CN209562901U - A kind of flexible electric circuit board based on chemical NiPdAu technology - Google Patents
A kind of flexible electric circuit board based on chemical NiPdAu technology Download PDFInfo
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- CN209562901U CN209562901U CN201821738017.7U CN201821738017U CN209562901U CN 209562901 U CN209562901 U CN 209562901U CN 201821738017 U CN201821738017 U CN 201821738017U CN 209562901 U CN209562901 U CN 209562901U
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- nipdau
- copper foil
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- base material
- foil plate
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a kind of flexible electric circuit boards based on chemical NiPdAu technology; including Double-layer flexible substrate and the NiPdAu superficial layer obtained using chemical NiPdAu technical treatment; Double-layer flexible substrate layer includes the copper foil base material with bent performance; the upper and lower surface of copper foil base material is bonded with composite protection film; copper foil base material includes the first copper foil plate and the second copper foil plate; it is filled with composite and flexible substrate between first copper foil plate and the second copper foil plate, passes through hot-setting adhesive adhesion between composite and flexible substrate and upper and lower copper foil；NiPdAu superficial layer includes the automatic NiPdAu line being electroplated on wiring layer cabling, plating in the change gold solder disk of chip pin position, further includes the NiPdAu via hole for connecting the first copper foil plate and the second copper foil plate；The utility model has good bending performance, and conduct electricity very well long service life, and yields is high, black disk risk is small.
Description
Technical field
The utility model relates to field of circuit boards, specially a kind of flexible electric circuit board based on chemical NiPdAu technology.
Background technique
Flexible printed board is also known as flexible printed wiring board i.e. FPC, and flexible circuit board is to be with polyimides or polyester film
A kind of printed circuit board with high reliability and higher circumnutating property made of substrate.It is this circuit board radiating good, i.e. bendable
It is bent, fold, volume is scratched, and can arbitrarily be moved in three-dimensional space and flexible.Volume is reduced using FPC, realizes lightweight, small-sized
Change, slimming, to realize component arrangement and conducting wire connecting integration.FPC is widely used in electronic computer, communication, space flight
And the industries such as household electrical appliances.The complicated multiplicity of FPC Current surface treatment process type, traditional spray tin, craft of gilding cannot expire completely
Sufficient modern product demand is suitble to the technology on wiring board for the surface treatment for small pin of running business into particular one to have wicking (Immersion
Tin), silver-colored (Immersion Silver), organic solder protective agent (OSP), chemical nickel plating leaching golden (ENIG) etc., but these works are soaked
Skill is not able to satisfy the necessary requirement of Lead-free in Electronic Packaging technique, these techniques processing yields is low, black disk risk is high, and these types of work
Resistance to storage time and routing joint capacity before the multiple reflow welding ability of skill, assembling, limitation is clearly.
Summary of the invention
In order to overcome the shortcomings of prior art, the utility model provides a kind of flexibility based on chemical NiPdAu technology
Circuit board can effectively solve the problem of background technique proposes.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of flexible electric circuit board based on chemical NiPdAu technology, including Double-layer flexible substrate and the chemical NiPdAu skill of use
The wiring layer in Double-layer flexible substrate is electroplated in the NiPdAu superficial layer that art is handled, NiPdAu superficial layer；Double-layer flexible substrate
Layer includes the copper foil base material with bent performance, and the upper and lower surface of copper foil base material is bonded with composite protection film, copper foil base material
Including the first copper foil plate and the second copper foil plate, composite and flexible substrate is filled between the first copper foil plate and the second copper foil plate, it is compound
Pass through hot-setting adhesive adhesion between flexible base board and upper and lower copper foil；
NiPdAu superficial layer includes the automatic NiPdAu line being electroplated on wiring layer cabling, plating in chip pin position
Change gold solder disk, further includes the NiPdAu via hole for connecting the first copper foil plate and the second copper foil plate.
Further, the lower layer of copper foil base material is inlaid with the benefit for enhancing mechanical strength according to the installation site of component
Strong plate substrate.
Further, composite protection film is using bottom for the electromagnetic shielding film of interference to be isolated and for carrying out insulation protection
Insulating coating compound obtain.
Further, automatic NiPdAu line, change gold solder disk and NiPdAu via hole are all made of same NiPdAu material and are made,
It is the layer gold with a thickness of 0.107mm that bottom, which is with a thickness of the palladium layers of 0.06mm, top layer for the nickel layer with a thickness of 8.7mm, middle layer,.
Further, the base material of composite and flexible substrate is made of polyimide surface coating epoxide-resin glue, whole
Body thickness is between 0.5mil-1mil.
Compared with prior art, the utility model has the beneficial effects that
(1) the utility model increases NiPdAu coating on flexible electric circuit board and is made by using chemical NiPdAu technology
Automatic NiPdAu line, change gold solder disk and NiPdAu via hole, effectively improve welding efficiency and conductive effect, layer adhesion is good
It is not easily to fall off, and bad order rate is substantially reduced；
(2) the utility model is enhanced while guaranteeing overall flexibility by increasing stiffening plate substrate in copper foil base material
Local strength is convenient for element welding；Have the composite protection film promotion of electromagnetic shielding performance to the protection energy of circuit board by being arranged
Power.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the overlooking structure diagram of the utility model.
Figure label:
1- Double-layer flexible substrate；2- NiPdAu superficial layer；
101- copper foil base material；102- composite protection film；103- stiffening plate substrate；The first copper foil plate of 104-；The second bronze medal of 105-
Foil plate；106- composite and flexible substrate；The automatic NiPdAu line of 201-；202-ization gold solder disk；203- NiPdAu via hole.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1, the utility model provides a kind of flexible electric circuit board based on chemical NiPdAu technology, including bilayer
Flexible base board 1 and the NiPdAu superficial layer 2 obtained using chemical NiPdAu technical treatment, NiPdAu superficial layer 2 are electroplated in bilayer
The wiring layer of flexible base board 1；Double-layer flexible substrate 1 can carry out the shape that height bending fold is needed, NiPdAu surface
The risk of black disk failure is effectively reduced in layer 2, and obtained pad appearance is good, adhesive force is strong and high temperature resistance is good.
Further, Double-layer flexible substrate layer 1 includes the copper foil base material 101 with bent performance, copper foil base material 101
Upper and lower surface is bonded with composite protection film 102, and the lower layer of copper foil base material 101 is inlaid with according to the installation site of component to be used for
Enhance the stiffening plate substrate 103 of mechanical strength, 101 overall flexibility of copper foil base material is fine but rigidity is short of, in installation member
Bearing capacity shortcoming is not easy to install when part, therefore increases reinforcement substrate plate 103 and be easily installed element to promote intensity；Compound guarantor
Insulating coating of the cuticula 102 using bottom for the electromagnetic shielding film of interference to be isolated and for carrying out insulation protection is compound to be obtained,
It effectively realizes the circuit protection to circuit board, prevents extraneous accidentally touching from circuit board being caused to be damaged.
It should be noted that copper foil base material 101 includes the first copper foil plate 104 and the second copper foil plate 105, the first copper foil plate
104 and second are filled with composite and flexible substrate 106 between copper foil plate 105, and the first copper foil plate 104 and the second copper foil plate 105 are adopted
It is made of rolled copper foil, with a thickness of 1/3oz, light weight conducts electricity very well；The base material of composite and flexible substrate 106 uses polyamides
Imines surface coating epoxide-resin glue is made, integral thickness composite and flexible substrate 106 and upper and lower copper foil between 0.5mil-1mil
Between by hot-setting adhesive adhesion, can at high temperature retention property it is constant；By using the design of doubling plate, it is convenient for complicated circuit
Cabling arrangement reduce the influence that intercouples of interelement.
In the present embodiment, as shown in Fig. 2, NiPdAu superficial layer 2 includes automatic nickel palladium of the plating on wiring layer cabling
Gold thread 201, plating further include the first copper foil plate 104 of connection and the second copper foil plate in the change gold solder disk 202 of chip pin position
105 NiPdAu via hole 203；Automatic NiPdAu line 201, change gold solder disk 202 and NiPdAu via hole 203 are all made of same nickel palladium
Golden material is made, bottom is with a thickness of the nickel of 8.7mm, middle layer to be with a thickness of the palladium layers of 0.06mm, top layer be with a thickness of
The layer gold of 0.107mm.
In particular, the bad order rate of automatic NiPdAu line 201 is low, line width is small and conducts electricity very well, and effectively resistance to
Corrosion；Changing gold solder disk 202 has good high-temperature resistance, does not aoxidize by high temperature non-discolouring convenient for soldering element, and promotion is led
Electric effect reduces rosin joint probability；NiPdAu via hole 203 has good adhesive ability, and be not easy peeling extension circuit board uses the longevity
Life.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (5)
1. a kind of flexible electric circuit board based on chemical NiPdAu technology, it is characterised in that: including Double-layer flexible substrate (1) and use
The NiPdAu superficial layer (2) that chemical NiPdAu technical treatment obtains, NiPdAu superficial layer (2) plating is in Double-layer flexible substrate
(1) upper and lower surface wiring layer；The Double-layer flexible substrate (1) includes the copper foil base material (101) with bent performance, described
The upper and lower surface of copper foil base material (101) is bonded with composite protection film (102), and the copper foil base material (101) includes the first copper foil
Plate (104) and the second copper foil plate (105), filled with compound soft between first copper foil plate (104) and the second copper foil plate (105)
Property substrate (106), between the composite and flexible substrate (106) and upper and lower copper foil pass through hot-setting adhesive adhesion；
The NiPdAu superficial layer (2) includes the automatic NiPdAu line (201) being electroplated on wiring layer cabling, is electroplated and draws in chip
The change gold solder disk (202) of placement of foot further includes the NiPdAu via hole for connecting the first copper foil plate (104) and the second copper foil plate (105)
(203)。
2. a kind of flexible electric circuit board based on chemical NiPdAu technology according to claim 1, it is characterised in that: the copper
The lower layer of paper tinsel base material (101) is inlaid with the stiffening plate substrate (103) for enhancing mechanical strength according to the installation site of component.
3. a kind of flexible electric circuit board based on chemical NiPdAu technology according to claim 1, it is characterised in that: described multiple
It is compound to close the insulating coating of protective film (102) using bottom for the electromagnetic shielding film of interference to be isolated and for carrying out insulation protection
It obtains.
4. a kind of flexible electric circuit board based on chemical NiPdAu technology according to claim 1, it is characterised in that: it is described from
Dynamic NiPdAu line (201), change gold solder disk (202) and NiPdAu via hole (203) are all made of same NiPdAu material and are made, bottom
For the nickel layer with a thickness of 8.7mm, the middle layer layer gold that be with a thickness of the palladium layers of 0.06mm, top layer be with a thickness of 0.107mm.
5. a kind of flexible electric circuit board based on chemical NiPdAu technology according to claim 1, it is characterised in that: described multiple
The base material for closing flexible base board (106) is made of polyimide surface coating epoxide-resin glue, and integral thickness is in 0.5mil-
Between 1mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821738017.7U CN209562901U (en) | 2018-10-25 | 2018-10-25 | A kind of flexible electric circuit board based on chemical NiPdAu technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821738017.7U CN209562901U (en) | 2018-10-25 | 2018-10-25 | A kind of flexible electric circuit board based on chemical NiPdAu technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209562901U true CN209562901U (en) | 2019-10-29 |
Family
ID=68298377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821738017.7U Expired - Fee Related CN209562901U (en) | 2018-10-25 | 2018-10-25 | A kind of flexible electric circuit board based on chemical NiPdAu technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209562901U (en) |
-
2018
- 2018-10-25 CN CN201821738017.7U patent/CN209562901U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191029 Termination date: 20211025 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |