CN116963375A - Flexible circuit board for LED lamp strip - Google Patents
Flexible circuit board for LED lamp strip Download PDFInfo
- Publication number
- CN116963375A CN116963375A CN202210403084.8A CN202210403084A CN116963375A CN 116963375 A CN116963375 A CN 116963375A CN 202210403084 A CN202210403084 A CN 202210403084A CN 116963375 A CN116963375 A CN 116963375A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit layer
- circuit board
- circuit
- lamp strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 19
- 229920002799 BoPET Polymers 0.000 claims abstract description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 2
- -1 polyethylene terephthalate Polymers 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000005030 aluminium foil Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a flexible circuit board for an LED (light-emitting diode) lamp strip, which comprises a PET (polyethylene terephthalate) film layer, wherein the front surface of the PET film layer is coated with a front insulating bonding layer, the back surface of the PET film layer is coated with a back insulating bonding layer, the top surface of the front insulating bonding layer is bonded with a front circuit layer, the bottom surface of the back insulating bonding layer is bonded with a back circuit layer, the top surface of the front circuit layer is provided with a front covering layer, the bottom surface of the back circuit layer is provided with a back covering layer, aluminum foils are arranged on the front circuit layer and the back circuit layer, and the front covering layer and/or the back covering layer are provided with bonding pad layers and through holes. The LED lamp strip is reasonable in structural arrangement, not only is the processing efficiency improved, but also the processing cost can be reduced, the contact surfaces of the aluminum foil on the front circuit layer and the aluminum foil on the back circuit board can be better protected, the effectiveness and the reliability of conduction are ensured, and meanwhile, the LED lamp strip can be produced in a large scale and automatically, so that the LED lamp strip is high in applicability and good in practicability.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to a flexible circuit board for an LED lamp strip.
Background
The LED lamp strip is provided with a corresponding circuit board, the conventional circuit board mainly comprises a substrate, a metal copper foil circuit printed on the substrate and the like, when the LED lamp strip is used, the LED light source lamp beads are welded on the metal copper foil, and although the LED lamp strip can meet the use requirements of general conditions, the LED lamp strip is high in cost and unfavorable for mass automatic production, and drilling and electroplating conduction are required to be added to ensure the overall conductivity, so that the applicability and the practicability are limited.
Disclosure of Invention
The invention aims to provide a flexible circuit board for an LED lamp strip, which is reasonable in structural arrangement and beneficial to cost reduction.
The technical scheme for achieving the purpose of the invention is that the flexible circuit board for the LED lamp strip comprises a PET film layer, wherein the front surface of the PET film layer is coated with a front insulating bonding layer, the back surface of the PET film layer is coated with a back insulating bonding layer, the top surface of the front insulating bonding layer is bonded with a front circuit layer, the bottom surface of the back insulating bonding layer is bonded with a back circuit layer, the top surface of the front circuit layer is provided with a front covering layer, the bottom surface of the back circuit layer is provided with a back covering layer, the front circuit layer and the back circuit layer are respectively provided with an aluminum foil, the front covering layer and/or the back covering layer are/is provided with a bonding pad layer, and the bonding pad on the front covering layer is used as a center to penetrate through the front circuit layer and the back circuit layer, so that the aluminum foil can be contacted and conducted.
The aluminum foil is ductile.
And the surfaces of the bonding pads of the front cover layer and the back cover layer are respectively provided with a protective electroless nickel plating layer.
The edge of the PET film layer is also provided with a hook hole which is through up and down and provided with a bonding pad.
The surface of the front circuit layer is a front surface, and the surface of the back circuit layer is a mirror surface.
The invention has the positive effects that: the invention has reasonable structural arrangement, is beneficial to improving the processing efficiency, can reduce the processing cost, can overflow solder paste into the through hole in the heating process when tin is coated, can better protect the contact surfaces of the aluminum foil on the front circuit layer and the aluminum foil on the back circuit board, ensures the effectiveness and reliability of conduction, simultaneously ensures that the LED lamp strip can be produced in a large batch and automatically, greatly saves labor, and has strong applicability and good practicability.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments that are illustrated in the appended drawings, in which:
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of a front side circuit layer according to the present invention;
fig. 3 is a schematic structural diagram of a reverse circuit layer in the present invention.
Detailed Description
Example 1
FIGS. 1 to 3 show an embodiment of the present invention, wherein FIG. 1 is a schematic structural diagram of the present invention; FIG. 2 is a schematic diagram of a front side circuit layer according to the present invention; fig. 3 is a schematic structural diagram of a reverse circuit layer in the present invention. In the present embodiment, directional words such as front and back are merely for convenience of description, and are not limited thereto.
See the fig. 1-3 show, a flexible circuit board for LED lamp area, including PET thin film layer 1, the front coating of PET thin film layer has positive insulating bonding layer 2, the reverse side coating of PET thin film layer has reverse side insulating bonding layer 3, the top surface bonding of positive insulating bonding layer has positive circuit layer 4, the bottom surface bonding of reverse side insulating bonding layer has reverse side circuit layer 5, the top surface of positive circuit layer is equipped with positive overburden 6, the bottom surface of reverse side circuit layer is equipped with reverse side overburden 7, all be provided with aluminium foil 8 on positive circuit layer and the reverse side circuit layer, in this embodiment, the aluminium foil is the aluminium foil of ductility. Thus, when the through hole is punched as a whole, the upper aluminum foil and the lower aluminum foil can be brought into contact with each other by utilizing the ductility of the aluminum foil to conduct electricity.
The front cover layer and/or the back cover layer are/is provided with a bonding pad layer 9 and a through hole 10, and in the practical application process, the through hole is punched through a tiny metal punching pin, and the through hole penetrates through the front circuit board layer and the back circuit layer by taking the bonding pad on the front cover layer as the center, so that the aluminum foil is contacted and can be electrically conducted. Meanwhile, in order to tin the aluminum foil, the pad surfaces of the front cover layer and the back cover layer are respectively provided with a protective electroless nickel plating layer 11.
The edge of the PET film layer is also provided with a hook hole which is through up and down and provided with a bonding pad.
In the practical application process, the surface of the front circuit layer is a front surface, and the surface of the back circuit layer is a mirror surface. Meanwhile, in the practical application process, the circuit board is designed to be a seamless butt joint process.
When the LED light source lamp beads are pasted, solder paste is brushed on the through holes, and in the heating process, the solder paste can overflow into the through holes, so that an aluminum foil contact surface for better protecting the upper layer and the lower layer is formed.
The invention has reasonable structural arrangement, is beneficial to improving the processing efficiency, can reduce the processing cost, can overflow solder paste into the through hole in the heating process when tin is coated, can better protect the contact surfaces of the aluminum foil on the front circuit layer and the aluminum foil on the back circuit board, ensures the effectiveness and reliability of conduction, simultaneously ensures that the LED lamp strip can be produced in a large batch and automatically, greatly saves labor, and has strong applicability and good practicability.
The standard components used in the present embodiment may be purchased directly from the market, but the nonstandard structural components according to the descriptions of the specification and the drawings may also be obtained by unambiguous processing according to the conventional technical knowledge, and meanwhile, the connection manner of each component adopts the conventional means mature in the prior art, and the machinery, the components and the equipment all adopt the conventional types in the prior art, so that the specific description will not be made here.
It is to be understood that the above examples of the present invention are provided by way of illustration only and not by way of limitation of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While those obvious variations or modifications which come within the spirit of the invention remain within the scope of the invention.
Claims (5)
1. A flexible circuit board for LED lamp area, includes PET thin film layer, its characterized in that: the PET film layer is characterized in that the front surface of the PET film layer is coated with a front insulating bonding layer, the back surface of the PET film layer is coated with a back insulating bonding layer, the top surface of the front insulating bonding layer is bonded with a front circuit layer, the bottom surface of the back insulating bonding layer is bonded with a back circuit layer, the top surface of the front circuit layer is provided with a front covering layer, the bottom surface of the back circuit layer is provided with a back covering layer, aluminum foils are arranged on the front circuit layer and the back circuit layer, a bonding pad layer is arranged on the front covering layer and/or the back covering layer, a through hole is further formed, and the through hole penetrates through the front circuit layer and the back circuit layer by taking a bonding pad on the front covering layer as a center, and enables the aluminum foils to be in contact and conduct electricity.
2. The flexible circuit board for an LED strip of claim 1, wherein: the aluminum foil is ductile.
3. A flexible circuit board for an LED strip as set forth in claim 2, wherein: and the surfaces of the bonding pads of the front cover layer and the back cover layer are respectively provided with a protective electroless nickel plating layer.
4. A flexible circuit board for an LED strip as set forth in claim 3, wherein: the edge of the PET film layer is also provided with a hook hole which is through up and down and provided with a bonding pad.
5. The flexible circuit board for an LED strip of claim 4, wherein: the surface of the front circuit layer is a front surface, and the surface of the back circuit layer is a mirror surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210403084.8A CN116963375A (en) | 2022-04-18 | 2022-04-18 | Flexible circuit board for LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210403084.8A CN116963375A (en) | 2022-04-18 | 2022-04-18 | Flexible circuit board for LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963375A true CN116963375A (en) | 2023-10-27 |
Family
ID=88455234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210403084.8A Pending CN116963375A (en) | 2022-04-18 | 2022-04-18 | Flexible circuit board for LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963375A (en) |
-
2022
- 2022-04-18 CN CN202210403084.8A patent/CN116963375A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication |