JP2014096260A - Flat wiring material and mounting body using it - Google Patents

Flat wiring material and mounting body using it Download PDF

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JP2014096260A
JP2014096260A JP2012246620A JP2012246620A JP2014096260A JP 2014096260 A JP2014096260 A JP 2014096260A JP 2012246620 A JP2012246620 A JP 2012246620A JP 2012246620 A JP2012246620 A JP 2012246620A JP 2014096260 A JP2014096260 A JP 2014096260A
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fixing
connection
solder material
mounting substrate
flat
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Takumi Kobayashi
拓実 小林
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Proterial Ltd
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Hitachi Metals Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a flat wiring material and a mounting body using it which can be soldered and jointed with high reliability by reducing stress by temperature variation generated to solder materials connecting a connection unit and a mounted board when thermal compression bond formula is used to connect the flat wiring material to the mounted board.SOLUTION: A flat wiring material comprises multiple conductor for signals 2 arranged with intervals and arranged to a cross direction side by side, and multiple connection units 22 provided to at least one end of the multiple conductor for signals 2 and connected to a printed circuit board 7 through solder materials. The connection unit 22 comprises a convex part 221 that an area where the thickness of the solder materials is thin is a spot or a line along the cross direction between the printed circuit board 7, a flat part 222 that the thickness of the solder materials is thick between the mounted board, an under surface 222a facing to the printed circuit board 7, and a flat surface 222b on a contralateral surface of the under surface 222a.

Description

本発明は、フレキシブルフラットケーブルをはじめとするMFJ(Multi Frame Joiner)、フレキシブルプリント配線板などのフラット配線材及びそれを用いた実装体に関する。   The present invention relates to an MFJ (Multi Frame Joiner) including a flexible flat cable, a flat wiring material such as a flexible printed wiring board, and a mounting body using the same.

(車載機器におけるプリント配線板間の配線部品)
車載用インバータユニットやエンジンコントロールユニットなどに実装される複数のプリント配線板間の電気的接続用配線部品には、従来、ワイヤハーネスが用いられている。また、このワイヤハーネスとプリント配線板との電気的接続には、コネクタ部品を用いた接続構造が採用されている。近年、上述した車載機器の小型・軽量化及び低コスト化を実現する一方策として、ワイヤハーネスに代わる配線部品の使用、及び接続工程の簡略化が求められている。
(Wiring components between printed wiring boards in in-vehicle devices)
Conventionally, wire harnesses are used for wiring components for electrical connection between a plurality of printed wiring boards mounted on an in-vehicle inverter unit, an engine control unit, or the like. In addition, a connection structure using connector parts is employed for electrical connection between the wire harness and the printed wiring board. In recent years, the use of wiring components in place of wire harnesses and the simplification of connection processes have been demanded as one measure for realizing the above-described in-vehicle devices that are smaller, lighter, and lower in cost.

一方で、車載機器には、以前から長期間の使用に耐える高い信頼性も要求されている。車載機器に実装される配線部品やその接続部も、長期間の振動負荷や熱負荷に対する信頼性確保が不可欠となっている。   On the other hand, in-vehicle devices are also required to have high reliability that can withstand long-term use. It is indispensable to ensure reliability for a long-term vibration load and heat load for wiring components mounted on in-vehicle devices and their connection portions.

上述した車載機器の小型・軽量化や低コスト化に対応するため、車載機器内の配線部品に、導体幅方向に並列に配置された複数の導体(主に無酸素銅、タフピッチ銅等の銅で構成)を信号用導体として用い、導体厚さ方向の両面から被覆用の絶縁フィルムを接着剤によって接着被覆して一体化されたフレキシブルフラットケーブル(Flexible Flat Cable)と呼称される配線部品を採用する基板間接続構造が考案されている。   In order to cope with the above-described reduction in size, weight and cost of in-vehicle devices, a plurality of conductors (mainly copper such as oxygen-free copper and tough pitch copper) arranged in parallel in the conductor width direction on the wiring components in the in-vehicle devices. Is used as a signal conductor, and a wiring component called a flexible flat cable (Flexible Flat Cable) that is integrated by adhesively coating an insulating film for coating from both sides in the conductor thickness direction is adopted. An inter-board connection structure has been devised.

このフレキシブルフラットケーブルでは、導体長手方向の両端部に絶縁フィルムから導体が露出した導体露出部が形成されており、この導体露出部の少なくとも一部を導体接続部としてプリント配線板との電気的接続が行われる。なお、車載機器内の配線部品として用いられるフレキシブルフラットケーブルをはじめとするフラット配線材には、フレキシブルフラットケーブルと類似した構造のMFJ(Multi Frame Joiner)や、フレキシブルプリント配線板(Flexible Print Circuit:FPC)なども採用されている。これらは、フラット配線材の製造方法や構成材料に違いはあるが、いずれも複数の導体を幅方向に並列に配置してフラット配線材とした構造となっている。以下、フレキシブルフラットケーブルをフラット配線材の代表例として説明する。   In this flexible flat cable, a conductor exposed portion where the conductor is exposed from the insulating film is formed at both ends in the conductor longitudinal direction, and at least a part of the conductor exposed portion is used as a conductor connecting portion for electrical connection with the printed wiring board. Is done. For flat wiring materials such as flexible flat cables used as wiring components in in-vehicle devices, MFJ (Multi Frame Joiner) with a structure similar to flexible flat cables and flexible printed circuit boards (Flexible Print Circuit: FPC) ) Etc. are also adopted. Although there are differences in the manufacturing method and constituent materials of the flat wiring material, these have a structure in which a plurality of conductors are arranged in parallel in the width direction to form a flat wiring material. Hereinafter, a flexible flat cable will be described as a representative example of a flat wiring material.

(接続部のコネクタ接続)
フレキシブルフラットケーブルの信号用導体とプリント配線板との電気的接続に、圧接型コネクタが用いられる場合がある。フレキシブルフラットケーブルの端末部の接続部をコネクタの開口部に挿入し、フレキシブルフラットケーブルの接続部とコネクタの電極とを圧接することによって電気的導通をとっている。コネクタによる接続では、フレキシブルフラットケーブルをコネクタの開口部に挿入することで、フレキシブルフラットケーブルの機械的な固定も成されている。
(Connector connection of connection part)
A pressure contact type connector may be used for electrical connection between a signal conductor of a flexible flat cable and a printed wiring board. The connection part of the terminal part of a flexible flat cable is inserted in the opening part of a connector, and the electrical continuity is taken by press-contacting the connection part of a flexible flat cable, and the electrode of a connector. In connection by a connector, the flexible flat cable is mechanically fixed by inserting the flexible flat cable into the opening of the connector.

コネクタを介したフレキシブルフラットケーブルの接続は、フレキシブルフラットケーブルの挿抜が容易であるという利点がある。しかしながら、小型化・軽量化が要求されている車載機器では、プリント配線板上にコネクタを設置するスペースが設計上取れない場合がある。   The connection of the flexible flat cable via the connector has an advantage that the flexible flat cable can be easily inserted and removed. However, in an in-vehicle device that is required to be reduced in size and weight, a space for installing a connector on a printed wiring board may not be designed.

また、圧接型コネクタの接続では、振動負荷によってフレキシブルフラットケーブルの接続部とコネクタの電極との接触が一時的に途切れる瞬断と呼ばれる接続不良が発生する場合があり、接続信頼性上の点で問題がある。   Also, in connection with a pressure contact type connector, a connection failure called a momentary disconnection in which the contact between the connection portion of the flexible flat cable and the electrode of the connector is temporarily interrupted by a vibration load may occur. There's a problem.

(接続部のはんだ接続)
フレキシブルフラットケーブルの接続部とプリント配線板に設けられた電極部との電気的接続には、コネクタを介することなく、はんだで直接接続する構造が採用されることがある。はんだによる直接接続は、接続部の領域の縮小による小型化への対応と接続部品の部品点数を削減することができる。はんだを用いた接合は、金属間化合物を形成する金属接合となるため、圧接型コネクタのような電気的接点の瞬断が発生することはなく、電気的に安定した接合が得られる。
(Solder connection of connection part)
For electrical connection between the connection portion of the flexible flat cable and the electrode portion provided on the printed wiring board, a structure in which the connection is made directly with solder without using a connector may be employed. The direct connection by solder can cope with the miniaturization by reducing the area of the connection portion and can reduce the number of parts of the connection parts. Since the joining using the solder becomes a metal joining that forms an intermetallic compound, the electrical contact such as the pressure contact type connector does not occur instantaneously, and an electrically stable joining is obtained.

フレキシブルフラットケーブルの接続部とプリント配線板の電極部をはんだで直接接続する構造でも、従来のコネクタ接続構造と同様に振動負荷で接続部近傍に生じる負荷を低減して振動に対する耐性を向上し、信頼性を確保することが必要である。   Even in the structure where the connection part of the flexible flat cable and the electrode part of the printed wiring board are directly connected with solder, the load generated in the vicinity of the connection part is reduced by the vibration load like the conventional connector connection structure, and the resistance to vibration is improved. It is necessary to ensure reliability.

しかし、機器に搭載されるプリント配線板とフラット配線材とを接続するはんだは、エンジン稼動による車両内部の温度変化や外気温変化により、繰り返し熱負荷を受けることになる。フラット配線材とプリント配線板の接続は、このような温度が変化する環境において、はんだとプリント配線板の電極との膨張係数の違いにより、はんだに応力が繰り返し生じるため、はんだに亀裂が生じてフラット配線材と、プリント配線板との電気的接続が損なわれる可能性がある。   However, the solder that connects the printed wiring board mounted on the device and the flat wiring material is repeatedly subjected to a thermal load due to a change in the temperature inside the vehicle and a change in the outside air temperature due to engine operation. In the connection between the flat wiring material and the printed wiring board, in such an environment where the temperature changes, stress is repeatedly generated in the solder due to the difference in expansion coefficient between the solder and the printed wiring board electrode. The electrical connection between the flat wiring material and the printed wiring board may be impaired.

また、パルスヒート等の熱圧着方式によりプリント配線板とフラット配線材とを接続する場合は、はんだを熱圧着して接続するため、接続部と電極部との間のはんだが薄くなることがある。はんだが薄くなると、温度が変化する時にはんだに作用する応力が大きくなり、はんだ接続の温度特性が大きく損なわれる可能性がある。   Also, when connecting a printed wiring board and a flat wiring material by a thermocompression bonding method such as pulse heat, the solder between the connection part and the electrode part may become thin because the solder is connected by thermocompression bonding. . When the solder is thinned, the stress acting on the solder increases when the temperature changes, and the temperature characteristics of the solder connection may be greatly impaired.

(接続部を接続する構成)
接続部をプリント配線板の電極に接続する構成として、従来、接続部の一部を長手方向に沿って変形させた変形部を設け、この変形部とプリント配線板の電極との間にはんだ溜りを形成して接続する構成(例えば、引用文献1)、プリント配線板上の電極と接触する面に溝壁部を有する接続部をはんだを介して接続することにより、プリント配線板の電極と接続部との接合強度を高める構成(例えば、引用文献2)、及び底辺が上辺より小さい台形、又は逆三角形の断面形状を有する接続部をはんだを介して接続することにより、ランド間にはみ出すはんだ量を極めて少量にする構成(例えば、引用文献3参照)が開示されている。
(Configuration to connect the connection part)
As a configuration for connecting the connecting portion to the electrode of the printed wiring board, conventionally, a deformed portion obtained by deforming a part of the connecting portion along the longitudinal direction is provided, and a solder pool is provided between the deformed portion and the electrode of the printed wiring board. Connected to the electrode of the printed wiring board by connecting a connecting portion having a groove wall to the surface in contact with the electrode on the printed wiring board via solder. The amount of solder that protrudes between lands by connecting a connecting portion having a cross-sectional shape of a trapezoid or inverted triangle whose base is smaller than the upper side (for example, cited document 2) to increase the bonding strength with the portion, via solder Has been disclosed (see, for example, cited document 3).

特開2007−165476号公報JP 2007-165476 A 特開平5−206359号公報JP-A-5-206359 特開平5−217790号公報JP-A-5-217790

しかし、特許文献1記載の接続部に長手方向に沿った溝壁部を設けた構成では、溝加工を形成した接続部の中央には、十分なはんだ材の厚さが確保されるが、溝周囲のはんだ材の厚さが小となる領域が接続部の長手方向に沿って存在し、この領域の面積が大きくなることから、温度変化によって応力が発生した時に溝周囲のはんだ材を介して接続する箇所に過大な応力がかかることが予想される。   However, in the configuration in which the groove portion along the longitudinal direction is provided in the connection portion described in Patent Document 1, a sufficient thickness of the solder material is secured in the center of the connection portion where the groove processing is formed. A region where the thickness of the surrounding solder material is small exists along the longitudinal direction of the connecting portion, and since the area of this region becomes large, when stress is generated due to temperature change, the solder material around the groove It is anticipated that excessive stress will be applied to the connection points.

特許文献2記載の接続部が平坦な部分を有しない構成では、パルスヒート等の熱圧着方式によってはんだ接続する場合、接続部の上面から加圧及び加熱をするため、加熱ツールと接続部との接触面積を確保できず、加熱ツールから伝達される熱が不足してはんだ材の未溶解等による、接続部と被実装基板との間の接触不良等が発生することが考えられる。   In the configuration in which the connecting portion described in Patent Document 2 does not have a flat portion, when soldering is performed by a thermocompression bonding method such as pulse heat, pressure and heating are performed from the upper surface of the connecting portion. It is conceivable that the contact area cannot be ensured, and the heat transmitted from the heating tool is insufficient, resulting in poor contact between the connecting portion and the mounted substrate due to unmelted solder material or the like.

特許文献3記載の接続部の断面形状が台形である構成では、接続部の台形の底面に形成されるはんだ材の厚さが小となる領域の面積が大きくなり、この箇所に温度変化によって過大な応力が発生することが予想される。また、断面形状が三角形の場合、熱圧着時に接続部が幅方向にねじれ、接続部が変形することが考えられる。   In the configuration in which the cross-sectional shape of the connection portion described in Patent Document 3 is a trapezoid, the area of the region where the thickness of the solder material formed on the bottom surface of the trapezoid of the connection portion is small increases, and this portion is excessively increased due to a temperature change. Is expected to generate a large amount of stress. Moreover, when a cross-sectional shape is a triangle, it is possible that a connection part twists in the width direction at the time of thermocompression bonding, and a connection part deform | transforms.

したがって、本発明の目的は、フラット配線材を被実装基板に接続するのに熱圧着方式を用いた場合でも、接続部と被実装基板とを接続するはんだ材に発生する温度変化による応力を小さくして信頼性の高いはんだ接続ができるフラット配線材及びそれを用いた実装体を提供することにある。   Therefore, the object of the present invention is to reduce the stress due to the temperature change generated in the solder material connecting the connecting portion and the mounted substrate even when the thermocompression bonding method is used to connect the flat wiring material to the mounted substrate. Another object of the present invention is to provide a flat wiring material capable of highly reliable solder connection and a mounting body using the same.

本発明の一態様は、上記目的を達成するため、以下のフラット配線材及びその接続構造を提供する。
[1]間隔を設けて幅方向に並列に配置された複数の信号用導体と、
前記複数の信号用導体の少なくとも一方の端部に設けられ、被実装基板にはんだ材を介して接続される複数の接続部とを備え、
前記接続部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向に沿う線状となる第1の接続部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の接続部と、
前記被実装基板に対向する面と反対側の面に設けられた第1の平坦面と、
を備えたフラット配線材。
[2]前記第1の接続部は、前記被実装基板側に突出する第1の凸部で形成され、
前記第2の接続部は、前記第1の凸部の周囲の前記接続部の部分で形成された、
前記[1]に記載のフラット配線材。
[3]前記複数の接続部にそれぞれ形成された前記第1の凸部は、前記幅方向に直交する長手方向において異なる位置に形成された、
前記[2]に記載のフラット配線材。
[4]前記接続部に近接した位置に前記幅方向に延伸して設けられ、前記信号用導体を固定する固定部材を更に備え、
前記固定部材は、前記被実装基板にはんだ材により固定される固定部を備え、
前記固定部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向と直交する方向に沿う線状となる第1の固定部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の固定部と、
前記被実装基板に対向する面と反対側の面に設けられた第2の平坦面と、
前記[2]又は[3]に記載のフラット配線材。
[5]前記第1の固定部は、前記被実装基板側に突出する第2の凸部で形成され、
前記第2の固定部は、前記第2の凸部の周囲の前記固定部の部分で形成された、
前記[4]に記載のフラット配線材。
[6]前記接続部の前記第1の凸部の頂点と、前記固定部の前記第2の凸部の頂点が略同一面上に位置するように第1及び第2の凸部が形成される、
前記[4]又は[5]に記載のフラット配線材。
[7]前記固定部材は、前記固定部の端部に設けられ、前記被実装基板に設けられた貫通孔に挿入されて前記接続部及び固定部の位置決めをする位置決め部を備えた、
前記[4]乃至[6]のいずれかに記載のフラット配線材。
[8]間隔を設けて幅方向に並列に配置された複数の信号用導体と、
前記複数の信号用導体の少なくとも一方の端部に設けられ、被実装基板にはんだ材を介して接続される複数の接続部とを備え、
前記接続部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向に沿う線状となる第1の接続部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の接続部と、
を備えたフラット配線材と、
前記被実装基板に対向する面と反対側の面に設けられた第1の平坦面と、
を備えたフラット配線材と、
前記フラット配線材の前記接続部が前記はんだ材を介して接続される信号用電極を備えた被実装基板と、
を備えた実装体。
[9]前記フラット配線材は、前記接続部に近接した位置に前記幅方向に延伸して設けられ、前記信号用導体を固定する固定部材を備え、
前記固定部材は、前記被実装基板にはんだ材により固定される固定部を備え、
前記固定部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向と直交する方向に沿う線状となる第1の固定部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の固定部と、
前記被実装基板に対向する面と反対側の面に設けられた第2の平坦面と、
前記被実装基板は、固定部が固定される固定用電極を備えた、
前記[8]記載の実装体。
[10]前記フラット配線材は、前記固定部の端部に設けられ、前記被実装基板に設けられた貫通孔に挿入されて前記接続部及び固定部の位置決めをする位置決め部を有する前記固定部材を備え、
前記被実装基板は、前記位置決め部が挿入される貫通孔を備えた、
前記[9]記載の実装体。
In order to achieve the above object, one aspect of the present invention provides the following flat wiring material and connection structure thereof.
[1] A plurality of signal conductors arranged in parallel in the width direction at intervals,
A plurality of connection portions provided at at least one end of the plurality of signal conductors and connected to a substrate to be mounted via a solder material;
The connection portion is a first connection portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along the width direction, and
A second connecting portion having a region in which the thickness of the solder material between the mounting substrate is large;
A first flat surface provided on a surface opposite to the surface facing the mounting substrate;
Flat wiring material with
[2] The first connection portion is formed by a first protrusion protruding toward the mounted substrate,
The second connection portion is formed by a portion of the connection portion around the first convex portion,
The flat wiring material according to [1].
[3] The first convex portions respectively formed on the plurality of connection portions are formed at different positions in a longitudinal direction orthogonal to the width direction.
The flat wiring material according to [2].
[4] It further includes a fixing member that extends in the width direction at a position close to the connection portion and fixes the signal conductor.
The fixing member includes a fixing portion that is fixed to the mounting substrate by a solder material,
The fixing portion is a first fixing portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along a direction orthogonal to the width direction,
A second fixing portion having a region where the thickness of the solder material between the mounting substrate is large;
A second flat surface provided on a surface opposite to the surface facing the mounting substrate;
The flat wiring material according to [2] or [3].
[5] The first fixing portion is formed by a second protrusion protruding toward the mounted substrate.
The second fixing portion is formed by a portion of the fixing portion around the second convex portion,
The flat wiring material according to the above [4].
[6] The first and second convex portions are formed such that the vertex of the first convex portion of the connection portion and the vertex of the second convex portion of the fixed portion are located on substantially the same plane. The
The flat wiring material according to [4] or [5].
[7] The fixing member includes a positioning portion that is provided at an end portion of the fixing portion and is inserted into a through-hole provided in the mounted substrate to position the connection portion and the fixing portion.
The flat wiring material according to any one of [4] to [6].
[8] A plurality of signal conductors arranged at intervals in parallel in the width direction;
A plurality of connection portions provided at at least one end of the plurality of signal conductors and connected to a substrate to be mounted via a solder material;
The connection portion is a first connection portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along the width direction, and
A second connecting portion having a region in which the thickness of the solder material between the mounting substrate is large;
A flat wiring material with
A first flat surface provided on a surface opposite to the surface facing the mounting substrate;
A flat wiring material with
A mounting substrate including a signal electrode to which the connecting portion of the flat wiring material is connected via the solder material;
An implementation with
[9] The flat wiring member includes a fixing member that extends in the width direction at a position close to the connection portion, and fixes the signal conductor.
The fixing member includes a fixing portion that is fixed to the mounting substrate by a solder material,
The fixing portion is a first fixing portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along a direction orthogonal to the width direction,
A second fixing portion having a region where the thickness of the solder material between the mounting substrate is large;
A second flat surface provided on a surface opposite to the surface facing the mounting substrate;
The mounting substrate includes a fixing electrode to which a fixing portion is fixed.
The mounting body according to the above [8].
[10] The fixing member having a positioning portion that is provided at an end portion of the fixing portion and is inserted into a through-hole provided in the mounted substrate to position the connection portion and the fixing portion. With
The mounted substrate includes a through hole into which the positioning portion is inserted.
The mounting body according to [9].

本発明によれば、フラット配線材を被実装基板に接続するのに熱圧着方式を用いた場合でも、接続部と被実装基板とを接続するはんだ材に発生する温度変化による応力を小さくして信頼性の高いはんだ接続が可能になる。   According to the present invention, even when the thermocompression bonding method is used to connect the flat wiring material to the mounted substrate, the stress due to the temperature change generated in the solder material connecting the connecting portion and the mounted substrate is reduced. Reliable solder connection is possible.

図1は、本発明の第1の実施の形態に係るフレキシブルフラットケーブルの外観を示す平面図である。FIG. 1 is a plan view showing the appearance of the flexible flat cable according to the first embodiment of the present invention. 図2は、図1のA−A線断面図である。2 is a cross-sectional view taken along line AA in FIG. 図3は、フレキシブルフラットケーブルの接続部の斜視図である。FIG. 3 is a perspective view of the connecting portion of the flexible flat cable. 図4は、図1のB−B線断面図である。4 is a cross-sectional view taken along line BB in FIG. 図5は、熱圧着方式によるフレキシブルフラットケーブルとプリント配線板の接続状態を示す断面図であり、(a)は、圧着前の状態を示し、(b)は、圧着中の状態を示し、(c)は、圧着後の状態を示す。FIG. 5 is a cross-sectional view showing a connection state between a flexible flat cable and a printed wiring board by a thermocompression bonding method, (a) showing a state before crimping, (b) showing a state during crimping, ( c) shows the state after pressure bonding. 図6は、フレキシブルフラットケーブルをプリント配線板に接続した状態の外観を示す平面図である。FIG. 6 is a plan view showing the appearance of a state in which the flexible flat cable is connected to the printed wiring board. 図7は、図5のC−C線断面図である。7 is a cross-sectional view taken along the line CC of FIG. 図8は、本発明の第2の実施の形態を示す図であり、(a)は、接続部の斜視図、(b)は、(a)のD矢視図、(c)は、固定部の平面図、(d)は、(c)のE矢視図、(e)は、凸部材の正面図である。FIGS. 8A and 8B are diagrams showing a second embodiment of the present invention, where FIG. 8A is a perspective view of a connecting portion, FIG. 8B is a view taken along arrow D in FIG. 8A, and FIG. The top view of a part, (d) is the E arrow directional view of (c), (e) is a front view of a convex member. 図9は、本発明の変形例を示す図であり、(a)〜(d)は、それぞれ変形例1乃至4の接続部の要部を示す斜視図である。FIG. 9 is a view showing a modified example of the present invention, and FIGS. 9A to 9D are perspective views showing a main part of the connection part of modified examples 1 to 4, respectively.

以下、本発明の実施の形態について図面を参照して説明する。ここでは、フレキシブルフラットケーブルをフラット配線材の代表例として説明するが、本発明は、MFJ、フレキシブルプリント配線板などの他のフラット配線材に適用することが可能である。なお、各図中、実質的に同一の機能を有する構成要素については、同一の符号を付してその重複した説明を省略する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. Here, a flexible flat cable will be described as a representative example of a flat wiring material, but the present invention can be applied to other flat wiring materials such as MFJ and flexible printed wiring boards. In addition, in each figure, about the component which has the substantially same function, the same code | symbol is attached | subjected and the duplicate description is abbreviate | omitted.

[実施の形態の要約]
本実施の形態のフラット配線材は、間隔を設けて幅方向に並列に配置された複数の信号用導体と、前記複数の信号用導体の少なくとも一方の端部に設けられ、被実装基板の信号用電極にはんだ材を介して接続される複数の接続部とを有するフラット配線材において、前記接続部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向に沿う線状となる第1の接続部と前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の接続部と、前記被実装基板に対向する面と反対側の面に設けられた第1の平坦面とを備える。
[Summary of embodiment]
The flat wiring member according to the present embodiment is provided with a plurality of signal conductors arranged in parallel in the width direction at intervals, and at least one end of the plurality of signal conductors. In the flat wiring material having a plurality of connection portions connected to the electrodes for solder via the solder material, the connection portion has a dotted area in which the thickness of the solder material between the mounting substrate and the mounting substrate is small Or a second connection portion having a region in which the thickness of the solder material between the first connection portion that is linear along the width direction and the mounting substrate is large, and the mounting substrate. A first flat surface provided on the opposite surface and the opposite surface.

「被実装基板」とは、本フレキシブルフラットケーブルの一方又は両方の端末部が電気的に接続される基板をいい、例えばプリント配線板等が挙げられる。プリント配線板には、例えば、フレキシブルプリント配線板(FPC)、リジッドプリント配線板、FPCとリジッドプリント配線板との複合基板であるリジッドフレックスプリント配線板等が挙げられる。「近接した位置」とは、補強部材が導体が露出する端部から僅かに(例えば補強部材の幅よりも短い距離)離れた位置だけでなく、一部が重なる位置でもよい。「はんだ材」には、ペースト状はんだ(クリームはんだを含む。)、板状はんだ等が含まれる。凸部の「頂点」には、凸部の頂点が線状となるものが含まれる。厚さが「小となる」とは、凸部の頂点とプリント配線板とが接触する状態が含まれる。   “Mounted substrate” refers to a substrate to which one or both terminal portions of the flexible flat cable are electrically connected, and examples thereof include a printed wiring board. Examples of the printed wiring board include a flexible printed wiring board (FPC), a rigid printed wiring board, and a rigid flex printed wiring board that is a composite substrate of an FPC and a rigid printed wiring board. The “close position” is not limited to a position where the reinforcing member is slightly separated from the end where the conductor is exposed (for example, a distance shorter than the width of the reinforcing member), but may be a position where a part of the reinforcing member overlaps. The “solder material” includes paste solder (including cream solder), plate solder, and the like. The “vertex” of the convex portion includes one in which the vertex of the convex portion is linear. “Thickness is reduced” includes a state in which the apex of the convex portion and the printed wiring board are in contact with each other.

[第1の実施の形態]
図1は、本発明の第1の実施の形態に係るフレキシブルフラットケーブルの外観を示す平面図である。図2は、図1のA−A線断面図である。図3は、フレキシブルフラットケーブルの接続部の斜視図である。図4は、図1のB−B線断面図である。
[First Embodiment]
FIG. 1 is a plan view showing the appearance of the flexible flat cable according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a perspective view of the connecting portion of the flexible flat cable. 4 is a cross-sectional view taken along line BB in FIG.

このフレキシブルフラットケーブル1は、図1に示すように、間隔を設けて幅方向に並列に配置された複数の信号用導体2と、複数の信号用導体2の両端部20が露出するように一括して被覆する絶縁性の被覆部材3と、フレキシブルフラットケーブル1をプリント配線板に固定する一対の固定部材4と、信号用導体2とプリント配線板との接続を補強する一対の補強部材5とを備える。   As shown in FIG. 1, the flexible flat cable 1 has a plurality of signal conductors 2 arranged in parallel in the width direction at intervals, and a plurality of signal conductors 2 so that both end portions 20 of the signal conductors 2 are exposed. An insulating covering member 3 for covering, a pair of fixing members 4 for fixing the flexible flat cable 1 to the printed wiring board, and a pair of reinforcing members 5 for reinforcing the connection between the signal conductor 2 and the printed wiring board. Is provided.

(信号用導体)
図5は、熱圧着方式によるフレキシブルフラットケーブルとプリント配線板の接続状態を示す図であり(a)は、熱圧着前の状態を示し、(b)は、熱圧着中の状態を示し、(c)は、熱圧着後の状態を示す。なお、図5は、信号用導体2の周辺部のみを図示している。
(Signal conductor)
FIG. 5 is a diagram showing a connection state between a flexible flat cable and a printed wiring board by a thermocompression bonding method, (a) shows a state before thermocompression bonding, (b) shows a state during thermocompression bonding, c) shows the state after thermocompression bonding. FIG. 5 shows only the periphery of the signal conductor 2.

各信号用導体2は、図1に示すように、信号用導体2の少なくとも一方の端部20に設けられ、図5に示す、プリント配線板7の信号用電極71にはんだ材を介して接続される接続部22を備える。接続部22は、図2、図3に示すように、プリント配線板7側に突出し、凸部421の頂点221aと、プリント配線板7の信号用電極71との間のはんだ材の厚さが小となる領域が幅方向に沿う線状となるように半円状に形成された凸部221と、凸部221の周囲の接続部22の部分で形成され、プリント配線板7に対向する下面222aがはんだ材と接続する平坦部222とを備えている。凸部221の頂点221a及び平坦部222の下面222aは、対応するプリント配線板7の信号用電極71に電気的にはんだ材を介して接続されている。なお、凸部221は、第1の接続部の一例であり、平坦部222は、第2の接続部の一例であり、平坦面222bは、第1の平坦面の一例である。   As shown in FIG. 1, each signal conductor 2 is provided at at least one end 20 of the signal conductor 2, and is connected to the signal electrode 71 of the printed wiring board 7 shown in FIG. 5 via a solder material. The connecting portion 22 is provided. As shown in FIGS. 2 and 3, the connecting portion 22 protrudes toward the printed wiring board 7, and the thickness of the solder material between the apex 221 a of the convex portion 421 and the signal electrode 71 of the printed wiring board 7 is large. A lower surface that is formed by a semicircular convex portion 221 and a connecting portion 22 around the convex portion 221 so that the region to be small is linear along the width direction, and faces the printed wiring board 7. 222a includes a flat portion 222 connected to the solder material. The apex 221a of the convex portion 221 and the lower surface 222a of the flat portion 222 are electrically connected to the signal electrode 71 of the corresponding printed wiring board 7 via a solder material. The convex portion 221 is an example of a first connection portion, the flat portion 222 is an example of a second connection portion, and the flat surface 222b is an example of a first flat surface.

凸部221は、平坦部222とプリント配線板7との間のはんだ材82の厚さが所定の厚さになるように、接続部22を変形させて形成されている。平坦部222は、下面222aと反対側の面に設けられた平坦面222bを有する。平坦部222は、下面222aとプリント配線板7の信号用電極71との間のはんだ材82の厚さが大となる領域を有するように設けられている。平坦部222は、その下面222aとプリント配線板7とが略平行になるように設けられるのが好ましい。この様な構成にすることで、平坦部222とプリント配線板7との間のはんだ材82の厚さを均一にすることができるため、より強固な接続が得られる。なお、平坦面222bは、第1の平坦面の一例である。   The convex portion 221 is formed by deforming the connecting portion 22 so that the thickness of the solder material 82 between the flat portion 222 and the printed wiring board 7 becomes a predetermined thickness. The flat part 222 has a flat surface 222b provided on the surface opposite to the lower surface 222a. The flat portion 222 is provided so as to have a region where the thickness of the solder material 82 between the lower surface 222a and the signal electrode 71 of the printed wiring board 7 becomes large. The flat portion 222 is preferably provided so that the lower surface 222a thereof and the printed wiring board 7 are substantially parallel. With such a configuration, the thickness of the solder material 82 between the flat portion 222 and the printed wiring board 7 can be made uniform, so that a stronger connection can be obtained. The flat surface 222b is an example of a first flat surface.

凸部221は、図3に示すように、信号用導体2の幅方向に直交する長手方向において接続部22の異なる位置に配置され、プリント配線板7と接触し得る凸部221の列が複数形成されている。凸部221は、例えば隣接する接続部22の凸部221と異なる位置に設けられ、接続部22の全体として凸部221が交互に位置を違えるように配置されている。   As shown in FIG. 3, the convex portions 221 are arranged at different positions of the connecting portion 22 in the longitudinal direction perpendicular to the width direction of the signal conductor 2, and there are a plurality of rows of convex portions 221 that can come into contact with the printed wiring board 7. Is formed. The convex portions 221 are provided at positions different from the convex portions 221 of the adjacent connecting portions 22, for example, and are arranged so that the convex portions 221 are alternately different in position as the whole connecting portions 22.

信号用導体2の端部20は、図2、図5に示すように、凸部221の頂点221aが補強部材5の下面5aと略同一面上に位置するように、折曲部21a、21bにより折り曲げられてS字形状(ガルウイング形状)が形成されている。   As shown in FIGS. 2 and 5, the end portion 20 of the signal conductor 2 is bent portions 21 a and 21 b so that the apex 221 a of the convex portion 221 is positioned substantially on the same plane as the lower surface 5 a of the reinforcing member 5. Is bent to form an S shape (gull wing shape).

信号用導体2には、無酸素銅、タフピッチ銅等の銅又は銅合金を用いることができる。銅又は銅合金の表面には、めっきを施しても良く、錫(Sn)、ニッケル(Ni)、金(Au)などの金属を単独もしくは複数の材料を積層した状態で用いてもよい。   For the signal conductor 2, copper or a copper alloy such as oxygen-free copper or tough pitch copper can be used. The surface of the copper or copper alloy may be plated, or a metal such as tin (Sn), nickel (Ni), or gold (Au) may be used alone or in a state where a plurality of materials are laminated.

(被覆部材)
被覆部材3には、フィルム状のポリイミド樹脂やポリエチレンテレフタレート(PET)樹脂等の絶縁性樹脂を用いることができる。
(Coating member)
For the covering member 3, an insulating resin such as a film-like polyimide resin or polyethylene terephthalate (PET) resin can be used.

(固定部材)
図6は、フレキシブルフラットケーブルをプリント配線板に実装した状態の平面図である。図7は、図6のC−C線断面図である。
(Fixing member)
FIG. 6 is a plan view of a state in which the flexible flat cable is mounted on a printed wiring board. 7 is a cross-sectional view taken along the line CC of FIG.

固定部材4は、図1、図2及び図4に示すように、信号用導体2の接続部22に近接した位置に幅方向に延伸して設けられ、図6、図7に示すように、補強部材5から露出している両端部40に一対のプリント配線板7の固定用電極72にはんだ材を介して固定される固定部42と、プリント配線板7の貫通孔73に挿入されて接続部22及び固定部材4を位置決めする位置決め部43とを備えている。   As shown in FIGS. 1, 2 and 4, the fixing member 4 is provided extending in the width direction at a position close to the connection portion 22 of the signal conductor 2, and as shown in FIGS. 6 and 7, A fixed portion 42 fixed to the fixing electrodes 72 of the pair of printed wiring boards 7 via solder material at both end portions 40 exposed from the reinforcing member 5 and a through hole 73 of the printed wiring board 7 inserted and connected. The positioning part 43 which positions the part 22 and the fixing member 4 is provided.

固定部42は、プリント配線板7側に突出し、凸部421の頂点421aと、プリント配線板7の固定用電極72との間のはんだ材の厚さが小となる領域が幅方向と直交する方向に沿う線状となるように半円状に形成された凸部421と、凸部421の周囲の固定部42に形成され、プリント配線板7に対向する下面422aがはんだ材を介してプリント配線板7の固定用電極72に固定される平坦部422を備えている。凸部421の凸部421の頂点421a及び平坦部422の下面422aは、対応するプリント配線板7の固定用電極72にはんだ材を介して固定される。なお、凸部421は、第1の固定部の一例であり、平坦部422は、第2の固定部の一例である。   The fixing part 42 protrudes toward the printed wiring board 7, and a region where the thickness of the solder material between the apex 421 a of the convex part 421 and the fixing electrode 72 of the printed wiring board 7 is small is orthogonal to the width direction. A convex part 421 formed in a semicircular shape so as to be linear along the direction, and a fixed part 42 around the convex part 421, and a lower surface 422 a facing the printed wiring board 7 is printed via a solder material A flat portion 422 fixed to the fixing electrode 72 of the wiring board 7 is provided. The apex 421a of the convex part 421 of the convex part 421 and the lower surface 422a of the flat part 422 are fixed to the corresponding fixing electrode 72 of the printed wiring board 7 via a solder material. The convex portion 421 is an example of a first fixing portion, and the flat portion 422 is an example of a second fixing portion.

平坦部422は、下面422aと反対側の面に設けられた平坦面422bを有する。平坦部422は、プリント配線板7に対向する下面422aと固定用電極との間のはんだ材の厚さが大になる領域を有するように設けられている。平坦部422は、その下面422aとプリント配線板7とが略平行になるように設けられるのが好ましい。この様な構成にすることで、平坦部422とプリント配線板7との間のはんだ材82の厚さを均一にすることができるため、より強固な接続が得られる。なお、平坦面422bは、第2の平坦面の一例である。   The flat portion 422 has a flat surface 422b provided on the surface opposite to the lower surface 422a. The flat portion 422 is provided so as to have a region where the thickness of the solder material between the lower surface 422a facing the printed wiring board 7 and the fixing electrode is large. The flat portion 422 is preferably provided such that the lower surface 422a thereof and the printed wiring board 7 are substantially parallel. With such a configuration, the thickness of the solder material 82 between the flat portion 422 and the printed wiring board 7 can be made uniform, so that a stronger connection can be obtained. The flat surface 422b is an example of a second flat surface.

位置決め部43は、図4に示すように、固定部42の端部に設けられ、折り曲げ部41cにより約90度折り曲げられて形成されている。位置決め部43は、プリント配線板7の対応する貫通孔73に挿入される。位置決め部43は、貫通孔73に挿入されていれば位置決めは可能だが、貫通孔73を貫通するようにしてプリント配線板7の裏面から露出させ、その端部431を折り曲げ、折り曲げた部分と固定部42によりプリント配線板7を挟み込んで接続部22を補強する構成としてもよい。   As shown in FIG. 4, the positioning portion 43 is provided at the end portion of the fixed portion 42, and is formed by being bent about 90 degrees by a bent portion 41c. The positioning part 43 is inserted into the corresponding through hole 73 of the printed wiring board 7. The positioning portion 43 can be positioned as long as it is inserted into the through hole 73, but is exposed from the back surface of the printed wiring board 7 so as to penetrate the through hole 73, and the end portion 431 is bent and fixed to the bent portion. It is good also as a structure which inserts the printed wiring board 7 by the part 42 and reinforces the connection part 22. FIG.

端部40は、図4、図7に示すように、凸部421の頂点421aが凸部221の頂点221a及び補強部材5の下面5aと略同一面上に位置するように、折曲部41a、41bにより折り曲げられてS字形状(ガルウイング形状)が形成されている。   As shown in FIGS. 4 and 7, the end portion 40 has a bent portion 41 a so that the vertex 421 a of the convex portion 421 is located on substantially the same plane as the vertex 221 a of the convex portion 221 and the lower surface 5 a of the reinforcing member 5. , 41b to form an S shape (gull wing shape).

固定部材4は、図1に示すように、端部40よりも幅の広い幅広部44を有している。固定部材4が幅広部44を有することにより、信号用導体2の接続部22近傍部分を固定する効果が高くなる。   As shown in FIG. 1, the fixing member 4 has a wide portion 44 that is wider than the end portion 40. Since the fixing member 4 has the wide portion 44, the effect of fixing the vicinity of the connection portion 22 of the signal conductor 2 is enhanced.

固定部材4には、信号用導体2よりも高強度(高引張り強度)の材料を用いるのが好ましく、例えばりん青銅等の銅合金や鉄(Fe)−ニッケル(Ni)合金などを用いことができる。なお、固定部材4の端部40にも、信号用導体2の端部20と同様の材料によるめっきを施してもよい。また、固定部材4の厚さは、信号用導体2に用いる金属板よりも厚くするのが好ましい。高強度材料の使用や板厚の増加によって、振動負荷に対する信号用導体2の接続部22近傍部分のより高い補強効果が得られる。   For the fixing member 4, it is preferable to use a material having higher strength (high tensile strength) than the signal conductor 2. For example, a copper alloy such as phosphor bronze or an iron (Fe) -nickel (Ni) alloy may be used. it can. The end 40 of the fixing member 4 may be plated with the same material as that of the end 20 of the signal conductor 2. Further, the thickness of the fixing member 4 is preferably thicker than the metal plate used for the signal conductor 2. By using a high-strength material and increasing the plate thickness, a higher reinforcing effect can be obtained in the vicinity of the connection portion 22 of the signal conductor 2 against the vibration load.

(フレキシブルフラットケーブルの層構成)
フレキシブルフラットケーブル1の層構成について、図2を用いて説明する。被覆部材3は、表面の絶縁フィルム30が接着剤31によって信号用導体2に接着されている。信号用導体2と絶縁フィルム30とを接着する接着剤31には、例えばエポキシ樹脂やアクリル樹脂等の熱硬化性樹脂を用いることができる。
(Layer structure of flexible flat cable)
The layer configuration of the flexible flat cable 1 will be described with reference to FIG. The covering member 3 has a surface insulating film 30 bonded to the signal conductor 2 with an adhesive 31. For the adhesive 31 that adheres the signal conductor 2 and the insulating film 30, for example, a thermosetting resin such as an epoxy resin or an acrylic resin can be used.

補強部材5は、被覆部材3の一方の面3a側に固定部材4が配置され、被覆部材3の他方の面3b側に補強用金属板52が配置され、固定部材4や補強用金属板52を覆う絶縁フィルム50と固定部材4及び補強用金属板52とを接着剤51により被覆部材3に固定する。補強部材5は、信号用導体2の接続部22近傍部分の変形を抑制する補強部材として作用する。なお、固定部材4及び補強用金属板52は、加熱と冷却による溶着(融着)や超音波溶着等によって被覆部材3に固定されてもよい。   In the reinforcing member 5, the fixing member 4 is disposed on the one surface 3 a side of the covering member 3, the reinforcing metal plate 52 is disposed on the other surface 3 b side of the covering member 3, and the fixing member 4 or the reinforcing metal plate 52 is disposed. The insulating film 50, the fixing member 4, and the reinforcing metal plate 52 are fixed to the covering member 3 with an adhesive 51. The reinforcing member 5 acts as a reinforcing member that suppresses deformation in the vicinity of the connecting portion 22 of the signal conductor 2. The fixing member 4 and the reinforcing metal plate 52 may be fixed to the covering member 3 by welding (fusion) or ultrasonic welding by heating and cooling.

補強用金属板52は、固定部材4と同様に信号用導体2よりも高強度(高引張り強度)の材料を用いるのが好ましく、例えばりん青銅や鉄(Fe)−ニッケル(Ni)合金などを用いる。上記の条件を満たす材料であれば、補強用金属板52は、固定部材4と同じ材料を用いてもよいし、異なる材料を用いてもよい。補強用金属板52の厚さは、信号用導体2に用いる金属板よりも厚くするのが好ましい。固定部材4と相俟って高強度材料の使用や板厚の増加により、振動負荷に対する信号用導体2の接続部22近傍部分のより高い補強効果が得られる。   The reinforcing metal plate 52 is preferably made of a material having a higher strength (high tensile strength) than the signal conductor 2, as in the case of the fixing member 4, such as phosphor bronze or iron (Fe) -nickel (Ni) alloy. Use. As long as the material satisfies the above conditions, the reinforcing metal plate 52 may use the same material as the fixing member 4 or a different material. The reinforcing metal plate 52 is preferably thicker than the metal plate used for the signal conductor 2. By using a high-strength material and increasing the plate thickness in combination with the fixing member 4, a higher reinforcing effect in the vicinity of the connection portion 22 of the signal conductor 2 against the vibration load can be obtained.

固定部材4、補強用金属板52及び絶縁フィルム50を信号用導体2用の被覆部材3に接着する接着剤51には、絶縁フィルム30を信号用導体2に接着する接着剤31と同じ材料を用いてもよい。   The adhesive 51 that bonds the fixing member 4, the reinforcing metal plate 52, and the insulating film 50 to the covering member 3 for the signal conductor 2 is made of the same material as the adhesive 31 that bonds the insulating film 30 to the signal conductor 2. It may be used.

(フレキシブルフラットケーブルのプリント配線板への実装方法)
次に、フレキシブルフラットケーブルのプリント配線板への実装方法について説明する。
(Mounting method of flexible flat cable to printed wiring board)
Next, a method for mounting the flexible flat cable on the printed wiring board will be described.

プリント配線板7は、図6、図7に示すように、絶縁基材70と、絶縁基材70の表面70aに形成され、信号用導体2の接続部22がはんだ接続される信号用電極71、及び固定部材4の固定部42がはんだ接続される固定用電極72と、固定部材4の位置決め部43が挿入される貫通孔73と、絶縁基材70の表面70aの信号用電極71、固定用電極72以外の領域に形成されたソルダレジスト74を備え、図5(a)に示すように、信号用電極71及び固定用電極72の表面に、フラックスや溶剤を含むペースト状のはんだ材81が塗布されたたものを準備する。はんだ材81は、例えばディスペンサのノズルから供給される方法や、印刷法によって信号用電極71や固定用電極72に塗布される。なお、信号用電極71や固定用電極72にはんだ材81が塗布された後に、プリント配線板7を加熱して凝固させた状態のはんだ材が形成されたプリント配線板7を用いてもよい。   As shown in FIGS. 6 and 7, the printed wiring board 7 is formed on the insulating base 70 and the surface 70 a of the insulating base 70, and the signal electrode 71 to which the connection portion 22 of the signal conductor 2 is solder-connected. , And a fixing electrode 72 to which the fixing portion 42 of the fixing member 4 is soldered, a through hole 73 into which the positioning portion 43 of the fixing member 4 is inserted, and a signal electrode 71 on the surface 70a of the insulating base 70, fixing A solder resist 74 formed in a region other than the electrode 72 is provided, and as shown in FIG. 5A, the surface of the signal electrode 71 and the fixing electrode 72 has a paste solder material 81 containing a flux or a solvent. Prepare the one coated with. The solder material 81 is applied to the signal electrode 71 and the fixing electrode 72 by, for example, a method of supplying from a nozzle of a dispenser or a printing method. Alternatively, the printed wiring board 7 may be used in which the solder material 81 is applied to the signal electrode 71 and the fixing electrode 72 and then the solder material is formed by heating and solidifying the printed wiring board 7.

まず、図6、図7に示すように、固定部材4の位置決め部43を貫通孔73に挿入する。これにより、接続部22をプリント配線板7の対応する信号用電極71の上に位置決めし、同時に、固定部材4の固定部42をプリント配線板7の対応する固定用電極72の上に位置決めする。位置決めした接続部22は、図5(a)に示すように、信号用電極71及びペースト状はんだ81の上に配置され、固定部42についても同様に固定用電極72及びペースト状のはんだ材81の上に配置される。   First, as shown in FIGS. 6 and 7, the positioning portion 43 of the fixing member 4 is inserted into the through hole 73. Thereby, the connecting portion 22 is positioned on the corresponding signal electrode 71 of the printed wiring board 7, and at the same time, the fixing portion 42 of the fixing member 4 is positioned on the corresponding fixing electrode 72 of the printed wiring board 7. . As shown in FIG. 5A, the positioned connection portion 22 is disposed on the signal electrode 71 and the paste solder 81, and the fixing portion 72 and the paste solder material 81 are similarly applied to the fixing portion 42. Placed on top.

次に、図5(b)に示すように、熱圧着方式の加熱ツール100を接続部22の平坦面222b及び固定部42の平坦面422bに接触させて接続部22及び固定部42を上方から加圧する。加熱ツール100は、接続部22及び固定部42を一括して加圧、加熱できる加圧面を有し、例えばモリブデン、タングステン等から形成されている。なお、加熱ツール100は、接続部22と固定部42とを別々に加圧、加熱する構成としてもよい。   Next, as shown in FIG. 5B, the thermocompression heating tool 100 is brought into contact with the flat surface 222b of the connecting portion 22 and the flat surface 422b of the fixing portion 42 so that the connecting portion 22 and the fixing portion 42 are viewed from above. Pressurize. The heating tool 100 has a pressing surface that can press and heat the connecting portion 22 and the fixing portion 42 in a lump, and is made of, for example, molybdenum, tungsten, or the like. In addition, the heating tool 100 is good also as a structure which pressurizes and heats the connection part 22 and the fixing | fixed part 42 separately.

次に、加熱ツール100に電流を流し、加熱ツール100の抵抗発熱により接続部22及び固定部42を瞬間的、局部的に加熱させる。これにより、加熱ツール100は、はんだ材81を溶融させる。融解したはんだ材81は、冷却により凝固して図5(c)に示すように、はんだ材82によって接続部22を信号用電極71に、固定部42を固定用電極72に接続及び固定する。   Next, an electric current is passed through the heating tool 100, and the connection portion 22 and the fixing portion 42 are instantaneously and locally heated by resistance heating of the heating tool 100. Thereby, the heating tool 100 melts the solder material 81. The melted solder material 81 is solidified by cooling, and the connecting portion 22 is connected to the signal electrode 71 and the fixing portion 42 is connected to and fixed to the fixing electrode 72 by the solder material 82 as shown in FIG.

(第1の実施の形態の効果)
本実施の形態によれば、以下の効果を奏する。
(ア)フレキシブルフラットケーブル1の信号用導体2の接続部22に半円形とした凸部221を設けることで、プリント配線板7と接続するはんだ材の厚さが小さくなる領域を幅方向に沿った線状とすることにより、温度変化時にはんだ材に発生する応力の影響を小さくすることができるので、接続部22とプリント配線板7との接続信頼性を向上させることができる。
(Effects of the first embodiment)
According to the present embodiment, the following effects can be obtained.
(A) By providing the semicircular convex portion 221 in the connecting portion 22 of the signal conductor 2 of the flexible flat cable 1, a region in which the thickness of the solder material connected to the printed wiring board 7 is reduced along the width direction. Since the influence of the stress generated in the solder material when the temperature changes is reduced, the connection reliability between the connection portion 22 and the printed wiring board 7 can be improved.

すなわち、接続部22に凸部221を設けることで、平坦部222とプリント配線板7の信号用電極71との間のはんだ材の厚さを確保することができるため、はんだ材に発生する温度変化つまり、はんだ材とプリント配線板7との温度膨張係数の違いによる応力の影響を小さくすることができる。これにより、はんだ接続の温度特性を改善することができ、はんだ材の割れや信号用電極71からの剥がれを抑制できる。   That is, since the thickness of the solder material between the flat portion 222 and the signal electrode 71 of the printed wiring board 7 can be ensured by providing the projection 221, the temperature generated in the solder material. In other words, the influence of stress due to the difference in temperature expansion coefficient between the solder material and the printed wiring board 7 can be reduced. Thereby, the temperature characteristic of the solder connection can be improved, and cracking of the solder material and peeling from the signal electrode 71 can be suppressed.

(イ)接続部22の平坦面222b及び固定部42の平坦面422bを設けることで、熱圧着方式によるはんだ接続時に加熱ツール100と接触する平坦面222b、422bの面積を確保することができる。これにより、加熱ツールか100ら伝達される熱が不足してはんだ材の未溶解等による接続部22及び固定部42と被実装基板7との間の接触不良等を防止することができる。 (A) By providing the flat surface 222b of the connecting portion 22 and the flat surface 422b of the fixing portion 42, it is possible to secure the areas of the flat surfaces 222b and 422b that come into contact with the heating tool 100 during solder connection by the thermocompression bonding method. Thereby, the heat transmitted from the heating tool 100 is insufficient, so that contact failure between the connecting portion 22 and the fixing portion 42 and the mounted substrate 7 due to undissolved solder material or the like can be prevented.

(ウ)固定部材4の固定部42に接続部22と同様に凸部421を設けることで、固定部42を固定するはんだ材についても、はんだ材の割れ等を抑制することができるので、固定部材4により接続部22をプリント配線板7に強固に固定することができる。また、固定部42に平坦部422を設けることで、はんだ材の未溶解等による固定部42と被実装基板7との間の接触不良等を防止することができる。 (C) Since the convex portion 421 is provided in the fixing portion 42 of the fixing member 4 in the same manner as the connection portion 22, the solder material fixing the fixing portion 42 can also be suppressed because cracking of the solder material can be suppressed. The connection part 22 can be firmly fixed to the printed wiring board 7 by the member 4. Further, by providing the fixing portion 42 with the flat portion 422, it is possible to prevent poor contact between the fixing portion 42 and the mounted substrate 7 due to unmelted solder material or the like.

(エ)接続部22の凸部221を隣接する接続部22と異なる位置に配置し、プリント配線板7と接触し得る凸部221の列が複数形成されることにより、加熱ツール100による熱圧着時に接続部22が傾いて変形することが抑制できるので、熱圧着方式で安定したはんだ接続ができる。 (D) The convex portion 221 of the connecting portion 22 is arranged at a position different from the adjacent connecting portion 22, and a plurality of rows of convex portions 221 that can come into contact with the printed wiring board 7 are formed. Since it can suppress that the connection part 22 inclines and deform | transforms sometimes, the stable solder connection can be performed by a thermocompression bonding system.

(オ)接続部22の凸部221の頂点221aと、固定部42の凸部421の頂点421aとを略同一面に形成することにより、加熱ツール100による熱圧着時に、凸部221、431のどちらかが浮いて対応するプリント配線板7の信号用電極71又は固定用電極72と非接触になることを抑制できるので、熱圧着方式でのはんだ接続の不良を抑制できる。 (E) By forming the apex 221a of the convex part 221 of the connection part 22 and the apex 421a of the convex part 421 of the fixed part 42 on substantially the same plane, when the heating tool 100 is thermocompression bonded, the convex parts 221 and 431 Since one of them can be prevented from floating and coming out of contact with the signal electrode 71 or the fixing electrode 72 of the corresponding printed wiring board 7, it is possible to suppress poor solder connection in the thermocompression bonding method.

(カ)固定部材4に位置決め部44を設けることで、位置決め部44をプリント配線板7に設けられた貫通孔73に挿入することにより、容易に接続部22と固定部42の位置決めができるので、フレキシブルフラットケーブル1とプリント配線板7との接続時の不具合の抑制、及び実装組立て作業の簡略化を図ることができる。 (F) Since the positioning portion 44 is provided in the fixing member 4 and the positioning portion 44 is inserted into the through hole 73 provided in the printed wiring board 7, the connection portion 22 and the fixing portion 42 can be easily positioned. In addition, it is possible to suppress problems during connection between the flexible flat cable 1 and the printed wiring board 7 and to simplify the mounting and assembling work.

(キ)本フレキシブルフラットケーブル1を実装するプリント配線板7、あるいはプリント配線板7が搭載される車載機器ユニット筐体構造によっては、局所加熱方式しか対応できない場合がある。本実施の形態は、このような場合にも適用することができる。 (G) Depending on the printed wiring board 7 on which the flexible flat cable 1 is mounted or the in-vehicle device unit housing structure on which the printed wiring board 7 is mounted, only the local heating method may be supported. The present embodiment can also be applied to such a case.

[第2の実施の形態]
図8は、本発明の第2の実施の形態を示す図であり、(a)は、接続部の斜視図、(b)は、(a)のD矢視図、(c)は、固定部の平面図、(d)は、(c)のE矢視図、(e)は、凸部材の正面図である。
[Second Embodiment]
FIGS. 8A and 8B are diagrams showing a second embodiment of the present invention, where FIG. 8A is a perspective view of a connecting portion, FIG. 8B is a view taken along arrow D in FIG. 8A, and FIG. The top view of a part, (d) is the E arrow directional view of (c), (e) is a front view of a convex member.

第1の実施の形態では、接続部22及び固定部42の凸部221、421は、接続部22又は固定部42を変形させて設けられていたが、本実施の形態では、凸部91を有する凸部材9が接続部22又は固定部42に打ち込まれて設けられている。以下、第1の実施の形態と異なる点を中心に説明する。なお、凸部材9の凸部91は、第1の接続部及び第1の固定部の一例である。   In the first embodiment, the convex portions 221 and 421 of the connecting portion 22 and the fixing portion 42 are provided by deforming the connecting portion 22 or the fixing portion 42. However, in the present embodiment, the convex portion 91 is provided. The convex member 9 is driven into the connecting portion 22 or the fixing portion 42 and provided. The following description will focus on differences from the first embodiment. In addition, the convex part 91 of the convex member 9 is an example of a 1st connection part and a 1st fixing | fixed part.

接続部22及び固定部42は、凸部材9を固定する固定孔223、423をそれぞれ備える。凸部材9は、接続部22又は固定部42の固定孔223、423に打ち込まれて凸部材9を固定する柱部92と、柱部92の端部に設けられ、接続部22又は固定部42に打ち込まれた状態でプリント配線板7側に半球状に突出する凸部91とを備える。凸部91は、はんだ材の厚さが小となる領域が点状になるように設けられ、はんだ材を介してプリント配線板7の信号用電極71、又は固定用電極72に接続されている。なお、凸部91を三角錐や、半円柱等に形成してもよい。また、凸部材9は、溶接や接着によって接続部22又は固定部42に固定されてもよい。   The connection part 22 and the fixing part 42 are respectively provided with fixing holes 223 and 423 for fixing the convex member 9. The convex member 9 is provided at the end portion of the column portion 92 that is driven into the fixing holes 223 and 423 of the connecting portion 22 or the fixing portion 42 to fix the convex member 9, and the connecting portion 22 or the fixing portion 42. And a convex portion 91 projecting in a hemispherical shape on the printed wiring board 7 side. The convex portion 91 is provided so that a region where the thickness of the solder material is small is dotted, and is connected to the signal electrode 71 or the fixing electrode 72 of the printed wiring board 7 via the solder material. . In addition, you may form the convex part 91 in a triangular pyramid, a semi-cylinder, etc. Moreover, the convex member 9 may be fixed to the connection part 22 or the fixing part 42 by welding or adhesion.

(第2の実施の形態の効果)
本実施の形態によれば、以下の効果を奏する。
(ア)接続部22及び固定部42が半球状に突出する凸部91を有する凸部材9を備えることで、プリント配線板7との間のはんだ材の厚さを確保することができるため、凸部91の頂点を点状としてはんだ材の厚さが小となる領域を狭めることができる。この結果、温度変化時にはんだ材に発生するはんだ材とプリント配線板7との熱膨張係数の違いによる応力の影響を小さくすることができるので、接続部22及び固定部42と、プリント配線板7との接続信頼性をより一層向上させることができる。
(イ)凸部材9を接続部22及び固定部42の固定孔に打ち込んで凸部91を形成するので、容易に凸部91を備えたフレキシブルフラットケーブル1を作成することができる。
(Effect of the second embodiment)
According to the present embodiment, the following effects can be obtained.
(A) Since the connecting portion 22 and the fixing portion 42 include the convex member 9 having the convex portion 91 protruding in a hemispherical shape, the thickness of the solder material between the printed wiring board 7 can be secured, The region where the thickness of the solder material is small can be narrowed by using the apex of the convex portion 91 as a dot. As a result, the influence of stress due to the difference in thermal expansion coefficient between the solder material and the printed wiring board 7 generated in the solder material when the temperature changes can be reduced, so that the connection portion 22 and the fixing portion 42 and the printed wiring board 7 can be reduced. Connection reliability can be further improved.
(A) Since the convex member 9 is driven into the fixing holes of the connecting portion 22 and the fixing portion 42 to form the convex portion 91, the flexible flat cable 1 including the convex portion 91 can be easily created.

[変形例]
なお、本発明は、上記実施の形態に限定されず、本発明の要旨の範囲内で種々に変形実施が可能である。図9の(a)乃至(d)は、それぞれ本発明の変形例1乃至4の接続部の要部を示す斜視図を示す図である。
[Modification]
In addition, this invention is not limited to the said embodiment, A various deformation | transformation implementation is possible within the range of the summary of this invention. (A) thru | or (d) of FIG. 9 is a figure which shows the perspective view which shows the principal part of the connection part of the modification 1 thru | or 4 of this invention, respectively.

(変形例1)
第1の実施の形態では、接続部22は、1つの凸部221、431を有する構成としていたが、接続部22及び固定部42は、図9(a)に示すように、接続部22を変形させた、複数の凸部221を有する構成としてもよい。
(Modification 1)
In the first embodiment, the connecting portion 22 has a configuration having one convex portion 221, 431. However, the connecting portion 22 and the fixing portion 42 have the connecting portion 22 as shown in FIG. It is good also as composition which has a plurality of convex parts 221 changed.

(変形例2)
変形例2の接続部22は、図9(b)に示すように、接続部22及びを三角形に変形させた凸部224を設けたものである。
(Modification 2)
As shown in FIG. 9B, the connection portion 22 of Modification 2 is provided with a projection 224 obtained by deforming the connection portion 22 and a triangle.

(変形例3)
変形例3の接続部22は、図9(c)に示すように、複数の凸部材9を設けたものである。
(Modification 3)
As shown in FIG. 9C, the connection portion 22 of the third modification is provided with a plurality of convex members 9.

(変形例4)
変形例4の接続部22は、図9(d)に示すように、接続部22のプリント配線板7の信号用電極71と対向する面に規則的又は不規則的に複数の凸部225を設ける構成としてもよい。なお、凸部225は、接続部22に固定されたものでなくてもよい。
(Modification 4)
As shown in FIG. 9D, the connection part 22 of the modification 4 has a plurality of convex parts 225 regularly or irregularly on the surface of the connection part 22 facing the signal electrode 71 of the printed wiring board 7. It is good also as a structure to provide. The convex portion 225 may not be fixed to the connection portion 22.

また、固定部42についても接続部22と同様に上記変形例1乃至4を適用してもよい。   Further, the modified examples 1 to 4 may be applied to the fixing portion 42 as well as the connecting portion 22.

(他の変形例)
また、本発明の実施の形態では、接続部22の凸部221は、隣接する接続部22と異なる位置に設けられ、接続部22の全体として凸部221が交互に配置されるものとして説明したが、接続部22は、例えば2つの接続部22毎に凸部221の位置が異なる構成としてもよいし、凸部221が接続部22の不規則的な位置に設けられる構成としてもよい。
(Other variations)
In the embodiment of the present invention, the convex portions 221 of the connecting portions 22 are provided at different positions from the adjacent connecting portions 22, and the convex portions 221 are alternately arranged as a whole of the connecting portions 22. However, the connecting portion 22 may have a configuration in which the position of the convex portion 221 is different for each of the two connecting portions 22, or the convex portion 221 may be provided at an irregular position of the connecting portion 22.

また、本発明の要旨を変更しない範囲内で上記実施の形態の構成要素のうち一部を除くことも可能である。例えば、補強部材の剛性を増すことにより、補強用金属板52を省くことも可能である。また、上述した実装方法は、本発明の要旨を変更しない範囲内で工程の削除、追加、変更、入替等を行ってもよい。   Moreover, it is also possible to remove some of the constituent elements of the above-described embodiment within a range not changing the gist of the present invention. For example, the reinforcing metal plate 52 can be omitted by increasing the rigidity of the reinforcing member. In addition, the mounting method described above may perform deletion, addition, change, replacement, etc. of steps within a range that does not change the gist of the present invention.

本発明は、例えば車載機器、携帯電話、通信機器、情報端末機器、測定機器、家電機器等に適用可能である。   The present invention is applicable to, for example, an in-vehicle device, a mobile phone, a communication device, an information terminal device, a measuring device, a home appliance, and the like.

1…フレキシブルフラットケーブル、2…信号用導体、3…被覆部材、3a、3b…面、
4…固定部材、5…補強部材、5a…下面、7…プリント配線板、9…凸部材、20…端部、21a、21b…折曲部、22…接続部、30…絶縁フィルム、31…接着剤、40…端部、41a、41b、41c…折曲部、42…固定部、43…位置決め部、44…幅広部、50…絶縁フィルム、51…接着剤、52…補強用金属板、70…絶縁基材、70a…表面、71…信号用電極、72…固定用電極、73…貫通孔、74…ソルダレジスト、81、82…はんだ材、91…凸部、92…柱部、100…加熱ツール、221…凸部、221a…頂点、222…平坦部、222a…下面、222b…平坦面、223…固定孔、421…凸部、421a…頂点、422…平坦部、422a…下面、422b…平坦面、431…端部
DESCRIPTION OF SYMBOLS 1 ... Flexible flat cable, 2 ... Signal conductor, 3 ... Cover member, 3a, 3b ... surface,
DESCRIPTION OF SYMBOLS 4 ... Fixed member, 5 ... Reinforcement member, 5a ... Lower surface, 7 ... Printed wiring board, 9 ... Convex member, 20 ... End part, 21a, 21b ... Bending part, 22 ... Connection part, 30 ... Insulating film, 31 ... Adhesive, 40 ... end, 41a, 41b, 41c ... bent part, 42 ... fixing part, 43 ... positioning part, 44 ... wide part, 50 ... insulating film, 51 ... adhesive, 52 ... reinforcing metal plate, DESCRIPTION OF SYMBOLS 70 ... Insulating base material, 70a ... Surface, 71 ... Signal electrode, 72 ... Fixing electrode, 73 ... Through-hole, 74 ... Solder resist, 81, 82 ... Solder material, 91 ... Convex part, 92 ... Column part, 100 ... heating tool, 221 ... convex part, 221a ... vertex, 222 ... flat part, 222a ... lower surface, 222b ... flat surface, 223 ... fixing hole, 421 ... convex part, 421a ... vertex, 422 ... flat part, 422a ... lower surface, 422b ... flat surface, 431 ... end

Claims (10)

間隔を設けて幅方向に並列に配置された複数の信号用導体と、
前記複数の信号用導体の少なくとも一方の端部に設けられ、被実装基板にはんだ材を介して接続される複数の接続部とを備え、
前記接続部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向に沿う線状となる第1の接続部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の接続部と、
前記被実装基板に対向する面と反対側の面に設けられた第1の平坦面と、
を備えたフラット配線材。
A plurality of signal conductors arranged in parallel in the width direction at intervals;
A plurality of connection portions provided at at least one end of the plurality of signal conductors and connected to a substrate to be mounted via a solder material;
The connection portion is a first connection portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along the width direction, and
A second connecting portion having a region in which the thickness of the solder material between the mounting substrate is large;
A first flat surface provided on a surface opposite to the surface facing the mounting substrate;
Flat wiring material with
前記第1の接続部は、前記被実装基板側に突出する第1の凸部で形成され、
前記第2の接続部は、前記第1の凸部の周囲の前記接続部の部分で形成された、
請求項1に記載のフラット配線材。
The first connection part is formed by a first convex part projecting to the mounted substrate side,
The second connection portion is formed by a portion of the connection portion around the first convex portion,
The flat wiring material according to claim 1.
前記複数の接続部にそれぞれ形成された前記第1の凸部は、前記幅方向に直交する長手方向において異なる位置に形成された、
請求項2に記載のフラット配線材。
The first convex portions respectively formed on the plurality of connecting portions are formed at different positions in a longitudinal direction orthogonal to the width direction.
The flat wiring material according to claim 2.
前記接続部に近接した位置に前記幅方向に延伸して設けられ、前記信号用導体を固定する固定部材を更に備え、
前記固定部材は、前記被実装基板にはんだ材により固定される固定部を備え、
前記固定部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向と直交する方向に沿う線状となる第1の固定部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の固定部と、
前記被実装基板に対向する面と反対側の面に設けられた第2の平坦面と、
を備えた請求項1乃至3のいずれか1項に記載のフラット配線材。
A fixing member that extends in the width direction at a position close to the connection portion and fixes the signal conductor;
The fixing member includes a fixing portion that is fixed to the mounting substrate by a solder material,
The fixing portion is a first fixing portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along a direction orthogonal to the width direction,
A second fixing portion having a region where the thickness of the solder material between the mounting substrate is large;
A second flat surface provided on a surface opposite to the surface facing the mounting substrate;
The flat wiring material according to any one of claims 1 to 3, further comprising:
前記第1の固定部は、前記被実装基板側に突出する第2の凸部で形成され、
前記第2の固定部は、前記第2の凸部の周囲の前記固定部の部分で形成された、
請求項4に記載のフラット配線材。
The first fixed portion is formed by a second convex portion protruding toward the mounted substrate side,
The second fixing portion is formed by a portion of the fixing portion around the second convex portion,
The flat wiring material according to claim 4.
前記接続部の前記第1の凸部の頂点と、前記固定部の前記第2の凸部の頂点が略同一面上に位置するように第1及び第2の凸部が形成された、
請求項5記載のフラット配線材。
The first and second convex portions are formed such that the vertex of the first convex portion of the connection portion and the vertex of the second convex portion of the fixed portion are located on substantially the same plane,
The flat wiring material according to claim 5.
前記固定部材は、前記固定部の端部に設けられ、前記被実装基板に設けられた貫通孔に挿入されて前記接続部及び固定部の位置決めをする位置決め部を備えた、
請求項4乃至6のいずれか1項に記載のフラット配線材。
The fixing member includes a positioning portion that is provided at an end of the fixing portion and is inserted into a through-hole provided in the mounted substrate to position the connection portion and the fixing portion.
The flat wiring material according to any one of claims 4 to 6.
間隔を設けて幅方向に並列に配置された複数の信号用導体と、
前記複数の信号用導体の少なくとも一方の端部に設けられ、被実装基板にはんだ材を介して接続される複数の接続部とを備え、
前記接続部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向に沿う線状となる第1の接続部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の接続部と、
を備えたフラット配線材と、
前記被実装基板に対向する面と反対側の面に設けられた第1の平坦面と、
前記フラット配線材の前記接続部が前記はんだ材を介して接続される信号用電極を備えた被実装基板と、
を備えた実装体。
A plurality of signal conductors arranged in parallel in the width direction at intervals;
A plurality of connection portions provided at at least one end of the plurality of signal conductors and connected to a substrate to be mounted via a solder material;
The connection portion is a first connection portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along the width direction, and
A second connecting portion having a region in which the thickness of the solder material between the mounting substrate is large;
A flat wiring material with
A first flat surface provided on a surface opposite to the surface facing the mounting substrate;
A mounting substrate including a signal electrode to which the connecting portion of the flat wiring material is connected via the solder material;
An implementation with
前記フラット配線材は、前記接続部に近接した位置に前記幅方向に延伸して設けられ、前記信号用導体を固定する固定部材を備え、
前記固定部材は、前記被実装基板にはんだ材により固定される固定部を備え、
前記固定部は、前記被実装基板との間の前記はんだ材の厚さが小となる領域が点状、又は前記幅方向と直交する方向に沿う線状となる第1の固定部と、
前記被実装基板との間の前記はんだ材の厚さが大となる領域を有する第2の固定部と、
前記被実装基板に対向する面と反対側の面に設けられた第2の平坦面と、
前記被実装基板は、固定部が固定される固定用電極を備えた、
請求項8記載の実装体。
The flat wiring member is provided to extend in the width direction at a position close to the connection portion, and includes a fixing member that fixes the signal conductor.
The fixing member includes a fixing portion that is fixed to the mounting substrate by a solder material,
The fixing portion is a first fixing portion in which a region where the thickness of the solder material between the mounting substrate is small is a dot shape, or a linear shape along a direction orthogonal to the width direction,
A second fixing portion having a region where the thickness of the solder material between the mounting substrate is large;
A second flat surface provided on a surface opposite to the surface facing the mounting substrate;
The mounting substrate includes a fixing electrode to which a fixing portion is fixed.
The mounting body according to claim 8.
前記フラット配線材は、前記固定部の端部に設けられ、前記被実装基板に設けられた貫通孔に挿入されて前記接続部及び固定部の位置決めをする位置決め部を有する前記固定部材を備え、
前記被実装基板は、前記位置決め部が挿入される貫通孔を備えた、
請求項9記載の実装体。












The flat wiring member includes the fixing member provided at an end portion of the fixing portion and having a positioning portion that is inserted into a through-hole provided in the mounted substrate and positions the connection portion and the fixing portion.
The mounted substrate includes a through hole into which the positioning portion is inserted.
The mounting body according to claim 9.












JP2012246620A 2012-11-08 2012-11-08 Flat wiring material and mounting body using it Pending JP2014096260A (en)

Priority Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021057310A1 (en) * 2019-09-27 2021-04-01 王定锋 Double-layer circuit board made by combining single-layer circuit board onto flat cable and manufacturing method
WO2021140059A1 (en) * 2020-01-10 2021-07-15 Rudi Blumenschein Flat conductor cable
WO2024016566A1 (en) * 2022-07-18 2024-01-25 上海兰钧新能源科技有限公司 Battery sampling assembly and battery pack

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021057310A1 (en) * 2019-09-27 2021-04-01 王定锋 Double-layer circuit board made by combining single-layer circuit board onto flat cable and manufacturing method
WO2021140059A1 (en) * 2020-01-10 2021-07-15 Rudi Blumenschein Flat conductor cable
DE102020000103C5 (en) 2020-01-10 2023-06-22 Rudi Blumenschein flat conductor cable
WO2024016566A1 (en) * 2022-07-18 2024-01-25 上海兰钧新能源科技有限公司 Battery sampling assembly and battery pack

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