JP2006332413A - Chip resistor and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip resistor capable of appropriately resolving the nonconformity of a large error being generated in a resistance value or the like without letting a resistor be easily deformed, even in the case of increasing the resistance value by thinning the resistor. <P>SOLUTION: The chip resistor A1 comprises the resistor 1 formed of a thin plate rectangular metal and a pair of electrodes 4 provided at an interval on one surface 1a of the resistor 1. An insulating film 31, covering a region between the pair of electrodes 4, is formed on one surface 1a, and a rigid chip-like support body 2 having a fixed thickness and having the same planar shape as that of the resistor 1 is joined to a surface 1b on the side opposite to the one surface 1a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip resistor and a manufacturing method thereof.

  An example of a conventional chip resistor is shown in FIG. 18 (see, for example, Patent Document 1). The illustrated chip resistor B has a structure in which a pair of electrodes 91 are provided on a lower surface 90a of a metal chip-like resistor 90 with a gap s3. A solder layer 92 is formed on the lower surface of each electrode 91 as a means for improving the solderability during mounting.

  In the chip resistor B having such a configuration, the resistance is determined by the distance s3 between the pair of electrodes corresponding to the length of the current flow path, and the width w3 and the thickness t3 of the resistor 90 constituting the cross section of the current flow path. The value is specified. For this reason, if the size of the resistor 90 is constant, the resistance value is proportional to the interval s3. Therefore, as the chip resistor B, by changing the interval s3, it is possible to manufacture a plurality of types having different resistance values while having the same outer dimensions in plan view.

  By the way, in the chip resistor B having such a configuration, there is a strong demand for miniaturization in order to increase the mounting efficiency of an electric circuit configured using the chip resistor B, and the size thereof is about several mm square in plan view. Is suppressed. On the other hand, the chip resistor B may have a high resistance value. In this case, it is conceivable to increase the distance s3 in order to increase the resistance value, but this has a limit from the viewpoint of miniaturization. Therefore, it is necessary to cope with the demand for a high resistance value of the chip resistor B by reducing the thickness t3, that is, by reducing the thickness of the resistor 90.

  However, when the resistor 90 is thinned in the chip resistor B, the mechanical strength of the resistor 90 itself is lowered. If a load is applied to the chip resistor B in this state, the resistor 90 may be easily damaged, for example, the portion between the electrodes of the resistor 90 may be bent or folded. If such a situation occurs, there is a problem that a large error occurs in the resistance value of the chip resistor B, or a specification of an electric circuit configured using the chip resistor B is distorted. End up.

JP 2002-57009 A

  The present invention has been conceived under the circumstances described above, and even when the resistance value is increased by thinning the resistor, the resistor is not easily deformed. It is an object of the present invention to provide a chip resistor that can appropriately eliminate such a problem that a large error occurs in the resistance value. Moreover, this invention makes it the other subject to provide the manufacturing method of the chip resistor which can manufacture such a chip resistor efficiently and appropriately.

  In order to solve the above problems, the present invention takes the following technical means.

  A chip resistor provided by the first aspect of the present invention includes a resistor formed of a thin plate-shaped metal, and a pair of electrodes provided on one side of the resistor with a gap therebetween, and An insulating film covering the region between the pair of electrodes is formed on one surface, and the surface opposite to the one surface is rigid and has a certain thickness, and the same planar shape as the resistor It is characterized in that a chip-like support body having the above is joined.

  According to the chip resistor having such a configuration, since the support having a constant thickness is bonded to the whole area of one surface of the thin rectangular resistor, even if a load is applied to the chip resistor, The load is borne not only by the resistor but also by the support. And since a support body has rigidity, predetermined | prescribed mechanical strength is maintained as a chip resistor. Therefore, even when the thickness of the resistor is reduced in order to increase the resistance value, the resistor is not easily deformed, and a large error occurs in the resistance value due to damage of the resistor. In addition, it is possible to appropriately solve such a problem that a large deviation occurs in the specification of an electric circuit configured using a chip resistor.

  Further, according to the above configuration, since the region between the pair of electrodes in the resistor is covered with the insulating film, there is no possibility that the solder will accidentally adhere to this region. Therefore, it is possible to appropriately prevent a large error in the resistance value due to inappropriate solder adhesion to the resistor.

  Furthermore, according to the above configuration, the dimension between the pair of electrodes can be defined by the insulating film. That is, if the insulating film is formed using a technique such as thick film printing described later, the formation region can be finished to a desired dimension. Therefore, the distance between the pair of electrodes can be set to a desired dimension with high accuracy. As a condition for bringing the effective resistance value of the chip resistor close to the target resistance value, it is required to finish the dimension between the electrodes to a predetermined accurate dimension. According to the above configuration, such a condition is satisfied. It becomes suitable for.

  In a preferred embodiment of the present invention, the support is made of an insulating material. In particular, if a synthetic resin with excellent mechanical strength is used, it is possible to appropriately prevent deformation of the resistor and to prevent unjustified electrical continuity between the surface of the resistor and other members or devices. Can do.

  In a preferred embodiment of the present invention, the support includes a first support portion made of an insulating material that covers at least a region corresponding to a region between the pair of electrodes, and the pair of electrodes of the first support portion. It is comprised from a pair of 2nd support part which consists of a metal material distribute | arranged at the both ends in the direction of an arrangement | sequence. According to such a configuration, heat generated in the resistor is released to the outside through the pair of second support portions. Therefore, the heat dissipation effect of the chip resistor is enhanced, and it is suitable for suppressing thermal damage to the mounting object.

  In a preferred embodiment of the present invention, the thickness of the support is greater than the thickness of the resistor. According to such a structure, the rigidity of a support body can be raised appropriately and it is suitable when suppressing a deformation | transformation of a resistor.

  In a preferred embodiment of the present invention, a solder layer is further provided to cover the end surface of the resistor in the direction in which the pair of electrodes are arranged, the pair of electrodes, or the pair of second support portions. According to such a configuration, when the chip resistor is mounted, it is possible to form a solder fillet that is bonded to each end face in the direction in which the pair of electrodes of the chip resistor are arranged by the solder layer. For this reason, it is possible to easily determine whether or not the chip resistor is mounted based on the presence or absence of the solder fillet. It is also suitable when it is desired to increase the bonding strength of the chip resistor by solder.

  In a preferred embodiment of the present invention, both side surfaces of the resistor are covered with an additional insulating film. According to such a configuration, solder does not accidentally adhere to the side surface of the resistor. Therefore, it is possible to more reliably prevent the solder from adhering to the resistor more reliably, and it is preferable to prevent an error in the resistance value of the chip resistor.

  The manufacturing method of the chip resistor provided by the second aspect of the present invention is directed to a strip-shaped laminated plate material joined by overlapping a plate-shaped support material on a plate-shaped metal resistor material. Patterning an insulating film having a predetermined length in a longitudinal direction of the laminated plate material on a surface of the resistor material opposite to the surface to which the support material is bonded; and the opposite side A step of forming a conductive layer on a region where the insulating film is not formed, and a part of the conductive layer is formed as a pair of electrodes spaced apart with the insulating film interposed therebetween. Dividing the laminated plate material into a plurality of chip-like resistors. According to such a manufacturing method, the chip resistor provided by the first aspect of the present invention can be appropriately manufactured.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings. For convenience of explanation, the upper and lower directions are specified with reference to FIG.

  1 to 3 show a chip resistor according to a first embodiment of the present invention. The chip resistor A <b> 1 of this embodiment includes a resistor 1, a support 2, insulating films 31 and 32, a pair of electrodes 4, and a pair of solder layers 5.

  The resistor 1 is a thin plate having a rectangular shape in plan view with a constant thickness of each part. Specific examples of the material include Fe—Cr alloy, Ni—Cr alloy, and Ni—Cu alloy. However, the material is not limited to these, and the size and target resistance value of the chip resistor A1. A metal material having a resistivity corresponding to the above may be selected as appropriate.

  The support 2 is for improving the mechanical strength of the chip resistor A1, and has a chip shape having the same planar shape (long rectangular shape) as the resistor 1 having a constant thickness of each part. The support 2 is made of an insulating material such as an epoxy resin, and is joined to the upper surface 1 b of the resistor 1. In the support 2, the thickness t <b> 2 is appropriately set according to the thickness t <b> 1 of the resistor 1 so that a desired mechanical strength can be ensured. Here, when the thickness t1 of the resistor 1 is reduced in order to increase the resistance value, the thickness t2 of the support 2 is increased. On the contrary, the thickness t1 of the resistor 1 is increased. If it is, the thickness t2 of the support 2 is relatively small. Although specific examples of these dimensions will be described later, the thickness t2 of the support 2 is at least larger than the thickness t1 of the resistor 1. As a result, the support 2 has a predetermined rigidity.

  The insulating films 31 and 32 are both epoxy resin-based resin coating films. The insulating film 31 is provided so as to cover a region between the pair of electrodes 4 in the lower surface 1 a of the resistor 1. The insulating film 32 is provided so as to cover the entire side surface 1d along the X direction (longitudinal direction of the chip resistor A1).

  The pair of electrodes 4 is provided on the lower surface 1a of the resistor 1 with a gap in the X direction. As will be described later, each electrode 4 is formed, for example, by subjecting the resistor 1 to a copper plating process. The inner end surface in the X direction of each electrode 4 is in contact with both end surfaces 31 a in the X direction of the insulating film 31. That is, the distance s1 between the pair of electrodes 4 is defined by both end faces 31a of the insulating film 31, and has the same dimension as the length of the insulating film 31 in the X direction.

  The pair of solder layers 5 are formed, for example, in a substantially L shape in a side view. Each solder layer 5 has a form connected so as to cover each end face 1 c and the surface of each electrode 4 spaced apart in the X direction of the resistor 1. Examples of the material of the solder layer 5 include Sn, but are not limited thereto.

  As an example of the thickness of each part described above, the thickness t1 of the resistor 1 is about 0.02 mm to 0.3 mm, the thickness t2 of the support 2 is about 0.2 mm to 0.5 mm, and the insulating films 31 and 32 are respectively. About 20 μm, each electrode 4 is about 30-100 μm, and each solder layer 5 is about 5-20 μm. The vertical and horizontal dimensions of the resistor 1 are each about 2 to 7 mm. However, the size of the resistor 1 is variously changed according to the target resistance value, and can be set to a numerical value other than the above. About the size of the support body 2, it changes according to the size of the resistor 1, and can also be made into numerical values other than the above. Further, the chip resistor A1 is configured such that the resistance between the pair of electrodes 4 is a low resistance of, for example, about 1 mΩ to 100 mΩ.

  Next, an example of a manufacturing method of the chip resistor A1 will be described with reference to FIGS.

  First, as shown in FIG. 4, a laminated plate material P as a material for the resistor 1 and the support 2 is prepared. The laminated plate material P is composed of a resistor material 10 which is a metal plate material whose thickness is uniform throughout, and a plate-like support material 20 made of a thermosetting resin having excellent adhesiveness such as an epoxy resin. Are bonded together by heating and pressurizing them. Then, the frame F is formed by punching the laminated plate material P or the like. In addition, as a joining method of the laminated sheet material P, it is not limited to the one by the above heating and pressurization, For example, you may employ | adopt other joining methods, such as using an adhesive agent.

  As shown in FIG. 5, the frame F includes a plurality of bar-like plate-like portions 11 and 21 extending in a certain direction (the plate-like portion 11 in the resistor material 10 and the plate-like portion 21 in the support material 20), The frame parts 12 and 22 of the rectangular frame shape (the frame part 12 in the resistor material 10 and the frame part 22 in the support material 20) which support these several plate-shaped parts 11 and 21 are provided. The plate-like portion 11 is a portion that becomes the original shape of the resistor 1, and the plate-like portion 21 is a portion that becomes the original shape of the support body 2. A slit S is formed between the adjacent plate-like portions 11 and 21. At both ends in the longitudinal direction of each plate-like portion 11, 21, connecting portions 13, 23 for connecting the plate-like portions 11, 21 and the frame portions 12, 22 (the connecting portion 13 and the support body in the resistor material 10). A connecting part 23) in the material 20 is provided, and the width W1 of the connecting parts 13 and 23 is smaller than the width W2 of the plate-like parts 11 and 21. For this reason, the connecting portions 13 and 23 are torsionally deformed so that the plate-like portions 11 and 21 can be rotated about 90 degrees in the direction of the arrow N1, and the side surfaces 11d and 21d of the plate-like portions 11 and 21 can be rotated. The operation of forming an insulating film 32 described later can be facilitated.

  Next, as shown in FIG. 6, a rectangular insulating film 31 having a predetermined size is formed on the surface 11 a opposite to the surface to which the support material 20 of each plate 11 is bonded. They are formed so as to be arranged at regular intervals in the longitudinal direction. Each insulating film 31 is formed by thick film printing using, for example, an epoxy resin. According to thick film printing, the width and thickness of the insulating film 31 can be accurately finished to a desired dimension. If necessary, a step of marking the surface of the insulating film 31 or the surface of the plate-like portion 21 may be performed.

  Next, as illustrated in FIG. 7, an insulating film 32 is formed on the pair of side surfaces 11 d and 21 d of each plate-like portion 11 and 21. For the formation of the insulating film 32, the same material as that used for forming the insulating film 31 is used. The insulating film 32 is formed by rotating each of the plate-like portions 11 and 21 to the posture shown by the phantom line in FIG. 5A so that the pair of side surfaces 11d and 21d are immersed in the coating liquid, and then the coating is applied. This can be done by drying.

  Next, as shown in FIG. 8, a conductive layer 4 ′ is formed in a region where the insulating film 31 is not formed on the opposite surface 11 a of each plate-like portion 11. The conductive layer 4 ′ is a portion that becomes the original shape of the electrode 4, and is formed by, for example, copper plating. According to the plating process, the conductive layer 4 ′ can be formed in a region between the adjacent insulating films 31 without generating a gap between the conductive layer 4 ′ and the insulating film 31.

  By the above-described process, a bar-shaped resistor aggregate A1 ″ is obtained. When this resistor aggregate A1 ″ is cut at the position of the virtual line C1, a plurality of chip resistors A1 ′ having no solder layer formed thereon are manufactured. The This cutting position is a position where each conductive layer 4 ′ is divided into two in the width direction (longitudinal direction of the resistor assembly A1 ″), and the cutting direction is the short direction of the resistor assembly A1 ″. As a result, a pair of electrodes 4 is formed on the chip resistor A1 '. In this way, since a plurality of chip resistors A1 'can be produced from one frame F, the productivity is improved.

  Next, a solder layer 5 is formed on each end face 1c of the resistor 1 and the surface of each electrode 4 of the chip resistor A1 '. The solder layer 5 is formed by barrel plating, for example. This barrel plating process is performed by accommodating a plurality of chip resistors A1 'in one barrel. Each chip resistor A <b> 1 ′ has a structure in which each end face 1 c of the resistor 1 and the metal surface of each electrode 4 are exposed, and other portions are covered with insulating films 31 and 32. Therefore, the solder layer 5 can be formed efficiently and appropriately only on the above-described metal surface. Note that a protective film made of, for example, Ni may be formed on the above-described metal surface before the solder layer 5 is formed, and then the solder layer 5 may be formed. It is preferable to form the protective film in this way because the electrode 4 can be prevented from being oxidized. The protective film can also be formed by barrel plating, for example. The chip resistor A1 shown in FIGS. 1 to 3 can be efficiently manufactured by the above-described series of work steps.

  Next, the operation of the chip resistor A1 will be described.

  The chip resistor A1 is surface-mounted on a desired mounting object using, for example, a solder reflow technique. In this solder reflow method, heating is performed using a reflow furnace in a state where the chip resistor A1 is placed so that each electrode 4 is positioned on a terminal provided on the mounting target.

  At the time of mounting, the work of placing the chip resistor A1 on the mounting target is performed using, for example, a vacuum suction type holder. When the chip resistor A1 is placed on the mounting target, a load may be applied to the chip resistor A1 due to inertia due to the placement operation, air supply for separating the chip resistor A1 from the holder, or the like. . Even in such a case, in the chip resistor A1, since the support 2 having a constant thickness is joined to the entire area of one surface of the thin rectangular resistor 1, the load applied to the chip resistor A1 is It is borne not only by 1 but also by the support 2. Here, since the support body 2 has rigidity, a predetermined mechanical strength is maintained as the chip resistor A1. Therefore, in the chip resistor A1 in the present embodiment, even when the thickness t1 of the resistor 1 is reduced in order to increase the resistance value, the resistor 1 is not easily deformed, and the resistor 1 is damaged. Due to this, problems such as a large error in the resistance value and a large deviation in the specifications of the electric circuit configured using the chip resistor A1 are appropriately eliminated.

  Further, according to the above configuration, the region between the pair of electrodes 4 in the resistor 1 is covered with the insulating film 31, so there is no possibility that the solder will accidentally adhere to this region. Accordingly, it is possible to appropriately prevent a large error in the resistance value due to inappropriate solder adhesion to the resistor 1. In addition, since both side surfaces 1d of the resistor 1 are covered with the insulating film 32, no solder is accidentally attached to the side surface 1d. Accordingly, it is possible to more reliably prevent the solder from adhering to the resistor 1 more reliably, and this is suitable for preventing an error in the resistance value of the chip resistor A1.

  In this embodiment, since the insulating film 31 is formed by thick film printing, the formation region can be finished to a desired dimension with high accuracy. On the other hand, the dimension between the pair of electrodes 4 is defined by both end faces 31 a of the insulating film 31. Therefore, the distance s1 between the pair of electrodes 4 can be set to a desired dimension with high accuracy. As a condition for bringing the effective resistance value of the chip resistor A1 close to the target resistance value, it is required to finish the dimension between the electrodes 4 to a predetermined accurate dimension. It is suitable for satisfying the conditions.

  In this embodiment, the support body 2 joined to the upper surface 1b of the resistor 1 is made of a synthetic resin mainly composed of an epoxy resin. Epoxy resin is an insulating material having excellent mechanical strength. Therefore, in the support body 2 of the chip resistor A1, it is possible to appropriately prevent electrical deformation between the upper surface 1b of the resistor body 1 and other members or devices while appropriately preventing the deformation of the resistor body 1. Can also be prevented.

  At the time of reflowing the solder, the solder layer 5 is melted. However, since the solder layer 5 is formed on each end face 1c of the resistor 1 and on the surface of the electrode 4, as shown by a virtual line in FIG. The solder fillet Hf is appropriately formed. Therefore, since the suitability of mounting of the chip resistor A1 can be determined by visually confirming the shape of the solder fillet Hf from the outside, the inspection can be facilitated. It also helps to increase the bonding strength of the chip resistor A1.

  9 to 12 show a chip resistor according to the second embodiment of the present invention. In FIG. 9 and subsequent drawings, the same or similar elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

  A chip resistor A2 shown in FIGS. 9 to 12 includes a resistor 1, a support 2, insulating films 31, 32, a pair of electrodes 4, and a pair of solder layers 5. The support body 2 includes a first support portion 2A made of an insulating material such as an epoxy resin, and second support portions 2B arranged at both ends in the X direction of the first support portion 2A. The first support portion 2 </ b> A has a length s <b> 2 in the X direction that is greater than a distance s <b> 1 between the pair of electrodes 4, and is formed to cover at least a region corresponding to a region between the pair of electrodes 4. . The 2nd support part 2B consists of metal materials excellent in electroconductivity, such as Cu, and is formed so that the thickness may become substantially the same as the thickness of 2 A of 1st support parts. As described above, the support body 2 in the present embodiment includes the first support portion 2A made of an insulating material and the pair of second support portions 2B made of a metal material. In this respect, a single insulating material is used. It is different from the configured support 2 of the first embodiment. Each solder layer 5 has a form connected so as to cover each end face 1c in the X direction of the resistor 1, the surface of each electrode 4, and the surface of each second support portion 2B. It is formed in a letter shape.

  Next, an example of a manufacturing method of the above chip resistor A2 will be described with reference to FIGS.

  First, as shown in FIG. 13, a laminated plate material P as a material for the resistor 1 and the support 2 is prepared. The laminated plate material P was bonded by pressure bonding by superposing the resistor material 10 which is a metal plate material whose thickness was made uniform over the whole and the plate-like support material 20 and heating and pressing them. Is. Here, the support material 20 is a form in which a band-shaped insulating layer 20A having a certain width made of a thermosetting resin such as an epoxy resin and a band-shaped conductive layer 20B having a certain width made of a metal such as Cu are alternately arranged. It is said that. Then, the frame F is formed by punching the laminated plate material P or the like. In addition, as a joining method of the laminated sheet material P, it is not limited to the one by the above heating and pressurization, For example, you may employ | adopt other joining methods, such as using an adhesive agent.

  As shown in FIG. 14, the frame F includes a plurality of bar-shaped plate portions 11 and 21 extending along the direction in which the insulating layer 20A and the conductive layer 20B are arranged. That is, the plate-like portion 21 has a configuration in which a plurality of insulating portions 21A and a plurality of conductive portions 21B are alternately arranged along the longitudinal direction thereof, and this is different from the frame F in the first embodiment. ing. Here, the insulating portion 21A is a portion that becomes the first support portion 2A, and the conductive portion 21B is a portion that becomes the original shape of the second support portion 2B.

  Next, as shown in FIG. 15, a rectangular insulating film 31 having a predetermined size is formed on the surface 11 a opposite to the surface to which the support material 20 of each plate 11 is bonded. They are formed so as to be arranged at regular intervals in the longitudinal direction. Each insulating film 31 is formed by thick film printing using, for example, an epoxy resin. According to thick film printing, the width and thickness of the insulating film 31 can be accurately finished to a desired dimension.

  Next, an insulating film 32 is formed on the pair of side surfaces 11d and 21d of each plate-like portion 11 and 21. For the formation of the insulating film 32, the same material as that used for forming the insulating film 31 is used. The insulating film 32 can be formed by a method similar to the formation of the insulating film 32 in the first embodiment.

  Next, as shown in FIG. 16, a conductive layer 4 ′ is formed in a region where the insulating film 31 is not formed on the opposite surface 11 a of each plate-like portion 11. The conductive layer 4 ′ is a portion that becomes the original shape of the electrode 4, and is formed by, for example, copper plating. According to the plating process, the conductive layer 4 ′ can be formed in a region between the adjacent insulating films 31 without generating a gap between the conductive layer 4 ′ and the insulating film 31.

  The bar-shaped resistor aggregate A2 ″ is obtained by the above-described process. When this resistor aggregate A2 ″ is cut at the position of the virtual line C2, a plurality of chip resistors A2 ′ with no solder layer formed are manufactured. The This cutting position is a position where each conductive layer 4 ′ is divided into two in the width direction (longitudinal direction of the resistor assembly A2 ″), and the cutting direction is the short direction of the resistor assembly A2 ″. Thereby, a pair of electrodes 4 and a pair of second support portions 2B (not shown) are formed in the chip resistor A2 '. Next, a solder layer 5 is formed by barrel plating on each end face 1c of the resistor 1 of the chip resistor A2 ', on the surface of each electrode 4 or on the surface of each second support 2B. Through the above-described series of work steps, the chip resistor A2 shown in FIGS. 9 to 12 can be efficiently manufactured.

  Next, the operation of the chip resistor A2 will be described.

  The chip resistor A2 is surface-mounted on a desired mounting object using a reflow technique in the same manner as the chip resistor A1 in the first embodiment. In the chip resistor A2 in the present embodiment, since the rigid support 2 is joined, a predetermined mechanical strength is maintained as in the chip resistor A1 in the first embodiment. Therefore, even when the thickness of the resistor 1 is reduced to increase the resistance value, the resistor 1 is not easily deformed, and a large error occurs in the resistance value due to damage of the resistor 1. Such a problem that a large deviation occurs in the specification of the electric circuit configured using the chip resistor A2 is appropriately solved.

  Further, in the chip resistor A2, the support body 2 includes a first support portion 2A made of an insulating material and a pair of second support portions 2B made of a metal material disposed at both ends of the first support portion 2A. Has been. For this reason, the heat generated in the resistor 1 by energization is efficiently radiated into the atmosphere through the second support portion 2B. Therefore, the heat dissipation effect of the chip resistor A2 is enhanced, and it is possible to suppress problems such as damage to the mounting target and other components mounted on the mounting target.

  The solder layer 5 melts during reflow, but the solder layer 5 in the chip resistor A2 is also formed on the end surface 1c of the resistor 1, the surface of the electrode 4, and the surface of the second support portion 2B. For this reason, as shown by the phantom line in FIG. 9, a large solder fillet Hf is appropriately formed so as to be in contact with the entire end face in the longitudinal direction of the chip resistor A2. Therefore, determination of the suitability of mounting of the chip resistor A2 by visual confirmation of the solder fillet Hf is further facilitated, and the bonding strength of the chip resistor A2 is further increased.

  Furthermore, the chip resistor A2 can be mounted upside down so that the support 2 is positioned below the resistor 1, as shown in FIG. In this case, between the resistor 1 and the terminal T of the mounting object, the second support 2B having a sufficient thickness and excellent in conductivity is interposed. For this reason, when the chip resistor A2 is mounted, even if there is an insufficient electrical connection to the terminal T, the width direction (short direction) of the resistor 1 on the end side in the X direction (longitudinal direction). The potential distribution becomes substantially uniform, and the effective resistance value hardly varies. This is more suitable for preventing an error from occurring in the resistance value of the chip resistor A2.

  The content of the present invention is not limited to the content of the above-described embodiment. The specific configuration of each part of the chip resistor according to the present invention can be varied in design in various ways. Similarly, the specific configuration of each work process in the method for manufacturing a chip resistor according to the present invention can be variously changed.

1 is a perspective view showing a chip resistor according to a first embodiment of the present invention. It is II-II sectional drawing of FIG. It is III-III sectional drawing of FIG. It is a perspective view which shows the laminated board material used for manufacture of the chip resistor which concerns on the 1st Embodiment of this invention. (A) is a perspective view which shows an example of the method of manufacturing the chip resistor which concerns on the 1st Embodiment of this invention, (b) is the principal part top view. (A) is a principal part top view which shows an example of the method of manufacturing the chip resistor which concerns on the 1st Embodiment of this invention, (b) is bb sectional drawing of (a). It is a principal part top view which shows an example of the method of manufacturing the chip resistor which concerns on the 1st Embodiment of this invention. It is a principal part top view which shows an example of the method of manufacturing the chip resistor which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the chip resistor which concerns on the 2nd Embodiment of this invention. It is XX sectional drawing of FIG. It is XI-XI sectional drawing of FIG. It is XII-XII sectional drawing of FIG. It is a perspective view which shows the laminated board material used for manufacture of the chip resistor which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows an example of the method of manufacturing the chip resistor which concerns on the 2nd Embodiment of this invention. (A) is a principal part top view which shows an example of the method of manufacturing the chip resistor which concerns on the 2nd Embodiment of this invention, (b) is bb sectional drawing of (a). It is a principal part top view which shows an example of the method of manufacturing the chip resistor which concerns on the 2nd Embodiment of this invention. It is a figure similar to FIG. 10 which shows the usage example of the chip resistor which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows an example of the conventional chip resistor.

Explanation of symbols

A1, A2 Chip resistor P Laminate plate 1 Resistor 2 Support 2A 1st support 2B 2nd support 4 Electrode 4 'Conductive layer 5 Solder layer 10 Resistor material 20 Support material 31, 32 Insulating film

Claims (7)

A resistor formed of a thin plate-shaped metal, and a pair of electrodes provided on one side of the resistor with a gap therebetween,
An insulating film that covers a region between the pair of electrodes is formed on the one surface,
A chip resistor characterized in that a chip-like support body having rigidity and a constant thickness and having the same planar shape as that of the resistor is joined to the surface opposite to the one surface. .   The chip resistor according to claim 1, wherein the support is made of an insulating material.   The support includes a first support portion made of an insulating material that covers at least a region corresponding to a region between the pair of electrodes, and a metal material disposed on both ends of the first support portion in the direction in which the pair of electrodes are arranged. The chip resistor according to claim 1, comprising a pair of second support portions made of   The chip resistor according to claim 1, wherein a thickness of the support is larger than a thickness of the resistor.   5. The chip resistor according to claim 1, further comprising a solder layer covering the end face of the resistor in the direction in which the pair of electrodes are arranged, the pair of electrodes, or the pair of second support portions. .   6. The chip resistor according to claim 1, wherein both side surfaces of the resistor are covered with an additional insulating film. The opposite side of the surface of the resistor material to which the support material is bonded to the strip-shaped laminated plate material that is bonded by overlapping the plate-shaped support material on the plate-shaped metal resistor material A step of patterning an insulating film having a predetermined length in the longitudinal direction of the laminated plate material at a constant pitch;
A step of forming a conductive layer on a region of the opposite surface where the insulating film is not formed;
Dividing the laminated plate material into a plurality of chip-like resistors so that a part of the conductive layer is formed as a pair of electrodes spaced apart with the insulating film interposed therebetween;
A method of manufacturing a chip resistor, comprising:

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