CN214541758U - High-power resistor heat dissipation structure - Google Patents
High-power resistor heat dissipation structure Download PDFInfo
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- CN214541758U CN214541758U CN202120708973.6U CN202120708973U CN214541758U CN 214541758 U CN214541758 U CN 214541758U CN 202120708973 U CN202120708973 U CN 202120708973U CN 214541758 U CN214541758 U CN 214541758U
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- high power
- insulating
- assembly
- heat dissipation
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Abstract
The utility model discloses a high power resistance heat radiation structure, this high power resistance heat radiation structure, the on-line screen storage device comprises a base, be equipped with on the base and be used for radiating radiator unit, be equipped with the insulating assembly who is used for insulating, bonding and heat conduction on the radiator unit, insulating assembly's relative both sides are equipped with the assembly subassembly that is used for pasting the dress, still be equipped with on the insulating assembly be used for the realization with the resistance component of assembly subassembly looks butt, be equipped with on the resistance component and cover and establish apron on the base. The utility model provides a high power resistance heat radiation structure realizes high power resistance heat dissipation function through setting up radiator unit, insulating assembly, assembly subassembly, resistance component and apron, and this high power resistance heat radiation structure has good heat conductivity, electrical insulation performance and machining performance to and can bear high electric current.
Description
Technical Field
The utility model relates to an electronic components field, in particular to high power resistance heat radiation structure.
Background
The Resistor (Resistor) is generally directly called as a Resistor in daily life, which is actually a current limiting element, after the Resistor is connected in a circuit, the resistance value of the Resistor is fixed, two pins are generally adopted, the pins can limit the current passing through a branch connected with the Resistor, the Resistor with the unchangeable resistance value is called as a fixed Resistor, and the Resistor with the changeable resistance value is called as a potentiometer or a variable Resistor.
The resistor has the advantages of single resistance heat dissipation form, simple resistance heat dissipation structure and common heat dissipation effect, and the heat dissipation function cannot be realized through high resistance.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing a high power resistance heat radiation structure, it is more simple to aim at solving resistance heat radiation structure, and the radiating effect is general, can not realize the problem of heat dissipation function through the high resistance.
In order to achieve the above object, the utility model provides a high power resistance heat radiation structure, this high power resistance heat radiation structure include the base, be equipped with on the base and be used for radiating radiator unit, be equipped with the insulating assembly who is used for insulating, bonding and heat conduction on the radiator unit, insulating assembly's relative both sides are equipped with the assembly subassembly that is used for the subsides dress, still be equipped with on the insulating assembly be used for the realization with the resistance component of assembly subassembly looks butt, be equipped with the lid on the resistance component and establish apron on the base.
Preferably, the insulating assembly comprises an insulating layer and an insulating substrate, the insulating substrate being metallic copper.
Preferably, the mounting component is a pad.
Preferably, the resistor component is a resistor pattern formed by etching a resistor material and used for connecting with the bonding pad.
Preferably, the cover plate is a plastic sealing layer.
Preferably, the molding layer is epoxy resin.
The utility model discloses technical scheme's beneficial effect lies in: the utility model provides a high power resistance heat radiation structure realizes high power resistance heat dissipation function through setting up radiator unit, insulating assembly, assembly subassembly, resistance component and apron, and this high power resistance heat radiation structure has good heat conductivity, electrical insulation performance and machining performance to and can bear high electric current.
Drawings
Fig. 1 is a schematic structural diagram of a high power resistance heat dissipation structure of the present invention;
Detailed Description
In the following, the embodiments of the present invention will be described in detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The utility model provides a high power resistance heat radiation structure, refer to figure 1, this high power resistance heat radiation structure, including base 1, be equipped with on base 1 and be used for radiating radiator unit 2, be equipped with on radiator unit 2 and be used for insulating, bonding and the insulating assembly 3 of heat conduction, insulating assembly 3's relative both sides are equipped with the assembly 4 that is used for pasting the dress, still are equipped with on the insulating assembly 3 to be used for realizing with the resistance component 5 of assembly 4 looks butt, are equipped with on the resistance component 5 to cover and establish apron 6 on base 1.
The utility model provides a high power resistance heat radiation structure realizes high power resistance heat dissipation function through setting up radiator unit 2, insulating assembly 3, assembly subassembly 4, resistance component 5 and apron 6, and this high power resistance heat radiation structure has good heat conductivity, electric insulating property and machining performance to and can bear high electric current.
Wherein, this high power resistance heat radiation structure includes base 1, radiator unit 2, insulating component 3, assembly 4, resistance component 5 and apron 6, radiator unit 2 sets up on base 1, radiator unit 2 is provided with the radiating area, the heat dissipation of this structure is accomplished at the radiating area, insulating component 3 sets up on radiator unit 2, mainly used is insulating, bonding and heat conduction, insulating component 3's relative both sides are equipped with the assembly 4 that is used for subsides dress, assembly 4's effect is welding electroplating process, still be equipped with resistance component 5 on the insulating component 3, resistance component 5 (generally adopt a resistance material) forms the resistance figure through the etching, be used for realizing being connected with the PCB pad, be equipped with apron 6 on the resistance component 5, apron 6 is exactly one and moulds the shrouding actually.
In a preferred embodiment, referring to fig. 1, the present invention provides an insulation assembly 3 comprising an insulation layer 31 and an insulation substrate 32, wherein the insulation substrate 32 is copper. In the present embodiment, the insulating assembly 3 includes the insulating layer 31 and the insulating substrate 32, and preferably, the insulating substrate 32 in the insulating assembly 3 proposed in the present embodiment is made of metal copper, and the thermal expansion coefficient, the thermal conductivity, the strength, the hardness, the weight, and the surface condition of the metal copper are excellent through many experiments. The specific material of the insulating substrate 32 is determined according to the actual process requirements, and is not limited herein.
In a preferred embodiment, and with reference to fig. 1, the present invention provides that the mounting elements 4 are pads. In this embodiment, the assembly component 4 is a bonding pad, preferably, a copper plating process is adopted to make the height of the assembly component 4 equal to the thickness of the plastic package, the circuit layer and the insulating layer 31 are reinforced to make the copper substrate structure beautiful, and a tin plating process is adopted to plate the bonding pad, so that weldability is improved.
In a preferred embodiment, referring to fig. 1, the present invention provides that the resistor element 5 is a resistor pattern formed by etching a resistor material and used for connection with a pad. In this embodiment, the resistor component 5 is a resistor pattern formed by etching a resistor material and used for connecting with a pad, and preferably, the resistor layer (generally, a resistor material) is etched to form the resistor pattern and used for connecting with a pad of a PCB. .
In a preferred embodiment, referring to fig. 1, the cover plate 6 of the present invention is a plastic package layer. In this embodiment, the cover plate 6 is a plastic package layer, and preferably, the plastic package layer is made of epoxy resin, so as to reinforce the structure and prevent solder climbing of components and parts to be soldered.
In a preferred embodiment, referring to fig. 1, the molding layer provided by the present invention is epoxy resin. In this embodiment, the plastic envelope layer adopts epoxy, and the purpose is reinforced structure, prevents that welding components and parts from climbing tin.
What just go up be the utility model discloses a part or preferred embodiment, no matter be characters or the drawing can not consequently restrict the utility model discloses the scope of protection, all with the utility model discloses a holistic thought down, utilize the equivalent structure transform that the contents of the description and the drawing do, or direct/indirect application all includes in other relevant technical field the utility model discloses the within range of protection.
Claims (6)
1. The utility model provides a high power resistance heat radiation structure, its characterized in that, includes the base, be equipped with on the base and be used for radiating radiator unit, the last insulating element who is used for insulating, bonding and heat conduction that is equipped with of radiator unit, insulating element's the relative both sides are equipped with the assembly subassembly that is used for pasting the dress, still be equipped with on the insulating element be used for the realization with assembly unit looks butt's resistance component, it establishes to be equipped with the lid on the resistance component apron on the base.
2. The high power resistive heat dissipation structure of claim 1, wherein the insulating assembly comprises an insulating layer and an insulating substrate, the insulating substrate being metallic copper.
3. The high power resistive heat dissipation structure of claim 1, wherein the mounting component is a solder pad.
4. The high power resistive heat dissipation structure of claim 3, wherein the resistive component is a resistive pattern of resistive material etched for connection to the pads.
5. The high power resistive heat dissipation structure of claim 4, wherein the cover plate is a molding layer.
6. The high power resistive heat dissipation structure of claim 5, wherein the molding layer is an epoxy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120708973.6U CN214541758U (en) | 2021-04-08 | 2021-04-08 | High-power resistor heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120708973.6U CN214541758U (en) | 2021-04-08 | 2021-04-08 | High-power resistor heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214541758U true CN214541758U (en) | 2021-10-29 |
Family
ID=78273317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120708973.6U Active CN214541758U (en) | 2021-04-08 | 2021-04-08 | High-power resistor heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214541758U (en) |
-
2021
- 2021-04-08 CN CN202120708973.6U patent/CN214541758U/en active Active
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