JP2016115897A - Light-emitting device and method of manufacturing the same - Google Patents

Light-emitting device and method of manufacturing the same Download PDF

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JP2016115897A
JP2016115897A JP2014255780A JP2014255780A JP2016115897A JP 2016115897 A JP2016115897 A JP 2016115897A JP 2014255780 A JP2014255780 A JP 2014255780A JP 2014255780 A JP2014255780 A JP 2014255780A JP 2016115897 A JP2016115897 A JP 2016115897A
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resin
light emitting
light
substrate
sealing resin
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JP6541963B2 (en
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加藤　達也
Tatsuya Kato
達也 加藤
福田　匡広
Masahiro Fukuda
福田　　匡広
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

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Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device having improved light extraction efficiency, by obtaining spread of light while preventing light absorption of a wiring pattern, and the like.SOLUTION: In a light-emitting device, wiring patterns 4, 5 are covered with a pattern sealing resin 7, and a transparent frame-like resin 8 is provided on the pattern sealing resin 7. Consequently, light is reflected by covering the wiring patterns 4, 5 reliably, and spread to the surroundings by transmitting the frame-like resin 8. In the case of a substrate where a resin substrate and a metal substrate are superimposed, the edge and inner peripheral surface of a hole in the resin substrate is covered with a peripheral surface sealing resin. Consequently, the light from a light-emitting is prevented from transmitting through the resin substrate.SELECTED DRAWING: Figure 2

Description

本発明は、光の取り出し効率を向上させた発光装置に関するものであり、特に照明用の発光装置及びその製造方法に関するものである。   The present invention relates to a light emitting device with improved light extraction efficiency, and more particularly to a light emitting device for illumination and a method for manufacturing the same.

従来、発光ダイオード等の発光素子を用いた照明用の発光装置では、基板上に実装された発光素子を枠状の樹脂で囲い、発光素子を封止する封止樹脂を枠状の樹脂内に充填していた。このような発光装置では、基板上に設けられた配線パターン、枠状の樹脂、封止樹脂等によって発光素子が発する光が吸収され、光の取り出し効率を低下させることがあった。   Conventionally, in a light emitting device for illumination using a light emitting element such as a light emitting diode, a light emitting element mounted on a substrate is surrounded by a frame-shaped resin, and a sealing resin for sealing the light emitting element is contained in the frame-shaped resin. It was filling. In such a light-emitting device, the light emitted from the light-emitting element is absorbed by the wiring pattern, the frame-shaped resin, the sealing resin, and the like provided on the substrate, which may reduce the light extraction efficiency.

そこで、発光素子を囲うように樹脂を１段又は数段積み上げて形成した反射体を設けて、発光素子からの光を基板の上方へ導くように構成した照明装置が提案されている（例えば、特許文献１参照）。   Therefore, there has been proposed an illuminating device configured to provide a reflector formed by stacking one or several stages of resin so as to surround the light emitting element, and to guide light from the light emitting element to above the substrate (for example, Patent Document 1).

また、基板上の導体配線とワイヤーの一部を光反射樹脂内に埋設した発光装置も提案されている（例えば、特許文献２参照）。   In addition, a light emitting device in which a part of conductor wiring and a wire on a substrate is embedded in a light reflecting resin has been proposed (for example, see Patent Document 2).

更に、発光素子を囲う枠部を透明な樹脂に光拡散材を混入した樹脂で形成した光源装置も提案されている（例えば、特許文献３参照）。   Furthermore, a light source device has also been proposed in which a frame portion surrounding a light emitting element is formed of a resin in which a light diffusing material is mixed into a transparent resin (see, for example, Patent Document 3).

特開２００８−４１２９０号公報JP 2008-41290 A 特開２００９−１６４１５７号公報JP 2009-164157 A 特開２０１３−１９７３６９号公報JP 2013-197369 A

上記特許文献１の照明装置では、反射体により基板上の電極が完全に覆われていないため、電極部分の光の吸収を防ぐことができなかった。また、特許文献２の発光装置では、導体配線を光反射樹脂で覆っているが、高い枠状の光反射樹脂で発光素子を囲っているため、光の広がりがなくなり、照明用の発光装置としては改善が必要であった。更に、特許文献３の光源装置では、枠部が光を透過して光の広がりを得られるものの、配線パターン等による光の吸収を防ぐことはできないものであった。   In the illuminating device of the said patent document 1, since the electrode on a board | substrate is not completely covered with the reflector, absorption of the light of an electrode part was not prevented. In the light emitting device of Patent Document 2, the conductor wiring is covered with the light reflecting resin. However, since the light emitting element is surrounded by the high frame-shaped light reflecting resin, the light does not spread and the light emitting device for illumination is used. Needed improvement. Further, in the light source device of Patent Document 3, although the frame portion transmits light and the spread of the light can be obtained, the light absorption by the wiring pattern or the like cannot be prevented.

本発明が解決しようとする課題は、上記従来技術の問題点を解決し、配線パターン等の光の吸収を防ぎながら光の広がりを得ることで、光の取り出し効率を高めた発光装置及びその製造方法を提供することにある。   The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art and to obtain a light spread while preventing light absorption of wiring patterns and the like, and a light emitting device with improved light extraction efficiency and its manufacture It is to provide a method.

本発明の一の実施形態に係る発光装置は、基板と、該基板上に実装された発光素子と、前記基板上における前記発光素子が実装されている発光エリアの周囲に設けられた配線パターンと、光を反射し、前記配線パターンを覆うパターン封止樹脂と、該パターン封止樹脂上に設けられて前記発光エリアを囲う透明な枠状樹脂と、該枠状樹脂の内側に設けられて前記発光素子を封止する封止樹脂と、を備えている。   A light emitting device according to an embodiment of the present invention includes a substrate, a light emitting element mounted on the substrate, and a wiring pattern provided around a light emitting area on which the light emitting element is mounted. A pattern sealing resin that reflects light and covers the wiring pattern, a transparent frame-shaped resin that is provided on the pattern sealing resin and surrounds the light-emitting area, and is provided on the inner side of the frame-shaped resin. Sealing resin for sealing the light emitting element.

また、本発明の他の実施形態に係る発光装置は、金属基板と該金属基板上に固着され発光エリアに対応する部分に孔が設けられた樹脂基板とからなる基板と、前記樹脂基板の孔内の前記金属基板上に実装された発光素子と、前記樹脂基板の孔の周囲に設けられた配線パターンと、光を反射し、前記樹脂基板の孔の縁及び内周面を覆う周面封止樹脂と、光を反射し、前記配線パターンを覆うパターン封止樹脂と、該パターン封止樹脂上に設けられて前記発光エリアを囲う透明な枠状樹脂と、該枠状樹脂の内側に設けられて前記発光素子を封止する封止樹脂と、を備えている。   Further, a light emitting device according to another embodiment of the present invention includes a substrate comprising a metal substrate and a resin substrate fixed on the metal substrate and provided with a hole in a portion corresponding to the light emitting area, and a hole in the resin substrate. A light emitting device mounted on the metal substrate, a wiring pattern provided around the hole of the resin substrate, and a peripheral surface seal that reflects light and covers an edge and an inner peripheral surface of the hole of the resin substrate A stop resin, a pattern sealing resin that reflects light and covers the wiring pattern, a transparent frame-shaped resin that is provided on the pattern sealing resin and surrounds the light emitting area, and is provided inside the frame-shaped resin And a sealing resin for sealing the light emitting element.

また、この発光装置における前記周面封止樹脂は、前記金属基板の上面から前記樹脂基板の上面に向かってせり上がるように傾斜して設けられている。また、前記発光装置における前記パターン封止樹脂は、その上面が内側から外側に向かってせり上がるように傾斜して設けられている。   Further, the peripheral surface sealing resin in the light emitting device is provided to be inclined so as to rise from the upper surface of the metal substrate toward the upper surface of the resin substrate. Further, the pattern sealing resin in the light emitting device is provided so as to be inclined so that the upper surface thereof rises from the inside toward the outside.

また、この発光装置における前記パターン封止樹脂と枠状樹脂は、その一方又は両方が複数の樹脂層により形成されている。また、この発光装置における前記周面封止樹脂は、複数の樹脂層により形成されている。   One or both of the pattern sealing resin and the frame-shaped resin in the light emitting device are formed of a plurality of resin layers. Further, the peripheral surface sealing resin in the light emitting device is formed of a plurality of resin layers.

また、この発光装置における前記パターン封止樹脂と枠状樹脂は、光を反射散乱する散乱剤粒子が混入された透明な樹脂で一体形成され、その下部に前記散乱剤粒子が沈殿して高濃度となることで前記パターン封止樹脂が形成され、上部における前記散乱剤粒子が低濃度となることで前記枠状樹脂が形成されている。   In addition, the pattern sealing resin and the frame-shaped resin in this light emitting device are integrally formed of a transparent resin mixed with scattering agent particles that reflect and scatter light, and the scattering agent particles are precipitated at a lower portion thereof to form a high concentration. As a result, the pattern sealing resin is formed, and the scatterer particles in the upper part have a low concentration, whereby the frame-shaped resin is formed.

一方、本発明の発光装置の製造方法は、発光素子が実装される金属基板と、該金属基板上に固着され、前記発光素子が実装されている発光エリアに対応する部分に孔を有し且つ該孔の周囲に配線パターンが設けられた樹脂基板とからなる基板上に前記発光素子をダイボンドする工程と、前記発光エリアの周囲に光を反射する周面封止樹脂の一部となる内壁部を形成する工程と、前記発光素子と前記配線パターンをワイヤーボンドする工程と、前記配線パターンを覆うパターン封止樹脂と、前記孔の縁及び内周面を覆い前記内壁部に連なる前記周面封止樹脂とを形成する工程と、前記パターン封止樹脂の上に透明な枠状樹脂を形成する工程と、前記枠状樹脂の内側に充填されて前記発光素子を封止する封止樹脂を形成する工程と、からなるものである。   On the other hand, the manufacturing method of the light-emitting device of the present invention includes a metal substrate on which a light-emitting element is mounted, a hole fixed to the metal substrate and corresponding to a light-emitting area on which the light-emitting element is mounted, and A step of die-bonding the light-emitting element on a substrate comprising a resin substrate provided with a wiring pattern around the hole, and an inner wall portion that is a part of a peripheral surface sealing resin that reflects light around the light-emitting area A step of wire bonding the light emitting element and the wiring pattern, a pattern sealing resin that covers the wiring pattern, and the peripheral surface sealing that covers the edge and inner peripheral surface of the hole and that is continuous with the inner wall portion. Forming a stop resin, forming a transparent frame resin on the pattern sealing resin, and forming a sealing resin that fills the frame resin and seals the light emitting element And a process consisting of A.

また、本発明の発光装置の製造方法は、発光素子が実装される発光エリアの周囲に配線パターンが設けられた基板上に発光素子を実装する工程と、前記配線パターンの外周を囲うマスク部材を前記基板上に取り付ける工程と、光を反射散乱する散乱剤粒子が混入された透明な樹脂で前記配線パターンを覆うことで前記発光エリアの周囲を囲い、前記発光エリアの中央に垂直な中心軸を中心として前記基板を回転させるスピンコートを施す工程と、前記透明な樹脂内の散乱剤粒子が下方に沈殿して上下２層に分離し硬化することで前記配線パターンを封止するパターン封止樹脂とその上に設けられる前記発光エリアを囲う枠状樹脂とを形成する工程と、前記マスク部材を除去する工程と、前記枠状樹脂の内側に封止樹脂を充填して前記発光素子を封止する工程と、からなるものでもある。この発光装置の製造方法における前記パターン封止樹脂は、スピンコート時にその上面が内側から外側に向かってせり上がるように傾斜して形成されている。   The method of manufacturing a light emitting device according to the present invention includes a step of mounting a light emitting element on a substrate provided with a wiring pattern around a light emitting area on which the light emitting element is mounted, and a mask member surrounding the outer periphery of the wiring pattern. A step of mounting on the substrate, and surrounding the light emitting area by covering the wiring pattern with a transparent resin mixed with scattering agent particles that reflect and scatter light, and a central axis perpendicular to the center of the light emitting area A step of applying a spin coat to rotate the substrate as a center, and a pattern sealing resin that seals the wiring pattern by scattering particles in the transparent resin to settle downward and separating into two upper and lower layers and curing And a step of forming a frame-shaped resin surrounding the light-emitting area provided thereon, a step of removing the mask member, and a sealing resin inside the frame-shaped resin to fill the light-emitting element A step of sealing, even those made from some. The pattern sealing resin in the method for manufacturing the light emitting device is formed so as to be inclined so that the upper surface rises from the inside toward the outside during spin coating.

本発明の発光装置では、光を反射するパターン封止樹脂で配線パターンを覆い、透明な枠状樹脂をパターン封止樹脂の上に設けているので、配線パターンを確実に覆って光を反射させ、更に枠状樹脂を透過して光が周囲に広がるようにすることができる。これにより、光の取り出し効率を向上させることができる。   In the light emitting device of the present invention, the wiring pattern is covered with the pattern sealing resin that reflects light, and the transparent frame-shaped resin is provided on the pattern sealing resin, so that the wiring pattern is reliably covered to reflect the light. Further, the light can spread through the frame-shaped resin. Thereby, the light extraction efficiency can be improved.

また、放熱性を考慮した樹脂基板と金属基板とを重ねた基板の場合であっても、発光素子が設けられた発光エリアを囲う配線パターンだけでなく、発光エリアを囲う樹脂基板の孔の縁及び内周面を光が反射する周面封止樹脂で覆うことにより、発光素子からの光が樹脂基板を透過することを防いでいる。これにより、上方の照射方向への光取り出し効率を向上させることができる。   In addition, even in the case of a substrate in which a resin substrate and a metal substrate are stacked in consideration of heat dissipation, not only the wiring pattern surrounding the light emitting area where the light emitting element is provided, but also the edge of the hole in the resin substrate surrounding the light emitting area. And by covering the inner peripheral surface with a peripheral surface sealing resin that reflects light, the light from the light emitting element is prevented from passing through the resin substrate. Thereby, the light extraction efficiency in the upper irradiation direction can be improved.

また、周面封止樹脂は、金属基板の上面から樹脂基板の上面に向かってせり上がるように傾斜して設けられ、パターン封止樹脂は、その上面が内側から外側に向かってせり上がるように傾斜して設けられているので、発光素子からの光を上方の照射方向に向かって反射することができる。   Further, the peripheral surface sealing resin is provided to be inclined so as to rise from the upper surface of the metal substrate toward the upper surface of the resin substrate, and the pattern sealing resin is so formed that the upper surface thereof rises from the inside toward the outside. Since it is provided with an inclination, the light from the light emitting element can be reflected in the upward irradiation direction.

また、パターン封止樹脂と枠状樹脂は、その一方又は両方が複数の樹脂層により形成され、周面封止樹脂は、複数の樹脂層により形成されているので、それらを形成する位置や高さを細かく設定することができ、精度よく形成することができる。更に、パターン封止樹脂や周面封止樹脂の上面を容易に傾斜させて形成することもできる。   In addition, one or both of the pattern sealing resin and the frame-shaped resin are formed by a plurality of resin layers, and the peripheral surface sealing resin is formed by a plurality of resin layers. The thickness can be set finely and can be formed with high accuracy. Furthermore, the upper surface of the pattern sealing resin or the peripheral surface sealing resin can be easily inclined.

また、光を反射散乱する散乱剤粒子が混入された透明な樹脂で配線パターンを覆うことにより、その下部に散乱剤粒子が沈殿して高濃度となり、上部における散乱剤粒子が低濃度となる。これにより、一体に形成された樹脂の下部と上部にパターン封止樹脂と枠状樹脂を一括して形成することができる。   Further, by covering the wiring pattern with a transparent resin mixed with scattering agent particles that reflect and scatter light, the scattering agent particles are precipitated at a lower portion to have a high concentration, and the scattering agent particles at the upper portion have a low concentration. Thereby, pattern sealing resin and frame-shaped resin can be collectively formed in the lower part and upper part of resin integrally formed.

また、本発明の発光装置の製造方法では、発光素子を基板にダイボンドした後、周面封止樹脂の一部となる内壁部を発光エリアの周囲に形成し、その後、配線パターンと基板の孔の縁及び内周面を覆うパターン封止樹脂と周面封止樹脂を形成している。これにより、周面封止樹脂を形成する際に、位置決めが容易となり、また、樹脂が発光エリア内に入り込むことを防ぐことができる。   Further, in the method for manufacturing a light emitting device of the present invention, after the light emitting element is die-bonded to the substrate, an inner wall portion that becomes a part of the peripheral surface sealing resin is formed around the light emitting area, and then the wiring pattern and the hole of the substrate are formed. A pattern sealing resin and a peripheral surface sealing resin are formed to cover the edges and the inner peripheral surface. Thereby, when forming the peripheral surface sealing resin, positioning becomes easy, and it is possible to prevent the resin from entering the light emitting area.

また、本発明の発光装置の製造方法では、光を反射散乱する散乱剤粒子が混入された透明な樹脂で配線パターンを覆うと共に基板を回転させるスピンコートを施している。これにより、パターン封止樹脂の上面が内側から外側に向かってせり上がるように傾斜して形成され、光を上方の照射方向へ反射するように設定することができる。   Further, in the method for manufacturing a light emitting device of the present invention, spin coating is performed in which the wiring pattern is covered with a transparent resin mixed with scattering agent particles that reflect and scatter light and the substrate is rotated. Accordingly, the upper surface of the pattern sealing resin is formed to be inclined so as to rise from the inner side toward the outer side, and the light can be set to be reflected in the upper irradiation direction.

本発明の第１の実施形態に係る発光装置を示す斜視図である。1 is a perspective view showing a light emitting device according to a first embodiment of the present invention. 図１に示す発光装置の断面図である。It is sectional drawing of the light-emitting device shown in FIG. 図２に示す発光装置の要部拡大図である。It is a principal part enlarged view of the light-emitting device shown in FIG. 本発明の第２の実施形態に係る発光装置を示す斜視図である。It is a perspective view which shows the light-emitting device which concerns on the 2nd Embodiment of this invention. 図４に示す発光装置の断面図である。It is sectional drawing of the light-emitting device shown in FIG. 図５に示す発光装置の要部拡大図である。It is a principal part enlarged view of the light-emitting device shown in FIG. 図４に示す発光装置の基板のみを示す斜視図である。It is a perspective view which shows only the board | substrate of the light-emitting device shown in FIG. 図７に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図７に示す基板に発光素子をダイボンドした状態を示す斜視図である。It is a perspective view which shows the state which carried out the die bonding of the light emitting element to the board | substrate shown in FIG. 図９に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図９に示す基板の発光エリアの周囲に周面封止樹脂の一部となる内壁部を形成した状態を示す斜視図である。It is a perspective view which shows the state which formed the inner wall part used as a part of peripheral surface sealing resin around the light emission area of the board | substrate shown in FIG. 図１１に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図１２に示す状態にある発光素子と配線パターンをワイヤーボンドした状態を示す斜視図である。It is a perspective view which shows the state which wire-bonded the light emitting element and wiring pattern in the state shown in FIG. 図１３に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図１３に示す状態にある配線パターンと基板の孔の縁及び内面にパターン封止樹脂と周面封止樹脂を形成した状態を示す斜視図である。It is a perspective view which shows the state which formed the pattern sealing resin and peripheral surface sealing resin in the edge and inner surface of the wiring pattern in the state shown in FIG. 13, and the board | substrate hole. 図１５に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 図１５に示すパターン封止樹脂の上に枠状樹脂を形成した状態を示す斜視図である。It is a perspective view which shows the state which formed frame-shaped resin on the pattern sealing resin shown in FIG. 図１７に示す基板の断面図である。It is sectional drawing of the board | substrate shown in FIG. 第１の実施形態において発光素子を実装した状態の基板を示す断面図である。It is sectional drawing which shows the board | substrate of the state which mounted the light emitting element in 1st Embodiment. 図１９に示す状態にある基板の発光エリアの周囲にマスク部材を取り付けた状態を示す断面図である。It is sectional drawing which shows the state which attached the mask member around the light emission area of the board | substrate in the state shown in FIG. 図２０に示す状態にある配線パターンの上に散乱剤粒子が混入された透明な樹脂を載せた状態を示す断面図である。FIG. 21 is a cross-sectional view showing a state in which a transparent resin mixed with scattering agent particles is placed on the wiring pattern in the state shown in FIG. 20. 図２１に示す状態にある基板を回転させる状態を示す断面図である。It is sectional drawing which shows the state which rotates the board | substrate in the state shown in FIG. 図２２に示す状態にある基板を回転させた後の状態を示す断面図である。It is sectional drawing which shows the state after rotating the board | substrate in the state shown in FIG. 図２２に示すマスク部材を取り除いた状態を示す断面図である。It is sectional drawing which shows the state which removed the mask member shown in FIG. 第１の実施形態において発光素子を実装した状態の基板の配線パターンの上に第１の樹脂層を設けた状態を示す断面図である。It is sectional drawing which shows the state which provided the 1st resin layer on the wiring pattern of the board | substrate of the state which mounted the light emitting element in 1st Embodiment. 図２５に示す第１の樹脂層の上に第２の樹脂層を設けた状態を示す断面図である。It is sectional drawing which shows the state which provided the 2nd resin layer on the 1st resin layer shown in FIG. 図２６に示す第２の樹脂層の上に第３の樹脂層を設けた状態を示す断面図である。It is sectional drawing which shows the state which provided the 3rd resin layer on the 2nd resin layer shown in FIG. 図２７に示す第３の樹脂層の上に第４の樹脂層を設けた状態を示す断面図である。It is sectional drawing which shows the state which provided the 4th resin layer on the 3rd resin layer shown in FIG.

図１乃至図３に示す本発明の第１の実施形態に係る発光装置１では、セラミック等の基板２の中央に複数の発光素子３が実装されている。基板２には、発光素子３が実装されている発光エリア３Ａを囲むように金メッキ等で形成される配線パターン４が（図７に示すそれぞれ半円形のパターンと同様に）設けられている。発光素子３は幾つかのグループに分かれて配線パターン４，５間に直列にワイヤー６で接続されている。   In the light emitting device 1 according to the first embodiment of the present invention shown in FIGS. 1 to 3, a plurality of light emitting elements 3 are mounted in the center of a substrate 2 made of ceramic or the like. A wiring pattern 4 formed by gold plating or the like is provided on the substrate 2 so as to surround the light emitting area 3A on which the light emitting element 3 is mounted (similar to each semicircular pattern shown in FIG. 7). The light emitting elements 3 are divided into several groups and connected in series between the wiring patterns 4 and 5 by wires 6.

配線パターン４，５の上には、それらを覆うように、白色光等を反射する色の顔料や光を反射拡散する散乱剤粒子等をエポキシ樹脂、シリコン樹脂等に混入したパターン封止樹脂７が設けられている。なお、このパターン封止樹脂７は、配線パターン４，５に沿ってそれぞれ設けられるか、又は一連の環状をなすように設けられている。   On the wiring patterns 4 and 5, a pattern sealing resin 7 in which a pigment of a color that reflects white light or the like, a scattering agent particle that reflects and diffuses light, or the like is mixed in an epoxy resin or a silicon resin so as to cover them. Is provided. The pattern sealing resin 7 is provided along the wiring patterns 4 and 5, or is provided so as to form a series of rings.

このパターン封止樹脂７の上には、エポキシ樹脂、シリコン樹脂等の透明な樹脂からなる枠状樹脂８が設けられている。この枠状樹脂８は、パターン封止樹脂７と共に、発光エリア３Ａを囲う環状に形成されている。   On the pattern sealing resin 7, a frame-shaped resin 8 made of a transparent resin such as an epoxy resin or a silicon resin is provided. The frame-shaped resin 8 is formed in an annular shape surrounding the light emitting area 3 </ b> A together with the pattern sealing resin 7.

枠状樹脂８の内側には、蛍光体を含有するエポキシ樹脂、シリコン樹脂等の樹脂からなる封止樹脂９が設けられている。この封止樹脂９により発光素子３とワイヤー６は封止されている。   Inside the frame-shaped resin 8, a sealing resin 9 made of a resin such as an epoxy resin or a silicon resin containing a phosphor is provided. The light emitting element 3 and the wire 6 are sealed by the sealing resin 9.

上記構成からなる発光装置１では、配線パターン４，５をパターン封止樹脂７で覆っているので、配線パターン４，５が光を吸収することがなくなる。また、パターン封止樹脂７が光を反射するので、上方の照射方向へ向かう光が増加することになり、パターン封止樹脂７を設けなかった場合に比べて、光の取り出し効率が１％向上することが確認できた。さらに、透明な枠状樹脂８を設けることで、光が外周方向にも広がり、光の広がりを必要とする照明として好ましい状態になる。そして、透明な枠状樹脂８を設けると、白色の枠を設けた場合に比べて、光の取り出し効率が０．４％向上することが確認できた。これは、白色の枠の場合、光を全て反射するのではなく一部吸収しながら反射するため、透明な枠を使用した方が光の吸収が減り、光の取り出し効率が向上することに起因している。   In the light emitting device 1 having the above configuration, since the wiring patterns 4 and 5 are covered with the pattern sealing resin 7, the wiring patterns 4 and 5 do not absorb light. In addition, since the pattern sealing resin 7 reflects light, the light toward the upper irradiation direction increases, and the light extraction efficiency is improved by 1% compared to the case where the pattern sealing resin 7 is not provided. I was able to confirm. Furthermore, by providing the transparent frame-shaped resin 8, the light spreads in the outer peripheral direction, which is a preferable state for illumination that requires the spread of light. It was confirmed that when the transparent frame-shaped resin 8 was provided, the light extraction efficiency was improved by 0.4% compared to the case where the white frame was provided. This is because, in the case of a white frame, the light is not reflected but reflected while partially absorbing, so the use of a transparent frame reduces the light absorption and improves the light extraction efficiency. doing.

図４乃至図６には本発明の第２の実施形態に係る発光装置１１が示されている。この発光装置１１における基板１２は、熱伝導率が高く放熱性に優れた金属、合金からなる金属基板１２Ａと、その上に重ねて固着されたガラスエポキシ等の樹脂からなる樹脂基板１２Ｂとからなる。金属基板１２Ａは矩形状の板からなり、中央に複数の発光素子１３が実装されている。また、樹脂基板１２Ｂは、金属基板１２Ａにおける発光素子１３が実装された発光エリア１３Ａに対応する部分に孔１２ａを有している。この樹脂基板１２Ａには、孔１２ａの周囲に配線パターン１４，１５が設けられている。   4 to 6 show a light emitting device 11 according to a second embodiment of the present invention. The substrate 12 in the light emitting device 11 includes a metal substrate 12A made of a metal or alloy having high heat conductivity and excellent heat dissipation, and a resin substrate 12B made of a resin such as glass epoxy that is stacked and fixed thereon. . The metal substrate 12A is a rectangular plate, and a plurality of light emitting elements 13 are mounted in the center. The resin substrate 12B has a hole 12a in a portion corresponding to the light emitting area 13A on which the light emitting element 13 is mounted on the metal substrate 12A. The resin substrate 12A is provided with wiring patterns 14 and 15 around the hole 12a.

発光素子１３は、発光装置１の発光素子３と同様に、幾つかのグループに分かれて配線パターン１４，１５間に直列にワイヤー１６で接続されている。また、配線パターン１４，１５も、発光装置１の配線パターン４，５と同様に、発光エリア１３Ａを囲むように金メッキ等でそれぞれ半円形等に形成されている。   Like the light emitting element 3 of the light emitting device 1, the light emitting element 13 is divided into several groups and connected in series between the wiring patterns 14 and 15 by a wire 16. Similarly to the wiring patterns 4 and 5 of the light emitting device 1, the wiring patterns 14 and 15 are also formed in a semicircular shape or the like by gold plating or the like so as to surround the light emitting area 13A.

この発光装置１１における配線パターン１４，１５の上にも、発光装置１のパターン封止樹脂７と同様の、光を反射するパターン封止樹脂１７が設けられている。このパターン封止樹脂１７も、配線パターン１４，１５に沿ってそれぞれ設けられるか、又は一連の環状をなすように設けられている。また、このパターン封止樹脂１７の上には、発光装置１の枠状樹脂８と同様の、透明な枠状樹脂１８が設けられている。この枠状樹脂１８も、発光エリア１３Ａを囲うように環状に形成されている。   Similar to the pattern sealing resin 7 of the light emitting device 1, a pattern sealing resin 17 that reflects light is also provided on the wiring patterns 14 and 15 in the light emitting device 11. The pattern sealing resin 17 is also provided along the wiring patterns 14 and 15, respectively, or is provided so as to form a series of rings. A transparent frame-shaped resin 18 similar to the frame-shaped resin 8 of the light emitting device 1 is provided on the pattern sealing resin 17. The frame-shaped resin 18 is also formed in an annular shape so as to surround the light emitting area 13A.

この発光装置１１における基板１２上には、さらに、周面封止樹脂２０とその一部となる内壁部２１が設けられている。この周面封止樹脂２０は、発光エリア１３Ａに面する又は隣接する樹脂基板１２Ｂの孔１２ａの内周面１２ｂと、孔１２ａの縁１２ｃを覆うものであり、パターン封止樹脂１７と同様に、光を反射する樹脂からなるものである。また、内壁部２１は、金属基板１２Ａ上における発光エリア１３Ａを囲うように孔１２ａの内周面１２ｂに沿って環状に設けられている。この内壁部２１は、周面封止樹脂２０の内側に設けられており、この内壁部２１と孔１２ａの内周面１２ｂ及び縁１２ｃとの間に周面封止樹脂２０が設けられている。   On the substrate 12 in the light emitting device 11, a peripheral surface sealing resin 20 and an inner wall portion 21 as a part thereof are further provided. The peripheral surface sealing resin 20 covers the inner peripheral surface 12b of the hole 12a of the resin substrate 12B facing or adjacent to the light emitting area 13A and the edge 12c of the hole 12a. It is made of a resin that reflects light. Further, the inner wall portion 21 is provided in an annular shape along the inner peripheral surface 12b of the hole 12a so as to surround the light emitting area 13A on the metal substrate 12A. The inner wall portion 21 is provided inside the peripheral surface sealing resin 20, and the peripheral surface sealing resin 20 is provided between the inner wall portion 21 and the inner peripheral surface 12b and the edge 12c of the hole 12a. .

本実施形態における周面封止樹脂２０は、内壁部２１と孔１２ａの内周面１２ｂとの間に設けられる内周面封止部２０ａと、この内周面封止部２０ａと孔１２ａの縁１２ｃとの間に設けられる縁封止部２０ｂとから構成されている。内壁部２１は樹脂基板１２Ｂの厚み程度の高さに形成されており、内周面封止部２０ａは内壁部２１よりわずかに高く形成され、縁封止部２０ｂは内周面封止部２０ａよりわずかに高く形成されている。これにより、周面封止樹脂２０は金属基板１２Ａの上面から樹脂基板１２Ｂの上面に向かってせり上がるように傾斜して形成されることになる。なお、本実施形態における内壁部２１は、周面封止樹脂２０と一体になってその一部を構成しており、周面封止樹脂２０と同じ光を反射する樹脂で形成されている。   The peripheral surface sealing resin 20 in the present embodiment includes an inner peripheral surface sealing portion 20a provided between the inner wall portion 21 and the inner peripheral surface 12b of the hole 12a, and the inner peripheral surface sealing portion 20a and the hole 12a. It is comprised from the edge sealing part 20b provided between the edges 12c. The inner wall portion 21 is formed to have a height approximately equal to the thickness of the resin substrate 12B, the inner peripheral surface sealing portion 20a is formed slightly higher than the inner wall portion 21, and the edge sealing portion 20b is the inner peripheral surface sealing portion 20a. It is formed slightly higher. Thereby, the peripheral surface sealing resin 20 is formed to be inclined so as to rise from the upper surface of the metal substrate 12A toward the upper surface of the resin substrate 12B. In addition, the inner wall part 21 in this embodiment is integrated with the peripheral surface sealing resin 20 to constitute a part thereof, and is formed of a resin that reflects the same light as the peripheral surface sealing resin 20.

この発光装置１１におけるパターン封止樹脂１７の上にも、発光装置１の枠状樹脂８と同様の、透明な枠状樹脂１８が発光エリア１３Ａを囲うように設けられている。また、この枠成樹脂１８の内側にも、発光装置１の封止樹脂９と同様の、封止樹脂１９が設けられており、発光素子１３及びワイヤー１６を封止している。   A transparent frame-shaped resin 18 similar to the frame-shaped resin 8 of the light-emitting device 1 is also provided on the pattern sealing resin 17 in the light-emitting device 11 so as to surround the light-emitting area 13A. In addition, a sealing resin 19 similar to the sealing resin 9 of the light emitting device 1 is provided inside the frame forming resin 18 to seal the light emitting element 13 and the wire 16.

上記構成からなる発光装置１１では、前述した発光装置１と同様に、パターン封止樹脂１７を設けたことで、配線パターン１４，１５が光を吸収することがなくなり、また、パターン封止樹脂１７が光を反射して照射方向へ向かう光を増すことができる。さらに、透明な枠状樹脂１８を設けることで、光が外周方向にも広がることになる。   In the light emitting device 11 having the above-described configuration, the pattern sealing resin 17 is provided in the same manner as the light emitting device 1 described above, whereby the wiring patterns 14 and 15 do not absorb light, and the pattern sealing resin 17 Can reflect light and increase the light traveling in the irradiation direction. Furthermore, by providing the transparent frame-shaped resin 18, light spreads in the outer peripheral direction.

また、発光エリア１３Ａに面する又は隣接する樹脂基板１２Ａの孔１２ａの内周面１２ｂと縁１２ｃを周面封止樹脂２０で覆っているので、発光素子１３からの光が樹脂基板１２Ａに吸収されることを防ぐことができる。さらに、周面封止樹脂２０及び内壁部２１が光を反射し、それらの上面が内側から外側にせり上がるように傾斜しているため、発光素子１３からの光を上方の照射方向へ向けて反射する。これにより、前述した発光装置１と同様に、パターン封止樹脂１７と枠状樹脂１８を設けたことによる効果によって、光の取り出し効率を向上させることができる。   Further, since the inner peripheral surface 12b and the edge 12c of the hole 12a of the resin substrate 12A facing or adjacent to the light emitting area 13A are covered with the peripheral surface sealing resin 20, the light from the light emitting element 13 is absorbed by the resin substrate 12A. Can be prevented. Further, since the peripheral surface sealing resin 20 and the inner wall portion 21 reflect light and the upper surfaces thereof are inclined so as to rise from the inside to the outside, the light from the light emitting element 13 is directed in the upward irradiation direction. reflect. Thereby, similarly to the light-emitting device 1 described above, the light extraction efficiency can be improved by the effect of providing the pattern sealing resin 17 and the frame-shaped resin 18.

次に、図７乃至図１８に基づいて上記発光装置１１の製造方法を説明する。図７及び図８に示すように、この発光装置１１の基板１２は、中央に発光素子を実装する発光エリア１３Ａが設けられた金属基板１２Ａに、発光エリア１３Ａに適合する孔１２ａと、その縁にそれぞれ半円形状に形成された配線パターン１４，１５と、を有する樹脂基板１２Ｂを重ねて固着したものである。   Next, a method for manufacturing the light emitting device 11 will be described with reference to FIGS. As shown in FIGS. 7 and 8, the substrate 12 of the light emitting device 11 includes a metal substrate 12A provided with a light emitting area 13A for mounting a light emitting element in the center, a hole 12a that fits the light emitting area 13A, and an edge thereof. And a resin substrate 12B having wiring patterns 14 and 15 each formed in a semicircular shape.

はじめに、図９及び図１０に示すように、金属基板１２Ａ上に複数の発光素子１３をダイボンドすることで実装する。   First, as shown in FIGS. 9 and 10, a plurality of light emitting elements 13 are mounted by die bonding on a metal substrate 12A.

その後、図１１及び図１２に示すように、ポッティング等により、発光素子１３を囲うように樹脂基板１２Ｂの孔１２ａの内周面１２ｂに沿って内壁部２１を金属基板１２Ａ上に形成する。   Thereafter, as shown in FIGS. 11 and 12, an inner wall portion 21 is formed on the metal substrate 12A along the inner peripheral surface 12b of the hole 12a of the resin substrate 12B so as to surround the light emitting element 13 by potting or the like.

ここで、図１３及び図１４に示すように、ワイヤー１６で発光素子１３を配線パターン１４，１５に接続すると共に隣接する発光素子１３を接続する。このときに、内壁部２１は樹脂基板１２Ａの厚みとほぼ同じ高さに形成されているので、この内壁部２１を飛び越すようにワイヤー１６を張っても、ワイヤー１６を特別に高く湾曲させる必要はない。従って、その後に形成される枠状樹脂１８等も特に高く形成する必要はないものであり、発光装置１１の厚みが増すことはない。   Here, as shown in FIGS. 13 and 14, the light emitting element 13 is connected to the wiring patterns 14 and 15 by the wire 16 and the adjacent light emitting elements 13 are connected. At this time, since the inner wall portion 21 is formed to have almost the same height as the thickness of the resin substrate 12A, even if the wire 16 is stretched so as to jump over the inner wall portion 21, it is necessary to bend the wire 16 to be particularly high. Absent. Therefore, it is not necessary to form the frame-shaped resin 18 and the like formed thereafter in a particularly high manner, and the thickness of the light emitting device 11 does not increase.

その後、図１５及び図１６に示すように、ポッティング等により、パターン封止樹脂１７と周面封止樹脂２０を環状に形成する。このパターン封止樹脂１７は、配線パターン１４，１５の上に一連の環状に設けられ、配線パターン１４，１５を覆っている。また、周面封止樹脂２０は、内壁部２１と孔１２ａの内周面１２ｂとの間に内周面封止部２０ａを設け、この内周面封止部２０ａと孔１２ａの縁１２ｃとの間に縁封止部２０ｂを設けることで形成されている。このように、内壁部２１、内周面封止部２０ａ、縁封止部２０ｂを順次積み上げることで、周面封止樹脂２０の上面が金属基板１２Ａの上面から樹脂基板１２Ｂの上面に向かってせり上がるように傾斜して形成される。なお、周面封止樹脂２０を形成する際に、発光素子１３を配線パターン１４，１５に接続するワイヤー１６の上から樹脂を垂らすことにより所定位置に形成している。   Thereafter, as shown in FIGS. 15 and 16, the pattern sealing resin 17 and the peripheral surface sealing resin 20 are formed in an annular shape by potting or the like. The pattern sealing resin 17 is provided in a series of annular shapes on the wiring patterns 14 and 15 and covers the wiring patterns 14 and 15. Further, the peripheral surface sealing resin 20 is provided with an inner peripheral surface sealing portion 20a between the inner wall portion 21 and the inner peripheral surface 12b of the hole 12a, and the inner peripheral surface sealing portion 20a and the edge 12c of the hole 12a, It is formed by providing the edge sealing part 20b in between. In this manner, by sequentially stacking the inner wall portion 21, the inner peripheral surface sealing portion 20a, and the edge sealing portion 20b, the upper surface of the peripheral surface sealing resin 20 is directed from the upper surface of the metal substrate 12A toward the upper surface of the resin substrate 12B. Inclined so as to rise. When forming the peripheral surface sealing resin 20, the light emitting element 13 is formed at a predetermined position by hanging the resin from above the wires 16 connecting the wiring patterns 14 and 15.

その後、図１７及び図１８に示すように、パターン封止樹脂１７の上に枠状樹脂１８を環状に形成する。そして、この枠状樹脂１８の内側に蛍光体等を混入した封止樹脂１９を充填することで図４乃至図６に示す発光装置１１が完成する。   Thereafter, as shown in FIGS. 17 and 18, a frame-shaped resin 18 is formed in an annular shape on the pattern sealing resin 17. Then, the inside of the frame-shaped resin 18 is filled with a sealing resin 19 mixed with a phosphor or the like, whereby the light emitting device 11 shown in FIGS. 4 to 6 is completed.

上記製造方法によれば、内壁部２１を形成してから周面封止樹脂２０を形成することで、内壁部２１を基準にして周面封止樹脂２０を精度よく位置決めすることができる。また、周面封止樹脂２０を順次積み重ねて形成するときに、樹脂が発光エリア１３Ａ内に流れることを内壁部２１で防ぐことができ、製品の歩留を向上させることができる。   According to the manufacturing method, the peripheral surface sealing resin 20 can be accurately positioned with reference to the inner wall portion 21 by forming the peripheral surface sealing resin 20 after forming the inner wall portion 21. Further, when the peripheral surface sealing resin 20 is sequentially stacked and formed, the inner wall portion 21 can prevent the resin from flowing into the light emitting area 13A, and the yield of the product can be improved.

次に、第１の実施形態に係る発光装置１を例に、パターン封止樹脂７と枠状樹脂８を同時に形成すると共に、パターン封止樹脂７の上面を傾斜した状態で形成する製造方法を図１９乃至図２４に基づいて説明する。図１９に示すように、基板２に発光素子３を実装した後、図２０に示すように、基板２上の配線パターン４，５の外周にマスク部材２２を取り付ける。   Next, taking the light emitting device 1 according to the first embodiment as an example, a manufacturing method in which the pattern sealing resin 7 and the frame-shaped resin 8 are simultaneously formed and the upper surface of the pattern sealing resin 7 is formed in an inclined state. This will be described with reference to FIGS. As shown in FIG. 19, after mounting the light emitting element 3 on the substrate 2, a mask member 22 is attached to the outer periphery of the wiring patterns 4 and 5 on the substrate 2 as shown in FIG. 20.

ここで、図２１に示すように、光を反射拡散する散乱剤粒子をエポキシ樹脂、シリコン樹脂等に混入した樹脂２４で配線パターン４，５を覆う。このときに混入される散乱剤粒子は、その粒子径がμｍオーダーの大きさのものを用いている。そして、図２２に示すように、樹脂２４が硬化する前に、基板２の中央に垂直な軸を回転軸２３として基板２を回転させる。   Here, as shown in FIG. 21, the wiring patterns 4 and 5 are covered with a resin 24 in which scattering particles for reflecting and diffusing light are mixed in an epoxy resin, a silicon resin or the like. As the scattering agent particles mixed at this time, particles having a particle size of the order of μm are used. Then, as shown in FIG. 22, before the resin 24 is cured, the substrate 2 is rotated about the axis perpendicular to the center of the substrate 2 as the rotation axis 23.

上記スピンコートを施すと、図２３に示すように、樹脂２４は遠心力によりその上面が内側から外側に向かってせり上がるように形成される。また、このときに、散乱剤粒子が樹脂２４の下部に沈殿して高濃度となることで光を反射するパターン封止樹脂７が形成され、樹脂２４の上部の散乱剤粒子が低濃度となることで透明な枠状樹脂８が形成される。この結果、樹脂２４内で分離したパターン封止樹脂７の上面も内側から外側に向かってせり上がるように形成される。   When the spin coating is performed, as shown in FIG. 23, the resin 24 is formed so that its upper surface rises from the inside toward the outside by centrifugal force. Further, at this time, the scattering agent particles are precipitated in the lower part of the resin 24 and become a high concentration, whereby the pattern sealing resin 7 that reflects light is formed, and the scattering agent particles on the upper part of the resin 24 have a low concentration. Thereby, the transparent frame-shaped resin 8 is formed. As a result, the upper surface of the pattern sealing resin 7 separated in the resin 24 is also formed so as to rise from the inside toward the outside.

その後、図２４に示すように、マスク部材２２を取り除き、枠状樹脂８の内側に封止樹脂９を充填する。   Thereafter, as shown in FIG. 24, the mask member 22 is removed, and the sealing resin 9 is filled inside the frame-shaped resin 8.

上記製造方法のように、比較的大きい散乱剤粒子を混入することで、樹脂２４の下部にその粒子を沈殿させて上下に分離し、パターン封止樹脂７と枠状樹脂８を一括して形成することができる。また、スピンコートを施すことで、パターン封止樹脂７の上面を容易に傾斜させることができる。   By mixing relatively large scattering agent particles as in the above manufacturing method, the particles are precipitated in the lower part of the resin 24 and separated into upper and lower parts, and the pattern sealing resin 7 and the frame-like resin 8 are formed in a lump. can do. Further, by applying spin coating, the upper surface of the pattern sealing resin 7 can be easily inclined.

なお、パターン封止樹脂と枠状樹脂を一括して形成する工程は、第２の実施形態における発光装置１１にも適用可能であり、周面封止樹脂２０と共にパターン封止樹脂１７を形成せずに、枠状樹脂１８と共にパターン封止樹脂１７を形成すればよい。   Note that the process of forming the pattern sealing resin and the frame-shaped resin together can be applied to the light emitting device 11 in the second embodiment, and the pattern sealing resin 17 is formed together with the peripheral surface sealing resin 20. Instead, the pattern sealing resin 17 may be formed together with the frame-shaped resin 18.

次に、第１の実施形態に係る発光装置１を例に、パターン封止樹脂７と枠状樹脂８を複数の樹脂層で形成する製造方法を図２５乃至図２８に基づいて説明する。図２５に示すように、基板２に発光素子３を実装した後に、配線パターン４，５の上に第１の樹脂層２５を環状に形成して配線パターン４，５を覆う。その後、図２６に示すように、第１の樹脂層２５よりもわずかに径が大きくなるように第２の樹脂層２６を第１の樹脂層２５の上に環状に形成する。そして、図２７に示すように、第２の樹脂層２６よりも更に径が大きくなるように第３の樹脂層２７を第２の樹脂層２６の上に環状に形成し、図２８に示すように、第３の樹脂層２７よりも径が大きくなるように第４の樹脂層２８を第３の樹脂層２７の上に環状に形成する。   Next, taking the light emitting device 1 according to the first embodiment as an example, a manufacturing method for forming the pattern sealing resin 7 and the frame-shaped resin 8 with a plurality of resin layers will be described with reference to FIGS. As shown in FIG. 25, after mounting the light emitting element 3 on the substrate 2, a first resin layer 25 is formed in an annular shape on the wiring patterns 4, 5 to cover the wiring patterns 4, 5. Thereafter, as shown in FIG. 26, the second resin layer 26 is formed in an annular shape on the first resin layer 25 so that the diameter is slightly larger than that of the first resin layer 25. Then, as shown in FIG. 27, the third resin layer 27 is formed in an annular shape on the second resin layer 26 so as to have a larger diameter than the second resin layer 26, and as shown in FIG. In addition, the fourth resin layer 28 is formed in an annular shape on the third resin layer 27 so as to have a diameter larger than that of the third resin layer 27.

このように、第１の樹脂層２５から第４の樹脂層２８を重ねて形成すると、樹脂層を少しずつ形成することで位置や形状を精度よく形成することができ、更に、積み上げられた樹脂層の上面が内側から外側に向かってせり上がるように傾斜して形成することができる。このため、例えば、第１の樹脂層２５と第２の樹脂層２６を光が反射する樹脂で形成すれば、発光素子３からの光を上方へ反射するパターン封止樹脂７を形成することができる。このときに、第３の樹脂層２７及び第４の樹脂層２８を透明な樹脂で形成すれば、光を外方に透過する枠状樹脂８を形成することができる。   As described above, when the fourth resin layer 28 is formed by overlapping the first resin layer 25, the position and shape can be accurately formed by forming the resin layer little by little. The upper surface of the layer can be formed to be inclined so as to rise from the inside toward the outside. Therefore, for example, if the first resin layer 25 and the second resin layer 26 are formed of a resin that reflects light, the pattern sealing resin 7 that reflects light from the light emitting element 3 upward can be formed. it can. At this time, if the third resin layer 27 and the fourth resin layer 28 are formed of a transparent resin, the frame-like resin 8 that transmits light outward can be formed.

なお、樹脂層の数は適宜設定することが可能であり、また、図２８に示すように、上に重ねる樹脂層の幅を小さくすれば、外側に広がることがなく、重ね易くすることができる。   Note that the number of resin layers can be set as appropriate, and as shown in FIG. 28, if the width of the resin layer to be overlaid is reduced, it can be easily stacked without spreading outward. .

また、第２の実施形態における発光装置１１では、既に周面封止樹脂２０を複数の樹脂層で形成しているが、更に、パターン封止樹脂１７と枠状樹脂１８を上記のように複数の樹脂層で形成することも可能である。   Further, in the light emitting device 11 according to the second embodiment, the peripheral surface sealing resin 20 is already formed of a plurality of resin layers, but a plurality of pattern sealing resins 17 and frame-shaped resins 18 are also provided as described above. It is also possible to form the resin layer.

１，１１ 発光装置
２，１２ 基板
３，１３ 発光素子
３Ａ，１３Ａ 発光エリア
４，５，１４，１５ 配線パターン
６，１６ ワイヤー
７，１７ パターン封止樹脂
８，１８ 枠状樹脂
９，１９ 封止樹脂
１２Ａ 金属基板
１２Ｂ 樹脂基板
１２ａ 孔
１２ｂ 内周面
１２ｃ 縁
２０ 周面封止樹脂
２０ａ 内周面封止部
２０ｂ 縁封止部
２１ 内壁部
２２ マスク部材
２３ 回転軸
２４ 樹脂
２５ 第１の樹脂層
２６ 第２の樹脂層
２７ 第３の樹脂層
２８ 第４の樹脂層 DESCRIPTION OF SYMBOLS 1,11 Light-emitting device 2,12 Board | substrate 3,13 Light-emitting element 3A, 13A Light emission area 4,5,14,15 Wiring pattern 6,16 Wire 7,17 Pattern sealing resin 8,18 Frame-shaped resin 9,19 Sealing Resin 12A Metal substrate 12B Resin substrate 12a Hole 12b Inner peripheral surface 12c Edge 20 Surrounding surface sealing resin 20a Inner peripheral surface sealing portion 20b Edge sealing portion 21 Inner wall portion 22 Mask member 23 Rotating shaft 24 Resin 25 First resin layer 26 Second resin layer 27 Third resin layer 28 Fourth resin layer

Claims (10)

基板と、
該基板上に実装された発光素子と、
前記基板上における前記発光素子が実装されている発光エリアの周囲に設けられた配線パターンと、
光を反射し、前記配線パターンを覆うパターン封止樹脂と、
該パターン封止樹脂上に設けられて前記発光エリアを囲う透明な枠状樹脂と、
該枠状樹脂の内側に設けられて前記発光素子を封止する封止樹脂と、
を備えることを特徴とする発光装置。 A substrate,
A light emitting device mounted on the substrate;
A wiring pattern provided around a light emitting area on which the light emitting element is mounted on the substrate;
A pattern sealing resin that reflects light and covers the wiring pattern;
A transparent frame-shaped resin provided on the pattern sealing resin and surrounding the light emitting area;
A sealing resin that is provided inside the frame-shaped resin and seals the light-emitting element;
A light emitting device comprising: 金属基板と該金属基板上に固着され発光エリアに対応する部分に孔が設けられた樹脂基板とからなる基板と、
前記樹脂基板の孔内の前記金属基板上に実装された発光素子と、
前記樹脂基板の孔の周囲に設けられた配線パターンと、
光を反射し、前記樹脂基板の孔の縁及び内周面を覆う周面封止樹脂と、
光を反射し、前記配線パターンを覆うパターン封止樹脂と、
該パターン封止樹脂上に設けられて前記発光エリアを囲う透明な枠状樹脂と、
該枠状樹脂の内側に設けられて前記発光素子を封止する封止樹脂と、
を備えることを特徴とする発光装置。 A substrate composed of a metal substrate and a resin substrate fixed on the metal substrate and provided with a hole in a portion corresponding to the light emitting area;
A light emitting device mounted on the metal substrate in the hole of the resin substrate;
A wiring pattern provided around the hole of the resin substrate;
A peripheral surface sealing resin that reflects light and covers an edge and an inner peripheral surface of the hole of the resin substrate;
A pattern sealing resin that reflects light and covers the wiring pattern;
A transparent frame-shaped resin provided on the pattern sealing resin and surrounding the light emitting area;
A sealing resin that is provided inside the frame-shaped resin and seals the light-emitting element;
A light emitting device comprising: 前記パターン封止樹脂は、その上面が内側から外側に向かってせり上がるように傾斜して設けられている請求項１又は２に記載の発光装置。   The light emitting device according to claim 1, wherein the pattern sealing resin is provided so as to be inclined so that an upper surface thereof rises from the inside toward the outside. 前記パターン封止樹脂と枠状樹脂は、その一方又は両方が複数の樹脂層により形成されている請求項１又は２に記載の発光装置。   The light emitting device according to claim 1, wherein one or both of the pattern sealing resin and the frame-shaped resin are formed of a plurality of resin layers. 前記パターン封止樹脂と枠状樹脂は、光を反射散乱する散乱剤粒子が混入された透明な樹脂で一体形成され、その下部に前記散乱剤粒子が沈殿して高濃度となることで前記パターン封止樹脂が形成され、上部における前記散乱剤粒子が低濃度となることで前記枠状樹脂が形成されている請求項１又は２に記載の発光装置。   The pattern sealing resin and the frame-shaped resin are integrally formed of a transparent resin mixed with scattering agent particles that reflect and scatter light, and the scattering agent particles are precipitated at a lower portion thereof to increase the concentration. The light-emitting device according to claim 1, wherein a sealing resin is formed, and the frame-shaped resin is formed by the concentration of the scattering agent particles in the upper part being low. 前記周面封止樹脂は、前記金属基板の上面から前記樹脂基板の上面に向かってせり上がるように傾斜して設けられている請求項２に記載の発光装置。   The light emitting device according to claim 2, wherein the peripheral surface sealing resin is provided to be inclined so as to rise from the upper surface of the metal substrate toward the upper surface of the resin substrate. 前記周面封止樹脂は、複数の樹脂層により形成されている請求項６に記載の発光装置。   The light emitting device according to claim 6, wherein the peripheral surface sealing resin is formed of a plurality of resin layers. 発光素子が実装される金属基板と、該金属基板上に固着され、前記発光素子が実装されている発光エリアに対応する部分に孔を有し且つ該孔の周囲に配線パターンが設けられた樹脂基板とからなる基板上に前記発光素子をダイボンドする工程と、
前記発光エリアの周囲に光を反射する周面封止樹脂の一部となる内壁部を形成する工程と、
前記発光素子と前記配線パターンをワイヤーボンドする工程と、
前記配線パターンを覆うパターン封止樹脂と、前記孔の縁及び内周面を覆い前記内壁部に連なる前記周面封止樹脂とを形成する工程と、
前記パターン封止樹脂の上に透明な枠状樹脂を形成する工程と、
前記枠状樹脂の内側に充填されて前記発光素子を封止する封止樹脂を形成する工程と、
からなることを特徴とする発光装置の製造方法。 A metal substrate on which a light emitting element is mounted, and a resin that is fixed on the metal substrate, has a hole in a portion corresponding to the light emitting area on which the light emitting element is mounted, and is provided with a wiring pattern around the hole A step of die-bonding the light emitting element on a substrate comprising a substrate;
Forming an inner wall portion to be a part of a peripheral surface sealing resin that reflects light around the light emitting area;
Wire bonding the light emitting element and the wiring pattern;
Forming a pattern sealing resin that covers the wiring pattern, and a peripheral surface sealing resin that covers an edge and an inner peripheral surface of the hole and continues to the inner wall portion;
Forming a transparent frame-shaped resin on the pattern sealing resin;
Forming a sealing resin that is filled inside the frame-shaped resin and seals the light-emitting element;
A method for manufacturing a light-emitting device comprising: 発光素子が実装される発光エリアの周囲に配線パターンが設けられた基板上に発光素子を実装する工程と、
前記配線パターンの外周を囲うマスク部材を前記基板上に取り付ける工程と、
光を反射散乱する散乱剤粒子が混入された透明な樹脂で前記配線パターンを覆うことで前記発光エリアの周囲を囲い、前記発光エリアの中央に垂直な中心軸を中心として前記基板を回転させるスピンコートを施す工程と、
前記透明な樹脂内の散乱剤粒子が下方に沈殿して上下２層に分離し硬化することで前記配線パターンを封止するパターン封止樹脂とその上に設けられる前記発光エリアを囲う枠状樹脂とを形成する工程と、
前記マスク部材を除去する工程と、
前記枠状樹脂の内側に封止樹脂を充填して前記発光素子を封止する工程と、
からなることを特徴とする発光装置の製造方法。 Mounting the light emitting element on a substrate provided with a wiring pattern around a light emitting area on which the light emitting element is mounted;
Attaching a mask member surrounding the outer periphery of the wiring pattern on the substrate;
A spin that surrounds the light emitting area by covering the wiring pattern with a transparent resin mixed with scattering agent particles that reflect and scatter light, and rotates the substrate about a central axis perpendicular to the center of the light emitting area. Applying a coat;
A pattern sealing resin that seals the wiring pattern by dispersing the scattering agent particles in the transparent resin downward, separating into two upper and lower layers and curing, and a frame-shaped resin surrounding the light emitting area provided thereon Forming a process; and
Removing the mask member;
Filling the inside of the frame-shaped resin with a sealing resin to seal the light emitting element;
A method for manufacturing a light-emitting device comprising: 前記パターン封止樹脂は、スピンコート時にその上面が内側から外側に向かってせり上がるように傾斜して形成されている請求項９に記載の発光装置の製造方法。   The light emitting device manufacturing method according to claim 9, wherein the pattern sealing resin is formed so as to be inclined so that an upper surface thereof rises from the inside toward the outside during spin coating.
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