CN211297134U - Printed circuit board with only soldering pad plated with lead and tin - Google Patents
Printed circuit board with only soldering pad plated with lead and tin Download PDFInfo
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- CN211297134U CN211297134U CN202020082025.1U CN202020082025U CN211297134U CN 211297134 U CN211297134 U CN 211297134U CN 202020082025 U CN202020082025 U CN 202020082025U CN 211297134 U CN211297134 U CN 211297134U
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Abstract
The utility model relates to a circuit board technical field, especially only pad lead-tin plating printed circuit board, including insulating substrate, insulating substrate is including alkali-free glass cloth layer, epoxy phenolic resin layer and corrosion resistant layer, a plurality of pad holes have been seted up on insulating substrate's surface, and are a plurality of insulating substrate is all run through in the pad hole, and is a plurality of the equal fixedly connected with pad of inner wall in pad hole, the pad is including pad conductor layer, lead-tin alloy cladding material and silicone grease filling layer. The utility model has the advantages that: through having set up the silicone grease filling layer, and the silicone grease filling layer fills in the gap department between pad and insulating substrate and pad hole, one side and the pad conductor layer fixed connection of silicone grease filling layer, the opposite side of silicone grease filling layer with state corrosion-resistant layer fixed connection, can make the heat between pad and the pad hole dissipate fast, reduce generating heat of circuit board, improve the fastness and the stability of pad and pad jogged joint simultaneously, reach the purpose that improves the practicality.
Description
Technical Field
The utility model relates to a circuit board technical field, especially only pad lead-tin plating printed circuit board.
Background
The printed circuit board plays a role in mounting and supporting and electrically connecting electronic components in the electronic product. Therefore, the weldability is an extremely important technical index, the poor welding of elements directly influences the performance and reliability of the whole machine, and particularly when a wave soldering machine is adopted for assembly welding, if the weldability of a printed board is poor, desoldering, false welding and the like can occur, light persons need to rework the places with poor welding, heavy persons can not repair the printed board in large batch, and even components on the printed board are scrapped, so that great economic loss is caused. At present, lead and tin are plated only on the surface of a bonding pad and the inner surface of a metallized hole to improve the solderability, but at present, the bonding pad-only lead and tin-plated printed circuit board has the following problems in practical use:
the existing printed circuit board only with the solder pad plated with lead and tin has poor heat dissipation effect due to the direct contact of the solder pad with the inner wall of the through hole on the circuit board substrate, and has the problems of loose connection and easy loosening caused by gaps between the solder pad and the substrate.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome prior art's shortcoming, provide only pad lead-tin printed circuit board, effectively solved prior art not enough.
The purpose of the utility model is realized through the following technical scheme: the printed circuit board only comprises an insulating substrate, wherein the insulating substrate comprises an alkali-free glass cloth layer, an epoxy phenolic resin layer and a corrosion-resistant layer, a plurality of pad holes are formed in the surface of the insulating substrate and penetrate through the insulating substrate, a plurality of pads are fixedly connected to the inner wall of each pad hole, each pad comprises a pad conductor layer, a lead-tin alloy coating and a silicone grease filling layer, a plurality of copper foil circuit strips are fixedly connected to the surface of the insulating substrate and comprise electroplated copper layers and oxidation-resistant layers, the epoxy phenolic resin layer is two-layer, the epoxy phenolic resin layers are respectively fixed to two sides of the alkali-free glass cloth layer, the corrosion-resistant layer is two-layer, and the corrosion-resistant layers are respectively fixed to one side, away from the alkali-free glass cloth layer, of the two epoxy phenolic resin layers.
Optionally, the copper electroplating layer is fixedly connected with the corrosion-resistant layer, two ends of the copper electroplating layer are both fixedly connected with the pad conductor layer, and the oxidation-resistant layers are respectively distributed on the top and two sides of the copper electroplating layer.
Optionally, a metalized hole is formed in the circle center of the pad, and lead-tin alloy plating layers are electroplated on the inner wall of the metalized hole and the top surface and the bottom surface of the pad conductor layer.
Optionally, the silicone grease filling layer is filled in a gap between the pad and the insulating substrate and between the pad and the pad hole, one side of the silicone grease filling layer is fixedly connected with the pad conductor layer, and the other side of the silicone grease filling layer is fixedly connected with the corrosion-resistant layer.
Optionally, the copper foil circuit strips penetrate through the silicone grease filling layer and are fixedly connected with the pad conductor layer, and the contact part of the electroplated copper layer and the pad conductor layer is not covered by the anti-oxidation layer.
Optionally, the diameters of the top and the bottom of the pad are larger than the diameter of the pad hole, and the diameter of the middle of the pad is smaller than the diameter of the pad hole.
Optionally, the insulating substrate is formed by pressing an alkali-free glass cloth layer and an epoxy phenolic resin layer at a high temperature and plating a corrosion-resistant layer on the surface of the alkali-free glass cloth layer and the epoxy phenolic resin layer, wherein tricyanodiamine is used as a curing agent.
Optionally, the corrosion-resistant layer is made of polytetrafluoroethylene, and the oxidation-resistant layer is made of electroplated palladium.
The utility model has the advantages of it is following:
1. this only pad lead-tin plating printed circuit board, through having set up the silicone grease filling layer, and the silicone grease filling layer fills in gap department between pad and insulating substrate and pad hole, one side and the pad conductor layer fixed connection of silicone grease filling layer, the opposite side of silicone grease filling layer with state corrosion-resistant layer fixed connection, because the silicone grease has the good and adhesive effect that has of heat dispersion, can make the heat between pad and the pad hole dissipate fast, reduce generating heat of circuit board, improve pad and pad hole connection's fastness and stability simultaneously, reach the purpose that improves the practicality.
2. This only pad lead-tin-plated printed circuit board, through having set up corrosion resistant layer and oxidation resisting layer, and the material on corrosion resistant layer is polytetrafluoroethylene, the material of oxidation resisting layer is electroplating palladium, while corrosion resistant layer is located insulating substrate's surface, the oxidation resisting layer distributes respectively in the top and both sides of electroplating copper layer, can effectual improvement insulating substrate's corrosion resistance, the while also improves the anti-oxidant effect of copper foil line strip, and oxidation resisting layer electric conductivity is poor, electroplating copper layer and pad conductor layer contact segment do not cover the oxidation resisting layer simultaneously, make the normal circular telegram of oxidation resisting layer not influence copper foil line strip, reach improvement circuit board life's purpose.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic rear view of the present invention;
fig. 3 is a schematic front view of the insulating substrate of the present invention;
fig. 4 is a schematic view of the internal structure of the present invention;
fig. 5 is an enlarged schematic view of the structure at a in fig. 4 according to the present invention;
fig. 6 is a schematic structural diagram of the present invention.
In the figure: 1-insulating substrate, 101-alkali-free glass cloth layer, 102-epoxy phenolic resin layer, 103-corrosion-resistant layer, 2-copper foil circuit bar, 201-electroplated copper layer, 202-oxidation-resistant layer, 3-bonding pad, 301-bonding pad conductor layer, 302-lead-tin alloy plating layer, 303-silicone grease filling layer, 4-bonding pad hole and 5-bonding pad hole.
Detailed Description
The invention will be further described with reference to the accompanying drawings, but the scope of the invention is not limited to the following description.
As shown in fig. 1 to 6, the pad-only pb-sn printed circuit board includes an insulating substrate 1, the insulating substrate 1 includes an alkali-free glass cloth layer 101, an epoxy-phenolic resin layer 102 and an anti-corrosion layer 103, a plurality of pad holes 4 are formed on the surface of the insulating substrate 1, the plurality of pad holes 4 penetrate through the insulating substrate 1, pads 3 are fixedly connected to inner walls of the plurality of pad holes 4, the pads 3 include a pad conductor layer 301, the lead-tin alloy coating 302 and the silicone grease filling layer 303, the surface of the insulating substrate 1 is fixedly connected with a plurality of copper foil circuit strips 2, each of the plurality of copper foil circuit strips 2 comprises an electroplated copper layer 201 and an oxidation resistant layer 202, two epoxy phenolic resin layers 102 are provided, the two epoxy phenolic resin layers 102 are respectively fixed on two sides of the alkali-free glass cloth layer 101, the corrosion resistant layers 103 are two in total, and the two corrosion resistant layers 103 are respectively fixed on one side of the two epoxy phenolic resin layers 102 away from the alkali-free glass cloth layer 101.
As an optional technical solution of the utility model:
the electroplated copper layer 201 is fixedly connected with the corrosion-resistant layer 103, two ends of the electroplated copper layer 201 are fixedly connected with the pad conductor layer 301, and the oxidation-resistant layers 202 are respectively distributed on the top and two sides of the electroplated copper layer 201.
As an optional technical solution of the utility model:
the centre of a circle department of pad 3 is provided with metallization hole 5, and the inner wall in metallization hole 5 and the top surface and the bottom surface of pad conductor layer 301 all have electroplated lead-tin alloy cladding material 302, can improve printed circuit board's solderability greatly, only has electroplated lead-tin alloy cladding material 302 simultaneously at the inner wall in metallization hole 5 and the top surface and the bottom surface of pad conductor layer 301, has both practiced thrift non ferrous metal, can avoid destroying the solder mask on the lines when wave-soldering again.
As an optional technical solution of the utility model:
the silicone grease filling layer 303 is filled in the gap between the pad 3 and the insulating substrate 1 and the pad hole 4, one side of the silicone grease filling layer 303 is fixedly connected with the pad conductor layer 301, and the other side of the silicone grease filling layer 303 is fixedly connected with the corrosion-resistant layer 103, so that the silicone grease filling layer 303 can seal the section of the insulating substrate 1 which is not sealed by the corrosion-resistant layer 103, the insulating substrate 1 is prevented from being damaged from the section of the pad hole 4, and the service life of the insulating substrate is prolonged.
As an optional technical solution of the utility model:
the copper foil circuit strips 2 penetrate through the silicone grease filling layer 303 and are fixedly connected with the pad conductor layer 301, and the contact part of the electroplated copper layer 201 and the pad conductor layer 301 is not covered with the oxidation resistant layer 202, so that the oxidation resistant layer 202 is prevented from influencing the electroplated copper layer 201 and the pad conductor layer 301 to form a passage.
As an optional technical solution of the utility model:
the diameters of the top and the bottom of the bonding pad 3 are larger than the diameter of the bonding pad hole 4, and the diameter of the middle of the bonding pad 3 is smaller than the diameter of the bonding pad hole 4, so that the bonding pad 3 can clamp the two sides of the bonding pad hole 4, and the firmness is improved.
As an optional technical solution of the utility model:
the insulating substrate 1 is formed by pressing the alkali-free glass cloth layer 101 and the epoxy phenolic resin layer 102 at a high temperature and plating the corrosion-resistant layer 103 on the surface, has the advantages of light weight, good electrical and mechanical properties, convenient processing and the like, and the alkali-free glass cloth layer 101 and the epoxy phenolic resin layer 102 adopt the tricyanodiamine as the curing agent, so that the circuit board has good transparency.
As an optional technical solution of the utility model:
the corrosion-resistant layer 103 is made of polytetrafluoroethylene, the polytetrafluoroethylene has the advantages of high temperature resistance, low temperature resistance, corrosion resistance, no toxicity, electric insulation and the like, the service life of the circuit board can be effectively prolonged, the normal use of the circuit board is not influenced, the oxidation-resistant layer 202 is made of electroplated palladium, the electroplated palladium has an oxidation-resistant effect and is poor in electric conductivity, and the normal operation of the circuit is not influenced while the copper foil circuit strips 2 are protected.
The working process of the utility model is as follows: when the user uses the electroplating device, the silicon grease filling layer 303 is arranged, the silicon grease filling layer 303 is filled in the gap between the pad 3 and the insulating substrate 1 and the pad hole 4, one side of the silicon grease filling layer 303 is fixedly connected with the pad conductor layer 301, the other side of the silicon grease filling layer 303 is fixedly connected with the corrosion-resistant layer 103, because the silicon grease has good heat dissipation performance and bonding effect, the heat between the pad 3 and the pad hole 4 can be quickly dissipated, the heating of the circuit board is reduced, the firmness and the stability of the connection between the pad and the pad hole 4 are improved, the purpose of improving the practicability is achieved, the corrosion-resistant layer 103 and the oxidation-resistant layer 202 are arranged, the corrosion-resistant layer 103 is made of polytetrafluoroethylene, the oxidation-resistant layer 202 is made of electroplated palladium, the corrosion-resistant layer 103 is positioned on the outer surface of the insulating substrate 1, and the oxidation-resistant layer 202 is respectively distributed on the top and two sides of the copper layer 201, can effectual improvement insulating substrate 1's corrosion resistance, also improved the anti-oxidant effect of copper foil wire rod 2 simultaneously, oxidation resisting layer 202 electric conductivity is poor moreover, and the copper layer 201 of electroplating simultaneously does not cover oxidation resisting layer 202 with pad conductor layer 301 contact part, makes oxidation resisting layer 202 not influence the normal circular telegram of copper foil wire rod 2, reaches improvement circuit board life's purpose.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Only pad lead-tin plating printed circuit board, its characterized in that: the insulating substrate (1) comprises an alkali-free glass cloth layer (101), an epoxy phenolic resin layer (102) and a corrosion-resistant layer (103), a plurality of pad holes (4) are formed in the surface of the insulating substrate (1), the pad holes (4) all penetrate through the insulating substrate (1), a plurality of pads (3) are fixedly connected to the inner walls of the pad holes (4), each pad (3) comprises a pad conductor layer (301), a lead-tin alloy coating (302) and a silicone grease filling layer (303), a plurality of copper foil circuit strips (2) are fixedly connected to the surface of the insulating substrate (1), the copper foil circuit strips (2) all comprise an electroplated copper layer (201) and an oxidation-resistant layer (202), the epoxy phenolic resin layer (102) is two-layer, and the epoxy phenolic resin layers (102) are respectively fixed on two sides of the alkali-free glass cloth layer (101), the corrosion-resistant layer (103) has two layers, and the two corrosion-resistant layers (103) are respectively fixed on one sides of the two epoxy phenolic resin layers (102) far away from the alkali-free glass cloth layer (101).
2. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the electroplated copper layer (201) is fixedly connected with the corrosion-resistant layer (103), two ends of the electroplated copper layer (201) are fixedly connected with the pad conductor layer (301), and the oxidation-resistant layers (202) are respectively distributed on the top and two sides of the electroplated copper layer (201).
3. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the circle center of the bonding pad (3) is provided with a metallized hole (5), and the inner wall of the metallized hole (5) and the top surface and the bottom surface of the bonding pad conductor layer (301) are both electroplated with a lead-tin alloy plating layer (302).
4. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the silicon grease filling layer (303) is filled in a gap between the pad (3) and the insulating substrate (1) and between the silicon grease filling layer and the pad hole (4), one side of the silicon grease filling layer (303) is fixedly connected with the pad conductor layer (301), and the other side of the silicon grease filling layer (303) is fixedly connected with the corrosion-resistant layer (103).
5. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the copper foil circuit strips (2) penetrate through the silicone grease filling layer (303) and are fixedly connected with the pad conductor layer (301), and the contact part of the electroplated copper layer (201) and the pad conductor layer (301) is not covered with the anti-oxidation layer (202).
6. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the diameters of the top and the bottom of the bonding pad (3) are larger than the diameter of the bonding pad hole (4), and the diameter of the middle of the bonding pad (3) is smaller than the diameter of the bonding pad hole (4).
7. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the insulating substrate (1) is formed by pressing an alkali-free glass cloth layer (101) and an epoxy phenolic resin layer (102) at high temperature and plating an anti-corrosion layer (103) on the surface, wherein the alkali-free glass cloth layer (101) and the epoxy phenolic resin layer (102) adopt tricyanodiamine as curing agents.
8. The pad-only lead-tin plated printed circuit board according to claim 1, characterized in that: the corrosion-resistant layer (103) is made of polytetrafluoroethylene, and the oxidation-resistant layer (202) is made of electroplated palladium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020082025.1U CN211297134U (en) | 2020-01-15 | 2020-01-15 | Printed circuit board with only soldering pad plated with lead and tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020082025.1U CN211297134U (en) | 2020-01-15 | 2020-01-15 | Printed circuit board with only soldering pad plated with lead and tin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211297134U true CN211297134U (en) | 2020-08-18 |
Family
ID=72021384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020082025.1U Expired - Fee Related CN211297134U (en) | 2020-01-15 | 2020-01-15 | Printed circuit board with only soldering pad plated with lead and tin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211297134U (en) |
-
2020
- 2020-01-15 CN CN202020082025.1U patent/CN211297134U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200818 Termination date: 20220115 |
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| CF01 | Termination of patent right due to non-payment of annual fee |