CN216852483U - Circuit board - Google Patents
Circuit board Download PDFInfo
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- CN216852483U CN216852483U CN202122038640.XU CN202122038640U CN216852483U CN 216852483 U CN216852483 U CN 216852483U CN 202122038640 U CN202122038640 U CN 202122038640U CN 216852483 U CN216852483 U CN 216852483U
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Abstract
The application discloses circuit board, including first circuit board and second circuit board, wherein the outer surface of at least one side of first circuit board includes first conductive connection portion, the outer surface of at least one side of second circuit board includes second conductive connection portion, establish the metal lug through covering on first conductive connection portion, keep away from a side surface upper cover of first conductive connection portion at the metal lug and establish the conductive slurry layer, then establish a side surface of keeping away from the metal lug with the conductive connection portion lid on the conductive slurry layer, thereby realize the electricity of first circuit board and second circuit board through setting up of metal lug and conductive slurry layer and be connected, Z is to the interconnection promptly. And through the combined use of the metal lug boss and the conductive paste layer, the connection reliability of the first circuit board and the second circuit board is improved, and the thickness of the conductive paste layer in the thickness direction is reduced, so that the resistance value of the connection part between layers is reduced, and the loss of signal transmission between circuit board layers is reduced.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a circuit board.
Background
At present, a Z-direction interconnection technology of a circuit board, that is, a conduction connection technology between layers of the circuit board, has a more flexible connection concept, a shorter processing flow and better reliability, and is more and more widely applied to multi-level HDI and multi-level assembly welding products, and may become one of necessary technologies in the fields of 6G and high frequency in the future.
However, the conventional Z-direction interconnection technology usually uses solder balls or solder paste for connection, but the solder balls or solder paste have large resistance, which causes large signal transmission loss between layers after Z-direction interconnection, and the problem that the connection region is easy to crack in a high-temperature and high-heat environment for a long time. Therefore, new Z-direction interconnection technology for circuit boards needs to be explored to improve the stability and reliability of Z-direction interconnection.
SUMMERY OF THE UTILITY MODEL
The application provides a circuit board to solve the problem that the Z-direction interconnection reliability of the circuit board is poor and the signal transmission loss is large.
In order to solve the technical problem, the application adopts a technical scheme that: provided is a circuit board including: the outer layer surface of at least one side of the first circuit board comprises a first conductive connecting part; the metal bulge is covered on the first conductive connecting part; the conductive slurry layer is covered on the surface of one side of the metal protruding part far away from the first conductive connecting part; and the outer layer surface of at least one side of the second circuit board comprises a second conductive connecting part, and the second conductive connecting part is covered on the surface of one side of the conductive slurry layer, which is far away from the metal bulge part, so that the first circuit board is electrically connected with the second circuit board.
Optionally, the first conductive connecting portion is a metal pad, and the second conductive connecting portion is a metal pad.
Optionally, the outer layer surface of one side of the first circuit board, which is away from the metal protruding portion, includes a third conductive connecting portion, and a conductive metalized hole is provided between the first conductive connecting portion and the third conductive connecting portion, so that the first conductive connecting portion and the third conductive connecting portion are electrically connected through the conductive metalized hole.
Optionally, the conductive metallization hole is filled with an insulating material.
Optionally, an insulating layer is further included between the first circuit board and the second circuit board, a groove is formed in the insulating layer, and the conductive paste layer is located in the groove.
Optionally, the conductive paste layer is one of a carbon-based paste layer, a gold-based paste layer, a silver-based paste layer, a copper-based paste layer, and a nickel-based paste layer.
Optionally, the conductive paste layer is a combined paste layer formed by at least two of carbon-based paste, gold-based paste, silver-based paste, copper-based paste, and nickel-based paste.
Optionally, the metal bump is one of a copper pillar bump, a silver pillar bump, and a gold pillar bump.
Alternatively, the metal bump is formed by an electroplating process.
Optionally, the second circuit board is a package substrate.
The beneficial effect of this application is: the circuit board comprises a first circuit board and a second circuit board, wherein at least one side outer layer surface of the first circuit board comprises a first conductive connecting part, at least one side outer layer surface of the second circuit board comprises a second conductive connecting part, a metal protruding part is arranged on the first conductive connecting part through a cover, a conductive slurry layer is arranged on one side surface, away from the first conductive connecting part, of the metal protruding part in a covering mode, then the second conductive connecting part is arranged on one side surface, away from the metal protruding part, of the conductive slurry layer in a covering mode, and therefore the first conductive connecting part and the second conductive connecting part are electrically connected through the arrangement of the metal protruding part and the conductive slurry layer, the first circuit board and the second circuit board are electrically connected, and the circuit board is interconnected in the Z direction. And through the combined use of the metal lug boss and the conductive paste layer, the connection reliability of the first circuit board and the second circuit board is improved, and the thickness of the conductive paste layer in the thickness direction or in the layer-to-layer direction is reduced, so that the resistance value of the connection position between layers is reduced, and the loss of signal transmission between circuit board layers is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the embodiments and the drawings used in the description of the prior art, and obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts.
FIG. 1 is a schematic diagram of a circuit board according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another embodiment of a circuit board provided in the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those skilled in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments without conflict. The following are detailed descriptions of the respective embodiments.
The circuit board in this application is a multilayer circuit board, where the first circuit board and the second circuit board may be a flexible circuit board, a rigid circuit board, or a rigid-flexible circuit board, which is not limited herein. Among them, a Flexible Printed Circuit (FPC) may be called a Flexible Circuit board, and has a Flexible performance.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a circuit board provided in the present application. The circuit board 10 includes a first circuit board 11, a metal bump 12, a conductive paste layer 13, and a second circuit board 14.
At least one side of the outer layer surface of the first circuit board 11 includes a first conductive connection portion 111, the metal protrusion 12 covers the first conductive connection portion 111, and the conductive paste layer 13 covers one side surface of the metal protrusion 12 away from the first conductive connection portion 111. At least one side of the outer layer surface of the second circuit board 14 includes a second conductive connecting portion 141, and the second conductive connecting portion 141 covers a side surface of the conductive paste layer 13 away from the metal bump 12, so as to electrically connect the first circuit board 11 and the second circuit board 14.
In the present embodiment, the electrical connection of the first circuit board 11 and the second circuit board 14, that is, the Z-direction interconnection of the circuit boards 10 is realized by providing the metal bump 12 and the conductive paste layer 13 between the first conductive connection portion 111 and the second conductive connection portion 141. And through the combined use of the metal convex part 12 and the conductive paste layer 13, the connection reliability of the first circuit board 11 and the second circuit board 14 is improved, the thickness of the conductive paste layer 13 in the thickness direction or the layer-to-layer direction (Z direction) is reduced, the occupation ratio of the conductive paste layer 13 at the connection part between layers is reduced, so that the resistance value of the connection part between layers is reduced, and the loss of signal transmission between layers of the circuit board 10 is reduced.
The first conductive connection portion 111 and the second conductive connection portion 141 may be metal PAD structures, which are also called PADs.
Further, the metal convex portion 12 may be formed by an electroplating process. For example, the metal bump 12 is formed by plating on the first conductive connection portion 111 on the surface of the first circuit board 11. Specifically, the plated metal may be a single metal, such as copper, silver, gold, or the like, thereby forming a corresponding copper pillar bump, silver pillar bump, or gold pillar bump. The plated metal may also be an alloy such as: electroplating copper-based alloys, electroplating zinc-based alloys, electroplating cadmium-based alloys, electroplating indium-based alloys, electroplating tin-based alloys, electroplating nickel-based alloys, and the like. It is understood that the metal used in the electroplating process is not limited to the above-mentioned metal, and other metals, such as zinc, nickel, chromium, tin, iron, cobalt, cadmium, lead, etc., which are commonly used in the electroplating process, can be electroplated here to obtain the metal bump 12, and the corresponding metal can be selected for electroplating according to actual requirements when used specifically.
In the present embodiment, the conductive paste layer 13 may be one of a carbon-based paste layer, a gold-based paste layer, a silver-based paste layer, a copper-based paste layer, and a nickel-based paste layer. In other embodiments, the conductive paste layer 13 may be a combined paste layer formed by at least two of carbon-based paste, gold-based paste, silver-based paste, copper-based paste, and nickel-based paste.
In other embodiments, the conductive paste layer 13 may be made of thermosetting conductive paste. Specifically, the thermosetting conductive adhesive may be silver-based conductive adhesive, gold-based conductive adhesive, copper-based conductive adhesive, carbon-based conductive adhesive, or the like.
Specifically, the insulating layer 15 is covered on one side of the second circuit board 14 close to the second conductive connection portion 141, and the insulating layer 15 is grooved by laser according to the preset shape of the conductive paste layer 13, so that at least part of the surface of the second conductive connection portion 141 is exposed, and then conductive paste, such as copper paste, is poured into the groove and is sintered by high-temperature pressing to obtain the conductive paste layer 13, so that the conductive paste layer 13 is in contact with at least part of the second conductive connection portion 141, and electrical connection is achieved.
The first circuit board 11 and the metal protruding portion 12 formed on the first conductive connecting portion 111 on the surface thereof are together contacted and connected with the conductive paste on the second circuit board 14 and the second conductive connecting portion 141 on the surface thereof to perform high temperature pressing, so that the metal protruding portion 12 is contacted with the conductive paste to fixedly connect the circuit board 10, and meanwhile, the conductive paste can be tightly connected with the metal protruding portion 12 and the second conductive connecting portion 141, and is sintered and formed at a high temperature to form the conductive paste layer 13. Because the conductive paste layer 13 has certain fluidity and adhesiveness, the Z-direction connection between the first circuit board 11 and the second circuit board 14 can be more stable, and the reliability of the interlayer interconnection of the circuit boards 10 can be increased. Since the conductive paste layer 13 has good conductivity, the Z-direction electrical connection between the first circuit board 11 and the second circuit board 14 can be achieved together with the metal bumps 12 having also good conductivity. Because the conductive paste used by the conductive paste layer 13 includes a non-conductive material, compared with a pure metal material, the conductive paste has a larger resistance value, so that the thickness of the conductive paste layer 13 in the joint between the first circuit board 11 and the second circuit board 14 can be reduced by combining the metal protrusion 12 and the conductive paste layer 13, or the occupation ratio of the conductive paste layer 13 in the joint between the first circuit board 11 and the second circuit board 14 can be reduced, the resistance value of the joint between the first circuit board 11 and the second circuit board 14 can be reduced, and the loss of signal transmission between layers of the circuit board 10 can be reduced.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of the circuit board provided by the present application. The circuit board 20 includes a first circuit board 21, a metal bump 22, a conductive paste layer 23, a second circuit board 24, and an insulating layer 25.
The first circuit board 21 includes a first conductive connection portion 211 on an outer surface of one side thereof, and the metal bump 22 is covered on the first conductive connection portion 211. The insulating layer 25 is provided with a groove (not shown), the conductive paste layer 23 is located in the groove, the insulating layer 25 containing the conductive paste layer 23 covers the metal protrusion 22 on the surface of the side away from the first conductive connection portion 211, and the conductive paste layer 23 is in contact connection with the metal protrusion 22. The surface of the outer layer on one side of the second circuit board 24 includes a second conductive connecting portion 241, and the second conductive connecting portion 241 is covered on the surface of the conductive paste layer 23 on one side far away from the metal bump 22, so as to realize the electrical connection between the first circuit board 21 and the second circuit board 24.
The metal bump 22 is prepared on the first conductive connection portion 211 of the first circuit board 21 by a copper pillar electroplating process by a wire bonding method, and the metal bump 22 is a copper pillar bump.
Further, the outer surface of the first circuit board 21 on the side away from the metal bump 22 includes a third conductive connection portion 212, a conductive metallization hole 213 is disposed between the first conductive connection portion 211 and the third conductive connection portion 212, and a conductive metal is plated on a hole wall of the conductive metallization hole 213, so that the first conductive connection portion 211 and the third conductive connection portion 213 can be electrically connected through the conductive metallization hole 213.
Further, the conductive metallization hole 213 is filled with an insulating material, such as a resin, inside the hole to protect the conductive metallization hole 213.
In the present embodiment, the first circuit board 21 may be a multilayer circuit board, and the second circuit board 24 may be a package Substrate (SUB). The first circuit board 21 is prepared by a conventional PCB processing method. The second circuit board 24 is prepared by a conventional SUB processing method. The first circuit board 21 may be larger in size than the second circuit board 24.
The insulating layer 25 may be a prepreg (also referred to as prepreg or pp) that serves as an insulation between the first circuit board 21 and the second circuit board 24. In other embodiments, other insulating materials may be used for insulating layer 25.
The above description is only an example of the present application, and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes performed by the present application and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (9)
1. A circuit board, comprising:
the surface of at least one side outer layer of the first circuit board comprises a first conductive connecting part;
the metal bulge part is covered on the first conductive connecting part;
the conductive slurry layer is covered on the surface of one side of the metal protruding part, which is far away from the first conductive connecting part;
and the outer layer surface of at least one side of the second circuit board comprises a second conductive connecting part, and the second conductive connecting part is covered on the surface of one side of the conductive slurry layer, which is far away from the metal bulge part, so that the first circuit board is electrically connected with the second circuit board.
2. The circuit board of claim 1, wherein the first conductive connection portion is a metal pad and the second conductive connection portion is a metal pad.
3. The circuit board according to claim 1, wherein a surface of an outer layer of the first circuit board on a side away from the metal bump comprises a third conductive connecting portion, and a conductive metallization hole is disposed between the first conductive connecting portion and the third conductive connecting portion, so that the first conductive connecting portion and the third conductive connecting portion are electrically connected through the conductive metallization hole.
4. The circuit board of claim 3, wherein the conductive metalized holes are filled with an insulating material.
5. The circuit board of claim 1, further comprising an insulating layer between the first circuit board and the second circuit board, wherein a groove is formed in the insulating layer, and the conductive paste layer is located in the groove.
6. The circuit board of claim 1, wherein the conductive paste layer is one of a carbon-based paste layer, a gold-based paste layer, a silver-based paste layer, a copper-based paste layer, and a nickel-based paste layer.
7. The circuit board of claim 1, wherein the metal bump is one of a copper pillar bump, a silver pillar bump, and a gold pillar bump.
8. The circuit board of claim 1, wherein the metal bump is formed by a plating process.
9. The circuit board of claim 1, wherein the second circuit board is a package substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122038640.XU CN216852483U (en) | 2021-08-26 | 2021-08-26 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122038640.XU CN216852483U (en) | 2021-08-26 | 2021-08-26 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216852483U true CN216852483U (en) | 2022-06-28 |
Family
ID=82082017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122038640.XU Active CN216852483U (en) | 2021-08-26 | 2021-08-26 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216852483U (en) |
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2021
- 2021-08-26 CN CN202122038640.XU patent/CN216852483U/en active Active
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