JP2011187451A - Light-emitting module, and vehicular lamp - Google Patents

Light-emitting module, and vehicular lamp Download PDF

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JP2011187451A
JP2011187451A JP2011101868A JP2011101868A JP2011187451A JP 2011187451 A JP2011187451 A JP 2011187451A JP 2011101868 A JP2011101868 A JP 2011101868A JP 2011101868 A JP2011101868 A JP 2011101868A JP 2011187451 A JP2011187451 A JP 2011187451A
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ceramic substrate
light emitting
pair
planar electrode
radiator
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Hitoshi Takeda
仁志 武田
Tsukasa Tokita
主 時田
Kazunori Watanabe
和憲 渡邉
Masato Ono
正人 小野
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Koito Mfg Co Ltd
株式会社小糸製作所
Nichia Corp
日亜化学工業株式会社
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module capable of preventing occurrence of short-circuiting. <P>SOLUTION: The light-emitting module includes: a ceramic substrate 2 having one side surface out of outer peripheral surfaces formed in an approximately rectangular shape as an abutting surface 2c which is abutted to positioning surfaces 20a, 20a of a radiator 16, and having one side surface out of surfaces in a thickness direction formed as an element arranging surface 2a where light-emitting elements 3 are arranged; given conductive patterns 5, 5 formed on the ceramic substrate; a light-emitting section 3A having the light-emitting element; and a pair of positive and negative planar electrodes 6, 6 formed on the ceramic substrate and connected with the semiconductor light-emitting element through the conductive patterns. At least parts of the pair of planar electrodes are to be exposed zones 6a, 6a exposed to the element arranging surface of the ceramic substrate, respective exposed zones of the pair of planar electrodes are located at a section excluding both ends in one direction of the ceramic substrate, and non-exposed zones are located on both ends in the one direction of the ceramic substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は発光モジュール及び車輌用灯具に関する。詳しくは、一対の面状電極部の露出領域をセラミック基板の所定の位置に形成してショートの発生の防止を図る技術分野に関する。   The present invention relates to a light emitting module and a vehicle lamp. Specifically, the present invention relates to a technical field in which an exposed region of a pair of planar electrode portions is formed at a predetermined position of a ceramic substrate to prevent occurrence of a short circuit.
発光ダイオード(LED)等の半導体発光素子を光源として用いた発光モジュールがあり、このような発光モジュールは、例えば、光源から出射された光を投光レンズによって照明光として照射する車輌用灯具に備えられている(例えば、特許文献1参照)。   There is a light emitting module that uses a semiconductor light emitting element such as a light emitting diode (LED) as a light source, and such a light emitting module is provided in a vehicle lamp that emits light emitted from a light source as illumination light by a light projection lens, for example. (For example, refer to Patent Document 1).
特許文献1に記載された発光モジュールにあっては、放熱基板の外周面のうちの1つの側面が、熱伝導性の高い金属材料によって形成された放熱体(特許文献1にあっては光源台座50a)の所定の面に突き当てられて該放熱体に固定される。   In the light emitting module described in Patent Document 1, one of the outer peripheral surfaces of the heat radiating substrate has a heat radiating body formed of a metal material having high thermal conductivity (in Patent Document 1, a light source base). It is abutted against a predetermined surface of 50a) and fixed to the radiator.
放熱基板には放熱体に対する突き当て方向に直交する方向における両端部の全体に、それぞれ半導体発光素子への給電用の面状電極部(特許文献1にあっては接点46、46)が形成されている。   On the heat radiating substrate, planar electrode portions (contacts 46 and 46 in Patent Document 1) for supplying power to the semiconductor light emitting element are formed on both ends in the direction orthogonal to the abutting direction with respect to the heat radiating body. ing.
特開2006−66108号公報JP 2006-66108 A
ところが、特許文献1に記載された発光モジュールにあっては、放熱基板の放熱体に対する突き当て方向に直交する方向における両端部の全体に面状電極部が形成されているため、放熱体の所定の面に突き当てられて該放熱体に固定された状態において、面状電極部の各一端が放熱体に接触するおそれがあり、ショートを引き起こす可能性がある。   However, in the light emitting module described in Patent Document 1, since the planar electrode portions are formed on both ends in the direction orthogonal to the abutting direction of the heat radiating substrate with respect to the heat radiating body, a predetermined amount of the heat radiating body is determined. There is a possibility that each end of the planar electrode portion may come into contact with the heat radiating body in a state where it is abutted against the surface and fixed to the heat radiating body, which may cause a short circuit.
特に、面状電極部の上記各一端や放熱体の上記所定の面に水分や異物等が付着していた場合には、これらが各一端と所定の面とを接続する介在物となり得るため、ショートの発生の可能性が高くなってしまう。   In particular, when moisture or foreign matter adheres to the one end of the planar electrode portion or the predetermined surface of the radiator, these can be inclusions connecting the one end and the predetermined surface, The possibility of occurrence of a short circuit is increased.
そこで、本発明発光モジュール及び車輌用灯具は、ショートの発生の防止を図ることを課題とする。   Accordingly, it is an object of the light emitting module and the vehicle lamp of the present invention to prevent the occurrence of a short circuit.
本発明発光モジュールは、上記した課題を解決するために、略矩形状に形成されると共に外周面のうちの1つの側面が放熱体の位置決め面に突き当てられる突き当て面として形成され厚み方向における一方の面が素子配置面として形成され厚み方向における他方の面が放熱体に面接触されて放熱を行う放熱面として形成されたセラミック基板と、該セラミック基板に形成された所定の導電パターンと、半導体発光素子を有し上記セラミック基板の素子配置面に配置され導電パターンに接続された発光部と、上記セラミック基板に形成され導電パターンを介して半導体発光素子に接続された正負一対の面状電極部とを設け、上記一対の面状電極部は少なくとも一部がセラミック基板の素子配置面に露出された露出領域とされ、上記一対の面状電極部のそれぞれの露出領域がセラミック基板の一の方向における両端部以外の部分に位置されるとともに、非露出領域がセラミック基板の一の方向における両端部に位置するようにしたものである。   In order to solve the above-described problem, the light emitting module of the present invention is formed in a substantially rectangular shape and one of the outer peripheral surfaces is formed as an abutting surface that abuts against the positioning surface of the heat radiating body. A ceramic substrate formed as a heat radiating surface where one surface is formed as an element arrangement surface and the other surface in the thickness direction is in surface contact with the heat radiating body, and a predetermined conductive pattern formed on the ceramic substrate, A light emitting portion having a semiconductor light emitting element and disposed on an element arrangement surface of the ceramic substrate and connected to a conductive pattern, and a pair of positive and negative planar electrodes formed on the ceramic substrate and connected to the semiconductor light emitting element through the conductive pattern The pair of planar electrode portions are at least partially exposed areas exposed on the element placement surface of the ceramic substrate, and the pair of planar electrode portions With each of the exposed areas of the parts it is located at a portion other than the both end portions in one direction of the ceramic substrate, in which the non-exposed areas was positioned at both ends in one direction of the ceramic substrate.
本発明車輌用灯具は、上記した課題を解決するために、位置決め面を有し所定の金属材料によって形成された放熱体と、略矩形状に形成されると共に外周面のうちの1つの側面が放熱体の位置決め面に突き当てられる突き当て面として形成され厚み方向における一方の面が素子配置面として形成され厚み方向における他方の面が放熱体に面接触されて放熱を行う放熱面として形成されたセラミック基板と、該セラミック基板に形成された所定の導電パターンと、半導体発光素子を有し上記セラミック基板の素子配置面に配置され導電パターンに接続された発光部と、上記セラミック基板に形成され導電パターンを介して半導体発光素子に接続された正負一対の面状電極部と、上記セラミック基板を保持し一対の面状電極部及び導電パターンを介して半導体発光素子への給電を行う給電用アタッチメントと、半導体発光素子から出射された光を照明光として照射する光学部材とを設け、上記一対の面状電極部は少なくとも一部がセラミック基板の素子配置面に露出された露出領域とされ、上記一対の面状電極部のそれぞれの露出領域がセラミック基板の一の方向における両端部以外の部分に位置されるとともに、非露出領域がセラミック基板の一の方向における両端部に位置するようにしたものである。   In order to solve the above-described problem, the vehicular lamp of the present invention has a positioning surface and is formed of a predetermined metal material, and is formed in a substantially rectangular shape and has one side surface of the outer peripheral surface. It is formed as an abutment surface that is abutted against the positioning surface of the radiator, and one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is formed as a heat dissipation surface that is in contact with the radiator and dissipates heat. A ceramic substrate, a predetermined conductive pattern formed on the ceramic substrate, a light emitting portion having a semiconductor light emitting element and disposed on an element arrangement surface of the ceramic substrate and connected to the conductive pattern, and formed on the ceramic substrate. A pair of positive and negative planar electrode parts connected to the semiconductor light emitting element through the conductive pattern, and a pair of planar electrode parts and the conductive pattern holding the ceramic substrate A power supply attachment for supplying power to the semiconductor light emitting element and an optical member for irradiating light emitted from the semiconductor light emitting element as illumination light, and at least a part of the pair of planar electrode portions is a ceramic substrate. The exposed area is exposed on the element arrangement surface, and the exposed areas of the pair of planar electrode portions are located at portions other than both ends in one direction of the ceramic substrate, and the non-exposed areas are formed on the ceramic substrate. It is located at both ends in one direction.
従って、本発明発光モジュール及び車輌用灯具にあっては、一対の面状電極部の露出領域が素子配置面の外周部のうち突き当て面に連続する部分に存在しないので、面状電極部が放熱体に接触せず、ショートを引き起こすことがなくなる。   Therefore, in the light emitting module and the vehicular lamp according to the present invention, since the exposed region of the pair of planar electrode portions does not exist in a portion of the outer peripheral portion of the element arrangement surface that is continuous with the abutting surface, the planar electrode portion is No contact with the radiator and no short circuit.
本発明発光モジュールは、車輌用灯具に用いられ放熱体に形成された位置決め面に突き当てられ位置決めされた状態で放熱体に固定される発光モジュールであって、略矩形状に形成されると共に外周面のうちの1つの側面が放熱体の位置決め面に突き当てられる突き当て面として形成され厚み方向における一方の面が素子配置面として形成され厚み方向における他方の面が放熱体に面接触されて放熱を行う放熱面として形成されたセラミック基板と、該セラミック基板に形成された所定の導電パターンと、半導体発光素子を有し上記セラミック基板の素子配置面に配置され導電パターンに接続された発光部と、上記セラミック基板に形成され導電パターンを介して半導体発光素子に接続された正負一対の面状電極部とを備え、上記一対の面状電極部は少なくとも一部がセラミック基板の素子配置面に露出された露出領域とされ、上記一対の面状電極部のそれぞれの露出領域がセラミック基板の一の方向における両端部以外の部分に位置されるとともに、非露出領域がセラミック基板の一の方向における両端部に位置するようにしたことを特徴とする。   The light-emitting module of the present invention is a light-emitting module that is fixed to a radiator in a state of being abutted and positioned on a positioning surface formed on a radiator used in a vehicle lamp, and is formed in a substantially rectangular shape and has an outer periphery One of the surfaces is formed as an abutting surface that is abutted against the positioning surface of the radiator, one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is in surface contact with the radiator. A ceramic substrate formed as a heat radiating surface for radiating heat, a predetermined conductive pattern formed on the ceramic substrate, and a light emitting unit having a semiconductor light emitting element and disposed on the element arrangement surface of the ceramic substrate and connected to the conductive pattern And a pair of positive and negative planar electrode portions formed on the ceramic substrate and connected to the semiconductor light emitting element through a conductive pattern, and the pair of planar shapes The pole portion is an exposed region in which at least a part is exposed on the element placement surface of the ceramic substrate, and each exposed region of the pair of planar electrode portions is located in a portion other than both end portions in one direction of the ceramic substrate. In addition, the non-exposed region is located at both ends in one direction of the ceramic substrate.
従って、放熱体に対して位置決めされて固定された状態において、面状電極部が放熱体に接触せず、ショートの発生を防止することができる。   Therefore, in a state where the radiator is positioned and fixed with respect to the heat radiating body, the planar electrode portion does not come into contact with the heat radiating body, thereby preventing occurrence of a short circuit.
請求項2に記載した発明にあっては、上記一対の面状電極部をそれぞれ半導体発光素子を挟んで反対側に位置する外周部に形成したので、給電用アタッチメントの給電端子の形成位置に関して設計が容易となり、設計の容易化を図ることができる。   In the invention described in claim 2, since the pair of planar electrode portions are formed on the outer peripheral portion located on the opposite side across the semiconductor light emitting element, the design is made with respect to the position where the power supply terminal of the power supply attachment is formed. And the design can be facilitated.
請求項3に記載した発明にあっては、上記一対の面状電極部の一部を絶縁層で覆いセラミック基板の素子配置面に露出されない非露出領域を形成したので、露出領域と非露出領域を容易に形成することができる。   In the invention described in claim 3, since a part of the pair of planar electrode portions is covered with an insulating layer to form an unexposed region that is not exposed on the element placement surface of the ceramic substrate, the exposed region and the unexposed region Can be easily formed.
本発明車輌用灯具は、ランプハウジング内に配置された発光モジュールの半導体発光素子から出射された光が投光レンズによって照明光として照射される車輌用灯具であって、位置決め面を有し所定の金属材料によって形成された放熱体と、略矩形状に形成されると共に外周面のうちの1つの側面が放熱体の位置決め面に突き当てられる突き当て面として形成され厚み方向における一方の面が素子配置面として形成され厚み方向における他方の面が放熱体に面接触されて放熱を行う放熱面として形成されたセラミック基板と、該セラミック基板に形成された所定の導電パターンと、半導体発光素子を有し上記セラミック基板の素子配置面に配置され導電パターンに接続された発光部と、上記セラミック基板に形成され導電パターンを介して半導体発光素子に接続された正負一対の面状電極部と、上記セラミック基板を保持し一対の面状電極部及び導電パターンを介して半導体発光素子への給電を行う給電用アタッチメントと、半導体発光素子から出射された光を照明光として照射する光学部材とを備え、上記一対の面状電極部は少なくとも一部がセラミック基板の素子配置面に露出された露出領域とされ、上記一対の面状電極部のそれぞれの露出領域がセラミック基板の一の方向における両端部以外の部分に位置されるとともに、非露出領域がセラミック基板の一の方向における両端部に位置するようにしたことを特徴とする。   The vehicular lamp according to the present invention is a vehicular lamp in which light emitted from a semiconductor light emitting element of a light emitting module disposed in a lamp housing is irradiated as illumination light by a light projecting lens, and has a positioning surface and has a predetermined surface. A heat radiator formed of a metal material and a substantially rectangular shape and one side surface of the outer peripheral surface is formed as an abutting surface against the positioning surface of the heat radiator, and one surface in the thickness direction is an element A ceramic substrate formed as a disposition surface, the other surface in the thickness direction being brought into surface contact with the heat dissipator to dissipate heat, a predetermined conductive pattern formed on the ceramic substrate, and a semiconductor light emitting element are provided. A light emitting portion disposed on the element placement surface of the ceramic substrate and connected to the conductive pattern; and a light emitting portion formed on the ceramic substrate through the conductive pattern. A pair of positive and negative planar electrode parts connected to the body light emitting element, a power supply attachment that holds the ceramic substrate and feeds power to the semiconductor light emitting element via the pair of planar electrode parts and the conductive pattern, and a semiconductor light emitting element An optical member that irradiates light emitted from the light source as illumination light, and the pair of planar electrode portions are at least partially exposed areas exposed on the element placement surface of the ceramic substrate, and the pair of planar electrodes Each of the exposed areas is located at a portion other than both ends in one direction of the ceramic substrate, and the non-exposed area is located at both ends in the one direction of the ceramic substrate.
従って、放熱体に対して位置決めされて固定された状態において、面状電極部が放熱体に接触せず、ショートの発生を防止することができる。   Therefore, in a state where the radiator is positioned and fixed with respect to the heat radiating body, the planar electrode portion does not come into contact with the heat radiating body, thereby preventing occurrence of a short circuit.
以下に、本発明発光モジュール及び車輌用灯具を実施するための最良の形態について添付図面を参照して説明する。   The best mode for carrying out the light emitting module and the vehicular lamp of the present invention will be described below with reference to the accompanying drawings.
発光モジュール1は、セラミック基板2とLED(発光ダイオード)チップ等の半導体発光素子3とカバー4とを備えている(図1参照)。   The light emitting module 1 includes a ceramic substrate 2, a semiconductor light emitting element 3 such as an LED (light emitting diode) chip, and a cover 4 (see FIG. 1).
セラミック基板2は矩形状、例えば、横長の長方形状に形成され、セラミック基板2としては、例えば、窒化アルミニウムセラミック基板、アルミナセラミック基板、ムライトセラミック基板、ガラスセラミック基板等の種々の基板が用いられている。   The ceramic substrate 2 is formed in a rectangular shape, for example, a horizontally long rectangular shape. As the ceramic substrate 2, various substrates such as an aluminum nitride ceramic substrate, an alumina ceramic substrate, a mullite ceramic substrate, and a glass ceramic substrate are used. Yes.
セラミック基板2は、厚み方向に直交し各側縁が延びる2方向をそれぞれ第1の方向(長手方向)及び第2の方向(短手方向)とすると(図2参照)、厚み方向における一方の面(上面)が半導体発光素子3が配置される素子配置面2aとして形成され、厚み方向における他方の面(下面)が放熱面2bとして形成され、外周面のうち第2の方向における一方の面(後面)が後述する放熱体に突き当てられる突き当て面2cとして形成されている。   When the ceramic substrate 2 is defined as a first direction (longitudinal direction) and a second direction (short direction), respectively, which are perpendicular to the thickness direction and extend from each side edge (see FIG. 2), The surface (upper surface) is formed as an element disposition surface 2a on which the semiconductor light emitting element 3 is disposed, the other surface (lower surface) in the thickness direction is formed as a heat radiating surface 2b, and one surface in the second direction among the outer peripheral surfaces. The (rear surface) is formed as an abutting surface 2c that abuts against a heat radiating body described later.
セラミック基板2には、第2の方向に延びる一対の導電パターン5、5が形成されている(図2参照)。   The ceramic substrate 2 is formed with a pair of conductive patterns 5 and 5 extending in the second direction (see FIG. 2).
セラミック基板2の第1の方向における両端部には、それぞれ面状電極部6、6が導電パターン5、5に連続して形成されている。面状電極部6、6は、それぞれセラミック基板2の素子配置面2aに露出された露出領域6a、6aと露出されていない非露出領域6b、6b、・・・とから成る。   Planar electrode portions 6 and 6 are formed on both ends of the ceramic substrate 2 in the first direction so as to be continuous with the conductive patterns 5 and 5, respectively. Each of the planar electrode portions 6 and 6 includes exposed regions 6a and 6a exposed on the element arrangement surface 2a of the ceramic substrate 2 and non-exposed regions 6b, 6b,.
露出領域6a、6aは、セラミック基板2の第2の方向における両端部以外の部分に位置され、セラミック基板2の第2の方向における両端部に非露出領域6b、6b、・・・が位置されている。非露出領域6b、6b、・・・は、例えば、面状電極部6、6の一部を絶縁層7で覆うことにより形成されている。   The exposed regions 6a, 6a are located at portions other than both ends in the second direction of the ceramic substrate 2, and the non-exposed regions 6b, 6b,... Are located at both ends in the second direction of the ceramic substrate 2. ing. The non-exposed regions 6b, 6b,... Are formed by, for example, covering part of the planar electrode portions 6 and 6 with the insulating layer 7.
尚、面状電極部6、6の第2の方向におけるY1(図2参照)側の端面は、例えば、絶縁層によって覆われて突き当て面2cに露出されていない。また、面状電極部6、6の第1の方向における両端面も、例えば、絶縁層によって覆われている。   In addition, the end surface on the Y1 (see FIG. 2) side in the second direction of the planar electrode portions 6 and 6 is covered with, for example, an insulating layer and is not exposed to the abutting surface 2c. Moreover, the both end surfaces in the 1st direction of the planar electrode parts 6 and 6 are also covered with the insulating layer, for example.
半導体発光素子3としては、例えば、蛍光体を均一の膜状に塗布した発光ダイオードが用いられている。半導体発光素子3は、導電パターン5、5に跨った状態又は導電パターン5、5に跨ったサブマウントを介してセラミック基板2の素子配置面2aに配置されている。尚、半導体発光素子3はサブマウント上に配置されていない場合には単体で発光部3Aとして機能し、サブマウント上に配置されている場合にはサブマウントとともに発光部3Aとして機能する。   As the semiconductor light emitting element 3, for example, a light emitting diode in which a phosphor is applied in a uniform film shape is used. The semiconductor light emitting element 3 is arranged on the element arrangement surface 2 a of the ceramic substrate 2 through a state over the conductive patterns 5 and 5 or a submount over the conductive patterns 5 and 5. When the semiconductor light emitting element 3 is not disposed on the submount, the semiconductor light emitting element 3 functions alone as the light emitting unit 3A, and when disposed on the submount, the semiconductor light emitting element 3 functions as the light emitting unit 3A together with the submount.
尚、上記した発光部3Aは、一つのみの半導体発光素子3を有していてもよく、また、複数の半導体発光素子3、3、・・・・、例えば、正方形状に形成された半導体発光素子3、3、・・・が一列に並んで配置され、全体として長方形状に形成されたものであってもよい。   The light emitting section 3A described above may have only one semiconductor light emitting element 3, and a plurality of semiconductor light emitting elements 3, 3,..., For example, a semiconductor formed in a square shape. The light emitting elements 3, 3,... May be arranged in a line and formed in a rectangular shape as a whole.
発光部3Aは、例えば、横長の長方形状に形成され、長手方向がセラミック基板2の長手方向に一致するように配置されている(図2参照)。   The light emitting unit 3A is formed in, for example, a horizontally long rectangular shape, and is arranged so that the longitudinal direction thereof coincides with the longitudinal direction of the ceramic substrate 2 (see FIG. 2).
カバー4は外面が略半球状に形成され、セラミック基板2の素子配置面2aに半導体発光素子3を覆うようにして接合されている(図1及び図2参照)。カバー4がセラミック基板2に接合されることにより、発光部3Aがカバー4内における中空の密閉領域に配置される。   The cover 4 has a substantially hemispherical outer surface and is joined to the element arrangement surface 2a of the ceramic substrate 2 so as to cover the semiconductor light emitting element 3 (see FIGS. 1 and 2). By joining the cover 4 to the ceramic substrate 2, the light emitting part 3 </ b> A is arranged in a hollow sealed region in the cover 4.
発光モジュール1は給電用アタッチメント8に接続されて固定される(図3参照)。給電用アタッチメント8は、導通部分を除き樹脂材料によって各部が一体に形成され、上下方向を向く略平板状に形成されたベース面部9と該ベース面部9の一端部から下方へ突出された突出部10とを有している。   The light emitting module 1 is connected and fixed to the power supply attachment 8 (see FIG. 3). The power supply attachment 8 includes a base surface portion 9 formed integrally with a resin material except for a conductive portion, formed in a substantially flat plate shape facing in the vertical direction, and a protruding portion protruding downward from one end portion of the base surface portion 9. 10.
ベース面部9には略矩形状を為す配置孔9aが形成されている。   An arrangement hole 9 a having a substantially rectangular shape is formed in the base surface portion 9.
突出部10には給電部11、11が設けられている。給電部11、11は、例えば、外部電源に接続されるコネクター端子である。   The protruding portion 10 is provided with power feeding portions 11 and 11. The power feeding units 11 and 11 are, for example, connector terminals connected to an external power source.
給電用アタッチメント8には給電端子12、12が設けられている。給電端子12、12は給電部11、11と同一の材料によって一体に形成され、一端部が給電用アタッチメント8の内周面から配置孔9aにおいて互いに近付く方向へ突出され、他端部がそれぞれ給電部11、11に接続されている。給電端子12、12の一端部は複数の板バネによって構成された接続部12a、12aとして設けられている。   The power supply attachment 8 is provided with power supply terminals 12 and 12. The power supply terminals 12 and 12 are integrally formed of the same material as the power supply units 11 and 11, one end projects from the inner peripheral surface of the power supply attachment 8 toward the arrangement hole 9 a, and the other end is supplied with power. Connected to the units 11 and 11. One end portions of the power supply terminals 12 and 12 are provided as connection portions 12a and 12a constituted by a plurality of leaf springs.
発光モジュール1はホルダー13によって給電用アタッチメント8に固定される。ホルダー13は左右に延びる基部14と該基部14の左右両端部から後方へ突出された側部15、15とを有し、該側部15、15には互いに近付く方向へ突出された受け突部15a、15aが設けられている。   The light emitting module 1 is fixed to the power feeding attachment 8 by a holder 13. The holder 13 has a base portion 14 extending left and right and side portions 15 and 15 projecting rearward from both left and right end portions of the base portion 14, and receiving portions projecting toward the side portions 15 and 15 toward each other. 15a and 15a are provided.
発光モジュール1は給電用アタッチメント8の配置孔9aに下方から挿入され、面状電極部6、6にそれぞれ給電端子12、12の接続部12a、12aが上方から押し付けられて接続される。この状態でホルダー13が給電用アタッチメント8に対して前方からスライドされ、ホルダー13は基部14及び側部15、15がベース面部9の下面に接した状態で結合される(図4参照)。ホルダー13の受け突部15a、15aによってセラミック基板2の放熱面2bの一部が下方から受けられ、発光モジュール1が給電用アタッチメント8に固定される。   The light emitting module 1 is inserted into the arrangement hole 9a of the power supply attachment 8 from below, and connected to the planar electrode portions 6 and 6 by pressing the connection portions 12a and 12a of the power supply terminals 12 and 12 from above. In this state, the holder 13 is slid from the front with respect to the power supply attachment 8, and the holder 13 is coupled with the base portion 14 and the side portions 15 and 15 in contact with the lower surface of the base surface portion 9 (see FIG. 4). A part of the heat radiating surface 2 b of the ceramic substrate 2 is received from below by the receiving protrusions 15 a and 15 a of the holder 13, and the light emitting module 1 is fixed to the power supply attachment 8.
面状電極部6、6に給電端子12、12が接続されることにより、半導体発光素子3が導電パターン5、5、面状電極部6、6、給電端子12、12を介して給電部11、11に電気的に接続される。   By connecting the power supply terminals 12 and 12 to the planar electrode parts 6 and 6, the semiconductor light emitting element 3 is connected to the power supply part 11 via the conductive patterns 5 and 5, the planar electrode parts 6 and 6, and the power supply terminals 12 and 12. , 11 are electrically connected.
上記のように構成された発光モジュール1が接続された給電用アタッチメント8は放熱体16に固定される(図1及び図5参照)。   The power supply attachment 8 to which the light emitting module 1 configured as described above is connected is fixed to the heat radiating body 16 (see FIGS. 1 and 5).
放熱体16は熱伝導性の高い金属材料によって各部が一体に形成されて成り、図1に示すように、ベース部17と該ベース部17から後方へ突出された放熱フィン18、18、・・・とベース部17から下方へ突出された取付突部19とから成る。放熱フィン18、18、・・・は左右に等間隔に離隔して設けられている。   The heat dissipating body 16 is formed by integrally forming each part with a metal material having high thermal conductivity. As shown in FIG. 1, the heat dissipating fins 18, 18,. And a mounting projection 19 projecting downward from the base portion 17. The heat dissipating fins 18, 18,...
ベース部17の上面には位置決め部20が設けられている。位置決め部20は前方を向く第1の位置決め面20a、20aと左右方向で向き合った第2の位置決め面20b、20bとを有している。   A positioning portion 20 is provided on the upper surface of the base portion 17. The positioning unit 20 has first positioning surfaces 20a, 20a facing forward and second positioning surfaces 20b, 20b facing in the left-right direction.
ベース部17の後端部には左右に離隔して前後に貫通された挿通孔17a、17aが形成されている。ベース部17の前面には取付用挿入孔17bが形成され、該取付用挿入孔17bの内部には、上方に開口された係合穴17cが形成されている。   Insertion holes 17a and 17a are formed in the rear end portion of the base portion 17 so as to be separated from each other in the left-right direction and penetrated in the front-rear direction. A mounting insertion hole 17b is formed in the front surface of the base portion 17, and an engagement hole 17c opened upward is formed in the mounting insertion hole 17b.
給電用アタッチメント8は放熱体16にクリップ21によって固定される。   The power supply attachment 8 is fixed to the radiator 16 by a clip 21.
クリップ21はバネ性を有する板状の金属材料によって各部が一体に形成されて成る(図1参照)。クリップ21は、前後方向を向く連結部22と、該連結部22の上縁からそれぞれ後方へ突出された押さえ突部23、23と、連結部22の下縁から後方へ突出された挿入突部24とから成る。   Each part of the clip 21 is integrally formed of a plate-like metal material having a spring property (see FIG. 1). The clip 21 includes a connecting portion 22 facing in the front-rear direction, pressing protrusions 23 and 23 protruding rearward from the upper edge of the connecting portion 22, and an insertion protrusion protruding rearward from the lower edge of the connecting portion 22. 24.
押さえ突部23、23は連結部22の左右両端部からそれぞれ後方へ突出され、突出方向における中間部にそれぞれ下方へ突出された係合突条23a、23aを有している。係合突条23a、23aは左右に延びるように形成されている。   The holding protrusions 23 and 23 protrude rearward from the left and right end portions of the connecting portion 22, respectively, and have engaging protrusions 23 a and 23 a that protrude downward at intermediate portions in the protruding direction. The engaging ridges 23a, 23a are formed to extend to the left and right.
挿入突部24には切り起こし状の係合突片24aが形成され、該係合突片24aは前斜め下方へ突出するように切り起こされている。   A cut-and-raised engagement protrusion 24a is formed in the insertion protrusion 24, and the engagement protrusion 24a is cut and raised so as to protrude obliquely downward in the front direction.
発光モジュール1が固定された給電用アタッチメント8は放熱体16のベース部17上に配置される。給電用アタッチメント8がベース部17上に配置されるときには、セラミック基板2の突き当て面2cが位置決め部20の第1の位置決め面20a、20aに前方から突き当てられて発光モジュール1の放熱体16に対する前後方向における位置決めが行われる(図6及び図7参照)。このときセラミック基板2の左右両側面の各後端部は、それぞれ位置決め部20の第2の位置決め面20b、20bに当接又は近接されて放熱体16に対する左右方向における位置決めが行われる。   The power supply attachment 8 to which the light emitting module 1 is fixed is disposed on the base portion 17 of the radiator 16. When the power supply attachment 8 is disposed on the base portion 17, the abutting surface 2 c of the ceramic substrate 2 is abutted against the first positioning surfaces 20 a and 20 a of the positioning portion 20 from the front, and the radiator 16 of the light emitting module 1. Positioning in the front-rear direction with respect to is performed (see FIGS. 6 and 7). At this time, the rear end portions on both the left and right side surfaces of the ceramic substrate 2 are brought into contact with or brought close to the second positioning surfaces 20b and 20b of the positioning portion 20, respectively, so that the positioning with respect to the radiator 16 is performed in the left-right direction.
発光モジュール1が放熱体16に位置決めされた状態においては、セラミック基板2の放熱面2bが放熱体16と面接触される。   In a state where the light emitting module 1 is positioned on the heat radiator 16, the heat radiation surface 2 b of the ceramic substrate 2 is in surface contact with the heat radiator 16.
このように位置決めが行われた状態において、放熱体16の挿通孔17a、17aにクリップ21の押さえ突部23、23がそれぞれ前方から挿入されると共に放熱体16の取付用挿入孔17bにクリップ21の挿入突部24が前方から挿入される。   In the state in which the positioning is performed in this way, the pressing protrusions 23 and 23 of the clip 21 are respectively inserted into the insertion holes 17a and 17a of the radiator 16 from the front and the clip 21 is inserted into the mounting insertion hole 17b of the radiator 16. The insertion protrusion 24 is inserted from the front.
給電用アタッチメント8は、クリップ21の係合突条23a、23aによって押さえられ、クリップ21の係合突片24aが放熱体16の係合穴17cの前側開口縁に係合することにより、クリップ21によって放熱体16に固定される(図5参照)。   The power feeding attachment 8 is pressed by the engagement protrusions 23 a and 23 a of the clip 21, and the engagement protrusion 24 a of the clip 21 is engaged with the front opening edge of the engagement hole 17 c of the heat dissipating body 16. Is fixed to the radiator 16 (see FIG. 5).
給電用アタッチメント8が放熱体16に固定された状態において、外部電源に接続された図示しない電源コードのコネクターが給電用アタッチメント8の給電部11、11に接続される。   In a state where the power supply attachment 8 is fixed to the radiator 16, a power cord connector (not shown) connected to an external power source is connected to the power supply units 11, 11 of the power supply attachment 8.
以上のように発光モジュール1が接続された給電用アタッチメント8が放熱体16にクリップ21によって固定された状態において、放熱体16には光学部品25が取り付けられる(図5参照)。光学部品25はリフレクター26及び投光レンズ27を有している。放熱体16に光学部品25が取り付けられ、これらの両者が図示しないランプハウジング内に配置されることにより車輌用灯具28が構成される。   In the state where the power supply attachment 8 to which the light emitting module 1 is connected as described above is fixed to the radiator 16 by the clip 21, the optical component 25 is attached to the radiator 16 (see FIG. 5). The optical component 25 includes a reflector 26 and a light projecting lens 27. An optical component 25 is attached to the heat radiating body 16, and both of them are arranged in a lamp housing (not shown) to constitute a vehicular lamp 28.
以上に記載した通り、発光モジュール1にあっては、一対の面状電極部6、6の露出領域6a、6aがセラミック基板2の素子配置面2aの外周部のうち突き当て面2cに接しない部分に位置するようにしているため、金属材料によって形成された放熱体16に対して位置決めされて固定された状態において、面状電極部6、6が放熱体16に接触せず、ショートの発生を防止することができる。   As described above, in the light emitting module 1, the exposed regions 6 a and 6 a of the pair of planar electrode portions 6 and 6 do not contact the abutting surface 2 c among the outer peripheral portions of the element arrangement surface 2 a of the ceramic substrate 2. Since it is positioned at the portion, the planar electrode portions 6 and 6 do not contact the radiator 16 and are short-circuited when positioned and fixed with respect to the radiator 16 formed of a metal material. Can be prevented.
また、発光モジュール1にあっては、一対の面状電極部6、6をそれぞれセラミック基板2における半導体発光素子3を挟んで反対側に位置する外周部に形成しているため、給電用アタッチメント8の給電端子12、12の形成位置に関して設計が容易となり、設計の容易化を図ることができる。   Further, in the light emitting module 1, the pair of planar electrode portions 6 and 6 are formed on the outer peripheral portion located on the opposite side of the semiconductor light emitting element 3 in the ceramic substrate 2, and thus the power supply attachment 8. It becomes easy to design the positions where the power supply terminals 12 and 12 are formed, and the design can be facilitated.
さらに、発光モジュール1にあっては、一対の面状電極部6、6の一部を絶縁層7で覆ってセラミック基板2の素子配置面2aに露出されない非露出領域6b、6b、・・・を形成しているので、露出領域6a、6aと非露出領域6b、6b、・・・を容易に形成することができる。   Further, in the light emitting module 1, a part of the pair of planar electrode portions 6, 6 is covered with the insulating layer 7 and is not exposed to the element placement surface 2 a of the ceramic substrate 2. , The exposed regions 6a, 6a and the non-exposed regions 6b, 6b,... Can be easily formed.
上記には、面状電極部6、6をセラミック基板2の第1の方向における両端部の全体に形成した例を示したが、例えば、図8に示すように、面状電極部6、6を第2の方向におけるY1側の端部に形成せず、面状電極部6、6の全体を露出領域6a、6aとして形成することも可能である。この場合には、絶縁層7が不要となり、製造コストの低減を図ることができる。   In the above, an example in which the planar electrode portions 6 and 6 are formed on the entire both ends in the first direction of the ceramic substrate 2 has been described. For example, as illustrated in FIG. 8, the planar electrode portions 6 and 6 are formed. It is also possible to form the entire planar electrode portions 6 and 6 as the exposed regions 6a and 6a without forming them at the end on the Y1 side in the second direction. In this case, the insulating layer 7 becomes unnecessary, and the manufacturing cost can be reduced.
また、面状電極部6、6の露出領域6a、6aはセラミック基板2の第2の方向におけるY1側の端部に形成されていなければよく、図9に斜線で示した部分に一対の面状電極部6、6の露出領域6a、6aを形成すればよい。   Further, the exposed regions 6a and 6a of the planar electrode portions 6 and 6 may not be formed at the end portion on the Y1 side in the second direction of the ceramic substrate 2, and a pair of surfaces are formed on the hatched portion in FIG. The exposed regions 6a and 6a of the electrode portions 6 and 6 may be formed.
上記した最良の形態において示した各部の形状及び構造は、何れも本発明を実施するに際して行う具体化のほんの一例を示したものに過ぎず、これらによって本発明の技術的範囲が限定的に解釈されることがあってはならないものである。   The shapes and structures of the respective parts shown in the above-described best mode are merely examples of implementations in carrying out the present invention, and the technical scope of the present invention is limitedly interpreted by these. It should not be done.
図2乃至図9と共に本発明の最良の形態を示すものであり、本図は各部を示す分解斜視図である。FIG. 2 to FIG. 9 show the best mode of the present invention, and this figure is an exploded perspective view showing each part. 発光モジュールを示す拡大斜視図である。It is an expansion perspective view which shows a light emitting module. 発光モジュールと給電用アタッチメントとホルダーを示す分解斜視図である。It is a disassembled perspective view which shows a light emitting module, the attachment for electric power feeding, and a holder. ホルダーによって発光モジュールを給電用アタッチメントに固定した状態を示す斜視図である。It is a perspective view which shows the state which fixed the light emitting module to the attachment for electric power feeding with the holder. 一部を分解して示す車輌用灯具の斜視図である。1 is a perspective view of a vehicular lamp that is partially exploded. FIG. 発光モジュールが放熱体に位置決めされた状態を示す斜視図である。It is a perspective view which shows the state in which the light emitting module was positioned by the heat radiator. 発光モジュールが放熱体に位置決めされた状態を一部を断面にして示す概略拡大側面図である。It is a general | schematic expanded side view which shows the state by which the light emitting module was positioned by the heat radiator with a part in cross section. 面状電極部が異なる位置に形成された発光モジュールを示す拡大平面図であ る。FIG. 6 is an enlarged plan view showing a light emitting module in which planar electrode portions are formed at different positions. 面状電極部の露出領域の形成可能位置を示す拡大平面図である。It is an enlarged plan view which shows the formation position of the exposure area | region of a planar electrode part.
1…発光モジュール、2…セラミック基板、2a…素子配置面、2b…放熱面、2c…突き当て面、3…半導体発光素子、3A…発光部、5…導電パターン、6…面状電極部、6a…露出領域、6b…非露出領域、7…絶縁層、8…給電用アタッチメント、12…給電端子、16…放熱体、20a…第1の位置決め面、25…光学部品、27…投光レンズ、28…車輌用灯具   DESCRIPTION OF SYMBOLS 1 ... Light emitting module, 2 ... Ceramic substrate, 2a ... Element arrangement | positioning surface, 2b ... Heat radiation surface, 2c ... Abutting surface, 3 ... Semiconductor light emitting element, 3A ... Light emission part, 5 ... Conductive pattern, 6 ... Planar electrode part, 6a ... exposed region, 6b ... non-exposed region, 7 ... insulating layer, 8 ... attachment for feeding, 12 ... feeding terminal, 16 ... heat radiating body, 20a ... first positioning surface, 25 ... optical component, 27 ... projecting lens , 28 ... Vehicle lamp

Claims (4)

  1. 車輌用灯具に用いられ放熱体に形成された位置決め面に突き当てられ位置決めされた状態で放熱体に固定される発光モジュールであって、
    略矩形状に形成されると共に外周面のうちの1つの側面が放熱体の位置決め面に突き当てられる突き当て面として形成され厚み方向における一方の面が素子配置面として形成され厚み方向における他方の面が放熱体に面接触されて放熱を行う放熱面として形成されたセラミック基板と、
    該セラミック基板に形成された所定の導電パターンと、
    半導体発光素子を有し上記セラミック基板の素子配置面に配置され導電パターンに接続された発光部と、
    上記セラミック基板に形成され導電パターンを介して半導体発光素子に接続された正負一対の面状電極部とを備え、
    上記一対の面状電極部は少なくとも一部がセラミック基板の素子配置面に露出された露出領域とされ、
    上記一対の面状電極部のそれぞれの露出領域がセラミック基板の一の方向における両端部以外の部分に位置されるとともに、非露出領域がセラミック基板の一の方向における両端部に位置するようにした
    ことを特徴とする発光モジュール。
    A light emitting module that is fixed to a radiator in a state where it is abutted against a positioning surface formed on a radiator and used in a vehicle lamp,
    It is formed in a substantially rectangular shape and one side surface of the outer peripheral surface is formed as an abutting surface that is abutted against the positioning surface of the radiator, and one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is formed. A ceramic substrate formed as a heat dissipating surface where the surface is in surface contact with the radiator and dissipates heat;
    A predetermined conductive pattern formed on the ceramic substrate;
    A light-emitting portion having a semiconductor light-emitting element and disposed on the element arrangement surface of the ceramic substrate and connected to the conductive pattern;
    A pair of positive and negative planar electrode parts formed on the ceramic substrate and connected to the semiconductor light emitting element through a conductive pattern,
    The pair of planar electrode portions is an exposed region in which at least a part is exposed on the element placement surface of the ceramic substrate,
    The exposed regions of the pair of planar electrode portions are positioned at portions other than both ends in one direction of the ceramic substrate, and the non-exposed regions are positioned at both ends in the one direction of the ceramic substrate. A light emitting module characterized by that.
  2. 上記一対の面状電極部をそれぞれ半導体発光素子を挟んで反対側に位置する外周部に形成した
    ことを特徴とする請求項1に記載の発光モジュール。
    The light emitting module according to claim 1, wherein the pair of planar electrode portions are formed on an outer peripheral portion located on opposite sides of the semiconductor light emitting element.
  3. 上記一対の面状電極部の一部を絶縁層で覆いセラミック基板の素子配置面に露出されない非露出領域を形成した
    ことを特徴とする請求項1又は請求項2に記載の発光モジュール。
    3. The light emitting module according to claim 1, wherein a part of the pair of planar electrode portions is covered with an insulating layer to form an unexposed region that is not exposed on the element placement surface of the ceramic substrate.
  4. ランプハウジング内に配置された発光モジュールの半導体発光素子から出射された光が投光レンズによって照明光として照射される車輌用灯具であって、
    位置決め面を有し所定の金属材料によって形成された放熱体と、
    略矩形状に形成されると共に外周面のうちの1つの側面が放熱体の位置決め面に突き当てられる突き当て面として形成され厚み方向における一方の面が素子配置面として形成され厚み方向における他方の面が放熱体に面接触されて放熱を行う放熱面として形成されたセラミック基板と、
    該セラミック基板に形成された所定の導電パターンと、
    半導体発光素子を有し上記セラミック基板の素子配置面に配置され導電パターンに接続された発光部と、
    上記セラミック基板に形成され導電パターンを介して半導体発光素子に接続された正負一対の面状電極部と、
    上記セラミック基板を保持し一対の面状電極部及び導電パターンを介して半導体発光素子への給電を行う給電用アタッチメントと、
    半導体発光素子から出射された光を照明光として照射する光学部材とを備え、
    上記一対の面状電極部は少なくとも一部がセラミック基板の素子配置面に露出された露出領域とされ、
    上記一対の面状電極部のそれぞれの露出領域がセラミック基板の一の方向における両端部以外の部分に位置されるとともに、非露出領域がセラミック基板の一の方向における両端部に位置するようにした
    ことを特徴とする車輌用灯具。
    A vehicle lamp in which light emitted from a semiconductor light emitting element of a light emitting module disposed in a lamp housing is irradiated as illumination light by a light projecting lens,
    A radiator having a positioning surface and formed of a predetermined metal material;
    It is formed in a substantially rectangular shape and one side surface of the outer peripheral surface is formed as an abutting surface that is abutted against the positioning surface of the radiator, and one surface in the thickness direction is formed as an element arrangement surface, and the other surface in the thickness direction is formed. A ceramic substrate formed as a heat dissipating surface where the surface is in surface contact with the radiator and dissipates heat;
    A predetermined conductive pattern formed on the ceramic substrate;
    A light-emitting portion having a semiconductor light-emitting element and disposed on the element arrangement surface of the ceramic substrate and connected to the conductive pattern;
    A pair of positive and negative planar electrode portions formed on the ceramic substrate and connected to the semiconductor light emitting element via a conductive pattern;
    An attachment for feeding that holds the ceramic substrate and feeds power to the semiconductor light emitting element through the pair of planar electrode portions and the conductive pattern;
    An optical member that irradiates light emitted from the semiconductor light emitting element as illumination light,
    The pair of planar electrode portions is an exposed region in which at least a part is exposed on the element placement surface of the ceramic substrate,
    The exposed regions of the pair of planar electrode portions are positioned at portions other than both ends in one direction of the ceramic substrate, and the non-exposed regions are positioned at both ends in the one direction of the ceramic substrate. A vehicular lamp characterized by that.
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WO2020159270A1 (en) * 2019-01-31 2020-08-06 주식회사 세미콘라이트 Semiconductor light emitting device and method for manufacturing same
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