CN108777199A - A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure - Google Patents
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure Download PDFInfo
- Publication number
- CN108777199A CN108777199A CN201810617176.XA CN201810617176A CN108777199A CN 108777199 A CN108777199 A CN 108777199A CN 201810617176 A CN201810617176 A CN 201810617176A CN 108777199 A CN108777199 A CN 108777199A
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- resistive layer
- layer
- heat
- antisurge
- power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/024—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being hermetically sealed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
- H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
Abstract
The object of the present invention is to provide a kind of high-power antisurge alloy sheet resistances of two-sided resistive layer structure, including：Heat-radiating substrate, both sides are equipped with resistive layer to heat-radiating substrate up and down, and insulating layer, resistive layer peripheral hardware matcoveredn are equipped between heat-radiating substrate and resistive layer.The high-power antisurge alloy sheet resistance of the two-sided resistive layer structure of the present invention, first, resistive layer is covered in the two sides of heat-radiating substrate, electric current by when pass through in upper and lower two resistive layers, it is equal to two circuit in parallel, two resistive layers are assigned to by the electric current of full wafer Chip-R to pass through, reduce the electric current by resistive layer, substantially reduce the calorific value of Chip-R, and heat is directly transferred to by upper layer and lower layer resistive layer on heat-radiating substrate, the heat transfer for substantially improving entire resistance, makes heat be more evenly distributed.
Description
Technical field
The invention belongs to technical field of electronic components, more particularly to a kind of high-power antisurge of two-sided resistive layer structure
Alloy sheet resistance.
Background technology
It, can be by the variation of magnetic flux in measure traverse line come feedback current, especially in the scheme of current sample
The appearance of low resistance resistance provides more reliable, easily design scheme for current sample, and principle is to be difficult to the electricity of detection
Stream signal is converted to the voltage signal for being easy to detection, to feed back the size of current value, plays protection circuit safety, feedback electricity
The effect of road signal, low resistance alloy Chip-R become because of the advantages that its size is small, power is big, precision is high, temperature coefficient is small
The first choice of current sample design.
First, the alloy Chip-R of single layer resistive layer structure in the fabrication process, because adjusting the needs of resistance value, often needs
To be etched on resistive layer, punching press or laser burns are at specific resistance circuit, this process will certainly cause resistive layer practical
Become smaller by the sectional area of electric current, the power of product is caused to become smaller, drop low-resistance pulse energy level, leads to the anti-wave of resistance
Gush less able, the Long Service Life of resistance shortens, and drops low-resistance reliability.Secondly, the patch of single layer resistive layer structure
Resistance is limited to the size reason of resistive element, it is difficult to accomplish small resistance value.
Invention content
The present invention thinking be：Chip-R is in heat-radiating substrate（Ceramic or high thermal conductivity metal）Top and bottom covering two
Resistance alloys layer as layer is linked together using bonding or process for pressing, is used between resistance alloys layer and heat-radiating substrate
The high glued membrane of thermal conductivity or glue connection solidification, and play the role of insulation, it, can then in resistive element partial encapsulation protective layer
In a manner of using epoxy resin or coating organic coating.Termination electrode is made later, and electro-coppering or in advance system may be used
The mode of the metal electrode nested encryptions performed is combined together, later electrode surface nickel plating, tin plating again, ensures alloy patch electricity
The solderability of resistance.The consistency of thickness for finally ensureing the thickness and resistive element of electrode ensures that product product when being mounted on pcb board is flat
It is whole.
In order to achieve the above object, the technical scheme is that：
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, including：Heat-radiating substrate, the upper and lower both sides of heat-radiating substrate
Equipped with resistive layer, insulating layer, resistive layer peripheral hardware matcoveredn are equipped between heat-radiating substrate and resistive layer.
Preferably, the both ends of resistive layer are equipped with electrode, the thickness of electrode and heat-radiating substrate, upper and lower two resistive layer, insulating layer,
The overall thickness of protective layer is equal.
Preferably, the protective layer both ends are equipped with through hole, and copper electrode is made in resistive layer electro-coppering at through hole.
Preferably, nickel coating or tin coating are electroplate on the copper electrode.
Preferably, it is electroplate with nickel coating on the copper electrode, tin coating is electroplate on nickel coating.
Preferably, resistive layer and heat-radiating substrate the both ends connection electrode by way of inlaying.
Preferably, tin coating or nickel coating are electroplate on electrode.
Preferably, it is electroplate with nickel coating on electrode, tin coating is electroplate on nickel coating.
Preferably, a kind of preparation method of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure is：It is radiating
Substrate top and bottom cover two layers as resistance alloys layer, between resistive layer and heat-radiating substrate with thermal conductivity it is high insulating layer connection
Solidification, then in resistive element partial encapsulation protective layer.
The beneficial effects of the invention are as follows：
The high-power antisurge alloy sheet resistance of two-sided resistive layer structure, first, resistive layer is covered in the two sides of heat-radiating substrate, electricity
Circulate it is out-of-date pass through in upper and lower two resistive layers, be equal to two circuit in parallel, be assigned by the electric current of full wafer Chip-R
Pass through to two resistive layers, reduce the electric current by resistive layer, according to Joule's law Q=I2* R substantially reduces Chip-R
Calorific value, and heat is directly transferred to by upper layer and lower layer resistive layer on heat-radiating substrate, and entire resistance is substantially improved
Heat transfer makes heat be more evenly distributed.Secondly, the resistance value of two resistive layers is consistent, and the resistance value of entire Chip-R is single electricity
The half of resistance layer resistance value can solve the difficulty that alloy Chip-R is difficult to small resistance value.
Description of the drawings
Fig. 1 is the structural schematic diagram of the embodiment of the present invention 1；
Fig. 2 is the structural schematic diagram of the embodiment of the present invention 2；
Fig. 3 is the structural schematic diagram of the embodiment of the present invention 3；
In figure：1, first resistor layer；2, second resistance layer；3, the first protective layer；4, the second protective layer；5, copper electrode；6, tin plating
Layer；7, nickel coating；8, heat-radiating substrate；9, the first insulating layer；10, second insulating layer.
Specific implementation mode
A kind of embodiment further illustrated the present invention with reference to the accompanying drawings.
Embodiment 1：With reference to figure 1：
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, including：Heat-radiating substrate 8, heat-radiating substrate about 8 two
Side has been covered each by first resistor layer 1 and second resistance layer 2, and the first insulating layer is equipped between heat-radiating substrate 8 and first resistor layer 1
9, it is equipped with second insulating layer 10 between heat-radiating substrate 8 and second resistance layer 2, is set respectively outside first resistor layer 1 and second resistance layer 2
There are the first protective layer 3 and the second protective layer 4.
The both ends of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure are equipped with copper electrode 5, the thickness of copper electrode 5
With heat-radiating substrate 8, first resistor layer 1, second resistance layer 2, the first insulating layer 9, second insulating layer 10, the first protective layer 3, second
The overall thickness of protective layer 4 is equal.Second protective layer, 4 both ends are equipped with through hole, and the electro-coppering at through hole of second resistance layer 2 is made
Copper electrode 5.
Nickel coating 7 is electroplate on copper electrode.
The preparation method of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure is：It is covered in heat-radiating substrate top and bottom
Then resistance alloys layer as two layers of lid exists with the insulating layer connection solidification that thermal conductivity is high between resistive layer and heat-radiating substrate
Then resistive element partial encapsulation protective layer is perforated at protective layer, the obtained copper electrode of electro-coppering, copper electrode power on resistive layer
Plating nickel coating can increase the solderability of resistance.
Embodiment 2：With reference to figure 2：
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, including：Heat-radiating substrate 8, heat-radiating substrate about 8 two
Side has been covered each by first resistor layer 1 and second resistance layer 2, and the first insulating layer is equipped between heat-radiating substrate 8 and first resistor layer 1
9, it is equipped with second insulating layer 10 between heat-radiating substrate 8 and second resistance layer 2, is set respectively outside first resistor layer 1 and second resistance layer 2
There are the first protective layer 3 and the second protective layer 4.
The both ends of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure are equipped with copper electrode 5, the thickness of copper electrode 5
With heat-radiating substrate 8, first resistor layer 1, second resistance layer 2, the first insulating layer 9, second insulating layer 10, the first protective layer 3, second
The overall thickness of protective layer 4 is equal.
Resistive layer connects copper electrode with heat-radiating substrate both ends by way of inlaying.Tin coating 6 is electroplate on copper electrode.
The preparation method of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure is：It is covered in heat-radiating substrate top and bottom
Then resistance alloys layer as two layers of lid exists with the insulating layer connection solidification that thermal conductivity is high between resistive layer and heat-radiating substrate
Resistive element partial encapsulation protective layer, then the both ends mosaic mode of resistive element connect copper electrode, plating tin coating 6 can on copper electrode
To increase the solderability of resistance.
Embodiment 3：With reference to figure 3：
A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, including：Heat-radiating substrate 8, heat-radiating substrate about 8 two
Side has been covered each by first resistor layer 1 and second resistance layer 2, and the first insulating layer is equipped between heat-radiating substrate 8 and first resistor layer 1
9, it is equipped with second insulating layer 10 between heat-radiating substrate 8 and second resistance layer 2, is set respectively outside first resistor layer 1 and second resistance layer 2
There are the first protective layer 3 and the second protective layer 4.
The both ends of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure are equipped with copper electrode 5, the thickness of copper electrode 5
With heat-radiating substrate 8, first resistor layer 1, second resistance layer 2, the first insulating layer 9, second insulating layer 10, the first protective layer 3, second
The overall thickness of protective layer 4 is equal.
Resistive layer connects copper electrode with heat-radiating substrate both ends by way of inlaying.It is electroplate with nickel coating 7 on copper electrode, plates
Tin coating 6 is electroplate on nickel layer.
The preparation method of the high-power antisurge alloy sheet resistance of two-sided resistive layer structure is：It is covered in heat-radiating substrate top and bottom
Then resistance alloys layer as two layers of lid exists with the insulating layer connection solidification that thermal conductivity is high between resistive layer and heat-radiating substrate
Resistive element partial encapsulation protective layer, then the both ends mosaic mode of resistive element connect copper electrode, 7 He of nickel coating is electroplated on copper electrode
Tin coating 6 can increase the solderability of resistance.
The above is not intended to limit the scope of the present invention, and all technical spirits according to the present invention are to above
Any modification, equivalent variations and modification made by embodiment, in the range of still falling within technical scheme of the present invention.
Claims (9)
1. a kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure, it is characterised in that：Including：Heat-radiating substrate dissipates
Both sides are equipped with resistive layer to hot substrate up and down, and insulating layer, resistive layer peripheral hardware matcoveredn are equipped between heat-radiating substrate and resistive layer.
2. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 1, it is characterised in that：Electricity
The both ends of resistance layer are equipped with electrode, the overall thickness phase of the thickness and heat-radiating substrate, upper and lower two resistive layer, insulating layer, protective layer of electrode
Deng.
3. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 2, it is characterised in that：Institute
It states protective layer both ends and is equipped with through hole, copper electrode is made in resistive layer electro-coppering at through hole.
4. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 3, it is characterised in that：Institute
It states and is electroplate with nickel coating or tin coating on copper electrode.
5. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 4, it is characterised in that：Institute
It states and is electroplate with nickel coating on copper electrode, tin coating is electroplate on nickel coating.
6. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 2, it is characterised in that：Electricity
Resistance layer and heat-radiating substrate the both ends connection electrode by way of inlaying.
7. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 6, it is characterised in that：Electricity
Tin coating or nickel coating are electroplate on extremely.
8. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 7, it is characterised in that：Electricity
It is electroplate with nickel coating on extremely, tin coating is electroplate on nickel coating.
9. the high-power antisurge alloy sheet resistance of two-sided resistive layer structure according to claim 1, it is characterised in that：System
Preparation Method is：Resistance alloys layer as being covered two layers in heat-radiating substrate top and bottom, uses thermal conductivity between resistive layer and heat-radiating substrate
The high insulating layer connection solidification of rate, then in resistive element partial encapsulation protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810617176.XA CN108777199A (en) | 2018-06-15 | 2018-06-15 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810617176.XA CN108777199A (en) | 2018-06-15 | 2018-06-15 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
Publications (1)
| Publication Number | Publication Date |
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| CN108777199A true CN108777199A (en) | 2018-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810617176.XA Pending CN108777199A (en) | 2018-06-15 | 2018-06-15 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459373A (en) * | 2019-08-19 | 2019-11-15 | 南京隆特电子有限公司 | A kind of low-resistance resistor and manufacturing method |
| CN114823020A (en) * | 2022-05-23 | 2022-07-29 | 贝迪斯电子有限公司 | Anti-surge chip resistor and manufacturing method thereof |
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| TW200522090A (en) * | 2003-12-31 | 2005-07-01 | Polytronics Technology Corp | Over-current protection apparatus |
| CN201117381Y (en) * | 2007-12-05 | 2008-09-17 | 颜琼章 | Multiple layer-type current sensing component structure |
| JP2010114167A (en) * | 2008-11-04 | 2010-05-20 | Sumitomo Metal Mining Co Ltd | Low-resistive chip resistor, and method for manufacturing the same |
| DE202011051296U1 (en) * | 2011-09-14 | 2011-12-22 | Giant Chip Technology Co., Ltd. | Chip resistor component |
| CN102473494A (en) * | 2009-08-11 | 2012-05-23 | 釜屋电机株式会社 | Low-resistance chip resistor and method of manufacturing same |
| CN208208459U (en) * | 2018-06-15 | 2018-12-07 | 深圳市业展电子有限公司 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
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2018
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200522090A (en) * | 2003-12-31 | 2005-07-01 | Polytronics Technology Corp | Over-current protection apparatus |
| CN201117381Y (en) * | 2007-12-05 | 2008-09-17 | 颜琼章 | Multiple layer-type current sensing component structure |
| JP2010114167A (en) * | 2008-11-04 | 2010-05-20 | Sumitomo Metal Mining Co Ltd | Low-resistive chip resistor, and method for manufacturing the same |
| CN102473494A (en) * | 2009-08-11 | 2012-05-23 | 釜屋电机株式会社 | Low-resistance chip resistor and method of manufacturing same |
| DE202011051296U1 (en) * | 2011-09-14 | 2011-12-22 | Giant Chip Technology Co., Ltd. | Chip resistor component |
| CN208208459U (en) * | 2018-06-15 | 2018-12-07 | 深圳市业展电子有限公司 | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110459373A (en) * | 2019-08-19 | 2019-11-15 | 南京隆特电子有限公司 | A kind of low-resistance resistor and manufacturing method |
| CN114823020A (en) * | 2022-05-23 | 2022-07-29 | 贝迪斯电子有限公司 | Anti-surge chip resistor and manufacturing method thereof |
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