KR101358215B1 - Substrate for light emitting device, module for light emitting device and its manufacturing method of substrate for light emitting device - Google Patents

Abstract

The present invention relates to a substrate for a light emitting device, a module for the light emitting device, and a method for manufacturing the substrate for light emitting device capable of improving electrical, mechanical, thermal, and optical performances. The present invention comprises an insulating plate, a first conductive layer, a second conductive layer, a groove unit, and an interconnecting plating layer. The insulating plate comprises a first surface and a second surface in which the light emitting device is mounted. The first conductive layer is formed on the first surface of the insulating plate. The second conductive layer is formed on the second surface of the insulating plate. The groove unit is formed on the second surface of the insulating plate by penetrating the second conductive layer. The interconnecting plating layer comprises a part formed on the second conductive layer. The interconnecting plating layer is extended from the part to an inner surface of the groove unit and the first conductive layer exposed inside the groove unit. The interconnecting plating layer electrically connects the first conductive layer and the second conductive layer.

Description

Substrate for light emitting device, module for light emitting device and its manufacturing method of substrate for light emitting device}

The present invention relates to a light emitting device substrate, a light emitting device module and a method for manufacturing a light emitting device substrate, and more particularly, a light emitting device substrate that can greatly improve the electrical, mechanical, thermal, and optical performance; A manufacturing method of a light emitting element module and a light emitting element substrate.

A light emitting diode (LED) refers to a kind of semiconductor device capable of realizing various colors of light by forming a light emitting source by forming a PN of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. In addition, these LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, and can be packaged after being mounted on a board or lead frame in various forms and modularized for various purposes and applied to various lighting devices or display devices. can do.

1. Published Patent Publication No. 10-2004-0080474 (2006.04.12) 2. Publication No. 10-2012-0121704 (January 12, 2006)

However, in the conventional substrate or lead frame mounting such a light emitting element, the bonding medium such as solder or conductive paste is bonded between two planes when bonding with the main substrate, so that the bonding area is very narrow when bonding. In addition to the mechanical performance, there was a problem that both the mechanical performance and the thermal performance falls.

On the other hand, the conventional substrate or the lead frame has a problem that the optical performance is also poor because there is no structure that can reflect the light generated from the light emitting device.

The present invention is to solve the various problems including the above problems, to form a groove portion in contact with the solder on the lower surface of the insulating plate, and to form electrical and thermal passage in the vertical direction to improve the electrical, mechanical and thermal performance of the product It is possible to greatly improve the light reflectance on the upper surface of the insulating plate, and to form a plating layer of gold or silver that does not perform surface oxidation to reflect the light generated from the light emitting device upwards, thereby improving the optical performance and It is an object of the present invention to provide a light emitting device substrate, a light emitting device module and a light emitting device substrate that can significantly improve durability. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a substrate for a light emitting device, including: an insulating plate having a first surface on which a light emitting device may be mounted and a second surface on an opposite side thereof; A first conductive layer formed on the first surface of the insulating plate; A second conductive layer formed on the second surface of the insulating plate; A groove formed in the second surface of the insulating plate through the second conductive layer; And a portion formed on the second conductive layer, an inner wall surface of the groove portion, and a portion extending on the first conductive layer exposed inside the groove portion, wherein the second conductive layer and the first conductive layer are formed. It may include; interconnecting plating layer for electrically connecting the.

In addition, according to the spirit of the present invention, the interconnecting plating layer may have a shape in which a solder induction space is formed at one side.

In addition, according to the spirit of the present invention, the interconnecting plating layer may have a shape in which the inside of the groove part is filled with a plating material.

In addition, according to the spirit of the present invention, the groove portion may be formed to at least the height of at least the first surface of the insulating plate or more within the range not penetrating the first conductive layer through the second conductive layer. .

In addition, according to the spirit of the present invention, the insulating plate, at least one of EMC, PI, ceramic, graphene, glass synthetic fibers and combinations thereof may be selected.

In addition, the light emitting device substrate according to the idea of the present invention may further include a first plating layer formed on the outer surface of the first conductive layer.

In addition, according to the spirit of the present invention, the first conductive layer and the second conductive layer are formed by selecting any one or more of copper, aluminum and a combination thereof, and the interconnecting plating layer and the first plating layer , At least one of silver (Ag), gold (Au), and a combination thereof may be selected.

In addition, the light emitting device substrate according to the spirit of the present invention, the first electrode portion formed on the insulating plate to be electrically connected to the first electrode of the light emitting device; And a second electrode part formed on the insulating plate to be electrically connected to a second electrode of the light emitting device, wherein the first electrode part and the second electrode part each include the first conductive layer; And the interconnect plating layer.

On the other hand, the light emitting device module according to the idea of the present invention for solving the above problems, the first surface on which the light emitting device can be mounted and the insulating plate having a second surface on the opposite side; A first conductive layer formed on the first surface of the insulating plate; A second conductive layer formed on the second surface of the insulating plate; A groove formed on the second surface of the insulating plate; A groove formed in the second surface of the insulating plate through the second conductive layer; And a portion formed on the second conductive layer, an inner wall surface of the groove portion, and a portion extending on the first conductive layer exposed inside the groove portion, wherein the second conductive layer and the first conductive layer are formed. An interconnect plating layer electrically connecting the interconnects; A first plating layer formed on an outer surface of the first conductive layer; A light emitting device mounted on the first plating layer; Solder in contact with said interconnect plating layer; And a main substrate electrically connected to the light emitting device through the solder.

On the other hand, the manufacturing method of the substrate for a light emitting device according to the idea of the present invention for solving the above problems, the insulating plate preparation step of preparing an insulating plate having a first surface on which the light emitting device can be mounted and a second surface on the opposite side; Forming a first conductive layer on the first surface of the insulating plate; A second conductive layer forming step of forming a second conductive layer on the second surface of the insulating plate; A groove portion forming step of forming a groove portion through the second conductive layer to a height of at least the first surface or the above of the insulating plate within a range not penetrating the first conductive layer; A groove formed in the second surface of the insulating plate through the second conductive layer; And a portion formed on the second conductive layer, an inner wall surface of the groove portion, and a portion extending on the first conductive layer exposed inside the groove portion, wherein the second conductive layer and the first conductive layer are formed. An interconnecting plating layer plating step of forming an interconnecting plating layer electrically connecting the interconnects; And a first plating layer plating step of forming a first plating layer on an outer surface of the first conductive layer.

In addition, according to the spirit of the present invention, the interconnecting plating layer plating step and the first plating layer plating step may be performed at the same time.

According to some embodiments of the present invention made as described above, it is possible to greatly improve the electrical, thermal, mechanical and optical performance of the product, the groove is mechanically robust because it does not completely penetrate the upper portion of the substrate, It has an effect which can make mounting work, fluorescent layer application work, and sealing work easy. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a substrate for a light emitting device according to some embodiments of the present invention.
2 to 5 are cross-sectional views illustrating a manufacturing process of a substrate for a light emitting device according to some embodiments of the present invention.
6 is a cross-sectional view illustrating a groove forming process of a substrate for a light emitting device according to some embodiments of the present invention.
7 is a cross-sectional view illustrating another example of FIG. 6.
8 is a cross-sectional view illustrating a light emitting device module according to some embodiments of the present invention.
9 is a cross-sectional view illustrating a light emitting device module according to some other embodiments of the present invention.
10 is a cross-sectional view illustrating a substrate for a light emitting device according to some other embodiments of the present invention.
11 is a flowchart illustrating a method of manufacturing a light emitting device substrate according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is a cross-sectional view showing a substrate 100 for a light emitting device according to some embodiments of the present invention.

First, as shown in FIG. 1, the substrate 100 for a light emitting device according to some embodiments of the present invention includes an insulating plate 10, a first conductive layer 11, and a second conductive layer 12. ), A groove 13 and an interconnecting plating layer 23.

Here, the insulating plate 10 may be made of a material having a suitable mechanical strength and insulating property or a conductive material having an insulating property on the surface so that the light emitting device 1 of FIG. 8 can be mounted. That is, the entirety of the insulating plate 10 may be an insulating material, and at least the surface of the insulating plate 10 may be an insulating material.

For example, the insulating plate 10 may be a part of a printed circuit board (PCB) in which an epoxy resin sheet is formed of at least one layer. In addition, the flexible plate 10 may be a part of a flexible printed circuit board (FPCB) made of a flexible material.

In addition, the insulating plate 10 may be a synthetic resin substrate such as resin or glass epoxy, or a ceramic substrate may be applied in consideration of thermal conductivity. In addition, insulated aluminum, copper, zinc, tin, lead, gold, A metal substrate such as silver may be applied, and substrates in the form of a plate or a lead frame may be applied.

In addition, the insulating plate 10 may be formed by selecting at least one of an epoxy mold compound (EMC), a polyimide (PI), ceramics, graphene, glass synthetic fibers, and combinations thereof to improve processability. have.

In addition, as illustrated in FIG. 1, for example, the first conductive layer 11 may be formed on the first surface 10a of the insulating plate 10 on which the light emitting device 1 may be mounted. The second conductive layer 12 is a conductive layer formed on the second surface 10b of the insulating plate 10.

Here, the first conductive layer 11 and the second conductive layer 12 may be simultaneously provided on the first surface 10a and the second surface 10b of the insulating plate 10 in the form of a conductive layer pattern. Can be.

In addition, the first conductive layer 11 and the second conductive layer 12 may be formed by selecting any one or more of copper, aluminum, and combinations thereof, which are excellent in thermal conductivity and relatively inexpensive.

At this time, such a pattern forming method may be used a method such as thermocompression processing, plating processing, adhesive processing, sputtering, or other etching processing, printing processing, spray processing.

In addition, as shown in FIG. 1, the groove portion 13 penetrates through the second conductive layer 12 to increase the electrical, mechanical, and thermal contact area with a bonding medium such as solder or conductive paste. It may be formed on the second surface 10b of the insulating plate 10.

Here, at least one groove 13 may be formed in the insulating plate 10 using CNC (Computer Numerical Control) drilling, laser drilling, or etching.

The interconnecting plating layer 23 also includes a second plating layer 22, which is a portion formed on the outer surface of the second conductive layer 12, and the groove 13 from the second plating layer 22. Extends on the inner wall surface of the c) and the first conductive layer 12 exposed inside the groove 13 to electrically connect the second conductive layer 12 and the first conductive layer 11 to each other. It may be a conductive layer formed through a plating process on the inner wall surface of the groove 13 so as to.

Here, as shown in FIG. 1, the interconnect plating layer 23 may have a solder induction space S formed at one side thereof. The solder induction space (S) may be cylindrical, in addition to the elliptic cylinder, triangular cylinder, square cylinder, polygonal cylinder, conical cylinder, polygonal pyramid, cross-section of the trapezoidal, multi-stage cylinder, such as a space of various geometric shapes can be formed have.

The solder induction space (S) may be designed to have a volume capable of fully utilizing the capillary shape of the solder or at least a space in which the solder may be sufficiently filled in consideration of the material of the solder.

Meanwhile, as shown in FIG. 1, the light emitting device substrate 100 according to some embodiments may further include a first plating layer 21 formed on an outer surface of the first conductive layer 11. It may include.

The interconnecting plating layer 23 and the first plating layer 21 have excellent thermal conductivity, have no surface oxidation, and reflect light at least of silver (Ag) and gold (Au). And any one or more of these combinations.

Accordingly, the light generated from the light emitting device by forming the first plating layer 21 made of gold or silver having excellent reflectivity of light on the first surface 10a, that is, the upper surface of the insulating plate 10, and having no surface oxidation. Can be reflected upwards, thereby greatly improving the optical performance and durability of the product.

In addition, a solder is formed by forming an interconnecting plating layer 23 on the second plating layer 22 and the groove 13 with gold or silver having excellent conductivity on the second surface 10b of the insulating plate 10, that is, the lower surface thereof. Induction increases the electrical, mechanical and thermal contact area, and surface oxidation does not occur, thereby improving the electrical, mechanical and thermal contact performance of the product as well as durability.

2 to 5 are cross-sectional views illustrating a manufacturing process of a light emitting device substrate 100 according to some embodiments of the present invention, and FIG. 6 is a light emitting device substrate 100 according to some embodiments of the present invention. It is sectional drawing which shows the process of forming groove part of ().

Referring to the manufacturing process of the light emitting device substrate 100 according to some embodiments of the present invention in more detail, first, as shown in Figure 2, the first surface on which the light emitting device 1 can be mounted It is possible to prepare the insulating plate 10 having the second surface 10b on the opposite side to 10a.

Subsequently, as shown in FIG. 3, the first conductive layer 11 is formed on the first surface 10a of the insulating plate 10, and at the same time, the first conductive layer 11 is formed on the second surface 10b of the insulating plate 10. 2 conductive layers 12 can be formed.

In this case, the first conductive layer 11 and the second conductive layer 12 may be provided on the upper and lower surfaces of the insulating plate 10 by thermocompression bonding, plating, bonding, sputtering, or the like.

Next, as shown in FIGS. 4 and 6, starting from the second surface 10b of the insulating plate 10 to increase the electrical, mechanical, and thermal contact area with the bonding medium such as solder or conductive paste. The groove 13 may be formed at least up to the height H1 of the first surface of the insulating plate 10 within a range that does not completely penetrate the first conductive layer 11.

7 is a cross-sectional view illustrating another example of FIG. 6.

In addition, as shown in FIG. 7, starting from the second surface 10b of the insulating plate 10, at least the first of the insulating plate 10 within a range that does not completely penetrate the first conductive layer 11. It is also possible to form the groove part 13 to the height H2 exceeding the surface 10a.

In this case, the groove 13 may be formed by at least one selected from at least one of CNC drilling, laser drilling, etching, and combinations thereof.

Here, since the groove 13 does not completely penetrate the first conductive layer 11, the light emitting device 1 or the encapsulant (described later in FIGS. 8 and 9) on the first conductive layer 11. 3) When the fluorescent layer 4 and the lens 5 are installed, the material does not leak in the direction of the groove 13 so that processing is advantageous, and the first plating layer 21 is disposed on the first conductive layer 11. It is formed flat and has excellent optical performance and thermal performance as well as workability.

Subsequently, as shown in FIG. 5, the interconnecting plating layer 23 is formed on the inner wall surface of the groove 13, and at the same time, the first plating layer 21 is formed on the outer surface of the first conductive layer 11. At the same time, the second plating layer 22 may be formed on the outer surface of the second conductive layer 12.

That is, for convenience of processing, the first plating layer 21, the second plating layer 22, and the interconnecting plating layer 23 may be simultaneously formed in the same plating bath. In addition, it can be installed with a partial time difference.

8 is a cross-sectional view illustrating a light emitting device module 10000 according to some embodiments of the present invention.

As shown in FIG. 8, the light emitting device module 10000 according to some embodiments of the present invention includes the insulating plate 10, a first electrode part 300, and a second electrode part 400. The light emitting device substrate 1000 may be included.

That is, the first electrode part 300 may be formed on the insulating plate 10 to be electrically connected to the first electrode 1-1 of the light emitting device 1.

In addition, the second electrode part 400 may be formed on the insulating plate 10 to be electrically connected to the second electrode 1-2 of the light emitting device 1.

The first electrode part 300 and the second electrode part 400 may have the same structure as the light emitting device substrate 100 according to some embodiments of the present invention, respectively.

That is, the area of electrical, mechanical, and thermal contact between the first conductive layer 11 formed on the first surface 10a of the insulating plate 10, on which the light emitting device 1 may be mounted, and the bonding medium may be increased. It may include a groove 13 formed on the second surface (10b) of the insulating plate 10 and the interconnecting plating layer 23 formed on the inner wall surface of the groove (13).

In addition, in addition to the light emitting device module 10000 according to some embodiments of the present invention, the second conductive layer 12 formed on the second surface 10b of the insulating plate 10, and the first conductive The first plating layer 21 formed on the outer surface of the layer 11, the second plating layer 22 formed on the outer surface of the second conductive layer 12, and the first plating layer 21 mounted on the first plating layer 21. The main substrate electrically connected to the light emitting element 1 through the solder 30 and the solder 30 in contact with the light emitting element 1, the second plating layer 22, and the interconnecting plating layer 23. 40 may include. In addition, a transparent or opaque encapsulant 3 may be provided around the light emitting device 1, a fluorescent layer 4 may be provided, or a lens 5 may be provided.

Accordingly, in the light emitting device module 10000 according to some embodiments of the present invention, heat generated in the light emitting device 1 may be generated by the first plating layer 21, as indicated by arrows in FIG. 8. The first conductive layer 11, the interconnecting plating layer 23, the solder 30, and the main substrate 40 may be quickly transferred to the outside, and the solder 30 may be transferred to the groove 13. Deeply penetrated into the shape, the electrical, thermal, and mechanical contact area is widened to improve the performance of the product. The first plating layer 21 and the second plating layer 22 are formed of gold or silver, and thus have excellent light reflectivity. In addition, since surface oxidation is not performed, durability can be greatly improved.

Here, the light emitting device 1 is a flip chip type, and as shown in FIG. 9, a horizontal or vertical light emitting device 2 may be applied.

9 is a cross-sectional view illustrating a light emitting device module 200 according to some other embodiments of the present invention.

As shown in FIG. 9, the light emitting device module 20000 according to some other exemplary embodiments may include the insulating plate 10, the first electrode part 300, and the second electrode part 400. The light emitting device substrate 1000 may be included.

That is, the first electrode part 300 may be formed on the insulating plate 10 so as to be electrically connected to the first electrode 2-1 of the light emitting device 2 using the wire W.

In addition, the second electrode part 400 may be formed on the insulating plate 10 to be electrically connected to the second electrode 2-2 of the light emitting device 2 by using a wire (W). . Therefore, according to the spirit of the present invention, it can be applied to all types of light emitting devices such as a horizontal type or a vertical type light emitting device in addition to the flip chip type light emitting devices.

10 is a cross-sectional view illustrating a light emitting device substrate 200 according to some other embodiments of the present invention.

As shown in FIG. 10, the interconnecting plating layer 23 may have a shape in which the inside of the groove 13 is filled with a plating material. Thus, as shown in FIG. 10, it is also possible for the plating material to improve the electrical, mechanical, and thermal performance of the product.

11 is a flowchart illustrating a method of manufacturing a light emitting device substrate according to some embodiments of the present invention.

2 to 5 and 11, a method of manufacturing a light emitting device substrate according to some embodiments of the present invention, the insulating plate preparation step (S1) for preparing the insulating plate 10 of Figure 2, Subsequently, a first conductive layer forming step S2 of forming a first conductive layer 11 on the first surface 10a of the insulating plate 10 of FIG. 3, and a second of the insulating plate 10 of FIG. 3. The second conductive layer forming step (S3) of forming the second conductive layer 12 on the surface 10b, and then, forming the second conductive layer 12, and subsequently, increasing the electrical, mechanical, and thermal contact area with the bonding medium. The groove of FIG. 4 starting from the second surface 10b and up to a height H1 (H2) of at least the first surface 10a of the insulating plate 10 within a range that does not completely penetrate the first conductive layer 11. Groove forming step (S4) to form (13), and then interconnecting plating layer plating step (S5) to form an interconnecting plating layer 23 on the inner wall surface of the groove 13 of FIG. And forming a first plating layer 21 on the outer surface of the first conductive layer 11 and applying a second plating layer 22 to the outer surface of the second conductive layer 12. Forming a second plating layer plating step (S7) may be included.

As shown in FIG. 3, the first conductive layer forming step S2 and the second conductive layer forming step S include at least thermocompression bonding, plating, bonding, sputtering, and combinations thereof. Any one or more of these may be selected and made at the same time.

In addition, as shown in FIG. 4, the groove forming step S4 may be performed by selecting at least one of at least CNC drilling, laser drilling, etching, and combinations thereof.

In addition, as shown in FIG. 5, the interconnecting plating layer plating step S5, the first plating layer plating step S6, and the second plating layer plating step S7 may be simultaneously performed.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1, 2: light emitting element
1-1, 2-1: first electrode
1-2, 2-2: second electrode
3: encapsulant
4: fluorescent layer
5: Lens
W: Wire
10: insulation plate
10a: first side
10b: second side
11: first conductive layer
12: second conductive layer
13: home
100, 200: substrate for light emitting element
S: solder induction space
H1, H2: height
21: first plating layer
22: second plating layer
23: interconnect plating layer
300: first electrode portion
400: second electrode portion
30: solder
40: main board
10000, 20000: Module for light emitting element

Claims (11)

An insulating plate having a first surface on which the light emitting element can be mounted and a second surface on the opposite side thereof;
A first conductive layer formed on the first surface of the insulating plate;
A second conductive layer formed on the second surface of the insulating plate;
A groove formed in the second surface of the insulating plate through the second conductive layer; And
The second conductive layer and the first conductive layer, including a portion formed on the second conductive layer, an inner wall surface of the groove portion, and a portion extending onto the first conductive layer exposed inside the groove portion. Interconnecting plating layers electrically connected to each other;
A light emitting device substrate comprising a. The method of claim 1,
The interconnecting plating layer has a shape in which a solder induction space is formed on one side, a substrate for a light emitting device. The method of claim 1,
The interconnecting plating layer has a shape in which the inside of the groove is filled with a plating material. The method of claim 1,
The groove portion is a substrate for a light emitting element is formed to penetrate the second conductive layer to a height of at least the first surface or more of the insulating plate within the range not penetrating the first conductive layer. The method of claim 1,
Wherein the insulating plate, at least one of EMC, PI, ceramic, graphene, glass synthetic fibers and combinations thereof are selected by selecting, the substrate for a light emitting device. The method of claim 1,
A first plating layer formed on an outer surface of the first conductive layer;
Further comprising a light emitting device substrate. The method according to claim 6,
The first conductive layer and the second conductive layer are formed by selecting any one or more of copper, aluminum, and a combination thereof,
The interconnecting plating layer and the first plating layer are at least one selected from silver (Ag), gold (Au), and a combination thereof. The method of claim 1,
A first electrode part formed on the insulating plate to be electrically connected to the first electrode of the light emitting device; And
And a second electrode part formed on the insulating plate to be electrically connected to the second electrode of the light emitting device.
The first electrode portion and the second electrode portion, respectively, the first conductive layer; And the interconnect plating layer;
A light emitting device substrate comprising a. An insulating plate having a first surface on which the light emitting element can be mounted and a second surface on the opposite side thereof;
A first conductive layer formed on the first surface of the insulating plate;
A second conductive layer formed on the second surface of the insulating plate;
A groove formed on the second surface of the insulating plate;
The second conductive layer and the first conductive layer, including a portion formed on the second conductive layer, an inner wall surface of the groove portion, and a portion extending onto the first conductive layer exposed inside the groove portion. Interconnecting plating layers electrically connected to each other;
A first plating layer formed on an outer surface of the first conductive layer;
A light emitting device mounted on the first plating layer;
Solder in contact with said interconnect plating layer; And
A main substrate electrically connected to the light emitting device through the solder;
Comprising a light emitting device module. An insulating plate preparation step of preparing an insulating plate having a first surface on which the light emitting device may be mounted and a second surface on the opposite side thereof;
Forming a first conductive layer on the first surface of the insulating plate;
A second conductive layer forming step of forming a second conductive layer on the second surface of the insulating plate;
A groove portion forming step of forming a groove portion through the second conductive layer to a height of at least the first surface or the above of the insulating plate within a range not penetrating the first conductive layer;
An interconnecting plating layer plating step of forming an interconnecting plating layer including a portion formed along an outer surface of the second conductive layer on an inner wall surface of the groove portion; And
A first plating layer plating step of forming a first plating layer on an outer surface of the first conductive layer;
A manufacturing method of a substrate for light emitting elements comprising a. 11. The method of claim 10,
The interconnecting plating layer plating step and the first plating layer plating step is performed at the same time, the manufacturing method of the light emitting device substrate.

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