CN208208459U - A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure - Google Patents
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure Download PDFInfo
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- CN208208459U CN208208459U CN201820927418.0U CN201820927418U CN208208459U CN 208208459 U CN208208459 U CN 208208459U CN 201820927418 U CN201820927418 U CN 201820927418U CN 208208459 U CN208208459 U CN 208208459U
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Abstract
The purpose of the utility model is to provide a kind of high-power antisurge alloy sheet resistances of two-sided resistive layer structure, comprising: heat-radiating substrate, two sides are equipped with resistive layer to heat-radiating substrate up and down, and insulating layer, resistive layer peripheral hardware matcoveredn are equipped between heat-radiating substrate and resistive layer.The high-power antisurge alloy sheet resistance of the two-sided resistive layer structure of the utility model, first, resistive layer is covered on the two sides of heat-radiating substrate, pass through when electric current passes through in upper and lower two resistive layers, it is equal to two circuit in parallel, two resistive layers are assigned to by the electric current of full wafer Chip-R to pass through, reduce the electric current by resistive layer, substantially reduce the calorific value of Chip-R, and heat is directly transferred on heat-radiating substrate by upper layer and lower layer resistive layer, the heat transfer for substantially improving entire resistance, makes heat be more evenly distributed.
Description
Technical field
The invention belongs to technical field of electronic components, in particular to a kind of high-power antisurge of two-sided resistive layer structure
Alloy sheet resistance.
Background technique
It, can be by the variation of magnetic flux in measure traverse line come feedback current, especially in the scheme of current sample
The appearance of low resistance resistance provides more reliable, convenient and fast design scheme for current sample, and principle is the electricity for being difficult to detection
Stream signal is converted to the voltage signal for being easy to detect, to feed back the size of current value out, plays protection circuit safety, feedback electricity
The effect of road signal, low resistance alloy Chip-R become because of the advantages that its size is small, power is big, precision is high, temperature coefficient is small
The first choice of current sample design.
Firstly, the alloy Chip-R of single layer resistive layer structure is in the fabrication process, because adjusting the needs of resistance value, often need
To be etched on resistive layer, punching press or laser burns are at specific resistance circuit, this process certainly will will lead to resistive layer reality
Become smaller by the sectional area of electric current, the power of product is caused to become smaller, drop low-resistance pulse energy level, leads to the anti-wave of resistance
Gush less able, the Long Service Life of resistance shortens, and drops low-resistance reliability.Secondly, the patch of single layer resistive layer structure
Resistance is limited to the size reason of resistor body, it is difficult to accomplish small resistance value.
Summary of the invention
Thinking of the invention is: Chip-R is in heat-radiating substrate (ceramic or high thermal conductivity metal) top and bottom covering two
Resistance alloys layer as layer is linked together using bonding or process for pressing, is used between resistance alloys layer and heat-radiating substrate
The high glue film of thermal conductivity or glue connection solidification, and play the role of insulation, it, can then in resistor body partial encapsulation protective layer
In a manner of using epoxy resin or coating organic coating.Termination electrode is made later, can be made using electro-coppering or in advance
The mode of the metal electrode nested encryptions performed is combined together, later electrode surface nickel plating, tin plating, guarantee alloy patch electricity again
The solderability of resistance.Finally guarantee the thickness of electrode and the consistency of thickness of resistor body, guarantees that product product when mounting on pcb board is flat
It is whole.
In order to achieve the above object, the technical solution of the present invention is as follows:
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, comprising: heat-radiating substrate, above and below heat-radiating substrate
Two sides are equipped with resistive layer, and insulating layer, resistive layer peripheral hardware matcoveredn are equipped between heat-radiating substrate and resistive layer.
Preferably, the both ends of resistive layer are equipped with electrode, the thickness of electrode and heat-radiating substrate, upper and lower two resistive layer, insulating layer,
The overall thickness of protective layer is equal.
Preferably, the protective layer both ends are equipped with through hole, and copper electrode is made in resistive layer electro-coppering at through hole.
Preferably, nickel coating or tin coating are electroplate on the copper electrode.
Preferably, it is electroplate with nickel coating on the copper electrode, is electroplate with tin coating on nickel coating.
Preferably, resistive layer and heat-radiating substrate the both ends connection electrode by way of inlaying.
Preferably, tin coating or nickel coating are electroplate on electrode.
Preferably, it is electroplate with nickel coating on electrode, is electroplate with tin coating on nickel coating.
Preferably, a kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure the preparation method comprises the following steps: radiating
Resistance alloys layer as two layers of the covering of substrate top and bottom, with the insulating layer connection that thermal conductivity is high between resistive layer and heat-radiating substrate
Solidification, then in resistor body partial encapsulation protective layer.
The beneficial effects of the present invention are:
The high-power antisurge alloy sheet resistance of two-sided resistive layer structure, firstly, resistive layer is covered on the two of heat-radiating substrate
Face passes through in upper and lower two resistive layers when electric current passes through, is equal to two circuit in parallel, passes through the electric current quilt of full wafer Chip-R
It is assigned to two resistive layers to pass through, the electric current by resistive layer is reduced, according to Joule's law Q=I2* R substantially reduces patch
The calorific value of resistance, and heat is directly transferred on heat-radiating substrate by upper layer and lower layer resistive layer, substantially improves entire electricity
The heat transfer of resistance, makes heat be more evenly distributed.Secondly, the resistance value of two resistive layers is consistent, the resistance value of entire Chip-R is single
The half of a resistive layer resistance value can solve the difficulty that alloy Chip-R is difficult to small resistance value.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment of the present invention 1；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention 2；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention 3；
In figure: 1, first resistor layer；2, second resistance layer；3, the first protective layer；4, the second protective layer；5, copper electrode；6,
Tin coating；7, nickel coating；8, heat-radiating substrate；9, the first insulating layer；10, second insulating layer.
Specific embodiment
One embodiment of the present invention is further illustrated with reference to the accompanying drawings.
Embodiment 1: Fig. 1 is referred to:
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, comprising: heat-radiating substrate 8, on heat-radiating substrate 8
Lower two sides have been covered each by first resistor layer 1 and second resistance layer 2, and first is equipped between heat-radiating substrate 8 and first resistor layer 1 absolutely
Edge layer 9 is equipped with second insulating layer 10, divides outside first resistor layer 1 and second resistance layer 2 between heat-radiating substrate 8 and second resistance layer 2
It She You not the first protective layer 3 and the second protective layer 4.
The both ends of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure are equipped with copper electrode 5, the thickness of copper electrode 5
With heat-radiating substrate 8, first resistor layer 1, second resistance layer 2, the first insulating layer 9, second insulating layer 10, the first protective layer 3, second
The overall thickness of protective layer 4 is equal.Second protective layer, 4 both ends are equipped with through hole, and the electro-coppering at through hole of second resistance layer 2 is made
Copper electrode 5.
Nickel coating 7 is electroplate on copper electrode.
The high-power antisurge alloy sheet resistance of two-sided resistive layer structure the preparation method comprises the following steps: being covered in heat-radiating substrate top and bottom
Resistance alloys layer as two layers of lid connects solidification with the high insulating layer of thermal conductivity between resistive layer and heat-radiating substrate, then exists
Then resistor body partial encapsulation protective layer is perforated at protective layer, copper electrode is made in electro-coppering on resistive layer, and copper electrode powers on
Plating nickel coating can increase the solderability of resistance.
Embodiment 2: Fig. 2 is referred to:
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, comprising: heat-radiating substrate 8, on heat-radiating substrate 8
Lower two sides have been covered each by first resistor layer 1 and second resistance layer 2, and first is equipped between heat-radiating substrate 8 and first resistor layer 1 absolutely
Edge layer 9 is equipped with second insulating layer 10, divides outside first resistor layer 1 and second resistance layer 2 between heat-radiating substrate 8 and second resistance layer 2
It She You not the first protective layer 3 and the second protective layer 4.
The both ends of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure are equipped with copper electrode 5, the thickness of copper electrode 5
With heat-radiating substrate 8, first resistor layer 1, second resistance layer 2, the first insulating layer 9, second insulating layer 10, the first protective layer 3, second
The overall thickness of protective layer 4 is equal.
Resistive layer connects copper electrode with heat-radiating substrate both ends by way of inlaying.Tin coating 6 is electroplate on copper electrode.
The high-power antisurge alloy sheet resistance of two-sided resistive layer structure the preparation method comprises the following steps: being covered in heat-radiating substrate top and bottom
Resistance alloys layer as two layers of lid connects solidification with the high insulating layer of thermal conductivity between resistive layer and heat-radiating substrate, then exists
Resistor body partial encapsulation protective layer, then the both ends mosaic mode of resistor body connects copper electrode, and plating tin coating 6 can on copper electrode
To increase the solderability of resistance.
Embodiment 3: Fig. 3 is referred to:
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, comprising: heat-radiating substrate 8, on heat-radiating substrate 8
Lower two sides have been covered each by first resistor layer 1 and second resistance layer 2, and first is equipped between heat-radiating substrate 8 and first resistor layer 1 absolutely
Edge layer 9 is equipped with second insulating layer 10, divides outside first resistor layer 1 and second resistance layer 2 between heat-radiating substrate 8 and second resistance layer 2
It She You not the first protective layer 3 and the second protective layer 4.
The both ends of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure are equipped with copper electrode 5, the thickness of copper electrode 5
With heat-radiating substrate 8, first resistor layer 1, second resistance layer 2, the first insulating layer 9, second insulating layer 10, the first protective layer 3, second
The overall thickness of protective layer 4 is equal.
Resistive layer connects copper electrode with heat-radiating substrate both ends by way of inlaying.It is electroplate with nickel coating 7 on copper electrode, plates
Tin coating 6 is electroplate on nickel layer.
The high-power antisurge alloy sheet resistance of two-sided resistive layer structure the preparation method comprises the following steps: being covered in heat-radiating substrate top and bottom
Resistance alloys layer as two layers of lid connects solidification with the high insulating layer of thermal conductivity between resistive layer and heat-radiating substrate, then exists
Resistor body partial encapsulation protective layer, then the both ends mosaic mode of resistor body connects copper electrode, and 7 He of nickel coating is electroplated on copper electrode
Tin coating 6 can increase the solderability of resistance.
The above is not intended to limit the scope of the present invention, and all technical spirits according to the present invention are to above
Any modification, equivalent variations and modification made by embodiment, in the range of still falling within technical solution of the present invention.
Claims (9)
1. a kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, it is characterised in that: include: heat-radiating substrate, dissipate
Two sides are equipped with resistive layer to hot substrate up and down, and insulating layer, resistive layer peripheral hardware matcoveredn are equipped between heat-radiating substrate and resistive layer.
2. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 1, it is characterised in that: electricity
The both ends of resistance layer are equipped with electrode, the overall thickness phase of the thickness and heat-radiating substrate, upper and lower two resistive layer, insulating layer, protective layer of electrode
Deng.
3. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 2, it is characterised in that: institute
Protective layer both ends are stated equipped with through hole, copper electrode is made in resistive layer electro-coppering at through hole.
4. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 3, it is characterised in that: institute
It states and is electroplate with nickel coating or tin coating on copper electrode.
5. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 4, it is characterised in that: institute
It states and is electroplate with nickel coating on copper electrode, be electroplate with tin coating on nickel coating.
6. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 2, it is characterised in that: electricity
Resistance layer and heat-radiating substrate the both ends connection electrode by way of inlaying.
7. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 6, it is characterised in that: electricity
Tin coating or nickel coating are electroplate on extremely.
8. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 7, it is characterised in that: electricity
It is electroplate with nickel coating on extremely, is electroplate with tin coating on nickel coating.
9. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 1, it is characterised in that: system
Preparation Method are as follows: the resistance alloys layer as covering two layers in heat-radiating substrate top and bottom uses thermal conductivity between resistive layer and heat-radiating substrate
The high insulating layer of rate connects solidification, then in resistor body partial encapsulation protective layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201820927418.0U CN208208459U (en) | 2018-06-15 | 2018-06-15 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
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| CN201820927418.0U CN208208459U (en) | 2018-06-15 | 2018-06-15 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777199A (en) * | 2018-06-15 | 2018-11-09 | 深圳市业展电子有限公司 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
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2018
- 2018-06-15 CN CN201820927418.0U patent/CN208208459U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108777199A (en) * | 2018-06-15 | 2018-11-09 | 深圳市业展电子有限公司 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
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