TW202034541A - Light-emitting device, light-emitting module, and method of manufacturing light-emitting device - Google Patents

Abstract

A light-emitting device includes a light-emitting element including first and second main surface, and a first lateral surface; a wavelength conversion member including a third main surface, a fourth main surface, and second lateral surfaces; a light-transmissive adhesive member; and a first light-reflective member containing a light-reflective first filler, covering the first lateral surface provided with the light-transmissive adhesive member, and including third lateral surfaces being peripheral surfaces of the first light-reflective member. In a cross-section in a direction perpendicular to the second main surface, a distance between the third lateral surfaces is smaller than a distance between the second lateral surfaces at the fourth main surface side. Each of the second lateral surfaces of the wavelength conversion member includes a first inclined surface in a region adjacent to the third main surface. The wavelength conversion member includes light-reflective particles located on the first inclined surface.

Description

Light emitting device, light emitting module and manufacturing method of light emitting device

The present invention relates to a light-emitting device, a light-emitting module, and a manufacturing method of the light-emitting device using light-emitting elements.

Light-emitting devices that use light-emitting elements such as light-emitting diodes (LEDs) are widely used in backlights of liquid crystal displays or light sources for displays.

For example, the light source device disclosed in Patent Document 1 includes a plurality of light-emitting elements mounted on a mounting substrate and a phosphor layer on each of the plurality of light-emitting elements, and a reflective layer is arranged on the surface of the phosphor layer.

Due to the recent trend of miniaturization and weight reduction of such light-emitting devices, on the one hand, it is required to be smaller and thinner, on the other hand, higher brightness is required, and in particular, it is sought to improve the extraction efficiency of light emitted by the light-emitting element. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-204614

[The problem to be solved by the invention]

One of the objectives of the present invention is to provide a light-emitting device, a light-emitting module, and a manufacturing method of the light-emitting device and the light-emitting module that further improve the light extraction efficiency. [Technical means to solve the problem]

According to one aspect of the light-emitting device of the present invention, there can be provided a light-emitting device including: a light-emitting element having: a first main surface on which an electrode is provided; a second main surface opposite to the first main surface; and A first side surface continuous with the first main surface and the second main surface; a wavelength conversion member having: a third main surface having a rectangular shape with a larger area than the second main surface, and The second main surface is joined; the fourth main surface opposite to the third main surface; and the second side surface continuous with the third main surface and the fourth main surface; and the wavelength of the light emitted by the light emitting element is converted to emit different Wavelength of light; a light-transmitting adhesive member that continuously covers a portion of the second main surface side of the first side surface and the third main surface; and a first light-reflective member that is covered with the light-transmitting adhesive The first side surface of the member has a third side surface around it; and the first light-reflective member contains a first filler having light reflectivity; the third side surface in a cross section perpendicular to the direction of the second main surface The distance between each other is smaller than the distance between the second side surfaces on the fourth main surface side in the second side surface; the wavelength conversion member has a first inclination that is inclined in an area of the second side surface close to the third main surface Surface; The wavelength conversion member has light reflective particles on the surface of the first inclined surface.

In addition, according to another aspect of the present invention, a method of manufacturing a light emitting device including a light emitting element, a wavelength conversion member, a light-transmitting adhesive member, and a first light-reflective member may include: preparing: A first resin layer in which a phosphor is mixed in a first resin; a plurality of the light-emitting elements arranged at intervals on the upper surface of the first resin layer; and a plurality of the light-emitting elements arranged between adjacent light-emitting elements as the first A step of a second resin layer of a light reflective member containing a first filler having light reflectivity; a step of cutting the second resin layer with a first blade having a first thickness at specific intervals to form a first cutting area; And inserting a second edge having a second thickness thinner than the first thickness into the first cutting area, and cutting the first resin layer directly below the first cutting area to form a second cutting area, which is divided into Each light-emitting device is formed on the side surface of each light-emitting device near the area where the first light-reflective member is joined to the side surface of the wavelength conversion member, that is, the second side surface, to form a first slope inclined from the plane of the second side surface The step of attaching light-reflective particles to the first inclined surface.

Furthermore, a method of manufacturing a light-emitting device including a light-emitting element, a wavelength conversion member, a light-transmitting adhesive member, and a first light-reflective member according to another aspect of the present invention may include preparing: as the above-mentioned wavelength conversion member, A first resin layer in which a phosphor is mixed in a first resin; a plurality of the light-emitting elements arranged at intervals on the upper surface of the first resin layer; and a plurality of the light-emitting elements arranged between adjacent light-emitting elements as the first A step of a second resin layer of a light reflective member containing a first filler having light reflectivity; a step of cutting the second resin layer with a first blade having a first thickness at specific intervals to form a first cutting area; And inserting a second edge having a second thickness thinner than the first thickness into the first cutting area, cutting the first resin layer directly below the first cutting area to form a second cutting area, and dividing it into each The light-emitting device is formed on the side surface of each light-emitting device, and a second inclined surface inclined from the plane of the third side surface is formed in the vicinity of the area where the wavelength conversion member is joined to the side surface of the first light reflective member, that is, the third side surface A step of. [Effects of Invention]

According to the light-emitting device according to one aspect of the present invention, when the light-emitting element of the light-emitting device emits light, the light passing through the wavelength conversion member is reflected in the direction of extraction to the outside according to the inclination direction of the first inclined surface, and is further arranged in The light-reflective particles on the first inclined surface scatter the light from the light-emitting element, and can increase the components extracted to the outside, which can improve the light extraction efficiency of the entire light-emitting device.

Hereinafter, the present invention will be described in detail based on the drawings. In addition, in the following description, terms that indicate a specific direction or location (for example, "up", "down", and other terms that include these terms) are used as needed. These terms are used for easy understanding of the reference map The invention does not limit the technical scope of the present invention by the meaning of these terms. In addition, the parts with the same symbols shown in the plural drawings represent the same or equivalent parts or components.

Furthermore, the embodiments shown below are examples of light-emitting devices, light-emitting modules, and manufacturing methods of light-emitting devices for embodying the technical idea of the present invention, and do not limit the present invention to the following. In addition, the dimensions, materials, shapes, and relative arrangements of the components described below are intended to be illustrative, and not intended to limit the scope of the present invention, unless there is a specific description. In addition, the content described in one embodiment or embodiment can also be applied to other embodiments and embodiments. In addition, for clarification, the size or positional relationship of the components shown in the drawings may be exaggerated. [Embodiment 1] (Liquid crystal display device 1000)

FIG. 1 is a structural diagram showing each structure of a liquid crystal display device 1000 with a light-emitting module according to the first embodiment. The liquid crystal display device 1000 includes a liquid crystal panel 120, two lens sheets 110a, 110b, a diffusion sheet 110c, and a light emitting module 100 in this order from the upper side. The liquid crystal display device 1000 shown in FIG. 1 is a so-called direct-under liquid crystal display device in which the light emitting module 100 is laminated under the liquid crystal panel 120. The liquid crystal display device 1000 irradiates the liquid crystal panel 120 with light irradiated from the light emitting module 100. In addition to the above-mentioned structural components, members such as a polarizing film or a color filter may be further provided. (Light-emitting module 100)

The structure of the light-emitting module 100 of Embodiment 1 is shown in FIG. 2 and FIG. 3. The light emitting module 100 of the first embodiment is a white surface emitting light. Figure 2 is a schematic top view of the light emitting module of this embodiment. FIG. 3 is a partially enlarged schematic cross-sectional view showing the light-emitting module of Embodiment 1. FIG. The light-emitting module 100 shown in the figures includes a light-emitting device 3 as a light source, and a light guide plate 1 on which the light-emitting device 3 is arranged. (Light guide plate 1)

The light guide plate 1 has a light guide plate first main surface 1c (lower surface in FIG. 3) as a light-emitting surface that emits light to the outside, and a light guide plate second main surface 1d on the opposite side of the light guide plate first main surface 1c (FIG. 3 Upper middle surface). On the second main surface 1d of the light guide plate of the light guide plate 1, a plurality of recesses 1b for arranging the light emitting device 3 are formed separately. In addition, grooves 1e are formed between the recesses 1b. On the other hand, an optical function portion 1a having a function of reflecting or diffusing light from the light emitting device 3 can be provided on the side of the first main surface 1c of the light guide plate of the light guide plate 1.

Furthermore, the light-emitting module 100 includes a second light reflective member 16 covering the second main surface 1d of the light guide plate of the light guide plate 1. In addition, the light-emitting module 100 includes a light-transmitting bonding member 14 that is in contact with the inner surface of the recess 1 b and the outer surface of the light-emitting device 3.

In the light emitting module 100 shown in FIGS. 2 and 3, a plurality of recesses 1b are provided on a light guide plate 1, and a light emitting device 3 is arranged in each recess 1b. However, the light-emitting module can also be as shown in the bottom view of the mode of FIG. 4, and a plurality of light-emitting modules can be arranged in the light guide plate 1'with a recess 1b and the light-emitting devices 3 are arranged in the recess 1b. (Light-emitting device 3)

FIG. 5 shows a schematic cross-sectional view of the light-emitting device 3. The light-emitting device 3 shown in the figure includes a light-emitting element 11, a wavelength conversion member 12 covering the second main surface 11c of the light-emitting element 11, a light-transmitting adhesive member 19, and a first light covering the first side surface 11e of the light-emitting element 11. Reflective member 15.

In addition, the light-emitting device 3 in FIG. 5 covers the second main surface 11c of the light-emitting element 11 with the wavelength conversion member 12. Furthermore, the wavelength conversion member 12 has a third main surface 12c joined to the second main surface 11c of the light emitting element 11, a fourth main surface 12d, and a second main surface 12c connecting the third main surface 12c and the fourth main surface 12d. Side 12e. The third main surface 12c has a rectangular shape with a larger area than the second main surface 11c, and is joined to the second main surface 11c. The wavelength conversion member 12 converts the wavelength of the light emitted by the light-emitting element 11 to emit light of different wavelengths.

On the other hand, the light-transmitting adhesive member 19 continuously covers a part of the second main surface 11c side and the third main surface 12c of the first side surface 11e of the light emitting element 11. Furthermore, the first side surface 11e of the light-emitting element 11 provided with the light-transmitting adhesive member 19 is covered with the first light-reflective member 15. In addition, the first light reflective member 15 has a third side surface 15e around it. (Light-emitting element 11)

The light emitting element 11 has a second main surface 11c, a first main surface 11d on the opposite side of the second main surface 11c, and a first side surface 11e between the second main surface 11c and the first main surface 11d. A pair of positive and negative electrodes 11b are provided on the first main surface 11d. The light emitting element 11 mainly emits light from the second main surface 11c, and irradiates the wavelength conversion member 12 covering the second main surface 11c with light.

The light-emitting element 11 has, for example, a translucent substrate such as sapphire, and a semiconductor multilayer structure laminated on the translucent substrate. The semiconductor multilayer structure includes a light-emitting layer, an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light-emitting layer, and the n-type semiconductor layer and the p-type semiconductor layer are electrically connected to the electrode 11b, that is, the n-side electrode and the p-side electrode, respectively. For example, the second main surface 11c of the light-emitting element 11 provided with a light-transmitting substrate is arranged facing the light guide plate 1, and the first main surface 11d on the opposite side of the second main surface 11c has a pair of electrodes 11b.

As the light-emitting element 11, there are no particular restrictions on the vertical, horizontal, and height dimensions. However, it is preferable to use a semiconductor light-emitting element whose vertical and horizontal dimensions are 1 mm or less when viewed from above, and more preferably the vertical and horizontal dimensions are 0.5 mm or less. It is best to use light-emitting elements with vertical and horizontal dimensions below 0.25 mm. If such a light-emitting element is used, high-definition images can be realized when performing area dimming of a liquid crystal display device. In addition, if a light-emitting element with a vertical and horizontal dimension of 0.5 mm or less is used, the cost efficiency of the light-emitting element becomes better, and the cost of the light-emitting module 100 can be reduced. In addition, for a light-emitting element whose vertical and horizontal dimensions are both 0.25 mm or less, since the area of the upper surface of the light-emitting element becomes smaller, the amount of light emitted from the first side surface 11e relatively increases. That is, this light-emitting element is easily formed into a bat-wing shape, so it is preferably used in the light-emitting module of this embodiment where the light-emitting element and the light guide plate are joined and the distance between the light-emitting element and the light guide plate is extremely short.

In addition, the height of the light emitting element 11 is preferably set to 0.10 mm to 0.25 mm. The height of the light-emitting element 11 is preferably such that when the light-emitting device 3 is installed in the recess 1b of the light guide plate 1, the first main surface 11d of the light-emitting element 11 protrudes from the recess 1b.

The light emitting element 11 can have any shape when viewed from above, such as a square or a rectangle. If the light-emitting element used in the high-definition liquid crystal display device is rectangular, in the mounting step of the light-emitting element, even if a part of the light-emitting element of the plurality of light-emitting elements is rotated, the light-emitting element is rectangular when viewed from above. , Easy to visually confirm. In addition, since the p-type electrode and the n-type electrode can be formed by separating the distance, the wiring described later can be easily formed. On the other hand, if a light-emitting element that is square in plan view is used, smaller light-emitting elements can be manufactured with good mass productivity. The density (arrangement pitch) of the light-emitting elements 11, that is, the distance between the light-emitting elements 11 is determined by the interval between the recesses 1b provided on the light guide plate 1. For example, it can be about 0.06 mm to 20 mm, preferably 1 mm to 10 mm about. In addition, the arrangement pitch of the light-emitting elements 11 is the distance between the centers of two adjacent light-emitting elements 11. The light-emitting element 11 is designed to be disposed approximately in the center of the light-emitting device 3, and therefore, the arrangement pitch of the light-emitting device 3 is also about 0.06 mm-20 mm, preferably about 1 mm-10 mm.

In addition, in the example of FIG. 4, the outer side surfaces of the light-emitting device 3 are arranged substantially parallel to the inner side surfaces of the recess 1b. However, the present invention is not limited to this arrangement. For example, the center of the light-emitting device may be set to be opposite to each other. The configuration is rotated 45° in the quadrilateral recess 1b.

As the light emitting element 11, a well-known semiconductor light emitting element can be used. In this embodiment, as the light-emitting element 11, a light-emitting diode is exemplified.

As the light-emitting element 11, an element that emits light of any wavelength can be selected. For example, as an element emitting blue and green light, a nitride-based semiconductor (In _x Al _y Ga _1-xy N, 0≦X, 0≦Y, X+Y≦1) or GaP can be used. Components to be used. In addition, as an element that emits red light, a light-emitting element including semiconductors such as GaAlAs and AlInGaP can be used. Furthermore, semiconductor light-emitting elements containing materials other than these can also be used. By changing the material of the semiconductor layer and its mixed crystallinity, the emission wavelength can be changed. The composition, luminous color, size, number, etc. of the light-emitting element used can be appropriately selected according to the purpose. (Wavelength conversion member 12)

The wavelength conversion member 12 is arranged so as to cover the second main surface 11 c of the light emitting element 11. The wavelength conversion member 12 receives the light emitted from the second main surface 11c with the third main surface 12c, converts the wavelength of the light, and emits it from the fourth main surface 12d. For example, the wavelength conversion member 12 includes a phosphor that is excited by light from the light emitting element 11 to emit light of different wavelengths. In this way, the components of the light emitted by the light-emitting element 11 that have passed through the wavelength conversion member 12 are mixed with the components that have been wavelength-converted by the wavelength conversion member 12, and mixed color light is emitted.

The wavelength conversion member 12 may be one in which the wavelength conversion substance is dispersed in the first resin as the base material. In addition, the wavelength conversion member 12 may be constituted by a plurality of layers. For example, the wavelength conversion member may be constituted by a plurality of wavelength conversion portion layers. Alternatively, the wavelength conversion member may have a two-layer structure in which a first layer in which a wavelength conversion substance is added to a base material, and a light diffusing portion to which a diffusion material is added to the base material as a second layer.

As the material of the first resin of the base material, a translucent material such as epoxy resin, silicone resin, resin mixed with these, or glass can be used. From the viewpoints of light resistance and easy moldability of the wavelength conversion member 12, it is more advantageous to select silicone resin as the first resin. In addition, as the base material of the wavelength conversion member 12, a material having a higher refractive index than the material of the light guide plate 1 is preferable.

For the wavelength conversion substance contained in the wavelength conversion member 12, a phosphor can be suitably used. For example, fluoride-based phosphors such as YAG phosphors, β-Sialon phosphors, KSF-based phosphors, or MGF-based phosphors, and nitride phosphors are cited. As specific examples of the composition formula, the following general formulae (I), (II), and (III) can be cited.

(其中，上述通式(I)中，A為選自由K⁺ 、Li⁺ 、Na⁺ 、Rb⁺ 、Cs⁺ 及NH⁴⁺ 組成之群中之至少1種，M為選自由第4族元素及第14族元素組成之群中之至少1種元素，a滿足0＜a＜0.2。)

(In the above general formula (I), A is at least one selected from the group consisting of K ⁺ , Li ⁺ , Na ⁺ , Rb ⁺ , Cs ⁺ and NH ⁴⁺ , and M is selected from the group 4 elements And at least one element in the group consisting of group 14 elements, a satisfies 0<a<0.2.)

(其中，上述通式(II)中，Ma為選自Ca、Sr、Ba、Zn之至少1種，Mb為選自Sc、La、Lu之至少1種，Mc為選自Ca、Sr、Ba、Zn之至少1種，X為選自F、Cl之至少1種，Md為選自Ti、Sn、Zr之至少1種，Me為選自B、Al、Ga、In之至少1種。此外，關於x、y、a、b、c、d、e，為2≦x≦4、0＜y≦2、0≦a≦1.5、0≦b＜1、0≦c≦2、0≦d≦0.5、0≦e＜1)

(Wherein, in the above general formula (II), Ma is at least one selected from Ca, Sr, Ba, and Zn, Mb is at least one selected from Sc, La, and Lu, and Mc is selected from Ca, Sr, Ba , Zn at least one kind, X is at least one kind selected from F, Cl, Md is at least one kind selected from Ti, Sn, Zr, Me is at least one kind selected from B, Al, Ga, In. , For x, y, a, b, c, d, e, 2≦x≦4, 0<y≦2, 0≦a≦1.5, 0≦b<1, 0≦c≦2, 0≦d ≦0.5, 0≦e＜1)

(其中，上述通式(III)中，Ma為選自由Ca、Sr及Ba組成之群中至少1種之元素，Mb為選自由Li、Na及K組成之群中至少1種之元素，x、y及z分別滿足0.5≦x≦1.5、0.5≦y≦1.2、及3.5≦z≦4.5。

(Among them, in the above general formula (III), Ma is at least one element selected from the group consisting of Ca, Sr and Ba, Mb is at least one element selected from the group consisting of Li, Na and K, x , Y and z satisfy 0.5≦x≦1.5, 0.5≦y≦1.2, and 3.5≦z≦4.5, respectively.

The half-value width of the KSF phosphor represented by the general formula (I) can be 10 nm or less. In addition, the half-value width of the MGF phosphor represented by the general formula (II) may be 15 nm or more and 35 nm or less. As shown in the above general formula (I), a part of Si of the composition K ₂ SiF ₆ : Mn ⁴⁺ of the KSF phosphor can be replaced with other tetravalent elements, namely Ti or Ge (the composition formula is expressed as K ₂ (Si, Ti, Ge) F ₆ : Mn), or replace a part of K of the composition K ₂ SiF ₆ : Mn ⁴⁺ with other alkali metals, or replace with Al as a trivalent element A part of Si, or the replacement of multiple elements can be combined.

The wavelength conversion member 12 may contain one kind of wavelength conversion material, or may contain multiple kinds of wavelength conversion materials. If it contains a plurality of wavelength conversion materials, for example, the wavelength conversion member may include fluoride-based phosphors such as β-sialon phosphors that emit green light and KSF-based phosphors that emit red light. Thereby, the color reproduction range of the light-emitting module 100 can be expanded. In this case, the light-emitting element 11 preferably includes a nitride-based semiconductor (In _x Al _y Ga _1-xy N, 0≦X, 0≦Y, X +Y≦1). Also, for example, when using a light emitting element 11 that emits blue light, if it is desired to obtain red light as a light emitting module, the wavelength conversion member 12 may also contain 60% by weight or more of KSF phosphor Red phosphor) preferably contains 90% by weight or more. That is, the wavelength conversion member 12 may contain a wavelength conversion material that emits light of a specific color, and emit light of a specific color. In addition, the wavelength conversion material may be quantum dots. In the wavelength conversion member 12, the wavelength conversion material can be arbitrarily arranged. For example, it may be approximately uniformly distributed or locally unevenly distributed. In addition, a plurality of layers each containing a wavelength conversion member may be stacked.

In addition, the wavelength conversion member 12 may add a member that diffuses and reflects light. For example, the light diffusion member may be mixed into the inside of the wavelength conversion member 12, or the light diffusion plate may be attached to the surface of the wavelength conversion member 12, or separated from the wavelength conversion member 12 and installed on the surface or inside of the light guide plate. Light diffusion layer of light diffusion member. By providing such a light diffusion layer or light diffusion region such as a light diffusion portion, the light emitted from the light guide plate 1 can be made more uniform. Furthermore, multiple light diffusion parts may be provided. For example, a plurality of light diffusion layers are stacked to form a light diffusion region.

The light diffusing part can be formed by adding a diffusing material to the base material. For example, a resin material as a base material and white inorganic fine particles such as SiO ₂ or TiO ₂ can be used as the light diffusion portion. In addition, it is also possible to use a light-reflective member that is a white-based resin or metal processed into fine particles for the diffusion material. The base material contains these diffusers irregularly, so that the light passing through the light diffuser is irregularly and repeatedly reflected, so that the transmitted light is diffused in multiple directions, and the localized concentration of the irradiated light is suppressed to prevent brightness Uneven.

The thickness of the wavelength conversion member 12 is preferably set to 0.02 mm to 0.30 mm. In order to exert the thinning and various wavelength conversion effects of the light-emitting module, it is preferably set within the above range.

In the light-emitting device 3 in FIG. 5, the outer shape of the wavelength conversion member 12 is larger than the outer shape of the light-emitting element 11 when viewed from above. The light emitting device 3 allows more light emitted from the second main surface 11c of the light emitting element 11 to pass through the wavelength conversion member 12 and enter the light guide plate 1, thereby reducing color unevenness or brightness unevenness. (Translucent Adhesive Member 19)

As shown in FIG. 5, the light-transmitting adhesive member 19 continuously covers a part of the first side surface 11e of the light emitting element 11, that is, the second main surface side of the first side surface 11e, and a part of the third main surface of the wavelength conversion member 12. In addition, the outer side surface of the light-transmitting adhesive member 19 is preferably an inclined surface extending from the first side surface 11e toward the wavelength conversion member 12. Moreover, it is more preferable that the light emitting element 11 side is a convex curved surface. Thereby, the light emitted from the first side surface 11e can be guided to the wavelength conversion member 12 side, and the light extraction efficiency can be improved.

In addition, a translucent adhesive member 19 may be provided between the second main surface 11c of the light-emitting element 11 and the wavelength conversion member 12. Thereby, for example, since the light-transmitting adhesive member 19 contains a diffusing agent or the like, the light emitted from the second main surface 11c of the light-emitting element 11 diffuses in the light-transmitting adhesive member 19 and enters the wavelength conversion member 12, thereby enabling Reduce uneven brightness. As the light-transmitting adhesive member 19, the same member as the joining member 14 described later can be used. (First light reflective member 15)

Furthermore, in the light emitting device 3, the first side surface 11e is covered by the first light reflective member 15 in a state where the wavelength conversion member 12 is provided in the light emitting element 11. Specifically, the first side surface 11e that is not covered by the light-transmitting adhesive member 19 and the outer side surface of the light-transmitting adhesive member 19 are covered by the first light-reflective member 15. (First packing 41)

The first light reflective member 15 is a material with excellent light reflectivity. As shown in the partially enlarged view of FIG. 5, the first light reflective member 15 contains a first filler 41 having light reflectivity. The first filler 41 may be composed of an inorganic substance derived from metal. Preferably, the first filler 41 is white inorganic particles, such as TiO ₂ . Such a first filler 41 is added to the second resin 42 as a base material, for example, a transparent resin as a white resin, and the first light reflective member 15 is obtained.

The light emitting device 3 covers the other surfaces of the light emitting element 11 except the second main surface 11c with the first light reflective member 15 to prevent light from leaking in directions other than the second main surface 11c. That is, the first light reflective member 15 reflects the light emitted from the first side surface 11e or the first main surface 11d, so that the light emitted by the light-emitting element 11 is effectively radiated from the first main surface 1c of the light guide plate 1 to the outside, and The light extraction efficiency of the light emitting module 100 can be improved.

The first light-reflective member 15 is suitable for white resin having a reflectance of 60% or more, preferably 90% or more of the light emitted from the light emitting element 11. The first light reflective member 15 is preferably a resin containing white pigments such as white powder. Particularly preferred is silicone resin containing inorganic white powder such as TiO ₂ .

The first light-reflective member 15 is in contact with at least a part of the first side surface 11e, and the light-emitting element 11 is buried around the light-emitting element 11, and the electrode 11b of the light-emitting element 11 is exposed on the surface. In the example of FIG. 5, the first light reflective member 15 is in contact with the wavelength conversion member 12. However, the light-transmitting adhesive member as described above can also be interposed between the first light-reflective member 15 and the wavelength conversion member 12. (The first inclined surface 12f)

As shown in FIG. 5, the distance between the third side surfaces 15e in the cross section perpendicular to the second main surface 11c is smaller than the second side surface at the position where the translucent adhesive member 19 is disposed on the upper end of the first side surface 11e The distance between 12e. In other words, the width of the first light reflective member 15 is configured to be narrower than the width of the wavelength conversion member 12 on the fourth main surface side. Specifically, the wavelength conversion member 12 having a wider width than the first light reflective member 15 forms a first inclined surface 12f in an area of the second side surface that is close to the third main surface 12c. The first inclined surface 12f is inclined from the third main surface 12c which is the upper end of the second side surface 12e. In other words, the wavelength conversion member 12 has a shape as if the corners of the third main surface 12c are chamfered. Thereby, the light incident from the light emitting element 11 to the wavelength conversion member 12 can be reflected in the direction of being extracted to the outside by the inclination of the first inclined surface 12f, thereby increasing the components extracted to the outside, thereby improving the light of the entire light emitting device. Extraction efficiency.

The first inclined surface 12f is continuously inclined from the third side surface 15e toward the second side surface 12e. The first inclined surface 12f is preferably formed at least partially in a curved shape. By setting the first inclined surface 12f in a curved shape with respect to the plane shape, the area of the first inclined surface 12f can be increased, so that the components extracted to the outside can be increased, and the light extraction efficiency of the entire light emitting device can be improved . (Light reflective particles 44)

Furthermore, the wavelength conversion member 12 has attached to the first inclined surface 12f light reflective particles 44 that reflect the light emitted by the light emitting element 11. Thereby, in addition to the above-mentioned inclination of the first inclined surface 12f, the light reflective particles 44 arranged on the first inclined surface 12f scatter the light from the light emitting element 11, thereby further increasing the components extracted to the outside. In addition, since FIG. 5 is a cross-sectional view of the light emitting device, a part of the first inclined surface 12f can be seen. In the case of a light emitting device having a rectangular shape in a plan view, the first inclined surface 12f exists on each of the four surfaces corresponding to the four sides of the rectangular shape in a plan view.

The light reflective particles 44 preferably include the same material as the first filler 41. In this example, white inorganic fine particles such as TiO ₂ are contained as the first filler 41 in a base material such as silicone resin. More preferably, the first filler 41 is mixed in the same base material as the second resin 42 constituting the first light reflective member 15. Thereby, the first light-reflective member 15 and the light-reflective particles 44 can be made common, and it is easy to manufacture.

In addition, it is preferable that the wavelength conversion member 12 does not allow the light reflective particles 44 to adhere to the second side surface 12e. However, the light reflective particles 44 can also be adhered to the second side surface 12e to some extent. In this case, as shown in FIG. 6, for example, the adhesion amount of the second side surface 12e is reduced more than the first inclined surface 12f. 6 is a view of the light-emitting device viewed from the side. The first inclined surface 12f is the area enclosed by the dotted line in the figure, and the light reflective particles 44 are attached in the area enclosed by the dotted line. (Method of manufacturing light emitting device)

Next, based on the schematic cross-sectional views of FIGS. 7 to 12, a method of manufacturing the light-emitting device of Embodiment 1 will be described. First, as shown in FIG. 7, the first resin layer 50, the light emitting element 11, and the second resin layer 40 are prepared. Here, the first resin layer 50 is coated on the substrate 30. The substrate 30 may use, for example, an adhesive tape having an adhesive layer. Thereby, the wavelength conversion member 12 attached to the substrate 30 can be easily peeled off. The first resin layer 50 contains a phosphor mixed with a first resin as a base material, and becomes the wavelength conversion member 12 after curing. As the first resin, the above-mentioned silicone resin or the like can be used. In addition, YAG-based phosphors and the like can be used as the phosphor.

In the state where the first resin layer 50 is cured, a plurality of light emitting elements 11 are arranged on the upper surface of the resin layer 50 separated from each other. The light emitting element 11 has the first main surface 11 d as the upper surface, and the second main surface 11 c is attached to and fixed to the first resin layer 50. Furthermore, the second resin 42 is applied between adjacent light-emitting elements 11. The second resin 42 is mixed with the first filler 41 having light reflectivity in the second resin 42 as the base material, and becomes the first light reflective member 15 after curing. In addition, on the first main surface 11d, in order to expose the electrode 11b from the second resin layer 40, the second resin 42 is applied in a state where a mask is arranged to cover the electrode 11b as needed. Alternatively, the second resin layer may be formed to cover the electrode 11b, and then formed to expose the electrode 11b by polishing or the like. In this way, after the second resin 42 is cured, an intermediate body in which the light-emitting element 11 and the second resin layer 40 are provided on the first resin layer 50 is obtained as shown in FIG. 7.

Next, as shown in FIGS. 8 and 9, a first cutting area 46 is formed on the intermediate body. Here, the first blade 61 having the first thickness (first blade thickness) cuts the adjacent light-emitting elements 11 of the second resin layer 40 at specific intervals. Then, cutting is stopped with the first resin layer 50 exposed on the bottom surface of the first cutting area 46. At this time, not only the second resin layer 40 is cut, but also a part of the first resin layer 50 is preferably cut. Thereby, the second resin layer 40 can be penetrated reliably and the first resin layer 50 can be exposed. The first blade 61 is made of a superhard metal saw, an electroformed blade, a metal bonded blade, and other materials. Here, dry cutting is performed by the first blade 61. Therefore, cutting chips 45 of the first resin layer 50 are generated during the cutting process. The cutting chips 45 are removed by suction or the like, and a certain amount is intentionally left in the first cutting area 46. The cutting chips 45 are light reflective particles 44 described later.

Furthermore, as shown in FIG. 10 and FIG. 11, it is divided into individual light emitting devices 3. Here, as shown in FIG. 10, the first cutting area 46 is further cut to form the second cutting area 48. Specifically, by inserting a second edge 62 having a second thickness (second edge thickness) thinner than the first thickness (first edge thickness) into the first cutting area 46, cutting is in the first cutting area 46 The first resin layer 50 directly below forms a second cutting area 48. At this time, as shown in FIG. 11, the cutting chips 55 of the first resin layer 50 are sucked by the sucker 60. As a result, as shown in FIG. 11, the light-emitting devices 3 are divided. At the same time, a first inclined surface 12f is formed on the side surface of each light-emitting device 3. The first inclined surface 12f is formed in the vicinity of the area where the first light reflective member 15 is joined in the second side surface 12e. The first inclined surface 12f is in a state inclined from the main plane of the second side surface 12e. Such a first inclined surface 12f is formed on the edge of the first cutting area 46 during the cutting process by the first edge 61 or the second edge 62. The processing of the first inclined surface 12f can be performed using other tools different from the first blade 61 or the second blade 62, or can be performed during the processing of the second cutting area 48 using the second blade. Thereby, when the light-emitting element of the light-emitting device emits light, an inclined surface that reflects the light incident on the wavelength conversion member in a direction extracted to the outside according to the inclination direction of the first inclined surface can be obtained.

Furthermore, the light reflective particles 44 are attached to the first inclined surface 12f. After the light-reflective particles 44 are formed on the first inclined surface 12f, separately prepared light-reflective particles are fixed on the surface with an adhesive material or the like. Alternatively, while forming the first inclined surface 12f, cutting chips generated by the cutting of the first cutting area 46 are attached to the first inclined surface 12f. The cutting chips generated by the cutting of the first cutting area 46 are light-reflective particles, so they can be used as light-reflective particles 44 to be attached to the first inclined surface 12f. Furthermore, when the second blade 62 is inserted to cut the first resin layer 50 directly below the first cutting area 46, the second thickness (second blade thickness) is thinner than the first thickness (first blade thickness). Therefore, the second blade 62 does not touch the second resin layer 40, and therefore, no cutting chips of light reflective particles are generated. That is, when the first resin layer 50 is cut by the second blade 62, it is possible to prevent or suppress the adhesion of cutting chips of light reflective particles to the side surface of the first resin layer 50. The amount of adhesion to the first inclined surface 12f can be appropriately adjusted by adjusting the number of rotations and suction of the blade.

The light reflective particles 44 are fixed to the first inclined surface 12f in a required amount. For example, the adhesive is applied with a spray to fix the light reflective particles 44 to the first inclined surface 12f.

In this way, as shown in FIG. 12, the light-emitting device 3 arranged on the substrate 30 is manufactured. In addition, FIGS. 7 to 12 are diagrams showing the steps of cutting in a direction perpendicular to the paper surface, but there are also steps of cutting in a direction parallel to the paper surface as in this step. Thereafter, each light-emitting device 3 is peeled off from the substrate 30 to obtain a singulated light-emitting device 3.

In this way, the light passing through the wavelength conversion member 12 is reflected in the direction extracted to the outside according to the inclination direction of the first inclined surface 12f, and the light is further scattered by the light reflective particles 44 arranged on the first inclined surface 12f, thereby increasing The components extracted to the outside can improve the light extraction efficiency of the entire light emitting device. [Embodiment 2]

In the above example, an example in which the inclined surface is provided on the wavelength conversion member 12 side has been described, but the present invention is not limited to this configuration. For example, the inclined surface may be provided on the side of the first light reflective member 15 instead of on the side of the wavelength conversion member. Fig. 13 is a schematic cross-sectional view showing this example as the light-emitting device 3B of the second embodiment. The light-emitting device 3B shown in the figure includes a light-emitting element 11, a wavelength conversion member 12, a light-transmitting adhesive member 19, a first light-reflective member 15, and light-reflective particles 44. In addition, members having the same functions as the members described above are denoted by the same symbols and detailed descriptions are omitted.

The light emitting device 3B shown in FIG. 13 has a second inclined surface 15f as an inclined surface on the first light reflective member 15. The second inclined surface 15f is provided in a region of the third side surface 15e close to the third main surface 12c. The second inclined surface 15f is inclined from the third side surface 15e in a downwardly widening direction. With this, according to this structure, since the area where the first light reflective member 15 and the third main surface 12c are joined can be increased, the effect of improving the adhesion between the first light reflective member 15 and the wavelength conversion member 12 can be obtained. Furthermore, the effect of reflecting the light incident on the wavelength conversion member in the direction extracted to the outside is improved. In addition, by arranging light reflective particles 44 on the third main surface 12c side (near 15f) of the wavelength conversion member 12, the range of light distribution can be adjusted.

The method of manufacturing the light-emitting device 3B of Embodiment 2 is substantially the same as the method of manufacturing the light-emitting device 3 of Embodiment 1 described above. The main difference is that when the second resin layer 40 forms the first cutting area 46B, the first edge 61 cuts the second resin layer 40 so that the cutting reaches the first resin layer at the front end of the first edge 61 Stop before 50. Thereby, as shown in FIG. 14, the first cutting area 46B is formed only in the second resin layer 40, and the first resin layer 50 is not exposed on the bottom surface of the first cutting area 46B. Furthermore, as shown in FIG. 15, the second blade 62 is inserted into the first cutting area 46B, and the second cutting area 48B is formed as shown in FIG. 16, and the light emitting device 3B is singulated into pieces. Thus, the light-emitting device 3B of Embodiment 2 is obtained. [Embodiment 3]

In the configuration described above, an example in which the inclined surface is provided on either the wavelength conversion member 12 or the first light reflective member 15 has been described. However, the present invention is not limited to this configuration, and the inclined surface may be provided on the wavelength conversion member and the first light reflective member. Fig. 17 is a schematic cross-sectional view showing the light-emitting device 3C of the third embodiment in this example. The light emitting device 3C shown in the figure has an inclined surface 49 continuous from the first light reflective member 15 across the wavelength conversion member 12. The inclined surface 49 is formed by the second inclined surface 15f of the first light reflective member 15 and the first inclined surface 12f of the wavelength conversion member 12. With this structure, the same effects as the above-mentioned Embodiments 1 and 2 can also be obtained. That is, with the first inclined surface 12f, it is possible to obtain an embodiment in which the light introduced from the light-emitting element 11 is reflected on the inner side of the wavelength conversion member 12 to increase the components of the wavelength-converted light, and the utilization efficiency of light can be improved as a whole The effect of 1 and the effect of the second embodiment of increasing the area where the first light-reflective member 15 and the third main surface 12c are joined to improve the adhesion. In this embodiment, the light-reflective particles 44 can also be attached to the first inclined surface 12f of the inclined surface 49 in the same manner as in other embodiments, so as to increase the components extracted to the outside.

The light-emitting devices of this embodiment 1 to 3 can be used to form a light-emitting module. Hereinafter, the description of the light-emitting module shown in FIG. 3 etc. which is constructed using the light-emitting device 3 of the first embodiment will be continued. (Light guide plate 1)

The light guide plate 1 is a translucent member that makes light incident from a light source into a plane shape and radiates to the outside. As shown in FIG. 3, the light guide plate 1 has a light guide plate first main surface 1c as a light-emitting surface, and a light guide plate second main surface 1d on the opposite side of the light guide plate first main surface 1c. The light guide plate 1 is provided with a plurality of recesses 1b on the second main surface 1d of the light guide plate. In addition, in this embodiment, grooves 1e are provided between adjacent recesses 1b.

In addition, a part of the light emitting device 3 is arranged in the recess 1b. In detail, the wavelength conversion member 12 arranges a part of the light emitting device 3 in the recess 1b of the light guide plate 1 so as to face the bottom surface of the recess 1b. Thereby, the whole light-emitting module can be thinned. As shown in FIG. 2 and FIG. 3, the light guide plate 1 is provided with a plurality of recesses 1 b, and a part of the light emitting device 3 is disposed in each recess 1 b, and can be used as a light emitting module 100.

Or, as shown in FIG. 4, a part of a light-emitting device 3 can be arranged on a certain light guide plate 1'of a concave portion 1b, and a plurality of light guide plates 1'can be arranged in a planar shape as the light-emitting module 100'. As shown in FIG. 3, the light guide plate 1 provided with a plurality of recesses 1b has grooves 1e in a dot matrix between the recesses 1b. As shown in FIG. 4, the light guide plate 1 ′ provided with a recess 1 b has an inclined surface 1 f on the outer periphery of the second main surface 1 d of the light guide plate toward the outer periphery.

The inclined surface 1f provided on the outer periphery of the groove 1e or the second main surface 1d of the light guide plate is provided with a second light reflective member 16 on its surface. The details of the second light-reflective member 16 arranged in the groove 1e are described later, but it is preferable to use white resin that reflects the light from the light-emitting device 3 to prevent the light-emitting element 11 from entering the adjacent light guide plate 1 divided by the groove 1e , To prevent the light of each light emitting element 11 from leaking to the neighboring. The second light-reflective member 16 joined to the inclined surface 1f provided on the outer periphery of the second main surface 1d of the light guide plate 1'of one light guide plate 1'prevents light from leaking to the periphery of the light guide plate 1, and prevents the light from the light guide plate 1 The luminous intensity of the first main surface 1c of the light guide plate decreases.

The size of the light guide plate 1 is appropriately set according to the size of the liquid crystal display device 1000, but for example, in the light guide plate 1 having a plurality of recesses 1b, one side can be set to be about 1 cm to 200 cm, preferably 3 cm to 30 cm The thickness can be set at about 0.1 mm to 5 mm, preferably 0.1 mm to 3 mm. The planar shape of the light guide plate 1 can be, for example, substantially rectangular or substantially circular.

As the material of the light guide plate 1, resin materials such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate, polyester and other thermoplastic resins, epoxy resin, silicone and other thermosetting resins can be used. Or optically transparent materials such as glass. In particular, thermoplastic resin materials are preferred because they can be efficiently manufactured by injection molding. Among them, polycarbonate with high transparency and low price is preferred. In the manufacturing process, the light-emitting module manufactured without being exposed to the high-temperature environment like solder reflow can also use materials with thermoplasticity and low heat resistance like polycarbonate.

In addition, the light guide plate 1 may be formed by a single layer, or may be formed by stacking a plurality of translucent layers. When a plurality of light-transmitting layers are laminated, it is preferable to provide layers with different refractive indexes between arbitrary layers, such as air layers. In this way, a light-emitting module can be made that makes it easier to diffuse light and reduces uneven brightness. Such a structure can be realized by providing an air layer as partitions are provided between arbitrary plural light-transmitting layers, for example. In addition, a light-transmitting layer may be provided on the first main surface 1c of the light guide plate of the light guide plate 1, and a layer with different refractive index may be provided between the first main surface 1c of the light guide plate of the light guide plate 1 and the light-transmitting layer. For example, the air layer. Thereby, it is possible to produce a liquid crystal display device that diffuses light more easily and reduces unevenness in brightness. Such a structure can be realized by providing an air layer to partition the light guide plate 1 and the light-transmitting layer by providing a partition between them, for example. (Concave 1b)

The light guide plate 1 is provided with a recess 1b on the second main surface 1d side of the light guide plate. A part of the light-emitting device 3 is arranged in the recess 1b such that the wavelength conversion member 12 faces the bottom surface of the recess 1b. The inner surface of the recess 1b is larger than the outer surface of the light emitting device 3 in a plan view. In detail, as shown in FIG. 3, the inner surface of the recess 1 b is located more outside than the outer surface of the light emitting device 3.

When the light guide plates 1, 1'of FIGS. 2 to 4 are viewed from above, the inner shape of the recess 1b is a quadrilateral, and the outer shape of the light emitting device 3 arranged here is also a quadrilateral. The quadrilateral light-emitting device 3 arranged in the quadrilateral recess 1b can also be configured such that each outer surface of the light-emitting device 3 is parallel to the inner surface of the opposing recess 1b. Furthermore, it may be configured such that the outer surfaces of the light emitting device 3 are rotated by 45° with respect to the inner surfaces of the recess 1b. Moreover, it is preferable to arrange it so that the center of the bottom surface of the recessed part 1b and the center of the light emitting device 3 may be substantially the same in a plan view. Thereby, the distance from the side surface of the light emitting device 3 to the inner side surface of the recess 1b can be set to a specific value, which can improve the color unevenness of the light emitting module. However, the light-emitting device whose outer shape is a quadrilateral can also be arranged so that each side crosses the concave portion of the quadrilateral, in other words, the posture of rotation relative to the concave portion of the quadrilateral can be arranged.

Here, although the size of the recess 1b in plan view is changed due to the shape of the light emitting device 3, the diameter in the case of a circle, the long diameter in the case of an ellipse, and the diagonal length in the case of a quadrilateral can be set to, for example, 0.05 mm to 10 mm. , Preferably 0.1 mm to 2 mm. The depth can be set to 0.05 mm to 4 mm, preferably 0.1 mm to 1 mm. The shape of the concave portion 1b in a plan view can be, for example, a substantially rectangular shape or a substantially circular shape, and can be selected according to the arrangement pitch of the concave portion 1b. When the arrangement pitch of the recesses 1b (the distance between the centers of the closest two recesses 1b) is approximately equal, it is preferably approximately circular or approximately square. Among them, it is made into a substantially circular shape, which has the effect of diffusing the light from the light emitting device 3 well.

The height from the bottom surface of the concave portion 1b to the concave portion 1b of the second main surface 1d of the light guide plate, in a cross-sectional view, as shown in FIG. 3, is more preferably the second main surface 11c of the light-emitting element 11 and the second main surface 1d of the light guide plate It is the height of the recess 1b which is substantially flush. Moreover, the height of the recess 1b can also be set such that when the light-emitting device 3 is installed in the recess 1b, the position of the third main surface 12c is higher than the second main surface 1d of the light guide plate. Thereby, the light-emitting device 3 protrudes from the recessed part 1b, and the wiring work of the electrode 11b, etc. can be performed easily. In this way, it is preferable to adjust the height of the recess 1b according to the height of the light-emitting device 3. (Joint member 14)

The light-transmitting joining member 14 is in contact with the inner surface of the recess 1b and the outer surface of the light emitting device 3. That is, the light-transmitting joining member 14 extends from the inner side surface of the recess 1b to the third side surface of the light emitting device 3 located outside the recess 1b. In addition, the joining member 14 may be in contact with a part of the first light reflective member 15 located on the outer side of the concave portion 1b. In other words, it may be configured to continuously cover the fourth main surface 12d, the second side surface 12e, and the third side surface 15e. Furthermore, the joining member 14 has an outer side surface inclined with respect to the third side surface 15e and an inclined surface 14a. The inclined surface 14a is arranged such that the inclined angle α formed with the third side surface 15e is an acute angle. In addition, the bonding member 14 may be arranged between the wavelength conversion member 12 and the bottom surface of the recess 1b.

As shown in FIG. 3, when the light-emitting device 3 of Embodiment 1 is fixed in the recess 1b by the bonding member 14, an inclined surface is formed near the third main surface 12c of the light-emitting device 3, thereby exerting an anchoring effect and improving Tightness.

Furthermore, as shown in FIG. 3, the joining member 14 is in contact with the second main surface 1d of the light guide plate of the light guide plate 1. Thereby, the area where the inclined surface 14a is formed is enlarged, more light can be reflected, and uneven brightness can be reduced. Here, the inclination angle α formed by the inclined surface 14a of the joining member 14 and the third side surface 15e may be 5° to 85°, preferably 5° to 50°, more preferably 10° to 45°. The width d1 between the outer side surface of the light-emitting device 3 and the inner side surface of the recess 1b may vary depending on the inner diameter of the recess 1b, the outer diameter of the light-emitting device 3, or the same shape, or the posture when the light-emitting device 3 is installed in the recess 1b, and the light emission. The tolerance of the installation position of the device 3 is changed. In addition, the inclination angle α also changes depending on the height of the bonding member 14, that is, the height of the light emitting device 3 (the height of the light emitting element 11 or the thickness of the wavelength conversion member 12), and the depth (height) of the recess 1b. Thereby, the inclination angle α formed by the inclined surface 14a of the joining member 14 that faces the second main surface 1d and widens downward and the outer side surface of the first light reflective member 15 is also set according to these conditions.

In addition, as shown in FIG. 3, the joining member 14 has an inclined surface 14a in a cross-sectional view. This shape can reflect the light incident on the inclined surface 14a through the joining member 14 to the light emitting surface side in the same state.

As the bonding member 14, a light-transmitting thermosetting resin material such as epoxy resin and silicone resin can be used. In addition, the light transmittance of the joining member is set to 60% or more, preferably 90% or more. Furthermore, the joining member 14 may include a diffuser or the like, or a white powder that is an additive that reflects light, or may be formed only of a translucent resin material that does not contain a diffuser or white powder.

Furthermore, the light-transmitting joining member 14 may have the inclined surface 14a a curved surface when viewed in section. For example, the inclined surface 14a may be a curved surface convex toward the concave portion 1b. The inclined surface 14a can set the traveling direction of the reflected light in the inclined surface 14a to a wide range, and can reduce uneven brightness.

In addition, the inclined surface 14a may cover the entire surface of the third side surface 15e. In the example of FIG. 3 etc., the upper part of the third side surface 15e is left and partially covered by the inclined surface 14a, but the upper end of the inclined surface 14a may be extended to the upper end of the first light reflective member 15. (Optical Function Section 1a)

The light guide plate 1 may be provided with an optical function part 1a having a function of reflecting or diffusing light from the light emitting device 3 on the side of the first main surface 1c of the light guide plate. The light guide plate 1 can diffuse the light from the light emitting device 3 to the side, so that the luminous intensity in the plane of the light guide plate 1 can be averaged. The optical function part 1a may have a function of spreading light in the surface of the light guide plate 1, for example. The optical function portion 1a is, for example, a concavity such as a cone, a quadrangular pyramid, and a polygonal pyramid such as a hexagonal cone, or a concavity such as a truncated cone or a polygonal cone provided on the first main surface 1c of the light guide plate. Thereby, it is possible to use a method that reflects the light irradiated on the interface of the light guide plate 1, the material (for example, air) of different refractive index located in the optical function part 1a, and the inclined surface of the recess toward the side of the light emitting device 3. In addition, for example, it may be a case where a light reflective material (for example, a reflective film such as a metal or a white resin) is provided in a recess having an inclined surface. The inclined surface of the optical function portion 1a may be a flat surface when viewed in section, or a curved surface. (Second light reflective member 16)

As shown in FIG. 3, the second light reflective member 16 covers the second main surface 1d side of the light guide plate 1 of the light guide plate 1. In detail, the second light reflective member 16 covers the area not covered by the bonding member 14 with the second main surface 1d of the light guide plate of the light guide plate 1, the inclined surface 14a and the third side surface 15e of the light-transmitting bonding member 14 .

The second light-reflective member 16 reflects the light emitted from the light-emitting element 11 and enters the light inside the light guide plate 1, and guides the light to the first main surface 1c side of the light guide plate as a light-emitting surface for external light emission, It can improve the light extraction efficiency. In addition, the light guide plate 1 is reinforced by being laminated on the light guide plate 1.

The second light-reflective member 16 can preferably use the same material as the first light-reflective member 15 described above, that is, a white resin in which a light-reflecting additive, which is a white powder, is added to a transparent resin. The second light reflective member 16 effectively radiates the light emitted by the light emitting element 11 from the first main surface 1c of the light guide plate of the light guide plate 1 to the outside.

In addition, the second light reflective member 16 is the same as the first light reflective member 15, and is suitable for white resin having a reflectance of 60% or more with respect to the light emitted from the light-emitting element 11, preferably 90% or more. . The white resin is preferably a resin containing white pigments such as white powder. In particular, silicone resin containing inorganic white powder such as TiO _{2 is} preferred. Thereby, by using a large amount of low-priced raw materials such as TiO ₂ as a large amount of material used for covering one surface of the light guide plate 1, the light-emitting module 100 can be reduced in price.

The above light-emitting module 100 is provided with a recess 1b in the light guide plate 1 and the light-emitting device 3 is arranged in the recess 1b, so the whole can be thinned. In addition, since the recess 1b is provided in the light guide plate 1 and the light emitting device 3 is arranged in the recess 1b, the mounting accuracy of the light emitting device 3 and the light guide plate 1 is improved. In particular, since the light-emitting device 3 in which the light-emitting element 11 is bonded to the wavelength conversion member 12 and the light-emitting element 11 and the wavelength conversion member 12 is integrated in the recessed portion 1b of the light guide plate 1, it is possible to improve the wavelength conversion member 12 and The mounting accuracy of the light-emitting element 11 to the light guide plate 1 achieves excellent light-emitting characteristics. In addition, in the light emitting module 100 that allows the light of the light emitting element 11 to pass through the wavelength conversion member 12 to guide the light to the light guide plate 1 and radiate to the outside, the light emitting element 11, the wavelength conversion member 12, and the light guide plate 1 can be arranged with high precision. Therefore, the luminous characteristics such as uneven color or uneven brightness of the light emitted from the light guide plate 1 to the outside are improved, and particularly excellent luminous characteristics are realized.

The joining member 14 is in contact with the second side surface 12e and the inner side surface of the light guide plate 1, and then is in contact with the first light reflective member 15 located outside the recess 1b, whereby the light emitted from the wavelength conversion member 12 and The light emitted to the side of the second light reflective member 16 is further guided to the side of the light emitting device 3 to improve uneven brightness. In addition, the emitted light can be further incident on the light guide plate 1 from the wavelength conversion member 12, and the light extraction efficiency can be improved.

In the direct bottom type liquid crystal display device, due to the close distance between the liquid crystal panel and the light emitting module, the uneven color or brightness of the light emitting module may affect the uneven color or brightness of the liquid crystal display device Sex. Therefore, as the light-emitting module of the direct type liquid crystal display device, a light-emitting module with less color unevenness or brightness unevenness is desired. If the configuration of the light-emitting module 100 of this embodiment is adopted, not only the thickness of the light-emitting module 100 can be reduced to 5 mm or less, 3 mm or less, 1 mm or less, etc., but also brightness unevenness or color unevenness can be reduced.

In addition, a translucent member having functions such as diffusion may be further laminated on the light guide plate 1. In this case, when the optical function part 1a is recessed, the recessed opening (that is, the portion close to the first main surface 1c of the light guide plate 1 of the light guide plate 1) will be closed, but it is better to provide the transparent part without embedding the recess. Light component. Thereby, an air layer can be arranged in the recess of the optical function part 1a, and the light from the light emitting element 11 can be diffused well. [Industrial availability]

The light-emitting device, the light-emitting module and the manufacturing method of the light-emitting device of the present disclosure can be used as the backlight of TV, flat panel, and liquid crystal display devices, and are preferably applied to TVs, tablets, smart phones, smart watches, head-up displays, Digital signage, bulletin board, etc. It can also be used as a light source for lighting, and can be used for emergency lighting, line lighting, various lighting, vehicle dashboards, and the like.

1: Light guide plate 1': light guide plate 1a: Optical Function Department 1b: recess 1c: The first main surface of the light guide plate 1d: The second main surface of the light guide plate 1e: slot 1f: Inclined surface 3: Light-emitting device 3B: Light-emitting device 3C: Light-emitting device 11: Light-emitting element 11b: Electrode 11c: Second major surface 11d: first major surface 11e: first side 12: Wavelength conversion component 12c: Third major surface 12d: The fourth major surface 12e: second side 12f: The first inclined plane 14: Joint member 14a: Inclined surface 15: The first light reflective member 15e: third side 15f: second inclined surface 16: second light reflective member 19: Light-transmitting adhesive member 24: conductive film 30: Substrate 40: second resin layer 41: The first filler 42: second resin 44: light reflective particles 45: Chips 46: first cutting area 46B: first cutting area 48: second cutting area 48B: second cutting area 49: Inclined surface 50: The first resin layer 55: Chips 60: Attractor 61: First Blade 62: Second Blade 100: Light-emitting module 100': Light-emitting module 110a: lens sheet 110b: lens sheet 110c: diffuser 120: LCD panel 1000: Liquid crystal display device d1: width α: tilt angle

Fig. 1 is a structural diagram showing the various structures of the liquid crystal display device of the first embodiment. FIG. 2 is a schematic top view of the light-emitting module of Embodiment 1. FIG. Fig. 3 is a partial enlarged cross-sectional view of the light-emitting module of the first embodiment, and is a view of the light guide plate being turned upside down. Fig. 4 is a schematic bottom view of a light-emitting module of a modified example. FIG. 5 is a schematic cross-sectional view showing the light-emitting device of Embodiment 1. FIG. Fig. 6 is a photograph showing a light-emitting device of a modified example. FIG. 7 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 1. FIG. FIG. 8 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 1. FIG. FIG. 9 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 1. FIG. 10 is a schematic cross-sectional view showing the manufacturing steps of the light emitting device of Embodiment 1. FIG. 11 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 1. FIG. FIG. 12 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 1. FIG. Fig. 13 is a schematic cross-sectional view showing the light-emitting device of the second embodiment. 14 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 2. 15 is a schematic cross-sectional view showing the manufacturing steps of the light-emitting device of Embodiment 2. 16 is a schematic cross-sectional view showing the manufacturing steps of the light emitting device of Embodiment 2. FIG. 17 is a schematic cross-sectional view showing the light-emitting device of Embodiment 3.

3: Light-emitting device

11: Light-emitting element

11b: Electrode

11c: Second major surface

11d: first major surface

11e: first side

12: Wavelength conversion component

12c: Third major surface

12d: The fourth major surface

12e: second side

12f: The first inclined plane

15: The first light reflective member

15e: third side

19: Light-transmitting adhesive member

41: The first filler

42: second resin

44: light reflective particles

Claims (15)

A light-emitting device including: A light emitting element having: a first main surface on which electrodes are provided; a second main surface on the opposite side of the first main surface; and a first side surface continuous with the first main surface and the second main surface; A wavelength conversion member having: a third main surface, which has a rectangular shape with a larger area than the second main surface, and is joined to the second main surface; and a fourth main surface opposite to the third main surface ; And a second side surface continuous with the third main surface and the fourth main surface; and convert the wavelength of the light emitted by the light-emitting element to emit light of different wavelengths; A light-transmitting adhesive member that continuously covers a part of the second main surface side of the first side surface and the third main surface; and A first light reflective member covering the first side surface provided with the light-transmitting adhesive member and having a third side surface around it; and The above-mentioned first light reflective member contains a first filler having light reflectivity; The distance between the third side surfaces in the cross section perpendicular to the direction of the second main surface is smaller than the distance between the second side surfaces on the fourth main surface side in the second side surface; The wavelength conversion member has a first inclined surface that is inclined in an area close to the third main surface in the second side surface; The wavelength conversion member has light reflective particles on the surface of the first inclined surface. Such as the light-emitting device of claim 1, wherein The first light reflective member has a second inclined surface that is inclined in an area close to the third main surface of the third side surface, and the second inclined surface is continuous with the first inclined surface. The light emitting device of claim 2, wherein the first inclined surface is at least partially formed in a curved shape. Such as the light-emitting device of claim 1, wherein The light reflective particles are made of the same material as the first filler. Such as the light-emitting device of claim 2, wherein The light reflective particles are made of the same material as the first filler. Such as the light-emitting device of claim 3, wherein The light reflective particles are made of the same material as the first filler. The light-emitting device of claim 4, wherein the first filler includes TiO ₂ . The light-emitting device of claim 5, wherein the first filler comprises TiO ₂ . The light-emitting device according to claim 6, wherein the first filler includes TiO ₂ . A light-emitting module, which has: Such as the light-emitting device of any one of claims 1 to 9; The light-transmitting light guide plate has: The first main surface of the light guide plate is a light-emitting surface that emits light to the outside; and The second main surface of the light guide plate, which is the surface on the opposite side of the first main surface of the light guide plate, is provided with a recess for disposing the light emitting device; and The second light reflective member covers the second main surface of the light guide plate and the light emitting device. Such as the light-emitting module of claim 10, where In a cross-sectional view, at least a part of the first light-reflective member has a light-transmitting joining member located outside the concave portion and in contact with the inner surface of the concave portion and the outer surface of the light emitting device; The joining member extends along the third side surface located outside the recess. A method of manufacturing a light-emitting device, which is a method of manufacturing a light-emitting device, the light-emitting device comprising: Light-emitting element Wavelength conversion component; Light-transmitting adhesive member; and The first light reflective member; and the manufacturing method includes the following steps: Preparation: a first resin layer in which a phosphor is mixed in a first resin as the wavelength conversion member; a plurality of the light-emitting elements arranged on the upper surface of the first resin layer separated from each other; and arranged in the adjacent ones Between the light-emitting elements, a second resin layer containing a first filler having light reflectivity as the first light reflective member; Cutting the second resin layer with a first edge having a first thickness at specific intervals to form a first cutting area; and Insert a second edge with a second thickness that is thinner than the first thickness into the first cutting area, and cut the first resin layer directly below the first cutting area to form a second cutting area, which is divided into individual light-emitting areas The device is combined with the side surface of each light-emitting device to form a first inclined surface inclined from the plane of the second side surface in the vicinity of the area where the first light reflective member is joined in the second side surface of the wavelength conversion member, In addition, light reflective particles are attached to the first inclined surface. Such as the method of manufacturing a light emitting device of claim 12, wherein In the step of forming the first cutting area in the second resin layer, a part of the first resin layer is cut with the front end of the first blade. A method of manufacturing a light-emitting device, which is a method of manufacturing a light-emitting device, the light-emitting device comprising: Light-emitting element Wavelength conversion component; Light-transmitting adhesive member; and The first light reflective member; and the manufacturing method includes the following steps: Preparation: a first resin layer in which a phosphor is mixed in a first resin as the wavelength conversion member; a plurality of the light-emitting elements arranged on the upper surface of the first resin layer separated from each other; and arranged in the adjacent ones Between the light-emitting elements, a second resin layer containing a first filler having light reflectivity as the first light reflective member; Cutting the second resin layer with a first edge having a first thickness at specific intervals to form a first cutting area; and Insert a second edge with a second thickness that is thinner than the first thickness into the first cutting area, and cut the first resin layer directly below the first cutting area to form a second cutting area, which is divided into individual light-emitting areas The device is integrated on the side surface of each light-emitting device, and a second inclined surface inclined from the plane of the third side surface is formed near the area where the wavelength conversion member is joined in the side surface of the first light reflective member, that is, the third side surface. Such as the method of manufacturing a light emitting device of claim 14, wherein In the step of forming the first cutting area in the second resin layer, cutting is stopped before the front end of the first blade reaches the first resin layer.

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