JP6989807B2

JP6989807B2 - Light emitting device and its manufacturing method

Info

Publication number: JP6989807B2
Application number: JP2020117877A
Authority: JP
Inventors: 博基中井; 賢介山岡
Original assignee: Nichia Corp
Current assignee: Nichia Corp
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2022-02-03
Anticipated expiration: 2037-11-30
Also published as: JP2020188265A

Description

本発明は、発光装置とその製造方法に関する。 The present invention relates to a light emitting device and a method for manufacturing the same.

近年、車載用途等の光源としてＬＥＤ等の発光素子を用いて構成した高出力の発光装置が用いられるようになってきている。例えば、特許文献１には、車載用の光源として用いられる高出力の発光装置において、発光素子の発光面の周縁部を覆うように放熱層を形成して、放熱効果を高めた発光装置が開示されている。特許文献１によれば、特許文献１の発光装置は、発光素子の発光面の周縁部を覆って放熱層を形成していることから、放熱特性の向上に加えシャープエッジの配光特性を得ることができ、例えば、車載用ヘッドランプ用途に適しているとされている。ここで、特許文献１における、シャープエッジの配光特性とは、光出射面の内側と外側における輝度差が大きいことと解される。 In recent years, a high-output light emitting device configured by using a light emitting element such as an LED has come to be used as a light source for in-vehicle applications and the like. For example, Patent Document 1 discloses a high-power light-emitting device used as an in-vehicle light source, in which a heat-dissipating layer is formed so as to cover the peripheral edge of the light-emitting surface of the light-emitting element to enhance the heat-dissipating effect. Has been done. According to Patent Document 1, since the light emitting device of Patent Document 1 covers the peripheral edge of the light emitting surface of the light emitting element to form a heat radiation layer, the light distribution characteristics of sharp edges are obtained in addition to the improvement of heat radiation characteristics. It can be used, for example, and is said to be suitable for in-vehicle headlamp applications. Here, the light distribution characteristic of the sharp edge in Patent Document 1 is understood to have a large difference in luminance between the inside and the outside of the light emitting surface.

特開２０１４－１２７６７９号公報Japanese Unexamined Patent Publication No. 2014-127679

しかしながら、車載用途等の高出力の光源としての使用される発光装置には発光素子が発光した光をより効率よく取り出すことが求められる。 However, a light emitting device used as a high-output light source for in-vehicle applications is required to more efficiently extract the light emitted by the light emitting element.

そこで、本発明は、光出射面の内側と外側における輝度差を大きくできかつ発光素子が発光した光を効率よく取り出すことができる発光装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a light emitting device capable of increasing the luminance difference between the inside and the outside of the light emitting surface and efficiently extracting the light emitted by the light emitting element.

以上の目的を達成するために、本発明に係る一実施形態の発光装置は、
基板と、
前記基板上に設けられた発光素子と、
上面と下面とを有し、該下面が前記発光素子の発光面に対向するように設けられた板状の透光性部材と、
前記発光素子の側面と前記透光性部材の側面とを覆う光反射性部材と、
前記透光性部材の周りの前記光反射性部材の上面に設けられた遮光フレームと、
を備え、
前記遮光フレームは開口部を有し、上方から平面視したときに、前記開口部の内周は透光性部材の上面の外周から離れて位置し、前記開口部の内周と前記透光性部材の上面の外周の間に前記光反射性部材が介在している。 In order to achieve the above object, the light emitting device of one embodiment according to the present invention is
With the board
The light emitting element provided on the substrate and
A plate-shaped translucent member having an upper surface and a lower surface and provided so that the lower surface faces the light emitting surface of the light emitting element.
A light-reflecting member that covers the side surface of the light emitting element and the side surface of the translucent member,
A light-shielding frame provided on the upper surface of the light-reflecting member around the translucent member, and
Equipped with
The light-shielding frame has an opening, and when viewed in a plan view from above, the inner circumference of the opening is located away from the outer periphery of the upper surface of the translucent member, and the inner circumference of the opening and the translucency thereof. The light-reflecting member is interposed between the outer periphery of the upper surface of the member.

また、本発明に係る一実施形態の発光装置の製造方法は、基板上に発光素子を実装する実装工程と、
前記実装した発光素子の発光面に下面が対向するように板状の透光性部材を接合する透光性部材接合工程と、
前記発光素子及び透光性部材から所定の間隔を隔てかつ発光素子及び透光性部材を挟んで対向する位置に、上端が透光性部材の上面より高い樹脂壁を、押圧による変形が可能な柔軟性を維持した状態で形成する樹脂壁形成工程と、
開口部を有する遮光フレームを、前記開口部の内周が透光性部材の上面の外周の外側に位置するように前記樹脂壁の上端に接触させて押圧することにより、前記基板から所定の高さに位置決めして載置する遮光フレーム載置工程と、
光反射性樹脂を、前記基板と前記遮光フレームの間の空間に充填することにより、前記基板と前記遮光フレームの間で前記発光素子と前記透光性部材とを囲む光反射性部材を形成する光反射性部材形成工程と、
を含む。 Further, the method for manufacturing a light emitting device according to an embodiment of the present invention includes a mounting process for mounting a light emitting element on a substrate and a mounting process.
A translucent member joining step of joining a plate-shaped translucent member so that the lower surface faces the light emitting surface of the mounted light emitting element.
A resin wall whose upper end is higher than the upper surface of the translucent member can be deformed by pressing at a position facing the light emitting element and the translucent member at a predetermined distance and sandwiching the light emitting element and the translucent member. A resin wall forming process that forms while maintaining flexibility,
By pressing the light-shielding frame having the opening in contact with the upper end of the resin wall so that the inner circumference of the opening is located outside the outer periphery of the upper surface of the translucent member, a predetermined height is determined from the substrate. The light-shielding frame mounting process, which is positioned and placed,
By filling the space between the substrate and the light-shielding frame with the light-reflecting resin, a light-reflecting member surrounding the light-emitting element and the translucent member is formed between the substrate and the light-shielding frame. Light-reflecting member forming process and
including.

以上のように構成された本発明に係る一実施形態の発光装置は、光出射面の内側と外側における輝度差を大きくできかつ発光素子が発光した光を効率よく取り出すことができる。
また、本発明に係る一実施形態の発光装置の製造方法によれば、光出射面の内側と外側における輝度差を大きくできかつ発光素子が発光した光を効率よく取り出すことができる発光装置を製造することができる。 The light emitting device of the embodiment according to the present invention configured as described above can increase the luminance difference between the inside and the outside of the light emitting surface and can efficiently take out the light emitted by the light emitting element.
Further, according to the method for manufacturing a light emitting device according to an embodiment of the present invention, a light emitting device capable of increasing the luminance difference between the inside and the outside of the light emitting surface and efficiently extracting the light emitted by the light emitting element is manufactured. can do.

本発明に係る実施形態の発光装置の平面図である。It is a top view of the light emitting device of the embodiment which concerns on this invention. 図１のＡ－Ａ線についての断面図である。It is sectional drawing about the line AA of FIG. 実施形態の変形例１に係る発光装置の断面図である。It is sectional drawing of the light emitting device which concerns on modification 1 of embodiment. 実施形態の変形例２に係る発光装置の断面図である。It is sectional drawing of the light emitting device which concerns on modification 2 of embodiment. 実施形態の変形例３に係る発光装置の断面図である。It is sectional drawing of the light emitting device which concerns on modification 3 of embodiment. 実施形態の変形例４に係る発光装置の断面図である。It is sectional drawing of the light emitting device which concerns on modification 4 of embodiment. 実施形態の発光装置の製造方法において、発光素子を実装したときの断面図である。It is sectional drawing when the light emitting element is mounted in the manufacturing method of the light emitting device of embodiment. 実施形態の発光装置の製造方法において、実装した発光素子の上に透光性部材を接合したときの断面図である。It is sectional drawing when the translucent member is joined on the mounted light emitting element in the manufacturing method of the light emitting device of embodiment. 実施形態の発光装置の製造方法において、発光素子及び透光性部材から所定の間隔を隔て樹脂壁を形成したときの断面図である。It is sectional drawing at the time of forming the resin wall from the light emitting element and the translucent member at a predetermined space in the manufacturing method of the light emitting device of embodiment. 実施形態の発光装置の製造方法において、樹脂壁の上に遮光フレームを載置したときの断面図である。It is sectional drawing when the light-shielding frame is placed on the resin wall in the manufacturing method of the light emitting device of embodiment. 実施形態の発光装置の製造方法において、光反射性樹脂を充填する様子を示す断面図である。It is sectional drawing which shows the state of filling with the light-reflecting resin in the manufacturing method of the light emitting device of embodiment. 実施形態の発光装置の製造方法において、樹脂壁の上に遮光フレームを、遮光フレームの上面が透光性部材の上面より高くなるように載置するときの断面図である。FIG. 5 is a cross-sectional view when a light-shielding frame is placed on a resin wall so that the upper surface of the light-shielding frame is higher than the upper surface of the translucent member in the method for manufacturing a light-emitting device of the embodiment. 実施形態の発光装置の製造方法において、樹脂壁の上に遮光フレームを、遮光フレームの上面が透光性部材の上面より低くなるように載置するときの断面図である。FIG. 5 is a cross-sectional view when a light-shielding frame is placed on a resin wall so that the upper surface of the light-shielding frame is lower than the upper surface of the translucent member in the method for manufacturing a light-emitting device of the embodiment.

本発明者らは、光出射面の内側と外側における輝度差を大きくできる発光装置を得るために、種々の検討を行った。ここでは、まず、基板上に発光素子を実装し、その発光素子の発光面の上に板状の透光性部材を設けて発光素子の側面と透光性部材の側面とを光反射性部材により覆うことにより、発光素子の側面及び透光性部材の側面から出射される光を効率よく上方に取り出すことができる発光装置を準備した。そして、この準備した発光装置において、発光面の内側と外側での輝度の差が大きくなるように、発光素子及び透光性部材の周りの光反射性部材の上面に透光性部材の外周に接するように遮光フレームを設けたところ、予想通り、発光面の内側と外側で輝度差を大きくできた。 The present inventors have conducted various studies in order to obtain a light emitting device capable of increasing the brightness difference between the inside and the outside of the light emitting surface. Here, first, a light emitting element is mounted on a substrate, a plate-shaped translucent member is provided on the light emitting surface of the light emitting element, and the side surface of the light emitting element and the side surface of the translucent member are light-reflecting members. A light emitting device capable of efficiently extracting light emitted from the side surface of the light emitting element and the side surface of the translucent member is prepared. Then, in the prepared light emitting device, on the upper surface of the light reflecting member around the light emitting element and the translucent member, on the outer periphery of the translucent member so that the difference in brightness between the inside and the outside of the light emitting surface becomes large. When a light-shielding frame was provided so as to be in contact with each other, as expected, the difference in brightness between the inside and the outside of the light emitting surface could be increased.

しかしながら、発光素子及び透光性部材の周りの光反射性部材の上面に遮光フレームを設けると、遮光フレームを設けていない発光装置に比較して、光の取りだし効率が低下することが確認された。さらに検討を進めた結果、この光の取りだし効率の低下は、遮光フレームの光の吸収が原因であることが分かった。すなわち、発光面の内側と外側での輝度差が大きくなるように設ける遮光フレームは、光を吸収する性質があり、透光性部材と遮光フレームの接触部分の近傍にあける遮光フレームによる光の吸収により光の取りだし効率が低下しているのである。そこで、本発明者らは、透光性部材と遮光フレームの間に光反射性部材を介在させるようにしたところ、光の取りだし効率の低下が抑制された。
本発明は、以上のような本願発明者が独自に得た上記知見に基づいて成されたものである。 However, it was confirmed that when a light-shielding frame is provided on the upper surface of the light-emitting element and the light-reflecting member around the light-transmitting member, the light extraction efficiency is lowered as compared with the light-emitting device not provided with the light-shielding frame. .. As a result of further studies, it was found that this decrease in light extraction efficiency was caused by the absorption of light by the light-shielding frame. That is, the light-shielding frame provided so that the difference in brightness between the inside and the outside of the light-emitting surface is large has the property of absorbing light, and the light-absorbing frame placed in the vicinity of the contact portion between the translucent member and the light-shielding frame absorbs light. As a result, the efficiency of light extraction is reduced. Therefore, the present inventors have placed a light-reflecting member between the translucent member and the light-shielding frame to suppress a decrease in light extraction efficiency.
The present invention has been made based on the above findings independently obtained by the inventor of the present application as described above.

以下、本発明に係る実施形態の発光装置とその製造方法について図面を参照しながら説明する。
＜実施形態の発光装置＞
実施形態の発光装置は、図１及び図２に示すように、基板１０と基板１０上に設けられた発光素子１と、下面が発光素子１の発光面に対向するように設けられた板状の透光性部材３と、を含み、さらに光反射性部材９が発光装置の光出射面である透光性部材３の上面３ａを露出させて発光素子１の側面と透光性部材３の側面とを覆うように設けられている。そして、実施形態の発光装置では、透光性部材３の周りの光反射性部材９の上面に、開口部を有する遮光フレーム５が開口部５ａの内側に透光性部材３の上面３ａが位置するように設けられ、透光性部材３の上面３ａが光反射性部材９及び遮光フレーム５から露出している。 Hereinafter, a light emitting device according to an embodiment of the present invention and a method for manufacturing the same will be described with reference to the drawings.
<Light emitting device of embodiment>
As shown in FIGS. 1 and 2, the light emitting device of the embodiment has a substrate 10 and a light emitting element 1 provided on the substrate 10, and a plate shape provided so that the lower surface faces the light emitting surface of the light emitting element 1. Including the translucent member 3 of the above, the light reflecting member 9 exposes the upper surface 3a of the translucent member 3 which is the light emitting surface of the light emitting device, and the side surface of the light emitting element 1 and the translucent member 3 are exposed. It is provided so as to cover the side surface. Then, in the light emitting device of the embodiment, the light-shielding frame 5 having an opening is located on the upper surface of the light-reflecting member 9 around the translucent member 3, and the upper surface 3a of the translucent member 3 is located inside the opening 5a. The upper surface 3a of the translucent member 3 is exposed from the light-reflecting member 9 and the light-shielding frame 5.

ここで特に、実施形態の発光装置では、上方から（つまり光出射面３ａ側から）平面視したときに、開口部５ａの内周が光出射面（つまり透光性部材３の上面）３ａの外周から離れて位置し、開口部５ａの内周と光出射面３ａの外周の間に光反射性部材９が露出している。このようにして、発光装置の上面において、光出射面３ａと遮光フレーム５の開口部の内周との間を、光反射性部材の表面を介在させることにより分離し、かつ発光素子１の側面及び透光性部材３の側面と遮光フレーム５との間を、光反射性部材９を介在させることにより分離している。 Here, in particular, in the light emitting device of the embodiment, when viewed from above (that is, from the light emitting surface 3a side), the inner circumference of the opening 5a is the light emitting surface (that is, the upper surface of the translucent member 3) 3a. It is located away from the outer circumference, and the light reflecting member 9 is exposed between the inner circumference of the opening 5a and the outer circumference of the light emitting surface 3a. In this way, on the upper surface of the light emitting device, the light emitting surface 3a and the inner circumference of the opening of the light shielding frame 5 are separated by interposing the surface of the light reflecting member, and the side surface of the light emitting element 1 is separated. And the side surface of the translucent member 3 and the light-shielding frame 5 are separated by interposing a light-reflecting member 9.

以上のように構成された実施形態の発光装置は、光出射面３ａと光出射面３ａを取り囲む領域における輝度差を大きくできかつ発光素子が発光した光を効率よく取り出すことができる。実施形態の発光装置において、開口部５ａの内周と光出射面３ａの外周の間隔は、光出射面３ａの内側と外側における輝度差を大きくすることと発光素子が発光した光を効率よく取り出すこととを両立させるために５μｍ以上１５０μｍ以下であることが好ましく、より好ましくは４０μｍ以上６０μｍ以下とする。 The light emitting device of the embodiment configured as described above can increase the luminance difference in the region surrounding the light emitting surface 3a and the light emitting surface 3a, and can efficiently take out the light emitted by the light emitting element. In the light emitting device of the embodiment, the distance between the inner circumference of the opening 5a and the outer circumference of the light emitting surface 3a increases the luminance difference between the inside and the outside of the light emitting surface 3a and efficiently extracts the light emitted by the light emitting element. In order to achieve both of these, it is preferably 5 μm or more and 150 μm or less, and more preferably 40 μm or more and 60 μm or less.

以下、実施形態の発光装置の種々の形態について説明する。
（形態１）
実施形態の発光装置では、透光性部材３の下面３ｂの面積は透光性部材３の上面（つまり発光装置の光出射面）３ａの面積より大きくなっている。
透光性部材３の上面３ａの面積を下面３ｂよりも小さくすることにより、透光性部材３の下面３ｂから入射される発光素子１からの出射光を、より小さな面積である上面３a（つまり発光装置の発光面）から放出させることができる。つまり、透光性部材３を通過することにより発光面の面積が絞られて、高輝度でより遠くを照らすことが可能となる。正面輝度の高い発光装置は、特にヘッドライト等の車載照明に適している。なお、車載照明においては、その灯火類の色についての様々な規定が有り、例えば前照灯（ヘッドライト）の灯光の色は白色または淡黄色であり、そのすべてが同一であることが定められている。
さらに、透光性部材３の下面３ｂの外周は、上方から平面視したときに遮光フレーム５の開口部５ａの内周の外側に位置することが好ましい。また、この場合、透光性部材３の側面は、図２等に示すように、厚さが一定の鍔部が形成されるように段差を有していても良いし、図６に示すように、一部又は全部が傾斜した面になっていても良い。透光性部材３の側面が傾斜面を有する場合、傾斜面は平面でもよいし曲面でもよい。
このように、透光性部材３の下面３ｂの外周が上方から平面視したときに開口部５ａの内周の外側に位置するようにし、透光性部材３の上面３ａの外周が平面視したときに開口部５ａの内周の内側に位置するようにすると、以下のような効果が得られる。
つまり、発光装置を上方（つまり発光面側）から平面視したときに、開口部５ａの内側には、透光性部材３の上面３ａと透光性部材３の上面３ａの外周を取り囲む光反射性部材９の上面を視認することができる。この際、開口部５ａの内側の領域において、光反射性部材９の下方には、透光性部材３の傾斜面及び／又は鍔部が位置する。これにより、仮に光反射性部材９にクラックや剥離等が生じたとしても、開口部５ａから漏れる光は透光性部材３から出射される光のみとすることができる。さらに、遮光フレーム５に覆われる領域では光反射性部材からの漏れ光は遮光されるため、例えば発光素子１の側方に位置する光反射性部材９にクラックや剥離が生じたとしても、発光素子１の側面から出射された光がクラックや剥離箇所を通過して発光面側に漏れ伝わることをより一層効果的に抑制することができる。例えば、発光素子１から出射された青色光と、その青色光の一部が波長変換された黄色光とを混色させることにより白色光を発する発光装置を車両照明として用いた際に、発光面から出射される白色光の他に、発光素子１から出射された青色光が漏れると、開口部５ａ内において色度差が生じ、照射エリア内に発光色むらが生じる虞がある。さらに、青色の漏れ光が視認されると、上述した車載照明としての規定が満たされず、車両の安全性が損なわれる虞がある。 Hereinafter, various embodiments of the light emitting device of the embodiment will be described.
(Form 1)
In the light emitting device of the embodiment, the area of the lower surface 3b of the translucent member 3 is larger than the area of the upper surface of the translucent member 3 (that is, the light emitting surface of the light emitting device) 3a.
By making the area of the upper surface 3a of the translucent member 3 smaller than that of the lower surface 3b, the light emitted from the light emitting element 1 incident from the lower surface 3b of the translucent member 3 is emitted from the upper surface 3a (that is, the lower surface 3a) having a smaller area. It can be emitted from the light emitting surface of the light emitting device). That is, by passing through the translucent member 3, the area of the light emitting surface is narrowed down, and it becomes possible to illuminate a farther distance with high brightness. A light emitting device having a high front luminance is particularly suitable for in-vehicle lighting such as a headlight. In addition, in in-vehicle lighting, there are various regulations regarding the color of the lights, for example, it is stipulated that the color of the headlight is white or pale yellow, and all of them are the same. ing.
Further, it is preferable that the outer periphery of the lower surface 3b of the translucent member 3 is located outside the inner circumference of the opening 5a of the light-shielding frame 5 when viewed from above in a plan view. Further, in this case, as shown in FIG. 2 and the like, the side surface of the translucent member 3 may have a step so as to form a collar portion having a constant thickness, and as shown in FIG. In addition, a part or all of it may be an inclined surface. When the side surface of the translucent member 3 has an inclined surface, the inclined surface may be a flat surface or a curved surface.
In this way, the outer circumference of the lower surface 3b of the translucent member 3 is positioned outside the inner circumference of the opening 5a when viewed in a plan view from above, and the outer circumference of the upper surface 3a of the translucent member 3 is viewed in a plan view. Occasionally, if it is located inside the inner circumference of the opening 5a, the following effects can be obtained.
That is, when the light emitting device is viewed in a plan view from above (that is, the light emitting surface side), light reflection that surrounds the outer periphery of the upper surface 3a of the translucent member 3 and the upper surface 3a of the translucent member 3 inside the opening 5a. The upper surface of the sex member 9 can be visually recognized. At this time, in the region inside the opening 5a, the inclined surface and / or the flange portion of the translucent member 3 is located below the light reflecting member 9. As a result, even if the light-reflecting member 9 is cracked or peeled off, the light leaking from the opening 5a can be limited to the light emitted from the translucent member 3. Further, since the light leaked from the light-reflecting member is shielded in the region covered by the light-shielding frame 5, for example, even if the light-reflecting member 9 located on the side of the light-emitting element 1 is cracked or peeled off, it emits light. It is possible to more effectively suppress the light emitted from the side surface of the element 1 from passing through cracks and peeling points and leaking to the light emitting surface side. For example, when a light emitting device that emits white light by mixing blue light emitted from the light emitting element 1 and yellow light whose wavelength is partially converted is used as vehicle lighting, the light emitting surface is used. If the blue light emitted from the light emitting element 1 leaks in addition to the emitted white light, a difference in chromaticity may occur in the opening 5a, and uneven emission color may occur in the irradiation area. Further, if the blue leaked light is visually recognized, the above-mentioned provisions for in-vehicle lighting may not be satisfied, and the safety of the vehicle may be impaired.

（形態２）
実施形態の発光装置では、透光性部材３の上面３ａの外周は、上方から平面視したときに発光素子１の外周の内側に位置することが好ましい。ここで、図１に示すように、複数の発光素子１を含む発光装置において発光素子１の外周という場合には、複数の発光素子１を一体として見て外周を規定するものとし、隣接する発光素子間で対向する個々の発光素子の外周は含まない。
このようにすると、複数の発光素子１から出た光を集光して、透光性部材３の上面３ａから出射することができる。これにより、発光素子１が発光した光をより光束密度の高い状態で出射面３ａから出射することができる。 (Form 2)
In the light emitting device of the embodiment, it is preferable that the outer periphery of the upper surface 3a of the translucent member 3 is located inside the outer periphery of the light emitting element 1 when viewed from above in a plan view. Here, as shown in FIG. 1, in the case of a light emitting device including a plurality of light emitting elements 1, when the outer circumference of the light emitting element 1 is referred to, the outer circumference is defined by looking at the plurality of light emitting elements 1 as a unit, and adjacent light emission is performed. The outer circumference of each light emitting element facing each other between the elements is not included.
In this way, the light emitted from the plurality of light emitting elements 1 can be collected and emitted from the upper surface 3a of the translucent member 3. As a result, the light emitted by the light emitting element 1 can be emitted from the emission surface 3a in a state where the luminous flux density is higher.

（形態３）
実施形態の発光装置では、透光性部材３の上面３ａと遮光フレーム５の上面とは、図２に示すように、実質的に同一平面上に位置していても良いし、図３及び図４に示すように、異なる平面上に位置していてもよい。透光性部材３の上面３ａと遮光フレーム５の上面とが異なる平面上に位置している場合、その異なる平面は互いに平行であることが好ましい。透光性部材３の上面３ａと遮光フレーム５の上面とが異なる平面上に位置している場合、透光性部材３の上面３ａが遮光フレーム５の上面より高い場合、低い場合、どちらの場合でも、光反射性部材９は発光装置の光出射面である透光性部材３の上面３ａを露出させて発光素子１の側面と透光性部材３の側面とを覆うように設けられていることが好ましい。 (Form 3)
In the light emitting device of the embodiment, the upper surface 3a of the translucent member 3 and the upper surface of the light-shielding frame 5 may be substantially located on the same plane as shown in FIGS. 3 and 3. As shown in 4, they may be located on different planes. When the upper surface 3a of the translucent member 3 and the upper surface of the light-shielding frame 5 are located on different planes, it is preferable that the different planes are parallel to each other. When the upper surface 3a of the translucent member 3 and the upper surface of the light-shielding frame 5 are located on different planes, the upper surface 3a of the translucent member 3 is higher or lower than the upper surface of the light-shielding frame 5, whichever case. However, the light reflecting member 9 is provided so as to expose the upper surface 3a of the translucent member 3 which is the light emitting surface of the light emitting device and cover the side surface of the light emitting element 1 and the side surface of the translucent member 3. Is preferable.

（形態４）
実施形態の発光装置では、遮光フレーム５は、遮光フレーム５の外周が発光装置の外周と一致するように設けられていても良いが、遮光フレーム５の外周が発光装置の外周の内側に位置するように設けられていていることが好ましい。これにより、後述する発光装置を単位領域ごと（つまり個々の発光装置ごと）に分割する分割工程において、分割線上に遮光フレームが配置されないため、分割時の遮光フレームの位置ずれ等が抑制される。
ここで、遮光フレーム５の外周が発光装置の外周の内側に位置するように遮光フレーム５が設けられていているとは、遮光フレーム５の外周の一部分が発光装置の外周の内側に位置するように遮光フレーム５が設けられていていることを含む。
平面視における遮光フレームの幅は、光出射面３ａの内側と外側における輝度差を大きくすることを考慮して、少なくとも１３０μｍ以上であることが好ましい。また、製造工程における取り扱いの容易さを考慮すると、５００μｍ以上であることがより好ましい。遮光フレームの幅は、全周に亘って一定の幅であってもよいが、部分的に異なっていてもよく、遮光フレームの幅が部分的に異なる場合、少なくとも全周に亘って１３０μｍ以上の幅を有し、かつ、部分的に５００μｍ以上の幅を有することがより好ましい。 (Form 4)
In the light-emitting device of the embodiment, the light-shielding frame 5 may be provided so that the outer periphery of the light-shielding frame 5 coincides with the outer periphery of the light-emitting device, but the outer circumference of the light-shielding frame 5 is located inside the outer periphery of the light-emitting device. It is preferable that it is provided as such. As a result, in the division step of dividing the light emitting device described later into each unit region (that is, for each individual light emitting device), the light-shielding frame is not arranged on the dividing line, so that the position shift of the light-shielding frame at the time of division is suppressed.
Here, the light-shielding frame 5 is provided so that the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device, so that a part of the outer circumference of the light-shielding frame 5 is located inside the outer circumference of the light-emitting device. The light-shielding frame 5 is provided in the light-shielding frame 5.
The width of the light-shielding frame in a plan view is preferably at least 130 μm or more in consideration of increasing the luminance difference between the inside and the outside of the light emitting surface 3a. Further, considering the ease of handling in the manufacturing process, it is more preferably 500 μm or more. The width of the light-shielding frame may be a constant width over the entire circumference, but may be partially different, and when the width of the light-shielding frame is partially different, at least 130 μm or more over the entire circumference. It is more preferable to have a width and a width of 500 μm or more partially.

以下に、本実施形態の発光装置の各構成部材について説明する。
（基板１０）
基板１０は、発光素子１等を支持する部材であり、図示はしていないが、発光素子１の外部電極に電気的に接続される配線を有する。基板１０の主な材料としては、絶縁性材料であって、発光素子１からの光及び外からの光が透過しにくい材料が好ましい。具体的には、例えば、アルミナや窒化アルミニウム等のセラミックス、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ＢＴレジン、ポリフタルアミド等の樹脂を挙げることができる。なお、樹脂を用いる場合には、必要に応じて、ガラス繊維、酸化ケイ素、酸化チタン、アルミナ等の無機フィラーを樹脂に混合してもよい。これにより、機械的強度の向上や熱膨張率の低減、光反射率の向上を図ることができる。また、基板１０は、金属部材の表面に絶縁性材料を形成したものでもよい。配線は、上記絶縁性材料の上に、所定のパターンで形成される。配線の材料として、金、銀、銅およびアルミニウムから選択された少なくとも一種とすることができる。配線は、めっき、蒸着、スパッタ等によって形成することができる。 Hereinafter, each component of the light emitting device of the present embodiment will be described.
(Board 10)
The substrate 10 is a member that supports the light emitting element 1 and the like, and has a wiring that is electrically connected to an external electrode of the light emitting element 1 although not shown. As the main material of the substrate 10, an insulating material, which is difficult for light from the light emitting element 1 and light from the outside to pass through, is preferable. Specific examples thereof include ceramics such as alumina and aluminum nitride, phenol resins, epoxy resins, polyimide resins, BT resins, and resins such as polyphthalamide. When a resin is used, an inorganic filler such as glass fiber, silicon oxide, titanium oxide, or alumina may be mixed with the resin, if necessary. As a result, it is possible to improve the mechanical strength, reduce the thermal expansion rate, and improve the light reflectance. Further, the substrate 10 may have an insulating material formed on the surface of a metal member. The wiring is formed in a predetermined pattern on the insulating material. The wiring material can be at least one selected from gold, silver, copper and aluminum. Wiring can be formed by plating, vapor deposition, sputtering, or the like.

（発光素子１）
発光素子１としては、発光ダイオードを用いるのが好ましい。発光素子は、任意の波長のものを選択することができる。例えば、青色、緑色の発光素子としては、窒化物系半導体（Ｉｎ_ＸＡｌ_ＹＧａ_{１－Ｘ－Ｙ}Ｎ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）やＺｎＳｅ、ＧａＰを用いたものを用いることができる。また、赤色の発光素子としては、ＧａＡｌＡｓ、ＡｌＩｎＧａＰなどを用いることができる。さらに、これ以外の材料からなる半導体発光素子を用いることもできる。用いる発光素子の組成や発光色、大きさや、個数などは目的に応じて適宜選択することができる。蛍光体を有する発光装置とする場合には、その蛍光体を効率良く励起できる短波長が発光可能な窒化物半導体（Ｉｎ_ＸＡｌ_ＹＧａ_{１－Ｘ－Ｙ}Ｎ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）が好適に挙げられる。半導体層の材料やその混晶度によって発光波長を種々選択することができる。 (Light emitting element 1)
It is preferable to use a light emitting diode as the light emitting element 1. The light emitting element can be selected from any wavelength. For example, as the blue and green light emitting devices, those using a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), ZnSe, and GaP are used. be able to. Further, as the red light emitting element, GaAlAs, AlInGaP and the like can be used. Further, a semiconductor light emitting device made of a material other than this can also be used. The composition, emission color, size, number, etc. of the light emitting element to be used can be appropriately selected according to the purpose. In the case of a light emitting device having a phosphor, a nitride semiconductor capable of emitting a short wavelength capable of efficiently exciting the phosphor (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferably mentioned. Various emission wavelengths can be selected depending on the material of the semiconductor layer and its mixed crystalliteness.

実施形態の発光装置に用いる発光素子１は、例えば、同一面側に正負の電極を有するものであり、図２に示すように、正負の電極が導電性接合部材１１を介して基板１０上にフリップチップ実装されている。尚、図２では、発光素子１の正負の電極を区別することなく簡略化して描いているが、実際には、同一面側に設けられた正負の電極的に分離するように設けられており、その電気的に分離された正負の電極がそれぞれ導電性接合部材１１を介して基板１０上に設けられた正負の配線に接続されている。また、発光素子１は、電極の形成された下面と対向する上面を主な光出射面としている。このような発光素子１は、上述したように、バンプや導電ペーストなどの導電性接合部材を用いて基板上に接続されるため、金属ワイヤなどで接続される発光素子と比較して、電極と基板との接触面積を大きくでき、接続抵抗を低くできる。 The light emitting element 1 used in the light emitting device of the embodiment has, for example, positive and negative electrodes on the same surface side, and as shown in FIG. 2, the positive and negative electrodes are placed on the substrate 10 via the conductive bonding member 11. Flip chip mounted. Although the positive and negative electrodes of the light emitting element 1 are simplified and drawn in FIG. 2 without distinguishing them, they are actually provided so as to be separated as positive and negative electrodes provided on the same surface side. The electrically separated positive and negative electrodes are connected to the positive and negative wiring provided on the substrate 10 via the conductive joining member 11, respectively. Further, the light emitting element 1 has an upper surface facing the lower surface on which the electrode is formed as a main light emitting surface. As described above, such a light emitting element 1 is connected to the substrate by using a conductive bonding member such as a bump or a conductive paste, so that the light emitting element 1 is connected to an electrode as compared with a light emitting element connected by a metal wire or the like. The contact area with the substrate can be increased and the connection resistance can be lowered.

発光素子１は、例えば、透光性の成長用のサファイア基板上に窒化物半導体層を積層させて形成された発光素子であり、サファイア基板が発光素子１の上面側となり、主な光出射面となる。なお、成長用基板は除去してもよく、例えば、研磨、ＬＬＯ（Laser Lift Off）等で除去することができる。 The light emitting element 1 is, for example, a light emitting element formed by laminating a nitride semiconductor layer on a sapphire substrate for growth of translucency, and the sapphire substrate is on the upper surface side of the light emitting element 1 and is a main light emitting surface. It becomes. The growth substrate may be removed, and can be removed by polishing, LLO (Laser Lift Off), or the like.

（遮光フレーム５）
遮光フレーム５は、発光装置の上面において光出射面を除いた部分の輝度を下げるために設けられる部材である。光出射面を除いた部分の輝度を下げるためには、光反射性部材９から漏れる光を遮光する必要がある。この機能を考慮すると、遮光フレーム５は、例えば、光を透過させずに、反射及び／又は吸収する材料からなる部材または表面に光を反射及び／又は吸収する材料からなる膜を備えた部材により構成することが好ましい。
遮光フレーム５を構成する材料としては、樹脂（繊維強化樹脂を含む）、セラミックス、ガラス、紙、金属等、及びこれらの材料の２種以上からなる複合材料などから選択して構成することができる。具体的には、遮光性に優れ、劣化しにくい材料として、例えば、遮光フレーム５は、金属からなる金属フレームまたは表面に金属膜を備えたフレームにより構成されることが好ましい。金属材料としては、銅、鉄、ニッケル、クロム、アルミニウム、金、銀、チタン、またはこれらの合金等が挙げられる。さらに、遮光フレーム５は、外部からの光の反射を抑制する機能を備えていることがより好ましく、少なくとも光出射面側の表面に光吸収率の高い材料を用いることがより好ましい。
また、遮光フレーム５の厚み（つまり遮光フレーム５の下面から上面までの高さ）は、発光装置として使用するときの強度を保ちつつ、軽さ、変形しにくさ、等を考慮して、２０μｍ～２００μｍ程度とすることが好ましく、３０～８０μｍ程度とすることがより好ましい。 (Shading frame 5)
The light-shielding frame 5 is a member provided on the upper surface of the light emitting device to reduce the brightness of the portion excluding the light emitting surface. In order to reduce the brightness of the portion other than the light emitting surface, it is necessary to block the light leaking from the light reflecting member 9. Considering this function, the light-shielding frame 5 is made of, for example, a member made of a material that reflects and / or absorbs light without transmitting light, or a member having a film made of a material that reflects and / or absorbs light on the surface. It is preferable to configure it.
The material constituting the light-shielding frame 5 can be selected from resin (including fiber reinforced resin), ceramics, glass, paper, metal, etc., and a composite material composed of two or more of these materials. .. Specifically, as a material having excellent light-shielding property and not easily deteriorated, for example, the light-shielding frame 5 is preferably composed of a metal frame made of metal or a frame having a metal film on the surface. Examples of the metal material include copper, iron, nickel, chromium, aluminum, gold, silver, titanium, and alloys thereof. Further, it is more preferable that the light-shielding frame 5 has a function of suppressing reflection of light from the outside, and it is more preferable to use a material having a high light absorption rate at least on the surface on the light emitting surface side.
Further, the thickness of the light-shielding frame 5 (that is, the height from the lower surface to the upper surface of the light-shielding frame 5) is 20 μm in consideration of lightness, resistance to deformation, etc. while maintaining strength when used as a light emitting device. It is preferably about 200 μm, more preferably about 30 to 80 μm.

また、詳細後述するように、製造過程で遮光フレーム５は、樹脂壁７により保持された状態で樹脂壁７と基板１０の間の空間に光反射性部材９を構成する材料が注入される。このため、遮光フレーム５の下面の、樹脂壁７に接する部分には凹凸が形成されていることが好ましく、その凹部に樹脂壁７を構成する樹脂が入り込んで硬化されることにより、遮光フレーム５と樹脂壁７とを強固に固定できる。また、製造後においても、遮光フレーム５の樹脂壁７に接する部分には凹凸が形成され、その凹部に樹脂壁７を構成する樹脂が入り込んで硬化されていると、遮光フレーム５の剥離を防止することができる。尚、遮光フレームの上面は、光反射性部材９が這いあがりにくいように、その表面が平坦であることが好ましい。
樹脂壁７は、光反射性部材９の外側に、例えば、光反射性部材９の周りを囲むように、または光反射性部材９を間において対向するように設けられる。また、遮光フレーム５は、外周の一部に内側に窪んだ窪み部５ｂが設けられていてもよい。これにより、製造時に、例えば、その窪み部５ｂを介して樹脂壁７と基板１０の間の空間に光反射性部材９を構成する材料を注入することができる。また、窪み部５ｂに光反射性部材９の表面が露出していてもよい。
尚、遮光フレーム５の開口部の内周端面は、図５及び図６に示すように傾斜していてもよい。 Further, as will be described in detail later, in the light-shielding frame 5 during the manufacturing process, the material constituting the light-reflecting member 9 is injected into the space between the resin wall 7 and the substrate 10 while being held by the resin wall 7. Therefore, it is preferable that unevenness is formed on the lower surface of the light-shielding frame 5 in contact with the resin wall 7, and the resin constituting the resin wall 7 enters the concave portion and is cured by the light-shielding frame 5. And the resin wall 7 can be firmly fixed. Further, even after manufacturing, unevenness is formed in the portion of the light-shielding frame 5 in contact with the resin wall 7, and if the resin constituting the resin wall 7 enters the recess and is cured, the light-shielding frame 5 is prevented from peeling off. can do. It is preferable that the upper surface of the light-shielding frame has a flat surface so that the light-reflecting member 9 does not easily crawl up.
The resin wall 7 is provided on the outside of the light-reflecting member 9, for example, so as to surround the light-reflective member 9 or to face the light-reflective member 9 between them. Further, the light-shielding frame 5 may be provided with a recessed portion 5b that is recessed inward in a part of the outer periphery thereof. Thereby, at the time of manufacturing, for example, the material constituting the light reflecting member 9 can be injected into the space between the resin wall 7 and the substrate 10 through the recessed portion 5b. Further, the surface of the light reflecting member 9 may be exposed in the recessed portion 5b.
The inner peripheral end surface of the opening of the light-shielding frame 5 may be inclined as shown in FIGS. 5 and 6.

（透光性部材３）
透光性部材３は、発光素子１から出射される光を透過して外部に放出する部材である。透光性部材３は、光拡散材や、入射された光の少なくとも一部を波長変換可能な蛍光体を含有させてもよい。透光性部材３は、例えば、樹脂、ガラス、無機物等により形成することができる。蛍光体を含有する透光性部材は、例えば、蛍光体の焼結体や、樹脂、ガラス、セラミック又は他の無機物に蛍光体を含有させたもの等が挙げられる。また、樹脂、ガラス、セラミック等の成形体の表面に蛍光体を含有する樹脂層を形成したものでもよい。透光性部材３の厚みは、例えば、５０～３００μｍ程度である。
透光性部材３と発光素子との接合は、図２に示すように、例えば、導光部材１３を介して接合することができる。また、透光性部材３と発光素子１との接合には、導光部材１３を用いることなく、圧着、焼結、表面活性化接合、原子拡散接合、水酸基接合による直接接合法を用いてもよい。 (Translucent member 3)
The translucent member 3 is a member that transmits the light emitted from the light emitting element 1 and emits it to the outside. The translucent member 3 may contain a light diffusing material or a phosphor capable of wavelength-converting at least a part of the incident light. The translucent member 3 can be formed of, for example, a resin, glass, an inorganic substance, or the like. Examples of the translucent member containing a fluorescent substance include a sintered body of a fluorescent substance, a resin, glass, ceramic, or another inorganic substance containing the fluorescent substance. Further, a resin layer containing a phosphor may be formed on the surface of a molded product such as resin, glass or ceramic. The thickness of the translucent member 3 is, for example, about 50 to 300 μm.
As shown in FIG. 2, the translucent member 3 and the light emitting element can be joined via, for example, the light guide member 13. Further, for the bonding between the translucent member 3 and the light emitting element 1, a direct bonding method using crimping, sintering, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding can be used without using the light guide member 13. good.

（蛍光体）
上述したように、透光性部材３は、蛍光体を含んでいても良い。透光性部材３に含有させることができる蛍光体としては、発光素子１からの発光で励起可能なものが使用される。例えば、青色発光素子又は紫外線発光素子で励起可能な蛍光体としては、セリウムで賦活されたイットリウム・アルミニウム・ガーネット系蛍光体（Ｃｅ：ＹＡＧ）；セリウムで賦活されたルテチウム・アルミニウム・ガーネット系蛍光体（Ｃｅ：ＬＡＧ）；ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体（ＣａＯ－Ａｌ_２Ｏ_３－ＳｉＯ_２）；ユウロピウムで賦活されたシリケート系蛍光体（（Ｓｒ，Ｂａ）_２ＳｉＯ_４）；βサイアロン蛍光体、ＣＡＳＮ系蛍光体、ＳＣＡＳＮ系蛍光体等の窒化物系蛍光体；ＫＳＦ系蛍光体（Ｋ_２ＳｉＦ_６：Ｍｎ）；硫化物系蛍光体、量子ドット蛍光体などが挙げられる。これらの蛍光体と、青色発光素子又は紫外線発光素子と組み合わせることにより、様々な色の発光装置（例えば白色系の発光装置）を製造することができる。 (Fluorescent material)
As described above, the translucent member 3 may contain a fluorescent substance. As the phosphor that can be contained in the translucent member 3, one that can be excited by light emission from the light emitting element 1 is used. For example, as a fluorescent substance that can be excited by a blue light emitting element or an ultraviolet light emitting element, an yttrium aluminum garnet fluorescent substance (Ce: YAG) activated by cerium; a lutethium aluminum garnet fluorescent substance activated by cerium is used. (Ce: LAG); nitrogen-containing calcium aluminosilicate-based fluorescent material activated with europium and / or chromium (CaO-Al ₂ O ₃ -SiO ₂ ); silicate-based fluorescent material activated with europium ((Sr, Ba)). ₂ SiO ₄ ); Nitride-based phosphors such as β-sialon phosphors, CASN-based phosphors, and SCASN _- based phosphors; KSF-based phosphors (K2 SiF ₆ : Mn); Sulfur-based phosphors, quantum dot phosphors And so on. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device of various colors (for example, a white light emitting device) can be manufactured.

（光反射性部材９）
光反射性部材９は、発光素子１の側面および透光性部材３の側面を被覆し、発光素子１の側面および透光性部材３の側面から出射される光を反射して光発光面から出射させる。このように発光素子１の側面および透光性部材３の側面を被覆する光反射性部材９を設けることにより光の取りだし効率を高くできる。光反射性部材９は、例えば、光反射率の高い光反射性材料から形成する。具体的には、光反射性部材９は、発光素子からの光に対する反射率が６０％以上、より好ましくは８０％又は９０％以上である光反射性材料を用いることができる。光反射性材料は、例えば、光反射性物質を含む樹脂からなる。 (Light reflective member 9)
The light-reflecting member 9 covers the side surface of the light emitting element 1 and the side surface of the translucent member 3, and reflects the light emitted from the side surface of the light emitting element 1 and the side surface of the translucent member 3 from the light emitting surface. Let it emit. By providing the light-reflecting member 9 that covers the side surface of the light emitting element 1 and the side surface of the translucent member 3 in this way, the light extraction efficiency can be increased. The light-reflecting member 9 is formed of, for example, a light-reflecting material having a high light reflectance. Specifically, as the light reflecting member 9, a light reflecting material having a reflectance of 60% or more, more preferably 80% or 90% or more with respect to the light from the light emitting element can be used. The light-reflecting material is made of, for example, a resin containing a light-reflecting substance.

光反射性部材９を構成する母体の樹脂としては、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、また、これらの樹脂を少なくとも一種以上含むハイブリッド樹脂等の樹脂を用いることができ、その樹脂からなる母材に反射性物質を含有させることで形成することができる。光反射性物質としては、酸化チタン、酸化ケイ素、酸化ジルコニウム、酸化マグネシウム、酸化イットリウム、イットリア安定化ジルコニア、炭酸カルシウム、水酸化カルシウム、珪酸カルシウム、酸化ニオブ、酸化亜鉛、チタン酸バリウム、チタン酸カリウム、フッ化マグネシウム、アルミナ、窒化アルミニウム、窒化ホウ素、ムライトなどを用いることができる。好ましくは酸化チタン（ＴｉＯ２）を用いる。また、好ましくは、光反射性物質として、母材の樹脂の屈折率と異なる粒子を母材の樹脂中に分散させる。光反射性物質の含有濃度、密度により光の反射量、透過量が異なるため、発光装置の形状、大きさに応じて、適宜濃度、密度を調整することができる。また、光反射性部材９は光反射性物質に加え、その他の顔料、蛍光体等を含有してもよい。 As the base resin constituting the light reflective member 9, a resin such as a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, or a hybrid resin containing at least one of these resins may be used. It can be formed by containing a reflective substance in the base material made of the resin. Light-reflecting substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, yttrium oxide, yttria-stabilized zirconia, calcium carbonate, calcium hydroxide, calcium silicate, niobium oxide, zinc oxide, barium titanate, and potassium titanate. , Magnesium fluoride, alumina, aluminum nitride, boron nitride, murite and the like can be used. Titanium oxide (TiO2) is preferably used. Further, preferably, as a light-reflecting substance, particles having a refractive index different from that of the resin of the base material are dispersed in the resin of the base material. Since the amount of light reflected and the amount of transmitted light differ depending on the concentration and density of the light-reflecting substance, the concentration and density can be appropriately adjusted according to the shape and size of the light emitting device. Further, the light-reflecting member 9 may contain other pigments, phosphors and the like in addition to the light-reflecting substance.

（導光部材１３）
発光装置において、上述したように、透光性部材３と発光素子との接合は、例えば、導光部材１３を介して接合される。導光部材１３は、図２に示すように、発光素子１の側面の一部または全部を被覆していてもよい。透光性部材３の下面の一部が発光素子１の主な光出射面である上面に対向していないような場合、導光部材１３は、発光素子の上面と対向していない透光性部材３の一部を被覆するように形成することが好ましい。なお、導光部材１３は発光素子と透光性部材３との間にも介在し、両者を接合する。以上のように構成された導光部材１３は、発光素子１の上面及び側面からの出射光を透光性部材３へと効率よく導光させることができる。 (Light guide member 13)
In the light emitting device, as described above, the light emitting member 3 and the light emitting element are joined via, for example, the light guide member 13. As shown in FIG. 2, the light guide member 13 may cover a part or all of the side surface of the light emitting element 1. When a part of the lower surface of the translucent member 3 does not face the upper surface which is the main light emitting surface of the light emitting element 1, the light guide member 13 does not face the upper surface of the light emitting element. It is preferable to form the member 3 so as to cover a part of the member 3. The light guide member 13 is also interposed between the light emitting element and the translucent member 3, and joins the two. The light guide member 13 configured as described above can efficiently guide the light emitted from the upper surface and the side surface of the light emitting element 1 to the translucent member 3.

導光部材１３は、取り扱いおよび加工が容易であるという観点から、樹脂材料を用いることが好ましい。樹脂材料としては、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、フッ素樹脂の１種以上を含む樹脂またはハイブリッド樹脂等からなる樹脂材料を用いることができる。導光部材１３は、導光部材１３を形成するための樹脂材料の粘性、樹脂材料と発光素子１との濡れ性を適宜調整して上述した形状に形成することができる。 It is preferable to use a resin material for the light guide member 13 from the viewpoint of easy handling and processing. As the resin material, a resin material including a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, a resin containing at least one of a fluororesin, a hybrid resin, or the like can be used. The light guide member 13 can be formed into the above-mentioned shape by appropriately adjusting the viscosity of the resin material for forming the light guide member 13 and the wettability between the resin material and the light emitting element 1.

（その他の部材）
発光装置は、任意に、保護素子等の別の素子、電子部品等を有していてもよい。これらの素子及び電子部品は、光反射性部材９内に埋設されていることが好ましい。 (Other parts)
The light emitting device may optionally have another element such as a protective element, an electronic component, or the like. It is preferable that these elements and electronic components are embedded in the light reflecting member 9.

＜実施形態の発光装置の製造方法＞
以下、実施形態の発光装置の製造方法について図面を参照しながら説明する。
（発光素子実装工程）
ここでは、図７Ａに示すように、基板１０上に発光素子１をフリップチップ実装する。
具体的には、例えば、同一面側の下面に正負の電極を有する発光素子１を、正の電極が基板１０上に設けられた正の配線に対向し、負の電極が基板１０上に設けられた負の配線に対向するようにそれぞれ導電性接合部材１１により接合する。尚、図７Ａ～７Ｅでは、図２と同様、発光素子１の正負の電極及び基板１０上に設けられた正負の配線を区別することなく簡略化して描いている。 <Manufacturing method of light emitting device of embodiment>
Hereinafter, a method of manufacturing the light emitting device of the embodiment will be described with reference to the drawings.
(Light emitting element mounting process)
Here, as shown in FIG. 7A, the light emitting element 1 is flip-chip mounted on the substrate 10.
Specifically, for example, a light emitting element 1 having positive and negative electrodes on the lower surface on the same surface side is provided so that the positive electrode faces the positive wiring provided on the substrate 10 and the negative electrode is provided on the substrate 10. Each of them is joined by the conductive joining member 11 so as to face the negative wiring. In FIGS. 7A to 7E, as in FIG. 2, the positive and negative electrodes of the light emitting element 1 and the positive and negative wiring provided on the substrate 10 are simplified and drawn without distinction.

（透光性部材接合工程）
ここでは、図７Ｂに示すように、実装した発光素子１の発光面に下面が対向するように板状の透光性部材を接合する。
まず、例えば、透光性部材３の下面３ｂが透光性部材３の上面３ａより大きくなった板状の透光性部材３を準備する。
次に、準備した透光性部材３を発光素子１に対して位置合わせをして、透光性部材３を、例えば、導光部材１３により発光素子１の発光面に接合する。
透光性部材３は、例えば、
（ｉ）透光性部材３の下面３ｂの外周が、上方から平面視したときに発光素子１の外周の外側に位置するように、
（ｉｉ）透光性部材３の上面３ａの外周が、上方から平面視したときに発光素子１の外周の内側に位置するように、
位置合わせをする。 (Translucent member joining process)
Here, as shown in FIG. 7B, a plate-shaped translucent member is joined so that the lower surface faces the light emitting surface of the mounted light emitting element 1.
First, for example, a plate-shaped translucent member 3 in which the lower surface 3b of the translucent member 3 is larger than the upper surface 3a of the translucent member 3 is prepared.
Next, the prepared translucent member 3 is aligned with the light emitting element 1, and the translucent member 3 is joined to the light emitting surface of the light emitting element 1 by, for example, the light guide member 13.
The translucent member 3 is, for example,
(I) The outer circumference of the lower surface 3b of the translucent member 3 is located outside the outer circumference of the light emitting element 1 when viewed from above in a plan view.
(Ii) The outer circumference of the upper surface 3a of the translucent member 3 is located inside the outer circumference of the light emitting element 1 when viewed from above in a plan view.
Align.

透光性部材３と発光素子１とを接合する際、予め下面に導光部材１３を塗布した透光性部材３を発光素子１上に載置するようにしてもよいし、発光素子１の上面に導光部材１３を塗布した後に透光性部材３を発光素子１上に載置するようにしてもよい。導光部材１３の塗布量、透光性部材３を発光素子１上に載置して押圧する際の荷重、導光部材１３として樹脂材料を用いる場合にはその塗布時の粘度等は、透光性部材３を発光素子１上に接合した後の導光部材１３の望ましい形状を考慮して適宜設定する。 When joining the translucent member 3 and the light emitting element 1, the translucent member 3 having the light guide member 13 coated on the lower surface in advance may be placed on the light emitting element 1 or the light emitting element 1 may be placed. After applying the light guide member 13 on the upper surface, the translucent member 3 may be placed on the light emitting element 1. The coating amount of the light guide member 13, the load when the translucent member 3 is placed on the light emitting element 1 and pressed, and the viscosity at the time of coating when a resin material is used as the light guide member 13 are transparent. It is appropriately set in consideration of the desired shape of the light guide member 13 after the optical member 3 is joined on the light emitting element 1.

（樹脂壁形成工程）
未硬化及び／又は半硬化の樹脂材料を基板１０上に塗布し、樹脂壁７を形成する。樹脂壁７は、樹脂壁７上に遮光フレームを載置した状態で、その形状を保持可能な粘度の樹脂材料を用いて形成される。なお、この樹脂壁形成工程では、樹脂壁７は完全に硬化されておらず、押圧による変形が可能な柔軟性を維持した状態で樹脂壁７を形成する。
この樹脂壁７は、図７Ｃに示すように、発光素子１及び透光性部材３から所定の間隔を隔てかつ発光素子１及び透光性部材３を挟んで対向する位置に、上端が透光性部材３の上面より高くなるように形成する。ここで、発光素子１及び透光性部材３を挟んで対向する位置とは、分離された２つの樹脂壁７が対向するように設けられている形態だけではなく、例えば、１つの樹脂壁７が環状に形成され、その環状の樹脂壁７の一部と他の一部が発光素子１及び透光性部材３を挟んで対向している場合も含む。すなわち、樹脂壁７は、例えば、発光素子１及び透光性部材３を挟んで対向するように互いに平行になるように形成するようにしてもよいし、発光素子１及び透光性部材３を囲むように形成するようにしてもよい。また、樹脂壁７は、複数の発光装置間を跨ぐように、具体的には後述する分割線を跨ぐように配置してもよい。もしくは、遮光フレームを保持可能な位置に点状に複数配置してもよい。 (Resin wall forming process)
An uncured and / or semi-cured resin material is applied onto the substrate 10 to form the resin wall 7. The resin wall 7 is formed by using a resin material having a viscosity capable of retaining the shape of the light-shielding frame placed on the resin wall 7. In this resin wall forming step, the resin wall 7 is not completely cured, and the resin wall 7 is formed in a state where the resin wall 7 is flexible enough to be deformed by pressing.
As shown in FIG. 7C, the resin wall 7 has a translucent upper end at a position facing the light emitting element 1 and the translucent member 3 at a predetermined distance and sandwiching the light emitting element 1 and the translucent member 3. It is formed so as to be higher than the upper surface of the sex member 3. Here, the positions facing each other with the light emitting element 1 and the translucent member 3 interposed therebetween are not limited to the form in which the two separated resin walls 7 face each other, but for example, one resin wall 7. Is formed in an annular shape, and a part of the annular resin wall 7 and another part thereof face each other with the light emitting element 1 and the translucent member 3 interposed therebetween. That is, for example, the resin wall 7 may be formed so as to be parallel to each other so as to face each other with the light emitting element 1 and the translucent member 3 interposed therebetween, or the light emitting element 1 and the translucent member 3 may be formed. It may be formed so as to surround it. Further, the resin wall 7 may be arranged so as to straddle between a plurality of light emitting devices, specifically, to straddle a dividing line described later. Alternatively, a plurality of light-shielding frames may be arranged in dots at positions where they can be held.

また、樹脂壁７は、例えば、上述した光反射性部材９と同様にシリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、アクリル樹脂、また、これらの樹脂を少なくとも一種以上含むハイブリッド樹脂等の樹脂材料を用いることができ、その樹脂からなる母材に反射性物質等の各種フィラーを含有させることで形成することができる。樹脂材料の粘度は、例えば樹脂材料中に含有させるフィラーの量により調整することができる。
樹脂壁７の形成方法は、例えば、基板１０の上方に樹脂吐出装置のノズルを配置し、ノズルの先端から基板１０上に未硬化の樹脂材料を吐出させながら、ノズルが樹脂壁載置領域を移動することにより形成される。ノズルから吐出された未硬化の樹脂材料は基板１０上で濡れ広がり、断面視形状が略半円形状の樹脂壁７として基板１０上に配置される。なお、樹脂壁は、複数の樹脂壁を積み重ねて形成してもよく、これにより、所望の高さの樹脂壁を形成することができる。 Further, the resin wall 7 is, for example, a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, or a hybrid resin containing at least one of these resins, similar to the light reflective member 9 described above. A resin material can be used, and the base material made of the resin can be formed by containing various fillers such as a reflective substance. The viscosity of the resin material can be adjusted, for example, by the amount of filler contained in the resin material.
As a method of forming the resin wall 7, for example, a nozzle of a resin ejection device is arranged above the substrate 10, and the nozzle forms a resin wall mounting area while ejecting an uncured resin material onto the substrate 10 from the tip of the nozzle. Formed by moving. The uncured resin material discharged from the nozzle wets and spreads on the substrate 10, and is arranged on the substrate 10 as a resin wall 7 having a substantially semicircular cross-sectional shape. The resin wall may be formed by stacking a plurality of resin walls, whereby a resin wall having a desired height can be formed.

（遮光フレーム載置工程）
ここでは、開口部５ａを有する遮光フレーム５を準備し、遮光フレーム５を位置決めして基板１０から所定の高さに載置して固定する。
例えば、吸着コレット３０に遮光フレーム５を吸着して、遮光フレーム５の開口部５aの内周が透光性部材の上面の外周の外側に位置するように位置決めして吸着コレット３０を下方に移動させる。吸着コレット３０は、遮光フレーム５が樹脂壁７の上端に接触した後も、図７Ｄに示すように、遮光フレーム５の上面が透光性部材３の上面と同一平面上に位置するまで下方に移動させる。このように、遮光フレーム５により、樹脂壁７を押圧して変形させて、遮光フレーム５を基板１０から所定の高さ位置に載置する。その後、樹脂壁７を形成している未硬化の樹脂材料を本硬化することにより、遮光フレーム５を所定の高さに固定する。
このように、未硬化の樹脂材料を用いた樹脂壁７で遮光フレーム５を保持し、遮光フレーム５を押圧して樹脂壁７を変形させた状態で硬化する。これにより、遮光フレーム５を所定の高さ位置に固定することができるため、発光装置の製造工程において、各発光装置の高さばらつきを抑えることができる。 (Shading frame mounting process)
Here, a light-shielding frame 5 having an opening 5a is prepared, the light-shielding frame 5 is positioned, placed at a predetermined height from the substrate 10 and fixed.
For example, the light-shielding frame 5 is sucked onto the suction collet 30, positioned so that the inner circumference of the opening 5a of the light-shielding frame 5 is located outside the outer periphery of the upper surface of the translucent member, and the suction collet 30 is moved downward. Let me. Even after the light-shielding frame 5 comes into contact with the upper end of the resin wall 7, the suction collet 30 is moved downward until the upper surface of the light-shielding frame 5 is flush with the upper surface of the translucent member 3 as shown in FIG. 7D. Move it. In this way, the light-shielding frame 5 presses and deforms the resin wall 7, and the light-shielding frame 5 is placed at a predetermined height position from the substrate 10. After that, the uncured resin material forming the resin wall 7 is finally cured to fix the light-shielding frame 5 to a predetermined height.
In this way, the light-shielding frame 5 is held by the resin wall 7 using the uncured resin material, and the light-shielding frame 5 is pressed to cure the resin wall 7 in a deformed state. As a result, the light-shielding frame 5 can be fixed at a predetermined height position, so that height variation of each light-emitting device can be suppressed in the manufacturing process of the light-emitting device.

ここでは、図７Ｄを参照しながら、遮光フレーム５の上面が透光性部材３の上面と実質的に同一平面上に位置するように遮光フレームを位置決めする場合の例を示した。
しかしながら、遮光フレーム載置工程において、以下のようにすれば、遮光フレーム５の上面が透光性部材３の上面と異なる平面上に位置するように遮光フレーム５を位置決めすることもできる。
遮光フレーム５の上面が透光性部材３の上面より高くなるように位置決めする場合には、例えば、図８に示すように、吸着コレット３０の吸着面において、遮光フレーム５の開口部５ａが配置される部分に、透光性部材３の上面に対向する上面を有する凸部を設け、その凸部の周りで遮光フレーム５を吸着して基板１０から所定の高さに位置に載置するようにすればよい。
また、遮光フレーム５の上面が透光性部材３の上面より低くなるように位置決めする場合には、例えば、図９に示すように、吸着コレット３０の吸着面において、遮光フレーム５の開口部５ａが配置される部分に、透光性部材３の上面に対向する底面を有する凹部を設け、その凹部の周りで遮光フレーム５を吸着して基板１０から所定の高さに位置に載置するようにすればよい。 Here, with reference to FIG. 7D, an example is shown in which the light-shielding frame is positioned so that the upper surface of the light-shielding frame 5 is substantially flush with the upper surface of the translucent member 3.
However, in the light-shielding frame mounting step, the light-shielding frame 5 can be positioned so that the upper surface of the light-shielding frame 5 is located on a plane different from the upper surface of the translucent member 3 by performing the following.
When positioning the upper surface of the light-shielding frame 5 so as to be higher than the upper surface of the translucent member 3, for example, as shown in FIG. 8, the opening 5a of the light-shielding frame 5 is arranged on the suction surface of the suction collet 30. A convex portion having an upper surface facing the upper surface of the translucent member 3 is provided in the portion to be formed, and the light-shielding frame 5 is attracted around the convex portion and placed at a predetermined height from the substrate 10. It should be.
When the upper surface of the light-shielding frame 5 is positioned to be lower than the upper surface of the translucent member 3, for example, as shown in FIG. 9, the opening 5a of the light-shielding frame 5 is formed on the suction surface of the suction collet 30. A recess having a bottom surface facing the upper surface of the translucent member 3 is provided in the portion where the light-transmitting member 3 is arranged, and the light-shielding frame 5 is attracted around the recess and placed at a predetermined height from the substrate 10. It should be.

（光反射性部材形成工程）
ここでは、光反射性部材を形成する未硬化の樹脂材料を、基板１０と遮光フレーム５の間の空間に充填することにより、基板１０と遮光フレーム５の間で発光素子１と透光性部材３とを囲む光反射性部材９を形成する。実施形態の発光装置の製造方法では、例えば、外周の一部に内側に窪んだ窪み部５ｂを有する遮光フレーム５を用い、その窪み部５ｂを介して基板１０と遮光フレーム５の間の空間に光反射性樹脂９ａを充填する。具体的には、例えば、遮光フレーム５の窪み部５ｂに、図７Ｅに示すように、樹脂吐出装置のノズル３５を挿入し、そのノズル３５の先端から光反射性樹脂９ａを吐出して基板１０と遮光フレーム５の間の空間に光反射性樹脂を充填する。窪み部５ｂを介して基板１０と遮光フレーム５の間の空間に光反射性樹脂９ａを充填する場合、遮光フレーム５の窪み部５ｂは、図１に示すように、２箇所、好ましくは対称の位置に２箇所形成することが好ましい。遮光フレーム５に２箇所の窪み部５ｂを形成しておくと、光反射性樹脂９ａを充填する際、一方の窪み部５ｂから光反射性樹脂９ａを充填し他方の窪み部５ｂから空気を排出でき、容易にボイドの発生を抑制できる。また、遮光フレーム５の開口部の内周が透光性部材の上面の外周から離れて位置することにより、ボイドが排出されるとともに、樹脂材料の充填を目視により観察することができる。
基板１０と遮光フレーム５の間の空間に光反射性樹脂９ａを充填した後、充填した光反射性樹脂を硬化させる。
以上のようにして、実施形態の発光装置は製造される。 (Light reflective member forming process)
Here, the uncured resin material forming the light-reflecting member is filled in the space between the substrate 10 and the light-shielding frame 5, so that the light-emitting element 1 and the light-transmitting member are sandwiched between the substrate 10 and the light-shielding frame 5. A light reflecting member 9 surrounding the 3 is formed. In the method of manufacturing the light emitting device of the embodiment, for example, a light-shielding frame 5 having an inwardly recessed portion 5b in a part of the outer periphery is used, and the space between the substrate 10 and the light-shielding frame 5 is formed through the recessed portion 5b. The light reflective resin 9a is filled. Specifically, for example, as shown in FIG. 7E, the nozzle 35 of the resin ejection device is inserted into the recessed portion 5b of the light-shielding frame 5, and the light-reflecting resin 9a is ejected from the tip of the nozzle 35 to eject the substrate 10. The space between the light-shielding frame 5 and the light-shielding frame 5 is filled with a light-reflecting resin. When the space between the substrate 10 and the light-shielding frame 5 is filled with the light-reflecting resin 9a via the recessed portion 5b, the recessed portion 5b of the light-shielding frame 5 is provided at two locations, preferably symmetrical. It is preferable to form two places at the positions. When the light-shielding frame 5 is formed with two recessed portions 5b, when the light-reflecting resin 9a is filled, the light-reflecting resin 9a is filled from one recessed portion 5b and air is discharged from the other recessed portion 5b. It can easily suppress the generation of voids. Further, since the inner circumference of the opening of the light-shielding frame 5 is located away from the outer periphery of the upper surface of the translucent member, voids are discharged and the filling of the resin material can be visually observed.
After filling the space between the substrate 10 and the light-shielding frame 5 with the light-reflecting resin 9a, the filled light-reflecting resin is cured.
As described above, the light emitting device of the embodiment is manufactured.

以上の説明では、１つの発光装置を図示した図面を参照しながら説明した。
しかしながら、実施形態の発光装置の製造方法では、基板１０として、それぞれ個々の発光装置に対応する複数の単位領域に区分された基板を用いて複数の発光装置を一括して作製した後に個々の発光装置に分離するようにすることが好ましい。
例えば、基板１０として、複数の行（ｎ行）及び複数の列（ｍ列）を成すように複数（ｎ×ｍ）の単位領域を含む基板を用いる場合、以下のようにする。 In the above description, one light emitting device has been described with reference to the illustrated drawings.
However, in the method for manufacturing a light emitting device of the embodiment, a plurality of light emitting devices are collectively manufactured using a substrate divided into a plurality of unit regions corresponding to each light emitting device as the substrate 10, and then individual light emission is performed. It is preferable to separate them into devices.
For example, when a substrate including a plurality of (n × m) unit regions is used as the substrate 10 so as to form a plurality of rows (n rows) and a plurality of columns (m columns), the process is as follows.

（１）発光素子実装工程において、各単位領域にそれぞれ１又は２以上の発光素子１を実装する。
（２）透光性部材接合工程において、各単位領域に実装された１又は２以上の発光素子１を一括して覆うようにそれぞれ透光性部材３を接合する。 (1) In the light emitting element mounting step, one or two or more light emitting elements 1 are mounted in each unit region.
(2) In the translucent member joining step, the translucent members 3 are joined so as to collectively cover one or more light emitting elements 1 mounted in each unit region.

（３）樹脂壁形成工程において、単位領域に実装された１又は２以上の発光素子１と透光性部材３とを挟んで対向する位置に単位領域ごとに樹脂壁を形成する。
基板１０として、複数の行（ｎ行）及び複数の列（ｍ列）を成すように複数（ｎ×ｍ）の単位領域を含む基板を用いる場合、例えば、互いに平行な複数の樹脂壁を列方向に形成することにより、列方向に配列された複数の単位領域の樹脂壁を連続した一本の樹脂壁により形成することが可能になり、効率良く樹脂壁を形成することができる。
（４）光反射性部材形成工程において、各単位領域の基板１０と遮光フレーム５の間の空間にそれぞれ光反射性樹脂を充填する。
そして、光反射性部材形成工程後に、分割工程において、光反射性部材及び基板を単位領域ごとに分割することで、発光装置を個片化する。分割は、例えばブレード等を用いた切断により行うことができる。
この単位領域ごとに分割することを考慮すると、単位領域ごとに分割する際の分割位置が遮光フレーム５の外周から離れていることが好ましい。言い換えれば、遮光フレーム５は、発光装置の外形より一回り小さいことが好ましい。 (3) In the resin wall forming step, a resin wall is formed for each unit region at positions facing each other with one or more light emitting elements 1 mounted in the unit region and the translucent member 3 interposed therebetween.
When a substrate containing a plurality of (n × m) unit regions is used as the substrate 10 so as to form a plurality of rows (n rows) and a plurality of columns (m columns), for example, a plurality of resin walls parallel to each other are arranged in columns. By forming in the direction, it becomes possible to form the resin wall of a plurality of unit regions arranged in the row direction by one continuous resin wall, and the resin wall can be efficiently formed.
(4) In the light-reflecting member forming step, the space between the substrate 10 and the light-shielding frame 5 in each unit region is filled with the light-reflecting resin.
Then, after the light-reflecting member forming step, in the dividing step, the light-reflecting member and the substrate are divided into unit regions to individualize the light emitting device. The division can be performed, for example, by cutting with a blade or the like.
Considering the division into each unit area, it is preferable that the division position when dividing into each unit area is far from the outer periphery of the light-shielding frame 5. In other words, the light-shielding frame 5 is preferably one size smaller than the outer shape of the light-emitting device.

以上の発光装置の製造方法によれば、基板１０上に複数の発光装置を一括して作製した後に個々の発光装置に分離するようにしているので、発光装置を安価に製造することができる。 According to the above method for manufacturing a light emitting device, since a plurality of light emitting devices are collectively manufactured on the substrate 10 and then separated into individual light emitting devices, the light emitting device can be manufactured at low cost.

１発光素子
３透光性部材
３ａ上面（発光装置の光出射面）
５遮光フレーム
５ａ開口部
５ｂ窪み部
７樹脂壁
９光反射性部材
１０基板
１１導電性接合部材
１３導光部材
３０吸着コレット
３５ノズル 1 Light emitting element 3 Translucent member 3a Upper surface (light emitting surface of light emitting device)
5 Light-shielding frame 5a Opening 5b Depression 7 Resin wall 9 Light-reflecting member 10 Substrate 11 Conductive joining member 13 Light-guiding member 30 Adsorption collet 35 Nozzle

Claims

With the board
The light emitting element provided on the substrate and
A plate-shaped translucent member having an upper surface and a lower surface having an area larger than the upper surface and provided so that the lower surface faces the light emitting surface of the light emitting element.
A light-reflecting member that covers the side surface of the light emitting element and the side surface of the translucent member,
A light-shielding frame provided on the upper surface of the light-reflecting member around the translucent member and arranged away from the side surface of the translucent member via the light-reflecting member.
Equipped with
The light-shielding frame has an opening, and when viewed in a plan view from above, the outer periphery of the upper surface of the translucent member is located inside the inner circumference of the opening, and the outer periphery of the lower surface of the translucent member is located. Located on the outside of the inner circumference of the opening
A light emitting device in which the light reflecting member is interposed between the side surface of the translucent member and the inner circumference of the opening.

The light emitting device according to claim 1, wherein the outer periphery of the upper surface of the translucent member is located inside the outer periphery of the light emitting element when viewed in a plan view from above.

The light emitting device according to claim 1 or 2, wherein the upper surface of the translucent member and the upper surface of the light shielding frame are substantially on the same plane.

The light emitting device according to claim 1 or 2, wherein the upper surface of the translucent member and the upper surface of the light shielding frame are located on different planes parallel to each other.

The light emitting device according to any one of claims 1 to 4, wherein the outer periphery of the light-shielding frame is located inside the outer periphery of the light emitting device.

The light emitting device according to any one of claims 1 to 5, wherein the light-shielding frame is a metal frame made of a metal that absorbs light or a frame having a metal film that absorbs light on the surface.

The light emitting device according to any one of claims 1 to 6, further comprising a resin wall whose upper end is in contact with the lower surface of the light shielding frame.

One of claims 1 to 7, wherein a recessed portion is provided in a part of the outer periphery of the light-shielding frame, and the surface of the light-reflecting member is exposed in the recessed portion. The light emitting device described.

The light emitting device according to any one of claims 1 to 8, further comprising a protective element embedded in the light reflecting member.

The light emitting device according to any one of claims 1 to 9, wherein the translucent member includes a phosphor.

In any one of claims 1 to 10, the distance between the inner circumference of the opening of the light-shielding frame and the outer circumference of the upper surface of the translucent member is 5 μm or more and 150 μm or less in a plan view from above. The light emitting device described.