CN203675418U - Cooling device for multilayer printed board - Google Patents
Cooling device for multilayer printed board Download PDFInfo
- Publication number
- CN203675418U CN203675418U CN201320696785.1U CN201320696785U CN203675418U CN 203675418 U CN203675418 U CN 203675418U CN 201320696785 U CN201320696785 U CN 201320696785U CN 203675418 U CN203675418 U CN 203675418U
- Authority
- CN
- China
- Prior art keywords
- substrate
- top board
- bonding sheet
- multilayer printed
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a cooling device for a multilayer printed board, and the device comprises a top plate, a bottom plate, a first substrate, a second substrate, and bonding pieces. The lower surface of the top plate and the upper surface of the first substrate are bonded together through one bonding piece. The first substrate and the second substrate are bonded together through ne bonding piece. The second substrate and the bottom plate are bonded together through one bonding piece. Aiming at the problems that a multilayer printed board in the prior art is bad in cooling effect and is liable to be damaged, the device provided by the utility model employs a mode that the top plate is provided with a cooling tube, so the cooling effect is good, and the damage to a product is prevented.
Description
Technical field
The utility model relates to printed circuit board field, is specifically related to a kind of multilayered printed plate heat dissipating device.
Background technology
At present, the development course of over half a century has been passed through in PCB technology and production, PCB has become an important component part of electronics and IT products basic material now, the develop rapidly of electronic information industry, make electronic product to miniaturization, functionalization, high performance, the development of high reliability aspect, the development of high-density interconnect technology simultaneously promotes printed board also to high density future development, thereby promote the technology of PCB also in constantly innovation progress, existing multilayer printed board heat dispersion is very bad, easily causes circuit board to burn out.
Utility model content
For above problems of the prior art, the utility model provides a kind of multilayered printed plate heat dissipating device, so just can make heat dispersion fine, has just avoided the damage of product.
The utility model is achieved through the following technical solutions:
A kind of multilayered printed plate heat dissipating device, comprise top board, base plate, first substrate, second substrate and bonding sheet, the lower surface of top board and the upper surface of first substrate bond by bonding sheet, between first substrate and second substrate, bond by bonding sheet, between second substrate and base plate, bond by bonding sheet, top board is provided with at least one heat pipe, and the two ends of top board are provided with fin.
Described top board and base plate are aluminium sheet.
Described bonding sheet is PE bonding sheet
One end of each heat pipe and the top board wherein fin on one end are connected.
The beneficial effects of the utility model are: very bad for existing technology multilayer printed board radiating effect, easily damage the problem of circuit board, and adopt the mode that radiating tube is set on top board, therefore heat dispersion is fine, has just avoided the damage of product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is vertical view of the present utility model.
In figure: 1 is top board; 2 is base plate; 3 is first substrate; 4 is second substrate; 5 is bonding sheet; 6 is heat pipe; 7 is fin.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details.
The utility model provides a kind of multilayered printed plate heat dissipating device, comprise top board, base plate, first substrate, second substrate and bonding sheet, the lower surface of top board and the upper surface of first substrate bond by bonding sheet, between first substrate and second substrate, bond by bonding sheet, between second substrate and base plate, bond by bonding sheet, top board is provided with at least one heat pipe, and the two ends of top board are provided with fin; Described top board and base plate are aluminium sheet; Described bonding sheet is PE bonding sheet; One end of each heat pipe and the top board wherein fin on one end are connected.
The lower surface of top board and the upper surface of first substrate bond by bonding sheet, between first substrate and second substrate, bond by bonding sheet, between second substrate and base plate, bond by bonding sheet, can form like this multilayer printed board, top board and floor are aluminium sheet, radiating effect is fine like this, top board is provided with heat pipe, the fin that the two ends of top board are provided with, can better dispel the heat like this, double-radiation function makes radiating effect better, therefore just prevented the damage of circuit board, bonding sheet is PE bonding sheet, the better effects if of bonding sheet, corrosion-resistant and high temperature, therefore make the performance of circuit board better.
The utility model is very bad for existing technology multilayer printed board radiating effect, easily damages the problem of circuit board, adopts the mode that radiating tube is set on top board, and therefore heat dispersion is fine, has just avoided the damage of product.
Claims (4)
1. a multilayered printed plate heat dissipating device, it is characterized in that: comprise top board, base plate, first substrate, second substrate and bonding sheet, the lower surface of top board and the upper surface of first substrate bond by bonding sheet, between first substrate and second substrate, bond by bonding sheet, between second substrate and base plate, bond by bonding sheet, top board is provided with at least one heat pipe, and the two ends of top board are provided with fin.
2. the multilayered printed plate heat dissipating device of one according to claim 1, is characterized in that: described top board and base plate are aluminium sheet.
3. the multilayered printed plate heat dissipating device of one according to claim 1, is characterized in that: described bonding sheet is PE bonding sheet.
4. the multilayered printed plate heat dissipating device of one according to claim 1, is characterized in that: one end of each heat pipe and the top board wherein fin on one end are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320696785.1U CN203675418U (en) | 2013-11-06 | 2013-11-06 | Cooling device for multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320696785.1U CN203675418U (en) | 2013-11-06 | 2013-11-06 | Cooling device for multilayer printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203675418U true CN203675418U (en) | 2014-06-25 |
Family
ID=50971660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320696785.1U Expired - Fee Related CN203675418U (en) | 2013-11-06 | 2013-11-06 | Cooling device for multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203675418U (en) |
-
2013
- 2013-11-06 CN CN201320696785.1U patent/CN203675418U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20181106 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |