JP6784287B2 - Light emitting device and its manufacturing method - Google Patents

Description

The present invention relates to a light emitting device including a covering member that covers the side surface of the light emitting element, and a light emitting device and a translucent member on the upper surface of the covering member, and a method for manufacturing the same.

Light-Emitting Diodes (LEDs) have many features such as low power consumption, long life, and high reliability. By putting white LEDs that combine blue LEDs and phosphors into practical use, various types of lighting and backlights can be used. It is widely used for various purposes such as light sources. In recent years, with the expansion of the demand, further improvement of the light emission output and the light emission efficiency of the LED is expected, and a light source having high output and high reliability is required.

The light emitting device obtained from the manufacturing method of Patent Document 1 is an LED die having a connecting electrode on the bottom surface, a reflective layer extending downward on the side surface thereof, and a phosphor layer on the upper surface of the LED die. And covers the top of the reflective layer. According to this configuration, since the extending portion of the reflective layer blocks the light leaking from the side and the bottom after mounting, it is possible to realize high light extraction efficiency, and a high-brightness LED die with good mass productivity can be manufactured. can do.

In the light emitting device of Patent Document 2, the light emitting element and the side surface of the wavelength conversion member arranged on the light emitting element are covered with a coating member containing a light reflecting material. Further, the light transmitting member is arranged so as to face the light source portion so that the light transmitting member can be accommodated in the covering member. As a result, it is possible to reduce the size of the light while maintaining the efficiency of extracting the light emitted from the light emitting element, and to obtain the light emitting characteristics in which color unevenness and brightness unevenness are suppressed.

Further, the configuration of the light emitting device as in Patent Document 2 is intended to improve the light extraction efficiency while avoiding a decrease in reliability due to deterioration of the constituent members. The light emitting device according to the above. In this light emitting device, by providing a gap and a first reflecting surface in the separated region between the light emitting element and the light transmitting member, the return light is reflected again to prevent the deterioration of the resin adhesive and the light transmitting member, and the light is reflected. It suppresses the decrease in the light coupling efficiency to the transmissive member.

Japanese Unexamined Patent Publication No. 2012-253223 JP-A-2010-238846 JP-A-2010-283281

With the light emitting device described in Patent Documents 1 and 2, it is possible to increase the light extraction efficiency by coating the light reflecting member. Then, by using a light emitting device as in Patent Document 3, it is possible to alleviate the deterioration of the adhesive and the light transmitting member. However, in LEDs for which further improvement in light extraction efficiency is desired in the future, it is difficult to completely avoid deterioration of constituent members, and there is a concern that reliability may deteriorate.

The present invention has been made in view of the above problems, and has improved the adhesion between the coating member that covers the side surface of the light emitting element and the translucent member on the upper surface of the light emitting element and the covering member, and has high reliability. An object of the present invention is to provide a light emitting device having a long life.

The light emitting device according to the present invention has a light emitting element, a coating member that covers the side surface of the light emitting element, and an end surface that is substantially on the same surface as the end surface of the coating member on the upper surface of the light emitting element and the coating member in the light emission direction. A light emitting device including a light emitting member, wherein the covering member has a concave portion or a convex portion on the upper surface, and the light emitting surface of the light emitting element and the upper surface other than the concave or convex portion of the covering member are substantially on the same surface. The translucent member is characterized in that it is fitted with a concave portion or a convex portion of the covering member.

A method for manufacturing a light emitting device, comprising: a light emitting element, a coating member that covers a side surface of the light emitting element, and a translucent member on the upper surface of the light emitting element and the covering member in a light emitting direction. The first step of forming the upper surface so as to be substantially on the same surface as the light emitting surface of the light emitting element and forming the concave portion or the convex portion on the upper surface thereof, and the translucency so as to fit the concave portion or the convex portion. It is characterized by having a second step of forming a member and a third step of cutting the end faces of the covering member and the translucent member so as to be substantially on the same surface.

As a result, in a light emitting device having a structure in which the end faces of the constituent members are substantially on the same surface and peeling is likely to occur, the adhesion between the covering member and the translucent member is improved, and reliability is maintained and the life is extended.

FIG. 1a is a plan view of the light emitting device according to the first embodiment of the present invention, and FIG. 1b is a cross-sectional view taken along the line AA of FIG. 1a. FIG. 1c is an example in which the recess is different from FIG. 1b, and FIG. 1d is an example in which the recess is different from FIG. 1a. However, FIGS. 1a and 1d are states before the translucent member is formed. FIG. 2a is a plan view of the light emitting device according to the second embodiment of the present invention, and FIG. 2b is a cross-sectional view taken along the line AA of FIG. 2a. FIG. 2c is an example in which the light emitting element and the recess are different from those in FIG. 2a. However, FIGS. 2a and 2c are states before the translucent member is formed. FIG. 3a is a plan view of the light emitting device according to the third embodiment of the present invention, and FIG. 3b is a cross-sectional view taken along the line AA of FIG. 3a and a partially enlarged view of the recess. However, FIG. 3a shows a state before forming the translucent member. FIG. 4a is a schematic view showing a manufacturing process of the light emitting device according to the first embodiment of the present invention. Further, FIG. 4b is a cross-sectional view of a light emitting device formed by the manufacturing process. FIG. 5 is a cross-sectional view of the light emitting device according to the fourth embodiment of the present invention and a partially enlarged view of the convex portion, and is an example in which the covering member has the convex portion. 6a to 6c are partially enlarged views in the cross-sectional view of the recess according to the embodiment of the present invention, and show an example of the recess. FIG. 6d is a partially enlarged view of a cross-sectional view of the convex portion according to the embodiment of the present invention, and shows an example of the concave portion. FIG. 7 is a cross-sectional view of the light emitting device according to the second embodiment of the present invention and a partially enlarged view of the recess.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light emitting device described below is for embodying the technical idea of the present invention, and does not specify the present invention as the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the constituent parts described below are not intended to limit the scope of the present invention to them, but are merely explanatory examples unless otherwise specified. The size and positional relationship of the members shown in each drawing may be exaggerated to clarify the explanation. Further, each element constituting the present invention may be configured such that a plurality of elements are composed of the same member and the plurality of elements are combined with one member, or conversely, the function of one member is performed by the plurality of members. It can also be shared and realized. Similarly, the embodiments described below can also be applied by appropriately combining the configurations and the like unless otherwise specified.

<Embodiment 1>
FIG. 1a is a plan view of the light emitting device according to the first embodiment of the present invention, and FIG. 1b is a cross-sectional view taken along the line AA of FIG. 1a. The light emitting device 100 shown in FIG. 1 is mainly composed of a light emitting element 1, a conductive wiring 2, a covering member 3, and a translucent member 5. A light emitting element 1 is flip-chip mounted on the conductive wiring 2. Further, on the conductive wiring, a covering member 3 having a side surface covered so as to expose the light emitting surface of the light emitting element 1 and having a recess 4 on the upper surface in contact with the translucent member 5 is arranged, and the light emitting element 1 is arranged. The translucent member 5 continuously covers the upper surface of the covering member 3 having the recess in the light emitting direction. The covering member in the present embodiment contains a light-reflecting material, and the translucent member includes a wavelength conversion member. The upper surface of the covering member 3 other than the recess and the light emitting surface of the light emitting element 1 are substantially on the same surface, but they do not have to be completely on the same surface.

With the above configuration, the light leaking from the light emitting element to the side surface can be reflected on the light emitting surface by the light reflecting material, and the wavelength can be converted and emitted by the translucent member which is a wavelength conversion member. .. Further, in the covering member 3 and the translucent member 5 having aligned end faces, a sheet-shaped translucent member 5 is arranged on the upper surface of the light emitting element 1 and the coating member 3, and the covering member and the translucent member are combined. It can be easily formed by cutting.

Further, a recess 4 is provided on the upper surface of the covering member 3 in contact with the translucent member 5, and the recess 4 is fitted with the translucent member 5. By fitting the recess 4 and the translucent member 5, the adhesion between the covering member 3 and the translucent member 5 is enhanced. The recess 4 of the covering member is not a gentle curve or arc that is formed by surface tension due to resin potting, but is a coating that is substantially on the same surface as the light emitting surface of the light emitting element 1. It is a recess (for example, about 30 to 50 μm in depth) in which a hole or a groove is formed with respect to the upper surface of the member, and the translucent member 5 penetrates deeply into the recess 4, so that the adhesion is further improved. Can be done. Further, although the recess 4 and the translucent member 5 are fitted to each other, when observed finely, some parts may not be fitted to each other, and some parts may not be completely in contact with each other. The most preferable state is that the recess 4 and the translucent member 5 are in close contact with each other without a gap, but there is a partial case where the translucent member is difficult to enter into the recess due to fine irregularities or rough surfaces of the member. There may be a non-fitting region, and the mating may be such that the adhesion between the two is maintained. When it is difficult for the translucent member to enter the recess, for example, when the recess is deep (depth of about 50 μm or more) as shown in FIG. 6c, or when the opening surface and the bottom of the recess are misaligned as shown in FIG. 6c (recess). The opening surface is separated from the light emitting element, but the bottom portion is directed toward the light emitting element), and the concave portion is widened toward the bottom as shown in FIG. 6b.

As described above, the light emitting device of the present invention includes a light emitting element, a covering member that covers at least a part of the side surface of the light emitting element at substantially the same height as the light emitting surface of the light emitting element, and the light emitting element and the covering member. A translucent member having an end face substantially on the same surface as the end face of the covering member is provided on the upper surface in the light emitting direction of the covering member, the covering member has a recess on the upper surface, and the recess is fitted with the translucent member. It is characterized by being. Similarly, the covering member has a convex portion on the upper surface thereof, and the convex portion is fitted to the light reflecting member.
In the present invention, in addition to deterioration of the member due to heat or light from the light emitting element, the light emitting surface of the light emitting element and the upper surface of the covering member other than the concave or convex portion, and the end faces of the covering member and the translucent member are omitted. By being on the same surface, the translucent member has a structure that is more easily peeled off. Therefore, by fitting the translucent member with the concave or convex portion on the upper surface of the covering member, a thin and highly reliable light emitting device with improved adhesion without using an adhesive or the like between the two members. can do.

Next, each component of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
A known light-emitting element 1, specifically a semiconductor light-emitting device, can be used. In particular, when a GaN-based compound semiconductor is used for the light-emitting device structure, short-wavelength visible light or ultraviolet light capable of efficiently exciting a phosphor can be emitted. Is. The specific emission peak wavelength is about 240 nm to 560 nm, preferably about 380 nm to 470 nm. In addition, ZnSe-based, InGaAs-based, and AlInGaP-based semiconductor light emitting devices may be used.

(Light emitting element structure)
The light emitting device structure composed of the semiconductor layer is preferably composed of at least a first conductive type (n type) layer and a second conductive type (p type) layer, and has an active layer between them. Further, the electrode structure is preferably the same surface side electrode structure in which both the first conductive type and the second conductive type electrodes are provided on one main surface side, but the electrodes are provided so as to face each main surface of the semiconductor layer. The counter electrode structure may be used. In the same surface side electrode structure, flip chip mounting is preferable in which the electrode forming surface is the mounting surface and the substrate side facing the electrode forming surface is the main light emitting surface. Flip-chip mounting has good light extraction efficiency because there are no electrodes or wires on the surface side of the light emitting element facing the phosphor layer, and high heat dissipation because the electrodes of the light emitting element and the substrate are connected by facing each other by bumps or the like. The property can be secured and the mounting area can be reduced. The growth substrate of the semiconductor layer may be removed, and a conductive substrate or another translucent member or substrate may be bonded to the semiconductor layer from which the growth substrate has been removed. Removal of the growth substrate can be carried out by mounting or holding on a support, device or submount, peeling, polishing, or LLO (Laser Lift Off). Further, the light emitting element can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer facing each other, the other main surface facing the light emitting surface is the light reflecting side, and this light is used. A light reflection structure is provided in the semiconductor layer on the reflection side or in an electrode. Examples of the light-reflecting structure include a structure in which a multilayer film-reflecting layer is provided in the semiconductor layer, an electrode having a metal film having high light-reflecting properties such as Ag and Al, a dielectric multilayer film, and a structure in which a reflective layer is provided.

An example of the light emitting element 1 of FIG. 1 will be described. In the light emitting element 1, an n-type semiconductor layer which is a first nitride semiconductor layer, a light emitting layer which is an active layer, and a p-type semiconductor layer which is a second nitride semiconductor layer are sequentially arranged on a translucent sapphire substrate. It is laminated. An n-type pad electrode, which is a first electrode, is provided in a portion where a part of the n-type layer is exposed, and an n-type pad electrode, which is a first electrode, is provided on almost the entire surface of the p-type layer on a conductive layer having high light reflectance such as Ag and a translucent conductive layer. A p-type pad electrode, which is a second electrode, is provided in the above, and a protective film is provided so as to expose the surface of the n-type and p-type pad electrodes and cover the semiconductor layer. As the substrate of the light emitting element, an insulating substrate such as sapphire or a conductive substrate of a semiconductor such as silicon carbide, Si, ZnS, ZnO, GaN, or AIN can be used. When the substrate of the light emitting element serves as a light emitting surface, it is preferably translucent such as sapphire and SiN.

(Translucent member)
The light emitting device 100 of FIG. 1 includes a light emitting element 1 and a translucent member 5 that transmits at least a part of the light from the light emitting element 1 on the upper surface of the covering member 3 that covers the side surfaces of the light emitting element 1. The shape of the translucent member 5 is particularly limited as long as it is arranged on the upper surface of the light emitting element 1 and the recess 4 of the covering member, is fitted with the recess 4, and the end face is substantially the same as the end face of the covering member. Not done. Therefore, the lower surface of the translucent member 5 has a convex shape that fits into the recess 4 in the region in contact with the recess 4 of the covering member. Further, when the covering member 3 has a convex portion, the lower surface of the translucent member 5 has a concave shape so as to fit with the convex portion. It is preferable that the concave shape and the convex shape of the translucent member 5 completely correspond to each other, but the non-corresponding part may be complemented and fitted with an adhesive or the like, and a part thereof is fitted. It doesn't matter if there is a missing part. Further, the upper surface of the translucent member 5 (the surface not in contact with the light emitting element and the covering member) has a gentle concave or convex shape corresponding to the region where the concave or convex portion of the covering member 3 is located. It may have (that is, when the translucent member 5 is laminated in a flexible state, it may be deformed along the concave portion or the convex portion of the covering member 3 below the translucent member 5).

Further, the number of light emitting elements 1 to be joined to the translucent member 5 is not particularly limited, and may be one or a plurality. It is preferable to use a plurality of light fluxes because the amount of luminous flux can be increased. In the case of a plurality of lights, it is easy to obtain a preferable light distribution by arranging them regularly or periodically such as in a row or in a grid pattern at equal intervals.

As the material of the translucent member, for example, resin, glass, an inorganic substance, or the like can be used. Specific examples thereof include a glass plate, a single crystal body, a polycrystal body, an amorphous body, and a ceramic body.
In addition, it is composed of a sintered body, an agglomerate, a porous body, a product obtained by mixing and impregnating them with a translucent member such as a translucent resin, and a molded body of a translucent resin.

The translucent member 5 is preferably an inorganic material such as glass rather than an organic material such as resin from the viewpoint of heat resistance, but in the present invention, it is easy because it is necessary to fit the covering member 3 and the translucent member 5. A resin or the like capable of forming a desired shape is preferable. For example, if the sheet-shaped translucent member 5 made of a silicone resin is used, it is placed on the upper surface of the covering member 3 having a concave portion or a convex portion in a semi-cured flexible state (for example, an elastic modulus of about 1 MPa or less). Since it is deformed along the shape of the concave portion or the convex portion, the translucent member 5 and the concave portion or the convex portion can be easily fitted. After that, since the resin sheet is finally cured, after the light emitting device is completed, it becomes harder than the flexible state at the time of arrangement, and mass productivity and reliability can be achieved at the same time. Even if it is not in the form of a sheet, it can be preferably used as long as it has flexibility. For example, the translucent member 5 may be formed by forming a film and laminating it.

Further, the translucent member 5 may be formed by spraying with a spray. By doing so, a recess that cannot be fitted by arranging a flexible resin or the like, that is, a recess having a deep recess as shown in FIG. 6c or a recess having a side wall having a complicated shape, as shown in FIG. 6a. It is possible to form a translucent member that easily fits into a concave portion in which the opening surface and the bottom portion are misaligned (oblique when viewed in a cross-sectional view). Similarly, when the covering member has a convex portion, even if the convex portion is high or has a complicated shape (such as being slanted in a cross-sectional view), it can be easily fitted.
Further, according to the spray, it is preferable that the thickness can be finely adjusted by repeating the spraying a plurality of times until a desired film thickness is obtained. In particular, when the translucent member contains a wavelength conversion member such as a phosphor as in the present embodiment, a desired emission color can be easily obtained by repeatedly spraying.

Further, by using a rigid (for example, elastic modulus of about 10 MPa or more) translucent member, deterioration over time can be reduced, and the light emitting device 100 having a long life can be obtained. For example, the desired sintered body can be processed so as to fit into the concave portion or the convex portion, and can be arranged so as to face the upper surface of the light emitting element 1 and the covering member 3. When arranging after processing, it is necessary to maintain high processing accuracy, but if it cannot be completely fitted, an adhesive may be provided between the translucent member 5 and the covering member 3. It doesn't matter.

The translucent member 5 may be composed of only the above materials, but contains a phosphor capable of wavelength-converting at least a part of the light emitted from the light emitting element 1 as in the present embodiment. It is preferable that a desired emission color can be obtained. In this case, the translucent member 5 is a base material containing a phosphor. Further, the translucent member 5 may be composed of only a phosphor. Typical phosphors that can be suitably combined with a blue light emitting element to emit white light include a YAG-based phosphor (ittrium, aluminum, garnet) and a LAG-based phosphor (lutetium, aluminum, garnet) activated by cerium having a garnet structure. ) Etc. are preferable. In addition, phosphors such as BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CCA, SCA, and nitride phosphors (SCESN, SESN, CESN, CASBN, and CaAlSiN3: Eu) that emit red light can be used. By increasing the reddish component by using a nitride-based phosphor or the like having yellow to red light emission, it is possible to realize illumination having a high average color rendering index Ra, a light bulb color LED, or the like. The phosphor can be provided not only in the phosphor layer but also in the adhesive interposed between the constituent members, between the light emitting element 1 and the covering member 3, and the like.

As the translucent member 5 containing a phosphor, a member containing a phosphor using the above-mentioned translucent member as a base material can be used, for example, a phosphor sheet, a phosphor glass, or a phosphor sintered. The body etc. can be mentioned.

(Coating member)
The covering member 3 covers the side surface of the light emitting element 1 as shown in FIG. 1b. More specifically, the light emitting surface of the light emitting element 1 is exposed and the side surface of the light emitting element 1 is covered so as to be embedded. That is, at least a part of the light emitting surface of the light emitting element 1 and the upper surface other than the recess 4 of the covering member are substantially on the same surface, and the heights of both are substantially equal. However, the height does not have to be exactly the same, and there may be a slight height difference of about 10 to 50 μm. As shown in FIG. 1c, the covering member 3 may not cover all the side surfaces of the light emitting element 1.

Further, the covering member 3 has a concave portion or a convex portion on the upper surface in contact with the translucent member 5. The recesses or protrusions are not gently curved over the entire surface of the covering member 3, but have deep holes or grooves (for example, a depth of about 30 to 70 μm, more preferably about 50 μm), or large protrusions (height). About 30 to 70 μm, more preferably about 50 μm) can enhance the adhesion to the translucent member 5. It is preferable that the width of the concave portion or the convex portion in the lateral direction is about 100 μm or less because the fitability with the translucent member 5 does not deteriorate.

As described above, the concave portion may have a hole or groove shape, and the convex portion may have a protruding shape protruding from the light emitting surface of the light emitting element 1. The concave portions or convex portions may be continuous as shown in FIG. 1a, divided as shown in FIG. 1d, or may be unevenly distributed. Even if the concave portions or convex portions are unevenly distributed in a complicated shape, they can be easily fitted by arranging a flexible translucent member. When the concave portion or the convex portion surrounds about 50% or more of the outer edge of the light emitting element 1, the translucent member 5 is less likely to peel off, and particularly when it is along the outer edge in the longitudinal direction of the light emitting element 1, the translucent member 5 is translucent. The adhesion with the member 5 can be effectively improved.

By the way, when forming a covering member using a mold, a release sheet may be arranged between the mold and the light emitting element and the covering member in order to facilitate peeling of the mold from the light emitting element and the covering member. However, the recess 4 of the covering member can be formed by utilizing the slack of the release sheet. The release sheet is loosened when the release sheet is pressed against the light emitting element, and the release sheet at the portion pressed by the light emitting element and the mold loosens in the direction of the covering member. The slack forms a recess in the covering member. When the elastic modulus of the looseness of the release sheet is larger than the elastic modulus of the covering member at the time of pressing the die, for example, if the covering member 3 is made of a liquid resin or the like, a recess can be formed. is there. In this case, the recess 4 is often along the light emitting element, but it is also possible to form a recess separated from the light emitting element. Further, the depth of the recess is often about twice the thickness of the release sheet. For example, if the thickness of the release sheet is about 50 μm, a recess with a depth of about 20 to 100 μm is formed. Cheap.

From the above, the thicker the release sheet, the deeper the recess tends to be. However, when the release sheet is twisted by using a thin release sheet, the twist forms a relatively narrow opening surface and a deep recess. It is also possible to do. Further, in this case, the recess is formed at a position separated from the light emitting element, and the bottom portion is often displaced in the direction of the light emitting element with respect to the opening surface of the recess. Such a recess is suitable because the translucent member of the recess is sandwiched above and below by the covering member, so that the translucent member is more difficult to peel off.

Further, when a plurality of light emitting elements are arranged and the arrangement interval is narrowed (for example, they are separated by about 100 to 1000 μm), the looseness of the release sheet pressed by the adjacent light emitting elements synergizes between the light emitting elements. A deeper recess (for example, a depth of about 50 μm or more) can be formed, and a recess along the light emitting element is likely to be formed.

It is the constituent member in the region where the amount of light emitted is large, that is, the translucent member 5 in the portion directly in contact with the light emitting element 1, which is most likely to deteriorate and peel off. Therefore, when the concave portion 4 or the convex portion 54 along the light emitting element as shown in FIGS. 1b and 5 is formed and fitted with the translucent member, the adhesion between the covering member 3 and the translucent member 5 is effective. Is enhanced to. When a mold and a mold release sheet are used to form a covering member, a desired recess along the light emitting element is formed by adjusting the press pressure of the mold, the thickness of the mold release sheet, the arrangement of the light emitting element, and the like. It is efficient and preferable because it can be used. It is also possible to form a recess as shown in FIG. 1c. In the recess 4, the slack of the release sheet is pressed toward the light emitting element of the covering member, and the side surface of the recess 4 is formed by the side surface of the light emitting element 1 and the covering member 3. As described above, when the side surface of the light emitting element 1 is partially exposed and the translucent member 5 has a concave shape that sandwiches the light emitting element 1, the translucent member 5 is more difficult to peel off.

In the present embodiment, one light emitting element 1 having a rectangular shape in a plan view is used, and peripheral groove-shaped recesses 4 are provided along the peripheral edges of all four sides of the light emitting element 1. The concave portion along the light emitting element refers to a state in which the concave portion 4 is in contact with the light emitting element when viewed in a plan view as shown in FIG. 1a. Since the recess is along the entire peripheral edge of the light emitting element, the state of close contact between the covering member 3 and the translucent member 5 becomes uniform, and peeling of both members is less likely to occur. Further, the light emitted from the light emitting element 1 to the translucent member 5 is uniformly transmitted, which is preferable. In particular, when the translucent member contains a phosphor, the wavelength can be uniformly converted, so that color unevenness can be prevented. When a convex portion is formed on the entire peripheral edge of the light emitting element, the convex portion has a frame shape surrounding the light emitting element. As long as the concave portion 4 or the convex portion is fitted to the translucent member 5 on the upper surface of the covering member 3, it may be separated from the light emitting element 1 or may not be formed on the entire peripheral edge. Is not particularly limited. The same applies when a plurality of light emitting elements are arranged.

As the material of the covering member 3, for example, a material in which a light-reflecting material is contained in a translucent base material can be used. When the covering member is a light-reflecting member, the light emitted from the light emitting element 1 can be reflected to the upper translucent member without leaking from the side surface, which is preferable. Further, the covering member may be composed of only a translucent base material having no light reflectivity, or may contain a wavelength conversion member such as the above-mentioned phosphor. If the forming step is different, the material may be partially different from or exactly the same as the translucent member 5. By including the wavelength conversion member in either the translucent member or the covering member and making the one translucent without the wavelength conversion member, it is possible to reduce the absorption of light at the time of wavelength conversion. , A light emitting device having high light extraction efficiency can be obtained. As the wavelength conversion member contained in the base material, a phosphor is particularly preferable, and the above-mentioned fluorescent material mentioned as the wavelength conversion member contained in the translucent member is preferably used.

The base material is, for example, a resin material, and a translucent silicone resin composition, a modified silicone resin composition, or the like can be used. Further, a translucent insulating resin composition such as an epoxy resin composition, a modified epoxy resin composition, or an acrylic resin composition can also be used, and a hybrid resin containing at least one of these resins has excellent weather resistance. Sealing members can also be used. When the base material is the above resin, recesses or protrusions can be easily formed on the upper surface of the covering member, and the controllability, sealing performance, and airtightness of the covering region (side surface of the light emitting element) can be improved. Therefore, it is preferable, but an inorganic substance having excellent light resistance such as glass and silica gel can also be used. Further, when the base material has high heat resistance, it can cope with the heat from the light emitting element and the translucent member. In the first embodiment, a silicone resin is used as the resin as the base material constituting the covering member 3. Silicone resin has high heat resistance and light resistance, and is preferably used.

The light-reflecting material has high light-reflecting property, and the material is one kind of oxide selected from the group consisting of Ti, Zr, Nb, Al, Si, or at least one kind of AlN, MgF. Specifically, at least one selected from the group consisting of TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ can be used. When the particles of the light-reflecting material are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, light absorption is suppressed while having high light reflectivity, and refraction with the base material is performed. It is preferable because the rate difference can be increased. The covering member 3 may be made of a molded product made of the light-reflecting material, and specifically, may be a porous material such as an aggregate or a sintered body in which the particles are aggregated. In addition, a molded product obtained by the sol-gel method may be used. In this way, the difference in refractive index between the light-reflecting material and the air in the porous material becomes large, so that the light reflectivity can be enhanced. Further, since it can be composed of an inorganic material, the reliability is improved and a composite molded body can be formed.

In the coating member 3 containing the light-reflecting material in the base material described above, the light leakage method differs depending on the concentration of the light-reflecting material, and therefore, it may be appropriately adjusted according to the shape and size of the light emitting device. For example, when the width and thickness of the covering member are thinly formed with a relatively small light emitting device (for example, the thickness of the light emitting device is about 50 μm or less), it is preferable to provide a high-concentration light-reflecting material. On the other hand, the same particle size as that of the conventional filler or the like can be used so as to be suitable for the preparation, coating, molding and the like of the raw material of the covering member 3. As an example, it is preferable that the content concentration of the light-reflecting material is 20% by weight or more and the thickness of the covering member is about 20 μm or more. Within this range, productivity is good, and highly bright and highly directional emitted light can be obtained from the light emitting surface. Further, other fillers may be added to the base material which is a resin. For example, a heat conductive material can be added, heat generated by the light emitting element can be efficiently diffused, and reliability and output can be improved. Specific examples of the heat conductive material preferably have a thermal conductivity of 0.8 W / K · m or more, and examples thereof include metal materials such as Ag and Cu and ceramic materials such as diamond, alumina and AlN. It may be mixed and contained. It is also possible to mix and color a pigment or the like to absorb light having a specific wavelength.

The covering region of the covering member 3 is as described above, but it is preferable that the covering member 3 is also provided between the light emitting element and the pair of conductive wirings. More specifically, it is provided so as to fill the space between the p-pad electrode, the n-pad electrode, and the conductive adhesive on the bottom surface of the light emitting element 1 mounted on the flip chip. As a result, it is possible to insulate between the pair of conductive wirings, further improve the light extraction efficiency and the wavelength conversion efficiency, and improve the heat dissipation.

(Mounting board)
The mounting substrate is a substrate on which the above-mentioned light emitting element is mounted and electrically connected, and examples thereof include a substrate having conductive wiring on a support substrate and a substrate consisting of only conductive wiring. Further, a mounting board consisting of only conductive wiring initially has a support board, but one that is peeled off during the manufacturing process and finally becomes only conductive wiring, and one that is formed only by conductive wiring from the beginning ( For example, it is classified as a lead electrode). In either case, a conductive adhesive such as solder, Ag paste, or Au bump may be used for mounting with the light emitting element.

First, a mounting board having conductive wiring on the support board will be described in detail. The conductive wiring on the support substrate is formed of metal layers such as Au, Cu, and Al, and two or more different metals may be laminated.
The thickness of the conductive wiring is not particularly limited, but is preferably about 1 to 50 μm. It is preferable that the support substrate is made of a material having a low light transmittance. Specific examples thereof include ceramics (Al ₂ O ₃ , AlN, etc.) and resins such as phenol resin, epoxy resin, polyimide resin, BT resin, and polyphthalamide (PPA). Further, it may be a metal substrate having an insulating layer formed on its surface. A mounting substrate having conductive wiring on the support substrate as described above is preferable because the emitted light of the light emitting element is less likely to escape below the substrate and the light extraction efficiency of the light emitting device is improved. Therefore, it is suitably used for preventing light leakage when the conductive wiring is a thin film of about several μm or when the covering member does not have light reflectivity.

Next, a mounting board composed of only conductive wiring will be described. When the support substrate is removed during the manufacturing process, the conductive wiring is made of metals such as Cu, Al, Au, Ag, W, Mo, Fe, Ni, Co or alloys thereof (Fe—Ni alloy, etc.), phosphor bronze, etc. It is formed of Cu containing Fe, ITO, and the like. The film thickness is preferably, for example, about 25 to 200 μm, and more preferably about 50 to 100 μm. It is particularly preferable that the conductive wiring having such a thickness is a plating layer laminated with plating.

As the support substrate to be removed, in addition to a conductive metal plate such as a SUS plate, an insulating plate such as polyimide having a conductive film formed by a sputtering method or a vapor deposition method can be used. Alternatively, an insulating plate-shaped member to which a metal thin film or the like can be attached may be used. Further, since it is necessary to peel off from the conductive wiring, it is necessary to use a bendable member, and it is preferable to use a plate-shaped member having a film thickness of about 10 to 300 μm, although it depends on the material. Examples of the material of such a support substrate include, in addition to the above-mentioned SUS, a metal plate such as Fe, Cu, Ag, Co, and Ni, and a resin sheet made of polyimide to which a metal thin film or the like can be attached. As described above, since there is no support substrate and the conductive wiring forms the outer surface of the light emitting device 100, it is possible to make a small light emitting device.

Here, it is preferable to control the difference between the linear expansion coefficients of the conductive wiring and the covering member so as to be small. The difference is preferably about 40% or less, more preferably about 20% or less. As a result, peeling of the conductive wiring and the covering member can be suppressed, and the light emitting device having excellent reliability can be obtained. Further, it is preferable that the difference in the coefficient of linear expansion between the covering member and the removed support substrate is also small. The difference is preferably about 30% or less, more preferably about 10% or less. When a SUS plate is used as the support substrate to be finally removed, the difference in coefficient of linear expansion is preferably about 20 ppm or less, more preferably about 10 ppm or less. As a result, the residual stress between the covering member and the SUS plate can be relaxed, and the warp of the aggregate of the light emitting device after the SUS plate is peeled off can be relaxed. By reducing the warp, internal damage such as cutting of the wire can be reduced, and the positional deviation at the time of individualizing can be suppressed to produce a product with a high yield.

An example of a mounting substrate formed only of conductive wiring from the beginning is a lead electrode. As the material of the lead electrode, Fe, Cu, Cu containing Fe, Cu containing Tin, Al and the like are preferable in consideration of electrical resistance. By punching such a metal flat plate, a lead frame having a plurality of pairs of protruding portions serving as a pair of positive and negative lead electrodes can be formed. It is preferable that the surface of the lead electrode is coated with a metal made of Ag, Au, Pd by plating, sputtering, or the like because the light reflectance can be improved.

(Frame body)
The light emitting device may have a frame body for holding the covering member. The frame can be made of ceramic, resin, or the like. As the material, alumina having high light reflectivity is preferably used, but the material is not limited to this as long as a reflective film is formed on the surface. In addition, it may be formed by screen printing or by adhering a separately molded molded body to a support substrate. Further, the frame body may be colored according to the purpose. The frame can also be removed after filling or molding the covering member. When not removed, it functions as a light-reflecting member. When the covering member has light reflectivity, it has the same function and may be regarded as a part of the covering member. When the frame body is also regarded as a part of the covering member, the end face of the translucent member is formed so as to be substantially on the same surface as the end face of the frame body.

(adhesive)
An adhesive may be appropriately interposed between the light emitting element, the covering member, the translucent member, the mounting substrate, and the frame in order to strengthen the adhesion between the members. In the first embodiment, the adhesive is not provided in consideration of cost and productivity.

The adhesive is preferably made of a material capable of effectively guiding the light emitted from the light emitting element to the translucent member side and optically connecting both members. Examples of the material include resin materials used for the above-mentioned members, and as an example, a translucent adhesive material such as silicone resin is used. In addition, the same translucent adhesive may be provided between each of the other members and on the optical path. The coating method may be discharged by a dispenser or spin-coated with a resin having a low viscosity with a spin coater, and is not particularly limited. Although it is easy to adjust the coating amount and the coating area according to the dispenser, the spin coating can easily apply the adhesive over a wide range and with a uniform thickness.

(Manufacturing method of light emitting device)
An example of the manufacturing method of the light emitting device 100 shown in FIG. 1 will be described below with reference to FIG. As shown in FIG. 4a, a bump is formed in the light emitting element 41, and the light emitting element 41 is flip-chip mounted on the conductive wiring 42 on the support substrate through the bump. In this example, one light emitting element 41 is mounted side by side in the region corresponding to one light emitting device (however, the number of light emitting elements can be appropriately changed). The support substrate is removed during the manufacturing process, and the conductive wiring is used as the mounting substrate.

(First step)
In the first step, the upper surface of the covering member is formed so as to be substantially on the same surface as the light emitting surface of the light emitting element, and a recess is formed on the upper surface thereof. Specifically, the light emitting surface side of the light emitting element 41 is sandwiched between the upper mold 50 and the lower surface side of the support substrate 49 is sandwiched by the lower mold 60, and the coating member 43 is formed of a resin containing a light reflective material. ..

When the mold is used as described above, the release sheet 48 can be arranged so as to be in close contact with the upper mold. By doing so, the interference between the light emitting element 41 and the mold is alleviated, and not only the mold and the member are easily separated from each other, but also the release sheet of the portion pressed by the light emitting element and the upper mold due to the stress at the time of pressing. By loosening the 48 in the direction of the covering member 43 on the periphery of the light emitting element, a groove-shaped recess 44 along the light emitting element can be formed. That is, the covering member 43 and the recess 44 can be formed at the same time. When the pressure at the time of pressing is increased, the slack of the release sheet becomes large, and it is possible to form a deep recess in the covering member. The concave portion or the convex portion is preferably provided around the light emitting element, which is easily affected by light or heat, and most preferably along the light emitting element. If the release sheet 48 is used, the cost required for the mold can be reduced, and a recess along the light emitting element can be formed without fear of damaging the light emitting element. The concave portion can be formed not only by using the slack of the release sheet, but also by the convex structure of the upper mold, etching, cutting, blasting, etc., and the concave portion separated from the light emitting element can also be formed. The first step is performed before the formation of the translucent member 45.

(Second step)
In the second step, the translucent member 45, here the phosphor sheet containing the phosphor, is directly arranged on the upper surface of the light emitting element 41 and the covering member 43 in the light emitting direction, and is fitted with the recess 44 of the covering member. .. By arranging a relatively flexible and adhesive translucent member containing a phosphor in the resin, the light emitted from the light emitting surface can be wavelength-converted to a desired emission color, and the recess 44 can be formed. Since it is easily deformed together, it is easy to fit. In addition, the translucent member 45 can be formed by a coating method, a squeegee, a mold, or the like.

(Third step)
Finally, the support substrate 49 is peeled off from the conductive wiring 42, and the coating member 43 and the translucent member 45 are individually diced at desired positions so that the end faces are substantially on the same surface. A device similar to the light emitting device 100 of FIG. 1 can be obtained. As shown by the dotted line in FIG. 4a, the dicing position may be in the middle of the concave or convex portion when the mounting interval of the light emitting element is narrow or when there is a concave or convex portion away from the light emitting element. Absent. In this case, the recess 44 is as shown in the light emitting device 400 of FIG. 4b, and the recess is cut off in the middle. As a result, a small light emitting device can be manufactured with good mass productivity.

<Embodiment 2>
FIG. 2a is a plan view of the light emitting device according to the second embodiment of the present invention, and FIG. 2b is a cross-sectional view taken along the line AA of FIG. 2a. It is substantially the same as that of the first embodiment except that the mounting substrate is the lead electrode 22, a plurality of light emitting elements 21 (two in the drawing) are arranged, and recesses are formed so as to surround the entire light emitting element. It shall be manufactured by the structure and manufacturing method. The presence of a plurality of light emitting elements 21 not only increases the amount of luminous flux, but also synergizes the loosening of the release sheets between the adjacent light emitting elements, so that the recesses between the light emitting elements are larger than the recesses not sandwiched between the light emitting elements. Is also deeply formed. Further, when the mounting substrate is the lead electrode 22, the step of peeling the support substrate can be reduced, which is preferable. The light emitting device of FIG. 2c is equipped with four light emitting elements, and a plurality of recesses are formed along each light emitting element.

<Embodiment 3>
FIG. 3a is a plan view of the light emitting device according to the third embodiment of the present invention, and FIG. 3b is a cross-sectional view taken along the line AA of FIG. 3a and a partially enlarged view of the recess. In the partially enlarged view, the upper surface of the translucent member 5 is gently recessed corresponding to the groove of the recess 4 of the covering member. The covering member 33 of the present embodiment does not have light reflectivity and is formed of a translucent resin such as a silicone resin. The recess 34 is separated from the light emitting element 31 and surrounds the periphery thereof, and the recess 34 and the light transmissive An adhesive 37 is provided between the sex members 35. Further, the conductive wiring 32 and the frame body 36 are provided on the upper surface of the support substrate 39, and the upper surface of the covering member is formed to be slightly lower than the light emitting surface of the light emitting element. The other structures other than the above are substantially the same as those in the first embodiment, and the description of the same configuration will be omitted as appropriate.

In the light emitting device 300, the light emitting elements 31 are connected side by side on the conductive wiring 32 formed on the upper surface of the support substrate 39, and a desired frame body 36 is provided around the conductive wiring 32. Since the covering member 33 is partitioned by the frame body 36, it is easy to pot the covering member 33 with a dispenser (liquid fixed quantity discharge device) or the like. Further, since the frame body 36 has light reflectivity, it is possible to reflect the light emitted from the side of the light emitting element transmitted through the covering member and guide the light toward the upper translucent member. In the figure, the height of the frame body 36 is substantially the same as the light emitting surface of the light emitting element 31, but it may be higher or lower than that.

In the third embodiment, the adhesive layer 37 is in a recess, and the covering member 33 and the translucent member 35 are adhered to each other. When the adhesive 37 is provided between the covering member 33 and the translucent member 35, it is possible to effectively prevent the translucent member 35 from peeling off without reducing the light transmission efficiency. In the adhesive layer 37, when the translucent member 35 is hard and does not have adhesiveness like ceramics or phosphor sintered plates, or when the recess 34 is deep and the translucent member 35 is difficult to fit. In some cases, it is preferably used to ensure fitability. The coating range is not limited to the recess 34, and can be arranged on the upper surface of the translucent member other than the light emitting element and the recess, and the wider the coating range, the better the adhesion of the translucent member.

As in the present embodiment, the translucent member 35 may not be arranged on the upper surface of the frame body 36 having light reflectivity. However, when the covering member 33 has light reflectivity, the frame body 36 may be regarded as a part of the covering member 33 and formed so that the end faces of the translucent member 35 and the frame body 36 are substantially the same surface. Good.

Here, the recess 34 is not along the light emitting element 31, but is formed by utilizing the slack of the release sheet. In addition, such a recess 34 can be formed by polishing, etching, or blasting a desired recess shape using a jig, or by using a convex structure of an upper mold. Further, a plurality of recesses may be provided by combining the above methods. By polishing, etching, and blasting, the detailed shape, depth, and position of the recess 34 can be selected. In the third embodiment, the support substrate is provided, and the conductive wiring 32 provided on the upper surface of the support substrate is connected to the conductive wiring on the back surface of the support substrate by the conductive wiring provided in the thickness direction of the support substrate. Be connected. Having a support substrate is preferable because the step of peeling off the support substrate can be reduced and light leakage to the lower side of the substrate can be prevented.

Here, the covering member 33 may contain a phosphor. For example, when using a light-emitting element 31 of blue (emission wavelength 430Nm～490nm), it is excited in the blue light for the covering member 33 for emitting red light _{(Sr, Ca) AlSiN 3:} SCASN phosphor such as Eu, CaAlSiN ₃ : When a CASN-based phosphor such as Eu is contained and the translucent member 35 contains a YAG-based phosphor that emits green light, the light is emitted by RGB (red, green, blue), and white with higher color reproducibility. Can also be a light emitting device 300 that emits light.

<Embodiment 4>
In the light emitting device 500 shown in FIG. 5, the covering member has a convex portion. The light emitting device 500 of the present embodiment has a concave shape in which the translucent member fits with the convex portion, and the structure and manufacturing method of other constituent members are the light emitting device of the first embodiment having the concave portion. Can be almost the same as.

Similar to the concave portion, the closer the convex portion is to the light emitting element 51, the more effectively the peeling of the translucent member due to the deterioration of the member can be prevented. However, considering the adhesion between the light emitting element 51 and the translucent member 55, when the translucent member is arranged in a relatively hard state, it is preferable that the convex portion is separated from the light emitting element 51. This is because when the translucent member in a relatively hard state is arranged, the translucent member has a shape that does not partially follow the light emitting surface due to the convex portion, and in that case, it becomes difficult for the emitted light to be uniformly transmitted. However, by arranging the translucent member in a flexible state, the translucent member can be formed so as to be in close contact with the light emitting surface of the light emitting element. In this case, it is more preferable that the convex portion also follows the light emitting element.

The convex portion 54 is generally formed by the concave structure of the upper mold, but the release occurs when a thin mold release sheet is used when forming the covering member and the mounting interval of a plurality of light emitting elements is narrowed. It can also be formed by tearing the mold sheet. When the tearing of the release sheet is used, it can be formed at the same time as filling the covering member and along the light emitting element as in the case of forming the recess, but it often has a distorted shape as shown in FIG. 6d.

As another method for forming the convex portion, a covering member is provided in advance higher than the light reflecting surface of the light emitting element, a mask is applied over the light emitting element and its peripheral portion, and the unmasked portion is the light emitting surface of the light emitting element. After forming a covering member so that it is substantially on the same surface as the light emitting surface by etching, cutting, and blasting, or by using a mold or potting, the convex portion is further formed by potting or the like. Examples thereof include a method of forming at a desired position. Further, a plurality of convex portions may be provided by appropriately combining the above-mentioned methods. In either case, the formation of the convex portion is less likely to damage the light emitting element, but it is preferable that the covering member has a concave portion because the light emitting device can be made thinner.

<Example 1>
Hereinafter, the step of forming the light emitting device 100 in the first embodiment will be described. First, a support substrate made of a metal such as SUS is prepared, and a resist is applied and exposed to form a resist having an opening. Next, a metal having a desired thickness is plated in the opening, and then the resist is removed to form a pair of conductive wires (thickness of about 30 to 100 μm, particularly preferably about 70 μm) that are separated from each other. As the plating method, electrolytic plating, electroless plating, or the like can be used. In particular, electrolytic plating is preferable because the resist can be easily removed and the shape of the conductive wiring can be easily formed uniformly.

In the first embodiment, a substantially rectangular light emitting element having a plan view shape of about 0.8 m × 0.3 mm (emission wavelength of about 455 nm, thickness) is provided as a light emitting element on a plurality of pairs of positive and negative electrodes that are separated from each other. Approximately 120 μm) is mounted on each flip chip. The separation distance between adjacent light emitting elements is about 1500 μm.

Subsequently, a support substrate on which a plurality of light emitting elements are mounted is sandwiched in a mold composed of an upper mold and a lower mold, and a covering member is formed by compression molding or the like. At this time, the release sheet is arranged so as to be in close contact with the upper mold, and then the covering member is filled. The release sheet has a thickness of about 20 to 100 μm, preferably about 50 μm, and ETFE (tetrafluoroethylene (C ₂ F ₄ ) and ethylene (C) in consideration of thermal durability, wettability, low cost, etc. ₂ H ₄ ) copolymer) is used. The heating temperature, heating time, pressure, thickness of the release sheet, etc. by the mold can be appropriately adjusted depending on the composition of the resin used, the desired recesses of the covering member, and the like.

In Example 1, a coating member made of a silicone resin containing a light-reflecting material which is a fine particle of TiO _{2 having} a particle size of about 270 nm at a concentration of about 23 weight percent is formed. The covering member is formed to have substantially the same thickness (about 120 μm) as the light emitting element and covers all the side surfaces of the light emitting element so as to expose the light emitting surface, and is also provided between the pair of electrodes and below the light emitting element. .. Further, a recess along the light emitting element is provided on the upper surface of the covering member in the light emitting direction due to the loosening of the release sheet. Since the release sheet in the region in contact with the light emitting element during pressing is pressed toward the coating member using the silicone resin as the base material, the slack is formed almost at the same time as the formation of the coating member. The recess is not a gentle curve over the surface of the covering member, but is groove-shaped (depth about 50 μm, width about 100 μm or less).

Then, the exposed surface of the light emitting element and the upper surface of the covering member on which the recess is formed are directly covered with a phosphor sheet (thickness of about 50 μm) containing a YAG phosphor which is a translucent member. When the covering member is formed up to the light emitting surface of the light emitting element, the light emitting surface may be appropriately exposed by polishing or the like, and then the translucent member may be arranged. The recesses of the phosphor sheet and the covering member are fitted. The translucent member does not have to be in the form of a sheet, and may be formed of a resin or the like using a mold. The support substrate is removed after the translucent member is formed. Subsequently, the light emitting device 100 having a plan view shape of about 2.2 mm × 0.5 mm and having one light emitting element in the center is separated by dicing to obtain a substantially rectangular light emitting device 100 having a thickness of about 0.26 mm.

As described above, in the first embodiment, it is possible to provide a light emitting device that has almost the same effect as that of the first embodiment.

<Example 2>
The light emitting device 600 according to the second embodiment shown in FIG. 7 includes a mounting board having a recess 64 of a covering member separated from the light emitting element 61 and having a conductive wiring 62 on a support board 69. Further, the translucent member 65 is formed by spraying and is fitted with the recess 64 of the covering member. Except for the above, the light emitting device 600 has substantially the same structure as that of the first embodiment. The description of the same configuration will be omitted as appropriate.

First, Cu is plated at a desired position on a ceramic support substrate (thickness of about 500 μm) to form a pair of positive and negative conductive wires (thickness of about 50 μm). Then, the light emitting element 61 is flip-chip mounted on the upper surface thereof, and the covering member 63 is provided by compression molding or the like using a mold as in the first embodiment.

At this time, a release sheet thinner than the release sheet used in Example 1 (thickness of about 30 μm) is used, the distance between the light emitting elements is narrowed (for example, the distance between the light emitting elements is about 300 μm), and the press pressing of the mold is strengthened. As a result, the recess 64 separated from the light emitting element 61 can be formed. The concave portion 64 has an opening surface separated from the light emitting element when viewed in a plan view, and has a shape extending from the opening surface toward the bottom in the light emitting element direction.

Further, the translucent member 65 is formed by spraying a liquid silicone resin containing a YAG phosphor on the upper surface of the coating member 63 in which the light emitting surface of the light emitting element and the recess 64 are formed.
Since the opening surface and the bottom of the recess 64 in this embodiment are displaced from each other in the cross-sectional view, it is difficult to fit the translucent member 65, but the translucent member 65 can be formed by spraying. It is fitted. The angle and number of times the spray is sprayed can be adjusted as appropriate, and it is preferable to spray the spray from an angle because the translucent member is easily formed in the recess. By injecting a plurality of times, the translucent member can be laminated to a desired thickness, and can be adjusted to a different thickness in various places. Furthermore, it is also possible to laminate resins containing different types of phosphors.

Finally, the light emitting device 600 is obtained by dicing to separate the pieces in the same manner as in Example 1.

Disclosures of the present specification may include the following aspects.
(Aspect 1)
A light emitting element, a coating member that covers the side surface of the light emitting element, and a translucent member having an end surface on the upper surface of the light emitting element and the coating member in the light emission direction on substantially the same surface as the end surface of the coating member. A light emitting device equipped with,
The covering member has a concave portion or a convex portion on the upper surface, and has a concave portion or a convex portion.
The light emitting surface of the light emitting element and the upper surface other than the concave portion or the convex portion of the covering member are substantially on the same surface.
The light emitting device, wherein the translucent member is fitted with the concave portion or the convex portion.
(Aspect 2)
The light emitting device according to the first aspect, wherein the concave portion or the convex portion is along the light emitting element.
(Aspect 3)
The light emitting device according to aspect 1, wherein the concave portion or the convex portion is separated from the light emitting element.
(Aspect 4)
The light emitting device according to any one of aspects 1 to 3, wherein the covering member is a resin containing a light-reflecting material.
(Aspect 5)
The light emitting device according to any one of aspects 1 to 4, wherein the translucent member contains a phosphor.
(Aspect 6)
A method for manufacturing a light emitting device, comprising: a light emitting element, a coating member that covers a side surface of the light emitting element, and a translucent member on the upper surface of the light emitting element and the covering member in a light emitting direction.
The first step of forming the upper surface of the covering member so as to be substantially on the same surface as the light emitting surface of the light emitting element, and forming a concave portion or a convex portion on the upper surface thereof.
A second step of forming the translucent member so as to fit with the concave portion or the convex portion, and
A method for manufacturing a light emitting device, which comprises a third step of cutting the end faces of the covering member and the translucent member so as to be substantially on the same surface.
(Aspect 7)
The method for manufacturing a light emitting device according to aspect 6, wherein the concave portion or the convex portion is formed along the light emitting element.
(Aspect 8)
The method for manufacturing a light emitting device according to aspect 6, wherein the concave portion or the convex portion is formed so as to be separated from the light emitting element.
(Aspect 9)
The method for manufacturing a light emitting device according to any one of aspects 6 to 8, wherein in the first step, the covering member is formed of a resin containing a light-reflecting material.
(Aspect 10)
The method for manufacturing a light emitting device according to any one of aspects 6 to 9, wherein in the second step, the translucent member contains a fluorescent substance.
(Aspect 11)
The method for manufacturing a light emitting device according to any one of aspects 6 to 10, wherein a mold is used in the first step.
(Aspect 12)
The method for manufacturing a light emitting device according to aspect 11, wherein a release sheet is used in the first step.
(Aspect 13)
The method for manufacturing a light emitting device according to any one of aspects 6 to 12, wherein the concave portion or the convex portion is formed by loosening or tearing the release sheet using a mold and a release sheet.
(Aspect 14)
A light emitting device manufactured by the method for manufacturing a light emitting device according to any one of the above aspects 6 to 13.

The light emitting device of the present invention can be suitably used for a lighting light source, an LED display, a backlight light source such as a liquid crystal display device, a traffic light, an illuminated switch, various sensors, various indicators and the like.

100, 200, 300, 400, 500, 600 ... Light emitting device 1,21,31,41,51,61 ... Light emitting element 22 ... Lead electrode 2,32,42,52,62 ... Conductive wiring 39,49,69 ... Support substrate 3,23,33,43,53,63 ... Covering member 4,24,34,44,64 ... Recessed 5,25,35,45,55,65 ... Translucent member 54 ... Convex 36 ... Frame Body 37 ... Adhesive 50 ... Upper mold 60 ... Lower mold

Claims (8)

A light emitting element having four side surfaces , a covering member covering at least a part of each of the four side surfaces of the light emitting element, and a translucent member arranged on the upper surface of the light emitting element.
The upper surface of the covering member is provided at a position in contact with the side surface of the light emitting element so that a portion flush with the light emitting surface of the light emitting element and a part of the side surface of the light emitting element are exposed from the covering member. With recesses
A light emitting device in which the translucent member is arranged in the recess. The light emitting device according to claim 1, wherein the recess is formed along the entire peripheral edge of the light emitting element. The light emitting device according to claim 1 or 2, wherein the light emitting device includes a mounting substrate composed of only a conductive member connected to an electrode of the light emitting element. The light emitting device according to claim 1 or 2, wherein the light emitting device includes a mounting substrate including a conductive member connected to an electrode of the light emitting element and a support substrate. The light emitting device according to any one of claims 1 to 3, wherein the light emitting device includes a frame body for holding the covering member. The light emitting device according to any one of claims 1 to 5, wherein the light emitting element and the translucent member are arranged via an adhesive. The light emitting device according to claim 6, wherein the adhesive is translucent. The light emitting device according to claim 7, wherein the adhesive is arranged on an optical path.

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