JP4960657B2 - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device enabling higher light output. <P>SOLUTION: The light-emitting device includes an LED chip 10, a mounting board 20 which has conductor patterns 23 and 23 for supplying power to the LED chip 10 and carries the mounted LED chip 10, a domelike optical member 60 which is fixed to the one surface side of the mounting board 20 to house the LED chip 10 between the optical member 60 and the mounting board 20, a sealing portion 50 composed of a transparent sealing resin that fills a space encircled with the optical member 60 and mounting board 20 to seal the LED chip 10, and a domelike color change member 70 which is so disposed as to encircle the optical member 60 on the one surface side of the mounting board 20. The mounting board 20 is provided with a plurality of resin pooling holes 27 between a part of one surface overlapping the mounting board 20 side edge of the optical member 60 and a part of one surface overlapping the mounting board 20 side edge of the color change member 70, where the resin pooling holes 27 pool the sealing resin leaking from the space when the optical member 60 is fixed to the mounting board 20. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to a light emitting device using an LED chip (light emitting diode chip).

  Conventionally, an LED chip and a fluorescent material that is excited by light emitted from the LED chip and emits light of a different emission color from the LED chip are combined with a light emitting color different from that of the LED chip. Research and development of light-emitting devices that emit mixed color light are performed in various places (for example, see Patent Document 1). In addition, as this kind of light emitting device, for example, a white light emitting device (generally a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized).

  In Patent Document 1, as an example of this type of light emitting device, as shown in FIG. 8, an LED chip 110, a mounting substrate 120 on which the LED chip 110 is mounted, and a convex lens arranged so as to overlap the LED chip 110. And a fluorescent material that emits light of a color different from the emission color of the LED chip 110 when covered by the light emitted from the LED chip 110 and covers the optical member 160 In this way, a device including a dome-shaped color conversion member (wavelength conversion member) 170 hermetically sealed to the mounting substrate 120 has been proposed.

  Here, the mounting substrate 120 is provided with a storage recess 123 for storing a part of the LED chip 110 and the optical member 160 on one surface, and the LED chip 110 is flip-chip mounted in the storage recess 123. . The light emitting device having the configuration shown in FIG. 8 includes a sealing portion 150 made of a sealing resin that seals the LED chip 110 stored in the storage recess 123 of the mounting substrate 120.

In addition, the light emitting device having the configuration shown in FIG. 8 overflows when the one surface of the mounting substrate 120 surrounds the housing recess 123 over the entire circumference and the housing recess 123 is filled with the sealing resin of the sealing portion 150. An annular groove 127 for storing the excess sealing resin is formed, and a portion of the color conversion member 170 on the side of the mounting substrate 120 is inserted into the groove 127 over the entire circumference to seal the groove 127. The mounting substrate 120 is fixed with resin.
JP 2005-158949 A

  By the way, in the light emitting device having the configuration shown in FIG. 8, since the annular concave groove 127 is formed on the one surface of the mounting substrate 120, bubbles (voids) are not generated in the sealing portion 150 during the manufacturing process. A large amount of sealing resin can be injected into the storage recess 123.

  However, each electrode of the LED chip 100 is flip-chip mounted so as to face the inner bottom surface of the housing recess 123 of the mounting substrate 120, and the convex lens-shaped optical member 160 is placed on the LED chip 100, so that the LED A part of the light radiated from the side surface of the chip 100 and incident on the inner side surface of the housing recess 123 is absorbed by the mounting substrate 120, the light extraction efficiency to the outside is lowered, and the light output is lowered.

  In the light emitting device having the configuration shown in FIG. 8, when the color conversion member 170 is fixed to the mounting substrate 120, the sealing resin in the concave groove 127 overflows and spreads on the mounting substrate 120. The light extraction efficiency as a whole of the light emitting device decreases and the light output decreases due to light absorption in the unnecessary portion made of the sealing resin or irregular reflection of light due to the unevenness of the unnecessary portion. Further, in the above-described light emitting device, an annular groove 127 is formed on the one surface of the mounting substrate 120 and a power supply conductor pattern (not shown) is provided on the other surface side. When used as a light source, it is necessary to mount the mounting board 120 on a circuit board and store it in the instrument body. Therefore, the thermal resistance from the light emitting part of the LED chip 110 to the instrument body increases, and the junction temperature of the LED chip 110 increases. Since it is necessary to limit the input power to the LED chip 110 so as not to exceed the maximum junction temperature, it is difficult to increase the light output.

  Further, since it is necessary to inject the sealing resin after the LED chip 110 and a part of the optical member 160 having a larger outer size than the LED chip 110 are stored in the storage recess 123 of the mounting substrate 120, the sealing portion In some cases, voids are generated in 150, the light extraction efficiency is lowered, and the light output is lowered.

  The present invention has been made in view of the above-described reasons, and an object thereof is to provide a light-emitting device capable of increasing the light output.

  An LED chip, a mounting substrate having a conductive pattern for supplying power to the LED chip on one surface side, the LED chip being mounted on the one surface side, and an optical member for controlling the light distribution of the light emitted from the LED chip The LED chip is filled in a space surrounded by the dome-shaped optical member fixed to the one surface side of the mounting substrate so as to house the LED chip between the mounting substrate and the optical member and the mounting substrate. A light-transmitting sealing resin and a light emitted from the LED chip that is excited by the light transmitted through the sealing part and the optical member to emit light of a color different from that of the LED chip. And a dome-shaped color conversion member disposed on the one surface side of the mounting substrate so as to surround the optical member. Optics on the surface When the optical member is fixed to the mounting substrate, the sealing resin overflowing from the space is accumulated between the portion overlapping the mounting substrate side edge and the color conversion member overlapping the mounting substrate side edge. A resin reservoir hole is provided.

  According to the present invention, the optical member for controlling the light distribution of the light emitted from the LED chip is formed in a dome shape, and is fixed to the one surface side of the mounting substrate in such a manner that the LED chip is housed between the mounting substrate and the LED member. Therefore, compared with conventional light emitting devices with mounting recesses that store part of the LED chip and optical member on the mounting board, the light absorption loss on the mounting board can be reduced and the light extraction efficiency to the outside can be reduced. In addition, the generation of voids in the sealing portion can be prevented and the light extraction efficiency to the outside can be increased, so that the light output can be increased. Moreover, when the optical member is fixed to the mounting substrate between the portion of the one surface of the mounting substrate that overlaps the mounting substrate side edge of the optical member and the portion of the color conversion member that overlaps the mounting substrate side edge. Since a resin reservoir hole for storing sealing resin overflowing from the space surrounded by the optical member and the mounting substrate is formed, the sealing resin stored in the resin reservoir hole causes the color conversion member to be mounted on the mounting substrate. Since it does not overflow when fixed, it can suppress the formation of an unnecessary portion made of sealing resin overflowing on the one surface of the mounting substrate, so light absorption at the unnecessary portion and the unnecessary It is possible to suppress a decrease in light extraction efficiency due to irregular reflection of light caused by the unevenness of the part, and to increase the light output. In addition, since it has a conductor pattern for feeding power to the LED chip on the one surface side of the mounting board, it becomes possible to thermally couple with the fixture body of the lighting fixture without mounting the mounting board on the circuit board, Since the heat resistance from the LED chip to the fixture body can be reduced, heat dissipation is improved, and the temperature rise of the junction temperature of the LED chip can be suppressed, the input power can be increased and the light output can be increased.

  According to a second aspect of the present invention, in the first aspect of the invention, the mounting substrate includes a heat transfer plate made of a heat conductive material on which the LED chip is mounted, and the LED chip in the heat transfer plate having the conductor pattern. A wiring board that is fixed to the mounting surface side of the heat transfer plate and that has a window hole that exposes the mounting surface of the LED chip in the heat transfer plate in the thickness direction, and the resin reservoir hole is a wiring board It is comprised by the through-hole penetrated by the board | substrate and the recessed part recessed by the heat-transfer board, It is characterized by the above-mentioned.

  According to this invention, the depth dimension of the resin reservoir hole can be increased, the amount of the sealing resin that can be stored in the resin reservoir hole can be increased, and the resin reservoir Since the sealing resin cured in the hole functions as a heat insulating portion that prevents heat transfer from the LED chip to the color conversion member, the temperature increase of the color conversion member due to heat generation of the LED chip can be suppressed. The decrease in the luminous efficiency of the phosphor due to the heat generation of the LED chip can be suppressed.

  According to a third aspect of the present invention, in the second aspect of the present invention, the LED chip includes a submount member that relieves stress acting on the LED chip due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate. It is mounted on the heat transfer plate.

  According to this invention, it is possible to prevent the LED chip from being damaged due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate, and to improve the reliability. The light emitted from the side surface of the LED chip can be prevented from being absorbed by the wiring board, and the light output can be increased.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, a plurality of the resin reservoir holes are provided apart from each other in the outer peripheral direction of the optical member.

  According to this invention, the plurality of the resin reservoir holes are provided apart from each other in the outer peripheral direction of the optical member, so that the one end surface of the mounting substrate has an edge on the mounting substrate side of the optical member. An unnecessary portion made of the sealing resin is formed on the one surface of the mounting substrate while shortening the distance between the overlapping portion and the portion overlapping the edge of the color conversion member on the mounting substrate side. Can be suppressed. In addition, it is possible to prevent the conductor pattern on the one surface side of the mounting substrate from being separated by the resin reservoir hole, and to reduce the resistance of the power supply path to the LED chip.

  According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the one surface side of the mounting substrate is disposed so as to cover the resin reservoir hole and prevents light absorption by the sealing resin in the resin reservoir hole. A ring-shaped light absorption preventing substrate is provided, and the light absorption preventing substrate has a white resist layer formed on the surface side opposite to the mounting substrate side.

  According to this invention, by providing the light absorption preventing substrate, it is possible to prevent light absorption by the sealing resin in the resin reservoir hole, and to increase the light output, and to absorb the light. Since the white resist layer is formed on the surface side of the prevention substrate, light absorption by the light absorption prevention substrate can be prevented, and the light output can be increased.

  According to the first aspect of the invention, there is an effect that the optical output can be increased.

  Hereinafter, the light-emitting device of this embodiment will be described with reference to FIGS.

  The light emitting device 1 of the present embodiment includes an LED chip 10, a rectangular plate-shaped mounting substrate 20 on which the LED chip 10 is mounted on one surface side, and an optical member that controls light distribution of light emitted from the LED chip 10. A dome-shaped optical member 60 made of a translucent material fixed to one surface side (the upper surface side in FIG. 1) of the mounting substrate 20 so as to house the LED chip 10 between the mounting substrate 20 and The LED chip 10 and a plurality of (four in this embodiment) bonding wires 14 which are filled in the space surrounded by the optical member 60 and the mounting substrate 20 and are electrically connected to the LED chip 10 are sealed. The LED chip 10 is excited by light emitted from the LED chip 10 and transmitted through the sealing part 50 and the optical member 60. It is formed of a phosphor that emits light of a color different from the light color and a light-transmitting material, and surrounds the LED chip 10 and the like between the mounting substrate 20 on the one surface side of the mounting substrate 20. And a dome-shaped color conversion member 70 disposed. Here, the color conversion member 70 is disposed so that an air layer 80 is formed between the light emitting surface 60 b of the optical member 60 on the one surface side of the mounting substrate 20.

  In addition, the light emitting device 1 according to the present embodiment includes a resin that includes a filler made of a filler such as silica or alumina on the other surface side of the mounting substrate 20 as a sheet-like bonding member 90 and has a low viscosity when heated. A sheet (for example, an organic green sheet such as an epoxy resin sheet highly filled with fused silica) is provided. Thus, when the light-emitting device 1 of the present embodiment is used as a light source of a lighting fixture, for example, a fixture main body 100 made of metal (for example, a metal having high thermal conductivity such as Al or Cu) in the lighting fixture (FIG. 2). 6 and FIG. 7) and the mounting substrate 20 can be joined by the joining member 90. Here, since the bonding member 90 made of the resin sheet has electrical insulation properties, heat conductivity is high, fluidity at the time of heating is high, and adhesion to the uneven surface is high, the mounting substrate 20 is made of a metal instrument. Joining to the main body 100 via the joining member 90 (the joining member 90 is heated between the mounting substrate 20 and the instrument main body 100 and then the joining member 90 is heated to thereby heat the mounting substrate 20 and the instrument main body 100. Can be prevented from generating gaps between the bonding member 90 and the mounting substrate 20 and the instrument main body 100, thereby preventing an increase in thermal resistance and variations due to insufficient adhesion. Compared to the conventional case where the light emitting device is mounted on a circuit board and a rubber sheet-like heat radiation sheet such as Sarcon (registered trademark) is sandwiched between the circuit board and the instrument body, the LED chip is used. Since the heat resistance from 10 to the instrument body 100 can be reduced to improve heat dissipation and the variation in thermal resistance is reduced, and the temperature rise of the junction temperature of the LED chip 10 can be suppressed, the input power can be increased, High output power can be achieved. In addition, when using the light-emitting device 1 of this embodiment as a light source of a lighting fixture, as shown in FIG. 6, the several light-emitting device 1 is mounted in the fixture main body 100, and the several light-emitting device 1 is connected in series. Or connect in parallel.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and uses an n-type SiC substrate having a lattice constant and a crystal structure close to GaN as compared to a sapphire substrate and having conductivity as a crystal growth substrate. In addition, a light emitting portion made of a GaN-based compound semiconductor material and having a laminated structure portion having a double hetero structure, for example, is grown on the main surface side of the SiC substrate by an epitaxial growth method (for example, MOVPE method). Here, in the LED chip 10, anode electrodes 13a (see FIGS. 3 and 4A) are formed at two adjacent corners on one surface side, and cathode electrodes 13b (see FIG. 3) are formed at the remaining two locations. And FIG. 4A) are formed.

  The mounting substrate 20 is made of a heat conductive material and has a rectangular plate-like heat transfer plate 21 on which the LED chip 10 is mounted, and a polyolefin-based fixing sheet 29 on one surface side (the upper surface side in FIG. 1) of the heat transfer plate 21. (Refer to FIG. 2) and a wiring board 22 made of a rectangular printed flexible printed wiring board fixed via (refer to FIG. 2), the mounting surface of the LED chip 10 on the heat transfer plate 21 at the center of the wiring board 22 (the above-mentioned one surface) A rectangular window hole 24 that exposes a part of the LED chip 10 is formed, and the LED chip 10 is mounted on the heat transfer plate 21 via a submount member 30 described later disposed inside the window hole 24. . Therefore, the heat generated in the LED chip 10 is transferred to the submount member 30 and the heat transfer plate 21 without passing through the wiring board 22. In this embodiment, Cu is adopted as the heat conductive material of the heat transfer plate 21, but not limited to Cu, for example, Al may be adopted. In the present embodiment, the LED chip 10 is mounted on the heat transfer plate 21 so that the light emitting portion of the LED chip 10 is further away from the heat transfer plate 21 than the crystal growth substrate. You may make it mount in the heat exchanger plate 21 so that it may become the side near the heat exchanger plate 21 rather than the board | substrate for crystal growth. In consideration of light extraction efficiency, it is desirable to arrange the light emitting part on the side away from the heat transfer plate 21, but in this embodiment, the crystal growth substrate and the light emitting part have the same refractive index. Therefore, even if the light emitting part is arranged on the side close to the heat transfer plate 21, the light extraction loss does not become too large.

  The above-mentioned wiring board 22 is provided with a pair of conductor patterns 23 and 23 for supplying power to the LED chip 10 on one surface side of an insulating base material 22a made of a polyimide film. A resist layer 26 made of a white resin covering a portion of the conductive base material 22a where the conductor patterns 23, 23 are not formed is laminated. Therefore, since the light emitted from the side surface of the LED chip 10 and incident on the surface of the resist layer 26 is reflected by the surface of the resist layer 26, the light emitted from the LED chip 10 is prevented from being absorbed by the wiring substrate 22. Thus, the light output can be improved by improving the light extraction efficiency to the outside. In addition, each conductor pattern 23 and 23 is formed in the outer periphery shape a little smaller than half of the outer periphery shape of the insulating base material 22a. Further, FR4, FR5, paper phenol or the like may be employed as the material of the insulating base material 22a.

  The resist layer 26 is patterned so that two portions of each of the conductor patterns 23 and 23 are exposed in the vicinity of the window hole 24 of the wiring substrate 22 and one portion of each of the conductor patterns 23 and 23 is exposed in the peripheral portion of the wiring substrate 22. In each conductor pattern 23, 23, two rectangular portions exposed in the vicinity of the window hole 24 of the wiring substrate 22 constitute a terminal portion 23 a to which the bonding wire 14 is connected. A circular portion exposed at the portion constitutes an electrode portion 23b for external connection. In this embodiment, as described above, the LED chip 10 having two anode electrodes 13 a and two cathode electrodes 13 b is used, and each anode electrode 13 a is connected to one conductor via the bonding wire 14. It is electrically connected to the pattern 73, and each cathode electrode 13 b is electrically connected to the other conductor pattern 73 via the bonding wire 14. The conductor patterns 23 and 23 of the wiring board 22 are constituted by a laminated film of a Cu film, a Ni film, and an Au film. In addition, a display of “+” is formed on the electrode portion 73b (the right electrode portion 73b in FIG. 7) to which the anode electrodes 13a of the LED chip 10 are electrically connected, of the two electrode portions 73b. Since the symbol “-” is formed on the electrode portion 73b (the left electrode portion 73b in FIG. 7) to which the ten cathode electrodes 13b are electrically connected, both electrode portions 73a and 73b in the light emitting device 1 are formed. Can be visually recognized, and erroneous connection can be prevented.

  In this embodiment, the window hole 24 in the wiring board 22 has a rectangular shape, and as shown in FIG. 4A, a terminal portion 23a is provided near the center of each side of the rectangular window hole 24. However, as shown in FIG. 4B, by providing the terminal portion 23a in the vicinity of one end of each side of the window hole 24, the entire length of the bonding wire 14 can be increased, and the expansion and contraction of the sealing portion 50 can be achieved. The bonding wire 14 is less likely to break due to the above, and the reliability is improved.

  By the way, the LED chip 10 is mounted on the heat transfer plate 21 via the above-described submount member 30 that relieves stress acting on the LED chip 10 due to a difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21. Has been. Here, the submount member 30 is formed in a rectangular plate shape having a size larger than the chip size of the LED chip 10.

  The submount member 30 has not only a function of relieving the stress but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 in the heat transfer plate 21. Yes. Therefore, in the light emitting device 1 of the present embodiment, since the LED chip 10 is mounted on the heat transfer plate 21 via the submount member 30, the heat generated in the LED chip 10 is transferred to the submount member 30 and the heat transfer plate 21. The heat acting on the LED chip 10 due to the difference in linear expansion coefficient between the LED chip 10 and the heat transfer plate 21 can be relieved.

  In the present embodiment, AlN having a relatively high thermal conductivity and insulating properties is employed as the material of the submount member 30, but the material of the submount member 30 is not limited to AlN, and the linear expansion coefficient is crystal growth. Any material may be used as long as it is relatively close to 6H—SiC, which is a material of the substrate for use, and has a relatively high thermal conductivity. For example, composite SiC, Si, Cu, or CuW may be employed. The LED chip 10 and the submount member 30 may be bonded using, for example, solder such as SnPb, AuSn, SnAgCu, or silver paste, but may be bonded using lead-free solder such as AuSn, SnAgCu. Preferably, when the submount member 30 is made of Cu and bonded using AuSn, a pretreatment is required in which a metal layer made of Au or Ag is formed in advance on the bonding surface of the submount member 30 and the LED chip. It is. Further, the submount member 30 and the heat transfer plate 21 are preferably bonded using, for example, lead-free solder such as AuSn or SnAgCu. However, when bonding using AuSn, the bonding in the heat transfer plate 21 is performed. A pretreatment for forming a metal layer made of Au or Ag in advance on the surface is necessary.

  In the light emitting device 1 of the present embodiment, the thickness dimension of the submount member 30 is set so that the surface of the submount member 30 is farther from the heat transfer plate 21 than the surface of the resist layer 26 of the wiring board 22. In addition, light emitted from the LED chip 10 to the side can be prevented from being absorbed by the wiring board 22 through the inner peripheral surface of the window hole 24 of the wiring board 22. In addition, if a reflective film that reflects the light emitted from the LED chip 10 is formed around the bonding portion with the LED chip 10 on the surface of the submount member 30 on the side to which the LED chip 10 is bonded, the LED chip 10 is formed. It is possible to prevent the light radiated from the side surface from being absorbed by the submount member 30 and to further increase the light extraction efficiency to the outside. Here, the reflective film may be formed of, for example, a laminated film of a Ni film and an Ag film.

  As the sealing resin that is the material of the sealing portion 50 described above, a silicone resin is used. However, the sealing resin is not limited to the silicone resin, and for example, an acrylic resin may be used.

  The optical member 60 is a molded product of a translucent material (for example, silicone) and is formed in a dome shape. Here, in this embodiment, since the optical member 60 is formed of a silicone molded product, the refractive index difference and the linear expansion coefficient difference between the optical member 60 and the sealing portion 50 can be reduced. In addition, when the material of the sealing part 50 is an acrylic resin, it is preferable to form the optical member 60 also with an acrylic resin.

  By the way, the optical member 60 has a light emitting surface 60b formed in a convex curved surface shape that does not totally reflect the light incident from the light incident surface 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. 10 and the optical axis coincide with each other. Therefore, the light emitted from the LED chip 10 and incident on the light incident surface 60a of the optical member 60 can easily reach the color conversion member 70 without being totally reflected at the boundary between the light emitting surface 60b and the air layer 80, The total luminous flux can be increased. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50, the optical member 60, and the air layer 80 to reach the color conversion member 70 to excite the phosphor of the color conversion member 70 or to the phosphor. Passes through the color conversion member 70 without colliding. Further, the optical member 60 is formed so that the thickness is uniform along the normal direction regardless of the position.

  The color conversion member 70 is formed of a mixture in which a translucent material such as silicone is mixed with a particulate yellow phosphor that emits broad yellow light when excited by the blue light emitted from the LED chip 10. (That is, the color conversion member 70 contains a phosphor). Therefore, in the light emitting device 1 of the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70b of the color conversion member 70, and white light is obtained. Can do. The translucent material used as the material of the color conversion member 70 is not limited to silicone. For example, an organic / inorganic hybrid material in which an acrylic resin, glass, an organic component and an inorganic component are mixed and combined at the nm level or the molecular level. Etc. may be adopted. Further, the phosphor mixed with the translucent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, the color conversion member 70 has an inner surface 70 a formed along the light emitting surface 60 b of the optical member 60. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the optical member 60. In addition, the color conversion member 70 is shape | molded so that the thickness along a normal line direction may become uniform irrespective of a position. In addition, the color conversion member 70 may be fixed to the mounting substrate 20 with an end edge (periphery of the opening) on the mounting substrate 20 side using, for example, an adhesive (for example, silicone resin, epoxy resin).

  By the way, in the manufacturing method of the light-emitting device 1 described above, for example, after the LED chip 10 and each of the conductor patterns 23 and 23 are electrically connected through two bonding wires 14, respectively, as shown in FIG. A part of the sealing portion 50 is placed in the gap between the submount member 30 and the wiring board 22 so that the tip of the nozzle 401 of the dispenser 400 is aligned with the resin injection hole 28 formed continuously from the window hole 24 of the wiring board 22. The liquid sealing resin (for example, silicone resin) to be used is injected and cured, and then the liquid sealing resin (the remaining portion of the sealing portion 50 described above is formed inside the dome-shaped optical member 60. For example, after the silicone resin is injected, the optical member 60 is disposed at a predetermined position on the mounting substrate 20 and the sealing resin is cured to form the sealing portion 50 at the same time. A manufacturing method in which the academic member 60 is fixed to the mounting substrate 20 and then the color conversion member 70 is fixed to the mounting substrate 20 is conceivable. However, even in such a manufacturing method, bubbles ( Therefore, it is necessary to inject a large amount of liquid sealing resin into the optical member 60.

  However, when such a manufacturing method is adopted, when the optical member 60 is arranged at the predetermined position on the mounting substrate 20, a part of the liquid sealing resin is from a space surrounded by the optical member 60 and the mounting substrate 20. Overflowing and spreading on the surface of the resist layer 76, the light emitting device 1 as a whole is caused by light absorption at an unnecessary portion made of the overflowing sealing resin or irregular reflection of light caused by unevenness of the unnecessary portion. It is conceivable that the light extraction efficiency decreases.

  Therefore, in the light emitting device 1 of the present embodiment, between the portion overlapping the ring-shaped end edge of the optical member 60 and the portion overlapping the ring-shaped end edge of the color conversion member 70 on the one surface of the mounting substrate 20, A plurality of resin reservoir holes 27 for storing the sealing resin overflowing from the space surrounded by the optical member 60 and the mounting substrate 20 are formed apart from each other in the outer peripheral direction of the optical member 60. Here, the resin reservoir hole 27 includes a through hole 27 a formed in the wiring substrate 22 and a recess 27 b formed in a portion corresponding to the through hole 27 a in the heat transfer plate 21, and the thickness of the wiring substrate 22. Even if the thickness of the resin reservoir hole 27 is reduced, the depth dimension of the resin reservoir hole 27 can be increased, and the amount of sealing resin that can be stored in the resin reservoir hole 27 can be increased. Since the sealing resin cured in step 1 functions as a heat insulating portion that prevents heat transfer from the LED chip 10 to the color conversion member 70, the temperature increase of the color conversion member 70 due to heat generation of the LED chip 10 can be suppressed. A decrease in the luminous efficiency of the phosphor due to the heat generation of the chip 10 can be suppressed.

  Further, in the light emitting device 1 of the present embodiment, the one surface side of the mounting substrate 20 is between the portion overlapping the ring-shaped end edge of the optical member 60 and the portion overlapping the ring-shaped end edge of the color conversion member 70. A ring-shaped light absorption preventing substrate 40 that is disposed and covers each resin reservoir hole 27 is provided, and light absorption by a resin portion made of a sealing resin that has accumulated and cured in each resin reservoir hole 27 This can be prevented by the absorption preventing substrate 40. Here, the light absorption preventing substrate 40 is provided with a white resist layer that reflects light from the LED chip 10 and the color conversion member 70 on the surface side opposite to the mounting substrate 20 side. Light absorption can be prevented. The light absorption preventing substrate 40 is filled with the sealing resin overflowing when the optical member 60 is arranged at a predetermined position on the mounting substrate 20 in each resin reservoir hole 27, and What is necessary is just to mount on the said one surface side, and when hardening sealing resin after that, it will adhere to the mounting board | substrate 20 with sealing resin. Here, the ring-shaped light absorption preventing substrate 40 is formed with a plurality of notches 42 for exposing the minute regions of the resin reservoir holes 27, and the sealing resin in the resin reservoir holes 27 is cured. It is possible to prevent voids from being generated.

  In the light emitting device 1 of the present embodiment, the thickness dimension of the submount member 30 is set such that the surface of the submount member 30 is farther from the heat transfer plate 21 than the one surface of the wiring substrate 22 (the surface of the resist layer 26). Thus, the light emitted from the LED chip 10 to the side can be prevented from being absorbed by the wiring board 22 and the light output can be increased.

  By the way, in the above-described lighting fixture using the light emitting device 1 of the present embodiment as a light source, as shown in FIGS. 6 and 7, the wiring pattern 202 that defines the connection relationship of each light emitting device 1 is the insulating base material 201. A circuit board 200 formed on one surface side is provided. In the present embodiment, the plurality of light emitting devices 1 are connected in series. However, the connection relationship between the plurality of light emitting devices 1 is not particularly limited. For example, the light emitting devices 1 may be connected in parallel or connected in series. And parallel connection may be combined.

  The circuit board 200 is disposed in the shallow bottomed cylindrical instrument body 100 so as to be separated from the bottom wall 100a of the instrument body 100, and the circuit board 200 is disposed at a position corresponding to each light-emitting device 1 respectively. An aperture window 204 through which a part passes is formed. In addition, as a material of the insulating base material 201 of the circuit board 200, for example, a glass epoxy resin such as FR4 may be adopted, but not limited to a glass epoxy resin, for example, a polyimide resin, a phenol resin, or the like may be used. . In addition, the shape of the instrument main body 100 is not specifically limited, For example, flat form may be sufficient.

  The circuit board 200 described above is provided with a wire insertion hole 206 through which a lead wire for power supply inserted through the insertion hole 100c formed in the bottom wall 100a of the instrument body 100 is inserted. A pair of electric wires inserted through 206 is electrically connected. Further, the circuit board 200 has a light reflecting layer 203 made of a white resist layer formed on the surface side opposite to the bottom wall 100 a side of the instrument body 100, and most of the wiring pattern 202 is the light reflecting layer 203. Covered by.

  In the circuit board 200, the opening size of each opening window 204 is set to be slightly larger than the planar size of the mounting substrate 20 in the light emitting device 1. Here, in the light emitting device 1 of the present embodiment, the chamfered portions are formed and rounded at the four corners in the plan view of the mounting substrate 20, but the chamfered portions in the vicinity of each electrode portion 23b (the left and right chamfered portions in FIG. 3), the radius of curvature of the remaining two chamfered portions (upper and lower chamfered portions in FIG. 3) is increased, so that the area of the area where the wiring pattern 202 can be formed on the one surface side of the circuit board 200 is increased. can do. In addition, in order to prevent an overvoltage from being applied to the LED chip 10 of the light emitting device 1, the circuit board 200 has a surface mount type Zener diode 231 (see FIG. 7) for preventing overvoltage and a surface mount type ceramic. A capacitor 232 is mounted in the vicinity of each opening window 204.

  By the way, in the light-emitting device 1 of this embodiment, each electrode part 23b of the mounting board | substrate 20 is electrically connected with the wiring pattern 202 of the circuit board 200 via the terminal board 210. FIG. Here, the terminal plate 210 forms a terminal piece 211 that is joined to the wiring pattern 202 by using solder or the like so as to overlap the wiring pattern 202 by bending one end of an elongated metal plate into an L shape. The other end portion is bent in a J shape to form a terminal piece 212 to be joined to the electrode portion 23b using solder or the like so that the thickness direction coincides with the electrode portion 23b. It is possible to relieve the stress generated at the joint between the connection terminal 210 and the electrode part 23b and the wiring pattern 202 due to the difference in linear expansion coefficient between the light emitting device 1 and the circuit board 200. Connection reliability can be improved.

  Moreover, in the light-emitting device 1 of this embodiment, since the planar size of the sheet-like joining member 90 is set larger than the planar size of the heat transfer plate 21, the joining member 90 and the heat transfer plate 21 are the same. Compared with the case where it is formed in a planar size, the creeping distance between the heat transfer plate 21 and the appliance body 100 that is a metal member can be increased, and lightning surge resistance when used as a light source for a lighting fixture can be increased. (However, the creepage distance between the light emitting device and the metal member, which is generally required for indoor lighting fixtures and outdoor lighting fixtures, is different, and outdoor lighting fixtures have longer creepage distances. As required). Here, the thickness of the sheet-like joining member 90 needs to be designed in accordance with the lightning surge resistance required withstand voltage, but it is desirable to set it thinner from the viewpoint of reducing thermal resistance. Therefore, regarding the joining member 90, after setting the thickness, the planar size may be set so that the creepage distance requirement can be satisfied.

  In the light emitting device 1 of the present embodiment described above, the optical member 60 that controls the light distribution of the light emitted from the LED chip 10 is formed in a dome shape, and the LED chip 10 is accommodated between the mounting substrate 20. Since it is fixed to the one surface side of the mounting substrate 20, the mounting substrate 120 is mounted as compared with a light emitting device in which the mounting substrate 120 is provided with a storage recess 123 for storing a part of the LED chip 110 and the optical member 160 as in the past. The light absorption loss in the substrate 20 can be reduced and the light extraction efficiency to the outside can be increased, and the occurrence of voids in the sealing portion 50 can be prevented and the light extraction efficiency to the outside can be increased. As a result, the optical output can be increased.

  Also, a resin reservoir hole 27 is formed between a portion of the one surface of the mounting substrate 20 that overlaps the edge of the optical member 60 on the mounting substrate 20 side and a portion of the color conversion member 70 that overlaps the edge of the mounting substrate 20 side. As a result, the sealing resin stored in the resin reservoir hole 27 does not overflow when the color conversion member 70 is fixed to the mounting substrate 20, and the sealing overflows on the one surface of the mounting substrate 20. Since it is possible to suppress the formation of an unnecessary portion made of a stop resin, it is possible to suppress a decrease in light extraction efficiency due to light absorption at the unnecessary portion or irregular reflection of light due to unevenness of the unnecessary portion. It is possible to increase the optical output.

  Moreover, since the light-emitting device 1 of this embodiment has the conductor patterns 23 and 23 for the electric power feeding to the LED chip 10 in the said one surface side of the mounting board | substrate 20, mounting board | substrate 20 is mounted in a circuit board. Since it is possible to thermally couple with the fixture body 100 of the lighting fixture, the thermal resistance from the LED chip 10 to the fixture body 100 can be reduced, the heat dissipation is improved, and the temperature rise of the junction temperature of the LED chip 10 can be suppressed. The input power can be increased and the optical output can be increased.

  Here, in the light emitting device 1 of the present embodiment, since the plurality of resin reservoir holes 27 are provided apart from each other in the outer peripheral direction of the optical member 60, the optical member 60 is mounted on the one surface of the mounting substrate 20. The surface of the mounting substrate 20 is made of a sealing resin while shortening the distance between the portion overlapping the edge on the substrate 20 side and the portion overlapping the edge on the mounting substrate 20 side of the color conversion member 70. Unnecessary portions can be prevented from being formed, and the conductor patterns 23 and 23 can be prevented from being separated by the resin reservoir holes 27, thereby reducing the resistance of the power supply path to the LED chip 10. Can be planned.

  In the above-described embodiment, a blue LED chip whose emission color is blue is used as the LED chip 10 and a SiC substrate is used as the crystal growth substrate. However, a GaN substrate or sapphire is used instead of the SiC substrate. A substrate may be used, and when a SiC substrate or a GaN substrate is used, the crystal growth substrate has a higher thermal conductivity than the case where a sapphire substrate, which is an insulator, is used as the crystal growth substrate. The thermal resistance of the circuit board can be reduced. In addition, the above-described LED chip 10 is provided with the anode electrode 13a and the cathode electrode 13b on one surface side, but is provided with one of the anode electrode 13a and the cathode electrode 13b on the one surface side and the other surface. The other electrode may be provided on the side, and when an insulator such as AlN or composite SiC is adopted as the submount member 30, for example, the other surface is disposed on the surface of the submount member 30 on the LED chip 10 side. An appropriate electrode pattern to be bonded to the other electrode is provided, and the other electrode and the conductor pattern 23 may be electrically connected via the electrode pattern and the bonding wire 14. Moreover, although the anode electrode 13a and the cathode electrode 13b are provided in the LED chip 10 2 each, the number of these is not specifically limited. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. In addition, when the difference in linear expansion coefficient between the LED chip 10 and the mounting substrate 20 is relatively small, the submount member 30 described in the above embodiment is not necessarily provided.

It is a schematic sectional drawing of the light-emitting device which shows embodiment. It is a principal part schematic disassembled perspective view of the lighting fixture using the light-emitting device same as the above. It is explanatory drawing of the manufacturing method of a light-emitting device same as the above. It is principal part explanatory drawing of a light-emitting device same as the above. It is a general | schematic disassembled perspective view of a light-emitting device same as the above. It is a principal part schematic disassembled perspective view of the lighting fixture using the light-emitting device same as the above. It is a principal part schematic perspective view of the lighting fixture using the light-emitting device same as the above. A prior art example is shown, (a) is a schematic cross-sectional view, and (b) is a schematic plan view of an essential part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 LED chip 14 Bonding wire 20 Mounting board 21 Heat-transfer board 22 Wiring board 23 Conductive pattern 26 Resist layer 27 Resin reservoir hole 27a Through-hole 27b Recess 30 Submount member 40 Light absorption prevention board 50 Sealing part 60 Optical member 70 Color conversion member

Claims (5)

  An LED chip, a mounting substrate having a conductive pattern for supplying power to the LED chip on one surface side, the LED chip being mounted on the one surface side, and an optical member for controlling the light distribution of the light emitted from the LED chip The LED chip is filled in a space surrounded by the dome-shaped optical member fixed to the one surface side of the mounting substrate so as to house the LED chip between the mounting substrate and the optical member and the mounting substrate. A light-transmitting sealing resin and a light emitted from the LED chip that is excited by the light transmitted through the sealing part and the optical member to emit light of a color different from that of the LED chip. And a dome-shaped color conversion member disposed on the one surface side of the mounting substrate so as to surround the optical member. Optics on the surface When the optical member is fixed to the mounting substrate, the sealing resin overflowing from the space is accumulated between the portion overlapping the mounting substrate side edge and the color conversion member overlapping the mounting substrate side edge. A light-emitting device, wherein a resin reservoir hole is provided.   The mounting substrate is a heat transfer plate made of a heat conductive material on which the LED chip is mounted, and a wiring substrate having the conductor pattern and fixed to the mounting surface side of the LED chip on the heat transfer plate. A window hole exposing the mounting surface of the LED chip in the hot plate is formed of a wiring board penetrating in the thickness direction, and the resin reservoir hole is formed in the through hole penetrating the wiring board and the heat transfer plate. The light-emitting device according to claim 1, wherein the light-emitting device comprises a recessed portion provided in a recessed manner.   The LED chip is mounted on the heat transfer plate via a submount member that relieves stress acting on the LED chip due to a difference in linear expansion coefficient between the LED chip and the heat transfer plate. The light emitting device according to claim 2.   4. The light emitting device according to claim 1, wherein a plurality of the resin reservoir holes are provided apart from each other in an outer peripheral direction of the optical member. A ring-shaped light absorption preventing substrate disposed on the one surface side of the mounting substrate so as to cover the resin reservoir hole and preventing light absorption by the sealing resin in the resin reservoir hole; 5. The light emitting device according to claim 4, wherein the prevention substrate has a white resist layer formed on a surface side opposite to the mounting substrate side.

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