CN217741990U - Packaging structure of PCB fuse - Google Patents
Packaging structure of PCB fuse Download PDFInfo
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- CN217741990U CN217741990U CN202221141917.XU CN202221141917U CN217741990U CN 217741990 U CN217741990 U CN 217741990U CN 202221141917 U CN202221141917 U CN 202221141917U CN 217741990 U CN217741990 U CN 217741990U
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Abstract
The utility model discloses a packaging structure of PCB fuse. Comprises a solder resistance ring, a solder joint and a printed fuse; the welding spot is a special-shaped welding spot and is formed by connecting a larger semicircular welding spot and a smaller semicircular welding spot, the larger semicircular welding spot is used as a detinning welding spot for uniformly guiding soldering tin to stay, and the smaller semicircular welding spot is used as a fuse welding spot for enhancing the soldering tin quality on the surface of the fuse; the printed fuse structure further comprises soldering tin arranged on the printed fuse, and the soldering tin is formed by a rectangular steel mesh windowing layer and is arranged in the middle of the printed fuse; the circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are superposed to be used as the circle center of the special-shaped welding point, and the diameter side of the larger semicircular welding point and the diameter side of the smaller semicircular welding point are superposed to be positioned on the same straight line. The utility model discloses the structure can be effectual reaches the printed fuse solder joint stress by force, and tin-plated surfacing is difficult for forming the purpose of tin ball.
Description
Technical Field
The utility model relates to a packaging structure of SMT (surface mounting technology) technical field, concretely relates to packaging structure of PCB fuse.
Background
The hardware circuit design adds a filter capacitor on the power supply line to suppress the ripple noise of the power supply line. Because the capacitor has a voltage across it, once a short circuit occurs, it may short the power supply to ground, causing damage to the circuit board. To prevent this, a small copper fuse wire is usually designed on the circuit board between the capacitor and the ground.
When designing a PCB, if a designed slender copper wire is just directly arranged between a capacitor and the ground, tin is plated on the surface of a fuse, and after the tin is cooled, a tin ball is formed on a printed wire. The solder balls are easy to fall off to cause short circuit at board level, thereby increasing the fraction defective of products.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that exists among the background art, the utility model discloses a packaging structure of PCB fuse has avoided forming the tin ball on printed conductor, can not cause the short circuit of board level to the yields of product has been increased.
The technical scheme of the utility model is realized like this:
the PCB comprises two welding points which are arranged at intervals and arranged on the PCB, and soldering tin is arranged on the welding points;
the PCB comprises a printed fuse and a PCB, wherein the printed fuse is arranged on the PCB and connected between two special-shaped welding points;
the PCB comprises a solder resisting ring, a printed fuse and two special-shaped welding points, wherein the solder resisting ring is arranged on the PCB and wraps the periphery of the printed fuse and the two special-shaped welding points;
the method is characterized in that:
the welding points are special-shaped welding points, and each special-shaped welding point is formed by connecting a larger semicircular welding point and a smaller semicircular welding point;
wherein, the larger semicircular welding spot is used as a detinning welding spot for uniformly guiding the solder to stay;
wherein the smaller semicircular welding points are used as the welding points of the fuse for enhancing the soldering tin quality on the surface of the fuse.
The printed fuse structure further comprises soldering tin arranged on the printed fuse, and the soldering tin is formed through a rectangular steel mesh windowing layer and is arranged in the middle of the printed fuse.
During the preparation, set up the steel mesh above the printing fuse, the steel mesh department directly over the printing fuse middle part sets up the rectangle and leads to the groove to form rectangle steel mesh layer of windowing, arrange in the rectangle leads to the groove to add soldering tin and make soldering tin cover on the printing fuse middle part.
The circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are superposed to be used as the circle center of the special-shaped welding point, and the diameter side of the larger semicircular welding point and the diameter side of the smaller semicircular welding point are superposed to be positioned on the same straight line.
And two ends of the printed fuse are respectively connected to the centers of the special-shaped welding spots.
The two special-shaped welding points are symmetrically arranged at the middle point of the printed fuse, the fuse welding points of the two smaller semicircular welding points are symmetrically arranged at the inner side positions of the special-shaped welding points, and two ends of the printed fuse extend through the fuse welding points of the smaller semicircular welding points and then are connected to the centers of the special-shaped welding points.
The printed fuse is a copper wire.
The utility model has the advantages that:
the utility model discloses effectively reduced the volume of whole welding tin cream, when reducing welding cost, also prevented to brush too much tin cream, also avoided the phenomenon and the problem that form the tin ball easily.
The utility model discloses the structure can be effectual reaches the printed fuse solder joint stress by force, and tin-plated surfacing is difficult for forming the purpose of tin ball.
Drawings
Fig. 1 is a packaging structure diagram of the PCB fuse of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and examples.
As shown in fig. 1, the package structure includes solder stop rings 1, fuse pads 2, printed fuses 4, and solder fillets 5.
The PCB comprises two welding spots which are arranged at intervals and arranged on the PCB, and soldering tin is arranged on the welding spots;
the PCB comprises a printed fuse 4 which is arranged on a PCB and connected between two special-shaped welding spots;
the printed fuse structure further comprises soldering tin arranged on the printed fuse 4, and the soldering tin is formed and arranged on the middle of the printed fuse 4 through the rectangular steel mesh windowing layer 3.
During the preparation, 4 tops of printing fuse set up the steel mesh, and the steel mesh department directly over 4 middle parts of printing fuse sets up the rectangle and leads to the groove to form rectangle steel mesh windowing layer 3, arrange in the rectangle leads to the groove to add soldering tin and make soldering tin cover on 4 middle parts of printing fuse.
The PCB comprises a solder mask ring 1, a printed fuse 4 and two special-shaped welding points, wherein the solder mask ring is arranged on the PCB and wraps the periphery of the printed fuse and the two special-shaped welding points;
the welding spots are special-shaped welding spots, and each special-shaped welding spot is formed by connecting a larger semicircular welding spot and a smaller semicircular welding spot;
wherein, the larger semicircular welding spot is used as a detinning welding spot 5 for uniformly guiding the solder to stay and enabling the solder to be uniform;
wherein the small semicircular welding spots are used as the fuse welding spots 2 for enhancing the soldering quality of the fuse surface.
The circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are superposed to be used as the circle center of the special-shaped welding point, and the diameter side of the larger semicircular welding point and the diameter side of the smaller semicircular welding point are superposed to be positioned on the same straight line. Two ends of the printed fuse 4 are respectively connected to the centers of the special-shaped welding spots.
The two special-shaped welding points are symmetrically arranged at the middle point of the printed fuse 4 in the packaging structure, the fuse welding points 2 of the two smaller semicircular welding points are symmetrically arranged at the inner side positions of the special-shaped welding points, the two larger semicircular welding points are symmetrically arranged close to the outer side, and two ends of the printed fuse 4 firstly extend through the fuse welding points 2 of the smaller semicircular welding points and then are connected to the centers of the special-shaped welding points, namely the circle centers of the special-shaped welding points.
Because the printed fuse 4 has a slender structure, in the process of melting the soldering tin, a large amount of tin can be remained on the surface of the fuse to form the soldering tin ball, and the product quality is influenced.
The detinned welding spots 5 are designed into large semicircles and arranged on the outer side, the surface area of the detinned welding spots 5 is far larger than that of the printed fuse 4, the fuse welding spots 2 are designed into small semicircles and arranged on the inner side to be connected with the printed fuse 4, so that the redundant melted soldering tin on the printed fuse 4 is absorbed by the detinned welding spots 5, and the formation of the soldering tin on the printed fuse 4 is avoided.
The utility model designs the small semicircular fuse welding spot 2 which can not only increase the connecting area of the two ends of the printed fuse 4 on the PCB, but also enhance the adhesive force of the copper wire to prevent the copper wire from cracking due to stress; the small semicircular welding points can effectively prevent the printed fuse 4 from conducting heat too fast due to overlarge connecting area of two ends in the process of melting soldering tin, so that the surface of the printed fuse 4 is plated with tin and is not flat.
The special-shaped welding points and the printed fuses 4 are wrapped by the solder resisting ring 1, and the copper wires of the printed fuses 4 are exposed by the special-shaped welding points and the printed fuses 4 through windowing due to the existence of the solder resisting ring 1.
In specific implementation, the utility model discloses a packaging manufacture process is: firstly, manufacturing two special-shaped welding points on a PCB, connecting a printed fuse 4 between the two special-shaped welding points through soldering tin, and arranging an upper solder stop ring 1 around the special-shaped welding points and the printed fuse 4; then, a steel mesh is arranged above the printed fuse 4, a rectangular through groove is formed in the steel mesh right above the middle part of the printed fuse 4, so that a rectangular steel mesh windowing layer 3 is formed, and soldering tin is arranged in the rectangular through groove to cover the middle part of the printed fuse 4.
The area of actually brushing the solder paste for the PCB fuse wire is the area of the rectangular groove of the rectangular steel mesh windowing layer 3, the design effectively reduces the whole amount of the solder paste, and the phenomenon of brushing the solder balls formed by excessive solder paste is prevented while the welding cost is reduced.
The rectangular steel mesh windowing layer 3 covers the middle part of the printed fuse 4, so that the center of the rectangular groove of the rectangular steel mesh windowing layer 3 coincides with the center of the printed fuse 4.
After the middle of the printed fuse 4 is provided with the soldering tin, the soldering tin in a melting state can flow along with the printed fuse 4 and then be connected with the soldering tin on the two welding spots, and then the current-carrying capacity of the printed fuse 4 is increased.
Claims (6)
1. A package structure of a PCB fuse is disclosed,
the PCB comprises two welding spots which are arranged at intervals and arranged on the PCB, and soldering tin is arranged on the welding spots;
the PCB comprises a printed fuse (4) which is arranged on a PCB and connected between two special-shaped welding points;
the PCB comprises a solder resisting ring (1) which is arranged on a PCB and wrapped around a printed fuse (4) and two special-shaped welding points;
the method is characterized in that:
the welding points are special-shaped welding points, and each special-shaped welding point is formed by connecting a larger semicircular welding point and a smaller semicircular welding point;
wherein, the bigger semicircular welding spot is used as a detinning welding spot (5) for uniformly guiding the solder to stay;
wherein the small semicircular welding points are used as fuse welding points (2) for enhancing the soldering quality of the fuse surface.
2. The PCB fuse package structure of claim 1, wherein:
the printed fuse structure further comprises soldering tin arranged on the printed fuse (4), and the soldering tin is formed through the rectangular steel mesh windowing layer (3) and is arranged in the middle of the printed fuse (4).
3. The PCB fuse package structure of claim 1, wherein:
the circle center of the larger semicircular welding point and the circle center of the smaller semicircular welding point are superposed to be used as the circle center of the special-shaped welding point, and the diameter side of the larger semicircular welding point and the diameter side of the smaller semicircular welding point are superposed to be positioned on the same straight line.
4. The PCB fuse packaging structure of claim 3, wherein:
and two ends of the printed fuse (4) are respectively connected to the centers of the special-shaped welding spots.
5. The PCB fuse package structure of claim 1, wherein:
the two special-shaped welding points are symmetrically arranged at the midpoint of the printed fuse (4), the fuse welding points (2) of the two smaller semicircular welding points are symmetrically arranged at the inner sides of the special-shaped welding points, and two ends of the printed fuse (4) extend through the fuse welding points (2) of the smaller semicircular welding points and then are connected to the centers of the special-shaped welding points.
6. The PCB fuse package structure of claim 1, wherein:
the printed fuse (4) is made of copper wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221141917.XU CN217741990U (en) | 2022-05-12 | 2022-05-12 | Packaging structure of PCB fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221141917.XU CN217741990U (en) | 2022-05-12 | 2022-05-12 | Packaging structure of PCB fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217741990U true CN217741990U (en) | 2022-11-04 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221141917.XU Active CN217741990U (en) | 2022-05-12 | 2022-05-12 | Packaging structure of PCB fuse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217741990U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928938A (en) * | 2022-05-12 | 2022-08-19 | 浙江亚太机电股份有限公司 | Packaging structure and packaging method of PCB fuse |
-
2022
- 2022-05-12 CN CN202221141917.XU patent/CN217741990U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928938A (en) * | 2022-05-12 | 2022-08-19 | 浙江亚太机电股份有限公司 | Packaging structure and packaging method of PCB fuse |
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