WO2012165125A1 - Led lamp and cooker equipped with same - Google Patents

Led lamp and cooker equipped with same Download PDF

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Publication number
WO2012165125A1
WO2012165125A1 PCT/JP2012/062220 JP2012062220W WO2012165125A1 WO 2012165125 A1 WO2012165125 A1 WO 2012165125A1 JP 2012062220 W JP2012062220 W JP 2012062220W WO 2012165125 A1 WO2012165125 A1 WO 2012165125A1
Authority
WO
WIPO (PCT)
Prior art keywords
led lamp
heating chamber
substrate
emitting diode
heat sink
Prior art date
Application number
PCT/JP2012/062220
Other languages
French (fr)
Japanese (ja)
Inventor
直紀 杉村
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2011125419A external-priority patent/JP2012253232A/en
Priority claimed from JP2011125426A external-priority patent/JP2012251738A/en
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012165125A1 publication Critical patent/WO2012165125A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24CDOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C15/00Details
    • F24C15/008Illumination for oven cavities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00Heating by electric, magnetic or electromagnetic fields
    • H05B6/64Heating using microwaves
    • H05B6/6444Aspects relating to lighting devices in the microwave cavity
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30Lighting for domestic or personal use
    • F21W2131/307Lighting for domestic or personal use for ovens
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements

Definitions

  • the present invention relates to an LED (light emitting diode) lamp and a cooking device provided with the same.
  • JP 2010-56059 A Patent Document 1
  • This LED lamp includes a substrate on which a light emitting diode element is mounted, and a heat sink on which the substrate is mounted.
  • the upper surface of the substrate and the heat sink, that is, the substrate side is covered with a substantially hemispherical transparent member, and the space between the transparent member and the heat sink is sealed.
  • a connection terminal is attached to the lower surface of the heat sink, that is, the side opposite to the substrate side via an insulating portion made of synthetic resin.
  • the heat sink has a shape in which the upper surface is a flat surface, the lower surface is a concave surface, the contour of the side surface is a part of a rotating hyperboloid, and the heat radiation fins project radially.
  • an insertion hole is provided in the center of the heat sink, and the light emitting diode element and the connection terminal are electrically connected by a wiring inserted through the insertion hole.
  • heat generated from the light emitting diode element is radiated into the air from the radial heat radiation fins of the heat sink.
  • an object of the present invention is to provide an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life, and a cooking device equipped with the LED lamp.
  • the present inventors pay attention to the presence of metal plates such as housings and cases in devices that generate high-temperature atmospheres such as heating cookers, video equipment, welding devices, heat treatment devices, and furnaces. We have intensively studied whether it can be used effectively for heat dissipation without interfering with the lamp illumination ability.
  • the inventor of the present invention invented an LED lamp that can use the metal plate very effectively for heat dissipation without impeding the illumination capability.
  • the LED lamp of the present invention is A substrate, A light-emitting diode element mounted on the first surface of the substrate; A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate; A heat sink having a flat adhesion plane in close contact with the second surface opposite to the first surface of the substrate, and a flat heat radiation plane provided on the opposite side of the adhesion plane;
  • the heat sink includes an extension direction of the heat radiation plane of the heat sink or an oblique direction with respect to the extension direction and a connection terminal electrically connected to the light emitting diode element.
  • the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the adhesion plane of the heat sink.
  • the contact flat surface of the heat sink is a flat surface in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the heat sink can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the heat sink through the substrate.
  • the heat dissipation plane of the heat sink is flat, and thus the high temperature atmosphere is generated.
  • the heat sink flat surface of the heat sink can be easily brought into close contact with the surface of the metal plate of the device, and the heat sink is a simple flat plate on the second surface side, that is, the back surface side of the substrate and on the light emitting diode element emission side. Therefore, the contact area between the heat radiation flat surface of the heat sink and the surface of the metal plate can be increased with a simple and compact structure without impeding the illumination capability.
  • the heat sink can efficiently dissipate heat from the light emitting diode element by heat conduction to the metal plate that directly contacts the heat sink.
  • the metal plate is, for example, a casing or a housing, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, this LED lamp can be used in a high temperature atmosphere and has a long life.
  • connection terminal since the connection terminal extends in the extending direction of the heat radiation plane of the heat sink or in an oblique direction with respect to the extension direction, the connection terminal should not be interposed between the surface of the metal plate and the heat radiation plane of the heat sink. it can.
  • the connecting terminal extends in an oblique direction with respect to the extending direction of the heat radiation plane of the heat sink where the connecting terminal is in close contact with the metal plate or the extending direction, the connecting terminal is not easily detached by a reaction force from the metal plate.
  • the LED lamp of the present invention has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
  • a thickness which is a dimension between the adhesion plane of the heat sink and the heat radiation plane, is smaller than the vertical and horizontal dimensions of the heat sink.
  • the “vertical dimension” refers to the long side of the outline with the outline of the heat radiation plane being substantially rectangular, and the “lateral dimension” refers to the short side of the outline.
  • the heat radiation plane and the contact plane are parallel because the structure becomes simple.
  • the contact plane 1021 and the heat radiation plane may not be parallel to 1022 but may be inclined.
  • the thickness dimension between the contact plane 1021 and the heat radiation plane 1022 refers to the dimension D between the central points in the tilt direction.
  • the inclination angle of the contact flat surface 1021 is exaggerated and increased.
  • the thickness which is the dimension between the adhesion plane and the heat radiation plane of the heat sink, is smaller than the vertical and horizontal dimensions of the heat sink, the heat radiation path between the adhesion plane and the heat radiation plane is Shorter. Therefore, the heat sink can quickly dissipate heat by quickly transferring heat from the light emitting diode element to the heat radiation plane.
  • the light emitting diode element and the connection terminal are connected by wiring on the substrate that passes outside without passing through the inside of the heat sink.
  • the light emitting diode element and the connection terminal are connected by the wiring on the substrate that passes outside without passing through the inside of the heat sink, it is possible to prevent the heat dissipation path of the heat sink from being reduced. it can.
  • the heat sink is provided with an insertion hole as in the conventional example, and the light emitting diode element and the connection terminal are electrically connected by the wiring inserted through the insertion hole, the heat dissipation path of the heat sink is equivalent to the insertion hole. It will be less.
  • the LED lamp of one embodiment is An attachment member insulated from the connection terminal is provided.
  • the LED lamp can be fixed by the mounting member so that the heat radiation plane is in close contact with the metal plate.
  • the attachment destination of the attachment member is a metal
  • the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
  • the mounting member is a mounting plate that extends in a direction intersecting the extending direction of the connection terminal in the vicinity of the connection terminal and has a mounting hole.
  • the mounting plate when, for example, a screw inserted into the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the mounting plate intersects the direction in which the connection terminal extends in the vicinity of the connection terminal.
  • the connection terminal is fixed to the connection destination by tightening a screw
  • the LED lamp is fixed in two directions, that is, the fixing direction by the connection terminal and the fixing direction by the mounting plate. It has the advantage of being difficult.
  • the heating cooker of the present invention is A casing, A heating chamber provided in the casing and containing an object to be heated;
  • the LED lamp of the present invention that is disposed between the casing and the heating chamber and illuminates the heating chamber,
  • the heat radiation plane of the heat sink of the LED lamp is in close contact with a metal plate.
  • the cooking device of the present invention is A casing, A heating chamber provided in the casing and containing an object to be heated; An LED lamp disposed between the casing and the heating chamber and illuminating the heating chamber; A metal attached portion to which the LED lamp is attached;
  • the LED lamp is A substrate having a first surface on the heating chamber side and a flat second surface on the opposite side of the heating chamber;
  • a light emitting diode element mounted on the first surface of the substrate;
  • a transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
  • the attached portion has a flat contact plane that is in close contact with the second surface of the substrate.
  • the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the contact flat surface of the mounted portion.
  • the contact flat surface of the attached portion is a flat surface that is in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the attached portion can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the mounted portion through the substrate.
  • the mounted portion is on the second surface side, that is, the back surface side of the substrate, and not on the light emitting diode element emission side. Therefore, the illumination capability of the LED lamp does not decrease.
  • the LED lamp does not have a reduced illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
  • the life of the LED lamp can be extended, the number of replacement of the LED lamp is reduced, and the running cost can be reduced.
  • connection terminal extends in the extending direction of the second surface of the substrate or in an oblique direction with respect to the extending direction, the connection terminal does not enter between the second surface of the substrate and the contact flat surface of the attached portion.
  • the substrate receives a reaction force in a direction perpendicular to the extending direction of the second surface from the mounted portion, but the connection terminal is inclined with respect to the extending direction of the second surface of the substrate or the extending direction thereof. Therefore, the connection terminal is difficult to come off due to the reaction force.
  • the LED lamp includes a mounting member that is insulated from the connection terminal.
  • the LED lamp since the LED lamp includes an attachment member, the LED lamp can be attached to the attachment portion so that the second surface of the substrate is in close contact with the contact flat surface of the attachment portion.
  • the attachment destination of the attachment member is a metal
  • the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
  • the attachment member is an attachment plate extending in the extending direction of the second surface of the substrate and having an attachment hole.
  • the second surface of the substrate extends in the extending direction. Can be pressed against the mounted portion. Therefore, the adhesion force between the second surface of the substrate and the adhesion plane of the attached portion can be increased.
  • the mounting plate is a part of the substrate.
  • the mounting member is a part of the substrate, the number of parts can be reduced.
  • the mounted portion is a part of the mounting bracket of the LED lamp.
  • the mounted portion is a part of the mounting bracket of the LED lamp, the surface area of the mounting bracket is large, and the cooling capacity of the LED lamp can be increased.
  • the attached portion is a part of the casing.
  • the attached portion is a part of the casing, the surface area of the casing is further increased, and the cooling capacity of the LED lamp can be increased.
  • the light emitting diode element can be sufficiently cooled, and an LED lamp having a long life, simple, inexpensive and compact structure can be provided.
  • the cooking device of the present invention includes the LED lamp of the present invention, so that the number of replacement of the LED lamp is reduced, so that the running cost can be reduced.
  • the present invention it is possible to provide a cooking device equipped with an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life.
  • FIG. 1 is a schematic side view of an LED lamp according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
  • FIG. 3 is a schematic diagram for explaining the mounting state of the LED lamp of the first embodiment.
  • FIG. 4 is the perspective view seen from the front diagonally upper direction of the heating cooker of 2nd Embodiment of this invention.
  • FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker.
  • FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • FIG. 7 is a control block diagram of the cooking device.
  • FIG. 8 is a perspective view of the heating cooker with the door and the casing removed, as viewed from the rear and diagonally above.
  • FIG. 9 is a perspective view of the heating cooker with the door and casing removed, as viewed from the front and diagonally above.
  • FIG. 10 is a schematic view of an upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above.
  • FIG. 11 is a schematic diagram of a longitudinal section viewed from the line XI-XI in FIG.
  • FIG. 12 is a schematic diagram of a main part of an LED lamp according to an embodiment of the present invention.
  • FIG. 13 is a schematic side view of an LED lamp according to a third embodiment of the present invention.
  • FIG. 14 is the perspective view seen from the front diagonally upper direction of the heating cooker of the said 3rd Embodiment.
  • FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker according to the third embodiment.
  • FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the heating cooker according to the third embodiment.
  • FIG. 17 is a control block diagram of the cooking device.
  • FIG. 18 is a perspective view of the heating cooker with the door and casing removed, as viewed from the upper rear side.
  • FIG. 19 is a perspective view of the heating cooker with the door and casing removed, as seen from the front and obliquely above.
  • FIG. 20 is a schematic view of the upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above.
  • FIG. 21 is a schematic view taken along line XXI-XXI in FIG. FIG.
  • FIG. 22 is a schematic view of the LED lamp attached to the frame as viewed from the connection terminal side.
  • FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
  • FIG. 1 is a schematic view of an LED lamp 1 according to a first embodiment of the present invention as viewed from the side.
  • the LED lamp 1 includes a substantially rectangular aluminum heat sink 2 as an example of a heat sink, a glass epoxy substrate 3 as an example of a substrate, and two light emitting diode elements 4 (only one is visible in FIG. 1). ) Of substantially rectangular plate-like connection terminals 5, 5, a substantially rectangular plate-like attachment plate 6 as an example of an attachment member, a cover glass 7 as an example of a transparent or translucent member, and a metal base 8. And.
  • the aluminum heat sink 2 has a flat adhesion plane 21 and a flat heat radiation plane 22 on the opposite side of the adhesion plane 21.
  • the thickness of the aluminum heat sink 2 (the dimension between the contact plane 21 and the heat radiation plane 22) is smaller than the vertical and horizontal dimensions of the aluminum heat sink 2.
  • the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed. Further, the contact plane 21 and the heat radiation plane 22 are substantially parallel to each other.
  • the vertical dimension of the aluminum heat sink 2 corresponds to the horizontal dimension in FIG.
  • the horizontal dimension of the aluminum heat sink 2 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
  • the light emitting diode element 4 is mounted on the first surface 31 of the glass epoxy substrate 3.
  • the flat contact surface 21 of the heat sink 2 is in close contact with the second surface 32 opposite to the first surface 31 of the glass epoxy substrate 3.
  • the glass epoxy substrate 3 is provided with wiring 33 for supplying current from the connection terminals 5 and 5 to the light emitting diode element 4. That is, the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes outside without passing through the inside of the aluminum heat sink 2. Further, the connection terminal 5, 5 side portion of the glass epoxy substrate 3 is inserted into the base 8. The remaining part of the glass epoxy substrate 3 is covered with a cover glass 7.
  • the light emitting diode element 4 is attached to the first surface 31 of the glass epoxy substrate 3.
  • the light emitting diode element 4 is hermetically sealed with a phosphor 9. This phosphor 9 converts the wavelength of the light emitted from the light emitting diode element 4.
  • the cover glass 7 covers the light emitting diode element 4 and a part of the first surface 31 side of the glass epoxy substrate 3.
  • the space in the cover glass 7 is a sealed space so that outside gas does not enter the cover glass 7.
  • the cover glass 7 is made of a material that transmits the light whose wavelength is converted by the phosphor 9.
  • connection terminals 5 and 5 are provided behind the aluminum heat sink 2 and extend in the extending direction of the heat radiation plane 22.
  • a through hole 13 is provided at the tip of each of the connection terminals 5 and 5.
  • the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5. A space between the base 8 and the connection terminals 5 and 5 is sealed with a heat-resistant sealing resin 10.
  • FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
  • the mounting plate 6 is insulated from the connection terminals 5 and 5 by the sealing resin 10. Further, the mounting plate 6 extends in a direction intersecting the extending direction of the connection terminals 5 and 5 in the vicinity of the connection terminals 5 and 5. The extending direction of the mounting plate 6 is substantially parallel to the heat radiation plane 22. Further, a mounting hole 14 penetrating the mounting plate 6 is provided at the tip of the mounting plate 6, and a screw (not shown) for fixing the position of the LED lamp 1 is inserted into the mounting hole 14.
  • the heat generated from the light emitting diode element 4 is transmitted to the first surface 31 of the glass epoxy substrate 3, and the adhesion plane of the aluminum heat sink 2 from the second surface 32 of the glass epoxy substrate 3. It is transmitted to 21.
  • the contact flat surface 21 of the aluminum heat sink 2 is a flat surface that is in close contact with the second surface 32 of the glass epoxy substrate 3, the second surface 32 of the glass epoxy substrate 3 and the contact flat surface 21 of the aluminum heat sink 2 are The contact area can be increased. Therefore, the heat of the light emitting diode element 4 can be efficiently transferred to the aluminum heat sink 2 through the glass epoxy substrate 3.
  • the heat radiation plane 22 of the aluminum heat sink 2 is flat as shown in FIG. 22 can be easily adhered, and the aluminum heat sink 2 has a simple flat plate shape on the second surface 32 side, that is, the back surface side of the glass epoxy substrate 3, and is not on the light emission side of the light emitting diode element 4.
  • the contact area between the heat radiation plane 22 of the aluminum heat sink 2 and the surface 51 of the metal plate 15 can be increased with a simple and compact structure without impeding the ability. Therefore, the aluminum heat sink 2 can efficiently release the heat from the light emitting diode element 4 to the metal plate 15 in direct contact with the aluminum heat sink 2 by heat conduction.
  • the metal plate 15 is, for example, a casing or a housing of the video equipment, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, the LED lamp 1 can be used in a high temperature atmosphere and has a long life.
  • connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2, the connection terminals 5 and 5 are interposed between the surface 51 of the metal plate 15 and the heat radiation plane 22 of the aluminum heat sink 2. You can avoid it.
  • connection terminals 5, 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2 that is in close contact with the metal plate 15. , 5 can be prevented from coming off.
  • the LED lamp 1 has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element 4 even in a high temperature atmosphere of the video equipment, and can extend the life. .
  • the aluminum heat sink 2 has a smaller dimension between the contact plane 21 and the heat radiation plane 22 than the vertical and horizontal dimensions, the heat radiation path between the contact plane 21 and the heat radiation plane 22 is shortened. Therefore, the aluminum heat sink 2 can quickly dissipate heat by quickly transferring the heat from the light emitting diode element 4 to the heat radiation plane 22.
  • the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes through the outside without passing through the inside of the aluminum heat sink 2, the heat dissipation path of the aluminum heat sink 2 is It can be prevented from becoming less.
  • the aluminum heat sink 2 is provided with an insertion hole and the light emitting diode element 4 and the connection terminals 5 and 5 are electrically connected by the wiring inserted into the insertion hole as in the conventional example, The heat radiation path is reduced by the amount of the insertion hole.
  • the LED lamp 1 when attaching the heat radiation plane 22 of the aluminum heat sink 2 to the metal plate 15, the LED lamp 1 can be fixed in a state where the heat radiation plane 22 of the aluminum heat sink 2 is in close contact with the metal plate 15.
  • connection terminals 5 and 5 can be pressed against the connection destination by tightening the screws. Therefore, it is possible to make it difficult for the connection terminals 5 and 5 to be disconnected from the connection destination.
  • the LED lamp 1 when, for example, a screw inserted through the mounting hole of the mounting plate 6 is tightened and the mounting plate 6 is mounted to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5 in the direction in which the connection terminals 5 and 5 extend.
  • the LED lamp 1 has two directions: a fixing direction by the connection terminals 5 and 5 and a fixing direction by the mounting plate 6. Fixed to. Therefore, the LED lamp 1 has an advantage that it is difficult to drop off.
  • the mounting plate 6 is insulated from the connection terminals 5 and 5, so that adverse effects on the energization of the connection terminals 5 and 5 can be prevented. Can do.
  • the cover glass 7 transmits the light whose wavelength is converted by the phosphor 9, the light can be taken out from the cover glass 7.
  • the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed, it is possible to prevent the heat radiation performance of the aluminum heat sink 2 from being deteriorated.
  • the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5, the mechanical strength can be increased.
  • the metal plate 15 may be a metal plate such as a housing or a case of a device that generates a high-temperature atmosphere such as a heating cooker, a washing / drying machine, a welding device, a heat treatment device, and a furnace.
  • a heat sink made of a metal other than aluminum for example, copper
  • a heat sink made of a material may be used.
  • the said material has a heat resistant thing.
  • connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2.
  • connection terminals 5 and 5 extend in the extending direction of the heat dissipation plane 22 of the aluminum heat sink 2. May extend in an oblique direction.
  • the contact plane 21 is substantially parallel to the heat dissipation plane 22, but the contact plane 21 may be an inclined surface that is inclined with respect to the heat dissipation plane 22.
  • the glass epoxy substrate 3 may be in direct contact with the adhesion plane 21 of the aluminum heat sink 2 or the glass epoxy substrate 3 may be in indirect contact with the adhesion plane 21 of the aluminum heat sink 2.
  • the glass epoxy substrate 3 may be attached to the adhesion flat surface 21 of the aluminum heat sink 2 via a thin adhesive film.
  • the rear end portion of the mounting plate 6 may be thermally connected to both the aluminum heat sink 2 and the glass epoxy substrate 3 or may be thermally connected only to the aluminum heat sink 2. Alternatively, it may be thermally connected only to the glass epoxy substrate 3.
  • a semiconductor substrate for example, a semiconductor substrate, a ceramic substrate, a metal substrate, or the like may be used instead of the glass epoxy substrate 3 of the first embodiment.
  • FIG. 4 is the figure which looked at the front of the heating cooker of 2nd Embodiment of this invention from diagonally upward.
  • the said heating cooker is provided with the LED lamp 1 of the said 1st Embodiment
  • “left” indicates the left when the cooking device is viewed from the front (door 102) side
  • “right” indicates the right when the cooking device is viewed from the front (door 102) side. Point to.
  • a door 102 is attached to the front surface of the rectangular parallelepiped casing 101 so as to rotate about the lower end side.
  • a handle 103 is attached to the upper part of the door 102, and a heat resistant glass 104 is attached to the approximate center of the door 102.
  • An operation panel 105 is provided on the right side of the door 102.
  • the operation panel 105 includes a liquid crystal display unit 106 and an operation button group 107 operated by a user.
  • An exhaust port cover 108 having an exhaust port 108a is provided on the upper side of the casing 101 and on the right rear side.
  • a dew receiving device 109 is detachably attached to a lower portion of the front surface of the casing 101 (a portion below the door 102).
  • FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker.
  • FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • a heating chamber 110 in which the object to be heated 123 can be accommodated together with the tray 190.
  • a water supply tank 111 that is detachably inserted from the front side is disposed on the right side of the heating chamber 110.
  • a steam generator 112 connected to the water supply tank 111 is disposed on the rear surface side of the water supply tank 111.
  • One end of a steam supply passage 113 is connected to the steam generator 112, and the other end of the steam supply passage 113 is connected to the circulation unit 114.
  • the steam generator 112 has a heater (not shown), and the water supplied from the water supply tank 111 is heated by the heater to generate saturated steam.
  • the saturated steam generated by the steam generator 112 is supplied from the steam supply port 113 a to the downstream side of the suction port 128 in the circulation unit 114 through the steam supply passage 113.
  • the steam supply port 113 a of the steam supply passage 113 is disposed in the vicinity of the suction port 128 in the circulation unit 114. Further, a circulation fan 118 is disposed in the circulation unit 114 so as to face the suction port 128. The circulation fan 118 is driven by a circulation fan motor 119.
  • a steam duct 180 bent in an L shape is attached to the upper and left sides of the heating chamber 110.
  • the steam duct 180 is fixed to the first duct portion 181 fixed to the upper wall of the heating chamber 110, the bent portion 182 bent from the left side to the lower side of the first duct portion 181, and the left wall of the heating chamber 110.
  • a second duct portion 183 connected to the first duct portion 181 through the bent portion 182.
  • a heater 121 made of a sheathed heater or the like is housed in the first duct portion 181 of the steam duct 180.
  • the first duct portion 181 and the heater 121 constitute a superheated steam generator.
  • the superheated steam generator may be provided separately from the steam duct.
  • a steam supply port 114 a provided on the upper portion of the circulation unit 114 is connected to the right end of the first duct portion 181, and the inside of the first duct portion 181 communicates with the circulation unit 114.
  • a plurality of first steam outlets 124 are provided on the top surface of the heating chamber 110, and the space in the first duct portion 181 of the steam duct 180 is inside the heating chamber 110 via the first steam outlet 124.
  • the second duct portion 183 of the steam duct 180 communicates with the inside of the heating chamber 110 via a plurality of second steam outlets 125 provided on the left side surface of the heating chamber 110.
  • the gap between the heating chamber 110 and the steam duct 180 is sealed with a heat resistant resin or the like.
  • the heating chamber 110 and the steam duct 180 are covered with a heat insulating material except for the front opening of the heating chamber 110.
  • the circulation path of the heat medium is formed by the circulation unit 114, the steam duct 180, the heating chamber 110, and the connection member connecting them. Then, saturated steam generated by the steam generator 112 is supplied to the boundary portion of the circulation unit 114 with the heating chamber 110 in this circulation path.
  • the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
  • a magnetron 120 is disposed in the space below the heating chamber 110.
  • the microwave generated in the magnetron 120 is guided to the lower center of the heating chamber 110 by a waveguide (not shown), and radiates upward in the heating chamber 110 while being stirred by a rotating antenna (not shown).
  • a rotating antenna not shown.
  • the article to be heated 123 is heated.
  • the article to be heated 123 is placed on the bottom of the heating chamber 110.
  • a suction port 128 is provided in the center of the right side wall of the heating chamber 110.
  • the right side wall of the heating chamber 110 is provided with an air supply port 133 (shown in FIG. 9) located on the front side of the suction port 128 and a first exhaust port 136 located on the rear side of the suction port 128. ing.
  • the air supply port 133 is located in the vicinity of the door 102, and the outside air blown into the heating chamber 110 from the air supply port 133 flows along the door 102.
  • a second exhaust port 137 having an opening area smaller than that of the first exhaust port 136 is provided on the lower right side of the rear side wall surface of the heating chamber 110.
  • a circulation fan motor 119 for driving the circulation fan 118 is attached to the circulation unit 114 disposed on the right side surface of the heating chamber 110. Steam and air in the heating chamber 110 are sucked from the suction port 128 by the circulation fan 118 and blown into the heating chamber 110 from the first and second steam outlets 124 and 125 through the steam duct 180. Further, an indoor temperature sensor 129 for detecting the temperature of the heat medium (air containing steam) in the heating chamber 110 is disposed in the vicinity of the suction port 128 of the circulation unit 114.
  • the object 123 to be heated in the heating chamber 110 is heated by the radiant heat of the heater 121 disposed in the first duct portion 181 of the steam duct 180. Moreover, the heating medium (air containing steam) passing through the steam duct 180 is heated by the heater 121, and the heated heating medium is blown out from the first and second steam outlets 124 and 125. Thereby, the heat medium in the heating chamber 110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 110 can be further heated by the heater 121 to generate superheated steam at 100 ° C. or higher.
  • the cooling fan part 122, the electrical component 117, and the magnetron 120 are disposed below the casing 101.
  • an air duct 131 is disposed on the right side of the heating chamber 110 in the casing 101.
  • the blower duct 131 houses therein a dilution fan 130 and a dilution fan motor 138 that drives the dilution fan 130.
  • the cooling fan unit 122 includes a cooling fan 115 and a cooling fan motor 116 that drives the cooling fan 115.
  • the electrical component 117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like.
  • the cooling fan 115 takes outside air into the casing 101 and cools the electrical component 117 and the magnetron 120 that generate heat. A part of the outside air that has flowed into the casing 101 by the cooling fan 115 is guided into the air duct 131 by the dilution fan 130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 101 and the like. ) To the outside.
  • a first exhaust duct 134 connected to the right side wall of the heating chamber 110 from a first exhaust port 136 via an exhaust damper (not shown) is disposed.
  • the first exhaust duct 134 has a lateral passage 134a extending in the lateral direction and a longitudinal passage 134b bent upward from the lateral passage 134a.
  • An exhaust port cover 108 is detachably attached to the upper end of the vertical passage 134b.
  • a suction port (not shown) for sucking outside air through a suction duct 127 is provided on the back side of the lateral passage 134a of the first exhaust duct 134.
  • the exhaust damper is controlled so that either one of the suction port or the first exhaust port 136 is alternatively selected and connected to the first exhaust duct 134.
  • the exhaust damper is driven by an exhaust damper motor 160 (shown in FIG. 7).
  • the vertical passage 134b of the first exhaust duct 134 is connected to the exhaust port cover 108 with the flow passage area enlarged toward the upper side.
  • An exhaust port 108 a that opens forward is formed in the upper portion of the exhaust port cover 108.
  • the lower end of the second exhaust duct 135 is connected to the second exhaust port 137, and the upper end of the second exhaust duct 135 is connected to the lower side of the vertical passage 134b of the first exhaust duct 134.
  • the distribution area of the second exhaust duct 135 is smaller than that of the first exhaust duct 134.
  • the exhaust from the second exhaust port 137 flows into the first exhaust duct 134 via the second exhaust duct 135 and is discharged to the outside from the exhaust port 108 a of the exhaust port cover 108.
  • the air duct 131 on the side of the heating chamber 110 includes a dilution fan housing part 131a, a vertical passage 131b extending upward from the dilution fan 130, a horizontal passage 131c bent from the vertical passage 131b to the rear side, and a horizontal passage 131b.
  • the nozzle portion 131d is bent upward from the passage 131c.
  • the lateral passage 131c and the nozzle portion 131d are inserted into the first exhaust duct 134.
  • An opening 131e is provided at the upper end of the nozzle portion 131d of the air duct 131.
  • an ejector is formed in the first exhaust duct 134, and the dilution fan 130 generates an air flow from the first exhaust port 136 toward the exhaust port 108a.
  • a recess is formed in the horizontal passage 131c of the blower duct 131 so as to be recessed below the lower end of the connection portion with the vertical passage 131b, and a sub nozzle portion that opens into the first exhaust duct 134 at one end of the recess. 131f is formed.
  • one end of the air supply passage 132 is connected to the upper part of the vertical passage 131b of the air duct 131, and the other end of the air supply passage 132 is connected to the air supply damper 140.
  • the air supply passage 132 and the air supply damper 140 are part of an air supply mechanism for supplying air to the heating chamber 110 via the air supply port 133 by the dilution fan 130.
  • a thawing sensor 150 is disposed near and below the air inlet 133 of the heating chamber 110.
  • the air supply damper 140 has a heat-resistant resin damper body 141 for opening and closing the air supply port 133 and a heat-resistant resin housing 142 covering the damper body 141.
  • FIG. 7 is a control block diagram of the heating cooker.
  • the heating cooker includes a control unit 200 including a microcomputer and an input / output circuit in the electrical component 17 (shown in FIGS. 5 and 6).
  • the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, an air supply damper motor 144, an exhaust damper motor 160, an operation panel 105, an indoor temperature sensor 129, and thawing.
  • the sensor 150, the feed water pump 170, the steam generator 112, and the magnetron 120 are connected.
  • the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, It controls the air damper motor 144, the exhaust damper motor 160, the operation panel 105, the water supply pump 170, the steam generator 112, the magnetron 120, and the like.
  • FIG. 8 is a perspective view of the rear surface of the cooking device in a state where the door 102 and the casing 101 are removed as viewed obliquely from above.
  • FIG. 9 is the perspective view which looked at the front of the heating cooker in the state which removed the said door 102 and the casing 101 from diagonally upward.
  • a front panel 126 is provided on the front side of the heating chamber 110.
  • the front panel 126 has an insertion port 126a for inserting a water supply tank 111 (shown in FIG. 6) on the right side.
  • upper tray receiving portions 151 a and 151 b, middle tray receiving portions 152 a, 152 b and 152 c and a lower tray receiving portion 153 are provided on the inner surface of the right side wall of the heating chamber 110.
  • a sensor unit 150a of the thawing sensor 150 is disposed between the middle tray receiving units 152a and 152b.
  • FIG. 10 is a schematic view of the upper portion of the front panel 126 and a portion in the vicinity thereof as viewed obliquely from above.
  • a frame body 16 formed of a steel plate is disposed between the first duct part 181 of the steam duct 180 and the upper part of the front panel 126.
  • a mounted portion 17 is provided on the right side of the frame body 16, and the mounting plate 6 of the LED lamp 1 is fixed to the mounted portion 17 with screws 19.
  • the flange portions 18 and 18 provided at the lower portion of the frame body 16 are fixed to the upper wall of the heating chamber 110 with screws (not shown).
  • FIG. 11 is a schematic view taken along line XI-XI in FIG.
  • the heat radiation plane 22 of the aluminum heat sink 2 of the LED lamp 1 is in close contact with the upper portion of the frame body 16. Further, a plurality of punching holes 20, 20,... Facing the LED lamp 1 are provided on the upper wall of the heating chamber 110. The light emitted from the LED lamp 1 enters the heating chamber 110 through a plurality of punching holes 20, 20,. Moreover, the glass plate 24 is arrange
  • the heating cooker having the above configuration heats the article to be heated 123 with superheated steam
  • superheated steam at 100 ° C. or higher generated by the heater 121 is heated from the plurality of first steam outlets 124 and second steam outlets 125. 110 is supplied. Therefore, the ambient temperature of the first duct portion 181 that houses the heater 121 is 80 ° C. to 100 ° C.
  • the LED lamp 1 is arranged in such a high temperature environment, the heat of the light emitting diode element 4 can be released to the frame body 16 through the aluminum heat sink 2 with very high efficiency. Can be suppressed. Therefore, since the lifetime of the light emitting diode element 4 can be extended, it is not necessary to frequently replace the LED lamp 1. As a result, the running cost of the cooking device can be reduced.
  • a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 16 of the second embodiment.
  • Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
  • healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like.
  • superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food.
  • the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation.
  • the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
  • FIG. 13 is the schematic diagram which looked at the LED lamp 2001 with which the heating cooker of 3rd Embodiment of this invention is provided from the side.
  • the LED lamp 2001 includes a glass epoxy substrate 2002 as an example of a substrate, a light emitting diode element 2003, two (only one is visible in FIG. 13) connection terminals 2004 and 2004, and a transparent terminal.
  • a cover glass 2005 as an example of a translucent member and a metal base 2006 are provided.
  • the glass epoxy substrate 2002 has a first surface 2021 directed to the heating chamber 2110 described later, and a flat second surface 2022 directed to the opposite side of the heating chamber 2110, and the vertical dimension is horizontal. It is longer than the dimensions. Further, the thickness of the glass epoxy substrate 2002 (the dimension between the first surface 2021 and the second surface 2022) is substantially constant, and is smaller than the vertical and horizontal dimensions of the glass epoxy substrate 2002.
  • the glass epoxy substrate 2002 is provided with wiring 2023 for supplying current from the connection terminals 2004 and 2004 to the light emitting diode element 2003. That is, the light emitting diode element 2003 and the connection terminals 2004 and 2004 are connected via the wiring 2023 on the glass epoxy substrate 2002.
  • a part of the glass epoxy board 2002 on the side of the connection terminals 2004 and 2004 is inserted into the base 2006. On the other hand, most of the remaining part of the glass epoxy substrate 2002 is covered with a cover glass 2005. Note that the vertical dimension of the glass epoxy substrate 2002 corresponds to the horizontal dimension in FIG. Further, the horizontal dimension of the glass epoxy substrate 2002 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
  • a part of the glass epoxy substrate 2002 opposite to the base 2006 is a mounting portion 2024 having a substantially rectangular plate shape as an example of a mounting plate.
  • the attachment portion 2024 protrudes from the cover glass 2005 and extends in the extending direction of the second surface 2022 of the glass epoxy substrate 2002.
  • the mounting portion 2024 is provided with a mounting hole 2025 through which a screw 2010 (shown in FIG. 21) is inserted. Further, the mounting portion 2024 is insulated from the connection terminals 2004 and 2004.
  • the light emitting diode element 2003 is attached to the first surface 2021 of the glass epoxy substrate 2002.
  • the light emitting diode element 2003 is hermetically sealed with a phosphor 2007.
  • the phosphor 2007 is for converting the wavelength of light emitted from the light emitting diode element 2003.
  • the cover glass 2005 covers a part of the first surface 2021 side of the glass epoxy substrate 2002 and the light emitting diode element 2003.
  • the space in the cover glass 2005 is a sealed space so that external gas does not enter the cover glass 2005.
  • the cover glass 2005 transmits light whose wavelength has been converted by the phosphor 2007.
  • connection terminals 2004 and 2004 are provided behind the glass epoxy substrate 2002 and extend in the extending direction of the heat radiation plane 2022.
  • a through hole 2041 is provided at the tip of each of the connection terminals 2004 and 2004.
  • the base 2006 is provided between the cover glass 2005 and the connection terminals 2004 and 2004. A space between the base 2006 and the connection terminals 2004 and 2004 is sealed with a heat-resistant sealing resin 8.
  • FIG. 14 is a view of the front surface of the heating cooker as viewed obliquely from above.
  • “left” indicates the left when the cooking device is viewed from the front (door 2102) side
  • “right” indicates the right when the cooking device is viewed from the front (door 2102). Point to.
  • the heating cooker has a rectangular parallelepiped shape, and a door 2102 that rotates about the lower end side is attached to the front surface of a casing 2101 made of metal such as iron.
  • a handle 2103 is attached to the upper part of the door 2102, and a heat resistant glass 104 is attached to the approximate center of the door 2102.
  • An operation panel 2105 is provided on the right side of the door 2102.
  • the operation panel 2105 includes a liquid crystal display unit 106 and an operation button group 2107 operated by the user.
  • an exhaust port cover 2108 having an exhaust port 2108a is provided on the upper side of the casing 2101 and on the right rear side.
  • a dew receptacle 2109 is detachably attached to a lower part of the front surface of the casing 2101 (a part below the door 2102).
  • FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the cooking device.
  • FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
  • a heating chamber 2110 that can accommodate the object to be heated 2123 together with the tray 190.
  • This heating chamber 2110 has an opening on the front side, and the side, bottom and top surfaces are made of stainless steel plates.
  • a water supply tank 2111 is detachably inserted from the front side.
  • a steam generator 2112 connected to the water supply tank 2111 is disposed on the rear surface side of the water supply tank 2111.
  • One end of a steam supply passage 2113 is connected to the steam generator 2112, and the other end of the steam supply passage 2113 is connected to the circulation unit 2114.
  • the steam generator 2112 has a heater (not shown), and heats the water supplied from the water supply tank 2111 with the heater to generate saturated steam.
  • the saturated steam generated by the steam generator 2112 is supplied from the steam supply port 2113a to the downstream side of the suction port 2128 in the circulation unit 2114 via the steam supply passage 2113.
  • the steam supply port 2113 a of the steam supply passage 2113 is disposed in the vicinity of the suction port 2128 in the circulation unit 2114. Further, a circulation fan 2118 is disposed in the circulation unit 2114 so as to face the suction port 2128.
  • a steam duct 2180 bent in an L shape is attached to the upper surface and the left side surface of the heating chamber 2110.
  • the steam duct 2180 is fixed to the first duct portion 2181 fixed to the upper wall of the heating chamber 2110, the bent portion 182 bent from the left side of the first duct portion 2181 to the lower side, and the left wall of the heating chamber 2110.
  • a second duct portion 2183 connected to the first duct portion 2181 via the bent portion 182.
  • a heater 2121 made of a sheathed heater or the like is housed in the first duct portion 2181 of the steam duct 2180.
  • the first duct portion 2181 and the heater 2121 constitute a superheated steam generator.
  • the superheated steam generator may be provided separately from the steam duct.
  • a steam supply port 2114 a provided at the upper portion of the circulation unit 2114 is connected to the right end of the first duct portion 2181, and the inside of the first duct portion 2181 communicates with the circulation unit 2114.
  • a plurality of first steam outlets 2124 are provided on the top surface of the heating chamber 2110, and the space in the first duct portion 2181 of the steam duct 2180 is inside the heating chamber 2110 via the first steam outlet 2124.
  • the second duct portion 2183 of the steam duct 2180 communicates with the inside of the heating chamber 2110 through a plurality of second steam outlets 2125 provided on the left side surface of the heating chamber 2110.
  • the gap between the heating chamber 2110 and the steam duct 2180 is sealed with a heat resistant resin or the like.
  • the heating chamber 2110 and the steam duct 2180 are covered with a heat insulating material except for the opening on the front side of the heating chamber 2110.
  • the circulation path of the heat medium is formed by the circulation unit 2114, the steam duct 2180, the heating chamber 2110, and the connecting member that connects them. Then, saturated steam generated by the steam generator 2112 is supplied to a boundary portion of the circulation unit 2114 with the heating chamber 2110 in this circulation path.
  • the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
  • a magnetron 2120 is disposed in the space below the heating chamber 2110.
  • the microwave generated by the magnetron 2120 is guided to the lower center of the heating chamber 2110 by a waveguide (not shown), and radiates upward in the heating chamber 2110 while being stirred by a rotating antenna (not shown).
  • a rotating antenna not shown
  • the article to be heated 2123 is heated.
  • the object to be heated 2123 is placed on the bottom in the heating chamber 2110.
  • a suction port 2128 is provided at the center of the right side wall of the heating chamber 2110.
  • the right side wall of the heating chamber 2110 is provided with an air supply port 2133 (shown in FIG. 19) located on the front side of the suction port 2128 and a first exhaust port 2136 located on the rear side of the suction port 2128. ing.
  • the air supply port 2133 is located in the vicinity of the door 2102, and outside air blown out from the air supply port 2133 into the heating chamber 2110 flows along the door 2102.
  • a second exhaust port 2137 having an opening area smaller than that of the first exhaust port 2136 is provided on the lower right side of the rear side wall surface of the heating chamber 2110.
  • a circulation fan motor 2119 for driving the circulation fan 2118 is attached to the circulation unit 2114 disposed on the right side surface of the heating chamber 2110. Steam or air in the heating chamber 2110 is sucked from the suction port 2128 by the circulation fan 2118 and blown out from the first and second steam outlets 2124 and 2125 into the heating chamber 2110 via the steam duct 2180.
  • an indoor temperature sensor 2129 that detects the temperature of the heat medium (air containing steam) in the heating chamber 2110 is disposed in the vicinity of the suction port 2128 of the circulation unit 2114.
  • the object to be heated 2123 in the heating chamber 2110 is heated by the radiant heat of the heater 2121 disposed in the first duct portion 2181 of the steam duct 2180. Further, the heating medium (air containing steam) passing through the steam duct 2180 is heated by the heater 2121, and the heated heating medium is blown out from the first and second steam outlets 2124 and 2125. Thereby, the heat medium in the heating chamber 2110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 2110 can be further heated by the heater 2121 to generate superheated steam at 100 ° C. or higher.
  • the cooling fan portion 2122, the electrical component 2117, and the magnetron 2120 are disposed on the lower side of the casing 2101. Further, an air duct 2131 is disposed on the right side of the heating chamber 2110 in the casing 2101. The air duct 2131 houses therein a dilution fan 2130 and a dilution fan motor 2138 that drives the dilution fan 2130.
  • the cooling fan unit 2122 includes a cooling fan 2115 and a cooling fan motor 2116 that drives the cooling fan 2115.
  • the electrical component 2117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. Further, the cooling fan 2115 takes outside air into the casing 2101 and cools the electrical component 2117 and the magnetron 2120 that generate heat. Further, a part of the outside air flowing into the casing 2101 by the cooling fan 2115 is guided into the air duct 2131 by the dilution fan 2130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 2101 or the like. ) To the outside.
  • a first exhaust duct 2134 connected to the right side wall of the heating chamber 2110 from the first exhaust port 2136 via an exhaust damper (not shown) is disposed.
  • the first exhaust duct 2134 has a lateral passage 2134a extending in the lateral direction and a longitudinal passage 2134b bent upward from the lateral passage 2134a.
  • An exhaust port cover 2108 is detachably attached to the upper end of the vertical passage 2134b.
  • a suction port (not shown) for sucking outside air through a suction duct 2127 is provided on the back side of the lateral passage 2134a of the first exhaust duct 2134.
  • the exhaust damper is controlled so that either one of the suction port or the first exhaust port 2136 is alternatively selected and connected to the first exhaust duct 2134.
  • the exhaust damper is driven by an exhaust damper motor 2160 (shown in FIG. 17).
  • the vertical passage 2134b of the first exhaust duct 2134 is connected to the exhaust port cover 2108 with the flow passage area enlarged toward the upper side.
  • An exhaust port 2108 a that opens forward is formed in the upper portion of the exhaust port cover 2108.
  • the lower end of the second exhaust duct 2135 is connected to the second exhaust port 2137, and the upper end of the second exhaust duct 2135 is connected to the lower side of the vertical passage 2134b of the first exhaust duct 2134.
  • the distribution area of the second exhaust duct 2135 is smaller than that of the first exhaust duct 2134.
  • the exhaust from the second exhaust port 2137 flows into the first exhaust duct 2134 via the second exhaust duct 2135 and is discharged to the outside from the exhaust port 2108a of the exhaust port cover 2108.
  • the air duct 2131 on the side of the heating chamber 2110 includes a dilution fan housing part 131a, a vertical passage 2131b extending upward from the dilution fan 2130, a horizontal passage 2131c bent from the vertical passage 2131b to the rear side, and a horizontal passage.
  • the nozzle portion 2131d is bent upward from the passage 2131c.
  • the lateral passage 2131c and the nozzle portion 2131d are inserted into the first exhaust duct 2134.
  • An opening 2131e is provided at the upper end of the nozzle portion 2131d of the air duct 2131.
  • an ejector is formed in the first exhaust duct 2134, and an air flow from the first exhaust port 2136 toward the exhaust port 2108 a is generated by the dilution fan 2130.
  • a concave portion is formed in the horizontal passage 2131c of the air duct 2131 so as to be recessed below the lower end of the connecting portion with the vertical passage 2131b, and a sub nozzle portion that opens into the first exhaust duct 2134 at one end of the concave portion. 2131f is formed.
  • one end of the air supply passage 2132 is connected to the upper part of the vertical passage 2131b of the air duct 2131, and the other end of the air supply passage 2132 is connected to the air supply damper 2140.
  • the air supply passage 2132 and the air supply damper 2140 are part of an air supply mechanism for supplying air to the heating chamber 2110 via the air supply port 2133 by the dilution fan 2130.
  • a thawing sensor 2150 is disposed near and below the air inlet 2133 of the heating chamber 2110.
  • the air supply damper 2140 includes a heat-resistant resin damper body 2141 for opening and closing the air supply opening 2133 and a heat-resistant resin housing 2142 for covering the damper body 2141.
  • FIG. 17 is a control block diagram of the heating cooker.
  • the heating cooker includes a control unit 2200 including a microcomputer and an input / output circuit in an electrical component 2117 (shown in FIGS. 15 and 16).
  • the control unit 2200 includes a heater 2121, a circulation fan motor 2119, a cooling fan motor 2116, a dilution fan motor 2138, a supply damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, an indoor temperature sensor 2129, and thawing.
  • a sensor 2150, a feed water pump 2170, a steam generator 2112 and a magnetron 2120 are connected.
  • control unit 2200 Based on signals from operation panel 2105 and detection signals from room temperature sensor 2129 and thawing sensor 2150, control unit 2200 includes heater 2121, circulation fan motor 2119, cooling fan motor 2119, dilution fan motor 2138, It controls an air damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, a water supply pump 2170, a steam generator 2112, a magnetron 2120, and the like.
  • FIG. 18 is a perspective view of the rear surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
  • FIG. 19 is a perspective view of the front surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
  • a front panel 2126 is provided on the front side of the heating chamber 2110.
  • the front panel 2126 has an insertion port 2126a for inserting a water supply tank 2111 (shown in FIG. 16) on the right side.
  • upper tray receiving portions 2151 a and 2151 b, middle tray receiving portions 2152 a, 2152 b and 2152 c, and a lower tray receiving portion 2153 are provided on the inner surface of the right side wall of the heating chamber 2110.
  • a sensor unit 2150a of the thawing sensor 2150 is disposed between the middle tray receiving units 2152a and 2152b.
  • FIG. 20 is a schematic view of the upper part of the front panel 2126 and the vicinity thereof as seen obliquely from above.
  • a steel frame 2009 as an example of a mounting bracket is disposed between the first duct portion 2181 of the steam duct 2180 and the upper part of the front panel 2126.
  • a thick part 2091 that is thicker than the other parts is provided as an example of an attached part on the upper part of the frame 2009.
  • flange portions 2092 and 2092 are provided in the lower portion of the frame body 2009.
  • the heating chamber 2110 has a gap between the thick portion 2091 and the upper wall of the heating chamber 2110 and is positioned above the plurality of punching holes 20111, 2011, ... and the glass plate 2012.
  • Flange portions 2092 and 2092 are fixed to the upper wall with screws (not shown).
  • FIG. 21 is a schematic diagram of a longitudinal section viewed from the XXI-XXI line of FIG.
  • FIG. 22 is a schematic view of the LED lamp 2001 attached to the frame 2009 as viewed from the connection terminals 2004 and 2004 side.
  • the LED lamp 2001 is attached to a frame 2009 as shown in FIGS. More specifically, the thick portion 2091 of the frame 2009 has a flat contact plane 2093 on the heating chamber 2110 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2093. . Further, the LED lamp 2001 is fixed to the frame body 2009 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply
  • a plurality of punching holes 2011, 2011,... Facing the LED lamp 2001 are provided on the upper wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2001 enters the heating chamber 2110 through the plurality of punching holes 20111, 2011,.
  • the glass plate 2012 is arrange
  • the light emitting diode element 2003 when the inside of the heating chamber 2110 is illuminated with the LED lamp 2001, the light emitting diode element 2003 generates heat.
  • the heat generated by the light emitting diode element 2003 is transmitted to the first surface 2021 of the glass epoxy substrate 2002, and is transmitted from the second surface 2022 of the glass epoxy substrate 2002 to the adhesion plane 2093 of the thick portion 2091 of the frame body 2009.
  • the second surface 2022 and the contact flat surface 2093 are both flat surfaces and are in close contact with each other, the contact area of the second surface 2022 with the contact flat surface 2093 is large. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the thick portion 2091 of the frame body 2009 through the glass epoxy substrate 2002.
  • the thick portion 2091 of the frame body 2009 is positioned on the LED lamp 2001. Then, since there is no space between the LED lamp 2001 and the upper wall of the heating chamber 2110, the light emitted from the LED lamp 2001 is not blocked by a part of the thick portion 2091 of the frame body 2009. That is, both high heat dissipation and high luminance of the LED lamp 2001 can be achieved.
  • the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
  • the life of the LED lamp 2001 can be extended, the number of replacements of the LED lamp 2001 is reduced, and the running cost can be reduced.
  • connection terminals 2004 and 2004 extend in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, the connection terminals 2004 and 2004 can be prevented from being interposed between the second surface 2022 and the contact plane 2093.
  • the glass epoxy substrate 2002 receives a reaction force in the direction perpendicular to the extending direction of the second surface 2022 from the thick portion 2091, but the connection terminals 2004 and 2004 extend from the second surface 2022 of the glass epoxy substrate 2002. Since it extends in the present direction, the connection terminals 2004 and 2004 are not easily detached by the reaction force.
  • the LED lamp 2001 includes the mounting portion 2024, the LED lamp 2001 is thickened so that the second surface 2022 of the glass epoxy substrate 2002 is in close contact with the contact flat surface 2093 of the thick portion 2091 of the frame body 2009. It can be attached to the part 2091.
  • the thick portion 2091 is made of steel
  • the attachment portion 2024 is insulated from the connection terminals 2004 and 2004, so that the energization of the connection terminals 2004 and 2004 is not adversely affected.
  • the glass epoxy substrate 2002 can be pressed against the thick portion 2091 of the frame body 2009, so that the second surface 2022 of the glass epoxy substrate 2002 and The adhesion force between the thick portion 2091 of the frame 2009 and the adhesion plane 2093 can be increased.
  • the mounting portion 2024 is a part of the glass epoxy substrate 2002, the number of parts can be reduced.
  • the thick portion 2091 is a part of the frame body 2009, the thick portion 2091 can release heat using a wide surface of the frame body 2009. Therefore, the cooling capacity of the light emitting diode element can be increased.
  • the LED lamp 2001 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002.
  • a connection terminal extending obliquely with respect to the direction may be provided.
  • the LED lamp 2001 includes the glass epoxy substrate 2002.
  • a metal substrate such as an aluminum substrate, a semiconductor substrate, or a ceramic substrate may be included.
  • a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 2009 of the third embodiment.
  • one attachment portion 2024 is provided on the glass epoxy substrate 2002, but a plurality of attachment portions may be provided.
  • FIG. 23 is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward.
  • the same reference numerals as those of the third embodiment are assigned to the same components as those of the third embodiment.
  • “left” refers to the left when the cooking device is viewed from the front side
  • “right” is when the cooking device is viewed from the front side. Point to the right.
  • the heating cooker includes a casing 2301 made of metal such as iron, a heating chamber 2310 provided in the casing 2301, and an LED lamp 2201 that illuminates the heating chamber 2310.
  • a steam generator, electrical components, a magnetron, a heater, a cooling fan unit, an air duct, and the like are installed in the casing 2301 as in the third embodiment.
  • the air blown out by the cooling fan portion flows between the right side portion of the casing 2301 and the right wall of the heating chamber 2310.
  • FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
  • a concave portion 2302 as an example of a mounted portion is provided on the right side surface of the casing 2301.
  • the concave portion 2302 includes a bottom portion 2321 substantially parallel to the extending direction of the right wall of the heating chamber 2310, and four peripheral walls provided around the bottom portion 2321 and inclined with respect to the extending direction of the right wall of the heating chamber 2310. It consists of parts 2322, 2323, 2324. Further, the bottom portion 2321 is located on the side of the plurality of punching holes 2211, 2111,... And the glass plate 2212.
  • the LED lamp 2201 is attached to the recess 2302 of the casing 2301. More specifically, the bottom 2321 of the recess 2302 has a flat contact plane 2325 on the heating chamber 2310 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2325. Further, the LED lamp 2001 is fixed to the casing 2301 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply
  • the LED lamp 2201 includes a metal base 306 having a shape different from that of the base 2006 of the LED lamp 2001 lamp 2001 of the third embodiment.
  • An inclined surface 2261 having an inclination angle substantially the same as the inclination angle of the peripheral wall 2323 of the recess 2302 is provided on the recess 2302 side of the base 306. Further, the inclined surface 2261 is designed so that the second surface 2022 of the glass epoxy substrate 2002 contacts the contact flat surface 2325 of the bottom portion 2321 when the inclined surface 2261 is brought into contact with the peripheral wall portion 2323 of the concave portion 2302.
  • a plurality of punching holes 2211, 2111,... Facing the LED lamp 2001 are provided on the right wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2201 enters the heating chamber 2310 through the plurality of punching holes 2211, 2111,. Further, the punching holes 2211, 2111,... Are covered with a glass plate 2212 so that steam in the heating chamber 2310 does not leak out of the heating chamber 2310 from the punching holes 2211, 2111,.
  • the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat close contact plane 325 of the bottom 2321 of the recess 2302, so the second surface 2022 with respect to the close contact flat surface 2325 The contact area is increased. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the bottom 2321 of the recess 2302 through the glass epoxy substrate 2002.
  • the bottom 2321 of the recess 2302 is not on the light emission side of the LED lamp 2201. It is possible to prevent the illumination capability of the LED lamp 2201 from being lowered.
  • the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
  • the heat radiation area is larger than that of the third embodiment, and the light emitting diode element 2003 can be made high.
  • the LED lamp 2201 can be air-cooled.
  • the LED lamp 2201 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002.
  • a connection terminal extending obliquely with respect to the direction may be provided.
  • the LED lamp 2201 includes the glass epoxy substrate 2002.
  • an aluminum substrate may be included.
  • Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
  • healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like.
  • superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food.
  • the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation.
  • the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
  • Glass plate 2021 ... First surface 2022 ... Second surface 2034 ... Mounting portion 2035 ... Mounting hole 2091 ... Thick part 2092 ... Flange part 093,2325 ... contact plane 2101,2301 ... casing 2110,2310 ... heating chamber 2302 ... recess 2321 ... bottom 2322,2323,2324 ... wall portion 2123 ... object to be heated

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Abstract

An LED lamp (1) equipped with a glass epoxy substrate (3), a light-emitting diode element (4) mounted on a first face (31) of the glass epoxy substrate (3), a cover glass (7) covering the light-emitting diode element (4) and the glass epoxy substrate (3) from the first face (31) side thereof, an aluminum heat sink (2), and a connection terminal (5) electrically connected to the light-emitting diode element (4). The aluminum heat sink (2) has a flat adhering planar face (11) that adheres to a second face (32) on the opposite side of the first face (31) of the glass epoxy substrate (3), and a flat, heat dissipation planar face (22) furnished on the opposite side from the adhering planar face (11). The connection terminal (5) extends in the direction of extension of the heat dissipation planar face (22) of the aluminum heat sink (2).

Description

LEDランプおよびそれを備えた加熱調理器LED lamp and cooking device provided with the same
 本発明は、LED(発光ダイオード)ランプおよびそれを備えた加熱調理器に関する。 The present invention relates to an LED (light emitting diode) lamp and a cooking device provided with the same.
 従来、LEDランプとしては、特開2010-56059号公報(特許文献1)に開示されたものがある。このLEDランプは、発光ダイオード素子が実装された基板と、この基板を上面に搭載したヒートシンクとを備えている。上記基板とヒートシンクの上面つまり基板側とは略半球状の透明部材で覆って、この透明部材とヒートシンクとの間の空間を密閉している。また、上記ヒートシンクの下面つまり基板側とは反対側には合成樹脂製の絶縁部を介して接続端子を取り付けている。 Conventionally, as an LED lamp, there is one disclosed in JP 2010-56059 A (Patent Document 1). This LED lamp includes a substrate on which a light emitting diode element is mounted, and a heat sink on which the substrate is mounted. The upper surface of the substrate and the heat sink, that is, the substrate side is covered with a substantially hemispherical transparent member, and the space between the transparent member and the heat sink is sealed. Further, a connection terminal is attached to the lower surface of the heat sink, that is, the side opposite to the substrate side via an insulating portion made of synthetic resin.
 上記ヒートシンクは、上面が平面であり、下面が凹面であり、側面の輪郭が回転双曲面の一部であり、放射状に突出する放熱フィンを有する形態である。 The heat sink has a shape in which the upper surface is a flat surface, the lower surface is a concave surface, the contour of the side surface is a part of a rotating hyperboloid, and the heat radiation fins project radially.
 さらに、上記ヒートシンクの中心には挿通孔を設けて、この挿通孔に挿通した配線によって発光ダイオード素子と接続端子との間を電気接続している。 Furthermore, an insertion hole is provided in the center of the heat sink, and the light emitting diode element and the connection terminal are electrically connected by a wiring inserted through the insertion hole.
 そして、上記LEDランプでは、発光ダイオード素子から発生した熱は、ヒートシンクの放射状の放熱フィンから空気中に放熱される。 In the LED lamp, heat generated from the light emitting diode element is radiated into the air from the radial heat radiation fins of the heat sink.
特開2010-56059号公報JP 2010-56059 A
 しかしながら、上記従来のLEDランプでは、発光ダイオード素子からの熱は、放熱フィンを介して熱伝導性の悪い空気中に放出するだけであるため、発光ダイオード素子の冷却が不充分であった。特に、このLEDランプを、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気で使用すると、発光ダイオード素子の冷却が全く不充分であり、寿命が著しく短くなるという問題があった。 However, in the above conventional LED lamp, the heat from the light emitting diode element is only released into the air having poor thermal conductivity through the heat radiation fin, so that the light emitting diode element is not sufficiently cooled. In particular, when this LED lamp is used in a high-temperature atmosphere such as a heating cooker, video equipment, welding apparatus, heat treatment apparatus and furnace, there is a problem that the cooling of the light-emitting diode element is quite inadequate and the life is remarkably shortened. It was.
 そこで、本発明の課題は、高温雰囲気でも充分に冷却できて寿命が長いLEDランプおよびそれを備えた加熱調理器を提供することにある。 Therefore, an object of the present invention is to provide an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life, and a cooking device equipped with the LED lamp.
 本発明者は、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置において、ハウジングやケースなどの金属板が存在することに着目して、これらの金属板をLEDランプの照明能力を妨げることなく放熱に有効に利用できないかと鋭意研究を行った。 The present inventors pay attention to the presence of metal plates such as housings and cases in devices that generate high-temperature atmospheres such as heating cookers, video equipment, welding devices, heat treatment devices, and furnaces. We have intensively studied whether it can be used effectively for heat dissipation without interfering with the lamp illumination ability.
 その結果、本発明者は、上記金属板を、照明能力を妨げることなく、放熱に極めて有効に利用できるLEDランプを発明した。 As a result, the inventor of the present invention invented an LED lamp that can use the metal plate very effectively for heat dissipation without impeding the illumination capability.
 すなわち、本発明のLEDランプは、
 基板と、
 この基板の第1面に搭載された発光ダイオード素子と、
 上記発光ダイオード素子と上記基板の第1面側とを覆う透明または半透明な部材と、
 上記基板の第1面とは反対側の第2面と密着する平坦な密着平面と、この密着平面とは反対側に設けられた平坦な放熱平面とを有するヒートシンクと、
 上記ヒートシンクの放熱平面の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子に電気接続される接続端子と
を備えることを特徴としている。
That is, the LED lamp of the present invention is
A substrate,
A light-emitting diode element mounted on the first surface of the substrate;
A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
A heat sink having a flat adhesion plane in close contact with the second surface opposite to the first surface of the substrate, and a flat heat radiation plane provided on the opposite side of the adhesion plane;
The heat sink includes an extension direction of the heat radiation plane of the heat sink or an oblique direction with respect to the extension direction and a connection terminal electrically connected to the light emitting diode element.
 上記構成によれば、上記発光ダイオード素子から発生した熱は、基板の第1面に伝わって、基板の第2面からヒートシンクの密着平面に伝わる。このとき、上記ヒートシンクの密着平面が基板の第2面に密着する平坦な面であるので、基板の第2面とヒートシンクの密着平面との接触面積を大きくとることができる。したがって、上記発光ダイオード素子の熱を基板を介してヒートシンクに効率良く伝えることができる。 According to the above configuration, the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the adhesion plane of the heat sink. At this time, since the contact flat surface of the heat sink is a flat surface in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the heat sink can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the heat sink through the substrate.
 さらに、例えば、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置に上記LEDランプを使用する場合、上記ヒートシンクの放熱平面が平坦であるので、上記高温雰囲気を生じる装置の金属板の表面にヒートシンクの放熱平面を容易に密着させることができ、しかも、ヒートシンクが、単なる平板状で、基板の第2面側つまり裏面側にあって、発光ダイオード素子の出射側にないから照明能力を妨げることなく、簡単、コンパクトな構造で、ヒートシンクの放熱平面と金属板の表面との接触面積を大きくとることができる。したがって、上記ヒートシンクは発光ダイオード素子からの熱をヒートシンクに直接接触する上記金属板に熱伝導により効率良く放出することができる。この金属板は、例えばケーシングやハウジングであって、放熱面積を極めて大きくすることができ、冷却効果を極めて大きくすることができる。したがって、このLEDランプは高温雰囲気で使用でき、寿命が長い。 Furthermore, for example, when the LED lamp is used in a device that generates a high temperature atmosphere such as a heating cooker, a video device, a welding device, a heat treatment device, and a furnace, the heat dissipation plane of the heat sink is flat, and thus the high temperature atmosphere is generated. The heat sink flat surface of the heat sink can be easily brought into close contact with the surface of the metal plate of the device, and the heat sink is a simple flat plate on the second surface side, that is, the back surface side of the substrate and on the light emitting diode element emission side. Therefore, the contact area between the heat radiation flat surface of the heat sink and the surface of the metal plate can be increased with a simple and compact structure without impeding the illumination capability. Therefore, the heat sink can efficiently dissipate heat from the light emitting diode element by heat conduction to the metal plate that directly contacts the heat sink. The metal plate is, for example, a casing or a housing, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, this LED lamp can be used in a high temperature atmosphere and has a long life.
 また、上記接続端子がヒートシンクの放熱平面の延在方向またはその延在方向に対して斜め方向に延びるので、上記金属板の表面とヒートシンクの放熱平面との間には接続端子が介在しないようにできる。 Further, since the connection terminal extends in the extending direction of the heat radiation plane of the heat sink or in an oblique direction with respect to the extension direction, the connection terminal should not be interposed between the surface of the metal plate and the heat radiation plane of the heat sink. it can.
 さらに、上記接続端子が金属板に密着しているヒートシンクの放熱平面の延在方向またはその延在方向に対して斜め方向に延びるので、接続端子は金属板からの反力で外れ難い。 Furthermore, since the connecting terminal extends in an oblique direction with respect to the extending direction of the heat radiation plane of the heat sink where the connecting terminal is in close contact with the metal plate or the extending direction, the connecting terminal is not easily detached by a reaction force from the metal plate.
 このように、本発明のLEDランプは、簡単、安価、コンパクトな構造で、照明能力を下げることがなく、発光ダイオード素子を高温雰囲気でも充分に冷却でき、寿命を長くすることができる。 As described above, the LED lamp of the present invention has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
 一実施形態のLEDランプでは、
 上記ヒートシンクの上記密着平面と上記放熱平面との間の寸法である厚さが、上記ヒートシンクの縦および横の寸法よりも小さい。
In one embodiment of the LED lamp,
A thickness, which is a dimension between the adhesion plane of the heat sink and the heat radiation plane, is smaller than the vertical and horizontal dimensions of the heat sink.
 ここで、「縦の寸法」とは、上記放熱平面の輪郭が略矩形として、この輪郭の長辺を指し、また、「横の寸法」とは、上記輪郭の短辺を指す。 Here, the “vertical dimension” refers to the long side of the outline with the outline of the heat radiation plane being substantially rectangular, and the “lateral dimension” refers to the short side of the outline.
 なお、上記放熱平面と上記密着平面とは平行であると構造が簡単になるので好ましい。尤も、図12に示すように、LEDランプが斜め方向に光を照射する場合(発光ダイオード素子1004の出射光が向かう方向が放熱平面1022に対して傾斜する場合)は、密着平面1021と放熱平面1022とは平行でなくて傾斜していてもよい。この場合、上記密着平面1021と放熱平面1022の間の厚さの寸法とは、傾斜方向の中央の点の間の寸法Dを言う。また、図12では密着平面1021の傾斜角は誇張して大きくしている。 In addition, it is preferable that the heat radiation plane and the contact plane are parallel because the structure becomes simple. However, as shown in FIG. 12, when the LED lamp irradiates light in an oblique direction (when the direction in which the light emitted from the light emitting diode element 1004 travels is inclined with respect to the heat radiation plane 1022), the contact plane 1021 and the heat radiation plane It may not be parallel to 1022 but may be inclined. In this case, the thickness dimension between the contact plane 1021 and the heat radiation plane 1022 refers to the dimension D between the central points in the tilt direction. In FIG. 12, the inclination angle of the contact flat surface 1021 is exaggerated and increased.
 上記実施形態によれば、上記ヒートシンクの密着平面と放熱平面との間の寸法である厚さが、ヒートシンクの縦および横の寸法よりも小さいので、密着平面と放熱平面との間の放熱経路が短くなる。したがって、上記ヒートシンクは発光ダイオード素子からの熱を放熱平面にも迅速に伝えて効果的に放熱できる。 According to the embodiment, since the thickness, which is the dimension between the adhesion plane and the heat radiation plane of the heat sink, is smaller than the vertical and horizontal dimensions of the heat sink, the heat radiation path between the adhesion plane and the heat radiation plane is Shorter. Therefore, the heat sink can quickly dissipate heat by quickly transferring heat from the light emitting diode element to the heat radiation plane.
 一実施形態のLEDランプでは、
 上記発光ダイオード素子と上記接続端子とは、上記ヒートシンクの内部を通らないで外側を通る上記基板上の配線によって接続されている。
In one embodiment of the LED lamp,
The light emitting diode element and the connection terminal are connected by wiring on the substrate that passes outside without passing through the inside of the heat sink.
 上記実施形態によれば、上記発光ダイオード素子と接続端子とは、ヒートシンクの内部を通らないで外側を通る基板上の配線によって接続されているので、ヒートシンクの放熱経路が少なくなるのを防ぐことができる。 According to the above embodiment, since the light emitting diode element and the connection terminal are connected by the wiring on the substrate that passes outside without passing through the inside of the heat sink, it is possible to prevent the heat dissipation path of the heat sink from being reduced. it can.
 仮に、従来例のように、上記ヒートシンクに挿通孔を設けて、その挿通孔に挿通した配線によって発光ダイオード素子と接続端子との間を電気接続したなら、ヒートシンクの放熱経路が挿通孔の分だけ少なくなってしまうのである。 If the heat sink is provided with an insertion hole as in the conventional example, and the light emitting diode element and the connection terminal are electrically connected by the wiring inserted through the insertion hole, the heat dissipation path of the heat sink is equivalent to the insertion hole. It will be less.
 一実施形態のLEDランプは、
 上記接続端子から絶縁された取付部材を備える。
The LED lamp of one embodiment is
An attachment member insulated from the connection terminal is provided.
 上記実施形態によれば、例えば、加熱調理器、映像機器、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置の金属板にヒートシンクの放熱平面を取り付ける場合、取付部材があるので、ヒートシンクの放熱平面が金属板に密着するように、取付部材でLEDランプを固定できる。 According to the above embodiment, for example, when attaching a heat sink plane of a heat sink to a metal plate of a device that generates a high temperature atmosphere such as a heating cooker, a video device, a welding device, a heat treatment device, and a furnace, since there is an attachment member, The LED lamp can be fixed by the mounting member so that the heat radiation plane is in close contact with the metal plate.
 また、仮に、上記取付部材の取付先が金属であったとしても、取付部材は接続端子から絶縁されているので、接続端子の通電に悪影響が及ぶのを防ぐことができる。 Further, even if the attachment destination of the attachment member is a metal, since the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
 一実施形態のLEDランプでは、
 上記取付部材は、上記接続端子の近傍において上記接続端子の延在する方向に交差する方向に延びると共に、取付穴を有する取付板である。
In one embodiment of the LED lamp,
The mounting member is a mounting plate that extends in a direction intersecting the extending direction of the connection terminal in the vicinity of the connection terminal and has a mounting hole.
 上記実施形態によれば、上記取付板の取付穴に挿通した例えばビスを締め付けて、取付板を取付先に取り付ける場合、取付板は接続端子の近傍において接続端子の延在する方向に交差する方向に延びているので、ビスの締め付けで、接続端子を接続先に固定すると、LEDランプは上記接続端子による固定方向と上記取付板による固定方向の二方向に固定されるので、LEDランプは脱落し難いという利点を有する。 According to the embodiment, when, for example, a screw inserted into the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the mounting plate intersects the direction in which the connection terminal extends in the vicinity of the connection terminal. When the connection terminal is fixed to the connection destination by tightening a screw, the LED lamp is fixed in two directions, that is, the fixing direction by the connection terminal and the fixing direction by the mounting plate. It has the advantage of being difficult.
 本発明の加熱調理器は、
 ケーシングと、
 上記ケーシング内に設けられ、被加熱物を収容する加熱室と、
 上記ケーシングと上記加熱室との間に配置されて、上記加熱室内を照らす本発明のLEDランプと
を備え、
 上記LEDランプの上記ヒートシンクの上記放熱平面は金属板に密着されていることを特徴としている。
The heating cooker of the present invention is
A casing,
A heating chamber provided in the casing and containing an object to be heated;
The LED lamp of the present invention that is disposed between the casing and the heating chamber and illuminates the heating chamber,
The heat radiation plane of the heat sink of the LED lamp is in close contact with a metal plate.
 上記構成によれば、上記LEDランプを備えることによって、LEDランプの交換回数が少なくなるので、ランニングコストを低減できる。 According to the above configuration, since the number of replacements of the LED lamp is reduced by providing the LED lamp, the running cost can be reduced.
 また、本発明の加熱調理器は、
 ケーシングと、
 上記ケーシング内に設けられ、被加熱物を収容する加熱室と、
 上記ケーシングと上記加熱室との間に配置され、上記加熱室内を照らすLEDランプと、
 上記LEDランプが取り付けられる金属製の被取付部と
を備え、
 上記LEDランプは、
 上記加熱室側に第1面を有すると共に、上記加熱室とは反対側に平坦な第2面を有する基板と、
 上記基板の第1面に搭載された発光ダイオード素子と、
 上記発光ダイオード素子と上記基板の第1面側とを覆う透明または半透明な部材と、
 上記基板の第2面の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子に電気接続される接続端子と
を備え、
 上記被取付部は、上記基板の第2面と密着する平坦な密着平面を有することを特徴としている。
Moreover, the cooking device of the present invention is
A casing,
A heating chamber provided in the casing and containing an object to be heated;
An LED lamp disposed between the casing and the heating chamber and illuminating the heating chamber;
A metal attached portion to which the LED lamp is attached;
The LED lamp is
A substrate having a first surface on the heating chamber side and a flat second surface on the opposite side of the heating chamber;
A light emitting diode element mounted on the first surface of the substrate;
A transparent or translucent member covering the light emitting diode element and the first surface side of the substrate;
The extending direction of the second surface of the substrate or an oblique direction with respect to the extending direction, and a connection terminal electrically connected to the light emitting diode element,
The attached portion has a flat contact plane that is in close contact with the second surface of the substrate.
 上記構成によれば、上記発光ダイオード素子から発生した熱は、基板の第1面に伝わって、基板の第2面から被取付部の密着平面に伝わる。このとき、上記被取付部の密着平面が基板の第2面に密着する平坦な面であるので、基板の第2面と被取付部の密着平面との接触面積を大きくとることができる。したがって、上記発光ダイオード素子の熱を基板を介して被取付部に効率良く伝えることができる。 According to the above configuration, the heat generated from the light emitting diode element is transmitted to the first surface of the substrate, and is transmitted from the second surface of the substrate to the contact flat surface of the mounted portion. At this time, since the contact flat surface of the attached portion is a flat surface that is in close contact with the second surface of the substrate, the contact area between the second surface of the substrate and the contact flat surface of the attached portion can be increased. Therefore, the heat of the light emitting diode element can be efficiently transmitted to the mounted portion through the substrate.
 さらに、上記基板の第2面と被取付部の密着平面との接触面積を大きくしても、被取付部が基板の第2面側つまり裏面側にあって、発光ダイオード素子の出射側にないから、LEDランプの照明能力は低下しない。 Furthermore, even if the contact area between the second surface of the substrate and the contact flat surface of the mounted portion is increased, the mounted portion is on the second surface side, that is, the back surface side of the substrate, and not on the light emitting diode element emission side. Therefore, the illumination capability of the LED lamp does not decrease.
 したがって、上記LEDランプは、照明能力が低下せず、発光ダイオード素子を高温雰囲気でも充分に冷却でき、寿命を長くすることができる。 Therefore, the LED lamp does not have a reduced illumination capability, can sufficiently cool the light emitting diode element even in a high temperature atmosphere, and can extend the life.
 また、上記LEDランプの寿命を長くすることができるので、LEDランプの交換回数が少なくなり、ランニングコストを低減できる。 Also, since the life of the LED lamp can be extended, the number of replacement of the LED lamp is reduced, and the running cost can be reduced.
 また、上記接続端子が基板の第2面の延在方向またはその延在方向に対して斜め方向に延びるので、基板の第2面と被取付部の密着平面との間に接続端子が入らないようにできる。 Further, since the connection terminal extends in the extending direction of the second surface of the substrate or in an oblique direction with respect to the extending direction, the connection terminal does not enter between the second surface of the substrate and the contact flat surface of the attached portion. You can
 さらに、上記基板は第2面の延在方向に対して垂直方向の反力を被取付部から受けるが、接続端子が基板の第2面の延在方向またはその延在方向に対して斜め方向に延びるので、接続端子は上記反力で外れ難い。 Further, the substrate receives a reaction force in a direction perpendicular to the extending direction of the second surface from the mounted portion, but the connection terminal is inclined with respect to the extending direction of the second surface of the substrate or the extending direction thereof. Therefore, the connection terminal is difficult to come off due to the reaction force.
 一実施形態の加熱調理器では、
 上記LEDランプは上記接続端子から絶縁された取付部材を備える。
In the heating cooker of one embodiment,
The LED lamp includes a mounting member that is insulated from the connection terminal.
 上記実施形態によれば、上記LEDランプは取付部材を備えるので、基板の第2面が被取付部の密着平面に密着するように、LEDランプを被取付部に取り付けることができる。 According to the above embodiment, since the LED lamp includes an attachment member, the LED lamp can be attached to the attachment portion so that the second surface of the substrate is in close contact with the contact flat surface of the attachment portion.
 また、仮に、上記取付部材の取付先が金属であったとしても、取付部材は接続端子から絶縁されているので、接続端子の通電に悪影響が及ぶのを防ぐことができる。 Further, even if the attachment destination of the attachment member is a metal, since the attachment member is insulated from the connection terminal, it is possible to prevent adverse effects on the conduction of the connection terminal.
 一実施形態の加熱調理器では、
 上記取付部材は、上記基板の第2面の延在方向に延びると共に、取付穴を有する取付板である。
In the heating cooker of one embodiment,
The attachment member is an attachment plate extending in the extending direction of the second surface of the substrate and having an attachment hole.
 上記実施形態によれば、上記取付板の取付穴に挿通した例えばビスを締め付けて、取付板を取付先に取り付ける場合、基板の第2面の延在方向に延びるので、ビスの締め付けで、基板を被取付部に押し付けることができる。したがって、上記基板の第2面と被取付部の密着平面との密着力を高くすることができる。 According to the above-described embodiment, for example, when a screw inserted through the mounting hole of the mounting plate is tightened and the mounting plate is mounted to the mounting destination, the second surface of the substrate extends in the extending direction. Can be pressed against the mounted portion. Therefore, the adhesion force between the second surface of the substrate and the adhesion plane of the attached portion can be increased.
 一実施形態の加熱調理器では、
 上記取付板は上記基板の一部である。
In the heating cooker of one embodiment,
The mounting plate is a part of the substrate.
 上記実施形態によれば、上記取付部材は基板の一部であるから、部品点数を少なくすることができる。 According to the above embodiment, since the mounting member is a part of the substrate, the number of parts can be reduced.
 一実施形態の加熱調理器では、
 上記被取付部は上記LEDランプの取付金具の一部である。
In the heating cooker of one embodiment,
The mounted portion is a part of the mounting bracket of the LED lamp.
 上記実施形態によれば、上記被取付部はLEDランプの取付金具の一部であるから、この取付金具の表面積が大きくて、LEDランプの冷却能力を高めることができる。 According to the above embodiment, since the mounted portion is a part of the mounting bracket of the LED lamp, the surface area of the mounting bracket is large, and the cooling capacity of the LED lamp can be increased.
 一実施形態の加熱調理器では、
 上記被取付部は上記ケーシングの一部である。
In the heating cooker of one embodiment,
The attached portion is a part of the casing.
 上記実施形態によれば、上記被取付部はケーシングの一部であるから、ケーシングの表面積がさらに大きくて、LEDランプの冷却能力を高めることができる。 According to the above embodiment, since the attached portion is a part of the casing, the surface area of the casing is further increased, and the cooling capacity of the LED lamp can be increased.
 本発明によれば、高温雰囲気で使用しても、発光ダイオード素子を充分に冷却できて、寿命の長く、かつ、簡単、安価、コンパクトな構造のLEDランプを提供できる。 According to the present invention, even when used in a high temperature atmosphere, the light emitting diode element can be sufficiently cooled, and an LED lamp having a long life, simple, inexpensive and compact structure can be provided.
 本発明の加熱調理器は、本発明のLEDランプを備えることによって、LEDランプの交換回数が少なくなるので、ランニングコストを低減できる。 The cooking device of the present invention includes the LED lamp of the present invention, so that the number of replacement of the LED lamp is reduced, so that the running cost can be reduced.
 本発明によれば、高温雰囲気でも充分に冷却できて寿命が長いLEDランプを備えた加熱調理器を提供できる。 According to the present invention, it is possible to provide a cooking device equipped with an LED lamp that can be sufficiently cooled even in a high-temperature atmosphere and has a long life.
図1は本発明の第1実施形態のLEDランプの模式側面図である。FIG. 1 is a schematic side view of an LED lamp according to a first embodiment of the present invention. 図2は図1の矢印方向から見た模式図である。FIG. 2 is a schematic view seen from the direction of the arrow in FIG. 図3は上記第1実施形態のLEDランプの取付状態を説明するための模式図である。FIG. 3 is a schematic diagram for explaining the mounting state of the LED lamp of the first embodiment. 図4は本発明の第2実施形態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 4: is the perspective view seen from the front diagonally upper direction of the heating cooker of 2nd Embodiment of this invention. 図5は上記加熱調理器の正面から見た縦断面の模式図である。FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker. 図6は上記加熱調理器の右側方から見た縦断面の模式図である。FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device. 図7は上記加熱調理器の制御ブロック図である。FIG. 7 is a control block diagram of the cooking device. 図8は扉とケーシングを取り外した状態の加熱調理器の後面斜め上方から見た斜視図である。FIG. 8 is a perspective view of the heating cooker with the door and the casing removed, as viewed from the rear and diagonally above. 図9は扉とケーシングを取り外した状態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 9 is a perspective view of the heating cooker with the door and casing removed, as viewed from the front and diagonally above. 図10は前面パネルの上部およびその近傍の部分を斜め上方から見た模式図である。FIG. 10 is a schematic view of an upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above. 図11は図10のXI-XI線から見た縦断面の模式図である。FIG. 11 is a schematic diagram of a longitudinal section viewed from the line XI-XI in FIG. 図12は本発明の一実施形態のLEDランプの要部の模式図である。FIG. 12 is a schematic diagram of a main part of an LED lamp according to an embodiment of the present invention. 図13は本発明の第3実施形態のLEDランプの模式側面図である。FIG. 13 is a schematic side view of an LED lamp according to a third embodiment of the present invention. 図14は上記第3実施形態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 14: is the perspective view seen from the front diagonally upper direction of the heating cooker of the said 3rd Embodiment. 図15は上記第3実施形態の加熱調理器の正面から見た縦断面の模式図である。FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker according to the third embodiment. 図16は上記第3実施形態の加熱調理器の右側方から見た縦断面の模式図である。FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the heating cooker according to the third embodiment. 図17は上記加熱調理器の制御ブロック図である。FIG. 17 is a control block diagram of the cooking device. 図18は扉とケーシングを取り外した状態の加熱調理器の後面斜め上方から見た斜視図である。FIG. 18 is a perspective view of the heating cooker with the door and casing removed, as viewed from the upper rear side. 図19は扉とケーシングを取り外した状態の加熱調理器の正面斜め上方から見た斜視図である。FIG. 19 is a perspective view of the heating cooker with the door and casing removed, as seen from the front and obliquely above. 図20は前面パネルの上部およびその近傍の部分を斜め上方から見た模式図である。FIG. 20 is a schematic view of the upper portion of the front panel and a portion in the vicinity thereof as viewed obliquely from above. 図21は図20のXXI-XXI線から見た模式図である。FIG. 21 is a schematic view taken along line XXI-XXI in FIG. 図22は枠体に取り付けられたLEDランプを接続端子側から見た模式図である。FIG. 22 is a schematic view of the LED lamp attached to the frame as viewed from the connection terminal side. 図23は本発明の第4実施形態の加熱調理器の要部の正面を斜め上方からみた模式図である。FIG. 23: is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward. 図24は図23のXXIV-XXIV線から見た縦断面の模式図である。FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
 以下、本発明のLEDランプおよび加熱調理器を図示の実施の形態により詳細に説明する。 Hereinafter, the LED lamp and the heating cooker of the present invention will be described in detail with reference to the illustrated embodiments.
 〔第1実施形態〕
 図1は、本発明の第1実施形態のLEDランプ1を側方から見た模式図である。
[First Embodiment]
FIG. 1 is a schematic view of an LED lamp 1 according to a first embodiment of the present invention as viewed from the side.
 上記LEDランプ1は、ヒートシンクの一例としての略矩形板状のアルミヒートシンク2と、基板の一例としてのガラスエポキシ基板3と、発光ダイオード素子4と、2本(図1では1本のみ見えている)の略矩形板状の接続端子5,5と、取付部材の一例としての略矩形板状の取付板6と、透明または半透明な部材の一例としてのカバーガラス7と、金属製の口金8とを備えている。 The LED lamp 1 includes a substantially rectangular aluminum heat sink 2 as an example of a heat sink, a glass epoxy substrate 3 as an example of a substrate, and two light emitting diode elements 4 (only one is visible in FIG. 1). ) Of substantially rectangular plate- like connection terminals 5, 5, a substantially rectangular plate-like attachment plate 6 as an example of an attachment member, a cover glass 7 as an example of a transparent or translucent member, and a metal base 8. And.
 上記アルミヒートシンク2は、平坦な密着平面21と、この密着平面21とは反対側に平坦な放熱平面22とを有している。また、上記アルミヒートシンク2の厚さ(密着平面21と放熱平面22との間の寸法)は、アルミヒートシンク2の縦および横の寸法に比べてよりも小さくなっている。また、上記アルミヒートシンク2の放熱平面22および4つの側面は、カバーガラス7で覆われていなくて露出している。また、上記密着平面21と放熱平面22は互いに略平行になっている。なお、上記アルミヒートシンク2の縦の寸法とは、図1中の左右方向の寸法に相当する。また、上記アルミヒートシンク2の横の寸法とは、図1の紙面に対して垂直な方向の寸法に相当する。 The aluminum heat sink 2 has a flat adhesion plane 21 and a flat heat radiation plane 22 on the opposite side of the adhesion plane 21. The thickness of the aluminum heat sink 2 (the dimension between the contact plane 21 and the heat radiation plane 22) is smaller than the vertical and horizontal dimensions of the aluminum heat sink 2. The heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed. Further, the contact plane 21 and the heat radiation plane 22 are substantially parallel to each other. The vertical dimension of the aluminum heat sink 2 corresponds to the horizontal dimension in FIG. The horizontal dimension of the aluminum heat sink 2 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
 上記ガラスエポキシ基板3の第1面31には発光ダイオード素子4が搭載されている。一方、上記ガラスエポキシ基板3の第1面31とは反対側の第2面32には、ヒートシンク2の平坦な密着平面21が密着している。また、上記ガラスエポキシ基板3には、接続端子5,5からの電流を発光ダイオード素子4に供給するための配線33が設けられている。すなわち、上記発光ダイオード素子4と接続端子5,5とは、アルミヒートシンク2の内部を通らないで外側を通るガラスエポキシ基板3上の配線33によって接続されている。また、上記ガラスエポキシ基板3の接続端子5,5側の部分は口金8内に挿入されている。また、上記ガラスエポキシ基板3の残りの部分はカバーガラス7で覆われている。 The light emitting diode element 4 is mounted on the first surface 31 of the glass epoxy substrate 3. On the other hand, the flat contact surface 21 of the heat sink 2 is in close contact with the second surface 32 opposite to the first surface 31 of the glass epoxy substrate 3. The glass epoxy substrate 3 is provided with wiring 33 for supplying current from the connection terminals 5 and 5 to the light emitting diode element 4. That is, the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes outside without passing through the inside of the aluminum heat sink 2. Further, the connection terminal 5, 5 side portion of the glass epoxy substrate 3 is inserted into the base 8. The remaining part of the glass epoxy substrate 3 is covered with a cover glass 7.
 上記発光ダイオード素子4は、ガラスエポキシ基板3の第1面31に取り付けられている。また、上記発光ダイオード素子4は蛍光体9で気密封止されている。この蛍光体9は、発光ダイオード素子4から出射された光の波長を変換するものである。 The light emitting diode element 4 is attached to the first surface 31 of the glass epoxy substrate 3. The light emitting diode element 4 is hermetically sealed with a phosphor 9. This phosphor 9 converts the wavelength of the light emitted from the light emitting diode element 4.
 上記カバーガラス7は、発光ダイオード素子4とガラスエポキシ基板3の一部の第1面31側とを覆っている。このカバーガラス7内の空間は密閉空間であり、外部の気体がカバーガラス7内に入らないようになっている。また、上記カバーガラス7は蛍光体9で波長が変換された光を透過する材料から成っている。 The cover glass 7 covers the light emitting diode element 4 and a part of the first surface 31 side of the glass epoxy substrate 3. The space in the cover glass 7 is a sealed space so that outside gas does not enter the cover glass 7. The cover glass 7 is made of a material that transmits the light whose wavelength is converted by the phosphor 9.
 上記接続端子5,5は、アルミヒートシンク2の後方に設けられて、放熱平面22の延在方向に延びている。この接続端子5,5のそれぞれの先端部には貫通穴13を設けている。これにより、上記接続端子5,5を差し込み口(図示せず)に挿入したとき、差し込み口に設けられた突起が貫通穴13に嵌合して、接続端子5,5の挿入が充分になったことを感触で判るようになっている。 The connection terminals 5 and 5 are provided behind the aluminum heat sink 2 and extend in the extending direction of the heat radiation plane 22. A through hole 13 is provided at the tip of each of the connection terminals 5 and 5. As a result, when the connection terminals 5 and 5 are inserted into the insertion holes (not shown), the protrusions provided in the insertion holes are fitted into the through holes 13 so that the connection terminals 5 and 5 are sufficiently inserted. You can understand that by touch.
 上記口金8はカバーガラス7と接続端子5,5との間に設けられている。この口金8と接続端子5,5との間は耐熱性の封止樹脂10で封止されている。 The base 8 is provided between the cover glass 7 and the connection terminals 5 and 5. A space between the base 8 and the connection terminals 5 and 5 is sealed with a heat-resistant sealing resin 10.
 図2は、図1の矢印方向から見た模式図である。 FIG. 2 is a schematic view seen from the direction of the arrow in FIG.
 上記取付板6は、封止樹脂10によって接続端子5,5から絶縁されている。また、上記取付板6は、接続端子5,5の近傍において接続端子5,5の延在する方向に交差する方向に延びている。この取付板6の延在方向は放熱平面22と略平行である。また、上記取付板6の先端部には、取付板6を貫通する取付穴14が設けられており、LEDランプ1の位置を固定するめのビス(図示せず)を取付穴14に挿通する。 The mounting plate 6 is insulated from the connection terminals 5 and 5 by the sealing resin 10. Further, the mounting plate 6 extends in a direction intersecting the extending direction of the connection terminals 5 and 5 in the vicinity of the connection terminals 5 and 5. The extending direction of the mounting plate 6 is substantially parallel to the heat radiation plane 22. Further, a mounting hole 14 penetrating the mounting plate 6 is provided at the tip of the mounting plate 6, and a screw (not shown) for fixing the position of the LED lamp 1 is inserted into the mounting hole 14.
 上記構成のLEDランプ1によれば、上記発光ダイオード素子4から発生した熱は、ガラスエポキシ基板3の第1面31に伝わって、ガラスエポキシ基板3の第2面32からアルミヒートシンク2の密着平面21に伝わる。このとき、上記アルミヒートシンク2の密着平面21がガラスエポキシ基板3の第2面32に密着する平坦な面であるので、ガラスエポキシ基板3の第2面32とアルミヒートシンク2の密着平面21との接触面積を大きくとることができる。したがって、上記発光ダイオード素子4の熱をガラスエポキシ基板3を介してアルミヒートシンク2に効率良く伝えることができる。 According to the LED lamp 1 having the above configuration, the heat generated from the light emitting diode element 4 is transmitted to the first surface 31 of the glass epoxy substrate 3, and the adhesion plane of the aluminum heat sink 2 from the second surface 32 of the glass epoxy substrate 3. It is transmitted to 21. At this time, since the contact flat surface 21 of the aluminum heat sink 2 is a flat surface that is in close contact with the second surface 32 of the glass epoxy substrate 3, the second surface 32 of the glass epoxy substrate 3 and the contact flat surface 21 of the aluminum heat sink 2 are The contact area can be increased. Therefore, the heat of the light emitting diode element 4 can be efficiently transferred to the aluminum heat sink 2 through the glass epoxy substrate 3.
 さらに、例えば映像機器にLEDランプ1を使用する場合、図3に示すように、アルミヒートシンク2の放熱平面22が平坦であるので、映像機器の金属板15の表面51にアルミヒートシンク2の放熱平面22を容易に密着させることができ、しかも、アルミヒートシンク2が、単なる平板状で、ガラスエポキシ基板3の第2面32側つまり裏面側にあって、発光ダイオード素子4の出射側にないから照明能力を妨げることなく、簡単、コンパクトな構造で、アルミヒートシンク2の放熱平面22と金属板15の表面51との接触面積を大きくとることができる。したがって、上記アルミヒートシンク2は発光ダイオード素子4からの熱をアルミヒートシンク2に直接接触する金属板15に熱伝導により効率良く放出することができる。この金属板15は、映像機器の例えばケーシングやハウジングであって、放熱面積を極めて大きくすることができ、冷却効果を極めて大きくすることができる。したがって、上記LEDランプ1は高温雰囲気で使用でき、寿命が長い。 Further, for example, when the LED lamp 1 is used in a video equipment, the heat radiation plane 22 of the aluminum heat sink 2 is flat as shown in FIG. 22 can be easily adhered, and the aluminum heat sink 2 has a simple flat plate shape on the second surface 32 side, that is, the back surface side of the glass epoxy substrate 3, and is not on the light emission side of the light emitting diode element 4. The contact area between the heat radiation plane 22 of the aluminum heat sink 2 and the surface 51 of the metal plate 15 can be increased with a simple and compact structure without impeding the ability. Therefore, the aluminum heat sink 2 can efficiently release the heat from the light emitting diode element 4 to the metal plate 15 in direct contact with the aluminum heat sink 2 by heat conduction. The metal plate 15 is, for example, a casing or a housing of the video equipment, and can greatly increase the heat radiation area and can greatly increase the cooling effect. Therefore, the LED lamp 1 can be used in a high temperature atmosphere and has a long life.
 また、上記接続端子5,5がアルミヒートシンク2の放熱平面22の延在方向に延びるので、金属板15の表面51とアルミヒートシンク2の放熱平面22との間には接続端子5,5が介在しないようにできる。 Further, since the connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2, the connection terminals 5 and 5 are interposed between the surface 51 of the metal plate 15 and the heat radiation plane 22 of the aluminum heat sink 2. You can avoid it.
 さらに、上記LEDランプ1が金属板15から反力を受けても、接続端子5,5が金属板15に密着しているアルミヒートシンク2の放熱平面22の延在方向に延びるので、接続端子5,5が外れるのを防ぐことができる。 Furthermore, even if the LED lamp 1 receives a reaction force from the metal plate 15, the connection terminals 5, 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2 that is in close contact with the metal plate 15. , 5 can be prevented from coming off.
 このように、上記LEDランプ1は、簡単、安価、コンパクトな構造で、照明能力を下げることがなく、発光ダイオード素子4を映像機器の高温雰囲気でも充分に冷却でき、寿命を長くすることができる。 As described above, the LED lamp 1 has a simple, inexpensive, and compact structure, does not lower the illumination capability, can sufficiently cool the light emitting diode element 4 even in a high temperature atmosphere of the video equipment, and can extend the life. .
 なお、図3の矢印は熱が伝導する方向を示している。 Note that the arrows in FIG. 3 indicate the direction in which heat is conducted.
 また、上記アルミヒートシンク2は、縦および横の寸法をよりも、密着平面21と放熱平面22との間の寸法が小さいので、密着平面21と放熱平面22との間の放熱経路が短くなる。したがって、上記アルミヒートシンク2は発光ダイオード素子4からの熱を放熱平面22に迅速に伝えて効果的に放熱できる。 Further, since the aluminum heat sink 2 has a smaller dimension between the contact plane 21 and the heat radiation plane 22 than the vertical and horizontal dimensions, the heat radiation path between the contact plane 21 and the heat radiation plane 22 is shortened. Therefore, the aluminum heat sink 2 can quickly dissipate heat by quickly transferring the heat from the light emitting diode element 4 to the heat radiation plane 22.
 また、上記発光ダイオード素子4と接続端子5,5とは、アルミヒートシンク2の内部を通らないで外側を通るガラスエポキシ基板3上の配線33によって接続されているので、アルミヒートシンク2の放熱経路が少なくなるのを防ぐことができる。 Further, since the light emitting diode element 4 and the connection terminals 5 and 5 are connected by the wiring 33 on the glass epoxy substrate 3 that passes through the outside without passing through the inside of the aluminum heat sink 2, the heat dissipation path of the aluminum heat sink 2 is It can be prevented from becoming less.
 仮に、従来例のように、上記アルミヒートシンク2に挿通孔を設けて、その挿通孔に挿通した配線によって発光ダイオード素子4と接続端子5,5との間を電気接続したなら、アルミヒートシンク2の放熱経路が挿通孔の分だけ少なくなってしまうのである。 If the aluminum heat sink 2 is provided with an insertion hole and the light emitting diode element 4 and the connection terminals 5 and 5 are electrically connected by the wiring inserted into the insertion hole as in the conventional example, The heat radiation path is reduced by the amount of the insertion hole.
 また、上記金属板15にアルミヒートシンク2の放熱平面22を取り付ける場合、取付板6があるので、アルミヒートシンク2の放熱平面22が金属板15に密着する状態で、LEDランプ1を固定できる。 Further, when attaching the heat radiation plane 22 of the aluminum heat sink 2 to the metal plate 15, the LED lamp 1 can be fixed in a state where the heat radiation plane 22 of the aluminum heat sink 2 is in close contact with the metal plate 15.
 また、上記取付板6の取付穴14に挿通した例えばビスを締め付けて、取付板6を取付先に取り付ける場合、取付板6は接続端子5,5の近傍において接続端子5,5の延在する方向に交差する方向に延びるので、上記ビスの締め付けで、接続端子5,5を接続先に押し付けることができる。したがって、上記接続端子5,5が接続先から抜け難くすることができる。 Further, when, for example, a screw inserted into the mounting hole 14 of the mounting plate 6 is tightened to attach the mounting plate 6 to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5. Since it extends in a direction crossing the direction, the connection terminals 5 and 5 can be pressed against the connection destination by tightening the screws. Therefore, it is possible to make it difficult for the connection terminals 5 and 5 to be disconnected from the connection destination.
 また、上記取付板6の取付穴に挿通した例えばビスを締め付けて、取付板6を取付先に取り付けるとき、取付板6は接続端子5,5の近傍において接続端子5,5の延在する方向に交差する方向に延びているので、そのビスの締め付けで、接続端子5,5を接続先に固定すると、LEDランプ1は接続端子5,5による固定方向と取付板6による固定方向の二方向に固定される。したがって、上記LEDランプ1は脱落し難いという利点を有する。 Further, when, for example, a screw inserted through the mounting hole of the mounting plate 6 is tightened and the mounting plate 6 is mounted to the mounting destination, the mounting plate 6 extends in the vicinity of the connection terminals 5 and 5 in the direction in which the connection terminals 5 and 5 extend. When the connection terminals 5 and 5 are fixed to the connection destination by tightening the screws, the LED lamp 1 has two directions: a fixing direction by the connection terminals 5 and 5 and a fixing direction by the mounting plate 6. Fixed to. Therefore, the LED lamp 1 has an advantage that it is difficult to drop off.
 また、仮に、上記取付板6の取付先が金属であったとしても、取付板6は接続端子5,5から絶縁されているので、接続端子5,5の通電に悪影響が及ぶのを防ぐことができる。 Further, even if the mounting destination of the mounting plate 6 is a metal, the mounting plate 6 is insulated from the connection terminals 5 and 5, so that adverse effects on the energization of the connection terminals 5 and 5 can be prevented. Can do.
 また、上記カバーガラス7は蛍光体9で波長が変換された光を透過するので、その光をカバーガラス7から取り出すことができる。 Further, since the cover glass 7 transmits the light whose wavelength is converted by the phosphor 9, the light can be taken out from the cover glass 7.
 また、上記アルミヒートシンク2の放熱平面22および4つの側面は、カバーガラス7で覆われていなくて露出しているので、アルミヒートシンク2の放熱性能が低下するのを防ぐことができる。 Further, since the heat radiation plane 22 and the four side surfaces of the aluminum heat sink 2 are not covered with the cover glass 7 and are exposed, it is possible to prevent the heat radiation performance of the aluminum heat sink 2 from being deteriorated.
 また、上記カバーガラス7と接続端子5,5との間に口金8を設けているので、機械的な強度を上げることができる。 Also, since the base 8 is provided between the cover glass 7 and the connection terminals 5 and 5, the mechanical strength can be increased.
 上記第1実施形態において、金属板15は、加熱調理器、洗濯乾燥機、溶接装置、熱処理装置および炉などの高温雰囲気を生じる装置のハウジングやケースなどの金属板であってもよい。 In the first embodiment, the metal plate 15 may be a metal plate such as a housing or a case of a device that generates a high-temperature atmosphere such as a heating cooker, a washing / drying machine, a welding device, a heat treatment device, and a furnace.
 上記第1実施形態のアルミヒートシンク2に換えて、アルミ以外の金属(例えば銅)からなるヒートシンクを用いてもよいし、あるいは、金属以外であっても、放熱性の良い材料であれば、その材料からなるヒートシンクを用いてもよい。また、上記材料は耐熱性があるものが好ましい。 In place of the aluminum heat sink 2 of the first embodiment, a heat sink made of a metal other than aluminum (for example, copper) may be used. A heat sink made of a material may be used. Moreover, the said material has a heat resistant thing.
 上記第1実施形態において、接続端子5,5がアルミヒートシンク2の放熱平面22の延在方向延びるようにしていたが、接続端子5,5がアルミヒートシンク2の放熱平面22の延在方向に対して斜め方向に延びるようにしてもよい。 In the first embodiment, the connection terminals 5 and 5 extend in the extending direction of the heat radiation plane 22 of the aluminum heat sink 2. However, the connection terminals 5 and 5 extend in the extending direction of the heat dissipation plane 22 of the aluminum heat sink 2. May extend in an oblique direction.
 上記第1実施形態において、密着平面21は放熱平面22と略平行になっていたが、密着平面21を放熱平面22に対して傾斜する傾斜面としてもよい。 In the first embodiment, the contact plane 21 is substantially parallel to the heat dissipation plane 22, but the contact plane 21 may be an inclined surface that is inclined with respect to the heat dissipation plane 22.
 上記第1実施形態において、アルミヒートシンク2の密着平面21にガラスエポキシ基板3を直接接触させてもよし、あるいは、アルミヒートシンク2の密着平面21にガラスエポキシ基板3を間接に接触させてもよい。例えば、上記アルミヒートシンク2の密着平面21に薄い接着膜を介してガラスエポキシ基板3を取り付けてもよい。 In the first embodiment, the glass epoxy substrate 3 may be in direct contact with the adhesion plane 21 of the aluminum heat sink 2 or the glass epoxy substrate 3 may be in indirect contact with the adhesion plane 21 of the aluminum heat sink 2. For example, the glass epoxy substrate 3 may be attached to the adhesion flat surface 21 of the aluminum heat sink 2 via a thin adhesive film.
 上記第1実施形態において、取付板6の後端部をアルミヒートシンク2およびガラスエポキシ基板3の両方に熱的に接続させてもよいし、あるいは、アルミヒートシンク2のみに熱的に接続してもよいし、あるいは、ガラスエポキシ基板3のみに熱的に接続してもよい。 In the first embodiment, the rear end portion of the mounting plate 6 may be thermally connected to both the aluminum heat sink 2 and the glass epoxy substrate 3 or may be thermally connected only to the aluminum heat sink 2. Alternatively, it may be thermally connected only to the glass epoxy substrate 3.
 上記第1実施形態のガラスエポキシ基板3に換えて、例えば、半導体基板、セラミック基板、金属基板等を用いてもよい。 For example, a semiconductor substrate, a ceramic substrate, a metal substrate, or the like may be used instead of the glass epoxy substrate 3 of the first embodiment.
 〔第2実施形態〕
 図4は、本発明の第2実施形態の加熱調理器の正面を斜め上方からみた図である。なお、上記加熱調理器は上記第1実施形態のLEDランプ1を備えているので、上記第1実施形態の構成部と同一構成部は上記第1実施形態の構成部と同一参照番号を付して説明を行う。また、以下の説明において、「左」は加熱調理器を正面(扉102)側から見たときの左を指し、「右」は加熱調理器を正面(扉102)側から見たときの右を指す。
[Second Embodiment]
FIG. 4: is the figure which looked at the front of the heating cooker of 2nd Embodiment of this invention from diagonally upward. In addition, since the said heating cooker is provided with the LED lamp 1 of the said 1st Embodiment, the component same as the component of the said 1st Embodiment attaches | subjects the same reference number as the component of the said 1st Embodiment. To explain. In the following description, “left” indicates the left when the cooking device is viewed from the front (door 102) side, and “right” indicates the right when the cooking device is viewed from the front (door 102) side. Point to.
 上記加熱調理器は、直方体形状のケーシング101の正面に、下端側の辺を略中心に回動する扉102が取り付けられている。この扉102の上部にハンドル103を取り付けると共に、扉102の略中央に耐熱ガラス104を取り付けている。また、扉102の右側には操作パネル105を設けている。この操作パネル105は、液晶表示部106と、ユーザが操作する操作ボタン群107とを有している。また、ケーシング101の上側かつ右側後方には、排気口108aを有する排気口カバー108を設けている。さらに、ケーシング101の前面の下部(扉102の下方の部分)には、露受容器109を着脱自在に取り付けている。 In the cooking device, a door 102 is attached to the front surface of the rectangular parallelepiped casing 101 so as to rotate about the lower end side. A handle 103 is attached to the upper part of the door 102, and a heat resistant glass 104 is attached to the approximate center of the door 102. An operation panel 105 is provided on the right side of the door 102. The operation panel 105 includes a liquid crystal display unit 106 and an operation button group 107 operated by a user. An exhaust port cover 108 having an exhaust port 108a is provided on the upper side of the casing 101 and on the right rear side. Further, a dew receiving device 109 is detachably attached to a lower portion of the front surface of the casing 101 (a portion below the door 102).
 図5は、上記加熱調理器の正面から見た縦断面の模式図である。また、図6は、上記加熱調理器の右側方から見た縦断面の模式図である。 FIG. 5 is a schematic diagram of a longitudinal section viewed from the front of the heating cooker. FIG. 6 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
 上記ケーシング101内には、図5に示すように、被加熱物123をトレイ190と共に収容可能な加熱室110を設けている。この加熱室110の右側方には、図6に示すように、前面側から着脱自在に挿入された給水タンク111を配置している。また、図5,図6に示すように、給水タンク111の後面側には、給水タンク111に接続された蒸気発生装置112を配置している。この蒸気発生装置112には蒸気供給通路113の一端を接続し、循環ユニット114には蒸気供給通路113の他端を接続している。 In the casing 101, as shown in FIG. 5, there is provided a heating chamber 110 in which the object to be heated 123 can be accommodated together with the tray 190. As shown in FIG. 6, a water supply tank 111 that is detachably inserted from the front side is disposed on the right side of the heating chamber 110. As shown in FIGS. 5 and 6, a steam generator 112 connected to the water supply tank 111 is disposed on the rear surface side of the water supply tank 111. One end of a steam supply passage 113 is connected to the steam generator 112, and the other end of the steam supply passage 113 is connected to the circulation unit 114.
 上記蒸気発生装置112は、ヒータ(図示せず)を有しており、給水タンク111から供給された水を上記ヒータで加熱して、飽和水蒸気を生成する。この蒸気発生装置112で生成された飽和水蒸気は、蒸気供給通路113を介して蒸気供給口113aから循環ユニット114内の吸込口128の下流側に供給される。 The steam generator 112 has a heater (not shown), and the water supplied from the water supply tank 111 is heated by the heater to generate saturated steam. The saturated steam generated by the steam generator 112 is supplied from the steam supply port 113 a to the downstream side of the suction port 128 in the circulation unit 114 through the steam supply passage 113.
 上記蒸気供給通路113の蒸気供給口113aは、循環ユニット114内の吸込口128の近傍に配置されている。また、循環ユニット114内には、吸込口128に対向するように循環ファン118が配置されている。この循環ファン118は、循環ファン用モータ119によって駆動される。 The steam supply port 113 a of the steam supply passage 113 is disposed in the vicinity of the suction port 128 in the circulation unit 114. Further, a circulation fan 118 is disposed in the circulation unit 114 so as to face the suction port 128. The circulation fan 118 is driven by a circulation fan motor 119.
 上記加熱室110の上面および左側面に、L字状に屈曲した蒸気ダクト180を取り付けている。この蒸気ダクト180は、加熱室110の上壁に固定された第1ダクト部181と、第1ダクト部181の左側方から下側に屈曲する屈曲部182と、加熱室110の左側壁に固定され、屈曲部182を介して第1ダクト部181に連なる第2ダクト部183とを有している。 A steam duct 180 bent in an L shape is attached to the upper and left sides of the heating chamber 110. The steam duct 180 is fixed to the first duct portion 181 fixed to the upper wall of the heating chamber 110, the bent portion 182 bent from the left side to the lower side of the first duct portion 181, and the left wall of the heating chamber 110. And a second duct portion 183 connected to the first duct portion 181 through the bent portion 182.
 上記蒸気ダクト180の第1ダクト部181内に、シーズヒータなどからなる加熱ヒータ121を収納している。この第1ダクト部181および加熱ヒータ121が過熱蒸気生成装置を構成している。なお、過熱蒸気生成装置は蒸気ダクトとは別に設けてもよい。 A heater 121 made of a sheathed heater or the like is housed in the first duct portion 181 of the steam duct 180. The first duct portion 181 and the heater 121 constitute a superheated steam generator. The superheated steam generator may be provided separately from the steam duct.
 また、上記第1ダクト部181の右側の端部には、循環ユニット114の上部に設けられた蒸気供給口114aが接続されており、第1ダクト部181内は循環ユニット114内に連通している。そして、加熱室110の天面には複数の第1蒸気吹出口124が設けられており、蒸気ダクト180の第1ダクト部181内の空間は第1蒸気吹出口124を介して加熱室110内に連通している。一方、蒸気ダクト180の第2ダクト部183は、加熱室110の左側面に設けられた複数の第2蒸気吹出口125を介して加熱室110内に連通している。 In addition, a steam supply port 114 a provided on the upper portion of the circulation unit 114 is connected to the right end of the first duct portion 181, and the inside of the first duct portion 181 communicates with the circulation unit 114. Yes. A plurality of first steam outlets 124 are provided on the top surface of the heating chamber 110, and the space in the first duct portion 181 of the steam duct 180 is inside the heating chamber 110 via the first steam outlet 124. Communicating with On the other hand, the second duct portion 183 of the steam duct 180 communicates with the inside of the heating chamber 110 via a plurality of second steam outlets 125 provided on the left side surface of the heating chamber 110.
 上記加熱室110と蒸気ダクト180との隙間は、耐熱樹脂などによりシールされている。また、加熱室110および蒸気ダクト180は、加熱室110の前面開口を除いて断熱材により覆われている。 The gap between the heating chamber 110 and the steam duct 180 is sealed with a heat resistant resin or the like. The heating chamber 110 and the steam duct 180 are covered with a heat insulating material except for the front opening of the heating chamber 110.
 上記循環ユニット114と蒸気ダクト180と加熱室110とそれらを接続する接続部材とによって、熱媒体の循環経路が形成されている。そして、この循環経路における循環ユニット114の加熱室110との境界部に、蒸気発生装置112で生成された飽和水蒸気が供給される。 The circulation path of the heat medium is formed by the circulation unit 114, the steam duct 180, the heating chamber 110, and the connection member connecting them. Then, saturated steam generated by the steam generator 112 is supplied to the boundary portion of the circulation unit 114 with the heating chamber 110 in this circulation path.
 ここで、熱媒体は、加熱された空気であってもよいし、水蒸気を含む加熱された空気であってもよく、100℃以上に加熱された過熱水蒸気を含む空気であってもよく、さらに、100℃以上に加熱された過熱水蒸気を主とするものであってもよい。 Here, the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
 また、上記加熱室110の下側の空間にはマグネトロン120を配置している。このマグネトロン120で発生したマイクロ波は、導波管(図示せず)によって加熱室110の下部中央に導かれ、回転アンテナ(図示せず)によって攪拌されながら加熱室110内の上方に向かって放射されて被加熱物123を加熱する。この場合、被加熱物123は加熱室110内の底部に載置される。 Also, a magnetron 120 is disposed in the space below the heating chamber 110. The microwave generated in the magnetron 120 is guided to the lower center of the heating chamber 110 by a waveguide (not shown), and radiates upward in the heating chamber 110 while being stirred by a rotating antenna (not shown). Thus, the article to be heated 123 is heated. In this case, the article to be heated 123 is placed on the bottom of the heating chamber 110.
 また、上記加熱室110の右側壁の中央部には吸込口128を設けを設けている。そして、加熱室110の右側壁には、吸込口128の前面側に位置する給気口133(図9に示す)を設けると共に、吸込口128の後面側に位置する第1排気口136を設けている。給気口133は扉102近傍に位置し、給気口133から加熱室110内に吹き出される外気が扉102に沿って流れる。また、加熱室110の後面側壁面の右下側に、第1排気口136よりも開口面積が小さい第2排気口137を設けている。 In addition, a suction port 128 is provided in the center of the right side wall of the heating chamber 110. The right side wall of the heating chamber 110 is provided with an air supply port 133 (shown in FIG. 9) located on the front side of the suction port 128 and a first exhaust port 136 located on the rear side of the suction port 128. ing. The air supply port 133 is located in the vicinity of the door 102, and the outside air blown into the heating chamber 110 from the air supply port 133 flows along the door 102. A second exhaust port 137 having an opening area smaller than that of the first exhaust port 136 is provided on the lower right side of the rear side wall surface of the heating chamber 110.
 上記加熱室110の右側面に配置された循環ユニット114に、循環ファン118を駆動する循環ファン用モータ119を取り付けている。この循環ファン118によって加熱室110内の蒸気や空気は、吸込口128から吸い込まれて蒸気ダクト180を介して第1,第2蒸気吹出口124,125から加熱室110内に吹き出す。また、循環ユニット114の吸込口128近傍には、加熱室110内の熱媒体(蒸気を含む空気)の温度を検出する室内温度センサ129を配置している。 A circulation fan motor 119 for driving the circulation fan 118 is attached to the circulation unit 114 disposed on the right side surface of the heating chamber 110. Steam and air in the heating chamber 110 are sucked from the suction port 128 by the circulation fan 118 and blown into the heating chamber 110 from the first and second steam outlets 124 and 125 through the steam duct 180. Further, an indoor temperature sensor 129 for detecting the temperature of the heat medium (air containing steam) in the heating chamber 110 is disposed in the vicinity of the suction port 128 of the circulation unit 114.
 上記加熱室110内の被加熱物123は、蒸気ダクト180の第1ダクト部181内に配置された加熱ヒータ121の輻射熱によって加熱される。また、加熱ヒータ121によって蒸気ダクト180を通過する熱媒体(蒸気を含む空気)が加熱され、加熱された熱媒体が第1,第2蒸気吹出口124,125から吹き出される。これにより、加熱室110内の熱媒体が所定温度に維持される。また、加熱室110に供給すべき蒸気を加熱ヒータ121によりさらに昇温して100℃以上の過熱蒸気を生成することができる。 The object 123 to be heated in the heating chamber 110 is heated by the radiant heat of the heater 121 disposed in the first duct portion 181 of the steam duct 180. Moreover, the heating medium (air containing steam) passing through the steam duct 180 is heated by the heater 121, and the heated heating medium is blown out from the first and second steam outlets 124 and 125. Thereby, the heat medium in the heating chamber 110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 110 can be further heated by the heater 121 to generate superheated steam at 100 ° C. or higher.
 上記ケーシング101内の下側には、冷却ファン部122、電装部品117およびマグネトロン120を配置している。また、ケーシング101内の加熱室110の右側方に送風ダクト131を配置している。この送風ダクト131は、希釈ファン130と、この希釈ファン130を駆動する希釈ファン用モータ138とを内部に収納している。冷却ファン部122は、冷却ファン115と、その冷却ファン115を駆動する冷却ファン用モータ116とを有する。 The cooling fan part 122, the electrical component 117, and the magnetron 120 are disposed below the casing 101. In addition, an air duct 131 is disposed on the right side of the heating chamber 110 in the casing 101. The blower duct 131 houses therein a dilution fan 130 and a dilution fan motor 138 that drives the dilution fan 130. The cooling fan unit 122 includes a cooling fan 115 and a cooling fan motor 116 that drives the cooling fan 115.
 上記電装部品117は、加熱調理器の各部を駆動する駆動回路やこの駆動回路を制御する制御回路等を有している。また、冷却ファン115は、ケーシング101内に外気を取り込み、発熱する電装部品117やマグネトロン120を冷却する。また、冷却ファン115によってケーシング101内に流入した外気の一部は、希釈ファン130により送風ダクト131内に導かれると共に、残りの外気は、ケーシング101の背面等に形成された開口(図示せず)から外部に排出される。 The electrical component 117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. In addition, the cooling fan 115 takes outside air into the casing 101 and cools the electrical component 117 and the magnetron 120 that generate heat. A part of the outside air that has flowed into the casing 101 by the cooling fan 115 is guided into the air duct 131 by the dilution fan 130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 101 and the like. ) To the outside.
 図6に示すように、加熱室110の右側壁に第1排気口136から排気ダンパ(図示せず)を介して接続された第1排気ダクト134を配置している。この第1排気ダクト134は、横方向に延びる横通路134aと、その横通路134aから上方に屈曲する縦通路134bとを有している。縦通路134bの上端に排気口カバー108を着脱可能に取り付けている。 As shown in FIG. 6, a first exhaust duct 134 connected to the right side wall of the heating chamber 110 from a first exhaust port 136 via an exhaust damper (not shown) is disposed. The first exhaust duct 134 has a lateral passage 134a extending in the lateral direction and a longitudinal passage 134b bent upward from the lateral passage 134a. An exhaust port cover 108 is detachably attached to the upper end of the vertical passage 134b.
 上記第1排気ダクト134の横通路134aの背面側に、吸込ダクト127を介して外気を吸い込む吸込口(図示せず)を設けている。この吸込口または第1排気口136のいずれか一方を択一的に選択して第1排気ダクト134に接続するように排気ダンパを制御する。上記排気ダンパは、排気ダンパ用モータ160(図7に示す)より駆動される。 A suction port (not shown) for sucking outside air through a suction duct 127 is provided on the back side of the lateral passage 134a of the first exhaust duct 134. The exhaust damper is controlled so that either one of the suction port or the first exhaust port 136 is alternatively selected and connected to the first exhaust duct 134. The exhaust damper is driven by an exhaust damper motor 160 (shown in FIG. 7).
 上記第1排気ダクト134の縦通路134bは、上側に向かって流路面積が拡大されて排気口カバー108に連結される。排気口カバー108の上部には、前方に向かって開口した排気口108aが形成されている。 The vertical passage 134b of the first exhaust duct 134 is connected to the exhaust port cover 108 with the flow passage area enlarged toward the upper side. An exhaust port 108 a that opens forward is formed in the upper portion of the exhaust port cover 108.
 一方、上記第2排気口137に第2排気ダクト135の下端を接続し、その第2排気ダクト135の上端を第1排気ダクト134の縦通路134bの下側に接続している。 On the other hand, the lower end of the second exhaust duct 135 is connected to the second exhaust port 137, and the upper end of the second exhaust duct 135 is connected to the lower side of the vertical passage 134b of the first exhaust duct 134.
 上記第2排気ダクト135は、第1排気ダクト134よりも流通面積が小さい。この第2排気口137からの排気は、第2排気ダクト135を介して第1排気ダクト134に流入し、排気口カバー108の排気口108aから外部に排出される。 The distribution area of the second exhaust duct 135 is smaller than that of the first exhaust duct 134. The exhaust from the second exhaust port 137 flows into the first exhaust duct 134 via the second exhaust duct 135 and is discharged to the outside from the exhaust port 108 a of the exhaust port cover 108.
 また、上記加熱室110の側方の送風ダクト131は、希釈ファン収納部131aと、希釈ファン130から上方に延びた縦通路131bと、縦通路131bから後面側に屈曲する横通路131cと、横通路131cから上方に屈曲するノズル部131dを有している。横通路131cとノズル部131dとが第1排気ダクト134内に挿入されている。 The air duct 131 on the side of the heating chamber 110 includes a dilution fan housing part 131a, a vertical passage 131b extending upward from the dilution fan 130, a horizontal passage 131c bent from the vertical passage 131b to the rear side, and a horizontal passage 131b. The nozzle portion 131d is bent upward from the passage 131c. The lateral passage 131c and the nozzle portion 131d are inserted into the first exhaust duct 134.
 上記送風ダクト131のノズル部131dの上端に開口部131eを設けている。これにより、第1排気ダクト134内にエジェクタが形成され、希釈ファン130によって第1排気口136から排気口108aに向かう気流を発生させる。 An opening 131e is provided at the upper end of the nozzle portion 131d of the air duct 131. As a result, an ejector is formed in the first exhaust duct 134, and the dilution fan 130 generates an air flow from the first exhaust port 136 toward the exhaust port 108a.
 また、上記送風ダクト131の横通路131cに、縦通路131bとの接続部の下端よりも下方に凹設される凹部が形成され、その凹部の一端に第1排気ダクト134内に開口するサブノズル部131fが形成される。 In addition, a recess is formed in the horizontal passage 131c of the blower duct 131 so as to be recessed below the lower end of the connection portion with the vertical passage 131b, and a sub nozzle portion that opens into the first exhaust duct 134 at one end of the recess. 131f is formed.
 さらに、上記送風ダクト131の縦通路131bの上部に給気通路132の一端を接続し、その給気通路132の他端を給気ダンパ140に接続している。給気通路132および給気ダンパ140は、希釈ファン130により給気口133を介して加熱室110に給気するための給気機構の一部である。この加熱室110の給気口133近傍かつ下側には、解凍センサ150を配置している。 Furthermore, one end of the air supply passage 132 is connected to the upper part of the vertical passage 131b of the air duct 131, and the other end of the air supply passage 132 is connected to the air supply damper 140. The air supply passage 132 and the air supply damper 140 are part of an air supply mechanism for supplying air to the heating chamber 110 via the air supply port 133 by the dilution fan 130. A thawing sensor 150 is disposed near and below the air inlet 133 of the heating chamber 110.
 上記給気ダンパ140は、給気口133を開閉するための耐熱樹脂製のダンパ本体141と、そのダンパ本体141を覆う耐熱樹脂製のハウジング142とを有している。 The air supply damper 140 has a heat-resistant resin damper body 141 for opening and closing the air supply port 133 and a heat-resistant resin housing 142 covering the damper body 141.
 図7は上記加熱調理器の制御ブロック図である。 FIG. 7 is a control block diagram of the heating cooker.
 上記加熱調理器は、マイクロコンピュータと入出力回路などからなる制御部200を電装部品17(図5,図6に示す)内に備えている。制御部200は、加熱ヒータ121,循環ファン用モータ119,冷却ファン用モータ116,希釈ファン用モータ138,給気ダンパ用モータ144,排気ダンパ用モータ160,操作パネル105,室内温度センサ129,解凍センサ150,給水ポンプ170,蒸気発生装置112およびマグネトロン120が接続されている。操作パネル105からの信号および室内温度センサ129,解凍センサ150からの検出信号に基づいて、制御部200は、加熱ヒータ121,循環ファン用モータ119,冷却ファン用モータ116,希釈ファン用モータ138,給気ダンパ用モータ144,排気ダンパ用モータ160,操作パネル105,給水ポンプ170,蒸気発生装置112およびマグネトロン120などを制御する。 The heating cooker includes a control unit 200 including a microcomputer and an input / output circuit in the electrical component 17 (shown in FIGS. 5 and 6). The control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, an air supply damper motor 144, an exhaust damper motor 160, an operation panel 105, an indoor temperature sensor 129, and thawing. The sensor 150, the feed water pump 170, the steam generator 112, and the magnetron 120 are connected. Based on the signal from the operation panel 105 and the detection signals from the indoor temperature sensor 129 and the thawing sensor 150, the control unit 200 includes a heater 121, a circulation fan motor 119, a cooling fan motor 116, a dilution fan motor 138, It controls the air damper motor 144, the exhaust damper motor 160, the operation panel 105, the water supply pump 170, the steam generator 112, the magnetron 120, and the like.
 図8は、上記扉102とケーシング101を取り外した状態の加熱調理器の後面を斜め上方から見た斜視図である。また、図9は、上記扉102とケーシング101を取り外した状態の加熱調理器の正面を斜め上方から見た斜視図である。 FIG. 8 is a perspective view of the rear surface of the cooking device in a state where the door 102 and the casing 101 are removed as viewed obliquely from above. Moreover, FIG. 9 is the perspective view which looked at the front of the heating cooker in the state which removed the said door 102 and the casing 101 from diagonally upward.
 上記加熱室110の前側には前面パネル126を設けている。この前面パネル126は、給水タンク111(図6に示す)を挿入するための挿入口126aを右側部に有している。また、加熱室110の右側壁の内面には、上段トレイ受部151a,151bと、中段トレイ受部152a,152b,152cと、下段トレイ受部153とを設けている。中段トレイ受部152a,152b間には解凍センサ150のセンサ部150aを配置している。 A front panel 126 is provided on the front side of the heating chamber 110. The front panel 126 has an insertion port 126a for inserting a water supply tank 111 (shown in FIG. 6) on the right side. Further, upper tray receiving portions 151 a and 151 b, middle tray receiving portions 152 a, 152 b and 152 c and a lower tray receiving portion 153 are provided on the inner surface of the right side wall of the heating chamber 110. A sensor unit 150a of the thawing sensor 150 is disposed between the middle tray receiving units 152a and 152b.
 図10は、上記前面パネル126の上部およびその近傍の部分を斜め上方から見た模式図である。 FIG. 10 is a schematic view of the upper portion of the front panel 126 and a portion in the vicinity thereof as viewed obliquely from above.
 上記蒸気ダクト180の第1ダクト部181と前面パネル126の上部との間には、鋼板で形成された枠体16を配置している。この枠体16の右側部には被取付部17を設けており、この被取付部17にLEDランプ1の取付板6をビス19で固定している。また、枠体16の下部に設けられたフランジ部18,18は、加熱室110の上壁にビス(図示せず)で固定されている。 Between the first duct part 181 of the steam duct 180 and the upper part of the front panel 126, a frame body 16 formed of a steel plate is disposed. A mounted portion 17 is provided on the right side of the frame body 16, and the mounting plate 6 of the LED lamp 1 is fixed to the mounted portion 17 with screws 19. Further, the flange portions 18 and 18 provided at the lower portion of the frame body 16 are fixed to the upper wall of the heating chamber 110 with screws (not shown).
 図11は、図10のXI-XI線から見た模式図である。 FIG. 11 is a schematic view taken along line XI-XI in FIG.
 上記LEDランプ1のアルミヒートシンク2の放熱平面22は枠体16の上部に密着している。また、加熱室110の上壁には、LEDランプ1に対向する複数のパンチング穴20,20,…を設けている。LEDランプ1から出射された光が複数のパンチング穴20,20,…を通って加熱室110内に入るようになっている。また、加熱室110内の蒸気などがパンチング穴20,20,…から加熱室110外に漏れないように、パンチング穴20,20,…上にガラス板24を配置している。 The heat radiation plane 22 of the aluminum heat sink 2 of the LED lamp 1 is in close contact with the upper portion of the frame body 16. Further, a plurality of punching holes 20, 20,... Facing the LED lamp 1 are provided on the upper wall of the heating chamber 110. The light emitted from the LED lamp 1 enters the heating chamber 110 through a plurality of punching holes 20, 20,. Moreover, the glass plate 24 is arrange | positioned on the punching holes 20, 20, ... so that the vapor | steam etc. in the heating chamber 110 may not leak out of the heating chamber 110 from the punching holes 20,20, ....
 上記構成の加熱調理器が過熱水蒸気で被加熱物123を加熱する場合、加熱ヒータ121で生成した100℃以上の過熱蒸気を複数の第1蒸気吹出口124,第2蒸気吹出口125から加熱室110内に供給する。このため、加熱ヒータ121を収納する第1ダクト部181の周辺温度は80℃~100℃にもなる。このような高温環境にLEDランプ1を配置しているが、発光ダイオード素子4の熱をアルミヒートシンク2を介して枠体16に非常に高い効率で放出できるので、発光ダイオード素子4の温度上昇を抑制することができる。したがって、発光ダイオード素子4の寿命を延ばすことができるので、LEDランプ1を頻繁に取り換えなくて済む。その結果、上記加熱調理器のランニングコストを低減することができる。 When the heating cooker having the above configuration heats the article to be heated 123 with superheated steam, superheated steam at 100 ° C. or higher generated by the heater 121 is heated from the plurality of first steam outlets 124 and second steam outlets 125. 110 is supplied. Therefore, the ambient temperature of the first duct portion 181 that houses the heater 121 is 80 ° C. to 100 ° C. Although the LED lamp 1 is arranged in such a high temperature environment, the heat of the light emitting diode element 4 can be released to the frame body 16 through the aluminum heat sink 2 with very high efficiency. Can be suppressed. Therefore, since the lifetime of the light emitting diode element 4 can be extended, it is not necessary to frequently replace the LED lamp 1. As a result, the running cost of the cooking device can be reduced.
 上記第2実施形態の鋼製の枠体16に換えて、例えば、Cu、Mo、WまたはAlから成る枠体を用いてもよい。 For example, a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 16 of the second embodiment.
 本発明の加熱調理器としては、例えば、過熱水蒸気を使用するオーブンレンジのみならず、過熱水蒸気を使用するオーブン、過熱水蒸気を使用しないオーブンレンジ、過熱水蒸気を使用しないオーブンなどがある。 Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
 本発明の加熱調理器では、オーブンレンジなどにおいて、過熱水蒸気または飽和水蒸気を用いることによって、ヘルシーな調理を行うことができる。例えば、本発明の加熱調理器では、温度が100℃以上の過熱水蒸気または飽和水蒸気を食品表面に供給し、食品表面に付着した過熱水蒸気または飽和水蒸気が凝縮して大量の凝縮潜熱を食品に与えるので、食品に熱を効率よく伝えることができる。また、凝縮水が食品表面に付着して塩分や油分が凝縮水と共に滴下することにより、食品中の塩分や油分を低減できる。さらに、加熱室内は過熱水蒸気または飽和水蒸気が充満して低酸素状態となることにより、食品の酸化を抑制した調理が可能となる。ここで、低酸素状態とは、加熱室内において酸素の体積%が10%以下(例えば0.5~3%)である状態を指す。 In the cooking device of the present invention, healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like. For example, in the cooking device of the present invention, superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food. Moreover, when condensed water adheres to the food surface and salt and oil are dropped together with condensed water, salt and oil in the food can be reduced. Further, the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation. Here, the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
 本発明の具体的な実施形態について説明したが、本発明は上記第1,第2実施形態に限定されるものではなく、本発明の範囲内で種々変更して実施することができる。 Although specific embodiments of the present invention have been described, the present invention is not limited to the first and second embodiments, and can be implemented with various modifications within the scope of the present invention.
 〔第3実施形態〕
 図13は、本発明の第3実施形態の加熱調理器が備えるLEDランプ2001を側方から見た模式図である。
[Third Embodiment]
FIG. 13: is the schematic diagram which looked at the LED lamp 2001 with which the heating cooker of 3rd Embodiment of this invention is provided from the side.
 上記LEDランプ2001は、基板の一例としてのガラスエポキシ基板2002と、発光ダイオード素子2003と、2本(図13では1本のみ見えている)の略矩形板状の接続端子2004,2004と、透明または半透明な部材の一例としてのカバーガラス2005と、金属製の口金2006とを備えている。 The LED lamp 2001 includes a glass epoxy substrate 2002 as an example of a substrate, a light emitting diode element 2003, two (only one is visible in FIG. 13) connection terminals 2004 and 2004, and a transparent terminal. Alternatively, a cover glass 2005 as an example of a translucent member and a metal base 2006 are provided.
 上記ガラスエポキシ基板2002は、後述する加熱室2110側に向けられる第1面2021と、加熱室2110とは反対側に向けられる平坦な第2面2022とを有して、縦の寸法が横の寸法よりも長くなっている。また、ガラスエポキシ基板2002の厚さ(第1面2021と第2面2022との間の寸法)は略一定であり、ガラスエポキシ基板2002の縦および横の寸法より小さくなっている。このガラスエポキシ基板2002には、接続端子2004,2004からの電流を発光ダイオード素子2003に供給するための配線2023を設けている。すなわち、発光ダイオード素子2003と接続端子2004,2004を、ガラスエポキシ基板2002上の配線2023を介して接続している。また、ガラスエポキシ基板2002の接続端子2004,2004側の一部は口金2006内に挿入されている。一方、ガラスエポキシ基板2002の残りの大部分はカバーガラス2005で覆われている。なお、ガラスエポキシ基板2002の縦の寸法とは、図13中の左右方向の寸法に相当する。また、ガラスエポキシ基板2002の横の寸法とは、図13の紙面に対して垂直な方向の寸法に相当する。 The glass epoxy substrate 2002 has a first surface 2021 directed to the heating chamber 2110 described later, and a flat second surface 2022 directed to the opposite side of the heating chamber 2110, and the vertical dimension is horizontal. It is longer than the dimensions. Further, the thickness of the glass epoxy substrate 2002 (the dimension between the first surface 2021 and the second surface 2022) is substantially constant, and is smaller than the vertical and horizontal dimensions of the glass epoxy substrate 2002. The glass epoxy substrate 2002 is provided with wiring 2023 for supplying current from the connection terminals 2004 and 2004 to the light emitting diode element 2003. That is, the light emitting diode element 2003 and the connection terminals 2004 and 2004 are connected via the wiring 2023 on the glass epoxy substrate 2002. A part of the glass epoxy board 2002 on the side of the connection terminals 2004 and 2004 is inserted into the base 2006. On the other hand, most of the remaining part of the glass epoxy substrate 2002 is covered with a cover glass 2005. Note that the vertical dimension of the glass epoxy substrate 2002 corresponds to the horizontal dimension in FIG. Further, the horizontal dimension of the glass epoxy substrate 2002 corresponds to a dimension in a direction perpendicular to the paper surface of FIG.
 また、上記ガラスエポキシ基板2002の口金2006とは反対側の一部は、取付板の一例としての略矩形板形状の取付部2024となっている。この取付部2024は、カバーガラス2005から突出して、ガラスエポキシ基板2002の第2面2022の延在方向に延びている。そして、取付部2024には、ビス2010(図21に示す)が挿通される取付穴2025が設けられている。また、取付部2024は接続端子2004,2004から絶縁している。 Further, a part of the glass epoxy substrate 2002 opposite to the base 2006 is a mounting portion 2024 having a substantially rectangular plate shape as an example of a mounting plate. The attachment portion 2024 protrudes from the cover glass 2005 and extends in the extending direction of the second surface 2022 of the glass epoxy substrate 2002. The mounting portion 2024 is provided with a mounting hole 2025 through which a screw 2010 (shown in FIG. 21) is inserted. Further, the mounting portion 2024 is insulated from the connection terminals 2004 and 2004.
 上記発光ダイオード素子2003は、ガラスエポキシ基板2002の第1面2021に取り付けられている。また、発光ダイオード素子2003は蛍光体2007で気密封止されている。この蛍光体2007は、発光ダイオード素子2003から出射された光の波長を変換するものである。 The light emitting diode element 2003 is attached to the first surface 2021 of the glass epoxy substrate 2002. The light emitting diode element 2003 is hermetically sealed with a phosphor 2007. The phosphor 2007 is for converting the wavelength of light emitted from the light emitting diode element 2003.
 上記カバーガラス2005は、ガラスエポキシ基板2002の一部の第1面2021側と、発光ダイオード素子2003とを覆っている。このカバーガラス2005内の空間は密閉空間であり、外部の気体がカバーガラス2005内に入らないようになっている。また、カバーガラス2005は蛍光体2007で波長が変換された光を透過する。 The cover glass 2005 covers a part of the first surface 2021 side of the glass epoxy substrate 2002 and the light emitting diode element 2003. The space in the cover glass 2005 is a sealed space so that external gas does not enter the cover glass 2005. The cover glass 2005 transmits light whose wavelength has been converted by the phosphor 2007.
 上記接続端子2004,2004は、ガラスエポキシ基板2002の後方に設けられて、放熱平面2022の延在方向に延びている。この接続端子2004,2004のそれぞれの先端部には貫通穴2041を設けている。これにより、接続端子2004,2004を差し込み口(図示せず)に挿入したとき、差し込み口に設けられた突起が貫通穴2041に嵌合して、接続端子2004,2004の挿入が充分になったことを感触で判るようになっている。 The connection terminals 2004 and 2004 are provided behind the glass epoxy substrate 2002 and extend in the extending direction of the heat radiation plane 2022. A through hole 2041 is provided at the tip of each of the connection terminals 2004 and 2004. As a result, when the connection terminals 2004 and 2004 are inserted into the insertion port (not shown), the protrusions provided in the insertion port are fitted into the through holes 2041 and the connection terminals 2004 and 2004 are sufficiently inserted. You can understand this by touch.
 上記口金2006はカバーガラス2005と接続端子2004,2004との間に設けられている。この口金2006と接続端子2004,2004との間は耐熱性の封止樹脂8で封止されている。 The base 2006 is provided between the cover glass 2005 and the connection terminals 2004 and 2004. A space between the base 2006 and the connection terminals 2004 and 2004 is sealed with a heat-resistant sealing resin 8.
 図14は、上記加熱調理器の正面を斜め上方からみた図である。なお、以下の説明において、「左」は加熱調理器を正面(扉2102)側から見たときの左を指し、「右」は加熱調理器を正面(扉2102)側から見たときの右を指す。 FIG. 14 is a view of the front surface of the heating cooker as viewed obliquely from above. In the following description, “left” indicates the left when the cooking device is viewed from the front (door 2102) side, and “right” indicates the right when the cooking device is viewed from the front (door 2102). Point to.
 上記加熱調理器は、直方体形状であって鉄などの金属製のケーシング2101の正面に、下端側の辺を略中心に回動する扉2102が取り付けられている。この扉2102の上部にハンドル2103を取り付けると共に、扉2102の略中央に耐熱ガラス104を取り付けている。また、扉2102の右側には操作パネル2105を設けている。この操作パネル2105は、液晶表示部106と、ユーザが操作する操作ボタン群2107とを有している。また、ケーシング2101の上側かつ右側後方には、排気口2108aを有する排気口カバー2108を設けている。さらに、ケーシング2101の前面の下部(扉2102の下方の部分)には、露受容器2109を着脱自在に取り付けている。 The heating cooker has a rectangular parallelepiped shape, and a door 2102 that rotates about the lower end side is attached to the front surface of a casing 2101 made of metal such as iron. A handle 2103 is attached to the upper part of the door 2102, and a heat resistant glass 104 is attached to the approximate center of the door 2102. An operation panel 2105 is provided on the right side of the door 2102. The operation panel 2105 includes a liquid crystal display unit 106 and an operation button group 2107 operated by the user. Further, an exhaust port cover 2108 having an exhaust port 2108a is provided on the upper side of the casing 2101 and on the right rear side. Further, a dew receptacle 2109 is detachably attached to a lower part of the front surface of the casing 2101 (a part below the door 2102).
 図15は、上記加熱調理器の正面から見た縦断面の模式図である。また、図16は、上記加熱調理器の右側方から見た縦断面の模式図である。 FIG. 15 is a schematic diagram of a longitudinal section viewed from the front of the cooking device. FIG. 16 is a schematic diagram of a longitudinal section viewed from the right side of the cooking device.
 上記ケーシング2101内には、図15に示すように、被加熱物2123をトレイ190と共に収容可能な加熱室2110を設けている。この加熱室2110は、正面側に開口を有し、側面、底面および天面がステンレス鋼板からなっている。また、加熱室2110の右側方には、図16に示すように、正面側から着脱自在に挿入された給水タンク2111を配置している。また、図15,図16に示すように、給水タンク2111の後面側には、給水タンク2111に接続された蒸気発生装置2112を配置している。この蒸気発生装置2112には蒸気供給通路2113の一端を接続し、循環ユニット2114には蒸気供給通路2113の他端を接続している。 In the casing 2101, as shown in FIG. 15, there is provided a heating chamber 2110 that can accommodate the object to be heated 2123 together with the tray 190. This heating chamber 2110 has an opening on the front side, and the side, bottom and top surfaces are made of stainless steel plates. Further, on the right side of the heating chamber 2110, as shown in FIG. 16, a water supply tank 2111 is detachably inserted from the front side. As shown in FIGS. 15 and 16, a steam generator 2112 connected to the water supply tank 2111 is disposed on the rear surface side of the water supply tank 2111. One end of a steam supply passage 2113 is connected to the steam generator 2112, and the other end of the steam supply passage 2113 is connected to the circulation unit 2114.
 上記蒸気発生装置2112は、ヒータ(図示せず)を有しており、給水タンク2111から供給された水を上記ヒータで加熱して、飽和水蒸気を生成する。この蒸気発生装置2112で生成された飽和水蒸気は、蒸気供給通路2113を介して蒸気供給口2113aから循環ユニット2114内の吸込口2128の下流側に供給される。 The steam generator 2112 has a heater (not shown), and heats the water supplied from the water supply tank 2111 with the heater to generate saturated steam. The saturated steam generated by the steam generator 2112 is supplied from the steam supply port 2113a to the downstream side of the suction port 2128 in the circulation unit 2114 via the steam supply passage 2113.
 上記蒸気供給通路2113の蒸気供給口2113aは、循環ユニット2114内の吸込口2128の近傍に配置されている。また、循環ユニット2114内には、吸込口2128に対向するように循環ファン2118が配置されている。 The steam supply port 2113 a of the steam supply passage 2113 is disposed in the vicinity of the suction port 2128 in the circulation unit 2114. Further, a circulation fan 2118 is disposed in the circulation unit 2114 so as to face the suction port 2128.
 上記加熱室2110の上面および左側面に、L字状に屈曲した蒸気ダクト2180を取り付けている。この蒸気ダクト2180は、加熱室2110の上壁に固定された第1ダクト部2181と、第1ダクト部2181の左側方から下側に屈曲する屈曲部182と、加熱室2110の左側壁に固定され、屈曲部182を介して第1ダクト部2181に連なる第2ダクト部2183とを有している。 A steam duct 2180 bent in an L shape is attached to the upper surface and the left side surface of the heating chamber 2110. The steam duct 2180 is fixed to the first duct portion 2181 fixed to the upper wall of the heating chamber 2110, the bent portion 182 bent from the left side of the first duct portion 2181 to the lower side, and the left wall of the heating chamber 2110. And a second duct portion 2183 connected to the first duct portion 2181 via the bent portion 182.
 上記蒸気ダクト2180の第1ダクト部2181内に、シーズヒータなどからなる加熱ヒータ2121を収納している。この第1ダクト部2181および加熱ヒータ2121が過熱蒸気生成装置を構成している。なお、過熱蒸気生成装置は蒸気ダクトとは別に設けてもよい。 A heater 2121 made of a sheathed heater or the like is housed in the first duct portion 2181 of the steam duct 2180. The first duct portion 2181 and the heater 2121 constitute a superheated steam generator. The superheated steam generator may be provided separately from the steam duct.
 また、上記第1ダクト部2181の右側の端部には、循環ユニット2114の上部に設けられた蒸気供給口2114aが接続されており、第1ダクト部2181内は循環ユニット2114内に連通している。そして、加熱室2110の天面には複数の第1蒸気吹出口2124が設けられており、蒸気ダクト2180の第1ダクト部2181内の空間は第1蒸気吹出口2124を介して加熱室2110内に連通している。一方、蒸気ダクト2180の第2ダクト部2183は、加熱室2110の左側面に設けられた複数の第2蒸気吹出口2125を介して加熱室2110内に連通している。 In addition, a steam supply port 2114 a provided at the upper portion of the circulation unit 2114 is connected to the right end of the first duct portion 2181, and the inside of the first duct portion 2181 communicates with the circulation unit 2114. Yes. A plurality of first steam outlets 2124 are provided on the top surface of the heating chamber 2110, and the space in the first duct portion 2181 of the steam duct 2180 is inside the heating chamber 2110 via the first steam outlet 2124. Communicating with On the other hand, the second duct portion 2183 of the steam duct 2180 communicates with the inside of the heating chamber 2110 through a plurality of second steam outlets 2125 provided on the left side surface of the heating chamber 2110.
 上記加熱室2110と蒸気ダクト2180との隙間は、耐熱樹脂などによりシールされている。また、加熱室2110および蒸気ダクト2180は、加熱室2110の正面側の開口を除いて断熱材により覆われている。 The gap between the heating chamber 2110 and the steam duct 2180 is sealed with a heat resistant resin or the like. The heating chamber 2110 and the steam duct 2180 are covered with a heat insulating material except for the opening on the front side of the heating chamber 2110.
 上記循環ユニット2114と蒸気ダクト2180と加熱室2110とそれらを接続する接続部材とによって、熱媒体の循環経路が形成されている。そして、この循環経路における循環ユニット2114の加熱室2110との境界部に、蒸気発生装置2112で生成された飽和水蒸気が供給される。 The circulation path of the heat medium is formed by the circulation unit 2114, the steam duct 2180, the heating chamber 2110, and the connecting member that connects them. Then, saturated steam generated by the steam generator 2112 is supplied to a boundary portion of the circulation unit 2114 with the heating chamber 2110 in this circulation path.
 ここで、熱媒体は、加熱された空気であってもよいし、水蒸気を含む加熱された空気であってもよく、100℃以上に加熱された過熱水蒸気を含む空気であってもよく、さらに、100℃以上に加熱された過熱水蒸気を主とするものであってもよい。 Here, the heating medium may be heated air, may be heated air containing water vapor, may be air containing superheated steam heated to 100 ° C. or higher, and The main component may be superheated steam heated to 100 ° C. or higher.
 また、上記加熱室2110の下側の空間にはマグネトロン2120を配置している。このマグネトロン2120で発生したマイクロ波は、導波管(図示せず)によって加熱室2110の下部中央に導かれ、回転アンテナ(図示せず)によって攪拌されながら加熱室2110内の上方に向かって放射されて被加熱物2123を加熱する。この場合、被加熱物2123は加熱室2110内の底部に載置される。 Further, a magnetron 2120 is disposed in the space below the heating chamber 2110. The microwave generated by the magnetron 2120 is guided to the lower center of the heating chamber 2110 by a waveguide (not shown), and radiates upward in the heating chamber 2110 while being stirred by a rotating antenna (not shown). Thus, the article to be heated 2123 is heated. In this case, the object to be heated 2123 is placed on the bottom in the heating chamber 2110.
 また、上記加熱室2110の右側壁の中央部には吸込口2128を設けを設けている。そして、加熱室2110の右側壁には、吸込口2128の正面側に位置する給気口2133(図19に示す)を設けると共に、吸込口2128の後面側に位置する第1排気口2136を設けている。給気口2133は扉2102近傍に位置し、給気口2133から加熱室2110内に吹き出される外気が扉2102に沿って流れる。また、加熱室2110の後面側壁面の右下側に、第1排気口2136よりも開口面積が小さい第2排気口2137を設けている。 Also, a suction port 2128 is provided at the center of the right side wall of the heating chamber 2110. The right side wall of the heating chamber 2110 is provided with an air supply port 2133 (shown in FIG. 19) located on the front side of the suction port 2128 and a first exhaust port 2136 located on the rear side of the suction port 2128. ing. The air supply port 2133 is located in the vicinity of the door 2102, and outside air blown out from the air supply port 2133 into the heating chamber 2110 flows along the door 2102. A second exhaust port 2137 having an opening area smaller than that of the first exhaust port 2136 is provided on the lower right side of the rear side wall surface of the heating chamber 2110.
 上記加熱室2110の右側面に配置された循環ユニット2114に、循環ファン2118を駆動する循環ファン用モータ2119を取り付けている。この循環ファン2118によって加熱室2110内の蒸気や空気は、吸込口2128から吸い込まれて蒸気ダクト2180を介して第1,第2蒸気吹出口2124,2125から加熱室2110内に吹き出す。また、循環ユニット2114の吸込口2128近傍には、加熱室2110内の熱媒体(蒸気を含む空気)の温度を検出する室内温度センサ2129を配置している。 A circulation fan motor 2119 for driving the circulation fan 2118 is attached to the circulation unit 2114 disposed on the right side surface of the heating chamber 2110. Steam or air in the heating chamber 2110 is sucked from the suction port 2128 by the circulation fan 2118 and blown out from the first and second steam outlets 2124 and 2125 into the heating chamber 2110 via the steam duct 2180. In addition, an indoor temperature sensor 2129 that detects the temperature of the heat medium (air containing steam) in the heating chamber 2110 is disposed in the vicinity of the suction port 2128 of the circulation unit 2114.
 上記加熱室2110内の被加熱物2123は、蒸気ダクト2180の第1ダクト部2181内に配置された加熱ヒータ2121の輻射熱によって加熱される。また、加熱ヒータ2121によって蒸気ダクト2180を通過する熱媒体(蒸気を含む空気)が加熱され、加熱された熱媒体が第1,第2蒸気吹出口2124,2125から吹き出される。これにより、加熱室2110内の熱媒体が所定温度に維持される。また、加熱室2110に供給すべき蒸気を加熱ヒータ2121によりさらに昇温して100℃以上の過熱蒸気を生成することができる。 The object to be heated 2123 in the heating chamber 2110 is heated by the radiant heat of the heater 2121 disposed in the first duct portion 2181 of the steam duct 2180. Further, the heating medium (air containing steam) passing through the steam duct 2180 is heated by the heater 2121, and the heated heating medium is blown out from the first and second steam outlets 2124 and 2125. Thereby, the heat medium in the heating chamber 2110 is maintained at a predetermined temperature. Further, the steam to be supplied to the heating chamber 2110 can be further heated by the heater 2121 to generate superheated steam at 100 ° C. or higher.
 上記ケーシング2101内の下側には、冷却ファン部2122、電装部品2117およびマグネトロン2120を配置している。また、ケーシング2101内の加熱室2110の右側方に送風ダクト2131を配置している。この送風ダクト2131は、希釈ファン2130と、この希釈ファン2130を駆動する希釈ファン用モータ2138とを内部に収納している。冷却ファン部2122は、冷却ファン2115と、その冷却ファン2115を駆動する冷却ファン用モータ2116とを有する。 The cooling fan portion 2122, the electrical component 2117, and the magnetron 2120 are disposed on the lower side of the casing 2101. Further, an air duct 2131 is disposed on the right side of the heating chamber 2110 in the casing 2101. The air duct 2131 houses therein a dilution fan 2130 and a dilution fan motor 2138 that drives the dilution fan 2130. The cooling fan unit 2122 includes a cooling fan 2115 and a cooling fan motor 2116 that drives the cooling fan 2115.
 上記電装部品2117は、加熱調理器の各部を駆動する駆動回路やこの駆動回路を制御する制御回路等を有している。また、冷却ファン2115は、ケーシング2101内に外気を取り込み、発熱する電装部品2117やマグネトロン2120を冷却する。また、冷却ファン2115によってケーシング2101内に流入した外気の一部は、希釈ファン2130により送風ダクト2131内に導かれると共に、残りの外気は、ケーシング2101の背面等に形成された開口(図示せず)から外部に排出される。 The electrical component 2117 has a drive circuit that drives each part of the cooking device, a control circuit that controls the drive circuit, and the like. Further, the cooling fan 2115 takes outside air into the casing 2101 and cools the electrical component 2117 and the magnetron 2120 that generate heat. Further, a part of the outside air flowing into the casing 2101 by the cooling fan 2115 is guided into the air duct 2131 by the dilution fan 2130, and the remaining outside air is an opening (not shown) formed on the back surface of the casing 2101 or the like. ) To the outside.
 図16に示すように、加熱室2110の右側壁に第1排気口2136から排気ダンパ(図示せず)を介して接続された第1排気ダクト2134を配置している。この第1排気ダクト2134は、横方向に延びる横通路2134aと、その横通路2134aから上方に屈曲する縦通路2134bとを有している。縦通路2134bの上端に排気口カバー2108を着脱可能に取り付けている。 As shown in FIG. 16, a first exhaust duct 2134 connected to the right side wall of the heating chamber 2110 from the first exhaust port 2136 via an exhaust damper (not shown) is disposed. The first exhaust duct 2134 has a lateral passage 2134a extending in the lateral direction and a longitudinal passage 2134b bent upward from the lateral passage 2134a. An exhaust port cover 2108 is detachably attached to the upper end of the vertical passage 2134b.
 上記第1排気ダクト2134の横通路2134aの背面側に、吸込ダクト2127を介して外気を吸い込む吸込口(図示せず)を設けている。この吸込口または第1排気口2136のいずれか一方を択一的に選択して第1排気ダクト2134に接続するように排気ダンパを制御する。上記排気ダンパは、排気ダンパ用モータ2160(図17に示す)より駆動される。 A suction port (not shown) for sucking outside air through a suction duct 2127 is provided on the back side of the lateral passage 2134a of the first exhaust duct 2134. The exhaust damper is controlled so that either one of the suction port or the first exhaust port 2136 is alternatively selected and connected to the first exhaust duct 2134. The exhaust damper is driven by an exhaust damper motor 2160 (shown in FIG. 17).
 上記第1排気ダクト2134の縦通路2134bは、上側に向かって流路面積が拡大されて排気口カバー2108に連結される。排気口カバー2108の上部には、前方に向かって開口した排気口2108aが形成されている。 The vertical passage 2134b of the first exhaust duct 2134 is connected to the exhaust port cover 2108 with the flow passage area enlarged toward the upper side. An exhaust port 2108 a that opens forward is formed in the upper portion of the exhaust port cover 2108.
 一方、上記第2排気口2137に第2排気ダクト2135の下端を接続し、その第2排気ダクト2135の上端を第1排気ダクト2134の縦通路2134bの下側に接続している。 On the other hand, the lower end of the second exhaust duct 2135 is connected to the second exhaust port 2137, and the upper end of the second exhaust duct 2135 is connected to the lower side of the vertical passage 2134b of the first exhaust duct 2134.
 上記第2排気ダクト2135は、第1排気ダクト2134よりも流通面積が小さい。この第2排気口2137からの排気は、第2排気ダクト2135を介して第1排気ダクト2134に流入し、排気口カバー2108の排気口2108aから外部に排出される。 The distribution area of the second exhaust duct 2135 is smaller than that of the first exhaust duct 2134. The exhaust from the second exhaust port 2137 flows into the first exhaust duct 2134 via the second exhaust duct 2135 and is discharged to the outside from the exhaust port 2108a of the exhaust port cover 2108.
 また、上記加熱室2110の側方の送風ダクト2131は、希釈ファン収納部131aと、希釈ファン2130から上方に延びた縦通路2131bと、縦通路2131bから後面側に屈曲する横通路2131cと、横通路2131cから上方に屈曲するノズル部2131dを有している。横通路2131cとノズル部2131dとが第1排気ダクト2134内に挿入されている。 The air duct 2131 on the side of the heating chamber 2110 includes a dilution fan housing part 131a, a vertical passage 2131b extending upward from the dilution fan 2130, a horizontal passage 2131c bent from the vertical passage 2131b to the rear side, and a horizontal passage. The nozzle portion 2131d is bent upward from the passage 2131c. The lateral passage 2131c and the nozzle portion 2131d are inserted into the first exhaust duct 2134.
 上記送風ダクト2131のノズル部2131dの上端に開口部2131eを設けている。これにより、第1排気ダクト2134内にエジェクタが形成され、希釈ファン2130によって第1排気口2136から排気口2108aに向かう気流を発生させる。 An opening 2131e is provided at the upper end of the nozzle portion 2131d of the air duct 2131. As a result, an ejector is formed in the first exhaust duct 2134, and an air flow from the first exhaust port 2136 toward the exhaust port 2108 a is generated by the dilution fan 2130.
 また、上記送風ダクト2131の横通路2131cに、縦通路2131bとの接続部の下端よりも下方に凹設される凹部が形成され、その凹部の一端に第1排気ダクト2134内に開口するサブノズル部2131fが形成される。 Further, a concave portion is formed in the horizontal passage 2131c of the air duct 2131 so as to be recessed below the lower end of the connecting portion with the vertical passage 2131b, and a sub nozzle portion that opens into the first exhaust duct 2134 at one end of the concave portion. 2131f is formed.
 さらに、上記送風ダクト2131の縦通路2131bの上部に給気通路2132の一端を接続し、その給気通路2132の他端を給気ダンパ2140に接続している。給気通路2132および給気ダンパ2140は、希釈ファン2130により給気口2133を介して加熱室2110に給気するための給気機構の一部である。この加熱室2110の給気口2133近傍かつ下側には、解凍センサ2150を配置している。 Furthermore, one end of the air supply passage 2132 is connected to the upper part of the vertical passage 2131b of the air duct 2131, and the other end of the air supply passage 2132 is connected to the air supply damper 2140. The air supply passage 2132 and the air supply damper 2140 are part of an air supply mechanism for supplying air to the heating chamber 2110 via the air supply port 2133 by the dilution fan 2130. A thawing sensor 2150 is disposed near and below the air inlet 2133 of the heating chamber 2110.
 上記給気ダンパ2140は、給気口2133を開閉するための耐熱樹脂製のダンパ本体2141と、そのダンパ本体2141を覆う耐熱樹脂製のハウジング2142とを有している。 The air supply damper 2140 includes a heat-resistant resin damper body 2141 for opening and closing the air supply opening 2133 and a heat-resistant resin housing 2142 for covering the damper body 2141.
 図17は上記加熱調理器の制御ブロック図である。 FIG. 17 is a control block diagram of the heating cooker.
 上記加熱調理器は、マイクロコンピュータと入出力回路などからなる制御部2200を電装部品2117(図15,図16に示す)内に備えている。制御部2200は、加熱ヒータ2121,循環ファン用モータ2119,冷却ファン用モータ2116,希釈ファン用モータ2138,給気ダンパ用モータ2144,排気ダンパ用モータ2160,操作パネル2105,室内温度センサ2129,解凍センサ2150,給水ポンプ2170,蒸気発生装置2112およびマグネトロン2120が接続されている。操作パネル2105からの信号および室内温度センサ2129,解凍センサ2150からの検出信号に基づいて、制御部2200は、加熱ヒータ2121,循環ファン用モータ2119,冷却ファン用モータ2116,希釈ファン用モータ2138,給気ダンパ用モータ2144,排気ダンパ用モータ2160,操作パネル2105,給水ポンプ2170,蒸気発生装置2112およびマグネトロン2120などを制御する。 The heating cooker includes a control unit 2200 including a microcomputer and an input / output circuit in an electrical component 2117 (shown in FIGS. 15 and 16). The control unit 2200 includes a heater 2121, a circulation fan motor 2119, a cooling fan motor 2116, a dilution fan motor 2138, a supply damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, an indoor temperature sensor 2129, and thawing. A sensor 2150, a feed water pump 2170, a steam generator 2112 and a magnetron 2120 are connected. Based on signals from operation panel 2105 and detection signals from room temperature sensor 2129 and thawing sensor 2150, control unit 2200 includes heater 2121, circulation fan motor 2119, cooling fan motor 2119, dilution fan motor 2138, It controls an air damper motor 2144, an exhaust damper motor 2160, an operation panel 2105, a water supply pump 2170, a steam generator 2112, a magnetron 2120, and the like.
 図18は、上記扉2102とケーシング2101を取り外した状態の加熱調理器の後面を斜め上方から見た斜視図である。また、図19は、上記扉2102とケーシング2101を取り外した状態の加熱調理器の前面を斜め上方から見た斜視図である。 FIG. 18 is a perspective view of the rear surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above. FIG. 19 is a perspective view of the front surface of the cooking device with the door 2102 and the casing 2101 removed as viewed obliquely from above.
 上記加熱室2110の前側には前面パネル2126を設けている。この前面パネル2126は、給水タンク2111(図16に示す)を挿入するための挿入口2126aを右側部に有している。また、加熱室2110の右側壁の内面には、上段トレイ受部2151a,2151bと、中段トレイ受部2152a,2152b,2152cと、下段トレイ受部2153とを設けている。中段トレイ受部2152a,2152b間には解凍センサ2150のセンサ部2150aを配置している。 A front panel 2126 is provided on the front side of the heating chamber 2110. The front panel 2126 has an insertion port 2126a for inserting a water supply tank 2111 (shown in FIG. 16) on the right side. Further, upper tray receiving portions 2151 a and 2151 b, middle tray receiving portions 2152 a, 2152 b and 2152 c, and a lower tray receiving portion 2153 are provided on the inner surface of the right side wall of the heating chamber 2110. A sensor unit 2150a of the thawing sensor 2150 is disposed between the middle tray receiving units 2152a and 2152b.
 図20は、上記前面パネル2126の上部およびその近傍の部分を斜め上方から見た模式図である。 FIG. 20 is a schematic view of the upper part of the front panel 2126 and the vicinity thereof as seen obliquely from above.
 上記蒸気ダクト2180の第1ダクト部2181と前面パネル2126の上部との間には、取付金具の一例としての鋼製の枠体2009を配置している。この枠体2009の上部には、他の部分よりも厚い肉厚部2091を被取付部の一例として設けている。一方、枠体2009の下部にはフランジ部2092,2092を設けている。また、上記肉厚部2091が、加熱室2110の上壁との間に隙間を有して、複数のパンチング穴2011,2011,…とガラス板2012との上方に位置するように、加熱室2110の上壁にフランジ部2092,2092をビス(図示せず)で固定している。 Between the first duct portion 2181 of the steam duct 2180 and the upper part of the front panel 2126, a steel frame 2009 as an example of a mounting bracket is disposed. A thick part 2091 that is thicker than the other parts is provided as an example of an attached part on the upper part of the frame 2009. On the other hand, flange portions 2092 and 2092 are provided in the lower portion of the frame body 2009. Further, the heating chamber 2110 has a gap between the thick portion 2091 and the upper wall of the heating chamber 2110 and is positioned above the plurality of punching holes 20111, 2011, ... and the glass plate 2012. Flange portions 2092 and 2092 are fixed to the upper wall with screws (not shown).
 図21は、図20のXXI-XXI線から見た縦断面の模式図である。また、図22は、上記枠体2009に取り付けられたLEDランプ2001を接続端子2004,2004側から見た模式図である。 FIG. 21 is a schematic diagram of a longitudinal section viewed from the XXI-XXI line of FIG. FIG. 22 is a schematic view of the LED lamp 2001 attached to the frame 2009 as viewed from the connection terminals 2004 and 2004 side.
 上記LEDランプ2001は、図21,図22に示すように、枠体2009に取り付けられている。より詳しくは、枠体2009の肉厚部2091は加熱室2110側に平坦な密着平面2093を有し、この平坦な密着平面2093にガラスエポキシ基板2002の平坦な第2面2022を密着させている。また、上記取付部2024の取付穴2025に挿通したビス2010を締め付けることにより、LEDランプ2001を枠体2009に固定している。なお、口金2006における肉厚部2091との接触箇所に接着剤を塗布してもよい。 The LED lamp 2001 is attached to a frame 2009 as shown in FIGS. More specifically, the thick portion 2091 of the frame 2009 has a flat contact plane 2093 on the heating chamber 2110 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2093. . Further, the LED lamp 2001 is fixed to the frame body 2009 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply | coat an adhesive agent to the contact location with the thick part 2091 in the nozzle | cap | die 2006. FIG.
 また、上記加熱室2110の上壁には、LEDランプ2001に対向する複数のパンチング穴2011,2011,…を設けている。これにより、LEDランプ2001から出射された光は複数のパンチング穴2011,2011,…を通って加熱室2110内に入るようになっている。また、加熱室2110内の蒸気などがパンチング穴2011,2011,…から加熱室2110外に漏れないように、パンチング穴2011,2011,…上にガラス板2012を配置している。 Further, a plurality of punching holes 2011, 2011,... Facing the LED lamp 2001 are provided on the upper wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2001 enters the heating chamber 2110 through the plurality of punching holes 20111, 2011,. Moreover, the glass plate 2012 is arrange | positioned on the punching holes 2011, 2011, ... so that the vapor | steam etc. in the heating chamber 2110 may not leak outside the heating chamber 2110 from the punching holes 2011, 2011, ....
 上記加熱調理器の構成によれば、加熱室2110内をLEDランプ2001で照らすとき、発光ダイオード素子2003が発熱する。この発光ダイオード素子2003が発した熱は、ガラスエポキシ基板2002の第1面2021に伝わって、ガラスエポキシ基板2002の第2面2022から枠体2009の肉厚部2091の密着平面2093に伝わる。このとき、第2面2022および密着平面2093は共に平坦な面であって互いに密着しているので、密着平面2093に対する第2面2022の接触面積が大きくなっている。したがって、発光ダイオード素子2003が発した熱をガラスエポキシ基板2002を介して枠体2009の肉厚部2091に効率良く伝えることができる。 According to the configuration of the cooking device, when the inside of the heating chamber 2110 is illuminated with the LED lamp 2001, the light emitting diode element 2003 generates heat. The heat generated by the light emitting diode element 2003 is transmitted to the first surface 2021 of the glass epoxy substrate 2002, and is transmitted from the second surface 2022 of the glass epoxy substrate 2002 to the adhesion plane 2093 of the thick portion 2091 of the frame body 2009. At this time, since the second surface 2022 and the contact flat surface 2093 are both flat surfaces and are in close contact with each other, the contact area of the second surface 2022 with the contact flat surface 2093 is large. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the thick portion 2091 of the frame body 2009 through the glass epoxy substrate 2002.
 さらに、上記ガラスエポキシ基板2002の第2面2022と枠体2009の肉厚部2091の密着平面2093との接触面積を大きくしても、枠体2009の肉厚部2091はLEDランプ2001上に位置してLEDランプ2001と加熱室2110の上壁との間に無いから、LEDランプ2001から出射された光が枠体2009の肉厚部2091の一部で遮られることがない。すなわち、LEDランプ2001の高放熱,高輝度の両立を図ることができる。 Further, even if the contact area between the second surface 2022 of the glass epoxy substrate 2002 and the contact flat surface 2093 of the thick portion 2091 of the frame body 2009 is increased, the thick portion 2091 of the frame body 2009 is positioned on the LED lamp 2001. Then, since there is no space between the LED lamp 2001 and the upper wall of the heating chamber 2110, the light emitted from the LED lamp 2001 is not blocked by a part of the thick portion 2091 of the frame body 2009. That is, both high heat dissipation and high luminance of the LED lamp 2001 can be achieved.
 このように、上記LEDランプ2001の放熱性能は非常に高いので、発光ダイオード素子2003を高温雰囲気でも充分に冷却できる。 Thus, since the heat dissipation performance of the LED lamp 2001 is very high, the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
 また、上記被加熱物2123を過熱水蒸気で加熱する場合、加熱ヒータ2121で生成した100℃以上の過熱蒸気を複数の第1蒸気吹出口2124,第2蒸気吹出口2125から加熱室2110内に供給する。このため、加熱ヒータ2121を収納する第1ダクト部2181の周辺温度は80℃~100℃にもなる。このような高温環境にLEDランプ2001を配置していても、発光ダイオード素子2003を充分に冷却できるので、LEDランプ2001は、照明能力が低下せず、寿命を長くすることができる。 In addition, when heating the object to be heated 2123 with superheated steam, superheated steam of 100 ° C. or higher generated by the heater 2121 is supplied into the heating chamber 2110 from the plurality of first steam outlets 2124 and second steam outlets 2125. To do. For this reason, the ambient temperature of the first duct portion 2181 that houses the heater 2121 becomes 80 ° C. to 100 ° C. Even if the LED lamp 2001 is arranged in such a high temperature environment, the light emitting diode element 2003 can be sufficiently cooled. Therefore, the LED lamp 2001 does not have a reduced illumination capability and can have a long life.
 また、上記LEDランプ2001の寿命を長くすることができるので、LEDランプ2001の交換回数が少なくなり、ランニングコストを低減できる。 Also, since the life of the LED lamp 2001 can be extended, the number of replacements of the LED lamp 2001 is reduced, and the running cost can be reduced.
 また、上記接続端子2004,2004がガラスエポキシ基板2002の第2面2022の延在方向に延びるので、第2面2022と密着平面2093の間には接続端子2004,2004が介在しないようにできる。 Further, since the connection terminals 2004 and 2004 extend in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, the connection terminals 2004 and 2004 can be prevented from being interposed between the second surface 2022 and the contact plane 2093.
 さらに、上記ガラスエポキシ基板2002は第2面2022の延在方向に対して垂直方向の反力を肉厚部2091から受けるが、接続端子2004,2004がガラスエポキシ基板2002の第2面2022の延在方向に延びるので、接続端子2004,2004は上記反力で外れ難い。 Further, the glass epoxy substrate 2002 receives a reaction force in the direction perpendicular to the extending direction of the second surface 2022 from the thick portion 2091, but the connection terminals 2004 and 2004 extend from the second surface 2022 of the glass epoxy substrate 2002. Since it extends in the present direction, the connection terminals 2004 and 2004 are not easily detached by the reaction force.
 また、上記LEDランプ2001は取付部2024を備えているので、ガラスエポキシ基板2002の第2面2022が枠体2009の肉厚部2091の密着平面2093に密着するように、LEDランプ2001を肉厚部2091に取り付けることができる。 Further, since the LED lamp 2001 includes the mounting portion 2024, the LED lamp 2001 is thickened so that the second surface 2022 of the glass epoxy substrate 2002 is in close contact with the contact flat surface 2093 of the thick portion 2091 of the frame body 2009. It can be attached to the part 2091.
 また、上記肉厚部2091が鋼から成るが、取付部2024は接続端子2004,2004から絶縁されているので、接続端子2004,2004の通電に悪影響は及ばない。 In addition, although the thick portion 2091 is made of steel, the attachment portion 2024 is insulated from the connection terminals 2004 and 2004, so that the energization of the connection terminals 2004 and 2004 is not adversely affected.
 また、上記取付部2024の取付穴2025に挿通したビス2010を締め付けることによって、ガラスエポキシ基板2002を枠体2009の肉厚部2091に押し付けることができるので、ガラスエポキシ基板2002の第2面2022と枠体2009の肉厚部2091の密着平面2093との密着力を高くすることができる。 Further, by tightening the screw 2010 inserted through the mounting hole 2025 of the mounting portion 2024, the glass epoxy substrate 2002 can be pressed against the thick portion 2091 of the frame body 2009, so that the second surface 2022 of the glass epoxy substrate 2002 and The adhesion force between the thick portion 2091 of the frame 2009 and the adhesion plane 2093 can be increased.
 また、上記取付部2024はガラスエポキシ基板2002の一部であるから、部品点数を少なくすることができる。 Further, since the mounting portion 2024 is a part of the glass epoxy substrate 2002, the number of parts can be reduced.
 また、上記肉厚部2091は枠体2009の一部であるから、肉厚部2091は枠体2009の広い表面を使って熱を放出することができる。したがって、上記発光ダイオード素子の冷却能力を高めることができる。 Further, since the thick portion 2091 is a part of the frame body 2009, the thick portion 2091 can release heat using a wide surface of the frame body 2009. Therefore, the cooling capacity of the light emitting diode element can be increased.
 上記第3実施形態では、LEDランプ2001は、ガラスエポキシ基板2002の第2面2022の延在方向に延びる接続端子2004,2004を備えていたが、ガラスエポキシ基板2002の第2面2022の延在方向に対して斜め方向に延びる接続端子を備えてもよい。 In the third embodiment, the LED lamp 2001 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002. A connection terminal extending obliquely with respect to the direction may be provided.
 上記第3実施形態では、LEDランプ2001はガラスエポキシ基板2002を備えていたが、ガラスエポキシ基板2002に換えて、例えば、アルミ基板等の金属基板、半導体基板、セラミック基板を備えてもよい。 In the third embodiment, the LED lamp 2001 includes the glass epoxy substrate 2002. However, instead of the glass epoxy substrate 2002, for example, a metal substrate such as an aluminum substrate, a semiconductor substrate, or a ceramic substrate may be included.
 上記第3実施形態の鋼製の枠体2009に換えて、例えば、Cu、Mo、WまたはAlから成る枠体を用いてもよい。 For example, a frame made of Cu, Mo, W, or Al may be used instead of the steel frame 2009 of the third embodiment.
 上記第3実施形態では、ガラスエポキシ基板2002に、1つの取付部2024を設けていたが、複数の取付部を設けるようにしてもよい。 In the third embodiment, one attachment portion 2024 is provided on the glass epoxy substrate 2002, but a plurality of attachment portions may be provided.
 〔第4実施形態〕
 図23は、本発明の第4実施形態の加熱調理器の要部の正面を斜め上方からみた模式図である。また、図23では、上記第3実施形態と同一構成部に上記第3実施形態の構成部と同一参照番号を付している。なお、以下の説明では、上記第3実施形態と同様に、「左」は加熱調理器を正面側から見たときの左を指し、「右」は加熱調理器を正面側から見たときの右を指す。
[Fourth Embodiment]
FIG. 23: is the schematic diagram which looked at the front of the principal part of the heating cooker of 4th Embodiment of this invention from diagonally upward. In FIG. 23, the same reference numerals as those of the third embodiment are assigned to the same components as those of the third embodiment. In the following description, as in the third embodiment, “left” refers to the left when the cooking device is viewed from the front side, and “right” is when the cooking device is viewed from the front side. Point to the right.
 上記加熱調理器は、鉄などの金属製のケーシング2301と、このケーシング2301内に設けられた加熱室2310と、この加熱室2310内を照らすLEDランプ2201とを備えている。また、図示しないが、ケーシング2301内には、上記第3実施形態と同様に、蒸気発生装置、電装部品、マグネトロン、加熱ヒータ、冷却ファン部および送風ダクト等を設置している。この冷却ファン部が吹き出した空気はケーシング2301の右側部と加熱室2310の右壁との間を流れるようになっている。 The heating cooker includes a casing 2301 made of metal such as iron, a heating chamber 2310 provided in the casing 2301, and an LED lamp 2201 that illuminates the heating chamber 2310. Although not shown, a steam generator, electrical components, a magnetron, a heater, a cooling fan unit, an air duct, and the like are installed in the casing 2301 as in the third embodiment. The air blown out by the cooling fan portion flows between the right side portion of the casing 2301 and the right wall of the heating chamber 2310.
 図24は、図23のXXIV-XXIV線から見た縦断面の模式図である。 FIG. 24 is a schematic diagram of a longitudinal section viewed from the line XXIV-XXIV in FIG.
 上記ケーシング2301の右側面には、被取付部の一例としての凹部2302を設けている。この凹部2302は、加熱室2310の右壁の延在方向に略平行な底部2321と、この底部2321の周囲に設けられ、加熱室2310の右壁の延在方向に対して傾斜する4つの周壁部2322,2323,2324とから成っている。また、底部2321は複数のパンチング穴2211,2211,…とガラス板2212との側方に位置している。 A concave portion 2302 as an example of a mounted portion is provided on the right side surface of the casing 2301. The concave portion 2302 includes a bottom portion 2321 substantially parallel to the extending direction of the right wall of the heating chamber 2310, and four peripheral walls provided around the bottom portion 2321 and inclined with respect to the extending direction of the right wall of the heating chamber 2310. It consists of parts 2322, 2323, 2324. Further, the bottom portion 2321 is located on the side of the plurality of punching holes 2211, 2111,... And the glass plate 2212.
 上記LEDランプ2201は、ケーシング2301の凹部2302に取り付けられている。より詳しくは、凹部2302の底部2321は加熱室2310側に平坦な密着平面2325を有し、この平坦な密着平面2325にガラスエポキシ基板2002の平坦な第2面2022を密着させている。また、上記取付部2024の取付穴2025に挿通したビス2010を締め付けることにより、LEDランプ2001をケーシング2301に固定している。なお、口金2206における周壁部2323との接触箇所に接着剤を塗布してもよい。 The LED lamp 2201 is attached to the recess 2302 of the casing 2301. More specifically, the bottom 2321 of the recess 2302 has a flat contact plane 2325 on the heating chamber 2310 side, and the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat contact plane 2325. Further, the LED lamp 2001 is fixed to the casing 2301 by tightening a screw 2010 inserted into the mounting hole 2025 of the mounting portion 2024. In addition, you may apply | coat an adhesive agent to the contact location with the surrounding wall part 2323 in the nozzle | cap | die 2206. FIG.
 また、上記LEDランプ2201は、上記第3実施形態のLEDランプ2001ランプ2001の口金2006とは異なる形状を有する金属製の口金306を備えている。この口金306の凹部2302側には、凹部2302の周壁部2323の傾斜角と略同じ傾斜角を有する傾斜面2261を設けている。また、傾斜面2261を凹部2302の周壁部2323に当接させると、ガラスエポキシ基板2002の第2面2022が底部2321の密着平面2325に接触するように、傾斜面2261を設計している。 The LED lamp 2201 includes a metal base 306 having a shape different from that of the base 2006 of the LED lamp 2001 lamp 2001 of the third embodiment. An inclined surface 2261 having an inclination angle substantially the same as the inclination angle of the peripheral wall 2323 of the recess 2302 is provided on the recess 2302 side of the base 306. Further, the inclined surface 2261 is designed so that the second surface 2022 of the glass epoxy substrate 2002 contacts the contact flat surface 2325 of the bottom portion 2321 when the inclined surface 2261 is brought into contact with the peripheral wall portion 2323 of the concave portion 2302.
 上記加熱室2110の右壁には、LEDランプ2001に対向する複数のパンチング穴2211,2211,…を設けている。これにより、LEDランプ2201から出射された光は複数のパンチング穴2211,2211,…を通って加熱室2310内に入るようになっている。また、加熱室2310内の蒸気などがパンチング穴2211,2211,…から加熱室2310外に漏れないように、パンチング穴2211,2211,…をガラス板2212で覆っている。 A plurality of punching holes 2211, 2111,... Facing the LED lamp 2001 are provided on the right wall of the heating chamber 2110. Thereby, the light emitted from the LED lamp 2201 enters the heating chamber 2310 through the plurality of punching holes 2211, 2111,. Further, the punching holes 2211, 2111,... Are covered with a glass plate 2212 so that steam in the heating chamber 2310 does not leak out of the heating chamber 2310 from the punching holes 2211, 2111,.
 上記構成の加熱調理器によれば、ガラスエポキシ基板2002の平坦な第2面2022が凹部2302の底部2321の平坦な密着平面と325に密着しているので、密着平面2325に対する第2面2022の接触面積を大きくなっている。したがって、発光ダイオード素子2003が発した熱をガラスエポキシ基板2002を介して凹部2302の底部2321に効率良く伝えることができる。 According to the heating cooker having the above configuration, the flat second surface 2022 of the glass epoxy substrate 2002 is in close contact with the flat close contact plane 325 of the bottom 2321 of the recess 2302, so the second surface 2022 with respect to the close contact flat surface 2325 The contact area is increased. Therefore, the heat generated by the light emitting diode element 2003 can be efficiently transmitted to the bottom 2321 of the recess 2302 through the glass epoxy substrate 2002.
 さらに、上記ガラスエポキシ基板2002の第2面2022と凹部2302の底部2321の密着平面2325との接触面積を大きくしても、凹部2302の底部2321はLEDランプ2201の光の出射側に無いから、LEDランプ2201の照明能力の低下を防ぐことができる。 Furthermore, even if the contact area between the second surface 2022 of the glass epoxy substrate 2002 and the contact flat surface 2325 of the bottom 2321 of the recess 2302 is increased, the bottom 2321 of the recess 2302 is not on the light emission side of the LED lamp 2201. It is possible to prevent the illumination capability of the LED lamp 2201 from being lowered.
 このように、上記LEDランプ2201の放熱性能は非常に高いので、発光ダイオード素子2003を高温雰囲気でも充分に冷却できる。 Thus, since the heat dissipation performance of the LED lamp 2201 is very high, the light emitting diode element 2003 can be sufficiently cooled even in a high temperature atmosphere.
 また、上記凹部2302はケーシング2301の一部であるから、上記第3実施形態よりも放熱面積が大きくて発光ダイオード素子2003を高くできる。 Further, since the recess 2302 is a part of the casing 2301, the heat radiation area is larger than that of the third embodiment, and the light emitting diode element 2003 can be made high.
 また、上記LEDランプ2201の配置箇所には冷却ファン部からの空気が流れるので、LEDランプ2201を空冷できる。 In addition, since the air from the cooling fan portion flows through the arrangement place of the LED lamp 2201, the LED lamp 2201 can be air-cooled.
 上記第4実施形態では、LEDランプ2201は、ガラスエポキシ基板2002の第2面2022の延在方向に延びる接続端子2004,2004を備えていたが、ガラスエポキシ基板2002の第2面2022の延在方向に対して斜め方向に延びる接続端子を備えてもよい。 In the fourth embodiment, the LED lamp 2201 includes the connection terminals 2004 and 2004 extending in the extending direction of the second surface 2022 of the glass epoxy substrate 2002, but the extension of the second surface 2022 of the glass epoxy substrate 2002. A connection terminal extending obliquely with respect to the direction may be provided.
 上記第4実施形態では、LEDランプ2201はガラスエポキシ基板2002を備えていたが、ガラスエポキシ基板2002に換えて例えばアルミ基板を備えてもよい。 In the fourth embodiment, the LED lamp 2201 includes the glass epoxy substrate 2002. However, instead of the glass epoxy substrate 2002, for example, an aluminum substrate may be included.
 本発明の加熱調理器としては、例えば、過熱水蒸気を使用するオーブンレンジのみならず、過熱水蒸気を使用するオーブン、過熱水蒸気を使用しないオーブンレンジ、過熱水蒸気を使用しないオーブンなどがある。 Examples of the cooking device of the present invention include not only an oven range using superheated steam but also an oven using superheated steam, an oven range not using superheated steam, and an oven not using superheated steam.
 本発明の加熱調理器では、オーブンレンジなどにおいて、過熱水蒸気または飽和水蒸気を用いることによって、ヘルシーな調理を行うことができる。例えば、本発明の加熱調理器では、温度が100℃以上の過熱水蒸気または飽和水蒸気を食品表面に供給し、食品表面に付着した過熱水蒸気または飽和水蒸気が凝縮して大量の凝縮潜熱を食品に与えるので、食品に熱を効率よく伝えることができる。また、凝縮水が食品表面に付着して塩分や油分が凝縮水と共に滴下することにより、食品中の塩分や油分を低減できる。さらに、加熱室内は過熱水蒸気または飽和水蒸気が充満して低酸素状態となることにより、食品の酸化を抑制した調理が可能となる。ここで、低酸素状態とは、加熱室内において酸素の体積%が10%以下(例えば0.5~3%)である状態を指す。 In the cooking device of the present invention, healthy cooking can be performed by using superheated steam or saturated steam in a microwave oven or the like. For example, in the cooking device of the present invention, superheated steam or saturated steam having a temperature of 100 ° C. or higher is supplied to the food surface, and the superheated steam or saturated steam adhered to the food surface is condensed to give a large amount of condensation latent heat to the food. So it can efficiently transfer heat to food. Moreover, when condensed water adheres to the food surface and salt and oil are dropped together with condensed water, salt and oil in the food can be reduced. Further, the heating chamber is filled with superheated steam or saturated steam to be in a low oxygen state, thereby enabling cooking while suppressing food oxidation. Here, the low oxygen state refers to a state in which the volume% of oxygen is 10% or less (for example, 0.5 to 3%) in the heating chamber.
 本発明の具体的な実施形態について説明したが、本発明は上記第3,第4実施形態に限定されるものではなく、本発明の範囲内で種々変更して実施することができる。 Although specific embodiments of the present invention have been described, the present invention is not limited to the third and fourth embodiments described above, and various modifications can be made within the scope of the present invention.
 また、上記第1~第4実施形態を適宜組み合わせたものを本発明の一実施形態としてもよい。 Also, a combination of the first to fourth embodiments as appropriate may be an embodiment of the present invention.
 1…LEDランプ
 2…アルミヒートシンク
 3…ガラスエポキシ基板
 4,1004…発光ダイオード素子
 5…接続端子
 6…取付板
 7…カバーガラス
 8…口金
 9…蛍光体
 14…取付穴
 15…金属板
 21,1021…密着平面
 22,1022…放熱平面
 31…第1面
 32…第2面
 33…配線
 101…ケーシング
 110…加熱室
 123…被加熱物
 2001,2201…LEDランプ
 2002…ガラスエポキシ基板
 2003…発光ダイオード素子
 2004…接続端子
 2005…カバーガラス
 2006,2206…口金
 2009…枠体
 2010…ビス
 2011,2211…パンチング穴
 2012,2212…ガラス板
 2021…第1面
 2022…第2面
 2034…取付部
 2035…取付穴
 2091…肉厚部
 2092…フランジ部
 2093,2325…密着平面
 2101,2301…ケーシング
 2110,2310…加熱室
 2302…凹部
 2321…底部
 2322,2323,2324…周壁部
 2123…被加熱物
DESCRIPTION OF SYMBOLS 1 ... LED lamp 2 ... Aluminum heat sink 3 ... Glass epoxy board 4,1004 ... Light emitting diode element 5 ... Connection terminal 6 ... Mounting plate 7 ... Cover glass 8 ... Base 9 ... Phosphor 14 ... Mounting hole 15 ... Metal plate 21,1021 ... adhesion plane 22,1022 ... heat radiation plane 31 ... first surface 32 ... second surface 33 ... wiring 101 ... casing 110 ... heating chamber 123 ... heated object 2001, 201 ... LED lamp 2002 ... glass epoxy substrate 2003 ... light emitting diode element 2004 ... Connection terminal 2005 ... Cover glass 2006, 2206 ... Base 2009 ... Frame 2010 ... Screw 2011, 2111, ... Punching hole 2012, 2212 ... Glass plate 2021 ... First surface 2022 ... Second surface 2034 ... Mounting portion 2035 ... Mounting hole 2091 ... Thick part 2092 ... Flange part 093,2325 ... contact plane 2101,2301 ... casing 2110,2310 ... heating chamber 2302 ... recess 2321 ... bottom 2322,2323,2324 ... wall portion 2123 ... object to be heated

Claims (12)

  1.  基板(3)と、
     この基板(3)の第1面(31)に搭載された発光ダイオード素子(4)と、
     上記発光ダイオード素子(4)と上記基板(3)の第1面(31)側とを覆う透明または半透明な部材と、
     上記基板(3)の第1面(31)とは反対側の第2面(32)と密着する平坦な密着平面(21,1021)と、この密着平面(21,1021)とは反対側に設けられた平坦な放熱平面(22,1022)とを有するヒートシンク(2)と、
     上記ヒートシンク(2)の放熱平面(22,1022)の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子(4)に電気接続される接続端子(5)と
    を備えることを特徴とするLEDランプ(1)。
    A substrate (3);
    A light emitting diode element (4) mounted on the first surface (31) of the substrate (3);
    A transparent or translucent member covering the light emitting diode element (4) and the first surface (31) side of the substrate (3);
    A flat contact plane (21, 1021) in close contact with the second surface (32) opposite to the first surface (31) of the substrate (3), and the opposite side of the contact plane (21, 1021). A heat sink (2) having a flat heat dissipation plane (22, 1022) provided;
    A connection terminal (5) extending in an oblique direction with respect to the extending direction of the heat radiation plane (22, 1022) of the heat sink (2) or the extending direction and electrically connected to the light emitting diode element (4), An LED lamp (1) characterized by comprising.
  2.  請求項1に記載のLEDランプ(1)において、
     上記ヒートシンク(2)の上記密着平面(21,1021)と上記放熱平面(22,1022)との間の寸法である厚さ(D)が、上記ヒートシンク(2)の縦および横の寸法よりも小さいことを特徴とするLEDランプ(1)。
    LED lamp (1) according to claim 1,
    The thickness (D), which is the dimension between the contact plane (21, 1021) of the heat sink (2) and the heat dissipation plane (22, 1022), is larger than the vertical and horizontal dimensions of the heat sink (2). LED lamp (1) characterized by being small.
  3.  請求項1または2に記載のLEDランプ(1)において、
     上記発光ダイオード素子(4)と上記接続端子(5)とは、上記ヒートシンク(2)の内部を通らないで外側を通る上記基板(3)上の配線(33)によって接続されていることを特徴とするLEDランプ(1)。
    LED lamp (1) according to claim 1 or 2,
    The light emitting diode element (4) and the connection terminal (5) are connected to each other by a wiring (33) on the substrate (3) passing through the outside without passing through the inside of the heat sink (2). LED lamp (1).
  4.  請求項1から3までのいずれか一項に記載のLEDランプ(1)において、
     上記接続端子(5)から絶縁された取付部材(6)を備えることを特徴とするLEDランプ(1)。
    LED lamp (1) according to any one of claims 1 to 3,
    An LED lamp (1) comprising a mounting member (6) insulated from the connection terminal (5).
  5.  請求項4に記載のLEDランプ(1)において、
     上記取付部材(6)は、上記接続端子(5)の近傍において上記接続端子(5)の延在する方向に交差する方向に延びると共に、取付穴(14)を有する取付板(6)であることを特徴とするLEDランプ(1)。
    LED lamp (1) according to claim 4,
    The mounting member (6) is a mounting plate (6) extending in a direction intersecting the extending direction of the connection terminal (5) in the vicinity of the connection terminal (5) and having a mounting hole (14). LED lamp (1) characterized by the above.
  6.  ケーシング(101)と、
     上記ケーシング(101)内に設けられ、被加熱物(123)を収容する加熱室(110)と、
     上記ケーシング(101)と上記加熱室(110)との間に配置されて、上記加熱室(110)内を照らす請求項1から5までのいずれか一項に記載のLEDランプ(1)と
    を備え、
     上記LEDランプ(1)の上記ヒートシンク(2)の上記放熱平面(22,1022)は金属板(16)に密着されていることを特徴とする加熱調理器。
    A casing (101);
    A heating chamber (110) that is provided in the casing (101) and accommodates an object to be heated (123);
    The LED lamp (1) according to any one of claims 1 to 5, which is arranged between the casing (101) and the heating chamber (110) and illuminates the inside of the heating chamber (110). Prepared,
    The heating cooker characterized in that the heat radiation plane (22, 1022) of the heat sink (2) of the LED lamp (1) is in close contact with the metal plate (16).
  7.  ケーシング(2101,2301)と、
     上記ケーシング(2101,2301)内に設けられ、被加熱物(2123)を収容する加熱室(2110,2310)と、
     上記ケーシング(2101,2301)と上記加熱室(2110,2310)との間に配置され、上記加熱室(2110,2310)内を照らすLEDランプ(2001)と、
     上記LEDランプ(2001)が取り付けられる金属製の被取付部(2091,2302)と
    を備え、
     上記LEDランプ(2001,2201)は、
     上記加熱室(2110,2310)側に第1面(2021)を有すると共に、上記加熱室(2110,2310)とは反対側に平坦な第2面(2022)を有する基板(2002)と、
     上記基板(2002)の第1面(2021)に搭載された発光ダイオード素子(2003)と、
     上記発光ダイオード素子(2003)と上記基板(2002)の第1面(2021)側とを覆う透明または半透明な部材(2005)と、
     上記基板(2002)の第2面(2022)の延在方向またはその延在方向に対して斜め方向に延びると共に、上記発光ダイオード素子(2003)に電気接続される接続端子(2004)と
    を備え、
     上記被取付部(2091,2302)は、上記基板(2002)の第2面(2022)と密着する平坦な密着平面(2093,2325)を有することを特徴とする加熱調理器。
    Casings (2101, 2301);
    A heating chamber (2110, 2310) which is provided in the casing (2101, 301) and accommodates an object to be heated (2123);
    An LED lamp (2001) that is disposed between the casing (2101, 301) and the heating chamber (2110, 2310) and illuminates the inside of the heating chamber (2110, 2310);
    A metal attached portion (2091, 302) to which the LED lamp (2001) is attached;
    The LED lamps (2001, 2011)
    A substrate (2002) having a first surface (2021) on the heating chamber (2110, 2310) side and a flat second surface (2022) on the opposite side of the heating chamber (2110, 2310);
    A light emitting diode element (2003) mounted on the first surface (2021) of the substrate (2002);
    A transparent or translucent member (2005) covering the light emitting diode element (2003) and the first surface (2021) side of the substrate (2002);
    A connection terminal (2004) extending in a direction oblique to the extending direction of the second surface (2022) of the substrate (2002) or the extending direction thereof and electrically connected to the light emitting diode element (2003). ,
    The cooker characterized in that the attached parts (2091, 3022) have flat contact planes (2093, 2325) that are in close contact with the second surface (2022) of the substrate (2002).
  8.  請求項7に記載の加熱調理器において、
     上記LEDランプ(2001,2201)は上記接続端子(2004)から絶縁された取付部材(2024)を備えることを特徴とする加熱調理器。
    The heating cooker according to claim 7, wherein
    The LED cooker (2001, 201) includes a mounting member (2024) insulated from the connection terminal (2004).
  9.  請求項8に記載の加熱調理器において、
     上記取付部材(2024)は、上記基板(2002)の第2面(2022)の延在方向に延びると共に、取付穴(2025)を有する取付板(2024)であることを特徴とする加熱調理器。
    The cooking device according to claim 8,
    The attachment member (2024) is an attachment plate (2024) extending in the extending direction of the second surface (2022) of the substrate (2002) and having an attachment hole (2025). .
  10.  請求項9に記載の加熱調理器において、
     上記取付板(2024)は上記基板(2002)の一部であることを特徴とする加熱調理器。
    The cooking device according to claim 9,
    The cooking device according to claim 1, wherein the mounting plate (2024) is a part of the substrate (2002).
  11.  請求項7から10までのいずれか一項に記載の加熱調理器において、
     上記被取付部(2091)は上記LEDランプ(2001)の取付金具(2009)の一部であることを特徴とする加熱調理器。
    In the heating cooker according to any one of claims 7 to 10,
    The cooking device according to claim 1, wherein the mounted portion (2091) is a part of a mounting bracket (2009) of the LED lamp (2001).
  12.  請求項7から10までのいずれか一項に記載の加熱調理器において、
     上記被取付部(2302)は上記ケーシング(2301)の一部であることを特徴とする加熱調理器。
    In the heating cooker according to any one of claims 7 to 10,
    The cooker characterized in that the attached portion (2302) is a part of the casing (2301).
PCT/JP2012/062220 2011-06-03 2012-05-11 Led lamp and cooker equipped with same WO2012165125A1 (en)

Applications Claiming Priority (4)

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JP2011-125426 2011-06-03
JP2011125419A JP2012253232A (en) 2011-06-03 2011-06-03 Heating cooker
JP2011125426A JP2012251738A (en) 2011-06-03 2011-06-03 Heating cooker
JP2011-125419 2011-06-03

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