CN216626189U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
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- CN216626189U CN216626189U CN202123384070.6U CN202123384070U CN216626189U CN 216626189 U CN216626189 U CN 216626189U CN 202123384070 U CN202123384070 U CN 202123384070U CN 216626189 U CN216626189 U CN 216626189U
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Abstract
The utility model provides a flexible circuit board, and relates to the technical field of electronic circuits. The utility model provides a flexible circuit board, which comprises a flexible substrate; the adhesive layer is attached to at least one surface of the flexible base material; the flexible composite conducting layer is printed on the upper surface of the adhesive layer and forms a patterned wiring layer; the flexible composite conducting layer at least comprises a first conducting layer and a second conducting layer, and the second conducting layer is a metal plating layer and is arranged on at least partial area of the first conducting layer. The technical scheme of the utility model can improve the adhesive force of the conductive paste on the surface of the flexible base material, and has good bending resistance, stable conductive performance and good reliability.
Description
Technical Field
The utility model relates to the technical field of electronic circuits, in particular to a flexible circuit board.
Background
With the development of miniaturization, ultra-thinning and multi-functionalization of wearable, portable and other electronic products, the requirements for the printed circuit board used therein are also increasing. Flexible Printed Circuit boards (FPCs) have high wiring density, light weight, thin thickness, and capability of being freely bent and folded, so as to integrate assembly and wire connection, and thus have been widely used in the manufacture of various electronic products.
At present, the most used FPC boards in the market are formed by coating copper foil on the surface of a flexible base film or by coating or printing conductive silver paste. The copper foil circuit has poor flexible bending performance, so that the problem of breakage is easily caused under the condition of repeated bending, the circuit performance is reduced or the circuit directly fails, and the application is limited; although the bending performance of the printed circuit formed by the conductive silver paste is stronger than that of a copper foil circuit, the conductive silver paste after sintering and curing has poor adhesive force on the base material, and the base material is easy to break or fall off at the bent part after being repeatedly bent, so that the electronic circuit is ineffective in function, and the reliability is poor.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems, the utility model provides a flexible circuit board which can improve the adhesive force of conductive paste on the surface of a flexible base material, and has good bending resistance, stable conductive performance and good reliability.
In a first aspect, the present invention provides a flexible circuit board comprising:
a flexible substrate;
the adhesive layer is attached to at least one surface of the flexible base material;
the flexible composite conducting layer is printed on the upper surface of the adhesive layer and forms a patterned wiring layer; the flexible composite conducting layer at least comprises a first conducting layer and a second conducting layer, and the second conducting layer is a metal plating layer and is arranged on at least partial area of the first conducting layer.
Optionally, the first conductive layer comprises a layer of conductive ink and/or a layer of liquid metal.
Optionally, the adhesive layer is a thermoplastic adhesive film.
Optionally, the second conductive layer at least comprises one of a copper layer, a nickel layer or a gold layer or a mixed layer or an alloy layer composed of at least two of the copper layer, the nickel layer and the gold layer; and the flexible circuit board further comprises:
and the organic protective layer covers at least one part of the first conductive layer and/or the second conductive layer.
Optionally, the organic light emitting diode further comprises an electronic element, and a pin of the electronic element passes through an opening formed in the organic protective layer and is connected and fixed with the second conductive layer.
Optionally, the flexible substrate, the adhesive layer and the patterned wiring layer are covered by a package insulating layer.
Optionally, a window for exposing at least a partial region of the patterned wiring layer is disposed on the package insulating layer, and the position of the window corresponds to the position of the pad of the patterned wiring layer.
Optionally, the adhesive layers include two adhesive layers respectively attached to the upper surface and the lower surface of the flexible substrate.
Optionally, the flexible substrate includes at least one metallized via to communicate with the patterned wiring layers formed on the upper and lower surfaces of the flexible substrate.
Optionally, the flexible substrate is a transparent flexible substrate, or a polyimide film.
Compared with the prior art, the utility model has the following technical advantages:
according to the flexible circuit board, the adhesive layer is additionally arranged between the flexible composite conductive layer and the flexible substrate, and the adhesive force between the adhesive layer and the flexible composite conductive layer as well as between the adhesive layer and the flexible substrate is far greater than that between the flexible composite conductive layer and the flexible substrate, so that the adhesive force between the conductive layer and the flexible substrate can be effectively improved by the layer structure, the patterned wiring layer of the flexible circuit board is prevented from falling off after the flexible circuit board is repeatedly bent, and the stable conductive performance is ensured; secondly, the flexible composite conducting layer structure can better ensure the bending resistance and further improve the conductivity, thereby improving the stability and reliability of the flexible circuit board structure; in addition, according to the requirements of use occasions, the flexible circuit board can be made into a double-sided flexible circuit board, so that the flexibility and the diversity of application scenes are improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model, as claimed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a cross-sectional side view of a flexible circuit board according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a flexible printed circuit board according to an embodiment of the present invention;
FIG. 3 is a cross-sectional side view of a flexible circuit board provided in accordance with another embodiment of the present invention;
fig. 4 is a cross-sectional side view of a double-sided flexible circuit board according to yet another embodiment of the utility model.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the present invention, it is to be understood that terms such as "including" or "having," etc., are intended to indicate the presence of the disclosed features, numbers, steps, actions, components, parts, or combinations thereof, and are not intended to preclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof may be present or added.
It should be noted that the technical features in the embodiments of the present invention may be combined with each other without conflict.
In the foregoing, the flexible bending performance of the existing copper foil circuit is poor, and the adhesion force of the flexible printed circuit sintered and cured by the conductive silver paste on the flexible substrate is poor, so that after being bent for many times, the flexible printed circuit is easily broken or falls off at the bent position, thereby causing the functional failure of the electronic circuit.
In order to solve the above technical problem, the present invention provides a flexible circuit board, which includes a flexible substrate, an adhesive layer attached to at least one surface of the flexible substrate, and a composite conductive layer printed on the upper surface of the adhesive layer and capable of forming a patterned conductive wiring layer, where the composite conductive layer includes at least a first conductive layer and a second conductive layer, and the second conductive layer is a metal plating layer and is disposed on at least a partial area of the first conductive layer. The adhesive layer with better adhesive force is adopted to realize the tight combination between the conductive layer and the flexible substrate, so that the adhesive force between the conductive layer and the substrate is effectively improved, the occurrence of falling after bending is avoided, and the reliability of the flexible circuit board is improved; due to the design of the flexible composite conducting layer, on one hand, the multi-bending performance of the flexible circuit board is improved, and meanwhile, the conductivity is improved.
FIG. 1 illustrates a side cross-sectional view of a flexible circuit board of an embodiment of the present invention; fig. 2 is a flowchart of a method for manufacturing a flexible circuit board according to an embodiment of the present invention.
A flexible circuit board according to an embodiment of the present invention, as shown in fig. 1, includes:
a flexible substrate 1;
an adhesive layer 2 attached to at least one surface 1a, 1b of the flexible substrate 1;
the flexible composite conducting layer 3 is printed on the upper surface of the adhesive layer 2 and forms a patterned wiring layer; the flexible composite conductive layer 3 at least includes a first conductive layer 31 and a second conductive layer 32, and the second conductive layer 32 is a metal plating layer and is disposed on at least a partial region of the first conductive layer 31.
In this embodiment, the adhesive layer 2 is closely attached to the upper surface 1a of the flexible substrate 1 and the lower surface of the first conductive layer 31, and the adhesive layer 2 and the second conductive layer 31A conductive layer 31 having a first adhesion Fs1When the adhesive layer 2 is not present, the first conductive layer and the flexible substrate have a second adhesion force Fs2，Fs1＞Fs2. According to the embodiment of the utility model, the adhesive layer capable of effectively improving the adhesive force is arranged between the first conductive layer and the flexible substrate, so that the conductive patterns or conductive circuits formed on the surface of the flexible substrate can be effectively prevented from falling off, and the stability of the conductive performance of the flexible circuit board is ensured.
Preferably, the adhesive layer 2 in the present invention has a film shape, and a commercially available thermoplastic film, which is a prior art film material, may be a film structure formed by spraying, dipping, spin coating, screen printing or inkjet printing; the thermoplastic adhesive film may be made of one or more of polyurethane, polyacrylate, polyamide, polyester, vinyl chloride-vinyl acetate copolymer resin, or polyvinyl butyral, for example. In addition, the thermoplastic adhesive film used in the present invention may also be made of a material having a melting point higher than the sintering temperature of the patterned wiring layer. The adhesive layer of the present invention is not melted during the sintering process to form the conductive wiring layer, and therefore, it should be understood by those skilled in the art that any thermoplastic adhesive film satisfying the above requirements is suitable for the present embodiment, and the present invention is not limited thereto.
As shown in fig. 1, the flexible composite conductive layer 3 of the present embodiment includes a first conductive layer 31 and a second conductive layer 32, wherein the first conductive layer 31 is a flexible conductive layer and includes a conductive ink layer and/or a liquid metal layer.
Specifically, the first conductive layer 31 in this embodiment may be a conductive ink layer, and the conductive ink layer may be formed after being printed, cured and then coated on the flexible substrate 1 covered with the adhesive layer 2 according to the conductive pattern requirement of the preset conductive wiring layer, wherein the method of printing the conductive ink layer is not limited to screen printing, gravure printing, flexo printing, pad printing, spray printing, printing or other surface treatment technologies; preferably, the thickness of the conductive ink layer printed by the utility model ranges from 5 μm to 100 μm.
The conductive ink involved in the present invention is a flexible conductive paste known or commonly used in the art, for example, the conductive ink includes, but is not limited to, a conductive paste of metal particles, an inorganic conductive paste, a carbon-based conductive paste, and the like in the prior art, wherein the conductive paste of metal particles at least includes conductive metal particles, such as copper, gold, silver-coated copper powder, and the like; or the flexible circuit board conductive paste disclosed in the utility model patent CN107809842A is adopted; or in the utility model patent CN 105702323 a, the flexible conductive silver paste with excellent adhesion and bending resistance is prepared by compounding silver nanowires as a conductive material with hydroxyethyl methacrylate phosphate, polyurethane resin, polyvinyl butyral, a solvent, a defoaming agent, a curing agent, and the like; or flexible conductive slurry comprising 3 to 7 percent of film forming material, 20 to 50 percent of conductive powder, 25 to 45 percent of liquid metal microcapsule, 10 to 30 percent of solvent, 0.1 to 5 percent of curing agent and 0.5 to 5 percent of functional auxiliary agent; of course, other flexible conductive paste can be selected from the conductive ink of the present invention, and the present invention is not limited thereto.
In addition, the first conductive layer 31 in this embodiment may also be a liquid metal layer, wherein the liquid metal layer is formed by at least a liquid metal. The liquid metal in this embodiment at least includes a low-melting-point metal simple substance or alloy with a melting point below 300 ℃, for example, one simple substance or an alloy composed of at least two of gallium, tin, indium and zinc metals, for example, gallium-indium eutectic alloy, gallium-indium-tin eutectic alloy and gallium-indium-tin-zinc eutectic alloy. It should be understood by those skilled in the art that the first conductive layer 31 in the present invention can also be a composite layer structure composed of a conductive ink layer and a liquid metal layer.
In some embodiments, at least a portion of the surface of the first conductive layer 31 is formed with a second conductive layer 32.
Specifically, the second conductive layer 32 is a metal plating layer. The metal coating can include a mixed layer or an alloy layer composed of one or two metal layers of a copper layer, a nickel layer, a gold layer or a silver layer. After a first conductive layer 31 is attached on a flexible substrate 1 to form a patterned wiring layer, the patterned wiring layer is selectively plated, so that a metal plating layer 32 is formed on at least a partial area of the first conductive layer 31; preferably, the metal plating layer 32 may be entirely or partially plated on the surface of the first conductive layer 31 to improve the conductivity of the conductive pattern and improve the reliability of the conductive circuit.
Further, the flexible circuit board further includes an organic protective layer 4, and the protective layer 4 covers at least a portion of the first conductive layer 31 and/or the second conductive layer 32.
Preferably, the organic protection layer 4 is formed with an opening 41 exposing at least a portion of the second conductive layer, and the position of the opening 41 corresponds to at least a position of a conductive trace pad (not shown in the figure) of the flexible circuit board. It should be understood by those skilled in the art that the organic protective layer 4 used in the present invention is not limited to the polyimide protective film, and other organic protective film layers may be selected according to the practical application, and the present invention is not particularly limited thereto.
According to an embodiment of the present invention, the flexible circuit board further includes an electronic component 5, and a pin of the electronic component 5 passes through an opening 41 formed on the organic protective layer 4 and is connected and fixed with the second conductive layer 32, for example, by soldering.
The flexible substrate in the implementation of the utility model can be a commercially available temperature-resistant flexible substrate, such as a transparent flexible substrate, or a PI polyimide film, a PET high-temperature-resistant polyester film, a PC polycarbonate film, a PEN polyethylene naphthalate film, a PP polypropylene film and the like; preferably, it may be a PI polyimide film.
The utility model further discloses a manufacturing method of the flexible circuit board. As shown in fig. 2, the manufacturing method includes the following steps:
step S1: providing a flexible substrate, such as a PI polyimide film;
step S2: adhering an adhesive layer on the upper surface of the flexible substrate;
step S3: printing a first conductive layer on the adhesive layer according to a target conductive pattern, and forming a patterned wiring layer after curing, wherein the thickness of the patterned wiring layer ranges from 5 micrometers to 100 micrometers;
step S4: forming a second conductive layer, and selectively plating a metal plating layer on the surface of the patterned wiring layer in an electroplating or chemical plating mode, wherein the thickness of the metal plating layer ranges from 0.05 mu m to 10 mu m;
step S5: mounting an organic protective layer for covering the first conductive layer and/or the second conductive layer, wherein an opening for exposing a conductive circuit pad of the flexible circuit board is reserved on the organic protective layer;
step S6: and the pins of the electronic element penetrate through the openings of the organic protective layer and are fixedly connected with the second conductive layer in a welding mode. The electronic component may be a switch, a power supply, a light emitting device, a sensor, a chip, etc. according to actual needs, which is not limited in the embodiments of the present invention.
The flexible circuit board prepared according to the manufacturing process can effectively improve the adhesive force between the conductive layer and the flexible substrate, ensures that the conductive circuit does not fall off after repeated bending, and improves the conductive stability of the flexible circuit board.
According to another embodiment of the present invention, as shown in FIG. 3. Fig. 3 is a side cross-sectional view of a flexible circuit board provided by another embodiment of the utility model. The flexible circuit board includes:
the flexible printed circuit board comprises a flexible substrate 1, an adhesive layer 2 attached to at least one surface 1a of the flexible substrate 1, and a flexible composite conductive layer 3 printed on the upper surface 1a of the adhesive layer 2 and forming a patterned wiring layer, wherein the flexible composite conductive layer 3 at least comprises a first conductive layer 31 and a second conductive layer 32, and the second conductive layer 32 is a metal plating layer and is disposed on at least a partial area of the first conductive layer 31.
In order to ensure the stability and reliability of the overall structure of the flexible circuit board, in the embodiment of the utility model, the flexible circuit board further comprises a packaging insulating layer 6, and the packaging insulating layer 6 coats the flexible substrate 1, the adhesive layer 2 and the patterned wiring layer.
Optionally, a window 61 for exposing at least a partial region of the patterned wiring layer is disposed on the package insulating layer 6, a position of the window 61 corresponds to a position of a pad of the patterned wiring layer, and the second conductive layer 32 is plated on the window 61.
And the pins of the electronic element 5 penetrate through the open window 61 formed on the packaging insulating layer 6 and are fixedly welded with the second conducting layer 32.
In the manufacturing method of the flexible circuit board of this embodiment, the steps of the manufacturing process described in the foregoing embodiment may be performed, and before the second conductive layer is formed in step S4 of the foregoing embodiment, an insulating packaging step is further included, that is, a packaging process is performed on the flexible substrate, the adhesive layer, and the side surface of the first conductive layer through an insulating packaging material (e.g., resin) to form a constraint, so as to greatly improve the structural stability of the conductive pattern.
In addition, before step S4, the method further includes shielding an area of the first conductive layer where the second conductive layer is not required to be plated, so that the formed metal plating layer is formed on the unmasked patterned wiring layer in S4, thereby meeting the corresponding structural requirements of the product.
According to another embodiment of the present invention, a double-sided flexible circuit board is provided, wherein the adhesive layers 2 'include two layers respectively attached to the upper surface and the lower surface of the flexible substrate 1', as shown in fig. 4. Moreover, the surfaces of the two adhesive layers 2 'are respectively provided with a first conductive layer 31', a second conductive layer 32', a packaging insulating layer 6', an organic protective layer 4 'and an electronic element 5'. The structures of the first conductive layer 31', the second conductive layer 32', the packaging insulating layer 6', the organic protection layer 4' and the electronic element 5' are the same as or similar to those of the previous embodiments, and the description of the present invention is omitted. According to the utility model, the double-sided lead lines are symmetrically formed on the upper surface and the lower surface of the flexible substrate 1', and finally the double-sided flexible circuit board can be formed, so that the application universality and flexibility of the flexible circuit board are increased, and the requirements of different application occasions are met. It should be understood by those skilled in the art that, in the double-sided flexible circuit board in the embodiment of the present invention, the flexible conductive traces formed on the upper and lower surfaces of the flexible substrate may be symmetrical, or of course, may also be of an asymmetrical structure, and those skilled in the art may completely flexibly set according to the needs of the actual application, and the present invention is not limited to this.
In this embodiment, the flexible substrate 1 'of the double-sided flexible circuit board further includes at least one metallized via 7', and the patterned wiring layers formed on the upper and lower surfaces of the flexible substrate 1 'are electrically conducted through the metallized via 7'. Wherein the metallized via 7' may be formed by an electroplating process that imparts conductivity to the via, for example, by forming a metal plating on the surface of the via using an electroplating process, and/or filling the via with a conductive filler to render the via conductive after metallization.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A flexible circuit board, comprising:
a flexible substrate;
the adhesive layer is attached to at least one surface of the flexible base material;
the flexible composite conducting layer is printed on the upper surface of the adhesive layer and forms a patterned wiring layer; the flexible composite conducting layer at least comprises a first conducting layer and a second conducting layer, and the second conducting layer is a metal plating layer and is arranged on at least partial area of the first conducting layer.
2. The flexible circuit board of claim 1, wherein the first conductive layer comprises a layer of flexible conductive ink and/or a layer of liquid metal.
3. The flexible circuit board according to claim 1 or 2, wherein the second conductive layer comprises at least one of a copper layer, a nickel layer, or a gold layer, or a mixed layer or an alloy layer of at least two of them; and the flexible circuit board further comprises:
and the organic protective layer covers at least one part of the first conductive layer and/or the second conductive layer.
4. The flexible circuit board according to claim 3, further comprising an electronic component, wherein a lead of the electronic component is connected and fixed to the second conductive layer through an opening formed in the organic protective layer.
5. The flexible circuit board according to claim 1 or 2, further comprising an encapsulating insulating layer covering the flexible substrate, the adhesive layer, and the patterned wiring layer.
6. The flexible circuit board according to claim 5, wherein the package insulating layer is provided with a window for exposing at least a partial region of the patterned wiring layer, and the position of the window corresponds to the position of the pad of the patterned wiring layer.
7. The flexible circuit board of claim 1, wherein the adhesive layer comprises two adhesive layers attached to the upper surface and the lower surface of the flexible substrate, respectively.
8. The flexible circuit board of claim 7, wherein the flexible substrate includes at least one metallized via to communicate with patterned wiring layers formed on the upper and lower surfaces of the flexible substrate.
9. The flexible circuit board of claim 1, wherein the flexible substrate is a transparent flexible substrate or a polyimide film.
10. The flexible circuit board of claim 1, wherein the adhesive layer is a thermoplastic film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123384070.6U CN216626189U (en) | 2021-12-30 | 2021-12-30 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123384070.6U CN216626189U (en) | 2021-12-30 | 2021-12-30 | Flexible circuit board |
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| CN216626189U true CN216626189U (en) | 2022-05-27 |
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| CN202123384070.6U Active CN216626189U (en) | 2021-12-30 | 2021-12-30 | Flexible circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116614957A (en) * | 2023-03-23 | 2023-08-18 | 深圳大学 | Flexible circuit board, preparation method of flexible circuit and wearable electronic equipment |
| CN116814145A (en) * | 2023-06-05 | 2023-09-29 | 北京梦之墨科技有限公司 | Primer and preparation method and application thereof |
-
2021
- 2021-12-30 CN CN202123384070.6U patent/CN216626189U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116614957A (en) * | 2023-03-23 | 2023-08-18 | 深圳大学 | Flexible circuit board, preparation method of flexible circuit and wearable electronic equipment |
| CN116814145A (en) * | 2023-06-05 | 2023-09-29 | 北京梦之墨科技有限公司 | Primer and preparation method and application thereof |
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