CN109903938A - A kind of resistor integrally to radiate and manufacturing method - Google Patents
A kind of resistor integrally to radiate and manufacturing method Download PDFInfo
- Publication number
- CN109903938A CN109903938A CN201711285433.6A CN201711285433A CN109903938A CN 109903938 A CN109903938 A CN 109903938A CN 201711285433 A CN201711285433 A CN 201711285433A CN 109903938 A CN109903938 A CN 109903938A
- Authority
- CN
- China
- Prior art keywords
- resistor
- cooling fin
- resistive element
- alloy
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000001816 cooling Methods 0.000 claims abstract description 54
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 14
- 230000004888 barrier function Effects 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 239000002086 nanomaterial Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000002952 polymeric resin Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000010426 asphalt Substances 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 229910001325 element alloy Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Abstract
The invention discloses a kind of resistor integrally to radiate and manufacturing method, wherein radiator and resistance form one, and including two high thermal conductivities and the insignificant cooling fin of resistivity.By the way that the cooling fin of high heat-conductivity conducting is fitted in resistive element lower surface, while increasing resistor load power, cooling fin has the function of resistor connecting terminal, to produce the resistor that a kind of precision is high, power is big, simple process, reliability and thermal stability are good.
Description
Technical field
The present invention relates to field of electrical components, especially a kind of resistor.
Background technique
In circuit operational process, the electric property that temperature raising will lead to resistance changes, and then changes resistance in electricity
Use state in road, seriously may cause circuit malfunction.Influencing the reason of resistor temperature increases mainly includes resistor electricity
The heat-sinking capability of power fever and resistor.
Therefore the technical solution for needing one kind new is to solve the above problems.
Summary of the invention
It is an object of the invention to: the present invention to utilize mounting technology, a kind of compact-sized miniaturization is provided and reliability and
The good resistor of thermal stability.
The present invention also provides a kind of manufacturing method of resistor, to produce compact-sized miniaturization and reliability and
The good resistor of thermal stability.
In order to achieve the above objectives, following technical solution can be used in resistor of the present invention:
A kind of resistor integrally to radiate, it is characterised in that: including flat resistive element, be located at below resistive element simultaneously
It carries two cooling fins of resistive element, the barrier layer between two cooling fins, positioned at resistor side and be conductively connected
The alloy coating of cooling fin and resistive element；, and the cooling fin lateral surface covers simultaneously with the side of corresponding resistive element
Alloy side coating makes the cooling fin and resistive element conductive contact, the lateral surface of another cooling fin and resistive element it is another
Simultaneously same covering alloy side coating makes the cooling fin and resistive element conductive contact for a side alignment；The barrier layer barrier dissipates
Electrical conduction between backing；The cooling fin is conductive material.
The utility model has the advantages that resistor of the invention disperses using heat sink and export the heat of resistive element generation, increase
The heat-sinking capability of entire resistor, load power greatly increase；For another cooling fin sheet as conductive material, conductive characteristic makes cooling fin
Has the function of connecting terminal, without electrode additionally is arranged for the resistor again, i.e. cooling fin plays heat dissipation and electricity simultaneously
The dual function of pole keeps the resistor structure compact small and exquisite, meets the demand of miniaturization.
In order to achieve the above objectives, following technical solution can be used in the manufacturing method of resistor of the present invention:
A kind of manufacturing method of resistor, comprising the following steps:
A. resistor disc is fitted on the upper surface of cooling fin of conductive material, the lower surface of cooling fin is equipped with several and puts down
Capable and of same size strip gap；The resistor disc forms compound plate body after being bonded with cooling fin；
B. insulating materials is filled in the gap of cooling fin lower surface；
C. compound plate body is divided into several strip shape bodies by the middle position along the two neighboring gap of cooling fin；
D. one layer of side coating is formed in the both ends of the surface that strip shape body is parallel to gap, the side coating is conductive conjunction
Golden material；
E. strip shape body is divided into along cross section and needs size coccoid, form resistor structure.
The utility model has the advantages that the manufacturing method can produce above-mentioned resistor, manufactured resistor structure is compact small and exquisite, symbol
The demand of miniaturization is closed, and since without manufacturing electrode, the processing procedure of this manufacturing method is simple, improves production efficiency.
Detailed description of the invention
Fig. 1 is the cross section of resistor in embodiment one；
Fig. 2 is the bottom view of resistor in embodiment one；
Fig. 3 is the schematic diagram that step a forms structure in embodiment two；
Fig. 4 is the schematic diagram that step b forms structure in embodiment two；
Fig. 5 is the schematic diagram that step c forms structure in embodiment two；
Fig. 6 is the schematic diagram that step d forms structure in embodiment two；
Fig. 7 is the schematic diagram that step e forms structure in embodiment two；
Fig. 8 is the resistor structure schematic diagram obtained after the completion of step e in embodiment two.
Specific embodiment
Embodiment one
Incorporated by reference to Fig. 1 and Fig. 2, for the embodiment for the resistor that the present invention integrally radiates.
The resistor includes flat resistive element 11, positioned at the lower section of resistive element 11 and carries two of resistive element and dissipate
Backing 31, the barrier layer 33 between two cooling fins 31；The cooling fin 31 is conductive material., and on the outside of the cooling fin
Covering alloy side coating 22 makes the cooling fin and resistive element conductive contact simultaneously with the side of corresponding resistive element in face.Separately
The lateral surface of one cooling fin and another side alloy side coating 22 of resistive element 11 make the cooling fin and resistive element
Conductive contact.The barrier layer 33 obstructs the electrical conduction between cooling fin 31, avoids causing short circuit between two cooling fins 31.?
In present embodiment, the lower surface 13 of the resistive element 11 is bonded by adhesive 20 with cooling fin 31 and barrier layer 33.
The material of the cooling fin 31 is selected as one of fine copper, copper alloy, graphene, functional form polymer resin or nano material,
It can be used as conductive electrode while so as to high thermal conductivity, high heat-sinking capability characteristic, and due to cooling fin 31
Itself is located at integrally-built lower section, directly can be bonded and reach the work of electrode with the conducting end in such as printed circuit board 65
With.The resistive element 11 does not need additional to be again resistor setting electrode in this way, i.e. cooling fin plays heat dissipation and electrode simultaneously
Dual function, keep the resistor structure compact small and exquisite, meet the demand of miniaturization.
The upper surface 12 of resistive element can be coated with coating material (not shown) to protect institute in the plating process
State resistance element.
Radiator 30 and resistor 10 are bonded to each other the heat conduction path to be formed from resistor 10 to radiator 30.Due to work
The heat that resistor generates in engineering can reduce resistor itself by the higher radiator export of thermal conductivity and runaway
Temperature, to reduce the variation of resistance value.In the embodiment shown in figure 1, resistive element 11 can pass through 10 He of resistor
The adhesive 20 of high thermal conductivity and electrical isolation between radiator 30 is joined to cooling fin 31.In one embodiment, cooling fin
Upper surface 32 need to be fitted in resistive element lower surface 13 completely.
And can be illustrated in this together by a variety of in the specific choice of above-mentioned each element: the resistive element 11 is gold
Belong to one of a resistive element, thick-film resistor, film resistor or metal foil.Coating 22 material in the alloy side is highly conductive
One kind of thermally conductive silver-tin alloy, nichrome or silver paste.The material of the barrier layer 33 be paint vehicle or function epoxy resin, i.e.,
High thermal conductivity electrically insulating material.
Embodiment two
It is a kind of embodiment of the manufacturing method of resistor incorporated by reference to shown in Fig. 3 to Fig. 8.The manufacturing method includes following
Step:
A. 11 ' of resistor disc is fitted on the upper surface of 31 ' of cooling fin of conductive material, the lower surface of 31 ' of cooling fin is set
There are several parallel and of same size strip gaps 34；The resistor disc forms compound plate body, such as Fig. 3 after being bonded with cooling fin
It is shown.
B. 33 ' of insulating materials is filled in the gap 34 of cooling fin lower surface；As shown in Figure 4.
C. compound plate body is divided into several strip shape bodies by the middle position along the two neighboring gap 34 of cooling fin；Such as Fig. 5 institute
Show.
D. one layer of side coating (using the modes such as sputtering or spraying) is formed in the both ends of the surface that strip shape body is parallel to gap
22 ', 22 ' of side coating are conductive alloy material；As shown in Figure 6.
E. strip shape body is divided into along cross section and needs size coccoid, form resistor structure.As shown in Figure 7.At this time
The single resistor structure recorded in above-described embodiment one is formd, as shown in Figure 8.
Further, further includes:
F. resistance value finishing is carried out to coccoid in the way of etching or laser or polishing.
G. coating, plating and printing are carried out to coccoid, forms finished product.
In the present embodiment, identical in the specific choice with embodiment one of each element, specifically, the resistive element
(11 ' of resistor disc) is one of metal strip resistor element, thick-film resistor, film resistor or metal foil；22 ' of side coating
Material is one kind of silver-tin alloy, nichrome or silver paste；The material of 33 ' of insulating materials is paint vehicle or function asphalt mixtures modified by epoxy resin
Rouge；The material of 31 ' of cooling fin is selected as one in fine copper, copper alloy, graphene, functional form polymer resin or nano material
Kind.
Claims (10)
1. a kind of resistor integrally to radiate, it is characterised in that: including flat resistive element, below the resistive element and hold
Two cooling fins of resistive element are carried, the barrier layer between two cooling fins, is located at resistor side and is conductively connected scattered
The alloy coating of backing and resistive element；, and the cooling fin lateral surface covers conjunction with the side of corresponding resistive element simultaneously
Golden side coating makes the cooling fin and resistive element conductive contact, the lateral surface of another cooling fin and resistive element another
Simultaneously same covering alloy side coating makes the cooling fin and resistive element conductive contact for side alignment；The barrier layer barrier heat dissipation
Electrical conduction between piece；The cooling fin is conductive material.
2. resistor according to claim 1, it is characterised in that: the resistive element is metal strip resistor element, thick film
One of resistance, film resistor or metal foil.
3. resistor according to claim 1, it is characterised in that: the alloy side coating material is silver-tin alloy, nickel
One kind of evanohm or silver paste.
4. resistor according to claim 3, it is characterised in that: the material of the barrier layer is paint vehicle or function asphalt mixtures modified by epoxy resin
Rouge.
5. resistor according to claim 4, it is characterised in that: the material of the cooling fin be selected as fine copper, copper alloy,
One of graphene, functional form polymer resin or nano material.
6. resistor according to claim 1, it is characterised in that: the lower surface of the resistive element and cooling fin and barrier
Layer is bonded.
7. a kind of manufacturing method of resistor, which comprises the following steps:
A. resistor disc is fitted on the upper surface of cooling fin of conductive material, the lower surface of cooling fin be equipped with several it is parallel and
Strip gap of same size；The resistor disc forms compound plate body after being bonded with cooling fin；
B. insulating materials is filled in the gap of cooling fin lower surface；
C. compound plate body is divided into several strip shape bodies by the middle position along the two neighboring gap of cooling fin；
D. one layer of side coating is formed in the both ends of the surface that strip shape body is parallel to gap, the side coating is conductive alloy material
Matter；
E. strip shape body is divided into along cross section and needs size coccoid, form resistor structure.
8. the manufacturing method of resistor according to claim 7, which is characterized in that after step e, further includes:
F. resistance value finishing is carried out to coccoid in the way of etching or laser or polishing.
9. the manufacturing method of resistor according to claim 7, it is characterised in that: after step f, further includes:
G. coating, plating and printing are carried out to coccoid, forms finished product.
10. the manufacturing method of the resistor according to any one of claim 7-9, it is characterised in that: the resistor disc is
One of metal strip resistor element, thick-film resistor, film resistor or metal foil；The side coating material be silver-tin alloy,
One kind of nichrome or silver paste；The material of the insulating materials is paint vehicle or function epoxy resin；The material of the cooling fin
It is selected as one of fine copper, copper alloy, graphene, functional form polymer resin or nano material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711285433.6A CN109903938A (en) | 2017-12-07 | 2017-12-07 | A kind of resistor integrally to radiate and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711285433.6A CN109903938A (en) | 2017-12-07 | 2017-12-07 | A kind of resistor integrally to radiate and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109903938A true CN109903938A (en) | 2019-06-18 |
Family
ID=66939135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711285433.6A Pending CN109903938A (en) | 2017-12-07 | 2017-12-07 | A kind of resistor integrally to radiate and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109903938A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140950A (en) * | 2021-03-29 | 2021-07-20 | 常州莱特康光电科技有限公司 | Laser gain unit, manufacturing method of laser gain unit and laser gain module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050200451A1 (en) * | 2002-06-13 | 2005-09-15 | Rohm Co., Ltd. | Chip resistor having low resistance and its producing method |
| JP2006332413A (en) * | 2005-05-27 | 2006-12-07 | Rohm Co Ltd | Chip resistor and its manufacturing method |
| US20100039211A1 (en) * | 2008-08-13 | 2010-02-18 | Chung-Hsiung Wang | Resistive component and method of manufacturing the same |
| CN102165538A (en) * | 2008-09-05 | 2011-08-24 | 韦沙戴尔电子公司 | Resistor and method for making same |
| US20130025915A1 (en) * | 2011-07-28 | 2013-01-31 | Cyntec Co., Ltd. | Aresistive device with flexible substrate and method for manufacturing the same |
| JP3195208U (en) * | 2014-10-22 | 2015-01-08 | 致強科技股▲ふん▼有限公司 | Metal resistor |
| CN207676748U (en) * | 2017-12-07 | 2018-07-31 | 南京萨特科技发展有限公司 | A kind of resistor integrally to radiate |
-
2017
- 2017-12-07 CN CN201711285433.6A patent/CN109903938A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050200451A1 (en) * | 2002-06-13 | 2005-09-15 | Rohm Co., Ltd. | Chip resistor having low resistance and its producing method |
| JP2006332413A (en) * | 2005-05-27 | 2006-12-07 | Rohm Co Ltd | Chip resistor and its manufacturing method |
| US20100039211A1 (en) * | 2008-08-13 | 2010-02-18 | Chung-Hsiung Wang | Resistive component and method of manufacturing the same |
| CN102165538A (en) * | 2008-09-05 | 2011-08-24 | 韦沙戴尔电子公司 | Resistor and method for making same |
| US20130025915A1 (en) * | 2011-07-28 | 2013-01-31 | Cyntec Co., Ltd. | Aresistive device with flexible substrate and method for manufacturing the same |
| JP3195208U (en) * | 2014-10-22 | 2015-01-08 | 致強科技股▲ふん▼有限公司 | Metal resistor |
| CN207676748U (en) * | 2017-12-07 | 2018-07-31 | 南京萨特科技发展有限公司 | A kind of resistor integrally to radiate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140950A (en) * | 2021-03-29 | 2021-07-20 | 常州莱特康光电科技有限公司 | Laser gain unit, manufacturing method of laser gain unit and laser gain module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4255691B2 (en) | Electronic component cooling device using thermoelectric conversion material | |
| TWI503849B (en) | Micro resistor | |
| CN107078110B (en) | IGBT module and manufacturing method thereof | |
| CN104051099A (en) | Production method of high-power precision alloy SMD (surface mount device) resistor | |
| CN104637832B (en) | Semiconductor device and its manufacturing method | |
| TWI467600B (en) | Power resistor with integrated haet spreader | |
| WO2009145133A1 (en) | Resistor | |
| US8456273B2 (en) | Chip resistor device and a method for making the same | |
| JP2009105366A5 (en) | ||
| CN207676748U (en) | A kind of resistor integrally to radiate | |
| CN109903938A (en) | A kind of resistor integrally to radiate and manufacturing method | |
| US9870849B2 (en) | Chip resistor and mounting structure thereof | |
| KR102632374B1 (en) | Chip resistor and chip resistor assembly | |
| JP6737634B2 (en) | Heat dissipation chip and heat dissipation structure | |
| CN108777199A (en) | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure | |
| CN102365734B (en) | The pressure support of electronic circuit | |
| JP6500210B2 (en) | Metal plate resistor | |
| CN208208459U (en) | A kind of high-power antisurge alloy sheet resistance of two-sided resistive layer structure | |
| CN103137614A (en) | Optical assembly packaging structure for strengthening heat dissipation and manufacturing method thereof | |
| CN102802347A (en) | Directional heat conduction PCB (printed circuit board) and electronic equipment | |
| CN206134677U (en) | High resistance precision chip resistor of metal sheet structure high power | |
| CN117558515A (en) | High-heat-conductivity resistance structure and processing method thereof | |
| CN210349819U (en) | Power device module | |
| CN212413507U (en) | Quick heat conduction structure of PCB board and have electronic equipment of this heat conduction structure | |
| CN104137662B (en) | Printed circuit board and manufacturing methods |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |