JP7343763B2 - Light emitting device and its manufacturing method - Google Patents

Description

The present invention relates to a light emitting device and a method for manufacturing the same.

In recent years, high-output light-emitting devices configured using light-emitting elements such as LEDs have come to be used as light sources for vehicle-mounted applications and the like. For example, Patent Document 1 discloses a high-output light emitting device used as an in-vehicle light source in which a heat dissipation layer is formed to cover the peripheral edge of the light emitting surface of a light emitting element to enhance heat dissipation effect. has been done.

Japanese Patent Application Publication No. 2014-127679

Embodiments of the present invention aim to provide a light emitting device that can increase the difference in brightness between the inside and outside of a light exit surface. Furthermore, an object of the embodiments of the present invention is to provide a manufacturing method that can easily manufacture such a light emitting device.

A light emitting device according to an embodiment of the present invention includes:
A substrate and
a light emitting element provided on the substrate;
a translucent member provided to face the light emitting surface of the light emitting element;
a first light reflective member provided on a side surface of the transparent member;
a light-shielding frame provided around the light-transmitting member and in contact with the first light-reflecting member;
Equipped with
The translucent member has a flange on the side surface, and the thickness of the flange is gradually different.

Further, a method for manufacturing a light emitting device according to an embodiment of the present invention includes:
A mounting process of mounting a light emitting element on a substrate,
a light-shielding frame mounting step of mounting a light-shielding frame having an opening on a sheet;
a light-reflective resin coating step of applying a light-reflective resin on the light-shielding frame;
A plate-shaped light-transmitting member having a flange on a side surface is arranged such that the upper surface of the light-transmitting member faces the sheet at a position where a space is formed between the light-transmitting member and the opening. The flange is brought into contact with the applied light-reflective resin and then pressed, and the light-reflective resin flows into the space to form a first light-reflective member, and the light-shielding frame and the light-transmitting a light guide support member forming step of producing a light guide support member in which a flexible member is supported by the first light reflective member;
a light guide support member bonding step of fixing the light guide support member on the light emitting element by bonding the upper surface of the mounted light emitting element and the lower surface of the light transmitting member;
including;
The thickness of the flange portion of the light-transmitting member gradually differs.

The light emitting device according to one embodiment of the present invention configured as described above can increase the difference in brightness between the inside and outside of the light exit surface. Moreover, according to the manufacturing method of one embodiment of the present invention, such a light emitting device can be easily manufactured.

FIG. 1 is an example of a plan view of a light emitting device according to an embodiment. FIG. 2(A) is an example of a cross-sectional view of the light-emitting device according to the embodiment taken along III-III shown in FIG. 1, and FIG. 2(B) is a diagram of the light-emitting device according to the embodiment. 1 is an example of a cross-sectional view taken along IV-IV shown in FIG. FIG. 3 shows a schematic perspective view of a translucent member (first embodiment). FIG. 4 shows a plan view and a side view of the translucent member shown in FIG. 3. FIGS. 5A and 5B are schematic cross-sectional views showing the mounting process. FIGS. 6A to 6E are schematic cross-sectional views showing a light shielding frame mounting step, a light reflective resin coating step, and a light guiding support member forming step. FIGS. 7A and 7B are schematic cross-sectional views showing the light guiding support member bonding step and the second light reflective member forming step. FIG. 8 shows a schematic perspective view of a translucent member (second embodiment). 9 shows a plan view and a side view of the translucent member shown in FIG. 8. FIG. 10 is a schematic diagram for explaining void movement. FIGS. 11(a) to 11(d) are schematic diagrams showing changes over time to explain void suppression in the light guide support member forming process.

In the method for manufacturing a light emitting device according to an embodiment of the present invention, first, a substrate on which a light emitting element is mounted, and a light guiding support member in which a light shielding frame and a light transmitting member are supported by a first light reflecting member are prepared. do.
In preparing the light guiding support member, a light-shielding frame having an opening is placed on a sheet, and a light-transmitting member is placed inside the opening so that a space is provided between the light-transmitting member and the opening of the light-shielding frame. Place. When placing the light-transmitting member, its flange exerts a pressing effect on the light-reflecting resin provided in the light-shielding frame, and light enters the space between the light-transmitting member and the opening of the light-shielding frame. Inject reflective resin.
The light guiding support member prepared in this manner is fixed onto the light emitting element mounted on the substrate, and then forms a second light reflective member surrounding the light emitting element.
With such a method, when manufacturing a plurality of light emitting devices, a substrate including a plurality of unit regions on which light emitting elements are mounted is prepared, and a light-shielding frame and a light-transmitting member are placed in each unit region of the substrate. Since the light guide support members supported by the light reflective members can be placed, it is possible to manufacture the light emitting device more efficiently and easily.
In the light-emitting device obtained by such a method, the first light-reflecting member is interposed between the light-shielding frame and the first surface of the light-transmitting member, which is the light-emitting surface of the light-emitting device, in plan view. The light-shielding frame, which is a member that increases the brightness difference between the inside and outside of the light emitting surface, has the property of absorbing light, so if the light-transmitting member and the light-shielding frame come into direct contact, the light from the light emitting device will be emitted. There is a risk of causing a decrease in efficiency. Therefore, in the light emitting device of this embodiment, such a decrease in light extraction efficiency is suppressed by "the first light reflective member interposed between the light transmitting member and the light shielding frame". Thereby, a light emitting device can be obtained that has a large difference in brightness between the inside and outside of the light emitting surface and has suitable optical characteristics in which a decrease in light extraction efficiency is suppressed.
Further, in the manufacturing method of the embodiment of the present invention, a light-transmitting member having a flange having a gradually different thickness is used, and by using such a light-transmitting member, the light-transmitting member and the light-shielding frame can be It is possible to eliminate or suppress the presence of voids (bubbles) in the region of the first light reflective member between the two.

Hereinafter, a manufacturing method according to an embodiment of the present invention and a light-emitting device obtained by the manufacturing method (hereinafter also referred to as a "light-emitting device of an embodiment") will be described with reference to the drawings. However, the embodiments described below are for embodying the technical idea of the present invention, and are not intended to limit the present invention. The drawings referred to in the following description schematically show the embodiments of the present invention, so the scale, spacing, positional relationships, etc. of each member may be exaggerated, or illustrations of some members may be omitted. There may be cases where

<<Light-emitting device of embodiment>>
The light emitting device of the embodiment includes at least a light emitting element, a translucent member, and a light shielding frame. As shown in FIGS. 1, 2(A), and 2(B), the light emitting device includes a substrate 10, a light emitting element 1 provided on the substrate 10, and a light emitting element 1 provided opposite to the light emitting surface of the light emitting element 1. a first light-reflecting member 9a provided on the side surface of the light-transmitting member 3; and a first light-reflecting member 9a provided around the light-transmitting member 3 in contact with the first light-reflecting member 9a. A light shielding frame 5 is provided.

More specifically, the light emitting device includes a substrate 10, a light emitting element 1 provided on the substrate 10, and a plate-shaped translucent member provided such that a lower surface 3b faces the light emitting surface of the light emitting element 1. 3, and further exposes the upper surface 3a of the light-transmitting member 3 constituting the light emitting surface of the light-emitting device, and connects the light-shielding frame 5 and at least a part of the side surface of the light-transmitting member 3. One light reflective member 9a is provided, and a second light reflective member 9b is provided between the first light reflective member 9a and the substrate 10 so as to cover the side surface of the light emitting element 1. Hereinafter, the first light reflective member 9a and the second light reflective member 9b may be collectively referred to as the "light reflective member 9."

In the light emitting device of the embodiment, the light-transmitting member 3 is positioned in the opening 5a of the light-shielding frame 5. Specifically, the light-shielding frame 5 is provided through the first light-reflecting member 9a around the light-transmitting member 3 such that the upper surface 3a of the light-transmitting member 3 is located in the opening 5a of the light-shielding frame 5. There is. As illustrated, the upper surface 3a of the light-transmitting member 3 is exposed from the first light-reflecting member 9a and the light-shielding frame 5. Further, the upper surface 3a of the light-transmitting member 3 may be located at substantially the same height as the upper surface of the light-shielding frame 5 (that is, they may be flush with each other).

In the light emitting device of the embodiment, when viewed from above (that is, from the light emitting surface side of the light emitting device), the inner periphery of the opening 5a is the upper surface 3a of the translucent member 3 that constitutes the light emitting surface of the light emitting device. The first light-reflecting member 9a is located apart from the outer periphery of the light-shielding frame 5 and is exposed between the inner periphery of the opening 5a of the light-shielding frame 5 and the outer periphery of the upper surface 3a of the light-transmitting member 3. In other words, it can be said that the frame portion of the light-shielding frame 5 and the upper surface 3a of the light-transmitting member 3 are separated from each other via the first light-reflecting member 9a. In this way, the light-transmitting member 3 and the light-blocking frame 5 are separated from each other on the upper surface of the light-emitting device by interposing the surface of the first light-reflecting member 9a, and the side surface of the light-transmitting member 3 and the light-blocking frame 5 are separated from each other by interposing the surface of the first light-reflecting member 9a. and are separated by interposing the first light reflective member 9a.

The light emitting device of the embodiment configured in this manner can increase the difference in brightness between the light emitting surface and the region surrounding the light emitting surface, and can efficiently extract the light emitted by the light emitting element.
In the light emitting device of the embodiment, the distance between the inner periphery of the opening 5a and the outer periphery of the upper surface 3a is determined to increase the brightness difference between the inside and outside of the upper surface 3a of the light exit surface and to efficiently transmit the light emitted by the light emitting element. In order to achieve both removal and extraction, the thickness may be 5 μm or more and 150 μm or less, for example, 40 μm or more and 60 μm or less.

Here, in the light emitting device of the embodiment, the light-transmitting member includes a flange on the side surface, and the thickness of the flange gradually differs. That is, the translucent member has a flange extending outward, and the flange has a thickness that gradually varies.

3 and 4 show an example of the translucent member 3 used in the embodiment. The translucent member 3 is a member that transmits the light emitted from the light emitting element 1 and emits it to the outside. The light-transmitting member 3 provided in the light-emitting device according to the embodiment has a flange portion 30 . As shown in the figure, the collar portion 30 has an extended form that projects outward from the side surface of the translucent member 3.

In the light emitting device of the embodiment, the flange portion 30 of the translucent member 3 has a shape in which the thickness thereof gradually differs. That is, the flange portion 30 has a portion whose thickness is not constant and gradually changes. The flange portion 30 having a gradually different thickness contributes to suppressing voids remaining during manufacturing of the light emitting device. Specifically, the translucent member 3 including the flange portions 30 having gradually different thicknesses has the effect of eliminating or reducing residual voids when forming the light guiding support member. In particular, since the light-transmitting member 3 includes a flange having a gradually different thickness, no voids (bubbles) remain in the region of the first light-reflecting member 9a between the light-transmitting member 3 and the light-shielding frame 5. Alternatively, a light-emitting device with suppressed voids can be obtained (details of suppressing the remaining voids will be described later in “Method for manufacturing a light-emitting device according to an embodiment”). If such voids remain, there is a risk that "suppression of reduction in light extraction efficiency" brought about by the first light-reflecting member interposed between the light-transmitting member and the light-shielding frame may be reduced. Further, the remaining voids may reduce the bonding strength between the constituent elements of the light emitting device. More specifically, voids in the region of the first light reflective member 9a between the light transmitting member 3 and the light shielding frame 5 are caused by the bonding strength between the first light reflective member 9a and the light transmitting member 3 and /Or this leads to a decrease in the bonding strength between the first light reflective member 9a and the light shielding frame 5. The light emitting device of the embodiment has as a constituent element a translucent member 3 having a flange portion 30 with gradually different thicknesses, and there is no possibility that such light extraction efficiency and/or bonding strength may be adversely affected. Some residual voids have been suppressed.

The thickness of the flange portion 30 of the translucent member 3 may gradually change toward the outside. In particular, in the light-transmitting member 3, it is preferable that the thickness of the flange portion becomes gradually smaller toward the periphery of the flange portion 30. As shown in FIG. 3, the flange 30 of the light-transmitting member is formed so that the thickness of the flange 30 becomes gradually smaller toward the periphery. This is related to the fact that voids remaining in the light emitting device are suppressed. Specifically, when the light-reflecting resin flows into the space between the light-transmitting member and the opening of the light-shielding frame in the light-guiding support member forming process, the thickness gradually decreases toward the periphery of the flange 30. The flange has a function of making it easier to push out the voids at the time of the inflow to the outside, and as a result, a light emitting device in which the remaining voids are further suppressed is provided.

In the light emitting device of the embodiment, the translucent member 3 has a plate shape as a whole. As shown in FIGS. 3 and 4, the transparent member 3 has a flat plate shape. In the specification, "plate-like" means, in a broad sense, that the overall appearance is flat, and in a narrow sense, it refers to the width dimension (one width dimension that is orthogonal to each other) rather than the thickness dimension. and/or the other width dimension) is considerably large. Considerable means, for example, that one width dimension and/or the other width dimension perpendicular to each other on the main surface (i.e., upper surface or lower surface) of the translucent member is twice or more the thickness dimension of the translucent member (e.g. 5 times or more). The conditions are not limited to these conditions, and include actual shapes that can be understood by those skilled in the art as plate-like. In addition, the term "plate-like" can be interpreted flexibly, and shapes in which the corners of the translucent member are rounded, chamfered, chamfered, and/or rounded are also considered plate-like. included in the concept of

In the light emitting device of the embodiment, such a plate-shaped light-transmitting member is provided with a flange on the side surface, and a gradient portion ( That is, a portion having a sloped surface) is provided.

The translucent member may have a rectangular shape in plan view. More specifically, the upper surface of the translucent member may have a rectangular shape in plan view. In other words, the translucent member may have a rectangular shape when viewed from above. The term "quadrilateral" as used herein means a substantially rectangular shape, and is therefore broadly interpreted to include squares, rectangles, parallelograms, trapezoids, and the like. For example, when a plurality of light-emitting elements 1 are provided for one light-transmitting member, the light-transmitting member 3 may have a rectangular shape and size that covers all of the plurality of light-emitting elements 1.

When the upper surface of the translucent member has a quadrangular shape, the collar portions may be provided in pairs on opposite sides of the quadrangular shape. In other words, the flange portion may be provided on a pair of opposing sides of the quadrangle. As shown in FIG. 4, the translucent member 3 may have, for example, an upper surface 3a and a lower surface 3b having a rectangular shape in plan view. When the upper and lower surfaces of the translucent member have a rectangular shape in plan view, the flanges 30 may be provided in pairs on opposing long sides of such a rectangle.

Hereinafter, the overall configuration and each component of the light emitting device of the embodiment will be described in detail.

In the light emitting device of the embodiment, the plate-shaped transparent member 3 has an upper surface and a lower surface opposite to the upper surface. The "upper surface" and "lower surface" herein are based on the directions in the light emitting device (for example, the light emitting device shown in FIGS. 2(A) and 2(B)). For convenience of explanation, hereinafter, the "upper surface" will also be referred to as the "first surface", and the "lower surface" will also be referred to as the "second surface".

In plan view, the area of the second surface 3b of the translucent member 3 is larger than the area of the first surface 3a of the translucent member 3 (that is, substantially the light emitting surface of the light emitting device).
In the light emitting device of the embodiment, the upper surface and the lower surface opposite to the upper surface of the light-transmitting member 3 are different in size from each other due to the flange 30 (see FIGS. 2(B) and 3). .
By making the area of the first surface 3a of the translucent member 3 smaller than the second surface 3b, the emitted light from the light emitting element 1 that enters from the second surface 3b of the translucent member 3 is spread over a smaller area. can be released from the first surface 3a (see FIG. 2(B)). That is, by passing through the light-transmitting member 3, the area of the light emitting surface is narrowed down, making it possible to illuminate a farther distance with high brightness. A light emitting device with high front brightness is particularly suitable for in-vehicle lighting such as headlights. Regarding in-vehicle lighting, there are various regulations regarding the color of the lights. For example, the color of headlights must be white or pale yellow, and all of them are stipulated to be the same color. ing.

Further, at least a portion of the outer periphery of the second surface 3b of the light-transmitting member 3 is preferably located outside the inner periphery of the opening 5a of the light-shielding frame 5 when viewed from above. In the light emitting device of the embodiment shown in FIG. 1, a portion of the outer periphery of the second surface 3b (particularly at least a portion of the outline of the flange portion 30 of the translucent member 3) is an opening when viewed from above. It is located outside the inner circumference of 5a. When the outer periphery of the second surface 3b of the light-transmitting member 3 has a rectangular shape, for example, at least one side of the outer periphery, for example, two opposing sides, preferably two opposing long sides, correspond to the inner periphery of the opening 5a of the light-shielding frame 5. It is preferable to configure the structure so that it is located on the outer side.

Thus, in a preferred embodiment, part or all of the outer periphery of the second surface 3b of the translucent member 3 is located outside the inner periphery of the opening 5a when viewed from above, The outer periphery of the first surface 3a of the light-transmitting member 3 is located inside the inner periphery of the opening 5a of the light-shielding frame 5 when viewed in plan.
That is, in the light-emitting device of this embodiment, when the light-emitting device is viewed from above (that is, from the light-emitting surface side of the light-emitting device), there is no space inside the opening 5a of the light-shielding frame 5 of the light-transmitting member 3. The first surface 3a and the upper surface of the first light reflective member 9a surrounding the outer periphery of the first surface 3a can be visually recognized. At this time, the light-transmitting member 3 is located at least in a portion below the first light-reflecting member in the area inside the opening 5a. As a result, even if cracks and/or peeling occur in the first light reflective member 9a, the light leaking from the opening 5a will not pass through the portion of the transparent member 3 located inside the opening 5a. It is likely that only the light is emitted from the optical member 3. From the viewpoint of enhancing such effects, when the outer periphery of the second surface 3b of the translucent member 3 is a rectangle having long sides and short sides, at least the long side of the outer periphery of the second surface 3b as described above. It is preferable that the light shielding frame 5 be located outside the inner periphery of the opening 5a of the light shielding frame 5.
Furthermore, since leakage light from the light reflective member 9 is blocked in the area covered by the light shielding frame 5, cracks and/or peeling may occur in the second light reflective member 9b located on the side of the light emitting element 1, for example. Even if the light emitted from the side surface of the light emitting element 1 passes through cracks and/or peeled parts, leakage to the light emitting surface side can be more effectively suppressed.
For example, when a light-emitting device that emits white light by mixing blue light emitted from the light-emitting element 1 and yellow light, which is a part of the blue light that has been wavelength-converted, is used as vehicle lighting, the light emitting surface If the blue light emitted from the light emitting element 1 leaks in addition to the white light emitted from the light emitting element 1, a chromaticity difference will occur within the opening 5a, and there is a possibility that luminous color unevenness will occur within the irradiation area. Furthermore, if blue leakage light is visually recognized, the above-mentioned regulations for vehicle-mounted lighting are not met, and there is a possibility that the safety of the vehicle may be impaired.

In one form of the light emitting device of the embodiment, at least a part of the outer periphery of the first surface 3a of the light-transmitting member 3 is located inside the outer periphery of the light emitting element 1 when viewed from above (see FIG. 1). . For example, when the outer periphery of the first surface 3 a of the light-transmitting member 3 has a rectangular shape, the long sides of the rectangle may be located inside the long sides of the outer periphery of the light emitting element 1 . Here, as shown in FIG. 1, when referring to the outer periphery of the light emitting element 1 in a light emitting device including a plurality of light emitting elements 1, the outer periphery is defined by viewing the plurality of light emitting elements 1 as one, and The outer periphery of each light emitting element facing each other is not included.
In this way, the light emitted from the plurality of light emitting elements 1 can be condensed and emitted from the first surface 3a of the translucent member 3. Therefore, the light emitted by the light emitting element 1 can be emitted from the first surface 3a of the emitting surface in a state where the luminous flux density is higher.

(substrate)
The substrate 10 is a member that supports the light emitting element 1 and the like, and has wiring electrically connected to the external electrode of the light emitting element 1 on at least its surface. The main material of the substrate 10 is preferably an insulating material through which light from the light emitting element 1 and light from the outside do not easily pass through. Specifically, for example, at least one resin selected from ceramics such as alumina and/or aluminum nitride, phenol resin, epoxy resin, silicone resin, polyimide resin, BT resin, polyphthalamide, etc. can be mentioned. In addition, when using a resin, at least one type of inorganic filler selected from glass fiber, silicon oxide, titanium oxide, alumina, etc. may be mixed with the resin, if necessary. Thereby, it is possible to improve the mechanical strength, reduce the coefficient of thermal expansion, and/or improve the light reflectance. Further, the substrate 10 may be a metal member with an insulating material formed on the surface. The wiring is formed in a predetermined pattern on the insulating material. The wiring material may be at least one selected from gold, silver, copper, titanium, palladium, nickel, and aluminum. The wiring can be formed by plating, vapor deposition, sputtering, or the like.

(Light emitting element)
As the light emitting element 1, it is preferable to use a light emitting diode. The light emitting element 1 can be selected to have an arbitrary wavelength. For example, as a blue or green light emitting element, at least one selected from nitride semiconductors (In _x Al _Y Ga _1-X-Y N, 0≦X, 0≦Y, X+Y≦1), ZnSe, and GaP. can be used. Further, as the red light emitting element, GaAlAs and/or AlInGaP can be used. Furthermore, semiconductor light emitting elements made of materials other than these can also be used. The composition, emitted light color, size, and/or number of the light emitting elements used can be appropriately selected depending on the purpose. In the case of a light emitting device having a phosphor, a nitride semiconductor (In _X Al _Y Ga _1-X-Y N, 0≦X, 0≦Y, X+Y≦1) is preferably mentioned. Various emission wavelengths can be selected depending on the material of the semiconductor layer and/or its mixed crystallinity.

The light emitting element 1 used in the light emitting device of the embodiment has, for example, positive and negative electrodes on the same side. As shown in FIG. 2(A), the light emitting element 1 may be flip-chip mounted on the substrate 10 via the conductive bonding member 11. Although the conductive bonding member 11 connected to the positive and negative electrodes of the light emitting element 1 is illustrated in a simplified manner in FIG. provided for connection. Positive and negative electrodes of the light emitting element 1 are respectively connected to positive and negative wiring (not shown) provided on the substrate 10 via conductive bonding members 11 . Further, the light emitting element 1 is mounted on a substrate with the surface on which the electrodes are formed as the bottom surface, and the top surface opposite to the bottom surface is the main light emitting surface. As described above, such a light emitting element 1 is connected to a substrate using a conductive bonding member such as a bump and/or a conductive paste, so compared to a light emitting element connected with a metal wire or the like, The contact area between the electrode and the substrate can be increased, and connection resistance can be reduced.

The light emitting element 1 is, for example, a light emitting element in which a nitride semiconductor layer is laminated on a transparent support substrate, and the support substrate is on the upper surface side of the light emitting element 1 and serves as a main light emitting surface. Note that the support substrate may be removed, for example, by polishing and/or laser lift-off.

(Translucent member)
The translucent member 3 is a member that transmits the light emitted from the light emitting element 1 and emits it to the outside. As described above, the translucent member 3 includes a flange 30 on the side surface, and the thickness of the flange 30 gradually differs (see FIGS. 3 and 4).

The translucent member 3 may contain a light diffusing material or a phosphor capable of converting the wavelength of at least a portion of the incident light. The translucent member 3 can be formed of, for example, resin, glass, and/or inorganic material. Examples of the light-transmitting member containing a phosphor include a sintered body of a phosphor, a resin, a glass, a ceramic, or another inorganic material containing a phosphor. Alternatively, a layer containing a phosphor may be formed on the surface of a molded body of resin, glass, and/or ceramic. The total thickness of the transparent member 3 is, for example, about 100 to 300 μm.
The light-transmitting member 3 and the light-emitting element 1 may be joined, for example, via a light-guiding member 13, as shown in FIG. 2(A). Furthermore, direct bonding methods such as pressure bonding, sintering, surface activation bonding, atomic diffusion bonding, and/or hydroxyl group bonding may be used to bond the light-transmitting member 3 and the light emitting element 1 without using the light guide member 13. It's okay to be hit.

The translucent member 3 may contain a phosphor. As the phosphor that can be contained in the light-transmitting member 3, one that can be excited by the light emitted from the light emitting element 1 is used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet-based phosphors (YAG:Ce) activated with cerium, and lutetium-aluminum-garnet-based phosphors activated with cerium. (LAG:Ce), nitrogen-containing calcium aluminosilicate phosphor activated with europium and/or chromium (CaO-Al ₂ O ₃ -SiO ₂ :Eu), silicate phosphor activated with europium ((Sr, Nitride-based fluorescent materials such as Ba) ₂ SiO ₄ :Eu), β-sialon phosphor, CASN-based phosphor represented by CaAlSiN ₃ :Eu, and SCASN-based phosphor represented by (Sr,Ca)AlSiN ₃ :Eu. Examples include at least one selected from a KSF-based phosphor represented by K ₂ SiF ₆ :Mn, a sulfide-based phosphor, and a quantum dot phosphor. By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, a light-emitting device emitting light of a desired color (for example, a white light-emitting device) can be manufactured.

Although this is merely an example, the translucent member 3 may be a plate material called a so-called "YAG plate."

(shading frame)
The light shielding frame 5 is a member provided to lower the brightness of the upper surface of the light emitting device except for the light exit surface. In order to lower the brightness of the portion other than the light exit surface, it is necessary to block light leaking to the outside from areas other than the first surface 3a of the translucent member 3. Considering this function, the light-shielding frame 5 may include, for example, a member made of a material that reflects and/or absorbs light without transmitting it, or a film made of a material that reflects and/or absorbs light on its surface. Preferably, it is a member.
The material constituting the light-shielding frame 5 can be selected from resins (including fiber-reinforced resins), ceramics, glass, paper, metals, etc., and composite materials made of two or more of these materials. . Specifically, the light-shielding frame 5 may be formed from a material that has excellent light-shielding properties and is resistant to deterioration. For example, the light-shielding frame 5 may be configured of a metal frame made of metal or a frame provided with a metal film on the surface. Examples of the metal material include copper, iron, nickel, chromium, aluminum, gold, silver, titanium, and alloys thereof.
Furthermore, it is more preferable that the light shielding frame 5 has a function of not only suppressing light leakage from inside the light emitting device but also suppressing reflection of light from the outside. Examples of the function of suppressing reflection of light from the outside include having fine irregularities on the surface on the light exit surface side and using a material with high light absorption rate. The fine irregularities include, for example, an average arithmetic roughness Ra of 0.5 μm or more and 1.0 μm or less. Note that when the surface of the light-shielding frame has fine irregularities, the wettability of the surface of the light-shielding frame to liquid becomes high, and the uncured resin material easily wets and spreads on the surface of the light-shielding frame. For this reason, for example, it is preferable not to apply fine unevenness to the edge of the upper surface of the light-shielding frame. In addition, examples of materials with high light absorption include black nickel plating and/or black chromium plating.
The thickness of the light-shielding frame 5 (that is, the height from the bottom surface to the top surface of the light-shielding frame 5) is determined in consideration of lightness and/or resistance to deformation while maintaining strength when used as a light-emitting device. The thickness may be approximately 20 μm to 200 μm, but in consideration of the thickness of the transparent member 3, etc., it is preferably approximately 30 μm to 80 μm.

The light-shielding frame 5 may be provided so that its outer periphery coincides with the outer periphery of the light-emitting device in plan view, but it may also be provided such that the outer periphery of the light-shielding frame 5 is located inside the outer periphery of the light-emitting device. . As a result, in the dividing step of dividing the light emitting device into unit areas (in other words, each light emitting device), which will be described later, the light shielding frame 5 is not placed on the dividing line, so positional shift of the light shielding frame 5 at the time of division is suppressed. Ru.
Here, the light-shielding frame 5 is provided so that the outer periphery of the light-shielding frame 5 is located inside the outer periphery of the light-emitting device. This includes that a light shielding frame 5 is provided.
The width of the light shielding frame 5 in a plan view may be at least 130 μm or more in consideration of increasing the brightness difference between the inside and outside of the light exit surface of the first surface 3a. In particular, considering ease of handling in the manufacturing process, the thickness may be, for example, 500 μm or more.

(light reflective member)
The light reflective member 9 includes a first light reflective member 9a provided to connect the opening 5a of the light shielding frame 5 and a part of the side surface of the translucent member 3, and a first light reflective member 9a. A second light reflective member 9b may be provided between the light emitting element 1 and the substrate 10 so as to cover the side surface of the light emitting element 1.

The first light reflective member 9a and the second light reflective member 9b cover the side surface of the light emitting element 1 and the side surface of the transparent member 3, and emit light from the side surface of the light emitting element 1 and the side surface of the transparent member 3. The light is reflected and emitted from the upper surface 3a of the translucent member 3, which becomes the light emitting surface of the light emitting device. By providing the light reflective member that covers the side surface of the light emitting element 1 and the side surface of the translucent member 3 in this way, the light extraction efficiency can be increased. The light reflective member is made of, for example, a light reflective material with high light reflectance. Specifically, the light reflective member may be a light reflective material having a reflectance of 60% or more, for example 80% or 90% or more, for light from the light emitting element. The light reflective material is made of, for example, a resin containing a light reflective substance. As will be described in detail later, the first light reflective member 9a and the second light reflective member 9b are formed separately and may be formed from different light reflective materials, or may have the same light reflective properties. It may be formed from any material.

As the base resin constituting the light reflective member 9, resins such as silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, and hybrid resin containing at least one of these resins can be used. The resin base material contains a light-reflecting substance. Light reflective substances include titanium oxide, silicon oxide, zirconium oxide, magnesium oxide, yttrium oxide, yttria-stabilized zirconia, calcium carbonate, calcium hydroxide, calcium silicate, niobium oxide, zinc oxide, barium titanate, potassium titanate. , magnesium fluoride, alumina, aluminum nitride, boron nitride, mullite, and the like. For example, titanium oxide (TiO ₂ ) may be used. Further, as the light-reflecting substance, particles having a refractive index different from that of the base resin may be dispersed in the base resin. Since the amount of light reflected and the amount of light transmitted vary depending on the concentration and/or density of the light-reflecting substance, the concentration and density can be adjusted as appropriate depending on the shape and/or size of the light-emitting device. In addition to the light-reflecting substance, the light-reflecting member may contain other pigments and/or phosphors. In particular, when the light-transmitting member 3 contains a phosphor, the second light-reflecting member 9b contains the same phosphor as the phosphor contained in the light-transmitting member 3. It is possible to suppress leakage of emitted light from the light emitting element from being visually recognized from the side.

(Light guiding member)
In the light emitting device, the light transmitting member 3 and the light emitting element 1 may be joined via the light guide member 13. The light guide member 13 may cover part or all of the side surface of the light emitting element 1, as shown in FIG. 2(A). In a case where a part of the second surface 3b of the light-transmitting member 3 does not face the top surface of the light emitting element 1, which is the main light output surface, the light guiding member 13 does not face the top surface of the light emitting element. A part of the translucent member 3 may be covered. Note that the light guiding member 13 is also interposed between the light emitting element 1 and the transparent member 3, and joins them together. The light guiding member 13 configured as described above can efficiently guide the light emitted from the upper surface and side surfaces of the light emitting element 1 to the light transmitting member 3.

It is preferable to use a resin material for the light guide member 13 from the viewpoint of ease of handling and processing. As the resin material, a resin material such as a resin or a hybrid resin containing at least one selected from silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, acrylic resin, and fluororesin can be used. The light guide member 13 can be formed into the above-described shape by appropriately adjusting the viscosity of the resin material for forming it and/or the wettability of the resin material and the light emitting element 1.

(Other parts)
The light emitting device may optionally include other elements such as protection elements, electronic components, etc. These elements and electronic components are preferably embedded within the light reflective member.

<<Method for manufacturing light emitting device of embodiment>>
A method for manufacturing a light emitting device according to an embodiment includes a mounting step of mounting a light emitting element on a substrate, a light shielding frame mounting step of mounting a light shielding frame having an opening on a sheet, and a light reflecting resin on the light shielding frame. a light-reflective resin coating step of applying a light-reflecting resin; and a plate-shaped light-transmitting member having a flange on the side surface, and applying the light-transmitting member at a position where a space is formed between the light-transmitting member and the opening. The flange is brought into contact with the applied light-reflective resin so that the upper surface of the flexible member faces the sheet, and then pressed, and the light-reflective resin is flowed into the space to form a first light-reflective member. forming a light guide support member in which the light shielding frame and the light transmitting member are supported by the first light reflective member; The light guide support member bonding step of fixing the light guide support member on the light emitting element by bonding the light guide support member to the lower surface of the light transmitting member is included.

By the manufacturing method of this embodiment, for example, the light emitting device of the embodiment shown in FIG. 1 and FIGS. 2(A) and 2(B) can be obtained. Hereinafter, the manufacturing method of the embodiment will be described with reference to the drawings.

(Mounting process)
Here, a light emitting element is mounted on a substrate. That is, as shown in FIGS. 5(A) and 5(B), at least one light emitting element 1 is mounted on the main surface of the substrate 10. For example, the light emitting element 1 may be flip-chip mounted on the substrate 10. Specifically, for example, the light emitting element 1 having positive and negative electrodes on the lower surface of the same side is arranged such that the positive electrode faces the positive wiring provided on the substrate 10 and the negative electrode is provided on the substrate 10. The electrically conductive bonding members 11 are used to bond the wires to each other so as to face the negative wires. Note that in FIG. 5(B), as in FIG. 2(A), the conductive bonding members 11 connected to the positive and negative electrodes of the light emitting element 1 and the positive and negative wirings provided on the substrate 10 are not distinguished. It is simplified and drawn.

(Light-shielding frame mounting process)
Here, a light shielding frame having an opening is placed on the sheet. That is, as shown in FIG. 6(A), the light-shielding frame 5 in which the opening 5a is formed by the frame portion 5b is placed on the main surface of the sheet 4.

For the light-shielding frame, a light-shielding frame processed into a desired shape may be prepared in advance, and a plurality of light-shielding frames may be individually arranged on a sheet, or a plurality of light-shielding frames may be arranged in row and/or column directions for each unit area. A light-shielding frame connected to the light-shielding frame may be prepared and placed all at once on the sheet. As the sheet, a heat-resistant sheet with adhesive surface may be used. Examples of the base material of the sheet include polyimide.

(Light reflective resin coating process)
Here, a light-reflecting resin is applied on the light-shielding frame. That is, as shown in FIG. 6(B), a light reflective resin 9a' is applied to the frame portion 5b of the light shielding frame.
The coating amount of the light-reflective resin 9a' is such that the first light-reflective member 9a can be formed without any gap between the light-transmitting member 3 and the light-shielding frame 5 in the next light-guiding support member forming step. good. However, the light-reflecting resin 9a' does not adhere to the first surface 3a of the light-transmitting member 3 because it does not prevent the emission of light from the first surface 3a of the light-transmitting member 3, which is the light emitting surface of the light-emitting device. The coating amount and viscosity of the light reflective resin 9a' may be adjusted accordingly.
The light-reflecting resin 9a' can be applied onto the light-shielding frame 5 by, for example, using a nozzle of a resin discharging device and discharging it from the tip of the nozzle. For example, the light-reflecting resin 9a' may be applied in a frame shape along the opening of the light-shielding frame 5 so as to surround the opening, or may be applied in a linear or dotted manner along the opening.
As will be described later, when the light-transmitting member 3 comes into contact with the light-reflecting resin 9a' coated on the light-shielding frame 5, the uncured light-reflecting resin 9a' is exposed to the light-shielding frame 5 and the light-transmitting member. 3 and covers the inner surface of the opening 5a of the light-shielding frame 5 and the side surface of the light-transmitting member 3. The resin 9a' is filled.
The viscosity of the uncured light reflective resin 9a' may be, for example, 5 Pa·s or more and 15 Pa·s or less. Thereby, it is possible to ensure that the resin material flows into the space between the light-transmitting member 3 and the opening 5a, and it is also possible to suppress the resin material from wetting and spreading to the upper surface 3a of the light-transmitting member 3.

(Light guiding support member forming process)
Here, a light-guiding support member is manufactured in which the light-shielding frame 5 and the light-transmitting member 3 are supported by the first light-reflecting member 9a. Specifically, a light-transmitting member is used, and a light-reflecting resin placed on a light-shielding frame is flowed between the light-transmitting member and the opening of the light-shielding frame, and then hardened to reflect the first light. A light-guiding support member is obtained in which a light-shielding frame and a light-transmitting member are supported by a first light-reflecting member.
In the light guide support member forming step, as shown in FIGS. 6(C) to 6(E), a plate-shaped light-transmitting member 3 having a flange 30 on the side surface is used. The flange 30 of the translucent member 3 is exposed to light so that the second surface 3b of the translucent member 3 faces the sheet 4 at a position where a space is formed between the translucent member 3 and the opening 5a of the light shielding frame 5. After being brought into contact with the reflective resin 9a', it is pressed and the light reflective resin 9a' flows into the space 5a to form the first light reflective member 9a. Thereby, a light guiding support member 60 in which the light shielding frame 5 and the light transmitting member 3 are supported by the first light reflecting member 9a is obtained.

The light-transmitting member 3 used in the light-guiding support member forming step has a first surface 3a serving as a light-emitting surface of the light-emitting device and a second surface 3b on the opposite side, and the outer periphery of the first surface 3a is a light-shielding frame. It is preferable that the light-shielding frame 5 is a plate-shaped member including at least a portion smaller than the inner periphery of the opening 5 a of the light-shielding frame 5 and at least a part of the outer periphery of the second surface 3 b larger than the inner periphery of the opening 5 a of the light-shielding frame 5 .
As shown in FIGS. 6(C) and 6(D), when placing the translucent member 3 on the sheet 4, before the first surface 3a of the translucent member 3 contacts the sheet 4, Then, the flange portion 30 of the translucent member 3 comes into contact with the light reflective resin 9a'. Specifically, the light-transmitting member 3 is placed so that the first surface 3a of the light-transmitting member 3 faces the sheet 4 at a position where a space is formed between the light-transmitting member 3 and the opening 5a of the light-shielding frame 5. The flexible member 3 is brought into contact with the light reflective resin 9a' on the light shielding frame 5. As a result, the light-reflecting resin 9a' flows, and as shown in FIG. A light reflective resin 9a' is filled.
More specifically, the outer periphery of the second surface 3b of the translucent member 3 is positioned outside the inner periphery of the opening 5a of the light-shielding frame 5 (see FIG. 6(C)), and the translucent When the flange 30 of the member 3 is brought into contact with the light reflective resin 9a' coated on the light shielding frame 5 (see FIG. 6(D)), this contact point becomes a starting point and the light reflective resin 9a' becomes transparent. The light-reflecting resin 9a' can flow from the flange 30 to the side surface of the light-transmitting member 3 and fill the space between the side surface of the light-transmitting member 3 and the opening 5a of the light-shielding frame 5 (see FIG. 6(E)). When the opening 5a of the light-shielding frame 5 and the second surface 3b of the light-transmitting member 3 are both rectangular having long sides and short sides, the long side of the second surface 3b and the opening 5a are The translucent member 3 and the light shielding frame 5 may be arranged so that the distance between the long sides and the distance between the short sides of the second surface 3b and the short sides of the opening 5a are equal.

Note that a suction means such as a collet may be used to place the transparent member 3 on the sheet 4. For example, the light-transmitting member 3 may be placed on the sheet 4 while being picked up by a suction means such as a collet 40, and by subsequently pressing the light-transmitting member 3 with such suction means, the light-transmitting member 3 is The light reflective resin 9a' in contact with the flange 30 of the member 3 may be made to flow (see FIGS. 6(C) to 6(E)).

(Light guiding support member joining process)
Here, as shown in FIG. 7(A), by bonding the second surface 3b of the light-transmitting member 3 to the light-emitting surface (that is, the upper surface) of the mounted light-emitting element 1, a light guiding support is placed on the light-emitting element 1. The member 60 is fixed.
The light-transmitting member 3 of the light-guiding support member 60 obtained as described above is aligned with the light-emitting element 1, and the light-transmitting member 3 is connected to the light-emitting element 1 using the light-guiding member 13, for example. Join to the surface.
When obtaining the light emitting device of the embodiment shown in FIGS. 1, 2(A), and 2(B), the light guiding support member 60 is, for example,
(i) so that the outer periphery of the second surface 3b of the translucent member 3 is located outside the outer periphery of the light emitting element 1 when viewed from above;
(ii) so that at least one side of the outer periphery of the first surface 3a of the translucent member 3 is located inside the outer periphery of the light emitting element 1 when viewed from above;
Align.

When joining the light-transmitting member 3 of the light-guiding support member 60 and the light-emitting element 1, the light-transmitting member 3 whose second surface 3b is coated with the light-guiding member 13 in advance is placed on the light-emitting element 1. Alternatively, the light-transmitting member 3 of the light-guiding support member 60 may be placed on the light-emitting element 1 after the light-guiding member 13 is applied to the upper surface of the light-emitting element 1. The amount of coating of the light guide member 13, the load when placing the translucent member 3 on the light emitting element 1 and pressing it, and when using a resin material as the light guide member 13, the viscosity of the resin material at the time of coating, etc. may be appropriately set in consideration of the desired shape of the light guide member 13 after the light-transmitting member 3 of the light guide support member is bonded onto the light emitting element 1.

(Sheet removal process)
The sheet 4 may be removed in a sheet removal step after the light guiding support member bonding step or after the second light reflective member forming step.

(Second light reflective member forming step)
Here, a further light reflective member is formed, that is, a second light reflective member 9b is formed. Specifically, by filling the space between the substrate 10 and the light-shielding frame 5 with an uncured second light-reflecting resin 9b' that becomes the second light-reflecting member 9b, the substrate 10 and the light-shielding frame 5 are A second light reflective member 9b surrounding the light emitting element 1 and the transparent member 3 is formed between the two (see FIG. 7(B)). The second light reflective member 9b is configured as an integral member together with the first light reflective member 9a described above. Note that FIG. 7(B) is an example in which the sheet 4 is removed before the second light reflective member forming step.
For example, the light shielding frame 5 may be used which is one size smaller than the substrate 10 (that is, the outer edge is included in the substrate 10 in plan view), and the space between the substrate 10 and the light shielding frame 5 is measured from the outer circumferential side of the light shielding frame. The space is filled with second light reflective resin 9b'.
After filling the space between the substrate 10 and the light-shielding frame 5 with the second light-reflective resin 9b', the filled second light-reflective resin 9b' is cured. Thereby, the second light reflective member 9b is formed.

The light emitting device of the embodiment is manufactured as described above.

The above description has been made with reference to drawings showing a single light emitting device.
However, in the method for manufacturing a light-emitting device according to the embodiment, a plurality of light-emitting devices are manufactured at once using a substrate and a light-shielding frame that are divided into a plurality of unit regions corresponding to each light-emitting device, and then each light-emitting device is individually manufactured. It may be separated into two light emitting devices.
For example, a substrate including a plurality of (n×m) unit areas forming a plurality of rows (n rows) and a plurality of columns (m columns) may be used as the substrate and the light shielding frame.
Further, for example, as the light-shielding frame, a light-shielding frame including a plurality of (n×m) unit areas forming a plurality of rows (n rows) and a plurality of columns (m columns) corresponding to the substrate may be used. Alternatively, for example, a plurality of (n×m) light-shielding frames are used as the light-shielding frames so as to form a plurality of rows (n rows) and a plurality of columns (m columns) corresponding to the substrate, and each light-shielding frame is used as a unit area. good.

More specifically, a plurality of light emitting devices may be created as follows.
(1) In the light emitting element mounting step, one or more light emitting elements are mounted in each of the unit areas.
(2) In the light guide support member forming step, a light guide support member is formed in each of the unit areas.
(3) In the light guide support member bonding step, each light guide support member is bonded so as to collectively cover one or more light emitting elements mounted in the unit area.
(4) In the second light-reflective member forming step, the space between the substrate and the light-shielding frame in each unit region is filled with a second light-reflective resin.
Next, after the second light-reflective member forming step, in the dividing step, the light-reflective member and the substrate are divided into unit regions, thereby dividing the light-emitting device into individual pieces. The division can be performed, for example, by cutting using a blade or the like.
Considering this division into unit areas, it is preferable that the dividing position when dividing into unit areas is away from the outer periphery of the light-shielding frame. In other words, it is preferable that the light-shielding frame is one size smaller than the outer shape of the light-emitting device. In this case, for example, a plurality of light-shielding frames that are one size smaller than the outer shape of the light-emitting device may be used as the light-shielding frames.

According to the above method for manufacturing a light emitting device, since a plurality of light emitting devices are manufactured at once and then separated into individual light emitting devices, the light emitting device can be manufactured easily.

In the manufacturing method according to the embodiment of the present invention, a light-transmitting member having a flange portion having a gradually different thickness is used. In particular, in the manufacturing of light emitting devices, a plate-shaped light-transmitting member with a flange on the side surface is used in the light-guiding support member forming process. It has a sloped portion whose thickness gradually changes.

3 and 4 and FIGS. 8 and 9 exemplarily show the translucent member 3 used in the embodiment of the present invention. 3 and 4 show a translucent member 3 according to the first embodiment. On the other hand, FIGS. 8 and 9 show a translucent member 3 according to a second embodiment. As illustrated, in both embodiments, the translucent member 3 has a flange 30 extending outward, and the flange 30 has a thickness that gradually changes in a predetermined direction. It has a length changing portion 35.

The translucent member 3 has a thickness changing portion 35 in which the thickness of the flange portion gradually differs, but it can be manufactured by any conventional method. For example, the translucent member 3 having a flange having a gradually different thickness may be manufactured by cutting using a machining means such as a blade.

The thickness changing portion 35 of the flange may be a portion where the flange thickness changes linearly, as shown in FIGS. 3 and 4 and FIGS. 8 and 9. However, in the embodiment according to the present invention, the thickness changing portion is not necessarily limited to this, and the thickness changing portion may be a portion where the flange thickness changes in a curved or stepwise manner. In either case, the "effect of suppressing void remaining", which will be described in detail below, is achieved.

A translucent member including a flange portion with a gradually different thickness contributes to suppressing voids remaining in the light emitting device. More specifically, when forming the light-guiding support member, the light-transmitting member acts to reduce or eliminate voids remaining in the region of the first light-reflecting member between the light-transmitting member and the light-shielding frame.

The voids formed during the formation of the light guiding support member are air bubbles or the like that are generated when the light reflective resin is introduced into the space between the light transmitting member and the opening of the light shielding frame. When placing the light-transmitting member, the light-reflecting resin on the light-shielding frame is pressed with the collar of the light-transmitting member to reflect light in "the space between the light-transmitting member and the opening of the light-shielding frame." However, voids may occur during this process. This is because when placing the light-transmitting member, the flange of the light-transmitting member and the light-reflecting resin come into contact with each other at a "surface", and the space between the light-transmitting member and the opening of the light-shielding frame is suddenly filled. This is thought to be caused by the light-reflective resin flowing in. If the light-reflective resin is cured to form the first light-reflective member with such voids present, there is a risk that the voids may remain in the light-guiding support member. In particular, it is considered that voids (bubbles) are likely to remain in the region of the first light-reflecting member interposed between the light-transmitting member and the light-shielding frame in plan view.

Remaining voids in the light guiding support member are undesirable for the optical characteristics of the light emitting device. For example, the effect of "suppressing a decrease in light extraction efficiency" brought about by the first light-reflecting member interposed between the light-transmitting member and the light-shielding frame may be reduced by the voids. The light-shielding frame that increases the difference in brightness between the inside and outside of the light exit surface has the property of absorbing light. For this reason, if the light-transmitting member and the light-shielding frame come into direct contact, there is a risk that the light extraction efficiency of the light-emitting device will be reduced. Therefore, in the light emitting device of this embodiment, such a decrease in light extraction efficiency is suppressed by "the first light reflective member interposed between the light transmitting member and the light shielding frame". Therefore, if voids (bubbles) are present in the region of the first light reflective member, the effect of "suppressing a decrease in light extraction efficiency" in the light emitting device will be reduced. The manufacturing method according to the embodiment of the present invention can reduce or eliminate such voids remaining in the light guiding support member, and can manufacture a light emitting device exhibiting desired optical characteristics.

Further, the remaining voids in the light guiding support member may reduce the bonding strength between its constituent elements. In the light guiding support member, the first light reflective member connects the light transmitting member and the light shielding frame to each other through the space between the light transmitting member and the light shielding frame. If voids (bubbles) are present in such a region of the first light-reflective member, there is a possibility that such bonding may be deteriorated. In other words, when voids exist in the region of the first light reflective member, the bonding strength between the first light reflective member and the light-transmitting member and/or the bonding strength between the first light reflective member and the light-blocking frame decreases. There are concerns. Since the manufacturing method of the embodiment of the present invention can reduce or eliminate such voids remaining, the bonding strength of the components of the light guide support member can be maintained more suitably.

As shown in FIGS. 3 and 4, the flange portion 30 whose thickness gradually changes has a shape in which a gradient portion 35a is added as a thickness changing portion 35 to a base portion 35b having a constant thickness. Preferably. Therefore, since the flange portion 30 is thicker than the base portion 35b by providing the slope portion 35a, the structural strength of the translucent member itself is improved in this respect. For example, even if an external force is accidentally or undesirably applied to the light-transmitting member when placing the light-transmitting member on the sheet in the process of forming the light-guiding support member, the thicker shape of the flange , inconvenient phenomena such as chipping or cracking of the flange are reduced. In other words, the light-transmitting member 3 whose flange thickness gradually decreases has the effect of reducing or eliminating voids remaining in the light guiding support member, and also improves structural strength due to the thick flange portion.

The suppression of residual voids will be explained in detail. When carrying out the light guide support member forming process, the light-reflecting resin placed on the light-shielding frame is pressed by the light-transmitting member and flows into "the space between the light-transmitting member and the opening of the light-shielding frame." let If voids are once generated due to such inflow, the flange of the light-transmitting member acts to move the voids. In particular, the portion where the thickness of the flange portion 30 gradually changes, that is, the thickness changing portion 35, promotes the movement of the void 80 generated during the above-mentioned inflow (FIGS. 10 and 11(a) to 11(d)).

That is, when the light flows into the space between the light-transmitting member and the opening in the light-guiding support member forming step, the void 80 moves due to the flange 30 having a gradually different thickness. Specifically, the void moves from a portion where the thickness of the flange portion is relatively thick to a portion where the thickness is relatively thin. For example, as shown in FIGS. 11(a) to 11(d), the thickness changing portion 35 of the flange portion 30 causes the flow 90 of the light-reflective resin to push out the void 80 at the time of the inflow to the outside. can be moved to This makes it easier for the voids to escape to the outside, and it is possible to reduce or eliminate voids remaining in the light guide support member. The light-guiding support member is obtained by curing the light-reflecting resin that flows into the gap between the light-transmitting member and the opening of the light-shielding frame, but voids can be discharged to the outside before curing. . As can be seen from the above, in the embodiment of the present invention, the thickness-changed portion of the flange of the light-transmitting member is made of light-reflecting resin so as to suppress the generation of voids during the light-guiding support member forming process. It has the effect of improving the flowability of.

Due to the thickness change portion, the thickness dimension of the collar portion has a slope in a certain direction. Preferably, the thickness of the flange has a slope toward the outside of the translucent member. In other words, it is preferable that the thickness of the flange gradually decreases toward the periphery of the flange. Thereby, even if voids occur during the inflow, the voids can be moved outward more effectively. As a result, the remaining voids in the light guiding support member can be more effectively reduced, and a light emitting device in which the generation of voids is suppressed can be obtained.

The slope angle indicating the degree of change in the thickness changing portion may be 20 degrees or less, for example, 10 degrees or less, or 5 degrees or less. For example, regarding the slope angle α shown in FIG. 11, it may be 0°<α≦20°, for example, 0°<α≦10° or 0°<α≦5°. In this way, the gradient angle α in the thickness changing portion does not necessarily have to be a large angle. Even if the gradient angle is as small as 20 degrees or less, 10 degrees or less, or 5 degrees or less, the effect of suppressing the generation of voids during the above-mentioned inflow or moving the generated voids to the outside can be obtained. Incidentally, the thickness changing portion includes a relatively thick portion and a relatively thin portion in the light-transmitting member, but when the above-mentioned slope angle becomes a large angle such as 20 degrees or more, the flange portion The “thick part” of the image becomes excessively thick. An excessively thick portion of the flange may cause the flange and the light-shielding frame to come into contact when the light-transmitting member is placed on the sheet in the light-guiding support member forming process. Alternatively, at a large slope angle of 20 degrees or more, the "thin part" of the flange becomes relatively excessively thin, and there is a risk that the flange will chip or crack.

The first embodiment includes, for example, the translucent member 3 shown in FIGS. 3 and 4. In such a translucent member 3, the thickness of the flange portion 30 is gradually changed in a direction different from the direction in which the flange portion 30 is stretched. As shown in the figure, the thickness changing portion 35 of the collar portion may have a form in which a sloped portion 35a is added to a base portion 35b having a constant thickness. That is, even the thinnest portion of the flange portion 30 has a predetermined thickness of, for example, 20 μm or more.

As shown in FIGS. 3 and 4, preferably, a thickness changing portion 35 is provided in a direction perpendicular to the extending direction of the collar. That is, in the translucent member 3 shown in FIGS. 3 and 4, the thickness of the flange 30 increases toward the periphery of the flange in a direction perpendicular to the extending direction of the flange 30 when viewed from above. It is gradually getting smaller.

In the manufacturing method according to the first embodiment, voids are created in the direction perpendicular to the extending direction of the flange when flowing into the space between the light-transmitting member and the opening of the light-shielding frame in the light-guiding support member forming step. The voids remaining in the light guiding support member can be more effectively reduced. The "direction perpendicular to the stretching direction of the flange" corresponds to a direction in which voids are particularly easy to escape. This is because when placing the light-transmitting member, the flange of the light-transmitting member and the light-reflecting resin come into contact and the light-reflecting resin flows into the "space between the light-transmitting member and the opening of the light-shielding frame." This is because there is an "escape route" in which the voids can be discharged toward the outside of the light-shielding frame in the "direction perpendicular to the extending direction of the flange" (Fig. 4 and Fig. 11(a)). ) to (d)).

In one aspect, the thickness of the flange may gradually change so as to be divided into two parts in "a direction perpendicular to the stretching direction of the flange". For example, the thickness of the flange may gradually change such that it is divided into two parts at the thickest part where the flange has the maximum thickness. In such a case, as shown in FIG. 3 or 4, the thickest part 35c of the flange 30 having the maximum thickness is the flange in the direction orthogonal to the extending direction of the flange 30 when viewed from above. 30 central regions. Preferably, one such thickest portion 35c is provided in each collar portion 30.

When the thickest part of the flange is provided in the central region in this manner, voids can be more effectively discharged to the outside. When the thickest part 35c of the flange 30 is the central region, the thickest part is positioned at approximately equal positions from two locations that serve as "escape routes" for evacuation to the outside. This is because, no matter where a void occurs, it is easy to discharge the void to the outside in a relatively short distance (see FIGS. 11(a) to 11(d)).

The thickest portion may extend along the extending direction of the collar. As shown in FIG. 3, the thickest portion 35c of the flange 30 may be provided along the extending direction of the flange 30 while maintaining substantially the same thickness. Although the thickness of the thickest portion may be the same as the maximum thickness of the light-transmitting member, it is preferably less than the maximum thickness of the light-transmitting member. In other words, if the maximum thickness of the translucent member 3 is "T ₁ " and the thickness of the thickest portion 35c of the flange 30 is "T ₂ ", T ₂ is preferably less than T ₁ . , that is, it is preferable that T ₂ <T ₁ (see FIG. 3). Assuming that T ₂ is the same or approximately the same as T ₁ , when the light-transmitting member is placed on the sheet in the light-guiding support member forming process, the flange of the light-transmitting member comes into contact with the sheet. Alternatively, the light-reflecting resin comes into contact with the light-shielding frame on the sheet, and the flow of the light-reflecting resin is hindered, and the light-reflecting resin does not spread to that location. In other words, if T ₂ is the same or substantially the same as T ₁ , there will be a portion between the light-transmitting member and the light-shielding frame where no light-reflecting member is interposed. As a result, there is a possibility that "suppression of reduction in light extraction efficiency" brought about by the light reflective member interposed between the light-transmitting member and the light-shielding frame may be reduced. Therefore, it is preferable that the thickness dimension T ₂ of the thickest portion of the flange portion 30 is less than the maximum thickness dimension T ₁ of the light-transmitting member. For example, 0.1T ₁ <T ₂ <0.9T ₁ may be mentioned, but it is preferable to set it to approximately 0.25T ₁ <T ₂ <0.5T ₁ in consideration of the thickness of the light shielding frame.

When the thickest portion extends along the stretching direction of the flange, voids can be more effectively discharged to the outside in the "direction perpendicular to the flange stretching direction." The thickest portion acts to dam the void, while also contributing to moving the void away from the thickest portion starting from the thickest portion. Regarding this, if the thickest part 35c extends along the extending direction of the flange part 30, the above-mentioned damming effect becomes higher, and as a result, voids start from the thickest part and move away from the thickest part. It becomes easier to move more effectively.

When the thickest portion is provided, a sloped portion may be provided such that the thickness of the flange portion gradually changes from the thickest portion. In other words, the thickness of the flange may gradually become smaller from the thickest portion in a direction perpendicular to the extending direction of the flange when viewed from above. As shown in FIG. 4, when it is assumed that one flange peripheral edge 30A and the other flange peripheral edge 30B face each other in a direction perpendicular to the extending direction of the flange 30, toward one flange peripheral edge 30A, The thickness of the flange 30 may gradually become smaller from the thickest portion 35c, and the thickness of the flange 30 may gradually become smaller from the thickest portion 35c toward the other flange peripheral edge 30B.

In such a case, when the light-reflecting resin flows into the space between the light-transmitting member and the opening of the light-shielding frame in the light-guiding support member forming process, the void is moved toward one of the flange peripheral edges 30A. At the same time, the void can be moved toward the other flange peripheral edge 30B. In other words, the void moves so as to be divided into two parts in opposite directions in the "direction perpendicular to the extending direction of the flange", so the moving distance of the void is shortened, and the void remaining in the light guide support member can be more effectively removed. (See Figure 10).

A second embodiment includes a translucent member 3 shown in FIGS. 8 and 9. In the translucent member 3, the thickness of the flange 30 becomes gradually smaller toward the periphery of the flange 30 in the extending direction of the flange 30. Preferably, the translucent member 3 has a thickness changing portion 35 provided outward from the base portion 32 of the collar portion 30, as shown in the figure.

In the manufacturing method according to the second embodiment, when the light-reflecting resin flows into the space between the light-transmitting member and the opening of the light-shielding frame in the light-guiding support member forming step, the stretching direction of the collar portion and/or Then, the voids can be moved in the direction of widening the angle, and the number of voids remaining in the light guiding support member can be reduced. In particular, in the second embodiment, when the light-transmitting member is placed, the flange of the light-transmitting member and the light-reflecting resin come into contact and voids are created in the gap area between the light-transmitting member and the light-reflecting resin. Even if the voids are about to be formed, the voids move in the extending direction of the flange portion and/or in the direction of widening from the flange portion and easily escape to the outside, and as a result, the remaining voids are eliminated or suppressed.

In the manufacturing method according to the second embodiment, the thickness changing portion 35 of the collar portion 30 may become gradually narrower in the extending direction of the collar portion 30. That is, as shown in FIG. 9, when the translucent member 3 is viewed from above in plan, the thickness changing portion 35 may have a tapered shape. As a result, when the light-reflecting resin flows into the space between the light-transmitting member and the opening of the light-shielding frame in the light-guiding support member forming process, the light-reflecting resin flows in the direction in which the flange extends and/or in the direction in which it widens at a wide angle. This makes it easier to move the voids, and the remaining voids in the light guiding support member are further suppressed.

Next, the translucent member 3 in which the thickness of the flange portion 30 gradually changes will be described in detail. In the light emitting device according to this embodiment, the flange portion 30 of the light-transmitting member 3 has a thickness changing portion 35 whose thickness gradually changes. The flange portion 30 may have a thickness changing portion 35 all over it, or may include a thickness changing portion 35 partially.

When the upper surface of the light-transmitting member has a rectangular shape in plan view, for example, a pair of flanges may be provided on opposite sides of the rectangle, and each of the pair of flanges has a thickness changing portion. It is good that it is provided. For example, when the upper surface of the light-transmitting member has a rectangular shape in plan view, the flanges 30 may be provided so as to form a pair on the long sides (as shown in FIG. 3 or 4, The flange portions 30 are provided so as to form a pair, and the flange portions may not be provided on the short sides). Here, in general, a translucent member having a flange on a rectangular long side (a translucent member without the thickness changing portion 35) is particularly susceptible to voids remaining. This is because, in such a translucent member having a flange on a long side, when the translucent member is arranged, the flange of the translucent member and the light-reflecting resin tend to come into contact with each other on the longer side, and light This is because it becomes difficult for air trapped or engulfed when the reflective resin suddenly flows into "the space between the light-transmitting member and the opening of the light-shielding frame" to escape. Regarding this, in the light-emitting device of the embodiment, the thickness-changed portion provided in the flange portion contributes to the void remaining, so the effect of the thickness-changed portion is more likely to become apparent.

The flange portion is related to the fact that the main surfaces of the light-transmitting member have different sizes. Specifically, in the translucent member 3, the size of the upper surface 3a and the lower surface 3b opposite to the upper surface are different from each other due to the flange 30 (see FIGS. 3 and 4, or FIGS. 8 and 8). (See Figure 9). The upper surface 3a is relatively small and serves as a "light exit surface of the light emitting device," while the lower surface is relatively large and serves as a light entrance surface into which light emitted from the light emitting element enters. Both the upper surface 3a and the lower surface 3b may be planar. As can be seen from the illustrated form, in the collar portion 30 of the translucent member 3, the portion corresponding to the back side of the surface forming the lower surface 3b forms a slope due to the “thickness changing portion”. good.

When viewed in plan, a portion corresponding to the difference between the upper surface 3a and the lower surface 3b corresponds to the flange portion 30. Note that the flange portion may be continuous with the lower surface of the translucent member. That is, the collar portion 30 may have a surface that is flush with the lower surface 3b of the transparent member 3. In the flange portion 30, a thickness changing portion may be provided on the surface opposite to the surface continuous with the lower surface 3b.

The translucent member 3 may have a symmetrical planar shape. Specifically, the flanges 30 are arranged point-symmetrically or line-symmetrically with respect to the center O or the center line M of the translucent member 3, and the thickness changing portions 35 provided in each flanges 30 are may also be arranged point-symmetrically or line-symmetrically with respect to the center O or center line M of the translucent member 3 (see FIGS. 4 and 9).

The light emitting device according to the first embodiment corresponds to one obtained by the manufacturing method according to the first embodiment. Therefore, as shown in FIGS. 3 and 4, the translucent member 3 is provided with a thickness changing portion 35 in a direction perpendicular to the direction in which the collar portion 30 extends. More specifically, the thickness of the flange 30 gradually decreases toward the periphery of the flange 30 in a direction perpendicular to the extending direction of the flange 30 when viewed from above. A light-emitting device including such a light-transmitting member has desired optical characteristics and/or more suitable bonding strength because voids are absent or suppressed due to the above-described manufacturing method. In other words, the effect of "suppressing a decrease in light extraction efficiency" achieved by the first light-reflecting member interposed between the light-transmitting member and the light-shielding frame is prevented or reduced due to voids. Alternatively, the bonding strength between the first light-reflecting member and the light-transmitting member and/or the light-shielding frame is more suitable. Furthermore, since the light-emitting device has a relatively thick flange portion, the mechanical strength of the light-transmitting member itself is improved in this respect.

Furthermore, in the light emitting device according to the first embodiment, the bonding area between the light-transmitting member and the first light-reflecting member becomes larger due to the “thickness changing portion” of the flange. In other words, when comparing the case where the flange has a "thickness changing part" and the case where it does not (for example, the case of a plate-shaped flange with a constant thickness), the former is more relative than the latter. Since the light-reflecting member has a larger surface, the bonding area with the first light-reflecting member becomes larger. Therefore, from the viewpoint of increasing the bonding area, the light emitting device according to the first embodiment provides improved bonding strength between the light-transmitting member and the first light-reflecting member.

In the light-emitting device according to the first embodiment, as shown in FIG. 3 or 4, the thickest portion 35c of the light-transmitting member 3 where the thickness of the flange portion 30 is maximum is when viewed from above in a plan view. It may be provided in the central region of the flange 30 in the direction orthogonal to the direction in which the flange 30 extends. In other words, in a plan view of each collar portion 30, it can be said that the "thickness changing portions" 35 are provided line-symmetrically about the thickest portion 35c. Further, as illustrated, the thickest portion 35c may extend along the extending direction of the collar portion 30. That is, as shown in FIG. 3, the thickest portion 35c of the flange 30 may be provided along the extending direction of the flange 30 while maintaining substantially the same thickness. Although the thickness of the thickest portion 35c may be the same as the thickness of the transparent member 3, it is preferably less than the thickness of the transparent member 3.

In the light emitting device according to the first embodiment, the thickness of the flange portion of the light-transmitting member may gradually become smaller from the thickest portion in a direction perpendicular to the extending direction of the flange portion when viewed from above. . As illustrated (particularly as shown in FIG. 4), when it is assumed that one flange peripheral edge 30A and the other flange peripheral edge 30B face each other in a direction orthogonal to the extending direction of the flange 30. , the thickness of the flange 30 gradually decreases from the thickest portion 35c toward the peripheral edge 30A of the flange, and decreases from the thickest portion 35c toward the periphery 30B of the other flange. 30 may gradually become smaller from the thickest portion 35c.

The light emitting device according to the second embodiment corresponds to one obtained by the manufacturing method according to the second embodiment. Therefore, in the translucent member 3, as shown in FIGS. 8 and 9, the thickness of the flange 30 gradually decreases toward the periphery of the flange 30 in the extending direction of the flange 30. Even in a light emitting device including such a light-transmitting member, voids are absent or suppressed due to the above-described manufacturing method, and thus desired optical characteristics and/or more suitable bonding strength can be obtained. In other words, the effect of "suppressing a decrease in light extraction efficiency" exerted by the first light-reflecting member interposed between the light-transmitting member and the light-shielding frame is prevented or reduced due to voids, Alternatively, the bonding strength between the first light-reflecting member and the light-transmitting member and/or the light-shielding frame is more suitable.

In the light emitting device according to the second embodiment, the regions of the flange having gradually different thicknesses may be gradually narrowed in the extending direction of the flange. That is, as shown in FIGS. 8 and 9, the thickness changing portion 35 may have a tapered shape when viewed from above. Thereby, voids can be more effectively discharged to the outside. In other words, when the light-reflecting resin flows into the space between the light-transmitting member and the opening of the light-shielding frame in the light-guiding support member forming process, air that causes voids can be easily pushed out to the outside. This facilitates a light-emitting device in which residual voids are further suppressed.

A more detailed explanation of the light-transmitting member in the light-emitting device of the embodiment has been explained in the above-mentioned manufacturing method, so the explanation will be omitted to avoid duplication.

Although the embodiments of the present invention have been described above, these are merely typical examples. Therefore, those skilled in the art will readily understand that the present invention is not limited thereto and that various embodiments are possible.

In the above explanation, when the upper surface of the light-transmitting member has a rectangular shape in plan view, the flange portions are provided so as to form a pair only on the long sides, and the flange portions are not provided on the short sides. For example, flanges may be provided not only on the long sides of the rectangle but also on the short sides of the rectangle, and each of the flanges may be provided with a thickness changing portion. In such a case, for example, each flange (that is, each of the four flange parts) may be provided with the thickest portion resulting from the thickness change portion, and this also allows the light-transmitting member and the light-transmitting member in the light guide support member forming process to be When water flows into the space between the opening of the light-shielding frame, the flange portion with a gradually different thickness can move so as to push out the voids caused by the flow of water further outward, and as a result, no voids remain or no voids remain. A suppressed light emitting device can be obtained.

Furthermore, in the embodiment of the present invention, the thickness change portion of the light-transmitting member can eliminate or suppress voids remaining in the region of the light-reflecting member. There is a higher degree of freedom in the selection of . In other words, voids are more likely to occur when the viscosity of the light-reflecting resin is high, but in the embodiment of the present invention, the remaining voids can be eliminated or suppressed in the thickness-changing portion of the light-transmitting member. It becomes possible to actively use resin. For example, it is possible to actively use a light-reflecting resin having a higher content of a light-reflecting substance such as titanium oxide and a relatively high viscosity.

Note that the fact that voids are more likely to occur when the viscosity of the light-reflective resin is higher means that voids are more likely to occur when the light-reflective resin has a property of being difficult to flow. In this regard, for example, the surface of the thickness changing portion may be a smooth surface. Since the smooth surface assists the flow of the light-reflective resin, voids are less likely to remain. In other words, the smooth surface on the flange can help eliminate or suppress residual voids. Therefore, in the embodiment of the present invention, the surface of the thickness-changing portion may be surface-treated by polishing or the like to make it a smooth surface.

Furthermore, in the embodiments of the present invention, it is also possible to locally change the light reflectance of the light emitting device, for example, by changing the thickness of the transparent member. Specifically, the thickness changing portion results in a relatively thick portion and a relatively thin portion in the flange, but in a light emitting device, the region near the thick portion of the flange has a relatively thick portion and a relatively thin portion in the flange. A region with a relatively small amount of light-reflective members is provided, while a region with a relatively large amount of light-reflective members is provided in the vicinity of the thin portion of the flange. Therefore, it is also possible to locally change the light reflectance by changing the thickness of the flange portion of the light-transmitting member.

1 Light emitting element 3 Transparent member 3a Top surface/first surface (light emitting surface of light emitting device)
3b Lower surface/second surface 30 Flange portion of translucent member 30A One flange periphery 30B Other flange periphery 32 Root portion of flange 35 Thickness changing portion of flange 35a Slope portion 35b Foundation portion 35c Top Thick portion 4 Sheet 5 Light shielding frame 5a Opening 5b Frame portion 9 Light reflective member 9a First light reflective member 9a' Light reflective resin 9b Second light reflective member 9b' Second light reflective resin 10 Substrate 11 Conductive 13 Light guide member 40 Collet 60 Light guide support member 80 Void 90 Flow of light reflective resin

Claims (15)

A mounting process of mounting a light emitting element on a substrate,
a light-shielding frame mounting step of mounting a light-shielding frame having an opening on a sheet;
a light-reflective resin coating step of applying a light-reflective resin on the light-shielding frame;
A plate-shaped light-transmitting member having a flange on a side surface is arranged such that the upper surface of the light-transmitting member faces the sheet at a position where a space is formed between the light-transmitting member and the opening. The flange is brought into contact with the applied light-reflective resin and then pressed, and the light-reflective resin flows into the space to form a first light-reflective member, and the light-shielding frame and the light-transmitting a light guide support member forming step of producing a light guide support member in which a flexible member is supported by the first light reflective member;
a light guide support member bonding step of fixing the light guide support member on the light emitting element by bonding the upper surface of the mounted light emitting element and the lower surface of the light transmitting member;
including;
The light-emitting device manufacturing method, wherein the light-transmitting member has a flange having a thickness that gradually differs. 2. The method for manufacturing a light emitting device according to claim 1, wherein the thickness of the flange gradually decreases toward the periphery of the flange. The method for manufacturing a light emitting device according to claim 1 or 2, wherein when the light reflective resin flows into the space, voids included in the light reflective resin are moved by the flange portion having a gradually different thickness. . The light emitting device according to any one of claims 1 to 3, wherein the thickness of the flange gradually decreases toward the periphery of the flange in a direction perpendicular to the extending direction of the flange when viewed from above. Method of manufacturing the device. Claims 1 to 4, wherein the thickest portion of the flange is provided in a central region of the flange in a direction perpendicular to the extending direction of the flange when viewed from above. A method for manufacturing a light emitting device according to any one of the above. The method for manufacturing a light emitting device according to claim 5, wherein the thickest portion extends along the extending direction of the flange. 7. The method for manufacturing a light emitting device according to claim 5, wherein the thickness of the flange gradually decreases from the thickest portion in a direction perpendicular to the extending direction of the flange when viewed from above. 4. The method for manufacturing a light emitting device according to claim 1, wherein the thickness of the flange gradually decreases toward the periphery of the flange in the extending direction of the flange. A substrate and
a light emitting element provided on the substrate;
a translucent member provided to face the light emitting surface of the light emitting element;
a first light reflective member provided on a side surface of the transparent member;
a light-shielding frame provided around the light-transmitting member and in contact with the first light-reflecting member;
Equipped with
The translucent member has a flange on a side surface, and the thickness of the flange gradually differs,
A light emitting device, wherein the thickness of the flange gradually decreases toward the periphery of the flange in a direction perpendicular to the extending direction of the flange when viewed from above. A substrate and
a light emitting element provided on the substrate;
a translucent member provided to face the light emitting surface of the light emitting element;
a first light reflective member provided on a side surface of the transparent member;
a light-shielding frame provided around the light-transmitting member and in contact with the first light-reflecting member;
Equipped with
The translucent member has a flange on a side surface, and the thickness of the flange gradually differs,
A light emitting device, wherein the thickest portion of the flange is provided in a central region of the flange in a direction perpendicular to a direction in which the flange extends when viewed from above. A substrate and
a light emitting element provided on the substrate;
a translucent member provided to face the light emitting surface of the light emitting element;
a first light reflective member provided on a side surface of the transparent member;
a light-shielding frame provided around the light-transmitting member and in contact with the first light-reflecting member;
Equipped with
The translucent member has a flange on a side surface, and the thickness of the flange gradually differs,
A light emitting device, wherein the thickness of the flange gradually decreases toward the periphery of the flange in the stretching direction of the flange, and the region of gradually different thickness gradually narrows in the stretching direction of the flange. . The upper surface of the light-transmitting member has a rectangular shape in plan view, and the flange portions are provided so as to form a pair on opposite sides of the rectangle. Light emitting device. 13. The light emitting device according to claim 9, wherein the light-transmitting member has an upper surface and a lower surface opposite to the upper surface having different sizes due to the flange. The light emitting device according to claim 10 , wherein the thickest portion extends along the extending direction of the flange. The light emitting device according to claim 10 or 14 , wherein the thickness of the flange gradually decreases from the thickest portion in a direction perpendicular to the extending direction of the flange when viewed from above.

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