JP2007294847A - Surface-mounting light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounting light emitting device capable of preventing cracks from being generated at junction portions for connecting electrodes for external connection and conductor patterns of a wiring board caused by a difference in a coefficient of thermal expansion between a packaging substrate and the wiring board. <P>SOLUTION: A surface-mounting light emitting device 1 is equipped with: an LED chip 10; and a packaging substrate 20 in which the LED chip 10 is mounted, wherein electrodes 25, 25 for external connection which are formed at both sides in the setting direction in the packaging substrate 20 and are electrically connected to the LED chip 10 are fixed to conductor patterns 83, 83 of a wiring board 80 via junctions 90, 90, and are used. There formed are slits 23, 23 intersecting with a straight line connecting the electrodes 25, 25 for external connection, and thereby the packaging substrate 20 becomes expandable and elastically deformable in the direction along the straight line. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface-mounted light-emitting device that includes an LED chip and a mounting board on which the LED chip is mounted, and is used by being surface-mounted on a wiring board.

  Conventionally, as shown in FIG. 18, an LED chip 10 ′ and a housing recess 21a ′ for housing the LED chip 10 ′ are formed on one surface side, and wiring patterns 22 ′ and 22 for feeding power to the LED chip 10 ′. A mounting substrate 20 'provided with', a sealing portion (not shown) made of a transparent sealing resin that seals the LED chip 10 'in the housing recess 21a' of the mounting substrate 20 ', and a mounting substrate A sheet-like color conversion member 30 ′ that closes the storage recess 21a ′ on the one surface side of 20 ′, and of the wiring patterns 22 ′ and 22 ′, the storage recess 21a ′ of the mounting substrate 20 ′ One end portion formed on the bottom surface constitutes the chip connection portions 22a ′ and 22a ′, and the other end portion formed on the peripheral portion on the other surface side of the mounting substrate 20 ′ serves as the external connection electrodes 22b ′ and 22b ′. A surface-mounted light-emitting device 1 ′ constructed is proposed. There. In the surface-mounted light-emitting device 1 ′ described above, a blue LED chip is used as the LED chip 10 ′, and the color conversion member 30 ′ is formed of a yellow phosphor and a translucent material, so that blue light and yellow light are generated. It is possible to realize a white light emitting device capable of obtaining white light composed of the mixed color light.

  The surface-mounted light-emitting device 1 ′ described above forms a package with the mounting substrate 20 ′ and the color conversion member 30 ′. When surface-mounted on the wiring substrate 80 ′, each external connection electrode 22b ′, 22b ′ is connected to the conductor patterns 83 ′ and 83 ′ of the wiring board 80 ′ via joints 90 ′ and 90 ′ made of brazing material (for example, solder). The mounting substrate 20 ′ is provided with the housing recess 21 a ′ and the wiring patterns 22 ′ and 22 ′ in an insulating substrate 21 ′ made of a ceramic substrate having high thermal conductivity. On the other hand, the wiring board 80 ′ is a metal-based printed wiring board, and conductor patterns (circuit patterns) 83 ′ and 83 ′ are formed on the insulating layer 82 ′ on the metal plate 81 ′ having a high thermal conductivity. A heat radiating protrusion 20e ′ protruding from the other surface of the mounting substrate 20 ′ is thermally coupled to the metal plate 81 ′ without passing through the insulating layer 82 ′.

  By the way, the surface-mounted light-emitting device as described above is not limited to a white light-emitting device, and has advantages such as a reduction in size, weight, and power saving compared to conventional incandescent bulbs and fluorescent lamps. It is widely used as a display light source, a display light source, an alternative light source for small light bulbs (incandescent light bulbs, halogen light bulbs, etc.), a liquid crystal panel light source (liquid crystal panel backlight) for mobile phones, and the like.

In addition, with the recent increase in output of white light emitting devices, research and development for expanding white light emitting devices for lighting applications has become active, but the above-mentioned white light emitting devices are relatively large for general lighting applications and the like. When used in applications requiring light output, a single white light-emitting device cannot obtain a desired light output. Therefore, an LED unit in which a plurality of white light-emitting devices are mounted on a single wiring board is configured. Generally, a desired light output is ensured in the entire unit.
JP 2005-12155 A

  By the way, in the LED unit in which a plurality of surface-mounted light-emitting devices 1 ′ are mounted on one wiring board 80 ′ as described above, the heat generation amount of each surface-mounted light-emitting device 1 ′ is relatively small. Since the amount of heat generation increases as the number of the mounting type light emitting devices 1 ′ increases, heat tends to be accumulated in the wiring board 80 ′, and the temperature of the entire LED unit tends to increase.

  Moreover, in the lighting fixture using the above-mentioned LED unit, it tends to aim at downsizing of the fixture body as compared with the conventional lighting fixture, and other circuit components such as a power supply unit and a control unit are also provided around the LED unit. Since these circuit components are often arranged close to each other and act as a heat source for the LED unit, a situation occurs in which the LED unit is further warmed by the heat source around the LED unit.

  When the LED unit is used for general lighting as described above, the LED unit is repeatedly expanded and contracted by repeating the temperature increase after the start of lighting and the temperature decrease after the extinction, but the surface shown in FIG. Even in the case of improving heat dissipation like the mounting type light emitting device 1 ′, the joints 90 ′ and 90 ′ are cracked due to the difference in linear expansion coefficient between the mounting substrate 20 ′ and the wiring substrate 80 ′. There is a fear.

  The present invention has been made in view of the above reasons, and its purpose is to connect the external connection electrode and the conductor pattern of the wiring board due to the difference in thermal expansion coefficient between the mounting board and the wiring board. An object of the present invention is to provide a surface-mount light-emitting device that can prevent cracks from occurring in a bonded portion.

  The invention of claim 1 includes an LED chip and a mounting substrate on which the LED chip is mounted, and external connection electrodes formed on both ends in the specified direction on the mounting substrate and electrically connected to the LED chip are connected to the wiring substrate. A surface-mounted light-emitting device that is used by being fixed to a conductor pattern via a joint portion, and the mounting substrate is formed with a slit that intersects a straight line that connects the external connection electrodes, and is elastically deformed in a direction along the straight line. It is possible.

  According to the present invention, the mounting substrate is formed with slits intersecting with a straight line connecting the external connection electrodes, and is elastically deformable in a direction along the straight line. Therefore, the linear expansion between the mounting substrate and the wiring substrate is achieved. Since stress generated in the joint due to the rate difference is relieved, cracks are prevented from occurring in the joint connecting the external connection electrode of the mounting board and the conductor pattern of the wiring board. Can do.

  According to a second aspect of the present invention, in the first aspect of the invention, the mounting substrate is configured such that the LED chip is disposed at an intermediate position in the prescribed direction, and the slits are formed on both sides of the LED chip in the prescribed direction. It is characterized by that.

  According to this invention, it is possible to effectively relieve the stress generated in each of the joints.

  According to a third aspect of the present invention, in the second aspect of the present invention, the slits are parallel to each other and have the same cutting direction from the outer peripheral edge of the mounting substrate.

  According to the present invention, even if a force pulled by the joint portion is applied to each of the external connection electrodes, these forces can be canceled each other, and the mounting board is positioned in a direction in which the mounting board rotates on the wiring board. It is possible to prevent the shift.

  According to a fourth aspect of the present invention, in the first aspect of the present invention, the mounting substrate is configured such that the chip mounting portion on which the LED chip is mounted is disposed on the inner side of the electrode forming portion on which the external connection electrode is formed. The slit is formed between the chip mounting part and the electrode forming part except for the connecting part and supported by the electrode forming part via the part.

  According to this invention, compared with the case where the slit is formed in a straight line shape, the mounting substrate is easily elastically deformed elastically, and it is possible to more reliably prevent cracks from occurring in the joint portion.

  According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the mounting substrate is characterized in that the connecting portion is provided at two positions apart in the outer peripheral direction of the chip mounting portion.

  According to this invention, it is possible to increase the mechanical strength of the mounting board as compared with the case where the connecting portion is provided only at one place.

  According to a sixth aspect of the present invention, in the fourth or fifth aspect of the present invention, the phosphor and the translucent light that are excited by the light emitted from the LED chip and emit light having a color different from the emission color of the LED chip. A color conversion member that is formed of a conductive material and is disposed so as to surround the LED chip between the mounting substrate and a sealing portion that includes a transparent sealing material that seals the LED chip inside the color conversion member And a reflection member that is disposed so as to surround the color conversion member and reflects light emitted from the color conversion member to the side, and the reflection member has an end on the mounting substrate side inserted into the slit. It is positioned on the mounting substrate.

  According to the present invention, since the end portion on the mounting board side of the reflecting member is inserted into the slit and positioned on the mounting board, the end portion on the mounting board side of the reflecting member is in the color conversion member. It is positioned closer to the wiring board than the end on the mounting board side, and the light extraction efficiency to the outside can be increased.

  According to a seventh aspect of the present invention, in the fourth or fifth aspect of the present invention, the phosphor and the translucent light which are excited by the light emitted from the LED chip and emit light having a color different from the emission color of the LED chip. A color conversion member that is formed of a conductive material and is disposed so as to surround the LED chip between the mounting substrate and a sealing portion that includes a transparent sealing material that seals the LED chip inside the color conversion member The color conversion member is characterized in that an end portion on the mounting board side is inserted into the slit and positioned on the mounting board.

  According to this invention, since the color conversion member is positioned on the mounting substrate with the end on the mounting substrate side inserted into the slit, the light emitted from the LED chip does not pass through the color conversion member. It is possible to prevent leakage of the color conversion member and to improve the alignment accuracy of the color conversion member.

  The invention according to claim 8 is the invention according to claim 7, wherein the mounting substrate is formed with at least two communication ports for communicating the space surrounded by the chip mounting portion and the color conversion member with the outside. It is characterized by that.

  According to the present invention, at the time of manufacture, one of at least two communication ports is used as the sealing material injection port for the space surrounded by the chip mounting portion and the color conversion member. A manufacturing method can be adopted in which the sealing portion is formed by curing the sealing material after injecting the sealing material into the space using an inlet as an air outlet. Therefore, it is possible to suppress the generation of voids in the sealing portion during the manufacturing process, and the reliability and light output can be improved.

  According to the first aspect of the present invention, there is an effect that it is possible to prevent the occurrence of cracks in the joint portion connecting the external connection electrode of the mounting substrate and the conductor pattern of the wiring substrate.

(Embodiment 1)
Hereinafter, the surface-mounted light-emitting device 1 of the present embodiment will be described with reference to FIGS. 1 and 2.

  The surface-mount light-emitting device 1 of the present embodiment includes an LED chip 10 that emits visible light (blue light in the present embodiment), a mounting substrate 20 on which the LED chip 10 is mounted, and the LED chip 10 on the mounting substrate 20. And a sealing portion (not shown) in which the LED chip 10 is sealed on the mounting surface side. In the present embodiment, the sealing portion is excited by light emitted from the transparent sealing material (for example, silicone resin) and the LED chip 10, and has a light color different from the emission color of the LED chip 10. It is formed with the fluorescent substance which radiates | emits. In the present embodiment, the mounting substrate 20 and the sealing portion constitute a package.

  The LED chip 10 is a GaN-based blue LED chip that emits light in a blue wavelength range, and a light-emitting portion made of a GaN-based compound semiconductor material is formed on one surface side of a base substrate made of a sapphire substrate that is a crystal growth substrate. However, the base substrate is not limited to the sapphire substrate, and may be a SiC substrate, a Si substrate, or the like. Although the LED chip 10 is flip-mounted on the mounting substrate 20, a mounting structure using bonding wires may be adopted.

  In addition, the sealing portion is a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10 as the phosphor (for example, a YAG phosphor or the like). ). Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted from the light emission surface of the sealing portion, and thus the white light is emitted. Light can be obtained. In addition, in this embodiment, although the yellow fluorescent substance is contained in the said sealing part, the fluorescent substance contained in the sealing part 50 is not restricted to a yellow fluorescent substance, For example, red fluorescent substance and green fluorescent substance are included. Even when mixed, white light can be obtained.

  The surface-mounted light-emitting device 1 of this embodiment is used as a light source of a lighting fixture, for example, and a plurality of surface-mounted light-emitting devices 1 are mounted on a wiring board 90 so as to obtain a desired light output. The plurality of surface-mounted light emitting devices 1 may be connected in series or in parallel.

  The wiring board 80 is a metal-based printed wiring board, and on the insulating layer 82 on the aluminum metal plate 81, each of the external connection electrodes 25, 25 of the surface-mounted light-emitting device 1 is joined by solder 90, Conductor patterns (wiring patterns) 83 and 83 fixed through 90 are formed. The wiring board 80 is not limited to a metal-based printed wiring board, and may be formed using, for example, a glass cloth / epoxy resin copper-clad laminate. Moreover, you may employ | adopt brazing materials other than solder as the material of the junction parts 90 and 90. FIG.

  The mounting substrate 20 is formed using an insulating substrate 21 made of a rectangular plate-shaped ceramic substrate (for example, a ceramic substrate having electrical insulation and high thermal conductivity such as an alumina substrate). Two wiring patterns 22, 22 that are electrically connected to the respective electrodes of the LED chip 10 are formed on the mounting surface side, and the wiring patterns 22, 22 penetrate through the insulating substrate 21 in the thickness direction. The external connection electrodes 25 and 25 are electrically connected through the hole wirings 28 and 28.

  Here, each of the external connection electrodes 25, 25 includes fillet forming side surface electrode portions 25 a, 25 a formed on the inner surface of a notch formed in the outer peripheral edge of the insulating substrate 21, and the insulating substrate 21. The back electrode portions 25b and 25b formed on the back surface opposite to the mounting surface side of the LED chip 10 are continuously formed, and the back electrode portions 25b and 25b connect the through-hole wirings 28 and 28 described above. The wiring patterns 22 and 22 are electrically connected to each other.

  In addition, since the mounting substrate 20 has a rectangular heat radiation conductor portion 26 for radiating heat generated in the LED chip 10 at the center of the back surface of the insulating substrate 21, the heat radiation conductor portion 26 is formed. Is fixed to the conductor pattern 84 of the wiring board 80 via the joint portion 92 made of solder and thermally coupled to the wiring board 80, thereby suppressing the temperature rise of the LED chip 10. The heat dissipating conductor portion 26 is formed of the same material as the back surface side electrode portions 25b and 25b. Further, the heat dissipating conductor portion 26 is set to have a larger planar size than the LED chip 10. The heat dissipating conductor portion 26 is not necessarily provided. However, by providing the heat dissipating conductor portion 26 in the surface-mounted light emitting device 1, the heat generated in the LED chip 10 is dissipated through the heat dissipating conductor portion 26 and the wiring substrate 80. Therefore, it is possible to suppress the temperature rise of the LED chip 10 and to suppress the temperature rise of the LED unit, and it is possible to more surely prevent the joints 90 and 90 from being cracked. .

  By the way, the mounting substrate 20 has the above-described external connection electrodes 25 and 25 formed at both ends in a specified direction (longitudinal direction in the present embodiment), and intersects a straight line connecting the external connection electrodes 25 and 25. Slits 23, 23 penetrating in the thickness direction are formed, and elastically deformable in a direction along the straight line. Here, the mounting substrate 20 has the LED chip 10 disposed at an intermediate position in the prescribed direction, and slits 23 and 23 are formed on both sides of the LED chip 10 in the prescribed direction, so that the mounting substrate 20 is narrow at both ends in the prescribed direction. The width | variety arm parts 24 and 24 are formed. Further, the mounting substrate 20 has the slits 23 and 23 that are linear and parallel to each other, and the cutting direction from the outer peripheral edge of the mounting substrate 20 is the same (in short, the slits 23 and 23 of the mounting substrate 20 are 23, one end is opened at one side edge of the mounting substrate 20 in the short direction). The mounting substrate 20 described above has a line-symmetric structure with respect to the center line along the short direction. The external connection electrodes 25 and 25 on the mounting substrate 20 are formed on the arm portions 24 and 24, but the side surface electrode portions 25 a and 25 a are ends on the one side edge side in the short direction of the mounting substrate 20. The back electrode portions 25b, 25b are formed over substantially the entire length of the arm portions 24, 24.

  Thus, in the surface-mounted light-emitting device 1 of the present embodiment, the mounting substrate 20 has slits 23 and 23 that intersect the straight line connecting the external connection electrodes 25 and 25, and the mounting substrate 20 extends in the direction along the straight line. Since the elastic deformation is possible, the difference in elongation between the mounting board 20 and the wiring board 80 caused by the temperature change between when the lamp is turned off and when the lamp is turned on is alleviated by the slits 23 and 23. Since stress generated in the joints 90 and 90 due to the difference in linear expansion coefficient between the external connection electrodes 25 and 25 of the mounting substrate 20 and the conductor patterns 83 and 83 of the wiring substrate 80 is connected. It is possible to prevent cracks from occurring in the joining portions 90, 90 that are being performed.

  Here, in the surface-mounted light-emitting device 1 of the present embodiment, the mounting substrate 20 has the LED chip 10 disposed at an intermediate position in the specified direction, and slits 23 are formed on both sides of the LED chip 10 in the specified direction. Therefore, the stress generated in each of the joint portions 90 and 90 can be effectively relaxed. Further, in the surface mount type light emitting device 1 of the present embodiment, the slits 23 and 23 are parallel to each other and the cutting direction from the outer peripheral edge of the mounting substrate 20 is the same. Even if forces pulled by the joint portions 90 and 90 are applied, these forces can be canceled out, and the mounting substrate 20 is displaced in the direction in which the mounting substrate 20 rotates on the wiring substrate 80 when the solder melts during mounting. Can be prevented.

  In this embodiment, an alumina substrate having a thickness dimension of 0.3 mm, a longitudinal dimension of 8 mm, and a lateral dimension of 7 mm is used as the insulating substrate 21 that is the basis of the mounting substrate 20. The width dimension of 24 (the distance from the side edge in the longitudinal direction of the alumina substrate to the slit 23) is 1 mm, and each slit 23, 23 has a width dimension (width dimension in the longitudinal direction of the alumina substrate) of 0.1 mm, Although the length dimension (the cut depth dimension in the short direction of the alumina substrate) is 5 mm, the substrate material and numerical values are not particularly limited.

Here, the coefficient of linear expansion of the material of the insulating substrate 21 is α1, the coefficient of linear expansion of the material of the metal plate 81 occupying most of the wiring board 80 is α2, and the temperature difference between the temperature during lighting and the temperature during light extinction. ΔT [K], the distance between the two external connection electrodes 25, 25 is L [mm], and the difference in elongation between the mounting board 20 and the wiring board 80 caused by the temperature change between when the lamp is turned off and when the lamp is turned on is ΔL [ mm], ΔL is obtained by ΔL = (| α1−α2 |) × ΔT × L. Here, when the material of the insulating substrate 21 is alumina and the material of the metal plate 81 is aluminum, α1 = 7.1 × 10 ⁻⁶ [K ⁻¹ ], α2 = 23 × 10 ⁻⁶ [K ^{− 1} ], the temperature at the time of turning off is 30 ° C., and the temperature at the time of turning on is 100 ° C., ΔL = 0.090 [mm]. Therefore, if the width dimension of each slit 23 and 23 is 0.1 mm as described above, this difference in elongation ΔL can be sufficiently absorbed by the slits 23 and 23. The length dimension of the slits 23 and 23 and the width dimension of the arm portions 24 and 24 are preferably set as appropriate in consideration of the elasticity required for the mounting substrate 20 and the strength of the arm portions 24 and 24. Since it is desirable to change according to the material and thickness of this, it does not specifically limit. Further, the outer peripheral shape of the mounting substrate 20 is not limited to a rectangular shape, and may be a square shape, for example.

  By the way, in the mounting board 20 described above, the mechanical strength is the weakest in the vicinity of the end portions of the slits 23, 23. However, the width dimension of the slits 23, 23 is set to 0.1 mm as described above, and the slits 23, 23 are formed. In the case where the shape of the terminal portion in plan view is an arc shape, the radius of curvature of the terminal portion is a small value of about 0.05 mm, and a force in the direction of widening the slits 23 and 23 is applied to the mounting substrate 20. In addition, there is a possibility that stress concentrates in the vicinity of the end portions of the slits 23 and 23 and cracks are generated in the mounting substrate 20 from the inner surfaces of the slits 23 and 23. Therefore, when the width of the slits 23 and 23 is relatively small and a crack may occur, for example, as shown in FIG. 3, the slit 23 is continuous with the terminal portion of the slit 23 and compared with the width of the slit 23. A large-diameter circular stress relaxation hole 23b (for example, a circular stress relaxation hole 23b having a radius of curvature of about 0.15 mm) is formed, and the stress generated near the end portion of the slit 23 is substantially reduced. What is necessary is just to disperse | distribute equally. This kind of stress relaxation hole 23b is also effective in each of the embodiments described later.

(Embodiment 2)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment. In the first embodiment, one end of each of the slits 23 and 23 is open, whereas FIG. As shown, the slits 23 and 23 are formed in the middle portion of the mounting substrate 20 in the short direction, and the both ends of the slits 23 and 23 are not opened. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  More specifically, in the present embodiment, both ends of the slits 23 and 23 are located at a predetermined distance (for example, 1.5 mm) from both side edges of the mounting substrate 20 in the short direction, and each wiring pattern 22, 22 is bifurcated so as to avoid the slits 23 and 23, and two through-hole wirings 28 for electrically connecting the wiring pattern 22 and the external connection electrode 25 are provided. In addition, the external connection electrode 25 is formed in the central portion of the mounting substrate 20 in the short direction, and two side electrode portions 25a and 25a formed apart from each other in the short direction of the mounting substrate 20 are one. The back electrode part 25b is connected. The mounting substrate 20 in the present embodiment has a line-symmetric structure with respect to the center line along the short direction, and also has a line-symmetric structure with respect to the center line along the long direction.

  Thus, in the surface mount light emitting device 1 of the present embodiment, similarly to the first embodiment, the mounting substrate 20 is provided with slits 23 and 23 that intersect the straight lines connecting the external connection electrodes 25 and 25, and along the straight lines. Since the mounting substrate 20 can be elastically deformed in a stretched direction, the difference in elongation between the mounting substrate 20 and the wiring substrate 80 caused by the temperature change between when the lamp is turned off and when the lamp is turned on is alleviated by the slits 23 and 23. Since stress generated in the joints 90 and 90 due to the difference in linear expansion coefficient between the substrate 20 and the wiring substrate 80 is relieved, the external connection electrodes 25 and 25 of the mounting substrate 20 and the conductor pattern 83 of the wiring substrate 80 are reduced. , 83 can be prevented from cracking at the joints 90, 90 connecting them. Further, in the surface-mounted light-emitting device 1 of the present embodiment, the slits 23 and 23 are formed in the central portion in the short direction of the mounting substrate 20 and both ends are not open. 20, the stress generated near the ends of the slits 23 and 23 can be reduced, and the mounting substrate 20 can be more reliably prevented from cracking.

(Embodiment 3)
The basic configuration of the surface-mounted light-emitting device 1 of this embodiment is substantially the same as that of the first embodiment. As shown in FIG. 5, the external connection electrodes 25, 25 are mounted at both ends in the specified direction. It differs in the short direction of the board | substrate 20, and the point from which the cutting direction of the two slits 23 and 23 differs mutually. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  In the present embodiment, the mounting board 20 is formed in such a manner that the slits 23 and 23 are cut from the side edges of the mounting board 20 in the short side direction that are closer to the external connection electrodes 25 and 25. The wiring patterns 22 and 22 are formed so as to avoid the slits 23 and 23 and have a point-symmetric structure as a whole.

  Thus, in the surface mount light emitting device 1 of the present embodiment, similarly to the first embodiment, the mounting substrate 20 is provided with slits 23 and 23 that intersect the straight lines connecting the external connection electrodes 25 and 25, and along the straight lines. Since the mounting substrate 20 can be elastically deformed in a stretched direction, the difference in elongation between the mounting substrate 20 and the wiring substrate 80 caused by the temperature change between when the lamp is turned off and when the lamp is turned on is alleviated by the slits 23 and 23. Since stress generated in the joints 90 and 90 due to the difference in linear expansion coefficient between the substrate 20 and the wiring substrate 80 is relieved, the external connection electrodes 25 and 25 of the mounting substrate 20 and the conductor pattern 83 of the wiring substrate 80 are reduced. , 83 can be prevented from cracking at the joints 90, 90 connecting them.

(Embodiment 4)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 6, the emission color of the LED chip 10 is excited by the light emitted from the LED chip 10. Is a dome-shaped color conversion member 30 that is formed of a phosphor and a light-transmitting material that emits light of different colors and is disposed so as to surround the LED chip 10 between the mounting substrate 20 and the inside of the color conversion member 30 And the gel-like sealing portion 40 made of a transparent sealing material (for example, silicone resin) that seals the LED chip 10 and the shapes of the slits 23 and 23 are different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted. Further, the wiring patterns 22 and 22 (see FIG. 1A) and the through-hole wirings 28 and 28 (see FIG. 1A) described in the first embodiment are not shown.

  Further, in the mounting substrate 20 in the present embodiment, the chip mounting portion 20a on which the LED chip 10 is mounted is disposed inside the electrode forming portion 20b in which the external connection electrodes 25 and 25 are formed, and via the connecting portion 20c. Are supported by the electrode forming portion 20b, and curved slits 23, 23 are formed between the chip mounting portion 20a and the electrode forming portion 20b except for the connecting portion 20c. That is, the slits 23 and 23 are formed in such a shape that the two slits 23 and 23 surround the circular chip mounting portion 20a.

  By the way, in the present embodiment, the above-described color conversion member 30 is fixed to the mounting surface side of the LED chip 10 in the chip mounting portion 20a, and the mounting substrate 20 and the color conversion member 30 constitute a package.

  Here, the color conversion member 30 is a mixture of a translucent material such as a silicone resin and a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. It is comprised by the molded article of the mixed mixture. Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface of the color conversion member 30, and white light is emitted. Obtainable. The translucent material used as the material of the color conversion member 30 is not limited to a silicone resin, but an organic material in which, for example, an epoxy resin, an acrylic resin, glass, an organic component and an inorganic component are mixed and bonded at the nm level or the molecular level. -Inorganic hybrid materials may be used. Further, the phosphor mixed with the translucent material used as the material of the color conversion member 30 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the mounting substrate 20 is easily elastically deformed elastically as compared with the case where the slits 23 and 23 are formed linearly as in the first embodiment. It can prevent more reliably that a crack arises in the junction parts 90 and 90. FIG. In the present embodiment, the color conversion member 30 has a dome shape. However, the color conversion member 30 is not limited to a dome shape, and may be, for example, a box shape with one surface open.

  By the way, in manufacturing the surface-mounted light-emitting device 1 of the present embodiment, for example, after the LED chip 10 is mounted on the mounting substrate 20, the liquid crystal first seal that becomes a part of the sealing portion 40 is mounted. After covering with a stopper (for example, a silicone resin) and curing, a liquid second sealing material (on the basis of the remaining portion of the sealing portion 40 described above is formed inside the dome-shaped color conversion member 30 ( For example, after the silicone resin is injected, the color conversion member 30 is disposed at a predetermined position on the mounting substrate 20 and the second sealing material is cured to form the gel-like sealing portion 40 at the same time. A manufacturing method for fixing the color conversion member 30 to the mounting substrate 20 may be employed. By employing such a manufacturing method, generation of voids in the sealing portion 40 can be suppressed. Moreover, in the above-mentioned example, although the whole sealing part 40 is formed in the gel form, the material which hardens | cures and becomes a gel form as a 1st sealing material is selected, and adhesiveness is used as a 2nd sealing material. By selecting a high material, the sealing portion 40 has a function of relieving stress transmitted from the outside to the LED chip 10, and the color conversion member 30 is mounted on the mounting substrate by the second sealing material at the time of manufacture. The color conversion member 30 can be securely fixed to the mounting substrate 20 at the same time as the sealing portion 40 is formed.

(Embodiment 5)
The basic configuration of the surface-mount light-emitting device 1 of the present embodiment is substantially the same as that of the fourth embodiment, and is arranged so as to surround the color conversion member 30 as shown in FIGS. The point which is provided with the reflection member 50 which reflects the light radiate | emitted to the front is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, 4, and description is abbreviate | omitted.

  The reflecting member 50 is formed in a tapered cylindrical shape whose opening area gradually increases as the distance from the mounting substrate 20 increases, and a reflecting film made of a metal (for example, silver) having a high reflectance with respect to visible light is deposited. It is made of acrylic plastic. The material of the reflecting member 50 is not particularly limited.

  In addition, the reflecting member 50 has a notch 53 (see FIG. 8) in which the connecting portion 20c engages at a portion corresponding to the connecting portion 20c of the mounting substrate 20 at the end on the mounting substrate 20 side. Since the end portion on the 20 side can be positioned on the mounting substrate 20 by inserting it into the slits 23, 23, the reflective member 50 can be mounted on the mounting substrate 20 by fixing the inner surface of the notch 53 and the connecting portion 20 c with an adhesive. Can be fixed against. In the example shown in FIG. 7, the through grooves 85 and 85 corresponding to the slits 23 and 23 of the mounting substrate 20 are formed in the wiring board 80.

  Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the reflection member 50 that reflects the light emitted from the color conversion member 30 to the side is slit, and the end of the reflection member 50 on the mounting substrate 20 side is slit. 23, 23 and positioned on the mounting substrate 20, the end of the reflecting member 50 on the mounting substrate 20 side is closer to the wiring substrate 80 than the end of the color conversion member 30 on the mounting substrate 20 side. Therefore, the light extraction efficiency to the outside can be increased. Here, in order to position the reflecting member 50 with respect to the mounting board 20, a hook piece protruding outward from the outer peripheral surface of the reflecting member 50 is provided, and the hook piece is adhered to one surface of the mounting board 20. Good.

  In the present embodiment, the surface-mounted light-emitting device 1 includes the reflecting member 50, but the reflecting member 50 may be provided in a lighting fixture.

(Embodiment 6)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the fourth embodiment, and as shown in FIG. 9, the shapes of the slits 23 and 23 in the mounting substrate 20 are different. The connection part 20c which connects the mounting part 20a and the electrode formation part 20b is spaced apart in the outer peripheral direction of the chip | tip mounting part 20a, and the point etc. which differ are provided. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 4, and description is abbreviate | omitted.

  Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the mechanical strength of the mounting substrate 20 can be increased as compared with the case where the connecting portion 20c is provided in only one place as in the fourth embodiment.

(Embodiment 7)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the sixth embodiment, and is arranged so as to surround the LED chip 10 between the mounting substrate 20 as shown in FIG. The color conversion member 30 is different in that the end on the mounting substrate 20 side is inserted into the slits 23 and 23 and positioned on the mounting substrate 20. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 6, and description is abbreviate | omitted.

  As shown in FIG. 10C, the color conversion member 30 has a notch in which the connecting portions 20c and 20c are engaged with portions corresponding to the connecting portions 20c and 20c of the mounting substrate 20 at the end on the mounting substrate 20 side. Since the portions 32 and 32 are formed and can be positioned on the mounting substrate 20 by inserting the end portions on the mounting substrate 20 side into the slits 23 and 23, the inner surfaces of the notches 32 and 32 and the connecting portions 20c, The color conversion member 30 can be fixed to the mounting substrate 20 by fixing 20c with an adhesive.

  Thus, in the surface-mount light-emitting device 1 of the present embodiment, the color conversion member 30 inserts the end portion of the color conversion member 30 on the mounting substrate 20 side into the slits 23 and 23 of the mounting substrate 20, and the mounting substrate 20. Therefore, the light emitted from the LED chip 10 can be prevented from leaking without passing through the color conversion member 30, and the alignment accuracy of the color conversion member 30 can be improved. As a structure for positioning and fixing the color conversion member 30 to the mounting substrate 20, a step portion 33 as shown in FIG. 11 is provided at the end portion of the color conversion member 30 on the mounting substrate 20 side. You may make it adhere | attach on the mounting board | substrate 20. FIG.

  By the way, as shown in FIG. 10B, the mounting substrate 20 in the present embodiment has two communication ports 29 and 29 that allow the space surrounded by the chip mounting portion 20a and the color conversion member 30 to communicate with the outside. (In FIG. 10B, illustration of the external connection electrodes 25, 25 is omitted). Here, the communication ports 29 and 29 are formed continuously to the slits 23 and 23, but may be provided apart from the slits 23 and 23.

  In manufacturing the surface-mounted light-emitting device 1 according to the present embodiment, one of the two communication ports 29 and 29 is connected to the sealing material (with respect to the space surrounded by the chip mounting portion 20a and the color conversion member 30). For example, the sealing part is used by curing the sealing material after injecting the sealing material into the space using the other one as an air outlet and using the other as an air outlet. Since the manufacturing method which forms 40 can be employ | adopted, it can suppress that a void generate | occur | produces in the sealing part 40 in a manufacture process, and can improve reliability and optical output.

(Embodiment 8)
The basic configuration of the surface-mount light-emitting device 1 of the present embodiment is substantially the same as that of the sixth embodiment, and is arranged so as to surround the color conversion member 30 as shown in FIGS. The point which is provided with the reflection member 50 which reflects the light radiate | emitted to the front is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 6, and description is abbreviate | omitted.

  The shape of the reflecting member 50 is substantially the same as that of the fifth embodiment, and two notches 53 (see FIG. 8) with which the connecting portion 20c of the mounting substrate 20 engages are formed at the end on the mounting substrate 20 side. Since the end portion on the mounting substrate 20 side can be positioned on the mounting substrate 20 by inserting it into the slits 23, 23, the inner surfaces of the cutout portions 53, 53 and the connecting portions 20c, 20c are fixed by an adhesive. Thus, the reflecting member 50 can be fixed to the mounting substrate 20. In the example shown in FIG. 12B, the through-grooves 85 and 85 corresponding to the slits 23 and 23 of the mounting board 20 are formed in the wiring board 80.

  Therefore, in the surface-mounted light-emitting device 1 of the present embodiment, the reflection member 50 that reflects the light emitted from the color conversion member 30 to the side is slit, and the end of the reflection member 50 on the mounting substrate 20 side is slit. 23, 23 and positioned on the mounting substrate 20, the end of the reflecting member 50 on the mounting substrate 20 side is closer to the wiring substrate 80 than the end of the color conversion member 30 on the mounting substrate 20 side. Therefore, the light extraction efficiency to the outside can be increased. Here, in order to position the reflecting member 50 with respect to the mounting board 20, a hook piece protruding outward from the outer peripheral surface of the reflecting member 50 is provided, and the hook piece is adhered to one surface of the mounting board 20. Good.

  In the present embodiment, the surface-mounted light-emitting device 1 includes the reflecting member 50, but the reflecting member 50 may be provided in a lighting fixture.

(Embodiment 9)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the sixth embodiment. As shown in FIG. 14, the light is emitted from the color conversion member 30 to the electrode forming portion 20b on the mounting substrate 20. The difference is that a reflecting portion 21b that projects forward light is projected. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 6, and description is abbreviate | omitted.

  Therefore, in the surface-mounted light-emitting device 1 according to the present embodiment, the light emitted from the color conversion member 30 to the side is reflected forward by the reflecting portion 21b, so that the directivity can be improved. In the reflection part 21b, the inner side surface 21c on the color conversion member 30 side forms a reflection surface, but a reflection film made of a metal having a high reflectance with respect to visible light may be provided on the inner side surface 21c.

  The mounting substrate 20 may be formed using a multilayer ceramic substrate, or may be configured with an MID substrate.

(Embodiment 10)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the ninth embodiment, and is arranged so as to surround the LED chip 10 between the mounting substrate 20 as shown in FIGS. The color conversion member 30 is different in that the end on the mounting substrate 20 side is inserted into the slits 23 and 23 and positioned on the mounting substrate 20. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 9, and description is abbreviate | omitted.

  The color conversion member 30 is formed with notches 32 and 32 with which the connecting portions 20c and 20c are engaged at portions corresponding to the respective connecting portions 20c and 20c of the mounting substrate 20 at the end on the mounting substrate 20 side. Since the end portion on the mounting substrate 20 side can be positioned on the mounting substrate 20 by inserting it into the slits 23, 23, the inner surface of the notches 32, 32 and the connecting portions 20c, 20c can be fixed with an adhesive. The conversion member 30 can be fixed to the mounting substrate 20.

  Thus, in the surface-mount light-emitting device 1 of the present embodiment, the color conversion member 30 inserts the end portion of the color conversion member 30 on the mounting substrate 20 side into the slits 23 and 23 of the mounting substrate 20, and the mounting substrate 20. Therefore, the light emitted from the LED chip 10 can be prevented from leaking without passing through the color conversion member 30, and the alignment accuracy of the color conversion member 30 can be improved. As a structure for positioning and fixing the color conversion member 30 to the mounting substrate 20, the step portion 33 as shown in FIG. 11 described above is provided at the end portion of the color conversion member 30 on the mounting substrate 20 side, and the step portion. 33 may be adhered to the mounting substrate 20.

  By the way, the mounting substrate 20 in the present embodiment is formed with two communication ports 29 and 29 for communicating the space surrounded by the chip mounting portion 20a and the color conversion member 30 with the outside, as in the seventh embodiment. Yes. Here, the communication ports 29 and 29 are formed continuously to the slits 23 and 23, but may be provided apart from the slits 23 and 23.

  In manufacturing the surface-mounted light-emitting device 1 according to the present embodiment, one of the two communication ports 29 and 29 is connected to the sealing material (with respect to the space surrounded by the chip mounting portion 20a and the color conversion member 30). For example, the sealing part is used by curing the sealing material after injecting the sealing material into the space using the other one as an air outlet and using the other as an air outlet. Since the manufacturing method which forms 40 can be employ | adopted, it can suppress that a void generate | occur | produces in the sealing part 40 in a manufacture process, and can improve reliability and optical output.

  The mounting substrate 20 may be formed using a multilayer ceramic substrate, or may be configured with an MID substrate.

(Embodiment 11)
The basic configuration of the surface-mounted light-emitting device 1 of the present embodiment is substantially the same as that of the first embodiment. As shown in FIG. 17, the insulating substrate 21 of the mounting substrate 20 is configured by a multilayer ceramic substrate, and the LED chip 10. A storage recess 21a is formed, and a sheet-like color conversion member 30 is fixed to the mounting substrate 20 so as to close the storage recess 21a of the mounting substrate 20. In the surface-mounted light-emitting device 1 of the present embodiment, the LED chip 10 is a sealing portion (not shown) made of a transparent sealing material (for example, silicone resin) in the housing recess 21a of the mounting substrate 20. It is sealed by. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted. In FIG. 17, the wiring patterns 22 and 22 (see FIG. 1A) and the through-hole wirings 28 and 28 (see FIG. 1A) described in the first embodiment are not shown.

  In the surface-mounted light-emitting device 1 of this embodiment, the opening area of the storage recess 21a gradually increases as the distance from the inner bottom surface of the storage recess 21a increases, as in the conventional configuration shown in FIG. The inner surface of the recess 21a constitutes a reflection surface that reflects the light emitted from the LED chip 10 to the side to the front. In the surface-mounted light-emitting device 1 of the present embodiment, white light composed of the combined light of the light emitted from the LED chip 10 and the light emitted from the yellow phosphor of the color conversion member 30 is obtained. The sealing portion may contain a yellow phosphor, and a sheet-like protective member made of a translucent material may be employed instead of the color conversion member 30.

  By the way, the mounting substrate 20 in this embodiment formed the slits 23 and 23 in the ceramic sheet of the lowest layer (first layer) among the multilayer ceramic substrates constituting the insulating substrate 21, and formed the slits 23 and 23. The dimension in the longitudinal direction of the second ceramic sheet immediately above the first ceramic sheet is set to be shorter than the distance between the slits 23 of the first ceramic sheet. Thus, in the surface-mounted light-emitting device 1 of the present embodiment, similarly to the first embodiment, slits 23 and 23 intersecting the straight line connecting the external connection electrodes 25 and 25 are formed on the mounting substrate 20, and the straight line is formed. Since the mounting substrate 20 can be elastically deformed in the extending direction, there is a difference in elongation between the mounting substrate 20 and the wiring substrate 80 (see FIG. 1B) caused by a temperature change between when the light is turned off and when the light is turned on. Since the stress generated in the joints 90 and 90 (see FIG. 1B) due to the difference in linear expansion coefficient between the mounting substrate 20 and the wiring substrate 80 is relieved by the slits 23 and 23, the mounting substrate It is possible to prevent cracks from occurring in the joint portions 90, 90 connecting the 20 external connection electrodes 25, 25 and the conductor patterns 83, 83 of the wiring board 80.

1A is a schematic perspective view of a state mounted on a wiring board, and FIG. 2B is a schematic cross-sectional view of the state mounted on a wiring board. The same as the above, (a) is a schematic perspective view, (b) is a schematic plan view, and (c) is a schematic bottom view. It is a principal part schematic plan view of the other structural example same as the above. Embodiment 2 is shown, (a) is a schematic perspective view, (b) is a schematic plan view, and (c) is a schematic bottom view. Embodiment 3 is shown, (a) is a schematic perspective view, (b) is a schematic plan view, and (c) is a schematic bottom view. Embodiment 4 is shown, (a) is a schematic plan view, and (b) is a schematic cross-sectional view along A-A ′ of (a). FIG. 10 is a schematic cross-sectional view showing a fifth embodiment and mounted on a wiring board. It is a general | schematic disassembled perspective view which shows the same as the above. Embodiment 6 is shown, (a) is a schematic plan view, and (b) is a schematic cross-sectional view. Embodiment 7 is shown, (a) is a schematic sectional view, (b) is a schematic bottom view, and (c) is a schematic perspective view of a color conversion member. It is a schematic sectional drawing which shows the other structural example of the color conversion member in the same as the above. Embodiment 8 is shown, (a) is a schematic plan view, (b) is a schematic cross-sectional view of a state mounted on a wiring board. It is a schematic sectional drawing which shows the same as the above. Embodiment 9 is shown, (a) is a schematic plan view, (b) is an A-A 'schematic cross-sectional view of (a). FIG. 10 is a schematic sectional view showing Embodiment 10. It is a general | schematic disassembled perspective view which shows the same as the above. Embodiment 11 is shown, (a) is a schematic plan view, and (b) is a schematic sectional view. It is a schematic sectional drawing of the state mounted in the wiring board which shows a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Surface mount type light-emitting device 10 LED chip 20 Mounting board 20a Chip mounting part 20b Electrode formation part 20c Connection part 22 Wiring pattern 23 Slit 25 External connection electrode 28 Through-hole wiring 29 Communication port 30 Color conversion member 40 Sealing part 50 Reflection Member 80 Wiring board 83 Conductor pattern 90 Joint

Claims (8)

  An LED chip and a mounting board on which the LED chip is mounted are provided, and external connection electrodes formed at both ends in a specified direction on the mounting board and electrically connected to the LED chip are joined to the conductor pattern of the wiring board. A surface-mounted light-emitting device that is fixedly attached to the mounting board, wherein the mounting substrate is formed with a slit that intersects a straight line connecting the external connection electrodes, and is elastically deformable in a direction along the straight line. A surface-mount type light emitting device characterized.   2. The surface-mount type light emitting device according to claim 1, wherein the LED chip is disposed at an intermediate position in the prescribed direction, and the slits are formed on both sides of the LED chip in the prescribed direction. apparatus.   3. The surface-mount light-emitting device according to claim 2, wherein the slits are parallel to each other and have the same cut direction from the outer peripheral edge of the mounting substrate.   The mounting substrate has a chip mounting portion on which the LED chip is mounted disposed inside the electrode forming portion on which the external connection electrode is formed and is supported by the electrode forming portion via the connecting portion. 2. The surface mount light emitting device according to claim 1, wherein the slit is formed between the chip mounting portion and the electrode forming portion.   5. The surface-mount light-emitting device according to claim 4, wherein the mounting board is provided with two of the connecting portions spaced apart in the outer peripheral direction of the chip mounting portion.   A shape formed of a phosphor and a light-transmitting material that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip, and surrounds the LED chip between the mounting substrate The color conversion member disposed in the color conversion member, a sealing portion made of a transparent sealing material that seals the LED chip inside the color conversion member, and the color conversion member disposed side by side so as to surround the color conversion member 5. A reflection member that reflects the emitted light forward, and the reflection member is positioned on the mounting substrate by inserting an end portion on the mounting substrate side into the slit. Item 6. A surface-mounted light-emitting device according to Item 5.   A shape formed of a phosphor and a light-transmitting material that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip, and surrounds the LED chip between the mounting substrate And a color conversion member disposed in the color conversion member, and a sealing portion made of a transparent sealing material that seals the LED chip inside the color conversion member. 6. The surface mount type light emitting device according to claim 4, wherein the surface mount type light emitting device is inserted into a slit and positioned on the mounting substrate.   8. The surface-mount type light emitting device according to claim 7, wherein the mounting substrate is formed with at least two communication ports for communicating a space surrounded by the chip mounting portion and the color conversion member with the outside. apparatus.

Images