CN204155616U - A kind of busbar - Google Patents
A kind of busbar Download PDFInfo
- Publication number
- CN204155616U CN204155616U CN201420543442.6U CN201420543442U CN204155616U CN 204155616 U CN204155616 U CN 204155616U CN 201420543442 U CN201420543442 U CN 201420543442U CN 204155616 U CN204155616 U CN 204155616U
- Authority
- CN
- China
- Prior art keywords
- busbar
- coating
- sn63pb
- red copper
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 44
- 238000000576 coating method Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- 239000010949 copper Substances 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 18
- 239000004642 Polyimide Substances 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 11
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 8
- 229910001369 Brass Inorganic materials 0.000 claims description 7
- 239000010951 brass Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 5
- 238000004804 winding Methods 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 20
- 238000009434 installation Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 9
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 239000012876 carrier material Substances 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 36
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model relates to a kind of preparation method of busbar, busbar performance prepared by the method is good, good reliability, the method, by implementing solderable coating and surface insulation process at busbar substrate surface, realizes the welding of busbar in printed board and the reliable installation with structural member and parts.The Material selec-tion red copper of busbar, directly electroplates at red copper surface the Sn63Pb coating that a layer thickness is 5 μm ~ 15 μm.The type selecting of bus bar materials, as the carrier material of big current transmission, bus bar materials meets following requirement: conduct electricity very well, and meets the needs of big current transmission; Pyroconductivity is high, to guarantee to be gone out by the heat conduction that big current produces smoothly; Corrosion-resistant, good processability; Good stability of the dimension, is out of shape little in the processes such as follow-up assembling and product military service.
Description
Technical field
The utility model relates to a kind of busbar, and this busbar performance is good, good reliability, by solderable coating and the surface insulation layer of busbar substrate surface, realizes the welding of busbar in printed board and the reliable installation with structural member and parts.
Background technology
Along with the needs of the increase of electronic product power density and high-power electronic product high pressure, big current, in power electronic product, the transmission means of big current becomes design of electronic products and one of problem of paying close attention to the most in producing.For traditional bundle conductor transmission current, busbar has more advantage in the heat radiation and transmission, installation convenience and required installing space of big current.According to product electrical property needs, wish that section of bus bar can directly be welded in printed board, section of bus bar is then independently arranged on structural member or parts.For the busbar be welded in printed board, require that busbar has good solderability and electric property; For the busbar be directly installed on structural member and parts, then require that there are good conductivity, mechanical performance and insulation property.And aerospace power electronic product is due to its highly reliable, long-life requirement, new challenge is proposed to the dress connection technique of busbar.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, proposes a kind of busbar.
The purpose of this utility model is achieved through the following technical solutions.
A kind of busbar of the present utility model, is divided into two kinds of situations:
The first, be directly welded on the busbar in printed board, and this busbar comprises base material and coating; Substrate material is red copper, and the preferred trade mark is T2, purity is the red copper of 99.9%, and the reduction conduction contained in this red copper, the impurity of thermal conductivity are few, and therefore this red copper has good conduction, heat conduction, corrosion-resistant and processing characteristics, can weld and soldering; Coating is Sn63Pb coating, and coating electroplates the surface at base material by the mode of plating, and the thickness of coating is 5 μm ~ 15 μm;
The second, be directly installed on the busbar on structural member or parts, this busbar comprises base material and coating, substrate material is brass, the preferred trade mark of brass is the brass of H62, and this brass is except conductivity is a little less than except red copper, and other performances are similar to red copper, but strength ratio red copper is high, high to the requirement of mechanical strength of the busbar of brass material; Coating comprises two-layer, and one deck is Ni barrier layer, and another layer is Sn63Pb coating, and Ni barrier layer is by plating mode plating at substrate surface, and Sn63Pb coating is electroplated at Ni barrier layer surface by the mode of plating; The thickness on Ni barrier layer is 8 μm ~ 18 μm, and the thickness of Sn63Pb coating is 5 μm ~ 15 μm;
The third, be directly installed on the busbar on structural member or parts, comprise base material and coating, substrate material is aluminium alloy, and the preferred trade mark of this aluminium alloy is the aluminium alloy of 2A14T6, the conductivity of aluminium is about 60% of copper, when flowing through same current, the cross section of aluminium about exceeds 67% of copper cross section, and can reach the effect of loss of weight half, therefore strict demand is had to the quality of the busbar of this material, and when space allows; Coating comprises two-layer, and one deck is Ni barrier layer, and another layer is Sn63Pb coating, and Ni barrier layer is by plating mode plating at substrate surface, and Sn63Pb coating is electroplated on Ni barrier layer by the mode of plating; The thickness on Ni barrier layer is 8 μm ~ 18 μm, and the thickness of Sn63Pb coating is 5 μm ~ 15 μm;
When busbar is single structure, first its surface insulation layer sprays the epoxy ester baking insulating coating that a layer thickness is the H30-12 of 25 ~ 45 μm, and then adopts 50% lapping winding method to realize two-layer seamless surface insulation processing with the polyimides one side pressure sensitive adhesive tape that the trade mark of 3M company is P224 and strengthen the wear resistance of busbar further.Then metal or nonmetal fixture is adopted to be fixed on structural member.When adopting metal fixture, in order to ensure the insulation between fixture and busbar, minor insulation measure is adopted between fixture and busbar, first be on the securing means wound around polyimides one side pressure sensitive adhesive tape, then between fixture and busbar, polyimide insulative cover that between busbar and structural member, cushioning 1mm is thick.
When busbar is sandwich construction, on the basis of each individual layer busbar surface insulation process, the polyimide plate of cushioning 1mm thickness strengthens the layer insulation between each layer between the layers again, then adopts single layer structure busbar fixture to be fixed in the same way on structural member.
Beneficial effect
(1) type selecting of bus bar materials, as the carrier material of big current transmission, bus bar materials meets following requirement: conduct electricity very well, and meets the needs of big current transmission; Pyroconductivity is high, to guarantee to be gone out by the heat conduction that big current produces smoothly; Corrosion-resistant, good processability; Good stability of the dimension, is out of shape little in the processes such as follow-up assembling and product military service;
(2) busbar surface solderable coating design, in order to ensure that busbar has good solderability, implements solderable coating on busbar surface; Busbar surface solderable coating is generally silver-plated, but for the busbar be arranged on by reflow welding in printed board, when the busbar spacing of different potentials is nearer, the hidden danger of silver ion migration in product use procedure, can be there is, therefore the solderable coating on busbar surface is designed to lead tin coating;
(3) be directly installed on busbar in printed board due to the electric current of transmission relatively smaller, its overall dimension is general less, is generally the elongate body of simple elongate body or band capillary; Busbar is welded in printed board by the method that reflow welding connects; Being welded to connect reliably to ensure to be formed between busbar and the lines of printed board, requiring the printing line thickness of printed board each side to stretch out 1mm (can according to the width of busbar, highly suitably adjust) at busbar;
(4) in order to ensure that the thermal stress of printed board assembly and busbar matches, the symmetry of busbar in printed board should be ensured during printed board design, being uniformly distributed;
(5) busbar surface insulation process, for the single structure be arranged on structural member or parts or sandwich construction busbar, in order to electric insulation and product operation safety, insulation processing is carried out again in the surface also need implementing solderable coating at busbar, and busbar insulating barrier meets following requirement: insulating barrier should meet the electric insulation requirement of busbar; Insulating barrier meets busbar surface radiating, heat resistant requirements; Should have good adhesive force and antiwear property between insulating barrier and busbar, busbar prepared by the method can meet busbar insulation, heat radiation and wear resistance;
(6) the utility model extends to spacecraft or military high pressure, big current power electronic product etc. in the high high reliability circuit product of performance requirement.Be applicable to direct reflow welding or the busbar be arranged on structural member or parts in printed board and fill connection mode.
(7) the utility model is for design and application situation, consider highly reliable, the long-life handling characteristics of aerospace power electronic product, the process for making of busbar is mainly divided into the solderable coating design of the type selecting of bus bar materials, busbar surface, busbar surface insulation process three aspects.
Accompanying drawing explanation
Fig. 1 is the structural representation of single structure busbar;
Fig. 2 is the structural representation of sandwich construction busbar;
Fig. 3 is polyimides one side pressure sensitive adhesive tape 50% lapping winding method schematic diagram;
Fig. 4 is the schematic diagram of single layer structure busbar assembly method;
Fig. 5 is the scheme of installation that direct Surface Mount is welded on the red copper busbar in printed board;
Fig. 6 is the scheme of installation that direct plug-in mounting is welded on the red copper busbar in printed board.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Embodiment 1
Direct Surface Mount is welded on the red copper busbar in printed board, directly electroplates at red copper surface the Sn63Pb coating that a layer thickness is 5 μm ~ 15 μm.Being welded to connect reliably to ensure to be formed between busbar and the lines of printed board, requiring the printing line thickness of printed board each side to stretch out busbar about 1mm at busbar.When the length of busbar is more than 50mm, answer segment design, installation.As shown in Figure 5.
Embodiment 2
Direct plug-in mounting is welded on the red copper busbar in printed board, directly electroplates at red copper surface the Sn63Pb coating that a layer thickness is 5 μm ~ 15 μm.In order to ensure the connection reliability of busbar and printed board, require that the every 20mm of busbar increases by one and installs leg, during in order to ensure to weld, saturating tin is good, need at two of a busbar termination design step.As shown in Figure 6.
Note: the distance of installing between leg suitably can adjust according to the overall dimension of the applied mechanics environment of product and busbar.
Embodiment 3
Be directly installed on the single structure brass busbar on structural member, first electroplating a layer thickness is the Ni barrier layer of 8 μm ~ 18 μm, and then to electroplate a layer thickness be 5 μm ~ 15 μm Sn63Pb coating; First spray at its non-mounting surface insulating barrier the epoxy fat drying insulated paint that a layer thickness is the H30-12 of 25 ~ 45 μm before installation, and then adopt 50% lapping winding method to realize two-layer seamless surface insulation processing with the polyimides one side pressure sensitive adhesive tape that the trade mark of 3M company is P224 and strengthen the wear resistance of busbar further.And then carry out the installation with structural member.See shown in Fig. 1 and Fig. 3.
When busbar is four-layer structure, on the basis of each individual layer busbar surface insulation process, the polyimide plate of cushioning 1mm thickness strengthens the layer insulation between each layer between the layers again, then adopts single layer structure busbar fixture to be fixed in the same way on structural member.
Embodiment 4
Be directly installed on four layers of chalocopyrite structure busbar on structural member, on the basis of each single structure busbar surface insulation process, the polyimide plate of cushioning 1mm thickness strengthens the layer insulation between each layer between the layers again, polyimide plate than busbar each side wide go out at least 1mm, and install time should install between two parties.Then metal clamps is adopted to be fixed on structural member by multilayer busbar, first in metal clamps, adopt 50% lapping winding method to be wound around polyimides one side pressure sensitive adhesive tape, then between metal clamps and busbar, that polyimide insulative cover that between busbar and structural member, cushioning 1mm is thick carries out installations is fixing.See shown in Fig. 2 and Fig. 4.
The content be not described in detail in the utility model specification belongs to technology as well known to those skilled in the art.
Claims (9)
1. a busbar, is characterized in that: this busbar comprises base material and coating; Substrate material is red copper, and coating is Sn63Pb coating, and coating electroplates the surface at base material by the mode of plating.
2. a kind of busbar according to claim 1, is characterized in that: the thickness of coating is 5 μm ~ 15 μm.
3. a kind of busbar according to claim 1, is characterized in that: red copper purity is 99.9%.
4. a busbar, is characterized in that: this busbar comprises base material and coating; Substrate material is brass or aluminium alloy; Coating comprises two-layer, and one deck is Ni barrier layer, and another layer is Sn63Pb coating, and Ni barrier layer is by plating mode plating at substrate surface, and Sn63Pb coating is electroplated on Ni barrier layer by the mode of plating.
5. a kind of busbar according to claim 4, is characterized in that: the thickness on Ni barrier layer is 8 μm ~ 18 μm.
6. a kind of busbar according to claim 4, is characterized in that: the thickness of Sn63Pb coating is 5 μm ~ 15 μm.
7. the arbitrary described busbar of claim 1-6, is characterized in that: this busbar also comprises epoxy ester baking insulating coating and the polyimides one side pressure sensitive adhesive tape of H30-12; The epoxy ester baking insulating coating of H30-12 is sprayed on coating surface, and polyimides one side pressure sensitive adhesive tape is wrapped in the epoxy ester baking insulating coating surface of H30-12.
8. busbar according to claim 7, is characterized in that: the thickness of the epoxy ester baking insulating coating of H30-12 is 25 ~ 45 μm.
9. busbar according to claim 7, is characterized in that: polyimides one side pressure sensitive adhesive tape adopts 50% lapping winding method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420543442.6U CN204155616U (en) | 2014-09-19 | 2014-09-19 | A kind of busbar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420543442.6U CN204155616U (en) | 2014-09-19 | 2014-09-19 | A kind of busbar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204155616U true CN204155616U (en) | 2015-02-11 |
Family
ID=52513714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420543442.6U Expired - Fee Related CN204155616U (en) | 2014-09-19 | 2014-09-19 | A kind of busbar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204155616U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410467A (en) * | 2016-09-19 | 2017-02-15 | 中国电子科技集团公司第十八研究所 | Aluminum bus bar and processing technology |
| CN112331412A (en) * | 2020-10-20 | 2021-02-05 | 南通德晋昌光电科技有限公司 | Supply system of interconnection strips and processing technology thereof |
| CN112616252A (en) * | 2020-12-09 | 2021-04-06 | 深圳市国鑫恒运信息安全有限公司 | Method and device applied to power supply of high-power-consumption PCBA of general server |
-
2014
- 2014-09-19 CN CN201420543442.6U patent/CN204155616U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106410467A (en) * | 2016-09-19 | 2017-02-15 | 中国电子科技集团公司第十八研究所 | Aluminum bus bar and processing technology |
| CN106410467B (en) * | 2016-09-19 | 2018-11-02 | 中国电子科技集团公司第十八研究所 | Processing technology of aluminum bus bar |
| CN112331412A (en) * | 2020-10-20 | 2021-02-05 | 南通德晋昌光电科技有限公司 | Supply system of interconnection strips and processing technology thereof |
| CN112616252A (en) * | 2020-12-09 | 2021-04-06 | 深圳市国鑫恒运信息安全有限公司 | Method and device applied to power supply of high-power-consumption PCBA of general server |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150211 |