JP2010157638A - Light emitting device, and method of manufacturing the same - Google Patents

Light emitting device, and method of manufacturing the same Download PDF

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JP2010157638A
JP2010157638A JP2008335579A JP2008335579A JP2010157638A JP 2010157638 A JP2010157638 A JP 2010157638A JP 2008335579 A JP2008335579 A JP 2008335579A JP 2008335579 A JP2008335579 A JP 2008335579A JP 2010157638 A JP2010157638 A JP 2010157638A
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light
light emitting
member
surface
emitting device
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JP5521325B2 (en
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Masatsugu Ichikawa
Shunsuke Minato
Masahiko Sano
雅彦 佐野
将嗣 市川
俊介 湊
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Nichia Corp
日亜化学工業株式会社
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    • HELECTRICITY
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    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
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    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
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    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/921Connecting a surface with connectors of different types
    • H01L2224/9212Sequential connecting processes
    • H01L2224/92122Sequential connecting processes the first connecting process involving a bump connector
    • H01L2224/92125Sequential connecting processes the first connecting process involving a bump connector the second connecting process involving a layer connector
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
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    • H01L2924/151Die mounting substrate
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
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    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L33/58Optical field-shaping elements

Abstract

Provided are a light emitting device that can stably emit light that can be cut off and has high secondary utilization, and a manufacturing method thereof.
A light emitting device includes a light emitting element and a light transmitting member into which light emitted from the light emitting element is incident. The light transmitting member has a light emitting surface and a side surface continuous from the light emitting surface. . The light-emitting device further includes a light-reflective first covering member that covers the side surface of the light-transmitting member and surrounds the light-emitting element, and covers the first covering member so that the light-emitting surface and the light-emitting surface-side exposed surface are exposed. And a second covering member having a larger absorption coefficient than the first covering member with respect to visible light. As a result, while the brightness is improved by the first covering member, stray light components such as return light can be absorbed by the second covering member, so that sharp emitted light with high contrast can be obtained.
[Selection] Figure 1

Description

  The present invention relates to a light emitting device excellent in light distribution characteristics and a method for manufacturing the same.

  Conventionally, by combining a light source and a wavelength conversion member that is excited by light emitted from the light source and can emit light having a hue different from the light emission color of the light source, a light emitting device having various emission colors based on the principle of light color mixing Has been developed. In addition, a light-emitting device using a semiconductor light-emitting element such as a light emitting diode (LED) or a laser diode (LD) as a light source has low power consumption and a long life, so that it can be substituted for a fluorescent lamp. It has attracted attention as generational illumination, and further improvements in output and uniform emission color and brightness in light distribution are required.

  For example, Patent Document 1 discloses a light emitting device that emits white light without color unevenness and a method for manufacturing the same. A cross-sectional view of the light emitting device 500 is shown in FIG. In the light emitting device 500, a light emitting element 501 in which a semiconductor light emitting layer is provided on a light transmitting substrate 508 is installed in a flip chip manner in a concave portion 503 of a lead frame so that the substrate side is an upper surface. The wavelength conversion material member 507 in which the phosphor layer is applied to the holding plate is closely provided. In addition, a phosphor layer 502 is provided around the light emitting element 501 in the recess 503 by being filled with a coating liquid in which a phosphor 505 is blended with an inorganic binder.

  If it is said structure, the wavelength conversion member 507 controlled by uniform thickness will be obtained easily, the distribution of a fluorescent substance will be equalize | homogenized, and it will be hard to produce color unevenness. In addition, by arranging the phosphor 505 on the end face of the light emitting element 501, the light leaking from the end face of the light emitting element 501 can be wavelength-converted with certainty, so that a brighter light emitting device can be obtained.

Furthermore, the secondary light whose light distribution has been adjusted by using the light emitting device as a primary light source and condensing the primary light in a desired light emission direction through an optical system such as a reflecting mirror or a lens. Is disclosed (for example, Non-Patent Document 1).
JP 2003-101074 A JP 2002-305328 A Supervised by Shigeo Oyama, "Development Technology and Prospects for Automotive Semiconductors", pages 109-118, CMC Publishing 2007

  However, especially when the primary light from the primary light source is adjusted and used as the light source of the final use form, such as a projector or a floodlight of a car headlight or projector, the final light source greatly depends on the light distribution characteristics of the primary light. . That is, when there is a negative factor such as color unevenness or luminance unevenness in the light distribution of the primary light source, the optical characteristics are emphasized by the optical system, and there is a possibility of causing blurring of light and defocusing.

  By combining a light blocking member in the optical system and blocking the return light and stray light, it is possible to emit light with an edge that is finally effective. However, in this embodiment, light loss due to the blocking is unavoidable. That is, increasing the light output and improving the parting-off are conflicting achievement means, and it has been difficult to satisfy both requirements so far. On the other hand, in the SMD type LED for LED display, there is one in which the surface of the package base material around the light emitting window is black and the contrast is increased. However, in the conventional SMD type, the output is insufficient, the light leaks from the base material, the light loss due to absorption of this on the black surface, and the black color change at the periphery of the window portion thereby worsens the parting. There was also a problem.

  In view of such a situation, as a result of intensive investigations, the present inventors have increased the contrast between the light-emitting region and the non-light-emitting region in the primary light source by setting the covering member that covers the light-emitting element to a specific arrangement form. It has been newly found that high brightness light can be stably emitted by effectively reducing light loss while satisfying this. That is, a main object of the present invention is to provide a light-emitting device that can stably emit a good-off light and has high secondary utilization, and a manufacturing method thereof.

  In order to achieve the above object, a first light-emitting device of the present invention has a light-emitting element, a light-emitting surface, and a side surface continuous from the light-emitting surface, and light transmission through which light emitted from the light-emitting element is incident. A light-reflective first covering member covering the light-emitting element by covering the member, the side surface of the light-transmitting member, and the first covering member; And a second covering member having an absorption coefficient larger than that of the first covering member with respect to visible light.

  According to the second light emitting device of the present invention, the light emitted from the light emitting surface to the outside is white light, and the second covering member can be a black body.

  Furthermore, according to the third light emitting device of the present invention, the first covering member is thicker on the side of the light emitting element than on the side of the light transmitting member, and the second covering member is on the side of the light emitting element. Further, the wall thickness can be increased on the side of the light transmitting member.

  Furthermore, according to the fourth light emitting device of the present invention, the light emitting device includes a frame body that surrounds the light emitting element and the light transmission member, and at least the first covering member is filled in the frame body. The covering member can cover the first covering member and the frame body to form the light emitting surface side exposed surface together with the light emitting surface.

  Furthermore, according to the fifth light emitting device of the present invention, the second covering member can be joined to the first covering member.

  Furthermore, according to the sixth light emitting device of the present invention, the metal member can be interposed between the first covering member and the second covering member.

  Furthermore, according to the seventh light emitting device of the present invention, the first and second covering members are resin molded bodies, and the first covering member is made of a silicone resin containing a light reflective material as a base material. The second covering member can be based on an epoxy resin or a silicone resin colored with a pigment.

  Furthermore, according to the eighth light emitting device of the present invention, the light transmitting member contains a phosphor capable of converting the wavelength of at least part of the light emitted from the light emitting element, and the second covering member includes the first covering member. The thermal conductivity can be made higher than that of the covering member.

  Furthermore, according to the ninth light emitting device manufacturing method of the present invention, a light emitting element, a light transmitting member having a light emitting surface and a side surface continuous from the light emitting surface, into which light emitted from the light emitting element is incident, A method of manufacturing a light emitting device comprising: a step of mounting a light emitting element on a wiring substrate; a step of disposing a light transmitting member above the light emitting element; and covering the side surface of the light transmitting member to form the light emitting element. Forming a surrounding light-reflective first covering member; covering the first covering member; forming a light-emitting surface-side exposed surface together with the light-emitting surface; and the first covering member for visible light Forming a second covering member having a larger absorption coefficient.

  According to the light emitting device of the present invention, the stray light component such as return light can be absorbed by the second covering member while improving the luminance by the first covering member, so that sharp emitted light with high contrast can be obtained. As a result, the optical control of the emitted light becomes easy, and the secondary usability using each light emitting device as a unit light source is enhanced. In particular, in an illuminating device in which the light emitting device of the present invention is combined with an optical system, light blurring is reduced, and a light source having high brightness while being clear can be realized.

  Further, according to the method for manufacturing a light emitting device of the present invention, the light reflective first covering member and the light absorbing second covering member can be easily formed in a desired arrangement form by resin molding or the like. A light-emitting device with high contrast and high brightness can be obtained with high productivity.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies the light emitting device and the manufacturing method thereof for embodying the technical idea of the present invention, and the present invention provides the light emitting device and the manufacturing method thereof as follows. Not specified. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified, but are merely described. It's just an example. Further, in this specification, “diameter” means a diameter, but even if it is defined by “diameter”, it may mean not only a circle but also a width and a length.

  Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. In addition, the contents described in some examples and embodiments may be used in other examples and embodiments. Further, in this specification, the term “upper” on the layer or the like is not necessarily limited to the case where the upper surface is formed in contact with the upper surface, but includes the case where the upper surface is formed apart from the upper surface. It is used to include the case where there is an intervening layer between them. In the present specification, the covering member may be described as a sealing member.

(Embodiment 1)
1A and 1B are schematic views of a light emitting device 100 according to Embodiment 1 of the present invention. FIG. 1A is a sectional view of the light emitting device 100, and FIG. Each of the plan views is shown. The light emitting device 100 mainly includes a light emitting element 10, a light transmitting member 15 to which light emitted from the light emitting element 10 is incident, and a covering member 26 that covers at least a part of the light transmitting member 15. . In the light emitting device 100 of FIG. 1, one main surface side of the light emitting element 10 is mounted on the wiring substrate 9 to be conductive, and the other main surface side opposite to the one main surface side is the light transmitting member 15. Optically connected. The light transmitting member 15 includes a light receiving surface 15b that receives light emitted from the light emitting element 10, a light emitting surface 15a that emits the received light and / or wavelength-converted light thereof, and a side surface 15c continuous from the light emitting surface 15a. Have In the example of FIG. 1, the light transmitting member 15 is plate-shaped, and one main surface facing the light emitting element 10 in the vicinity is the light receiving surface 15 b, and the surface of the light emitting device 100 is opposed to the light receiving surface 15 b. The other main surface constituting the exit surface is a light emitting surface 15a. Then, both end surfaces constituting the thickness of the light transmission member 15 substantially orthogonal to the light emitting surface 15a are referred to as side surfaces 15c.

  The covering member 26 includes a first sealing member 26a and a second sealing member 26b, and covers the side surface 15c with at least a part of the light emitting surface 15a and the light receiving surface 15b of the light transmitting member 15 exposed. To do. The first sealing member 26 a contains the light reflective material 2 capable of reflecting light, and is disposed in a posture surrounding the light emitting element 10. A second sealing member 26b containing a light-absorbing material 29 that absorbs light is further disposed outside the first sealing member 26a. In the example of FIG. It forms an interface with the outer surface of the member 26a. The second sealing member 26 b covers the periphery of the light emitting surface 15 a of the light transmitting member 15 in a plan view from the light observation direction, and this covered region covers at least a part of the exposed surface of the light emitting device 100. Constitute.

  Further, as shown in FIG. 1A, the first sealing member 26a covers the side surface 15c with the light emitting area on the light emitting surface 15a of the light transmitting member 15 and the light receiving area on the light receiving surface 15b as non-covering areas. Specifically, the light emitting surface 15a is exposed to the outside with the substantially entire area of the light emitting surface 15a that emits light to the outside and the region facing the light emitting element 10 on the light receiving surface 15b as an uncovered region. Further, the exposed surface of the covering member 26 in the region covering the side surface 15c of the light transmitting member 15 is arranged in a posture that is substantially flush with the light emitting surface 15a. However, “substantially the same surface” in the present specification may be substantially the same surface in terms of the functions described above. For example, compared to the dimensions of the light transmitting member and the light emitting element of the light emitting device on the same surface. It can be about ± 10%. Further, the present invention is not limited to this, and the present invention can be similarly applied to the light emitting surface of the light transmitting member and the same surface of the outer surface of the covering member surrounding the light emitting surface.

  With the above structure, the light emitted from the light emitting element 10 travels to the light transmitting member 15, and then the light emitting surface 15a serves as a window portion of the light emitting device 100, and is emitted outward from the window portion 15a. The window portion 15a is provided on the front surface in the emission direction with respect to the covering member 26 surrounding the light transmitting member 15, that is, the covering member 26 is substantially flush with the light emitting surface 15a. Alternatively, as shown in the light emitting device 200 of FIG. 2, the light emitting surface 15a of the light transmitting member 15 protrudes outward from the exposed surface of the second sealing member 26b, that is, the covering member 26 is received from the light emitting surface 15a. As the outer surface that has receded to the surface 15b side, the main light emission from the light emitting surface 15a of the light transmitting member 15 may not be blocked by the covering member 26. More specifically, the main light output can be prevented from being lost by the light absorbing material 29 by retracting the second sealing member 26b from the light emitting surface 15a. As a result, it is preferable that stray light such as return light can be used for a light-emitting device with limited contrast and relatively improved overall output.

  Further, the light transmission member 15 contains a wavelength conversion material 12 capable of converting the wavelength of at least part of the light emitted from the light emitting element 10. As a result, a part of the primary light emitted from the light emitting element 10 is additively mixed with the secondary light wavelength-converted by the wavelength conversion material 12, and a light emitting device capable of emitting light of a desired wavelength it can. In addition, as described above, the light emitting surface 15a is used as a light emission window portion in the light emitting device 100. In other words, the light distribution curve indicating the light distribution region substantially corresponds to the shape and size of the window portion that is the light emitting surface. Dependent. For example, as shown in FIG. 1, when the light transmitting member 15 includes the light emitting element 10 in a plan view from the light observation direction, that is, if the diameter of the light transmitting member 15 is larger than the diameter of the light emitting element 10, Can be wide. That is, the amount of light from the light emitting device can be increased by increasing the light emitting surface 15a as compared with the light emitting element. Alternatively, the diameter of the light transmissive member 15 may be made smaller than the outline of the light emitting element 10 so that the side surface 15 c of the light transmissive member 15 is positioned on the light emitting element 10. That is, the light emitting surface 15a is made smaller than that of the light emitting element 10 and the light emitting region is narrowed down, so that the color mixture ratio can be made substantially constant, so that the emitted light can be further reduced in color unevenness. Further, the relative luminance can be increased by reducing the light emitting area. Alternatively, the light transmitting member 15 and the light emitting element 10 may have substantially the same outer diameter, and may be positioned so that the side surface 15c of the light transmitting member and the end surface 33 that is the side surface of the light emitting element 10 are substantially aligned. As a result, it is possible to emit light in which both the luminous flux, the luminance, and the color arrangement are balanced.

  Hereinafter, each member and structure of the light emitting device 100 according to the present invention will be described.

(Light emitting element)
As the light-emitting element 10, a known element, specifically, a semiconductor light-emitting element can be used. In particular, a GaN-based semiconductor is preferable because it can emit visible light or ultraviolet light having a short wavelength that can excite a fluorescent substance efficiently. A specific emission peak wavelength is 240 nm to 560 nm, preferably 380 nm to 420 nm, or 450 nm to 470 nm. In addition, a light emitting element of ZnSe, InGaAs, or AlInGaP semiconductor may be used.

(Light emitting element structure)
The light emitting element structure by the semiconductor layer is composed of at least a first conductivity type (n-type) layer and a second conductivity type (p-type) layer. Further, a structure having an active layer between both the conductivity type layers is preferable in terms of output and efficiency, but is not limited thereto.
The electrode structure is preferably a structure in which both electrodes of the first conductivity type (negative) and the second conductivity type (positive) are provided on one main surface side, but are not limited thereto and face each main surface of the semiconductor layer. Thus, a structure in which electrodes are provided may be used. The positive and negative electrodes are not necessarily limited to a pair, and a plurality of positive and negative electrodes can be formed. Furthermore, a well-known technique can also be adopted for the mounting form of the light emitting element. For example, in an element structure having positive and negative electrodes on the same surface side, flip chip mounting with the growth substrate side facing the electrode forming surface as a main light extraction surface is possible. Since the light emitting element 10 and the light transmitting member 15 can be optically stably connected, it is preferable from the viewpoint of optical characteristics related to hue, luminance, and the like. In addition, mounting with the electrode forming surface side as the main light extraction surface and face-up mounting can be employed, and mounting means suitable for the element structure can be employed as appropriate.

  Note that the growth substrate for crystal growth of the semiconductor layer may be removed when the growth substrate does not constitute a light emitting element structure. Alternatively, a structure in which a supporting substrate, for example, a conductive substrate, another light-transmitting member, or a light-transmitting substrate is bonded to the semiconductor layer from which the growth substrate has been removed may be employed. Moreover, it can replace with the translucent member and board | substrate connected to a semiconductor layer, and the light transmissive member 15 can also be used. In addition, an element having a structure in which a semiconductor layer is bonded and covered with a light-transmitting member such as glass or resin may be used. The removal of the growth substrate can be carried out by peeling, polishing, or LLO (Laser Lift Off) while being held on the chip mounting portion of the apparatus or the submount, for example. Moreover, even if it is a translucent dissimilar board | substrate, light extraction efficiency and an output can be improved by removing a board | substrate, and it is preferable.

(Light reflection structure)
The light emitting element 10 can have a light reflecting structure. Specifically, of the two main surfaces facing each other of the semiconductor layer, the other main surface facing the light extraction side is defined as a light reflecting side (lower side in FIG. 1). A light reflecting structure can be provided on the electrode or the like. Examples of the light reflecting structure include an element structure in which a multilayer reflective layer is provided in a semiconductor layer, or an electrode having a highly light reflective metal film such as Ag or Al or a dielectric multilayer film on the semiconductor layer, reflective There are structures with layers.

(Nitride semiconductor light emitting device)
The light emitting element 10 mounted on the light emitting device 100 of FIG. 1 is an LED chip, and this LED chip is flip-chip mounted on a submount substrate which is one of the wiring boards 9. A nitride semiconductor light emitting element will be described below as an example of the light emitting element 10. FIG. 3 is a schematic cross-sectional view of the light-emitting element 10. In the nitride semiconductor light emitting device 10 of FIG. 3, on the sapphire substrate which is the growth substrate 5, the n-type semiconductor layer which is the first nitride semiconductor layer 6, the light emitting layer which is the active layer 8, and the second nitride. A p-type semiconductor layer which is the physical semiconductor layer 7 is epitaxially grown in order to form a nitride semiconductor layer 11. Then, a part of the light emitting layer 8 and the p-type semiconductor layer 7 is selectively removed by etching, and a part of the n-type semiconductor layer 6 is exposed, and an n-type pad which is the first electrode 3A is exposed in this exposed region. An electrode is formed. In addition, a light-transmitting conductive layer 13 such as ITO is formed on almost the entire surface of the p-type semiconductor layer 7, and a p-type pad electrode as the second electrode 3 </ b> B is formed on a part of the transparent conductive layer 13. Furthermore, only predetermined surfaces of the n-type pad electrode 3A and the p-type pad electrode 3B are exposed, and other portions are covered with an insulating protective film 14. Note that the n-type pad electrode 3A may be formed in the exposed region of the n-type semiconductor layer 6 via the n-type electrode of the translucent conductive layer.

(Growth substrate, nitride semiconductor)
The growth substrate 5 is a substrate on which the semiconductor layer 11 is epitaxially grown. As a substrate in the nitride semiconductor, sapphire or spinel (MgAl 2 O 4 ) whose main surface is any one of the C-plane, R-plane, and A-plane is used. Insulating substrates, silicon carbide (6H, 4H, 3C), Si, ZnS, ZnO, GaAs, diamond, and oxide substrates such as lithium niobate and neodymium gallate that are lattice-bonded to nitride semiconductors, GaN and AlN There are nitride semiconductor substrates such as. As the nitride semiconductor, the general formula In x Al y Ga 1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1) A, B and P, may be mixed with As. Further, the n-type semiconductor layer 6 and the p-type semiconductor layer 7 are not particularly limited to a single layer or a multilayer. The light emitting layer 8 which is an active layer has a single (SQW) or multiple quantum well structure (MQW). As an example of the nitride semiconductor layer 11, an n-type semiconductor layer, for example, n of Si-doped GaN is formed on a sapphire substrate via a nitride semiconductor underlayer such as a buffer layer, for example, a low-temperature grown thin film GaN and a GaN layer. Type contact layer and GaN / InGaN n-type multilayer film layer, followed by InGaN / GaN MQW active layer, and p-type semiconductor layer, for example, Mg-doped InGaN / AlGaN p-type multilayer film layer and Mg A structure in which p-type contact layers of doped GaN are stacked is used.

(Wiring board)
On the other hand, in the light emitting device 100 of FIG. 1, as the substrate 9 on which the light emitting element 10 is mounted, a substrate on which at least the surface is connected to the electrode of the element can be used. The material of the substrate is made of aluminum nitride (AlN) as an example, single crystal, polycrystalline, sintered substrate, ceramics such as alumina as other materials, glass, metal or metal substrate such as Si, and their surfaces A laminate or a composite such as a substrate on which an AlN thin film layer is formed can be used. A metal substrate, a metallic substrate, and a ceramic substrate are preferable because of high heat dissipation. The substrate on which the element is placed may be a substrate having no wiring. For example, in a light emitting element whose main light emitting side is the electrode formation surface side, the substrate side is mounted and the electrode of the element is attached to the device. It may be in the form of wire connection to the electrode, or a light emitting device provided with a base material for the mounting portion and a lead electrode. Further, as the form of the substrate and the covering member, a form in which the covering member is provided on the substrate as well as the side surface of the substrate may be used as in the illustrated light emitting device. Further, it is preferable that at least the surface of the wiring board is made of a highly reflective material so that light can be effectively reflected in the light extraction direction.

(Light transmission member)
Further, the light emitting device 100 of FIG. 1 includes a light transmission member 15 into which light from the light emitting element 10 is incident. The light transmitting member 15 preferably has a wavelength conversion material 12 capable of converting the wavelength of at least part of the light passing therethrough. Thereby, when the primary light from the light source passes through the light transmitting member 15, the secondary light having a wavelength different from the wavelength of the light source is obtained by exciting the phosphor as the wavelength conversion material 12. As a result, outgoing light having a desired hue can be realized by color mixing with primary light that is not wavelength-converted. In addition, there is a form that only transmits primary light, a form that transmits secondary light or its secondary light excited by primary light, and hardly transmits primary light. The former is a single color of LED light, the latter is It can be set as the light-emitting device which light-emits the conversion light (monochromatic, mixed-color light) of ultraviolet light emission LED.

  Further, the light transmitting member 15 in FIG. 1 is configured to include the light emitting element 10 in a plan view from the light emitting surface 15a. In other words, as shown in FIG. 1, the side surface 15 c of the light transmitting member 15 protrudes outward from the end surface 33 constituting the side surface of the light emitting element 10. As a result, light emitted from the optically connected light emitting element 10 can be directly received by the light receiving surface 15b wider than the upper surface of the light emitting element 10, so that there is little loss of light flux. The protrusion amount of the side surface 15c of the light transmitting member 15 with respect to the side surface of the light emitting element 10 is, for example, 3% or more and 30% or less, specifically 5% or more and 15% or less as compared with the dimension of the light emitting element. is there. As an example, in the light-emitting device of Example 1, the light-transmitting member 15 protrudes to the end with a width of about 50 μm.

  Here, as the translucent member serving as a base material of the light transmissive member 15, the same material as the following covering member can be used, for example, resin, glass, inorganic material can be used, and the following wavelength conversion material A molded body, a crystalline body, or the like may be used. Further, when the light transmitting member has a plate shape, the light emitting surface and the light receiving surface are preferably both substantially flat surfaces, and moreover, both opposing surfaces are preferably parallel to each other. The light travels favorably. On the other hand, the light-emitting surface and the light-receiving surface are not limited to flat surfaces, but are not limited to flat surfaces, and are not limited to planar shapes such as uneven surfaces, or even planar shapes. Various shapes or forms, for example, a shape for condensing light, a shape for dispersing, for example, an optical shape such as a lens shape, etc., or a structure in which it is combined on a light transmitting member it can. The light transmitting member 15 may be a part of the constituent members of the light emitting element 10.

  In addition to the light emitting device that emits visible light from the light emitting element and a mixed color light of the converted light by the wavelength conversion function of the light transmitting member, for example, converted light by ultraviolet light from the light emitting element or a plurality of converted light A light-emitting device that emits secondary light converted from primary light of a light-emitting element, such as mixed color light, can also be provided.

  Specific examples of the light transmissive member 15 having a wavelength conversion function include a glass plate having a light conversion member, a phosphor crystal or a single crystal having a phase thereof, a polycrystal, an amorphous body, and a ceramic body. It is done. In addition, a sintered body, an aggregate, a porous body of phosphor crystal particles and a translucent member to be added as appropriate, and further, a translucent member such as a translucent resin mixed or impregnated therein, or It is comprised from the translucent member containing fluorescent substance particle, for example, the molded object etc. of translucent resin. Further, the shape of the light transmitting member 15 is not particularly limited, but in the first embodiment, the light transmitting member 15 is plate-shaped. By using the plate shape, the coupling efficiency with the emission surface of the light emitting element 10 configured in a planar shape is good, and the alignment can be easily performed so that the main surface of the light transmission member 15 is substantially parallel. In addition, by making the thickness of the light transmissive member 15 substantially constant, the wavelength conversion amount of light passing therethrough can be made substantially uniform, the color mixing ratio can be stabilized, and color unevenness at the light emitting surface 15a can be suppressed. For this reason, in the case where a plurality of light emitting elements 10 are mounted on one light transmitting member 15, the luminance and chromaticity distribution in the light emitting surface due to the arrangement of the individual light emitting elements 10 are less uneven and substantially uniform and high luminance. Luminescence can be obtained. The thickness of the light transmitting member 15 having a wavelength conversion function is preferably 10 μm or more and 500 μm or less, and more preferably 50 μm or more and 300 μm or less in terms of light emission efficiency and chromaticity adjustment.

Moreover, it can be suitably combined with a blue light emitting element to emit white light, and typical phosphors used for wavelength conversion materials include phosphors of YAG (yttrium, aluminum, garnet) and LAG (lutetium) that are attached to cerium. aluminum garnet) phosphor can be cited, in particular, at the time of high luminance and long-term use (Re 1-x Sm x) 3 (Al 1-y Ga y) 5 O 12: Ce (0 ≦ x <1, 0 ≦ y ≦ 1, where Re is at least one element selected from the group consisting of Y, Gd, La, and Lu). Further, a phosphor containing at least one selected from the group consisting of YAG, LAG, BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CCA, SCA, SCESN, SESN, CESN, CASBN, and CaAlSiN 3 : Eu. Can be used.

  In the light emitting device 100, a plurality of light transmissive members having a wavelength conversion material or a function thereof may be provided. For example, the light conversion member may be a mixture of two or more kinds of phosphors. In addition, a light transmissive member having a plurality of wavelength conversion materials having different conversion wavelengths, or a laminate of light transmissive members containing wavelength conversion materials having different conversion wavelengths may be used. Further, a light transmission member having one wavelength conversion material or its function and a light conversion unit having a light conversion member separately from the light conversion device may be provided on the window for extracting light from the light emitting device or in the device from the light source to the light source. It can also be provided on the optical path, for example, between the light transmitting member and the light emitting element, in the coupling member, between the light emitting element and the covering member, and the like.

It is also possible to increase the reddish component using a nitride phosphor having yellow to red light emission, and to realize illumination with high average color rendering index Ra, light bulb color LED, and the like. Specifically, by adjusting the amount of phosphors having different chromaticity points on the CIE chromaticity diagram according to the emission wavelength of the light emitting device, the phosphor is connected between the phosphors and the light emitting device. Any point can be made to emit light. In addition, a nitride phosphor, oxynitride phosphor, silicate phosphor, L 2 SiO 4 : Eu (L is an alkaline earth metal) that converts near-ultraviolet to visible light into a yellow to red region, particularly (Sr x Mae 1-x ) 2 SiO 4 : Eu (Mae is an alkaline earth metal such as Ca or Ba). Examples of nitride phosphors and oxynitride (oxynitride) phosphors include Sr—Ca—Si—N: Eu, Ca—Si—N: Eu, Sr—Si—N: Eu, and Sr—Ca—Si. —O—N: Eu, Ca—Si—O—N: Eu, Sr—Si—O—N: Eu, and the like. As the alkaline earth silicon nitride phosphor, the general formula LSi 2 O 2 N 2 : Eu , general formula L x Si y N (2 / 3x + 4 / 3y): Eu or L x Si y O z N ( 2 / 3x + 4 / 3y-2 / 3z): Eu (L is, Sr, Ca, One of Sr and Ca).

  In the light emitting device, the number of the light emitting elements 10 corresponding to one light transmitting member 15 is not particularly limited. If a plurality of light emitting elements 10 capable of emitting light that passes through one light transmitting member 15 are used, the total amount of light beams traveling to the light receiving surface 15b can be increased, so that the brightness of light emitted from the light emitting surface 15a can be increased. It is preferable. As shown in the figure, there are a structure in which a plurality of elements are arranged in a row, a structure in which lattice elements are arranged at equal intervals, and the like.

(Coating member / sealing member)
As shown in FIG. 1, the covering member 26 covers a part of the light transmitting member 15, and specifically covers at least the side surface 15 c of the light transmitting member 15. The material of the resin used as the base material of the covering member 26 is not particularly limited as long as it is translucent, and it is preferable to use a silicone resin composition, a modified silicone resin composition, or the like. An insulating resin composition having translucency such as a composition and an acrylic resin composition can be used. Moreover, sealing members excellent in weather resistance, such as hybrid resins containing at least one of these resins, can also be used. Furthermore, inorganic materials having excellent light resistance such as glass and silica gel can be used. Furthermore, a lens effect can be provided by making the light emitting surface side of the sealing member have a desired shape, and light emitted from the light emitting element chip can be focused. In addition, the first sealing member disposed on the light emitting element side generates heat and emits light from the light emitting element and the wavelength conversion member. Therefore, a material excellent in light resistance and heat resistance is used, and the outside is covered. Since the influence of the second covering member is small, other materials, the above-described improvement in parting ability, weather resistance, and heat conductivity, that is, different materials (base materials) are selected and separated from each other. You can also.

  Furthermore, the covering member 26 is preferably a resin molded body having high heat resistance. This is because the light emitting element 10 and the light transmitting member 15 correspond to the propagation path of the photon energy and may generate heat. Therefore, it is preferable that the first sealing member 26a adjacent to these heating elements employs a resin having particularly high light resistance and heat resistance. In the first embodiment, in the first sealing member 26a constituting the covering member 26, the resin serving as the base material is a silicone resin. Silicone resins are excellent in heat resistance, water repellency, and electrical insulation, and have the advantage of being resistant to deterioration over time. Further, the first sealing member 26a contains at least one kind of light-reflective material 2 with little light absorption in the resin of the base material. Inclusion of the light reflective material 2 increases the light reflectance of the first sealing member 26a, suppresses light leakage to the adjacent member through the resin, that is, light induction in a desired direction. Is possible. In order to effectively realize the above effect, at least one light reflecting material 2 with little light absorption is contained in the resin serving as the base material, that is, in the first embodiment, the silicone resin. Further, by including the light reflective material 2, the reflectance of the first sealing member 26a is increased, and more preferably, the coating member has a reflection function by translucent particles, and reduces light absorption and loss. And can. That is, the emitted light from the LED chip that is the light emitting element 10 is reflected by the first sealing member 26a coated in the vicinity of the periphery of the LED chip and guided to the LED chip side or the light transmitting member 15 side. The Thus, by using a structure using the second sealing member in combination with the first sealing member, the light emission side surface of the base material of the device is light compared to the conventional case of coloring black. Reflective efficiency, high output and high brightness.

In the first sealing member 26a constituting the covering member 26, the contained light reflecting material 2 is one oxide selected from the group consisting of Ti, Zr, Nb, Al, Si, or AlN, at least one of MgF, specifically a TiO 2, ZrO 2, Nb 2 O 5, Al 2 O 3, MgF, AlN, at least one selected from the group consisting of SiO 2. The light-reflective material 2 contained in the first sealing member 26a, particularly in the translucent resin, in particular, the translucent particles are selected from the group consisting of Ti, Zr, Nb, and Al. It is preferable to be a seed oxide because the translucency and reflectivity of the material and the refractive index difference from the substrate can be increased. Similarly, the second sealing member may have a light reflective material to reinforce the reflection function. In this case, the density of the light reflective material is made lower than that of the first sealing member or the reflective function is reduced. Reduce the rate. The covering member can also be constituted by a molded body made of the light reflective material 2, specifically, a porous material such as an aggregate obtained by agglomerating the particles or a sintered body. In addition, a molded body by a sol-gel method may be used. Such a porous covering member can increase the refractive index difference between the light-reflecting material 2 and the air in the porous body, so that the light-reflecting property can be improved and the light resistance and heat resistance are excellent. In addition, in consideration of the characteristics of both the covering members, it is also possible to form a covering member that is a composite molded body of both. For example, a covering member molded into a desired shape is impregnated with resin from the outer surface side. It can also be a molded body. As described above, the covering member, the sealing member, or the surrounding body thereof may not be completely sealed or hermetically sealed, but the internal region and the outside may be communicated or may be gas permeable. It is sufficient that the light does not leak at least, particularly a shape that does not leak in the emission direction. Such a structure may be composed of the first and second covering members, or may be composed of only the first covering member on the light emitting element side.

  In the covering member containing the light-reflective material 2 in the base material described above, the depth at which light oozes out varies depending on the concentration and density, so the concentration and density are adjusted appropriately according to the shape and size of the light emitting device. Good. For example, in the case of a relatively small light emitting device, it is necessary to reduce the thickness of the covering member that covers the light emitting element and the light transmitting member, that is, the high concentration so that light leakage is suppressed with the thin member. It is preferable that the light reflecting material 2 is provided. On the other hand, if the concentration of the light-reflective material 2 in the raw material is increased in the manufacturing process such as preparation of the covering member containing the light-reflective material 2, application of the raw material, molding, etc., manufacturing difficulties may occur. In some cases, the concentration is appropriately adjusted. Here, the covering member provided with the base material has been described, but the same can be applied to the porous body. As an example, in the experiment in the following comparative example, it is preferable that the concentration is 20 wt% or more and the thickness is 20 μm or more. Within this range, emitted light with high brightness and high directivity can be obtained from the light emitting surface.

  Moreover, the 2nd sealing member 26b can use various resin as a main ingredient similarly to the 1st sealing member 26a. For example, epoxy resin, silicone resin, phenol resin, and polyimide resin are listed. However, it is preferable that the second sealing member 26b be a resin molded body excellent in strength, weather resistance, or gas barrier properties. This is because the second sealing member 26b is a member constituting the outer shape of the light emitting device and is exposed to the external environment. In the first embodiment, an epoxy resin is used as the base material of the second sealing member 26b. Epoxy resins have good water resistance and heat resistance and are excellent in electrical insulation. Further, since it has good adhesion to the first sealing member 26a and little molding shrinkage, it has excellent characteristics as an adhesive. Furthermore, it has high strength and excellent chemical resistance and corrosion resistance. Therefore, even when the strength of the first sealing member 26a is relatively small, the second sealing member 26b having high mechanical strength surrounds the outside of the first sealing member 26a. The light emitting element can be protected from external stress, and the impact resistance can be improved. Further, the reliability of the light-emitting device can be improved by not passing negative factors of the external environment with respect to the light-emitting element such as humidity and temperature. In addition, the adhesion (dirt) of the surface can be prevented because the surface has low tackiness (tackiness). In the case where a plurality of resin materials are integrally formed, it is preferable from the viewpoint of avoiding interfacial delamination to select resins having similar thermal expansion coefficients. Furthermore, in order to increase productivity, the base materials of the first sealing member 26a and the second sealing member 26b may be matched. In the first embodiment, the base of the second sealing member 26b is used. The material may also be a silicone resin that is substantially the same material as the first sealing member 26a.

Further, the second sealing member 26b contains a light-absorbing material 29 capable of absorbing light in a resin base material, and has a larger absorption coefficient for visible light than at least the first sealing member 26a. And For example, the second sealing member 26b can be colored by containing a light-absorbing material 29 such as a pigment so that light having a desired wavelength can be absorbed. In particular, by making the second sealing member 26b a black body colored black, most of it can be absorbed uniformly over substantially the entire wavelength range of visible light, so that stray light such as return light is absorbed. Therefore, it is preferable that re-release to the outside can be suppressed. For this reason, it is preferable that the 2nd sealing member 26b is a black body especially with respect to the light-emitting device whose luminescent color is white. Moreover, if it is a black body, even if dirt adheres, it can be hard to visually recognize. Alternatively, the contrast to external light can be increased. Therefore, the light-absorbing material 29 to be contained in the resin base material is preferably a structure capable of coloring the resin base material black, for example, a black pigment. Specific examples of the black colored material include carbon black, carbon fine powder, carbon nanotubes, carbon fibers, fullerene, and the like, which are a collection of carbon graphite-type microcrystals. Further, other fillers may be added in consideration of dispersibility and sedimentation properties of the light absorbing material 29 in the resin base material. For example, the addition of silica (SiO 2 ) makes it possible to make the particle diameters substantially uniform, and is relatively inexpensive and suitable.

  The second sealing member 26b is preferably added with a heat conductive material. Accordingly, heat generated by a heat source such as a light-transmitting member containing a light-emitting element and a wavelength conversion material can be efficiently diffused to the outside, and the reliability of the light-emitting device can be improved. Specifically, a heat conductive material having a heat conductivity of 0.8 W / K · m or more is preferable. Since the second sealing member 26b constitutes the exposed surface of the light emitting device, if the thermal conductivity is in the above range, heat generated by the heat source can be effectively released to the outside, and the life characteristics of the light emitting device are improved. In particular, it is preferable to make the thermal conductivity of the second sealing member 26b higher than the thermal conductivity of the first sealing member 26a. As a result, when the heat source, particularly, the light transmitting member 15 contains a wavelength conversion material (phosphor), heat generation from the wavelength conversion material can be easily induced to the outside, and heat dissipation to the outside can be enhanced. . Examples of the heat conductive material include metal materials such as Ag and Cu, and ceramic materials with good heat absorption such as diamond, alumina, AlN, and glass, and these may be mixed and contained. The optical properties (translucency, light reflectivity, and light absorption) of the second sealing member 26b largely depend on the light absorbing material 29 contained therein, but the main resin itself and the added heat conduction. It varies somewhat depending on the material used. In other words, the higher the concentration of the heat conductive material, the greater the influence on the optical characteristics of the second sealing member 26b. Therefore, both the light absorptive and heat conductive elements of the final second sealing member 26b are determined. In consideration, the ratio of the contained material is determined. Note that the light-absorbing material 29 may also serve as the heat conductive material. For example, the light-absorbing material 29 mentioned as an example of a black colored body is also a highly heat-conductive material, and thus it may be omitted to separately apply a heat-conductive material.

(Coating area)
By the way, the emitted light from the light emitting element 10 and / or its wavelength converted light travels on the light receiving surface 15b of the light transmitting member 15 as described above, passes through the light transmitting member 15, and then is emitted to the outside. Therefore, by covering at least the side surface 15c of the light transmitting member 15 with the first sealing member 26a which is the covering member 26, the following actions and effects can be obtained. Leakage of light from the side surface 15c region can be avoided, and further, emission from the side surface 15c side can be suppressed to reduce color unevenness and luminance unevenness in the entire emission color, thereby the first sealing. The parting function of the second sealing member constituting the light emitting surface outside the member can be enhanced. In addition, by reflecting the light traveling in the direction of the side surface 15c toward the light extraction direction side and further limiting the light emitting area to the outside, the directivity of the emitted light and the luminance at the light emitting surface 15a can be increased, On the other hand, due to the light resistance of the inner first sealing member, the outer second sealing member can be prevented from being deteriorated by light having high luminance and high luminous flux. Furthermore, heat generated from the light transmitting member can be conducted to the first sealing member, and heat dissipation can be improved. In the case where the light transmitting member contains a wavelength conversion material, it is particularly effective when the light is emitted with high luminance and high output because the wavelength conversion material generates significant heat.

  In the first embodiment, the first sealing member 26 a covers a part of the light receiving surface 15 b in addition to the side surface 15 c of the light transmitting member 15. Specifically, as illustrated in FIG. 1, a sealing member 26 is filled between the light transmitting member 15 and the wiring substrate 9, and the periphery of the light emitting element 10 is covered with the sealing member 26. In other words, on the light receiving surface 15 b of the light transmitting member 15, the area facing the light emitting element 10, that is, the area excluding the bonding area with the element, that is, the exposed area from the element is covered with the sealing member 26. With this configuration, an optical connection region between the light emitting element 10 and the light transmission member 15 and a covering region of the sealing member 26 are provided on the light receiving surface of the light transmission member, and limited to this optical connection region. From there, the primary light of the light emitting element 10 can be guided to the light transmitting member 15 side with high efficiency. In addition, the light that has traveled to the light receiving surface side of the light transmitting member can be reflected to the light extraction side by the sealing member 26 in the covering region, and light loss of primary light due to light absorption in the wiring substrate 9 can be suppressed. . Further, as shown in the drawing, a plurality of light emitting elements 10 are bonded to one light transmitting member 15, and the first sealing member 26a is filled between the elements, so that adjacent element bonding is performed on the light receiving surface 15b. It is preferable to cover the separation region provided between the regions with the first sealing member 26a. In the light transmission member 15, heat generated immediately above the junction region by being adjacent to the element and heat that easily accumulates in the light transmission member 15 can be suppressed by increasing the heat dissipation of the separation region by the first sealing member.

  Further, the second sealing member 26b is disposed outside the first sealing member 26a. More specifically, the second sealing member 26b in FIG. 1 or FIG. 2 is joined to the first sealing member 26a and surrounds it while being in contact with the outer surface of the first sealing member 26a. That is, the shape of the outer surface side of the first sealing member 26a is connected while being substantially aligned with the shape of the inner surface side of the second sealing member 26b, and an interface is formed in the joining region of both members. Molded integrally. In other words, the first sealing member 26 a is interposed between the second sealing member 26 b and the light emitting element 10. And the diameter of the outer surface in the molded object of the 1st sealing member 26a is the lamination direction of the light emitting element 10 and the light transmissive member 15, as shown to Fig.1 (a), and the optical axis direction of a light emission surface (Fig.1 (a)). (Upward direction). That is, in the horizontal direction orthogonal to the stacking direction and the direction parallel to the light emitting surface (the left-right direction in FIG. 1A), the ratio of the first sealing member 26a in the outer shape of the entire light emitting device decreases toward the top. Therefore, the ratio of the second sealing member 26b to the first sealing member 26a is small on the lowest surface of the covering member 26 in contact with the wiring board 9, and this ratio increases as it goes upward. The ratio of the second sealing member 26b is the largest on the outermost surface of the covering member 26 on the light emitting side, and the second sealing member 26b is exposed to the outside to constitute the exposed surface of the light emitting device. In other words, in the horizontal direction, the first sealing member 26a is thicker on the side of the light emitting element 10 than on the side of the light transmitting member 15, while the second sealing member 26b is on the side of the light emitting element 10. The wall thickness is larger on the side of the light transmission member 15 than on the side of.

  As described above, the covering member 26 has the first sealing member 26a and the first sealing member 26a so that the cross-sectional shape of the interface between the first sealing member 26a and the second sealing member 26b is tapered upward. The two sealing members 26b are integrally formed as a unique shape. As a result, the arrangement region of the highly reflective first sealing member 26a included in the second sealing member 26b having high light absorption can be narrowed toward the top. That is, the region where light can travel according to the light emission direction is tapered, and the light is guided to the light transmitting member 15 disposed in the uppermost narrowest region. Therefore, since the emitted light from the light emitting element 10 can be condensed with high efficiency onto the light receiving surface 15b of the light transmitting member 15, the luminance in the light emitting region can be effectively increased. On the other hand, by embedding the narrow region of the first sealing member 26a with the second sealing member, the ratio of the second sealing member 26b occupying the light emitting surface is increased, and further the second Since the sealing member 26b is close to the light emitting surface, the parting function and the heat radiation function can be enhanced. On the other hand, the parting function is not required on the bottom side facing the light emitting surface, that is, the mounting surface side. Therefore, the ratio of the second sealing member can be reduced. In addition, on the bottom surface side forming a wide wide area where the ratio of the first sealing member is high, the first sealing member that surrounds and holds the light emitting element and the light transmission member and the mounting substrate Adhesive strength can be increased.

  Furthermore, as shown in FIG. 1B, the light emitting device 100 covers the periphery of the light emitting surface 15a with a second sealing member 26b having a high light absorption in the plan view from the light observation direction, and the first The exposed surface of the light emitting device is configured by maximizing the ratio of the second sealing member 26b to the sealing member 26a. With this structure, when the emitted light from the light emitting device 100 becomes return light and travels to the light emitting device 100, the return light can be absorbed by the outer surface of the light emitting device surrounding the light emitting surface 15a, and the return light is again outward. It is possible to prevent reflections. Therefore, it is possible to effectively prevent the reflected light from traveling to a region outside the main light distribution region, and avoid occurrence of luminance unevenness and color unevenness. That is, it is possible to obtain a light distribution having uniform brightness and hue within the surface.

  By making the first sealing member and the second sealing member in the covering member 26 into a unique arrangement form, it is possible to improve the light collection rate on the light emitting surface 15a while suppressing the loss of the total light flux. . In addition, since the luminance difference between the light emitting region and other regions can be increased, the light emitting region can be substantially limited to the light emitting surface 15a and the emission light can be cut off. That is, the shape of the light emitting surface 15a of the light transmitting member 15 and the shape of the light distribution curve formed by the light emitted from the light emitting surface 15a can be made to substantially coincide. In other words, the light distribution pattern can be controlled by the shape of the light emitting surface 15a.

  The light emitting device has a structure in which the exposed surface around the light emitting surface 15a is formed by the second sealing member 26b in a state where the first sealing member 26a encloses at least the side surface 15c of the light transmitting member 15. Various forms can be adopted for other covering regions of the sealing member. For example, in the arrangement in which the first sealing member 26a surrounds the light emitting element 10 as illustrated, the first sealing member 26a is attached to the end surface 33 of the light emitting element 10 to encapsulate the light emitting element 10. It is preferable from the simplicity of the production. However, the first sealing member 26a can be arranged to be spaced outward from the end face 33 of the light emitting element 10, and specifically, a connection portion that optically connects to the light transmitting member on the surface of the light emitting element 10. If the exposed portions exposed from the electrical and physical connection portions with the substrate are exposed without being covered by the first sealing member 26a and further include a plurality of light emitting elements 10, these light emission The first sealing member 26a is not filled in the space between the elements 10 and a gap is formed. In this way, if the surrounding member which is the first sealing member 26a is provided with an internal space, the reflectance can be increased by the refractive index difference between the surrounding member and the gas, and the light emitting device with high output and brightness can be obtained. can do. At this time, it is preferable to form an exposed portion having a high refractive index difference between the element and air / gas by airtight sealing or the like so that the refractive index difference with the light emitting element is preferably increased. Further, when a plurality of light emitting elements are optically connected to one light transmitting member, a gap can be formed between the elements in the same manner to increase the output.

  In the form in which the light emitting device has a frame, the first sealing member 26a has a cross-sectional shape that tapers and becomes narrower toward the upper side not only on the light emitting element 10 and the light transmitting member 15 side but also on the inner wall side of the frame. The first sealing member 26a may have a shape having a bottom of a concave portion between the side surface 15c of the light transmitting member 15 and the inner wall of the frame. And the form with which the 2nd sealing member 26b was filled in the recessed part may be sufficient. The second sealing member 26b may be thick enough to constitute the surface layer of the sealing member 26 as long as the second sealing member 26b can sufficiently attenuate stray light such as return light by absorption. Furthermore, as described above, the first sealing member 26a and the second sealing member 26b are preferably provided to be joined to each other, but a gap or other member, for example, described later, is provided between the two sealing members. An adhesive member or the like for improving the adhesion of the light reflecting layer or both sealing members may be interposed.

(Adhesive)
An adhesive 17 is interposed at the interface between the light emitting element 10 and the light transmitting member 15, thereby fixing both members. The adhesive 17 is preferably made of a material that can effectively guide the light emitted from the light emitting element 10 toward the light transmitting member 15 and optically connect both members. Examples of the material include resin materials used for the above-described members. As an example, a translucent adhesive material such as a silicone resin is used. Further, for bonding between the light emitting element 10 and the light transmitting member 15, crystal bonding by thermocompression bonding or the like can be employed.

(Method for manufacturing light emitting device)
The light emitting element 10 is flip-chip mounted on a wiring substrate 9 as a mounting substrate, and the light transmitting device 100 of the example shown in FIG. 1 is obtained by including the light transmitting member and the covering member. An example of the manufacturing method will be described with reference to FIG. First, as shown in FIG. 4A, bumps 24 are formed on the wiring substrate 9 or on the light emitting element 10 in accordance with a flip chip mounting pattern. Next, the light emitting element 10 is flip-chip mounted through the bumps 24. In this example, one LED chip is mounted side by side on the submount substrate 9 in an area corresponding to one light emitting device. The number of chips mounted depends on the size of the light emitting surface and the light transmitting member. Can be changed as appropriate. Or the form which mounts the light emitting element 10 in this cavity using the mounting substrate which has a cavity structure may be sufficient. The light emitting element 10 may be mounted by eutectic bonding, thereby increasing the bonding area between the wiring board and the light emitting element to promote heat dissipation and improve heat dissipation.

  Next, in FIG. 4B, a silicone resin as an adhesive 17 is applied to the back surface side of the light emitting element 10 (the back surface of the sapphire substrate or the nitride semiconductor exposed surface if the substrate is removed by LLO) to transmit light. The members 15 are stacked. Thereafter, the silicone resin 17 is thermally cured to bond the light emitting element 10 and the light transmitting member 15 together.

  Further, a frame 25 having a predetermined size and shape is erected around the light emitting element 10. For example, the frame 25 and the cavity may have a lower height than the light transmitting member 15. The component members of the package (excluding the electrical connection portion with the outside) such as the frame 25 and the mounting substrate are preferably black. Then, as shown in FIG. 4C, the first sealing member 26a is potted in the frame 25 standing around the light emitting element 10 or in the cavity so as to cover the side surface of the light transmitting member 15. To do. The dropped first sealing member 26 a scoops up the wall surface side of the light emitting element 10 by surface tension and covers the side surface 15 c of the light transmitting member 15. That is, the first sealing member 26 a has a shape that expands downward, and is recessed at a position lower than the light emitting surface 15 a of the light transmitting member 15 to form the recess 32. In other words, the light transmission member 15 is a convex window portion, the light emitting surface 15a is disposed at the highest position, and the light transmission member 15 is provided with a recess 32 around the light transmission surface 15a.

  Subsequently, in FIG. 4D, the second sealing member 26b is filled into the recess 32 formed by the first sealing member 26a. Specifically, the second sealing member 26b is potted on the recess 32 and is flattened by its own weight. At this time, the filling amount is adjusted so that the surface of the second sealing member 26b is along the light emitting surface 15a of the light transmitting member 15, that is, both surfaces are positioned on substantially the same surface. Then, after the second sealing member 26b is cured, it is diced at a predetermined position (for example, a one-dot chain line portion in FIG. 4D) and cut into a desired size to obtain the light emitting device of FIG. If it is the said manufacturing method, the 1st sealing member 26a and the 2nd sealing member 26b can be joined easily, and can be shape | molded integrally. In addition, the first sealing member tapered in the light guide direction and the second sealing member constituting most of the exposed surface of the light emitting surface can be preferably manufactured with a high yield. Here, the first sealing member and the second sealing member are preferably cured and molded after application, for example, vacuum defoaming and thermosetting, but both are simultaneously cured and molded. For example, after the first sealing member is formed, a part of the curing and molding process is performed, and temporary curing and molding are performed to form the second sealing member, and the main curing and molding process are performed. It is good also as a form to do. It is only necessary that the curing and molding process be performed under conditions suitable for each sealing member, and the curing and molding process conditions of the second sealing member are such that the first sealing member is not adversely affected. The material can be selected to be the same base material or different base materials.

  However, the arrangement method of the first sealing member 26a and the second sealing member 26b covering the periphery of the light emitting element 10 is not limited to the above. Further, the light emitting element may not be provided with a form that is directly mounted on a predetermined mounting portion of the light emitting device, that is, a submount. Furthermore, a lens or the like can be bonded and sealed to the light emitting devices cut out individually.

(Embodiment 2)
In the first embodiment, the cutting is performed at a position where the frame body 25 is excluded during dicing. That is, the frame 25 is not included in the final form of the light emitting device 100. However, the positioning of the dicing is not limited to this, and the light emitting device can be chipped as a form in which the frame 25 is left on the light emitting device side. A light-emitting device 300 having a frame body in this manner is referred to as Embodiment Mode 2. FIG. 5A is a cross-sectional view of the light-emitting device 300, and FIG. 5B is a plan view of the light-emitting device 300 from the light observation direction. Each is shown. The light emitting device 300 of the second embodiment is different from the light emitting device 100 of the first embodiment in that the frame body 25 is provided, but the other structures are the same. Therefore, the same reference numerals are assigned to the same members, and detailed descriptions thereof are omitted.

  The light emitting device 300 of FIG. 5 covers the periphery of the light emitting surface 15a with the second sealing member 26b, and the second sealing member 26b is surrounded by the frame body 25. That is, the frame 25 constitutes the outline of the light emitting device 300. Thereby, the mechanical strength of the light emitting device 300 can be increased. Further, as described above, the frame 25 is preferably formed of a light absorbing member, particularly a black body, like the second sealing member 26b, from the viewpoint of the light characteristics of the light emitting surface 15a. In other words, stray light such as return light and extraneous light can be absorbed to obtain a light distribution with uniform brightness and chromaticity within the surface.

  Further, by attaching the frame body 25, the first sealing member 26 a and the second sealing member 26 b can be stored in the housing surrounded by the frame body 25, and the respective members can be firmly fixed. In particular, when the resin that is the main component of the first sealing member 26a and the second sealing member 26b is different, the resin may float due to poor curing of the resin or due to peeling at the interface due to differences in the thermal expansion coefficient of each member. There is a risk that the member may be displaced, such as expansion or expansion, but by surrounding the frame body 25 around the covering member and standing, the frame body 25 can restrain each member and fix the sealing member in place. . Therefore, if both the first sealing member 26a and the second sealing member 26b are joined to the inner wall of the frame 25 in the height direction of the frame 25, the adhesion of the members can be further improved. This is preferable.

  Furthermore, by installing the frame body 25, the installation area of the second sealing member 26b can be reduced by the amount of the structure of the frame body 25 while maintaining the entire outer diameter of the light emitting device 300, and the cost can be reduced. In addition, since the frame 25 constitutes the outline of the light emitting device 300, the dependence on strength elements such as the hardness of the sealing member 26 is reduced, and the range of selection of the constituent material can be widened. For example, the main component of the second sealing member 26b may be a silicone resin to improve light resistance and heat resistance. Further, the frame body 25 is arranged on the same plane as the covering member 26 or in a lower posture than the light transmitting member 15 in a plan view from the light observation direction. In other words, the light emitting surface 15a is arranged at the uppermost part in the stacking direction of the light emitting device (upward direction in FIG. 1B) without providing a member protruding in the light emitting direction around the light emitting surface 15a. Thereby, it is possible to avoid that main light emitted from the light emitting surface 15a is shielded and absorbed by the adjacent member, that is, it is possible to suppress light loss.

(Embodiment 3)
In the light emitting device, it is preferable that the exposed surface exposed to the outside is formed of a light absorbing member except for the light emitting surface and the electrical connection region. As a result, light emission having uniform brightness and chromaticity within the surface can be obtained. In the example of FIG. 1, the end face 27 exposed in the stacking direction of the light emitting device is configured by the second sealing member 26 b having high light absorption. Therefore, the outer diameter of the light emitting device in plan view from the light observation direction depends on the outer diameter of the second sealing member 26b. The outer diameter of the second sealing member 26b is not particularly limited, but by increasing the outer diameter, the periphery of the light emitting surface 15a is covered over a wide area in a region having high light absorption, and the scattered light is scattered. The return light greatly deviated from the axis can be absorbed in a wide range. Here, the light emitting device 400 in which the end face of the second sealing member 26b constituting the outer shape of the light emitting device is disposed outward from the wiring substrate 9 is shown as a third embodiment in FIG.

  6A is a cross-sectional view of the light emitting device 400, and FIG. 6B is a plan view from the light observation direction. The light emitting device 400 is different from the light emitting device 100 of FIG. 1 in the arrangement shape of the second sealing member, and the other structures are the same. Therefore, the same reference numerals are assigned to the same members, and detailed description thereof is omitted.

As shown in FIG. 6, the second sealing member 36 b is joined to the first sealing member 26 a integrally with the diameter increasing in the stacking direction (upward in FIG. 6A). Molded. The structure covering the periphery of the light emitting surface 15a in plan view from the light observation direction is the same as that of the first embodiment. That is, the periphery of the light emitting surface 15a is covered with the second sealing member 26b via the first sealing member 26a, and the second sealing member 26b constitutes an exposed surface. Further, the second sealing member 36b continuously covers from the end surface 28 constituting the thickness of the wiring board 9 from the outer surface of the first sealing member 26a in the stacking direction. That is, the second sealing member 26 b encapsulates the wiring substrate 9 and constitutes the end face of the light emitting device 400.
Furthermore, in the third embodiment, the frame 25 may be included. Then, the mechanical strength of the light emitting device can be further increased by covering the frame with the second sealing member. Further, when the surface of the wiring board 9 is exposed outside the frame body, it may be extended and continuously covered from the frame body to the exposed surface of the wiring board 9, and the end face (side surface) of the wiring board 9 may be further covered. ) 28 may also be coated. In the third embodiment, when the frame is provided, the height of the frame is preferably lower than the light emitting surface 15a, that is, provided so as to recede from the light emitting surface in the light emitting direction. This is because, as described above, the exposed surface of the second sealing member 36b can be formed lower than the light emitting surface 15a, and light shielding and light loss by the constituent members can be suppressed. In this way, when the exposed surface of the first sealing member is substantially the same surface as the light emitting surface and the second sealing member is provided there, or the exposed surface of the second sealing member is When protruding forward from the light emitting surface, the light emission from the light emitting surface is inhibited, but the present invention is preferable because it can be avoided.

  By setting the second sealing member 26b to the above configuration, the contact area between the second sealing member 26b and the wiring board 9 can be increased, and both can be firmly connected. Furthermore, since the first sealing member 26a can be sandwiched between the second sealing member 26b and the wiring board 9, the covering member 26 and the wiring board 9 can be stably adhered. As a result, peeling in the vicinity of the interface due to a difference in expansion coefficient between the first sealing member 26a and the second sealing member 26b can be effectively prevented, which is preferable.

  Further, the wiring pattern by the wiring board 9 is not particularly limited. As shown in FIG. 6A, a wiring pattern for external connection is applied to the back side through the through hole of the wiring board, and other members are connected. It is good also as a structure which makes easy the electrical connection of this, and improves secondary utilization, or the structure which exposes a member with high heat conductivity outside and improves heat dissipation. Further, an external connection portion can be provided on the upper surface side of the wiring board 9 on which the light emitting element is mounted, and the rear surface side, preferably substantially the entire surface, of the wiring board 9 can be used for bonding the heat sink.

(Embodiment 4)
Further, a metal member capable of reflecting light may be provided between the first sealing member 26a and the second sealing member 26b. A light-emitting device 600 of this embodiment is referred to as Embodiment 4, FIG. 7A shows a schematic cross-sectional view, and FIG. 7B shows a plan view from the light observation direction. In the light emitting device 600 according to the fourth embodiment, the metal member 34 having a high reflectance is provided between the first sealing member 26a and the second sealing member 26b. This is different from Form 3. Accordingly, the same structures in other members are denoted by the same reference numerals, and detailed description thereof is omitted.

  With the light emitting device 600 of FIG. 7, the path of the emitted light diffused laterally from the light emitting element 10 can be effectively corrected toward the light emitting surface 15a by both the first sealing member 26a and the metal member 34. . Further, it is possible to prevent light loss by firmly blocking the progress of the light toward the second sealing member 26b, that is, avoiding the leakage of light. That is, the metal member 34 serves as a light reflecting layer, and the output of the entire light emitting device 600 can be relatively improved. As a result, the burden of the reflective ability in the first sealing member 26b can be reduced. Specifically, the thickness of the first sealing member 26a and the concentration of the light-reflecting material 2 contained can be reduced to reduce the cost. . At the same time, the first sealing member 26a and the first sealing member 26b contain materials having different optical characteristics from each other, and may be made of different types of resins as base materials. It can also function as a barrier layer that prevents defective effects and poor adhesion due to diffusion and mixing of constituent materials between both members.

  Therefore, the metal member 34 preferably has a high reflectance. In addition, the metal member 34 is made of a material having excellent adhesion to the first sealing member 26a and the second sealing member 26b. This is because the first sealing member 26a and the second sealing member 26b that are joined to each other by the metal member 34 can be firmly fixed and integrated. As the metal member 34, Al, Pt, Ag, Rh, Ir, Ti, or the like can be used.

(Example 1, Comparative Examples 1 to 3)
With respect to the light emitting device in the embodiment, the following comparative examples and examples will be given in order to confirm the characteristics relating to the luminous flux. Example 1, Comparative Example 1, and Comparative Example 2 differ only in the constituent members of the covering member that seals the LED chip, and the other structures are the same. Specifically, in Comparative Example 1, the sealing member is only the first sealing member 26a, which is a silicone resin containing TiO 2 fine particles. On the other hand, in Comparative Example 2, the sealing member is only the second sealing member 26b, which is a silicone resin containing carbon black and silica (JCR6146 manufactured by Toray Dow Corning). Moreover, Example 1 employs both the first sealing member 26a and the second sealing member 26b used in the comparative example.

In more detail, the light emitting devices of Comparative Examples 1 and 2 and Example 1 are mounted with one light transmitting member 15 and two approximately square blue LED chips of about 1 mm × 1 mm as shown in FIG. . The light transmitting member 15 is a phosphor plate (hereinafter referred to as a YAG plate) obtained by slicing a YAG / Al 2 O 3 sintered body having a YAG concentration of 20% into a size of about 1.1 mm × 2.2 mm and a thickness of about 120 μm. Called). The YAG plate is fixed on the LED chip so as to contain the two LED chips, and the YAG plate and a part of the LED chip are sealed with the respective covering members 26. In Comparative Example 3, the light transmitting member 15 and the sealing member 26 are not provided, and the two mounted blue LED chips are exposed. The luminous fluxes in the light emitting devices of Comparative Examples 1 to 3 and Example 1 are shown in FIG. In FIG. 8, the luminous flux of Example 1 is represented by e1, and similarly, the luminous fluxes of Comparative Examples 1 to 3 are represented by c1, c2, and c3.

  From FIG. 8, the luminous flux of Comparative Example 1 is the highest, and if this is 100%, the luminous flux of Comparative Example 2 is reduced by 65%. In other words, 65% of the light component is diffused toward the side surface of the light emitting element and absorbed by the second sealing member 26b, and the remaining light component of only 35% is recognized as traveling to the YAG plate side. The On the other hand, when the LED chip is sealed with both the light emitting device of Example 1, that is, the first sealing member 26a and the second sealing member 26b, the second sealing member 26b having high light absorption. However, the decrease in luminous flux is suppressed to 5%, and it can be seen that the high luminance is substantially maintained.

  FIG. 9 shows a cross section of luminance in the longitudinal direction of the YAG plate (in the direction crossing the two LED chips) through the center of the YAG plate in the light emitting devices of Comparative Example 1 and Example 1. In addition, in order to confirm the contrast of the light at the terminal portion of the light emitting surface, in each example, the peak value is normalized as 1, and the low luminance region is shown enlarged. In FIG. 9, the luminance of Example 1 is represented as e1, and the luminance of Comparative Example 1 is represented as c1. From FIG. 9, it can be seen that in the light emitting device of Example 1, the rise in brightness is sharper than that of the light emitting device of Comparative Example 1, and light emission with high edged contrast is obtained. Further, in the vicinity of the light emitting surface, the luminance of the light emitting device of Example 1 is lower than that of the light emitting device of Comparative Example 1, and it is apparent that stray light is reduced by absorption.

  Thus, when the light emitting element 10 is encapsulated only by the high-absorbency second sealing member 26a (black resin), the light-emitting element 10 is encapsulated only by the highly reflective first sealing member 26a (white resin). The luminous flux is reduced by 65% or more as compared with the case of being wrapped. However, if the first sealing member 26a and the second sealing member 26b are combined in a specific arrangement condition, light emission is possible. Even if the region is limited, substantially the same luminous flux is maintained, and light emission with reduced luminance unevenness and color unevenness can be realized. Also, the contrast of light is improved. This is not only due to the light blocking effect by the sealing member, but also due to the synergistic effect that the plate-like light transmitting member itself suppresses the uneven distribution of the wavelength conversion amount and can effectively avoid the occurrence of luminance unevenness and color unevenness. In addition, the manufacturing method in which the sealing member 26 is formed after the light transmitting member 15 is mounted is independent of the capacity of the light transmitting member 15 and can maintain the adhesion between the side surface and the sealing member 26. It is possible to improve the sealing environment of the light emitting element and to obtain a light emitting device with excellent life characteristics. In addition, in an illuminating device including the above-described light emitting device as a light source and including an optical system capable of adjusting a light distribution region of light emitted from the light source, contrast in the light emitting portion is improved and high luminance light distribution can be obtained. it can.

  The light emitting device and the manufacturing method thereof of the present invention can be suitably used for illumination light sources, LED displays, backlight light sources, traffic lights, illumination switches, various sensors, various indicators, and the like.

1A is a schematic cross-sectional view of the light-emitting device 100 according to Embodiment 1, and FIG. 1B is a plan view of the light-emitting device 100 from the light observation direction. FIG. 5 is a schematic cross-sectional view showing another form of the light emitting device according to Embodiment 1. 2 is a schematic cross-sectional view of the light-emitting element according to Embodiment 1. FIG. 6 is a schematic diagram showing a method for manufacturing the light emitting device according to Embodiment 1. FIG. 5A is a schematic cross-sectional view of the light-emitting device 300 according to Embodiment 2, and FIG. 5B is a plan view of the light-emitting device 300 from the light observation direction. 6A is a schematic cross-sectional view of the light-emitting device 400 according to Embodiment 3, and FIG. 6B is a plan view of the light-emitting device 400 from the light observation direction. 7A is a schematic cross-sectional view of the light-emitting device 600 according to Embodiment 4, and FIG. 7B is a plan view of the light-emitting device 600 from the light observation direction. 6 is a graph showing light beams according to Example 1 and Comparative Examples 1 to 3. 6 is a graph showing cross sections of respective luminances according to Example 1 and Comparative Example 1. It is sectional drawing which shows the conventional light-emitting device.

Explanation of symbols

2 ... Light reflective material 3A ... 1st electrode (n-type pad electrode)
3B ... Second electrode (p-type pad electrode)
5 ... Growth substrate (sapphire substrate)
6: First nitride semiconductor layer (n-type semiconductor layer)
7: Second nitride semiconductor layer (p-type semiconductor layer)
8 ... Light emitting layer (active layer)
9 ... Wiring board (submount)
10 ... Light emitting element (LED chip)
DESCRIPTION OF SYMBOLS 11 ... Semiconductor structure 12 ... Wavelength conversion material 13 ... Translucent conductive layer (ITO)
14 ... Protective film 15 ... Light transmitting member 15a ... Light emitting surface (window)
15b ... Light receiving surface 15c ... Side 17 ... Adhesive (silicone resin)
24 ... Conductive member 25 ... Frame 26 ... Cover member (sealing member, resin)
26a: first sealing member (first covering member)
26b ... second sealing member (second covering member)
27 ... End face of light emitting device 28 ... End face of wiring board 29 ... Light absorbing material 31 ... Interface 32 ... Recess 33 ... End face 34 ... Metal member 36b ... Second sealing member 100, 200, 300, 400 , 600 ... Light emitting device 500 ... Light emitting device 501 ... Light emitting element 502 ... Translucent material 503 ... Recess 504 ... P-type electrode 505 ... Phosphor 506 ... N-type electrode 507 ... Wavelength conversion member 508 ... Substrate

Claims (9)

  1. A light emitting element;
    A light-transmitting member having a light-emitting surface and a side surface continuous from the light-emitting surface, into which light emitted from the light-emitting element is incident;
    A light-reflective first covering member that covers a side surface of the light-transmitting member and surrounds the light-emitting element;
    A second covering member that covers the first covering member, constitutes a light emitting surface side exposed surface together with the light emitting surface, and has a larger absorption coefficient than the first covering member for visible light;
    A light emitting device comprising:
  2.   The light emitting device according to claim 1, wherein the light emitted from the light emitting surface to the outside is white light, and the second covering member is a black body.
  3. The first covering member is thicker on the side of the light emitting element than on the side of the light transmitting member,
    3. The light emitting device according to claim 1, wherein the second covering member is thicker on a side of the light transmission member than on a side of the light emitting element.
  4. The light emitting device includes a frame that surrounds the light emitting element and the light transmitting member,
    At least the first covering member is filled in the frame;
    The said 2nd coating | coated member coat | covers the said 1st coating | coated member and a frame, and comprises the exposure surface of this light emission surface side with the said light emission surface, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. The light emitting device according to item.
  5.   5. The light emitting device according to claim 1, wherein the second covering member is bonded to the first covering member. 6.
  6.   5. The light emitting device according to claim 1, wherein a metal member is interposed between the first covering member and the second covering member.
  7. The first and second covering members are resin molded bodies,
    The first covering member is based on a silicone resin containing a light reflective material,
    The light emitting device according to any one of claims 1 to 6, wherein the second covering member is made of an epoxy resin or a silicone resin colored with a pigment as a base material.
  8. The light transmissive member contains a phosphor capable of wavelength-converting at least a part of the light emitted from the light emitting element,
    The light emitting device according to claim 1, wherein the second covering member has higher thermal conductivity than the first covering member.
  9. A light emitting element;
    A light-transmitting member having a light-emitting surface and a side surface continuous from the light-emitting surface, and having a light-transmitting member on which light emitted from the light-emitting element is incident,
    Mounting the light emitting element on a wiring board;
    Disposing the light transmissive member above the light emitting element;
    Forming a light-reflective first covering member that covers a side surface of the light transmitting member and surrounds the light emitting element;
    The first covering member is covered to form a light emitting surface-side exposed surface together with the light emitting surface, and a second covering member having a larger absorption coefficient than the first covering member for visible light is formed. Process,
    A method for manufacturing a light-emitting device, comprising:
JP2008335579A 2008-12-27 2008-12-27 Light emitting device and manufacturing method thereof Active JP5521325B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008335579A JP5521325B2 (en) 2008-12-27 2008-12-27 Light emitting device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008335579A JP5521325B2 (en) 2008-12-27 2008-12-27 Light emitting device and manufacturing method thereof

Publications (2)

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