CN107864555B - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN107864555B CN107864555B CN201711299704.3A CN201711299704A CN107864555B CN 107864555 B CN107864555 B CN 107864555B CN 201711299704 A CN201711299704 A CN 201711299704A CN 107864555 B CN107864555 B CN 107864555B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating film
- conductive
- metal wires
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 229910001020 Au alloy Inorganic materials 0.000 claims description 3
- 239000003353 gold alloy Substances 0.000 claims description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Conductors (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a flexible circuit board, which comprises a board body, wherein the board body comprises a first insulating film and a second insulating film which are stacked, a plurality of metal wires are arranged in parallel between the first insulating film and the second insulating film, a plurality of through holes are arranged between adjacent metal wires, the edges of the through holes are connected with the metal wires on two sides of the through holes and are arranged in a matrix, two ends of the metal wires are respectively connected with a conductive tap, and the conductive taps extend to the outer side of the board body to serve as electric connection ends of the circuit board. The invention not only can realize the electric interconnection function of the complex hybrid integrated circuit board and ensure that the wiring consistency is strictly controlled, but also is convenient for fixing flexible wire rows and manually and neatly dividing the circuit board.
Description
Technical Field
The invention relates to a circuit board, in particular to a flexible circuit board.
Background
At present, most of structures for directly carrying out short circuit interconnection in a complex hybrid integrated circuit are independent wires, and when the number of wires is large, the wiring consistency is difficult to control, and the consumption of adhesive materials for fixing leads is increased; not only affects the consistency of the internal structure of the circuit, but also makes the content of harmful atmosphere in the circuit of the sealing structure difficult to control; if a conventional flexible flat cable is used as a short circuit interconnection structure, when the span is large and the flexible flat cable needs to be routed along the surface of a complex structure, the flexible flat cable is difficult to fix, cannot be divided and used, and has poor universality.
Disclosure of Invention
The invention aims to provide a flexible circuit board which not only can realize the electric interconnection function of a complex hybrid integrated circuit board and ensure that the wiring consistency is strictly controlled, but also is convenient for fixing flexible wire rows and orderly dividing the circuit board manually.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a flexible circuit board, includes the plate body, the plate body is including the first insulating film and the second insulating film of range upon range of setting, parallel arrangement has a plurality of metal wires between first insulating film and the second insulating film, is equipped with a plurality of through-holes between the adjacent metal wire, the edge of through-hole is connected with the metal wire of its both sides and is the matrix arrangement, the both ends of metal wire are connected with a conductive tap respectively, conductive tap extends to the outside of plate body and regard as the electric link of circuit board.
As a further improvement of the above technical scheme:
the width of the conductive tap is larger than that of the metal wire, and one end of the conductive tap is fixed between the first insulating film and the second insulating film.
The conductive tap is fixedly connected with the metal wire in a welding, bonding or crimping mode.
The surface of the conductive tap is plated with nickel-gold alloy.
The metal wire and the conductive tap are made of copper materials.
The metal wire is fixed between the first insulating film and the second insulating film in a hot pressing mode.
The thickness of the metal wire is 15-30 ounces.
The width of the connecting end of the conductive tap and the metal wire is larger than that of the other end of the conductive tap and the metal wire.
According to the technical scheme, the flexible circuit board can realize the electrical interconnection function of the complex hybrid integrated circuit board, the wiring consistency is strictly controlled, dispensing fixation can be carried out on any surface and any position of a complex structure, and the flexible circuit board can be divided neatly along the through holes by hand without tools. The problem that the existing short circuit interconnection structure is poor in wiring consistency and poor in universality can be effectively solved, the short circuit interconnection structure consistency of the complex hybrid integrated circuit is improved, and the wiring mode is more flexible.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
as shown in fig. 1, the flexible circuit board of this embodiment includes a board body 1, the board body 1 includes a first insulating film and a second insulating film that are stacked, a plurality of metal wires 2 are disposed in parallel between the first insulating film and the second insulating film, a plurality of through holes 3 are disposed between adjacent metal wires 2, edges of the through holes 3 are connected with the metal wires 2 on two sides thereof and are arranged in a matrix, two ends of the metal wires 2 are respectively connected with a conductive tap 4, and the conductive taps 4 extend to the outer side of the board body 1 to serve as an electrical connection end of the circuit board.
In order to improve the fatigue resistance of the circuit board, in the present embodiment, the width of the conductive tap 4 is set to be larger than the width of the metal wire 2, and the specific size is determined according to the actual situation; one end of the conductive tap 4 is fixed between the first insulating film and the second insulating film, so that the conductive tap 4 can be better connected and fixed with the metal wire 2. The connected metal wire 2 and the conductive tap 4 are fixed between the first insulating film and the second insulating film by a hot pressing method.
Further, the conductive tap 4 may be fixedly connected to the metal wire 2 by welding, bonding or crimping. A nickel-gold alloy is plated on the surface of the conductive tap 4. The conductive tap 4 which is plated with nickel and alloy can be assembled by adopting a conductive bonding and crimping process during connection, and can also be assembled by adopting a welding process, so that the assembly is more convenient, gold is not easy to oxidize, and the copper strip can be protected.
In this embodiment, the metal wire 2 and the conductive tap 4 are made of copper. The thickness of the metal wire 2 is 15 to 30 ounces, and the thickness of the metal wire 2 of this embodiment is preferably 15 ounces, 30 ounces or 20 ounces. In order to facilitate connection of the conductive tap 4 with other circuits and to improve the shock resistance of the circuit board, the width of the conductive tap 4 at the connection end with the metal wire 2 is designed to be larger than that at the other end thereof.
And adhesive is dispensed at the position of the through hole 3, so that the flexible circuit board can be attached to the surface of the complex structure. The through holes 3 not only can realize the electric interconnection function of the complex hybrid integrated circuit board, so that the wiring consistency is strictly controlled, but also can be fixed by dispensing on any surface and any position of a complex structure, and can be used as a parting line for the local or whole parting of the flexible circuit board, and the parting can be performed manually without tools.
The above examples are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solution of the present invention should fall within the scope of protection defined by the claims of the present invention without departing from the spirit of the present invention.
Claims (5)
1. A flexible circuit board, characterized in that: the novel printed circuit board comprises a board body (1), wherein the board body (1) comprises a first insulating film and a second insulating film which are arranged in a stacked mode, a plurality of metal wires (2) are arranged between the first insulating film and the second insulating film in parallel, the metal wires (2) are fixed between the first insulating film and the second insulating film in a hot pressing mode, a plurality of through holes (3) are formed between the adjacent metal wires (2), edges of the through holes (3) are connected with the metal wires (2) on two sides of the through holes and are arranged in a matrix mode, two ends of the metal wires (2) are respectively connected with a conductive tap (4), the conductive taps (4) extend to the outer side of the board body (1) to serve as electric connection ends of the circuit board, the width of each conductive tap (4) is larger than that of each metal wire (2), and the width of the connection ends of the conductive taps (4) and each metal wire (2) is larger than that of the other, and one ends of the conductive taps (4) are fixed between the first insulating film and the second insulating film.
2. The flexible circuit board of claim 1 wherein: the conductive tap (4) is fixedly connected with the metal wire (2) in a welding, bonding or crimping mode.
3. The flexible circuit board according to any one of claims 1 to 2, wherein: the surface of the conductive tap (4) is plated with nickel-gold alloy.
4. The flexible circuit board of claim 1 wherein: the metal wire (2) and the conductive tap (4) are made of copper materials.
5. The flexible circuit board of claim 1 wherein: the thickness of the metal wire (2) is 15-30 ounces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711299704.3A CN107864555B (en) | 2017-12-09 | 2017-12-09 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711299704.3A CN107864555B (en) | 2017-12-09 | 2017-12-09 | Flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107864555A CN107864555A (en) | 2018-03-30 |
| CN107864555B true CN107864555B (en) | 2024-02-09 |
Family
ID=61705711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711299704.3A Active CN107864555B (en) | 2017-12-09 | 2017-12-09 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107864555B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109831871B (en) * | 2019-03-28 | 2020-02-21 | 厦门天马微电子有限公司 | Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0897330A (en) * | 1994-07-25 | 1996-04-12 | Toppan Printing Co Ltd | Chip carrier and manufacture thereof |
| TW200531229A (en) * | 2004-03-11 | 2005-09-16 | Advanced Semiconductor Eng | Substrate strip for flip chip package |
| CN2757494Y (en) * | 2004-12-01 | 2006-02-08 | 群康科技(深圳)有限公司 | Soft circuit board |
| JP2008166741A (en) * | 2006-12-04 | 2008-07-17 | Ngk Spark Plug Co Ltd | Multilayer substrate and its manufacturing method |
| CN101964458A (en) * | 2009-07-22 | 2011-02-02 | 庄炳荣 | Flat cable structure and manufacturing method thereof |
| JP4917668B1 (en) * | 2010-12-29 | 2012-04-18 | パナソニック株式会社 | Multilayer wiring board and method for manufacturing multilayer wiring board |
| CN202335069U (en) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | Flexible circuit board with suspension plugging fingers |
| CN203136328U (en) * | 2013-03-23 | 2013-08-14 | 广州安费诺诚信软性电路有限公司 | Mounting structure of flexible circuit board pin |
| JP2015138967A (en) * | 2014-01-24 | 2015-07-30 | ツーハイ アドバンスド チップ キャリアーズ アンド エレクトロニック サブストレート ソリューションズ テクノロジーズ カンパニー リミテッド | Substrate with protruding copper terminal post |
| CN106206613A (en) * | 2016-08-24 | 2016-12-07 | 昆山工研院新型平板显示技术中心有限公司 | A kind of flexible display substrates and preparation method thereof |
| CN206686438U (en) * | 2017-04-10 | 2017-11-28 | 南昌金轩科技有限公司 | A kind of multi-layer H DI wiring boards of internal layer interconnection |
| CN207560449U (en) * | 2017-12-09 | 2018-06-29 | 中国电子科技集团公司第四十三研究所 | A kind of flexible PCB |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013008880A (en) * | 2011-06-24 | 2013-01-10 | Fujitsu Ltd | Manufacturing method of multilayer circuit board and multilayer circuit board |
| JP2016076658A (en) * | 2014-10-08 | 2016-05-12 | イビデン株式会社 | Electronic component built-in wiring board and method of manufacturing the same |
-
2017
- 2017-12-09 CN CN201711299704.3A patent/CN107864555B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0897330A (en) * | 1994-07-25 | 1996-04-12 | Toppan Printing Co Ltd | Chip carrier and manufacture thereof |
| TW200531229A (en) * | 2004-03-11 | 2005-09-16 | Advanced Semiconductor Eng | Substrate strip for flip chip package |
| CN2757494Y (en) * | 2004-12-01 | 2006-02-08 | 群康科技(深圳)有限公司 | Soft circuit board |
| JP2008166741A (en) * | 2006-12-04 | 2008-07-17 | Ngk Spark Plug Co Ltd | Multilayer substrate and its manufacturing method |
| CN101964458A (en) * | 2009-07-22 | 2011-02-02 | 庄炳荣 | Flat cable structure and manufacturing method thereof |
| JP4917668B1 (en) * | 2010-12-29 | 2012-04-18 | パナソニック株式会社 | Multilayer wiring board and method for manufacturing multilayer wiring board |
| CN202335069U (en) * | 2011-11-11 | 2012-07-11 | 厦门爱谱生电子科技有限公司 | Flexible circuit board with suspension plugging fingers |
| CN203136328U (en) * | 2013-03-23 | 2013-08-14 | 广州安费诺诚信软性电路有限公司 | Mounting structure of flexible circuit board pin |
| JP2015138967A (en) * | 2014-01-24 | 2015-07-30 | ツーハイ アドバンスド チップ キャリアーズ アンド エレクトロニック サブストレート ソリューションズ テクノロジーズ カンパニー リミテッド | Substrate with protruding copper terminal post |
| CN106206613A (en) * | 2016-08-24 | 2016-12-07 | 昆山工研院新型平板显示技术中心有限公司 | A kind of flexible display substrates and preparation method thereof |
| CN206686438U (en) * | 2017-04-10 | 2017-11-28 | 南昌金轩科技有限公司 | A kind of multi-layer H DI wiring boards of internal layer interconnection |
| CN207560449U (en) * | 2017-12-09 | 2018-06-29 | 中国电子科技集团公司第四十三研究所 | A kind of flexible PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107864555A (en) | 2018-03-30 |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |