JP2011187451A - Light-emitting module, and vehicular lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module capable of preventing occurrence of short-circuiting. <P>SOLUTION: The light-emitting module includes: a ceramic substrate 2 having one side surface out of outer peripheral surfaces formed in an approximately rectangular shape as an abutting surface 2c which is abutted to positioning surfaces 20a, 20a of a radiator 16, and having one side surface out of surfaces in a thickness direction formed as an element arranging surface 2a where light-emitting elements 3 are arranged; given conductive patterns 5, 5 formed on the ceramic substrate; a light-emitting section 3A having the light-emitting element; and a pair of positive and negative planar electrodes 6, 6 formed on the ceramic substrate and connected with the semiconductor light-emitting element through the conductive patterns. At least parts of the pair of planar electrodes are to be exposed zones 6a, 6a exposed to the element arranging surface of the ceramic substrate, respective exposed zones of the pair of planar electrodes are located at a section excluding both ends in one direction of the ceramic substrate, and non-exposed zones are located on both ends in the one direction of the ceramic substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting module and a vehicle lamp. Specifically, the present invention relates to a technical field in which an exposed region of a pair of planar electrode portions is formed at a predetermined position of a ceramic substrate to prevent occurrence of a short circuit.

  There is a light emitting module that uses a semiconductor light emitting element such as a light emitting diode (LED) as a light source, and such a light emitting module is provided in a vehicle lamp that emits light emitted from a light source as illumination light by a light projection lens, for example. (For example, refer to Patent Document 1).

  In the light emitting module described in Patent Document 1, one of the outer peripheral surfaces of the heat radiating substrate has a heat radiating body formed of a metal material having high thermal conductivity (in Patent Document 1, a light source base). It is abutted against a predetermined surface of 50a) and fixed to the radiator.

  On the heat radiating substrate, planar electrode portions (contacts 46 and 46 in Patent Document 1) for supplying power to the semiconductor light emitting element are formed on both ends in the direction orthogonal to the abutting direction with respect to the heat radiating body. ing.

JP 2006-66108 A

  However, in the light emitting module described in Patent Document 1, since the planar electrode portions are formed on both ends in the direction orthogonal to the abutting direction of the heat radiating substrate with respect to the heat radiating body, a predetermined amount of the heat radiating body is determined. There is a possibility that each end of the planar electrode portion may come into contact with the heat radiating body in a state where it is abutted against the surface and fixed to the heat radiating body, which may cause a short circuit.

  In particular, when moisture or foreign matter adheres to the one end of the planar electrode portion or the predetermined surface of the radiator, these can be inclusions connecting the one end and the predetermined surface, The possibility of occurrence of a short circuit is increased.

  Accordingly, it is an object of the light emitting module and the vehicle lamp of the present invention to prevent the occurrence of a short circuit.

  In order to solve the above-described problem, the light emitting module of the present invention is formed in a substantially rectangular shape and one of the outer peripheral surfaces is formed as an abutting surface that abuts against the positioning surface of the heat radiating body. A ceramic substrate formed as a heat radiating surface where one surface is formed as an element arrangement surface and the other surface in the thickness direction is in surface contact with the heat radiating body, and a predetermined conductive pattern formed on the ceramic substrate, A light emitting portion having a semiconductor light emitting element and disposed on an element arrangement surface of the ceramic substrate and connected to a conductive pattern, and a pair of positive and negative planar electrodes formed on the ceramic substrate and connected to the semiconductor light emitting element through the conductive pattern The pair of planar electrode portions are at least partially exposed areas exposed on the element placement surface of the ceramic substrate, and the pair of planar electrode portions With each of the exposed areas of the parts it is located at a portion other than the both end portions in one direction of the ceramic substrate, in which the non-exposed areas was positioned at both ends in one direction of the ceramic substrate.

  In order to solve the above-described problem, the vehicular lamp of the present invention has a positioning surface and is formed of a predetermined metal material, and is formed in a substantially rectangular shape and has one side surface of the outer peripheral surface. It is formed as an abutment surface that is abutted against the positioning surface of the radiator, and one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is formed as a heat dissipation surface that is in contact with the radiator and dissipates heat. A ceramic substrate, a predetermined conductive pattern formed on the ceramic substrate, a light emitting portion having a semiconductor light emitting element and disposed on an element arrangement surface of the ceramic substrate and connected to the conductive pattern, and formed on the ceramic substrate. A pair of positive and negative planar electrode parts connected to the semiconductor light emitting element through the conductive pattern, and a pair of planar electrode parts and the conductive pattern holding the ceramic substrate A power supply attachment for supplying power to the semiconductor light emitting element and an optical member for irradiating light emitted from the semiconductor light emitting element as illumination light, and at least a part of the pair of planar electrode portions is a ceramic substrate. The exposed area is exposed on the element arrangement surface, and the exposed areas of the pair of planar electrode portions are located at portions other than both ends in one direction of the ceramic substrate, and the non-exposed areas are formed on the ceramic substrate. It is located at both ends in one direction.

  Therefore, in the light emitting module and the vehicular lamp according to the present invention, since the exposed region of the pair of planar electrode portions does not exist in a portion of the outer peripheral portion of the element arrangement surface that is continuous with the abutting surface, the planar electrode portion is No contact with the radiator and no short circuit.

  The light-emitting module of the present invention is a light-emitting module that is fixed to a radiator in a state of being abutted and positioned on a positioning surface formed on a radiator used in a vehicle lamp, and is formed in a substantially rectangular shape and has an outer periphery One of the surfaces is formed as an abutting surface that is abutted against the positioning surface of the radiator, one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is in surface contact with the radiator. A ceramic substrate formed as a heat radiating surface for radiating heat, a predetermined conductive pattern formed on the ceramic substrate, and a light emitting unit having a semiconductor light emitting element and disposed on the element arrangement surface of the ceramic substrate and connected to the conductive pattern And a pair of positive and negative planar electrode portions formed on the ceramic substrate and connected to the semiconductor light emitting element through a conductive pattern, and the pair of planar shapes The pole portion is an exposed region in which at least a part is exposed on the element placement surface of the ceramic substrate, and each exposed region of the pair of planar electrode portions is located in a portion other than both end portions in one direction of the ceramic substrate. In addition, the non-exposed region is located at both ends in one direction of the ceramic substrate.

  Therefore, in a state where the radiator is positioned and fixed with respect to the heat radiating body, the planar electrode portion does not come into contact with the heat radiating body, thereby preventing occurrence of a short circuit.

  In the invention described in claim 2, since the pair of planar electrode portions are formed on the outer peripheral portion located on the opposite side across the semiconductor light emitting element, the design is made with respect to the position where the power supply terminal of the power supply attachment is formed. And the design can be facilitated.

  In the invention described in claim 3, since a part of the pair of planar electrode portions is covered with an insulating layer to form an unexposed region that is not exposed on the element placement surface of the ceramic substrate, the exposed region and the unexposed region Can be easily formed.

  The vehicular lamp according to the present invention is a vehicular lamp in which light emitted from a semiconductor light emitting element of a light emitting module disposed in a lamp housing is irradiated as illumination light by a light projecting lens, and has a positioning surface and has a predetermined surface. A heat radiator formed of a metal material and a substantially rectangular shape and one side surface of the outer peripheral surface is formed as an abutting surface against the positioning surface of the heat radiator, and one surface in the thickness direction is an element A ceramic substrate formed as a disposition surface, the other surface in the thickness direction being brought into surface contact with the heat dissipator to dissipate heat, a predetermined conductive pattern formed on the ceramic substrate, and a semiconductor light emitting element are provided. A light emitting portion disposed on the element placement surface of the ceramic substrate and connected to the conductive pattern; and a light emitting portion formed on the ceramic substrate through the conductive pattern. A pair of positive and negative planar electrode parts connected to the body light emitting element, a power supply attachment that holds the ceramic substrate and feeds power to the semiconductor light emitting element via the pair of planar electrode parts and the conductive pattern, and a semiconductor light emitting element An optical member that irradiates light emitted from the light source as illumination light, and the pair of planar electrode portions are at least partially exposed areas exposed on the element placement surface of the ceramic substrate, and the pair of planar electrodes Each of the exposed areas is located at a portion other than both ends in one direction of the ceramic substrate, and the non-exposed area is located at both ends in the one direction of the ceramic substrate.

  Therefore, in a state where the radiator is positioned and fixed with respect to the heat radiating body, the planar electrode portion does not come into contact with the heat radiating body, thereby preventing occurrence of a short circuit.

  The best mode for carrying out the light emitting module and the vehicular lamp of the present invention will be described below with reference to the accompanying drawings.

  The light emitting module 1 includes a ceramic substrate 2, a semiconductor light emitting element 3 such as an LED (light emitting diode) chip, and a cover 4 (see FIG. 1).

  The ceramic substrate 2 is formed in a rectangular shape, for example, a horizontally long rectangular shape. As the ceramic substrate 2, various substrates such as an aluminum nitride ceramic substrate, an alumina ceramic substrate, a mullite ceramic substrate, and a glass ceramic substrate are used. Yes.

  When the ceramic substrate 2 is defined as a first direction (longitudinal direction) and a second direction (short direction), respectively, which are perpendicular to the thickness direction and extend from each side edge (see FIG. 2), The surface (upper surface) is formed as an element disposition surface 2a on which the semiconductor light emitting element 3 is disposed, the other surface (lower surface) in the thickness direction is formed as a heat radiating surface 2b, and one surface in the second direction among the outer peripheral surfaces. The (rear surface) is formed as an abutting surface 2c that abuts against a heat radiating body described later.

  The ceramic substrate 2 is formed with a pair of conductive patterns 5 and 5 extending in the second direction (see FIG. 2).

  Planar electrode portions 6 and 6 are formed on both ends of the ceramic substrate 2 in the first direction so as to be continuous with the conductive patterns 5 and 5, respectively. Each of the planar electrode portions 6 and 6 includes exposed regions 6a and 6a exposed on the element arrangement surface 2a of the ceramic substrate 2 and non-exposed regions 6b, 6b,.

  The exposed regions 6a, 6a are located at portions other than both ends in the second direction of the ceramic substrate 2, and the non-exposed regions 6b, 6b,... Are located at both ends in the second direction of the ceramic substrate 2. ing. The non-exposed regions 6b, 6b,... Are formed by, for example, covering part of the planar electrode portions 6 and 6 with the insulating layer 7.

  In addition, the end surface on the Y1 (see FIG. 2) side in the second direction of the planar electrode portions 6 and 6 is covered with, for example, an insulating layer and is not exposed to the abutting surface 2c. Moreover, the both end surfaces in the 1st direction of the planar electrode parts 6 and 6 are also covered with the insulating layer, for example.

  As the semiconductor light emitting element 3, for example, a light emitting diode in which a phosphor is applied in a uniform film shape is used. The semiconductor light emitting element 3 is arranged on the element arrangement surface 2 a of the ceramic substrate 2 through a state over the conductive patterns 5 and 5 or a submount over the conductive patterns 5 and 5. When the semiconductor light emitting element 3 is not disposed on the submount, the semiconductor light emitting element 3 functions alone as the light emitting unit 3A, and when disposed on the submount, the semiconductor light emitting element 3 functions as the light emitting unit 3A together with the submount.

  The light emitting section 3A described above may have only one semiconductor light emitting element 3, and a plurality of semiconductor light emitting elements 3, 3,..., For example, a semiconductor formed in a square shape. The light emitting elements 3, 3,... May be arranged in a line and formed in a rectangular shape as a whole.

  The light emitting unit 3A is formed in, for example, a horizontally long rectangular shape, and is arranged so that the longitudinal direction thereof coincides with the longitudinal direction of the ceramic substrate 2 (see FIG. 2).

  The cover 4 has a substantially hemispherical outer surface and is joined to the element arrangement surface 2a of the ceramic substrate 2 so as to cover the semiconductor light emitting element 3 (see FIGS. 1 and 2). By joining the cover 4 to the ceramic substrate 2, the light emitting part 3 </ b> A is arranged in a hollow sealed region in the cover 4.

  The light emitting module 1 is connected and fixed to the power supply attachment 8 (see FIG. 3). The power supply attachment 8 includes a base surface portion 9 formed integrally with a resin material except for a conductive portion, formed in a substantially flat plate shape facing in the vertical direction, and a protruding portion protruding downward from one end portion of the base surface portion 9. 10.

  An arrangement hole 9 a having a substantially rectangular shape is formed in the base surface portion 9.

  The protruding portion 10 is provided with power feeding portions 11 and 11. The power feeding units 11 and 11 are, for example, connector terminals connected to an external power source.

  The power supply attachment 8 is provided with power supply terminals 12 and 12. The power supply terminals 12 and 12 are integrally formed of the same material as the power supply units 11 and 11, one end projects from the inner peripheral surface of the power supply attachment 8 toward the arrangement hole 9 a, and the other end is supplied with power. Connected to the units 11 and 11. One end portions of the power supply terminals 12 and 12 are provided as connection portions 12a and 12a constituted by a plurality of leaf springs.

  The light emitting module 1 is fixed to the power feeding attachment 8 by a holder 13. The holder 13 has a base portion 14 extending left and right and side portions 15 and 15 projecting rearward from both left and right end portions of the base portion 14, and receiving portions projecting toward the side portions 15 and 15 toward each other. 15a and 15a are provided.

  The light emitting module 1 is inserted into the arrangement hole 9a of the power supply attachment 8 from below, and connected to the planar electrode portions 6 and 6 by pressing the connection portions 12a and 12a of the power supply terminals 12 and 12 from above. In this state, the holder 13 is slid from the front with respect to the power supply attachment 8, and the holder 13 is coupled with the base portion 14 and the side portions 15 and 15 in contact with the lower surface of the base surface portion 9 (see FIG. 4). A part of the heat radiating surface 2 b of the ceramic substrate 2 is received from below by the receiving protrusions 15 a and 15 a of the holder 13, and the light emitting module 1 is fixed to the power supply attachment 8.

  By connecting the power supply terminals 12 and 12 to the planar electrode parts 6 and 6, the semiconductor light emitting element 3 is connected to the power supply part 11 via the conductive patterns 5 and 5, the planar electrode parts 6 and 6, and the power supply terminals 12 and 12. , 11 are electrically connected.

  The power supply attachment 8 to which the light emitting module 1 configured as described above is connected is fixed to the heat radiating body 16 (see FIGS. 1 and 5).

  The heat dissipating body 16 is formed by integrally forming each part with a metal material having high thermal conductivity. As shown in FIG. 1, the heat dissipating fins 18, 18,. And a mounting projection 19 projecting downward from the base portion 17. The heat dissipating fins 18, 18,...

  A positioning portion 20 is provided on the upper surface of the base portion 17. The positioning unit 20 has first positioning surfaces 20a, 20a facing forward and second positioning surfaces 20b, 20b facing in the left-right direction.

  Insertion holes 17a and 17a are formed in the rear end portion of the base portion 17 so as to be separated from each other in the left-right direction and penetrated in the front-rear direction. A mounting insertion hole 17b is formed in the front surface of the base portion 17, and an engagement hole 17c opened upward is formed in the mounting insertion hole 17b.

  The power supply attachment 8 is fixed to the radiator 16 by a clip 21.

  Each part of the clip 21 is integrally formed of a plate-like metal material having a spring property (see FIG. 1). The clip 21 includes a connecting portion 22 facing in the front-rear direction, pressing protrusions 23 and 23 protruding rearward from the upper edge of the connecting portion 22, and an insertion protrusion protruding rearward from the lower edge of the connecting portion 22. 24.

  The holding protrusions 23 and 23 protrude rearward from the left and right end portions of the connecting portion 22, respectively, and have engaging protrusions 23 a and 23 a that protrude downward at intermediate portions in the protruding direction. The engaging ridges 23a, 23a are formed to extend to the left and right.

  A cut-and-raised engagement protrusion 24a is formed in the insertion protrusion 24, and the engagement protrusion 24a is cut and raised so as to protrude obliquely downward in the front direction.

  The power supply attachment 8 to which the light emitting module 1 is fixed is disposed on the base portion 17 of the radiator 16. When the power supply attachment 8 is disposed on the base portion 17, the abutting surface 2 c of the ceramic substrate 2 is abutted against the first positioning surfaces 20 a and 20 a of the positioning portion 20 from the front, and the radiator 16 of the light emitting module 1. Positioning in the front-rear direction with respect to is performed (see FIGS. 6 and 7). At this time, the rear end portions on both the left and right side surfaces of the ceramic substrate 2 are brought into contact with or brought close to the second positioning surfaces 20b and 20b of the positioning portion 20, respectively, so that the positioning with respect to the radiator 16 is performed in the left-right direction.

  In a state where the light emitting module 1 is positioned on the heat radiator 16, the heat radiation surface 2 b of the ceramic substrate 2 is in surface contact with the heat radiator 16.

  In the state in which the positioning is performed in this way, the pressing protrusions 23 and 23 of the clip 21 are respectively inserted into the insertion holes 17a and 17a of the radiator 16 from the front and the clip 21 is inserted into the mounting insertion hole 17b of the radiator 16. The insertion protrusion 24 is inserted from the front.

  The power feeding attachment 8 is pressed by the engagement protrusions 23 a and 23 a of the clip 21, and the engagement protrusion 24 a of the clip 21 is engaged with the front opening edge of the engagement hole 17 c of the heat dissipating body 16. Is fixed to the radiator 16 (see FIG. 5).

  In a state where the power supply attachment 8 is fixed to the radiator 16, a power cord connector (not shown) connected to an external power source is connected to the power supply units 11, 11 of the power supply attachment 8.

  In the state where the power supply attachment 8 to which the light emitting module 1 is connected as described above is fixed to the radiator 16 by the clip 21, the optical component 25 is attached to the radiator 16 (see FIG. 5). The optical component 25 includes a reflector 26 and a light projecting lens 27. An optical component 25 is attached to the heat radiating body 16, and both of them are arranged in a lamp housing (not shown) to constitute a vehicular lamp 28.

  As described above, in the light emitting module 1, the exposed regions 6 a and 6 a of the pair of planar electrode portions 6 and 6 do not contact the abutting surface 2 c among the outer peripheral portions of the element arrangement surface 2 a of the ceramic substrate 2. Since it is positioned at the portion, the planar electrode portions 6 and 6 do not contact the radiator 16 and are short-circuited when positioned and fixed with respect to the radiator 16 formed of a metal material. Can be prevented.

  Further, in the light emitting module 1, the pair of planar electrode portions 6 and 6 are formed on the outer peripheral portion located on the opposite side of the semiconductor light emitting element 3 in the ceramic substrate 2, and thus the power supply attachment 8. It becomes easy to design the positions where the power supply terminals 12 and 12 are formed, and the design can be facilitated.

  Further, in the light emitting module 1, a part of the pair of planar electrode portions 6, 6 is covered with the insulating layer 7 and is not exposed to the element placement surface 2 a of the ceramic substrate 2. , The exposed regions 6a, 6a and the non-exposed regions 6b, 6b,... Can be easily formed.

  In the above, an example in which the planar electrode portions 6 and 6 are formed on the entire both ends in the first direction of the ceramic substrate 2 has been described. For example, as illustrated in FIG. 8, the planar electrode portions 6 and 6 are formed. It is also possible to form the entire planar electrode portions 6 and 6 as the exposed regions 6a and 6a without forming them at the end on the Y1 side in the second direction. In this case, the insulating layer 7 becomes unnecessary, and the manufacturing cost can be reduced.

  Further, the exposed regions 6a and 6a of the planar electrode portions 6 and 6 may not be formed at the end portion on the Y1 side in the second direction of the ceramic substrate 2, and a pair of surfaces are formed on the hatched portion in FIG. The exposed regions 6a and 6a of the electrode portions 6 and 6 may be formed.

  The shapes and structures of the respective parts shown in the above-described best mode are merely examples of implementations in carrying out the present invention, and the technical scope of the present invention is limitedly interpreted by these. It should not be done.

FIG. 2 to FIG. 9 show the best mode of the present invention, and this figure is an exploded perspective view showing each part. It is an expansion perspective view which shows a light emitting module. It is a disassembled perspective view which shows a light emitting module, the attachment for electric power feeding, and a holder. It is a perspective view which shows the state which fixed the light emitting module to the attachment for electric power feeding with the holder. 1 is a perspective view of a vehicular lamp that is partially exploded. FIG. It is a perspective view which shows the state in which the light emitting module was positioned by the heat radiator. It is a general | schematic expanded side view which shows the state by which the light emitting module was positioned by the heat radiator with a part in cross section. FIG. 6 is an enlarged plan view showing a light emitting module in which planar electrode portions are formed at different positions. It is an enlarged plan view which shows the formation position of the exposure area | region of a planar electrode part.

  DESCRIPTION OF SYMBOLS 1 ... Light emitting module, 2 ... Ceramic substrate, 2a ... Element arrangement | positioning surface, 2b ... Heat radiation surface, 2c ... Abutting surface, 3 ... Semiconductor light emitting element, 3A ... Light emission part, 5 ... Conductive pattern, 6 ... Planar electrode part, 6a ... exposed region, 6b ... non-exposed region, 7 ... insulating layer, 8 ... attachment for feeding, 12 ... feeding terminal, 16 ... heat radiating body, 20a ... first positioning surface, 25 ... optical component, 27 ... projecting lens , 28 ... Vehicle lamp

Claims (4)

A light emitting module that is fixed to a radiator in a state where it is abutted against a positioning surface formed on a radiator and used in a vehicle lamp,
It is formed in a substantially rectangular shape and one side surface of the outer peripheral surface is formed as an abutting surface that is abutted against the positioning surface of the radiator, and one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is formed. A ceramic substrate formed as a heat dissipating surface where the surface is in surface contact with the radiator and dissipates heat;
A predetermined conductive pattern formed on the ceramic substrate;
A light-emitting portion having a semiconductor light-emitting element and disposed on the element arrangement surface of the ceramic substrate and connected to the conductive pattern;
A pair of positive and negative planar electrode parts formed on the ceramic substrate and connected to the semiconductor light emitting element through a conductive pattern,
The pair of planar electrode portions is an exposed region in which at least a part is exposed on the element placement surface of the ceramic substrate,
The exposed regions of the pair of planar electrode portions are positioned at portions other than both ends in one direction of the ceramic substrate, and the non-exposed regions are positioned at both ends in the one direction of the ceramic substrate. A light emitting module characterized by that. The light emitting module according to claim 1, wherein the pair of planar electrode portions are formed on an outer peripheral portion located on opposite sides of the semiconductor light emitting element. 3. The light emitting module according to claim 1, wherein a part of the pair of planar electrode portions is covered with an insulating layer to form an unexposed region that is not exposed on the element placement surface of the ceramic substrate. A vehicle lamp in which light emitted from a semiconductor light emitting element of a light emitting module disposed in a lamp housing is irradiated as illumination light by a light projecting lens,
A radiator having a positioning surface and formed of a predetermined metal material;
It is formed in a substantially rectangular shape and one side surface of the outer peripheral surface is formed as an abutting surface that is abutted against the positioning surface of the radiator, and one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is formed. A ceramic substrate formed as a heat dissipating surface where the surface is in surface contact with the radiator and dissipates heat;
A predetermined conductive pattern formed on the ceramic substrate;
A light-emitting portion having a semiconductor light-emitting element and disposed on the element arrangement surface of the ceramic substrate and connected to the conductive pattern;
A pair of positive and negative planar electrode portions formed on the ceramic substrate and connected to the semiconductor light emitting element via a conductive pattern;
An attachment for feeding that holds the ceramic substrate and feeds power to the semiconductor light emitting element through the pair of planar electrode portions and the conductive pattern;
An optical member that irradiates light emitted from the semiconductor light emitting element as illumination light,
The pair of planar electrode portions is an exposed region in which at least a part is exposed on the element placement surface of the ceramic substrate,
The exposed regions of the pair of planar electrode portions are positioned at portions other than both ends in one direction of the ceramic substrate, and the non-exposed regions are positioned at both ends in the one direction of the ceramic substrate. A vehicular lamp characterized by that.

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