CN110459373A - A kind of low-resistance resistor and manufacturing method - Google Patents
A kind of low-resistance resistor and manufacturing method Download PDFInfo
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- CN110459373A CN110459373A CN201910763410.4A CN201910763410A CN110459373A CN 110459373 A CN110459373 A CN 110459373A CN 201910763410 A CN201910763410 A CN 201910763410A CN 110459373 A CN110459373 A CN 110459373A
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 239000010410 layer Substances 0.000 claims description 188
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 33
- 238000000576 coating method Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 229910003172 MnCu Inorganic materials 0.000 claims description 5
- 229910003322 NiCu Inorganic materials 0.000 claims description 5
- -1 electrode Substances 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C13/00—Resistors not provided for elsewhere
- H01C13/02—Structural combinations of resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
The present invention relates to a kind of low-resistance resistors; including substrate, the electrode positioned at substrate both ends; the substrate upper and lower surface and two sides are equipped with resistive layer; insulating layer between the substrate and resistive layer; the both ends of the four sides resistive layer are connect with termination electrode; the two sides resistive layer above and front and rear sides resistive layer are parallel connection, the resistive layer peripheral hardware matcoveredn.When energization, electric current passes through from four resistive layers, it is equivalent to four circuit in parallel, four resistive layers are assigned to by the electric current of full wafer Chip-R to pass through, reduced by the electric current of each resistive layer, heat is more evenly distributed, and heat dissipation is faster, and the resistance value of entire Chip-R is less than single resistive layer resistance value, can reduce product resistance value.
Description
Technical field
The present invention relates to field of electrical components, in particular to a kind of low-resistance resistor.
Background technique
Resistor have it is small in size, light-weight, electrical property high reliablity, assembly cost is low, high mechanical strength, high frequency characteristics
Many advantages, such as superior, minimum precision can reach ultraprecise ± 0.01%, is widely used in computer, mobile phone, medical treatment
The fields such as electronic product, unmanned plane, tablet computer.In recent years, the application of power-supply system tends to higher power and smaller szie, institute
Lower resistance value is requested to have with resistor and can load the ability of more high current, and therefore, high-power low-resistance is resistor
Development trend.
The resistance value size of resistor element generally with material, length, cross-sectional area there are also temperature related, single resistive layer
The Chip-R of structure is limited by its processing procedure and resistor body size in the fabrication process, it is difficult to accomplish ultralow resistance value.Patch type
Resistor product usually has three thick-film resistor, alloy film resistor and pure alloy fled rheostat mainstream types, hinders according to covering
Value section is divided: thick-film resistor covers 10m Ω~1000m Ω resistance value section, and alloy film resistor covers 1m Ω~500m Ω
Resistance value section, pure alloy fled rheostat cover 0.5m Ω~200m Ω resistance value section, therefore, resistor product ultralow resistance value section still have compared with
Big design space.
In the manufacturing process of existing resistor, most common technique are as follows: using ceramics as substrate, using single layer resistive layer knot
Structure prints electrode, and prints protective layer, last electroplated metal layer.The properties of product produced under this technique can meet related request, so
And it is insufficient still to there are at least following two points.First point: being burnt into specific resistance electricity using modes such as etching, punching press or laser
Road, the sectional area that this processing procedure inevitably results in the practical electric current passed through of resistive layer become smaller, and heat is concentrated, and lead to the power of product
Become smaller；Second point: the alloy film resistor of single layer resistive layer structure is limited to its substrate size, causes resistive layer is practical to pass through
The effective length of electric current be basically unchanged, it is difficult to accomplish ultralow resistance value.
In summary illustrate, the technical solution for needing one kind new is to solve the above problems.
Summary of the invention
Goal of the invention: the purpose of the present invention is overcome to reduce that resistor resistance value is difficult in the prior art and heat is concentrated
Problem.
Technical solution: in order to achieve the above objectives, following technical solution can be used in low-resistance resistor provided by the invention:
A kind of low-resistance resistor, including substrate, two electrodes, two electrodes are located at the electrode at substrate both ends, special
Sign is, further includes the first resistor layer positioned at upper surface of base plate, the second resistance layer positioned at base lower surface, is located at substrate one
The 3rd resistor layer of a side, the 4th resistive layer positioned at another side of substrate；The both ends of the first resistor layer, the second electricity
The both ends of resistance layer, the both ends of 3rd resistor layer, the 4th resistive layer both ends connect respectively with two electrodes.
The first resistor layer, second resistance layer, 3rd resistor layer, the 4th resistive layer are connected in parallel.
Further, the resistance value of the first resistor layer is identical as the resistance value of second resistance layer；The resistance value of 3rd resistor layer
It is identical as the resistance value of the 4th resistive layer.
Further, the resistance value of the first resistor layer, the resistance value of second resistance layer, the resistance value of 3rd resistor layer, the 4th
The resistance value of resistive layer is all the same.
Further, the resistance value of the first resistor layer is identical as the resistance value of second resistance layer；It is covered outside 3rd resistor layer
It is stamped protective layer.
Further, substrate is ceramic substrate, PCB substrate or flexible material substrate；The first resistor layer, second resistance
Layer, 3rd resistor layer, the 4th resistive layer accompany insulation glue-line between substrate respectively.
Further, there is nickel coating on electrode, have tin coating on nickel coating；Substrate, electrode, tin coating, tin coating it is total
Thickness is equal with substrate, first resistor layer, second resistance layer, the overall thickness of protective layer.
Have first, second, third the utility model has the advantages that compared with the existing technology, in low-resistance resistor provided by the invention, the
The four sides resistive layer that four resistive layers are formed, four sides resistive layer are respectively overlay in upper and lower surface and the two sides of substrate, when energization, electricity
Stream passes through from four resistive layers, is equivalent to four circuit in parallel, is assigned to four resistance by the electric current of full wafer Chip-R
Layer passes through, and is reduced by the electric current of each resistive layer, according to Joule's law Q=I2RT, the calorific value of single resistive layer is significantly
Reduce, by the way that on heat transfer to substrate, heat is more evenly distributed, heat dissipation faster, greatly improves the load power of product.Its
Secondary, the resistive layer resistance value of upper and lower surface is consistent, is denoted as R1, R2, the resistance value of front and back two sides resistive layer is consistent, is denoted as R3, R4, according to
Resistor coupled in parallel formula, the resistance value of entire Chip-R are R1R2R3R4/(R1+R2+R3+R4), work as R1=R2=R3=R4When, it is entire to paste
The resistance value of sheet resistance is the 1/4 of single resistive layer resistance value, greatly reduces product resistance value.
The present invention also provides the manufacturing methods of above-mentioned low-resistance resistor:
(1), by first resistor layer, second resistance layer, 3rd resistor layer, the 4th resistive layer by printing, bonding, pressing or
Sputtering vacuum process links together with substrate；Wherein, resistance layer material can be equal for the width of MnCu, FeCrAl, NiCu etc.
Less than substrate width；
(2), in the plating of the two sides of substrate or printing copper electrode, the two sides in substrate above and below and forward and backward face have copper electric
Pole；
(3), to first resistor layer, second resistance layer, by way of chemical attack, etching, laser burns or grinding
Three resistive layers, the 4th resistive layer resistance value be adjusted；
(4), using insulating materials as protective layer, by way of printing or coating, to first resistor layer, second resistance layer,
3rd resistor layer, the 4th resistive layer surface be packaged protection；
(5), end face conductive layer, end are formed in substrate left and right ends using printing, bonding, pressing or sputtering vacuum process
The copper electrode of substrate above and below and the two sides in forward and backward face is electrically connected by face conductive layer as a part of electrode；
(6), nickel coating is formed in substrate both ends of the surface and copper electrode by way of being electroplated, printing, has plating on nickel coating
Tin layers.
Resistance layer material is selected as MnCu, FeCrAl or NiCu.Protective layer is epoxy resin；End face conductive is selected
Ag, Cu or NiCr.
Detailed description of the invention
Fig. 1 is the structural schematic diagram for the patch resistor that the embodiment of the present invention 1 provides；
Fig. 2 is the upper surface of the patch resistor that the embodiment of the present invention 1 provides structural schematic diagram；
Fig. 3 is the front structure schematic diagram for the patch resistor that the embodiment of the present invention 1 provides；
Fig. 4 is the structural schematic diagram for the patch resistor that the embodiment of the present invention 2 provides；
Fig. 5 is the structural schematic diagram for the patch resistor that the embodiment of the present invention 3 provides.
In figure: 1-first resistor layer；2-second resistance layers；3-3rd resistor layers；4-the four resistive layer；5-ceramics
Substrate；6-protective layers；7-copper electrodes；8-conductive layers；9-nickel coatings；10-tin coatings；11-insulating cements；12-soft materials
Expect substrate；13-PCB substrates.
Specific embodiment
Embodiments of the present invention are further illustrated with reference to the accompanying drawings.
Embodiment 1: Fig. 1, Fig. 2 and Fig. 3 are referred to.
A kind of low-resistance Power Resistor, including ceramic substrate 5, the upper and lower surface of ceramic substrate 5 and two sides difference
Applying first resistor layer 1, second resistance layer 2,3rd resistor layer 3 and the 4th resistive layer 4, resistive layer 1 and resistive layer 3 can pass through
Pressing, the mode of printing or bonding and ceramic substrate 5 link together, resistive layer 3 and resistive layer 4 can by vacuum sputtering,
The mode of pressing or bonding links together with ceramic substrate 5, and matcoveredn 6 is all provided with outside resistive layer, wherein to prevent resistive layer
3, resistive layer 4 is connected with resistive layer 1, the overlap joint of resistive layer 2, first to 2 packaging protection of resistive layer 1 and resistive layer, then in front and back side
Apply resistive layer 3 and resistive layer 4 on face.
The both ends of low-resistance Power Resistor are equipped with copper electrode 7 and end face conductive layer 8, end face conductive layer 8 and copper electrode 7
As a part of electrode.The copper electrode 7 of substrate above and below and the two sides in forward and backward face is electrically connected by end face conductive layer 8.
There is nickel coating 9 on copper electrode, there is tin coating 10 on nickel coating 9.It is ceramic substrate 5, copper electrode 7, tin coating 9, tin plating
The overall thickness of layer 10 is equal with substrate 5, first resistor layer 1, second resistance layer 2, the overall thickness of protective layer 6.
Embodiment 2: Fig. 4 is referred to.
A kind of low-resistance Power Resistor, including flexible material substrate 12,12 upper and lower surface of flexible material substrate and two
Side applies first resistor layer 1, second resistance layer 2,3rd resistor layer 3 and the 4th resistive layer 4, resistive layer 1 and resistive layer 3 respectively
It can be linked together by way of pressing, printing or bonding with flexible material substrate 12, resistive layer and flexible material substrate
There is insulation glue-line 11 among 12.Resistive layer 3 and resistive layer 4 can be by way of vacuum sputtering, pressing or bondings and ceramic base
Plate 5 links together, and matcoveredn 6 is all provided with outside resistive layer, wherein to prevent resistive layer 3, resistive layer 4 and resistive layer 1, resistance
Then 2 overlap joint series connection of layer applies resistive layer 3 and resistive layer first to 2 packaging protection of resistive layer 1 and resistive layer on front and back sides
4。
A kind of both ends of low-resistance Power Resistor are equipped with copper electrode 7.End face conductive layer 8 by substrate above and below and before,
The copper electrode 7 of subsequent two sides is electrically connected.There is nickel coating 9 on copper electrode, there are plating tin layers 10 on nickel coating 9.Ceramic substrate 5,
Copper electrode 7, tin coating 9, the overall thickness of tin coating 10 and ceramic substrate 5, insulation glue-line 11, first resistor layer 1, second resistance layer
2, the overall thickness of protective layer 6 is equal.
Embodiment 3: Fig. 5 is referred to.
A kind of low-resistance Power Resistor, including PCB substrate 13,13 upper and lower faces of PCB substrate and two sides are applied respectively
Add first resistor layer 1, second resistance layer 2,3rd resistor layer 3 and the 4th resistive layer 4, resistive layer 1 and resistive layer 3 can pass through pressure
The mode and PCB substrate 13 closed, print or bonded link together, and resistive layer 3 and resistive layer 4 can pass through vacuum sputtering, pressure
Close or the mode of bonding link together with PCB substrate 13, matcoveredn 6 is all provided with outside resistive layer, wherein be prevent resistive layer 3,
Resistive layer 4 is connected with resistive layer 1, the overlap joint of resistive layer 2, first to 2 packaging protection of resistive layer 1 and resistive layer, then in front and back sides
Upper application resistive layer 3 and resistive layer 4.
A kind of both ends of low-resistance Power Resistor are equipped with copper electrode 7.End face conductive layer 8 by substrate above and below and before,
The copper electrode 7 of subsequent two sides is electrically connected.There is nickel coating 9 on copper electrode, there is tin coating 10 on nickel coating 9.PCB substrate 13, copper
Electrode 7, plating tin layers 9, the overall thickness and PCB substrate 13, first resistor layer 1, second resistance layer 2, protective layer 6 that tin layers 10 are electroplated
Overall thickness it is equal.
Example IV
Provided in this embodiment is the manufacturing method of low-resistance resistor.
(1), four sides resistive layer is linked together by printing, bonding, pressing or sputtering vacuum process and substrate,
In, substrate can be ceramic substrate, PCB substrate or flexible material layer etc.；Four sides resistive layer be located at substrate up and down two sides and
Front and rear sides, wherein the width of resistive layer is respectively less than substrate width, and resistance layer material can be MnCu, FeCrAl, NiCu etc.；
(2), in the plating of the two sides of substrate or the copper that prints electrode, in which: there are copper in substrate top and bottom and the two sides of front-back
Electrode；
(3), the resistance value of four sides resistive layer is adjusted by way of chemical attack, etching, laser burns or grinding；
(4), using epoxy resin or other insulating materials as protective layer, by way of printing or coating, to four surface resistances
The surface of layer is packaged protection；
(5), end face conductive layer is formed in substrate left and right ends using printing, bonding, pressing or sputtering vacuum process,
Middle end face conductive can be the materials such as Ag, Cu, NiCr；
(6), nickel coating is formed in substrate both ends of the surface and copper electrode by way of being electroplated, printing, has plating on nickel coating
Tin layers.
In addition, there are many concrete methods of realizing and approach of the invention, the above is only a preferred embodiment of the present invention.
It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, can also do
Several improvements and modifications out, these modifications and embellishments should also be considered as the scope of protection of the present invention.What is be not known in the present embodiment is each
The available prior art of component part is realized.
Claims (10)
1. a kind of low-resistance resistor, including substrate, two electrodes, two electrodes are located at the electrode at substrate both ends, feature
It is, further includes the first resistor layer positioned at upper surface of base plate, the second resistance layer positioned at base lower surface, is located at substrate one
The 3rd resistor layer of side, the 4th resistive layer positioned at another side of substrate；The both ends of the first resistor layer, second resistance
Both ends, the both ends of 3rd resistor layer, the both ends of the 4th resistive layer of layer are connect with two electrodes respectively.
2. low-resistance resistor according to claim 1, it is characterised in that: the first resistor layer, second resistance layer, third
Resistive layer, the 4th resistive layer are connected in parallel.
3. low-resistance resistor according to claim 1 or 2, it is characterised in that: the resistance value and second of the first resistor layer
The resistance value of resistive layer is identical；The resistance value of 3rd resistor layer is identical as the resistance value of the 4th resistive layer.
4. low-resistance resistor according to claim 3, it is characterised in that: resistance value, the second resistance of the first resistor layer
Resistance value, the resistance value of 3rd resistor layer, the resistance value of the 4th resistive layer of layer are all the same.
5. low-resistance resistor according to claim 1 or 2, it is characterised in that: the resistance value and second of the first resistor layer
The resistance value of resistive layer is identical；Protective layer is all covered with outside 3rd resistor layer.
6. low-resistance resistor according to claim 1 or 2, it is characterised in that: substrate is ceramic substrate, PCB substrate or soft
Property material substrate；The first resistor layer, second resistance layer, 3rd resistor layer, the 4th resistive layer accompany between substrate respectively
Insulate glue-line.
7. low-resistance resistor according to claim 5, it is characterised in that: have nickel coating on electrode, have on nickel coating tin plating
Layer；The overall thickness and the overall thickness of substrate, first resistor layer, second resistance layer, protective layer of substrate, electrode, tin coating, tin coating
It is equal.
8. a kind of manufacturing method using the low-resistance resistor as described in any one of claims 1 to 7, it is characterised in that:
(1), first resistor layer, second resistance layer, 3rd resistor layer, the 4th resistive layer are passed through into printing, bonding, pressing or vacuum
Sputtering technology links together with substrate；Wherein, resistance layer material can be respectively less than for the width of MnCu, FeCrAl, NiCu etc.
Substrate width；
(2), there is copper electrode in the plating of the two sides of substrate or printing copper electrode, the two sides in substrate above and below and forward and backward face；
(3), to first resistor layer, second resistance layer, third electricity by way of chemical attack, etching, laser burns or grinding
Resistance layer, the resistance value of the 4th resistive layer are adjusted；
(4), using insulating materials as protective layer, by way of printing or coating, to first resistor layer, second resistance layer, third
Resistive layer, the 4th resistive layer surface be packaged protection；
(5), end face conductive layer is formed in substrate left and right ends using printing, bonding, pressing or sputtering vacuum process, end face is led
The copper electrode of substrate above and below and the two sides in forward and backward face is electrically connected by electric layer as a part of electrode；
(6), nickel coating is formed in substrate both ends of the surface and copper electrode by way of being electroplated, printing, has tin coating on nickel coating.
9. manufacturing method according to claim 8, it is characterised in that: resistance layer material is selected as MnCu, FeCrAl or NiCu.
10. manufacturing method according to claim 9, it is characterised in that: protective layer is epoxy resin；End face conductive
Select is Ag, Cu or NiCr.
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| CN201910763410.4A CN110459373A (en) | 2019-08-19 | 2019-08-19 | A kind of low-resistance resistor and manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114823020A (en) * | 2022-05-23 | 2022-07-29 | 贝迪斯电子有限公司 | Anti-surge chip resistor and manufacturing method thereof |
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| CN108231308A (en) * | 2016-12-21 | 2018-06-29 | 李文熙 | The manufacturing method of aluminium termination electrode chip resister |
| CN108666057A (en) * | 2018-04-03 | 2018-10-16 | 广东风华高新科技股份有限公司 | A kind of chip resistor and preparation method thereof |
| CN108777199A (en) * | 2018-06-15 | 2018-11-09 | 深圳市业展电子有限公司 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
| CN109346255A (en) * | 2018-11-29 | 2019-02-15 | 昆山厚声电子工业有限公司 | A kind of low resistivity value resistor and its manufacture craft |
| CN210349483U (en) * | 2019-08-19 | 2020-04-17 | 南京隆特电子有限公司 | Low-resistance resistor |
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| CN114823020A (en) * | 2022-05-23 | 2022-07-29 | 贝迪斯电子有限公司 | Anti-surge chip resistor and manufacturing method thereof |
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