CN213071166U - Light emitting module - Google Patents

Light emitting module Download PDF

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Publication number
CN213071166U
CN213071166U CN202020958800.5U CN202020958800U CN213071166U CN 213071166 U CN213071166 U CN 213071166U CN 202020958800 U CN202020958800 U CN 202020958800U CN 213071166 U CN213071166 U CN 213071166U
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China
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light
emitting device
light emitting
guide plate
reflecting member
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CN202020958800.5U
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Chinese (zh)
Inventor
林忠雄
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Liquid Crystal (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The utility model provides a light emitting module can dispose illuminator for the light guide plate with high position accuracy. The light emitting module includes: a light guide plate having a first surface, a second surface opposite to the first surface, and a through portion passing through between the first surface and the second surface; a light emitting device disposed on the second surface side of the through portion; a light-transmitting member provided on the first surface side in the through portion and between the light-emitting device and the side wall of the through portion; and a first light reflecting member provided between the upper surface of the light emitting device and the translucent member, and contacting the upper surface of the light emitting device.

Description

Light emitting module
Technical Field
The utility model relates to a light-emitting module.
Background
A light emitting module in which a light emitting element such as a light emitting diode and a light guide plate are combined is widely used for a surface light source such as a backlight of a liquid crystal display. For example, patent document 1 discloses a configuration in which a light guide plate having a plurality of through holes formed therein is joined to a substrate on which a plurality of light sources are mounted, and the light sources are disposed in the through holes.
Patent document 1: japanese patent laid-open publication No. 2011-211085
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a light emitting module can dispose illuminator in the light guide plate with high position accuracy.
According to the utility model discloses an aspect, light-emitting module possesses: a light guide plate having a first surface, a second surface opposite to the first surface, and a through portion passing through between the first surface and the second surface; a light emitting device disposed on the second surface side of the through portion; a light-transmitting member provided on the first surface side in the through portion and above the light-emitting device and between the light-emitting device and the side wall of the through portion; and a first light-reflecting member provided between an upper surface of the light-emitting device and the light-transmitting member, and contacting the upper surface of the light-emitting device.
According to an aspect of the present invention, a light-emitting module can be provided, in which a light-emitting device can be arranged on a light guide plate with high positional accuracy.
Drawings
Fig. 1 is a schematic cross-sectional view of a light emitting module according to an embodiment.
Fig. 2 is a schematic cross-sectional view of a light emitting module according to an embodiment.
Fig. 3A is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 3B is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 4A is a cross-sectional view schematically illustrating a method of manufacturing a light-emitting module according to an embodiment.
Fig. 4B is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 5A is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 5B is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 6A is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 6B is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 7 is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 8A is a schematic perspective view illustrating a method of manufacturing a light-emitting module according to an embodiment.
Fig. 8B is a schematic cross-sectional view showing a method of manufacturing a light-emitting module according to an embodiment.
Fig. 9 is a schematic sectional view of a light emitting module of another embodiment.
Fig. 10A is a schematic cross-sectional view showing a method for manufacturing a light-emitting module according to another embodiment.
Fig. 10B is a schematic cross-sectional view showing a method for manufacturing a light-emitting module according to another embodiment.
Fig. 11 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 12 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 13 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 14 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 15 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 16 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 17 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 18 is a schematic sectional view of a light emitting module of still another embodiment.
Fig. 19A is a schematic sectional view of a light-emitting device of still another embodiment.
Fig. 19B is a schematic sectional view of a light-emitting device of still another embodiment.
Fig. 19C is a schematic sectional view of a light-emitting device of still another embodiment.
Fig. 20 is a schematic plan view of a light emitting module of an embodiment.
Fig. 21 is an exploded perspective view showing the structure of the liquid crystal display according to the embodiment.
Description of the marks
10: light guide plate
11: first side
12: second surface
13: inclined plane
15: penetration part
15': through hole
20: light emitting device
21: light emitting element
22: phosphor layer
23: first light-reflecting member
24: second light-reflecting Member
25: electrode part
26: rear electrode
27: conductive film
30: translucent member
31: concave part
40: fourth light-reflecting Member
50: third light-reflecting Member
61: wiring harness
70: air layer
100: sheet material
120: liquid crystal panel
200: light emitting module
1000: liquid crystal display device with a light guide plate
Detailed Description
Hereinafter, embodiments will be described with reference to the drawings. In the drawings, the same elements are denoted by the same reference numerals.
Fig. 1 is a schematic cross-sectional view of a light-emitting module according to an embodiment of the present invention. Fig. 1 shows a cross section cut at a position passing through the center axis of the through-hole 15 formed in the light guide plate 10.
The light emitting module of the embodiment includes a light guide plate 10, a light emitting device 20, and a light transmissive member 30.
The light guide plate 10 has transparency to light emitted from the light emitting device 20. As a material of the light guide plate 10, for example, a thermoplastic resin such as acryl, polycarbonate, cyclic polyolefin, polyethylene terephthalate, or polyester, a thermosetting resin such as epoxy or silicon, or glass can be used. The thickness of the light guide plate 10 is preferably 100 μm to 1000 μm, and more preferably 200 μm to 800 μm.
The light guide plate 10 has a first surface 11 serving as a light-emitting surface and a second surface 12 opposite to the first surface 11. The light guide plate 10 has a through portion 15 that penetrates between the first surface 11 and the second surface 12.
The light-emitting device 20 includes a light-emitting element 21 and a phosphor layer 22 as a light-transmitting member. The phosphor layer 22 is disposed on the upper surface of the light emitting element 21. The phosphor layer 22 may be in contact with the upper surface of the light emitting element 21, or may be bonded with an adhesive or the like. The light-emitting element 21 has a semiconductor multilayer body. The semiconductor stack contains, for example, InxAlyGa1－x－yN (x is more than or equal to 0, y is more than or equal to 0, and x + y is less than or equal to 1) can emit blue light.
The phosphor layer 22 includes a base material and a phosphor dispersed in the base material. As a material of the base material of the phosphor layer 22, for example, silicone resin, epoxy resin, glass, or the like can be used. The phosphor is a wavelength conversion substance that is excited by light emitted from the light emitting element 21 and emits light having a wavelength different from that of the light emitted from the light emitting element 21. For example, as the phosphor, yttrium-aluminum garnet phosphor (e.g., Y) can be used3(Al，Ga)5O12: ce), lutetium aluminum garnet phosphor (e.g., Lu)3(Al，Ga)5O12: ce), terbium aluminum garnet phosphor (e.g., Tb3(Al, Ga)5O12: ce), β sialon phosphor (e.g., Si)6－zAlzOzN8－z: eu (0 < z < 4.2)), and an alpha sialon phosphor (e.g., Mz (Si, Al)12(O，N)16(wherein 0 < z.ltoreq.2, and M is Li, Mg, Ca, Y, or a lanthanum element other than La and Ce), and a phosphor of nitrogen-containing calcium aluminosilicate (CASN or SCASN) (e.g., (Sr, Ca) AlSiN3: eu) and the like, and KSF-based phosphor (K)2SiF6: mn) or MGF phosphor (3.5 MgO.0.5 MgF)2·GeO2: a fluoride phosphor such as Mn) or a silicate phosphor (e.g., (Ba, Sr)2SiO4: eu), chlorosilicate based phosphor (e.g., Ca)8Mg(SiO4)4Cl2: eu), and the like. The phosphor layer 22 may also contain a plurality of phosphors. Further, a plurality of the above phosphors may be stacked.
A second light-reflecting member 24 is provided on a side surface of the light-emitting element 21. A pair of positive and negative element electrodes is provided on the opposite side of the upper surface of the light-emitting element 21. The element electrode may include an ohmic electrode in ohmic contact with the semiconductor layer and a columnar electrode (back electrode 26) further connected to the ohmic electrode. A conductive film 27 is provided on the lower surface of the rear electrode 26 and the lower surface of the second light-reflecting member 24. Although the light-emitting element 21 including the rear electrode 26 will be described below, the rear electrode 26 may be omitted, and in this case, the rear electrode 26 may be replaced with an element electrode.
The rear electrode 26 is connected to the conductive film 27. The rear electrode 26 is provided on the lower surface of the light emitting element 21, and the conductive film 27 extends from the rear electrode 26 to a region outside the lower surface (side surface) of the light emitting element 21. The rear electrode 26 and the conductive film 27 function as the electrode portion 25 of the light-emitting device 20. The conductive film 27 may cover only the lower surface of the rear electrode 26. Further, the light-emitting device may be a light-emitting device without the conductive film 27.
The second light-reflecting member 24 is provided between the conductive film 27 on the side of the light-emitting element 21 and the phosphor layer 22. The second light-reflecting member 24 directly or indirectly covers the side surface of the light-emitting element 21. For example, an adhesive or the like for connecting the phosphor layer 22 and the light emitting element 21 may be disposed on the side surface of the light emitting element 21. Further, the side surface of the light emitting element 21 may be coated with the second light reflecting member 24 via the adhesive. The second light-reflecting member 24 is also disposed between a pair of rear electrodes 26 on the lower surface of the light-emitting element 21. That is, at least a part of the lower surface of the semiconductor multilayer body of the light-emitting element 21 is covered with the second light-reflecting member 24.
The light emitting device 20 is disposed on the second surface 12 side of the through portion 15 of the light guide plate 10. That is, the light emitting device 20 is disposed at a position closer to the second surface 12 than the first surface 11. Light emitting element 21 is located on the side closer to second surface 12 than phosphor layer 22, and phosphor layer 22 is located on the side closer to first surface 11 than light emitting element 21.
The light-transmitting member 30 is provided in the through portion 15 of the light guide plate 10. The light-transmitting member 30 has transparency to light emitted from the light-emitting device 20, and for example, the same resin as the material of the light guide plate 10 or a resin having a small refractive index difference from the material of the light guide plate 10 can be used. Alternatively, glass may be used as the material of the light-transmissive member 30.
The translucent member 30 is provided on the light-emitting device 20 and between the side surface of the light-emitting device 20 and the side wall of the through portion 15. The light emitting device 20 is fixed to the light guide plate 10 via the translucent member 30. Spaces such as air layers are not formed between the side surfaces of the light-emitting device 20 and the light-transmissive member 30, between the side walls of the through portion 15 and the light-transmissive member 30, and between the upper surface of the light-emitting device 20 and the light-transmissive member 30. However, the present invention is not limited to this, and air may be contained in the translucent member 30.
A recess 31 may be provided on the upper surface of the translucent member 30. The concave portion 31 may be formed as a concave portion having a conical shape such as a cone or a pyramid, or a truncated cone such as a truncated cone or a truncated pyramid. Alternatively, the concave portion may be formed in a shape recessed so as to be foldable only in one direction in a plan view, such as a triangular column shape or a semi-cylindrical shape. The opening diameter of the recess 31 may be set to a diameter equal to the opening diameter of the through portion 15. Alternatively, the opening diameter of the recess 31 may be smaller than the opening diameter of the through portion 15. The center of the recess 31 may coincide with the center of the through portion 15 in a plan view. The center of the concave portion 31 may coincide with the center of the light emitting device 20 in a plan view. Alternatively, depending on the position of the through portion 15, the center of the concave portion 31 may not coincide with the center of the through portion 15 in a plan view, or may not coincide with the center of the light emitting device 20. In the example shown in fig. 1, a recess 31 having a V-shaped cross section is provided. That is, an inclined surface inclined with respect to the first surface 11 is provided on the upper surface of the light-transmitting member 30. By reflection and refraction of light at the interface between the light-transmissive member 30 and the air at the inclined surface, concentration of brightness in the region directly above the light-emitting device 20 can be suppressed. Alternatively, by providing a curved surface or a convex portion on the upper surface of the light-transmissive member 30, light diffusion or light emission efficiency can be improved.
The first light reflecting member 23 is provided between the upper surface of the light emitting device 20, that is, the upper surface of the phosphor layer 22, and the light transmitting member 30. The first light-reflecting member 23 is in contact with the upper surface of the light-emitting device 20 (in this example, the upper surface of the phosphor layer 22) and directly covers the upper surface of the light-emitting device 20. The first light-reflecting member 23 may be a part of the light-emitting device 20.
A third light reflecting member 50 is provided around the light emitting device 20 disposed in the through portion 15 on the second surface 12 side of the light guide plate 10. The third light-reflecting member 50 is provided on the side surface of the second light-reflecting member 24, and is not provided on at least a part of the side surface of the phosphor layer 22. A part or the whole of the side surface of the phosphor layer 22 is covered with the light-transmitting member 30. Preferably, the entire side surface of the phosphor layer 22 is in contact with the light-transmitting member 30.
The second surface 12 of the light guide plate 10 includes a flat surface parallel to the first surface 11 and a concave portion having the inclined surface 13 as an inner surface. Further, the corner between the second face 12 and the inclined face 13 may also have a curvature. Further, a linear portion may be included between the second surface 12 and the inclined surface 13. The fourth light reflecting member 40 is provided on the second surface 12 and the inclined surface 13 (i.e., the inner surface of the recess). The inclined surface 13 of the second surface 12 is provided on the inner surface of the recess of the second surface 12 so as to surround the through hole in a plan view. When the light guide plate 10 includes the plurality of through-holes 15, the inclined surface 13 is, for example, an inner surface of a recess disposed between the through-hole 15 and the adjacent through-hole 15 as shown in fig. 2. When the light guide plate 10 includes a plurality of through-holes 15, the recessed portions of the second surface 12 are arranged in a grid pattern, and one through-hole 15 is provided in a region surrounded by each grid. The second surface 12 of the light guide plate 10 may not include the inclined surface 13. That is, the second surface 12 may be a flat surface. The second surface 12 may be a sloped surface only, and may not have a flat surface. That is, the penetrating portion 15 and the inclined surface 13 may be in contact with each other.
The first, second, third and fourth light-reflecting members 23, 24, 50 and 40 may be made of, for example, white resin containing a light-reflecting material (or a light-scattering material). The first, second, third and fourth light-reflecting members 23, 24, 50 and 40 comprise TiO, for example2、SiO2、Al2O3And ZnO, etc. as a silicone resin or an epoxy resin for a light reflecting member (or a light scattering member). The first light-reflecting member 23 and the fourth light-reflecting member 40 may be made of a light-reflecting metal, a dielectric film (dielectric sheet), or the like. In addition, when used as the first and fourth light-reflecting members 23 and 40, a resin sheet that is recognized as white by including air bubbles may be used in addition to the above-described resin sheet made of white resin.
The first light reflecting member 23 reflects a part of the light emitted directly above the light emitting device 20 in the downward direction or the lateral direction, and transmits the other part. This can prevent the vicinity directly above the light-emitting device 20 from becoming excessively brighter than other regions on the light-emitting surface of the light-emitting module.
Light emitted downward from the fluorescent material or light emitted laterally and downward from the light-emitting element 21 is reflected upward by the second and third light-reflecting members 24 and 50, and the brightness of light extracted from the first surface 11, which is the light-emitting surface, can be increased.
Further, the fourth light reflecting member 40 provided on the second surface 12 and the inclined surface 13 of the light guide plate 10 reflects the light guided in the light guide plate 10 toward the first surface 11, thereby improving the brightness of the light extracted from the first surface 11.
The lower surface of the fourth light-reflecting member 40, the lower surface of the third light-reflecting member 50, and the lower surface of the conductive film 27 are disposed on the same plane, and metal-containing wiring 61 is provided on the lower surfaces of the fourth light-reflecting member 40, the third light-reflecting member 50, and the conductive film 27. The conductive film 27 is connected to the wiring 61. The light emitting module is mounted on the wiring substrate via the wiring 61.
As shown in fig. 2, a plurality of through portions 15 may be provided in one light guide plate 10, and a plurality of light emitting devices 20 may be arranged. The light emitting devices 20 are disposed in the respective through portions 15, and the respective light emitting devices 20 are fixed to the light guide plate 10 via the light transmissive member 30. This structure realizes a wide-area light source with little luminance unevenness.
Next, a method for manufacturing a light emitting module according to an embodiment will be described with reference to fig. 3A to 8B.
First, as shown in fig. 3A, the light guide plate 10 is prepared. The light guide plate 10 is provided with a recess having a second surface 12 opposite to the first surface 11 and an inclined surface 13 forming an obtuse angle with the second surface 12 as an inner surface. The recessed portions are formed in a lattice shape in a plan view. Such a light guide plate 10 can be prepared by forming a flat light transmitting member by, for example, purchasing or injection molding, and forming a recess by a processing tool. Alternatively, the light guide plate may be prepared by purchasing a light guide plate having a recess in advance, or may be prepared by forming a light guide plate having a recess by injection molding or the like.
Next, as shown in fig. 3B, the fourth light reflecting member 40 is formed on the second surface 12 (the flat surface and the inclined surface 13 which is the inner surface of the recess) of the light guide plate 10. When the fourth light reflecting member 40 is a white resin material, examples of a forming method include a method of forming a liquid or paste light reflecting resin by printing, spraying, compression molding, transfer molding, or the like, and curing the resin. Alternatively, a reflective sheet formed separately may be bonded. When the fourth light-reflecting member 40 is made of metal, examples thereof include adhesion of metal foil, sputtering, vapor deposition, and printing of paste. When the fourth light-reflecting member 40 is a dielectric, examples thereof include adhesion of a dielectric sheet, sputtering formation, and the like.
After the fourth light reflecting member 40 is formed, as shown in fig. 4A, a plurality of through holes 15' penetrating between the first surface 11 and the second surface 12 are formed in the light guide plate 10 so as to also penetrate through the fourth light reflecting member 40. Fig. 8A is a perspective view of the light guide plate 10 having the plurality of through holes 15' when viewed from the first surface 11 side. Fig. 4A is a cross-sectional view taken along line IVA-IVA in fig. 8A. In the example shown in fig. 8A, the planar shape of the through hole 15' may be circular, or may be triangular, quadrangular, or the like. When the corner portions are angular, the corner portions may be curved or chamfered.
For example, the through-hole 15' can be formed by machining such as drilling or punching. Alternatively, the through-hole 15' may be formed by etching or laser. In the case of machining, as shown in fig. 8B, the corner of the end of the through-hole 15' may have a curvature (curvature). In the case of machining, irregularities may be formed on the inner wall of the through-hole 15'.
After the through-holes 15' are formed, the second surface 12 side of the light guide plate 10 is pasted to the sheet 100 as shown in fig. 4B. In this example, the surface of the fourth light-reflective member 40 is adhered to the sheet 100. The opening of the through hole 15' on the second surface 12 side is closed by the sheet 100. A part of the sheet 100 forms the bottom surface of the through-hole 15'.
As shown in fig. 5A, the light emitting device 20 is disposed in the through hole 15'. In detail, in the light-emitting device 20, the conductive film 27 constituting the electrode portion 25 shown in fig. 1 is attached to the sheet 100 closing the opening on the second surface 12 side of the through hole 15'. A gap exists between the side surface of the light emitting device 20 and the side wall of the through hole 15'.
After the light emitting device 20 is disposed in the through hole 15 ', as shown in fig. 5B, the liquid resin 30 ' is supplied into the through hole 15 '. Examples of the method of supplying the resin 30' include potting, spraying, dispensing, jet dispensing, and printing. The resin 30' contains, for example, TiO2、SiO2、Al2O3And ZnO, etc.
Then, the light reflecting material included in the resin 30 'is deposited on the upper surface of the light emitting device 20 and the sheet 100 closing the opening on the second surface 12 side of the through hole 15' by the centrifugal method. The reflectors deposited on the sheet 100 are deposited in the region below the phosphor layer 22.
As shown in fig. 6A, the first light reflecting member 23 is formed on the upper surface of the phosphor layer 22 of the light emitting device 20 by the subsidence of the light reflecting material, and the third light reflecting member 50 is formed on the periphery of the second surface 12 side of the light emitting device 20.
After allowing the reflectors to settle, the resin 30' is cured. For example, the resin 30' is thermally cured at a temperature of about 150 ℃. The sheet 100 has heat resistance against the temperature at this time.
By curing the resin 30 ', the light-transmissive member 30 is formed on the light-emitting device 20 in the through-hole 15 ' and between the light-emitting device 20 and the side wall of the through-hole 15 ', and the light-emitting device 20 is fixed to the light guide plate 10 via the light-transmissive member 30.
The upper surface of the light-transmissive member 30 is pressed by, for example, a molding die, and as shown in fig. 6B, a concave portion 31 is formed on the upper surface of the light-transmissive member 30. The concave portion 31 can also be formed by making use of the volume reduction of the translucent member 30 due to curing or making use of the surface tension to make the resin 30 'climb up the inner surface of the through hole 15'.
Thereafter, the light guide plate 10 to which the light emitting device 20 is fixed is separated from the sheet 100, and as shown in fig. 7, the conductive film 27 constituting the electrode portion 25 of the light emitting device 20 is exposed on the second surface 12 side. The wiring 61 shown in fig. 1 is formed on the second surface 12 side so as to be connected to the exposed conductive film 27.
According to the embodiment, after the fourth light-reflecting member 40 is formed on the second surface 12, the through-hole 15 'is formed, and the light-emitting device 20 is disposed in the through-hole 15', so that the electrode portion 25 of the light-emitting device 20 is not covered with the fourth light-reflecting member 40. After the electrode portion 25 of the light-emitting device 20 is attached to the sheet 100, the resin 30 ' is supplied into the through hole 15 ', and therefore the electrode surface of the light-emitting device 20 is not covered with the resin 30 '. In this example, the lower surface of the conductive film 27 is not covered with the resin 30' because it is in contact with the sheet 100. After the resin 30' is cured, the sheet 100 is peeled off, whereby the electrode surface of the light-emitting device 20 is exposed. Therefore, the wiring 61 can be easily connected to the electrode surface without a step of removing the fourth light-reflecting member 40 or the resin 30' covering the electrode surface of the light-emitting device 20.
By providing the conductive film 27 extending from the rear electrode 26 provided on the lower surface of the light-emitting element 21 to the region outside the lower surface of the light-emitting element 21, the connection between the electrode portion 25 of the light-emitting device 20 and the wiring 61 is facilitated, and highly reliable wiring connection can be performed.
In particular, since the light guide plate 10 having the plurality of through holes 15 ' is attached to a structure in which the plurality of light emitting devices 20 are mounted on the wiring board in advance, high accuracy is required between the positions of the plurality of light emitting devices 20 mounted on the wiring board and the positions of the plurality of through holes 15 ' on the light guide plate 10 when the light emitting devices 20 are disposed in the through holes 15 '.
In contrast, according to the embodiment, since the light emitting device 20 is held by the light guide plate 10 instead of the wiring board and the light guide plate 10 and the light emitting device 20 are integrally configured, the light emitting device 20 can be disposed on the light guide plate 10 with high positional accuracy. The brightness unevenness in the light emitting surface of the light guide plate 10 is suppressed.
Further, by attaching, for example, a flexible wiring board to the wiring 61, it is possible to reduce the thickness of the entire module including the wiring board. Such a light emitting module is suitable for, for example, a direct type backlight of a liquid crystal display.
Fig. 9 is a schematic sectional view of a light emitting module of another embodiment.
The fourth light reflecting member 40 is not provided on the inclined surface 13 of the recess of the light guide plate 10, and the inclined surface 13 of the recess is in contact with the air layer 70 provided between the fourth light reflecting member 40 and the inclined surface 13. The refractive index of the material of the light guide plate 10 is higher than that of air. The refractive index here means a refractive index with respect to light emitted from the light emitting device 20. Therefore, the light guided in the light guide plate 10 can be totally reflected by the inclined surface 13 and directed toward the first surface 11, and the brightness of the light extracted from the first surface 11 can be improved.
In manufacturing the structure of fig. 9, as shown in fig. 10A, after the second surface 12 of the light guide plate 10 having the inclined surface 13 is attached to the sheet-like fourth light reflecting member 40 by processing or the like, the through hole 15' is formed in the light guide plate 10 so as to penetrate also the fourth light reflecting member 40. The air layer 70 is interposed between the inclined surface 13 and the fourth light reflecting member 40. As the sheet-shaped fourth light-reflecting member 40, for example, a white resin containing a light-reflecting material (or a light-scattering material), a multilayer film of a resin or a ceramic, a dielectric multilayer film, a metal, or the like can be used.
Further, as shown in fig. 10B, the fourth retroreflective member 40 is affixed to the sheeting 100. After that, the light emitting device 20 is disposed in the through hole 15', and the same steps as those described above are continued. Fig. 10A and 10B show cross sections passing through the centers of the plurality of through holes 15' as in the cross-sectional schematic diagrams of the other figures.
As shown in fig. 11, the light-transmitting resin 71 may be provided on the inclined surface 13 of the light guide plate 10. The light-transmitting resin 71 is provided between the inclined surface 13 and the fourth light-reflecting member 40. The light-transmitting resin 71 is preferably made of a material having a refractive index smaller than that of the light guide plate.
The inclined surface 13 may not be formed on the light guide plate 10, and the light guide plate 10 may be flat as shown in fig. 12.
Further, the first surface 11 of the light guide plate 10 may be formed with irregularities for diffusing light or improving light extraction efficiency. For example, fig. 13 shows an example in which a plurality of projections 16 are formed on the first surface 11 of the light guide plate 10. The plurality of projections 16 are formed concentrically around the through portion 15, for example. The convex portion 16 may be in the form of a dot.
For example, the height and width of the convex portion 16 on the outer peripheral side farther from the light emitting device 20 are larger than the height and width of the convex portion 16 on the inner peripheral side closer to the light emitting device 20. The density of the convex portions 16 on the outer peripheral side may be higher than the density of the convex portions 16 on the inner peripheral side. Not only the convex portions 16 but also concave portions may be formed on the first surface 11.
Further, the second surface 12 of the light guide plate 10 may have irregularities. For example, fig. 14 shows an example in which a plurality of concave portions 17 are formed on the second surface 12 of the light guide plate 10. Not only the concave portion 17 but also a convex portion may be formed on the second surface 12. The shape of the irregularities is not limited to a curved surface in cross section, and may be an irregularity formed by a continuous inclined surface.
As shown in fig. 15, the wiring 61 may be formed on, for example, a side surface of the fourth light reflecting member 40 constituting a side surface of the light emitting module. When the mutual side surfaces are arranged adjacent to each other, the plurality of light emitting modules may connect the wires 61 formed on the side surfaces of the adjacent light emitting modules to each other directly or via a conductive material.
As shown in fig. 16, a phosphor layer 122 may be provided on the second surface 12 of the light guide plate 10 around the light emitting device 20. The light that has been wavelength-converted by the phosphor layer 122 can be diffused in the planar direction by the light guide plate 10, and color unevenness in the plane of the light guide plate 10 can be suppressed.
As shown in fig. 17, a light reflecting member 72 may be provided on, for example, a V-shaped cross-sectional recess 31 on the upper surface of the light-transmissive member 30. The light-reflecting member 72 reflects a part of the light emitted from the light-emitting device 20 and transmits the other part. This can prevent the vicinity directly above the light-emitting device 20 from becoming excessively brighter than other regions on the light-emitting surface of the light-emitting module. Further, the translucent member 30 is provided between the first light-reflecting member 23 and the light-reflecting member 72, so that the vicinity directly above the light-emitting device 20 can be suppressed from becoming darker than the surroundings.
Fig. 18 is a schematic sectional view of a light emitting module of still another embodiment.
The fourth light reflecting member 140 is provided on the second surface 12 of the light guide plate 10 via the adhesive sheet 92. For the adhesive sheet 92, for example, an acrylic resin is used. The fourth light reflective member 140 may use, for example, polyethylene terephthalate or the like that is recognized as white by forming many bubbles. The thickness of the fourth light-reflecting member 140 is preferably 35 μm or more and 350 μm or less.
The lower surface of the light-reflecting member 140 is bonded to the wiring board 80 via the adhesive sheet 93. The adhesive sheet 93 contains, for example, an acrylic resin. The wiring board 80 includes an insulating base 81, a wiring layer 82, and a pad 83 connected to the wiring layer 82.
The light-emitting device 20 includes a light-emitting element 21 and a phosphor layer 22 covering the upper surface and the side surfaces of the light-emitting element 21. The light emitting device 20 is disposed in the through portion 15. In the through portion 15, the translucent member 30 is provided on the light emitting device 20 and between the side surface of the light emitting device 20 and the side wall of the through portion 15.
The first light reflecting member 23 is provided between the upper surface of the light emitting device 20, that is, the upper surface of the phosphor layer 22, and the light transmitting member 30. The first light-reflecting member 23 is in contact with the upper surface of the light-emitting device 20 (in this example, the upper surface of the phosphor layer 22) and directly covers the upper surface of the light-emitting device 20.
A light reflecting member 124 is provided on the lower surface of the light emitting element 21 and the lower surface of the phosphor layer 22. A light-reflecting member 150 is provided on the surface of the wiring board 80 in the vicinity of the light-emitting device 20 in the through portion 15. The light-reflecting members 124 and 150 comprise TiO, for example2、SiO2、Al2O3And ZnO, etc. as a silicone resin or an epoxy resin for a light reflecting member.
The electrode 26 of the light emitting element 21 is bonded to the land 83 of the wiring board 80 via a bonding member (e.g., solder) 91.
As a light source of the light emitting module, only a light emitting element may be used instead of the light emitting device using the light transmitting member such as the phosphor layer 22 as described above. As shown in fig. 19A, a light-emitting device including a light-emitting element 21 and a first light-reflecting member 23 can be used. In this case, the first light-reflecting member 23 is disposed on the upper surface of the light-emitting element 21.
As shown in fig. 19B, the light-emitting device may have a light-emitting element 21, a light-transmitting member 29 covering the upper surface and the side surface of the light-emitting element 21, and a light-reflecting member 124 covering the lower surface of the light-emitting element 21 and the lower surface of the light-transmitting member 29. The light-transmitting member 29 may be a phosphor layer containing a phosphor, or may be a layer containing no phosphor. The first light reflecting member 23 is disposed on the upper surface of the light transmitting member 29.
As shown in fig. 19C, the light-emitting device may have a structure including the light-emitting element 21, the phosphor layer 22, the light-transmitting member 129 containing no phosphor, and the light-reflecting member 24. The phosphor layer 22 covers the upper surface of the light emitting element 21. The light emitting element 21 is bonded to the phosphor layer 22 via the adhesive member 28. The light-reflecting member 24 covers the side surfaces and the lower surface of the light-emitting element 21 and the side surfaces of the phosphor layer 22. The light-transmitting member 129 is disposed on the upper surface of the phosphor layer 22. The first light reflecting member 23 is disposed on the upper surface of the light transmitting member 129.
When the light emitting device does not contain a phosphor, a phosphor sheet may be disposed on the first face 11 of the light guide plate 10.
Fig. 20 is a schematic plan view of the light-emitting surface (first surface 11 of light guide plate 10) side of the light-emitting module according to the embodiment. In a plan view, the first surface 11 of the light guide plate 10 is formed in a quadrilateral shape having four corners, and the light emitting device 20 is also formed in a quadrilateral shape having four corners.
In a plan view, the light emitting device 20 having a square shape is arranged to be rotated by, for example, 45 degrees with respect to the square shape of the first main surface 11 of the light guide plate 10, and a diagonal line connecting corners of the first surface 11 intersects with a side surface (or side portion) of the light emitting device 20. For example, when the light guide plate 10 is square, the corners of the light emitting devices 20 are not located on the diagonal line connecting the corners of the first face 11.
In the square light-emitting device 20, the side surface has a larger area than the corner portion in a plan view, and the luminance of light emitted from the side surface of the light-emitting device 20 tends to be higher than the luminance of light emitted in the diagonal direction of the light-emitting device 20.
In addition, on the first surface 11 of the light guide plate 10, the distance between the central portion where the light emitting device 20 is disposed and the corner portion of the first surface 11 is longer than the distance between the central portion and the side portion of the first surface 11, and light tends to be less likely to spread to the four corners of the first surface 11.
According to the embodiment shown in fig. 20, the light emitting device 20 is disposed with respect to the light guide plate 10 such that a diagonal line connecting the corners of the first surface 11 intersects with the side surface (side portion) of the light emitting device 20, and the side surface of the light emitting device 20 faces the corners of the first surface 11, whereby the light emitted from the light emitting device 20 can be easily spread toward the four corners of the first surface 11 of the light guide plate 10. However, the light emitting device 20 may be disposed using a light guide plate 10 having a square shape in a plan view and a light emitting device 20 having a square shape in a plan view such that one side of the light guide plate 10 and one side of the light emitting device 20 are parallel to each other.
Fig. 21 is an exploded perspective view showing a structure of a liquid crystal display 1000 including the light-emitting module 200 according to the embodiment.
The liquid crystal display 1000 includes, in order from the upper side, a liquid crystal panel 120, two lens sheets 110a and 110b, a diffusion sheet 110c, and a light emitting module 200.
The light emitting module 200 has the structure of fig. 1, 9, and 11 to 20 described above, or a combination thereof. The light emitting module 200 includes a plurality of through portions 15 and a plurality of light emitting devices 20 disposed in the through portions 15.
The liquid crystal display 1000 is a so-called direct-type liquid crystal display in which the light-emitting module 200 functioning as a backlight is stacked below (on the rear side of) the liquid crystal panel 120. The liquid crystal display 1000 irradiates light irradiated from the light emitting module 200 onto the liquid crystal panel 120. The diffusion sheet 110c is superimposed on the first surface 11, which is the light-emitting surface of the light guide plate 10, and can suppress luminance unevenness in the light-emitting surface. In addition to the above-described components, the liquid crystal display 1000 may further include components such as a polarizing film and a color filter.
As described above, the embodiments of the present invention have been described with reference to specific examples. However, the present invention is not limited to these specific examples. In view of the above-described embodiments of the present invention, it is within the scope of the present invention that a person skilled in the art can appropriately design and modify all the embodiments to be implemented, as long as the present invention includes the gist of the present invention. It should be noted that various modifications and alterations can be conceived by those skilled in the art within the scope of the idea of the present invention, and these modifications and alterations also fall within the scope of the present invention.

Claims (9)

1. A light emitting module is provided with:
a light guide plate having a first surface, a second surface opposite to the first surface, and a through portion passing through between the first surface and the second surface;
a light emitting device disposed on the second surface side of the through portion;
a light-transmitting member provided on the first surface side in the through portion and above the light-emitting device and between the light-emitting device and the side wall of the through portion;
and a first light-reflecting member provided between an upper surface of the light-emitting device and the light-transmitting member, and contacting the upper surface of the light-emitting device.
2. The lighting module of claim 1,
the light emitting device has:
a light emitting element;
a phosphor layer provided on the light emitting element;
and a second light-reflecting member provided on a side surface of the light-emitting element.
3. The lighting module of claim 1,
the light emitting device has:
a light emitting element;
and a phosphor layer covering the upper surface and the side surface of the light emitting element.
4. The light emitting module according to any one of claims 1 to 3,
a recess is provided on an upper surface of the translucent member.
5. The light emitting module according to any one of claims 1 to 3,
the light-emitting device further includes a third light-reflecting member provided on a periphery of the second surface side of the light-emitting device.
6. The light emitting module according to any one of claims 1 to 3,
the light guide plate is provided with an inclined surface forming an obtuse angle with the second surface.
7. The lighting module of claim 6,
and a fourth light reflecting member provided on the second surface and the inclined surface.
8. The lighting module of claim 6,
the inclined surface is in contact with air.
9. The light emitting module according to any one of claims 1 to 3,
the light emitting device and the light transmissive member are disposed in each of the plurality of through portions provided in the light guide plate.
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