JP2006060058A - Surface-mounting electronic component and lighting apparatus provided therewith - Google Patents

Surface-mounting electronic component and lighting apparatus provided therewith Download PDF

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JP2006060058A
JP2006060058A JP2004241049A JP2004241049A JP2006060058A JP 2006060058 A JP2006060058 A JP 2006060058A JP 2004241049 A JP2004241049 A JP 2004241049A JP 2004241049 A JP2004241049 A JP 2004241049A JP 2006060058 A JP2006060058 A JP 2006060058A
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Prior art keywords
electronic component
groove
mounting
mounting substrate
side electrode
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JP2004241049A
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Japanese (ja)
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Masaki Kobayashi
正喜 小林
Masaru Sugimoto
勝 杉本
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

<P>PROBLEM TO BE SOLVED: To mount a surface-mounting electronic component to a mounting substrate and improve the reliability of a soldering part in the surface-mounting electronic component soldered to a wiring substrate. <P>SOLUTION: The surface-mounting electronic component 1 includes a side surface electrode 5 for electrical connection of the wiring substrate to the side surface of the mounting substrate 2, and a lead 6 electrically conductive to the side surface electrode 5. The side surface electrode 5 is provided at almost the center of one side of external front surface of the mounting substrate 2, and a groove 10 is also formed where at least a part of the side surface electrode 5 is recessed to the internal side of the mounting substrate 2. In this surface-mounting electronic component 1, the bottom surface of the mounting substrate 2 is defined as the mounting surface to the wiring substrate, and the side surface electrode 5 is soldered to the wiring substrate using the cream solder. Accordingly, adequate solder thickness can be formed at the intermediate part of the side surface electrode 5 since the width of the side surface electrode 5 is twice the depth size of the groove 10. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、例えばLEDチップ等の実装電子部品を実装基板に搭載し、配線基板にはんだ付け接合される表面実装型電子部品、及び表面実装型電子部品を備えた照明器具に関するものである。   The present invention relates to a surface-mounted electronic component that is mounted on a mounting substrate and mounted with a mounting electronic component such as an LED chip, and a lighting fixture that includes the surface-mounted electronic component.

従来から、実装基板の上面と底面に形成された回路パターンを電気的に接続するために、スルーホールを用いる構造がある。また、表面実装型電子部品の実装基板を配線基板にはんだ付けするために、実装基板の側面に断面が半円状の溝を形成し、溝内の壁面に導電膜を形成して電極とする構造がある。表面実装型電子部品の実装基板の電極としては、これ以外に、4分の1円の窪み状や半円の溝状のものが知られている(例えば、特許文献1参照)。
特許第2994800号公報
Conventionally, there is a structure using a through hole in order to electrically connect circuit patterns formed on the upper surface and the bottom surface of a mounting substrate. Also, in order to solder the mounting board of the surface mounting type electronic component to the wiring board, a groove having a semicircular cross section is formed on the side surface of the mounting board, and a conductive film is formed on the wall surface in the groove to form an electrode. There is a structure. In addition to this, the electrode of the mounting substrate of the surface-mount type electronic component is known to have a quarter-circle recess shape or a semi-circular groove shape (see, for example, Patent Document 1).
Japanese Patent No. 2994800

しかしながら、上述した従来の表面実装型電子部品において、半円状の電極では、クリームはんだを印刷によりはんだ付けする場合、はんだ量が一定であるため、電極のはんだ接合表面積に対するはんだ量が少なくなり、はんだ中腹部でのはんだ体積(はんだ厚み)の形成が困難であり、はんだ接合部の信頼性が十分に確保できないという問題があった。また、上述した特許文献1に記載の電極では、電極幅が狭いため、はんだ接合を行う際、はんだ接合面を広くとれず、はんだ接合部の信頼性が低いという問題点があった。   However, in the above-described conventional surface-mounted electronic component, in the case of semi-circular electrodes, when soldering cream solder by printing, the amount of solder is constant, so the amount of solder relative to the solder joint surface area of the electrode is reduced, There is a problem that it is difficult to form a solder volume (solder thickness) at the middle part of the solder, and the reliability of the solder joint cannot be sufficiently secured. Moreover, since the electrode described in Patent Document 1 described above has a narrow electrode width, there is a problem in that the solder joint surface cannot be made wide when performing solder joint, and the reliability of the solder joint is low.

本発明は、上記課題を解決するためになされたものであり、はんだ接合部の信頼性を向上できる表面実装型電子部品、及び表面実装型電子部品を備えた照明器具を提供することを目的とする。   The present invention has been made to solve the above-described problems, and has an object to provide a surface-mount type electronic component that can improve the reliability of a solder joint and a lighting fixture including the surface-mount type electronic component. To do.

上記目的を達成するために請求項1の発明は、実装基板の底面及び側面の少なくとも何れか一方に配線基板との電気接続を行うための電極部と、この電極部と電気導通された実装電子部品接続用のリード部とを有した表面実装型電子部品において、電極部は、実装基板の外部表面の一辺の略中央部分に設けられ、電極部の少なくとも一部が実装基板の内方へ窪んだ溝部を形成し、溝部の窪みの幅を、奥行き寸法の2倍よりも大きくしたものである。   In order to achieve the above object, an invention according to claim 1 is directed to an electrode portion for making electrical connection with a wiring substrate on at least one of a bottom surface and a side surface of a mounting substrate, and a mounting electron electrically connected to the electrode portion. In a surface-mount electronic component having a lead part for connecting components, the electrode part is provided at a substantially central portion of one side of the outer surface of the mounting board, and at least a part of the electrode part is recessed inward of the mounting board. A groove portion is formed, and the width of the recess of the groove portion is made larger than twice the depth dimension.

請求項2の発明は、請求項1に記載の表面実装型電子部品において、実装電子部品は、LEDチップであり、実装基板は、LEDチップを搭載する凹部を有し、LEDチップを実装基板の凹部に搭載したものである。   According to a second aspect of the present invention, in the surface-mounted electronic component according to the first aspect, the mounted electronic component is an LED chip, the mounting substrate has a recess for mounting the LED chip, and the LED chip is mounted on the mounting substrate. It is mounted in the recess.

請求項3の発明は、請求項1に記載の表面実装型電子部品において、溝部は、実装基板の配線基板への実装面から該実装面に対向する面に貫通しているものである。   According to a third aspect of the present invention, in the surface-mounted electronic component according to the first aspect, the groove portion penetrates from a mounting surface of the mounting substrate to the wiring substrate to a surface facing the mounting surface.

請求項4の発明は、請求項1に記載の表面実装型電子部品において、溝部の断面形状が楕円状であるものである。   According to a fourth aspect of the present invention, in the surface mount electronic component according to the first aspect, the cross-sectional shape of the groove is an ellipse.

請求項5の発明は、請求項1に記載の表面実装型電子部品において、溝部を一つの電極部に対して2以上設けたものである。   According to a fifth aspect of the present invention, in the surface mount electronic component according to the first aspect, two or more groove portions are provided for one electrode portion.

請求項6の発明は、請求項1乃至請求項5の何れかに記載の表面実装型電子部品を備えた照明器具である。   A sixth aspect of the present invention is a luminaire provided with the surface mount electronic component according to any one of the first to fifth aspects.

請求項1の発明によれば、表面実装型電子部品をクリームはんだにより配線基板にはんだ付け実装する場合、溝部の幅が、奥行き寸法の2倍よりも大きく、電極部の表面積は従来と比較して大きいので、配線基板の電気接続用ランドに印刷するクリームはんだの量が一定であるとしたとき、はんだの濡れが良くなって、電極部に吸い上げられるクリームはんだの厚みは厚くなる。従って、電極部に適切なはんだ厚みを形成することが可能となり、はんだ接合部の信頼性の向上が図れる。   According to the first aspect of the present invention, when the surface-mount type electronic component is soldered and mounted on the wiring board by cream solder, the width of the groove is larger than twice the depth dimension, and the surface area of the electrode is smaller than that of the conventional one. Therefore, when the amount of cream solder printed on the electrical connection land of the wiring board is constant, the solder wettability is improved, and the thickness of the cream solder sucked up by the electrode portion is increased. Therefore, it is possible to form an appropriate solder thickness on the electrode portion, and the reliability of the solder joint portion can be improved.

請求項2の発明によれば、実装基板の凹部から電極部を逃がす必要があるが、電極部の少なくとも一部が実装基板の内方へ窪んでいるため、実装基板全体の大きさが大きくならず、配線基板への実装高密度化及び配線基板の小型化が可能となる。   According to the invention of claim 2, it is necessary to let the electrode part escape from the concave part of the mounting board. However, since at least a part of the electrode part is recessed inward of the mounting board, the size of the entire mounting board is increased. Therefore, it is possible to increase the mounting density on the wiring board and reduce the size of the wiring board.

請求項3の発明によれば、はんだ付けを確認する際に、障害となる部分がなく、はんだ付けの確認が容易になる。   According to invention of Claim 3, when confirming soldering, there is no part which becomes obstruction and confirmation of soldering becomes easy.

請求項4の発明によれば、電極部のはんだ接合部に加わる応力が一部分に集中することを防止でき、はんだ接合部の信頼性が一層向上する。   According to the invention of claim 4, it is possible to prevent stress applied to the solder joint portion of the electrode portion from being concentrated on a part, and the reliability of the solder joint portion is further improved.

請求項5の発明によれば、溝部の奥行きを広げることなく電極部の表面積を確保することができ、これにより、電極部のはんだ接合面積が増え、はんだ接合部の信頼性が一層向上する。   According to the invention of claim 5, the surface area of the electrode part can be ensured without increasing the depth of the groove part, thereby increasing the solder joint area of the electrode part and further improving the reliability of the solder joint part.

請求項6の発明によれば、表面実装型電子部品の配線基板へのはんだ接合部の信頼性が高いため、品質の優れた照明器具を得ることができる。   According to the invention of claim 6, since the reliability of the solder joint portion of the surface mount electronic component to the wiring board is high, it is possible to obtain a lighting apparatus with excellent quality.

以下、本発明を具体化した実施形態による表面実装型電子部品及び表面実装型電子部品を備えた照明器具について図面を参照して説明する。
<第1の実施形態>
図1、図2、図3は、第1の実施形態に係る表面実装型電子部品の構成を示す。表面実装型電子部品1は、実装基板2と、実装基板2に搭載される実装電子部品であるLEDチップ3と、後述する配線基板との電気接続を行うための底面電極部4及び側面電極部5と、LEDチップ3の電気的接続用のリード部6とを有する。
Hereinafter, a surface mount electronic component and a lighting fixture including the surface mount electronic component according to an embodiment of the present invention will be described with reference to the drawings.
<First Embodiment>
1, 2, and 3 show the configuration of the surface mount electronic component according to the first embodiment. The surface-mounted electronic component 1 includes a mounting substrate 2, an LED chip 3 that is a mounting electronic component mounted on the mounting substrate 2, and a bottom electrode portion 4 and a side electrode portion for electrical connection with a wiring substrate to be described later. 5 and a lead portion 6 for electrical connection of the LED chip 3.

実装基板2は、例えばセラミックスで形成されており、LEDチップ3を搭載するための凹部7を有している。底面電極部4は、実装基板2の外部表面の底面に設けられている。側面電極部5は、実装基板2の外部表面の側面の一辺の略中央に設けられており、底面電極部4と繋がっている。リード部6は、底面電極部4及び側面電極部5と電気導通されており、凹部7の底に伸びている。LEDチップ3は、実装基板2の凹部7内に搭載されており、バンプ8を介してリード部6と電気的に接続されている。   The mounting substrate 2 is made of ceramics, for example, and has a recess 7 for mounting the LED chip 3. The bottom electrode portion 4 is provided on the bottom surface of the outer surface of the mounting substrate 2. The side electrode part 5 is provided at substantially the center of one side of the side surface of the external surface of the mounting substrate 2 and is connected to the bottom electrode part 4. The lead part 6 is electrically connected to the bottom electrode part 4 and the side electrode part 5 and extends to the bottom of the recess 7. The LED chip 3 is mounted in the concave portion 7 of the mounting substrate 2 and is electrically connected to the lead portion 6 via the bumps 8.

この表面実装型電子部品1は、側面電極部5が実装基板2の内方へ窪んだ溝部10を形成している。溝部10は、実装基板2の底面から上面(後述する配線基板への実装面から該実装面に対向する面)に貫通しており、溝部10の断面形状は楕円状になっている。側面電極部5は、溝部10の全体に薄く設けられている。側面電極部5及び溝部10の幅は、実装基板2の底面側から上面側に亘って一定となっている。溝部10の窪み(側面電極部5の窪み)の奥行き寸法dは、側面電極部5の幅wに対して半分より小さくなっている。換言すれば、溝部10の奥行き寸法dに対する側面電極部5の幅wの比率が2よりも大きくなっている。このような溝部10は、実装基板2に側面から内方に楕円状に窪んだ窪み領域を形成し、その窪み領域の壁面に例えばめっき等を施して側面電極部5を設けることにより、形成される。   The surface-mount type electronic component 1 has a groove portion 10 in which the side electrode portion 5 is recessed inward of the mounting substrate 2. The groove portion 10 penetrates from the bottom surface to the top surface of the mounting substrate 2 (the surface facing the mounting surface from the mounting surface to the wiring board described later), and the cross-sectional shape of the groove portion 10 is elliptical. The side electrode part 5 is thinly provided on the entire groove part 10. The width of the side electrode part 5 and the groove part 10 is constant from the bottom surface side to the top surface side of the mounting substrate 2. The depth dimension d of the recess of the groove 10 (the recess of the side electrode part 5) is smaller than half the width w of the side electrode part 5. In other words, the ratio of the width w of the side electrode part 5 to the depth dimension d of the groove part 10 is larger than 2. Such a groove portion 10 is formed by forming a recessed region recessed in an elliptical shape inwardly from the side surface on the mounting substrate 2, and providing the side surface electrode portion 5 by, for example, plating the wall surface of the recessed region. The

図4は、上記表面実装型電子部品1を配線基板に実装した構成を示す。配線基板20は、銅等の金属基板上21にガラスエポキシ樹脂等の絶縁基板層22を設け、絶縁基板層22上に電気接続用ランド23を設けた構造となっている。金属基板21は、放熱用ランド24を有している。表面実装型電子部品1は、実装基板2の底面が配線基板20への実装面とされ、底面電極部4及び側面電極部5と電気接続用ランド23とがはんだ30によってはんだ付け接合される。はんだ付け接合は、例えばクリームはんだを印刷することにより行われる。   FIG. 4 shows a configuration in which the surface mount electronic component 1 is mounted on a wiring board. The wiring substrate 20 has a structure in which an insulating substrate layer 22 such as a glass epoxy resin is provided on a metal substrate 21 such as copper and an electrical connection land 23 is provided on the insulating substrate layer 22. The metal substrate 21 has a heat dissipation land 24. In the surface mount electronic component 1, the bottom surface of the mounting substrate 2 is a mounting surface to the wiring substrate 20, and the bottom electrode portion 4 and the side electrode portion 5 and the electrical connection land 23 are soldered and joined by the solder 30. Soldering joining is performed by printing cream solder, for example.

このようにして表面実装型電子部品1を配線基板20にはんだ付け接合することにより、実装基板2の底面電極部4及び側面電極部5と配線基板20の電気接続用ランド23とが電気的に導通され、また、表面実装型電子部品1の底面が放熱用ランド24に熱的に接触されて、LEDチップ3で発生した熱が放熱用ランド24を介して金属基板21から放熱される。   By soldering and joining the surface mount electronic component 1 to the wiring board 20 in this manner, the bottom electrode part 4 and the side electrode part 5 of the mounting board 2 and the electrical connection land 23 of the wiring board 20 are electrically connected. In addition, the bottom surface of the surface-mounted electronic component 1 is brought into thermal contact with the heat dissipation land 24, and the heat generated in the LED chip 3 is dissipated from the metal substrate 21 through the heat dissipation land 24.

本実施形態の表面実装型電子部品1によれば、側面電極部5の溝部10の幅が、奥行き寸法の2倍よりも大きいので、従来の溝部の幅が奥行き寸法の2倍である場合と比較して、側面電極部5の表面積は大きい。表面実装型電子部品1をクリームはんだにより配線基板20にはんだ付け実装する場合、配線基板20の電気接続用ランド23に印刷するクリームはんだの量は、電気接続用ランド23の面積が同じであれば一定になる。従って、本実施形態の表面実装型電子部品1によれば、側面電極部5の表面積が従来と比較して大きいので、その分、はんだの濡れが良くなって、側面電極部5に吸い上げられるクリームはんだの厚みが厚くなり、側面電極部5に適切なはんだ30の厚みを形成でき、はんだ接合部の信頼性を向上することが可能となる。   According to the surface-mounted electronic component 1 of the present embodiment, the width of the groove portion 10 of the side surface electrode portion 5 is larger than twice the depth dimension, and therefore the conventional groove portion width is twice the depth dimension. In comparison, the surface area of the side electrode part 5 is large. When the surface-mounted electronic component 1 is soldered and mounted on the wiring board 20 with cream solder, the amount of cream solder printed on the electric connection land 23 of the wiring board 20 is the same as the area of the electric connection land 23. It becomes constant. Therefore, according to the surface-mounted electronic component 1 of the present embodiment, the surface area of the side electrode portion 5 is larger than that of the conventional one. The thickness of the solder is increased, and an appropriate thickness of the solder 30 can be formed on the side electrode portion 5, and the reliability of the solder joint portion can be improved.

しかも、溝部10の断面形状が楕円状であるため、側面電極部5のはんだ接合部に加わる応力が一部分に集中することを防止でき、はんだ接合部の信頼性をより一層向上することができる。また、溝部10が実装基板2の底面から上面に貫通しているため、はんだ付けを確認する際に、障害となる部分がなく、はんだ付けの確認が容易になる。   And since the cross-sectional shape of the groove part 10 is elliptical, it can prevent that the stress added to the solder joint part of the side electrode part 5 concentrates on a part, and can improve the reliability of a solder joint part further. In addition, since the groove portion 10 penetrates from the bottom surface to the top surface of the mounting substrate 2, there is no hindrance when confirming the soldering, and the confirmation of the soldering becomes easy.

また、実装基板2の凹部7にLEDチップ3を設ける場合、凹部7から側面電極部5を逃がす必要があるが、側面電極部5の少なくとも一部が実装基板2の内方へ窪んだ溝部10を形成することにより、実装基板2全体の大きさが大きくならず、配線基板20への実装高密度化及び配線基板の小型化が可能となる。   Further, when the LED chip 3 is provided in the concave portion 7 of the mounting substrate 2, it is necessary to escape the side electrode portion 5 from the concave portion 7, but the groove portion 10 in which at least a part of the side electrode portion 5 is recessed inward of the mounting substrate 2. Thus, the size of the entire mounting substrate 2 is not increased, and the mounting density on the wiring substrate 20 and the size of the wiring substrate can be reduced.

なお、本実施形態において、側面電極部5は、必ずしも溝部10の全体に設ける必要はなく、はんだ30の吸い上がり状態により、実装基板2の底面から上面に至るまでの一部に設けてもよい。すなわち、はんだ30の吸い上がり状態により、はんだ付け表面積を多く確保する必要がある場合には、溝部10の全体に側面電極部5を設ければよく、また、その必要がない場合には、実装基板2の底面から上面に至るまでのはんだ付けに必要な部分にのみ側面電極部5を設ければよい。   In the present embodiment, the side electrode portion 5 is not necessarily provided in the entire groove portion 10, and may be provided in a part from the bottom surface to the top surface of the mounting board 2 depending on the sucked-up state of the solder 30. . That is, when it is necessary to secure a large soldering surface area due to the sucked-up state of the solder 30, the side electrode portion 5 may be provided on the entire groove portion 10, and when it is not necessary, mounting is performed. It is only necessary to provide the side surface electrode portion 5 only in a portion necessary for soldering from the bottom surface to the top surface of the substrate 2.

また、溝部10は、実装基板2の底面から上面に貫通していなくてもよく、溝部10の断面形状は、楕円状以外であってもよい。溝部10の窪みの奥行き寸法は、側面電極部5の幅に対して半分より小さければよいが、限りなく小さければよいというものではなく、ある程度の大きさの奥行きは必要である。実装基板2は、凹部7を有していなくてもよく、LEDチップ3以外に、例えば受光素子チップや半導体回路チップ等の実装電子部品を搭載するものであってもよい。   Moreover, the groove part 10 does not need to penetrate from the bottom surface of the mounting substrate 2 to the upper surface, and the cross-sectional shape of the groove part 10 may be other than an elliptical shape. Although the depth dimension of the recess of the groove part 10 should just be smaller than half with respect to the width | variety of the side electrode part 5, it does not have to be infinitely small and the depth of a certain amount is required. The mounting substrate 2 does not need to have the recess 7 and may be mounted with a mounting electronic component such as a light receiving element chip or a semiconductor circuit chip in addition to the LED chip 3.

<第2の実施形態>
図5、図6は、第2の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、1つの側面電極部5に対して2つの溝部10が設けられている。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Second Embodiment>
5 and 6 show the configuration of the surface mount electronic component according to the second embodiment. In the surface mount electronic component 1 of the present embodiment, two groove portions 10 are provided for one side electrode portion 5. Other configurations in the present embodiment are the same as those in the first embodiment.

各溝部10は、実装基板2の底面から上面に貫通しており、各溝部10の断面形状は楕円状になっている。側面電極部5は、各溝部10の全体に設けられている。溝部10の窪み(側面電極部5の窪み)の奥行き寸法dは、側面電極部5の幅wに対して半分より小さくなっている。すなわち、溝部10の奥行き寸法dに対する側面電極部5の幅wの比率が2よりも大きくなっている。   Each groove 10 penetrates from the bottom surface to the top surface of the mounting substrate 2, and the cross-sectional shape of each groove 10 is elliptical. The side electrode part 5 is provided in the whole of each groove part 10. The depth dimension d of the recess of the groove 10 (the recess of the side electrode part 5) is smaller than half the width w of the side electrode part 5. That is, the ratio of the width w of the side electrode part 5 to the depth dimension d of the groove part 10 is larger than 2.

このような構成の表面実装型電子部品1は、上記第1の実施形態と同様に、実装基板2の底面が配線基板への実装面とされ、クリームはんだを用いて、底面電極部4及び側面電極部5が配線基板にはんだ付け接合される。   In the surface-mounted electronic component 1 having such a configuration, the bottom surface of the mounting substrate 2 is a mounting surface on the wiring substrate, and the bottom electrode portion 4 and the side surface are formed using cream solder, as in the first embodiment. The electrode part 5 is soldered and joined to the wiring board.

本実施形態の表面実装型電子部品1によれば、溝部10の奥行き寸法が側面電極部5の幅に対して半分より小さいことにより、上記第1の実施形態と同様の作用、効果が得られる。また、本実施形態の表面実装型電子部品1によれば、1つの側面電極部5に対して2つの溝部10を設けることにより、溝部10の奥行きを小さくしつつ、側面電極部5の表面積を確保できる。従って、溝部10の奥行きを広げることなく実装基板2の大きさを維持しつつ、側面電極部5の表面積を確保することができ、これにより、側面電極部5のはんだ接合面積が増え、はんだ接合部の信頼性をより一層向上することが可能となる。   According to the surface-mounted electronic component 1 of the present embodiment, the depth and size of the groove portion 10 is smaller than half the width of the side electrode portion 5, so that the same operation and effect as in the first embodiment can be obtained. . Further, according to the surface mount electronic component 1 of the present embodiment, by providing the two groove portions 10 for one side electrode portion 5, the surface area of the side electrode portion 5 is reduced while reducing the depth of the groove portion 10. It can be secured. Therefore, it is possible to secure the surface area of the side electrode part 5 while maintaining the size of the mounting substrate 2 without increasing the depth of the groove part 10, thereby increasing the solder joint area of the side electrode part 5, and solder joining. The reliability of the part can be further improved.

なお、本実施形態において、側面電極部5は、必ずしも各溝部10の全体に設ける必要はなく、はんだ30の吸い上がり状態により、実装基板2の底面から上面に至るまでの一部に設けてもよい。   In the present embodiment, the side electrode portion 5 is not necessarily provided in the entire groove portion 10, and may be provided in a part from the bottom surface to the top surface of the mounting substrate 2 due to the sucked-up state of the solder 30. Good.

<第3の実施形態>
図7、図8は、第3の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、1つの側面電極部5に対して5つの溝部10が設けられている。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Third Embodiment>
7 and 8 show the configuration of the surface mount electronic component according to the third embodiment. In the surface mount electronic component 1 of the present embodiment, five groove portions 10 are provided for one side electrode portion 5. Other configurations in the present embodiment are the same as those in the first embodiment.

各溝部10は、実装基板2の底面から上面に貫通しており、各溝部10の断面形状は楕円状になっている。側面電極部5は、各溝部10の全体に設けられている。溝部10の窪み(側面電極部5の窪み)の奥行き寸法dは、側面電極部5の幅wに対して半分より小さくなっている。すなわち、溝部10の奥行き寸法dに対する側面電極部5の幅wの比率が2よりも大きくなっている。   Each groove 10 penetrates from the bottom surface to the top surface of the mounting substrate 2, and the cross-sectional shape of each groove 10 is elliptical. The side electrode part 5 is provided in the whole of each groove part 10. The depth dimension d of the recess of the groove 10 (the recess of the side electrode part 5) is smaller than half the width w of the side electrode part 5. That is, the ratio of the width w of the side electrode part 5 to the depth dimension d of the groove part 10 is larger than 2.

このような構成の表面実装型電子部品1は、上記第1の実施形態と同様に、実装基板2の底面が配線基板への実装面とされ、クリームはんだを用いて、底面電極部4及び側面電極部5が配線基板にはんだ付け接合される。   In the surface-mounted electronic component 1 having such a configuration, the bottom surface of the mounting substrate 2 is a mounting surface on the wiring substrate, and the bottom electrode portion 4 and the side surface are formed using cream solder, as in the first embodiment. The electrode part 5 is soldered and joined to the wiring board.

本実施形態の表面実装型電子部品1によれば、溝部10の奥行き寸法が側面電極部5の幅に対して半分より小さいことにより、上記第1の実施形態と同様の作用、効果が得られる。また、本実施形態の表面実装型電子部品1によれば、1つの側面電極部5に対して5つの溝部10を設けることにより、溝部10の奥行きを小さくしつつ、側面電極部5の表面積を確保できる。従って、溝部10の奥行きを広げることなく実装基板2の大きさを維持しつつ、側面電極部5の表面積を確保することができ、これにより、側面電極部5のはんだ接合面積が増え、はんだ接合部の信頼性をより一層向上することが可能となる。   According to the surface-mounted electronic component 1 of the present embodiment, the depth and size of the groove portion 10 is smaller than half the width of the side electrode portion 5, so that the same operation and effect as in the first embodiment can be obtained. . Further, according to the surface-mount type electronic component 1 of the present embodiment, by providing the five groove portions 10 for one side electrode portion 5, the surface area of the side electrode portion 5 is reduced while reducing the depth of the groove portion 10. It can be secured. Therefore, it is possible to secure the surface area of the side electrode part 5 while maintaining the size of the mounting substrate 2 without increasing the depth of the groove part 10, thereby increasing the solder joint area of the side electrode part 5, and solder joining. The reliability of the part can be further improved.

なお、本実施形態において、側面電極部5は、必ずしも溝部10の全体に設ける必要はなく、はんだ30の吸い上がり状態により、実装基板2の底面から上面に至るまでの一部に設けてもよい。   In the present embodiment, the side electrode portion 5 is not necessarily provided in the entire groove portion 10, and may be provided in a part from the bottom surface to the top surface of the mounting board 2 depending on the sucked-up state of the solder 30. .

<第4の実施形態>
図9、図10は、第4の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、断面形状が長方形状の溝部10を形成している。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Fourth Embodiment>
9 and 10 show the configuration of the surface-mount electronic component according to the fourth embodiment. In the surface-mounted electronic component 1 according to the present embodiment, the groove portion 10 having a rectangular cross section is formed. Other configurations in the present embodiment are the same as those in the first embodiment.

溝部10は、実装基板2の底面から上面に貫通している。側面電極部5は、溝部10の奥行面(実装基板2の側面と平行な面)10xの全体に設けられている。側面電極部5及び溝部10の幅は、実装基板2の底面側から上面側に亘って一定となっている。側面電極部5の幅wは溝部10の窪み(側面電極部5の窪み)の奥行き寸法dの2倍よりも大きくなっている。   The groove 10 penetrates from the bottom surface to the top surface of the mounting substrate 2. The side electrode portion 5 is provided on the entire depth surface 10x of the groove portion 10 (a surface parallel to the side surface of the mounting substrate 2). The width of the side electrode part 5 and the groove part 10 is constant from the bottom surface side to the top surface side of the mounting substrate 2. The width w of the side electrode portion 5 is larger than twice the depth dimension d of the recess of the groove portion 10 (the recess of the side electrode portion 5).

このような構成の表面実装型電子部品1は、上記第1の実施形態と同様に、実装基板2の底面が配線基板への実装面とされ、クリームはんだを用いて、底面電極部4及び側面電極部5が配線基板にはんだ付け接合される。   In the surface-mounted electronic component 1 having such a configuration, the bottom surface of the mounting substrate 2 is a mounting surface on the wiring substrate, and the bottom electrode portion 4 and the side surface are formed using cream solder, as in the first embodiment. The electrode part 5 is soldered and joined to the wiring board.

本実施形態の表面実装型電子部品1によれば、溝部10の奥行き寸法が側面電極部5の幅に対して半分より小さいことにより、上記第1の実施形態と同様の作用、効果が得られる。また、本実施形態の表面実装型電子部品1によれば、溝部10の断面形状が長方形状であるため、溝部10の奥行きを小さくしつつ、側面電極部5の表面積を確保できる。従って、溝部10の奥行きを広げることなく実装基板2の大きさを維持しつつ、側面電極部5の表面積を確保することができ、これにより、側面電極部5のはんだ接合面積が増え、はんだ接合部の信頼性をより一層向上することが可能となる。   According to the surface-mounted electronic component 1 of the present embodiment, the depth and size of the groove portion 10 is smaller than half the width of the side electrode portion 5, so that the same operation and effect as in the first embodiment can be obtained. . Further, according to the surface mount electronic component 1 of the present embodiment, since the cross-sectional shape of the groove portion 10 is rectangular, the surface area of the side electrode portion 5 can be secured while reducing the depth of the groove portion 10. Therefore, it is possible to secure the surface area of the side electrode part 5 while maintaining the size of the mounting substrate 2 without increasing the depth of the groove part 10, thereby increasing the solder joint area of the side electrode part 5, and solder joining. The reliability of the part can be further improved.

なお、本実施形態において、側面電極部5は、必ずしも溝部10の奥行面10xの全体に設ける必要はなく、はんだ30の吸い上がり状態により、実装基板2の底面から上面に至るまでの一部に設けてもよい。また、側面電極部5は、溝部10の奥行面10xだけに限られず、溝部10の側面10yに設けてもよい。   In the present embodiment, the side electrode portion 5 is not necessarily provided on the entire depth surface 10x of the groove portion 10, and is partially formed from the bottom surface to the top surface of the mounting substrate 2 due to the sucked-up state of the solder 30. It may be provided. Further, the side electrode portion 5 is not limited to the depth surface 10x of the groove portion 10 and may be provided on the side surface 10y of the groove portion 10.

<第5の実施形態>
図11、図12は、第5の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、実装基板2の側面の一部に、断面形状が長方形状の溝部10を形成している。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Fifth Embodiment>
11 and 12 show the configuration of the surface mount electronic component according to the fifth embodiment. In the surface-mounted electronic component 1 of the present embodiment, a groove 10 having a rectangular cross-sectional shape is formed on a part of the side surface of the mounting substrate 2. Other configurations in the present embodiment are the same as those in the first embodiment.

溝部10は、実装基板2の底面から上面に至る途中までの箇所に形成されている。側面電極部5は、溝部10の実装基板2の側面と平行な奥行面10xの全体、及び上面10zの全体に設けられている。側面電極部5及び溝部10の幅は、実装基板2の底面側から上面側に亘って一定となっている。側面電極部5の幅wは溝部10の窪み(側面電極部5の窪み)の奥行き寸法dの2倍よりも大きくなっている。   The groove 10 is formed at a location from the bottom surface to the top surface of the mounting substrate 2. The side electrode portion 5 is provided on the entire depth surface 10x parallel to the side surface of the mounting substrate 2 of the groove portion 10 and the entire upper surface 10z. The width of the side electrode part 5 and the groove part 10 is constant from the bottom surface side to the top surface side of the mounting substrate 2. The width w of the side electrode portion 5 is larger than twice the depth dimension d of the recess of the groove portion 10 (the recess of the side electrode portion 5).

図13は、上記表面実装型電子部品1を配線基板に実装した構成を示す。配線基板20の構成は、上記第1の実施形態と同様である。表面実装型電子部品1は、上記第1の実施形態と同様に、実装基板2の底面が配線基板20への実装面とされ、底面電極部4及び側面電極部5と電気接続用ランド23とがはんだ30によってはんだ付け接合される。図13に示すように、はんだ30は、溝部10の上面10zまで吸い上げられて、溝部10の上面10zに設けられた側面電極部5とも接合している。   FIG. 13 shows a configuration in which the surface mount electronic component 1 is mounted on a wiring board. The configuration of the wiring board 20 is the same as that in the first embodiment. As in the first embodiment, the surface-mount type electronic component 1 has a bottom surface of the mounting substrate 2 as a mounting surface to the wiring substrate 20, and includes a bottom electrode portion 4, a side electrode portion 5, and an electrical connection land 23. Are soldered and joined by the solder 30. As shown in FIG. 13, the solder 30 is sucked up to the upper surface 10 z of the groove 10 and is also joined to the side electrode portion 5 provided on the upper surface 10 z of the groove 10.

本実施形態の表面実装型電子部品1によれば、側面電極部5の幅が溝部10の奥行き寸法の2倍よりも大きいことにより、上記第1の実施形態と同様の作用、効果が得られる。また、本実施形態の表面実装型電子部品1によれば、溝部10の断面形状が長方形状であるため、上記第4の実施形態と同様の作用、効果が得られる。   According to the surface-mounted electronic component 1 of the present embodiment, since the width of the side electrode part 5 is larger than twice the depth dimension of the groove part 10, the same operation and effect as in the first embodiment can be obtained. . Further, according to the surface mount electronic component 1 of the present embodiment, since the cross-sectional shape of the groove 10 is rectangular, the same operation and effect as in the fourth embodiment can be obtained.

さらに、本実施形態の表面実装型電子部品1によれば、実装基板2の底面から上面に至る途中までの箇所に溝部10を形成していることにより、はんだ30は、溝部10の上面10zまで吸い上げられて、溝部10の上面10zと接合する。これにより、はんだ30の吸い上がりを一定にすることができ、安定したはんだ形状が可能となり、はんだ接合部の信頼性をより一層向上することが可能となる。   Furthermore, according to the surface-mount type electronic component 1 of the present embodiment, the solder 30 can reach the upper surface 10z of the groove portion 10 by forming the groove portion 10 at a location from the bottom surface to the upper surface of the mounting substrate 2. Sucked up and joined to the upper surface 10z of the groove 10. As a result, the sucking up of the solder 30 can be made constant, a stable solder shape can be achieved, and the reliability of the solder joint can be further improved.

なお、本実施形態において、側面電極部5は、溝部10の奥行面10x及び上面10zだけに限られず、溝部10の側面10yに設けてもよい。また、側面電極部5は、溝部10の上面10zには、必ずしも設ける必要はなく、奥行面10xにのみ設けてもよい。   In the present embodiment, the side surface electrode portion 5 is not limited to the depth surface 10x and the upper surface 10z of the groove portion 10, but may be provided on the side surface 10y of the groove portion 10. Further, the side electrode portion 5 is not necessarily provided on the upper surface 10z of the groove portion 10, and may be provided only on the depth surface 10x.

<第6の実施形態>
図14、図15、図16は、第6の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、実装基板2の側面に断面形状が長方形状の溝部10を形成すると共に、実装基板2の底面の一部に断面形状が長方形の底溝部11を形成している。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Sixth Embodiment>
FIG. 14, FIG. 15 and FIG. 16 show the configuration of a surface mount electronic component according to the sixth embodiment. In the surface-mounted electronic component 1 according to the present embodiment, a groove 10 having a rectangular cross section is formed on the side surface of the mounting substrate 2, and a bottom groove 11 having a rectangular cross section is formed on a part of the bottom surface of the mounting substrate 2. is doing. Other configurations in the present embodiment are the same as those in the first embodiment.

溝部10は、実装基板2の底面から上面に貫通している。底溝部11は、実装基板2の側端縁付近の一部に形成されており、溝部10に繋がっている。側面電極部5は、溝部10の奥行面10xの全体に設けられている。底面電極部4は、底溝部11内に設けられている。側面電極部5及び溝部10の幅は、実装基板2の底面側から上面側に亘って一定となっている。側面電極部5の幅wは溝部10の窪み(側面電極部5の窪み)の奥行き寸法dの2倍よりも大きくなっている。   The groove 10 penetrates from the bottom surface to the top surface of the mounting substrate 2. The bottom groove 11 is formed in a part near the side edge of the mounting substrate 2 and is connected to the groove 10. The side electrode portion 5 is provided on the entire depth surface 10 x of the groove portion 10. The bottom electrode part 4 is provided in the bottom groove part 11. The width of the side electrode part 5 and the groove part 10 is constant from the bottom surface side to the top surface side of the mounting substrate 2. The width w of the side electrode portion 5 is larger than twice the depth dimension d of the recess of the groove portion 10 (the recess of the side electrode portion 5).

このような構成の表面実装型電子部品1は、上記第1の実施形態と同様に、実装基板2の底面が配線基板への実装面とされ、クリームはんだを用いて、底面電極部4及び側面電極部5が配線基板にはんだ付け接合される。   In the surface-mounted electronic component 1 having such a configuration, the bottom surface of the mounting substrate 2 is a mounting surface on the wiring substrate, and the bottom electrode portion 4 and the side surface are formed using cream solder, as in the first embodiment. The electrode part 5 is soldered and joined to the wiring board.

本実施形態の表面実装型電子部品1によれば、側面電極部5の幅が溝部10の奥行き寸法の2倍よりも大きいことにより、上記第1の実施形態と同様の作用、効果が得られる。また、本実施形態の表面実装型電子部品1によれば、溝部10の断面形状が長方形状であるため、上記第4の実施形態と同様の作用、効果が得られる。   According to the surface-mounted electronic component 1 of the present embodiment, since the width of the side electrode part 5 is larger than twice the depth dimension of the groove part 10, the same operation and effect as in the first embodiment can be obtained. . Further, according to the surface mount electronic component 1 of the present embodiment, since the cross-sectional shape of the groove 10 is rectangular, the same operation and effect as in the fourth embodiment can be obtained.

さらに、本実施形態の表面実装型電子部品1によれば、実装基板2の底面に溝部10に繋がる底溝部11を形成していることにより、側面電極部5の表面積を確保した上で、はんだの吸い上がりを一定にすることができ、安定したはんだ形状が可能となり、はんだ接合部の信頼性をより一層向上することが可能となる。   Furthermore, according to the surface-mount type electronic component 1 of the present embodiment, the bottom groove portion 11 connected to the groove portion 10 is formed on the bottom surface of the mounting substrate 2, thereby ensuring the surface area of the side electrode portion 5 and soldering. As a result, it is possible to make the suction of the solder constant, to enable a stable solder shape, and to further improve the reliability of the solder joint.

なお、本実施形態において、側面電極部5は、必ずしも溝部10の奥行面10xの全体に設ける必要はなく、はんだ30の吸い上がり状態により、実装基板2の底面から上面に至るまでの一部に設けてもよい。また、側面電極部5は、溝部10の奥行面10xだけに限られず、溝部10の側面10yに設けてもよい。溝部10の断面形状は、楕円状等、長方形状以外であってもよい。   In the present embodiment, the side electrode portion 5 is not necessarily provided on the entire depth surface 10x of the groove portion 10, and is partially formed from the bottom surface to the top surface of the mounting substrate 2 due to the sucked-up state of the solder 30. It may be provided. Further, the side electrode portion 5 is not limited to the depth surface 10x of the groove portion 10 and may be provided on the side surface 10y of the groove portion 10. The cross-sectional shape of the groove 10 may be other than a rectangular shape such as an ellipse.

<第7の実施形態>
図17(a)(b)、図18(a)(b)、図19(a)(b)は、第7の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、実装基板2の側面に断面形状が長方形状の溝部10を形成すると共に、実装基板2の底面の一部に断面形状が長方形の底溝部11を形成しており、これら溝部10及び底溝部11に電極端子部50が取付けられる。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Seventh Embodiment>
FIGS. 17A, 18B, 18A, 18B, and 19A, 19B show the configuration of the surface-mount type electronic component according to the seventh embodiment. In the surface-mounted electronic component 1 according to the present embodiment, a groove 10 having a rectangular cross section is formed on the side surface of the mounting substrate 2, and a bottom groove 11 having a rectangular cross section is formed on a part of the bottom surface of the mounting substrate 2. The electrode terminal portion 50 is attached to the groove portion 10 and the bottom groove portion 11. Other configurations in the present embodiment are the same as those in the first embodiment.

溝部10は、実装基板2の底面から上面に貫通している。底溝部11は、実装基板2の側端縁付近の一部に形成されており、溝部10に繋がっている。側面電極部5は、溝部10の奥行面10xの全体に設けられている。底面電極部4は、底溝部11内に設けられている。側面電極部5の幅wは溝部10の窪み(側面電極部5の窪み)の奥行き寸法dの2倍よりも大きくなっている。電極端子部50は、板状であり、L字形状をしており、溝部10及び底溝部11に合致する形状になっている。   The groove 10 penetrates from the bottom surface to the top surface of the mounting substrate 2. The bottom groove 11 is formed in a part near the side edge of the mounting substrate 2 and is connected to the groove 10. The side electrode portion 5 is provided on the entire depth surface 10 x of the groove portion 10. The bottom electrode part 4 is provided in the bottom groove part 11. The width w of the side electrode portion 5 is larger than twice the depth dimension d of the recess of the groove portion 10 (the recess of the side electrode portion 5). The electrode terminal portion 50 is plate-shaped, has an L shape, and has a shape that matches the groove portion 10 and the bottom groove portion 11.

このような構成の表面実装型電子部品1は、電極端子部50を溝部10及び底溝部11に嵌合して実装基板2に取付けることにより、底面電極部4及び側面電極部5と電極端子部50が接触して電気的に導通される。そして、表面実装型電子部品1は、このように電極端子部50を取付けた状態で、実装基板2の底面が配線基板への実装面とされ、クリームはんだを用いて、電極端子部50が配線基板にはんだ付け接合される。   The surface-mount type electronic component 1 having such a configuration is formed by fitting the electrode terminal portion 50 into the groove portion 10 and the bottom groove portion 11 and attaching the electrode terminal portion 50 to the mounting substrate 2, whereby the bottom electrode portion 4, the side electrode portion 5, and the electrode terminal portion. 50 comes into contact and is electrically conducted. In the surface-mounted electronic component 1, the bottom surface of the mounting substrate 2 is used as a mounting surface to the wiring substrate with the electrode terminal portion 50 attached as described above, and the electrode terminal portion 50 is wired using cream solder. Soldered to the board.

本実施形態の表面実装型電子部品1によれば、電極端子部50の材質として、はんだ接合性の優れた材質を選択することで、はんだ接合面の強度を向上することができ、はんだ接合部の信頼性を向上することが可能となる。   According to the surface-mounted electronic component 1 of the present embodiment, the strength of the solder joint surface can be improved by selecting a material having excellent solderability as the material of the electrode terminal portion 50, and the solder joint portion. It becomes possible to improve the reliability.

なお、本実施形態において、溝部10及び底溝部11の形状及び電極端子部50の形状は、電極端子部50を溝部10及び底溝部11に嵌合して実装基板2に取付けることができる形状であれば、どのような形状であってもよい。   In the present embodiment, the shape of the groove 10 and the bottom groove 11 and the shape of the electrode terminal portion 50 are shapes that allow the electrode terminal portion 50 to be fitted to the groove 10 and the bottom groove 11 and attached to the mounting substrate 2. Any shape can be used.

図20(a)(b)は、電極端子部50の別の構成を示す。図20(a)(b)に示す電極端子部50は、実装基板2の外方に伸びるリード部51を有し、リード部51の基端部に湾曲形状部52が形成されている。このような構成の電極端子部50によれば、リード部51により、はんだ接合面積を確保できると共に、リード部51の湾曲形状部52により、はんだへの機械的応力を逃がすことができ、はんだ接合部の信頼性をより一層向上することが可能となる。   20A and 20B show another configuration of the electrode terminal portion 50. FIG. The electrode terminal portion 50 shown in FIGS. 20A and 20B has a lead portion 51 extending outward from the mounting substrate 2, and a curved portion 52 is formed at the base end portion of the lead portion 51. According to the electrode terminal portion 50 having such a configuration, a solder joint area can be secured by the lead portion 51, and mechanical stress to the solder can be released by the curved shape portion 52 of the lead portion 51. The reliability of the part can be further improved.

<第8の実施形態>
図21、図22は、第8の実施形態に係る表面実装型電子部品の構成を示す。本実施形態の表面実装型電子部品1では、断面形状が長方形状で、実装基板2の底面側よりも上面側で幅が広くなっている溝部10を形成している。本実施形態における他の構成については、上記第1の実施形態と同様である。
<Eighth Embodiment>
21 and 22 show the configuration of the surface mount electronic component according to the eighth embodiment. In the surface-mounted electronic component 1 of the present embodiment, the groove portion 10 having a rectangular cross-sectional shape and having a width wider on the upper surface side than the bottom surface side of the mounting substrate 2 is formed. Other configurations in the present embodiment are the same as those in the first embodiment.

溝部10は、実装基板2の底面から上面に貫通している。側面電極部5は、溝部10の実装基板2の側面と平行な奥行面10xの全体に設けられている。実装基板2の底面側での側面電極部5の幅(すなわち最も狭い幅)wは、溝部10の窪み(側面電極部5の窪み)の奥行き寸法dの2倍よりも大きくなっている。   The groove 10 penetrates from the bottom surface to the top surface of the mounting substrate 2. The side electrode portion 5 is provided on the entire depth surface 10x parallel to the side surface of the mounting substrate 2 of the groove portion 10. The width (that is, the narrowest width) w of the side electrode portion 5 on the bottom surface side of the mounting substrate 2 is larger than twice the depth dimension d of the recess of the groove portion 10 (the recess of the side electrode portion 5).

このような構成の表面実装型電子部品1は、上記第1の実施形態と同様に、実装基板2の底面が配線基板への実装面とされ、クリームはんだを用いて、底面電極部4及び側面電極部5が配線基板にはんだ付け接合される。   In the surface-mounted electronic component 1 having such a configuration, the bottom surface of the mounting substrate 2 is a mounting surface on the wiring substrate, and the bottom electrode portion 4 and the side surface are formed using cream solder, as in the first embodiment. The electrode part 5 is soldered and joined to the wiring board.

本実施形態の表面実装型電子部品1によれば、側面電極部5の幅が溝部10の奥行き寸法の2倍よりも大きいことにより、上記第1の実施形態と同様の作用、効果が得られる。また、本実施形態の表面実装型電子部品1によれば、溝部10の断面形状が長方形状であるため、上記第4の実施形態と同様の作用、効果が得られる。   According to the surface-mounted electronic component 1 of the present embodiment, since the width of the side electrode part 5 is larger than twice the depth dimension of the groove part 10, the same operation and effect as in the first embodiment can be obtained. . Further, according to the surface mount electronic component 1 of the present embodiment, since the cross-sectional shape of the groove 10 is rectangular, the same operation and effect as in the fourth embodiment can be obtained.

さらに、本実施形態の表面実装型電子部品1によれば、溝部10の幅が実装基板2の底面側よりも上面側で広くなっていることにより、側面電極部5の表面積を確保した上で、はんだの吸い上がりを一定にすることができ、安定したはんだ形状が可能となり、はんだ接合部の信頼性をより一層向上することが可能となる。   Furthermore, according to the surface-mounted electronic component 1 of the present embodiment, the width of the groove portion 10 is wider on the upper surface side than the bottom surface side of the mounting substrate 2, thereby ensuring the surface area of the side electrode portion 5. The solder sucking up can be made constant, a stable solder shape can be achieved, and the reliability of the solder joint can be further improved.

なお、本実施形態において、側面電極部5は、必ずしも溝部10の奥行面10xの全体に設ける必要はなく、はんだ30の吸い上がり状態により、実装基板2の底面から上面に至るまでの一部に設けてもよい。また、側面電極部5は、溝部10の奥行面10xだけに限られず、溝部10の側面10yに設けてもよい。溝部10の断面形状は、楕円状等、長方形状以外であってもよい。   In the present embodiment, the side electrode portion 5 is not necessarily provided on the entire depth surface 10x of the groove portion 10, and is partially formed from the bottom surface to the top surface of the mounting substrate 2 due to the sucked-up state of the solder 30. It may be provided. Further, the side electrode portion 5 is not limited to the depth surface 10x of the groove portion 10 and may be provided on the side surface 10y of the groove portion 10. The cross-sectional shape of the groove 10 may be other than a rectangular shape such as an ellipse.

<第9の実施形態>
図23は、第9の実施形態に係る表面実装型電子部品を備えた照明器具の構成を示す。照明器具70は、筐体71内に上記第1乃至第8の何れかの実施形態の表面実装型電子部品1を搭載しており、表面実装型電子部品1のLEDチップ3から発光された光を前面パネル72から照射する。
<Ninth Embodiment>
FIG. 23 shows a configuration of a lighting fixture including the surface mount electronic component according to the ninth embodiment. The luminaire 70 has the surface-mounted electronic component 1 according to any one of the first to eighth embodiments mounted in a housing 71, and light emitted from the LED chip 3 of the surface-mounted electronic component 1. Is irradiated from the front panel 72.

筐体71は、アルミダイカスト等の放熱性のよい材質で構成されており、前面パネル72は、アクリル等の透光性を有する材質にて構成されている。表面実装型電子部品1は、配線基板20にはんだ付け実装された状態で、筐体71内に搭載されている。このような構成の照明器具70によれば、表面実装型電子部品1の配線基板20へのはんだ接合部の信頼性が高いため、品質を向上することが可能となる。   The casing 71 is made of a material with good heat dissipation such as aluminum die casting, and the front panel 72 is made of a material having translucency such as acrylic. The surface mount electronic component 1 is mounted in the casing 71 in a state where it is soldered and mounted on the wiring board 20. According to the luminaire 70 having such a configuration, since the reliability of the solder joint portion of the surface mount electronic component 1 to the wiring board 20 is high, the quality can be improved.

本発明の第1の実施形態に係る表面実装型電子部品の構成を示す斜視図である。1 is a perspective view showing a configuration of a surface mount electronic component according to a first embodiment of the present invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 同表面実装型電子部品の構成を示す図2のA−A線断面に相当する断面図である。FIG. 3 is a cross-sectional view corresponding to a cross section taken along line AA of FIG. 2 showing the configuration of the surface mount electronic component. 同表面実装型電子部品を配線基板に実装した状態の構成を示す図2A−A線断面図である。FIG. 2B is a cross-sectional view taken along line AA in FIG. 2, illustrating a configuration in a state where the same surface-mounted electronic component is mounted on a wiring board. 本発明の第2の実施形態に係る表面実装型電子部品の構成を示す斜視図である。It is a perspective view which shows the structure of the surface mount type electronic component which concerns on the 2nd Embodiment of this invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 本発明の第3の実施形態に係る表面実装型電子部品の構成を示す斜視図である。It is a perspective view which shows the structure of the surface mount type electronic component which concerns on the 3rd Embodiment of this invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 本発明の第4の実施形態に係る表面実装型電子部品の構成を示す斜視図である。It is a perspective view which shows the structure of the surface mount type electronic component which concerns on the 4th Embodiment of this invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 本発明の第5の実施形態に係る表面実装型電子部品の構成を示す斜視図である。It is a perspective view which shows the structure of the surface mount type electronic component which concerns on the 5th Embodiment of this invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 同表面実装型電子部品を配線基板に実装した状態の構成を示す図12B−B線断面図である。FIG. 12B is a cross-sectional view taken along the line B-B in FIG. 12, illustrating a configuration in a state where the surface-mounted electronic component is mounted on the wiring board. 本発明の第6の実施形態に係る表面実装型電子部品の構成を示す斜視図である。It is a perspective view which shows the structure of the surface mount type electronic component which concerns on the 6th Embodiment of this invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 同表面実装型電子部品の構成を示す図15のC−C線断面図である。It is CC sectional view taken on the line of FIG. 15 which shows the structure of the surface mount type electronic component. (a)は本発明の第7の実施形態に係る表面実装型電子部品の構成を示す電極端子部を取付ける前の斜視図であり、(b)は同電極端子部を取付けた状態の斜視図である。(A) is a perspective view before attaching the electrode terminal part which shows the structure of the surface mount type electronic component which concerns on the 7th Embodiment of this invention, (b) is a perspective view of the state which attached the electrode terminal part It is. (a)は同表面実装型電子部品の構成を示す電極端子部を取付ける前の底面図であり、(b)は同電極端子部を取付けた状態の底面図である。(A) is the bottom view before attaching the electrode terminal part which shows the structure of the surface mount type electronic component, (b) is a bottom view of the state which attached the electrode terminal part. (a)は同表面実装型電子部品の構成を示す電極端子部を取付ける前の図18(a)のD−D線断面図であり、(b)は同電極端子部を取付けた状態の断面図である。(A) is the DD sectional view taken on the line of FIG. 18 (a) before attaching the electrode terminal part which shows the structure of the same surface mount-type electronic component, (b) is the cross section of the state which attached the electrode terminal part FIG. (a)は電極端子部の別の構成を示す電極端子部を取付ける前の斜視図であり、(b)は同電極端子部を取付けた状態の斜視図である。(A) is a perspective view before attaching the electrode terminal part which shows another structure of an electrode terminal part, (b) is a perspective view of the state which attached the electrode terminal part. 本発明の第8の実施形態に係る表面実装型電子部品の構成を示す斜視図である。It is a perspective view which shows the structure of the surface mount type electronic component which concerns on the 8th Embodiment of this invention. 同表面実装型電子部品の構成を示す底面図である。It is a bottom view which shows the structure of the same surface mount-type electronic component. 本発明の第9の実施形態に係る表面実装型電子部品を備えた照明器具の構成を示す斜視図である。It is a perspective view which shows the structure of the lighting fixture provided with the surface mount type electronic component which concerns on the 9th Embodiment of this invention.

符号の説明Explanation of symbols

1 表面実装型電子部品
2 実装基板
3 LEDチップ(実装電子部品)
4 底面電極部
5 側面電極部
6 リード部
7 凹部
10 溝部
20 配線基板
30 はんだ
50 電極端子部
d 溝部の窪みの奥行き
w 側面電極部の幅
DESCRIPTION OF SYMBOLS 1 Surface mount type electronic component 2 Mounting board 3 LED chip (mounting electronic component)
4 Bottom electrode portion 5 Side electrode portion 6 Lead portion 7 Recess portion 10 Groove portion 20 Wiring substrate 30 Solder 50 Electrode terminal portion d Depth of recess in groove portion w Side electrode portion width

Claims (6)

実装基板の底面及び側面の少なくとも何れか一方に配線基板との電気接続を行うための電極部と、この電極部と電気導通された実装電子部品接続用のリード部とを有した表面実装型電子部品において、
前記電極部は、前記実装基板の外部表面の一辺の略中央部分に設けられ、
前記電極部の少なくとも一部が前記実装基板の内方へ窪んだ溝部を形成し、
前記溝部の窪みの幅を、奥行き寸法の2倍よりも大きくすることを特徴とする表面実装型電子部品。
A surface-mount type electronic device having an electrode portion for electrical connection with a wiring board on at least one of a bottom surface and a side surface of the mounting substrate, and a lead portion for mounting electronic components connected to the electrode portion. In parts,
The electrode portion is provided in a substantially central portion of one side of the outer surface of the mounting substrate,
Forming a groove part in which at least a part of the electrode part is recessed inward of the mounting substrate;
A surface-mount type electronic component characterized in that the width of the recess of the groove is larger than twice the depth dimension.
前記実装電子部品は、LEDチップであり、
前記実装基板は、前記LEDチップを搭載する凹部を有し、
前記LEDチップを前記実装基板の凹部に搭載したことを特徴とする請求項1に記載の表面実装型電子部品。
The mounting electronic component is an LED chip,
The mounting substrate has a recess for mounting the LED chip,
The surface-mount type electronic component according to claim 1, wherein the LED chip is mounted in a recess of the mounting substrate.
前記溝部は、前記実装基板の配線基板への実装面から該実装面に対向する面に貫通していることを特徴とする請求項1に記載の表面実装型電子部品。   The surface-mount type electronic component according to claim 1, wherein the groove portion penetrates from a mounting surface of the mounting substrate to the wiring substrate to a surface facing the mounting surface. 前記溝部の断面形状が楕円状であることを特徴とする請求項1に記載の表面実装型電子部品。   The surface-mount type electronic component according to claim 1, wherein a cross-sectional shape of the groove is an ellipse. 前記溝部を一つの電極部に対して2以上設けたことを特徴とする請求項1に記載の表面実装型電子部品。   The surface-mount type electronic component according to claim 1, wherein two or more groove portions are provided for one electrode portion. 請求項1乃至請求項5の何れかに記載の表面実装型電子部品を備えたことを特徴とする照明器具。   A lighting fixture comprising the surface-mount type electronic component according to any one of claims 1 to 5.
JP2004241049A 2004-08-20 2004-08-20 Surface-mounting electronic component and lighting apparatus provided therewith Withdrawn JP2006060058A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294847A (en) * 2006-03-27 2007-11-08 Matsushita Electric Works Ltd Surface-mounting light emitting device
JP2009111180A (en) * 2007-10-30 2009-05-21 Panasonic Electric Works Co Ltd Led unit
JP2009130205A (en) * 2007-11-26 2009-06-11 Toyoda Gosei Co Ltd Light-emitting device, substrate device, and method of manufacturing light-emitting device
WO2012042333A1 (en) * 2010-09-27 2012-04-05 パナソニック電工Sunx株式会社 Led module
KR101358215B1 (en) 2013-09-13 2014-02-06 주식회사 루멘스 Substrate for light emitting device, module for light emitting device and its manufacturing method of substrate for light emitting device
JP2014135521A (en) * 2006-08-08 2014-07-24 Lg Electronics Inc Light emitting element package
WO2015093593A1 (en) * 2013-12-19 2015-06-25 ローム株式会社 Electronic device
CN109343273A (en) * 2018-11-23 2019-02-15 江苏新广联科技股份有限公司 A kind of big beam angle Mini LED backlight mould group and preparation method thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007294847A (en) * 2006-03-27 2007-11-08 Matsushita Electric Works Ltd Surface-mounting light emitting device
JP2014135521A (en) * 2006-08-08 2014-07-24 Lg Electronics Inc Light emitting element package
US9166123B2 (en) 2006-08-08 2015-10-20 Lg Electronics Inc. Light emitting device package and method for manufacturing the same
JP2009111180A (en) * 2007-10-30 2009-05-21 Panasonic Electric Works Co Ltd Led unit
JP2009130205A (en) * 2007-11-26 2009-06-11 Toyoda Gosei Co Ltd Light-emitting device, substrate device, and method of manufacturing light-emitting device
WO2012042333A1 (en) * 2010-09-27 2012-04-05 パナソニック電工Sunx株式会社 Led module
JP2012074423A (en) * 2010-09-27 2012-04-12 Panasonic Electric Works Sunx Co Ltd Led module
CN103119739A (en) * 2010-09-27 2013-05-22 松下神视株式会社 Led module
US8866183B2 (en) 2010-09-27 2014-10-21 Panasonic Industrial Devices Sunx Co., Ltd. LED module
KR101358215B1 (en) 2013-09-13 2014-02-06 주식회사 루멘스 Substrate for light emitting device, module for light emitting device and its manufacturing method of substrate for light emitting device
WO2015093593A1 (en) * 2013-12-19 2015-06-25 ローム株式会社 Electronic device
CN109343273A (en) * 2018-11-23 2019-02-15 江苏新广联科技股份有限公司 A kind of big beam angle Mini LED backlight mould group and preparation method thereof

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