CN114096078A - Preparation method of printed board protective cover of device without high temperature resistance, protective cover and application - Google Patents
Preparation method of printed board protective cover of device without high temperature resistance, protective cover and application Download PDFInfo
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- CN114096078A CN114096078A CN202111412593.9A CN202111412593A CN114096078A CN 114096078 A CN114096078 A CN 114096078A CN 202111412593 A CN202111412593 A CN 202111412593A CN 114096078 A CN114096078 A CN 114096078A
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- protective cover
- high temperature
- printed board
- temperature resistant
- resist high
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
The invention discloses a preparation method of a printed board protective cover of a device which does not resist high temperature, a protective cover and application, wherein the method comprises the following steps: selecting an additive protection material of the protective cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and the reflow soldering heat transfer principle; according to the convection heat transfer model, constructing a size model of a protective cover of a device which does not resist high temperature on the printed board through thermal simulation; obtaining the size of the protective cover of the non-high temperature resistant device on the printed board according to the size model of the protective cover of the non-high temperature resistant device; according to the size of the protective cover of the device which does not resist high temperature, a welding disc is arranged on the printed board, and the protective cover is welded on the periphery of the device which does not resist high temperature of the printed board through the welding disc. According to the invention, according to the heat transfer principle and the characteristics of the reflow soldering process, the design idea of reducing the temperature of the device which cannot resist high temperature in the reflow soldering process is adopted by adopting the additive protection technology, so that the defect that the device which cannot resist high temperature is not suitable for the reflow soldering process is effectively overcome, and the consistency, the production efficiency and the product quality of the printed board assembly product are improved.
Description
Technical Field
The invention relates to the technical field of reflow soldering processes, in particular to a manufacturing method of a printed board protective cover of a device which does not resist high temperature, a protective cover and application.
Background
The reflow soldering process is a core process for printed board assembly, and due to the design and process technology level of part of domestic chip manufacturers, part of domestic devices cannot resist high temperature, and the compatibility of the lead reflow soldering process is poor; particularly, the lead-containing process is adopted for packaging devices of some domestic military product chips, the chip welding can only adopt manual welding, the production efficiency of products is reduced, and the welding quality and the reliability of the chips are difficult to ensure.
Along with the large-scale application of the domestic chip devices, more and more QFP and QFN packaging domestic devices which do not resist high temperature appear on the printed board assembly, and most of the existing devices which do not resist high temperature are installed on the printed board assembly in a manual welding mode so as to ensure that the devices do not bear overhigh temperature impact and ensure that the devices normally work. However, the manual soldering of such devices has the following problems: 1. manual welding cannot weld a bottom thermal pad of the device, grounding of the bottom pad of the device cannot be guaranteed, particularly an A/D, D/A device, and poor bottom grounding cannot guarantee that electrical performance parameters of the device are completely realized; 2. poor bottom pad grounding is not beneficial to heat dissipation of the device, so that the heat dissipation cost of the device is improved; 3. the manual welding has low efficiency, the consistency and the quality of products cannot be ensured, and the reliability of welding spots of devices is influenced; 4. the production procedures of the product are increased, and the device is manually cleaned after being manually welded, so that the production cost is increased.
Disclosure of Invention
The invention aims to provide a method for preparing a printed board protective cover of a device which does not resist high temperature, a protective cover and application, which effectively overcome the technical defect that the printed board of the device which does not resist high temperature is not suitable for a reflow soldering process.
The invention is realized by the following technical scheme:
in a first aspect, the invention provides a method for preparing a printed board protective cover of a device which does not resist high temperature, which comprises the following steps:
selecting an additive protection material of the protective cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and the reflow soldering heat transfer principle;
according to the convection heat transfer model, constructing a size model of a protective cover of a device which does not resist high temperature on the printed board through thermal simulation; obtaining the size of the protective cover of the non-high temperature resistant device on the printed board according to the size model of the protective cover of the non-high temperature resistant device;
according to the size of the protective cover of the non-high temperature resistant device, a dot matrix bonding pad is arranged on the printed board, and the protective cover is welded on the periphery of the non-high temperature resistant device of the printed board through the bonding pad.
The working principle is as follows: the printed board based on the device which does not resist high temperature is not suitable for the technical defect of the reflow soldering process, and the printed board protective cover for the device which does not resist high temperature is designed and prepared by adopting the additive protection technology from the perspective of printed board design according to the heat transfer principle and the characteristics of the reflow soldering process, so that the applicability of the device which does not resist high temperature in the reflow soldering process is realized. The invention adopts the technical scheme that the design idea of reducing the temperature of the device which cannot resist high temperature in the reflow soldering process is adopted by adopting the additive protection technology according to the heat transfer principle and the reflow soldering process characteristics. Firstly, selecting an additive protection material of a protective cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and the reflow soldering heat transfer principle; secondly, according to the convection heat transfer model, a size model of a protective cover of a device which cannot resist high temperature on the printed board is constructed through thermal simulation; obtaining the size of the protective cover of the non-high temperature resistant device on the printed board according to the size model of the protective cover of the non-high temperature resistant device; and finally, arranging a bonding pad on the printed board according to the size of the protective cover of the device which does not resist high temperature, and welding the protective cover on the periphery of the device which does not resist high temperature on the printed board through the bonding pad.
The printed board assembly with the non-high temperature resistant device can be preprocessed in the printed board design stage, so that the non-high temperature resistant device and the high temperature resistant device can be assembled together through a reflow soldering process without adopting a manual soldering method; effectively solves the technical defect that the device which can not resist high temperature is not suitable for the reflow soldering process. The practice proves that the method is stable and reliable, and the consistency, the production efficiency and the product quality of the printed board assembly product can be greatly improved.
Further, the additive protection material of the protective cover is a metal material with high thermal conductivity.
Further, the convective heat transfer model is:
wherein h ismAverage convective heat transfer coefficient; d is the diameter of the circular nozzle; lambda is the air thermal conductivity coefficient; h is the height of the nozzle to the surface to be impacted; reDIs Reynolds number; nu (Nu)DAre the nussel coefficients.
Furthermore, a protective cover of a device which does not resist high temperature on the printed board is in a rectangular cavity with an opening at the lower end.
Further, the size of the protective cover of the device which does not resist high temperature on the printed board is as follows: (length of non-high temperature resistant device +8mm) > length of protective cover > (length of non-high temperature resistant device +3 mm); (width of non-high temperature resistant device +8mm) > width of protective cover > (width of non-high temperature resistant device +3 mm); (height of non-high temperature resistant device +8mm) > height of protective cover > (height of non-high temperature resistant device +3 mm); the thickness of the protective cover is 1.5 mm-2.5 mm.
Furthermore, the bottom of the protective cover is plated with a bump, and the size of the bump is 60% -80% of the area of the bonding pad.
Further, copper is plated on the salient points, and nickel is plated after copper plating to serve as a barrier layer; and finally, plating tin. The metal salient points are prepared at the bottom of the protective cover so as to facilitate welding alignment; the protective cover has better weldability, and the protective cover of the device which can not resist high temperature does not deviate in the reflow soldering process.
Furthermore, the pad adopts a dot matrix pad structure, and the self-alignment principle of the welding spot is utilized to ensure that the cavity of the protective cover does not deviate in the reflow soldering process.
In a second aspect, the invention also provides a printed board protective cover of a device which does not resist high temperature, and the protective cover is manufactured by using the method for manufacturing the printed board protective cover of the device which does not resist high temperature; the protective cover is a rectangular cavity with an opening at the lower end, and the protective cover is used for being welded on the periphery of a device which does not resist high temperature on the printed board.
In a third aspect, the invention further provides an application of the printed board protective cover for the non-high temperature resistant device, the printed board protective cover for the non-high temperature resistant device according to claim 9 is used, the printed board is assembled by welding the protective cover to the periphery of the non-high temperature resistant device on the printed board and performing reflow soldering on the non-high temperature resistant device and the high temperature resistant device together.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. according to the invention, from the perspective of printed board design, according to the principle of heat transfer and the characteristics of reflow soldering process, the printed board protective cover for the device which does not resist high temperature is designed and prepared by adopting the additive protection technology, so that the applicability of the device which does not resist high temperature in the reflow soldering process is realized. The invention adopts the technical scheme that the design idea of reducing the temperature of the device which cannot resist high temperature in the reflow soldering process is adopted by adopting the additive protection technology according to the heat transfer principle and the reflow soldering process characteristics.
2. The printed board assembly with the non-high temperature resistant device can be preprocessed in the printed board design stage, so that the non-high temperature resistant device and the high temperature resistant device can be assembled together through a reflow soldering process without adopting a manual soldering method; effectively solves the technical defect that the device which does not resist high temperature is not suitable for the reflow soldering process. The practice proves that the method is stable and reliable, and the consistency, the production efficiency and the product quality of the printed board assembly product can be greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic diagram of the layout of the non-refractory device of the present invention.
Fig. 2 is a schematic diagram of the protective cover (including the pad array) of the present invention.
Fig. 3 is a schematic view of a protective cover of the present invention having a bump structure on the bottom of the protective cover after sizing.
Fig. 4 is a schematic diagram of a typical heat transfer principle of a hot air reflow oven used in the reflow soldering process of the present invention.
Fig. 5 is a partial schematic view of a printed board of the invention suitable for a reflow soldering process for a device which is not resistant to high temperature.
Reference numbers and corresponding part names:
1-printed board, 2-non-high temperature resistant device, 3-bonding pad, 4-salient point and 5-protective cover.
Detailed Description
Hereinafter, the term "comprising" or "may include" used in various embodiments of the present invention indicates the presence of the invented function, operation or element, and does not limit the addition of one or more functions, operations or elements. Furthermore, as used in various embodiments of the present invention, the terms "comprises," "comprising," "includes," "including," "has," "having" and their derivatives are intended to mean that the specified features, numbers, steps, operations, elements, components, or combinations of the foregoing, are only meant to indicate that a particular feature, number, step, operation, element, component, or combination of the foregoing, and should not be construed as first excluding the existence of, or adding to the possibility of, one or more other features, numbers, steps, operations, elements, components, or combinations of the foregoing.
In various embodiments of the invention, the expression "or" at least one of a or/and B "includes any or all combinations of the words listed simultaneously. For example, the expression "a or B" or "at least one of a or/and B" may include a, may include B, or may include both a and B.
Expressions (such as "first", "second", and the like) used in various embodiments of the present invention may modify various constituent elements in various embodiments, but may not limit the respective constituent elements. For example, the above description does not limit the order and/or importance of the elements described. The foregoing description is for the purpose of distinguishing one element from another. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of various embodiments of the present invention.
It should be noted that: if it is described that one constituent element is "connected" to another constituent element, the first constituent element may be directly connected to the second constituent element, and a third constituent element may be "connected" between the first constituent element and the second constituent element. In contrast, when one constituent element is "directly connected" to another constituent element, it is understood that there is no third constituent element between the first constituent element and the second constituent element.
The terminology used in the various embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the various embodiments of the invention. As used herein, the singular forms are intended to include the plural forms as well, unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which various embodiments of the present invention belong. The terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning that is consistent with their contextual meaning in the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein in various embodiments of the present invention.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1
As shown in fig. 1 to 5, the method for manufacturing a printed board protective cover of a device which does not resist high temperature includes:
selecting an additive protection material of the protective cover 5, and constructing a convection heat transfer model according to the characteristics of the additive protection material and the reflow soldering heat transfer principle;
according to the convection heat transfer model, constructing a size model of a protective cover of a device which does not resist high temperature on the printed board through thermal simulation; obtaining the size of the protective cover of the non-high temperature resistant device on the printed board according to the size model of the protective cover of the non-high temperature resistant device;
according to the size of the protective cover of the device which does not resist high temperature, a bonding pad 3 is arranged on the printed board, and the protective cover 5 is welded on the periphery of the device which does not resist high temperature 2 of the printed board through the bonding pad 3.
To further explain the present embodiment, the additive protection material of the protective cover 5 is a metal material with high thermal conductivity.
To further illustrate the present embodiment, the convective heat transfer model is:
wherein h ismAverage convective heat transfer coefficient; d is the diameter of the circular nozzle; lambda is the air thermal conductivity coefficient; h is the height of the nozzle to the surface to be impacted; reDIs Reynolds number; nu (Nu)DAre the nussel coefficients.
For further explanation of the present embodiment, the protection cover 5 of the non-high temperature resistant device on the printed board is shaped as a rectangular cavity with an open lower end. The size of a protective cover of a device which does not resist high temperature on the printed board is as follows: (length of non-high temperature resistant device +8mm) > length of protective cover > (length of non-high temperature resistant device +3 mm); (width of non-high temperature resistant device +8mm) > width of protective cover > (width of non-high temperature resistant device +3 mm); (height of non-high temperature resistant device +8mm) > height of protective cover > (height of non-high temperature resistant device +3 mm); the thickness of the protective cover is 1.5 mm-2.5 mm.
In the specific implementation, taking the SFM95 series rf chip of some electrical department in the factory as an example, the maximum withstand temperature of the device does not exceed 215 ℃, and the hybrid reflow soldering (the maximum temperature is greater than 217 ℃) process cannot be used. The size of the chip is 21.7 multiplied by 4mm, and the size of the protective cover obtained through simulation is 25-27 mm in length, 25-27 mm in width, 7-9 mm in height and 1.5-2.5 mm in thickness, so that the high temperature resistance of the device can be protected to be not more than 215 ℃, and the temperature of the device can reach more than 183 ℃. Tests prove that the size of the protective cover with the length (26mm), the width (26mm), the height (7mm) and the thickness (2mm) can not damage devices and obtain a better reflow soldering effect.
To further illustrate the embodiment, the bottom of the protective cover 5 is plated with bumps 4, and the size of the bumps 4 is 60% to 80% of the area of the bonding pads 3.
Plating copper on the salient points 4, and plating nickel after plating copper to be used as a barrier layer; and finally, plating tin. The metal salient points are prepared at the bottom of the protective cover so as to facilitate welding alignment; the protective cover has better weldability, and the protective cover of the device which can not resist high temperature does not deviate in the reflow soldering process.
For further explanation of the embodiment, the pad 3 adopts a dot-matrix pad structure, and the self-alignment principle of the solder joint itself is utilized to ensure that the cavity of the protective cover does not deviate in the reflow soldering process; and attention is paid to the dot matrix spacing to facilitate printed board design.
For further explanation of the embodiment, the position of the device which is not suitable for the reflow soldering process and is not high temperature resistant is determined according to the design requirements of the printed board; and reasonably arranging the devices which cannot resist high temperature according to the requirements of the design structural elements of the printed board, and keeping a sufficient distance from the rest devices as far as possible.
The working principle is as follows: the printed board based on the device which does not resist high temperature is not suitable for the technical defect of the reflow soldering process, and the printed board protective cover for the device which does not resist high temperature is designed and prepared by adopting the additive protection technology from the perspective of printed board design according to the heat transfer principle and the characteristics of the reflow soldering process, so that the applicability of the device which does not resist high temperature in the reflow soldering process is realized. The invention adopts the technical scheme that the design idea of reducing the temperature of the device which cannot resist high temperature in the reflow soldering process is adopted by adopting the additive protection technology according to the heat transfer principle and the reflow soldering process characteristics. Firstly, selecting an additive protection material of a protective cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and the reflow soldering heat transfer principle; secondly, according to the convection heat transfer model, a size model of a protective cover of a device which cannot resist high temperature on the printed board is constructed through thermal simulation; obtaining the size of the protective cover of the non-high temperature resistant device on the printed board according to the size model of the protective cover of the non-high temperature resistant device; and finally, arranging a bonding pad on the printed board according to the size of the protective cover of the device which does not resist high temperature, and welding the protective cover on the periphery of the device which does not resist high temperature on the printed board through the bonding pad.
The printed board assembly with the non-high temperature resistant device can be preprocessed in the printed board design stage, so that the non-high temperature resistant device and the high temperature resistant device can be assembled together through a reflow soldering process without adopting a manual soldering method; effectively solves the technical defect that the device which can not resist high temperature is not suitable for the reflow soldering process. The practice proves that the method is stable and reliable, and the consistency, the production efficiency and the product quality of the printed board assembly product can be greatly improved.
Example 2
As shown in fig. 1 to 5, the present embodiment is different from embodiment 1 in that the present embodiment provides a printed board protective cover for a device that does not resist high temperature, which is manufactured by using the method for manufacturing the printed board protective cover for the device that does not resist high temperature described in embodiment 1; the protective cover 5 is a rectangular cavity with an opening at the lower end, and the protective cover 5 is used for being welded on the periphery of the device 2 which does not resist high temperature on the printed board.
Meanwhile, the invention also provides the application of the printed board protective cover of the non-high temperature resistant device, the printed board protective cover of the non-high temperature resistant device is used, the protective cover is welded on the periphery of the non-high temperature resistant device on the printed board, and the non-high temperature resistant device and the high temperature resistant device are assembled on the printed board through a reflow soldering process.
Because the printed board assembly basically adopts the reflow soldering process, the components which do not resist high temperature cannot be suitable for the reflow soldering process because the temperature resistance value is low, and the working procedures and the cost of the printed board assembly process are increased. Through the application of the printed board protective cover of the device which does not resist high temperature, the reflow soldering process of the device which does not resist high temperature can be realized, the procedures of printed board assembly are reduced, the production efficiency of printed board assembly is improved, and the production cost of the product is greatly reduced.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The preparation method of the printed board protective cover of the device which does not resist high temperature is characterized by comprising the following steps:
selecting an additive protection material of the protective cover, and constructing a convection heat transfer model according to the characteristics of the additive protection material and the reflow soldering heat transfer principle;
according to the convection heat transfer model, constructing a size model of a protective cover of a device which does not resist high temperature on the printed board through thermal simulation; obtaining the size of the protective cover of the non-high temperature resistant device on the printed board according to the size model of the protective cover of the non-high temperature resistant device;
according to the size of the protective cover of the device which does not resist high temperature, a welding disc is arranged on the printed board, and the protective cover is welded on the periphery of the device which does not resist high temperature of the printed board through the welding disc.
2. The method for manufacturing the printed board protective cover of the non-high temperature resistant device according to claim 1, wherein the additive protection material of the protective cover is a metal material.
3. The method for manufacturing the printed board protective cover of the non-high temperature resistant device according to claim 1, wherein the convection heat transfer model is as follows:
wherein h ismAverage convective heat transfer coefficient; d is the diameter of the circular nozzle; lambda is the air thermal conductivity coefficient; h is the height of the nozzle to the surface to be impacted; reDIs Reynolds number; nu (Nu)DAre the nussel coefficients.
4. The method for manufacturing the printed board protective cover of the non-high temperature resistant device according to claim 1, wherein the protective cover of the non-high temperature resistant device on the printed board is shaped as a rectangular cavity with an opening at the lower end.
5. The method for manufacturing the printed board protective cover of the device which does not resist high temperature according to claim 4, wherein the size of the protective cover of the device which does not resist high temperature on the printed board is as follows: the length of the protective cover is more than the length of the non-high temperature resistant device by +3mm and less than the length of the non-high temperature resistant device by +8 mm; the width of the protective cover is greater than the width of the non-high temperature resistant device by +3mm and less than the width of the non-high temperature resistant device by +8 mm; the height of the protective cover is more than +3mm of the height of the non-high temperature resistant device and less than +8mm of the height of the non-high temperature resistant device; the thickness of the protective cover is 1.5 mm-2.5 mm.
6. The method for manufacturing the printed board protective cover of the non-high temperature resistant device according to claim 1, wherein the bottom of the protective cover is plated with bumps, and the size of the bumps is 60% -80% of the area of the bonding pad.
7. The method for manufacturing the printed board protective cover of the non-high temperature resistant device according to claim 6, wherein the salient points are plated with copper, and nickel is plated after the copper is plated; and finally, plating tin.
8. The method for manufacturing the printed board protective cover of the device which does not resist high temperature as claimed in claim 1, wherein the pad is in a dot matrix pad structure.
9. The printed board protective cover of the device which does not resist high temperature is characterized in that the protective cover is manufactured by using the method for manufacturing the printed board protective cover of the device which does not resist high temperature as claimed in any one of claims 1 to 8; the protective cover is a rectangular cavity with an opening at the lower end, and the protective cover is used for being welded on the periphery of a device which does not resist high temperature on the printed board.
10. The application of the printed board protective cover of the device which does not resist high temperature is characterized in that the printed board protective cover of the device which does not resist high temperature as claimed in claim 9 is used, the protective cover is welded on the periphery of the device which does not resist high temperature on the printed board, and the device which does not resist high temperature and the device which resists high temperature are assembled on the printed board through a reflow soldering process.
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