiency by arranging it.

A light-emitting device according to the present disclosure includes a substrate, a light-emitting element arranged on the upper surface of the substrate, a frame arranged on the upper surface of the substrate so as to surround the light-emitting element and reflecting light from the light-emitting element, and a frame. and a sealing material for sealing the light-emitting element, the frame including a phosphor arranged inside and emitting light whose wavelength is converted from the light emitted from the light-emitting element, wherein the frame is on the side of the light-emitting element. a first frame portion having a first inner peripheral curved surface that protrudes outward; and a second frame portion having a second inner peripheral curved surface; It is arranged so as to be the same height as the upper surface of the.

Further, in the light emitting device according to the present disclosure, it is preferable that the inclination angle of the first inner peripheral curved surface at the connecting portion is smaller than the inclination angle of the second inner peripheral curved surface at the connecting portion.

Further, in the light emitting device according to the present disclosure, the difference between the height of the connecting portion from the surface of the substrate and the height of the upper surface of the light emitting element from the surface of the substrate is ± the height of the upper surface of the light emitting element from the surface of the substrate. It is preferably 10% or less.

Further, in the light-emitting device according to the present disclosure, it is preferable that the distance from the light-emitting element to the connecting portion is 300 μm or less.

Further, in the light emitting device according to the present disclosure, it is preferable that the ratio of the height of the second frame portion to the distance from the light emitting element to the connection portion is 0.2 or more and 1.5 or less.

Further, in the light-emitting device according to the present disclosure, it is preferable that the second frame is formed thicker than the first frame and covers the upper portion and the outer peripheral surface of the first frame.

Further, in the light emitting device according to the present disclosure, the first frame portion and the second frame portion contain resin and titanium oxide, and the content of titanium oxide in the first frame portion and the second frame portion based on the resin is It is preferably 30 phr or more and 130 phr or less.

Further, the light-emitting device according to the present disclosure further includes a conductive wiring pattern arranged to be surrounded by the frame on the upper surface of the substrate and reflecting light from the light-emitting element, and the light-emitting element is located on the upper surface of the wiring pattern. It is preferable that the frame cover the outer periphery of the wiring pattern.

Further, in the light emitting device according to the present disclosure, the substrate has a rectangular planar shape, and the first wiring and the second wiring electrically connected to the light emitting element are arranged along the longitudinal direction of the substrate. It is preferable that the width of the frames arranged at both ends in the longitudinal direction is wider than the width of the frames arranged at both ends in the width direction of the substrate, and that the upper surface of the sealing material has a square planar shape. .

Further, in the light-emitting device according to the present disclosure, the separation distance between the tip of the first frame portion arranged in the longitudinal direction of the substrate and the light-emitting element is and the light emitting element.

Further, in the light emitting device according to the present disclosure, in the short direction of the substrate, the length obtained by adding the separation distance between the ends of the pair of first frame portions facing each other and the end portion of the substrate is It is preferably longer than the sum of the separation distance between the tip of one frame and the light emitting element.

Further, the light-emitting device according to the present disclosure includes a substrate on which a wiring pattern having a concave portion is arranged, a light-emitting element arranged on the upper surface of the substrate, and arranged on the upper surface of the substrate so as to surround the light-emitting element. a frame, and a sealing material that is disposed inside the frame and contains a phosphor that emits light obtained by converting the wavelength of light emitted from the light emitting element and that seals the light emitting element, The frame has at least a first frame portion having a first inner curved surface protruding toward the light emitting element and a second frame portion having a second inner curved surface, the first frame portion and the second frame portion is arranged so as to be at the same height as the upper surface of the light emitting element, the substrate has a rectangular planar shape, and the first wiring and the second wiring electrically connected to the light emitting element are on the substrate The width of the frames arranged along the longitudinal direction and arranged at both ends in the longitudinal direction of the substrate is wider than the width of the frames arranged at both ends in the transverse direction of the substrate, and the width of the frames arranged in the longitudinal direction of the substrate A pair of first frame portions are arranged to cover the recess.

The light emitting device according to the present disclosure makes it possible to improve light extraction efficiency.

1 is a plan view of a light emitting device according to a first embodiment; FIG. FIG. 2 is a cross-sectional view (part 1) of the light emitting device shown in FIG. 1; FIG. 2 is a cross-sectional view (part 2) of the light emitting device shown in FIG. 1; FIG. 3 is a diagram for explaining the relationship between the height of the connection portion shown in FIG. 2 and the height of the upper surface of the light emitting element; 3 is a diagram showing the relationship between the height of the connecting portion shown in FIG. 2 and the intensity of light emitted to the outside of the light emitting device shown in FIG. 1; FIG. 2 is a diagram for explaining a distance from the light emitting element shown in FIG. 1 to a connecting portion; FIG. It is a figure for demonstrating the height of the 2nd frame part shown in FIG. 2. It is a figure which shows the relationship between the height of the 2nd frame part shown in FIG. 2, and the intensity|strength of the light emitted to the exterior of the light-emitting device shown in FIG. 3 is a diagram for explaining the relationship between a first inner peripheral curved surface and a second inner peripheral curved surface in the connecting portion shown in FIG. 2; FIG. It is a figure for demonstrating the relationship between a 1st inner peripheral curved surface and a 2nd inner peripheral curved surface. (A) is a diagram showing the chromaticity uniformity of the light emitting device shown in FIG. 1, and (B) is a diagram showing the chromaticity uniformity of a comparative example. FIG. 2 is a flowchart showing an example of the flow of a method for manufacturing the light emitting device shown in FIG. 1; 1. It is a schematic diagram for demonstrating each process of the manufacturing method of the light-emitting device shown in FIG. FIG. 2 is a diagram for explaining the content of titanium oxide in the frame shown in FIG. 1; It is a top view of the light-emitting device which concerns on 2nd Embodiment. FIG. 16 is a cross-sectional view of the light emitting device shown in FIG. 15; It is a top view of the light-emitting device which concerns on 3rd Embodiment. FIG. 18 is a cross-sectional view of the light emitting device shown in FIG. 17 (No. 1); FIG. 18 is a cross-sectional view of the light emitting device shown in FIG. 17 (No. 2); It is a sectional view of a light-emitting device concerning a 4th embodiment. FIG. 11 is a plan view of a light emitting device according to a fifth embodiment; FIG. 22 is a cross-sectional view of the light emitting device shown in FIG. 21; FIG. 11 is a plan view of a light emitting device according to a sixth embodiment; FIG. 24 is a cross-sectional view of the light emitting device shown in FIG. 23; FIG. 21 is a plan view (part 1) of the light emitting device according to the seventh embodiment; FIG. 26 is a cross-sectional view (part 2) of the light emitting device shown in FIG. 25; FIG. 21 is a plan view of a light emitting device according to an eighth embodiment; FIG. 28 is a cross-sectional view (part 1) of the light emitting device shown in FIG. 27; FIG. 28 is a cross-sectional view (part 2) of the light emitting device shown in FIG. 27; FIG. 21 is a plan view of a light emitting device according to a ninth embodiment; 31 is a cross-sectional view (part 1) of the light emitting device shown in FIG. 30; FIG. FIG. 31 is a cross-sectional view (part 2) of the light emitting device shown in FIG. 30; It is a figure for demonstrating preferable arrangement|positioning of the short direction in the light-emitting device which concerns on embodiment. (a) is a diagram (part 1) showing the directivity when the separation distance between the tip of the first frame and the end of the light emitting element is changed, and (b) is the tip of the first frame; and the end of the light emitting element is a diagram (part 2) showing the directivity when changing the separation distance between the tip of the first frame and the end of the light emitting element FIG. 3D is a diagram (part 3) showing the directivity when the separation distance is changed, and (d) shows the directivity when the separation distance between the tip of the first frame and the end of the light emitting element is changed; is a diagram (part 4), and (e) is a diagram (part 5) showing the directivity when the separation distance between the tip of the first frame and the end of the light emitting element is changed, (f) is a diagram (part 6) showing the directivity when the separation distance between the tip of the first frame and the end of the light emitting element is changed, and (g) is the tip of the first frame; FIG. 11 is a diagram (No. 7) showing the directivity when the separation distance between the edge of the light emitting element is changed.

Various embodiments of the present disclosure will be described below with reference to the drawings. It should be noted that the technical scope of the present disclosure is not limited to these embodiments, but extends to the inventions recited in the claims and their equivalents.

1 is a plan view of the light emitting device according to the first embodiment, and FIGS. 2 and 3 are cross-sectional views of the light emitting device 1. FIG. 2 is a cross-sectional view along line II-II of FIG. 1, and FIG. 3 is a cross-sectional view along line III-III of FIG. 2 and 3 may be referred to as the upper side of the light emitting device 1, and the lower side may be referred to as the lower side of the light emitting device 1 hereinafter.

The light emitting device 1 has a substrate 11, a wiring pattern 12, an electrode 13, a single light emitting element 14, a frame 15 and a sealing material 16.

The substrate 11 is formed in a rectangular flat plate shape from an electrically insulating resin such as phenol resin, epoxy resin, polyimide resin or polyester resin. The thickness of the substrate 11 is, for example, 200 μm.

The wiring pattern 12 has flat plate-like first wiring 121 and second wiring 122 provided on the upper surface of the substrate 11 so as to be separated from each other. The first wiring 121 and the second wiring 122 have a rectangular planar shape and are made of silver. The first wiring 121 and the second wiring 122 have an area where bonding wires that can be electrically connected to the light emitting element 14 can be arranged by wire bonding processing. Also, the separation distance between the first wiring 121 and the second wiring 122 has a length equal to or greater than the insulation distance. The first wiring 121 and the second wiring 122 secure an area in which bonding wires can be arranged, and the first wiring 121 and the second wiring 122 are separated by an insulation distance or more. and a rectangular planar shape whose longitudinal direction is the arrangement direction of the second wirings 122 . In the example shown in FIGS. 1 and 2, the first wiring 121 and the second wiring 122 are arranged side by side along the longitudinal direction of the substrate 11 . The thickness of the first wiring 121 and the second wiring 122 is, for example, 50 μm. The wiring pattern 12 may be formed of other conductive material that reflects the light from the light emitting element 14, including gold, copper, or aluminum.

The electrode 13 has a first electrode 131 and a second electrode 132 provided on the lower surface of the substrate 11 and separated from each other. The first electrode 131 and the second electrode 132 are made of a conductor such as gold or copper. The first electrode 131 is electrically connected to the first wiring 121 through a through-hole (indicated by a broken line in FIG. 1) penetrating vertically through the substrate 11 . Similarly, the second electrode 132 is electrically connected to the second wiring 122 through a through-hole (indicated by a dashed line in FIG. 1) penetrating vertically through the substrate 11 . The first electrode 131 and the second electrode 132 are connected to an external power source (not shown) and used to supply power to the light emitting element 14 via the wiring pattern 12 .

The light emitting element 14 is fixed to the upper surface of the second wiring 122 by die bonding such as silver paste or solder, as shown in FIGS. The light-emitting element 14 is, for example, a blue LED made of an InGaN-based compound semiconductor that emits light with a wavelength of 440-455 nm. A pair of device electrodes are provided on the upper surface 141 of the light emitting device 14 , the first device electrode is connected to the first wiring 121 via the bonding wire 17 , and the second device electrode is connected to the second device electrode via the bonding wire 18 . It is connected to the wiring 122 .

The light emitting element 14 has, for example, a substantially rectangular parallelepiped shape with each side of 650 μm in length and width and 260 μm in height. The light emitting element 14 emits light when current is supplied between the first wiring 121 and the second wiring 122 from an external power supply. The light-emitting element 14 is not limited to a blue LED, but may be, for example, a violet LED or a near-ultraviolet LED, and its emission wavelength band may be within the range of about 200-440 nm including the ultraviolet region.

The frame 15 is arranged in a rectangular shape on the upper surface of the substrate 11 along the outer periphery of the substrate 11 so as to surround the light emitting element 14 and the first wiring 121 and the second wiring 122 . The frame 15 is a white resin formed by dispersing fine particles of titanium oxide (TiO ₂ ) in resin such as silicon resin or epoxy resin, and reflects light from the light emitting element 14 .

The frame 15 includes a first frame portion 151 having a first inner curved surface protruding toward the light emitting element 14 side, and a second inner curved surface connected to the upper portion of the first frame portion 151 and protruding toward the light emitting element 14 side. and a second frame portion 152 . That is, the frame body 15 has a shape in which the second frame portion 152 is stacked on the first frame portion 151 . A connecting portion 153 between the first frame portion 151 and the second frame portion 152 is arranged so as to have the same height as the upper surface 141 of the light emitting element 14 . When the height of the connecting portion 153 from the surface of the substrate 11 is ±10% or less of the height of the upper surface 141 of the light emitting element 14 from the surface of the substrate 11, the height of the connecting portion 153 and the upper surface 141 of the light emitting element 14 are equal. are assumed to be the same. In the examples shown in FIGS. 2 and 3, the first inner curved surface and the second inner curved surface each have a cross-sectional shape that is convex upward.

Also, the lateral width of the second frame portion 152 is smaller than the lateral width of the first frame portion 151 . That is, the second frame portion 152 is formed thinner than the first frame portion 151 . By forming the second frame portion 152 thinner than the first frame portion 151, the light emitting area of the light emitting device 1 (referring to the area of the upper surface of the encapsulant 16) is increased, and the light extraction efficiency of the light emitting device 1 is increased. improves.

The sealing material 16 is translucent resin such as epoxy resin or silicon resin. The sealing material 16 seals the light emitting element 14 by filling the region surrounded by the frame 15 to a height at least at which the upper surface 141 of the light emitting element 14 is not exposed. A phosphor that converts the wavelength of light emitted from the light emitting element 14 is mixed in the sealing material 16 . A yellow phosphor such as YAG (Yttrium Aluminum Garnet) is mixed in the sealing material 16 as such a phosphor. The light-emitting device 1 emits white light obtained by mixing blue light from the light-emitting element 14, which is a blue LED, and yellow light obtained by the blue light exciting a yellow phosphor. 1 to 3, the sealing material 16 is illustrated as being transparent, and the same applies hereinafter.

The yellow phosphor described above is an example, and the sealing material 16 may contain other phosphors. For example, the encapsulant 16 may contain two types of green phosphor and red phosphor. In this case, the light-emitting device 1 is a white light obtained by mixing blue light from the light-emitting element 14, which is a blue LED, with green light and red light obtained by exciting the green phosphor and the red phosphor with the blue light. emit light. As the green phosphor, a particulate phosphor material such as (BaSr) ₂ SiO ₄ :Eu ²⁺ that absorbs the blue light emitted by the light emitting element 14 and converts the wavelength into green light can be used. As the red phosphor, a particulate phosphor material such as CaAlSiN ₃ :Eu ²⁺ that absorbs the blue light emitted by the light emitting element 14 and converts the wavelength into red light can be used.

The above-described green phosphor and red phosphor are examples, and the sealing material 16 may be obtained by adding a small amount of green phosphor or a small amount of red phosphor to the above-described yellow phosphor. In this case, the light-emitting device 1 is based on white light obtained by mixing blue light from the light-emitting element 14, which is a blue LED, and yellow light obtained by exciting a yellow phosphor with the blue light. By mixing the excited green light and red light, it is possible to emit white light with improved color rendering, though not as much as the above combination.

As shown in FIG. 3, the light L1 emitted upward from the light emitting element 14 is transmitted through the sealing material 16 and emitted to the outside of the light emitting device 1 . The light L<b>2 emitted sideways from the vicinity of the upper surface 141 of the light emitting element 14 reaches the vicinity of the connecting portion 153 of the frame 15 . Since the inclination angle of the inner peripheral surface of the first frame portion 151 is small at the connection portion 153 , the light L2 is reflected upward by the first frame portion 151 and emitted to the outside of the light emitting device 1 . If the inclination angle of the inner peripheral surface of the frame 15 at the connecting portion 153 is large, the light emitted to the side from the light emitting element 14 is reflected in the direction of the opposing frame 15 rather than upward, and is reflected toward the opposing frame 15. The light is emitted to the outside of the light emitting device 1 while being repeatedly reflected a plurality of times between 15 . In this case, since the light is greatly attenuated by multiple reflections, the light extraction efficiency of the light emitting device 1 is lowered. In the frame 15 , the inclination angle of the inner peripheral surface of the first frame portion 151 at the connection portion 153 is formed to be small, so that the light emitted sideways from the light emitting element 14 is reflected once to the light emitting device 1 . Since the light is emitted to the outside, the light extraction efficiency is improved.

Further, most of the light emitted sideways from the light emitting element 14 is emitted from the vicinity of the upper surface 141 of the light emitting element 14 . In the frame 15, the connection portion 153 is positioned at the same height as the upper surface 141 of the light emitting element 14, so that most of the light emitted sideways from the light emitting element 14 is reflected outside the light emitting device 1 once. , the light extraction efficiency is further improved.

FIG. 4 is a diagram for explaining the relationship between the height of the connecting portion 153 and the height of the upper surface 141 of the light emitting element 14. FIG. FIG. 4 is a cross-sectional view in a cross-section similar to that of FIG. The height of the connection portion 153 means the height H1 of the connection portion 153 with respect to the upper surface of the wiring pattern 12, as shown in FIG. The height of the upper surface 141 of the light emitting element 14 means the height H2 of the upper surface 141 of the light emitting element 14 with respect to the upper surface of the wiring pattern 12, as shown in FIG.

FIG. 5 is a diagram showing the relationship between the height of the connecting portion 153 and the intensity of light emitted to the outside of the light emitting device 1. As shown in FIG. In the graph of FIG. 5, the horizontal axis is the height H1 of the connection portion 153 from the upper surface of the wiring pattern 12, and the vertical axis is the intensity ratio R of the light emitted to the outside of the light emitting device 1. FIG. The intensity ratio R is the intensity of light emitted to the outside of the light emitting device 1 when the height H2 of the connection portion 153 is 0 μm (that is, when the height of the connection portion 153 is equal to the height of the upper surface of the wiring pattern 12). is 100%. The data shown in the graph of FIG. 5 was acquired with the height H2 of the upper surface 141 of the light emitting element 14 set to 260 μm and the height of the frame 15 set to 460 μm. In FIG. 5, the height H2 of the upper surface 141 of the light emitting element 14 and the height of the frame 15 are indicated by dashed lines.

As shown in FIG. 5, the strength ratio R is 102% or more in the range where the height H1 is approximately 110 μm or more and 410 μm or less. That is, in the range where the difference between the height H1 of the connecting portion 153 and the height H2 of the upper surface 141 of the light emitting element 14 is 150 μm or less, the intensity of the light emitted to the outside of the light emitting device 1 is increased by 2% or more. , the light extraction efficiency is improved.

In addition, in the range where the height H1 is approximately 230 μm or more and 290 μm or less, the strength ratio R is further improved than in the range where the height H1 is approximately 110 μm or more and 410 μm or less. That is, when the difference between the height H1 of the connecting portion 153 and the height H2 of the upper surface 141 of the light emitting element 14 is in the range of ±10% of the height H1 of the connecting portion 153, the amount of light emitted to the outside of the light emitting device 1 is reduced. The intensity is further increased, and the light extraction efficiency is further improved.

FIG. 6 is a diagram for explaining the distance from the light emitting element 14 to the connecting portion 153. FIG. FIG. 6 is a cross-sectional view in a cross-section similar to that of FIG. The distance D from the light emitting element 14 to the connection portion 153 is the horizontal distance between the side surface of the light emitting element 14 facing the frame 15 and the connection portion 153, as shown in FIG. The distance D is preferably 300 μm or less, more preferably 200 μm or less. The smaller the distance D from the light emitting element 14 to the connecting portion 153 is, the smaller the amount of attenuation of the light emitted sideways from the light emitting element 14 until it reaches the connecting portion 153 . The intensity of the emitted light is increased, and the light extraction efficiency is further improved. Although the light emitting element 14 is arranged in the center of the frame 15 in the examples shown in FIGS. 1 to 3, the present invention is not limited to such an example. The light emitting element 14 is placed at an arbitrary position inside the frame 15 so that the distance D between at least one of the four side surfaces of the light emitting element 14 and the frame 15 facing the side is 300 μm or less. may be placed.

In addition, since the distance D from the light emitting element 14 to the connection portion 153 is set to 300 μm or less, the area filled with the sealing material 16 is reduced, so the required amount of the resin and phosphor is reduced, and the manufacturing cost is reduced. can be suppressed.

FIG. 7 is a diagram for explaining the height of the second frame portion 152. FIG. FIG. 7 is a cross-sectional view in a cross-section similar to that of FIG. The height of the second frame portion 152 refers to the height H3 of the top portion of the second frame portion 152 with respect to the height of the connection portion 153 .

FIG. 8 is a diagram showing the relationship between the height of the second frame portion 152 and the intensity of light emitted to the outside of the light emitting device 1. As shown in FIG. In the graph of FIG. 8, the horizontal axis represents the ratio H3/D of the height of the second frame portion 153 to the distance D from the light emitting element 14 to the connection portion 153, and the vertical axis represents the light emitted to the outside of the light emitting device 1. is the intensity ratio R of The data shown in FIG. 8 was obtained by changing the distance D from the light emitting element 14 to the connection in the range of 150 μm to 400 μm and appropriately changing the height of the second frame portion 152 . The intensity ratio R is the ratio of the intensity of light when the highest intensity of light among the data obtained by the above method is set to 100%.

As shown in FIG. 8, the strength ratio R is maximized when H3/D is 0.8, and the strength ratio R decreases as H3/D increases. Moreover, when H3/D is larger than 1.5, the intensity ratio R is below 95%. Therefore, by setting H3/D to 1.5 or less, the light extraction efficiency is improved. Also, when the height H3 of the second frame portion 153 is small, the upper surface of the light emitting element and the upper surface of the encapsulant 16 are close to each other. However, the phosphor of the sealing material 16 may not be sufficiently excited, and white light may not be obtained. Therefore, it is preferable to set H3/D to 0.2 or more.

FIG. 9 is a diagram for explaining the relationship between the first inner peripheral curved surface and the second inner peripheral curved surface in the connecting portion 153. FIG. The inclination angle θ1 shown in FIG. 9 is the inclination angle of the first inner peripheral curved surface of the connecting portion 153, that is, the angle formed between the substrate 11 and the tangential plane in contact with the inner peripheral curved surface of the first frame portion 151 at the connecting portion 153. . In addition, the inclination angle θ2 is the inclination angle of the second inner peripheral curved surface of the connecting portion 153 , that is, the angle formed between the substrate 11 and the tangential plane in contact with the inner peripheral curved surface of the second frame portion 152 in the connecting portion 153 .

As shown in FIG. 9, the tilt angle θ1 is smaller than the tilt angle θ2. In other words, the lower side of the connecting portion 153 has a gentler slope than the upper side of the connecting portion 153 . By making the lower slope of the connection portion 153 gentler than the upper slope of the connection portion 153, the light emitted from the upper surface 141 of the light emitting element 14 toward the lower side of the connection portion 153 is easily reflected upward. As a result, the light extraction efficiency of the light emitting device 1 is further improved.

FIG. 10 is a diagram for explaining the relationship between the first inner peripheral curved surface and the second inner peripheral curved surface. The inclination angle θ shown in FIG. 10 is the inclination angle of the tangential plane contacting the inner peripheral curved surface of the first frame portion 151 and the inner peripheral curved surface of the second frame portion 152, that is, the inner peripheral curved surface of the first frame portion 151 and the contact point. This is the angle formed by the substrate 11 and a plane that is in contact with the inner peripheral curved surface of the second frame portion 152 at P1 and in contact with the contact point P2. The inclination angle θ of the tangential plane that contacts the inner peripheral curved surface of the first frame portion 151 and the inner peripheral curved surface of the second frame portion 152 is preferably 40 degrees or more and 50 degrees or less, more preferably 45 degrees. preferable. By setting the inclination angle θ of the tangential plane to 40 degrees or more and 50 degrees or less, most of the light emitted in the horizontal direction from the light emitting element 14 is reflected vertically upward by the frame 15, so that the light from the light emitting device 1 is is improved, the spread of the luminous flux emitted from the light emitting device 1 to the outside is suppressed, and the optical characteristics of the light emitting device 1 are improved.

FIG. 11(A) is a diagram showing the chromaticity uniformity in the light emitting device 1, and FIG. 11(B) is a diagram showing the chromaticity uniformity in the comparative example. In the comparative example, in the light-emitting device 1, the inner peripheral surface of the frame 15 is a vertical surface instead of the inner peripheral curved surface protruding toward the light emitting element 14 side. In the graphs shown in FIGS. 11A and 11B, the horizontal axis represents the angle of the light emission direction with respect to the vertical direction in a short cross section (for example, a cross section along line III-III in FIG. 1). , the vertical axis indicates the chromaticity difference from the light emitted vertically upward. Chromaticity difference is the difference in chromaticity x in the CIE XYZ color space.

In FIG. 11(B), the chromaticity difference increases as the emission angle increases. That is, FIG. 11B shows that yellow rings are generated in the comparative example. On the other hand, in FIG. 11A, the chromaticity is almost uniform in the range of the emission angle from -40 degrees to +40 degrees, and even at -80 degrees or +80 degrees, the chromaticity difference is less than that of the comparative example. less than one-fifth. That is, FIG. 11A shows that the yellow ring is suppressed in the light emitting device 1 and light without color unevenness is emitted.

In the comparative example, the light emitted obliquely from the light emitting element 14 has a longer optical path length inside the encapsulant 16 than the light emitted vertically upward. Therefore, the light emitted in an oblique direction excites more phosphors before being emitted from the sealing material 16, and becomes yellowish than the light emitted vertically upward, resulting in yellow rings. . On the other hand, in the light emitting device 1 , part of the light emitted obliquely from the light emitting element 14 is reflected upward by the inner peripheral curved surface of the frame 15 . Therefore, the emission direction of the yellowish light is made uniform as a whole, so that the yellow ring is suppressed.

FIG. 12 is a flow chart showing an example of the flow of the method for manufacturing the light emitting device 1, and FIG. 13 is a schematic diagram for explaining each step of the method for manufacturing the light emitting device 1. FIG. A manufacturing method for manufacturing one light-emitting device 1 will be described below, but a plurality of light-emitting devices 1 may be manufactured simultaneously by the manufacturing method described below.

First, in the substrate/wiring preparation process, as shown in FIG. 13A, the substrate 11 on which the wiring pattern 12 and the electrodes 13 are arranged in advance is prepared (step S101). The wiring pattern 12 and the electrodes 13 are arranged at predetermined positions on the upper and lower surfaces of the substrate 11 by, for example, electroless silver plating, and are electrically connected to each other.

In the light-emitting element arrangement step, as shown in FIG. 13B, the light-emitting element 14 is arranged on the upper surface of the second wiring 122 (step S102). Further, in the light-emitting element placement step, the bonding wires 17 are arranged to connect the first element electrodes of the light-emitting elements 14 and the first wirings 121, and the bonding wires 18 are arranged to connect the second element electrodes of the light-emitting elements 14 and the second element electrodes. 2 wirings 122 are arranged to be connected to each other.

Next, in the frame arrangement step, as shown in FIG. 13C, the frame 15 is arranged on the upper surface of the substrate 11 so as to surround the wiring patterns 12 and the light emitting elements 14 (step S103). First, white resin droplets containing titanium oxide are prepared by dispersing fine particles of titanium oxide in droplets of thermosetting resin such as silicon resin. Subsequently, white resin droplets are applied to the upper surface of the substrate 11 so as to surround the wiring pattern 12, and the applied resin droplets are heated and cured to form the first frame portion 151. At this time, the inner peripheral surface of the first frame portion 151 becomes a curved surface due to the surface tension of the resin droplets. By pressing the upper surface of the first frame portion 151 during or after the first frame portion 151 is cured, the upper surface of the first frame portion 151 is flattened.

Subsequently, white resin droplets are further applied to the upper surface of the flat first frame portion 151, and the applied resin droplets are heated and cured to form the second frame portion 152. . At this time, the inner peripheral surface of the second frame portion 152 becomes a curved surface due to the surface tension of the resin droplets. Moreover, since the upper surface of the first frame portion 151 is formed flat, resin droplets are prevented from running down along the side surfaces of the first frame portion 151 . By pressing the upper surface of the second frame portion 152 during or after the second frame portion 152 is cured, the upper surface of the second frame portion 152 is flattened. Thus, the frame 15 is arranged on the upper surface of the substrate 11 . Since the frame 15 does not require molding or cutting to form the connecting portion 153, the frame 15 can be easily manufactured.

FIG. 14 is a diagram for explaining the content of titanium oxide in the frame 15. FIG. In the graph of FIG. 14, the horizontal axis represents the content m of titanium oxide based on the resin in the frame 15 as the mass of titanium oxide with respect to the mass of the resin 100, and the vertical axis represents the mass of the frame 15. is the reflectance S of . In FIG. 14, the solid line represents the data for the frame 15 with a thickness of 40 μm, the dashed line represents the data for the frame 15 having a thickness of 60 μm, and the one-dot chain line represents the data for the frame 15 having a thickness of 100 μm. ing.

As shown in FIG. 14, for any thickness, the reflectance S of the frame 15 is less than 10% when the content m of titanium oxide is 0 phr (that is, the resin alone). When m is 30 phr, the reflectance S is approximately 80% or more. On the other hand, the increase in reflectance S is less than 10% when the content of titanium oxide is increased from 30 phr to 130 phr. Also, although not shown, no significant increase in reflectance was confirmed when the content m of titanium oxide was increased above 130 phr. Therefore, in order to improve the reflectance of the frame 15, the content m of titanium oxide in the frame 15 based on the resin is preferably 30 phr or more and 130 phr or less.

As described above, when the first frame portion 151 and the second frame portion 152 are formed by applying resin droplets on the upper surface of the substrate 11, the width-to-height ratio of each frame portion is the same as that of the resin liquid. Determined by droplet viscosity. Therefore, the inclination angle θ shown in FIG. 10 is also generally determined by the viscosity of the resin droplet. The viscosity of the resin droplets changes according to the content of titanium oxide. When silicon resin is used as the resin and the content of titanium oxide is 60 phr, the ratio of the width to the height of the frame 15 is approximately 2:1, and the angle of inclination θ is 40 degrees or more and 50 degrees or less. preferable.

Returning to FIGS. 12 and 13, in the sealing material filling step, as shown in FIG. It is filled (step S104).

Finally, in the dicing step, as shown in FIG. 13E, the light emitting device 1 is manufactured by cutting the frame 15 and the substrate 11 into rectangular shapes along the frame 15 (step S105). . At this time, since the upper surface of the second frame portion 152 is formed flat, even if the cutting position is displaced, the height of the frame body 15 after cutting is not affected by this deviation, and light emission of uniform quality can be obtained. A device 1 is manufactured.

As described above, the light-emitting device 1 includes the light-emitting element 14 arranged on the upper surface of the substrate 11, and the frame member arranged on the upper surface of the substrate 11 so as to surround the light-emitting element 14 and reflecting the light from the light-emitting element 14. 15. In the frame 15, a first frame portion 151 having a first inner curved surface protruding toward the light emitting element side and a second inner curved surface connected to the upper portion of the first frame portion 151 and protruding toward the light emitting element side. A connecting portion 153 connected to the second frame portion 152 is positioned at the same height as the upper surface 141 of the light emitting element 14 . By setting the height of the connecting portion 153 to the same height as the upper surface 141 of the light emitting element 14, the light emitting device 1 can improve the light extraction efficiency.

In addition, in the light emitting device 1, the inclination angle of the first inner peripheral curved surface in the connection portion 153 is smaller than the inclination angle of the second inner peripheral curved surface in the connection portion 153, so that the light extraction efficiency of the light emitting device 1 is further improved. make it possible to

Further, in the light-emitting device 1, the difference between the height of the connecting portion 153 and the height of the upper surface 141 of the light-emitting element 14 is preferably 100 μm or less. By setting the difference between the height of the connection portion 153 and the height of the upper surface 141 of the light emitting element 14 to 100 μm or less, most of the light emitted sideways from the light emitting element 14 is reflected outside the light emitting device 1 once. Since the light is emitted, the light emitting device 1 can further improve the light extraction efficiency.

Further, in the light emitting device 1, the difference between the height H1 of the connecting portion 153 and the height H2 of the upper surface 141 of the light emitting element 14 is ±10% or less of the height H1 of the connecting portion 153, so that the light extraction efficiency is improved. can be further improved.

Also, in the light-emitting device 1, the distance from the light-emitting element 14 to the connecting portion 153 is preferably 300 μm or less. By setting the distance from the light emitting element 14 to the connection portion 153 to 300 μm or less, the optical path length of the light laterally emitted from the light emitting element 14 to the outside of the light emitting device 1 is shortened. 1 makes it possible to further improve the light extraction efficiency.

Further, in the light emitting device 1, the inclination angle of the tangential plane contacting the inner peripheral surface of the first frame portion 151 and the inner peripheral surface of the second frame portion 152 is preferably 40 degrees or more and 50 degrees or less. By setting the inclination angle of the tangential plane to 40 degrees or more and 50 degrees or less, the light emitted to the side from the light emitting device 1 is more likely to be reflected upward of the light emitting device 1, so that the light emitting device 1 can extract light. It makes it possible to improve the efficiency and improve the optical properties.

Further, in the light emitting device 1, the frame 15 contains resin and titanium oxide, and the content of titanium oxide with respect to the resin is 30 phr or more and 130 phr or less. By setting the content of titanium oxide in the resin to 30 phr or more and 130 phr or less, the reflectance of the frame 15 is improved, so that the light extraction efficiency of the light emitting device 1 can be further improved.

Also, in the light emitting device 1 , the second frame portion 152 is formed thinner than the first frame portion 151 . By forming the second frame portion 152 thinner than the first frame portion 151, the light emitting area of the light emitting device 1 is increased, so that the light extraction efficiency of the light emitting device 1 can be further improved.

In the above description, the frame 15 has the first frame portion 151 and the second frame portion 152, but it may further have a third frame portion connected to the upper portion of the second frame portion 152. In this case, either one of the connection portion 153 between the first frame portion 151 and the second frame portion 152 and the connection portion between the second frame portion 152 and the third frame portion is the same as the upper surface 141 of the light emitting element 14 . It should be placed at height. Moreover, the frame 15 may have a shape in which four or more frame portions are stacked. That is, the frame 15 should have at least the first frame portion 151 and the second frame portion 152 .

In the above description, the light emitting element 14 is arranged on the upper surface of the second wiring 122, but may be arranged on the upper surface of the first wiring 121. Alternatively, the light emitting element 14 may be arranged directly on the upper surface of the substrate 11 .

In the above description, the second frame portion 152 has the second inner curved surface protruding toward the light emitting element 14 side, but the inner peripheral surface of the second frame portion 152 may be formed flat. That is, only the inner peripheral surface of the first frame portion 151 may be a curved surface protruding toward the light emitting element 14 side. In this case also, the light emitted laterally from the upper surface 141 of the light emitting element 14 is reflected upward by the first inner curved surface, so that the light emitting device 1 can improve the light extraction efficiency.

In the above description, the frame 15 has a rectangular shape, but it is not limited to such an example, and the frame 15 may have any shape surrounding the light emitting element 14, such as a circular shape.

15 is a plan view of the light emitting device 2 according to the second embodiment, and FIG. 16 is a cross-sectional view of the light emitting device 2. FIG. 16 is a cross-sectional view along line XVI--XVI of FIG. 15. FIG. The light emitting device 2 differs from the light emitting device 1 in that it has a substrate 21 instead of the substrate 11 and a frame 25 instead of the frame 15 . In addition, the same code|symbol is attached|subjected to the structure similar to embodiment mentioned above, and description is abbreviate|omitted suitably.

The substrate 21 differs from the substrate 11 in that it is formed in a substantially square flat plate shape. The frame 25 is arranged on the upper surface of the substrate 21 along the outer circumference of the substrate 21 . By arranging the frame 25 along the outer periphery of the substrate 21, the inner periphery of the frame 25 also has a substantially square planar shape.

The light emitting element 14 is arranged on the upper surface of the second wiring 122 so as to be positioned in the center of the frame 25 . By arranging the light emitting element 14 on the upper surface of the second wiring 122 so as to be positioned in the center of the frame 25, the four side surfaces of the light emitting element 14 and the connecting portions 153 of the frame 25 facing the respective side surfaces are separated. are substantially equal to each other. All of the distances D1 to D4 are preferably 300 μm or less, more preferably 200 μm or less. By setting the distances D1 to D4 to 200 μm or less, the amount of attenuation of the light emitted in each direction from the light emitting element 14 until it reaches the connecting portion 153 is reduced. The intensity is increased, and the light emitting device 2 can further improve the light extraction efficiency.

17 is a plan view of the light emitting device 3 according to the third embodiment, and FIGS. 18 and 19 are sectional views of the light emitting device 3. FIG. 18 is a cross-sectional view along line XVIII-XVIII in FIG. 17, and FIG. 19 is a cross-sectional view along line XIX-XIX in FIG. The light-emitting device 3 differs from the light-emitting device 1 in that it has a frame 35 instead of the frame 15 .

The frame 35 is different from the frame 15 in that the inner periphery is arranged so as to be in contact with the outer periphery of the first wiring 121 and the second wiring 122 . That is, the frame 35 covers the entire area of the substrate 11 outside the wiring pattern 12 . The area outside the wiring pattern 12 refers to the area outside the rectangular or convex figure that includes the first wiring 121 and the second wiring 122 .

Since the substrate 11 is made of insulating resin, the resin deteriorates (soots) when exposed to light from the light emitting element 14 for a long period of time, and the frame may peel off from the substrate 11 . On the other hand, since the frame 35 reflects the light from the light emitting element 14, such deterioration is less likely to occur. In the substrate 11 , the entire area outside the first wiring 121 and the second wiring 122 is covered with the frame 35 , so that the deterioration range of the substrate 11 is reduced. It is possible to reduce the possibility of peeling off from the substrate 11 .

In addition, the frame 35 is in contact with the outer peripheries of the first wiring 121 and the second wiring 122 . Since the frame 3 is in contact with the outer periphery of the first wiring 121 and the second wiring 122, the distance from the light emitting element 14 to the connection portion 153 of the frame 35 is reduced, and the light is emitted sideways from the light emitting element 14. Since the amount of attenuation of the emitted light before it reaches the connecting portion 153 is small, the light emitting device 3 can further improve the light extraction efficiency.

FIG. 20 is a cross-sectional view of the light emitting device 4 according to the fourth embodiment. 20 is a cross-sectional view in the same cross-section as FIG. 19. FIG. The light-emitting device 4 differs from the light-emitting device 1 in that it has a frame 45 instead of the frame 15 .

The frame 45 is different from the frame 15 in that it is arranged so as to cover the outer peripheral portions of the first wiring 121 and the second wiring 122 . That is, like the frame 35, the frame 45 covers the entire region outside the first wiring 121 and the second wiring 122 of the substrate 11, and further covers the outer peripheral portions of the first wiring 121 and the second wiring 122. cover.

The first wiring 121 and the second wiring 122 are made of silver, reflect the light from the light emitting element 14 and emit it to the outside of the light emitting device 1 . Since the sulfide gas has a property of permeating resin, when the light emitting device is used in an environment where the sulfide gas exists, the sulfide gas passes through the sealing material 16 made of resin to form the first wiring 121 and the second wiring 122 . and degrades the first wiring 121 and the second wiring 122 . When the first wiring 121 and the second wiring 122 deteriorate, the reflectance of the light from the light emitting element 14 on the first wiring 121 and the second wiring 122 may be lowered, and the light extraction efficiency may be lowered.

In the light emitting device 4, the frame 45 covers the outer circumferences of the first wiring 121 and the second wiring 122, so that the light reaching the outer circumferences of the first wiring 121 and the second wiring 122 is affected by the sulfide gas. It is reflected by the frame 45 which is not there. Light that has reached the outer peripheral portions of the first wiring 121 and the second wiring 122 is reflected by the frame 45, so that the light emitting device 4 can suppress the degree of deterioration in light extraction efficiency due to the influence of the sulfide gas. do. The frame 45 is preferably formed so as to cover a range of 100 μm from the outer peripheries of the first wiring 121 and the second wiring 122 in order to further suppress the deterioration of the light extraction efficiency.

21 is a plan view of the light emitting device 5 according to the fifth embodiment, and FIG. 22 is a cross-sectional view of the light emitting device 5. FIG. 22 is a cross-sectional view taken along line XXII--XXII of FIG. 21. FIG. The light-emitting device 5 differs from the light-emitting device 1 in that it has a frame 55 instead of the frame 15 .

The frame body 55 has a first frame portion 551 , a second frame portion 552 connected to the upper portion of the first frame portion 551 , and a third frame portion 553 connected to the upper portion of the second frame portion 552 . The first frame portion 551 has a first inner curved surface protruding toward the light emitting element 14 side, the second frame portion 552 has a second inner curved surface protruding toward the light emitting element 14 side, and a third frame portion. 553 has a third inner curved surface protruding toward the light emitting element 14 side. The third frame portion 553 is formed thicker than the first frame portion 551 and the second frame portion 552, covers the upper surface of the second frame portion 552, and also covers the outer peripheral surfaces of the first frame portion 551 and the second frame portion 552. to cover.

At the connecting portion 554 between the first frame portion 551 and the second frame portion 552, the first frame portion 551 has an upwardly convex cross-sectional shape, and the second frame portion 552 has a downwardly convex cross-sectional shape. The first frame portion 551 has an upwardly convex cross-sectional shape and the second frame portion 552 has a downwardly convex cross-sectional shape. , the light emitting device 5 makes it possible to improve the light extraction efficiency.

Similarly, at a connection portion 555 between the second frame portion 552 and the third frame portion 553, the second frame portion 552 has an upwardly convex cross-sectional shape, and the third frame portion 553 has a downwardly convex cross-sectional shape. have. The first frame portion 551 has an upwardly convex cross-sectional shape and the second frame portion 552 has a downwardly convex cross-sectional shape. Therefore, the light emitting device 1 can improve the light extraction efficiency.

In addition, the connecting portion 555 between the second frame portion 552 and the third frame portion 553 is positioned at the same height as the top surface 141 of the light emitting element 14 . By positioning the connection portion 555 at the same height as the upper surface 141 of the light emitting element 14, most of the light emitted sideways from the light emitting element 14 is emitted to the outside of the light emitting device 1 by one reflection. , the light extraction efficiency is further improved. Instead of the connecting portion 555 , the connecting portion 554 between the first frame portion 551 and the second frame portion 552 may be arranged at the same height as the upper surface 141 of the light emitting element 14 .

It should be noted that the first frame portion 551 and the second frame portion 552 may be formed flat at the connecting portion 554 between the first frame portion 551 and the second frame portion 552 . That is, V-shaped or sawtooth-shaped grooves may be formed in the connecting portion 554 . In this case also, the light emitted sideways from the light emitting element 14 is reflected upward at the connecting portion 554, so that the light emitting device 5 can improve the light extraction efficiency. Similarly, a V-shaped or sawtooth-shaped groove may be formed at the connecting portion 555 between the second frame portion 552 and the third frame portion 553 .

23 is a plan view of the light emitting device 6 according to the sixth embodiment, and FIG. 24 is a cross-sectional view of the light emitting device 6. FIG. 24 is a cross-sectional view taken along line XXIV--XXIV of FIG. 22. FIG. The light emitting device 6 differs from the light emitting device 1 in that it has a substrate 61 instead of the substrate 11 and a frame 65 instead of the frame 15 .

The substrate 61 differs from the substrate 11 in that it has a plurality of recesses 611 (indicated by broken lines in FIG. 23) on the outer periphery of the upper surface. A plurality of recesses 611 are provided along a pair of opposing sides of the rectangular substrate 61 . The frame 65 differs from the frame 15 in that it has a plurality of protrusions 654 on the outer circumference of the lower surface. The plurality of protrusions 654 are provided at positions and shapes corresponding to the recesses 611 respectively. The frame 65 is fixed to the substrate 61 by fitting the protrusions 654 into the recesses 611 . By fixing the frame 65 to the substrate 61 , even if the resin forming the substrate 61 deteriorates (stains) as described above, the possibility of the frame 65 peeling off from the substrate 61 is reduced.

In the above description, the recesses 611 are provided along a pair of opposing sides of the rectangular substrate 61 , but the present invention is not limited to this example, and the recesses 611 are provided along each side of the substrate 61 . may be provided along only one side. Further, in the above description, a plurality of recesses 611 are provided along the side, but the present invention is not limited to such an example, and only one recess 611 extending from one end to the other end of one side is provided. may be provided.

25 is a plan view of the light emitting device 7 according to the seventh embodiment, and FIG. 26 is a cross-sectional view of the light emitting device 7. FIG. 26 is a cross-sectional view taken along line XXVI--XXVI of FIG. 25. FIG. The light emitting device 7 differs from the light emitting device 1 in that it has a substrate 71 instead of the substrate 11 and a frame 75 instead of the frame 15 .

The substrate 71 differs from the substrate 11 in that it has a plurality of recesses 711 (indicated by rectangular dashed lines in FIG. 25) on its upper surface. The plurality of recesses 711 extends along a pair of opposing sides of the rectangular substrate 71 and is provided along the inner periphery of the frame 75 . The frame 75 differs from the frame 15 in that it has a plurality of projections 754 on the inner periphery of the lower surface. The plurality of protrusions 754 are provided at positions and shapes corresponding to the recesses 711 respectively. The frame 75 is fixed to the substrate 71 by fitting the projections 754 into the recesses 711 . By fixing the frame 75 to the substrate 71 by fitting the projections 754 into the recesses 711, even if the resin forming the substrate 71 deteriorates (soots), the frame 75 can be removed, as in the case of the light emitting device 6. is detached from the substrate 71 is reduced. In addition, since the convex portion 754 is provided along the inner circumference of the frame 75 , the light emitted downward from the light emitting element 14 and transmitted through the substrate 71 is reflected by the convex portion 754 and is emitted from the side surface of the light emitting device 7 to the outside. will no longer leak into the

In the above description, the recesses 711 are provided along a pair of opposing sides of the rectangular substrate 61 , but the present invention is not limited to this example, and the recesses 711 are provided along each side of the substrate 71 . may be provided along only one side. Further, in the above description, the concave portion 711 is provided extending along the side, but the present invention is not limited to such an example, and a plurality of concave portions 711 may be provided along the side.

27 is a plan view of the light emitting device 8 according to the eighth embodiment, FIG. 28 is a cross-sectional view of the light emitting device 8 (No. 1), and FIG. 29 is a cross-sectional view of the light emitting device 8 (No. 2). 28 is a cross-sectional view along line XXVIII--XXVIII of FIG. 27, and FIG. 29 is a cross-sectional view along line XXIX--XXIX of FIG. The light-emitting device 8 differs from the light-emitting device 1 in that it has a frame 85 instead of the frame 15 .

The frame body 85 includes a first frame portion 851 having a first inner curved surface protruding toward the light emitting element 14 side, and a second inner curved surface connected to the upper portion of the first frame portion 851 and protruding toward the light emitting element 14 side. and a second frame portion 852 . Like the frame 15 , the frame 85 has a shape in which the second frame 852 is stacked on the first frame 851 . A connecting portion 853 between the first frame portion 851 and the second frame portion 852 is arranged so as to have the same height as the upper surface 141 of the light emitting element 14 . The first inner curved surface and the second inner curved surface each have an upwardly convex cross-sectional shape.

The first frame portion 851 and the second frame portion 852 are formed so that the width of the portions arranged at both ends in the longitudinal direction of the substrate 11 is wider than the width of the portions arranged at both ends in the width direction of the substrate 11. be done. The first frame portion 851 and the second frame portion 852 are arranged at both ends of the substrate 11 in the longitudinal direction because the width of both ends of the substrate 11 in the longitudinal direction is wider than the width of both ends of the substrate 11 in the lateral direction. The width of the body 85 is wider than the width of the frames 85 arranged at both ends of the substrate 11 in the short direction.

The distance DL between the upper end of the second inner peripheral curved surface of the second frame portion 852 arranged in the longitudinal direction and the upper end of the second inner peripheral curved surface of the second frame portion 852 arranged in the lateral direction is It is the same as the distance DS between the top edges. When the difference between the distance DL and the distance DS is ±10% or less of the distance DL, the distance DL is considered to be the same as the distance DS. Since the distance DL is the same as the distance DS, the shape of the upper surface of the sealing member 16, which is arranged so that the end portion is in contact with the upper end of the second inner peripheral curved surface of the second frame portion 852, is square when viewed from above. . The planar shape of the upper surface of the encapsulant 16, that is, the light emitting surface of the light emitting device 8 is square.

Since the light emitting surface of the light emitting device 8 has a rectangular planar shape, the light emitting device 8 functions as a point light source having the same directivity in the longitudinal direction and the lateral direction of the rectangular substrate 11 having sides extending in the longitudinal direction and the lateral direction. can function. The frame body 85 covers and protects the joint portion where the first wiring 121 and the bonding wire 17 are joined and the joint portion where the second wiring 122 and the bonding wire 18 are joined. Further, the frame 85 is arranged so as to cover the first wiring 121 and the second wiring 122 arranged above the through-hole. The first wiring 121 and the second wiring 122 arranged above the through-hole may be recessed more than other portions of the first wiring 121 and the second wiring 122 . In the light-emitting device 8, the frame 85 is arranged so as to cover the concave portions of the first wiring 121 and the second wiring 122 formed above the through holes. Phosphors are prevented from precipitating in the recesses. In the light-emitting device 8, since the phosphor does not precipitate in the recesses formed in the first wiring 121 and the second wiring 122, it is possible to prevent color unevenness caused by yellow light emitted from the phosphor deposited in the recesses. . In addition, in the light emitting device 8, the frame 85 is arranged so as to cover the concave portions formed in the first wiring 121 and the second wiring 122. Therefore, even if air bubbles are generated in the concave portions, the optical characteristics are unlikely to deteriorate. .

30 is a plan view of the light emitting device 9 according to the ninth embodiment, FIG. 31 is a cross-sectional view of the light emitting device 9 (No. 1), and FIG. 32 is a cross-sectional view of the light emitting device 9 (No. 2). 31 is a cross-sectional view along line XXXI--XXXI of FIG. 30, and FIG. 32 is a cross-sectional view along line XXXII--XXXII of FIG. The light emitting device 9 differs from the light emitting device 8 in that it has a frame 95 instead of the frame 85 .

The frame body 95 includes a first frame portion 951 having a first inner curved surface protruding toward the light emitting element 14 side, and a second inner curved surface connected to the upper portion of the first frame portion 951 and protruding toward the light emitting element 14 side. and a second frame portion 952 . Like the frame 85 , the frame 95 has a shape in which the second frame 952 is stacked on the first frame 951 . A connection portion 953 between the first frame portion 951 and the second frame portion 952 is arranged so as to have the same height as the upper surface 141 of the light emitting element 14 . The first inner curved surface and the second inner curved surface each have an upwardly convex cross-sectional shape.

As with the first frame portion 851 and the second frame portion 852 , the first frame portion 951 and the second frame portion 952 are arranged at both ends in the longitudinal direction of the substrate 11 so that the width of the portion is equal to the width of the substrate 11 in the lateral direction. It is formed so as to be wider than the width of the portions arranged at both ends. Since the width of both ends of the substrate 11 in the longitudinal direction is wider than the width of both ends of the substrate 11 in the lateral direction, the first frame portion 951 and the second frame portion 952 are arranged at both ends of the substrate 11 in the longitudinal direction. The width of the body 95 is wider than the width of the frame 95 arranged at both ends of the substrate 11 in the short direction.

The distance DL between the upper end of the second inner peripheral curved surface facing the second frame portion 952 arranged in the longitudinal direction is arranged in the lateral direction, similarly to the first frame portion 851 and the second frame portion 852. is the same as the distance DS between the upper ends of the second inner peripheral curved surfaces of the second frame portion 952 facing each other. Since the distance DL is the same as the distance DS, the shape of the upper surface of the sealing material 16, which is arranged so that the end portion is in contact with the upper end of the second inner peripheral curved surface of the second frame portion 952, is square when viewed from above. . The planar shape of the upper surface of the sealing material 16 , that is, the light emitting surface of the light emitting device 9 is square like the planar shape of the light emitting surface of the light emitting device 8 .

However, the distance DL1 between the tip of the first frame portion 951 arranged in the longitudinal direction and the light emitting element 14 is the distance between the tip of the first frame portion 951 arranged in the lateral direction and the light emitting element 14. longer than the separation distance DS1. Since the distance between the edge of the substrate 11 and the light emitting element 14 is relatively short and the surface of the substrate 11 is flat, the first frame portion 951 arranged in the lateral direction does not It is easy to control the separation distance from the light emitting element 14 . On the other hand, in the first frame portion 951 arranged in the longitudinal direction, the distance between the end portion of the substrate 11 and the light emitting element 14 is relatively long and the surface of the substrate 11 is uneven. It is not easy to control the distance between the tip of the light emitting element 14 and the light emitting element 14 .

In the light emitting device 9, the first frame portion 951 arranged in the longitudinal direction is arranged further away from the light emitting element 14 than the first frame portion 951 arranged in the lateral direction, so that the first frame portion 951 emits light. It is possible to reduce the risk of lowering the luminous efficiency of the light emitting device 9 due to contact with the element 14 .

In addition, in the light emitting device 9, by arranging the first frame portion 951 arranged in the longitudinal direction further away from the light emitting element 14 than the first frame portion 951 arranged in the lateral direction, the directivity in the longitudinal direction is reduced. can be made different from the directivity in the lateral direction.

In the light emitting device 9, the first frame portion 951 arranged in the longitudinal direction is arranged further away from the light emitting element 14 than the first frame portion 951 arranged in the lateral direction. The separation distances between the four sides of the light emitting element and the first frame may be different from each other. The directivity peak position of the emitted light can be displaced from the top of the light emitting element 14 by arranging the four sides of the light emitting element and the first frame portion with different separation distances.

Further, in the light emitting device according to the embodiment, the separation distance between the edge of the substrate and the tip of the first frame in the lateral direction is equal to the distance between the tip of the first frame and the edge of the light emitting element. It is preferably longer than the separation distance. In the light emitting device according to the embodiment, the length obtained by adding the separation distance between the ends of the pair of first frame portions facing each other and the end portion of the substrate in the short direction is the length of the pair of first frame portions facing each other. More preferably, it is longer than the sum of the distance between the tip and the edge of the light emitting element. Further, in the light emitting device according to the embodiment, the separation distance between the edge of the substrate and the tip of the first frame in the lateral direction is the same as the separation between the edge of the substrate and the tip of the second frame. It is preferably less than twice the distance.

FIG. 33 is a diagram for explaining a preferable layout in the short direction of the light emitting device according to the embodiment. FIG. 33 is a cross-sectional view corresponding to FIG.

In the light emitting device according to the embodiment, the separation distance W1L between the edge of the substrate 11 and the tip of the first frame 151 is the separation distance between the tip of the first frame 151 and the edge of the light emitting element 14. It is preferably longer than (WD-W1L). Further, in the light emitting device according to the embodiment, the separation distance W1R between the edge of the substrate 11 and the tip of the first frame 151 is equal to the distance between the tip of the first frame 151 and the edge of the light emitting element 14 It is preferably longer than the separation distance (WD-W1R).

In the light emitting device according to the embodiment, the length obtained by adding the separation distance between the ends of the pair of first frame portions 151 facing each other and the end portion of the substrate 11 is More preferably, it is longer than the sum of the separation distance from the edge of the light emitting element 14 . The length obtained by adding the separation distance between the tip of the pair of first frame portions 151 and the edge of the substrate 11 is represented by (W1L+W1R), and the tip of the pair of first frame portions 151 and the edge of the light emitting element 14 Since the length obtained by adding the distance between
(W1L+W1R)≧(2×WD-(W1L+W1R)) (1)
relationship is established. Since (2×WD) on the left side of equation (1) is expressed by (WS-WD) from the length (WS) of the substrate 11 in the lateral direction and the width (WE) of the light emitting element 14, equation (1) teeth,
(W1L+W1R)≧((WS-WD)-(W1L+W1R)) (2)
, the length obtained by adding the width (WS) of the substrate 11 in the lateral direction, the width (WE) of the light emitting element 14, and the separation distance between the tip of the pair of first frame portions 151 and the edge of the substrate 11 (W1L+W1R) is
2≧(WS−WD)/(W1L+W1R)
have a relationship with

In the light emitting device according to the embodiment, the separation distance W1L between the edge of the substrate 11 and the tip of the first frame 151 in the lateral direction is the distance between the edge of the substrate 11 and the tip of the second frame 152. It is preferable that the separation distance W2L between them is two times or less. Further, in the light emitting device according to the embodiment, the separation distance W1R between the edge of the substrate 11 and the tip of the first frame 151 in the lateral direction is It is preferably less than twice the separation distance W2R between. For example, when the width (WE) of the light emitting element 14 is twice or more the length (WS) of the substrate 11 in the lateral direction, WS≦2×WE, that is, when WD becomes smaller, both ends of the light emitting element 14 3, the light directed to the side from the light emitting element 14 can be suppressed from being transmitted through the first frame portion 151, the amount of light emitted from the light emitting device 1 can be maintained, and the directivity of the light can be narrowed. can be done.

FIGS. 34(a) to 34(g) are diagrams showing the directivity when the separation distance between the tip of the first frame portion 151 and the end portion of the light emitting element 14 is changed. In FIGS. 34(a) to 34(g), the horizontal axis indicates the angle and the vertical axis indicates the radiation intensity. The simulations shown in FIGS. 34(a)-34(g) were performed using Synopsys' LightTools as a simulator. 34(a) shows the directivity when the separation distance between the tip of the first frame 151 and the end of the light emitting element 14 is 80 μm, and FIG. 34(b) shows the tip of the first frame 151. FIG. and the edge of the light emitting element 14 is 180 μm. 34(c) shows the directivity when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 280 μm, and FIG. 34(d) shows the tip of the first frame portion 151. and the edge of the light emitting element 14 is 380 μm. FIG. 34(e) shows the directivity when the separation distance between the tip of the first frame 151 and the end of the light emitting element 14 is 480 μm, and FIG. 34(f) shows the tip of the first frame 151. and the edge of the light emitting element 14 is 580 μm. FIG. 34(g) shows the directivity when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 680 μm.

As shown in FIG. 34(a), when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 80 μm, the radiation intensity is 0° when the angle is ±25°. is within ±1% of the radiant intensity of the maximum. Also, the radiation intensity is within ±5% of the radiation intensity at 0° when the angle is ±35°, and a flat directivity of light is obtained. When the distance between the tip of the first frame portion 151 and the edge of the light emitting element 14 is 80 μm, the maximum radiation intensity increases by 1% from the radiation intensity at 0°. As shown in FIG. 34(b), when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 180 μm, the radiant intensity is 0° when the angle is ±25°. is within ±1% of the radiant intensity of the maximum. Also, the radiation intensity is within ±5% of the radiation intensity at 0° when the angle is ±35°, and a flat directivity of light is obtained. When the separation distance between the tip of the first frame portion 151 and the edge of the light emitting element 14 is 180 μm, the maximum radiation intensity increases by 1% from the radiation intensity at 0°. As shown in FIG. 34(c), when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 80 μm, the radiation intensity is maximized at ±25°. Also, the radiation intensity is within ±5% of the radiation intensity at 0° when the angle is ±40°, and flat directivity of light is obtained. When the distance between the tip of the first frame portion 151 and the edge of the light emitting element 14 is 280 μm, the maximum radiation intensity increases by 4% from the radiation intensity at 0°.

As shown in FIG. 34(d), when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 380 μm, the radiation intensity reaches its maximum at ±25° to ±30°. Become. When the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 380 μm, the maximum radiation intensity increases by 6% from the radiation intensity at 0°. As shown in FIG. 34(e), when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 480 μm, the radiant intensity is maximized at ±30°. When the separation distance between the tip of the first frame portion 151 and the edge of the light emitting element 14 is 840 μm, the maximum radiation intensity increases by 10% from the radiation intensity at 0°. As shown in FIG. 34(f), when the separation distance between the tip of the first frame portion 151 and the end of the light emitting element 14 is 580 μm, the radiant intensity is maximized at ±35°. When the separation distance between the tip of the first frame portion 151 and the edge of the light emitting element 14 is 580 μm, the maximum radiation intensity increases by 14% from the radiation intensity at 0°. As shown in FIG. 34(g), when the separation distance between the tip of the first frame 151 and the end of the light emitting element 14 is 680 μm, the radiation intensity is maximized at ±35°. When the distance between the tip of the first frame portion 151 and the edge of the light emitting element 14 is 680 μm, the maximum radiation intensity increases by 16% from the radiation intensity at 0°.

In a light-emitting device, if the maximum radiant intensity increases by 5% or more from the radiant intensity at 0°, variations in light output can be perceived, which is not preferable. In the embodiment shown in FIGS. 34(a) to 34(c), the maximum radiant intensity is less than 5 % of the radiant intensity at 0° and has good directivity. On the other hand, in the comparative examples shown in FIGS. 34(d) to 34(g), the maximum radiation intensity is 5 % or more of the radiation intensity at 0°, and does not have good directivity.

It should be understood that those skilled in the art can make various changes, substitutions and modifications to this without departing from the spirit and scope of the present invention. For example, the processing of each unit described above may be performed in a different order as appropriate within the scope of the present invention. Also, the above-described embodiments and modifications may be implemented in appropriate combinations within the scope of the present invention.

Claims

a substrate;
a light emitting element disposed on the upper surface of the substrate;
a frame disposed on the upper surface of the substrate so as to surround the light emitting element and reflecting light from the light emitting element;
a sealing material disposed inside the frame, containing a phosphor that emits light obtained by converting the wavelength of light emitted from the light emitting element, and sealing the light emitting element,
The frame has at least a first frame portion having a first inner peripheral curved surface protruding toward the light emitting element and a second frame portion having a second inner peripheral curved surface,
The connecting portion between the first frame portion and the second frame portion is arranged so as to be at the same height as the upper surface of the light emitting element,
A light-emitting device characterized by:
The inclination angle of the first inner peripheral curved surface at the connecting portion is smaller than the inclination angle of the second inner peripheral curved surface at the connecting portion,
A light-emitting device according to claim 1 .
The difference between the height of the connection portion from the surface of the substrate and the height of the upper surface of the light emitting element from the surface of the substrate is ±10% or less of the height of the upper surface of the light emitting element from the surface of the substrate. be,
The light-emitting device according to claim 1 or 2.
The distance from the light emitting element to the connection part is 300 μm or less,
A light-emitting device according to any one of claims 1-3.
A ratio of the height of the second frame portion to the distance from the light emitting element to the connection portion is 0.2 or more and 1.5 or less.
A light-emitting device according to any one of claims 1-4.
The second frame is formed thicker than the first frame and covers the upper part and the outer peripheral surface of the first frame.
A light emitting device according to any one of claims 1-5.
The first frame and the second frame contain resin and titanium oxide,
In the first frame portion and the second frame portion, the content of the titanium oxide based on the resin is 30 phr or more and 130 phr or less.
A light emitting device according to any one of claims 1-6.
further comprising a conductive wiring pattern disposed on the upper surface of the substrate so as to be surrounded by the frame and reflecting light from the light emitting element;
The light emitting element is arranged on the upper surface of the wiring pattern,
The frame covers the outer periphery of the wiring pattern,
A light emitting device according to any one of claims 1-7.
the substrate has a rectangular planar shape, and first wiring and second wiring electrically connected to the light emitting element are arranged along the longitudinal direction of the substrate;
the width of the frames arranged at both ends in the longitudinal direction of the substrate is wider than the width of the frames arranged at both ends in the width direction of the substrate;
The upper surface of the sealing material has a square planar shape,
A light emitting device according to any one of claims 1-8.
The separation distance between the tip of the first frame portion arranged in the longitudinal direction of the substrate and the light emitting element is the distance between the tip of the first frame portion arranged in the width direction of the substrate and the light emitting element. 10. A light-emitting device according to claim 9, wherein the distance between is greater than the separation between.
In the lateral direction of the substrate, the length obtained by adding the distance between the ends of the pair of first frame portions facing each other and the end portion of the substrate is equal to the distance between the tips of the pair of first frame portions facing each other 11. The light-emitting device according to claim 1, wherein the length is longer than the sum of the separation distance from the light-emitting element.
a substrate on which a wiring pattern having a concave portion is arranged;
a light emitting element disposed on the upper surface of the substrate;
a frame arranged on the upper surface of the substrate so as to surround the light emitting element;
a sealing material disposed inside the frame, containing a phosphor that emits light obtained by converting the wavelength of light emitted from the light emitting element, and sealing the light emitting element,
The frame has at least a first frame portion having a first inner peripheral curved surface protruding toward the light emitting element and a second frame portion having a second inner peripheral curved surface,
a connection portion between the first frame portion and the second frame portion is arranged so as to have the same height as the upper surface of the light emitting element;
the substrate has a rectangular planar shape, and first wiring and second wiring electrically connected to the light emitting element are arranged along the longitudinal direction of the substrate;
the width of the frames arranged at both ends in the longitudinal direction of the substrate is wider than the width of the frames arranged at both ends in the width direction of the substrate;
A light emitting device, wherein the pair of first frame portions arranged in the longitudinal direction of the substrate are arranged so as to cover the concave portion.