CN205071464U - Pad - Google Patents
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- CN205071464U CN205071464U CN201520623553.2U CN201520623553U CN205071464U CN 205071464 U CN205071464 U CN 205071464U CN 201520623553 U CN201520623553 U CN 201520623553U CN 205071464 U CN205071464 U CN 205071464U
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- pad
- pad body
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- millimeters
- soldering paste
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Abstract
The utility model relates to a pad, include: at least pad body more than two, each the pad body separates each other. This pad have a welding effectual, can not produce the hydro -planing when the reflow soldering, be difficult for arousing that the soldering paste is piled up, simple process and the high advantage of reliability of an item.
Description
Technical field
The utility model relates to printed circuit board technology field, particularly relates to a kind of pad.
Background technology
Along with the development of electronic information technology, printed circuit board in electronic applications owing to having that integrated level is high, volume is little and lightweight etc. feature and being widely used.
Pad is the important component part of printed circuit board, and it is for welding component.When suppressing circuit board and mechanical part will realize electrical connection, by being positioned on the pad bottom this suppression circuit board after Printing Paste, forming solder joint to realize the electrical connection between this printed circuit board and mechanical part through Reflow Soldering.But existing pad mostly is large bonding pad, in the process of carrying out Reflow Soldering, often in soldering paste, there is much gas, thus pore can be produced on the surface of soldering paste, cause the drawback of welding effect difference.
Utility model content
For the problems referred to above, according to the utility model proposes a kind of pad, comprising: at least plural pad body, each described pad body is spaced apart from each other.As can be seen here, the pad in the application includes multiple pad body, and like this, just an existing large scale pad is divided into multiple pad body, namely the gross area of multiple pad body approximates the gross area of an existing large scale pad.Thus, just avoid when the large scale pad bottom printed circuit board is welded with the hot weld dish on circuit board, due to can gas be had in large scale pad, and not easily to outdiffusion, the surface of soldering paste is caused to have pore, namely produce hydro-planing, thus make this large scale pad can take inventory drawback in welding effect difference with the hot weld on circuit board.
Preferably, the spacing magnitude range between each described pad body is for being more than or equal to 0.1 millimeter and being less than or equal to 0.2 millimeter.Like this, between each pad body, be just configured with the passage of supplied gas flowing, thus decrease the generation of the pore in the soldering paste be deposited on each pad body.Meanwhile, owing to being configured with passage between each pad body, therefore, be also beneficial to the heat radiation of soldering paste, greatly increase the thermal diffusivity of soldering paste.In addition, make the spacing magnitude range between each pad body for being more than or equal to 0.1 millimeter and being less than or equal to 0.2 millimeter, thus can welding effect be ensured, avoid the spacing between adjacent soldering paste body excessive, cause the drawback taken up room, and spacing between avoiding due to adjacent soldering paste body is too small, causes the soldering paste on each pad body to be connected, thus the drawback be short-circuited.
Preferably, described pad comprises the first pad body and the second pad body, the center alignment of described first pad body and described second pad body.So just, the solderability of this pad can be ensured.Meanwhile, also avoid when limited space, due to the first pad body and the second pad body, skewness in the plane residing for it, causes the drawback cannot placing miscellaneous part.
Preferably, described pad also comprises the 3rd pad body and the 4th pad body, and described first pad body, described second pad body, described 3rd pad body and described 4th pad body are uniformly distributed in residing plane.Like this, just greatly reduce soldering paste and floating phenomenon occurs, improve the solderability of the pad in the application.
Preferably, described pad body is rectangle or square.Like this, because existing large scale pad is generally rectangle or square, thus, be square or rectangle by this pad body design, be then convenient to the segmentation of this pad body.
Preferably, the magnitude range of the length of each described pad body is for being more than or equal to 2.6 millimeters and being less than or equal to 2.7 millimeters, and the magnitude range of width is for being more than or equal to 2.6 millimeters and being less than or equal to 2.7 millimeters.
According to the utility model, this pad tool welding effect is good, can not produce hydro-planing when Reflow Soldering, not easily cause the advantage that soldering paste stacking, technique reliability that is simple and product is high.In addition, the pad in the application also has that structure is simple, the production cost of saving printed board, the speed production cycle, solderability is strong and thermal diffusivity is good advantage.
Accompanying drawing explanation
Also will be described in more detail the utility model with reference to accompanying drawing based on embodiment hereinafter.In the drawings:
Fig. 1 is the overall structure schematic diagram of embodiment of the present utility model.
In the accompanying drawings, identical parts use identical Reference numeral.Accompanying drawing is not according to the scaling of reality.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, Fig. 1 show schematically show this pad 100 and comprises pad body 1.
In the embodiment of the application, this pad 100 comprises at least plural pad body 1, and each pad body 1 is spaced apart from each other.As can be seen here, the pad 100 in the application includes multiple pad body 1, and like this, just an existing large scale pad is divided into multiple pad body 1, namely the gross area of multiple pad body 1 approximates the gross area of an existing large scale pad.Thus, just avoid when the large scale pad bottom printed circuit board is welded with the hot weld dish on circuit board, due to can gas be had in large scale pad, and not easily to outdiffusion, the surface of soldering paste is caused to have pore, namely produce hydro-planing, thus make this large scale pad can take inventory drawback in welding effect difference with the hot weld on circuit board.
In addition, because the pad 100 in the application comprises multiple pad body 1, the area of each pad body 1 is all less than the area of existing large scale pad, thus the solder paste amounts that each pad body 1 is shared also is less than the solder paste amounts of large scale pad.Further, avoid because solder paste amounts is too much, soldering paste overflows, thus causes the drawback of short circuit.
In a preferred embodiment, the spacing magnitude range between each pad body 1 is for being more than or equal to 0.1 millimeter and being less than or equal to 0.2 millimeter.Like this, between adjacent pad body 1, be just configured with the passage 2 of supplied gas flowing, thus decrease the generation probability of the pore in the soldering paste be deposited on each pad body 1.Meanwhile, owing to being configured with passage 2 between each pad body 1, therefore, be also beneficial to the heat radiation of soldering paste, greatly increase the thermal diffusivity of soldering paste.
In addition, make the spacing magnitude range between each pad body 1 for being more than or equal to 0.1 millimeter and being less than or equal to 0.2 millimeter, thus can welding effect be ensured, avoid the spacing between adjacent pad body 1 excessive, cause the drawback taken up room, and spacing between avoiding due to adjacent pad body 1 is too small, causes the soldering paste on each pad body 1 to be connected, thus the drawback be short-circuited.
As shown in Figure 1, in a preferred embodiment, this pad 100 comprises the center alignment of the first pad body 3 and the second pad body 4, first pad body 3 and the second pad body 4.In a specific embodiment, this first pad body 3 and the second pad body 4 symmetrically formula are arranged.So just, the solderability of this pad 100 can be ensured.Meanwhile, also avoid when limited space, due to skewness in the first pad body 3 and the plane of the second pad body 4 residing for it, cause the drawback cannot placing miscellaneous part.
In a preferred embodiment, this pad 100 also comprises the 3rd pad body 5 and the 4th pad body 6, first pad body 3, second pad body 4, the 3rd pad body 5 and the 4th pad body 6 are uniformly distributed in residing plane.Namely the first pad body 3, second pad body 4, the 3rd pad body 5 and the 4th pad body 6 are equally distributed in the plane residing for it.As can be seen here, when guaranteeing the size constancy of original large scale pad, with the center of this large scale pad for initial point, be spaced apart 0.1 millimeter to 0.2 millimeter four the pad bodies 1 launched, thus above-mentioned passage 2 is formed between adjacent pad body 1, meanwhile, original solder paste amounts is divided into four parts.Like this, just greatly reduce soldering paste and floating probability occurs, improve the solderability of the pad 100 in the application.
As shown in Figure 1, in a preferred embodiment, this pad body 1 is rectangle or square.Like this, because existing large scale pad is generally rectangle or square, thus, this pad body 1 is designed to square or rectangle, is then convenient to the segmentation of this pad body 1.
In a preferred embodiment, the magnitude range of the length of each pad body 1 is for being more than or equal to 2.6 millimeters and being less than or equal to 2.7 millimeters, and the magnitude range of width is for being more than or equal to 2.6 millimeters and being less than or equal to 2.7 millimeters.But the concrete size of each pad body 1 can need specifically to determine according to the design of reality.
In sum, the pad 100 in the application have welding effect good, hydro-planing can not be produced when Reflow Soldering, not easily cause the advantage that soldering paste stacking, technique reliability that is simple and product is high.In addition, the pad 100 in the application also has that structure is simple, the production cost of saving printed board, the speed production cycle, solderability is strong and thermal diffusivity is good advantage.
Although be described the utility model with reference to preferred embodiment, when not departing from scope of the present utility model, various improvement can be carried out to it and parts wherein can be replaced with equivalent.Especially, only otherwise there is structural hazard, the every technical characteristic mentioned in each embodiment all can combine in any way.The utility model is not limited to specific embodiment disclosed in literary composition, but comprises all technical schemes fallen in the scope of claim.
Claims (5)
1. a pad, is characterized in that, comprising:
At least plural pad body, each described pad body is spaced apart from each other;
Spacing magnitude range between each described pad body for being more than or equal to 0.1 millimeter and being less than or equal to 0.2 millimeter, and is configured with the passage of supplied gas flowing between adjacent described pad body.
2. pad according to claim 1, is characterized in that, described pad comprises the first pad body and the second pad body, the center alignment of described first pad body and described second pad body.
3. pad according to claim 2, it is characterized in that, described pad also comprises the 3rd pad body and the 4th pad body, and described first pad body, described second pad body, described 3rd pad body and described 4th pad body are uniformly distributed in residing plane.
4. pad according to claim 1, is characterized in that, described pad body is rectangle or square.
5. pad according to claim 4, is characterized in that, the magnitude range of the length of each described pad body is for being more than or equal to 2.6 millimeters and being less than or equal to 2.7 millimeters, and the magnitude range of width is for being more than or equal to 2.6 millimeters and being less than or equal to 2.7 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520623553.2U CN205071464U (en) | 2015-08-18 | 2015-08-18 | Pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520623553.2U CN205071464U (en) | 2015-08-18 | 2015-08-18 | Pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071464U true CN205071464U (en) | 2016-03-02 |
Family
ID=55397960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520623553.2U Active CN205071464U (en) | 2015-08-18 | 2015-08-18 | Pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071464U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793456A (en) * | 2016-12-15 | 2017-05-31 | 宁波央腾汽车电子有限公司 | A kind of pad structure |
| WO2019007034A1 (en) * | 2017-07-03 | 2019-01-10 | 京东方科技集团股份有限公司 | Circuit board, electrical element and display device |
| CN110958768A (en) * | 2019-12-25 | 2020-04-03 | 浪潮商用机器有限公司 | PCB (printed circuit board) bonding pad and manufacturing method thereof |
| CN114096078A (en) * | 2021-11-25 | 2022-02-25 | 四川九洲电器集团有限责任公司 | Preparation method of printed board protective cover of device without high temperature resistance, protective cover and application |
-
2015
- 2015-08-18 CN CN201520623553.2U patent/CN205071464U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106793456A (en) * | 2016-12-15 | 2017-05-31 | 宁波央腾汽车电子有限公司 | A kind of pad structure |
| WO2019007034A1 (en) * | 2017-07-03 | 2019-01-10 | 京东方科技集团股份有限公司 | Circuit board, electrical element and display device |
| US10779410B2 (en) | 2017-07-03 | 2020-09-15 | Beijing Boe Optoelectronics Technology Co., Ltd. | Circuit board, electronic component and display apparatus |
| CN110958768A (en) * | 2019-12-25 | 2020-04-03 | 浪潮商用机器有限公司 | PCB (printed circuit board) bonding pad and manufacturing method thereof |
| CN114096078A (en) * | 2021-11-25 | 2022-02-25 | 四川九洲电器集团有限责任公司 | Preparation method of printed board protective cover of device without high temperature resistance, protective cover and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |