CN210039943U

CN210039943U - Coating type multicore group condenser

Info

Publication number: CN210039943U
Application number: CN201920974588.9U
Authority: CN
Inventors: 张瑞强; 徐强; 肖富强; 牟宇
Original assignee: Chengdu Hongke Electronic Technology Co Ltd
Current assignee: Chengdu Hongke Electronic Technology Co Ltd
Priority date: 2019-06-26
Filing date: 2019-06-26
Publication date: 2020-02-07
Anticipated expiration: 2029-06-26

Abstract

The utility model relates to an electronic component technical field discloses a coating type multicore group condenser, include a pair of lead frame and set up the capacitor chip group between the lead frame, capacitor chip group includes a plurality of series connection or parallelly connected porcelain capacitor chip, the surface coating of porcelain capacitor chip has the electronic protection layer, the one end of lead wire is provided with the kink that extends the lead wire, the kink is provided with the notch. The utility model discloses a surface coating electronic protection layer at ceramic dielectric capacitor chip can effectively solve the problem of the voltage flashover of multicore group condenser in test and use, still can avoid the multicore group condenser to scrape flower, collision damage scheduling problem on the surface that produces in the circulation box use.

Description

Coating type multicore group condenser

Technical Field

The utility model relates to an electronic component technical field particularly, relates to a coating type multicore group condenser.

Background

As the circuit is continuously developed toward integration, miniaturization, and high reliability, higher requirements are put on the size of electronic components included in the circuit. The utility model discloses a utility model patent of publication No. CN206340448U, the name is "a mixed integrated circuit is with many core group porcelain dielectric capacitor" discloses a multicore group porcelain dielectric capacitor, and it mainly is applied to mixed integrated circuit, hinders the solder ink through coating at capacitor chip group, improves the ability that the condenser is able to bear or endure temperature shock. The traditional multi-core capacitor applied to high-voltage circuits such as medium-high frequency high-current switching power supply output/input filtering, power bus filtering, DC-DC converters and the like has the advantages that a ceramic body is exposed, and metal dendrite (crystal floc) is easy to grow after the capacitor is placed for a long time. The surface of a traditional multi-core group capacitor is easy to scratch, scratch and damage due to collision in the using process because of high-voltage current, and the surface of the ceramic is easy to generate voltage flashover in the testing and using process, so that the surface damage and even the ceramic damage and other fatal defects are caused. In addition, the capacitor is a pouring (packaging) multi-core group capacitor, and because the process is immature, gaps among the multi-layer ceramic dielectric capacitors can not be effectively packaged, the phenomenon of voltage flashover in the gaps occurs, or bubbles appear on the surface of a packaging material to influence the appearance.

SUMMERY OF THE UTILITY MODEL

The utility model provides a coating type multicore group condenser mainly is applied to high-voltage circuit for solve multicore group condenser porcelain body surface and produce voltage flashover, easy damaged problem easily

The utility model adopts the technical proposal that: the utility model provides a coating type multicore group condenser, includes a pair of lead wire and sets up the capacitor chip group between the lead wire, the capacitor chip group includes a plurality of ceramic dielectric capacitor chips of establishing ties or parallelly connected, the surface coating of ceramic dielectric capacitor chip has the electronic protection layer, the one end of lead wire is provided with the kink that extends the lead wire, the kink is provided with the notch.

Further, the ceramic capacitor chip comprises an inner electrode layer and an end electrode communicated with the inner electrode layer, and the end electrode is connected with the lead through a soldering tin layer.

Furthermore, the lead is provided with a solder hole.

The utility model has the advantages that: the electronic protection layer is coated on the surface of the ceramic capacitor chip, so that the problem of voltage flashover of the multi-core capacitor in the testing and using processes can be effectively solved, the problems of surface scratching, collision damage and the like caused by the multi-core capacitor in the using process of the flow box can be avoided, the yield of the multi-core capacitor in the production process is greatly improved, and the failure rate of a user in the using process are effectively reduced.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a right side view of the present invention.

Reference numerals: 10-lead, 11-bend, 12-notch, 13-solder hole, 20-ceramic capacitor chip, 21-internal electrode layer, 22-end electrode, 23-electronic protection layer, 24-solder layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the accompanying drawings.

Referring to fig. 1 and 2, a coating type multi-core pack capacitor includes a pair of leads 10 and a capacitor chip set disposed between the leads 10, the capacitor chip set including a plurality of ceramic dielectric capacitor chips 20 connected in series or in parallel, a surface of the ceramic dielectric capacitor chip 20 being coated with an electronic protection layer 23. The ceramic capacitor chip 20 includes an internal electrode layer 21 and an end electrode 22 communicating with the internal electrode layer 21, and the end electrode 22 and the lead 10 are connected by a solder layer 24. One end of the lead 10 is provided with a bending part 11 extending out of the lead 10, and the bending part 11 is used as an external pin of the coating type multi-core group capacitor and is used for surface mounting. The bending portion 11 is provided with a notch 12 to facilitate welding the bending portion 11 and the substrate, so as to avoid cold joint. The lead 10 is provided with a solder hole 13 for injecting solder to solder the plurality of ceramic dielectric capacitor chips 20 to the lead 10.

The electronic protective layer 23 is formed by coating an electronic protective agent on the surface of the ceramic dielectric capacitor chip 20 (including the seams among a plurality of ceramic dielectric capacitors), wherein the electronic protective agent adopts the existing electronic protective coating, and a transparent protective film is formed after the electronic protective agent is cured, so that the electronic protective layer has the protective effects of insulation, leakage prevention, corrosion prevention, aging prevention, corona resistance and the like. The electronic protection layer 23 can effectively solve the problem of voltage flashover of the multi-core group capacitor in the testing and using processes, and can also avoid the problems of surface scratching, collision damage and the like of the multi-core group capacitor in the using process of the circulation box, greatly improve the qualification rate of the multi-core group capacitor in the production process, and effectively reduce the failure rate and the failure rate of a user in the using process. Because the existing multi-core group capacitor is placed for a long time at normal temperature and is easy to grow metal dendrite (crystal floc), the electronic protective agent of the utility model can also inhibit the growth of dendrite.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A coating type multicore group condenser, includes a pair of lead wires and sets up the capacitor chip group between the lead wire, its characterized in that: the capacitor chip group comprises a plurality of ceramic capacitor chips connected in series or in parallel, an electronic protection layer is coated on the surface of each ceramic capacitor chip, a bent part extending out of the lead is arranged at one end of the lead, and a notch is formed in the bent part.

2. The coated multi-core pack capacitor as claimed in claim 1, wherein: the ceramic capacitor chip comprises an inner electrode layer and an end electrode communicated with the inner electrode layer, wherein the end electrode is connected with a lead through a soldering tin layer.

3. The coated multi-core pack capacitor as claimed in claim 1, wherein: the lead is provided with a soldering tin material hole.